KR20220008568A - Dicing die bonding film - Google Patents

Abstract

The present invention relates to a dicing film capable of more easily picking up a diced wafer or a dicing die-bonding film including the same. The present invention can stably dice a filter wafer.

Description

Dicing die bonding film {DICING DIE BONDING FILM}

The present invention relates to a dicing die-bonding film.

In general, a manufacturing process of a semiconductor chip includes a process of forming a fine pattern on a wafer and a process of packaging the wafer by polishing it to meet the specifications of a final device.

The packaging process includes: a wafer inspection process for inspecting defects of a semiconductor chip; a dicing process of cutting the wafer and separating it into individual chips; a die bonding process of attaching the separated chip to a mounting plate of a circuit film or lead frame; a wire bonding process of connecting a chip pad provided on a semiconductor chip and a circuit pattern of a circuit film or a lead frame with an electrical connection means such as a wire; a molding process of encapsulating the outside with an encapsulant to protect the internal circuit and other components of the semiconductor chip; A trim process of cutting the lead and the damp bar connecting the leads; a forming process that bends the lead into a desired shape; and a finished product inspection process for inspecting defects in the finished package.

Through the dicing process, individual chips separated from each other from the semiconductor wafer on which the plurality of chips are formed are manufactured. Broadly speaking, the dicing process is a process of manufacturing a plurality of individual chips separated from each other by grinding the back surface of a semiconductor wafer and cutting the semiconductor wafer along a dicing line between the chips. Specifically, the dicing process is performed by attaching the wafer to the adhesive layer of the dicing die-bonding film. After the dicing process is completed, an individual chip pickup process of peeling the adhesive layer to which the diced wafer is attached is performed from the dicing film.

Recently, a semiconductor chip having a small size and a thin thickness has been developed, and accordingly, the thickness of an adhesive layer provided between the semiconductor chips is also decreasing. However, as the thickness of the semiconductor chip and the adhesive layer becomes thinner, the difficulty of the pick-up process of the diced semiconductor wafer increases, and the pickup quality deteriorates such as damage or deformation of the semiconductor wafer during the pick-up process.

Accordingly, there is a need for a technology capable of easily performing a pickup process after a wafer dicing process.

An object of the present invention is to provide a dicing die-bonding film capable of more easily picking up a diced wafer.

However, the problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

An exemplary embodiment of the present invention, a base film; an adhesive layer provided on one surface of the base film and comprising an adhesive composition; and an adhesive layer provided on one surface of the adhesive layer and including an adhesive composition, wherein the adhesive composition includes a thermosetting resin, a thermoplastic resin, a curing agent, a magnetic material and a solvent, and the melt viscosity of the adhesive layer is 2,600 Pa Provided is a dicing die-bonding film that is greater than ·s and less than 3,400 Pa·s.

A wafer can be stably diced using the dicing die-bonding film according to an exemplary embodiment of the present invention, and a pick-up process of the diced wafer can be easily performed.

Effects of the present invention are not limited to the above-described effects, and effects not mentioned will be clearly understood by those skilled in the art from the present specification and accompanying drawings.

1 is a view showing a dicing die-bonding film according to an embodiment of the present invention.
2A is a view showing dicing a wafer using a dicing die bonding film according to an exemplary embodiment of the present invention, and FIG. 2B is a dicing using a dicing die bonding film according to an exemplary embodiment of the present invention. It is a diagram showing the pickup of the old wafer.

Throughout this specification, when a part "includes" a certain element, it means that other elements may be further included, rather than excluding other elements, unless otherwise stated.

Throughout this specification, when a member is said to be located “on” another member, this includes not only a case in which a member is in contact with another member but also a case in which another member is present between the two members.

Throughout this specification, the unit "part by weight" may mean a ratio of weight between each component.

Throughout this specification, "(meth)acrylate" is used in the collective sense of acrylate and methacrylate.

Hereinafter, the present specification will be described in more detail.

An exemplary embodiment of the present invention, a base film; an adhesive layer provided on one surface of the base film and comprising an adhesive composition; and an adhesive layer provided on one surface of the adhesive layer and including an adhesive composition, wherein the adhesive composition includes a thermosetting resin, a thermoplastic resin, a curing agent, a magnetic material and a solvent, and the melt viscosity of the adhesive layer is 2,600 Pa Provided is a dicing die-bonding film that is greater than ·s and less than 3,400 Pa·s.

A wafer can be stably diced using the dicing die-bonding film according to an exemplary embodiment of the present invention, and a pick-up process of the diced wafer can be easily performed.

1 is a view showing a dicing die-bonding film according to an embodiment of the present invention.

Referring to FIG. 1 , a dicing die bonding film 100 according to an exemplary embodiment of the present invention includes a base film 10 , an adhesive layer 20 provided on one surface of the base film 10 , and an adhesive layer 20 . ) may include an adhesive layer 30 provided on one surface. The adhesive layer 30 may include a magnetic material 35 .

Referring to FIG. 1 , in an exemplary embodiment of the present invention, the size of the base film 10 and the adhesive layer 20 is the same, and the size of the adhesive layer 30 is the size of the base film 10 and the adhesive layer 20 . may be smaller than That is, the adhesive layer 30 may be provided on a portion of the adhesive layer 20 . In the present invention, the same size may mean that the size is substantially the same as well as that there is a slight difference in size including an error occurring during a process. Meanwhile, unlike shown in FIG. 1 , the sizes of the base film 10 , the adhesive layer 20 , and the adhesive layer 30 may be the same.

According to an exemplary embodiment of the present invention, since the magnetic material is included in the adhesive layer, the adhesive layer to which a diced wafer is attached can be easily separated from the adhesive layer during a pickup process to be described later. That is, by using the dicing die-bonding film including the adhesive layer including the magnetic material, the pickup quality and pickup efficiency of the diced wafer may be further improved.

According to an exemplary embodiment of the present invention, the melt viscosity of the adhesive layer may be greater than 2,600 Pa·s and less than 3,400 Pa·s. Specifically, the melt viscosity of the adhesive layer is 2,650 Pa·s or more and 3,380 Pa·s or less, 2,700 Pa·s or more and 3,350 Pa·s or less, 2,750 Pa·s or more and 3,300 Pa·s or less, 2,800 Pa·s or more 3,300 Pa·s s or less, 2,700 Pa s or more and 3,200 Pa s or less, 2,750 Pa s or more and 3,150 Pa s or less, 2,800 Pa s or more and 3,100 Pa s or less, 3,000 Pa s or more and 3,350 Pa s or less, 3,050 Pa s s or more and 3,300 Pa·s or less, or 3,100 Pa·s or more and 3,300 Pa·s or less.

When the melt viscosity of the adhesive layer is within the aforementioned range, the adhesive layer may stably support the magnetic material during a wafer pickup process to be described later. Through this, the pick-up process of the diced wafer can be easily performed, and pick-up quality can be further improved. In addition, by adjusting the melt viscosity of the adhesive layer within the above-described range, it is possible to effectively prevent the adhesive strength of the adhesive layer to the wafer from being lowered. In addition, when the melt viscosity of the adhesive layer is within the above range, it is possible to effectively suppress the change over time of the adhesive layer.

In the present invention, "melt viscosity" is a viscosity value at a shear rate of 5 rad/s, a temperature range of 25 °C to 200 °C, and a temperature increase rate of 10 °C/min using ARES (advanced rheometric expansion system, TA) Measures the change of , and means the lowest value among the measured viscosity values.

According to an exemplary embodiment of the present invention, the adhesive layer may include the adhesive composition. Specifically, the adhesive layer may include a dried product (or a thermosetting product) of the adhesive composition. The adhesive composition may include a thermosetting resin, a thermoplastic resin, a curing agent, a magnetic material, and a solvent.

According to an exemplary embodiment of the present invention, a method of forming an adhesive layer on one surface of the adhesive layer is not particularly limited. For example, a method of applying the adhesive composition on the adhesive layer and drying to form an adhesive layer, or applying the adhesive composition on a release film and drying to form the adhesive layer, and using the release film to apply the adhesive layer to the adhesive layer A method of transferring to , etc. can be used.

At this time, the method of applying and drying the adhesive composition is not particularly limited, and for example, the adhesive composition as it is or diluted in a suitable organic solvent and applied by a known means such as a comb coater, gravure coater, die coater or reverse coater. Then, a method of drying the adhesive composition may be used. In addition, in the above process, an aging process may be additionally performed for a sufficient crosslinking reaction of the adhesive layer to proceed.

According to an exemplary embodiment of the present invention, the thermosetting resin may include at least one of a solid epoxy-based resin and a liquid epoxy-based resin. The epoxy resin may form a hard cross-linked structure through a curing process, thereby exhibiting excellent adhesion, heat resistance and mechanical strength. Specifically, the epoxy resin may have an average epoxy equivalent weight of 100 to 1,000. When the epoxy equivalent of the epoxy resin is within the above range, it is possible to suppress that the crosslinking density is excessively high and the adhesive layer becomes hard as a whole, and it is possible to prevent deterioration of heat resistance. The average epoxy equivalent can be obtained based on the weight ratio and the epoxy equivalent of each epoxy resin included in the epoxy resin.

According to an exemplary embodiment of the present invention, an epoxy resin used in the art may be used as the epoxy resin. Specifically, the epoxy resin is a bifunctional epoxy resin such as bisphenol A epoxy resin or bisphenol F epoxy resin, cresol novolac epoxy resin, novolac epoxy resin such as phenol novolac epoxy resin, tetrafunctional epoxy resin, biphenyl Having three or more functional groups, such as a type epoxy resin, a triphenolmethane type epoxy resin, an alkyl modified triphenolmethane type epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene type epoxy resin, or a dicyclopentadiene type epoxy resin At least one of polyfunctional epoxy resins may be included, but the type of the epoxy resin is not limited.

According to an exemplary embodiment of the present invention, a mixed epoxy resin of a bifunctional epoxy resin and a polyfunctional epoxy resin may be used as the epoxy resin. In the present invention, the term "polyfunctional epoxy resin" means an epoxy resin having three or more functional groups. That is, in general, bifunctional epoxy resins have excellent flexibility and flowability at high temperatures, but have poor heat resistance and curing rate, whereas polyfunctional epoxy resins having three or more functional groups have a fast curing rate and excellent crosslinking density due to their high crosslinking density. It shows heat resistance, but has poor flexibility and flowability. Therefore, by appropriately mixing the two types of resins, it is possible to control the elastic modulus and tack characteristics of the adhesive layer, while suppressing chip scattering or burrs during the dicing process.

According to an exemplary embodiment of the present invention, the thermoplastic resin is a polyimide-based resin, a polyether imide-based resin, a polyester imide-based resin, a polyamide-based resin, a polyether sulfone-based resin, a polyether ketone-based resin, and a polyolefin-based resin. , polyvinyl chloride-based resin, phenoxy-based resin, butadiene-based rubber, styrene-butadiene-based rubber, modified butadiene-based rubber, reactive butadiene acrylonitrile copolymer rubber, and (meth) acrylate-based resin containing at least one polymer resin can By selecting the thermoplastic resin from the above, compatibility with the epoxy resin can be increased, and scattering of chips or generation of burrs can be effectively suppressed during the dicing process. In addition, stress generated in the semiconductor package may be reduced.

According to an exemplary embodiment of the present invention, the thermoplastic resin may include a (meth)acrylate-based resin having a glass transition temperature of -10 to 30° C. and a weight average molecular weight of 50,000 g/mol to 1,000,000 g/mol. . By using the thermoplastic resin including the (meth)acrylate-based resin having the above-described glass transition temperature and weight average molecular weight, scattering of chips or generation of burrs during the dicing process can be effectively suppressed. In addition, since the (meth)acrylate-based resin has sufficient compatibility and adhesion with the epoxy resin, and an appropriate viscosity increase rate due to curing, bonding and embedding of solder bumps in the thermocompression bonding process of a semiconductor device can be sufficiently performed.

According to an exemplary embodiment of the present invention, the content of the thermoplastic resin may be 5 parts by weight or more and 350 parts by weight or less based on 100 parts by weight of the thermosetting resin. Specifically, the content of the thermoplastic resin with respect to 100 parts by weight of the thermosetting resin is 10 parts by weight or more and 300 parts by weight or less, 25 parts by weight or more and 250 parts by weight or less, 50 parts by weight or more and 200 parts by weight or less, 100 parts by weight or more and 150 parts by weight or more. parts by weight or less, 5 parts by weight or more and 200 parts by weight or less, 7.5 parts by weight or more and 180 parts by weight or less, 15 parts by weight or more and 160 parts by weight or less, 30 parts by weight or more and 150 parts by weight or less, 50 parts by weight or more and 125 parts by weight or less, 75 parts by weight parts by weight or more and 100 parts by weight or more, 100 parts by weight or more and 350 parts by weight or less, 100 parts by weight or more and 300 parts by weight or less, 100 parts by weight or more and 250 parts by weight or less, 100 parts by weight or more and 200 parts by weight or less, 125 parts by weight or more and 180 parts by weight or less, or 150 parts by weight or more and 155 parts by weight or less.

When the content of the thermoplastic resin is within the above-described range, compatibility with the thermosetting resin may be improved, and the adhesive layer may effectively suppress scattering or burrs in the semiconductor chip (wafer) during a dicing process. In addition, when the content of the thermoplastic resin is within the above-described range, it is possible to suppress the change over time of the adhesive layer, and it is possible to effectively reduce the stress generated in the semiconductor package.

According to an exemplary embodiment of the present invention, the curing agent may include at least one of an amine-based compound, an acid anhydride-based compound, an amide-based compound, and a phenol-based compound. Specifically, the amine-based compound may be one selected from the group consisting of diaminodiphenylmethane, diethylenetriamine, triethylenetriamine, diaminodiphenylsulfone, isophoronediamine, or a combination thereof. The acid anhydride-based compound is phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, or these It may be one selected from the group consisting of a combination of The amide-based compound may be a polyamide resin synthesized from dicyandiamide, a dimer of linolenic acid, and ethylenediamine. The said phenolic compound is polyhydric phenols, such as bisphenol A, bisphenol F, bisphenol S, fluorenebisphenol, and terpene diphenol; phenol resins obtained by condensation of phenols with aldehydes, ketones or dienes; phenols and/or modified products of phenol resins; halogenated phenols such as tetrabromobisphenol A and brominated phenol resins; Other imidazoles, BF ₃ -amine complex, may be a guanidine derivative. By selecting the curing agent from the above, it is possible to control the degree of curing of the epoxy resin and improve the mechanical properties of the adhesive layer.

According to an exemplary embodiment of the present invention, the curing agent may include a phenol-based resin having a softening point of 60° C. or higher. Specifically, the softening point of the phenol-based resin may be 60 °C or more and 150 °C or less, 65 °C or more and 145 °C or less, or 70 °C or more and 140 °C or less. By including the phenolic resin having a softening point within the above range, heat resistance, strength, and adhesion after curing of the adhesive composition can be improved, and voids can be prevented from being generated inside the adhesive layer in the semiconductor manufacturing process. have.

According to an exemplary embodiment of the present invention, the curing agent may include a novolak-based phenol resin. The novolak-based phenolic resin has a chemical structure in which a ring is positioned between reactive functional groups. Due to these structural characteristics, the novolac-based phenolic resin can lower the hygroscopicity of the adhesive layer, and can further increase stability in a high-temperature compression process, thereby preventing peeling of the adhesive layer.

According to an exemplary embodiment of the present invention, the content of the curing agent may be 10 parts by weight or more and 500 parts by weight or less based on 100 parts by weight of the thermosetting resin. Specifically, the content of the curing agent is 25 parts by weight or more and 450 parts by weight or less, 50 parts by weight or more and 400 parts by weight or less, 75 parts by weight or more and 300 parts by weight or less, 100 parts by weight or more and 200 parts by weight based on 100 parts by weight of the thermosetting resin. 10 parts by weight or more and 300 parts by weight or less, 15 parts by weight or more and 275 parts by weight or less, 30 parts by weight or more and 250 parts by weight or less, 55 parts by weight or more and 220 parts by weight or less, 70 parts by weight or more and 200 parts by weight or less, 85 parts by weight 175 parts by weight or more, 100 parts by weight or more and 150 parts by weight or less, 100 parts by weight or more and 500 parts by weight or less, 100 parts by weight or more and 400 parts by weight or less, 100 parts by weight or more and 300 parts by weight or less, 125 parts by weight or more and 275 parts by weight or less , 150 parts by weight or more and 250 parts by weight or less, or 175 parts by weight or more and 20 parts by weight or less. By adjusting the content of the curing agent to the above-described range, heat resistance, strength, and adhesiveness after curing of the adhesive composition may be improved.

According to an exemplary embodiment of the present invention, along a direction from the base film toward the adhesive layer, the magnetic material may be deflected to one side and magnetized. Specifically, along the direction from the base film toward the adhesive layer, the magnetic pole (eg, N pole or S pole) of the magnetic material may be deflected to one side. Referring to FIG. 1 , along the direction A from the base film 10 toward the adhesive layer 30 , the magnetic pole (S pole) of the magnetic material 35 may be deflected toward the base film. Meanwhile, unlike shown in FIG. 1 , along the direction from the base film toward the adhesive layer, the magnetic pole (S pole) of the magnetic material may be deflected toward the surface of the adhesive layer. By deflecting the magnetization direction of the magnetic material included in the adhesive layer to one side, the adhesive layer may be more easily peeled from the adhesive layer during a wafer pickup process to be described later. That is, by using the dicing die-bonding film, the difficulty of the wafer pickup process can be effectively reduced, and pickup quality can be further improved. Through this, a dicing process and a pickup process for a wafer having a small size and thickness may be easily performed.

According to an exemplary embodiment of the present invention, after the magnetic material included in the adhesive composition is magnetized to be biased to one side, the adhesive composition may be dried or thermally cured to form the adhesive layer. Using a method of magnetizing a magnetic material in the art, the magnetic material included in the adhesive composition may be magnetized. For example, by applying an external magnetic field to the adhesive composition to deflect the magnetization direction of the magnetic material to one side, the adhesive composition may be dried or thermally cured.

According to an exemplary embodiment of the present invention, the magnetic material may include a ferromagnetic material. Since the magnetic material includes a ferromagnetic material other than a diamagnetic material, magnetism can be effectively imparted to the adhesive layer. Through this, the adhesive layer can be easily separated from the adhesive layer during a pickup process to be described later.

The ferromagnetic material may be used in the art. For example, the ferromagnetic material may include at least one of nickel, cobalt, manganese, silicon, iron, alloys thereof, oxides thereof, iron carbide, ferrite, manganese tin oxide, and iron (III) oxide, The type of magnetic material is not limited.

According to an exemplary embodiment of the present invention, the content of the magnetic material may be more than 100 parts by weight and less than 500 parts by weight based on 100 parts by weight of the thermosetting resin. Specifically, the content of the magnetic material with respect to 100 parts by weight of the thermosetting resin is 105 parts by weight or more and 495 parts by weight or less, 110 parts by weight or more and 485 parts by weight or less, 115 parts by weight or more and 470 parts by weight or less, 120 parts by weight or more and 460 parts by weight. parts by weight or less, 125 parts by weight or more and 450 parts by weight or less, 150 parts by weight or more and 400 parts by weight or less, 175 parts by weight or more and 350 parts by weight or less, 200 parts by weight or more and 300 parts by weight or less, 100 parts by weight or more and 350 parts by weight or less, 130 parts by weight parts by weight or more and 320 parts by weight or more, 155 parts by weight or more and 280 parts by weight or less, 180 parts by weight or more and 250 parts by weight or less, 200 parts by weight or more and 500 parts by weight or less, 200 parts by weight or more and 400 parts by weight or less, 200 parts by weight or more and 350 parts by weight or less, or 200 parts by weight or more and 300 parts by weight or less.

By controlling the content of the magnetic material within the above-described range, magnetism can be effectively imparted to the adhesive layer without degrading the physical properties of the adhesive layer. In addition, when the content of the magnetic material is within the above range, the adhesive layer may be easily separated from the adhesive layer during a pickup process to be described later.

According to an exemplary embodiment of the present invention, the adhesive composition may include a solvent. As the solvent, any solvent used in the art may be used without limitation. For example, the solvent may include at least one of methyl ethyl ketone, ethyl acetate, toluene, xylene, benzene, cyclohexane, and cycloheptane, but the type of the solvent is not limited thereto.

According to an exemplary embodiment of the present invention, the content of the solvent may be 50 parts by weight or more and 350 parts by weight or less based on 100 parts by weight of the thermosetting resin. Specifically, the content of the solvent is 75 parts by weight or more and 300 parts by weight or less, 100 parts by weight or more and 275 parts by weight or less, 150 parts by weight or more and 250 parts by weight or less, 200 parts by weight or more and 225 parts by weight based on 100 parts by weight of the thermosetting resin. 50 parts by weight or more and 300 parts by weight or less, 80 parts by weight or more and 280 parts by weight or less, 100 parts by weight or more and 260 parts by weight or less, 125 parts by weight or more and 250 parts by weight or less, 160 parts by weight or more and 230 parts by weight or less, 180 parts by weight 200 parts by weight or more, 150 parts by weight or more and 350 parts by weight or less, 160 parts by weight or more and 320 parts by weight or less, 175 parts by weight or more and 300 parts by weight or less, 185 parts by weight or more and 275 parts by weight or less, or 200 parts by weight or more and 250 parts by weight or more. may be below.

By adjusting the content of the solvent to the above-described range, the thermosetting resin, the thermoplastic resin, the curing agent and the magnetic material included in the adhesive composition may be more homogeneously mixed. In addition, when the content of the solvent is within the above range, the viscosity of the adhesive composition may be easily adjusted within the range to be described later without changing the physical properties of the adhesive layer.

According to an exemplary embodiment of the present invention, the adhesive composition may further include an inorganic filler and a curing catalyst. The inorganic filler may include at least one of silica, titanium dioxide, aluminum hydroxide, calcium carbonate, magnesium hydroxide, aluminum oxide, talc, and aluminum nitride. By using the above type of inorganic filler, it is possible to improve the adhesion of the adhesive layer and prevent cracks in the semiconductor package.

According to an exemplary embodiment of the present invention, the average particle diameter of the inorganic filler may be 0.03 μm or more and 3 μm or less. Specifically, the inorganic filler may have an average particle diameter of 0.04 μm or more and 2.5 μm or less, or 0.05 μm or more and 2 μm or less. When the average particle diameter of the inorganic filler is within the above range, the dispersion degree of the inorganic filler in the adhesive composition may be improved.

According to an exemplary embodiment of the present invention, the content of the inorganic filler may be 10 parts by weight or more and 400 parts by weight or less, based on 100 parts by weight of the thermosetting resin. Specifically, the content of the inorganic filler is 25 parts by weight or more and 380 parts by weight or less, 50 parts by weight or more and 350 parts by weight or less, 75 parts by weight or more and 320 parts by weight or less, 100 parts by weight or more and 300 parts by weight or less relative to 100 parts by weight of the thermosetting resin. , 150 parts by weight or more and 270 parts by weight or less, or 180 parts by weight or more and 250 parts by weight or less. By adjusting the content of the inorganic filler to the above-mentioned range, the mechanical properties of the adhesive layer can be improved, and reliability can be improved by reducing the mismatch of the thermal expansion coefficient of the semiconductor wafer.

According to an exemplary embodiment of the present invention, the curing catalyst may include at least one of a phosphorus-based compound, a boron-based compound, a phosphorus-boron-based compound, and an imidazole-based compound, but is not limited thereto. By using the curing catalyst, the action of the curing agent and curing of the adhesive composition can be accelerated. In addition, the amount of the curing catalyst used may be appropriately selected in consideration of the physical properties of the finally prepared adhesive layer. For example, the content of the curing catalyst may be 1 part by weight or more and 50 parts by weight or less, based on 100 parts by weight of the thermosetting resin.

According to an exemplary embodiment of the present invention, the viscosity of the adhesive composition may be 75 Pa·s or more and 1,000 Pa·s or less. Specifically, the viscosity of the adhesive composition may be 75 Pa·s or more and 1,000 Pa·s or less at 25°C. More specifically, the viscosity of the adhesive composition at 25° C. is 80 Pa·s or more and 950 Pa·s or less, 100 Pa·s or more and 900 Pa·s or less, 150 Pa·s or more and 850 Pa·s or less, 200 Pa·s or more. 800 Pa·s or more, 250 Pa·s or more and 750 Pa·s or less, 300 Pa·s or more and 700 Pa·s or less, 350 Pa·s or more and 650 Pa·s or less, 400 Pa·s or more and 600 Pa·s or less , 450 Pa·s or more and 550 Pa·s or less, 480 Pa·s or more and 500 Pa·s or less, 75 Pa·s or more and 850 Pa·s or less, 90 Pa·s or more and 825 Pa·s or less, 110 Pa·s or more 790 Pa·s or less, 130 Pa·s or more and 760 Pa·s or less, 160 Pa·s or more and 730 Pa·s or less, 210 Pa·s or more and 680 Pa·s or less, 260 Pa·s or more and 620 Pa·s or less, 310 Pa·s or more and 580 Pa·s or less, 340 Pa·s or more and 560 Pa·s or less, 380 Pa·s or more and 530 Pa·s or less, 100 Pa·s or more and 600 Pa·s or less, 150 Pa·s or more and 570 Pa·s or less, 200 Pa·s or more and 550 Pa·s or less, 220 Pa·s or more and 530 Pa·s or less, or 250 Pa·s or more and 500 Pa·s or less.

By adjusting the viscosity of the adhesive composition in the above-described range, the magnetic material included in the adhesive composition may be effectively magnetized. Specifically, when the viscosity of the adhesive composition is within the aforementioned range, the magnetization direction of the magnetic material may be more easily deflected to one side in the process of magnetizing the magnetic material. In addition, when the viscosity of the adhesive composition is within the above range, it is possible to effectively suppress a change in the position of the magnetic material deflected to one side during drying or thermal curing of the adhesive composition.

Throughout this specification, the viscosity may be a value measured with a Brookfield viscometer at the corresponding temperature. Specifically, after defoaming the adhesive composition in a bubble-free state, sample 0.5 mL using a 5 mL syringe, maintain constant temperature at 25 ° C with a Brook field HB No. 40 spindle, and increase the viscosity for 10 minutes measurement, and the Pa·s value at the time of no change in viscosity is measured.

According to an exemplary embodiment of the present invention, the thickness of the adhesive layer may be 10 μm or more and 200 μm or less. Specifically, the thickness of the adhesive layer is 15 μm or more and 150 μm or less, 20 μm or more 100 μm or less, 35 μm or more and 75 μm or less, 10 μm or more and 100 μm or less, 15 μm or more and 70 μm or less, or 20 μm or more and 50 μm or less. can

When the thickness of the adhesive layer is within the above range, it is possible to stably support the wafer during the dicing process, and it is possible to effectively prevent the adhesive layer from being deformed during the pickup process.

According to an exemplary embodiment of the present invention, the adhesive composition may further include an additive including at least one of a leveling agent, a coupling agent, and a dispersing agent, if necessary.

According to an exemplary embodiment of the present invention, the base film is a polyolefin film, a polyester film, a polycarbonate film, a polyvinyl chloride film, a polytetrafluoroethylene film, a polybutene film, a polybutadiene film, a vinyl chloride copolymer film, It may include at least one of an ethylene-vinyl acetate copolymer film, an ethylene-propylene copolymer film, and an ethylene-alkyl acrylate copolymer film. However, the type of the base film is not limited, and the base film used in the art may be used without limitation.

According to an exemplary embodiment of the present invention, the thickness of the base film may be 10 μm or more and 200 μm or less. Specifically, the thickness of the base film is 20 μm or more and 180 μm or less, 50 μm or more and 150 μm or less, 70 μm or more and 130 μm or less, 90 μm or more and 120 μm or less, 10 μm or more and 150 μm or less, 25 μm or more and 125 μm or less. , 50 μm or more and 100 μm or less, 70 μm or more and 90 μm or less, 100 μm or more and 200 μm or less, 120 μm or more and 180 μm or less, or 140 μm or more and 160 μm or less. When the thickness of the base film is within the above range, the wafer may be stably supported during the dicing process, and the wafer may be easily picked up after dicing is completed.

According to an exemplary embodiment of the present invention, the pressure-sensitive adhesive layer may include the pressure-sensitive adhesive composition. Specifically, the pressure-sensitive adhesive layer may include a dried product (or a thermosetting product) of the pressure-sensitive adhesive composition.

According to an exemplary embodiment of the present invention, a method of forming an adhesive layer on one surface of the base film is not particularly limited. For example, a method of coating the adhesive composition on the base film and drying it to form an adhesive layer, or applying the adhesive composition on a release film and drying to form the adhesive layer and using the release film to form the adhesive layer A method of transferring to a base film, etc. can be used.

At this time, the method for applying and drying the pressure-sensitive adhesive composition is not particularly limited, and for example, the pressure-sensitive adhesive composition as it is, or diluted in a suitable organic solvent, applied by known means such as a comb coater, gravure coater, die coater or reverse coater. After that, a method of drying the solvent may be used. In addition, in the above process, an aging process may be additionally performed for a sufficient crosslinking reaction of the adhesive layer to proceed.

According to an exemplary embodiment of the present invention, the pressure-sensitive adhesive composition may include a (meth)acrylate-based resin, a crosslinking agent, and a photoinitiator.

According to an exemplary embodiment of the present invention, the (meth)acrylate-based resin may be a copolymer of a (meth)acrylate-based monomer and a crosslinkable functional group-containing monomer. The (meth) acrylate-based monomer is a monomer having an alkyl group having 1 to 12 carbon atoms, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl ( Meth)acrylate, hexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, dodecyl (meth)acrylate and decyl (meth)acrylate ) may include at least one of acrylates. Since the glass transition temperature of the final copolymer decreases as the number of carbon atoms of the alkyl contained in the (meth)acrylate-based monomer increases, an appropriate monomer may be selected according to the desired glass transition temperature.

According to an exemplary embodiment of the present invention, the crosslinkable functional group-containing monomer may include at least one of a hydroxyl group-containing monomer, a carboxyl group-containing monomer, and a nitrogen-containing monomer. Specifically, the hydroxyl group-containing monomer may include at least one of 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate, and the carboxyl group-containing monomer may include (meth)acrylic acid. and the nitrogen-containing monomer may include at least one of (meth)acrylonitrile, N-vinyl pyrrolidone, and N-vinyl caprolactam. However, the types of the hydroxyl group-containing monomer, the carboxyl group-containing monomer and the nitrogen-containing monomer are not limited.

In addition, from the viewpoint of improving other functionalities such as compatibility, the (meth)acrylate-based resin may further include vinyl acetate, styrene or acrylonitrile carbon-carbon double bond-containing low molecular weight compounds.

According to an exemplary embodiment of the present invention, the weight average molecular weight of the (meth)acrylate-based resin may be 100,000 g/mol or more and 1,500,000 g/mol or less. Specifically, the (meth) acrylate-based resin has a weight average molecular weight of 150,000 g/mol or more and 1,300,000 g/mol or less, 300,000 g/mol or more and 1,100,000 g/mol or less, 500,000 g/mol or more and 900,000 g/mol or less, 700,000 g/mol or more and 850,000 g/mol or more, 450,000 g/mol or more and 1,300,000 g/mol or less, 550,000 g/mol or more and 1,200,000 g/mol or less, 650,000 g/mol or more and 1,000,000 g/mol or less, 700,000 g/mol or more and 950,000 g /mol or less, or 750,000 g/mol or more and 850,000 g/mol or less. When the weight average molecular weight of the (meth)acrylate-based resin satisfies the aforementioned range, it is possible to effectively prevent the adhesive layer from being destroyed or deformed during the wafer pickup process, and the adhesive layer can be peeled off from the base film and the adhesive layer can be effectively prevented.

According to an exemplary embodiment of the present invention, the pressure-sensitive adhesive composition may further include an ultraviolet curable compound. Specifically, the UV-curable compound may be used as an additive type. That is, the pressure-sensitive adhesive composition may additionally include the UV-curable compound (additive type) in addition to the (meth)acrylate-based resin, crosslinking agent, and photoinitiator. The molecular weight (weight average molecular weight) of the UV-curable compound may be 500 g/mol or more and 300,000 g/mol or less. The ultraviolet curable compound may include at least one of a (meth)acrylate-based isocyanate compound, a polyfunctional urethane (meth)acrylate-based compound, a polyfunctional (meth)acrylate-based monomer, and a polyfunctional (meth)acrylate-based oligomer. can However, the type of the UV-curable compound is not limited, and an appropriate compound used in the art may be selected and used according to the intended use.

According to an exemplary embodiment of the present invention, in the (meth)acrylate-based resin, the ultraviolet curable compound may be bonded to a main chain as a side chain. Specifically, the UV-curable compound may be used as a bonding type. That is, the pressure-sensitive adhesive composition does not separately include the UV-curable compound, but may include a (meth)acrylate-based resin to which the UV-curable compound (binding type) is bonded. The UV-curable compound bonded to the main chain of the (meth)acrylate-based resin has 1 to 5 photocurable functional groups (eg, UV-polymerizable carbon-carbon double bond) per molecule, specifically 1 or Can contain two. In addition, the type of the UV-curable compound is not particularly limited as long as it has a functional group capable of reacting with a crosslinkable functional group included in the main chain of the (meth)acrylate-based resin. In this case, the ultraviolet curable compound may include an isocyanate group or an epoxy group, which is a functional group capable of reacting with a crosslinkable functional group of the (meth)acrylate-based resin main chain. However, the type of the functional group included in the UV-curable compound is not limited.

According to an exemplary embodiment of the present invention, when a hydroxyl group is included in the (meth)acrylate-based resin main chain, the UV-curable compound is acrylic isocyanate, (meth)acryloyloxy isocyanate, (meth)acryloyloxymethyl Isocyanate, 2-(meth)acryloyloxy ethyl isocyanate, 3-(meth)acryloyloxy propyl isocyanate, 4-(meth)acryloyloxy butyl isocyanate, m-propenyl-α, α-dimethylbenzylisocyanate , methacryloyl isocyanate, or allyl isocyanate; an acryloyl monoisocyanate compound obtained by reacting a diisocyanate compound or a polyisocyanate compound with 2-hydroxyethyl (meth)acrylic acid; an acryloyl monoisocyanate compound obtained by reacting a diisocyanate compound or a polyisocyanate compound with a polyol compound and 2-hydroxyethyl (meth)acrylic acid; may include at least one of Meanwhile, when the (meth)acrylate-based resin main chain includes a carboxyl group, the UV-curable compound may include at least one of glycidyl (meth)acrylate and allyl glycidyl ether.

According to an exemplary embodiment of the present invention, the content of the ultraviolet curable compound may be 5 parts by weight or more and 400 parts by weight or less, based on 100 parts by weight of the (meth)acrylate-based resin. Specifically, the content of the above-described UV-curable compound means the respective content when the UV-curable compound is used as an additive type and when used as a bonding type. More specifically, based on 100 parts by weight of the (meth)acrylate-based resin, the content of the UV-curable compound is 7.5 parts by weight or more and 350 parts by weight or less, 10 parts by weight or more and 200 parts by weight or less, 5 parts by weight or more and 50 parts by weight. or less, 6.5 parts by weight or more and 40 parts by weight or less, 7 parts by weight or more and 35 parts by weight or less, 8.5 parts by weight or more and 25 parts by weight or less, or 10 parts by weight or more and 20 parts by weight or less. When the content of the UV-curable compound is within the above range, the adhesive layer has excellent adhesion to the base film during the dicing process of the wafer, and after light irradiation, the adhesion of the adhesive layer is appropriately reduced, so that the pick-up property of the wafer is deterioration can be prevented.

According to an exemplary embodiment of the present invention, the crosslinking agent may include at least one of an isocyanate-based compound, an aziridine-based compound, an epoxy-based compound, and a metal chelate-based compound. However, the type of the crosslinking agent is not limited, and a crosslinking agent used in the art may be selected and used.

According to an exemplary embodiment of the present invention, the content of the crosslinking agent may be 5 parts by weight or more and 20 parts by weight or less, based on 100 parts by weight of the (meth)acrylate-based resin. Specifically, based on 100 parts by weight of the (meth)acrylate-based resin, the content of the crosslinking agent may be 7.5 parts by weight or more and 18.5 parts by weight or less, or 10 parts by weight or more and 15 parts by weight or less. When the content of the crosslinking agent is within the above-mentioned range, the adhesive layer may have excellent cohesive strength, and may suppress chip scattering by maintaining excellent adhesive strength to the base film and the second adhesive layer before light irradiation. In addition, by adjusting the content of the crosslinking agent to the above-described range, the first adhesive layer is stably cured by light irradiation, thereby implementing better pickup properties.

According to an exemplary embodiment of the present invention, a photoinitiator used in the art may be used as the photoinitiator. The content of the photoinitiator is based on 100 parts by weight of the (meth)acrylate-based resin, 0.1 parts by weight or more and 20 parts by weight or less, 0.3 parts by weight or more and 15 parts by weight or less, 0.5 parts by weight or more and 10 parts by weight or more, 0.8 parts by weight or more It may be 7.5 parts by weight or less, or 1 part by weight or more and 5 parts by weight or less. By adjusting the content of the photoinitiator to the above-mentioned range, it is possible to prevent a decrease in the pick-up property of the wafer due to insufficient curing reaction of the adhesive layer according to light irradiation. In addition, when the content of the photoinitiator is within the above range, the adhesive force of the adhesive layer is appropriately reduced after light irradiation to maintain the adhesive force to the base film, thereby further improving the pickup property of the wafer.

According to an exemplary embodiment of the present invention, the adhesive layer may include a tackifier such as a rosin resin, a terpene resin, a phenol resin, a styrene resin, an aliphatic petroleum resin, an aromatic petroleum resin, or an aliphatic aromatic copolymerized petroleum resin. .

According to an exemplary embodiment of the present invention, the thickness of the adhesive layer may be 5 μm or more and 100 μm or less. Specifically, the thickness of the adhesive layer is 7.5 μm or more and 75 μm or less, 7.5 μm or more and 75 μm or less, 10 μm or more and 50 μm or less, 20 μm or more and 35 μm or less, 5 μm or more and 50 μm or less, 7 μm or more and 30 μm or less. Or it may be 10 μm or more and 20 μm or less. When the thickness of the adhesive layer is within the aforementioned range, the wafer may be stably fixed to the base film during the dicing process. In addition, by adjusting the thickness of the adhesive layer in the above-described range, it is possible to effectively prevent the adhesive layer from being peeled from the base film and the adhesive layer during the wafer pickup process.

2A is a view showing dicing a wafer using a dicing die bonding film according to an exemplary embodiment of the present invention, and FIG. 2B is a dicing using a dicing die bonding film according to an exemplary embodiment of the present invention. It is a diagram showing the pickup of the old wafer.

Specifically, FIG. 2A is a view illustrating that the wafer W is attached to the adhesive layer 30 of the dicing die-bonding film, and the wafer W is diced. FIG. 2B is a diagram illustrating pickup of the adhesive layer 30 to which the diced wafer W is attached from the adhesive layer 20 .

An exemplary embodiment of the present invention provides a method of manufacturing a semiconductor package using the dicing die bonding film.

According to an exemplary embodiment of the present invention, the method for manufacturing the semiconductor package includes attaching a wafer to an adhesive layer of the dicing die bonding film, dicing the wafer into a predetermined shape, and the dicing die bonding A step of curing the adhesive layer by irradiating light to the adhesive layer of the film, and picking up the adhesive layer to which the diced wafer is attached from the adhesive layer, wherein the picking up has a repulsive force with respect to the adhesive layer. It may be to use an actuated push unit.

Referring to FIG. 2A , the wafer W is attached to the adhesive layer 30 of the dicing die-bonding film, and the wafer W, the adhesive layer 30 and the adhesive layer 20 are cut into a predetermined shape through dicing. can do. Thereafter, by irradiating UV to the dicing die-bonding film, the adhesive layer 20 may be photocured. Conditions such as a wavelength value and light amount of UV irradiated to the dicing die-bonding film may be set in consideration of physical properties such as a photoinitiator included in the adhesive layer.

As shown in FIG. 2B , the step of picking up the wafer W may be performed using the push unit 1 and the pick-up unit 2 . The push unit 1 may be magnetized so that a repulsive force is applied to the magnetic material 35 included in the adhesive layer 30 . Referring to FIG. 2b, in the direction from the base film 10 of the dicing die bonding film to the adhesive layer 30, the lower side of the adhesive layer 30 is magnetized to the S pole, and the upper side of the push unit 1 is S can be polarized. At this time, when the push unit 1 is moved in the A direction, the adhesive layer 30 may be easily separated from the adhesive layer 20 by the repulsive force. The pickup unit 2 may adsorb the diced wafer W by forming a vacuum. Meanwhile, unlike shown in FIG. 2B , the lower side of the adhesive layer 30 may be magnetized to the N pole, and the upper side of the push unit 1 may be magnetized to the N pole.

According to an exemplary embodiment of the present invention, the upper area of the push unit may be smaller than the area of the diced adhesive layer. Through this, it is possible to effectively reduce the repulsive force acting between the push unit and the adhesive layer from affecting the adhesive layer disposed in the vicinity.

Hereinafter, examples will be given to describe the present invention in detail. However, the embodiments according to the present invention may be modified in various other forms, and the scope of the present invention is not to be construed as being limited to the embodiments described below. The embodiments of the present specification are provided to more completely explain the present invention to those of ordinary skill in the art.

Example 1

Preparation of adhesive composition

A first (meth)acrylic having a weight average molecular weight of 850,000 g/mol by copolymerizing 75 g of 2-ethylhexyl acrylate, 10 g of 2-ethylhexyl methacrylate, and 15 g of 2-hydroxyethyl acrylate in 300 g of an ethyl acrylate solvent A rate-based resin was obtained. Then, 10 parts by weight of an acrylic isocyanate compound, which is an ultraviolet curable compound, was added to 100 parts by weight of the obtained (meth)acrylate-based resin to obtain a reaction product.

Thereafter, the reaction product was mixed with a polyfunctional isocyanate oligomer as a crosslinking agent and Daroker TPO as a photoinitiator to prepare an adhesive composition. At this time, based on 100 parts by weight of the obtained (meth)acrylate-based resin, the content of the crosslinking agent was 10 parts by weight, and the content of the photoinitiator was 1 part by weight.

Preparation of adhesive composition

100 parts by weight of a liquid epoxy resin as a thermosetting resin (RE-310S, Nippon Chemicals, bisphenol A epoxy resin, an epoxy equivalent of 180 g/eq), an acrylate resin (KG-3015, a glycidyl methacrylate repeating unit as a thermoplastic resin) Including 3% by weight, weight average molecular weight 900,000 g/mol, glass transition temperature 10° C.) 100 parts by weight, as a curing agent phenol resin (KH-6021, DIC, bisphenol A novolac resin, hydroxyl equivalent weight 121 g/eq, softening point 133° C.) ) 100 parts by weight, 200 parts by weight of ferromagnetic iron oxide (III; HF-03C, Nofion) as a magnetic material, 4 parts by weight of 2-methylimidazole (Curezol 2MZ-H, SHIKOKU) as a curing catalyst, spherical silica as an inorganic filler (SC-2020, Admatec, average particle diameter about 400 nm) 200 parts by weight, 3-glycidoxypropyl trimethoxysilane (KBM-403, Shin-Etsu chemical) 2 parts by weight as a solvent, methyl ethyl ketone as a coupling agent 200 parts by weight were stirred and mixed to prepare an adhesive composition (solid content: 40% by weight).

Manufacture of dicing film

The prepared pressure-sensitive adhesive composition was applied to a release-treated PET film having a thickness of 38 µm to a thickness of 10 µm after drying, and dried at 110° C. for 3 minutes to prepare an adhesive layer. Thereafter, the prepared adhesive layer was laminated on a polyolefin base film having a thickness of 100 μm.

Manufacture of dicing die bonding film

The prepared adhesive composition is applied on a release-treated polyethylene terephthalate (PET) film having a thickness of 38 μm, and the PET film coated with the adhesive composition is passed between two panels to deflect the magnetic material to one side. and dried for 3 minutes to prepare an adhesive layer with a thickness of about 50 μm.

At this time, each of the two panels has a width of 40 cm and a length of 40 cm. In addition, one panel is placed on the upper side (adhesive composition side) of the PET film coated with the adhesive composition at intervals of 1 cm, and the other panel is placed on the lower side of the PET film coated with the adhesive composition (PET film side) and They were positioned to be spaced apart by an interval of 1 cm, and a DC voltage of 10 V was applied to the two panels. In addition, the time for the PET film coated with the adhesive composition to pass between the two panels was adjusted to about 20 seconds.

Thereafter, the adhesive layer prepared on the adhesive layer of the dicing film prepared above ^{is laminated at 30° C. under the conditions of 5 kgf/cm 2} using a polarminator (Fujishoko) and cut in a circle, the base film, the adhesive layer , and a dicing die-bonding film provided with an adhesive layer sequentially was prepared.

Example 2

An adhesive composition, an adhesive composition, a dicing film, and a dicing die-bonding film were prepared in the same manner as in Example 1, except that ferrite was used as the ferromagnetic material included in the adhesive composition in Example 1.

Comparative Example 1

A pressure-sensitive adhesive composition, an adhesive composition, a dicing film, and a dicing die-bonding film were prepared in the same manner as in Example 1, except that the content of methyl ethyl ketone included in the adhesive composition in Example 1 was adjusted to 400 parts by weight. prepared.

Comparative Example 2

A pressure-sensitive adhesive composition, an adhesive composition, a dicing film, and a dicing die-bonding film were prepared in the same manner as in Example 1, except that the content of methyl ethyl ketone included in the adhesive composition in Example 1 was adjusted to 40 parts by weight. prepared.

Comparative Example 3

A pressure-sensitive adhesive composition, an adhesive composition, a dicing film, and a dicing die-bonding film were prepared in the same manner as in Example 1, except that the content of the magnetic material included in the adhesive composition in Example 1 was adjusted to 100 parts by weight. did

Comparative Example 4

An adhesive composition, an adhesive composition, a dicing film, and a dicing die-bonding film were prepared in the same manner as in Example 1, except that the content of the magnetic material included in the adhesive composition in Example 1 was adjusted to 500 parts by weight. did

Experimental example

1. Viscosity Measurement of Adhesive Compositions

The viscosity of the adhesive compositions prepared in Examples 1 to 2 and Comparative Examples 1 to 4 was measured. For extermination, after defoaming the adhesive composition in a bubble-free state, sample 0.5 mL using a 5 mL syringe, maintain constant temperature at 25 ° C with a Brook field HB No. 40 spindle, and maintain the viscosity for 10 minutes was measured to measure the Pa·s value at the point in time when there was no change in viscosity, and the measured viscosity values are shown in Table 1 below.

2. Measurement of melt viscosity of adhesive layer

The adhesive layer prepared in Example 1 was overlapped to have a thickness of 600 μm, and laminated using a laminator at 60° C. to prepare a specimen. Thereafter, the prepared specimen was molded into a circle having a diameter of 8 mm, and the change in viscosity was measured at a shear rate of 5 rad/s by ARES (TA), a temperature range of 25° C. to 200° C., and a temperature increase rate of 10° C./min. and the lowest value among the measured viscosity values was obtained as the melt viscosity.

For the adhesive layers prepared in Example 2 and Comparative Examples 1 to 4, melt viscosities were obtained in the same manner as above, and are shown in Table 1 below.

3. Magnetization evaluation

Magnetization evaluation of the adhesive layers prepared in Examples 1 to 2 and Comparative Examples 1 to 4 was performed as follows.

Specifically, after cutting the adhesive layer prepared in Example 1 to a size of 1 cm × 1 cm, a neodymium magnet is applied to it, and when a movement of 1 mm or more is observed, it is evaluated as "O", and the movement distance is 1 If it was less than mm, it was evaluated as "Δ", and if there was no movement, it was evaluated as "X".

In addition, the adhesive layers prepared in Example 2 and Comparative Examples 1 to 4 were also subjected to magnetization evaluation in the same manner as above, and the results are shown in Table 1 below.

4. Pickup Rating

Wafer pickup evaluation of the dicing die-bonding films prepared in Examples 1 to 2 and Comparative Examples 1 to 4 was performed as follows.

Specifically, the dicing die-bonding film prepared in Example 1 was prepared, and a mirror wafer (8 inches, 60 μm thick) was mounted on the adhesive layer of the dicing die-bonding film at a temperature of 60° C., and then the chip size was 1 mm x Dicing was performed under the following conditions so as to be 1 mm. Thereafter, the diced sample was irradiated with ultraviolet rays with a light quantity of 300 mJ/cm ² to the base film side of the dicing die-bonding film to prepare a pick-up measurement sample.

Pickup was performed on the prepared sample using SPA-400 (SHINKAWA) under the following conditions, and the minimum needle pin height for achieving 100% pickup success rate was measured.

In addition, the pick-up evaluation was performed in the same manner as above for the dicing die-bonding films prepared in Example 2 and Comparative Examples 1 to 4, and the results are shown in Table 1 below.

<Dicing conditions>

Instrument: DFD-650 (DISCO)

Blade type: 27HEBB (DISCO)

Cutting blade height: 80 um

Dicing speed: 50 mm/s

Blade speed: 40,000 rpm

<Pick-up conditions>

Device: SPA-400 (SHINKAWA)

Expanding height: 3.5 mm

Number of needles: 20

Needle plunge up speed: 10 mm/s

5. Evaluation of changes over time at room temperature

Examples 1 to 2 and Comparative Examples 1 to 4 were evaluated as follows.

Specifically, after the adhesive film prepared in Example 1 (the adhesive layer is formed on the PET film) was left at 25 ° C., the amount of change in the peak of ΔH was calculated using a differential thermal analyzer (DSC) for each day, and the “2. The amount of change in melt viscosity was calculated through the melt viscosity measurement method in "Measurement of the melt viscosity of the adhesive layer".

At this time, when the peak change rate of ΔH was 20% or more and the change rate of the melt viscosity was 50% or more, it was determined that there was a change with time. If there was no change over time after 4 weeks, it was evaluated as pass (O), and if there was no change over time, it was evaluated as fail (X).

For the adhesive layers prepared in Example 2 and Comparative Examples 1 to 4, the change over time at room temperature was evaluated in the same manner as above, and is shown in Table 1 below.

6. Assessment of landfill properties

The embedding properties of the adhesive layers prepared in Examples 1 to 2 and Comparative Examples 1 to 4 were evaluated as follows.

Specifically, after mounting a mirror wafer (8 inches, thickness 60 μm) on the adhesive layer of the adhesive film (the adhesive layer is formed on the PET film) prepared in Example 1 at a temperature of 60 ° C, the chip size is 1 mm x 1 mm Dicing was performed under the following conditions. Thereafter, the diced sample was irradiated with ultraviolet light with a light quantity of 300 mJ/cm ² to the PET film side of the adhesive film to prepare a sample for measuring embedding properties. Pick-up & Place was performed on the prepared sample using SPA-400 (SHINKAWA) under the following conditions.

At this time, the diced individual chips were die-bonded (1.5 kg, 1.5 s, 120 °C) on a controller (4 mm x 4 mm) having a thickness of 40 µm, and then cured at 140 °C and 7 atmospheres for 30 minutes. . After that, it was checked whether voids were removed around the controller using ultrasonic microscope equipment (SONIX). X) was evaluated.

For the adhesive layers prepared in Example 2 and Comparative Examples 1 to 4, embedding properties were evaluated in the same manner as above, and the results are shown in Table 1 below.

<Dicing conditions>

Instrument: DFD-650 (DISCO)

Blade type: 27HEBB (DISCO)

Cutting blade height: 80 um

Dicing speed: 50 mm/s

Blade speed: 40,000 rpm

<Pick-up conditions>

Device: SPA-400 (SHINKAWA)

Expanding height: 3.5 mm

Number of needles: 20

Needle plunge up height: 0.2 mm

Needle plunge up speed: 10 mm/s

Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Viscosity (Pa s) 480 500 74 1,370 210 890 Melt Viscosity (Pa s) 3,300 3,100 2,600 3,400 1,200 7,950 magnetization evaluation O O X X X O Pickup Rating 0.12 0.13 0.40 0.40 0.34 0.15 Evaluation of changes over time O O O O O O Assessment of landfill characteristics O O O O O X

Referring to Table 1, Examples 1 and 2, in which the viscosity of the adhesive composition and the melt viscosity of the adhesive layer satisfy the above-described ranges, are compared to Comparative Examples 1 to 4, which are out of the aforementioned viscosity range and melt viscosity range. Thus, it was confirmed that the magnetization evaluation and pickup evaluation results were excellent. In addition, it was confirmed that the adhesive layers of Examples 1 and 2 were effectively suppressed from aging and had excellent embedding properties.

Therefore, it can be seen that the pick-up process of the diced wafer can be easily performed using the dicing die-bonding film according to an exemplary embodiment of the present invention.

100: dicing die bonding film
10: base film
20: adhesive layer
30: adhesive layer
35: magnetic material
1: Push unit
2: Pickup unit
W: Wafer

Claims (12)

base film;
an adhesive layer provided on one surface of the base film and comprising an adhesive composition; and
It is provided on one surface of the adhesive layer, and includes an adhesive layer comprising an adhesive composition;
The adhesive composition includes a thermosetting resin, a thermoplastic resin, a curing agent, a magnetic material and a solvent,
A dicing die-bonding film having a melt viscosity of the adhesive layer greater than 2,600 Pa·s and less than 3,400 Pa·s.
The method according to claim 1,
The viscosity of the adhesive composition is 75 Pa·s or more and 1,000 Pa·s or less of a dicing die-bonding film.
The method according to claim 1,
The thermosetting resin is a dicing die-bonding film comprising at least one of a solid epoxy resin and a liquid epoxy resin.
The method according to claim 1,
The thermoplastic resin is a polyimide-based resin, a polyether imide-based resin, a polyester imide-based resin, a polyamide-based resin, a polyether sulfone-based resin, a polyether ketone-based resin, a polyolefin-based resin, a polyvinyl chloride-based resin, and a phenoxy group. A dicing die-bonding film comprising at least one of a resin, a butadiene-based rubber, a styrene-butadiene-based rubber, a modified butadiene-based rubber, a reactive butadiene acrylonitrile copolymer rubber, and a (meth)acrylate-based resin.
The method according to claim 1,
The content of the thermoplastic resin, the dicing die-bonding film will be 5 parts by weight or more and 350 parts by weight or less based on 100 parts by weight of the thermosetting resin.
The method according to claim 1,
The content of the curing agent, the dicing die-bonding film will be 10 parts by weight or more and 500 parts by weight or less based on 100 parts by weight of the thermosetting resin.
The method according to claim 1,
In a direction from the base film toward the adhesive layer, the magnetic material is deflected to one side and is magnetized. A dicing die-bonding film.
The method according to claim 1,
The magnetic material is a dicing die-bonding film comprising a ferromagnetic material.
The method according to claim 1,
The content of the magnetic material, the dicing die-bonding film that exceeds 100 parts by weight and less than 500 parts by weight based on 100 parts by weight of the thermosetting resin.
The method according to claim 1,
The content of the solvent, the dicing die-bonding film will be 50 parts by weight or more and 350 parts by weight or less based on 100 parts by weight of the thermosetting resin.
The method according to claim 1,
The thickness of the adhesive layer is a dicing die-bonding film of 10 μm or more and 200 μm or less.
The method according to claim 1,
The adhesive composition is a dicing die-bonding film comprising a (meth)acrylate-based resin, a crosslinking agent, and a photoinitiator.

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