KR20220001048A - Apparatus for manufacturing a display device - Google Patents

Abstract

The present invention provides a manufacturing device of a display device which comprises: a crucible containing a deposition material; a nozzle disposed on one side of the crucible to guide a path through which a deposition material is sprayed toward a substrate; and a cover disposed on a surface of the deposition material accommodated in the crucible.

Description

Apparatus for manufacturing a display device

The present invention relates to a manufacturing apparatus, and more particularly, to an apparatus for manufacturing a display device having improved deposition uniformity.

For example, in a thin film manufacturing process such as forming a thin film of an organic light emitting diode display, a deposition process in which a deposition material is evaporated to adhere to the surface of a substrate is widely used. That is, a deposition process is used in which a mask is placed on a substrate and vapor of a deposition material is passed through an opening of the mask to form a thin film having a desired pattern on the substrate.

SUMMARY Embodiments of the present invention provide an apparatus for manufacturing a display device having improved deposition uniformity.

According to one aspect of the present invention, a crucible in which the deposition material is accommodated; a nozzle disposed on one side of the crucible to guide a path through which the deposition material is sprayed toward the substrate; and a cover disposed on a surface of the deposition material accommodated in the crucible.

In this embodiment, the cover may be disposed directly on the surface of the deposition material accommodated in the crucible.

In this embodiment, the deposition material accommodated in the crucible may have a first area, and the cover may have a second area smaller than the first area.

In this embodiment, the cover may expose at least a portion of the surface of the deposition material accommodated in the crucible.

In this embodiment, the surface of the deposition material to which the at least part is exposed may be 10% to 50% of the total area of the surface of the deposition material.

In this embodiment, the deposition material accommodated in the crucible may have a first specific gravity, and the cover may have a second specific gravity smaller than the first specific gravity.

In this embodiment, the deposition material accommodated in the crucible may include silver (Ag).

In this embodiment, the cover may include at least one of carbon, graphite, pyrolytic boron nitride, pyrolytic graphite, and mullite.

In this embodiment, the cover may be provided in a circular shape.

In this embodiment, the cover may be provided in a polygonal shape.

In this embodiment, the cover may have irregularities formed on the surface facing the nozzle.

In this embodiment, the crucible may be provided in a cylindrical shape.

In this embodiment, a heater for heating the deposition material accommodated in the crucible may be further included.

In this embodiment, the deposition material accommodated in the crucible may be heated by the heater and sprayed toward the substrate.

According to another aspect of the present invention, there is provided a mask comprising: a mask comprising an opening; a crucible containing a deposition material; a nozzle disposed on one side of the crucible to guide a path through which the deposition material is sprayed toward the substrate; and a cover disposed on a surface of the deposition material accommodated in the crucible, wherein the deposition material accommodated in the crucible is sprayed through the nozzle and passed through the opening to be deposited on the substrate; provided

In this embodiment, the cover may be disposed directly on the surface of the deposition material accommodated in the crucible.

In this embodiment, the surface of the deposition material accommodated in the crucible may have a first area, and the cover may have a second area smaller than the first area.

In this embodiment, the deposition material accommodated in the crucible may have a first specific gravity, and the cover may have a second specific gravity smaller than the first specific gravity.

In this embodiment, the deposition material accommodated in the crucible may include silver (Ag).

In this embodiment, the cover may include at least one of carbon, graphite, pyrolytic boron nitride, pyrolytic graphite, and mullite.

Other aspects, features and advantages other than those described above will become apparent from the following detailed description, claims and drawings for carrying out the invention.

According to an embodiment of the present invention made as described above, a cover is disposed on the surface of the deposition material accommodated in the crucible to prevent a splash defect from occurring, thereby realizing an apparatus for manufacturing a display device with improved deposition uniformity. can Of course, the scope of the present invention is not limited by these effects.

1 is a plan view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment.
2 is a perspective view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment.
3 is a perspective view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment.
4 is a cross-sectional view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment.
5 is a plan view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment.
6 is a plan view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment.
7 is a plan view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment.
8 is a cross-sectional view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment.
9 is a perspective view schematically illustrating a display device manufactured by using the device for manufacturing a display device according to an exemplary embodiment.
10 is a cross-sectional view schematically illustrating a display device manufactured by using an apparatus for manufacturing a display device according to an exemplary embodiment.

Since the present invention can apply various transformations and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. Effects and features of the present invention, and a method for achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

In the following embodiments, terms such as first, second, etc. are used for the purpose of distinguishing one component from another, not in a limiting sense.

In the following examples, the singular expression includes the plural expression unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have means that the features or components described in the specification are present, and the possibility that one or more other features or components will be added is not excluded in advance.

In the following embodiments, when it is said that a part such as a film, region, or component is on or on another part, not only when it is directly on the other part, but also another film, region, component, etc. is interposed therebetween. Including cases where there is

In the drawings, the size of the components may be exaggerated or reduced for convenience of description. For example, since the size and thickness of each component shown in the drawings are arbitrarily indicated for convenience of description, the present invention is not necessarily limited to the illustrated bar.

In the present specification, "A and/or B" refers to A, B, or A and B. Also, in the present specification, "at least one of A and B" refers to A, B, or A and B.

In the following embodiments, the meaning of the wiring "extending in the first direction or the second direction" includes not only extending linearly, but also extending in a zigzag or curved manner along the first or second direction .

In the following embodiments, when "on a plane", it means when the target part is viewed from above, and when "in cross-section", it means when viewed from the side of a cross section cut vertically of the target part. In the following examples, when referring to "overlap", it includes "on a plane" and "on a cross-section" overlap.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and the same or corresponding components are given the same reference numerals when described with reference to the drawings.

1 is a plan view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment.

Referring to FIG. 1 , an apparatus 300 for manufacturing a display device according to an exemplary embodiment includes a chamber 301 , a mask 310 , a magnetic force generator 320 , a vision unit 330 , a pressure control unit 390 , and an evaporation source 400 .

The chamber 301 may have a space formed therein. Although not shown, the chamber 301 may be formed to be partially opened, and a gate valve or the like may be disposed in the opened portion of the chamber 301 to open or shield the opened portion of the chamber 301 .

The mask 310 may include an opening through which the deposition material may pass. In one embodiment, the mask 310 may include a mask sheet and a mask frame fixed to the mask sheet. One mask sheet or a plurality of mask sheets may be fixed to the mask frame.

A substrate 100 on which a deposition material is deposited may be disposed on the mask 310 , and an electrostatic chuck (not shown) may be disposed on the substrate 100 . The electrostatic chuck may serve to fix the substrate 100 using an electrostatic force and to attach the substrate 100 to the mask 310 . The electrostatic chuck may be coupled to the substrate 100 to prevent the substrate 100 from moving during alignment and deposition of a deposition material. Also, it is possible to prevent the gas filled between the electrostatic chuck and the substrate 100 from leaking out and lifting the substrate 100 by the gas.

The magnetic force generator 320 may be disposed in the chamber 301 to attach the mask 310 to the substrate 100 . The magnetic force generator 320 may be disposed to overlap the electrostatic chuck. By disposing the magnetic force generator 320 to overlap the electrostatic chuck, the substrate 100 and the mask 310 can be brought into close contact with each other by not only electrostatic force but also magnetic force. By using the magnetic force generating unit 320 to attract the mask 310 by magnetic force, it is possible to prevent the substrate 100 and the mask 310 from sagging.

The vision unit 330 may be disposed in the chamber 301 to photograph positions of the substrate 100 , the mask 310 , and the deposition source 400 . Based on the positions of the substrate 100 , the mask 310 , and the deposition source 400 photographed by the vision unit 330 , the substrate 100 , the mask 310 , and the deposition source 400 may be aligned. have.

The pressure adjusting unit 390 may be connected to the chamber 301 to adjust the pressure inside the chamber 301 . In this case, the pressure control unit 390 may include a connection pipe 391 connected to the chamber 301 , and a pump 393 disposed in the connection pipe 391 . In this case, the connecting pipe 391 may be connected to a separate device capable of removing external contaminants.

The apparatus 300 for manufacturing a display device according to an embodiment may further include an evaporation source 400 . The deposition source 380 may be disposed inside the chamber 301 . A deposition material may be accommodated in the deposition source 400 .

2 is a perspective view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment, FIG. 3 is a perspective view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment, and FIG. 4 is an exemplary embodiment. It is a cross-sectional view schematically illustrating an apparatus for manufacturing a display device.

More specifically, FIGS. 2 and 3 are perspective views schematically illustrating an evaporation source 400 included in an apparatus 300 for manufacturing a display device according to an exemplary embodiment, and FIG. 4 is a display device according to an exemplary embodiment. It is a cross-sectional view schematically showing the deposition source 400 included in the manufacturing apparatus 300 of the

2, 3, and 4 , the deposition source 400 according to an exemplary embodiment includes a crucible 410 in which the deposition material 450 is accommodated, and is disposed on the crucible 410 to accommodate the deposition material 450 . ) is located on the side and/or lower surface of the nozzle 430, the crucible 410, and a nozzle 430 for guiding the path to be sprayed toward the substrate 100, and a heater 480 for heating the deposition material 450 accommodated in the crucible 410. may include

In an embodiment, the deposition source 400 may include a crucible 410 , a nozzle 430 , and a housing 490 for accommodating the heater 480 . A plurality of crucibles 410 may be accommodated in the housing 490 .

Here, the manufacturing apparatus 300 according to an embodiment describes that the upper portion of the crucible 410 is opened as the deposition source 400 is located at the lower portion of the chamber 301 , but the opening of the crucible 410 is The portion may be a side or a lower portion depending on the location of the deposition source 400 .

The crucible 410 may have a space formed therein to accommodate the deposition material 450 , and may be formed such that one side thereof is opened. In this case, the deposition material 450 may include an organic material or a metal. For example, the deposition material 450 may include silver (Ag).

In one embodiment, as shown in FIG. 3 , the crucible 410 may be provided in a cylindrical shape. However, the crucible 410 may be provided in various shapes other than the cylindrical shape.

The heater 480 may be disposed on at least one of a side surface and/or a lower surface of the crucible 410 . The heater 480 may heat the deposition material 450 accommodated in the crucible 410 by applying heat to the crucible 410 . The deposition material 450 accommodated in the crucible 410 may be heated by the heater 480 to be melted, vaporized, or sublimed. When the deposition material 450 accommodated in the crucible 410 is heated through the heater 480, the pressure in the crucible 410 increases, so that the molten, vaporized, or sublimed deposition material is directed toward the substrate 100 (FIG. 1) can be sprayed.

A nozzle 430 may be disposed on one opened side of the crucible 410 . The nozzle 430 may be disposed on the crucible 410 to guide a path through which the deposition material 450 is sprayed toward the substrate 100 ( FIG. 1 ). Although one nozzle 430 corresponding to one crucible 410 is illustrated in FIG. 4 , a plurality of nozzles 430 may be provided to correspond to one crucible 410 . The nozzle 430 may be connected to the crucible 410 by a connecting member.

In one embodiment, as shown in FIG. 4 , at least a portion of the nozzle 430 may be inserted into the crucible 410 . In another embodiment, the nozzle 430 may be disposed on the crucible 410 .

In FIG. 4 , the nozzle 430 is illustrated as having a shape in which a middle part is inserted, but is not limited thereto. The shape of the nozzle 430 may be provided in various shapes, such as a cylindrical shape.

In general, the deposition material may be deposited on the substrate by heating the crucible through a heater to vaporize the deposition material accommodated in the crucible. However, when the deposition material contained in the crucible is heated to deposit the deposition material on the substrate, there is a problem in that a splash defect occurs. More specifically, when the deposition material accommodated in the crucible is heated, bubbles are generated inside the deposition material, and when the bubbles generated inside the deposition material burst on the surface of the deposition material, a defect in which the deposition material in a liquid state is deposited on the substrate occurs was present. In addition, there existed a case where the deposition material condensed on the nozzle fell without being sprayed toward the substrate, and the deposition material in a liquid state was deposited on the substrate, resulting in a defect.

In an embodiment, a cover 460 may be disposed on the deposition material 450 accommodated in the crucible 410 . The cover 460 may be disposed directly on the surface 451 of the deposition material 450 accommodated in the crucible 410 . By disposing the cover 460 on the surface 451 of the deposition material 450 accommodated in the crucible 410, it is possible to prevent a splash defect from occurring, thereby improving the deposition uniformity of the apparatus 300 for manufacturing a display device. can

More specifically, by disposing the cover 460 on the surface 451 of the deposition material 450 accommodated in the crucible 410 , bubbles generated inside the deposition material 450 are removed from the surface 451 of the deposition material 450 . It is possible to prevent the deposition material 450 in a liquid state from being exploded from being deposited on the substrate 100 ( FIG. 1 ), and the deposition material 450 condensed on the nozzle 430 without being sprayed toward the substrate 100 ( FIG. 1 ). ) is dropped and the deposition material 450 in a liquid state is deposited on the substrate 100 ( FIG. 1 ) to prevent defects from occurring, thereby improving the deposition uniformity of the apparatus 300 for manufacturing a display device.

In an embodiment, the cover 460 may have a lower thermal conductivity than the deposition material 450 accommodated in the crucible 410 . In addition, the cover 460 may have a lower specific gravity than the deposition material 450 accommodated in the crucible 41 . For example, the deposition material 450 accommodated in the crucible 410 may have a first specific gravity, and the cover 460 disposed on the deposition material 450 may have a second specific gravity smaller than the first specific gravity. The cover 460 may be made of a material that is easily separated from the deposition material 450 in a solid state after the deposition material 450 contained in the crucible 410 is solidified. For example, the cover 460 may include at least one of carbon, graphite, pyrolytic boron nitride (PBN), pyrolytic graphite (PG), and mullite.

In one embodiment, the cover 460 includes at least one of graphite, pyrolytic boron nitride (PBN), and mullite, and the surface of the cover 460 is pyrolytic graphite (PG, Pyrolytic). Graphite) may be coated.

5 is a plan view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment, FIG. 6 is a plan view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment, and FIG. 7 is an exemplary embodiment It is a plan view schematically illustrating an apparatus for manufacturing a display device.

More specifically, FIGS. 5, 6, and 7 are diagrams for comparing the area of the deposition material accommodated in the crucible with the area of the cover, and for explaining the shape of the cover.

Referring to FIG. 5 , in an embodiment, the area of the cover 460 may be smaller than the area of the deposition material 450 accommodated in the crucible 410 . More specifically, the deposition material 450 accommodated in the crucible 410 may have a first area A1 , and the cover 460 may have a second area A2 smaller than the first area A1 .

Since the cover 460 has a small area compared to the area of the deposition material 450 accommodated in the crucible 410 , the cover 460 exposes at least a portion of the surface of the deposition material 450 accommodated in the crucible 410 . can At this time, the surface of the deposition material 450 exposed at least in part by the cover 460 may be 5% to 60% of the total area of the surface of the deposition material 450, 5% to 50%, Various variations are possible, such as being 10% to 60%. For example, the surface of the deposition material 450 exposed at least in part by the cover 460 may be 10% to 50% of the total area of the surface of the deposition material 450 .

The deposition material may be vaporized and sprayed toward the substrate through the surface of the deposition material 450 exposed at least in part by the cover 460 .

In one embodiment, the cover 460 disposed on the deposition material 450 accommodated in the crucible 410 may be provided in a circular shape, as shown in FIG. 5 , and a rectangular shape as shown in FIG. 6 . Various modifications are possible, such as being provided in a cross shape as shown in FIG. 7 . For example, the cover 460 disposed on the deposition material 450 accommodated in the crucible 410 may also have an elliptical or polygonal shape.

8 is a cross-sectional view schematically illustrating an apparatus for manufacturing a display device according to an exemplary embodiment.

The embodiment of FIG. 8 is different from the embodiment of FIG. 4 in that irregularities are formed on the surface 461 of the cover 460 . Hereinafter, the differences will be mainly described. Other configurations are the same as or similar to those of the above-described embodiment.

Referring to FIG. 8 , irregularities 463 may be formed on the surface 461 of the cover 460 disposed on the deposition material 450 accommodated in the crucible 410 . More specifically, the cover 460 disposed on the deposition material 450 accommodated in the crucible 410 may include a plurality of irregularities 463 formed on the surface 461 facing the nozzle 430 .

As irregularities 463 are formed on the surface 461 of the cover 460 disposed on the deposition material 450 accommodated in the crucible 410 , splash by the deposition material 450 that is condensed and falls on the nozzle 430 . (Splash) It can prevent defects from occurring.

9 is a perspective view schematically illustrating a display device manufactured by using the apparatus for manufacturing a display device according to an exemplary embodiment, and FIG. 10 is a schematic diagram of a display device manufactured by using the apparatus for manufacturing a display device according to an exemplary embodiment of the present invention. It is a cross-sectional view shown. FIG. 10 corresponds to a cross-sectional view taken along line I-I' of FIG. 9 .

Referring to FIG. 9 , the display device 1 may include a display area DA and a non-display area NDA disposed around the display area DA. The non-display area NDA may surround the display area DA. The display device 1 may provide an image using light emitted from a plurality of pixels P disposed in the display area DA, and the non-display area NDA may be an area in which an image is not displayed. have.

Hereinafter, an organic light emitting diode display will be described as the display device 1 according to an exemplary embodiment, but the display device of the present invention is not limited thereto. As an embodiment, the display device 1 of the present invention may be an inorganic light emitting display device (an organic light emitting display or an inorganic EL display) or a display device such as a quantum dot light emitting display device. For example, the light emitting layer of the display element included in the display device 1 may include an organic material, an inorganic material, a quantum dot, an organic material and a quantum dot, or an inorganic material and a quantum dot.

9 illustrates the display device 1 having a flat display surface, but the present invention is not limited thereto. As an embodiment, the display device 1 may include a three-dimensional display surface or a curved display surface.

When the display device 1 includes a three-dimensional display surface, the display device 1 includes a plurality of display areas indicating different directions, and may include, for example, a polygonal columnar display surface. As an embodiment, when the display device 1 includes a curved display surface, the display device 1 may be implemented in various forms, such as a flexible, foldable, or rollable display device.

9 illustrates a display device 1 applicable to a mobile phone terminal. Although not shown, electronic modules, camera modules, power modules, etc. mounted on the main board are disposed together with the display device 1 in a bracket/case, etc., thereby configuring a mobile phone terminal. In particular, the display device 1 according to the present invention can be applied to large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as tablets, car navigation systems, game consoles, and smart watches.

Although FIG. 9 illustrates a case in which the display area DA of the display device 1 has a rectangular shape, the shape of the display area DA may be a circle, an ellipse, or a polygon such as a triangle or a pentagon.

The display device 1 includes a plurality of pixels P disposed in the display area DA. Each of the plurality of pixels P may include an organic light-emitting diode (OLED). Each of the plurality of pixels P may emit, for example, red, green, blue, or white light through the organic light emitting diode OLED. As described above, the pixel P in the present specification may be understood as a pixel emitting light of any one color among red, green, blue, and white.

Referring to FIG. 10 , a pixel P may be disposed on the substrate 100 . The pixel P may include a thin film transistor (TFT) and an organic light emitting diode (OLED).

The substrate 100 may include glass or a polymer resin. Polymer resins include polyethersulfone, polyacrylate, polyether imide, polyethylene naphthalate, polyethylene terephthalate, and polyphenylene sulfide. , polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. The substrate 100 including the polymer resin may have flexible, rollable, or bendable properties. The substrate 100 may have a multilayer structure including a layer including the above-described polymer resin and an inorganic layer (not shown).

A buffer layer 101 may be disposed on the substrate 100 . The buffer layer 101 may be positioned on the substrate 100 to reduce or block penetration of foreign substances, moisture, or external air from the lower portion of the substrate 100 , and may provide a flat surface on the substrate 100 . The buffer layer 101 may include an inorganic material such as an oxide or a nitride, an organic material, or an organic/inorganic composite, and may have a single-layer or multi-layer structure of an inorganic material and an organic material.

A thin film transistor (TFT) may be disposed on the buffer layer 101 . The thin film transistor TFT may include a semiconductor layer 134 , a gate electrode 136 overlapping the semiconductor layer 134 , and a connection electrode electrically connected to the semiconductor layer 134 . The thin film transistor TFT may be connected to the organic light emitting diode OLED to drive the organic light emitting diode OLED.

The semiconductor layer 134 is disposed on the buffer layer 101 , the channel region 131 overlaps with the gate electrode 136 , and is disposed on both sides of the channel region 131 and contains impurities having a higher concentration than the channel region 131 . It may include a source region 132 including a drain region 133 . Here, the impurity may include an N-type impurity or a P-type impurity. The source region 132 and the drain region 133 may be electrically connected to the connection electrode.

The semiconductor layer 134 may include an oxide semiconductor and/or a silicon semiconductor. When the semiconductor layer 134 is formed of an oxide semiconductor, for example, indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium It may include an oxide of at least one material selected from the group consisting of (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). For example, the semiconductor layer 134 may be ITZO (InSnZnO), IGZO (InGaZnO), or the like. When the semiconductor layer 134 is formed of a silicon semiconductor, it may include, for example, amorphous silicon (a-Si) or low temperature poly-silicon (LTPS) obtained by crystallizing amorphous silicon (a-Si). have.

A first insulating layer 103 may be disposed on the semiconductor layer 134 . The first insulating layer 103 is silicon oxide (SiO _2), silicon nitride (SiN _x), silicon oxynitride (SiO _X N _Y), aluminum oxide (Al ₂ O _3), titanium oxide (TiO _2), tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO ₂ ) It may include at least one inorganic insulating material selected from the group consisting of. The first insulating layer 103 may be a single layer or a multilayer including the aforementioned inorganic insulating material.

A gate electrode 136 may be disposed on the first insulating layer 103 . The gate electrode 136 includes aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), and iridium (Ir). , chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), copper (Cu) may be formed as a single layer or multiple layers of one or more metals selected from the group consisting of. The gate electrode 136 may be connected to a gate line for applying an electrical signal to the gate electrode 136 .

A second insulating layer 105 may be disposed on the gate electrode 136 . A second insulating layer 105 is silicon oxide (SiO _2), silicon nitride (SiN _x), silicon oxynitride (SiO _X N _Y), aluminum oxide (Al ₂ O _3), titanium oxide (TiO _2), tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO ₂ ) It may include at least one inorganic insulating material selected from the group consisting of. The second insulating layer 105 may be a single layer or a multilayer including the aforementioned inorganic insulating material.

A storage capacitor Cst may be disposed on the first insulating layer 103 . The storage capacitor Cst may include a lower electrode 144 and an upper electrode 146 overlapping the lower electrode 144 . The lower electrode 144 and the upper electrode 146 of the storage capacitor Cst may overlap with the second insulating layer 105 interposed therebetween.

The lower electrode 144 of the storage capacitor Cst overlaps the gate electrode 136 of the thin film transistor TFT, and the lower electrode 144 of the storage capacitor Cst is the gate electrode 136 of the thin film transistor TFT. and may be disposed as one body. In an embodiment, the storage capacitor Cst may not overlap the thin film transistor TFT, and the lower electrode 144 of the storage capacitor Cst is independent from the gate electrode 136 of the thin film transistor TFT. It can be a component.

The upper electrode 146 of the storage capacitor Cst is formed of aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), and neodymium (Nd). ), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper (Cu), It may be a single layer or multiple layers of the aforementioned materials.

A third insulating layer 107 may be disposed on the upper electrode 146 of the storage capacitor Cst. The third insulating layer 107 is silicon oxide (SiO _2), silicon nitride (SiN _x), silicon oxynitride (SiO _X N _Y), aluminum oxide (Al ₂ O _3), titanium oxide (TiO _2), tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO ₂ ) It may include at least one inorganic insulating material selected from the group consisting of. The third insulating layer 107 may be a single layer or a multilayer including the aforementioned inorganic insulating material.

A source electrode 137 and a drain electrode 138 serving as connection electrodes may be disposed on the third insulating layer 107 . The source electrode 137 and the drain electrode 138 may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc. It may be formed in multiple layers or a single layer. The source electrode 137 and the drain electrode 138 may have a multilayer structure of Ti/Al/Ti.

A first planarization layer 111 may be disposed on the source electrode 137 and the drain electrode 138 . The first planarization layer 111 may be formed as a single layer or a multilayer film made of an organic material or an inorganic material. In one embodiment, the first planarization layer 111 is benzocyclobutene (BCB), polyimide (PI), hexamethyldisiloxane (HMDSO), polymethyl methacrylate (Polymethy lmethacrylate, PMMA) ), general-purpose polymers such as polystyrene (PS), polymer derivatives with phenolic groups, acrylic polymers, imide-based polymers, arylether-based polymers, amide-based polymers, fluorine-based polymers, p-xylene-based polymers, vinyl alcohol polymers and blends thereof, and the like. On the other hand, the first planarizing layer 111 is a silicon oxide (SiO _2), silicon nitride (SiN _x), silicon oxynitride (SiO _X N _Y), aluminum oxide (Al ₂ O _3), titanium oxide (TiO _2), It may include tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO ₂ ). After the first planarization layer 111 is formed, chemical mechanical polishing may be performed to provide a flat top surface.

A contact metal layer CM may be disposed on the first planarization layer 111 . The contact metal layer CM includes aluminum (Al), copper (Cu), titanium (Ti), and the like, and may be formed as a multi-layer or a single layer. The contact metal layer CM may have a multilayer structure of Ti/Al/Ti.

A second planarization layer 113 may be disposed on the contact metal layer CM. The second planarization layer 113 may be formed as a single layer or a multilayer film made of an organic material or an inorganic material. In an embodiment, the second planarization layer 113 may include benzocyclobutene (BCB), polyimide (PI), hexamethyldisiloxane (HMDSO), and poly(methy lmethacrylate). ), PMMA), general-purpose polymers such as polystyrene (PS), polymer derivatives with phenolic groups, acrylic polymers, imide-based polymers, arylether-based polymers, amide-based polymers, fluorine-based polymers, p-xylene-based polymers , vinyl alcohol-based polymers and blends thereof, and the like. On the other hand, the second planarizing layer 113 of silicon oxide (SiO _2), silicon nitride (SiN _x), silicon oxynitride (SiO _X N _Y), aluminum oxide (Al ₂ O _3), titanium oxide (TiO _2), It may include tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO ₂ ). After the second planarization layer 113 is formed, chemical mechanical polishing may be performed to provide a flat top surface. In an embodiment, the second planarization layer 113 may be omitted.

An organic light emitting diode (OLED) including a pixel electrode 210 , an intermediate layer 220 , and a counter electrode 230 may be disposed on the second planarization layer 113 . The pixel electrode 210 is electrically connected to the contact metal layer CM through a contact hole penetrating the second planarization layer 113 , and the contact metal layer CM is a contact penetrating the first planarization layer 111 . The organic light emitting diode OLED may be electrically connected to the thin film transistor TFT by being electrically connected to the source electrode 137 and the drain electrode 138 that are the connection electrodes of the thin film transistor TFT through the hole.

A pixel electrode 210 may be disposed on the second planarization layer 113 . The pixel electrode 210 may be a (semi)transmissive electrode or a reflective electrode. The pixel electrode 210 includes aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), and iridium (Ir). , chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), copper (Cu) and a reflective film formed of a compound thereof, and a transparent film formed on the reflective film Alternatively, a translucent electrode layer may be provided. The transparent or translucent electrode layer includes indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In ₂ O ₃ ; indium oxide), and indium gallium. At least one selected from the group consisting of indium gallium oxide (IGO) and aluminum zinc oxide (AZO) may be included. The pixel electrode 210 may be provided in a stacked structure of ITO/Ag/ITO.

A pixel defining layer 180 may be disposed on the second planarization layer 113 , and the pixel defining layer 180 may have an opening exposing at least a portion of the pixel electrode 210 . An area exposed by the opening of the pixel defining layer 180 may be defined as the emission area EA. A periphery of the light-emitting areas EA may be a non-emission area NEA, and the non-emission area NEA may surround the light-emitting areas EA. That is, the display area DA may include a plurality of light-emitting areas EA and a non-emission area NEA surrounding them. The pixel defining layer 180 may prevent an arc from occurring at the edge of the pixel electrode 210 by increasing the distance between the counter electrode 230 on the pixel electrode 210 . The pixel defining layer 180 is made of, for example, an organic insulating material such as polyimide, polyamide, acrylic resin, benzocyclobutene, hexamethyldisiloxane (HMDSO), and phenol resin, and may be formed by spin coating or the like.

The intermediate layer 220 may be disposed on the pixel electrode 210 at least partially exposed by the pixel defining layer 180 . The intermediate layer 220 may include an emission layer 220b, and a first functional layer 220a and/or a second functional layer 220c may be selectively disposed below and above the emission layer 220b.

In an embodiment, the intermediate layer 220 may be formed on the pixel electrode 210 at least partially exposed by the pixel defining layer 180 . More specifically, the emission layer 220b of the intermediate layer 220 may be formed on the pixel electrode 210 at least partially exposed by the pixel defining layer 180 .

The first functional layer 220a may include a hole injection layer (HIL) and/or a hole transport layer (HTL), and the second functional layer 220c is an electron transport layer (ETL). transport layer) and/or an electron injection layer (EIL).

The emission layer 220b may include an organic material including a fluorescent or phosphorescent material emitting red, green, blue, or white light. The light emitting layer 220b may be formed of a low molecular weight organic material or a high molecular weight organic material.

When the light emitting layer 220b includes a low molecular weight organic material, the intermediate layer 220 may have a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, etc. are stacked in a single or complex structure, and a low molecular weight organic material Copper phthalocyanine (CuPc: copper phthalocyanine), N,N'-di(naphthalen-1-yl)-N,N'-diphenyl-benzidine (N,N'-Di(napthalene-1-yl)-N, N'-diphenyl-benzidine: NPB) , tris-8-hydroxyquinoline aluminum ((tris-8-hydroxyquinoline aluminum) (Alq ₃ )), and the like may include various organic substances. These layers can be formed by a method of vacuum deposition.

When the light emitting layer 220b includes a polymer organic material, the intermediate layer 220 may have a structure including a hole transport layer and a light emitting layer 220b. In this case, the hole transport layer may include PEDOT, and the light emitting layer may include a polymer material such as poly-phenylene vinylene (PPV) and polyfluorene. The light emitting layer may be formed by screen printing, inkjet printing, laser induced thermal imaging (LITI), or the like.

The counter electrode 230 may be disposed on the intermediate layer 220 . In an embodiment, the counter electrode 230 of the display device 1 may be formed on the intermediate layer 220 using the above-described manufacturing device 300 ( FIG. 1 ). The counter electrode 230 is disposed on the intermediate layer 220 , and may be disposed to cover the entirety of the intermediate layer 220 . The counter electrode 230 is disposed on the display area DA, and may be disposed to cover the entire display area DA. That is, the counter electrode 230 may be integrally formed throughout the display panel to cover the plurality of pixels P disposed in the display area DA using an open mask.

The counter electrode 230 may include a conductive material having a low work function. For example, the counter electrode 230 may include silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium ( Ir), chromium (Cr), lithium (Li), calcium (Ca), or an alloy thereof may include a (semi) transparent layer. Alternatively, the counter electrode 230 may further include a layer such as _{ITO, IZO, ZnO, or In 2} O ₃ on the (semi)transparent layer including the aforementioned material.

According to an embodiment, in the display device, in order to solve problems such as a decrease in deposition uniformity due to a splash defect, a cover on the surface 451 of the deposition material 450 accommodated in the crucible 410 . By disposing the 460, it is possible to prevent a splash defect from occurring due to air bubbles generated inside the deposition material, and to prevent a splash failure from occurring due to the deposition material condensed on the nozzle falling, thereby improving deposition uniformity. can be improved

Although the present invention has been described with reference to the embodiments shown in the drawings, which are merely exemplary, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

1: display device
100: substrate
300: manufacturing device
400: evaporation source
410: crucible
430: nozzle
450: deposition material
460: cover

Claims (20)

a crucible containing a deposition material;
a nozzle disposed on one side of the crucible to guide a path through which the deposition material is sprayed toward the substrate; and
a cover disposed on the surface of the deposition material accommodated in the crucible;
A manufacturing apparatus for a display device comprising: According to claim 1,
and the cover is disposed directly on a surface of the deposition material accommodated in the crucible. According to claim 1,
The deposition material accommodated in the crucible has a first area, and the cover has a second area smaller than the first area. 4. The method of claim 3,
and the cover exposes at least a portion of a surface of the deposition material accommodated in the crucible. 5. The method of claim 4,
The surface of the deposition material to which the at least part is exposed is 10% to 50% of a total area of the surface of the deposition material. According to claim 1,
The deposition material accommodated in the crucible has a first specific gravity, and the cover has a second specific gravity smaller than the first specific gravity. According to claim 1,
The deposition material accommodated in the crucible includes silver (Ag). According to claim 1,
and the cover includes at least one of carbon, graphite, pyrolytic boron nitride, pyrolytic graphite, and mullite. According to claim 1,
The cover is provided in a circular shape. According to claim 1,
and the cover is provided in a polygonal shape. According to claim 1,
and wherein the cover has irregularities formed on a surface facing the nozzle. According to claim 1,
The crucible is provided in a cylindrical shape. According to claim 1,
and a heater configured to heat the deposition material accommodated in the crucible. 14. The method of claim 13,
and the deposition material accommodated in the crucible is heated by the heater and sprayed toward the substrate. a mask comprising an opening;
a crucible containing a deposition material;
a nozzle disposed on one side of the crucible to guide a path through which the deposition material is sprayed toward the substrate; and
a cover disposed on the surface of the deposition material accommodated in the crucible;
to provide
The deposition material accommodated in the crucible is sprayed through the nozzle and passed through the opening to be deposited on the substrate. 16. The method of claim 15,
and the cover is disposed directly on a surface of the deposition material accommodated in the crucible. 16. The method of claim 15,
A surface of the deposition material accommodated in the crucible has a first area, and the cover has a second area that is smaller than the first area. 16. The method of claim 15,
The deposition material accommodated in the crucible has a first specific gravity, and the cover has a second specific gravity smaller than the first specific gravity. 16. The method of claim 15,
The deposition material accommodated in the crucible includes silver (Ag). 16. The method of claim 15,
and the cover includes at least one of carbon, graphite, pyrolytic boron nitride, pyrolytic graphite, and mullite.

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