KR20210158248A - Substrate cleaning apparatus and carrier used therein - Google Patents

Abstract

The present invention relates to a substrate cleaning apparatus. According to the present invention, a substrate is seated on a carrier provided with a porous sheet to which suction pressure is applied so that cleaning is performed while transferring the substrate in a predetermined path, wherein backside contamination of the substrate is not generated. The substrate cleaning apparatus includes a first carrier; a first transfer unit; and a first cleaning unit.

Description

Substrate cleaning apparatus for ultra-thin glass substrate and substrate carrier used therefor {SUBSTRATE CLEANING APPARATUS AND CARRIER USED THEREIN}

The present invention relates to a substrate cleaning apparatus and a substrate carrier used therefor, and more specifically, cleaning to remove foreign substances remaining on the surface of a foldable and thin ultra-thin glass substrate (Ultra Thin Glass, UTG) with a thickness of several microns to several tens of microns. A substrate cleaning apparatus capable of performing a process more cleanly in a shorter time, and a substrate carrier used therefor.

Recently, glass substrates used in portable devices are getting thinner, and the need for a cleaning method for using thin substrates in portable devices without errors has been greatly increased.

Conventionally, according to the configuration shown in Figs. 1 and 2, a cleaning process was performed on one surface of the substrate G with a cleaning solution. That is, as shown in FIG. 1 , when a substrate is supplied to the substrate loader 10 and the supplied substrate is supplied to the substrate cleaning unit 20 , the substrate G in the substrate cleaning unit 20 shown in FIG. 2 . ) is mounted on the cradle 22 .

Then, the cleaning liquid 25a is supplied from the cleaning liquid supply unit 28 to the cleaning liquid spray nozzle 25 and applied to the surface of the substrate G to clean the surface of the substrate G. Then, the cleaned substrate G is discharged by the substrate unloader 30 and transferred to the next process.

However, the conventional substrate cleaning apparatus 20 as described above cleans the surface by spraying the cleaning liquid 25a at a high pressure while the substrate G is mounted on the cradle 22 . During the cleaning process of the substrate G, the cleaning liquid (25a) is introduced (25x) to the opposite side of the cleaning surface of the substrate (G), and is in close contact with the surface (22s) through which the substrate (G) passes after the cleaning process of the substrate (G) by the surface tension of the introduced liquid, The process of separating the substrate G from the surface 22s was very difficult.

Moreover, in the process of separating the substrate G from the rough surface 22s, the ultra-thin glass substrate G having a thickness of 100 μm or less used in a flexible display device frequently causes damage to the substrate G. caused

In addition, in the substrate cleaning apparatus 20 shown in FIG. 2 , in the process of cleaning the cleaning surface of the substrate G, while washing the cleaning surface of the substrate, the cleaning liquid containing foreign substances passes through the substrate G ( 22), causing a problem of contaminating the cleaning surface of the substrate. This means that the cleaning surface that has already been cleaned is contaminated in the process of cleaning the cleaning surface of the substrate, so there is a serious problem in that it is difficult to completely clean the substrate.

An object of the present invention is to clean a glass substrate having an allowable thickness of 100 μm or less in a flexible display device so as not to contaminate the rear surface of the cleaning surface in order to solve the above-mentioned conventional problems.

In addition, an object of the present invention is to prevent damage to the substrate in the process of separating the ultra-thin substrate, which is a glass material, from the passing surface.

Through this, an object of the present invention is to more cleanly clean the substrate without damaging the substrate.

In order to achieve the objects of the present invention described above, the present invention provides that a substrate is seated on a carrier provided with a porous sheet to which suction pressure is applied, and cleaning is performed while transferring the substrate in a predetermined path, but contamination of the back surface of the substrate occurs To provide a substrate cleaning apparatus that does not

The 'first cleaning surface' described in this specification and claims refers to one surface of the substrate on which the cleaning process is performed, and the 'second cleaning surface' refers to the other surface of the substrate on which the cleaning process is performed.

'Front part' and similar terms described in this specification and claims refer to a portion facing the opposite side to the direction in which the substrate is transported on the transport belt, and 'rear part' and similar terms described in this specification and claims denotes a portion facing the direction in which the substrate is transported on the transport belt.

As described above, according to the present invention, it is possible to obtain an advantageous effect of efficiently performing double-sided cleaning of a glass substrate having a thickness of 100 μm or less used in a flexible or foldable display device in a short time and without damage.

That is, in the present invention, the ultra-thin substrate is seated on a porous sheet to which suction pressure is applied, the cleaning process is performed, and when the cleaning process is completed, positive pressure is applied to separate the substrate from the surface through which the cleaning liquid is used. It is possible to obtain an advantageous effect of minimizing damage to the substrate in the process of separating the substrate from the surface after cleaning.

And, according to the present invention, as the cleaning process is sequentially performed while continuously supplying a plurality of substrates, it is possible to obtain an effect of shortening the time required for cleaning one substrate.

In addition, in the present invention, the size of the porous sheet on which the substrate is mounted is formed to correspond to the area of the substrate, and the side surface of the porous sheet exposed to the outside is waterproofed to suppress the side penetration of the cleaning solution, thereby scattering during the cleaning process or It is possible to obtain the effect of preventing contamination of the rear surface by preventing the splashing cleaning liquid from penetrating into the rear surface of the cleaning surface of the substrate.

And, according to the present invention, the size of the porous sheet on which the substrate is seated is formed to correspond to the area of the substrate, and the upper surface of the porous sheet is formed to surround the housing having the hydrophobic treated surface, so that the cleaning liquid that is scattered or splashed during the cleaning process The effect of preventing contamination of the back surface of the substrate can be obtained by allowing the droplets to remain on the upper surface of the housing without penetrating into the back surface of the substrate, and to push the droplets out in the subsequent drying process.

Through this, the present invention can obtain an advantageous effect of more cleanly cleaning both surfaces of the substrate by preventing contamination of the rear surface while cleaning the cleaning surface of the substrate.

1 is a block diagram showing the configuration of a conventional substrate processing system;
Fig. 2 is a view showing the configuration of the substrate cleaning apparatus of Fig. 1;
3 is a block diagram showing the configuration of a substrate processing system according to an embodiment of the present invention;
Fig. 4 is a view showing the configuration of the substrate cleaning apparatus of Fig. 3;
Figure 5 is a perspective view showing the configuration of the carrier of Figure 4;
Figure 6 is a view for explaining the action of preventing moisture penetration into the back surface of the substrate by the carrier of Figure 5;
Figure 7 is a perspective view showing the configuration of a carrier according to another embodiment applied to Figure 4;
8 is a view for explaining an action of preventing moisture penetration into the back surface of the substrate by the carrier of FIG. 7;
Figure 9 is a view showing the configuration of the substrate loader of Figure 4;
Figure 10 is a view showing the configuration of the first cleaning unit of Figure 4;
11 is a view showing the configuration of the inverter of FIG. 4;
12 is a view showing the configuration of the second cleaning unit of FIG. 4;
Figure 13 is a view showing the configuration of the unloading unit of Figure 4;
FIG. 14 is a view showing the configuration of the cleaning liquid discharge unit mounted on the carrier of FIG. 4 .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, the same numbers in this description refer to substantially the same elements, and may be described by citing the contents described in other drawings under these rules, and the contents determined to be obvious to those skilled in the art or repeated may be omitted.

As shown in the drawing, the substrate processing system 1000 according to the present invention includes a loader unit 10 for supplying a glass substrate G from a cassette (not shown), and a substrate ( G) a substrate cleaning apparatus 1 for cleaning while transporting, an inspection unit 2 for inspecting the cleaning state of the substrate G cleaned with a cleaning liquid in the substrate cleaning apparatus 1, and inspection by the inspection unit 2 It is configured to include an unloading unit 30 for transporting the substrate to the next process.

Here, as the substrate G, various types of substrates may be applied, and in particular, a glass substrate UTG having a thickness of 100 μm or less used in a foldable display device of a portable device may be applied.

The substrate loader 10 supplies 51 the substrate G stored in the cassette to the substrate cleaning apparatus 1 as shown in FIGS. 4 and 9 .

The substrate loader 10 may be configured in various forms, and as shown in FIG. 4 , the substrates G are supplied to the substrate cleaning apparatus 1 one by one from a cassette in which a plurality of substrates G are accommodated.

For example, the substrate loader 10 includes a loader post 11 capable of rotating (12r), an extension member 12 capable of moving up and down from the support post 11 (12d), and moving along the extension member 12 ( 13d) is possible and a gripping part 13 to which suction pressure is applied is provided. Accordingly, the substrate loader 10 moves the gripper 13 to a position where the cassette (not shown) is located, grips the substrate G in the gripper 13 , and rotates the extension member 12 ( 12d) After positioning on the upper surface St of the first carrier C1 being transferred in the first moving belt 111 of the first cleaning unit 100, the extended member 12 is moved downward to hold the substrate (G) is mounted (61) on the upper surface (St) of the first carrier (C1).

At this time, when the distance from the loader post 11 to the cassette and the distance from the loader post 11 to the first carrier C1 are different from each other, the gripper 13 moves along the extension member 12 ( 13d) to offset the distance deviation from the loader column 11 .

As shown in the figure, the first carrier (C1) is fixed to the first transfer belt 111, and is configured to move (71) together with the first transfer belt 111 formed of a conveyor that circulates in a closed loop form. can be However, according to another embodiment of the present invention, the first carrier (C1) is installed movably independently of the first moving belt 111, the substrate (not shown) in a separate holder (not shown) from the substrate loader (10) The first carrier (C1) on which G) is mounted may be configured to move to the first moving belt 111 and be transferred 71 by the first moving belt 111 .

A fixing protrusion 111a may be provided on the first moving belt 111 for detachment of the first carrier C1, and a receiving groove 91a for accommodating the fixing protrusion 111a may be provided on the first carrier C1. Preferably, any one of the fixing protrusion 111a and the receiving groove 91a is formed of a magnet, and the other of the fixing projection 111a and the receiving groove 91a is a magnet having an opposite pole or a magnetic material attached to the magnet. is formed, so that the detachment of the first carrier C1 can be easily and firmly fixed to the first moving belt 111 by magnetic force.

According to the embodiment shown in FIGS. 4 and 10 , the first carrier C1 is fixed to the first moving belt 111 and moves 71 along the circulation path, and the substrate loader 10 is the first moving first It is seated on the upper surface St of the first carrier C1 so that the first cleaning surface S1 of the substrate G faces upward with respect to the carrier C1.

In order to seat the substrate G from the substrate loader 10 to the first carrier C1, a suction pressure pn is applied to the first carrier C1, and the substrate loader 10 is each first carrier ( Recognizing the mark 115 provided on the first transfer belt 111 for each C1), the first carrier C1 together with the first transfer belt 111 moves (71) from the substrate loader 10 to the substrate ( G) is seated on the upper surface of the first carrier C1.

The loader unit 10 continuously supplies the substrate G to the first carrier C1 circulating in a predetermined path in the first moving belt 111 of the first cleaning unit 100 . That is, even before the cleaning process of the first cleaning surface S1 with respect to one substrate G is completed, another first carrier that subsequently circulates another substrate G in the first moving belt 111 . By supplying to (C1), the cleaning process is performed with respect to the board|substrate G supplied continuously.

Here, the 'first cleaning surface' refers to the exposed surface to be cleaned of the substrate G seated on the first carrier C1 of the first moving belt 111 rotating in a closed loop form, and the 'second cleaning surface' (底面)' refers to the surface to be cleaned as the exposed surface to be cleaned of the substrate G seated on the second carrier C2 of the second moving belt 211 rotating in a closed loop form, and refers to the opposite surface of the first cleaning surface.

The substrate cleaning apparatus 1 includes, as shown in FIG. 4, a first cleaning unit 100 for cleaning the first cleaning surface S1 of the substrate G supplied by the loader unit 10; The second cleaning unit 200 receives the substrate G from the first cleaning unit 100 and cleans the second cleaning surface S2 of the substrate G, and The second cleaning unit 200 is configured to include an inverter 300 for moving the substrate G in a 180-degree inverted posture.

The first cleaning unit 100 is a first moving belt ( 111), and the first cleaning unit 120 disposed on the first movement path and cleaning the first cleaning surface S1 of the substrate G mounted on the first carrier C1 ), a first dryer 130 for drying the substrate G cleaned by the first cleaning unit 120, and the porous sheet 91 of the first carrier C1 before the substrate G is mounted. It is configured to include a first carrier dryer 190 for drying the upper surface of the.

Similarly, the second cleaning unit 200 circulates in a closed loop form in a state in which the plurality of second carriers C2 are fixed to move the second carriers C2 along a predetermined second movement path. The second transfer unit 210 having two transfer belts 211 and a second cleaning surface S2 of the substrate G disposed on the second movement path and mounted on the second carrier C2 The cleaning unit 220, the second dryer 230 for drying the substrate (G) cleaned by the second cleaning unit 220, and the porosity of the second carrier (C2) before the substrate (G) is mounted It is configured to include a second carrier dryer 290 for drying the upper surface of the sheet (91).

Here, the first carrier (C1) and the second carrier (C2) refer to the substrate carrier transferred from the first moving belt 111 and the second moving belt 211, respectively, in a state in which the substrate G is sucked and held. and the first carrier C1 and the second carrier C2 may be formed identically to each other or may be formed differently. For example, the carrier C shown in FIGS. 5 and 6 or the carrier C′ shown in FIGS. 7 and 8 may be applied.

5 and 6, the substrate carrier (C) according to an embodiment of the present invention is a carrier used in the cleaning process of the substrate (G), and the substrate (G) is seated on the upper surface (St) and suction pressure ( pn) or positive pressure is selectively applied, the housing 91 supporting the porous sheet 92, and the waterproof treatment formed on the side surface Ss exposed to the outside as a part of the porous sheet 92 A layer 93x and a pressure regulator P for applying a pressure to the porous sheet 92 are included.

Here, the upper surface (St) of the porous sheet 92 is formed to be completely covered by the substrate (G), preferably compared to the upper surface (St) of the porous sheet (92) at the edge of the substrate (G). The protrusion length is determined so that the bottom surface is all dried during the drying process. For example, the edge protrusion length of the substrate G may be set to be approximately 3 mm or less compared to the upper surface St of the porous sheet 92 .

Through this, as shown in FIG. 6 , in a state in which the substrate G is seated on the upper surface St of the substrate carrier C, the cleaning solution 88 is sprayed onto the substrate G from the cleaners 120 and 220 . Then, since the substrate G is suction-fixed while completely covering the upper surface St of the porous sheet 92 , there is no gap between the substrate G and the porous sheet 92 . In addition, since the water-repellent treatment layer 93x is formed on the side surface Ss of the porous sheet 92 , the cleaning liquid flows into the back surface of the substrate G through the side surface of the porous sheet 92 as indicated by reference numeral XP. path does not exist.

Therefore, as the cleaning process is performed by suctioning and mounting the substrate G on the substrate carrier C as described above, the cleaning liquid 88x flowing out of the substrate G flows all the side surfaces of the porous sheet 92 down, and does not flow into the side surface of the porous sheet 92 . Accordingly, the penetration of the cleaning liquid into the rear surface of the cleaning surface of the substrate G during the cleaning process of the substrate G is fundamentally prevented, thereby solving the problem of rear surface contamination. At this time, even if there is a substrate G protruding outward compared to the upper surface of the porous sheet 92, the protrusion length is formed small enough to be dried during the drying process after the cleaning process, so that contamination of the rear surface by the cleaning liquid is prevented can do.

On the other hand, referring to Figures 7 and 8, the substrate carrier (C') according to another embodiment of the present invention is a carrier used in the cleaning process of the substrate (G), the substrate (G) is seated on the upper surface (St) and A porous sheet 92 to which suction pressure pn or positive pressure is selectively applied, a housing 91 supporting the porous sheet 92 but surrounding the upper surface of the porous sheet 92, and the housing 91 It is configured to include a hydrophobic treatment layer 91s formed on the upper surface, and a pressure regulator P for applying pressure to the porous sheet 92 .

Similarly, the upper surface St of the porous sheet 92 is formed to be completely covered by the substrate G, and preferably the upper surface St of the porous sheet 92 and the substrate G have the same dimensions. it is decided

Through this, as shown in FIG. 8 , in a state in which the substrate G is seated on the upper surface St of the substrate carrier C, the cleaning solution 88 is sprayed onto the substrate G from the cleaners 120 and 220 . Then, since the substrate G is suction-fixed while completely covering the upper surface St of the porous sheet 92 , there is no gap between the substrate G and the porous sheet 92 . And, the cleaning solution 88 sprayed onto the substrate G flows down the side of the housing 92 as indicated by reference numeral 88x, or the hydrophobic treatment layer 91s on the upper surface of the housing disposed outside the substrate G ) in the form of droplets 88b.

As described above, as the hydrophobic treatment layer 91s is formed on the upper surface of the housing, the cleaning solution remaining on the outside of the substrate G maintains a droplet form and is less likely to penetrate into the back surface of the substrate, and the edge of the substrate G is adsorbed by the porous sheet 92 and there is no gap, so that penetration of the cleaning solution into the back surface of the substrate can be prevented during the cleaning process. In addition, the cleaning liquid in the form of droplets remaining in the hydrophobic treatment layer 91s is pushed out of the upper surface of the housing by the dry air 89 during the drying process and removed.

Therefore, as the cleaning process is performed while the substrate G is mounted on the substrate carrier C' as described above, it is fundamental that the cleaning liquid penetrates into the back surface of the cleaning surface of the substrate G during the cleaning process of the substrate G. This can be prevented and the problem of backside contamination can be solved. In addition, instead of sucking and fixing the substrate G by a vacuum hole, as the substrate G is sucked and fixed on the upper surface of the porous sheet 92, a hole-shaped mark or stain is generated on the back surface of the substrate G it can be prevented

On the other hand, a liquid component may be introduced into the porous sheet 92 of the substrate carriers C and C' while the substrate G is circulated in the not seated state.

In order to discharge the liquid flowing into the porous sheet 92 of the substrate carriers C and C', a cleaning solution discharge unit 150 including a discharge pipe 151 communicating with the porous sheet 92 may be provided. . Specifically, as shown in FIG. 14 , the liquid component flowing into the porous sheet 92 is discharged through the discharge pipe 151 . Although not shown in the drawings, a discharge pipe 151 for discharging the cleaning solution used also in the first moving belt 111 and the second moving belt 211 to the outside may be provided.

Since gas and liquid are mixed in what is discharged through the discharge pipe 151, the discharge pipe 151 is provided with a collection container 155 for temporarily collecting the discharged liquid and gas. A liquid discharge pipe 159 for discharging a liquid is provided on the bottom surface of the collection barrel 155 , and a gas discharge pipe 158 for discharging gas is provided on the ceiling surface of the collection barrel 155 above this. At this time, the gas discharge pipe 158 may be provided with a suction pump V for applying a negative pressure.

Through this, the gas and liquid (mainly cleaning liquid) introduced into the collection tube 155 are discharged (69) to the outside through the liquid discharge pipe 159 in the heavy liquid in the collection tube 155, and the light gas is discharged through the gas discharge pipe ( 158) to the outside. Therefore, in the process where the substrate is continuously supplied to the substrate cleaning apparatus 100 and the cleaning process is continuously performed, the discharge pipe 151 is guided to a vacuum state to immediately discharge the cleaning liquid to the outside in real time, continuously The treatment process can be performed efficiently.

Hereinafter, a configuration in which any one of the substrate carriers C and C' shown in FIGS. 5 to 8 is applied to the first carrier C1 and the second carrier C2 will be described as an example.

As shown in FIG. 10 , in the first cleaning unit 100 , the first transfer unit 110 includes a first moving belt 111 rotating in a closed loop form, and The first carrier (C1) is transferred to the outer surface in a fixed state.

The first carrier C1 transfers the substrate G to a predetermined path 71 while the substrate G is mounted thereon. Although the drawing shows a configuration in which the first carrier C1 moves to a circulation path by a configuration in which the first moving belt 111 rotates and circulates in a closed loop form, according to another embodiment of the present invention, the first carrier ( Various means other than a belt capable of transporting C1) can be applied. And, according to another embodiment of the present invention, the first carrier (C1) does not move to the circulation path, but to move from the carrier drying area (OO) to the inversion area (DD) to be described later in various types of paths such as straight lines and curves. may be configured.

And, as described above, the plurality of first carriers (C1) may be semi-permanently fixed to the first moving belt 111, or may be configured to be easily attached to and detached from the first moving belt 111 by using a magnet or the like. have.

To this end, a plurality of driving rollers 112 inside the first moving belt 111 are rotationally driven by the driving motor M1 to cyclically move the first moving belt 111 in a predetermined direction (71). In some cases, on the inner surface of the first moving belt 111, in addition to the driving roller 112, an idler roller that supports the path of the first moving belt 111 and is rotatably installed may be partially disposed.

As shown in FIG. 10 , the first moving belt 111 includes a loading area AA for receiving a substrate G on which a cleaning process is to be performed from the substrate loader 10 , and a cleaning solution for the substrate G using the cleaning solution. A cleaning region BB in which a cleaning process is performed on the first cleaning surface S1, a drying region CC in which a drying process is performed on the cleaned substrate G, and a second movement of the dried substrate G It may be divided into an unloading area DD that is transmitted to the belt 211 . And, since the upper surface St of the porous sheet 92 of the first carrier C1 may be partially wet with the washing liquid scattered around it, a carrier drying area for drying the first carrier C1 on which the carrier is not mounted ( OO) may be provided.

The first cleaning unit 120 is provided in the cleaning area BB on the first movement path of the circulation type of the first movement belt 111 . As shown in FIG. 10 , the first cleaning unit 120 is seated on the porous sheet 92 of the first carrier C1 along with the cyclic movement of the first moving belt 111 and moves together with the substrate (71). With respect to (G), a cleaning brush 121 that contacts and cleans the first cleaning surface S1 of the substrate G while rotating from the upper side of the substrate G, and a cleaning liquid supplied from the cleaning liquid supply unit CL1 to the substrate ( The first cleaning liquid injector 122 for spraying the cleaning liquid 88 at a high pressure higher than atmospheric pressure to the first cleaning surface S1 of G) is included. Here, the cleaning liquid is supplied even during the cleaning process by the brush 121 to increase the removal efficiency of foreign substances adhering to the first cleaning surface S1 of the substrate G.

According to another embodiment of the present invention, the first cleaning unit 120 may be composed of only one of the cleaning brush 121 and the first cleaning liquid sprayer 122 .

As such, the first cleaning surface S1 of the substrate G undergoes a contact cleaning process and a non-contact cleaning process in the cleaning region BB, and foreign substances adhering to the first cleaning surface S1 of the substrate G and You can remove all the foreign substances that have been attached to it.

In the cleaning process of the first cleaning surface S1 of the substrate G by the first cleaning unit 120 , the first moving belt 111 installs the cleaning brush 121 or the first cleaning liquid sprayer 122 . Although it may be performed while being stopped at the position, according to a preferred embodiment of the present invention, the first moving belt 111 cleans while transporting without stopping even at the installation position of the cleaning brush 121 or the first cleaning liquid sprayer 122 . The process is done. Through this, even if the substrate G is continuously supplied by the loader unit 10 , the cleaning process by the cleaning liquid of the substrate G may be performed without any setback.

The first dryer 130 is provided in the drying area CC on the first moving path of the circulation type of the first moving belt 111 . In the first dryer 130 , with respect to the substrate G on which the cleaning process for the first cleaning surface S1 of the substrate G has been completed by the first cleaning unit 120 , the substrate G is moved to the inversion region DD In the drying area CC before reaching The cleaning surface S1 is dried.

Preferably, the drying gas 89 injected from the first dryer 130 has an inclination toward the opposite direction to the transfer direction 71 of the substrate G and is directed toward the substrate G in the form of an air knife. 89) is sprayed. Through this, instead of instantaneously drying all of the cleaning liquid remaining on the first cleaning surface S1 of the substrate G by the drying gas sprayed from the first dryer 130, the first cleaning surface of the substrate G As the cleaning liquid 88 remaining in ( S1 ) is pushed in a direction opposite to the transfer direction, the cleaning liquid remaining on the first cleaning surface S1 of the substrate G may be removed.

At this time, the first dryer 130 may spray the drying gas 89 in one row, but the cleaning liquid remaining from the first cleaning surface S1 of the substrate G more reliably by forming two or more rows of air knives. It can be removed by pushing out liquid components such as

And, by the high-temperature hot air sprayed from the first dryer 130, the rear surface of the substrate protruding outside the upper surface St of the first carrier of the configuration shown in FIG. 6 is completely dried to prevent contamination of the rear surface. can do.

The first carrier dryer 190 is disposed on the first movement path of the first carrier C1 to dry the first carrier C1 before the substrate G is mounted on the first carrier. That is, if the substrate G is mounted in a state in which a liquid such as a cleaning liquid remains on the upper surface of the first carrier C1, the rear surface of the substrate G may be contaminated. Before the (G) is mounted, the drying gas is supplied from the drying gas supply unit DAx, and the high temperature drying gas 89 is sprayed on the upper surface St of the first carrier C1 to be dried.

Like the first dryer 130 , the drying gas 89 is sprayed in the form of an air knife toward the first carrier C1 with an inclination toward the direction opposite to the transfer direction 71 of the substrate G. Through this, the liquid remaining on the porous sheet 92 of the first carrier C1 is dried, and the rear surface of the substrate G mounted on the first carrier C1 can be maintained in a dry state.

As shown in FIG. 11 , the inverter 300 separates and holds the substrate G from the first carrier C1 of the first moving belt 111 and inverts the substrate G by 180 degrees As a result, the second carrier (C2) of the second moving belt 211 is turned 180 degrees to be seated.

To this end, the inverter 300 separates the substrate G from the first carrier C1 of the first moving belt 111 and inverts it 180 degrees in a gripped state, and the first half It is composed of a substrate transmitter 320 that receives the substrate G inverted by 180 degrees from the electricity 310 and places it on the second carrier C2 of the second moving belt 211 .

Here, the separation inverter 310 is provided in the inversion region DD on the first movement path of the circulation type of the first movement belt 111, and is configured similarly to the substrate loader 10 shown in FIG. G) is operated in the reverse order to that of seating the first carrier (C1).

That is, as shown in Figure 11, the separation inverter 310 is a gripping portion 313 that moves (313d) riding on the extension bar 312 extending in the horizontal direction from the support pillar 311 is the first carrier ( Move to a position aligned with C1). At this time, the height adjustment 312d of the extension bar 312 is made so that the gripper 313 is close to the substrate G of the first carrier C1.

At this time, when a positive pressure is applied to the porous sheet 92 of the first carrier C1 of the first moving belt 111, the substrate G is easily aligned with the upper surface of the porous sheet 92 of the first carrier C1. become separable. At the same time, while suction pressure is applied to the gripper 313 , the substrate G is moved 62 from the first carrier C1 to the gripper 313 . Then, the grip portion 313 rotates 180 degrees with respect to the extension bar 312 (313r). Accordingly, in the substrate G, the first cleaning surface S1 cleaned by the first cleaning unit 100 faces downward, and the second cleaning surface S2 to be cleaned by the second cleaning unit 200 is It becomes an upward-facing posture. Then, the extension bar 312 rotates with respect to the support pillar 311 and moves to the lower side of the grip part 323 of the substrate transmitter 320 .

As shown in FIG. 4 , the pillar part 321 of the substrate transmitter 320 and the connecting bar 322 connecting them are respectively connected to the first moving belt 111 and the second moving belt 211 so that they can be connected. are placed When the substrate G sucked and held by the gripping part 313 of the separation inverter 310 is aligned to the lower side of the gripping part 323 of the substrate transmitter 320, the gripping part of the separation inverter 310 ( The suction pressure applied to the 313 is removed, and the suction pressure is applied to the gripper 323 of the substrate transmitter 320 . Accordingly, the substrate G is sucked and held 63 by the holding unit 323 of the substrate transmitter 323 .

Then, the gripper 323 moves (323d) upward of the second moving belt 211 along the extension bar 322, and moves the extension bar 322 downward (322d) to the second moving belt ( When positioned on the upper surface St of the second porous sheet of the second carrier C2 transported together with the 211), the suction pressure applied to the gripper 323 is removed and the second porous sheet of the second carrier C2 As the suction pressure pn is applied to the do. (Here, the second porous sheet of the second carrier refers to the porous sheet 92 shown in Figs. 5 to 8)

Although the present invention is configured to mount the substrate G from the inverter 300 while the second carrier C2 moves, the present invention is not limited thereto, and the method for mounting the substrate G on the second carrier C2 is not limited thereto. For this purpose, the second moving belt 211 may be temporarily stopped.

Similar to the first carrier C1, the carriers C and C' shown in FIGS. 5 to 8 may be applied to the second carrier C2, and various other types of substrate fixing means may be applied. Here, the second carrier C2 may be formed in the same manner as the first carrier C1 or may be formed in a shape different from that of the first carrier C1 .

On the other hand, according to another embodiment of the present invention, in addition to the configuration of the inverter 300 shown in the drawings, the substrate G is transferred from the first carrier C1 of the first moving belt 111 to the second moving belt 211 ) of the second carrier (C2) can be made of a variety of known configurations that can be moved in a 180-degree inverted posture.

As shown in FIG. 12 , in the second cleaning unit 200 , the second transfer unit 210 includes a second moving belt 211 that rotates in a closed loop form, and The second carrier (C2) is transferred to the outer surface in a fixed state.

The second carrier C2 transfers the substrate G to a predetermined circulation path 71 while the substrate G is mounted thereon. Although the drawing shows a configuration in which the second carrier C2 moves to the circulation path by the configuration in which the second moving belt 211 rotates and circulates in a closed loop form, according to another embodiment of the present invention, the second carrier ( Various means other than a belt capable of transporting C2) can be applied. And, according to another embodiment of the present invention, the second carrier (C2) does not move to the circulation path, but to move in various types of paths such as straight lines and curves from the carrier drying area (OO) to the discharge area (DD) to be described later. may be configured.

Here, the circulating movement direction of the second moving belt 211 is directed in the opposite direction to the circulating movement direction of the first moving belt 111 , so that the moving direction and the second moving direction of the substrate G in the first cleaning unit 100 are Since the moving directions of the substrates in the second cleaning unit 200 are opposite to each other, the substrate loader 10 and the unloading unit 30 are arranged on one side, and the inverter 300 can be arranged on the other side, The entire substrate cleaning apparatus 1 can be implemented with a compact structure.

And, as described above, the plurality of second carriers C2 may be transferred in a semi-permanently fixed state to the second moving belt 211, and may be easily attached to and detached from the second moving belt 111 using a magnet or the like. It may be configured to be

To this end, a plurality of driving rollers 212 are rotationally driven inside the second moving belt 211 by a driving motor M1 to circulate 72 the second moving belt 211 in a predetermined direction. As shown in the figure, the circulation path of the second carrier C2 by the second moving belt 211 may be arranged parallel to the circulation path of the first carrier C1 by the first moving belt 111 However, they may be arranged in various ways while forming perpendicular to each other or forming a predetermined angle.

As shown in FIG. 12 , the second moving belt 211 includes a receiving area AA for receiving the substrate G to be subjected to the cleaning process from the inverter 300 , and washing of the substrate G using the cleaning solution. The cleaning area BB in which the cleaning process of the front surface S1 is performed, the drying area CC in which the drying process of the cleaned substrate G is performed, and the dried substrate G are transferred to the next process. It may be divided into an unloading area DD for unloading. In addition, since the upper surface St of the porous sheet 92 of the second carrier C2 may be partially wet with the cleaning liquid scattered around the cleaning apparatus, the second carrier C2 has a second A carrier drying area OO for drying the carrier C2 may be provided.

The second carrier dryer 290 is disposed on the second movement path of the second carrier C2, and receives the substrate G on the second carrier C2 from the inverter 300 before mounting. 2 The carrier (C2) is dried.

That is, before the substrate G is mounted on the upper surface of the second carrier C2, the dry gas is supplied from the dry gas supply unit DAx, and the high-temperature dry gas 89 is applied to the upper surface of the second carrier C2. By spraying and drying (St), it is possible to prevent contamination of the back surface of the substrate (G) mounted on the second carrier (C1).

The second cleaning unit 220 is provided in the cleaning area BB on the second movement path of the circulation type of the second movement belt 111 . As shown in FIG. 12 , the second cleaning unit 220 is seated on the porous sheet 92 of the second carrier C2 with the cyclic movement of the second moving belt 211 and moves 72 together. With respect to (G), a cleaning brush 222 for contact cleaning the second cleaning surface S2 of the substrate G while rotating from the upper side of the substrate G, and a cleaning liquid supplied from the cleaning liquid supply unit CL2 to the substrate ( A first cleaning liquid injector 122 for spraying the cleaning liquid 88 at a higher pressure than atmospheric pressure to the second cleaning surface S2 of G) is included. Here, the cleaning liquid is supplied even during the cleaning process by the brush 221 to increase the removal efficiency of foreign substances adhering to the second cleaning surface S2 of the substrate G.

According to another embodiment of the present invention, the second cleaning unit 220 may be composed of only one of the cleaning brush 221 and the second cleaning liquid sprayer 222 .

As such, the second cleaning surface S2 of the substrate G undergoes a contact cleaning process and a non-contact cleaning process in the cleaning region BB, and foreign substances adhering to the second cleaning surface S2 of the substrate G and You can remove all the foreign substances that have been attached to it.

In the cleaning process of the second cleaning surface S2 of the substrate G by the second cleaning unit 220 , the second moving belt 211 installs the cleaning brush 221 or the second cleaning liquid sprayer 222 . Although it may be performed while being stopped at a position, according to a preferred embodiment of the present invention, the second moving belt 211 cleans while transporting without stopping even at the installation position of the cleaning brush 221 or the second cleaning liquid sprayer 222 . The process is done. Through this, a continuous cleaning process of the substrate G is possible.

The second dryer 230 is provided in the drying area CC on the second moving path of the circulation type of the second moving belt 211 . In the second dryer 230, the substrate G is unloaded from the unloading region ( In the drying area CC before reaching DD), the drying gas is supplied from the drying gas supply unit DA1, and the high temperature drying gas 89 is sprayed on the surface of the substrate G to prepare the substrate G. 2 Dry the cleaning surface (S2).

Similar to the first dryer 130 , the drying gas 89 injected from the second dryer 230 has an inclination toward the opposite direction to the transfer direction 72 of the substrate G and an air knife toward the substrate G. In the form of spraying the drying gas (89). Through this, instead of drying all of the cleaning liquid remaining on the second cleaning surface S2 of the substrate G instantaneously by the drying gas sprayed from the second dryer 230, the second cleaning surface of the substrate G As the cleaning liquid 88 remaining in ( S1 ) is pushed in the opposite direction to the transfer, the cleaning liquid remaining on the second cleaning surface S2 of the substrate G may be removed.

At this time, the second dryer 230 may spray the drying gas 89 in one row, but the cleaning liquid remaining from the second cleaning surface S1 of the substrate G more reliably by forming two or more rows of air knives. It can be removed by pushing out liquid components such as

And, by the high-temperature hot air sprayed from the second dryer 130, the rear surface of the substrate protruding outside the upper surface St of the second carrier of the configuration shown in FIG. 6 is completely dried, preventing contamination of the rear surface from occurring can do.

The substrate G from which the cleaning liquid remaining on the second cleaning surface S2 has been removed by the second dryer 230 is mounted on the second carrier C2, and is driven by the second moving belt 211 on the second moving belt ( 211 reaches the unloading area DD.

At this time, the unloading unit 30 is provided in the unloading area DD on the second movement path of the circulation type of the second movement belt 211, similar to the substrate loader 10 shown in FIG. G) is separated from the second carrier (C2) and transferred to the next process.

That is, as shown in FIG. 13 , the unloading unit 30 has a holding part 33 that moves in a straight line along a horizontal bar 32 extending in a horizontal direction from the support pillar 31 in a second carrier. Move to the upper alignment position of (C2). At this time, the grip portion 33 is adjusted to the height of the horizontal bar 32 (32d) so as to be close to the substrate (G) of the second carrier (C2) (32d) is made.

And, when a positive pressure is applied to the porous sheet 92 of the second carrier C2, the substrate G is in a state in which it can be easily separated from the upper surface of the porous sheet 92 of the second carrier C2. At the same time, while suction pressure is applied to the gripper 33 , the substrate G is moved 65 from the second carrier C2 to the gripper 33 .

Then, the horizontal bar 32 rotates (32r) to reach the gripper 33 to a unit (not shown) that transfers the substrate G to the next inspection process, and from the gripper 33 to the substrate ( G) to that unit (65).

On the other hand, the cleaning state of the substrate that has been cleaned in the substrate cleaning apparatus 1 is inspected by the inspection unit 2 . As a result of the inspection, if the cleaning is poor, the cleaning process may be performed again ( 999 ). And, if cleaning is good, it is transferred to the next process.

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and modify the present invention within the scope without departing from the spirit and scope of the present invention as set forth in the following claims. You will understand that it can be changed.

1: substrate cleaning device 10: substrate loader
30: unloading unit 91: porous sheet
92: housing 100: first cleaning unit
110: first transfer unit 111: first moving belt
120: first washing unit 130: first dryer
190: first carrier dryer 200: second cleaning unit
220: second transfer unit 211: second transfer belt
220: second washing unit 230: second dryer
290: second carrier dryer G: substrate

Claims (22)

a first carrier having a porous sheet on which a substrate is seated in a posture in which the first cleaning surface is exposed and a suction pressure is selectively applied;
a first transfer unit for moving the first carrier along a predetermined first movement path;
a first cleaning unit disposed on the first movement path to clean the first cleaning surface of the substrate seated on the first carrier;
A substrate cleaning apparatus, characterized in that it comprises a.
The method of claim 1,
The porous sheet is formed to have a dimension in which an upper surface is covered by the substrate, and the side surface of the porous sheet is waterproofed.
3. The method of claim 2,
A substrate cleaning apparatus, characterized in that the upper surface of the housing is formed to surround the periphery of the porous sheet and subjected to hydrophobic treatment.
The method of claim 1,
The substrate cleaning apparatus according to claim 1, wherein the first transfer unit includes a first transfer belt that circulates in a closed loop form.
5. The method of claim 4,
the first carrier circulates in a closed loop with the movement of the first moving belt;
a substrate loader for seating the substrate on the first carrier located on the first moving belt;
Substrate cleaning apparatus, characterized in that it further comprises.
6. The method of claim 5,
The first carrier is magnetically attached to and fixed to the first moving belt.
The method of claim 1,
a first dryer for drying the first cleaning surface of the substrate cleaned by the first cleaning unit;
Substrate cleaning apparatus, characterized in that it further comprises.
The method of claim 1,
a first carrier dryer for drying the first carrier before the substrate is mounted on the first carrier;
Substrate cleaning apparatus, characterized in that it further comprises.
9. The method according to any one of claims 1 to 8,
a second carrier including the second porous sheet on which the substrate is seated in a posture in which a second cleaning surface is exposed and a suction pressure is selectively applied, and a housing for fixing the second porous sheet;
a second transfer unit for moving the second carrier along a predetermined second movement path;
a second cleaning unit disposed in the second movement path to clean a second cleaning surface of the substrate seated on the second carrier;
A substrate cleaning apparatus, characterized in that it comprises a.
10. The method of claim 9,
The second porous sheet is formed to have a dimension in which an upper surface is covered by the substrate, and a side surface exposed to the outside of the second porous sheet is waterproofed.
10. The method of claim 9,
The second porous sheet is formed to have a dimension in which an upper surface is covered by the substrate, and the upper surface of the housing is hydrophobically treated while surrounding the upper surface of the second porous sheet.
10. The method of claim 9,
and the second transfer unit includes a second transfer belt for circulatingly moving the second carrier in a closed loop form.
13. The method of claim 12,
The substrate cleaning apparatus, characterized in that the second movement path is different from the first movement path.
10. The method of claim 9,
an inverter for turning the substrate seated on the first carrier 180 degrees to the second carrier and moving it;
Substrate cleaning apparatus, characterized in that it further comprises.
10. The method of claim 9,
a second dryer for drying the second cleaning surface of the substrate cleaned by the second cleaning unit;
Substrate cleaning apparatus, characterized in that it further comprises.
10. The method of claim 9,
a second carrier dryer for drying the second carrier before the substrate is mounted on the second carrier;
Substrate cleaning apparatus, characterized in that it further comprises.
10. The method of claim 9,
an unloading unit for separating the substrate cleaned by the second cleaning unit from the second carrier;
Substrate cleaning apparatus, characterized in that it further comprises.
10. The method of claim 9,
The substrate cleaning apparatus, characterized in that the first carrier and the second carrier are plural and each cyclically moves.
10. The method of claim 9,
a carrier dryer for drying an upper surface of any one of the porous sheet and the second porous sheet before the substrate is seated on at least one of the first carrier and the second carrier;
Substrate cleaning apparatus, characterized in that it further comprises.
As a carrier used in the cleaning process of the substrate,
a porous sheet on which the substrate is seated, the upper surface of which is covered by the substrate, and a suction pressure is applied thereto;
a housing supporting the porous sheet;
a waterproofing layer formed on a side surface of the porous sheet exposed to the outside;
A carrier for cleaning the substrate comprising a.
As a carrier used in the cleaning process of the substrate,
a porous sheet on which the substrate is seated, the upper surface of which is covered by the substrate, and a suction pressure is applied thereto;
a housing supporting the porous sheet and enclosing a side surface of the porous sheet;
a hydrophobic treatment layer formed on the upper surface of the housing;
A carrier for cleaning the substrate comprising a.
23. The method of claim 21 or 22,
A carrier for cleaning a substrate, characterized in that when the substrate mounted on the porous sheet is separated, a positive pressure is applied to the porous sheet.

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