KR20210144340A - Head mounting device - Google Patents

Abstract

An electronic device according to various embodiments of the present invention comprises: a housing including a first surface facing the outside of the electronic device and a second surface facing a user's face; a frame disposed in the housing; a first light output device and a second light output device disposed in the housing and configured to output an image; and a printed circuit board which includes a first substrate, a second substrate, and an interposer disposed between the first substrate and the second substrate, and has at least a portion positioned between the first light output device and the second light output device, wherein the first light output device, the second light output device, and the printed circuit board can be disposed on the frame in a first direction facing the first surface. The present invention can reduce a volume.

Description

Head mounting device {HEAD MOUNTING DEVICE}

Various embodiments of the present disclosure relate to an electronic device that can be worn on a body, for example, to a head mounting device.

With the development of electronic and communication technologies, electronic devices may be miniaturized and lightened to such an extent that they can be used without great inconvenience even when worn on a user's body. For example, a head mounting device (HMD), smart glasses, smart watch (or band), contact lens type device, ring type device, glove type device, shoe type device, or clothing type device may be worn on the user's body. can Such a body-worn electronic device can be easily carried and improved user accessibility.

The head mounting apparatus is a device used while being worn on the user's head or face, and may provide augmented reality (AR) to the user. For example, the head mounting apparatus providing augmented reality may be implemented in the form of glasses, and may provide information on objects in the form of images or texts to the user in at least a partial space of the user's field of view. The head mounting apparatus may provide virtual reality (VR) to a user. For example, by outputting independent images to both eyes of the user, and outputting content provided from an external input to the user in the form of an image or sound, an excellent sense of immersion can be provided.

The head mounting apparatus is being reduced in size and weight in order to increase the user's portability and convenience, and may include components integrated in an increasingly small space for high performance. Accordingly, the components used in the electronic device may have a higher heating temperature due to high performance, and the increased heating temperature may affect the adjacent components, thereby degrading the overall performance of the electronic device.

In addition, the head mounting apparatus includes an essential structure such as a structure (eg, an optical output apparatus) for providing an output screen to both eyes of a user. Accordingly, a dead space exists in the mounting space, and thus the space may not be efficiently utilized.

According to various embodiments of the present disclosure, it is possible to provide a head mounting apparatus capable of effectively dissipating heat generated from a heat source.

According to various embodiments of the present disclosure, the volume of the head mounting apparatus may be reduced by efficiently utilizing the mounting space.

However, the problems to be solved in the present disclosure are not limited to the above-mentioned problems, and may be variously expanded without departing from the spirit and scope of the present disclosure.

According to various embodiments of the present disclosure, an electronic device includes a housing including a first surface facing the outside of the electronic device and a second surface configured to face a user's face, a frame disposed within the housing, and disposed within the housing A printed circuit board comprising: a first optical output device and a second optical output device configured to output an image, and at least a portion of which is positioned between the first optical output device and the second optical output device, the first substrate; a printed circuit board including a second substrate and an interposer disposed between the first substrate and the second substrate, wherein the first optical output device, the second optical output device, and the printed circuit board include the first optical output device and the second printed circuit board. It may be disposed on the frame in a first direction toward one side.

According to various embodiments of the present disclosure, an electronic device includes a housing, a first light output device and a second light output device disposed in the housing and configured to output an image, a first substrate, and a seventh light output device facing the first substrate A printed circuit board, the printed circuit board including a second substrate positioned opposite to the first surface and the seventh surface, the second substrate including an eighth surface on which a processor is disposed, and an interposer disposed between the first and second substrates; A frame including a first area in which a first light output device is disposed, a second area in which the second light output device is disposed, and a third area positioned between the first area and the second area and facing the processor The first optical output device, the second optical output device, and the processor may be disposed in contact with the frame.

In the head mounting apparatus according to various embodiments of the present disclosure, a printed circuit board may be disposed between the light output devices to reduce the volume of the head mounting apparatus.

The head mounting apparatus according to various embodiments of the present disclosure may effectively dissipate heat generated from a heat source by using a frame that receives heat generated from a processor and an optical output device.

1 is a perspective view of an electronic device, according to various embodiments of the present disclosure;
2 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;
3 is a cross-sectional view taken along the AA′ of FIG. 2 .
4 is an exploded perspective view of some components of an electronic device, according to various embodiments of the present disclosure;
5A and 5B are perspective views of an optical output device separated from a frame according to various embodiments of the present disclosure;
6 is a perspective view of a printed circuit board and an optical output device disposed on a frame, according to various embodiments of the present disclosure;
7 is a diagram illustrating a temperature distribution of the electronic device of FIG. 1 .

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

1 is a perspective view of an electronic device, according to various embodiments of the present disclosure;

According to various embodiments, the electronic device 101 may be a body wearable device. For example, the electronic device 101 may be a head mounting device (HMD) capable of providing an image directly in front of the user's eyes.

Referring to FIG. 1 , an electronic device 101 may include a housing 200 that forms an exterior of the electronic device 101 . According to various embodiments, the housing 200 may form an exterior of the electronic device 101 and provide a space in which components of the electronic device 101 may be disposed. For example, the housing 200 may include a first housing 210 that may surround at least a portion of the user's head. According to an embodiment, the first housing 210 may include a first surface 200a facing the outside of the electronic device 101 and a second surface 200b at least partially facing the user's face. have. According to an embodiment, at least a portion of the second surface 200b is in a direction opposite to the first surface 200b with respect to the component of the electronic device 101 (eg, the light output device 310 of FIG. 3 ). can be located

For example, the second surface 200b may surround at least a portion of the user's face. As another example, the first housing 210 may include a nose support (not shown) configured to be seated on the user's nose. According to an embodiment, the second surface 200b may form a space S into which the user's body is inserted.

According to various embodiments, the first housing 210 surrounds at least a portion between the first surface 200a and the second surface 200b and has an outer surface 200c facing the outside of the electronic device 101 . may include

According to various embodiments, the housing 200 may include a second housing 220 that may be seated on the user's face. According to an embodiment, the second housing 220 may include a third surface 200d that can be seated on the user's face (eg, the user's forehead). According to an embodiment, the second housing 220 may be disposed on at least a portion of the second surface 200b. For example, the second housing 220 may include a fourth surface (eg, the fourth surface 200e of FIG. 4 ) facing the second surface 200b.

According to various embodiments, the housing 200 may include a third housing 230 that may be seated on the back of the head of the user. According to an embodiment, at least a portion of the third housing 230 may be disposed on the second surface 200b of the first housing 210 . According to an embodiment, a battery (not shown) capable of supplying power to an electronic component (eg, a processor (processor 440 of FIG. 6 ) of the electronic device 101 ) may be disposed in the third housing 230 . have.

2 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure; FIG. 3 is a cross-sectional view taken along line A-A′ of FIG. 1 .

2 and 3 , the electronic device 101 includes a first housing 210 , a second housing 220 , an optical output device 310 , a camera module 320 , an antenna module 330 , and a glass member. It may include a 340 and a frame 500 . The configurations of the electronic device 101 , the first housing 210 and the second housing 220 of FIG. 2 are the same as those of the electronic device 101 , the first housing 210 and the second housing 220 of FIG. 1 . All or some may be the same.

According to various embodiments, the first housing 210 may include a window member 212 , a first support member 214 , a second support member 216 , and the first support member 214 and the second support member. side members 218 surrounding at least a portion between 216 . According to an embodiment, the first support member 214 may be disposed in the second direction (eg, the -X direction) of the window member 212 . According to an embodiment, the side member 218 may be the outer surface of the electronic device 101 (eg, the outer surface 200c of FIG. 1 ) or the second surface of the electronic device 101 (eg, the second surface of FIG. 1 ) 200b)) may be formed. According to an embodiment, the first housing 210 may include a window member 212 forming a first surface (eg, the first surface 200a of FIG. 1 ). The window member 212 is substantially transparent, so that a user wearing the electronic device 101 may acquire an external image through the window member 212 . According to another embodiment, some components of the housing 200 (eg, the window member 212 ) may be omitted.

According to various embodiments, the second housing 220 may include a cushion member 222 configured to be seated on the user's forehead. The cushion member 222 may form at least a portion of the third surface 200d. According to various embodiments, the second housing 220 may be coupled to the first housing 210 . For example, the second housing 220 includes a first connecting member 226 disposed on the second supporting member 216 of the first housing 210 and a cushion member frame connected to the first connecting member 226 ( 224) and a cushion member 222 disposed on the cushion member frame 224.

According to various embodiments, the optical output device 310 may provide an image to a user. For example, the light output device may include a display panel (not shown) capable of outputting an image, and a lens (not shown) corresponding to the user's eye and guiding the image to the glass member 340 . According to an embodiment, the user's right eye acquires the image output from the display panel of the first light output device 312 through the lens of the first light output device 312 , and the user's left eye uses the second light An image output from the display panel of the second light output device 314 may be acquired through the lens of the output device 314 .

According to various embodiments, the lens includes the first lens for guiding the image output from the display panel of the first light output device 312 to the first glass member 340a and the display panel of the second light output device 314 . It may include a second lens for guiding the image output from the second glass member (340b). For example, the first lens and the second lens may be a condenser lens. According to an exemplary embodiment, other optical elements are disposed between the first lens and the first glass member 340a or between the second lens and the second glass member 340b to be disposed from the first lens to the first glass member 340a. A travel path of light or image from the second lens and/or a path of light or image from the second lens to the second glass member 340b may be set. The first image or the second image passing through the first lens or the second lens may be transmitted to the glass member 340 through an input port (not shown) in one region of the glass member 340 .

According to various embodiments, the light output device 310 may be disposed in the housing 200 . For example, the light output device 310 may include a first light output device 312 configured to correspond to the user's right eye and a second light output device 314 configured to correspond to the user's left eye.

According to various embodiments, the electronic device 101 may include a camera module 320 capable of capturing still images and moving images. The camera module 320 may include at least one of a lens, at least one image sensor, an image signal processor, and a flash. The camera modules 322 , 326 , and 328 may include at least one of a first camera module 322 , a second camera module 326 , and a third camera module 328 . According to an embodiment, the first camera module 322 may capture an external image through the first camera hole 322a of the first support member 214 . According to an embodiment, the second camera module 326 includes the 2-1 camera module 326a and the first support member 214 disposed in the second camera hole 326c of the first support member 214 . A 2-2 second camera module 326b disposed in the third camera hole 326d may be included. The second camera module 326 may be a gray scale camera. According to an embodiment, the third camera module 328 may capture a trajectory of the user's eye (eg, a pupil). For example, the third camera module 328 may photograph the reflection pattern of the light emitted by the 3-1 light emitting unit 366a or the 3-2 light emitting unit 366b to the user's eyes. The third camera module 328 includes a 3-1 camera module 328a capable of photographing the trajectory of the user's right eye and a 3-2 camera module 328b capable of photographing the trajectory of the user's left eye. can do.

According to various embodiments, the antenna module 330 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the processor of the electronic device 101 (eg, the processor 440 of FIG. 3 ) uses the antenna module 330 to perform a short-range communication network (eg, Bluetooth, Bluetooth low energy). , may communicate with an external electronic device through wireless fidelity (WiFi) direct or infrared data association (IrDA) According to an embodiment, the antenna module 330 includes a conductor formed on a substrate (eg, PCB) or The antenna module 330 may include a plurality of antennas (eg, an array antenna).

According to various embodiments, the electronic device 101 may include a glass member 340 including a plurality of glasses. The glass member 340 may provide the user with at least one of an external image or an image output from the light output device 310 .

According to various embodiments, at least a portion of the glass member 340 may transmit external light. For example, the user may acquire an external image through the glass member 340 while wearing the electronic device 101 .

According to various embodiments, the glass member 340 may include a waveguide (not shown) providing a path of light generated by the light output device 310 . According to an embodiment, the glass member 340 may guide the image output from the light output device 310 to the user's eyes through the waveguide. For example, the waveguide may diffract, polarize, or reflect the image to guide the image to the user's eye. As another example, the waveguide may form a hologram based on an image output from the optical output device 310 . According to an embodiment, the waveguide may include at least one of a lens, a mirror, a prism, or a transparent member on which a nano-pattern is formed. The size of the image guided by the user's eyes from the glass member 340 may be larger than the size of the image output from the light output device 310 .

According to various embodiments, the glass member 340 may provide an image output from the light output device 310 and an image incident to the user from the outside of the electronic device 101 to the user.

According to various embodiments, the light output device 310 may be disposed on at least a portion of the glass member 340 . For example, the first light output device 312 is disposed in a third direction (eg, +Z direction) of the first glass member 340a, and the second light output device 314 is disposed in the second glass member 340b. ) in the + third direction (eg, +Z direction).

According to various embodiments, a portion of the glass member 340 may be disposed in the frame 500 . At least a portion of a side surface (eg, YZ plane) of the glass member 340 may be surrounded by at least one glass member enclosure 342 . For example, the first glass member 340a and the second glass member 340b may be disposed in the glass member enclosure 342 , respectively.

According to various embodiments, the electronic device 101 may include at least one of a first microphone 372a, a second microphone 372b, and a third microphone 374 capable of converting a sound into an electrical signal. . According to an embodiment, the first microphone 372a and the second microphone 372b are respectively disposed in the glass member enclosure 342 , and the third microphone 374 is disposed above the glass member 340 (eg, a frame ( 500) or in the third direction (+Z direction).

According to various embodiments, the electronic device 101 includes a first light emitting unit 362 , a second light emitting unit 364 , and a 3-1 light emitting unit 366a capable of emitting light to the outside of the electronic device 101 . ) or at least one of the 3-2 light emitting part 366b. According to an embodiment, the first light emitting unit 362 and the second light emitting unit 364 may include a light emitting diode (LED) configured to emit light in a visible ray band. According to an embodiment, the 3-1 light emitting part 366a and the 3-2 light emitting part 366b may include light emitting diodes configured to emit light in the infrared band. At least one of the 3-1 light emitting unit 366a and the 3-2 light emitting unit 366b may emit light in an infrared band to a user (eg, the user's eyes). For example, the 3-1 light-emitting unit 366a or the 3-2 light-emitting unit 366b may be configured to allow the third camera module 328 to capture the trajectory of the user's eye (eg, a pupil). It can emit light in the infrared band through its eyes.

According to various embodiments, the electronic device 101 may include a first speaker 376a or a second speaker 376b capable of converting an electrical signal into sound. According to an embodiment, the first speaker 376a may be disposed on the side member 218 to correspond to the user's right ear, and the second speaker 376b may be disposed to the side member 218 to correspond to the user's left ear. have.

According to various embodiments, the electronic device 101 may include a sensor module (not shown). The sensor module may detect an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state) and generate an electrical signal or data value corresponding to the sensed state. . According to an embodiment, the sensor module may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor 382, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor. According to an embodiment, the proximity sensor 382 may detect whether the user wears the electronic device 101 .

According to various embodiments, the electronic device 101 transmits commands or data to be used in a component of the electronic device 101 (eg, the processor 440 of FIG. 6 ) outside the electronic device 101 (eg, a user). It may include a key input device (384, 386) that can receive from. According to an embodiment, the first key input device 384 is used as a key input device for volume control of the speakers 376a and 376b, and the second key input device 386 adjusts the brightness of the optical output device 310 . It can be used as a key input device for

According to various embodiments, the electronic device 101 may include a printed circuit board 400 on which a processor (eg, the processor 440 of FIG. 6 ) is disposed. Electronic components of the electronic device 101 may be electrically connected to the printed circuit board 400 to receive a command from the processor 440 . For example, the first optical output device 312 is electrically connected to the printed circuit board 400 through the first flexible printed circuit board 450a, and the second optical output device 314 is electrically connected to the second flexible printed circuit board 450a. It is electrically connected to the printed circuit board 400 through the board 450b, and the 2-1 camera module 326a is electrically connected to the printed circuit board 400 through the third flexible printed circuit board 450c. , 2-2 The camera module 326b may be electrically connected to the printed circuit board 400 through the fourth flexible printed circuit board 450d. As another example, the first camera module 322 or the antenna module 330 may be directly electrically connected to the printed circuit board 440 . As another example, the third camera module 328 , the proximity sensor 382 , the 3-1 light emitting part 366a and the 3-2 light emitting part 366b are connected through the fifth flexible printed circuit board 450e. It may be electrically connected to the printed circuit board 400 . According to an embodiment, the printed circuit board 400 may be electrically connected to a battery (not shown) through at least one wire 462 . According to an embodiment, the printed circuit board 400 may be electrically connected to the auxiliary printed circuit board 460 through at least one wire 462 .

According to various embodiments, at least a portion of the printed circuit board 400 may be positioned between the first light output device 312 and the second light output device 314 . For example, the printed circuit board 400 includes a first area (eg, the first area 502 of FIG. 5A ) of the frame 500 in which the first light output device 312 is disposed and a second light output device ( A third region of the frame 500 (eg, the third region 506 of FIG. 5A ) located between the second region of the frame 500 (eg, the second region 504 of FIG. 5A ) in which the 314 is disposed. can be placed in

According to various embodiments, the frame 500 may support components of the electronic device 101 . For example, a portion of the light output device 310 , the printed circuit board 400 , and/or the glass member 340 may be disposed on the frame 500 .

According to various embodiments, the frame 500 is made of a material capable of increasing heat dissipation or lowering heat generated by electronic components (eg, processors 440 ) of the electronic device 101 . can be formed with For example, the frame 500 may be formed of metal. According to an embodiment, the frame 500 may be formed of at least one of aluminum, magnesium, or stainless steel.

According to various embodiments, the frame 500 may be disposed in the first housing 210 , and may be coupled to the second support member 216 of the first housing 210 through the frame support member 510 .

According to various embodiments, the electronic device 101 may include an auxiliary printed circuit board 460 . The auxiliary printed circuit board 460 may be disposed in a second direction (eg, -X direction) with respect to the frame 500 . According to an embodiment, an auxiliary processor (not shown) may be disposed on the auxiliary printed circuit board 460 .

According to various embodiments, the frame 500 may include at least one through hole 520 . According to an embodiment, the surface area of the frame 500 may be increased due to the through hole 520 , so that heat dissipation of the electronic device 101 may be increased. According to another embodiment, the through hole 520 may be formed to correspond to an outdoor air inlet hole (not shown) formed in the housing 200 . The air introduced from the outside air inlet hole is transferred to the through hole 520 of the frame 500 , so that heat dissipation of the electronic device 101 may be increased. According to an embodiment, the through hole 520 may be formed between the first region (eg, the first region 502 of FIG. 5A ) and the second region (eg, the second region 504 of FIG. 5A ). have.

According to various embodiments, the electronic device 101 may include a first heat dissipation sheet 392 and a second heat dissipation sheet 394 . The heat dissipation sheet 390 may be formed of a material having high thermal conductivity (eg, graphite). According to an exemplary embodiment, the first heat dissipation sheet 392 and the second heat dissipation sheet 394 may be disposed in the first housing 210 . For example, the first heat dissipation sheet 392 is the second surface (eg, the second surface of FIG. 1 ) of the first housing 210 that forms a space into which the user's body is inserted (eg, (S) of FIG. 1 ). 200b), etc. For example, the second heat dissipation sheet 394 may be disposed on the outer surface of the first housing 210 ( 200c), etc. For example, the first heat dissipation sheet 392 provides an image output from the light output device 310 and an image incident to the user from the outside of the electronic device 101 to the user. It may be located in a portion that does not overlap with the area of the glass member 340 to be used.

4 is an exploded perspective view of an electronic device in which a light output device of the electronic device is disposed in a frame, according to various embodiments of the present disclosure; 5A and 5B are exploded perspective views of an electronic device in which an optical output device is separated from a frame, according to various embodiments of the present disclosure;

4, 5A and 5B , the electronic device 101 includes an optical output device 310, a printed circuit board 400, a frame 500, and a camera module 320 (eg, a first camera module ( 322 ), an antenna module 330 , and a heat dissipation sheet 390 . The configuration of the electronic device 101 , the optical output device 310 , the printed circuit board 400 , the frame 500 , the camera module 320 and the antenna module 330 of FIGS. 4 , 5A and 5B is shown in FIG. 2 . All or part of the configuration of the electronic device 101, the optical output device 310, the printed circuit board 400, the frame 500, the camera module 320, and the antenna module 330 of FIGS. 3 to 3 may be the same. have.

According to various embodiments, the light output device 310 may be disposed on the frame 500 . According to an embodiment, the first light output device 312 includes a first rear surface 312a in contact with the frame 500 , and the second light output device 314 includes a second light output device 314 in contact with the frame 500 . It may include a rear surface 314a. For example, the heat generated by the first light output device 312 is transferred to the frame 500 through the first rear surface 312a, and the heat generated by the second light output device 314 is transferred to the second rear surface ( 314a) may be transmitted to the frame 500 . According to an embodiment, as the light output device 310 directly contacts the frame 500 , heat generated by the light output device 310 may be efficiently transferred to the frame 500 . According to an embodiment, the light output device 310 is configured to face the frame 500 in a direction toward the first surface (eg, the first surface 200a of FIG. 1 ) of the housing (eg, the housing 200 of FIG. 1 ). can be placed in For example, the light output device 310 may be disposed on the frame 500 in a first direction (eg, a +X direction).

In various embodiments, the light output device 310 may be formed in various shapes. According to an embodiment, the first light output device 312 has a first front surface 312b facing a direction opposite to the first rear surface 312a and at least a portion between the first rear surface 312a and the first front surface 312b. It may include a first side 312c surrounding the. According to an embodiment, the second light output device 314 has a second front surface 314b facing in a direction opposite to the second rear surface 314a and at least a portion between the second rear surface 314a and the second front surface 314b. It may include a second side 314c surrounding the.

According to various embodiments, the electronic device 101 may include a shielding member 316 for coupling the light output device 310 to the frame 500 . According to an embodiment, the shielding member 316 may surround at least a portion of the light output device 310 .

According to various embodiments, the shielding member 316 connects the first shielding member 316a coupling the first light output device 312 to the frame 500 and the second light output device 314 to the frame 500 . It may include a second shielding member 316b coupled to the. According to an embodiment, the first shielding member 316a may surround at least a portion of the first front surface 312b and at least a portion of the first side surface 312c, and may be coupled to the frame 500 . According to an exemplary embodiment, the second shielding member 316b may surround at least a portion of the second front surface 314b and at least a portion of the second side surface 314c, and may be coupled to the frame 500 . According to an exemplary embodiment, heat generated by the light output device 310 may be transferred to the frame 500 through the shielding member 316 . According to an embodiment, a heat transfer member (not shown) may be positioned between the first front surface 312b and the first shielding member 316a of the first light output device 312 . For example, the heat transfer member may include a carbon fiber thermal interface material (TIM) capable of transferring heat generated from the first light output device 312 to the first shielding member 316a. As another example, the heat transfer member is not limited to the carbon fiber TIM, and transfers heat generated from the light output device 310 to the outside or to the cover of the electronic device 101 (eg, the housing 200 of FIG. 1 ). It may include a heat pipe, a heat dissipation sheet, or a heat dissipation paint. According to various embodiments, the heat transfer member is disposed between the first rear surface 312a of the first light output device 312 and the frame 500 , the second front surface 314b of the second light output device 314 and the second light output device 314 . It may be positioned between the two shielding members 316b or between the second rear surface 312b of the second light output device 314 and the frame 500 .

According to various embodiments, the optical output device 310 may be electrically connected to the printed circuit board 400 through the flexible printed circuit board 450 . For example, the first optical output device 312 is electrically connected to the printed circuit board 400 through the first flexible printed circuit board 450a, and the second optical output device 314 is electrically connected to the second flexible printed circuit board 450a. It may be electrically connected to the printed circuit board 400 through the board 450b. According to an embodiment, the first flexible printed circuit board 450a surrounds at least a portion of the first shielding member 316a, and the second flexible printed circuit board 450b includes at least a portion of the second shielding member 316b. can surround

According to various embodiments, the electronic device 101 may include a heat dissipation sheet 390 . The heat dissipation sheet 390 may be formed of a material having high thermal conductivity. According to an embodiment, the heat dissipation sheet 390 may be formed of at least one of graphite and copper (Cu).

According to various embodiments, the heat dissipation sheet 390 may be disposed in various positions of the electronic device 101 . For example, the heat dissipation sheet 390 may be at least one first heat dissipation sheet 392 disposed on the first support member 214 and an upper portion of the frame 500 (eg, in the third direction (+Z direction)). The second heat dissipation sheet 394 disposed below the frame 500 (eg, the fourth direction (-Z direction) opposite to the third direction (+Z)) at least one third heat dissipation sheet ( 396) may be included. Although the structure in which the first heat dissipation sheet 392 is two is disclosed in FIG. 4 , in another embodiment (the heat dissipation sheet 392 of FIG. 3 ), the first heat dissipation sheet 392 may be integrally formed.

According to an embodiment, at least a portion of the first support member 214 and/or the frame 500 may include a heat dissipation paint. For example, the heat dissipation paint may include a material such as graphite, carbon nanotubes, a natural recycled material, silicon, silicon, or graphite.

According to various embodiments, a portion of the printed circuit board 400 may be disposed on the frame 500 . According to one embodiment, the printed circuit board 400 is the frame 500 in a direction toward the first side (eg, the first side 200a of FIG. 1 ) of the housing (eg, the housing 200 of FIG. 1 ). can be placed in For example, the printed circuit board 400 may be disposed to face a first direction (eg, a +X direction) toward the first surface 200a of the electronic device 101 .

According to various embodiments, the printed circuit board 400 includes a first substrate 410 , a second substrate 420 , and an interposer 430 disposed between the first substrate 410 and the second substrate 420 . may include. According to an embodiment, the interposer 430 may electrically connect the first substrate 410 and the second substrate 420 .

According to various embodiments, at least a portion of the camera module 320 (eg, the first camera module 322 ) may be positioned on the printed circuit board 400 . For example, the camera module 320 includes a camera bracket 324 disposed between the printed circuit board 400 and the first support member 214 and a first camera module 322 disposed on the camera bracket 324 . may include. According to an embodiment, the camera bracket 324 may be formed of metal, and heat generated in the first camera module 322 may be distributed to the camera bracket 324 .

According to various embodiments, at least a portion of the camera module 320 may be disposed between the first light output device 312 and the second light output device 314 . For example, the first camera module 322 and the camera bracket 324 are arranged in a first direction ( e.g. in the +X direction).

According to various embodiments, the antenna module 330 may include an antenna pattern 332 and an antenna bracket 334 on which the antenna pattern 332 is formed. According to an embodiment, the antenna bracket 334 may be disposed in a first direction (eg, a +X direction) of the camera bracket 324 . For example, the antenna bracket 334 may surround at least a portion of the first camera module 322 and may be disposed in a first direction (eg, a +X direction) of the camera bracket 324 . According to an embodiment, the antenna module 330 may be a laser direct structuring (LDS) antenna. According to another embodiment, the antenna module 330 may include a patch type antenna.

According to various embodiments, at least a portion of the antenna module 330 may be disposed between the first light output device 312 and the second light output device 314 . According to an embodiment, the antenna bracket 334 on which the antenna pattern 332 is formed is disposed between the first optical output device 312 and the second optical output device 314 in the first direction of the printed circuit board 400 . (eg +X direction). For example, the antenna bracket 334 may be disposed between the first support member 214 and the first camera module 322 . According to another embodiment, the antenna bracket 334 may be disposed between the camera bracket 324 and the printed circuit board 400 .

According to various embodiments, the frame 500 may support components of the electronic device 101 . For example, the frame 500 includes a first area 502 in which the first light output device 312 is disposed, a second area 504 in which the second light output device 314 is disposed, and the printed circuit board 400 . ) may include a third region 506 in which is disposed. According to one embodiment, the third region 506 is formed between the first region 502 and the second region 504 , and the first region 502 , the second region 504 , and the third region 506 . ) can point in the same direction (eg +X direction).

According to various embodiments, the frame 500 may dissipate heat generated from components of the electronic device 101 . For example, when the electronic device 101 operates, the first area 502 in which the first light output device 312 is disposed, the second area 504 in which the second light output device 314 is disposed, and The temperature of the third region 506 in which the printed circuit board 400 is disposed is at least one spaced apart from the third region 506 in a fifth direction (eg, +Y direction) or a sixth direction (-Y direction). It may be higher than the temperature of the fourth region 508 of For example, the fourth region 508 may be located at an end of the frame 500 . Heat is transferred from the first region 502 , the second region 504 , and the third region 506 to the at least one fourth region 508 , so that the heat of the electronic device 101 may be dispersed. have.

6 is a perspective view of a printed circuit board and an optical output device disposed on a frame, according to various embodiments of the present disclosure;

Referring to FIG. 6 , the electronic device 101 may include an optical output device 310 , a printed circuit board 400 , and a frame 500 . The configuration of the electronic device 101 , the optical output device 310 , the printed circuit board 400 , and the frame 500 of FIG. 6 is the electronic device 101 and the optical output device 310 of FIGS. 4 , 5A and 5B . ), the printed circuit board 400 and the configuration of the frame 500 and all or a part may be the same.

According to various embodiments, the printed circuit board 400 may include a plurality of boards. For example, the printed circuit board 400 may include a first substrate 410 , a second substrate 420 , and an interposer 430 disposed between the first substrate 410 and the second substrate 420 . can According to an embodiment, the first substrate 410 may include a fifth surface 410a facing the first surface 200a and a sixth surface 410b facing the second substrate 420 . According to an embodiment, the second substrate 420 may include a seventh surface 420a facing the first substrate 410 and an eighth surface 420b facing the frame 500 . According to an embodiment, the interposer 430 may be disposed between the sixth surface 410b and the seventh surface 420a.

According to various embodiments, the printed circuit board 400 may include a processor 440 . According to an embodiment, the processor 440 may be disposed on the second substrate 420 . For example, the processor 440 may be disposed on the eighth surface 420b of the second substrate 420 and positioned between the second substrate 420 and the frame 500 . For example, the processor 440 disposed on the second substrate 420 may face the frame 500 .

According to various embodiments, the processor 440 may be thermally connected to the frame 500 . For example, heat generated by the processor 440 may be transferred to the frame 500 . According to an embodiment, the processor 440 may be in direct contact with the frame 500 , and heat generated by the processor 440 may be transferred to the frame 500 . According to another embodiment, the processor 440 may indirectly contact the frame 500 . For example, the processor 440 may be in contact with the frame 500 through a heat transfer member 442 or an adhesive member (eg, a tape (not shown)) described below.

According to various embodiments, the electronic device 101 may include a heat transfer member 442 . For example, the heat transfer member 442 may be disposed between the processor 440 and the frame 500 , and heat generated by the processor 440 may be transferred to the frame 500 through the heat transfer member 442 . . According to an embodiment, the heat transfer member 442 may surround at least a portion of the processor 440 .

According to various embodiments, the heat transfer member 442 may increase the heat dissipation effect of the processor 440 . For example, the heat transfer member 442 may include at least one of a metal plate, a thermal interface material (TIM), a nano-foam, or a vapor chamber. According to an embodiment, the thermal interface material and the nanofoam increase the conductivity of heat transferred from the processor 440 to the frame 500 by reducing the air layer on the contact surface between the processor 440 and the frame 500 . can do it According to an embodiment, the vapor chamber may include a refrigerant configured to undergo a phase change to increase conductivity of heat transferred from the processor 440 to the frame 500 . According to an embodiment, the metal plate may be formed of a metal having high thermal conductivity (eg, stainless steel, magnesium, or aluminum) to increase the conductivity of heat transferred from the processor 440 to the frame 500 .

According to various embodiments, the electronic device 101 may include a heat pipe (not shown) disposed on the frame 500 . The heat pipe may dissipate heat of the frame 500 . According to an embodiment, the heat pipe may be disposed under the frame support member 510 (eg, in the second direction (-X direction)). According to another embodiment, the heat pipe may be disposed between the frame 500 and the frame support member 510 .

7 is a diagram illustrating a temperature distribution of the electronic device of FIG. 1 .

Referring to FIG. 7 , the temperature of the electronic device 101 of FIG. 1 may be changed based on a structure in which components of the electronic device 101 are disposed. For example, a region in which a processor (eg, the processor 440 of FIG. 6 ) or an optical output device (eg, the optical output device 310 of FIG. 6 ) is located may have a higher temperature than other regions. The configuration of the electronic device 101 of FIG. 7 may be all or partly the same as that of the electronic device 101 of FIG. 1 .

According to various embodiments, when the electronic device 101 is used, heat may be generated in components of the electronic device 101 and the temperature of the electronic device 101 may increase. According to an embodiment, the temperature of the region (eg, the first hot spot area A1 ) in which the processor (eg, the processor 440 of FIG. 6 ) is located may be the highest temperature region in the electronic device 101 . For example, when the electronic device 101 is operated, heat generated by the processor 440 is dispersed to the outside of the electronic device 101, thereby reducing the temperature rise of the first hot spot area A1. have.

According to various embodiments, a frame (eg, frame 500 of FIG. 6 ) may be configured by a processor (eg, processor 440 of FIG. 6 ) and an optical output device (eg, optical output device 310 of FIG. 6 ). The transferred heat can be dissipated. According to one embodiment, the frame 500 is directly from the processor 440 and the light output device 310 of the printed circuit board 400 or a heat transfer member (eg, the heat transfer member of FIG. 6 ) 442)), the temperature of the electronic device is determined by the frame 500 directly transferring heat from the processor 440 and the optical output device 310 of the printed circuit board 400 and the heat transfer. The temperature may be lower than the temperature of the electronic device that does not receive heat through the member 442 . For example, the printed circuit board 400 is positioned in a third direction (eg, +Z direction in FIG. 4 ) of the frame 500 , and the processor 440 is not thermally connected to the frame 500 . In an electronic device without the processor 440 , the temperature of the second hot spot region (not shown) in which the processor 440 is located (eg, about 49.7° C.) is the frame 500 , the processor 440 of the printed circuit board 400 . and a temperature ( e.g. about 42.1°C).

According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 101 of FIG. 1 ) includes a first surface (eg, the first surface 200a of FIG. 1 ) facing the outside of the electronic device and a user a housing (eg, housing 200 of FIG. 1 ) comprising a second side (eg, second side 200b of FIG. 2 ) configured to face a frame disposed within the housing (eg, second side 200b of FIG. 2 ); frame 500), a first light output device (eg, the first light output device 312 of FIG. 2 ) and a second light output device (eg, the second light output device of FIG. 2 ) disposed in the housing and configured to output an image 2 light output device 314) and a first substrate (eg, the first substrate 410 of FIG. 6), a second substrate (eg, the second substrate 420 of FIG. 6), and the first substrate and the A printed circuit board (eg, an interposer 430 of FIG. 6 ) disposed between second substrates, at least a portion of which is positioned between the first optical output device and the second optical output device : the printed circuit board 400 of FIG. 2 ), wherein the first light output device, the second light output device, and the printed circuit board are directed in a first direction (eg, + in FIG. 2 ) toward the first surface. X-direction) may be disposed on the frame.

According to various embodiments, the electronic device is disposed on the second substrate and further includes a processor (eg, the processor 440 of FIG. 3 ) facing the frame, wherein at least a portion of the heat generated by the processor is It may be configured to be delivered to the frame.

According to various embodiments, the electronic device further includes a heat transfer member disposed between the processor and the frame (eg, the heat transfer member 442 of FIG. 6 ), the heat transfer member comprising: a thermal interface material; It may include at least one of a nano-foam, a vapor chamber, or a metal plate.

According to various embodiments, the first light output device includes a first rear surface in contact with the frame (eg, the first rear surface 312a in FIG. 5B ), and the second light output apparatus contacts the frame. and a second rear surface (eg, the second rear surface 314a of FIG. 5B ).

According to various embodiments, the first light output device includes a first front surface (eg, the first front surface 312b of FIG. 5A ) facing the opposite direction of the first rear surface and between the first front surface and the first rear surface a first side (eg, first side 312c in FIG. 5A ) surrounding at least a portion of a second front surface (314b) of a first shielding member (eg, the first shielding member 316a in FIG. 5A ) coupled to the frame and surrounding at least a portion of the first front surface and at least a portion of the first side surface, and at least a portion of the second front surface and the It may further include a second shielding member (eg, the second shielding member 316b of FIG. 5A ) that surrounds at least a portion of the second side surface and is coupled to the frame.

According to various embodiments, the first substrate has a fifth surface (eg, the fifth surface 410a of FIG. 6 ) facing the first surface and a sixth surface (eg, of FIG. 6 ) facing the second substrate a sixth surface 410b), wherein the second substrate includes a seventh surface (eg, the seventh surface 420a of FIG. 6 ) facing the first substrate and an eighth surface (eg, FIG. 6 ) facing the frame 6 of the eighth surface 420b), and the interposer may be disposed between the sixth surface and the seventh surface.

According to various embodiments, at least a part of the electronic device is inserted into the frame, and a first glass member (eg, the first glass member 340a of FIG. 2 ) configured to guide the image output from the first light output device. )) and a second glass member (eg, the second glass member 340b of FIG. 2 ) at least partially inserted into the frame and configured to guide the image output from the second light output device. .

According to various embodiments, the electronic device includes a camera bracket (eg, the camera bracket 324 of FIG. 4 ) disposed on the printed circuit board and a first camera module (eg, the first camera module of FIG. 4 ) disposed on the camera bracket. 1 camera module 322), wherein at least a portion of the camera bracket may be disposed between the first optical output device and the second optical output device.

According to various embodiments, the electronic device includes an antenna module (eg, the antenna module 330 of FIG. 4 ) disposed on the camera bracket and including an antenna pattern (eg, the antenna pattern 332 of FIG. 4 ). may include more.

According to various embodiments, the frame may include at least one of aluminum, magnesium, or stainless steel.

According to various embodiments, the housing includes a window member (eg, the window member 212 of FIG. 2 ) forming at least a portion of the first surface and a first support member (eg, FIG. 2 ) supporting the window member of the first support member 214), and the electronic device may further include a heat dissipation sheet (eg, the first heat dissipation sheet 392 of FIG. 4 ) disposed on the first support member.

According to various embodiments, the electronic device may further include a heat pipe disposed under the frame.

According to various embodiments, the frame includes a first area in which the first light output device is disposed (eg, the first area 502 of FIG. 5A ), and a second area (eg, a first area 502 in FIG. 5A ) in which the second light output device is disposed. : a second area 504 of FIG. 5A ) and a third area (eg, a third area 506 of FIG. 5A ) located between the first area and the second area, in which the printed circuit board is disposed and at least one through hole (eg, the through hole 520 of FIG. 5B ) formed between the first region and the second region.

According to various embodiments, the housing may include an outdoor air inlet hole corresponding to the at least one through hole.

According to various embodiments, the housing may include a first housing (eg, the first housing 210 of FIG. 1 ) in which the first light output device, the second light output device, the frame, and the printed circuit board are disposed. and a second housing (eg, the second housing 220 of FIG. 1 ) formed to surround at least a portion of the user's head.

According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 101 of FIG. 1 ) includes a housing (eg, the housing 200 of FIG. 1 ), a first device disposed in the housing and configured to output an image 1 optical output device (eg, first optical output device 312 in FIG. 2 ) and second optical output device (eg, second optical output device 314 in FIG. 2 ), a first substrate (eg, in FIG. 6 ) The first substrate 410), the seventh surface facing the first substrate (eg, the seventh surface 420a in FIG. 6) and located in the opposite direction to the seventh surface, and a processor (eg, the processor (eg, the processor ( 440)) is disposed on a second substrate (eg, the second substrate 420 of FIG. 6) including an eighth surface (eg, the eighth surface 420b of FIG. 6), and the first substrate and the second substrate A printed circuit board (eg, the printed circuit board 400 of FIG. 2 ) including an interposer (eg, the interposer 430 of FIG. 6 ) disposed between the two substrates, and the first optical output device is disposed A first region (eg, the first region 502 of FIG. 5A ), a second region in which the second light output device is disposed (eg, the second region 504 of FIG. 5A ), and the first region and the second region a frame positioned between two regions and including a third region (eg, third region 506 in FIG. 5A ) facing the processor, the first optical output device, the second optical output device and the A processor may be disposed in contact with the frame.

According to various embodiments, the electronic device further includes a heat transfer member disposed between the processor and the frame, wherein the heat transfer member includes at least one of a thermal interface material, a nanofoam, a vapor chamber, or a metal plate. can do.

According to various embodiments, the first light output device includes a first rear surface in contact with the frame (eg, the first rear surface 312a in FIG. 5B ), and the second light output apparatus contacts the frame. and a second rear surface (eg, the second rear surface 314a of FIG. 5B ).

According to various embodiments, the electronic device includes a first shielding member (eg, the first shielding member 316a of FIG. 4 ) coupling the first light output device to the frame and the second light output device A second shielding member coupled to the frame (eg, the second shielding member 316b of FIG. 4 ) may be further included.

According to various embodiments, the electronic device may further include a heat pipe disposed under the frame.

The various electronic devices of the present disclosure described above are not limited by the above-described embodiments and drawings, and it is common knowledge in the art to which the present disclosure pertains that various substitutions, modifications and changes are possible within the technical scope of the present disclosure. It will be clear to those who have

101: electronic device
200: housing
310: optical output device
312: first optical output device
314: second light output device
316: shielding member
332: antenna bracket
340: glass member
400: printed circuit board
410: first substrate
420: second substrate
430: interposer
440: processor
500: frame

Claims (20)

In an electronic device,
a housing including a first surface facing the outside of the electronic device and a second surface configured to face a user's face;
a frame disposed within the housing;
a first light output device and a second light output device disposed in the housing and configured to output an image; and
A printed circuit comprising a first substrate, a second substrate, and an interposer disposed between the first substrate and the second substrate, at least a portion of which is located between the first optical output device and the second optical output device substrate; including;
The first optical output device, the second optical output device, and the printed circuit board are disposed on the frame in a first direction toward the first surface.
According to claim 1,
A processor disposed on the second substrate and facing the frame,
At least a portion of the heat generated by the processor is configured to be transferred to the frame.
3. The method of claim 2,
The electronic device further comprising a heat transfer member disposed between the processor and the frame, wherein the heat transfer member includes at least one of a thermal interface material, a nanofoam, a vapor chamber, or a metal plate.
According to claim 1,
and the first light output device includes a first rear surface in contact with the frame, and the second optical output device includes a second rear surface in contact with the frame.
5. The method of claim 4,
the first light output device includes a first front surface facing in a direction opposite to the first rear surface and a first side surrounding at least a portion between the first front surface and the first rear surface;
the second light output device includes a second front surface facing in a direction opposite to the second rear surface and a second side surface surrounding at least a portion between the second front surface and the second rear surface;
The electronic device is
a first shielding member surrounding at least a portion of the first front surface and at least a portion of the first side surface and coupled to the frame; and
and a second shielding member surrounding at least a portion of the second front surface and at least a portion of the second side surface and coupled to the frame.
According to claim 1,
The first substrate includes a fifth surface facing the first surface and a sixth surface facing the second substrate,
The second substrate includes a seventh surface facing the first substrate and an eighth surface facing the frame,
The interposer is disposed between the sixth surface and the seventh surface.
According to claim 1,
a first glass member, at least a portion of which is inserted into the frame and configured to guide the image output from the first light output device; and
The electronic device further comprising a second glass member, at least a part of which is inserted into the frame and configured to guide the image output from the second light output device.
According to claim 1,
a camera bracket disposed on the printed circuit board; and a first camera module disposed on the camera bracket;
At least a portion of the camera bracket is disposed between the first light output device and the second light output device.
9. The method of claim 8,
The electronic device further comprising an antenna module disposed on the camera bracket and including an antenna pattern.
According to claim 1,
The frame includes at least one of aluminum, magnesium, and stainless steel.
According to claim 1,
The housing includes a window member forming at least a portion of the first surface and a first support member supporting the window member,
The electronic device further comprising a heat dissipation sheet disposed on the first support member.
According to claim 1,
The electronic device further comprising a heat pipe disposed under the frame.
According to claim 1,
The frame includes a first area in which the first light output device is disposed, a second area in which the second light output device is disposed, and a second area disposed between the first area and the second area, and in which the printed circuit board is disposed. includes 3 areas,
and at least one through hole formed between the first region and the second region.
14. The method of claim 13,
The housing includes an outdoor air inlet hole corresponding to the at least one through hole.
According to claim 1,
and the housing includes a first housing in which the first optical output device, the second optical output device, the frame and the printed circuit board are disposed, and a second housing formed to surround at least a portion of a user's head.
In an electronic device,
housing;
a first light output device and a second light output device disposed in the housing and configured to output an image;
A second substrate including a first substrate, a seventh surface facing the first substrate, and an eighth surface on which a processor is disposed and positioned in a direction opposite to the seventh surface, and between the first substrate and the second substrate a printed circuit board including an interposer disposed thereon; and
a first area in which the first light output device is disposed, a second area in which the second light output device is disposed, and a third area positioned between the first area and the second area and facing the processor; including a frame,
The first optical output device, the second optical output device, and the processor are disposed in contact with the frame.
17. The method of claim 16,
The electronic device further comprising a heat transfer member disposed between the processor and the frame, wherein the heat transfer member includes at least one of a thermal interface material, a nanofoam, a vapor chamber, or a metal plate.
17. The method of claim 16,
and the first light output device includes a first rear surface in contact with the frame, and the second optical output device includes a second rear surface in contact with the frame.
17. The method of claim 16,
a first shielding member coupling the first light output device to the frame;
and a second shielding member coupling the second light output device to the frame.
17. The method of claim 16,
The electronic device further comprising a heat pipe disposed under the frame.

Images