KR20210137041A - Adhesive composition, film-like adhesive, adhesive sheet, and method for manufacturing a semiconductor device - Google Patents

Abstract

An adhesive composition containing a thermosetting resin, a curing agent, an elastomer, and an inorganic filler, wherein the curing agent contains a phenol resin having an alicyclic ring, and the content of the elastomer is 10 to 80 parts by mass with respect to 100 parts by mass of the thermosetting resin. This is initiated. Moreover, the film-form adhesive agent using such an adhesive composition is disclosed. Moreover, the manufacturing method of the adhesive sheet and semiconductor device using such a film adhesive is disclosed.

Description

Adhesive composition, film-like adhesive, adhesive sheet, and method for manufacturing a semiconductor device

The present invention relates to an adhesive composition, a film adhesive, an adhesive sheet, and a method for manufacturing a semiconductor device.

DESCRIPTION OF RELATED ART Conventionally, silver paste is mainly used for bonding of a semiconductor chip and the support member for semiconductor chip mounting. However, in accordance with the recent miniaturization and integration of semiconductor chips, miniaturization, miniaturization, etc. are required for the supporting member used. On the other hand, in the case of using a silver paste, problems such as occurrence of trouble at the time of wire bonding due to protrusion of the paste or inclination of the semiconductor chip, difficulty in controlling the film thickness, and generation of voids may occur.

Therefore, in recent years, the film adhesive for bonding a semiconductor chip and a support member is used (for example, refer patent document 1). When using an adhesive sheet comprising a dicing tape and a film adhesive laminated on the dicing tape, the film adhesive is adhered to the back surface of the semiconductor wafer, and the semiconductor wafer is divided into pieces by dicing, thereby attaching the film adhesive semiconductor chips can be obtained. The obtained semiconductor chip with a film adhesive can be affixed to a support member via a film adhesive, and can be joined by thermocompression bonding.

Patent Document 1: Japanese Patent Application Laid-Open No. 2007-053240

However, as the size of the semiconductor chip decreases, the force applied per unit area at the time of thermocompression bonding increases, and a phenomenon called bleed may occur in which the film adhesive protrudes from the semiconductor chip.

In addition, when the film adhesive is used as FOW (Film Over Wire), which is a wire embedded film adhesive, or FOD (Film Over Die), which is a semiconductor chip embedded film adhesive, from the viewpoint of improving embedding properties, high Liquidity is required. Therefore, there is a tendency for the occurrence frequency and amount of bleed to further increase. In some cases, bleed may even occur on the upper surface of the semiconductor chip, which may lead to electrical failure or wire bonding failure.

The present invention was made in view of such a situation, and its main object is to provide an adhesive composition capable of suppressing bleed while having good embedding properties at the time of thermocompression bonding.

One aspect of the present invention provides an adhesive composition. The said adhesive composition contains a thermosetting resin, a hardening|curing agent, an elastomer, and an inorganic filler. The curing agent includes a phenol resin having an alicyclic ring. Content of an elastomer is 10-80 mass parts with respect to 100 mass parts of thermosetting resins. According to such an adhesive composition, it becomes possible to suppress bleed, having favorable embedding property at the time of thermocompression bonding.

An epoxy resin may be sufficient as a thermosetting resin. The epoxy resin may contain the bisphenol F-type epoxy resin.

An acrylic resin may be sufficient as an elastomer.

Silica may be sufficient as an inorganic filler. 25 mass % or more may be sufficient as content of an inorganic filler on the basis of the adhesive composition whole quantity.

95 mass % or more may be sufficient as content of the sum total of a thermosetting resin, a hardening|curing agent, an elastomer, and an inorganic filler on the basis of the adhesive composition whole quantity.

The adhesive composition may further contain a hardening accelerator.

The adhesive composition is a semiconductor device in which a first semiconductor element is wire-bonded on a substrate via a first wire and a second semiconductor element is crimped onto the first semiconductor element. WHEREIN: In addition, it may be used for embedding at least a part of the first wire.

The present invention also provides a composition comprising a thermosetting resin, a curing agent, and an elastomer, wherein the curing agent includes a phenol resin having an alicyclic ring, a first semiconductor element is wire-bonded through a first wire on a substrate; In a semiconductor device in which a second semiconductor element is crimped onto a first semiconductor element, application as an adhesive or production of an adhesive used to bury at least a part of a first wire while crimping the second semiconductor element It may be related to the application for

Another aspect of the present invention provides a film adhesive formed by forming the above-described adhesive composition in a film shape.

Another aspect of the present invention provides an adhesive sheet comprising a substrate and the above-described film-like adhesive provided on the substrate.

A dicing tape may be sufficient as a base material. In addition, in this specification, the adhesive sheet whose base material is a dicing tape may be called "dicing die-bonding integrated adhesive sheet".

The adhesive sheet may further comprise the protective film laminated|stacked on the surface on the opposite side to the base material of the film adhesive.

Another aspect of the present invention is a wire bonding process of electrically connecting a first semiconductor element on a substrate via a first wire, and a lamination process of attaching the above-described film-like adhesive to one side of the second semiconductor element. and a die bonding step of embedding at least a part of the first wire in the film adhesive by crimping the second semiconductor element to which the film adhesive is affixed through the film adhesive. do.

Moreover, in a semiconductor device, while a 1st semiconductor chip is wire-bonded through a 1st wire on a semiconductor substrate, a 2nd semiconductor chip is crimped|bonded on a 1st semiconductor chip via an adhesive film, so that a 1st wire may be a wire-embedded semiconductor device in which at least a part is embedded in an adhesive film, or a chip-embedded semiconductor device in which a first wire and a first semiconductor chip are embedded in an adhesive film.

ADVANTAGE OF THE INVENTION According to this invention, the adhesive composition which can suppress bleed while having favorable embedding property at the time of thermocompression bonding is provided. Therefore, the film adhesive formed by forming the adhesive composition in a film form can be useful as FOD (Film Over Die), which is a semiconductor chip embedded film adhesive, or FOW (Film Over Wire), which is a wire embedded film adhesive. Moreover, according to this invention, the manufacturing method of the adhesive sheet and semiconductor device using such a film adhesive is provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows the film adhesive which concerns on one Embodiment.
2 is a schematic cross-sectional view showing an adhesive sheet according to an embodiment.
3 is a schematic cross-sectional view showing an adhesive sheet according to another embodiment.
4 is a schematic cross-sectional view showing a semiconductor device according to an embodiment.
5 is a schematic cross-sectional view showing a series of steps of a method for manufacturing a semiconductor device according to an embodiment.
6 is a schematic cross-sectional view showing a series of steps of a method for manufacturing a semiconductor device according to an embodiment.
7 is a schematic cross-sectional view showing a series of steps of a method for manufacturing a semiconductor device according to an embodiment.
8 is a schematic cross-sectional view showing a series of steps of a method for manufacturing a semiconductor device according to an embodiment.
9 is a schematic cross-sectional view showing a series of steps of a method for manufacturing a semiconductor device according to an embodiment.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring drawings suitably. However, this invention is not limited to the following embodiment.

In the present specification, (meth)acrylic acid means acrylic acid or methacrylic acid corresponding thereto. The same applies to other analogous expressions such as (meth)acryloyl group.

[Adhesive composition]

The adhesive composition which concerns on this embodiment contains (A) thermosetting resin, (B) hardening|curing agent, (C) elastomer, and (D) inorganic filler. The adhesive composition is thermosetting and can be in a fully cured product (C stage) state after a curing treatment through a semi-cured (B-stage) state.

<(A) component: thermosetting resin>

(A) An epoxy resin may be sufficient as a component from an adhesive viewpoint. The epoxy resin can be used without particular limitation as long as it is a compound having an epoxy group in the molecule. Examples of the epoxy resin include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, bisphenol A novolak epoxy resin, bisphenol F Novolak-type epoxy resin, stilbene-type epoxy resin, triazine skeleton-containing epoxy resin, fluorene skeleton-containing epoxy resin, triphenolmethane-type epoxy resin, biphenyl-type epoxy resin, xylylene-type epoxy resin, biphenyl aralkyl-type epoxy resin , a naphthalene-type epoxy resin, an epoxy resin having an alicyclic ring, and the like. These may be used individually by 1 type or in combination of 2 or more type. Among these, the epoxy resin may contain the bisphenol F-type epoxy resin. When an epoxy resin contains a bisphenol F-type epoxy resin, there exists a tendency for embedding property to improve. Moreover, the epoxy resin may contain the epoxy resin which has an alicyclic ring from a fluid viewpoint, and the epoxy resin which has an alicyclic ring is a dicyclopentadiene type epoxy resin (having a dicyclopentadiene structure epoxy resin).

Although the epoxy equivalent in particular of (A) component is not restrict|limited, 90-600 g/eq, 100-500 g/eq, or 120-450 g/eq may be sufficient. (A) When the epoxy equivalent of component exists in such a range, there exists a tendency for favorable reactivity and fluidity|liquidity to be acquired. (A) When component contains a bisphenol F-type epoxy resin, the epoxy equivalent of a bisphenol F-type epoxy resin may be less than 180 g/eq from a viewpoint of embedding property, and 170 g/eq or 160 g/eq or less may be sufficient as it. The epoxy equivalent of the bisphenol F-type epoxy resin may be 90 g/eq or more, 100 g/eq or more, or 120 g/eq or more.

<(B) component: curing agent>

(B) Component contains the phenol resin (B-1) which has an alicyclic ring.

(B-1) A component is a compound which has an alicyclic ring and a hydroxyl group in a molecule|numerator. The hydroxyl group may be bonded to an alicyclic ring or a site other than the alicyclic ring of the compound via a single bond or a linking group (eg, an alkylene group, an oxyalkylene group, etc.). By including component (B-1) as a hardening|curing agent, it becomes possible to suppress bleed, having favorable embedding property at the time of thermocompression bonding.

(B-1) The phenol resin represented by the following general formula (1) may be sufficient as a component, for example.

[Formula 1]

In the formula (1), E represents an alicyclic ring, G represents a single bond or an alkylene group, and R ¹ each independently represents a hydrogen atom or a monovalent hydrocarbon group. n1 represents the integer of 1-10, m represents the integer of 1-3.

The number of carbon atoms of E may be 4-12, 5-11, or 6-10. Although monocyclic or polycyclic may be sufficient as E, it is preferable that it is polycyclic, and it is more preferable that it is a dicyclopentadiene ring. The alkylene group in G may be a C1-C5 alkylene group, such as a methylene group, an ethylene group, a propylene group, a butylene group, and a pentylene group. It is preferable that G is a single bond. The ^{monovalent hydrocarbon group for R 1} may be, for example, an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, or a pentyl group, an aryl group such as a phenyl group or a naphthyl group, or a heteroaryl group such as a pyridyl group. It is preferable that R<^1> is a hydrogen atom.

The phenol resin represented by the following general formula (1a) may be sufficient as the phenol resin represented by General formula (1).

[Formula 2]

In formula (1a), n1 has the same meaning as above.

As a commercial item of the epoxy resin represented by General formula (1a), J-DPP-85, J-DPP-95, J-DPP-115 (all are the JFE Chemical Corporation make) etc. are mentioned, for example.

(B-1) Although the hydroxyl equivalent in particular of a component is not restrict|limited, 80-400 g/eq, 90-350 g/eq, or 100-300 g/eq may be sufficient. (B-1) When the hydroxyl equivalent of a component exists in such a range, there exists a tendency for favorable reactivity and fluidity|liquidity to be acquired.

(B-1) Content of the component may be 5 mass % or more, 10 mass % or more, or 15 mass % or more on the basis of the adhesive composition whole quantity. (B-1) When content of component is 5 mass % or more on the basis of the adhesive composition whole quantity as a reference, there exists a tendency which can suppress bleed favorably, having better embedding property at the time of thermocompression bonding. (B-1) Content of component may be 50 mass % or less, 40 mass % or less, or 30 mass % or less on the basis of the adhesive composition whole quantity as a reference.

(B) component may further contain the phenol resin (B-2) which does not have an alicyclic ring in addition to (B-1) component. As the component (B-2), for example, phenols such as phenol, cresol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol and/or α-naphthol, β-naphthol , Novolac-type phenol resin obtained by condensing or co-condensing naphthols such as dihydroxynaphthalene and a compound having an aldehyde group such as formaldehyde under an acidic catalyst, allylated bisphenol A, allylated bisphenol F, allylated naphthalenediol, phenol Phenol aralkyl resin, naphthol aralkyl resin, biphenyl aralkyl type phenol resin, phenyl aralkyl synthesized from phenols and/or naphthols such as novolac and phenol and dimethoxyparaxylene or bis(methoxymethyl)biphenyl Kill type phenol resin etc. are mentioned. These may be used individually by 1 type or in combination of 2 or more type.

(B-2) Although the hydroxyl equivalent in particular of a component is not restrict|limited, 80-400 g/eq, 90-350 g/eq, or 100-300 g/eq may be sufficient. (B-1) When the hydroxyl equivalent of a component exists in such a range, there exists a tendency for favorable reactivity and fluidity|liquidity to be acquired.

(B-1) Content of component may be 50-100 mass % on the basis of (B) component whole quantity. (B-1) Content of component may be 60 mass % or more or 70 mass % or more on the basis of (B) component whole quantity. (B-2) Content of component may be 0-50 mass % on the basis of (B) component whole quantity. (B-2) Content of component may be 40 mass % or less or 30 mass % or less on the basis of (B) component whole quantity.

(A) The ratio of the epoxy equivalent of the epoxy resin and the hydroxyl equivalent of the component (B) when the component is an epoxy resin (epoxy equivalent of the epoxy resin / the hydroxyl equivalent of the phenol resin) is 0.30/0.70 to 0.70 from the viewpoint of curability /0.30, 0.35/0.65-0.65/0.35, 0.40/0.60-0.60/0.40, or 0.45/0.55-0.55/0.45 may be sufficient. There exists a tendency for more sufficient sclerosis|hardenability to be obtained as the said equivalent ratio is 0.30/0.70 or more. If the equivalence ratio is 0.70/0.30 or less, it is possible to prevent the viscosity from becoming excessively high, and more sufficient fluidity can be obtained.

30-70 mass % may be sufficient as content of the sum total of (A) component and (B) component on the basis of adhesive composition whole quantity. (A) Content of the total of component and (B) component may be 33 mass % or more, 36 mass % or more, or 40 mass % or more, 65 mass % or less, 60 mass % or less, or 55 mass % or less may be sufficient. . Adhesiveness tends to improve that content of the sum total of (A) component and (B) component is 30 mass % or more on the basis of adhesive composition whole quantity. When the content of the total of the component (A) and the component (B) is 70% by mass or less based on the total amount of the adhesive composition, the viscosity can be prevented from becoming excessively low, and the tendency to further suppress bleed There is this.

<(C) component: elastomer>

The adhesive composition which concerns on this embodiment contains (C) an elastomer. As for component (C), it is preferable that the glass transition temperature (Tg) of the polymer which comprises an elastomer is 50 degrees C or less.

(C) As a component, an acrylic resin, a polyester resin, a polyamide resin, a polyimide resin, a silicone resin, a butadiene resin, an acrylonitrile resin, these modified bodies etc. are mentioned, for example.

(C) Component may contain the acrylic resin from a viewpoint of the solubility with respect to a solvent, and fluidity|liquidity. Here, an acrylic resin means the polymer containing the structural unit derived from (meth)acrylic acid ester. It is preferable that an acrylic resin is a polymer containing the structural unit derived from the (meth)acrylic acid ester which has crosslinkable functional groups, such as an epoxy group, alcoholic or phenolic hydroxyl group, and a carboxyl group, as a structural unit. Moreover, acrylic rubber, such as a copolymer of (meth)acrylic acid ester and acrylonitrile, may be sufficient as an acrylic resin.

-50-50 degreeC or -30-30 degreeC may be sufficient as the glass transition temperature (Tg) of an acrylic resin. There exists a tendency which can prevent that the softness|flexibility of an adhesive composition becomes high that Tg of an acrylic resin is -50 degreeC or more. Thereby, it becomes easy to cut|disconnect a film adhesive at the time of wafer dicing, and it becomes possible to prevent generation|occurrence|production of a burr. There exists a tendency for the fall of the softness|flexibility of an adhesive composition to be suppressed that Tg of an acrylic resin is 50 degrees C or less. Thereby, when affixing a film adhesive to a wafer, there exists a tendency for a void to become fully easy to fill. Moreover, it becomes possible to prevent the chipping at the time of dicing by the fall of the adhesiveness of a wafer. Here, the glass transition temperature (Tg) means a value measured using a TMA testing apparatus (manufactured by TAA Instruments, TMA400Q).

100,000-3 million or 500,000-2 million may be sufficient as the weight average molecular weight (Mw) of an acrylic resin. When the Mw of the acrylic resin is in such a range, the film formability, the strength on the film, flexibility, tacking property, etc. can be appropriately controlled, and the reflow property is excellent and the embedding property is excellent. can be improved Here, Mw means the value measured by gel permeation chromatography (GPC) and converted using the calibration curve by standard polystyrene.

As a commercial item of an acrylic resin, SG-70L, SG-708-6, WS-023 EK30, SG-280 EK23, SG-P3 solvent modified product (all are Nagase Chemtex Corporation make) are mentioned, for example.

(C) Content of component is 10-80 mass parts with respect to 100 mass parts of (A) component. (C) Content of component may be 20 mass parts or more, 30 mass parts or more, 35 mass parts or more, 40 mass parts or more, or 42 mass parts or more with respect to 100 mass parts of (A) component, 75 mass parts or less , 72 parts by mass or less, 70 parts by mass or less, or 68 parts by mass or less may be sufficient. (C) When content of component is 10 mass parts or more with respect to 100 mass parts of (A) component, there exists a tendency for the handleability (for example, bendability etc.) of a film adhesive to become favorable. (C) There exists a tendency which can prevent that the softness|flexibility of an adhesive composition becomes high that content of component is 80 mass parts or less with respect to 100 mass parts of (A) component. Thereby, it becomes easy to cut|disconnect a film adhesive at the time of wafer dicing, and it becomes possible to prevent generation|occurrence|production of a burr. Moreover, there exists a tendency for embedding property of a wire or a semiconductor chip to improve that content of (C)component is 80 mass parts or less with respect to 100 mass parts of (A) component.

(C) Content of component should just be 10 mass parts or more, 20 mass parts or more, or 30 mass parts or more with respect to 100 mass parts of total amounts of (A) component and (B) component, 80 mass parts or less, 75 mass A part or less, 60 mass parts or less, or 55 mass parts or less may be sufficient. (C) When the content of the component is 10 parts by mass or more with respect to 100 parts by mass of the total amount of the component (A) and the component (B), the handleability (for example, bendability, etc.) of the film adhesive tends to become more favorable. have. (C) When content of component is 80 mass parts or less with respect to 100 mass parts of total amounts of (A) component and (B) component, there exists a tendency which can prevent more that the softness|flexibility of an adhesive composition becomes high too much. Thereby, it becomes easy to cut|disconnect a film adhesive at the time of wafer dicing, and it exists in the tendency which becomes further possible to prevent generation|occurrence|production of a burr.

<(D) component: inorganic filler>

Examples of the inorganic filler include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, boron nitride, crystalline silica, non Qualitative silica etc. are mentioned. These may be used individually by 1 type, and may be used in combination of 2 or more type. From the viewpoint of further improving the thermal conductivity of the obtained film adhesive, the inorganic filler may contain aluminum oxide, aluminum nitride, boron nitride, crystalline silica, or amorphous silica. Further, from the viewpoint of adjusting the melt viscosity of the adhesive composition and from the viewpoint of imparting thixotropic properties to the adhesive composition, the inorganic filler is aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, oxide Magnesium, aluminum oxide, crystalline silica, or amorphous silica may be sufficient, and silica (crystalline silica or amorphous silica) may be sufficient.

(D) The average particle diameter of component may be 0.005-0.5 micrometer or 0.05-0.3 micrometer from a viewpoint that adhesiveness improves more. Here, an average particle diameter means the value calculated|required by converting from a BET specific surface area.

(D) The component may be surface-treated with the surface treatment agent from the viewpoint of the compatibility with the surface, a solvent, another component, and adhesive strength. As a surface treatment agent, a silane coupling agent etc. are mentioned, for example. As a functional group of a silane coupling agent, a vinyl group, a (meth)acryloyl group, an epoxy group, a mercapto group, an amino group, a diamino group, an alkoxy group, an ethoxy group etc. are mentioned, for example.

(D) Content of component should just be 25 mass % or more on the basis of adhesive composition whole quantity, 28 mass % or more, or 30 mass % or more may be sufficient as it. If the content of the component (D) is 25% by mass or more based on the total amount of the adhesive composition, the dicing property of the adhesive layer before curing is improved, and the adhesive strength of the adhesive layer after curing tends to be improved. Thereby, sufficient dicing property is ensured also in the film adhesive with a comparatively thick (for example, 20 micrometers or more, preferably 30 micrometers or more) for FOD/FOW use, for example. (D) Although the upper limit in particular of content of component is not restrict|limited, 60 mass % or less, 50 mass % or less, or 40 mass % or less may be sufficient on the basis of the adhesive composition whole quantity. (D) When content of component is 60 mass % or less based on the adhesive composition whole quantity as a reference, the fall of fluidity|liquidity can be suppressed and it becomes possible to prevent that the elasticity modulus of the film adhesive after hardening becomes high too much.

In the adhesive composition according to the present embodiment, (A) component, (B) component, (C) component, and (D) component are main components, (A) component, (B) component, (C) component, and ( D) Content of the sum total of components should just be 95 mass % or more or 97 mass % or more on the basis of adhesive composition whole quantity, and may be 100 mass % or less or 99 mass % or less.

<(E) component: curing accelerator>

The adhesive composition which concerns on this embodiment may contain the (E) hardening accelerator. A hardening accelerator is not specifically limited, A commonly used thing can be used. (E) As a component, imidazole and its derivative(s), organophosphorus type compound, secondary amines, tertiary amines, quaternary ammonium salt etc. are mentioned, for example. These may be used individually by 1 type or in combination of 2 or more type. Among these, imidazoles and its derivative(s) may be sufficient as (E) component from a reactive viewpoint.

Examples of the imidazoles include 2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl-2-methyl. Midazole, etc. are mentioned. These may be used individually by 1 type or in combination of 2 or more type.

0.01-3 mass parts or 0.03-1 mass part may be sufficient as content of (E) component with respect to 100 mass parts of total amounts of (A) component, (B) component, and (C)component. (E) When content of a component exists in such a range, there exists a tendency for sclerosis|hardenability and reliability to be compatible.

<Other ingredients>

The adhesive composition according to the present embodiment may further contain an antioxidant, a silane coupling agent, a rheology control agent, and the like as other components. 0.01-3 mass parts may be sufficient as content of these components with respect to 100 mass parts of total amounts of (A) component, (B) component, and (C)component.

The adhesive composition according to the present embodiment may be used as an adhesive varnish diluted with a solvent. A solvent in particular will not be restrict|limited, as long as it can melt|dissolve components other than (D)component. As a solvent, For example, aromatic hydrocarbons, such as toluene, xylene, mesitylene, cumene, p-cymene; aliphatic hydrocarbons such as hexane and heptane; Cyclic alkanes, such as methylcyclohexane; cyclic ethers such as tetrahydrofuran and 1,4-dioxane; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, and 4-hydroxy-4-methyl-2-pentanone; esters such as methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, and γ-butyrolactone; carbonate esters such as ethylene carbonate and propylene carbonate; and amides such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone. These may be used individually by 1 type or in combination of 2 or more type. Among these, from a viewpoint of solubility and a boiling point, toluene, xylene, methyl ethyl ketone, methyl isobutyl ketone, or cyclohexanone may be sufficient as a solvent.

The solid component concentration in the adhesive varnish may be 10-80 mass % based on the total mass of the adhesive varnish.

The adhesive varnish can be prepared by mixing and kneading the component (A), the component (B), the component (C), the component (D), and the solvent, and, if necessary, the component (E) and other components. . Mixing and kneading can be performed by combining suitably a dispersion machine, such as a normal stirrer, a grinder, three rolls, a ball mill, and a bead mill. (D) When mixing a component, after mixing (D) component and a low molecular-weight component previously, mixing time can be shortened by mix|blending a high molecular weight component. Moreover, after preparing an adhesive agent varnish, you may remove the bubble in a varnish by vacuum deaeration etc.

[Film-like adhesive]

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows the film adhesive which concerns on one Embodiment. The film adhesive 10 is formed by forming the above-mentioned adhesive composition into a film shape. The film adhesive 10 may be in a semi-cured (B-stage) state. Such a film adhesive 10 can be formed by apply|coating an adhesive composition to a support film. When using an adhesive varnish, the film adhesive 10 can be formed by apply|coating an adhesive varnish to a support film, and heat-drying and removing a solvent.

There is no restriction|limiting in particular as a support film, For example, films, such as polytetrafluoroethylene, polyethylene, a polypropylene, polymethylpentene, a polyethylene terephthalate, a polyimide, are mentioned. The thickness of the support film may be, for example, 10-200 µm or 20-170 µm.

As a method of applying the adhesive varnish to the support film, a known method can be used, for example, a knife coat method, a roll coat method, a spray coat method, a gravure coat method, a bar coat method, a curtain coat method, etc. have. Although there will be no restriction|limiting in particular as long as the conditions of heat-drying are conditions in which the solvent used fully volatilizes, For example, 0.1 to 90 minutes may be sufficient at 50-200 degreeC.

The thickness of a film adhesive can be suitably adjusted according to a use. The thickness of the film adhesive may be 20 to 200 µm, 30 to 200 µm, or 40 to 150 µm from the viewpoint of sufficiently embedding irregularities such as semiconductor chips, wires, and wiring circuits of the substrate.

[Adhesive sheet]

2 is a schematic cross-sectional view showing an adhesive sheet according to an embodiment. The adhesive sheet 100 is provided with the base material 20 and the above-mentioned film adhesive 10 provided on the base material.

Although the base material 20 in particular is not restrict|limited, A base film may be sufficient. The base film may be the same as the support film mentioned above.

The base material 20 may be a dicing tape. Such an adhesive sheet can be used as a dicing die-bonding integrated adhesive sheet. In this case, since the lamination process with respect to a semiconductor wafer becomes one time, efficiency of an operation|work can be improved.

As a dicing tape, plastic films, such as a polytetrafluoroethylene film, a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a polymethylpentene film, a polyimide film, etc. are mentioned, for example. Moreover, the dicing tape may be surface-treated, such as a primer application|coating, UV treatment, a corona discharge treatment, a grinding|polishing process, and an etching process, as needed. It is preferable that a dicing tape has adhesiveness. Such a dicing tape may be the one in which adhesiveness was provided to the above-mentioned plastic film, or the one in which the adhesive layer was provided in the single side|surface of the above-mentioned plastic film may be sufficient as it.

The adhesive sheet 100 can be formed by apply|coating an adhesive composition to a base film similarly to the method of forming the film adhesive mentioned above. The method of apply|coating the adhesive composition to the base material 20 may be the same as the method of apply|coating the adhesive composition mentioned above to a support film.

The adhesive sheet 100 may be formed using a film-like adhesive prepared in advance. In this case, the adhesive sheet 100 can be formed by laminating under predetermined conditions (eg, room temperature (20°C) or heated state) using a roll laminator, a vacuum laminator, or the like. It is preferable to form the adhesive sheet 100 using a roll laminator in a heated state from a point which can manufacture continuously and has good efficiency.

The thickness of the film adhesive 10 may be 20-200 micrometers, 30-200 micrometers, or 40-150 micrometers from a viewpoint of embedding properties, such as unevenness|corrugation of a wiring circuit of a semiconductor chip, a wire, a board|substrate, etc. When the thickness of the film adhesive 10 is 20 μm or more, more sufficient adhesive force tends to be obtained. becomes

3 is a schematic cross-sectional view showing an adhesive sheet according to another embodiment. The adhesive sheet 110 further includes a protective film 30 laminated on the surface of the film adhesive 10 opposite to the base material 20 . The protective film 30 may be the same as the support film mentioned above. The thickness of a protective film may be 15-200 micrometers or 70-170 micrometers, for example.

[Semiconductor device]

4 is a schematic cross-sectional view showing a semiconductor device according to an embodiment. In the semiconductor device 200, the first semiconductor element Wa of the first stage is wire-bonded to the substrate 14 via the first wire 88, and the first semiconductor element Wa is connected to the first semiconductor element Wa. It is a semiconductor device in which the 2nd semiconductor element Waa is crimped|bonded through the film adhesive 10, and at least a part of the 1st wire 88 is embedded in the film adhesive 10. FIG. The semiconductor device may be a wire-embedded semiconductor device in which at least a part of the first wire 88 is embedded, or may be a semiconductor device in which the first wire 88 and the first semiconductor element Wa are embedded. Moreover, in the semiconductor device 200, the board|substrate 14 and the 2nd semiconductor element Waa are electrically connected via the 2nd wire 98 further, and while the 2nd semiconductor element Waa is the sealing material 42 ) is sealed by

10-170 micrometers may be sufficient as the thickness of 1st semiconductor element Wa, and 20-400 micrometers may be sufficient as the thickness of 2nd semiconductor element Waa. The first semiconductor element Wa embedded in the film adhesive 10 is a controller chip for driving the semiconductor device 200 .

The board|substrate 14 consists of the organic board|substrate 90 in which the circuit patterns 84, 94 were formed in two places respectively on the surface. The first semiconductor element Wa is press-bonded on the circuit pattern 94 with an adhesive 41 interposed therebetween. The second semiconductor element Waa is formed with a film adhesive ( It is pressed against the substrate 14 via 10). A film adhesive 10 is embedded in the uneven step caused by the circuit patterns 84 and 94 on the substrate 14 . Then, the second semiconductor element Waa, the circuit pattern 84, and the second wire 98 are sealed by the resin sealing material 42 .

[Method for manufacturing semiconductor device]

The manufacturing method of the semiconductor device which concerns on this embodiment includes the 1st wire bonding process of electrically connecting a 1st semiconductor element on a board|substrate via a 1st wire, and the above-mentioned film adhesive on one side of a 2nd semiconductor element. a lamination process of affixing the film adhesive, and a die bonding process of embedding at least a part of the first wire in the film adhesive by crimping the second semiconductor element to which the film adhesive is affixed through the film adhesive.

5 to 9 are schematic cross-sectional views illustrating a series of steps of a method for manufacturing a semiconductor device according to an embodiment. A semiconductor device 200 according to the present embodiment includes a first wire 88 and a first semiconductor element Wa. ) is embedded in the semiconductor device, and is manufactured by the following procedure. First, as shown in FIG. 5 , a first semiconductor element Wa having an adhesive 41 is pressed onto a circuit pattern 94 on a substrate 14 , and a first wire 88 is interposed between the substrate ( 14) The circuit pattern 84 and the first semiconductor element Wa are electrically bonded to each other (first wire bonding process).

Next, by laminating the adhesive sheet 100 on one side of a semiconductor wafer (for example, 100 μm in thickness, 8 inches in size), and peeling the base material 20, the film adhesive 10 on one side of the semiconductor wafer ) (for example, 110 µm in thickness) is affixed. And after bonding the dicing tape to the film adhesive 10, as shown in FIG. 6 by dicing to a predetermined size (for example, 7.5 mm square), the film adhesive 10 is affixed A second semiconductor element Waa is obtained (lamination process).

The temperature conditions of a lamination process may be 50-100 degreeC or 60-80 degreeC. A semiconductor wafer and favorable adhesiveness can be acquired that the temperature of a lamination process is 50 degreeC or more. If the temperature of the lamination process is 100 degrees C or less, since it is suppressed that the film adhesive 10 flows excessively during a lamination process, it can prevent that the change of thickness etc. arise.

Examples of the dicing method include blade dicing using a rotating blade, and a method of cutting a film adhesive or both a wafer and a film adhesive with a laser.

And the 2nd semiconductor element Waa to which the film adhesive 10 was affixed is crimped|bonded to the board|substrate 14 to which the 1st semiconductor element Wa was bonded via the 1st wire 88. As specifically, shown in FIG. 7, the 2nd semiconductor element Waa to which the film adhesive 10 was affixed is the 1st wire 88 and the 1st semiconductor element Wa by the film adhesive 10. ), and then, as shown in FIG. 8 , the second semiconductor element Waa is fixed to the substrate 14 by pressing the second semiconductor element Waa to the substrate 14 (die bonding process). ). It is preferable that a die-bonding process press-bonds the film adhesive 10 for 0.5 to 3.0 second under the conditions of 80-180 degreeC and 0.01-0.50 MPa. After the die-bonding process, the film adhesive 10 is pressurized and heated for 5 minutes or more on conditions of 60-175 degreeC and 0.3-0.7 MPa.

Next, as shown in Fig. 9, after the substrate 14 and the second semiconductor element Waa are electrically connected via the second wire 98 (second wire bonding step), the circuit pattern 84, The second wire 98 and the second semiconductor element Waa are sealed with a sealing material 42 . Through such a process, the semiconductor device 200 may be manufactured.

As another embodiment, the semiconductor device may be a wire-embedded semiconductor device in which at least a part of the first wire 88 is embedded.

Example

Hereinafter, the present invention will be described in more detail with reference to Examples. However, the present invention is not limited to these Examples.

(Examples 1 to 8 and Comparative Examples 1 to 4)

<Production of adhesive sheet>

Each component shown below was mixed at the compounding ratio (mass part) shown in Table 1 and Table 2, and the varnish of the adhesive composition of 40 mass % of solid content was prepared using cyclohexanone as a solvent. Next, the obtained varnish was filtered through a 100-mesh filter, and vacuum degassing|defoaming was carried out. The varnish after vacuum defoaming was used as a base film, and it apply|coated on the polyethylene terephthalate (PET) film which performed the mold release process of 38 micrometers in thickness. The apply|coated varnish was heat-dried at 90 degreeC for 5 minutes, then, at 140 degreeC for 5 minutes, two steps. In this way, the adhesive sheet provided with the 110-micrometer-thick film adhesive in a semi-hardened (B stage) state on a base film was obtained.

In addition, each component in Table 1 and Table 2 is as follows.

(A) thermosetting resin

A-1: Epoxy resin having a dicyclopentadiene structure, manufactured by DIC Corporation, trade name: HP-7200L, epoxy equivalent: 250 to 280 g/eq

A-2: Epoxy resin having a dicyclopentadiene structure, manufactured by Nippon Kayaku Co., Ltd., trade name: XD-1000, epoxy equivalent: 254 g/eq

A-3: alicyclic epoxy resin, manufactured by Daicel Corporation, trade name: EHPE3150, epoxy equivalent: 170 to 190 g/eq

A-4: polyfunctional aromatic epoxy resin, manufactured by PRINTEC Co., Ltd., trade name: VG3101L, epoxy equivalent: 210 g/eq

A-5: cresol novolak type epoxy resin, manufactured by Nippon-Sumikin Chemical Co., Ltd., trade name: YDCN-700-10, epoxy equivalent: 209 g/eq

A-6: Bisphenol F-type epoxy resin (liquid at 25°C), manufactured by DIC Corporation, brand name: EXA-830CRP, epoxy equivalent: 159 g/eq

(B) curing agent

(B-1) phenol resin having an alicyclic ring

B-1-1: phenol resin having a dicyclopentadiene structure represented by the general formula (1a), manufactured by JFE Chemicals, trade name: J-DPP-85, hydroxyl equivalent: 164 to 167 g/eq, softening point 85 to 89 ℃

B-1-2: phenol resin having a dicyclopentadiene structure represented by the general formula (1a), manufactured by JFE Chemicals, trade name: J-DPP-115, hydroxyl equivalent: 177 to 181 g/eq, softening point 107 to 116 ℃

(B-2) Phenolic resin having no alicyclic ring

B-2-1: Bisphenol A novolac-type phenol resin, manufactured by DIC Corporation, trade name: LF-4871, hydroxyl equivalent: 118 g/eq

B-2-2: Phenyl aralkyl type phenol resin, Mitsui Chemicals Co., Ltd. product name: XLC-LL, hydroxyl equivalent: 175 g/eq

B-2-3: Phenyl aralkyl type phenol resin, manufactured by Air Water Corporation, trade name: HE100C-30, hydroxyl equivalent: 170 g/eq

(C) elastomer

C-1: Epoxy group-containing acrylic resin (acrylic rubber), manufactured by Nagase Chemtex Co., Ltd., brand name: SG-P3 solvent modified product, weight average molecular weight: 800,000, glycidyl functional group monomer ratio: 3%, Tg: -7°C

C-2: Acrylic resin (acrylic rubber), manufactured by Nagase Chemtex Co., Ltd., trade name: SG-70L, weight average molecular weight: 900,000, acid value: 5 mgKOH/g, Tg: -13°C

C-3: carboxyl group-containing acrylic resin (acrylic rubber), manufactured by Nagase Chemtex Corporation, trade name: SG-708-6, weight average molecular weight: 700,000, acid value: 9 mgKOH/g, Tg: 4°C

(D) inorganic filler

D-1: silica filler dispersion, fused silica, manufactured by Admatex Corporation, trade name: SC2050-HLG, average particle diameter: 0.50 µm

(E) curing accelerator

E-1: 1-cyanoethyl-2-phenylimidazole, manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name: Curesol 2PZ-CN

<Evaluation of various physical properties>

About the obtained adhesive sheet, embedding property and bleed amount were evaluated.

[Evaluation of burial property]

The following evaluation samples were produced and evaluated for embedding property of an adhesive sheet. The base film of the film adhesive (110 micrometers in thickness) obtained above was peeled, and it affixed to the dicing tape, and produced the dicing die-bonding integrated adhesive sheet. Next, a 100-micrometer-thick semiconductor wafer (8 inches) was prepared, and this was heated at 70 degreeC and affixed to the adhesive agent side of the dicing die-bonding integrated adhesive sheet. Then, the semiconductor chip A was obtained by dicing this semiconductor wafer to 7.5 mm square. Next, a semiconductor wafer (8 inches) having a thickness of 50 µm and a dicing die-bonding integrated adhesive sheet different from the above (Hitachi Kasei Co., Ltd., trade name: HR9004-10) (thickness 10 µm) were prepared, and the semiconductor wafer was diced and die-bonded. It was affixed by heating at 70 degreeC on the adhesive agent side of the integrated adhesive sheet. Then, the semiconductor chip B with a die-bonding film was obtained by dicing this semiconductor wafer to 4.5 mm square. Next, prepare a substrate for evaluation with a total thickness of 260 μm coated with a solder resist (Taiyo Nissan Co., Ltd., trade name: AUS308), 120° C., 0.20 MPa so that the die bonding film of the semiconductor chip B and the solder resist of the substrate for evaluation are in contact , and crimping under the conditions of 2 seconds. Then, it crimped|bonded under the conditions for 120 degreeC, 0.20 MPa, 1.5 second so that the film adhesive of the semiconductor chip A and the semiconductor wafer of the semiconductor chip B might contact, and the evaluation sample was obtained. At this time, alignment was performed so that the semiconductor chip B previously crimped|bonded might become the center of the semiconductor chip A. For the evaluation sample thus obtained, the presence or absence of observation of voids is observed with an ultrasonic digital imaging apparatus (manufactured by Insight Corporation, probe: 75 MHz), and when voids are observed, the ratio of the area of voids per unit area is calculated, and these The analysis result was evaluated as embedding property. Evaluation criteria are as follows. A result is shown in Table 1 and Table 2.

A: No voids were observed.

B: Voids were observed, but the proportion was less than 5 area%.

C: Voids were observed, and the ratio was 5 area% or more.

[Bleed amount evaluation]

About what was "A" or "B" in the said embedding evaluation, bleed amount evaluation was performed. It carried out similarly to the evaluation sample produced by the said embedding evaluation, and produced the evaluation sample of bleed amount evaluation. Using a microscope, the protrusion amount of the film adhesive was measured from the center of 4 sides of the evaluation sample, and the maximum value was made into the bleed amount. A result is shown in Table 1 and Table 2.

[Table 1]

[Table 2]

As shown in Tables 1 and 2, Examples 1 to 6 containing the phenol resin having an alicyclic ring suppress bleed while maintaining good embedding properties compared to Comparative Examples 1 to 4 that do not contain it. could From these results, it was confirmed that it is possible to suppress bleed, while the adhesive composition which concerns on this invention has favorable embedding property at the time of thermocompression bonding.

Industrial Applicability

As described above, the adhesive composition according to the present invention has good embedding properties at the time of thermocompression bonding and is excellent in that it can suppress bleeding. , FOD (Film Over Die), which is a chip-embedded film adhesive, or FOW (Film Over Wire), which is a wire-embedded film-type adhesive.

10… film adhesive
14… Board
20… write
30… protective film
41… glue
42… sealant
84, 94... circuit pattern
88… first wire
90… organic substrate
98… second wire
100, 110… adhesive sheet
200… semiconductor device
Wow… first semiconductor element
Waa… second semiconductor element

Claims (13)

A thermosetting resin, a curing agent, an elastomer, and an inorganic filler,
The curing agent includes a phenol resin having an alicyclic ring,
Adhesive composition whose content of the said elastomer is 10-80 mass parts with respect to 100 mass parts of said thermosetting resins. The method according to claim 1,
The thermosetting resin is an epoxy resin, the adhesive composition. 3. The method according to claim 2,
The adhesive composition in which the said epoxy resin contains a bisphenol F-type epoxy resin. 4. The method according to any one of claims 1 to 3,
The adhesive composition, wherein the elastomer is an acrylic resin. 5. The method according to any one of claims 1 to 4,
The adhesive composition, wherein the inorganic filler is silica. 6. The method according to any one of claims 1 to 5,
Adhesive composition whose content of the said inorganic filler is 25 mass % or more on the basis of the adhesive composition whole quantity. 7. The method according to any one of claims 1 to 6,
The adhesive composition in which content of the sum total of the said thermosetting resin, the said hardening|curing agent, the said elastomer, and the said inorganic filler is 95 mass % or more on the basis of the adhesive composition whole quantity. 8. The method according to any one of claims 1 to 7,
An adhesive composition further comprising a curing accelerator. A film adhesive formed by forming the adhesive composition according to any one of claims 1 to 8 in the form of a film. description and,
The adhesive sheet provided on the said base material and provided with the film adhesive of Claim 9. 11. The method of claim 10,
The adhesive sheet, wherein the substrate is a dicing tape. 12. The method of claim 10 or 11,
The adhesive sheet further comprising a protective film laminated on the side opposite to the base material of the film adhesive. A wire bonding process of electrically connecting a first semiconductor element on a substrate with a first wire interposed therebetween;
A lamination step of affixing the film adhesive according to claim 9 on one side of the second semiconductor element;
A method for manufacturing a semiconductor device comprising: a die bonding step of embedding at least a part of the first wire in the film adhesive by crimping a second semiconductor element to which the film adhesive is affixed through the film adhesive; .

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