KR20210124656A - Method for manufacturing double-sided soldering of thick multilayer printed circuit boards - Google Patents

Method for manufacturing double-sided soldering of thick multilayer printed circuit boards Download PDF

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KR20210124656A
KR20210124656A KR1020200041947A KR20200041947A KR20210124656A KR 20210124656 A KR20210124656 A KR 20210124656A KR 1020200041947 A KR1020200041947 A KR 1020200041947A KR 20200041947 A KR20200041947 A KR 20200041947A KR 20210124656 A KR20210124656 A KR 20210124656A
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soldering
pcb
hole
component
temperature
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KR1020200041947A
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Korean (ko)
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허준우
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허준우
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention relates to a method for manufacturing double-sided soldering of a thick multilayer printed circuit board. The method comprises: a preheat step of setting the temperature on a PCB preheat tool and mounting and fixing a PCB; a flux application step of inserting a component into a through hole of the PCB and applying flux between a soldering area and the through hole; and a soldering step of raising the temperature of an iron to perform soldering so that a fillet is formed while soldering smoothly on the top and bottom surfaces of the through hole. The present invention minimizes the soldering time and soldering temperature to prevent the deterioration of a component or performance degradation due to thermal shock, improves soldering quality, and has significant economic effects.

Description

두꺼운 다층 인쇄회로기판 양면 납땜 제조방법{Method for manufacturing double-sided soldering of thick multilayer printed circuit boards}Method for manufacturing double-sided soldering of thick multilayer printed circuit boards

본발명은 부품의 납땜 부위를 PCB 구멍(Through Hole)에 삽입하여 납땜하는 제조 기술 부분을 소개하고 특수한 목적으로 사용되어지고 있는 두꺼운 양면 PCB의 Through Hole 납땜 기술에 관한 것이다.The present invention introduces a manufacturing technology part for soldering by inserting a soldering part of a component into a PCB hole (through hole), and relates to a through hole soldering technology of a thick double-sided PCB that is used for a special purpose.

일반적으로 인쇄회로기판(PCB = Printer Circuit Board)은 각종 전자 회로 부품을 납땜(Soldering)으로 연결 할 목적으로 사용되고 있는데 PCB와 부품의 구조 종류에 따라 납땜 방법도 여러 가지로 나누어지고 있다.In general, a printed circuit board (PCB = Printer Circuit Board) is used for the purpose of connecting various electronic circuit components by soldering, but the soldering method is also divided into various types according to the type of structure of the PCB and components.

PCB의 종류도 시대 발전에 따라 용도의 다양성으로 두께도 일반적인 1.6T에서 2.5T, 4.0T로 두꺼워지고 양면 2층 구조의 Through Hole도 다층으로 계속해서 진화하고 있다. 일반적인 PCB는 두께가 1.2T~1.6T 정도이고 양면 2층 구조의 Through Hole에 부품을 삽입하고 납땜(Soldering) 하는 작업은 큰 어려움이 없을 정도로 대중화 되어 있다. 그러나 최근 방산용 무기 또는 항공 우주산업의 위성 등, 특수한 환경에서 사용되는 PCB는 두께가 2.5T~4.0T로 두꺼워지고 층수도 다층화 되어 일반 PCB 납땜 기술로는 납땜 자체가 매우 힘들고 어렵다. The type of PCB also has a variety of uses according to the development of the times, and the thickness has increased from the general 1.6T to 2.5T and 4.0T, and the double-sided two-layered through hole continues to evolve into multiple layers. A typical PCB has a thickness of about 1.2T to 1.6T, and inserting parts into the through hole of a double-sided two-layer structure and soldering is popular enough that there is no difficulty. However, recently, PCBs used in special environments, such as defense weapons or satellites in the aerospace industry, have a thickness of 2.5T to 4.0T, and the number of layers is multi-layered, so soldering itself is very difficult and difficult with general PCB soldering technology.

납땜 과정에서 무리하게 납땜 시간을 초과 하거나 높은 열을 사용할 경우 반도체 부품의 열화로 손상을 줄 수도 있고 PCB의 동판(Pattern)을 파손시켜 납땜의 품질과 신뢰성을 저하 시킬 수 있다.If the soldering time is excessively exceeded or high heat is used during the soldering process, it may cause damage due to deterioration of semiconductor components and may damage the copper plate of the PCB, thereby reducing the quality and reliability of soldering.

PCB 부품 납땜은 PCB두께에 상관없이 부품을 기준하여 상(부품면), 하(납땜면) 즉, Through Hole 양면의 납땜 형상은 그림(1-1)과 같이 필렛(Fillet) 형성이 되어야하고 납땜 표면이 매끄럽고 윤기가 있어야 한다.For soldering of PCB components, regardless of the thickness of the PCB, the top (component side) and bottom (solder side), that is, the soldering shape of both sides of the through hole, should form a fillet as shown in Figure (1-1) and solder The surface should be smooth and shiny.

일반적인 회로기판(두께:1.6mm & 3층 기판 이하) 구조의 납땜은 인두가 온도 330℃ 전, 후로 열을 가하여 부품의 Lead와 회로기판 Pattern에 Solder가 완전히 녹을 때까지 인두기 Tip을 3~5초정도 접촉하면 그림(1-2)과 같은 납땜 형상을 만들 수 있다.For general circuit board (thickness: 1.6mm & 3 layer board or less) structure soldering, the iron applies heat before and after the temperature of 330℃ and presses the tip of the iron for 3~5 seconds until the solder completely melts on the lead of the part and the circuit board pattern. If the contact is accurate, a solder shape like the one in Figure (1-2) can be made.

일례로서 공개특허공보 공개번호 특2002-0015176호에는 장착될 부품의 크기에 대응하는 부품안착개구(24)가 소정 위치에 형성되어 있는 PCB 기판(10)상에 부품(21,31,41)을 설치하여 전기적 접촉 및 고정시키기 위한 상기 부품(21,31,41)의 장착방법에 있어서, 상기 부품안착개구(24)내에 상기 부품(21,31,41)을 끼워넣고 상기 부품의 리드핀(22,32)을 상기 부품안착개구(24) 주위에 형성된 리드핀 삽입구멍(23,33)에 끼워넣는 부품설치 단계; 및 상기 리드핀(22,32)이 끼여있는 삽입구멍(23,33)에 용융납을 장착시키고응고시키는 솔더링 단계를 포함하는 것을 특징으로 하는 PCB 기판상의 부품 장착방법이 공개되어 있다.As an example, in Unexamined Patent Publication No. 2002-0015176, the components 21, 31, and 41 are formed on the PCB substrate 10 in which the component seating opening 24 corresponding to the size of the component to be mounted is formed at a predetermined position. In the mounting method of the parts (21, 31, 41) for installation and electrical contact and fixing, the parts (21, 31, 41) are inserted into the part seating opening (24) and the lead pins (22) of the parts are inserted. a component installation step of inserting the 32) into the lead pin insertion holes 23 and 33 formed around the component seating opening 24; and a soldering step of mounting and solidifying molten solder in the insertion holes 23 and 33 in which the lead pins 22 and 32 are sandwiched.

또한, 공개특허공보 공개번호 특1999-027174호에는 PCB기판(50)상에 부품을 가설치한 후 솔더링하여 전기적 접촉을 이룸과 함께 견고하게 고정시키기 위한 PCB상에의 부품의 리드핀 납땜방법에 있어서: 상기 PCB기판(50)상의 소정의 납땜부위에 납땜보조선을 가 설치하도록 납땜보조선홀을 형성시키는 홀형성단계; 솔더링전에 상기 납땜보조선홀에 납땜보조선(60, 61)을 가설치하는 납땜보조선 설치단계; 그 납땜보조선 설치단계의 전후 내지 동시에 상기 부품을 가설치하는 부품설치단계; 그리고 그 부품의 리드핀(L1, L2, L')과 납땜보조선(60,61)에 용융납을 부착시키고 응고시켜 전기적 접촉을 이룸과 함께 견고하게 PCB기판(50)에 고정시키는 솔더링단계를 포함하여 구성되는 것을 특징으로 하는 PCB상에의 부품의 리드핀 납땜방법이 공개되어 있다.In addition, in Korean Patent Laid-Open Publication No. 1999-027174, a lead pin soldering method of a component on a PCB for making electrical contact and firmly fixing the component by soldering after temporarily installing the component on the PCB substrate 50 : A hole forming step of forming a soldering auxiliary line hole to temporarily install a soldering auxiliary line on a predetermined soldering part on the PCB board 50; A soldering auxiliary line installation step of temporarily installing soldering auxiliary lines (60, 61) in the soldering auxiliary line hole before soldering; A component installation step of temporarily installing the component before or after the soldering auxiliary wire installation step or at the same time; And the soldering step of attaching the molten lead to the lead pins (L1, L2, L') and the soldering auxiliary wires (60, 61) of the component and solidifying it to make electrical contact and firmly fix it to the PCB board (50). There is disclosed a method of soldering lead pins of components on a PCB, characterized in that it comprises.

그러나 여기서 말하는 두꺼운 다층기판의 경우는 일반 PCB와 동일한 방법으로 납땜(Soldering)을 진행하면 납땜에 필요한 열 온도가 두꺼운 다층기판의 Pattern에 흡수되어 정상적인 납땜을 기대 할 수가 없다.However, in the case of a thick multi-layer board, if soldering is performed in the same way as a general PCB, the heat temperature required for soldering is absorbed by the pattern of the thick multi-layer board, so normal soldering cannot be expected.

그림(2-2)을 보면 직접 납땜한 "하"면은 납땜이 잘되었지만 "상"면 부품 면에는 납이 올라오지 않아서 필렛(Fillet) 형성이 되지 않았다.Referring to Figure (2-2), the "lower" side soldered directly was soldered well, but the fillet was not formed because lead did not rise on the "upper" side component side.

구분division PCB 두께PCB thickness 납땜 온도/시간Soldering Temperature/Time 납땜 결과Soldering result 일반 PCBNormal PCB 1.6T1.6T 330℃/3∼5sec330℃/3∼5sec 그림1-2 양호Figure 1-2 Good 두꺼운 다층 PCBthick multilayer pcb 2.5T~4.0T2.5T~4.0T 350℃/5.0sec350℃/5.0sec 그림2 부적합Figure 2 Nonconformity

표 1은 PCB두께에 따른 성질표이다.Table 1 is a table of properties according to the thickness of the PCB.

만약 부품 "상(부품면)"면에 납이 올라오지 않는다고 납땜 온도를 올리거나 납땜 시간을 늘릴 경우 납땜을 촉진시켜주는 플럭스(FLUX) 성분이 순식간에 증발되어 납땜의 상태는 거칠어지면서 필렛(Fillet) 형성은 되지 않고 오히려 부품의 열화 또는 회로기판의 Pattern이 손상되어 회로기판 자체를 폐기해야 하는 상황이 발생하게 된다.If the soldering temperature is raised or the soldering time is increased because the lead does not rise on the "upper (component side)" side of the component, the flux component that promotes soldering is evaporated in an instant, and the condition of soldering becomes rough and fillet. ) is not formed, but rather the deterioration of parts or damage to the pattern of the circuit board causes a situation in which the circuit board itself must be discarded.

그리고 만약, 높은 온도에서 납땜 시간이 길어질 경우 부품이 열화 또는 열 쇼크로 부품의 성능을 저하 시킬 수가 있고 납땜 품질이 저하되어 각종 문제를 발생시킬 수 있다.And, if the soldering time is prolonged at a high temperature, the performance of the component may be deteriorated due to deterioration or thermal shock, and the soldering quality may be deteriorated, which may cause various problems.

따라서 본 발명은 상기와 같은 문제점을 해결하고자 안출된 것으로, 본발명은 납땜 시간과 납땜 온도를 최소화 시켜 부품의 열화 또는 열쇼크로 인한 성능저하를 방지할 수 있고 납땜품질을 향상시킬 수 있으며 경제적인 두꺼운 다층 인쇄회로기판 양면 납땜 제조방법을 제공하고자 하는 것이다.Therefore, the present invention has been devised to solve the above problems, and the present invention can minimize the soldering time and soldering temperature to prevent deterioration of parts or performance degradation due to thermal shock, improve soldering quality, and economical An object of the present invention is to provide a method for manufacturing thick multilayer printed circuit board double-sided soldering.

본발명은 두꺼운 다층 인쇄회로기판 양면 납땜 제조방법에 관한 것으로,The present invention relates to a method for manufacturing thick multilayer printed circuit board double-sided soldering,

PCB 예열 도구에 온도를 설정하고 PCB를 올려 고정하는 예열단계;A preheating step of setting the temperature in the PCB preheating tool and placing and fixing the PCB;

PCB의 쓰로우홀(Through Hole)에 부품을 삽입하고 납땜 부위 및 쓰로우홀(Through Hole)사이로 플럭스(FLUX)를 도포하는 플럭스 도포단계;A flux application step of inserting a component into a through hole of the PCB and applying a flux between the soldering area and the through hole;

인두기 온도를 높혀서 납땜을 하여 쓰로우홀(Through Hole)의 “상”, “하”면에 매끄럽게 납땜이 되면서 필렛(Fillet) 형성되는 납땜단계;를 포함하는 것을 특징으로 한다.It is characterized in that it includes a soldering step in which the fillet is formed while the soldering is performed by raising the iron temperature to smoothly solder the “upper” and “lower” surfaces of the through hole.

따라서 본발명은 납땜 시간과 납땜 온도를 최소화시켜 부품의 열화 또는 열쇼크로 인한 성능저하를 방지할 수 있고 납땜품질을 향상시킬 수 있으며 경제적인 현저한 효과가 있다.Therefore, the present invention can minimize the soldering time and soldering temperature to prevent deterioration of the performance due to deterioration of components or thermal shock, improve soldering quality, and have remarkable economical effects.

도 1a은 종래의 PCB 부품 납땜단면도
도 1b 는 종래의 납땜 품질인증 기준인 IPC-A-610(Class.3)에 만족한 상태사진
도 2a은 직접 납땜한 “하”면은 납땜이 잘되었지만 “상”면 부품 면에는 납이 올라오지 않아서 필렛(Fillet) 형성이 되지 않은 사진
도 2b는 Through Hole 납땜 부품들 예시사진
도 3은 PCB예열도구
도 4는 본발명의 FIUX 도포 공정사진
도 5는 본발명의 FIUX 도포 사진1a is a cross-sectional view of a conventional PCB component soldering
1b is a photograph of a state that satisfies IPC-A-610 (Class.3), which is a conventional soldering quality certification standard;
Figure 2a is a photo in which the "bottom" side soldered directly was well soldered, but the fillet was not formed because lead did not rise on the "top" side component side.
Figure 2b is an example picture of through hole soldering parts
3 is a PCB preheating tool
4 is a picture of the FIUX application process of the present invention
5 is a picture of FIUX application of the present invention

본발명은 두꺼운 다층 인쇄회로기판 양면 납땜 제조방법에 관한 것으로,The present invention relates to a method for manufacturing thick multilayer printed circuit board double-sided soldering,

PCB 예열 도구에 온도를 설정하고 PCB를 올려 고정하는 예열단계;A preheating step of setting the temperature in the PCB preheating tool and placing and fixing the PCB;

PCB의 쓰로우홀(Through Hole)에 부품을 삽입하고 납땜 부위 및 쓰로우홀(Through Hole)사이로 플럭스(FLUX)를 도포하는 플럭스 도포단계;A flux application step of inserting a component into a through hole of the PCB and applying a flux between the soldering area and the through hole;

인두기 온도를 높혀서 납땜을 하여 쓰로우홀(Through Hole)의 “상”, “하”면에 매끄럽게 납땜이 되면서 필렛(Fillet) 형성되는 납땜단계;를 포함하는 것을 특징으로 한다.It is characterized in that it includes a soldering step in which the fillet is formed while the soldering is performed by raising the iron temperature to smoothly solder the “upper” and “lower” surfaces of the through hole.

또한, 상기 납땜단계는 "하(납땜면)"면에서 납땜을 하는 것을 특징으로 한다.In addition, the soldering step is characterized in that the "bottom (soldering surface)" side soldering.

또한, 상기 "하(납땜면)"면에서 납땜을 하되, "상(부품면)"면까지 납이 차고 올라와서 필렛(Fillet)이 형성되는 것을 특징으로 한다.In addition, it is characterized in that the solder is carried out from the "lower (solder side)" side, and the lead fills up to the "upper (component side)" side to form a fillet.

본발명을 첨부도면에 의해 상세히 설명하면 다음과 같다.The present invention will be described in detail with reference to the accompanying drawings as follows.

도 1a은 종래의 PCB 부품 납땜단면도, 도 1b 는 종래의 납땜 품질인증 기준인 IPC-A-610(Class.3)에 만족한 상태사진, 도 2a은 직접 납땜한 "하"면은 납땜이 잘되었지만 "상"면 부품 면에는 납이 올라오지 않아서 필렛(Fillet) 형성이 되지 않은 사진, 도 2b는 Through Hole 납땜 부품들 예시사진, 도 3은 PCB예열도구, 도 4는 본발명의 FIUX 도포 공정사진, 도 5는 본발명의 FIUX 도포 사진이다.1A is a cross-sectional view of a conventional PCB component soldering, FIG. 1B is a picture of a state that satisfies IPC-A-610 (Class.3), which is a conventional soldering quality certification standard, and FIG. However, on the "top" side, lead did not rise on the component side, so no fillet was formed. Photo, Figure 5 is a photo of FIUX application of the present invention.

본발명은 두꺼운 다층 인쇄회로기판의 Through Hole 양면 납땜 필렛(Fillet) 형성 방법에 관한 것이다.The present invention relates to a method for forming a through hole double-sided solder fillet of a thick multilayer printed circuit board.

두꺼운 다층 인쇄회로기판을 예열 도구를 사용하여 90~100℃ 온도로 가열한 상태에서 납땜 부위에 액체 Flux를 도포하고 인두기 온도를 380℃로 설정하여 납땜 시간을 4~5sec하여 납땜을 하면 Through Hole의 “상”, “하”면에 매끄럽게 납땜이 되면서 원하는 필렛(Fillet) 형성이 이루어진다.When the thick multilayer printed circuit board is heated to a temperature of 90~100℃ using a preheating tool, liquid flux is applied to the soldering area, and the iron temperature is set to 380℃ and the soldering time is 4~5sec. As the “top” and “bottom” sides are smoothly soldered, the desired fillet is formed.

㉮ PCB 예열도구 : 95℃ ± 5℃㉮ PCB preheating tool : 95℃ ± 5℃

㉯ 액체 FLUX : Koki JS-75(비중 0.80)㉯ Liquid FLUX : Koki JS-75 (specific gravity 0.80)

주요성분은 1. 수소화된 로신(스타이벨리트(R)수지) 함유량: 4~7(%), 2. 이소프로필 알코올 함유량: 88~98(%) Main components are 1. Hydrogenated rosine (Stybelite(R) resin) content: 4~7(%), 2. Isopropyl alcohol content: 88~98(%)

㉰ 인두기 온도 : 380℃ ± 5℃㉰ Iron temperature: 380℃ ± 5℃

㉱ 납땜 시간 : 4.5sec ± 0.5sec㉱ Soldering time: 4.5sec ± 0.5sec

본발명의 작업 순서에 대해 설명하면 다음과 같다.The operation sequence of the present invention will be described as follows.

1. PCB 예열 도구(온도 조절이 가능하도록 주문제작)에 온도를 설정하고 PCB를 올려 고정한다.1. Set the temperature on the PCB preheating tool (custom-made to allow temperature control) and mount the PCB to fix it.

2. PCB의 Through Hole에 부품을 삽입하고 그림(4)와 같이 납땜 부위 및 Through Hole 사이로 FLUX를 적당히 도포 한다.2. Insert the component into the through hole of the PCB and apply the FLUX properly between the soldering part and the through hole as shown in Figure (4).

Through Hole 삽입 부품의 납땜단계는 "하(납땜면)"면에서 납땜을 하여 "상(부품면)"까지 납이 올라오도록 납땜을 한다.In the soldering step of through hole inserting parts, solder from the "bottom (solder side)" side so that the lead goes up to the "upper (component side)" side.

3. 380℃ 온도로 설정한 인두기로 4.5sec ± 0.5sec 동안 납땜을 한다.3. Solder for 4.5sec ± 0.5sec with an iron set at 380℃.

그림(5)와 같이 위 조건들로 납땜을 하면 두꺼운 다층 인쇄회로기판이라 할지라도 "하(납땜면)"면에서 납땜을 해도 "상(부품면)"면까지 납이 차고 올라와서 필렛(Fillet)이 형성되는 것을 알 수가 있다. 여기서 납땜 온도, 인쇄회로기판의 예열 온도, FLUX 도포, 납땜 시간 등이 잘 조화가 되어야만 정상적인 “납땜 품질 인증 기준”인 IPC-A-610(Class.3)을 만족 시킬 수가 있다.As shown in Figure (5), if you solder under the above conditions, even if it is a thick multilayer printed circuit board, even if you solder from the "bottom (solder side)" side, the solder rises up to the "upper (component side)" side and fills up the fillet. ) can be seen to form. Here, the normal “solder quality certification standard”, IPC-A-610 (Class.3), can be satisfied only when the soldering temperature, the preheating temperature of the printed circuit board, the flux application, and the soldering time are well harmonized.

따라서 본발명은 납땜 시간과 납땜 온도를 최소화 시켜 부품의 열화 또는 열쇼크로 인한 성능저하를 방지할 수 있고 납땜품질을 향상시킬 수 있으며 경제적인 현저한 효과가 있다.Therefore, the present invention can minimize the soldering time and soldering temperature to prevent deterioration of parts due to deterioration or thermal shock, improve soldering quality, and have significant economical effects.

10 : 필렛 20 : 부품
30 : 솔더(SOLDER) 40 : 부품리드
50 : 인두기 60 : PCB10: fillet 20: parts
30: solder (SOLDER) 40: component lead
50: iron 60: PCB

Claims (3)

PCB 예열 도구에 온도를 설정하고 PCB를 올려 고정하는 예열단계;
PCB의 쓰로우홀(Through Hole)에 부품을 삽입하고 납땜 부위 및 쓰로우홀(Through Hole)사이로 플럭스(FLUX)를 도포하는 플럭스 도포단계;
인두기 온도를 높혀서 납땜을 하여 쓰로우홀(Through Hole)의 “상”, “하”면에 매끄럽게 납땜이 되면서 필렛(Fillet) 형성되는 납땜단계;를 포함하는 것을 특징으로 하는 두꺼운 다층 인쇄회로기판 양면 납땜 제조방법A preheating step of setting the temperature in the PCB preheating tool and mounting and fixing the PCB;
A flux application step of inserting a component into a through hole of the PCB and applying flux between the soldering area and the through hole;
Both sides of a thick multi-layer printed circuit board comprising: a soldering step in which a fillet is formed while being smoothly soldered to the “upper” and “lower” surfaces of the through hole by raising the iron temperature and soldering Solder manufacturing method 제1항에 있어서, 상기 납땜단계는 "하(납땜면)"면에서 납땜을 하는 것을 특징으로 하는 두꺼운 다층 인쇄회로기판 양면 납땜 제조방법The method according to claim 1, wherein in the soldering step, soldering is performed from the "bottom (solder side)" side. 제2항에 있어서, 상기 "하(납땜면)"면에서 납땜을 하되, "상(부품면)"면까지 납이 차고 올라와서 필렛(Fillet)이 형성되는 것을 특징으로 하는 두꺼운 다층 인쇄회로기판 양면 납땜 제조방법3. The thick multilayer printed circuit board according to claim 2, wherein soldering is carried out from the "lower (solder side)" side, but the lead fills up to the "upper (component side)" side to form a fillet. Double-sided soldering method
KR1020200041947A 2020-04-07 2020-04-07 Method for manufacturing double-sided soldering of thick multilayer printed circuit boards KR20210124656A (en)

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