KR20210115299A - Deco-film with metalic circuit pattern and producting methode thereof - Google Patents

Abstract

The present invention relates to a metal circuit wiring integrated decoration film. Specifically, the present invention relates to the metal circuit wiring integrated decoration film that can be attached in a form of a film to various devices with panels to implement a capacitive touch or an antenna function, and a manufacturing method thereof. In the metal circuit wiring integrated decoration film installed between a panel and a circuit board composed of a tempered glass or a synthetic resin, the metal circuit wiring integrated decoration film according to the present invention comprises: a color pattern layer attached to a lower surface of the panel; and a metal circuit pattern layer formed on a lower surface of the color pattern layer and electrically connected to the circuit board.

Description

Deco-film with metalic circuit pattern and producting methode thereof

The present invention relates to a metal circuit wiring integrated decoration film, and more particularly, to a metal circuit wiring integrated decoration film that can be attached in the form of a film to various devices having a touch input function to implement a capacitive touch or antenna function, and the same It relates to a manufacturing method.

In recent years, electronic devices such as a mobile communication terminal or a vehicle navigation device mainly have a touch screen or a touch panel installed in an input manipulation unit.

The configuration of the input manipulation unit of such a touch screen or touch panel includes tempered glass or synthetic resin to protect the touch function integrated display or touch input module, a decoration film printed with a company logo or image, and ITO (Indium Tin Oxide) ) has a structure in which conductive glass or film formed with a conductive layer is adhered through OCA (Optical Clear Adhesive), etc.

Republic of Korea Patent No. 10-1277727 discloses a "deco film for a touch panel and a method for manufacturing the same" used as a protective film for an existing window LCD module, and the deco film disclosed in this document is a screen printing layer and , a deposition layer laminated on the upper end of the screen printing layer, a UV pattern layer formed over the entire upper end of the deposition layer, and an optical base film (PET base film: 40) laminated on top of the UV pattern layer, and an optical base It is composed of tempered glass that is adhered through an adhesive layer on the upper part of the film.

The decorative film having such a configuration is provided with a UV pattern layer with an arbitrary pattern design on the lower part of the optical base film for light projection, diffusion and reflection, and the design of the product is realized through this UV pattern layer. The color of the entire film (for example, black sapphire, gold platinum, silver titanium, white pearl, etc.) is controlled by the type and thickness of the material deposited on the deposition layer. It was implemented using the reflection of light in the wavelength band.

However, in such a conventional decorative film, the deposition process for forming the deposition layer has extremely high process difficulty, and, in order to realize a specific color, it is necessary to precisely match the thickness of the deposition layer to implement color uniformity. It was not easy, and the process was also very difficult. In addition, in order to implement a specific color, deposition materials of various materials must be sequentially deposited to form at least 2 to 4 layers, so that the thickness of the deposition layer is thickened as well as the deposition process belonging to the most complicated process in a vacuum state There was a problem that the process was very complicated because it had to be repeatedly performed for each layer using E-Beam. In addition, due to the characteristic of achieving color implementation through deposition, it is only possible to implement a uniform color as a whole, and it is impossible to express a specific pattern having a difference in color. In addition, in the case of the conventional decorative film as described above, only the design aspect for the realization of a specific color was the main consideration when designing the product. There was a limit in not being able to contribute to the improvement of dona or product quality.

Republic of Korea Patent No. 10-1277727

The present invention has been devised to solve the above problems, and the technical problem to be solved in the present invention is to attach a film to various devices equipped with a touch panel, and then to various touch circuit patterns or to the outside through a metal pattern layer. An object of the present invention is to provide a metal circuit wiring integrated decoration film capable of implementing an antenna function for transmission and reception, and a method for manufacturing the same.

The metal circuit wiring integrated decorative film of the present invention for solving the above technical problem is a metal circuit wiring integrated decorative film installed between a panel and a circuit board composed of tempered glass or synthetic resin, the color attached to the lower surface of the panel a pattern layer; and a metal circuit pattern layer formed on the lower surface of the color pattern layer and electrically connected to the circuit board.

Here, an insulating layer may be additionally formed on the upper surface of the metal circuit pattern layer.

In addition, a wax layer may be additionally formed on the lower surface of the metal circuit pattern layer.

In addition, the color pattern layer may include a color tint layer attached to the lower surface of the panel, and a pattern printing layer attached to the lower surface of the color tint layer.

At this time, the color tint layer includes a first color tint layer bonded to the pattern printing layer, a base layer formed on the upper surface of the first color tint layer, and a second color tint layer formed on the upper surface of the base layer and attached to the panel. may include

In addition, the pattern printing layer may include an optical film layer, a pattern layer formed on the lower surface of the optical film layer, a deposition layer formed on the lower surface of the pattern layer, and a printed layer formed on the lower surface of the deposition layer. .

Here, the wax layer may be formed with a first cutting part cut so that the metal circuit pattern layer and the pin connector of the circuit board are electrically connected.

In addition, the metal circuit pattern layer and the wax layer may be formed with a second cutting portion cut so that the light generated from the LED installed on the circuit board can be projected to the panel.

In addition, as the circuit board, a flexible printed circuit board (FPCB) may be applied, and the wax layer may have a third cutting part cut so that a portion of the flexible circuit board is electrically connected to the lower surface of the metal circuit pattern layer. have.

In this case, the flexible circuit board may be fixed to the lower surface of the metal circuit pattern layer so as to be integrated through an ACF (Anisotropic Conductive Film) or ACP (Activated Carbon Powder) bonding.

On the other hand, the metal circuit wiring integrated decoration film manufacturing method of the present invention for solving the above technical problem, in the metal circuit wiring integrated decoration film manufacturing method installed between the panel and the circuit board composed of tempered glass or synthetic resin, the panel Forming a color pattern layer to be attached to the lower surface of the (a) and; forming a metal circuit pattern layer for electrical connection with a circuit board (b); It characterized in that it comprises the step (c) of bonding the color pattern layer and the metal circuit pattern layer.

Here, the step (b) may further include the step (b-1) of forming an insulating layer on the upper surface of the metal circuit pattern layer.

And, the step (b) may further include the step (b-2) of forming a wax layer on the lower surface of the metal circuit pattern layer.

On the other hand, the step (a) comprises the steps (a-1) of forming a color tint layer to be attached to the lower surface of the panel; forming a pattern printing layer to be attached to the lower surface of the color tint layer (a-2); bonding the color tint layer and the pattern printing layer (a-3); may include.

Here, the step (a-1) comprises the steps of (a-1-1) forming a first color tint layer; forming a base layer on the upper surface of the first color tint layer (a-1-2); forming a second color tint layer on the upper surface of the base layer (a-1-3); may be included.

In addition, the step (a-2) comprises the steps of (a-2-1) forming an optical film layer; forming a pattern layer on the lower surface of the optical film layer (a-2-2); forming a deposition layer on the lower surface of the pattern layer (a-2-3); Forming a printed layer on the lower surface of the deposition layer (a-2-4); may include.

In this case, in the step (b-2), a first cut region for electrical connection between the metal circuit pattern layer and the pin connector of the circuit board may be formed in the wax layer.

Alternatively, in the step (b-2), a second cut region through which light generated from an LED installed on a circuit board can be projected may be formed on the metal circuit pattern layer and the wax layer.

Alternatively, in the step (b-2), a third cut region for electrical connection between the flexible circuit board and the metal circuit pattern layer may be formed in the wax layer.

In this case, the flexible circuit board may be integrally bonded to the lower surface of the metal circuit pattern layer in the third cut region through an anisotropic conductive film (ACF) or activated carbon powder (ACP).

According to the metal circuit wiring integrated decoration film of the present invention having the above configuration and a method for manufacturing the same, the metal circuit pattern is formed by forming a metal circuit pattern layer electrically connected to the circuit board under the pattern layer of the metal circuit wiring integrated decoration film. Capacitive touch or antenna functions can be implemented through the layers, and the decorative film is made in the form of a thin film that can be bent or bent. and a touch function or an antenna function can be implemented.

In addition, since the color tint layer is directly implemented on the optical base film (PET base film) through the ink thermal transfer method, etc., and the deposition layer is implemented only with the function of adjusting the reflectance and transmittance, the manufacturing process is simplified, There is an advantage in that it is possible to lower the process cost and process difficulty, and significantly shorten the manufacturing time. In addition, there is an advantage that various colors or designs are possible through the color tint layer.

1 is a cross-sectional view showing a detailed configuration of a metal circuit wiring integrated decorative film according to the present invention.
Figure 2 is an exemplary view showing an example of one use of the metal circuit wiring integrated decorative film according to the present invention.
3 is an exemplary view showing a state in which the decorative film shown in FIG. 2 is bonded to the panel and the circuit board.
Figure 4 is an exemplary view showing another example of use of the metal circuit wiring integrated decorative film according to the present invention.
5 is an exemplary view showing a state in which the decorative film shown in FIG. 4 is bonded to the panel and the circuit board.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them.

However, the present invention may be implemented in several different forms and is not limited to the embodiments described herein. In addition, it should be noted that parts denoted by the same reference numerals throughout the detailed description mean the same components.

Hereinafter, an embodiment of the metal circuit wiring integrated decorative film and the manufacturing method thereof of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view showing a detailed configuration of a metal circuit wiring integrated decorative film according to the present invention.

1, the metal circuit wiring-integrated decorative film 100 according to the present invention is a thin film-shaped member installed between a panel 10 and a circuit board (not shown) made of tempered glass or transparent synthetic resin (resin). The color pattern layer 140 is largely attached to the lower surface of the panel 10, and the metal circuit pattern layer assembly 150 is attached to the lower surface of the color pattern layer 140 to make electrical connection with the circuit board. do.

The color pattern layer 140 includes a color tint layer 120 attached to the lower surface of the panel 10 and a pattern printing layer 130 attached to the lower surface of the color tint layer 120 . do.

The color tint layer 120 is attached to the lower surface of the panel 10 and expresses any one or more of a color or a shape. The color tint layer 120 forms a color layer having semi-transmission properties and can be implemented according to various embodiments. As one embodiment, it may be formed through an ink thermal transfer method.

In the case of the ink thermal transfer method, it is possible to implement various colors and shapes, as well as the permeability can be adjusted through the combination of the thickness, color, and layer of the thermally transferred ink layer. Compared to that, since the thickness of one transfer layer is only about 0.6 ~ 2.0㎛, it is possible to implement 1/3 ~ 1/5 as thin as possible, so it is possible to greatly improve the operating sensitivity of the panel that requires touch manipulation. .

The color tint layer 120 includes a first color tint layer 124 bonded to the lower pattern printing layer 130 , and a base layer 123 formed on the upper surface of the first color tint layer 124 , The second color tint layer 122 formed on the upper surface of the base layer 123 and attached to the panel 10 is sequentially stacked.

The base layer 123 may be composed of any one of a PET film or a printable hard coating layer, and a first color tint layer 124 and a second color tint layer 122 are respectively formed on the lower and upper surfaces of the base layer 123 . can be formed. In this case, only the first color tint layer 124 may be formed on the lower surface of the base layer 123 , or only the second color tint layer 122 may be formed on the upper surface of the base layer 123 .

In addition, since the adhesive layer 121 is formed on the upper surface of the second color tint layer 122 , the decorative film 100 may be bonded to the lower surface of the panel 10 through the adhesive layer 121 .

On the other hand, the pattern printing layer 130 is an optical film layer 132, a pattern layer 133 formed on the lower surface of the optical film layer 132, and a deposition layer formed on the lower surface of the pattern layer 133 ( 134 , and a printed layer 135 formed on the lower surface of the deposition layer 134 .

That is, the pattern printed layer 130 has a structure in which a printed layer 135 , a deposition layer 134 , a pattern layer 133 , and an optical film layer 132 are sequentially stacked, and an optical film layer 132 . An adhesive layer 131 is formed on the upper surface of the tint layer 131 and bonded to the first color tint layer 124 , whereby bonding between the color tint layer 120 and the pattern printing layer 130 is made.

In this case, the color tint layer 120 is formed by bonding between the color tint layer 120 and the pattern printing layer 130 through the adhesive layer 131 formed on the upper surface of the optical film layer 132 . It becomes possible to separately perform the constituting process and the deposition process constituting the pattern printing layer 130 , thereby increasing process efficiency.

In this case, the adhesive layer 131 formed on the pattern printing layer 130 as well as the adhesive layer 121 formed on the color tint layer 120 may be formed of OCA (Optical Clear Adhesive) or an adhesive resin.

The pattern layer 133 is formed on the lower surface of the optical film layer 132 to implement various patterns, and the deposition layer 134 is formed on the lower surface of the pattern layer 133 through a deposition process to form transmittance or reflectance. functions to control

In this case, it is preferable that the deposition layer 134 includes any one of various metal materials such as indium, chromium, and tin.

In addition, the deposition layer 134 controls transmittance/reflectance rather than color expression, unlike conventional deposition layers that are formed by repeating a plurality of deposition processes as a multi-layer for the function of expressing color. Considering the characteristic having only the function, it is formed to have a thickness of 400 Å or less, and the reflectance is preferably 30% or more.

As described above, according to the characteristic that the deposition layer 134 mainly performs a function of controlling transmittance or reflectance, it is not necessary to consist of a plurality of layers for color expression like the conventional deposition layer, and the most Since the deposition process, which is a complex process, can be performed much less, the overall process is extremely simple and has the advantage of excellent reproducibility of the deposition effect.

On the other hand, on the lower surface of the color pattern layer 140 , a metal circuit pattern layer assembly 150 in which a wax layer 154 , a metal circuit pattern layer 153 , and an insulating layer 152 are sequentially stacked is formed. are joined

The wax layer 154 may be formed on the lower surface of the metal circuit pattern layer 153 to partially insulate the metal circuit pattern layer 153 or to provide a function of allowing only a specific region of the metal circuit pattern layer 153 to conduct electricity. have.

As an example, as shown in FIG. 5 to be described later, the pin connector 32 of the pin connector 32 of the circuit board 30 and the metal circuit pattern layer 153 are electrically connected to each other in the wax layer 154 part. ) may form a space in which the first cutting part CA1 can be inserted.

In this way, the metal circuit pattern layer 153 and the pin connector 32 of the circuit board 30 may be connected through the first cutting portion CA1 region, and various types of the metal circuit pattern layer 153 may be connected to each other. By implementing the antenna pattern, it is possible to implement an antenna that can transmit/receive wirelessly to the outside.

As another example, as shown in FIG. 3 , in the LED 61 of the circuit board 60 by forming the second cut portion CA2 region in the metal circuit pattern layer 153 and the wax layer 154 portion. Since the generated light is projected through the space of the second cutting part CA2 and then passes through the upper color pattern layer 140 to be illuminated by the panel 10 , the color tone and pattern provided to the color pattern layer 140 . It is possible to implement an excellent lighting effect toward the panel 10 through the back.

In addition, as in the form of FIG. 3 , only a part of the wax layer 154 is cut off to form a third cutting part CA3 area, and a part of a flexible printed circuit board (FPCB) 60 on the lower side thereof is cut above. It may be configured to be electrically connected by bonding to the lower surface of the metal circuit pattern layer 153 through the third cutting portion CA3 region. In addition, by implementing various types of touch patterns that are easy to recognize a touch in the metal circuit pattern layer 153 , it is possible to implement a capacitive touch function capable of performing a touch input on the surface of the panel 10 .

In this case, the flexible circuit board 60 may be fixed to the lower surface of the metal circuit pattern layer 153 so as to be integrated with an ACF (Anisotropic Conductive Film) or ACP (Activated Carbon Powder) bonding 63 .

The insulating layer 152 may completely insulate the metal circuit pattern layer 153 from the upper color pattern layer 140 , or partially insulate the metal circuit pattern layer 153 like the wax layer 154 , or It is responsible for the function of allowing electricity to flow only in a specific area. In this case, the insulating layer 152 may or may not be formed as needed.

In addition, an adhesive layer 151 for bonding the color pattern layer 140 and the metal circuit pattern layer assembly 150 to the upper surface of the insulating layer 152 forming the uppermost end of the metal circuit pattern layer assembly 150 is to be formed. can

The adhesive layer 151 is the same as in the case of the adhesive layers 121 and 131 formed on the color tint layer 120 and the pattern printing layer 130 described above, and the process of forming the metal circuit pattern layer assembly 150 and the color pattern layer. By allowing the deposition processes constituting 140 to be performed independently of each other, it contributes to improvement of process efficiency.

Here, the adhesive layer 151 formed on the metal circuit pattern layer assembly 150 is OCA (Optical) like the adhesive layers 121 and 131 formed on the color tint layer 120 and the pattern printing layer 130 described above. Clear Adhesive) or adhesive resin.

Hereinafter, a method for manufacturing a metal circuit wiring integrated decorative film according to an embodiment of the present invention will be described.

The metal circuit wiring integrated decoration film manufacturing method according to the present invention comprises the steps (a) of forming a color pattern layer 140 to be attached to the lower surface of the panel 10 made of tempered glass or transparent synthetic resin, and the circuit board 30 , including the step (b) of forming a metal circuit pattern layer assembly 150 for electrical connection with 60, and (c) bonding the color pattern layer 140 and the metal circuit pattern layer assembly 150 is composed by

Here, the step (a) of forming the color pattern layer 140 includes the step (a-1) of forming the color tint layer 120 to be attached to the lower surface of the panel 10 and the color tint layer 120 . It is configured to include a step (a-2) of forming the pattern printing layer 130 to be attached to the lower surface (a-2), and a step (a-3) of mutually bonding the color tint layer 120 and the pattern printing layer 130 to each other.

In addition, the step (a-1) of forming the color tint layer 120 includes the step (a-1-1) of forming the first color tint layer 124 and the steps of the first color tint layer 124 . Forming the base layer 123 on the upper surface (a-1-2), forming the second color tint layer 122 on the upper surface of the base layer 123 (a-1-3); and forming an adhesive layer 121 for bonding to the panel 10 on the upper surface of the two-color tint layer 122 (a-1-4).

As described above, the color tint layer 120 includes a first color tint layer 124 and a second color tint layer ( 122), or only the first color tint layer 124 or the second color tint layer 122 may be formed on any one of the lower surface and the upper surface of the base layer 123 . In this case, the first and second color tint layers 124 and 122 are preferably formed on the base layer 123 through an ink thermal transfer method.

In addition, the adhesive layer 121 formed on the upper surface of the second color tint layer 122 may be formed of OCA (Optical Clear Adhesive) or an adhesive resin.

In addition, the step (a-2) of forming the pattern printing layer 130 includes the step (a-2-1) of forming the optical film layer 132 and the pattern on the lower surface of the optical film layer 132 . Forming the layer 133 (a-2-2), forming the deposition layer 134 on the lower surface of the pattern layer 133 (a-2-3), and the lower surface of the deposition layer 134 It may include the step (a-2-4) of forming the printed layer 135 on the .

In step (a-2) for forming the pattern printing layer 130, the optical film layer 132 and the pattern layer 133 may be provided in the form of a sheet or a roll in the process. have.

At this time, when the optical film layer 132 and the pattern layer 133 are provided in the form of a sheet or roll, the (a-2) step is deposited using E-Beam or sputtering. It is desirable that the process be applied

Here, the deposition layer 134 deposited in step (a-2) may include any one of various metal materials such as indium, chromium, and tin.

At this time, as described above, the deposition layer 134 is formed to have a thickness of 400 Å or less, and a reflectance is preferably formed to be 30% or more.

On the other hand, the step (b) of forming the metal circuit pattern layer assembly 150 for electrical connection with the circuit boards 30 and 60 is to form an insulating layer 152 on the upper surface of the metal circuit pattern layer 153 . Step (b-1), forming the wax layer 154 on the lower surface of the metal circuit pattern layer 153 (b-2), and forming the adhesive layer 151 on the upper surface of the insulating layer 152 (b-3).

In the step (b-1) of forming the insulating layer 152 on the upper surface of the metal circuit pattern layer 153, the upper surface of the metal circuit pattern layer 153 is completely covered with the insulating layer 152. The metal circuit pattern layer 153 can be completely insulated from the color pattern layer 140, or the metal circuit pattern layer ( 153) can be partially insulated or configured so that only a specific area is energized. In this case, the insulating layer 152 may be selectively formed as needed.

In addition, in the step (b-2) of forming the wax layer 154 on the lower surface of the metal circuit pattern layer 153, only a part of the wax layer 154 is formed to cover the metal circuit pattern layer 153, so that the circuit board 30, 60 ) and the metal circuit pattern layer 153 may be electrically connected, and the remaining regions not connected to the circuit boards 30 and 60 may be configured to be insulated through the wax layer 154 .

Meanwhile, in the step (b-2) of forming the wax layer 154, the pin connector 32 of the circuit board 30 and the metal circuit pattern layer 153 are electrically connected as described above (FIG. 5). By forming the first cutting portion CA1 on the wax layer 154 as much as possible, an antenna capable of wirelessly transmitting/receiving to the outside can be realized through the metal circuit pattern layer 153 in which the antenna pattern is implemented.

In addition, by forming the second cutting portion CA2 on the metal circuit pattern layer 153 and the wax layer 154 as in the above-described form of FIG. 3 , the light generated from the LED 61 of the circuit board 60 is The color pattern layer 140 is transmitted through the space of the second cutting part CA2 so as to be illuminated by the panel 10 , so that the color pattern layer 140 has an excellent lighting effect through the color tone and pattern applied to the panel 10 . can be implemented.

In addition, only a portion of the wax layer 154 is cut to form the third cutting portion CA3 region, and a portion of the flexible circuit board 60 is formed in the third cutting portion CA3 region to form a metal circuit pattern layer ( By making it electrically connected to the lower surface of the 153 ), a capacitive touch function can be implemented through the metal circuit pattern layer 153 .

Meanwhile, in the step (b-3) of forming the adhesive layer 151 on the upper surface of the insulating layer 152 , the adhesive layer 151 is formed on the upper surface of the insulating layer 152 with OCA (Optical Clear Adhesive) or an adhesive resin. Thus, the color pattern layer 140 and the metal circuit pattern layer assembly 150 can be bonded together, and the deposition process constituting the color pattern layer 140 and the metal circuit pattern layer due to the formation of the adhesive layer 151 Since it is possible to separate the process of configuring the assembly 150 , improvement in process efficiency can be expected.

After the color pattern layer 140 and the metal circuit pattern layer assembly 150 are all completed through the above process, the color pattern layer 140 and the metal circuit pattern layer assembly 150 are applied to the adhesive layer 151. The decoration film is finally completed by bonding them together. (c)

On the other hand, Figure 2 shows an example of use of the metal circuit wiring integrated decoration film according to the present invention, Figure 3 shows a state in which the decoration film shown in Figure 2 is mutually bonded to the panel and the circuit board.

2 to 3, the metal circuit wiring-integrated decorative film 100 according to the present invention can be applied to the operation panel 50 portion of the washing machine, the front panel 10 forming a touch-operable appearance and It can be used by attaching the decorative film 100 between the rear side circuit board 60 .

In this case, in the panel 10 , a touch area is formed in the peripheral portion where the rotary knob 20 is mounted and other portions requiring a touch input to correspond to the touch area 12 . The metal circuit pattern layer 153 of the decor film 100 is patterned to establish a connection with the circuit board 60 , so that a capacitive touch function can be implemented through the metal circuit pattern layer 153 .

Here, since the decorative film 100 forms a structure in which the color pattern layer 140 and the metal circuit pattern layer assembly 150 are bonded to each other, the color pattern layer 140 is formed on the adhesive layer 121 through the The decorative film 100 can be easily attached to the rear side of the panel 10 , and the circuit board 60 can be coupled to the rear side of the decorative film 100 to be connected to the metal circuit pattern layer 153 . .

At this time, as described above, the light generated from the LED 61 installed on the circuit board 60 on the lower side of the metal circuit pattern layer 153 and the wax layer 154 can be projected to the panel 10 side. The color pattern layer (2) is formed by forming the two cut portions CA2, and the light generated from the LED 61 passes through the color pattern layer 140 through the space of the second cut portion CA2 to be illuminated by the panel 10. An excellent lighting effect may be exhibited on the panel 10 through the colors and patterns implemented in 140 .

In addition, a third cut portion CA3 region is additionally formed in a portion of the wax layer 154 adjacent to the second cut portion CA2, and a bent portion of the flexible printed circuit board 60 is formed by the third cut portion CA3. By fixing the region to be electrically connected to the lower surface of the metal circuit pattern layer 153 , the capacitive touch function of the panel 10 can be implemented through the metal circuit pattern layer 153 .

On the other hand, Figure 4 shows another example of use of the metal circuit wiring integrated decoration film 100 according to the present invention, Figure 5 shows the appearance of the decoration film shown in Figure 4 is interconnected with the panel and the circuit board, have.

4 and 5, the metal circuit wiring integrated decoration film 100 according to the present invention can be applied to a back cover of a mobile phone to implement a wireless antenna function.

That is, it is configured by bonding the decor film 100 interposed between the main body 80 and the back cover 90 to which the mobile phone is accommodated, but the color pattern layer 140 part of the decor film 100 is made of glass. Alternatively, the metal circuit pattern layer 153 in which the antenna pattern of the metal circuit pattern layer assembly 150 is implemented is bonded to the back cover 90 part made of the transparent synthetic resin molding through the adhesive layer 121 to the body ( It may be configured to be electrically connected to the circuit board 30 installed on the 80 .

At this time, the pin connector 32 installed on the circuit board 30 and the metal circuit pattern layer 153 in which the antenna pattern is implemented are electrically connected to each other so that the pin connector 32 can be inserted into the wax layer 154 part. The first cutting part CA1 is formed so that the metal circuit pattern layer 153 and the pin connector 32 of the circuit board 30 can be electrically connected through the space of the first cutting part CA1, and through this Through the metal circuit pattern layer 153 in which the antenna pattern is implemented, wireless transmission/reception may be implemented to the outside.

As described above, in the metal circuit wiring integrated decoration film 100 of the present invention, the metal circuit pattern layer 153 forming an electrical connection with the circuit boards 30 and 60 is additionally formed under the color pattern layer 140, so that the A capacitive touch or antenna function can be implemented through the metal circuit pattern layer 153, and since the decorative film 100 is manufactured in the form of a thin film that can be bent or bent, it can be formed in a curved shape including a flat panel. It has the advantage that it can be easily attached to the panel without additional parts and used.

In addition, since the color tint layer is directly implemented on the optical base film (PET base film) through the ink thermal transfer method, etc., and the deposition layer is implemented only with the function of adjusting the reflectance and transmittance, the manufacturing process is simplified, There is an advantage in that it is possible to lower the process cost and process difficulty, and significantly shorten the manufacturing time. In addition, there is an excellent advantage that various colors or designs are possible through the color tint layer.

In the above, preferred embodiments of the present invention have been described, but the scope of the present invention is not limited to these specific embodiments, and those skilled in the art may appropriately change within the scope described in the claims of the present invention. this will be possible

10: panel 20: rotary knob
30, 60: circuit board 100: decorative film
120: color tint layer 121,131,151: adhesive layer
122: second color tint layer 123: earth layer
124: first color tint layer 130: pattern printing layer
132: optical film layer 133: pattern layer
134: deposition layer 135: printed layer
140: color pattern layer 150: metal circuit pattern layer combination
152: insulating layer 153: metal circuit pattern layer
154: wax layer

Claims (20)

In the metal circuit wiring integrated decorative film installed between the panel and the circuit board composed of tempered glass or synthetic resin,
a color pattern layer attached to the lower surface of the panel;
a metal circuit pattern layer formed on a lower surface of the color pattern layer and electrically connected to the circuit board;
A metal circuit wiring-integrated decorative film comprising a.
According to claim 1, wherein the metal circuit wiring integrated decorative film further comprising an insulating layer formed on the upper surface of the metal circuit pattern layer.
[Claim 3] The metal circuit wiring integrated decoration film according to claim 2, further comprising a wax layer formed on a lower surface of the metal circuit pattern layer.
According to claim 1, wherein the color pattern layer
a color tint layer attached to the lower surface of the panel;
Metal circuit wiring integrated decoration film, characterized in that it comprises a pattern printing layer attached to the lower surface of the color tint layer.
The method of claim 4, wherein the color tint layer,
a first color tint layer bonded to the pattern printing layer;
a base layer formed on an upper surface of the first color tint layer;
a second color tint layer formed on the upper surface of the base layer and attached to the panel;
Metal circuit wiring integrated decorative film comprising a.
According to claim 4, wherein the pattern printing layer,
an optical film layer;
a pattern layer formed on a lower surface of the optical film layer;
a deposition layer formed on a lower surface of the pattern layer;
a printed layer formed on a lower surface of the deposition layer;
Metal circuit wiring integrated decorative film comprising a.
[Claim 4] The metal circuit wiring-integrated decorative film according to claim 3, wherein the wax layer has a first cut portion cut so that the metal circuit pattern layer and the pin connector of the circuit board are electrically connected.
[4] The decorative film of claim 3, wherein the metal circuit pattern layer and the wax layer are formed with a second cutting part cut so that the light generated from the LED installed on the circuit board can be projected to the panel.
The third cutting according to claim 3, wherein the circuit board is a flexible printed circuit board (FPCB), and a portion of the flexible printed circuit board is cut in the wax layer to be electrically connected to a lower surface of the metal circuit pattern layer. Metal circuit wiring integrated decorative film, characterized in that the addition is formed.
10. The method of claim 9, wherein the flexible circuit board is a metal circuit wiring integrated decorative film, characterized in that the integrated through the ACF (Anisotropic Conductive Film) or ACP (Activated Carbon Powder) bonding to the lower surface of the metal circuit pattern layer.
In the metal circuit wiring integrated decoration film manufacturing method installed between a panel and a circuit board composed of tempered glass or synthetic resin,
(a) forming a color pattern layer to be attached to the lower surface of the panel;
(b) forming a metal circuit pattern layer for electrical connection with the circuit board;
(c) bonding the color pattern layer and the metal circuit pattern layer;
Metal circuit wiring integrated decoration film manufacturing method comprising a.
The method of claim 11, wherein the step (b) further comprises the step (b-1) of forming an insulating layer on the upper surface of the metal circuit pattern layer.
[13] The method of claim 12, wherein the step (b) further comprises the step (b-2) of forming a wax layer on the lower surface of the metal circuit pattern layer.
The method of claim 11, wherein (a) step,
forming a color tint layer to be attached to the lower surface of the panel (a-1);
forming a pattern printing layer to be attached to the lower surface of the color tint layer (a-2);
bonding the color tint layer and the pattern printing layer (a-3);
Metal circuit wiring integrated decoration film manufacturing method comprising a.
15. The method of claim 14, wherein the step (a-1),
forming a first color tint layer (a-1-1);
forming a base layer on an upper surface of the first color tint layer (a-1-2);
forming a second color tint layer on the upper surface of the base layer (a-1-3);
Metal circuit wiring integrated decoration film manufacturing method comprising a.
5. The method of claim 4, wherein the step (a-2) comprises:
forming an optical film layer (a-2-1);
forming a pattern layer on the lower surface of the optical film layer (a-2-2);
forming a deposition layer on the lower surface of the pattern layer (a-2-3);
forming a printed layer on the lower surface of the deposition layer (a-2-4);
Metal circuit wiring integrated decoration film manufacturing method comprising a.
14. The metal circuit wiring of claim 13, wherein in the step (b-2), a first cut region for electrical connection between the metal circuit pattern layer and the pin connector of the circuit board is formed in the wax layer. All-in-one decorative film manufacturing method.
14. The metal according to claim 13, wherein in the step (b-2), a second cut-out region is formed on the metal circuit pattern layer and the wax layer through which the light generated from the LED installed on the circuit board can be projected. Circuit wiring integrated decoration film manufacturing method.
[Claim 14] The method of claim 13, wherein in the step (b-2), a third cut-out region for electrical connection between the flexible circuit board and the metal circuit pattern layer is formed on the wax layer. .
20. The metal of claim 19, wherein the flexible circuit board is integrally bonded to the lower surface of the metal circuit pattern layer in the third cut-out region through an anisotropic conductive film (ACF) or activated carbon powder (ACP). Circuit wiring integrated decoration film manufacturing method.

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