KR20210115192A - Electronic device including antenna and grip sensor - Google Patents

Abstract

According to various embodiments, an electronic device comprises: a housing including at least one non-conductive part and conductive part; at least one substrate disposed in an inner space of the housing; a conductive pattern disposed in the inner space and electrically connected to the conductive part; a wireless communication circuit disposed on the at least one substrate and transmitting and/or receiving a wireless signal through the conductive part and the conductive pattern; and a grip sensor circuit disposed in the inner space and electrically connected to the conductive part through the conductive pattern. Various other embodiments may be possible.

Description

ELECTRONIC DEVICE INCLUDING ANTENNA AND GRIP SENSOR

Various embodiments of the present invention relate to an electronic device including an antenna and a grip sensor.

Electronic devices are becoming slimmer to secure competitiveness with other manufacturers, and are being developed to increase rigidity of electronic devices, strengthen design aspects, and differentiate functional elements thereof.

The electronic device may include an antenna operating in at least one designated frequency band using a conductive portion disposed on at least a portion of a side frame connected to a wireless communication circuit. The electronic device may sense a user's grip through a change in capacitance by using a grip sensor circuit disposed therein.

As for the antennas used in the electronic device, the volume and number of antennas to be mounted may be determined according to the frequency, bandwidth, and type of each service. For example, by region around the world, the main communication bands are the low band of about 700 MHz to 900 MHz, the mid band of about 1700 MHz to 2100 MHz, the high band of about 2300 MHz to 2700 MHz, or the high-frequency band of about 3 GHz to 100 GHz. can be used as As another example, various wireless communication services such as bluetooth (BT), global positioning system (GPS), or wireless fidelity (WIFI) may be used. In order to support the above-described communication bands, a plurality of antennas are required, whereas an electronic device may have a relatively insufficient space for disposing of antennas due to a gradually widening display. To overcome this, the electronic device includes at least one conductive portion in which at least a portion of the conductive side frame is electrically segmented through at least one non-conductive portion (segmentation portion) and is electrically connected to a wireless communication circuit, thereby serving as an antenna. can do.

Meanwhile, since the conductive part is electrically connected to a grip sensor circuit disposed therein, it may be used as a grip detection element of the electronic device by a user. In this case, the electronic device detects the gripping of the electronic device by the user and adjusts the intensity of transmission/reception power of the antenna in order to reduce a specific absorption rate (SAR) (eg, electromagnetic wave absorption rate) on the human body according to a change in the state of the electronic device. can be adjusted

However, an electrical wiring path separately disposed for grip sensing on a substrate near the antenna may act as a cause of parasitic resonance affecting the resonance frequency of the antenna, thereby reducing radiation performance of the antenna. In addition, when the grip sensing by the user uses the conductive part included in the side frame, since it is concentrated only on the side grip, it may be vulnerable to the rear side sensing.

According to various embodiments of the present disclosure, it is possible to provide an electronic device including an antenna and a grip sensor that can help improve the radiation performance of the antenna.

According to various embodiments, an electronic device includes a housing including at least one non-conductive portion and a conductive portion, at least one substrate disposed in an inner space of the housing, and disposed in the inner space, the conductive portion and a conductive pattern electrically connected, disposed on the at least one substrate, disposed in the internal space and a wireless communication circuit configured to transmit and/or receive a wireless signal through the conductive portion and the conductive pattern, and the conductive pattern It may include a grip sensor circuit electrically connected to the conductive part through the .

According to various embodiments, the electronic device at least partially surrounds a front plate, a rear plate facing in a direction opposite to the front plate, and a space between the front plate and the rear plate, and electrically through at least one non-conductive portion A housing including a side frame including a conductive portion disposed to be separated, a substrate disposed in the space, a dielectric structure disposed in the space and comprising a conductive pattern electrically connected to the conductive portion, the substrate; a wireless communication circuit configured to transmit and/or receive a wireless signal through the conductive portion and the conductive pattern, and a grip sensor circuit disposed on the substrate and electrically connected to the conductive portion through the conductive pattern; may include

According to exemplary embodiments of the present invention, by separating the electrical connection path of the grip sensor circuit from the feeding path of the antenna, it is possible to help improve the radiation performance of the antenna. In addition, a grip sensing function through side and rear sensing may be improved.

In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.
1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;
2A is a perspective view of an electronic device according to various embodiments of the present disclosure;
2B is a rear perspective view of an electronic device according to various embodiments of the present disclosure;
3 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;
4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;
5 is a perspective view of an electronic device to which a dielectric structure is coupled according to various embodiments of the present disclosure;
6A and 6B are perspective views illustrating front and rear views of a dielectric structure according to various embodiments of the present disclosure;
6C is a configuration diagram of a flexible printed circuit board (FPCB) including a plurality of conductive patterns according to various embodiments of the present disclosure;
7 is a partial configuration diagram of an electronic device illustrating a state in which conductive parts are electrically connected through a substrate and a dielectric structure according to various embodiments of the present disclosure;
8 is a graph comparing radiation performance of an antenna when an electrical connection structure between a conductive part and a grip sensor circuit is disposed on a substrate and a dielectric structure according to various embodiments of the present disclosure;
9 and 10A are partial configuration views of an electronic device illustrating a state in which conductive portions are electrically connected through conductive patterns of a substrate and a dielectric structure according to various embodiments of the present disclosure;
10B is a diagram illustrating the configuration of the variable circuit of FIG. 10A according to various embodiments of the present disclosure.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present disclosure.

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 . According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or in conjunction with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 may be, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input device 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 155 may output a sound signal to the outside of the electronic device 101 . The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display device 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. According to an embodiment, the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. .

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) connected directly or wirelessly with the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used for the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 388 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct, or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, or It may communicate with an external electronic device via a computer network (eg, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified and authenticated.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network such as the first network 198 or the second network 199 is selected from a plurality of antennas by, for example, the communication module 190 . can be A signal or power may be transmitted or received between the communication module 190 and an external electronic device through at least one selected antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as a part of the antenna module 197 .

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the electronic devices 102 and 104 may be the same or a different type of the electronic device 101 . According to an embodiment, all or part of the operations performed by the electronic device 101 may be executed by one or more of the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. The one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology This can be used.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable antenna module (eg, a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

It should be understood that the various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C," "at least one of A, B and C," and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit. A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of one or more instructions stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the at least one command called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product). Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store™) or on two user devices (eg, It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

2A is a perspective view of a front side of an electronic device 200 according to various embodiments of the present disclosure. FIG. 2B is a perspective view of a rear surface of the electronic device 200 of FIG. 2A according to various embodiments of the present disclosure.

The electronic device 200 of FIGS. 2A and 2B may be at least partially similar to the electronic device 101 of FIG. 1 , or may include other embodiments of the electronic device.

Referring to FIGS. 2A and 2B , the electronic device 200 according to an embodiment includes a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a first surface 210A. and a housing 210 including a side surface 210C surrounding the space between the second surfaces 210B. In another embodiment (not shown), the housing 210 may refer to a structure that forms part of the first surface 210A, the second surface 210B, and the side surface 210C of FIG. 1 . According to one embodiment, the first surface 210A may be formed by a front plate 202 (eg, a glass plate including various coating layers, or a polymer plate) that is at least partially transparent. The second surface 210B may be formed by a substantially opaque back plate 211 . The back plate 211 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. can be The side surface 210C is coupled to the front plate 202 and the rear plate 211 and may be formed by a side bezel structure (or “side member”) 218 including a metal and/or a polymer. In some embodiments, the back plate 211 and the side bezel structure 218 are integrally formed and may include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 202 has a first area 210D that extends seamlessly by bending from the first surface 210A toward the rear plate, the long edge of the front plate 210D. edge) can be included at both ends. In the illustrated embodiment (see FIG. 2B ), the rear plate 211 may include a second region 210E that extends seamlessly from the second surface 210B toward the front plate at both ends of the long edge. have. In some embodiments, the front plate 202 or the back plate 211 may include only one of the first region 210D or the second region 210E. In some embodiments, the front plate 202 does not include the first region and the second region, but may include only a flat plane disposed parallel to the second surface 210B. In the above embodiments, when viewed from the side of the electronic device, the side bezel structure 218 has a first thickness ( or width), and may have a second thickness thinner than the first thickness at the side surface including the first area or the second area.

According to an embodiment, the electronic device 200 includes the display 201 , the input device 203 , the sound output devices 207 and 214 , the sensor modules 204 and 219 , and the camera modules 205 , 212 and 213 . , a key input device 217 , an indicator (not shown), and a connector 208 . In some embodiments, the electronic device 200 may omit at least one of the components (eg, the key input device 217 or the indicator) or additionally include other components.

The display 201 may be exposed through a substantial portion of the front plate 202 , for example. In some embodiments, at least a portion of the display 201 may be exposed through the front plate 202 forming the first area 210D of the first surface 210A and the side surface 210C. The display 201 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. In some embodiments, at least a portion of the sensor module 204 , 219 , and/or at least a portion of a key input device 217 is located in the first area 210D, and/or the second area 210E. can be placed.

The input device 203 may include a microphone 203 . In some embodiments, the input device 203 may include a plurality of microphones 203 arranged to sense the direction of the sound. The sound output devices 207 and 214 may include speakers 207 and 214 . The speakers 207 and 214 may include an external speaker 207 and a receiver 214 for a call. In some embodiments, the microphone 203 , the speakers 207 , 214 , and the connector 208 are disposed in the space of the electronic device 200 , and are exposed to the external environment through at least one hole formed in the housing 210 . can be In some embodiments, the hole formed in the housing 210 may be used in common for the microphone 203 and the speakers 207 and 214 . In some embodiments, the sound output devices 207 and 214 may include a speaker (eg, a piezo speaker) that operates while excluding a hole formed in the housing 210 .

The sensor modules 204 and 219 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 200 or an external environmental state. The sensor modules 204 and 219 are, for example, a first sensor module 204 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the first surface 210A of the housing 210 . ) (eg, a fingerprint sensor), and/or a third sensor module 219 (eg, an HRM sensor) disposed on the second surface 210B of the housing 210 . The fingerprint sensor may be disposed on the first surface 210A of the housing 210 . A fingerprint sensor (eg, an ultrasonic fingerprint sensor or an optical fingerprint sensor) may be disposed under the display 201 of the first surface 210A. The electronic device 200 may include a sensor module (not shown), for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor 204 .

The camera modules 205 , 212 , and 213 include a first camera device 205 disposed on the first side 210A of the electronic device 200 , and a second camera device 212 disposed on the second side 210B of the electronic device 200 . ), and/or a flash 213 . The camera modules 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200 .

The key input device 217 may be disposed on the side surface 210C of the housing 210 . In another embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 217 and the not included key input devices 217 may be displayed on the display 201 as soft keys or the like. It may be implemented in other forms. In another embodiment, the key input device 217 may be implemented using a pressure sensor included in the display 201 .

The indicator may be disposed, for example, on the first surface 210A of the housing 210 . The indicator may provide, for example, state information of the electronic device 200 in the form of light. In another embodiment, the light emitting device may provide, for example, a light source that is interlocked with the operation of the camera module 205 . Indicators may include, for example, LEDs, IR LEDs and xenon lamps.

The connector hole 208 includes a first connector hole 208 that can accommodate a connector (eg, a USB connector or an interface connector port module (IF) module) for transmitting and receiving power and/or data with an external electronic device; and/or a second connector hole (or earphone jack) (not shown) capable of accommodating a connector for transmitting/receiving an audio signal to/from an external electronic device.

Some of the camera modules 205 and 212 , some of the camera modules 205 , and some of the sensor modules 204 and 219 , 204 or indicators may be disposed to be exposed through the display 201 . For example, the camera module 205 , the sensor module 204 , or the indicator is disposed so as to be in contact with the external environment through the opening perforated to the front plate 202 of the display 201 in the internal space of the electronic device 200 . can be In another embodiment, some sensor modules 204 may be arranged to perform their functions without being visually exposed through the front plate 202 in the internal space of the electronic device. For example, in this case, the area of the display 201 facing the sensor module may not need a perforated opening.

3 is an exploded perspective view of an electronic device 300 according to various embodiments of the present disclosure.

The electronic device 300 of FIG. 3 may be at least partially similar to the electronic device 101 of FIG. 1 or the electronic device 200 of FIGS. 2A and 2B , or may include another embodiment of the electronic device.

Referring to FIG. 3 , the electronic device 300 (eg, the electronic device 200 of FIG. 2A ) includes a side member 310 (eg, a side bezel structure), a first support member 311 (eg, a bracket or support structure), a front plate 320 (eg, a front cover), a display 330 , a printed circuit board 340 , a battery 350 , a second support member 360 (eg, a rear case), an antenna 370 . ), and a rear plate 380 (eg, a rear cover). In some embodiments, the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360 ) or additionally include other components. . At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 200 of FIGS. 2A and 2B , and overlapping descriptions will be omitted below.

The first support member 311 may be disposed inside the electronic device 300 and connected to the side member 310 , or may be integrally formed with the side member 310 . The first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The first support member 311 may have a display 330 coupled to one surface and a printed circuit board 340 coupled to the other surface. The printed circuit board 340 may be equipped with a processor, memory, and/or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

Memory may include, for example, volatile memory or non-volatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 350 is a device for supplying power to at least one component of the electronic device 300 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 300 . In another embodiment, the battery 350 may be detachably disposed from the electronic device 300 .

The antenna 370 may be disposed between the rear plate 380 and the battery 350 . The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a part of the side bezel structure 310 and/or the first support member 311 or a combination thereof.

4 is an exploded perspective view of an electronic device 400 according to various embodiments of the present disclosure. 5 is a perspective view of an electronic device 400 to which a dielectric structure 460 is coupled according to various embodiments of the present disclosure. 5 may be a perspective view of the electronic device 400 from which the rear plate 450 is removed.

The electronic device 400 of FIGS. 4 and 5 is at least partially similar to the electronic device 101 of FIG. 1 , the electronic device 200 of FIG. 2A , or the electronic device 300 of FIG. 3 , or another embodiment of the electronic device may include more.

Referring to FIGS. 4 and 5 , the electronic device 400 (eg, the electronic device 300 of FIG. 3 ) has a front plate 440 facing the first direction (the direction ①) (eg, the Z-axis direction of FIG. 3 ). ) (for example, the front plate 320, the front cover of FIG. 3), the rear plate facing the second direction (② direction) opposite to the first direction (① direction) (eg - Z-axis direction in FIG. 3) ( 450) (eg, the rear plate 380 of FIG. 3 , the rear cover), and a side frame 410 surrounding the inner space 4001 between the front plate 440 and the rear plate 450 (eg, in FIG. 3 ). The side member 310, the side bezel structure), the display 441 (eg, the display 330 of FIG. 3 ) disposed to be visible from the outside at least partially through the front plate 440 in the interior space 4001; The substrate 420 (eg, the printed circuit board 340 of FIG. 3 ) and/or at least one conductive pattern 461 , 462 , and 463 disposed in the internal space 4001 of the electronic device 400 may be included. have. According to an embodiment, the at least one conductive pattern 461 , 462 , and 463 may be disposed on a dielectric structure 460 (eg, an antenna carrier) disposed in the internal space 4001 of the electronic device 400 . According to one embodiment, the dielectric structure 460 may include an antenna carrier and/or a structure (eg, a speaker enclosure) including electronic components (eg, a speaker module). In some embodiments, at least one conductive pattern 461 , 462 , and 463 may be disposed on the back plate 450 . In some embodiments, the at least one conductive pattern 461 , 462 , and 463 may be disposed on an inner surface of the rear plate 450 facing the internal space 4001 of the electronic device 400 . In this case, the at least one conductive pattern 461 , 462 , and 463 may be disposed in the form of a laser direct structuring (LDS) pattern and/or a flexible printed circuit board (FPCB). In some embodiments, the at least one conductive pattern 461 , 462 , and 463 may be embedded in the back plate 450 in an ejected manner. In some embodiments, at least one conductive pattern 461 , 462 , and 463 may be disposed on the outer surface of the back plate 450 . In this case, the at least one conductive pattern 461 , 462 , and 463 may be used as a decorative member. As another example, when the at least one conductive pattern 461 , 462 , and 463 is formed of an FPCB, it may be positioned to be supported by a component included in the electronic device. According to one embodiment, the electronic device 400 has a housing structure (eg, the housing 210 of FIG. 2A ) having an inner space 4001 through the front plate 440 , the rear plate 450 , and the side frame 410 . ) may be included. According to an embodiment, when viewed in the second direction (direction ②), the dielectric structure 460 may be disposed to at least partially overlap the substrate 420 in the inner space 4001 .

According to various embodiments, the side frame 410 includes a first side 411 having a first length, a second side 412 extending in a vertical direction from one end of the first side 411 , and a second side 412 having a second length. ), extending from the second side 412 in a direction parallel to the first side 411 and having a first length from the third side 413 and/or the third side 413 to the first side 411 It extends to the other end of the , and may include a fourth side 414 having a second length. According to one embodiment, the first length may be formed to be shorter than the second length. In some embodiments, the second length may be shorter than the first length. According to an embodiment, the side frame 410 may include a support plate 4101 (eg, the first support member 311 of FIG. 3 ) extending into the inner space of the electronic device 400 . According to an embodiment, the support plate 4101 is formed in such a way that it extends with at least one side of the first side 411 , the second side 412 , the third side 413 , or the fourth side 414 . can be According to an embodiment, the support plate 4101 is a support structure for supporting at least one electronic component (eg, the substrate 420 , the display 441 , or the dielectric structure 460 ) disposed in the inner space 4001 . can have In some embodiments, the support plate 4101 is provided separately and structurally with at least one side of the first side 411 , the second side 412 , the third side 413 , or the fourth side 414 . It may also be arranged through bonding. According to one embodiment, the side frame 410 may be formed of a metal material (eg, aluminum). In some embodiments, the side frame 410 may further include, at least partially, a polymer that is injected (insert injection or double injection) into a metal material.

According to various embodiments, the side frame 410, on the first side 411, is formed to be electrically disconnected through at least one non-conductive portion 4112, 4113 (eg, polymer injection molding) conductive portion 4111 may include. According to one embodiment, the side frame 410 is, on the first side 411, a conductive formed through the first non-conductive portion 4112 and/or the second non-conductive portion 4113 spaced apart at a predetermined interval. portion 4111 . According to one embodiment, the conductive portion 4111 is a wireless communication circuit mounted on a substrate 420 disposed in the internal space 4001 of the electronic device 400 (eg, the wireless communication circuit 470 of FIG. 7 ) ( Example: By being electrically connected to the wireless communication module 192 of FIG. 1 ), it may be used as the first antenna A1 operating in a specified frequency band (eg, about 700 MHz to 3000 MHz band). In some embodiments, the electronic device 400 is conductively formed to be segmented through at least one non-conductive portion on at least one of the second side 412 , the third side 413 , or the fourth side 414 . It may include at least one additional antenna operating through the part. In some embodiments, an additional antenna operating through a conductive portion formed using two neighboring sides of the first side 411 , the second side 412 , the third side 413 , or the fourth side 414 is provided. may include

According to various embodiments, the electronic device 400 may include another substrate 430 (eg, a main substrate or a sub-substrate) spaced apart from the substrate 420 in the internal space 4001 . According to an embodiment, another substrate 430 may be electrically connected to the substrate 420 through an electrical connection member 415 . According to an embodiment, the electrical connection member 415 may include an RF coaxial cable or a flexible printed circuit board (FRC) type RF cable. According to an embodiment, the electronic device 400 is disposed in the inner space 4001 and further includes a bracket 431 (eg, the second support member 360 of FIG. 3 ) for protecting or supporting electronic components. may include

According to various embodiments, the electronic device 400 includes a dielectric structure 460 (eg, an antenna carrier) disposed to at least partially overlap the substrate 420 when the front plate 440 is viewed from above. ) may be included. According to an embodiment, the dielectric structure 460 may include at least one conductive pattern 461 , 462 , and 463 . According to an embodiment, the at least one conductive pattern 461 , 462 , 463 may include a first conductive pattern 461 , a second conductive pattern 462 , and/or a third conductive pattern 463 spaced apart from each other at a predetermined interval. may include. In some embodiments, the at least one conductive pattern 461 , 462 , and 463 may include one conductive pattern or four or more conductive patterns in consideration of an arrangement space of the dielectric structure 460 . According to an embodiment, the first conductive pattern 461 may include a conductive portion 4111 of the side frame 410 and a grip sensor circuit mounted on the substrate 420 (eg, the grip sensor circuit 480 of FIG. 7 ). (eg, the sensor module 176 of FIG. 1 ) may be electrically connected. According to an embodiment, the first conductive pattern 461 is electrically connected to a wireless communication circuit (eg, the wireless communication circuit 470 of FIG. 7 ), and may be used as a radiator or a matching pattern of the first antenna A1 . have. For example, as the bandwidth of the first antenna A1 is increased in the operating frequency band or the operating frequency band is shifted to a designated frequency band through the first conductive pattern 461, the radiation performance of the first antenna A1 is improved can help According to one embodiment, the second conductive pattern 462 may be used as the second antenna A2 by being electrically connected to the wireless communication circuit (eg, the wireless communication circuit 470 of FIG. 7 ) of the substrate 420 . have. According to one embodiment, the third conductive pattern 463 may be used as the third antenna A3 by being electrically connected to the wireless communication circuit (eg, the wireless communication circuit 470 of FIG. 7 ) of the substrate 420 . have. According to an embodiment, at least the first conductive pattern 461 is disposed to face the rear plate 450 in the dielectric structure 460 , so that the rear grip of the electronic device 400 may be detected. According to an embodiment, the location of the first conductive pattern 461 may be determined in the internal space 4001 of the electronic device 400 so that the user's right hand grip or left hand grip may be detected. According to an embodiment, the position of the first conductive pattern 461 may be determined in the dielectric structure 460 to detect the user's right hand grip or left hand grip. In some embodiments, the second conductive pattern 462 and/or the third conductive pattern 463 are located in the dielectric structure 460 , without facing the back plate 450 , at various locations favorable to antenna radiation characteristics (eg, : in a position facing the side and/or front plate). According to an embodiment, the at least one conductive pattern 461 , 462 , and 463 is a flexible substrate including a laser direct structuring (LDS) pattern formed on the dielectric structure 460 and a conductive pattern attached to the dielectric structure 460 . It may include at least one of a thin conductive plate attached to a flexible printed circuit board (FPCB) or the dielectric structure 460 through bonding, taping, or fusion (eg, ultrasonic fusion or thermal fusion). In some embodiments, the at least one conductive pattern 461 , 462 , and 463 may be embedded in the dielectric structure 460 made of a polymer material through insert injection. In some embodiments, dielectric structure 460 may house at least one other electronic component. For example, dielectric structure 460 may at least partially include speaker assembly 465 .

According to an exemplary embodiment of the present invention, the conductive portion 4111 used as the antenna A1 of the side frame 410 and the grip sensor circuit of the substrate 420 (eg, the grip sensor circuit 480 of FIG. 7 )) Since the first conductive pattern 461 disposed on the dielectric structure 460 and not on the substrate 420 and used as an additional antenna radiator for the conductive portion 4111 is used as a conductive connection means for connecting the substrates, the substrate An efficient component placement design of 420 may be possible. As another example, since the first conductive pattern 461 is disposed in the direction toward the rear plate 450 (direction ②), the operation of the electronic device 400 because the side grip and the rear grip according to the user's grip are simultaneously detected. It can help improve reliability.

6A and 6B are perspective views illustrating a front surface (eg, a first surface 4601 ) and a rear surface (eg, a second surface 4602 ) of a dielectric structure 460 according to various embodiments of the present disclosure.

Referring to FIGS. 6A and 6B , the dielectric structure 460 has a first surface 4601 and a first surface (eg, facing the direction ②) facing the rear plate (eg, the rear plate 450 of FIG. 5 ). 4601 ) and may include a second surface 4602 facing (eg, facing the direction ①) opposite the front plate (eg, the front plate 440 of FIG. 5 ). According to an embodiment, when the dielectric structure 460 is disposed in the internal space (eg, the internal space 4001 of FIG. 4 ) of the electronic device (eg, the electronic device 400 of FIG. 4 ), the first surface 4601 may be disposed to face the back plate (eg, the back plate 450 of FIG. 4 ), and the second surface 4602 may be disposed to face the substrate (eg, the substrate 420 of FIG. 4 ). According to an embodiment, the dielectric structure 460 may include at least one conductive pattern 461 , 462 , and 463 disposed on the first surface 4601 . According to an embodiment, the at least one conductive pattern 461 , 462 , 463 may include a first conductive pattern 461 , a second conductive pattern 462 , or a third conductive pattern 463 spaced apart from each other at a specified interval. can According to one embodiment, one end 4611 of the first conductive pattern 461 penetrates from the first surface 4601 to the second surface 4602 and is disposed on the second surface 4602 of the first connection part 4612 . can be electrically connected to. According to an embodiment, the other end 4613 of the first conductive pattern 461 penetrates from the first surface 4601 to the second surface 4602 , and the second connection part 4614 is disposed on the second surface 4602 . ) can be electrically connected to. According to one embodiment, one end 4611 of the first conductive pattern 461 penetrates from the first surface 4601 of the dielectric structure 460 to the first connection part 4612 of the second surface 4602. It may be electrically connected to the first connection part 4612 through a connected conductive via. According to one embodiment, the other end 4613 of the first conductive pattern 461 penetrates from the first surface 4601 of the dielectric structure 460 to the second connection portion 4614 of the second surface 4602. It may be electrically connected to the second connection part 4614 through a connected conductive via. In some embodiments, the first conductive pattern 461 has one end 4611 and/or the other end 4613 detoured laterally from the first surface 4601 of the dielectric structure 460 to form the second surface 4602 of the dielectric structure 460 . It may include a first connection portion 4612 and/or a second connection portion 4614 formed by extending to a designated position. In some embodiments, the first conductive pattern 461 is such that one end 4611 and the other end 4613 penetrate from the first surface 4601 of the dielectric structure 460 to a designated position of the second surface 4602 . It may include a first connecting portion 4612 and a second connecting portion 4614 formed by extending (eg, by injection). According to one embodiment, the dielectric structure 460 is disposed in an internal space (eg, the internal space 4001 of FIG. 4 ) of the electronic device (eg, the electronic device 400 of FIG. 4 ), and has at least one electrical connection Through the member, the first connection part 4612 is electrically connected to the conductive part (eg, the conductive part 4111 of FIG. 4 ) of the side frame (eg, the side frame 410 in FIG. 4 ), and the second connection part (eg, the conductive part 4111 in FIG. 4 ) 4614 ) may be electrically connected to a grip sensor circuit (eg, the grip sensor circuit 480 of FIG. 7 ). According to one embodiment, the at least one electrical connection member may include a C-clip, an electrical connector, a conductive tape or a pogo pin.

According to various embodiments, the second conductive pattern 462 may also be electrically connected to the third connection part 4621 formed on the second surface 4602 in a manner similar to that described above. According to one embodiment, in the second conductive pattern 462 , the dielectric structure 460 is formed in an internal space (eg, the internal space 4001 of FIG. 4 ) of the electronic device (eg, the electronic device 400 of FIG. 4 ). When disposed in the second antenna (eg, the third connection part 4621 is electrically connected to the wireless communication circuit (eg, the wireless communication circuit 470 of FIG. 7 ) of the substrate (eg, the substrate 420 of FIG. 4 ) A2) can be operated. According to an embodiment, the third conductive pattern 463 may also be electrically connected to the fourth connection part 4631 formed on the second surface 4602 in a similar manner as described above. According to one embodiment, in the third conductive pattern 463 , the dielectric structure 460 is formed in an internal space (eg, the internal space 4001 of FIG. 4 ) of the electronic device (eg, the electronic device 400 of FIG. 4 ). When disposed in the third antenna (eg, the fourth connector 4631 is electrically connected to the wireless communication circuit (eg, the wireless communication circuit 470 of FIG. 7 ) of the substrate (eg, the substrate 420 of FIG. 4 ) A3) can be operated.

6C is a configuration diagram of a flexible printed circuit board (FPCB) 560 including a plurality of conductive patterns 561 , 562 , and 563 according to various embodiments of the present disclosure.

Referring to FIG. 6C , an electronic device (eg, the electronic device 400 of FIG. 4 ) according to an exemplary embodiment of the present invention includes a flexible substrate 560 including a plurality of conductive patterns 561 , 562 , and 563 . ) (eg, a dielectric substrate or a dielectric film). According to an embodiment, the flexible substrate 560 may include a first conductive pattern 561 , a second conductive pattern 562 , and/or a third conductive pattern 563 spaced apart from each other by a predetermined interval. According to one embodiment, the flexible substrate 560 includes a first connection part 5601 electrically connected to the first conductive pattern 561 and/or a second connection part 5602 electrically connected to the second conductive pattern 562 . may include According to an embodiment, the first conductive pattern 561 may be formed through the first connection part 5601 of the side frame (eg, the side frame of FIG. 4 ) of the electronic device (eg, the electronic device 400 of FIG. 4 ). 410) and electrically connected to a conductive portion (eg, conductive portion 4111 in FIG. 4) used as a first antenna (eg, first antenna A1 in FIG. 4), so that the first antenna may be used as additional emitters and/or matching patterns of

According to an embodiment, the second conductive pattern 562 and/or the third conductive pattern 563 are electrically connected to a wireless communication circuit (eg, the wireless communication circuit 470 of FIG. 7 ) to thereby be electrically connected to the second antenna A2. ) and/or as the third antenna (A3). In some embodiments, the second conductive pattern 562 is electrically connected to another conductive portion used as another antenna of a side frame (eg, side frame 410 in FIG. 4A ) through the second connection portion 5602 . As connected, they may be used as additional emitters and/or matching patterns. According to one embodiment, the first connection portion 5601 and/or the second connection portion 5602 are electrically connected to the side frame (eg, the side frame 410 of FIG. 4 ) via C clips, conductive tape or screws, or It can be physically connected.

According to various embodiments, the first connection unit 5601 may be electrically connected to a wireless communication circuit (eg, the wireless communication circuit 470 of FIG. 7 ) through a first electrical path 5701 . According to an embodiment, the electronic device (eg, the electronic device 400 of FIG. 4 ) may include at least one electrical element 570 disposed in the first electrical path 5701 . According to an embodiment, the at least one electrical element 570 may include a matching circuit, an electric shock protection circuit, and/or a tunable IC.

According to various embodiments, one end 5611 of the first conductive pattern 561 may be electrically connected to a grip sensor circuit (eg, the grip sensor circuit 480 of FIG. 7 ). In some embodiments, one end 5621 of the second conductive pattern 562 and/or one end 5631 of the third conductive pattern 563 are also connected to a grip sensor circuit (eg, the grip sensor circuit 480 of FIG. 7 ). By being electrically connected, a grip sensing function may be performed. For example, the electronic device (eg, the electronic device 400 of FIG. 4 ) has a grip sensing function through the first conductive pattern 561 , the second conductive pattern 562 , and/or the third conductive pattern 563 . can be improved

FIG. 7 is a partial configuration diagram of an electronic device 400 illustrating a state in which a conductive portion 4111 is electrically connected through a substrate 420 and a dielectric structure 460 according to various embodiments of the present disclosure.

Referring to FIG. 7 , the electronic device 400 is disposed in a side frame 410 including a conductive portion 4111 on a first side 411 , and an internal space 4001 of the electronic device 400 , and performs wireless communication. a substrate 420 including circuitry 470 and grip sensor circuitry 480 and/or a dielectric structure 460 including a conductive pattern 461 (eg, first conductive pattern 461 in FIG. 4 ). can do. According to an embodiment, the conductive portion 4111 may be formed through the first non-conductive portion 4112 and the second non-conductive portion 4113 spaced apart from the first side 411 . According to one embodiment, the side frame 410 is spaced apart from the first connection piece 4114 and the first connection piece 4114 extending in the direction of the inner space 4001 in the conductive portion 4111 at a specified interval. A second connection piece 4115 may be included. According to one embodiment, the first connection piece 4114 may be electrically connected to the wireless communication circuit 470 of the substrate 420 and one end 4611 of the first conductive pattern 461 of the dielectric structure 460 . . According to an embodiment, the second connection piece 4115 may be electrically connected to the ground GND of the substrate 420 .

According to various embodiments, the substrate 420 includes a first conductive pad 4201 electrically connected to the first connection piece 4114 and a second conductive pad 4202 electrically connected to the second connection piece 4115 . and/or a third conductive pad 4203 electrically connected to the grip sensor circuit 480 . According to an embodiment, the first conductive pad 4201 may be electrically connected to the wireless communication circuit 470 through a first electrical path 4701 (eg, an electrical wire) in the substrate 420 . According to an embodiment, the second conductive pad 4202 may be electrically connected to the ground GND through a second electrical path 4702 (eg, an electric wire) in the substrate 420 . According to an embodiment, the third conductive pad 4203 may be electrically connected to the grip sensor circuit 480 through the third electrical path 4703 on the substrate 420 . According to an embodiment, at least one matching circuit 471 disposed for impedance matching of the antenna A1 may be included in the first electrical path 4701 . According to an embodiment, in the first electrical path 4701 , the substrate 420 is directly electrically connected to the conductive portion 4111 of the first side 411 forming at least a part of the exterior of the electronic device 400 . , may further include at least one electric shock prevention circuit 472 disposed to prevent electric shock and discharge static electricity (ESD). According to an embodiment, the electronic device 400 may include a passive element 481 disposed in the third electrical path 4703 . According to one embodiment, the passive element 481 may include an inductor having a specified inductance value (eg, about 120nH). Accordingly, the third electrical path 4703 may be configured to appear open from an RF transmission perspective through the passive element 481 .

According to various embodiments, one end 4611 of the first conductive pattern 461 of the dielectric structure 460 is electrically connected to the first conductive pad 4201 only by an operation of being superimposed on the substrate 420, and the other end ( 4613 may be electrically connected to the third conductive pad 4203 . Accordingly, the conductive portion 4111 is electrically connected to the wireless communication circuit 470 to operate as the antenna A1, and at the same time, because it is also electrically connected to the grip sensor circuit 480, a grip sensing function can be performed. . In some embodiments, the third conductive pad 4203 may be disposed adjacent to the grip sensor circuit 480 without a third electrical path 4703 , or formed as part of an extended conductive connection of the grip sensor circuit 480 . have. For example, the third conductive pad 4203 may be connected to the grip sensor circuit 480 through an electrical connection member without the third electrical path 4703 . According to an embodiment, the first conductive pattern 461 is disposed to face the rear plate (eg, the rear plate 450 of FIG. 4 ) of the electronic device 400 , thereby holding the rear surface together with the conductive part 4111 . It can perform a grip sensing function for For example, the grip sensor circuit 480 detects a user's grip on the electronic device 400 through the conductive portion 4111 and/or the first conductive pattern 461 (eg, detects a change in capacitance according to the grip) detected) and may provide the corresponding detection information to the processor 490 of the electronic device 400 . As an embodiment, the processor 490 of the electronic device 400 may reduce the SAR on the human body by lowering the transmission/reception power of the antenna A1 based on the received detection information.

According to various embodiments, the electrical connection between the first conductive pad 4201 and the first connection piece 4114 , the electrical connection between the second conductive pad 4202 and the second connection piece 4115 , and the dielectric structure 460 . Electrical connection between the first connection part (eg, the first connection part 4612 of FIG. 6B ) and the first conductive pad 4201 or the second connection part of the dielectric structure 460 (eg, the second connection part 4614 of FIG. 6B )) Electrical connection between the and the third conductive pad 4203 may be performed through at least one electrical connection member. For example, the at least one electrical connection member may include a C-clip, an electrical connector, a conductive tape, or a pogo pin.

According to various embodiments, the grip sensing function of the electronic device 400 may be improved through the conductive portion 4111 and the first conductive pattern 461 of the side frame 410 . According to an embodiment, the grip sensing function of the electronic device 400 in the direction of the rear plate (eg, the rear plate 450 of FIG. 4 ) may be improved through the first conductive pattern 461 . For example, referring to <Table 1> below, the recognition distance of the grip sensor in the direction of the rear plate (eg, the rear plate 450 in FIG. 4 ) of the comparative example that does not use the first conductive pattern 461 is 14 mm, whereas , it can be seen that the recognition distance of the grip sensor through the first conductive pattern 461 of the present invention is increased to 16 mm. This may mean that the grip sensing function through the conductive portion 4111 and the first conductive pattern 461 according to the exemplary embodiment of the present invention is improved in various directions of the electronic device 400 .

8 is a diagram illustrating the case where an electrical connection path between the conductive part 4111 and the grip sensor circuit 480 is disposed on the substrate 420 and the dielectric structure 460 according to various embodiments of the present disclosure; It is a graph comparing the radiation performance of A1).

Referring to FIGS. 8 and 7 , radiation efficiency when the electrical connection structure between the conductive part 4111 used as the antenna A1 and the grip sensor circuit 480 is implemented through electrical wiring disposed on the substrate 420 . (Graph 801), the electrical connection structure between the conductive portion 4111 used as the antenna A1 according to an exemplary embodiment of the present invention and the grip sensor circuit 480 is the first conductive pattern ( 461), it can be seen that the radiation efficiency (802 graph) is improved by about 1.5 dB in the operating frequency band (eg, 850 MHz to 900 MHZ) (region B). This means that the electrical wiring for connecting the grip sensor circuit disposed on the substrate 420 of the comparative example forms a parasitic resonance that degrades the radiation performance of the antenna A1, and through the removal of the electrical wiring from the substrate 420, the antenna It may mean that the radiation efficiency of (A1) is improved.

9 and 10A are partial components of an electronic device illustrating a state in which a conductive portion 4111 is electrically connected through a conductive pattern 461 of a substrate 420 and a dielectric structure 460 according to various embodiments of the present disclosure; It is also 10B is a diagram illustrating the configuration of the variable circuit 491 of FIG. 10A according to various embodiments of the present disclosure.

In the description of FIGS. 9 and 10A , the same reference numerals are assigned to the components substantially the same as those shown in FIG. 7 , and detailed descriptions thereof may be omitted.

Referring to FIG. 9 , the first conductive pattern 461 disposed on the dielectric structure 460 and connecting the conductive portion 4111 of the side frame 410 and the grip sensor circuit 480 of the substrate 420 is partially It may include at least one conductive extension 4615 branching from the region. For example, the antenna A1 using the conductive parts 4111 may be implemented to operate in at least two different frequency bands according to the shape, arrangement position, and/or number of the conductive extension parts 4615 . As another example, the radiation characteristics of the antenna A1 may be tuned according to the shape, arrangement position, and/or number of the conductive extension parts 4615 .

Referring to FIG. 10A , in the electronic device 400, a fourth electrical path branched between the passive element 481 of the third electrical path 4703 and the third conductive pad 4203 and connected to the ground GND ( and a tunable IC 491 disposed among 4704 . According to an embodiment, the processor 490 of the electronic device 400 may change the operating frequency band of the antenna A1 through the control of the variable circuit 491 . For example, the processor 490 of the electronic device 400 detects state information (eg, region information and/or channel information) of the electronic device 400 and determines a current frequency mode based on the detected state information, By controlling the variable circuit 491 according to the determined frequency mode, the operating frequency band of the antenna A1 may be changed. For example, when the grip sensor circuit 480 detects a grip through the first conductive pattern or the conductive portion 4111 , the electronic device 400 performs matching of the antenna A1 using the variable circuit 491 . can be changed

Referring to FIG. 10B , the variable circuit 491 includes at least one switch 4911 and at least one lumped integer element selectively coupled to a fourth electrical path 4704 by at least one switch 4911 . element) 4912 (eg, T1, T2 ..... Tn). According to one embodiment, the at least one switch 4911 grips the fourth electrical path 4703 through at least one of the lumped integer elements 4912 under control of a processor (eg, the processor 490 in FIG. 10A ). The sensor circuit 490 may be connected to the connected third electrical path 4703 . For example, the first conductive pattern (eg, the first conductive pattern 461 of FIG. 10A ) may be connected to a ground (GND) (eg, the ground GND of the substrate 420 of FIG. 10A ) through the variable circuit 491 ). can be electrically connected to. As another example, the first conductive pattern (eg, the first conductive pattern 461 of FIG. 10A ) may be connected to a ground GND (eg, the ground GND of the substrate 420 of FIG. 10A ) through the grip sensor circuit 491 . ) can be electrically connected to. According to one embodiment, the at least one switch 4911 includes a micro-electro mechanical systems (MEMS) switch, a single pole single throw (SPST), a single pole double throw (SPDT) switch, or a switch comprising three or more throws. can do.

According to various embodiments, the electronic device (eg, the electronic device 400 of FIG. 4 ) includes at least one non-conductive part (eg, the first non-conductive part 4112 and the second non-conductive part 4113 of FIG. 4 ). )) and a conductive portion (eg, the conductive portion 4111 of FIG. 4 ); and an interior space of the housing (eg, the housing 210 of FIG. 2A ) (eg, the interior space 4001 of FIG. 4 ) ) disposed on at least one substrate (eg, the substrate 420 of FIG. 4 ), and a conductive pattern disposed in the inner space and electrically connected to the conductive portion (eg, the first conductive pattern 461 of FIG. 4 ) )), a wireless communication circuit disposed on the at least one substrate and configured to transmit and/or receive a wireless signal through the conductive portion and the conductive pattern (eg, the wireless communication circuit 470 of FIG. 7 ); and It may include a grip sensor circuit (eg, the grip sensor circuit 480 of FIG. 7 ) disposed in the inner space and electrically connected to the conductive part through the conductive pattern.

According to various embodiments, the conductive pattern is disposed on a dielectric structure (eg, the dielectric structure 460 of FIG. 4 ) disposed in the inner space, and the at least one substrate may be viewed from above when the at least one substrate is viewed from above. In this case, the dielectric structure may be at least partially overlapped.

According to various embodiments, the at least one substrate includes a first conductive pad (eg, FIG. 7 ) electrically connected to the wireless communication circuit through a first electrical path (eg, the first electrical path 4701 of FIG. 7 ). of a first conductive pad 4201), wherein the first conductive pad may be electrically connected to the conductive portion through at least one electrical connection member.

According to various embodiments, the first conductive pad may be electrically connected to one end (eg, one end 4611 of FIG. 7 ) of the conductive pattern through the at least one electrical connection member.

According to various embodiments, the at least one substrate is connected to a ground (eg, GND in FIG. 7 ) of the at least one substrate via a second electrical path (eg, the second electrical path 4702 in FIG. 7 ). and a second conductive pad (eg, the second conductive pad 4202 of FIG. 7 ) electrically connected to the second conductive pad, wherein the second conductive pad is spaced apart from the first conductive pad by a predetermined distance, wherein the at least It may be electrically connected to the conductive part through one electrical connection member.

According to various embodiments, the at least one substrate includes a third conductive pad (eg, the third conductive pad 4203 of FIG. 7 ) electrically connected to the grip sensor circuit, and the third conductive pad is the at least It may be electrically connected to the other end (eg, the other end 4613 of FIG. 7 ) of the conductive pattern through one electrical connection member.

According to various embodiments, a third electrical path (eg, a third electrical path 4703 of FIG. 10A ) electrically connecting the third conductive pad and the grip sensor circuit and the third electrical path on one substrate A tunable IC branching from the third electrical path and including a fourth electrical path (eg, the fourth electrical path 4704 of FIG. 10A ) connected to the ground of the substrate, and disposed in the fourth electrical path (eg, the variable circuit (T) 491 of FIG. 10A ) may be further included.

According to various embodiments, the at least one electrical connection member may include at least one of a C-clip, an electrical connector, a conductive tape, or a pogo pin.

According to various embodiments, the housing may include a front plate (eg, the front plate 440 of FIG. 4 ), a rear plate facing the opposite direction to the front plate (eg, the rear plate 450 of FIG. 4 ), and the front surface. a conductive side frame (eg, the conductive side frame 410 of FIG. 4 ) at least partially surrounding the interior space between the plate and the back plate, the conductive portion being disposed on at least a portion of the conductive side frame can

According to various embodiments, the at least one non-conductive portion may include a first non-conductive portion (eg, the first non-conductive portion 4112 of FIG. 4 ) formed on the conductive side frame and the first non-conductive portion; a second non-conductive portion (eg, the second non-conductive portion 4113 of FIG. 7 ) formed at positions spaced apart by a predetermined distance, wherein the conductive portion includes the first non-conductive portion and the second non-conductive portion can be placed between them.

According to various embodiments, the dielectric structure may be disposed between the substrate and the back plate in the inner space.

According to various embodiments, to receive, through the grip sensor circuit, the user's grip detection information for the side member and/or the rear plate, and to control the function of the electronic device based on the received grip detection information It may further include at least one set processor (eg, the processor 490 of FIG. 7 ).

According to various embodiments, the dielectric structure further includes at least one additional conductive pattern (eg, the second conductive pattern 462 and/or the third conductive pattern 463 of FIG. 4 ) spaced apart from the conductive pattern. and the at least one additional conductive pattern may be electrically connected to the wireless communication circuit.

According to various embodiments, the conductive pattern may be a laser direct structuring (LDS) pattern formed on the dielectric structure, a flexible printed circuit board (FPCB) attached to the dielectric structure, or bonding, taping, or bonding to the dielectric structure. It may include at least one of the conductive plates of the thin plate attached through fusion.

According to various embodiments, the at least one substrate may include a first substrate and a second substrate, the wireless communication circuit may be disposed on the first substrate, and the grip sensor circuit may be disposed on the second substrate. .

According to various embodiments, the electronic device (eg, the electronic device 400 of FIG. 4 ) includes a front plate (eg, the front plate 440 of FIG. 4 ) and a rear plate (eg, the front plate 440 of FIG. 4 ) facing the opposite direction to the front plate. A housing (eg, the back plate 450 of FIG. 4 ) and a conductive side frame (eg, the conductive side frame 410 of FIG. 4 ) at least partially surrounding the interior space between the front plate and the back plate. : the housing 210 of FIG. 2A ), a substrate disposed in the space (eg, the substrate 420 of FIG. 4 ), and a conductive pattern disposed in the space and electrically connected to the conductive part (eg, FIG. 4 ) A dielectric structure (eg, the dielectric structure 460 of FIG. 4 ) including the first conductive pattern 461 of FIG. 4 , is disposed on the substrate, and transmits a radio signal through the conductive portion and the conductive pattern and/or or a wireless communication circuit configured to receive (eg, the wireless communication circuit 470 of FIG. 7 ) and a grip sensor circuit disposed on the substrate and electrically connected to the conductive portion through the conductive pattern (eg, the grip of FIG. 7 ) sensor circuitry 480).

According to various embodiments, the substrate may be disposed to at least partially overlap the dielectric structure when the front plate is viewed from above.

According to various embodiments, the substrate includes a first conductive pad electrically connected to the wireless communication circuit through a first electrical path, wherein the first conductive pad includes the conductive portion through at least one electrical connection member. and electrically connected to one end of the conductive pattern.

According to various embodiments, the substrate may include a second conductive pad electrically connected to the grip sensor circuit, and the second conductive pad may be electrically connected to the other end of the conductive pattern through the at least one electrical connection member. have.

In addition, the embodiments of the present invention disclosed in the present specification and drawings are merely provided for specific examples to easily explain the technical contents according to the embodiments of the present invention and to help the understanding of the embodiments of the present invention, and to extend the scope of the embodiments of the present invention. It is not meant to be limiting. Therefore, in the scope of various embodiments of the present invention, in addition to the embodiments disclosed herein, all changes or modifications derived from the technical ideas of various embodiments of the present invention should be interpreted as being included in the scope of various embodiments of the present invention. .

400: electronic device 410: side frame
411: first side 420: substrate
460: dielectric structure 461: first conductive pattern
462: second conductive pattern 463: third conductive pattern
470: wireless communication circuit 480: grip sensor circuit

Claims (20)

In an electronic device,
a housing comprising at least one non-conductive portion and a conductive portion;
at least one substrate disposed in the inner space of the housing;
a conductive pattern disposed in the inner space and electrically connected to the conductive portion;
a wireless communication circuit disposed on the at least one substrate and configured to transmit and/or receive a wireless signal through the conductive portion and the conductive pattern; and
and a grip sensor circuit disposed in the inner space and electrically connected to the conductive part through the conductive pattern.
According to claim 1,
The conductive pattern is disposed on a dielectric structure disposed in the inner space,
The at least one substrate is disposed to at least partially overlap the dielectric structure when the at least one substrate is viewed from above.
According to claim 1,
the at least one substrate comprises a first conductive pad electrically connected to the wireless communication circuit through a first electrical path;
The first conductive pad is electrically connected to the conductive portion through at least one electrical connection member.
4. The method of claim 3,
The first conductive pad is electrically connected to one end of the conductive pattern through the at least one electrical connection member.
5. The method of claim 4,
the at least one substrate includes a second conductive pad electrically connected to a ground of the at least one substrate through a second electrical path;
The second conductive pad is electrically connected to the conductive portion through the at least one electrical connection member at a position spaced apart from the first conductive pad by a predetermined distance.
6. The method of claim 5,
the at least one substrate includes a third conductive pad electrically connected to the grip sensor circuit;
The third conductive pad is electrically connected to the other end of the conductive pattern through the at least one electrical connection member.
7. The method of claim 6,
a third electrical path electrically connecting the third conductive pad and the grip sensor circuit in the at least one substrate; and
a fourth electrical path branched from the third electrical path and connected to the ground of the at least one substrate;
The electronic device further comprising a tunable IC disposed in the fourth electrical path.
4. The method of claim 3,
and the at least one electrical connection member includes at least one of a C-clip, an electrical connector, a conductive tape, or a pogo pin.
According to claim 1,
The housing is
front plate;
a rear plate facing in a direction opposite to the front plate; and
a conductive side frame at least partially surrounding the interior space between the front plate and the back plate;
wherein the conductive portion is disposed on at least a portion of the conductive side frame.
10. The method of claim 9,
the at least one non-conductive portion includes a first non-conductive portion formed on the conductive side frame and a second non-conductive portion formed at a location spaced apart from the first non-conductive portion by a predetermined distance;
and the conductive portion is disposed between the first non-conductive portion and the second non-conductive portion.
10. The method of claim 9,
The conductive pattern is disposed between the at least one substrate and the back plate in the inner space.
10. The method of claim 9,
at least one processor configured to receive, through the grip sensor circuit, the user's grip detection information for the side member and/or the rear plate, and control a function of the electronic device based on the received grip detection information; Further comprising an electronic device.
According to claim 1,
The electronic device further comprising at least one conductive extension extending from a portion of the conductive pattern.
According to claim 1,
The dielectric structure further includes at least one additional conductive pattern spaced apart from the conductive pattern,
The at least one additional conductive pattern is electrically connected to the wireless communication circuit.
According to claim 1,
The conductive pattern may include a laser direct structuring (LDS) pattern formed on the dielectric structure, a flexible printed circuit board (FPCB) attached to the dielectric structure, or bonding, taping, screw fastening or fusion to the dielectric structure. An electronic device comprising at least one of a thin conductive plate to which it is attached.
According to claim 1,
The at least one substrate includes a first substrate and a second substrate,
The wireless communication circuit is disposed on the first substrate,
and the grip sensor circuit is disposed on the second substrate.
In an electronic device,
a side surface comprising a front plate, a rear plate facing in a direction opposite to the front plate, and a conductive portion at least partially surrounding a space between the front plate and the rear plate and disposed to be electrically isolated through at least one non-conductive portion a housing including a frame;
a substrate disposed in the space;
a dielectric structure disposed in the space and including a conductive pattern electrically connected to the conductive portion;
a wireless communication circuit disposed on the substrate and configured to transmit and/or receive a wireless signal through the conductive portion and the conductive pattern; and
and a grip sensor circuit disposed on the substrate and electrically connected to the conductive portion through the conductive pattern.
18. The method of claim 17,
The substrate is disposed to at least partially overlap the dielectric structure when the front plate is viewed from above.
18. The method of claim 17,
The substrate includes a first conductive pad electrically connected to the wireless communication circuit through a first electrical path,
The first conductive pad is electrically connected to one end of the conductive portion and the conductive pattern through at least one electrical connection member.
20. The method of claim 19,
the substrate includes a second conductive pad electrically connected to the grip sensor circuit;
The second conductive pad is electrically connected to the other end of the conductive pattern through the at least one electrical connection member.

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