KR20210138418A - Antenna module and electronic device including the same - Google Patents

Abstract

Various embodiments of the present invention relate to an antenna module and an electronic device including the antenna module, the antenna module comprising: a first conductive pattern layer which has at least one connector and at least one electronic element arranged on a first surface thereof and which is electrically connected to the at least one connector and the at least one electronic device; a first dielectric layer arranged below the first conductive pattern layer; a first ground arranged below the first dielectric layer; a second dielectric layer arranged below the first ground; a second ground arranged below the second dielectric layer; a third dielectric layer arranged below the second ground; a second conductive pattern layer which is arranged below the third dielectric layer and which has at least one antenna array; and a conductive shielding layer including first portion, which is spaced from the first surface of the first conductive pattern layer to cover at least a part of the first surface, and a second portion, which extends from the first portion to encompass at least a part of the side surfaces of the first conductive pattern layer, the first dielectric layer, the first ground, the second dielectric layer, the second ground, the third dielectric layer, and the second conductive pattern layer, wherein the conductive shielding layer is insulated from the first ground and can be electrically connected to at least a part of the side surface of the second ground. Various other embodiments are possible. The present invention can reduce electric shock and leakage current due to direct current (DC) component applied from the antenna module to the metal housing of the electronic device.

Description

Antenna module and electronic device including the antenna module {Antenna module and electronic device including the same}

Various embodiments of the present invention relate to an antenna module and an electronic device including the antenna module.

A portable electronic device such as a smart phone may transmit/receive various data to and from another electronic device through wireless communication.

The electronic device may include at least one antenna to perform long-distance communication and/or short-range communication.

For example, the electronic device may include at least one antenna module capable of supporting a high frequency band (eg, about 3 GHz to 300 GHz).

The electronic device can perform a wireless communication function corresponding to 5G (5 ^th generation) communication band using at least one of the antenna module.

Next-generation wireless communication technology may transmit and receive signals using a frequency band in the range of about 3 GHz to 300 GHz.

Has been actively research on the antenna module to perform: (a millimeter wave (mmWave) communication Example) In recent years, the next-generation radio of 5G (5 ^th generation), a type of communication technique communication.

The antenna module for performing the 5G communication may be miniaturized according to various changes of electronic devices, and mutual interference between components mounted in the antenna module may be reduced.

The antenna module may have various electromagnetic wave shielding structures to implement shielding characteristics against electromagnetic interference (EMI).

The antenna module may consider power efficiency, manufacturing cost, and safe connection with an electronic device (eg, a smart phone) for an electromagnetic wave shielding structure.

In the antenna module, the ground may be energized with the conductive shielding layer, and when the antenna module has a structure in contact with a metal housing of an electronic device (eg, a smart phone), electric shock and leakage current may be generated.

Various embodiments of the present invention may provide an antenna module capable of preventing electric shock and leakage current as described above, and an electronic device including the antenna module.

An electronic device according to various embodiments of the present disclosure includes a housing; a printed circuit board provided inside the housing; a wireless communication module, memory and processor mounted on the printed circuit board; and an antenna module, wherein at least one connector and at least one electronic element are disposed on a first surface facing the first direction, and the antenna module is electrically connected to the at least one connector and the at least one electronic element. a first conductive pattern layer connected thereto; a first dielectric layer disposed on a second surface of the first conductive pattern layer facing a second direction opposite to the first direction; a first ground disposed on a third surface of the first first dielectric layer facing the second direction; a second dielectric layer disposed on a fourth surface of the first ground facing the second direction; a second ground disposed on a fifth surface of the first dielectric layer facing the second direction; a third dielectric layer disposed on a sixth surface of the second ground facing the second direction; a second conductive pattern layer disposed on a seventh surface of the third dielectric layer facing the second direction and having at least one antenna array formed thereon; and a first portion spaced apart from the first surface of the first conductive pattern layer, covering at least a portion of the first surface, and extending from the first portion, the first conductive pattern layer, the first dielectric layer, and the a conductive shielding layer including a second portion surrounding at least a portion of side surfaces of the first ground, the second dielectric layer, the second ground, the third dielectric layer, and the second conductive pattern layer, the conductive shielding layer comprising: may be insulated from the first ground and may be electrically connected to at least a portion of a side surface of the second ground.

In the antenna module according to various embodiments of the present disclosure, at least one connector and at least one electronic device are disposed on a first surface, and a first conductive pattern is electrically connected to the at least one connector and the at least one electronic device. floor; a first dielectric layer disposed under the first conductive pattern layer; a first ground disposed under the first dielectric layer; a second dielectric layer disposed under the first ground; a second ground disposed under the second dielectric layer; a third dielectric layer disposed under the second ground; a second conductive pattern layer disposed under the third dielectric layer and having at least one antenna array formed thereon; and a first portion spaced apart from the first surface of the first conductive pattern layer, covering at least a portion of the first surface, and extending from the first portion, the first conductive pattern layer, the first dielectric layer, and the a conductive shielding layer including a second portion surrounding at least a portion of side surfaces of the first ground, the second dielectric layer, the second ground, the third dielectric layer, and the second conductive pattern layer, the conductive shielding layer comprising: may be insulated from the first ground and may be electrically connected to at least a portion of a side surface of the second ground.

Various embodiments of the present disclosure may reduce electric shock and leakage current due to a direct current (DC) component applied from the antenna module to the metal housing of the electronic device from the antenna module by insulating the ground provided in the antenna module and at least a portion of the conductive shielding layer. have.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;
2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to various embodiments of the present disclosure.
3A is a perspective view of a front side of a mobile electronic device according to various embodiments of the present disclosure;
3B is a perspective view of a rear surface of the electronic device of FIG. 3A according to various embodiments of the present disclosure;
3C is an exploded perspective view of the electronic device of FIG. 3A according to various embodiments of the present disclosure;
4A is a diagram illustrating an embodiment of the structure of a third antenna module described with reference to FIG. 2 according to various embodiments of the present invention.
4B is a cross-sectional view taken along Y-Y′ of the third antenna module 246 shown in (a) of FIG. 4A according to various embodiments of the present disclosure.
5A is a perspective view and a cross-sectional view schematically illustrating an antenna module according to various embodiments of the present invention.
5B is an exploded perspective view schematically illustrating the antenna module shown in FIG. 5A according to various embodiments of the present invention.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments.

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 . According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphic processing unit, an image signal processor) that can operate independently or together with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 may be, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input device 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 155 may output a sound signal to the outside of the electronic device 101 . The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display device 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. According to an embodiment, the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. have.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) connected directly or wirelessly with the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct, or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, or It may communicate with an external electronic device via a computer network (eg, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified and authenticated.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as a part of the antenna module 197 .

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the electronic devices 102 and 104 may be the same or a different type of the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more of the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. The one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology may be used.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

It should be understood that the various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "A; Each of the phrases "at least one of B, or C" may include any one of, or all possible combinations of, items listed together in the corresponding one of the phrases. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When mentioned, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit. A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of one or more instructions stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the at least one command called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

2 is a block diagram 200 of an electronic device 101 for supporting legacy network communication and 5G network communication, according to various embodiments.

Referring to FIG. 2 , the electronic device 101 includes a first communication processor 212 , a second communication processor 214 , a first radio frequency integrated circuit (RFIC) 222 , a second RFIC 224 , and a third RFIC 226 , a fourth RFIC 228 , a first radio frequency front end (RFFE) 232 , a second RFFE 234 , a first antenna module 242 , a second antenna module 244 , and an antenna (248). The electronic device 101 may further include a processor 120 and a memory 130 . The second network 199 (eg, the second network 199 of FIG. 1 ) may include a first cellular network 292 (eg, a legacy network) and a second cellular network 294 (eg, a 5G network). can According to another embodiment, the electronic device 101 may further include at least one component among the components illustrated in FIG. 1 , and the second network 199 may further include at least one other network. According to an embodiment, a first communication processor 212 , a second communication processor 214 , a first RFIC 222 , a second RFIC 224 , a fourth RFIC 228 , a first RFFE 232 , and the second RFFE 234 may form at least a part of the wireless communication module 192 . According to another embodiment, the fourth RFIC 228 may be omitted or may be included as a part of the third RFIC 226 .

The first communication processor 212 may support establishment of a communication channel of a band to be used for wireless communication with the first cellular network 292 and legacy network communication through the established communication channel. According to various embodiments, the first cellular network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor 214 establishes a communication channel corresponding to a designated band (eg, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second cellular network 294, and establishes a 5G network through the established communication channel. communication can be supported. According to various embodiments, the second cellular network 294 may be a 5G network defined by 3GPP. Additionally, according to an embodiment, the first communication processor 212 or the second communication processor 214 corresponds to another designated band (eg, about 6 GHz or less) among bands to be used for wireless communication with the second cellular network 294 . 5G network communication through the establishment of a communication channel and the established communication channel can be supported. According to one embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be formed in a single chip or a single package with the processor 120 , the coprocessor 123 , or the communication module 190 . have.

The first RFIC 222, when transmitting, transmits a baseband signal generated by the first communication processor 212 from about 700 MHz to about 700 MHz used for the first cellular network 292 (eg, a legacy network). It can be converted to a radio frequency (RF) signal of 3 GHz. Upon reception, an RF signal is obtained from a first cellular network 292 (eg, a legacy network) via an antenna (eg, a first antenna module 242), and an RFFE (eg, a first RFFE 232) It can be preprocessed through The first RFIC 222 may convert the preprocessed RF signal into a baseband signal to be processed by the first communication processor 212 .

The second RFIC 224, when transmitting, uses the baseband signal generated by the first communication processor 212 or the second communication processor 214 to the second cellular network 294 (eg, a 5G network). It can be converted into an RF signal (hereinafter, 5G Sub6 RF signal) of the Sub6 band (eg, about 6 GHz or less). Upon reception, a 5G Sub6 RF signal is obtained from a second cellular network 294 (eg, 5G network) via an antenna (eg, second antenna module 244 ), and an RFFE (eg, second RFFE 234 ) ) can be preprocessed. The second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal to be processed by a corresponding one of the first communication processor 212 or the second communication processor 214 .

The third RFIC 226 transmits the baseband signal generated by the second communication processor 214 to the 5G Above6 band (eg, about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (eg, 5G network). It can be converted into an RF signal (hereinafter referred to as 5G Above6 RF signal). Upon reception, a 5G Above6 RF signal may be obtained from the second cellular network 294 (eg, 5G network) via an antenna (eg, antenna 248 ) and pre-processed via a third RFFE 236 . The third RFIC 226 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214 . According to one embodiment, the third RFFE 236 may be formed as part of the third RFIC 226 .

According to an embodiment, the electronic device 101 may include the fourth RFIC 228 separately from or as at least a part of the third RFIC 226 . In this case, the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter, IF signal) of an intermediate frequency band (eg, about 9 GHz to about 11 GHz). After conversion, the IF signal may be transmitted to the third RFIC 226 . The third RFIC 226 may convert the IF signal into a 5G Above6 RF signal. Upon reception, a 5G Above6 RF signal may be received from the second network 294 (eg, 5G network) via an antenna (eg, antenna 248 ) and converted into an IF signal by a third RFIC 226 . . The fourth RFIC 228 may convert the IF signal into a baseband signal for processing by the second communication processor 214 .

According to an embodiment, the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least a part of a single package. According to an embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as at least a part of a single chip or a single package. According to an embodiment, at least one of the first antenna module 242 and the second antenna module 244 may be omitted or may be combined with another antenna module to process RF signals of a plurality of corresponding bands.

According to an embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246 . For example, the wireless communication module 192 or the processor 120 may be disposed on the first substrate (eg, main PCB). In this case, the third RFIC 226 is located in a partial area (eg, the bottom surface) of the second substrate (eg, sub PCB) that is separate from the first substrate, and the antenna 248 is located in another partial region (eg, the top surface). is disposed, the third antenna module 246 may be formed. By disposing the third RFIC 226 and the antenna 248 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This, for example, can reduce loss (eg, attenuation) of a signal in a high-frequency band (eg, about 6 GHz to about 60 GHz) used for 5G network communication by a transmission line. Accordingly, the electronic device 101 may improve the quality or speed of communication with the second cellular network 294 (eg, a 5G network).

According to an embodiment, the antenna 248 may be formed as an antenna array including a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC 226 may include, for example, as a part of the third RFFE 236 , a plurality of phase shifters 238 corresponding to a plurality of antenna elements. During transmission, each of the plurality of phase shifters 238 may transform the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (eg, a base station of a 5G network) through a corresponding antenna element. . Upon reception, each of the plurality of phase shifters 238 may convert the phase of the 5G Above6 RF signal received from the outside through a corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.

The second cellular network 294 (eg, 5G network) may be operated independently (eg, Stand-Alone (SA)) or connected to the first cellular network 292 (eg, legacy network). Example: Non-Stand Alone (NSA)). For example, the 5G network may have only an access network (eg, 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (eg, next generation core (NGC)). In this case, after accessing the access network of the 5G network, the electronic device 101 may access an external network (eg, the Internet) under the control of a core network (eg, evolved packed core (EPC)) of the legacy network. Protocol information for communication with a legacy network (eg, LTE protocol information) or protocol information for communication with a 5G network (eg, New Radio (NR) protocol information) is stored in the memory 130 , and other components (eg, processor 120 , the first communication processor 212 , or the second communication processor 214 ).

3A is a perspective view of a front side of a mobile electronic device according to various embodiments of the present disclosure; 3B is a perspective view of a rear surface of the electronic device of FIG. 3A according to various embodiments of the present disclosure;

Referring to FIGS. 3A and 3B , the electronic device 300 according to an embodiment includes a first side (or front side) 310A, a second side (or back side) 310B, and a first side 310A and The housing 310 may include a side surface 310C surrounding the space between the second surfaces 310B. In another embodiment (not shown), the housing 310 may refer to a structure that forms part of the first surface 310A, the second surface 310B, and the side surface 310C of FIG. 3A . According to one embodiment, the first side 310A may be formed by a front plate 302 (eg, a glass plate comprising various coating layers, or a polymer plate) at least a portion of which is substantially transparent. The second surface 310B may be formed by a substantially opaque back plate 311 . The back plate 311 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. can be The side surface 310C is coupled to the front plate 302 and the rear plate 311 and may be formed by a side bezel structure (or “side member”) 318 including a metal and/or a polymer. In some embodiments, the back plate 311 and the side bezel structure 318 are integrally formed and may include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 302 includes two first regions 310D that extend seamlessly from the first surface 310A toward the rear plate 311 by bending the front plate. It may include both ends of the long edge of (302). In the illustrated embodiment (see FIG. 3B ), the rear plate 311 has two second regions 310E that extend seamlessly by bending from the second surface 310B toward the front plate 302 with long edges. It can be included at both ends. In some embodiments, the front plate 302 (or the back plate 311 ) may include only one of the first regions 310D (or the second regions 310E). In another embodiment, some of the first regions 310D or the second regions 310E may not be included. In the above embodiments, when viewed from the side of the electronic device 300 , the side bezel structure 318 has a side surface that does not include the first regions 310D or the second regions 310E as described above. It may have a first thickness (or width), and may have a second thickness thinner than the first thickness at the side surface including the first regions 310D or the second regions 310E.

According to an embodiment, the electronic device 300 includes the display 301 , the input device 303 , the sound output devices 307 and 314 , the sensor modules 304 and 319 , and the camera modules 305 , 312 , 313 . , a key input device 317 , an indicator (not shown), and/or at least one of connector holes 308 and 309 . In some embodiments, the electronic device 300 may omit at least one of the components (eg, the key input device 317 or an indicator) or additionally include other components.

The display 301 may be exposed through a substantial portion of the front plate 302 , for example. In some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 forming the first area 310D of the first surface 310A and the side surface 310C. The display 301 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. In some embodiments, at least a portion of the sensor module 304 , 319 , and/or at least a portion of a key input device 317 is located in the first area 310D, and/or the second area 310E. can be placed.

The input device 303 may include a microphone 303 . In some embodiments, the input device 303 may include a plurality of microphones 303 arranged to sense the direction of the sound. The sound output devices 307 and 314 may include speakers 307 and 314 . The speakers 307 and 314 may include an external speaker 307 and a receiver 314 for calls. In some embodiments, the microphone 303 , the speakers 307 , 314 , and the connectors 308 , 309 are disposed in the space of the electronic device 300 , and externally through at least one hole formed in the housing 310 . may be exposed to the environment. In some embodiments, the hole formed in the housing 310 may be commonly used for the microphone 303 and the speakers 307 and 314 . In some embodiments, the sound output devices 307 and 314 may include a speaker (eg, a piezo speaker) that operates while excluding a hole formed in the housing 310 .

The sensor modules 304 and 319 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 300 or an external environmental state. The sensor modules 304 and 319 include, for example, a first sensor module 304 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the first surface 310A of the housing 310 . ) (eg, a fingerprint sensor), and/or a third sensor module 319 (eg, an HRM sensor) disposed on the second surface 310B of the housing 310 . The fingerprint sensor may be disposed on the first surface 310A of the housing 310 . A fingerprint sensor (eg, an ultrasonic fingerprint sensor or an optical fingerprint sensor) may be disposed under the display 301 of the first surface 310A. The electronic device 300 includes a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor 304 .

The camera modules 305 , 312 , and 313 include a first camera device 305 disposed on the first side 310A of the electronic device 300 , and a second camera device 312 disposed on the second side 310B of the electronic device 300 . ), and/or a flash 313 . The camera modules 305 and 312 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 300 .

The key input device 317 may be disposed on the side surface 310C of the housing 310 . In another embodiment, the electronic device 300 may not include some or all of the above-mentioned key input devices 317 and the not included key input devices 317 are displayed on the display 301 as a soft key or the like. It may be implemented in other forms. In another embodiment, the key input device 317 may be implemented using a pressure sensor included in the display 301 .

The indicator may be disposed, for example, on the first surface 310A of the housing 310 . The indicator may provide, for example, state information of the electronic device 300 in the form of light. In another embodiment, the light emitting device may provide, for example, a light source that is interlocked with the operation of the camera module 305 . Indicators may include, for example, LEDs, IR LEDs and xenon lamps.

The connector holes 308 and 309 are a first connector hole 308 capable of receiving a connector (eg, a USB connector or an interface connector port module (IF module)) for transmitting and receiving power and/or data with an external electronic device. ), and/or a second connector hole (or earphone jack) 309 capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device.

Some of the camera modules 305 and 312 , the camera module 305 , and some of the sensor modules 304 and 319 , the sensor module 304 or the indicator may be disposed to be exposed through the display 101 . For example, the camera module 305 , the sensor module 304 , or the indicator is disposed so as to be in contact with the external environment through a perforated opening up to the front plate 302 of the display 301 in the internal space of the electronic device 300 . can be In another embodiment, some sensor modules 304 may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device. For example, in this case, the area of the display 301 facing the sensor module may not need a perforated opening.

3C is an exploded perspective view of the electronic device of FIG. 3A according to various embodiments of the present disclosure;

Referring to FIG. 3C , the electronic device 300 includes a side member 310 (eg, a side bezel structure), a first support member 3111 (eg, a bracket), a front plate 302 , and a display 301 ( For example, a display device), a printed circuit board 340 , a battery 350 , a second support member 360 (eg, a rear case), an antenna 370 , and/or a rear plate 380 may be included. . In some embodiments, the electronic device 300 may omit at least one of the components (eg, the first support member 3111 or the second support member 360) or additionally include other components. have. At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 300 of FIG. 3A or 3B , and overlapping descriptions will be omitted below.

The first support member 3111 may be disposed inside the electronic device 300 and connected to the side bezel structure 310 , or may be integrally formed with the side bezel structure 310 . The first support member 3111 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The first support member 3111 may have a display 301 coupled to one surface and a printed circuit board 340 coupled to the other surface. The printed circuit board 340 may be equipped with a processor, memory, and/or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

Memory may include, for example, volatile memory or non-volatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 350 is a device for supplying power to at least one component of the electronic device 300 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 300 , or may be disposed detachably from the electronic device 300 .

The antenna 370 may be disposed between the rear plate 380 and the battery 350 . The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a part of the side bezel structure 310 and/or the first support member 3111 or a combination thereof.

According to various embodiments, the third antenna module 246 illustrated in FIG. 2 may be disposed on at least a portion of a first surface (eg, upper surface) or a second surface (eg, lower surface) of the printed circuit board 340 . have. The third antenna module 246 may be disposed between the rear case 360 and the antenna 370 .

FIG. 4A is, for example, a diagram illustrating an embodiment of the structure of a third antenna module described with reference to FIG. 2 .

4A (a) is a perspective view of the third antenna module 246 viewed from one side, and FIG. 4A (b) is a perspective view of the third antenna module 246 viewed from the other side. 4A (c) is a cross-sectional view taken along X-X' of the third antenna module 246 .

Referring to (a) of Figure 4a, in one embodiment, the third antenna module 246 is a printed circuit board 410, an antenna array 430, a radio frequency integrate circuit (RFIC) 452 or PMIC (power manage integrate circuit) 454 . Optionally, the third antenna module 246 may further include a shielding member 490 . In other embodiments, at least one of the above-mentioned components may be omitted, or at least two of the above-mentioned components may be integrally formed.

The printed circuit board 410 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The printed circuit board 410 may provide an electrical connection between the printed circuit board 410 and/or various electronic components disposed outside by using wires and conductive vias formed on the conductive layer.

Antenna array 430 (eg, antenna 248 of FIG. 2 ) includes a plurality of antenna elements 432 , 434 , 436 , or 438 (eg, a conductive patch) disposed to form a directional beam. can do. The antenna elements 432 , 434 , 436 , or 438 may be formed on the first surface of the printed circuit board 410 as shown. According to another embodiment, the antenna array 430 may be formed inside the printed circuit board 410 . According to some embodiments, the antenna array 430 may include a plurality of antenna arrays (eg, a dipole antenna array and/or a patch antenna array) having the same shape or different shapes and/or different types.

The RFIC 452 (eg, the third RFIC 226 of FIG. 2 ) is located in another area of the printed circuit board 410 (eg, opposite to the first side), spaced apart from the antenna array 430 . on the second side). The RFIC 452 is configured to process a signal of a selected frequency band, which is transmitted/received through the antenna array 430 . According to an embodiment, the RFIC 452 may convert a baseband signal obtained from a communication processor (not shown) into an RF signal of a designated band during transmission. Upon reception, the RFIC 452 may convert the RF signal received through the antenna array 452 into a baseband signal and transmit it to the communication processor.

According to another embodiment, the RFIC 452, at the time of transmission, an IF signal (eg, about 9 GHz to about 11GHz) can be up-converted to an RF signal of the selected band. The RFIC 452, upon reception, down-converts the RF signal obtained through the antenna array 430, converts it into an IF signal, and transmits it to the IFIC.

The PMIC 454 may be disposed in another partial area (eg, the second surface) of the printed circuit board 410 that is spaced apart from the antenna array 430 . The PMIC 454 may receive a voltage from a main PCB (not shown) to provide power required for various components (eg, the RFIC 452 ) on the antenna module.

The shielding member 490 may be disposed on a portion (eg, the second surface) of the printed circuit board 410 to electromagnetically shield at least one of the RFIC 452 and the PMIC 454 . According to an embodiment, the shielding member 490 may include a shield can.

Although not shown, in various embodiments, the third antenna module 246 may be electrically connected to another printed circuit board (eg, a main circuit board) through a module interface. The module interface may include a connection member, for example, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB). Through the connection member, the RFIC 452 and/or the PMIC 454 of the antenna module may be electrically connected to the printed circuit board.

FIG. 4B is a cross-sectional view taken along Y-Y′ of the third antenna module 246 shown in FIG. 4A (a). The printed circuit board 410 of the illustrated embodiment may include an antenna layer 411 and a network layer 413 .

Referring to FIG. 4B , the antenna layer 411 includes at least one dielectric layer 437 - 1 , and an antenna element 436 and/or class formed on or inside the outer surface of the dielectric layer 437 - 1 . All 425 may be included. The feeding unit 425 may include a feeding point 427 and/or a feeding line 429 .

The network layer 413 includes at least one dielectric layer 437-2, and at least one first ground layer 433-1 formed on or inside the outer surface of the dielectric layer 437-2, at least one may include a conductive via 435 , a transmission line 423 , and/or a signal line 429 . According to an embodiment, the first ground layer 433 - 1 may be disposed between the antenna layer 411 and the network layer 413 .

According to various embodiments, the antenna layer 411 may include at least one second ground layer 433 - 2 formed on or inside the outer surface of the dielectric layer 437 - 1 . The second ground layer 433 - 2 may be disposed between the first ground layer 433 - 1 and the mounting surface of the antenna element 436 . According to an embodiment, the second ground layer 433 - 2 may be disposed between the first ground layer 433 - 1 and the RFIC 452 mounting surface.

In addition, in the illustrated embodiment, the RFIC 452 (eg, the third RFIC 226 of FIG. 2 ) of (c) shown in FIG. 4A has, for example, first and second connections (solder bumps) It may be electrically connected to the network layer 413 through 440 - 1 and 440 - 2 . In other embodiments, various connection structures (eg, soldering or BGA) may be used instead of the connection parts 440 - 1 and 440 - 2 . The RFIC 452 may be electrically connected to the antenna element 436 through a first connection unit 440-1, a transmission line 423, and a power supply unit 425. The RFIC 452 may be electrically connected to the first ground layer 433 - 1 through the second connection part 440 - 2 and the conductive via 435 . Although not shown, the RFIC 452 may be electrically connected to the above-described module interface through the signal line 429 .

5A is a perspective view and a cross-sectional view schematically illustrating an antenna module according to various embodiments of the present invention. 5B is an exploded perspective view schematically illustrating the antenna module shown in FIG. 5A according to various embodiments of the present invention.

According to various embodiments, the antenna module 500 disclosed in FIGS. 5A and 5B may include the antenna module 197 illustrated in FIG. 1 , and the third antenna module 246 illustrated in FIGS. 2 , 4A or 4B . can

According to various embodiments, the antenna module 500 illustrated in FIGS. 5A and 5B may be provided in the electronic device 101 illustrated in FIGS. 1 or 2 or the electronic apparatus 300 illustrated in FIGS. 3A to 3C . .

According to various embodiments, the antenna module 500 illustrated in FIGS. 5A and 5B includes a printed circuit board 340 (eg, a main board) of the electronic device 300 illustrated in FIG. 3C and at least some positions (eg, a main board). : At least part of the upper part, lower part, or side surface of the electronic device), it may be connected through a connector 514 and/or a flexible printed circuit board (FPCB).

According to various embodiments, the antenna module 500 disclosed in FIGS. 5A and 5B is, for example, 5 ^th generation (5G) communication (eg, millimeter wave (mmWave) that can use a frequency band in the range of about 3 GHz to 300 GHz). ) communication).

5A and 5B , the antenna module 500 according to various embodiments of the present invention includes a first conductive pattern layer 510 , a first dielectric layer 515 , a first ground 520 , and a second dielectric layer. 525 , a second ground 530 , a third dielectric layer 535 , a second conductive pattern layer 540 , a conductive shielding layer 550 , a heat conductive layer 560 and/or a conductive plate 570 . can do.

According to an embodiment, the first conductive pattern layer 510 may include a ground pattern 511 on a first surface (eg, an upper surface or an upper surface). The first conductive pattern layer 510 may mount at least one electronic device 512 through the ground pattern 511 . The first conductive pattern layer 510 may include a pattern layer that may be electrically connected to at least one electronic device 512 . The ground pattern 511 may include a wiring line that may contact the terminal of the electronic device 512 . The ground pattern 511 may include a ground via. The ground pattern 511 may include a ground pattern area, and the ground pattern area may be exposed to the outside. A cover layer (not shown) may be disposed on the first conductive pattern layer 510 .

According to various embodiments, the at least one electronic device 512 may include a radio frequency integrate circuit (RFIC) 452 or a power manage integrate circuit (PMIC) 454 illustrated in (a) of FIG. 4A . . The at least one electronic element 512 may further include a passive element such as a resistor, a capacitor, and/or a coil. The at least one electronic device 512 may be mounted on the ground pattern 511 formed on the first surface (eg, upper portion) of the first conductive pattern layer 510 through, for example, soldering. The first conductive pattern layer 510 may include a structure in which at least one printed circuit board is stacked. The first conductive pattern layer 510 may include at least one circuit wire for connecting the at least one electronic device 512 and various components (eg, the connector 514 ).

According to various embodiments, a radio frequency integrate circuit (RFIC) 452 of the at least one electronic device 512 is transmitted from an intermediate frequency integrate circuit (IFIC) (eg, 228 in FIG. 2 ) during transmission. It is possible to up-convert the acquired IF signal (eg, about 9 GHz to about 11 GHz) into an RF signal of a selected band. Upon reception, the RFIC 452 may down-convert an RF signal obtained through an antenna array (eg, the antenna array 541 of FIG. 5B ), convert it into an IF signal, and transmit it to the IFIC.

According to various embodiments, a power manage integrate circuit (PMIC) 454 of the at least one electronic device 512 may be, for example, a voltage from the printed circuit board 340 of the electronic device 300 illustrated in FIG. 3C . may be supplied, and power required for various electronic devices (eg, RFIC 452) included in the antenna module 500 may be supplied.

According to an embodiment, the first conductive pattern layer 510 may include at least one connector 514 on at least a portion of a first surface (eg, an upper surface). The first conductive pattern layer 510 may be electrically connected to at least one connector 514 .

According to various embodiments, the at least one connector 514 may include, for example, an electronic device (eg, a main board) mounted on a printed circuit board 340 (eg, a main board) of the electronic device 300 illustrated in FIG. 3C . It may be electrically or operationally connected to the processor 120 and the memory 130 and the wireless communication module 192 shown in FIG. 1 or FIG. 2 .

According to an embodiment, the ground pattern 511 formed on the first conductive pattern layer 510 may include at least one ground exposed region (not shown) in contact with the terminal of the at least one electronic device 512 . can The ground pattern 511 may be formed to be exposed on the first surface (eg, the top surface) of the first conductive pattern layer 510 . The ground pattern 511 may be an open area of the first ground 520 . The ground pattern 511 may be a ground region positioned to correspond to the via 516 formed through the first dielectric layer 515 .

According to various embodiments, the ground pattern 511 may be spaced apart from the side surface of the first conductive pattern layer 510 by a predetermined distance inward, and may be disposed to be exposed on the first surface (eg, the top surface). The ground pattern 511 may be disposed inside at least a portion of an edge of the first conductive pattern layer 510 . The ground pattern 511 may be formed at a position corresponding to the via 516 formed in the first dielectric layer 515 . An inner peripheral surface of the ground pattern 511 may be plated with a conductive material. The ground pattern 511 may be electrically connected to the first ground 520 .

According to various embodiments, the ground pattern 511 may be disposed to surround at least a portion of the electronic device 512 . The ground pattern 511 may also be disposed to surround the connector 514 . The ground pattern 511 is not limited to the above arrangement and may be arranged in various forms.

According to an embodiment, the first ground 520 may be disposed on a second surface (eg, a lower surface or a lower portion) of the first conductive pattern layer 510 .

According to various embodiments, a first dielectric layer 515 may be disposed between the first conductive pattern layer 510 and the first ground 520 . At least one via 516 may be formed in the first dielectric layer 515 .

According to various embodiments, the first ground 520 is electrically connected to at least one via 516 corresponding to the ground pattern 511 disposed along an edge of at least a portion of the first conductive pattern layer 510 . can be connected The at least one via 516 may constitute an electrical path between the ground pattern 511 and the first ground 520 . The at least one via 516 may be disposed to be spaced apart from the side by a predetermined distance inward. A side surface of the first ground 520 may be formed of a non-conductive material.

According to an embodiment, the first ground 520 may be insulated (or disconnected) from the conductive shielding layer 550 . The first ground 520 may not be electrically connected to the conductive shielding layer 550 through the non-conductive region 524 formed on the side surface. The non-conductive region 524 may be adhered to the conductive shielding layer 550 through an adhesive. The first ground 520 formed inside the via 516 may be made of a conductive material. The first ground 520 may be formed through patterning on the lower surface (or lower portion) of the first dielectric layer 515 . The first ground 520 may include, for example, a copper foil. The first ground 520 may include the first ground layer 433 - 1 illustrated in FIG. 4B . The first ground 520 may include at least one circuit wire.

According to an embodiment, the second dielectric layer 525 may be disposed on a lower surface (or lower portion) of the first ground 520 . The second dielectric layer 525 may insulate the first ground 520 and the second ground 530 . The second dielectric layer 525 may include dielectric layers 437 - 1 and 437 - 2 as shown in FIG. 4B .

According to an embodiment, the second ground 530 may be disposed on a lower surface (or lower portion) of the second dielectric layer 525 .

According to various embodiments, the second ground 530 may ground the antenna array 541 disposed on the upper surface of the second conductive pattern layer 540 . The second ground 530 may include at least one via or transmission line. A side surface of the second ground 530 may be formed of a conductive material.

According to an embodiment, the second ground 530 may be electrically connected to the conductive shielding layer 550 . A side surface of the second ground 530 may be adhered to the conductive shielding layer 550 through an adhesive. The second ground 530 may be formed of a conductive material. The second ground 530 may be formed through patterning on the lower surface of the second dielectric layer 525 . The second ground 530 may include, for example, a copper foil. The second ground 530 may include the second ground layer 433 - 2 illustrated in FIG. 4B . The second ground 530 may include at least one circuit wire.

According to an embodiment, the third dielectric layer 535 may be disposed on a lower surface (or lower portion) of the second ground 530 . The third dielectric layer 535 may insulate at least a portion of the second ground 530 and the second conductive pattern layer 540 . The third dielectric layer 535 may include dielectric layers 437 - 1 and 437 - 2 illustrated in FIG. 4B .

According to an embodiment, the second conductive pattern layer 540 may be disposed on a lower surface (or lower portion) of the third dielectric layer 535 . The second conductive pattern layer 540 may mount at least one antenna array 541 on a first surface (eg, an upper surface). At least a portion of the second conductive pattern layer 540 may constitute an antenna array 541 . The second conductive pattern layer 540 may include at least one circuit wire. The at least one antenna array 541 may be electrically connected to the second ground 530 to be grounded.

According to various embodiments, the at least one antenna array 541 may include the antenna array 430 illustrated in FIGS. 4A (a) and (c). The at least one antenna array 541 (eg, the antenna array 248 of FIG. 2 ) includes a plurality of antenna elements (eg, the elements disclosed in (a) and (c) of FIG. 4A ) arranged to form a directional beam. (432, 434, 436 or 438)). The at least one antenna array 541 may include a plurality of antenna arrays (eg, a dipole antenna array and/or a patch antenna array) having the same shape or different shapes or different types. At least one antenna array 541 may be disposed on the second conductive pattern layer 540 , for example, in a loop-shaped antenna shape.

According to various embodiments, a non-conductive layer 543 may be disposed on or below the second conductive pattern layer 540 . The non-conductive layer 543 may include a cover layer.

According to an embodiment, the conductive shielding layer 550 includes the first conductive pattern layer 510 , the first dielectric layer 515 , the non-conductive region 524 , the second dielectric layer 525 , and the second ground 530 . ), the third dielectric layer 535 , and the second conductive pattern layer 540 may have a cap shape surrounding at least a portion of the side surfaces. The conductive shielding layer 550 may electromagnetically shield the at least one electronic device 512 (eg, the RFIC 452 or the PMIC 454 illustrated in (a) of FIG. 4A ). The conductive shielding layer 550 may include a shield can. The conductive shielding layer 550 may include the shielding member 490 illustrated in (b) and (c) of FIGS. 4A .

According to various embodiments, an inner surface of at least a portion of the conductive shielding layer 550 may be adhered to a side surface of at least a portion of the first dielectric layer 515 . The conductive shielding layer 550 may be insulated from the first ground 520 . At least a portion of the inner surface of the conductive shielding layer 550 may not be connected to the first ground 520 through the non-conductive region 524 formed on the side surface of the first ground 520 . An inner surface of at least a portion of the conductive shielding layer 550 may be adhered to at least a portion of a side surface of the non-conductive region 524 through an adhesive. An inner surface of at least a portion of the conductive shielding layer 550 may be adhered to at least a portion of a side surface of the second dielectric layer 525 through an adhesive. An inner surface of at least a portion of the conductive shielding layer 550 may be electrically connected to at least a portion of a side surface of the second ground 530 by being adhered through an adhesive. An inner surface of at least a portion of the conductive shielding layer 550 may be adhered to at least a portion of a side surface of the third dielectric layer 535 through an adhesive. At least a portion of the inner surface of the conductive shielding layer 550 may be adhered to at least a portion of the side surface of the second conductive pattern layer 540 and the non-conductive layer 543 through an adhesive.

According to an embodiment, since the conductive shielding layer 550 is insulated from the first ground 520, for example, the housing ( 310), it is possible to prevent direct current (DC) from being applied.

According to various embodiments, the conductive shielding layer 550 may include a conductive coating layer. An inner surface of at least a portion of the conductive shielding layer 550 is connected to at least a portion of a side surface of the second ground 530 , and thus at least one electronic device 512 (eg, the RFIC 452 disclosed in (a) of FIG. 4A ). ) or the noise generated from the PMIC 454) may be shielded.

According to an embodiment, the heat conductive layer 560 may be disposed on the upper surface (or upper portion) of the conductive shielding layer 550 . The heat conductive layer 560 may be adhered to the upper surface (or upper portion) of the conductive shielding layer 550 . The heat conductive layer 560 may induce heat dissipation by transferring heat transferred from the conductive shielding layer 550 to the housing of the electronic device (eg, the housing 310 of FIG. 3A ). The heat conductive layer 560 may be made of a thin film-shaped conductive material. The thermally conductive layer 560 may include an insulating tape or a thermal interface material (TIM).

According to an embodiment, the heat conductive layer 560 may be formed of a conductive material because the conductive shielding layer 550 is insulated from the first ground 520 .

According to an embodiment, since the conductive shielding layer 550 is insulated from the first ground 520 , the heat conductive layer 560 may be removed.

According to an embodiment, the conductive plate 570 may be disposed on the upper surface (or upper portion) of the heat conductive layer 560 . The conductive plate 570 may be adhered to the top surface (or top) of the heat conductive layer 560 . The conductive plate 570 may protect the antenna module 500 from external impact. The conductive plate 570 may include steel use stainless (SUS) or a metal bracket.

According to various embodiments, the conductive plate 570 may include the rear plate 380 illustrated in FIG. 3C . The conductive plate 570 may include a conductive material (not shown) provided between the back plate 380 and the conductive shielding layer 550 .

According to an embodiment, since the conductive shielding layer 550 is insulated from the first ground 520 , an insulating coating layer may not be separately formed on the conductive plate 570 .

The electronic device (eg, the electronic device 101 of FIGS. 1 and 2 or the electronic device 300 of FIGS. 3A to 3 ) according to various embodiments of the present disclosure includes a housing (eg, the housing 310 of FIG. 3A ). ); a printed circuit board (eg, the printed circuit board 340 of FIG. 3C ) provided in the housing; and an antenna module 500 disposed on the printed circuit board, wherein the antenna module 500 includes at least one connector 514 and at least one electronic element 512 on a first surface facing a first direction. a first conductive pattern layer 510 disposed and electrically connected to the at least one connector and the at least one electronic device; a first dielectric layer 515 disposed on a second surface of the first conductive pattern layer 510 facing a second direction opposite to the first direction; a first ground (520) disposed on a third surface of the first dielectric layer (515) facing the second direction; a second dielectric layer (525) disposed on a fourth surface of the first ground (520) facing the second direction; a second ground (530) disposed on a fifth surface of the second dielectric layer (525) facing the second direction; a third dielectric layer (535) disposed on a sixth surface of the second ground (530) facing the second direction; a second conductive pattern layer 540 disposed on a seventh surface of the third dielectric layer 535 facing the second direction and having at least one antenna array 541 formed thereon; and a first portion spaced apart from the first surface of the first conductive pattern layer 510 and covering at least a portion of the first surface and extending from the first portion, the first conductive pattern layer 510; of the first dielectric layer 515 , the first ground 520 , the second dielectric layer 525 , the second ground 530 , the third dielectric layer 535 , and the second conductive pattern layer 540 . a conductive shielding layer 550 including a second portion surrounding at least a portion of a side surface, wherein the conductive shielding layer 550 is insulated from the first ground 520 and It may be electrically connected to at least a portion of the side surface.

According to various embodiments, the at least one connector 514 may be electrically connected to a printed circuit board (eg, printed circuit board 340 ) of an electronic device (eg, electronic device 300 of FIGS. 3A to 3C ). can

According to various embodiments, the antenna module 500 may perform 5G (5 ^th generation) communication using a frequency band of approximately 3GHz ~ 300GHz range.

According to various embodiments, the at least one electronic device 512 includes an RFIC (eg, the RFIC 452 illustrated in (a) of FIG. 4A) or a PMIC (the PMIC 454 illustrated in (a) of FIG. 4A). may include

According to various embodiments, the first conductive pattern layer 510 may include, on the first surface, a ground pattern 511 in contact with the terminal of the at least one electronic device 512 .

According to various embodiments, the ground pattern 511 may be formed to be spaced apart from the side surface of the first conductive pattern layer 510 by a predetermined distance inward, and may be electrically connected to the first ground 520 .

According to various embodiments, the first conductive pattern layer 510 may include at least one via 516 formed at a position corresponding to the ground pattern 511 .

According to various embodiments, the at least one via 516 may be disposed to be spaced apart from the side surface of the first dielectric layer 515 inward by a predetermined distance.

According to various embodiments, a heat conductive layer 560 made of a conductive material may be disposed on the conductive shielding layer 550 .

According to various embodiments, a conductive plate 570 may be disposed on the heat conductive layer 560 .

In the antenna module 500 according to various embodiments of the present disclosure, at least one connector 514 and at least one electronic device 512 are disposed on a first surface, the at least one connector 514 and the at least one connector 514 a first conductive pattern layer 510 electrically connected to one electronic device 512 , a first dielectric layer 515 disposed under the first conductive pattern layer 510 ; The first ground 520 disposed under the first dielectric layer 515 , the second dielectric layer 525 disposed under the first ground 520 , and the second dielectric layer 525 disposed under the second dielectric layer 525 . The second ground 530 , the third dielectric layer 535 disposed under the second ground 530 , and the third dielectric layer 535 disposed under the third dielectric layer 535 and having at least one antenna array 541 formed thereon. A second conductive pattern layer 540 , and a first portion spaced apart from the first surface of the first conductive pattern layer 510 and covering at least a portion of the first surface and extending from the first portion, 1 conductive pattern layer 510 , the first dielectric layer 515 , the first ground 520 , the second dielectric layer 525 , the second ground 530 , the third dielectric layer 535 and the third 2 A conductive shielding layer 550 including a second portion surrounding at least a portion of a side surface of the conductive pattern layer 540, wherein the conductive shielding layer 550 is insulated from the first ground 520, It may be electrically connected to at least a portion of a side surface of the second ground 530 .

In the above, the present invention has been described according to various embodiments of the present invention, but changes and modifications made by those of ordinary skill in the art to which the present invention pertains without departing from the technical spirit of the present invention also belong to the present invention. Of course.

500: antenna module 512: electronic device
514: connector 510: first conductive pattern layer
516: via 515: first dielectric layer
520: first ground 525: second dielectric layer
530: second ground 535: third dielectric layer
540: second conductive pattern layer 541: antenna array
550: conductive shielding layer 560: heat conductive layer
570: conductive plate

Claims (20)

In an electronic device,
housing;
a printed circuit board provided inside the housing;
a wireless communication module, memory and processor mounted on the printed circuit board; and
comprising an antenna module;
The antenna module is
a first conductive pattern layer having at least one connector and at least one electronic device disposed on a first surface facing the first direction and electrically connected to the at least one connector and the at least one electronic device;
a first dielectric layer disposed on a second surface of the first conductive pattern layer facing a second direction opposite to the first direction;
a first ground disposed on a third surface of the first first dielectric layer facing the second direction;
a second dielectric layer disposed on a fourth surface of the first ground facing the second direction;
a second ground disposed on a fifth surface of the second dielectric layer facing the second direction;
a third dielectric layer disposed on a sixth surface of the second ground facing the second direction;
a second conductive pattern layer disposed on a seventh surface of the third dielectric layer facing the second direction and having at least one antenna array formed thereon; and
A first portion spaced apart from the first surface of the first conductive pattern layer and covering at least a portion of the first surface, and extending from the first portion, the first conductive pattern layer, the first dielectric layer, and the first portion a conductive shielding layer including a second portion surrounding at least a portion of side surfaces of the first ground, the second dielectric layer, the second ground, the third dielectric layer, and the second conductive pattern layer;
The conductive shielding layer is insulated from the first ground and is electrically connected to at least a portion of a side surface of the second ground. The method of claim 1,
The at least one connector is electrically connected to a printed circuit board of the electronic device. The method of claim 1,
The antenna module is an electronic device that performs ^{5 th} generation (5G) communication using a frequency band in the range of 3 GHz to 300 GHz. The method of claim 1,
The at least one electronic device includes a radio frequency integrate circuit (RFIC) or a power manage integrate circuit (PMIC). The method of claim 1,
The first conductive pattern layer includes, on the first surface, a ground pattern in contact with the terminal of the at least one electronic device. 6. The method of claim 5,
The ground pattern is formed to be spaced inwardly by a predetermined distance from a side surface of the first conductive pattern layer, and is electrically connected to the first ground. 7. The method of claim 6,
and the first conductive pattern layer includes at least one via formed at a position corresponding to the ground pattern. 8. The method of claim 7,
The at least one via is disposed inwardly spaced apart from a side surface of the first dielectric layer by a predetermined distance. The method of claim 1,
An electronic device having a heat conductive layer formed of a conductive material disposed on the conductive shielding layer. 10. The method of claim 9,
An electronic device having a conductive plate disposed on the heat conductive layer. In the antenna module,
a first conductive pattern layer having at least one connector and at least one electronic device disposed on the first surface and electrically connected to the at least one connector and the at least one electronic device;
a first dielectric layer disposed under the first conductive pattern layer;
a first ground disposed under the first dielectric layer;
a second dielectric layer disposed under the first ground;
a second ground disposed under the second dielectric layer;
a third dielectric layer disposed under the second ground;
a second conductive pattern layer disposed under the third dielectric layer and having at least one antenna array formed thereon; and
A first portion spaced apart from the first surface of the first conductive pattern layer and covering at least a portion of the first surface, and extending from the first portion, the first conductive pattern layer, the first dielectric layer, and the first portion a conductive shielding layer including a second portion surrounding at least a portion of side surfaces of the first ground, the second dielectric layer, the second ground, the third dielectric layer, and the second conductive pattern layer;
The conductive shielding layer is insulated from the first ground and is electrically connected to at least a portion of a side surface of the second ground. 12. The method of claim 11,
The at least one connector is an antenna module electrically connected to a printed circuit board of an electronic device. 12. The method of claim 11,
The antenna module includes an antenna module for performing a 5G (5 ^th generation) communication using a frequency band of 3GHz ~ 300GHz range. 12. The method of claim 11,
The at least one electronic element is an antenna module including a radio frequency integrate circuit (RFIC) or a power manage integrate circuit (PMIC). 12. The method of claim 11,
The first conductive pattern layer includes, on the first surface, a ground pattern in contact with the terminal of the at least one electronic device. 16. The method of claim 15,
The ground pattern is formed to be spaced apart from a side surface of the first conductive pattern layer by a predetermined distance inward, and is electrically connected to the first ground. 17. The method of claim 16,
and the first conductive pattern layer includes at least one via formed at a position corresponding to the ground pattern. 18. The method of claim 17,
The at least one via is inwardly spaced apart from a side surface of the first dielectric layer by a predetermined distance. 12. The method of claim 11,
An antenna module in which a heat conductive layer made of a conductive material is disposed on the conductive shielding layer. 20. The method of claim 19,
An antenna module having a conductive plate disposed on the heat conductive layer.

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