KR20210104517A - Electronic device - Google Patents

Abstract

The present invention is to provide an electronic device in which an area of an active region is increased. According to an embodiment of the present invention, the electronic device includes: a display panel; a cushion member disposed under the display panel; an electronic module inserted into a hole defined in the display panel and the cushion member; and a light blocking pattern disposed on the electronic module with the display panel interposed therebetween. In a first state where the display panel and the cushion member are folded and a second state where the display panel and the cushion member are unfolded, the electronic module may be spaced apart from a sidewall defining the hole.

Description

Electronic device {ELECTRONIC DEVICE}

The present invention relates to a foldable electronic device.

The electronic device includes an active region activated according to an electrical signal. The electronic device may detect an input applied from the outside through the active area, and simultaneously display various images to provide information to the user. Recently, as electronic devices having various shapes have been developed, active regions having various shapes are being implemented.

An object of the present invention is to provide an electronic device in which an area of an active region is increased.

An object of the present invention is to provide an electronic device with improved product reliability.

According to an embodiment of the present invention, an electronic device includes a display panel, a cushion member disposed under the display panel, an electronic module inserted into the display panel and a hole defined in the cushion member, and the display panel with the display panel interposed therebetween. a light blocking pattern disposed on an electronic module, wherein the electronic module has a sidewall defining the hole in a first state in which the display panel and the cushion member are folded and a second state in which the display panel and the cushion member are unfolded can be separated from

An electronic device according to an exemplary embodiment includes a display panel, an electronic module disposed to overlap a hole defined in the display panel, and an inner diameter and an outer diameter surrounding the inner diameter disposed on the electronic module with the display panel interposed therebetween and a light blocking pattern having a ring shape having a first distance between the inner diameter and an edge of the display panel defining the hole is different from a second distance between the outer diameter and an edge of the display panel defining the hole can do.

According to the present invention, some of the plurality of electronic modules may overlap an active area of the electronic device, and other portions of the plurality of electronic modules may be surrounded by the active area. Accordingly, it is not necessary to separately provide an area in which the plurality of electronic modules are to be arranged in the peripheral area. As a result, the area ratio of the active area to the front surface of the electronic device may be increased.

According to the present invention, a hole defined in the electronic device may include at least two or more hole portions. The sizes of each of the hole portions may be formed to be different from each other in consideration of part tolerance, equipment tolerance, and folding tolerance. Accordingly, even if a hole is provided in the foldable electronic device, interference may not occur between the inner sidewall of the hole and the electronic module inserted into the hole. In addition, the light blocking pattern disposed corresponding to the position of the hole may be designed in consideration of the folding tolerance. Accordingly, the probability that the light blocking pattern covers the active area of the display panel or the field of view area of the electronic module may be reduced.

1A is a perspective view of an electronic device according to an embodiment of the present invention.
1B is a perspective view of an electronic device according to an embodiment of the present invention.
2 is a cross-sectional view of an electronic device according to an embodiment of the present invention taken along line I-I' of FIG. 1A.
3A is a cross-sectional view of a display panel according to an exemplary embodiment.
3B is a cross-sectional view of a display panel according to an exemplary embodiment.
4 is an exploded perspective view illustrating some components of an electronic device according to an embodiment of the present invention.
5 is a rear view illustrating a partial configuration of a display device according to an exemplary embodiment.
6 is a cross-sectional view taken along II-II' of FIG. 1A according to an embodiment of the present invention.
7 is a plan view of an electronic device according to an embodiment of the present invention.
8 is a cross-sectional view taken along line III-III' of FIG. 1A according to an embodiment of the present invention.
9A is an operation perspective view of an electronic device according to an embodiment of the present invention.
9B is a cross-sectional view taken along line IV-IV' of FIG. 9A.
10A is an operation perspective view of an electronic device according to an embodiment of the present invention.
10B is a cross-sectional view taken along line V-V' of FIG. 10A.
11 is a cross-sectional view illustrating a design dimension of an electronic device according to an embodiment of the present invention.

In this specification, when a component (or region, layer, part, etc.) is referred to as being “on,” “connected to,” or “coupled to” another component, it is directly disposed/on the other component. It means that it can be connected/coupled or a third component can be placed between them.

Like reference numerals refer to like elements. In addition, in the drawings, thicknesses, ratios, and dimensions of components are exaggerated for effective description of technical content.

“and/or” includes any combination of one or more that the associated configurations may define.

Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The singular expression includes the plural expression unless the context clearly dictates otherwise.

In addition, terms such as "below", "below", "above", "upper" and the like are used to describe the relationship between the components shown in the drawings. The above terms are relative concepts, and are described based on directions indicated in the drawings.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Also, terms such as terms defined in commonly used dictionaries should be construed as having a meaning consistent with their meaning in the context of the relevant art, and unless they are interpreted in an ideal or overly formal sense, they are explicitly defined herein can be

Terms such as “comprise” or “have” are intended to designate that a feature, number, step, action, component, part, or combination thereof described in the specification is present, and includes one or more other features, numbers, or steps. , it should be understood that it does not preclude the possibility of the existence or addition of , operation, components, parts, or combinations thereof.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1A is a perspective view of an electronic device according to an embodiment of the present invention. 1B is a perspective view of an electronic device according to an embodiment of the present invention. FIG. 1A shows the electronic device 1000 in an unfolded state, and FIG. 1B shows the electronic device 1000 in a folded state.

1A and 1B , the electronic device 1000 may be a device activated according to an electrical signal. For example, the electronic device 1000 may be a mobile phone, a tablet, a car navigation system, a game machine, or a wearable device, but is not limited thereto. 1A exemplarily illustrates that the electronic device 1000 is a mobile phone.

The electronic device 1000 may display an image through the active area 1000A. In the unfolded state of the electronic device 1000 , the active region 1000A may include a plane defined by the first direction DR1 and the second direction DR2 . The thickness direction of the electronic device 1000 may be parallel to the third direction DR3 intersecting the first direction DR1 and the second direction DR2 . Accordingly, the front (or upper surface) and rear (or lower surface) of the members constituting the electronic device 1000 may be defined based on the third direction DR3 .

The active area 1000A may include a first area 1000A1 , a second area 1000A2 , and a third area 1000A3 . The second area 1000A2 may be bent based on the folding axis FX extending in the second direction DR2 . Accordingly, the first area 1000A1 and the third area 1000A3 may be referred to as non-folding areas, and the second area 1000A2 may be referred to as a folding area.

When the electronic device 1000 is folded, the first area 1000A1 and the third area 1000A3 may face each other. Accordingly, in the fully folded state, the active region 1000A may not be exposed to the outside, which may be referred to as in-folding. However, this is an example and the operation of the electronic device 1000 is not limited thereto.

For example, in an embodiment of the present disclosure, when the electronic device 1000 is folded, the first area 1000A1 and the third area 1000A3 may face each other. Accordingly, in the folded state, the active region 1000A may be exposed to the outside, which may be referred to as out-folding.

The electronic device 1000 may be capable of only one of in-folding and out-folding operations. Alternatively, the electronic device 1000 may perform both an in-folding operation and an out-folding operation. In this case, the same area of the electronic device 1000 , for example, the second area 1000A2 may be in-folded and out-folded. Alternatively, some areas of the electronic device 1000 may be in-folded and other partial areas may be out-folded.

In FIGS. 1A and 1B , one folding area and two non-folding areas are illustrated, for example, but the number of folding areas and non-folding areas is not limited thereto. For example, the electronic device 1000 may include more than two non-folding regions and a plurality of folding regions disposed between adjacent non-folding regions.

1A and 1B exemplarily show that the folding axis FX is parallel to the shortened axis of the electronic device 1000, but the present invention is not limited thereto. For example, the folding axis FX may extend along a long axis of the electronic device 1000 , for example, in a direction parallel to the first direction DR1 . In this case, the first area 1000A1 , the second area 1000A2 , and the third area 1000A3 may be sequentially arranged along the second direction DR2 .

A plurality of sensing regions 100SA1 , 100SA2 , and 100SA3 may be defined in the electronic device 1000 . Although three sensing areas 100SA1 , 100SA2 , and 100SA3 are illustrated in FIG. 1A , the number of the plurality of sensing areas 100SA1 , 100SA2 , and 100SA3 is not limited thereto.

The plurality of sensing areas 100SA1 , 100SA2 , and 100SA3 may include a first sensing area 100SA1 , a second sensing area 100SA2 , and a third sensing area 100SA3 . For example, the first sensing area 100SA1 may overlap the camera module, and the second sensing area 100SA2 and the third sensing area 100SA3 may overlap the proximity illuminance sensor, but is not limited thereto. .

Each of the plurality of electronic modules 2000 (refer to FIG. 4 ) receives an external input transmitted through the first sensing area 100SA1 , the second sensing area 100SA2 , or the third sensing area 100SA3 , or The output may be provided through the sensing area 100SA1 , the second sensing area 100SA2 , or the third sensing area 100SA3 .

The first sensing area 100SA1 may be surrounded by the active area 1000A, and the second sensing area 100SA2 and the third sensing area 100SA3 may be included in the active area 1000A. That is, the second sensing area 100SA2 and the third sensing area 100SA3 may display an image. The transmittance of each of the first sensing area 100SA1 , the second sensing area 100SA2 , and the third sensing area 100SA3 may be higher than that of the active area 1000A. Also, the transmittance of the first sensing area 100SA1 may be higher than the transmittance of the second sensing area 100SA2 and the transmittance of the third sensing area 100SA3, respectively.

According to an embodiment of the present invention, some of the plurality of electronic modules 2000 (refer to FIG. 4 ) may overlap the active area 1000A, and another part of the plurality of electronic modules 2000 (refer to FIG. 4 ) may overlap with the active area 1000A. It may be surrounded by the active region 1000A. Accordingly, it is not necessary to provide an area in which the plurality of electronic modules 2000 (refer to FIG. 4 ) will be disposed in the peripheral area 1000NA around the active area 1000A. As a result, the area ratio of the active area 1000A to the front surface of the electronic device 1000 may be increased.

2 is a cross-sectional view of an electronic device according to an embodiment of the present invention taken along line I-I' of FIG. 1A. 3A is a cross-sectional view of a display panel according to an exemplary embodiment.

Referring to FIG. 2 , the electronic device 1000 may include a display panel 100 , upper functional layers, and lower functional layers.

Referring to FIG. 3A , the display panel 100 may be configured to generate an image and sense an externally applied input. For example, the display panel 100 may include a display layer 110 and a sensor layer 120 . The thickness of the display panel 100 may be 25 micrometers to 35 micrometers, for example, 30 micrometers, and the thickness of the display panel 100 is not limited thereto.

The display layer 110 may be configured to substantially generate an image. The display layer 110 may be a light emitting display layer, for example, the display layer 110 may be an organic light emitting display layer, a quantum dot display layer, or a micro LED display layer.

The display layer 110 may include a base layer 111 , a circuit layer 112 , a light emitting device layer 113 , and an encapsulation layer 114 .

The base layer 111 may include a synthetic resin film. The synthetic resin layer may include a thermosetting resin. The base layer 111 may have a multi-layered structure. For example, the base layer 111 may have a three-layer structure of a synthetic resin layer, an adhesive layer, and a synthetic resin layer. In particular, the synthetic resin layer may be a polyimide-based resin layer, and the material thereof is not particularly limited. The synthetic resin layer may include at least one of acrylic resins, methacrylic resins, polyisoprene, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins. . In addition, the base layer 111 may include a glass substrate or an organic/inorganic composite material substrate.

The circuit layer 112 may be disposed on the base layer 111 . The circuit layer 112 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. An insulating layer, a semiconductor layer, and a conductive layer are formed on the base layer 111 by coating, deposition, etc., and then, the insulating layer, the semiconductor layer, and the conductive layer can be selectively patterned through a plurality of photolithography processes. have. Thereafter, a semiconductor pattern, a conductive pattern, and a signal line included in the circuit layer 112 may be formed.

The light emitting device layer 113 may be disposed on the circuit layer 112 . The light emitting device layer 113 may include a light emitting device. For example, the light emitting device layer 113 may include an organic light emitting material, quantum dots, quantum rods, or micro LEDs.

The encapsulation layer 114 may be disposed on the light emitting device layer 113 . The encapsulation layer 114 may include an inorganic layer, an organic layer, and an inorganic layer sequentially stacked, but the layers constituting the encapsulation layer 114 are not limited thereto.

The inorganic layers may protect the light emitting element layer 113 from moisture and oxygen, and the organic layer may protect the light emitting element layer 113 from foreign substances such as dust particles. The inorganic layers may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include, but is not limited to, an acrylic-based organic layer.

The sensor layer 120 may be disposed on the display layer 110 . The sensor layer 120 may sense an external input applied from the outside. The external input may be a user's input. The user's input may include various types of external inputs, such as a part of the user's body, light, heat, pen, or pressure.

The sensor layer 120 may be formed on the display layer 110 through a continuous process. In this case, it may be expressed that the sensor layer 120 is disposed directly on the display layer 110 . Directly disposed may mean that the third component is not disposed between the sensor layer 120 and the display layer 110 . That is, a separate adhesive member may not be disposed between the sensor layer 120 and the display layer 110 .

Alternatively, the sensor layer 120 may be coupled to each other through the display layer 110 and an adhesive member. The adhesive member may include a conventional adhesive or pressure-sensitive adhesive.

Referring back to FIG. 2 , the upper functional layers may be disposed on the display panel 100 . For example, the upper functional layers may include an anti-reflection member 200 and an upper member 300 .

The anti-reflection member 200 may be referred to as an anti-reflection layer. The anti-reflection member 200 may reduce the reflectance of external light incident from the outside. The anti-reflection member 200 may include a stretchable synthetic resin film. For example, the anti-reflection member 200 may be provided by dyeing an iodine compound on a polyvinyl alcohol film (PVA film). However, this is an example, and the material constituting the anti-reflection member 200 is not limited to the above example. The thickness of the anti-reflection member 200 may be 25 micrometers to 35 micrometers, for example, 31 micrometers, and the thickness of the anti-reflection member 200 is not limited thereto.

The anti-reflection member 200 may be coupled to the display panel 100 through the first adhesive layer 1010 . The first adhesive layer 1010 may be a transparent adhesive layer such as a pressure sensitive adhesive film (PSA), an optically clear adhesive film (OCA), or an optically clear adhesive resin (OCR). . The adhesive layer described below may include a conventional adhesive or pressure-sensitive adhesive. The thickness of the first adhesive layer 1010 may be 20 micrometers to 30 micrometers, for example, 25 micrometers, and the thickness of the first adhesive layer 1010 is not limited thereto.

In an exemplary embodiment, the first adhesive layer 1010 may be omitted, and in this case, the anti-reflection member 200 may be directly disposed on the display panel 100 . In this case, a separate adhesive layer may not be disposed between the anti-reflection member 200 and the display panel 100 .

The upper member 300 may be disposed on the anti-reflection member 200 . The upper member 300 includes a first hard coating layer 310, a protective layer 320, a first upper adhesive layer 330, a window 340, a second upper adhesive layer 350, a light blocking layer 360, a shock absorbing layer ( 370 ), and a second hard coating layer 380 . Components included in the upper member 300 are not limited to the above-described components. At least some of the above-described components may be omitted, and other components may be added.

The first hard coating layer 310 may be a layer disposed on the outermost surface of the electronic device 1000 . The first hard coating layer 310 is a functional layer for improving use characteristics of the electronic device 1000 , and may be coated on the protective layer 320 and provided. For example, anti-fingerprint properties, anti-contamination properties, and anti-scratch properties may be improved by the first hard coating layer 310 .

The protective layer 320 may be disposed under the first hard coating layer 310 . The protective layer 320 may protect components disposed under the protective layer 320 . The protective layer 320 may further include a first hard coating layer 310 and an anti-fingerprint layer to improve properties such as chemical resistance and abrasion resistance. The protective layer 320 may include a film having an elastic modulus at room temperature of 15 GPa or less. The thickness of the passivation layer 320 may be 50 micrometers to 60 micrometers, for example, 55 micrometers, but the thickness of the passivation layer 320 is not limited thereto. In one embodiment, the protective layer 320 may be omitted.

The first upper adhesive layer 330 may be disposed under the protective layer 320 . The protective layer 320 and the window 340 may be coupled to each other by the first upper adhesive layer 330 . The thickness of the first upper adhesive layer 330 may be 20 micrometers to 30 micrometers, for example, 25 micrometers and 25 micrometers, but the thickness of the first upper adhesive layer 330 is not limited thereto.

The window 340 may be disposed under the first upper adhesive layer 330 . The window 340 may include an optically transparent insulating material. For example, the window 340 may include a glass substrate or a synthetic resin film. When the window 340 is a glass substrate, the thickness of the window 340 may be 80 micrometers or less, for example, 30 micrometers, but the thickness of the window 340 is not limited thereto.

When the window 340 is a synthetic resin film, the window 340 may include a polyimide (Pl) film or a polyethylene terephthalate (PET) film.

The window 340 may have a multi-layer structure or a single-layer structure. For example, the window 340 may include a plurality of synthetic resin films bonded with an adhesive, or may include a glass substrate and a synthetic resin film bonded with an adhesive.

The second upper adhesive layer 350 may be disposed under the window 340 . The window 340 and the impact absorbing layer 370 may be coupled to each other by the second upper adhesive layer 350 . The thickness of the second upper adhesive layer 350 may be 30 micrometers to 40 micrometers, for example, 35 micrometers, but the thickness of the second upper adhesive layer 350 is not limited thereto.

In an embodiment of the present invention, the sidewall 340S of the window 340 and the sidewall 350S of the second upper adhesive layer 350 are sidewalls of other layers, for example, the sidewall 100S of the display panel 100 . and the sidewall 320S of the protective layer 320 may be disposed inside the sidewall 320S. Being disposed inside may mean that it is closer to the active area 1000A than other comparison objects.

By the folding operation of the electronic device 1000 , the positional relationship between the respective layers may be changed. According to an embodiment of the present invention, since the sidewall 340S of the window 340 is disposed inside the sidewall 100S of the display panel 100 and the sidewall 320S of the protective layer 320 , a space between the respective layers is provided. Even if the positional relationship is changed, the probability that the sidewall 340S of the window 340 protrudes from the sidewall 320S of the passivation layer 320 may be reduced. Accordingly, the possibility that an external impact is transmitted through the sidewall 340S of the window 340 may be reduced. As a result, the probability that a crack is generated in the window 340 may be reduced.

The first distance 340W between the sidewall 340S of the window 340 and the sidewall 320S of the passivation layer 320 may be greater than or equal to a predetermined distance. Here, the first distance 340W may mean a distance in a direction parallel to the first direction DR1. Also, the first distance 340W may correspond to a distance between the sidewall 340S and the sidewall 320S when viewed in a plan view.

The first distance 340W may be 180 micrometers to 205 micrometers, for example, 196 micrometers, but is not limited thereto. For example, the first distance 340W may be 50 micrometers or more, or 300 micrometers. As the first distance 340W increases, the protective layer 320 protrudes more than the window 340 , and a portion of the protective layer 320 may be bent to be attached to other components, for example, a case. In addition, as the area of the passivation layer 320 increases, the probability that a foreign material introduced from the upper portion of the passivation layer 320 will flow into the lower portion of the passivation layer 320 may be reduced.

Also, the window 340 and the second upper adhesive layer 350 may be adhered to the impact absorbing layer 370 through a lamination process. In consideration of the lamination process tolerance, the area of the window 340 and the second upper adhesive layer 350 may be smaller than the area of the impact absorbing layer 370 . Also, the area of the second upper adhesive layer 350 may be smaller than the area of the window 340 . For example, pressure may be applied to the second upper adhesive layer 350 in the process of attaching the window 340 . The second upper adhesive layer 350 may expand in a direction parallel to the first direction DR1 and the second direction DR2 under pressure. In this case, the area of the second upper adhesive layer 350 may be smaller than the area of the window 340 so that the second upper adhesive layer 350 does not protrude from the window 340 .

When the first upper adhesive layer 330 and the second upper adhesive layer 350 are attached to each other, the window 340 does not slip during a folding operation of the electronic device 1000 , so that a buckling phenomenon occurs in the window 340 . can be However, according to the embodiment of the present invention, the area of the second upper adhesive layer 350 is smaller than the area of the window 340 . Accordingly, the first upper adhesive layer 330 may not be attached to the second upper adhesive layer 350 , and a probability that a foreign material adheres to the second upper adhesive layer 350 may be reduced.

The second distance 350W between the sidewall 350S of the second upper adhesive layer 350 and the sidewall 320S of the passivation layer 320 may be greater than or equal to a predetermined distance. Here, the second distance 350W may mean a distance in a direction parallel to the first direction DR1 . Also, the second distance 350W may correspond to a distance between the sidewall 350S and the sidewall 320S when viewed in a plan view.

The second distance 350W may be 392 micrometers, but is not limited thereto. For example, the second distance 350W may be selected from a range between 292 micrometers and 492 micrometers, but is not limited thereto. The light blocking layer 360 may be disposed between the impact absorbing layer 370 and the second upper adhesive layer 350 . The light blocking layer 360 may be provided by being printed on the upper surface of the impact absorbing layer 370 . The light blocking layer 360 may overlap the peripheral area 1000NA. The light blocking layer 360 may be formed by a coating method as a colored layer. The light blocking layer 360 may include a colored organic material or an opaque metal, and the material constituting the light blocking layer 360 is not limited thereto.

Although FIG. 2 exemplarily illustrates that the light blocking layer 360 is disposed on the upper surface of the impact absorbing layer 370 , the position of the light blocking layer 360 is not limited thereto. For example, the light blocking layer 360 may be provided on the upper surface of the passivation layer 320 , the lower surface of the passivation layer 320 , the upper surface of the window 340 , or the lower surface of the window 340 . In addition, the light blocking layer 360 may be provided in a plurality of layers, and in this case, a portion is an upper surface of the impact absorbing layer 370 , and another portion is an upper surface of the protective layer 320 , a lower surface of the protective layer 320 , a window It may be provided on the upper surface of the 340 or the lower surface of the window 340 .

The impact absorbing layer 370 may be a functional layer for protecting the display panel 100 from external impact. The impact absorbing layer 370 may be selected from films having an elastic modulus of 1 GPa or more at room temperature. The impact absorbing layer 370 may be a stretched film having an optical function. For example, the impact absorbing layer 370 may be an optical axis control film. The thickness of the impact absorption layer 370 may be 35 micrometers to 45 micrometers, for example, 41 micrometers, but the thickness of the impact absorption layer 370 is not limited thereto. In an embodiment of the present invention, the impact absorbing layer 370 may be omitted.

The second hard coating layer 380 may be provided on the surface of the impact absorbing layer 370 . The impact absorbing layer 370 may include a curved surface. An upper surface of the impact absorbing layer 370 may be in contact with the second upper adhesive layer 350 . Accordingly, the curvature of the upper surface of the shock absorbing layer 370 may be filled by the second upper adhesive layer 350 . Accordingly, an optical issue may not occur on the upper surface of the impact absorbing layer 370 . A lower surface of the impact absorbing layer 370 may be planarized by the second hard coating layer 380 . That is, when the first hole 101H (refer to FIG. 4) is provided by being cut to the second adhesive layer 1020, the surface exposed by the first hole 101H (refer to FIG. 4) may have a smooth surface. Accordingly, as the second hard coating layer 380 covers the uneven surface of the impact absorbing layer 370 , haze that may be generated on the uneven surface may be prevented.

The upper member 300 may be coupled to the anti-reflection member 200 through the second adhesive layer 1020 . The second adhesive layer 1020 may include a conventional adhesive or pressure-sensitive adhesive. The thickness of the second adhesive layer 1020 may be 20 micrometers to 30 micrometers, for example, 25 micrometers, and the thickness of the second adhesive layer 1020 is not limited thereto.

The lower functional layers may be disposed under the display panel 100 . For example, the lower functional layers may include a lower protective film 400 , a cushion member 500 , a first lower member 600 , a second lower member 700 , and a step compensation member 800 . Components included in the lower functional layers are not limited to the above-described components. At least some of the above-described components may be omitted, and other components may be added.

The lower protective film 400 may be coupled to the rear surface of the display panel 100 through the third adhesive layer 1030 . The lower protective film 400 may prevent scratches on the rear surface of the display panel 100 during the manufacturing process of the display panel 100 . The lower protective film 400 may be a colored polyimide film. For example, the lower protective film 400 may be an opaque yellow film, but is not limited thereto.

The thickness of the lower protective film 400 may be 30 micrometers to 50 micrometers, for example, 40 micrometers. The thickness of the third adhesive layer 1030 may be 13 micrometers to 25 micrometers, for example, 18 micrometers. However, the thickness of the lower protective film 400 and the thickness of the third adhesive layer 1030 are not limited thereto.

The cushion member 500 may be disposed under the lower protective film 400 . The cushion member 500 may protect the display panel 100 from an impact transmitted from the bottom. The impact resistance of the electronic device 1000 may be improved by the cushion member 500 .

The cushion member 500 may include a first cushion adhesive layer 510 , a barrier film 520 , a cushion layer 530 , and a second cushion adhesive layer 540 . Components included in the cushion member 500 are not limited to the above-described components. At least some of the above-described components may be omitted, and other components may be added.

The first cushion adhesive layer 510 and the second cushion adhesive layer 540 may include a conventional adhesive or pressure-sensitive adhesive. The first cushion adhesive layer 510 may be attached to the lower protective film 400 , and the second cushion adhesive layer 540 may be attached to the first lower member 600 . The thickness of the first cushion adhesive layer 510 may be 20 micrometers to 30 micrometers, for example, 25 micrometers. The thickness of the second cushion adhesive layer 540 may be 4 micrometers to 15 micrometers, for example, 8 micrometers. However, the thickness of the first cushion adhesive layer 510 and the second cushion adhesive layer 540 is not limited thereto.

The barrier film 520 may be provided to improve impact resistance performance. The barrier film 520 may serve to prevent deformation of the display panel 100 . The barrier film 520 may be a synthetic resin film, for example, a polyimide film, but is not limited thereto. The thickness of the barrier film 520 may be 30 micrometers to 40 micrometers, for example, 35 micrometers, but the thickness of the barrier film 520 is not limited thereto.

The cushion layer 530 may include, for example, foam or sponge. The foam may include a polyurethane foam or a thermoplastic polyurethane foam. When the cushion layer 530 includes foam, the cushion layer 530 may be formed using the barrier film 520 as a base layer. For example, the cushion layer 530 may be formed by foaming a foaming agent on the barrier film 520 .

The thickness of the cushion layer 530 may be 80 micrometers to 120 micrometers, for example, 100 micrometers, but the thickness of the cushion layer 530 is not limited thereto.

At least one of the barrier film 520 and the cushion layer 530 may have a color absorbing light. For example, at least one of the barrier film 520 and the cushion layer 530 may be black. In this case, the components disposed under the cushion member 500 may be prevented from being visually recognized from the outside.

The first lower member 600 may be disposed under the cushion member 500 . The first lower member 600 may include a plate 610 , a lower adhesive layer 620 , and a cover layer 630 . Components included in the first lower member 600 are not limited to the above-described components. At least some of the above-described components may be omitted, and other components may be added.

The plate 610 may include a material having an elastic modulus of 60 GPa or more at room temperature. For example, the plate 610 may be SUS304, but is not limited thereto. The plate 610 may support components disposed thereon. Also, the heat dissipation performance of the electronic device 1000 may be improved by the plate 610 .

An opening 611 may be defined in a portion of the plate 610 . The opening 611 may be defined in an area overlapping the second area 1000A2 . On a plane, for example, when viewed in the third direction DR3 , the opening 611 may overlap the second area 1000A2 . The shape of a portion of the plate 610 may be more easily deformed by the opening 611 .

The cover layer 630 may be attached to the plate 610 by the lower adhesive layer 620 . The lower adhesive layer 620 may include a conventional adhesive or pressure-sensitive adhesive. The cover layer 630 may cover the opening 611 of the plate 610 . Accordingly, it is possible to additionally prevent foreign matter from being introduced into the opening 611 .

The cover layer 630 may include a material having a lower elastic modulus than that of the plate 610 . For example, the cover layer 630 may include, but is not limited to, thermoplastic polyurethane.

The thickness of the plate 610 may be 120 micrometers to 180 micrometers, for example, 150 micrometers. The thickness of the lower adhesive layer 620 may be 4 micrometers to 15 micrometers, for example, 8 micrometers. The thickness of the cover layer 630 may be 4 micrometers to 15 micrometers, for example, 8 micrometers. However, the thickness of the plate 610 , the thickness of the lower adhesive layer 620 , and the thickness of the cover layer 630 are not limited to the above-described values.

The second lower members 700 may be disposed under the first lower member 600 . The second lower members 700 may be disposed to be spaced apart from each other. For example, one second lower member 700 may be disposed in the first area 1000A1 , and the other second lower member 700 may be disposed in the third area 1000A3 .

Each of the second lower members 700 may be attached to the first lower member 600 by the fourth adhesive layers 1040 . For example, one fourth adhesive layer 1040 is attached to the lower surface of the first lower member 600 overlapping the first area 1000A1 , and the other fourth adhesive layer 1040 is attached to the third area 1000A3 . ) and may be attached to the lower surface of the first lower member 600 overlapping. That is, the fourth adhesive layers 1040 may not overlap the second area 1000A2 . Each of the fourth adhesive layers 1040 may have a thickness of 8 micrometers to 15 micrometers, for example, 8 micrometers, but the thickness of each of the fourth adhesive layers 1040 is not limited thereto.

Although not shown, a step difference compensation film may be further disposed between each of the second lower members 700 and the first lower member 600 . For example, the step compensation film may be provided in an area overlapping the second area 1000A2 . The adhesive strength of one surface of the step compensation film may have a lower adhesive strength than that of the other surface. For example, the one surface may not have adhesive force. The one surface may be a surface facing the first lower member 600 .

Each of the second lower members 700 may include a lower plate 710 , a heat dissipation sheet 720 , and an insulating film 730 . Components included in each of the second lower members 700 are not limited to the above-described components. At least some of the above-described components may be omitted, and other components may be added.

The lower plate 710 is provided in plurality. One of the lower plates 710 is disposed to overlap a portion of the first area 1000A1 and the second area 1000A2 , and the other of the lower plates 710 is another portion of the second area 1000A2 . , and may be disposed to overlap the third area 1000A3 .

The lower plates 710 may be spaced apart from each other in the second area 1000A2 . However, the lower plates 710 may be disposed as close as possible to support the region in which the opening 611 of the plate 610 is formed. For example, the lower plates 710 may prevent the shape of the region in which the opening 611 of the plate 610 is defined from being deformed by the pressure applied from the upper portion.

In addition, the lower plates 710 may serve to prevent the shape of the components disposed above the second lower members 700 from being deformed by the configuration disposed below the second lower members 700 . .

Each of the lower plates 710 may include a metal alloy, for example, each of the lower plates 710 may include a copper alloy. However, the material constituting the lower plates 710 is not limited thereto. A thickness of each of the lower plates 710 may be 60 micrometers to 100 micrometers, for example, 80 micrometers, and the thickness of the lower plates 710 is not limited thereto.

The heat dissipation sheet 720 may be attached under the lower plate 710 . The heat dissipation sheet may be a heat conductive sheet having high thermal conductivity. For example, the heat dissipation sheet 720 may include a heat dissipation layer 721 , a first heat dissipation adhesive layer 722 , a second heat dissipation adhesive layer 723 , and a gap tape 724 .

The gap tape 724 may be attached to the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723 spaced apart from each other with the heat dissipation layer 721 interposed therebetween. Gap tape 724 may be comprised of a plurality of layers. For example, the gap tape 724 may include a base layer, an upper adhesive layer disposed on an upper surface of the base layer, and a lower adhesive layer disposed on a lower surface of the base layer.

The heat dissipation layer 721 may be attached to the lower plate 710 by the first heat dissipation adhesive layer 722 . The heat dissipation layer 721 may be sealed by the first heat dissipation adhesive layer 722 , the second heat dissipation adhesive layer 723 , and the gap tape 724 . The heat dissipation layer 721 may be a graphitized polymer film. The polymer film may be, for example, a polyimide film. Each of the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723 may have a thickness of 3 micrometers to 8 micrometers, for example, 5 micrometers, and the heat dissipation layer 721 and the gap tape ( 724) each thickness may be between 10 micrometers and 25 micrometers, for example, 17 micrometers. However, the thickness of each of the first heat dissipation adhesive layer 722 , the second heat dissipation adhesive layer 723 , the heat dissipation layer 721 , and the gap tape 724 is not limited to the above-described values.

The insulating film 730 may be attached under the heat dissipation sheet 720 . For example, the insulating film 730 may be attached to the second heat dissipation adhesive layer 723 . Generation of a rattle in the electronic device 1000 may be prevented by the insulating film 730 . The thickness of the insulating film 730 may be 15 micrometers, but is not limited thereto.

The step compensation member 800 may be attached under the plate 610 . For example, a lower adhesive layer 620 may be attached to a portion of the plate 610 , and a step difference compensating member 800 may be attached to a portion of the other portion of the plate 610 .

The step compensation member 800 may include a first compensation adhesive layer 810 , a step compensation film 820 , and a second compensation adhesive layer 830 . The first compensation adhesive layer 810 may be attached to the lower surface of the plate 610 . The step compensation film 820 may be a synthetic resin film. The second compensation adhesive layer 830 may be attached to the lower surface of the step compensation film 820 and a set (not shown).

3B is a cross-sectional view of a display panel according to an exemplary embodiment.

Referring to FIG. 3B , the display panel 100aa may further include an anti-reflection layer 130 when compared to the display panel 100 described above with reference to FIG. 3A . In this case, in the electronic device 1000 (refer to FIG. 2 ) including the display panel 100aa, the anti-reflection member 200 (refer to FIG. 2 ) and the first adhesive layer 1010 (refer to FIG. 2 ) may be omitted.

The display panel 100aa may include a display layer 110 , a sensor layer 120 , and an anti-reflection layer 130 .

The anti-reflection layer 130 according to an embodiment of the present invention may include color filters. The color filters may have a predetermined arrangement. An arrangement of color filters may be determined in consideration of emission colors of pixels included in the display layer 110 . In addition, the anti-reflection layer 130 may further include a black matrix adjacent to the color filters.

The anti-reflection layer 130 according to an embodiment of the present invention may include a destructive interference structure. For example, the destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light respectively reflected from the first and second reflective layers may be destructively interfered, and thus external light reflectance may be reduced.

4 is an exploded perspective view illustrating some components of an electronic device according to an embodiment of the present invention.

Referring to FIG. 4 , a light blocking layer 360 , a display panel 100 , and a plurality of electronic modules 2000 among components of the electronic device 1000 (refer to FIG. 2 ) are exemplarily illustrated. The plurality of electronic modules 2000 may include a camera module 2100 and a proximity illuminance sensor 2200 .

The proximity illuminance sensor 2200 may include a light emitting module 2210 and a light receiving module 2220 . The light emitting module 2210 and the light receiving module 2220 may be mounted on one substrate. The light emitting module 2210 may generate and output light. For example, the light emitting module 2210 may output infrared rays, and the light emitting module 2210 may include a light emitting diode. The light receiving module 2220 may detect infrared rays. The light receiving module 2220 may be activated when infrared rays above a predetermined level are detected. The light receiving module 2220 may include a CMOS sensor. After the infrared light generated by the light emitting module 2210 is output, it is reflected by an external subject (eg, a user's finger or face), and the reflected infrared light may be incident on the light receiving module 2220 .

An active area 100A and a peripheral area 100NA may be defined in the display panel 100 . The active area 100A may correspond to the active area 1000A illustrated in FIG. 1A , and the peripheral area 100NA may correspond to the peripheral area 1000NA illustrated in FIG. 1A .

The first sensing area 100SA1 overlapping the camera module 2100 may be surrounded by the active area 100A, and the second sensing area 100SA2 overlapping the light emitting module 2210 and the light receiving module 2220 and The overlapping third sensing area 100SA3 may be a portion of the active area 100A.

A first hole 101H may be defined in a portion of the display panel 100 . The first hole 101H may be provided to correspond to the first sensing area 100SA1. Accordingly, the camera module 2100 may receive an external input transmitted through the first hole 101H.

The light blocking layer 360 may include a first light blocking pattern 361 and a second light blocking pattern 362 . The first blocking pattern 361 may be a pattern covering the peripheral area 100NA. When viewed in a plan view, the second blocking pattern 362 may surround the camera module 2100 .

5 is a rear view illustrating a partial configuration of a display device according to an exemplary embodiment.

4 and 5 , the display panel 100 , the step compensation member 800 , the heat dissipation layer 721 , and the gap tape 724 are exemplarily illustrated.

A first hole 101H, a second hole 102H, and a third hole 103H are formed in correspondence to the first sensing area 100SA1, the second sensing area 100SA2, and the third sensing area 100SA3, respectively. may be provided.

The first hole 101H, the second hole 102H, and the third hole 103H may be provided by removing some components of the electronic device 1000 (refer to FIG. 1A ), which will be described in detail later.

The first hole 101H may be provided to overlap the step compensation member 800 , and each of the second hole 102H and the third hole 103H may be provided to overlap the gap tape 724 . Accordingly, when viewed in a plan view, the first hole 101H is surrounded by the step compensation member 800 , and each of the second hole 102H and the third hole 103H can be surrounded by the gap tape 724 . have.

6 is a cross-sectional view taken along II-II' of FIG. 1A according to an embodiment of the present invention.

Referring to FIG. 6 , the first hole 101H into which the camera module 2100 is inserted is shown. The first hole 101H may include a first hole portion 101H1 , a second hole portion 101H2 , and a third hole portion 101H3 .

The first hole portion 101H1 is defined by the first sidewall SW1, the second hole portion 101H2 is defined by the second sidewall SW2, and the third hole portion 101H3 is defined by the third sidewall SW1. SW3) can be defined.

The sizes of the first hole portion 101H1 , the second hole portion 101H2 , and the third hole portion 101H3 may be different from each other. For example, the size of the first hole portion 101H1 is the smallest, the size of the second hole portion 101H2 is the largest, and the third hole portion 101H3 is the size and the second hole portion of the first hole portion 101H1. It may have a size between the size of the hole portion 101H2.

The first hole portion 101H1 may be formed by a laser cutting process. For example, a laser may be used to cut from the lower protective film 400 to the second adhesive layer 1020 . The second hole portion 101H2 may be a portion provided on the cushion member 500 , and the cushion member 500 may be punched to form the second hole portion 101H2 . The cushion member 500 in which the second hole portion 101H2 is formed may be attached to the lower protective film 400 . The plate 610 and the step compensation member 800 may be punched to form a third hole portion 101H3 .

According to an embodiment of the present invention, the cushion member 500 on which the second hole portion 101H2 is formed is attached to the plate 610 on which the third hole portion 101H3 is formed, after which the cushion member 500 is formed. It may be attached to the lower protective film 400 . Accordingly, the sizes of the first hole portion 101H1 , the second hole portion 101H2 , and the third hole portion 101H3 may be formed to be different from each other in consideration of the component tolerance, the equipment tolerance, and the folding tolerance.

The folding tolerances may be tolerances generated by a folding operation of the electronic device 1000 . For example, it may be a tolerance in consideration of the amount of movement (or slip) of each component when the electronic device 1000 is fully folded, and a tolerance in consideration of the amount of unrestored movement of each component when unfolding after folding.

According to an embodiment of the present invention, since sizes of the first hole portion 101H1 , the second hole portion 101H2 , and the third hole portion 101H3 are determined in consideration of the folding tolerance, the first hole 101H ) and the electronic module inserted into the first hole 101H, for example, the camera module 2100 may not interfere with each other. In addition, the second light blocking pattern 362 disposed to correspond to the position of the first hole 101H may also be disposed in consideration of the folding tolerance. Accordingly, even when the electronic device 1000 is folded and unfolded, the second blocking pattern 362 may cover the active area 100A (refer to FIG. 4 ) of the display panel 100 or the angle of view area 2100AV of the camera module 2100 . ) can be reduced.

The camera module 2100 may be disposed to be inserted into the first hole 101H. A second upper adhesive layer 350 , a light blocking layer 360 , an impact absorbing layer 370 , and a second hard coating layer 380 may be disposed between the camera module 2100 and the window 340 . Accordingly, since at least one or more layers are disposed between the camera module 2100 and the window 340 , the possibility that the window 340 is damaged by the camera module 2100 may be reduced. Accordingly, product reliability can be improved.

The upper surface 2100U of the camera module 2100 may be located in the second hole portion 101H2 provided in the cushion member 500 . The second hole portion 101H2 may be a hole portion having the largest diameter among the first to third hole portions 101H1 , 101H2 , and 101H3 . Accordingly, even if the electronic device 1000 is folded and the positional relationship between the layers is changed, the probability of colliding with the second sidewall SW2 of the camera module 2100 may be reduced. Accordingly, product reliability can be improved.

The position of the upper surface 2100U of the camera module 2100 is not limited to the example illustrated in FIG. 6 . For example, the upper surface 2100U of the camera module 2100 may be disposed in the first hole portion 101H1 . In this case, the width 362W of the area surrounded by the second light blocking pattern 362 can be designed to be smaller than when the upper surface 2100U of the camera module 2100 is disposed on the second hole portion 101H2. have.

For example, the second blocking pattern 362 may be designed not to overlap the angle of view area 2100AV of the camera module 2100 . When viewed in a plan view, the second light blocking pattern 362 may be disposed to be spaced apart from the angle of view area 2100AV of the camera module 2100 by a predetermined distance in consideration of process errors. Since the camera module 2100 is closer to the second blocking pattern 362 , even if the width 362W of the area surrounded by the second blocking pattern 362 is reduced, the second blocking pattern 362 is the camera module. The angle of view region 2100AV of 2100 may not be blocked.

According to an embodiment of the present invention, the distance DT between the camera module 2100 and the window 340 may be secured to a predetermined distance or more. When the distance DT between the camera module 2100 and the window 340 is secured to be greater than or equal to a predetermined distance, the probability that the window 340 is damaged by the camera module 2100 may be reduced. Accordingly, product reliability can be improved. The damage may be a crack when the window 340 is a glass substrate, and may be a dent when the window 340 is a synthetic resin film.

For example, the distance DT may be 60% or more and less than 200% of the total sum of thicknesses of components having a modulus equal to or less than a reference modulus among components in which the first hole 101H is defined. Components in which the first hole 101H is defined in FIG. 3 may correspond to components disposed under the second hard coating layer 380 . The reference modulus may be 100 MPa or less, for example, 50 MPa or less and 0 MPa or more.

Components satisfying the above conditions are the first adhesive layer 1010 , the second adhesive layer 1020 , the third adhesive layer 1030 , the first cushion adhesive layer 510 , the cushion layer 530 , and the second cushion adhesive layer 540 . , a first compensation adhesive layer 810 and a second compensation adhesive layer 830 .

The thickness of the first adhesive layer 1010 is 25 micrometers, the thickness of the second adhesive layer 1020 is 25 micrometers, the thickness of the third adhesive layer 1030 is 18 micrometers, and the thickness of the first cushion adhesive layer 510 is 25 Micrometer, the thickness of the cushion layer 530 is 100 micrometers, the thickness of the second cushion adhesive layer 540 is 8 micrometers, the thickness of the first compensation adhesive layer 810 is 17 micrometers, and the second compensation adhesive layer 830 is may have a thickness of 17 micrometers. Each of the thicknesses may have a process error. Accordingly, the sum of the thicknesses may be 183 micrometers to 300 micrometers, for example, 235 micrometers. However, the sum of the thicknesses is not limited thereto.

The distance DT between the camera module 2100 and the window 340 may be determined in consideration of the maximum compression ratio of layers having a modulus less than or equal to the reference modulus. For example, the distance DT may be greater than or equal to a value obtained by multiplying the sum of the thicknesses by the maximum compression ratio. The distance DT may be 110 micrometers or more, for example, 141 micrometers or more.

According to an embodiment of the present invention, even if the components are maximally compressed by the pressure generated while using the electronic device 1000 , the window 340 and the camera module 2100 may be spaced apart from each other by a predetermined distance. Accordingly, the probability that the window 340 is damaged by the camera module 2100 may be greatly reduced. Accordingly, product reliability can be improved.

7 is a plan view of an electronic device according to an embodiment of the present invention.

7 , a second light blocking pattern 362 , a first sidewall SW1 , a second sidewall SW2 , and a third sidewall SW3 are exemplarily illustrated.

When viewed in a plan view, the first sidewall SW1 may overlap the second blocking pattern 362 , and the second sidewall SW2 and the third sidewall SW3 may not overlap the second blocking pattern 362 . can When viewed in a plan view, the third sidewall SW3 may surround the second light blocking pattern 362 , and the second sidewall SW2 may surround the third sidewall SW3 .

6 and 7 , the first width WT1 of the first hole portion 101H1 , the second width WT2 of the second hole portion 101H2 , and the third width of the third hole portion 101H3 The width WT3 can all be different. For example, the second width WT2 may be greater than the first width WT1 and the third width WT3 , and the third width WT3 may be greater than the first width WT1 .

8 is a cross-sectional view taken along line III-III' of FIG. 1A according to an embodiment of the present invention.

Referring to FIG. 8 , the third hole 103H into which the light receiving module 2220 is inserted is shown. Since the second hole 102H (refer to FIG. 5) into which the light emitting module 2210 (see FIG. 4) is inserted may have substantially the same cross-sectional structure as the third hole 103H, the second hole 102H (refer to FIG. 5) It may be understood through the following description.

The third hole 103H may include a first hole portion 103H1 and a second hole portion 103H2 . The first hole portion 103H1 may be defined by the first sidewall SW13 , and the second hole portion 103H2 may be defined by the second sidewall SW23 .

The sizes of the first hole portion 103H1 and the second hole portion 103H2 may be different from each other. For example, the size of the first hole portion 103H1 may be greater than the size of the second hole portion 103H2 .

The first hole portion 103H1 may be a portion provided on the cushion member 500 , and the cushion member 500 may be punched to form the first hole portion 103H1 . The first lower member 600 and the second lower member 700 may be punched to form a second hole portion 103H2 .

The third hole 103H may not be provided in the display panel 100 . For example, the third hole 103H may be provided only in at least some of the components disposed under the display panel 100 . Accordingly, a portion of the display panel 100 overlapping the third hole 103H may display an image and sense an external input.

The first hole 101H (refer to FIG. 6 ) may pass through the display panel 100 , but the third hole 103H may not pass through the display panel 100 . That is, the depth DT1 of the first hole 101H (refer to FIG. 6 ) may be greater than the depth DT2 of the third hole 103H.

9A is an operation perspective view of an electronic device according to an embodiment of the present invention. 9B is a cross-sectional view taken along line IV-IV' of FIG. 9A. 10A is an operation perspective view of an electronic device according to an embodiment of the present invention. 10B is a cross-sectional view taken along line V-V' of FIG. 10A.

9A illustrates a state in which the electronic device 1000 is fully folded. This may be referred to as the first state. 9B is a cross-sectional view of the first sensing area 100SA1 of the electronic device 1000 folded in the state shown in FIG. 9A . 10A illustrates a state in which the electronic device 1000 is folded and then unfolded again. This may be referred to as the second state. 10B is a cross-sectional view of the first sensing area 100SA1 of the electronic device 1000 that is unfolded in the state shown in FIG. 10A .

9A, 9B, 10A, and 10B are views illustrating the electronic device 1000 disposed in the chamber to measure the amount of positional movement and the amount of unrestored movement between each component according to folding and unfolding. have.

9A and 10A , the electronic device 1000 is exemplarily illustrated, but is not limited thereto. For example, a test may be performed using only some components of the electronic device 1000 , or a product designed similarly to the electronic device 1000 may be tested.

Since the adhesive layers and tapes frequently slip due to shearing in a high-temperature environment, in order to measure the amount of position movement and the amount of unrestored movement according to folding and unfolding, the electronic device 1000 in a high-temperature chamber testing can be carried out. The high temperature may be, for example, 60 degrees Celsius, but is not limited thereto.

9A and 9B , when the electronic device 1000 is folded, shapes of components having relatively low modulus may be deformed. For example, shapes of the second adhesive layer 1020 , the first adhesive layer 1010 , the third adhesive layer 1030 , the first cushion adhesive layer 510 , and the second cushion adhesive layer 540 may be deformed. For example, the side surfaces of the deformed second adhesive layer 1020, the first adhesive layer 1010, the third adhesive layer 1030, the first cushion adhesive layer 510, and the second cushion adhesive layer 540 are in the third direction ( DR3) may have inclined sides.

In FIG. 9B , the positions of the components in a state before folding are shown by dotted lines, and positions of the components in a fully folded state are shown by a solid line. Positions of components disposed on the plate 610 with respect to the plate 610 may be modified. The plate 610 may be SUS304, and may be a rigid material. Accordingly, the position of the components disposed on the plate 610 with respect to the plate 610 may be deformed in a direction crossing the folding axis FX (refer to FIG. 1A ), for example, in the second direction DR2. .

According to an embodiment of the present invention, in a state in which the electronic device 1000 is fully folded, the camera module 2100 does not collide with the sidewalls constituting the first hole 101H, and the second light blocking pattern 362 is The positions of the first hole 101H and the second light blocking pattern 362 may be designed so as not to block the angle of view area 2100AV of the camera module 2100 . A detailed description related thereto will be provided later.

Referring to FIGS. 10A and 10B , even when the electronic device 1000 is unfolded again, some of the shapes of the deformed components may not be restored. In FIG. 10B , the positions of the components before folding are shown with dotted lines, and positions of the components after being fully folded are shown with solid lines.

According to an embodiment of the present invention, when the electronic device 1000 is unfolded again, the positions of the first hole 101H and the second blocking pattern 362 are changed in consideration of positions of unrestored components. can be designed A detailed description related thereto will be provided later.

11 is a cross-sectional view illustrating a design dimension of an electronic device according to an embodiment of the present invention.

9A, 9B, 10A, 10B, and 11 , a first design target FD1, a second design target FD2, a third design target FD3, and a fourth design target FD4 , a fifth design object FD5 , a sixth design object FD6 , a seventh design object FD7 , and an eighth design object FD8 are illustrated.

The second light blocking pattern 362 may have a ring shape having an inner diameter 362I and an outer diameter 362O surrounding the inner diameter 362I. The first design target FD1 is a distance between the edge 100E of the display panel 100 and the inner diameter 362I of the second blocking pattern 362 . The second design target FD2 is a distance between the edge 100E of the display panel 100 and the outer diameter 362O of the second blocking pattern 362 .

The third design target FD3 is a distance between the outer diameter 362O of the second blocking pattern 362 and the active area 100A of the display panel 100 . The fourth design target FD4 is a distance between the inner diameter 362I of the second blocking pattern 362 and the angle of view area 2100AV. The fifth design target FD5 is a distance between the edge 100E of the display panel 100 and the camera module 2100 . The sixth design target FD6 is a distance between the edge 100E of the display panel 100 and the cushion member 500 . The seventh design target FD7 is a distance between the edge 100E of the display panel 100 and the plate 610 . The eighth design target FD8 is a distance between the plate 610 and the step compensation member 800 .

All of the above-described distances may be distances in a direction parallel to the first direction DR1 . Also, the above-described distances may correspond to a distance between two components when the electronic device 1000 is viewed on a plane.

First design object FD1, second design object FD2, third design object FD3, fourth design object FD4, fifth design object FD5, sixth design object FD6, seventh Each of the design target FD7 and the eighth design target FD8 may be designed in consideration of a component tolerance, equipment tolerance, characteristic tolerance, and folding tolerance.

For example, the component tolerance includes a tolerance generated in the process of printing the second blocking pattern 362 , a tolerance for the size of the second blocking pattern 362 , a tolerance for the position of the second blocking pattern 362 , and display Tolerance for the position of the alignment mark of the panel 100 , the tolerance for the outside of the cushion member 500 , the tolerance for the size of the second hole portion 101H2 of the cushion member 500 , and the tolerance for the cushion member 500 . Tolerance for the position of the second hole portion 101H2, the tolerance for the outside of the plate 610, the tolerance for the size of the third hole portion 101H3 of the plate 610, the third hole portion of the plate 610 ( 101H3), and the like.

For example, the equipment tolerance is a tolerance generated in a process of laser cutting the first hole portion 101H1 , a tolerance generated in a process of laminating the upper member 300 to a configuration including the display panel 100 , and a cushion member The tolerance generated in the process of laminating the 500 to the configuration including the display panel 100 and the tolerance generated in the process of laminating the cushion member 500 to the plate 610 may be included. The configuration including the display panel 100 may refer to the second adhesive layer 1020 to the lower protective film 400 .

For example, the characteristic tolerance may be a tolerance due to high-temperature shrinkage of the anti-reflection member 200 and the second adhesive layer 1020 .

For example, the folding tolerance is the tolerance generated by the folding operation of the electronic device 1000 . The movement amount DS1 of the display panel 100 measured with respect to the plate 610 in the folded state, the second light blocking The unreconstructed movement amount DS2 of the pattern 362 , the unrestored movement amount DS3 between the anti-reflection member 200 and the layer including the second blocking pattern 362 , the display panel 100 and the second blocking pattern 362 ) 362 , the unreconstructed movement amount DS4 between the layers, and the like.

In Table 1 below, part tolerance data and equipment tolerances for determining the dimensions of each of the first design object FD1, the second design object FD2, the fourth design object FD4, and the fifth design object FD5 Data were recorded.

Tolerance type Tolerance (mm) Tolerance generated in the process of printing the second light blocking pattern 362 0.05 Tolerance for the size of the second blocking pattern 362 0.04 Tolerance for the position of the second light blocking pattern 362 0.1 Tolerance for the position of the alignment mark of the display panel 100 0.01 Tolerance generated in the process of laser cutting the first hole portion 101H1 0.09 Tolerance generated in the process of laminating the upper member 300 to a configuration including the display panel 100 . 0.125 1st RSS (Part Tolerance + Equipment Tolerance) 0.195

The first RSS (Root Sum of Squares) value may be calculated by Equation 1 below. Formula 1:

The dimension of the first design target FD1 may be determined based on a value obtained by adding the first RSS value to the first other tolerances. The first other tolerances may include a tolerance due to steaming generated by the second adhesive layer 1020 and a tolerance generated as components of the electronic device 1000 are not restored. In detail, the tolerance generated as the restoration is not restored may be an unrestored movement amount DS4 (refer to FIG. 10B ) between the display panel 100 and the layer including the second blocking pattern 362 . For example, it may be an unrestored movement amount DS4 (refer to FIG. 10B ) between the display panel 100 and the upper member 300 . The tolerance due to the adhesive layer steaming phenomenon may be 0.05 mm, and the unrestored movement amount (DS4, see FIG. 10B) may be 0.094 mm.

The sum of the first RSS value and the first other tolerances may be 0.339 mm. Since the angle of view area 2100AV and the second blocking pattern 362 should not overlap, it may be advantageous as the design dimension of the first design target FD1 is smaller than the calculated value. Accordingly, the first design target FD1 may be designed with a value smaller than the calculated value. For example, the first design target FD1 may be designed to be 0.287 mm.

The dimension of the second design target FD2 may be determined based on a sum of the first RSS value and the second other tolerances. The second other tolerances may include tolerances caused by high-temperature shrinkage of the anti-reflection member 200 and the second adhesive layer 1020 , and tolerances generated when components of the electronic device 1000 are not restored. Specifically, there may be an unrestored movement amount DS3 (refer to FIG. 10B ) between the anti-reflection member 200 and the layer including the second light blocking pattern 362 . For example, it may be the unrestored movement amount DS3 between the anti-reflection member 200 and the upper member 300 . The tolerance due to the high temperature shrinkage of the adhesive layer may be 0.03 mm, and the unrestored movement amount (DS3, see FIG. 10B ) may be 0.014 mm.

The sum of the first RSS value and the second other tolerances may be 0.241 mm. The second design target FD2 may be designed with a calculated numerical value. Accordingly, the second design target FD2 may be designed to be 0.241 mm.

The second light blocking pattern 362 may be provided to prevent light blur from occurring in the camera module 2100 . Accordingly, the dimension of the first design target FD1 may be designed to be larger than the dimension of the second design target FD2 .

The dimension of the fourth design target FD4 may be designed based on the sum of the first RSS value and the fourth other tolerance. The fourth other tolerance may be an unrestored movement amount DS2 (refer to FIG. 10B ) of the second blocking pattern 362 . The unrestored movement amount (DS2, see FIG. 10B) may be 0.051 mm.

The sum of the first RSS value and the fourth other tolerance may be 0.246 mm. The fourth design target FD4 may be selected within a predetermined range based on the calculated value. For example, the fourth design target FD4 may be designed to be 0.0245 mm.

The dimension of the fifth design target FD5 may be designed based on the sum of the first RSS value and the fifth other tolerance. The fifth other tolerance may be a movement amount DS1 of the display panel 100 measured with respect to the plate 610 . For example, the distance DS1a between the plate 610 before folding and the edge 100E of the display panel 100 and the distance between the plate 610 in the fully folded state and the edge 100E of the display panel 100 are The movement amount DS1 of the display panel 100 may be measured as the distance DS1b.

The sum of the first RSS value and the fifth other tolerance may be 0.320. The fifth design target FD5 may be designed based on the calculated value. In consideration of the case in which the upper surface 2100U of the camera module 2100 is disposed up to the first hole portion 101H1 , the fifth design target FD5 is provided so that the display panel 100 and the camera module 2100 do not collide. can be designed to be larger than the calculated value. For example, the fifth design target FD5 may be designed to be 0.483 mm.

In Table 2 below, part tolerance data and equipment tolerance data for determining the dimension of the third design target FD3 are described.

Tolerance type Tolerance (mm) Tolerance generated in the process of printing the second light blocking pattern 362 0.05 Tolerance for the size of the second blocking pattern 362 0.04 Tolerance for the position of the second light blocking pattern 362 0.1 Tolerance for the position of the alignment mark of the display panel 100 0.01 Tolerance generated in the process of laminating the upper member 300 to a configuration including the display panel 100 . 0.125 2nd RSS (Part Tolerance + Equipment Tolerance) 0.173

The second RSS value may be calculated by Equation 2 below.

Formula 2:

The dimension of the third design target FD3 may be determined based on the sum of the second RSS value and the third other tolerance. The third other tolerance may be an unreconstructed movement amount DS4 (refer to FIG. 10B ) between the display panel 100 and the layer including the second blocking pattern 362 . For example, it may be an unrestored movement amount DS4 (refer to FIG. 10B ) between the display panel 100 and the upper member 300 . The unrestored movement amount (DS4, see FIG. 10B ) may be 0.094 mm.

The sum of the second RSS value and the third other tolerance may be 0.267. As the design value of the third design target FD3 decreases, the area of a region other than the active region 100A may decrease. Accordingly, the design dimension of the third design target FD3 may be designed to be smaller than the calculated value. For example, the third design target FD3 may be designed to be 0.230 mm.

In Table 3 below, part tolerance data and equipment tolerance data for determining the dimension of the sixth design target FD6 are described.

Tolerance type Tolerance (mm) Tolerance for the cushion member 500 perimeter 0.075 Tolerance for the size of the second hole portion 101H2 of the cushion member 500 0.05 Tolerance for the position of the second hole portion 101H2 of the cushion member 500 0.15 Tolerance for the position of the alignment mark of the display panel 100 0.01 Tolerance for the outer edge of the plate 610 0.06 Tolerance generated in the process of laser cutting the first hole portion 101H1 0.09 Tolerance occurring in the process of laminating the cushion member 500 to the configuration including the display panel 100 . 0.125 Tolerance generated in the process of laminating the cushion member 500 to the plate 610 0.150 3rd RSS (Part Tolerance + Equipment Tolerance) 0.284

The third RSS value may be calculated by Equation 3 below.

Equation 3:

The dimension of the sixth design target FD6 may be designed based on the third RSS value. For example, the sixth design target FD6 may be designed to be 0.3 mm.

In Table 4 below, part tolerance data and equipment tolerance data for determining the dimension of the seventh design object FD7 are described.

Tolerance type Tolerance (mm) Tolerance for the outer edge of the plate 610 0.06 Tolerance for the size of the third hole portion 101H3 of the plate 610 0.05 Tolerance for the position of the third hole portion 101H3 of the plate 610 0.1 Tolerance for the position of the alignment mark of the display panel 100 0.01 Tolerance generated in the process of laser cutting the first hole portion 101H1 0.09 Tolerance generated in the process of laminating the cushion member 500 to the plate 610 0.150 4th RSS (Part Tolerance + Equipment Tolerance) 0.216

The fourth RSS value may be calculated by Equation 4 below.

Formula 4:

The dimension of the seventh design target FD7 may be designed based on the fourth RSS value. For example, the seventh design target FD7 may be designed to be 0.22 mm. The eighth design target FD8 may be designed to be 0.5 mm.

6, 7, and 11 , the first width WT1 of the first hole portion 101H1, the second width WT2 of the second hole portion 101H2, and the third hole portion 101H3 ) may have different third widths WT3. For example, the second width WT2 may be greater than the first width WT1 . For example, the second width WT2 may correspond to a value obtained by adding the dimension of the sixth design target FD6 to the first width WT1 twice. Accordingly, the difference between the first width WT1 and the second width WT2 may be 0.6 mm. The difference between the second width WT2 and the third width WT3 may correspond to a value obtained by adding the dimension of the seventh design target FD7 twice. Accordingly, the difference between the second width WT2 and the third width WT3 may be 0.44 mm.

The positional relationship between the second light blocking pattern 362 and the first sidewall SW1 may be determined in consideration of the dimensions of the first design target FD1 and the dimensions of the second design target FD2 . For example, the second blocking pattern 362 may have a width of 0.214 mm in a direction toward the active region 100A with respect to the first sidewall SW1 , and the second blocking pattern 362 may have a width of the first sidewall SW1 . It may have a width of 0.287 mm in a direction toward the angle-of-view region 2100AV with respect to SW1.

According to the present invention, the first hole 101H defined in the electronic device 1000 may include at least two or more hole portions 101H1 , 101H2 , and 101H3 . The sizes of the hole portions 101H1 , 101H2 , and 101H3 may be formed to be different from each other in consideration of part tolerance, equipment tolerance, and folding tolerance. Accordingly, even if the first hole 101H is provided in the foldable electronic device 1000 , interference may not occur between the inner sidewall of the first hole 101H and the camera module 2100 . Also, the second light blocking pattern 362 disposed to correspond to the position of the first hole 101H may be designed in consideration of the folding tolerance. Accordingly, the probability that the second blocking pattern 362 covers the active area 100A of the display panel 100 or the angle of view area 2100AV of the camera module 2100 may be reduced.

Although the above has been described with reference to the preferred embodiment of the present invention, those skilled in the art or those having ordinary knowledge in the technical field will not depart from the spirit and technical scope of the present invention described in the claims to be described later. It will be understood that various modifications and variations of the present invention can be made without departing from the scope of the present invention. Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

1000: display device 100: display panel
200: anti-reflection member 300: upper member
400: lower protective film 500: cushion member
600: first lower member 700: second lower member

Claims (20)

display panel;
a cushion member disposed under the display panel;
an electronic module inserted into a hole defined in the display panel and the cushion member; and
and a light blocking pattern disposed on the electronic module with the display panel interposed therebetween;
In a first state in which the display panel and the cushion member are folded and a second state in which the display panel and the cushion member are unfolded, the electronic module is spaced apart from a sidewall defining the hole. According to claim 1,
In the first state and the second state, the light blocking pattern is spaced apart from a field of view area of the electronic module. According to claim 1,
The hole includes a first hole portion defined in the display panel and a second hole portion defined in the cushion member, and a width of the first hole portion is greater than a width of the second hole portion. 4. The method of claim 3,
When viewed in a plan view, the light blocking pattern overlaps a sidewall of the display panel defining the first hole portion. 4. The method of claim 3,
When viewed in a plan view, a sidewall of the cushion member defining the second hole portion surrounds the light blocking pattern. 4. The method of claim 3,
The sidewall of the cushion member defining the second hole portion does not overlap the light blocking pattern. 4. The method of claim 3,
It further includes a plate disposed under the cushion member, wherein the plate has a third hole portion larger than the width of the second hole portion and smaller than the width of the second hole portion is defined, the first hole portion, the first hole portion The second hole portion and the third hole portion overlap each other to form the hole. 4. The method of claim 3,
The light blocking pattern has a ring shape having an inner diameter and an outer diameter surrounding the inner diameter, and when viewed in a plan view, the inner diameter is smaller than the first hole portion, and the outer diameter is larger than the first hole portion. 9. The method of claim 8,
A first distance between the inner diameter and an edge of the display panel defining the first hole portion is different from a second distance between the outer diameter and an edge of the display panel defining the first hole portion. 10. The method of claim 9,
The first distance is greater than the second distance. 10. The method of claim 9,
Each of the first distance and the second distance is determined based on a component tolerance, a facility tolerance, and a folding tolerance. According to claim 1,
a shock absorbing layer disposed on the display panel; and
The electronic device further comprising a hard coating layer disposed between the shock absorbing layer and the display panel, wherein a portion of the hard coating layer is exposed by the hole. 13. The method of claim 12,
The shock absorbing layer is an electronic device in which the optical axis is a stretched film. According to claim 1,
a window disposed on the light blocking pattern; and
The electronic device further comprising a passivation layer disposed on the window, wherein a sidewall of the passivation layer protrudes more than a sidewall of the window. 15. The method of claim 14,
The distance between the window and the electronic module is at least 60% of the sum of the thicknesses of the components in which the hole is defined, the modulus of which is equal to or less than the reference modulus. 16. The method of claim 15,
The reference modulus is 50 MPa or less. display panel;
an electronic module disposed to overlap a hole defined in the display panel; and
a light blocking pattern disposed on the electronic module with the display panel interposed therebetween and having a ring shape having an inner diameter and an outer diameter surrounding the inner diameter, wherein a first distance between the inner diameter and an edge of the display panel defining the hole The electronic device is different from a second distance between the outer diameter and an edge of the display panel defining the hole. 18. The method of claim 17,
The first distance is greater than the second distance. 18. The method of claim 17,
Each of the first distance and the second distance is determined based on a component tolerance, a facility tolerance, and a folding tolerance. 18. The method of claim 17,
In the first state in which the display panel is folded and the second state in which the display panel is unfolded, the electronic module is spaced apart from an edge of the display panel.

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