KR20210099461A - Transparent led display panel and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a transparent LED display panel and a manufacturing method thereof, capable of very easily forming a protective layer for protecting an LED element and the like from an external environment, and preventing oxidation of a circuit pattern and the LED element, a short circuit caused by penetration of moisture, discoloration, distortion of a display image, deterioration of visibility, and the like. According to the present invention, the transparent LED display panel includes: a substrate on which a conductive pattern and a plurality of unit LED packages are formed; a thermoplastic resin layer formed on the substrate, completely covering the conductive pattern and the unit LED packages, filling a pitch space between the unit LED packages, and formed of a thermoplastic resin material; and a buffer medium formed on the thermoplastic resin layer, and formed of a transparent resin material having a glass transition temperature that is higher than a glass transition temperature of the thermoplastic resin layer.

Description

Transparent LED display panel and manufacturing method thereof

The present invention relates to an LED display panel, and more particularly, to a transparent LED display panel that can be installed and used in an outdoor environment such as an electric signboard, an exterior wall of a building, a building entrance, a screen door, a train entry/exit door, and the like, and a manufacturing method thereof.

In general, as a light emitting device used outdoors, neon, a cold cathode discharge tube (CCL), an electric sign using a light emitting diode (LED), etc. are widely used. In addition, as a light emitting device used indoors, an external electrode fluorescent lamp (EEFL), a cold cathode fluorescent lamp (CCFL), a light emitting diode display, etc. are used.

Here, neon or cold-cathode discharge tubes use a high-voltage power source, so they consume a lot of power, have a risk of electric shock and fire, and have disadvantages in that they have a short lifespan. In addition, EEFL or CCFL has disadvantages in that it is difficult to use outdoors in that it uses a high frequency, and has a low illuminance and a short lifespan.

In addition, in the case of an electric sign using an LED, the back side of the side that emits light due to wire treatment or black film treatment on the back side is blocked by a cover, so that it emits light in only one direction.

On the other hand, in recent years, the light emitting device is used as an advertising signboard rather than simply used as a function of lighting, and is widely used in interiors and the like as an aesthetically added design.

However, the above light emitting devices are limited in providing aesthetic sense due to restrictions such as the size of the lamp and the size of a stand supporting the light emitting device.

Accordingly, in the prior art, in order to provide the aesthetic sense as described above, a circuit pattern is formed on a transparent substrate, a plurality of LED elements are mounted, and the light is emitted under control by a controller to display characters or figures, and furthermore, to express a moving picture. A transparent electronic display board was released.

In order to protect the LED element and the circuit pattern from external moisture penetration, condensation, inflow of foreign substances, etc., in such a transparent electric sign board, a protective layer must be formed on the transparent substrate on which the LED element is formed.

Looking at the protective layer of a conventional transparent electric sign board, a light emitting element is mounted on any one of a pair of transparent plates in Korean Patent No. 10-1188747 and Korean Patent No. 10-1188748, and between the pair of transparent plates A method of bonding a pair of transparent plates by filling a transparent resin and forming a protective layer capable of protecting a light emitting device is proposed.

The following structure has been proposed as a protective layer of another conventional transparent electric sign board. That is, a resin film having a plurality of through-holes perforated was used as a protective layer. In this case, the through-holes are formed as many as the number of LED elements mounted on the substrate, and the size is formed to be several mm larger than the LED elements.

And, when such a resin film is laminated on the substrate, the LED element mounted on the substrate forms a structure inserted into the through hole of the resin film. Space (i.e., play) will exist.

However, the transparent electric sign board is usually installed and used in an outdoor environment, and when such a gap exists, moisture is invaded through the gap, dew condensation occurs, and foreign substances are introduced to cause an electric short or malfunction.

In order to solve this problem, a method of filling the space by injecting a filler such as a transparent resin material into the space between the LED element and the through hole has been proposed.

However, according to the method of filling the spaced space with the filler as described above, there is a difference in optical characteristics between the filler and the resin film, resulting in scattering and refraction of light emitted from the LED element, resulting in distortion of the display image and deterioration of visibility. there was.

In addition, this conventional method has a disadvantage in that the number of processes such as the perforation process of the resin film and the filling process of the filler increases, thereby reducing the yield, and increasing the number of equipment required for manufacturing, thereby increasing the manufacturing cost.

Korean Patent Registration No. 10-1188747 (Registered on September 28, 2012) Korean Patent Registration No. 10-1188748 (Registered on September 28, 2012)

The present invention is to solve the above problems, and an object of the present invention is to form a protective layer for protecting the LED element from the external environment very easily, and by oxidation and invasion of the circuit pattern and the LED element To provide a transparent LED display panel capable of preventing short circuit, discoloration, distortion of a display image, deterioration of visibility, and the like, and a method for manufacturing the same.

A transparent LED display panel according to the present invention comprises: a substrate on which a conductive pattern and a plurality of unit LED packages are formed; a thermoplastic resin layer formed on the substrate, completely covering the conductive pattern and the plurality of unit LED packages, filling a pitch space between the plurality of unit LED packages, and formed of a thermoplastic resin material; and a buffer medium formed on the thermoplastic resin layer and made of a transparent resin material having a glass transition temperature higher than that of the thermoplastic resin layer.

A method for manufacturing a transparent LED display panel according to the present invention includes: a first step of preparing a substrate on which a conductive pattern and a plurality of unit LED packages are formed; a second step of disposing a thermoplastic resin film made of a thermoplastic resin material on the substrate; a third step of applying heat to the thermoplastic resin film to make it fluidized; and a fourth step of applying pressure to the thermoplastic resin film in the fluidized state.

And, between the second step and the third step, the step of placing a buffer medium on the thermoplastic resin film may be further included. In this case, the buffer medium is characterized in that it is made of a transparent resin material having a higher glass transition temperature than the thermoplastic resin film.

According to the transparent LED display panel and the manufacturing method thereof according to the present invention, the conductive pattern and the protective layer of the LED device can be easily formed with a minimum process, so that the yield and productivity are increased, and there is an effect of reducing the manufacturing cost. .

According to the transparent LED display panel and the manufacturing method thereof according to the present invention, it is possible to completely prevent short circuit due to oxidation and invasion of conductive patterns and LED elements, discoloration, distortion of the display image, deterioration of visibility, etc., thereby greatly improving product reliability and competitiveness. There is an effect that can be improved.

1 is a process flow chart of a transparent LED display manufacturing method according to the present invention.
Figure 2 (a), (b), (c), (d), (e) is a process diagram showing the cross-sectional structure of each step of the transparent LED display manufacturing method according to the present invention.
3 is a cross-sectional view of a transparent LED display panel manufactured according to the manufacturing method of FIG.
Figure 4 (a), (b), (c), (d) is a process diagram showing the cross-sectional structure of each step of the transparent LED display manufacturing method according to the first extended embodiment of the present invention.
5 is a cross-sectional view of a transparent LED display panel manufactured according to the manufacturing method of FIG.
6 is a cross-sectional view of a transparent LED display panel according to a second extended embodiment of the present invention.

The terms used herein are used only to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present specification, terms such as "comprise" or "have" are intended to designate that a feature, number, step, action, component, part, or combination thereof described therein exists, and includes one or more other features or It is to be understood that the existence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded in advance.

In addition, in this specification, "on or on top of" means to be located above or below the target part, which does not necessarily mean to be located above the direction of gravity. That is, the term "on or on top of" referred to in the present specification includes not only a case located above or below the target part, but also a case located in front or behind the target part.

Also, when a part of a region, plate, etc. is said to be "on or on" another part, it means that another part is in-between as well as when it is in contact with or spaced "on or on" another part. Including cases where there is

In addition, in this specification, when a component is referred to as "connected" or "connected" with another component, the component may be directly connected or directly connected to the other component, but in particular It should be understood that, unless there is a description to the contrary, it may be connected or connected through another element in the middle.

Also, in this specification, terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another.

Hereinafter, preferred embodiments, advantages and features of the present invention will be described in detail with reference to the accompanying drawings.

1 is a process flow chart of a method for manufacturing a transparent LED display according to the present invention, FIG. 2 is a flowchart showing a cross-sectional structure of each step of a method for manufacturing a transparent LED display according to the present invention, and FIG. 3 is a manufacturing method of FIG. It is a cross-sectional view of the manufactured transparent LED display panel.

1 to 3, the transparent LED display panel manufacturing method according to the present invention includes an LED package mounting step (S10), a resin film arrangement step (S20), a resin film fluidization step (S30), and a resin film pressurization step ( S40), preferably further comprising a buffer medium arrangement step (S25) between steps 'S20' and 'S30'.

(1) LED package mounting step (S10; FIG. 2 (a))

Referring to FIG. 2A , the LED package mounting step S10 is a step of forming a conductive pattern 30 and a plurality of unit LED packages 20 on a substrate 10 .

The unit LED (Light Emitting Diode) package 20 of step 'S10' includes three LED chips each implementing red (R), green (G), and blue (B), and an IC chip for controlling the LED chip. consists of including In addition, the unit LED package 20 constitutes a plurality of rows and columns and is arranged on the substrate 10 .

According to an embodiment, the unit LED package 20 is randomly rotated in a direction in which the position of the LED chip is rotated by 90 degrees or 180 degrees based on the unit LED package 20 positioned in the first row and first column. The structure is repeated and arranged. In other words, in the plurality of unit LED packages 20, the structure in which the position of the LED chip is rotated by 90 degrees or 180 degrees is repeated and arranged.

In this case, the adjacent unit LED packages 20 should be arranged in a structure in which they are rotated in different directions. That is, the second unit LED package is arranged directly above the first unit LED package, the second unit LED package is arranged immediately below the first unit LED package, and the third unit LED package is arranged on the right side, and the third unit LED package is arranged immediately on the left side. Assuming that the fourth unit LED packages are arranged, the second, third, and fourth unit LED packages are arranged in a structure in which they are rotated in different directions compared to the first unit LED package.

According to another embodiment, the unit LED package 20 may be arranged in the following structure. That is, based on the unit LED package positioned in the first row and first column, the LED chip may be repeatedly arranged in a rotated structure in a direction in which the position of the LED chip is sequentially rotated by 90 degrees or 180 degrees.

The substrate 10 may be formed of a film made of a transparent and flexible resin material, or may be formed of a transparent glass substrate.

The conductive pattern 30 includes a power electrode and a signal electrode electrically connected to a plurality of unit LED packages 20 mounted on the substrate 10 , respectively.

The conductive pattern 30 includes a circuit pattern region including a dot matrix, and the dot matrix includes a power electrode and a signal electrode, and may be formed in a square or rectangular shape.

According to an embodiment, the unit LED packages 20 may be arranged on the dot matrix, and four adjacent unit LED packages may be repeatedly arranged in a group.

According to another embodiment, the unit LED packages 20 may be arranged on the dot matrix, and 16 adjacent unit LED packages may be repeatedly arranged in a group.

(2) resin film arrangement step (S20; FIG. 2 (b))

Referring to FIG. 2 ( b ), the resin film arrangement step ( S20 ) is a step of disposing the resin film 40 on the substrate 10 on which the conductive pattern 30 and the plurality of unit LED packages 20 are formed.

The resin film of step S20 uses a film formed of a thermoplastic resin material (hereinafter referred to as 'thermoplastic resin film 40').

According to a preferred embodiment, the thermoplastic resin film 40 may be a film formed of at least one resin material selected from Polyvinyl Butyral (PVB), Ethylene Vinyl Acetate (EVA), Polyurethane (PU), and Polyolefin (PO).

Specifically, the thermoplastic resin film 40 is laminated on the surface on which the unit LED package 20 is formed among the upper and lower surfaces of the substrate 10 , and the size thereof is a plurality of unit LED packages 20 mounted on the substrate 10 . and a size to cover the entire conductive pattern 30 .

Therefore, when the thermoplastic resin film 40 is seated on the substrate 10 , a plurality of unit LED packages 20 and the conductive pattern 30 are interposed between the substrate 10 and the thermoplastic resin film 40 . will achieve

And, the thermoplastic resin film 40 is formed to a thickness of 0.2 ~ 12mm, preferably may be formed to a thickness of 0.4 ~ 9mm.

(3) buffer medium arrangement step (S25; FIG. 2 (c))

Referring to FIG. 2 ( c ), the buffer medium arrangement step ( S25 ) is a step of disposing the buffer medium 50 on the thermoplastic resin film 40 .

The buffer medium 50 is interposed between the thermoplastic resin film 40 and the press plate 60, and evenly distributes the pressure applied to the thermoplastic resin film 40 during the pressing process of step 'S40' to the thermoplastic resin film 40 ) plays a role in improving the flatness and surface roughness.

In addition, the buffer medium 50 serves to protect the thermoplastic resin film 40 layer from the external environment during storage, transportation, installation, and use of the manufactured transparent LED display panel.

The buffer medium 50 has a higher glass transition temperature than the thermoplastic resin film 40 of step 'S20' and is made of a transparent material. This is because the buffer medium 50 should remain in a solid state without becoming a fluidized state in the resin film fluidizing step (S30) to be described later, and for improving the pressure dispersion, flatness and surface roughness described above in the resin film pressing step (S40). Because it can function as a means.

The buffer medium 50 is preferably formed in the same size as the thermoplastic resin film 40 . For reference, in the horizontal/vertical length constituting the size (ie, area), the 'same size' means that the length difference falls within 0 to 3 mm is included in the 'same size'.

According to an embodiment, the buffer medium 50 may be formed in the form of a transparent plastic sheet, a transparent resin film, a transparent glass plate, or a transparent thin glass plate.

When the buffer medium 50 is formed in the form of a transparent plastic sheet or a transparent resin film, the sheet or film may be formed of a resin material such as polyethylene (PE), polycarbonate (PC), or polyethylene terephthalate (PET).

On the other hand, when using a transparent glass plate having a thickness of 5 mm or more for the buffer medium 50, even if a separate press plate 60 is not provided in the resin film pressing step (S40), the thick transparent glass plate (that is, the buffer medium; 50) is The press plate 60 may function.

In this case, the thick transparent glass plate (ie, buffer medium; 50) acts as the press plate 60 in step 'S40', and thereafter, like other buffer media 50, is integrated into one configuration of the transparent LED display panel. It can be installed and used in the form of building glass with a display function.

(3) resin film fluidization step (S30; FIG. 2 (d))

Referring to FIG. 2 (d), the resin film fluidization step (S30) is a process of applying heat H1 to the thermoplastic resin film 40 to make it flowable (hereinafter referred to as a 'fluidized state').

Therefore, the temperature of the heat applied to the thermoplastic resin film 40 in the resin film fluidization step (S30) is raised to at least the glass transition temperature of the thermoplastic resin film 40.

According to one embodiment, the resin film fluidizing step (S30) may be performed in an autoclave.

(4) resin film pressing step (S40; FIG. 2 (e))

Referring to Figure 2 (e), the resin film pressurizing step (S40) is a process of applying a predetermined pressure (K1) to the thermoplastic resin film 40, which has become fluidized in step 'S30'.

According to an embodiment, the resin film pressing step ( S40 ) may be configured to apply pressure to the thermoplastic resin film 40 using the press plate 60 .

In this case, the press plate 60 having an area equal to or greater than the area of the thermoplastic resin film 40 may be configured to be pressed into close contact with the buffer medium 50 .

Here, the 'area' refers to the area of the upper surface facing the press plate 60 side in the case of the thermoplastic resin film 40, and refers to the area of the lower surface facing the upper surface of the thermoplastic resin film in the case of the press plate 60. .

According to a preferred embodiment, the resin film pressurizing step (S40) includes a pressure increasing step (S41) and a critical pressure maintaining step (S42).

The pressure-increasing step ( S41 ) is configured to gradually increase the pressure applied to the thermoplastic resin film 40 . That is, the pressure raising step (S41) is configured to gradually increase the pressure from the initial starting pressure (eg, 0.1 kg/cm ² ) to eventually reach a pressure that is no longer increased (hereinafter, referred to as 'critical pressure').

The critical pressure maintaining step ( S42 ) is a step of maintaining the critical pressure for a predetermined time when the critical pressure is reached by the pressure increasing process of step 'S41'.

The critical pressure of the step of raising the pressure (S41) and the step of maintaining the critical pressure (S42) ^{is composed of 9 to 17 kg/cm 2} , preferably 11 to 15 kg/cm ² .

When the thermoplastic resin film 40 in the fluidized state is pressed by step 'S30', a portion of the fluidized thermoplastic resin film 40 is spaced apart between a plurality of unit LED packages 20 (ie, pitch space). : P1) is moved to fill the corresponding space, and the remaining part forms a cover layer structure covering the whole of the plurality of unit LED packages 20 in the form of a flat thin plate (see FIG. 3 ).

Meanwhile, the above-described critical pressure is related to the filling of the pitch space P1 of the fluidized thermoplastic resin film 40 and the formation of the cover layer. That is, when the threshold pressure is less than 9 kg / cm ² a thermoplastic resin film 40 is not completely fill all of the pitch area (P1), and can lead to some empty pitch spaces, the covering layer when it is more than 17 kg / cm ² A large thickness deviation may occur, which may lead to a decrease in visibility due to light refraction and scattering.

When the above-described resin film pressurization step (S40) is completed, the temperature is lowered to the room temperature level, and after a certain period of time has elapsed after the pressure is removed, a transparent LED display panel having the structure as shown in FIG. 3 can be obtained.

That is, according to the above-described manufacturing method, as shown in FIG. 3 , a thermoplastic resin layer and a buffer medium 50 are sequentially stacked on a substrate 10 on which a conductive pattern 30 and a plurality of unit LED packages 20 are formed. A transparent LED display panel made of

Specifically, the thermoplastic resin layer (ie, the thermoplastic resin film: 40) is formed on the substrate 10, completely covering the conductive pattern 30 and the plurality of unit LED packages 20, and the plurality of unit LED packages ( 20) to form a structure that fills the pitch space P1 between them.

In addition, the buffer medium 50 is formed of a transparent resin film 40 having a higher glass transition temperature than the thermoplastic resin layer 40 and has a structure that completely covers the upper surface of the thermoplastic resin layer.

On the other hand, the transparent LED display panel obtained through steps S10 to S40 may be coated with an adhesive 75 on its buffer medium 50 and then a release paper 70 may be attached thereon.

4 (a), (b), (c), and (d) are process diagrams illustrating the cross-sectional structure of each step of the transparent LED display manufacturing method according to the first extended embodiment of the present invention, and FIG. 5 is FIG. It is a cross-sectional view of a transparent LED display panel manufactured according to the manufacturing method of

According to the first extended embodiment of the present invention, the thermoplastic resin film of step 'S20' (hereinafter referred to as 'first thermoplastic resin film') 40 is disposed on the opposite surface of the one surface of the substrate 10 and It may further include the step of disposing another thermoplastic resin film (hereinafter referred to as 'second thermoplastic resin film') 42 (hereinafter referred to as step 'S21').

That is, referring to FIG. 4 , the first thermoplastic resin film 40 is disposed on the upper surface of the substrate 10 , and the second thermoplastic resin film 42 is disposed below the lower surface of the substrate 10 .

On the other hand, in the case of the first extended embodiment, the step of disposing another buffer medium (hereinafter referred to as 'second buffer medium') 52 on the second thermoplastic resin film 42 (hereinafter referred to as step 'S26') ) may be further included.

In this case, the second buffer medium 52 has a glass transition temperature higher than that of the second thermoplastic resin layer 42 and is made of a transparent material, and may be formed in the form of a film, a sheet, a thin plate, or a plate.

On the other hand, when using a thick transparent glass plate of 5 mm or more as the second buffer medium 52, even if a separate press plate 62 is not provided in the resin film pressing step (S40), the thick transparent glass plate (ie, the second buffer medium) ; 52) can perform the function of the press plate 62.

In this case, after the thick transparent glass plate (ie, buffer medium) 50 acts as the press plate 62 in step 'S40' according to the first extended embodiment, thereafter, like other buffer media 52, the transparent LED display It can be installed and used in the form of building glass having a display function by being integrated into one configuration of the panel.

The second thermoplastic resin film arrangement step (S21) of the first extended embodiment may be performed at any stage as long as it is before the resin film fluidization step (S30). For example, step 'S21' may be performed before the thermoplastic resin film arrangement step (S20), before the buffer medium arrangement step (S25), or before the resin film fluidization step (S30).

Similarly, the second buffer medium arrangement step (S26) of the first extended embodiment may be performed at any step as long as it is before the resin film fluidization step (S30). For example, step 'S21' may be performed before the thermoplastic resin film arrangement step (S20), before the buffer medium arrangement step (S25), or before the resin film fluidization step (S30).

That is, steps 'S21' and 'S26' are performed before the resin film fluidization step (S30; FIG. 4(c)) of the first extended embodiment, as shown in FIG. 4(b), under the substrate 10 under the second thermoplastic As long as it is possible to form a structure in which the resin film 42 is disposed and the second buffer film 52 is disposed under the second thermoplastic resin film 42, the chronological order thereof does not need to be particularly limited.

The resin film fluidization step (S30) according to the first extended embodiment is configured to heat the first thermoplastic resin film 40 and the second thermoplastic resin film 42 together to make them both in a fluidized state (Fig. 4 (c) ) reference).

The resin film pressing step S40 according to the first extended embodiment is configured to apply pressure to both the first thermoplastic resin film 40 and the second thermoplastic resin film 42 . That is, as shown in FIG. 4 (d), the first thermoplastic resin film 40 is pressed (K1) through the press plate '60', and the second thermoplastic resin film 42 is pressed (K1) through the press plate '62'. K2) can be configured to be.

When all of the manufacturing processes according to the above-described first extended embodiment are completed, a transparent LED display panel having a structure as shown in FIG. 5 can be obtained after a predetermined time elapses after the temperature is lowered to a room temperature level and the pressure is removed.

That is, the transparent LED display panel according to the first extended embodiment includes: a substrate 10 on which a conductive pattern 30 and a plurality of unit LED packages 20 are formed; A first thermoplastic resin layer 40 formed on the substrate 10, completely covering the conductive pattern and the plurality of unit LED packages, filling the pitch space between the plurality of unit LED packages, and formed of a thermoplastic resin material class; The first buffer medium ( 50) and; a second thermoplastic resin layer 42 formed on the opposite surface of one surface of the substrate 10 on which the first thermoplastic resin layer 40 is formed; and a second buffer medium disposed on the second thermoplastic resin layer 42, made of a transparent material having a higher glass transition temperature than that of the second thermoplastic resin layer 42, and formed in the form of a film, sheet, thin plate or plate (52) is included.

For reference, the transparent LED display panel as shown in FIG. 3 manufactured according to the manufacturing method of FIG. 2 is a form that can be additionally attached to the installed building glass, and is manufactured according to the first extended embodiment of FIG. 5 . A transparent LED display panel such as a bar is configured in the form of a double-story building glass, and is a form that can be installed and used on windows/exteriors of buildings having a display function.

According to the second extended embodiment of the present invention, the step of attaching the protective plate (S50) may be further included. 6 is a cross-sectional view of a transparent LED display panel according to a second extended embodiment of the present invention.

1 and 6, the protective plate attaching step (S50) is a step of attaching the protective plate 70 on the buffer medium 50 of the transparent LED display panel obtained through steps S10 to S40.

If the buffer medium arrangement step (S25) is omitted, the protective plate attaching step (S50) is configured to attach the protective plate 70 on the thermoplastic film of the transparent LED display panel obtained through steps S10 to S40.

The protection plate 70 of step 'S50' may be formed of a plate made of a material having high rigidity, such as a release paper, a glass plate, a plastic plate, or a metal plate.

Meanwhile, the protective plate 70 of step 'S50' may be attached and fixed by an adhesive layer or an adhesive layer 75 applied on the buffer medium 50 .

In the above, preferred embodiments of the present invention have been described and illustrated using specific terms, but such terms are only for clearly describing the present invention, and the embodiments and described terms of the present invention are the spirit and scope of the following claims. It is obvious that various changes and changes can be made without departing from it. Such modified embodiments should not be individually understood from the spirit and scope of the present invention, but should be considered to fall within the scope of the claims of the present invention.

10: substrate 20: unit LED package
30: conductive pattern 40: thermoplastic resin film (resin layer)
42: second thermoplastic resin film (resin layer) 50: buffer medium
52: second buffer medium 60, 62: press plate
70: protective plate 75: adhesive layer (adhesive layer)

Claims (14)

A first step of preparing a substrate on which a conductive pattern and a plurality of unit LED packages are formed;
a second step of disposing a thermoplastic resin film made of a thermoplastic resin material on the substrate;
a third step of applying heat to the thermoplastic resin film to make it fluidized; and
A transparent LED display panel manufacturing method comprising a; a fourth step of applying pressure to the thermoplastic resin film in the fluidized state.
According to claim 1,
between the second step and the third step,
Further comprising the step of disposing a buffer medium on the thermoplastic resin film,
The buffer medium,
A method of manufacturing a transparent LED display panel, characterized in that it has a higher glass transition temperature than the thermoplastic resin film and is made of a transparent material, and is formed in the form of a film, sheet, thin plate or plate.
3. The method according to claim 1 or 2,
between the second step and the third step,
Disposing another thermoplastic resin film (hereinafter referred to as 'second thermoplastic resin film') on the opposite side of one side of the substrate on which the thermoplastic resin film (hereinafter referred to as 'first thermoplastic resin film') is disposed further comprising steps,
The third step is
making the first thermoplastic resin film and the second thermoplastic resin film in a fluidized state,
The fourth step is
A method of manufacturing a transparent LED display panel, characterized in that applying pressure to the first thermoplastic resin film and the second thermoplastic resin film.
3. The method of claim 2,
The fourth step is
A method for manufacturing a transparent LED display panel, characterized in that the press plate having an area equal to or larger than that of the thermoplastic resin film is pressed in close contact with the buffer medium.
3. The method according to claim 1 or 2,
The fourth step is
a step 4-1 of gradually increasing the pressure applied to the thermoplastic resin film; and
and a 4-2 step of maintaining the critical pressure for a predetermined time when the critical pressure is reached by the step 4-1 pressure increase,
The critical pressure of the step 4-2 is 9 ~ 17 kg/cm ² A transparent LED display panel manufacturing method, characterized in that.
3. The method according to claim 1 or 2,
The thermoplastic resin film is a transparent LED display panel manufacturing method, characterized in that formed of at least one resin material selected from PVB, EVA, PU and PO.
3. The method according to claim 1 or 2,
The transparent LED display panel manufacturing method, characterized in that the thickness of the thermoplastic resin film is 0.2 ~ 12mm.
3. The method according to claim 1 or 2,
The substrate is a transparent LED display panel manufacturing method, characterized in that the transparent flexible substrate.
According to claim 1,
Further comprising a fifth step of attaching a protective plate on the thermoplastic resin film,
The protection plate is
A transparent LED display panel manufacturing method, characterized in that any one of a release paper, a glass plate, a plastic plate, and a metal plate.
3. The method of claim 2,
A fifth step of attaching a protective plate on the buffer medium,
The protection plate is
A transparent LED display panel manufacturing method, characterized in that any one of a release paper, a glass plate, a plastic plate, and a metal plate.
a substrate on which a conductive pattern and a plurality of unit LED packages are formed;
a thermoplastic resin layer formed on the substrate, completely covering the conductive pattern and the plurality of unit LED packages, filling a pitch space between the plurality of unit LED packages, and formed of a thermoplastic resin material; and
A transparent LED display panel, which is disposed on the thermoplastic resin layer, is made of a transparent material having a higher glass transition temperature than the thermoplastic resin layer, and includes a buffer medium formed in the form of a film, sheet, thin plate or plate .
12. The method of claim 11,
Another thermoplastic resin layer (hereinafter, referred to as a 'second thermoplastic resin layer') formed on the opposite surface of the one surface of the substrate on which the thermoplastic resin layer (hereinafter referred to as a 'first thermoplastic resin layer') is formed; and
It is disposed on the second thermoplastic resin layer, the glass transition temperature is higher than that of the second thermoplastic resin layer, is made of a transparent material, and further comprises a second buffer medium formed in the form of a film, sheet, thin plate or plate material Features a transparent LED display panel.
12. The method of claim 11,
an adhesive layer or an adhesive layer applied on the buffer medium; and
Further comprising; a protective plate attached to the adhesive layer or the adhesive layer,
The protection plate is
A transparent LED display panel, characterized in that any one of a release paper, a glass plate, a plastic plate, and a metal plate.
12. The method of claim 11,
The unit LED package,
It includes three LED chips each implementing red (R), green (G), and blue (B), and an IC chip for controlling the LED chip, and constitutes a plurality of rows and columns and is arranged on the substrate. ,
The plurality of unit LED packages,
A transparent LED display panel, characterized in that the structure in which the unit LED package is rotated in a direction in which the position of the LED chip is rotated by 90 degrees or 180 degrees is repeated and arranged based on the unit LED package positioned in the first row and first column .

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