KR20210094599A - Multi-component crosslinkable materials based on organyloxysilane terminated polymers - Google Patents

Abstract

The present invention relates to a multicomponent crosslinkable material based on a silane crosslinked polymer, comprising at least one component (K1) and one component (K2), wherein the component (K1) is a compound of the formula (Ia) ( A1a), and an organosilicon compound (A1) selected from compound (A1b) of the formula (Ib) , at least 0.05 parts by weight of water, and 10 to 1,000 parts by weight of component (A2) selected from compounds (A2a) of the formula (IIa) and (A2b) of the formula (IIb) It relates to a component crosslinkable material.
Y ¹ -[B ¹ -CR ² ₂ -SiR _a (OR ¹ ) _3-a ] _x (Ia)
Y ² -[B ² -(CR ⁴ ₂ ) _b -Si(OR ³ ) ₃ ] _y (Ib)
Y ³ -B ³ -CR ⁷ ₂ -SiR ⁵ _c (OR ⁶ ) _3-c (IIa)
Y ⁴ -[B ⁴ -(CR ¹⁰ ₂ ) _e -SiR ⁸ _d (OR ⁹ ) _3-d ] _z (IIb)
(Moieties and indices have the meanings set forth in paragraph 1.)
The present invention further relates to a process for preparing said multi-component cross-linkable material and to the use of said multi-component cross-linkable material as adhesives and sealants.

Description

Multi-component crosslinkable materials based on organyloxysilane terminated polymers

The present invention relates to multicomponent crosslinkable materials based on silane crosslinked polymers, to a process for their preparation and to their use as adhesives and sealants.

Polymer systems with reactive alkoxysilyl groups are well established. Upon contact with water and/or atmospheric humidity, these alkoxysilane terminated polymers can condense with each other even at room temperature while removing the alkoxy groups. One of the most important applications of these materials is in the production of adhesives and sealants, in particular elastic adhesive systems.

The reason is that the alkoxysilane-crosslinked polymer-based adhesive shows excellent properties in the fully cured state in mechanical properties as well as in adhesion to a wide variety of substrates. because there is Another decisive advantage of silane crosslinking systems over many other adhesive and sealant technologies (eg, over isocyanate-based or epoxy-based systems) is that they are toxicologically acceptable.

Many applications in this area favor one-component systems (1K systems) that cure only through contact with atmospheric moisture. The biggest advantage of the 1K system is that it is easy to apply, since in this case the user does not need to mix different adhesive components. In addition to saving work and avoiding errors that may occur in weighing or mixing, for a one-component system, the time is usually very narrow, as in the case of a two-component system (2K system) after the two components have been thoroughly mixed There is no need to apply adhesives or sealants within the window.

However, 1K systems have a crucial disadvantage inherent in systems that only harden on contact with (atmospheric) moisture. In the case of deep joints and/or extensive junctions, this leads to a very slow cure “outside to inside” as the longer and longer diffusion path progresses more slowly as the cure progresses. This is especially true when bonding non-porous substrates (plastics, metals, painted or polished surfaces, glass and glazed surfaces, etc.), which cannot be solved by pre-uniformly wetting the bonding area in advance. Therefore, for these joint and splicing operations, it is often advantageous or simply unavoidable in practice to use a 2K system.

2K adhesive systems based on silane-crosslinked polymers, for example described in EP-A 824 574 or EP-A 2 448 976, are already known. A typical 2K system herein comprises a first component comprising a silane terminated polymer and additional adhesive components such as plasticizers, fillers, catalysts, stabilizers, and the like. The second component then contains water and further compounds which do not react with water, such as fillers or plasticizers, and also optionally thickeners such as, for example, cellulose derivatives and also further components.

However, these prior art systems face the problem that an extremely small amount of water in the second component is sufficient to cure the polymer in the first component after the two components are thoroughly mixed. Furthermore, because of the low mutual solubility of the silane terminated polymer with water, the second component cannot in this case contain a substantially higher additional amount of water. Thus, while the second component comprising water as the sole liquid becomes solid (eg when large amounts of filler are added), in practical application conditions this is hardly practicable or otherwise very small amounts (eg 1:100 of the second component). blend ratio) and added to the first component, which would be equally impractical.

Thus, in addition to water, the second component must also comprise a second liquid substance that does not react with water. However, in general, non-reactive plasticizers are suitable for this purpose. Therefore, 2K systems without plasticizers are not possible with this technology.

However, non-reactive plasticizers are not incorporated into the resulting polymer network. Thus, if the molecule is relatively small, it can be ejected, migrate to the substrate, or volatilize as a gas. All of this generally results in unwanted changes in properties such as shrinkage and/or embrittlement of the respective adhesive or sealant. In addition, migration of the plasticizer to the substrate can also lead to an unattractive discoloration of the substrate, which is absolutely unacceptable, especially in the case of decorative substrates made of, for example, natural stone. Therefore, the lack of options to develop plasticizer-free 2K systems is a significant disadvantage in many cases.

A 2K system that is not free of plasticizers, but contains at least a small amount of plasticizer, which minimizes the problems associated with adding plasticizers is indeed possible. However, even this kind of system poses a serious problem for developers: if only a small amount of plasticizer is used, the second water and plasticizer-containing component can contain only such small amount of plasticizer and thus contain only a small volume. Accordingly, this second component should, upon application, be continuously mixed into the first component only in relatively small amounts, such as in a ratio of 1:10 (see Example 2 of EP-A 824 574 or Example 2 of EP-A 2 448 976) ). Although this is practical in principle, it is inconvenient because it is not easy for users to achieve moderately accurate mixing accuracy. Also, this kind of system is very susceptible to mixing errors.

Easier to handle and less error prone are 2K systems, where the two components are mixed in a 1:1 ratio. However, using existing 2K technology, as has already been observed, this is only possible if the entire 2K system contains relatively high amounts of plasticizers (see example 1 of EP-A 2 448 976), although in many cases this is undesirable. .

A 2K system, which is no longer bound by a plasticizer in the second component, is substantially more advantageous since both components contain a water crosslinked polymer. Examples of such systems are described in EP-A 1 743 008 or EP-A 2 009 063.

The concept underlying this technology is that the reaction rate of the silane crosslinked polymer used is so slow that it will not crosslink without a catalyst even in the presence of water. Thus, the polymer may be present in both components, wherein the first component further comprises a curing catalyst and the second component contains water.

The disadvantage of this technique, however, is that the reaction rate is very high, which remains uncrosslinked for several months in the second component even in the presence of water, is lead free and does not lead to a significant and naturally unwanted increase in viscosity, let alone gels. The fact is that this can only be done using slow silane terminated polymers. The slow rate of this reaction in the portion of the polymer used results of course that the desired crosslinking in the final application can only take place rapidly in the presence of relatively large amounts of critically active catalyst. That is, such systems should generally contain large amounts of toxicologically objectionable tin catalyst in the first component. 2K systems that are highly reactive, quickly cure and are tin-free or at least low tin cannot be produced using this technique.

Another disadvantage of aggressive (tin) catalysis of the kind unavoidable in these 2K systems arises from the adverse effect of the associated catalyst on the storage stability of the associated composition. Indeed, highly reactive catalysts can catalyze the decomposition reaction of silane terminated polymers and/or other formulation components. These typical degradation reactions include the removal of urethane and/or urea units in the polymer backbone that occurs in silane terminated polyurethanes, and (although generally slower) cleavage of ether linkages and ester linkages that may also be present in the polymer. .

The same decomposition reaction accelerated by aggressive catalysts adversely affects the thermal stability of the adhesive or sealant in question.

It was an object of the present invention to provide a two-component adhesive or sealant based on a silane terminated polymer which can overcome the disadvantages of the prior art.

A subject of the present invention is a multicomponent crosslinkable composition (K) comprising at least one component (K1) and one component (K2), wherein component (K1) is a compound (A1a) of the formula (Ia) and an organosilicon compound (A1) selected from the compound (A1b) of the formula (Ib):

Component (K2) comprises, in each case, based on 100 parts by weight of compound (A1) in component (K1), at least 0.05 parts by weight of water, and 10 to 1,000 parts by weight of compounds (A2a) of the formula (IIa) and A multicomponent crosslinkable composition (K), characterized in that it comprises a component (A2) selected from the compound (A2b) of (IIb):

Y ¹ -[B ¹ -CR ² ₂ -SiR _a (OR ¹ ) _3-a ] _x (Ia)

Y ² -[B ² -(CR ⁴ ₂ ) _b -Si(OR ³ ) ₃ ] _y (Ib)

Y ³ -B ³ -CR ⁷ ₂ -SiR ⁵ _c (OR ⁶ ) _3-c (IIa)

Y ⁴ -[B ⁴ -(CR ¹⁰ ₂ ) _e -SiR ⁸ _d (OR ⁹ ) _3-d ] _z (IIb)

In the above formulas (Ia) and (Ib),

Y ¹ is an x-valent polymer radical bonded through carbon,

Y ² is a y-valent polymer radical bonded through carbon,

B ¹ and B ² may be each independently the same or different from each other, and a divalent linking group -O-, -NH-, -NR'-, -O-CO-NH-, -NH-CO-O-, - NH-CO-NH, -NH-CO-NR'-, -NR'-CO-NH-, -NH-CO-, -CO-NH-, -CO-O-, -O-CO-, -O -CO-O-, -S-CO-NH-, -NH-CO-S-, -CO-S-, -S-CO- or -S-;

R', which may be the same or different, is a monovalent, optionally substituted hydrocarbon radical or group -CH(COOR*)-CH ₂ -COOR*, wherein R* is an alkyl radical,

R, which may be the same or different, is a monovalent, optionally substituted, SiC bonded hydrocarbon radical,

R ¹ and R ³ may each independently be the same or different from each other and are a hydrogen atom or a monovalent, optionally substituted hydrocarbon radical,

R ² and R ⁴ are each independently from each other a monovalent, optionally substituted hydrocarbon radical, which may be the same or different and may be attached to a hydrogen atom or a carbon atom via a nitrogen, phosphorus, oxygen, sulfur or carbonyl group,

x and y are each independently of one another an integer from 0 to 10, preferably 1, 2 or 3, more preferably 2 or 3, more particularly 2,

a can be the same or different and is 0, 1 or 2, preferably 0 or 1, provided that if x=1 then a=0,

b may be the same or different, and is an integer of 3 to 10, preferably 3 or 4, more preferably 3,

In the above formulas (IIa) and (IIb),

Y ³ is a monovalent polymer radical bonded through carbon,

Y ⁴ is a polymer radical with z bonded through carbon,

B ³ and B ⁴ may be the same or different from each other independently in each case, and a divalent linking group -O-, -NH-, -NR"-, -O-CO-NH-, -NH-CO-O- , -NH-CO-NH, -NH-CO-NR"-, -NR"-CO-NH-, -NH-CO-, -CO-NH-, -CO-O-, -O-CO-, -O-CO-O-, -S-CO-NH-, -NH-CO-S-, -CO-S-, -S-CO- or -S-;

R″, which may be the same or different, is a monovalent, optionally substituted hydrocarbon radical or group —CH(COOR*)—CH ₂ —COOR*, wherein R* is an alkyl radical,

R ⁵ and R ⁸ are each independently from each other, which may be the same or different, and are monovalent, optionally substituted, SiC bonded hydrocarbon radicals,

R ⁶ and R ⁹ may each independently be the same or different, and are a hydrogen atom or a monovalent, optionally substituted hydrocarbon radical,

R ⁷ and R ¹⁰ are each independently from each other, which may be the same or different, a hydrogen atom or a monovalent, optionally substituted hydrocarbon radical which may be attached to a carbon atom via a nitrogen, phosphorus, oxygen, sulfur or carbonyl group,

z is an integer from 1 to 10, preferably 1, 2 or 3, more preferably 2 or 3, more particularly 2,

c is 1 or 2, preferably 1,

d can be the same or different and is 1 or 2, preferably 1,

e may be the same or different, and is an integer of 3 to 10, preferably 3 or 4, more preferably 3;

The composition (K) of the present invention is preferably a two-component composition consisting of components (K1) and (K2).

The components (K1) and (K2) of the composition (K) of the present invention are preferably stored separately during storage and are not mixed with each other immediately before or during the application of the composition (K) of the present invention. Preferably components (K1) and (K2) are mixed with each other for no more than 60 minutes, more preferably no more than 30 minutes and even more particularly no more than 10 minutes before application. The mixing of components (K1) and (K2) only during application also constitutes a particularly preferred embodiment of the invention.

Examples of radicals R are alkyl radicals such as methyl, ethyl, n-propyl, isopropyl, 1-n-butyl, 2-n-butyl, isobutyl, tert-butyl, n-pentyl, isopentyl, neopentyl, tert -pentyl radical; hexyl radicals such as the n-hexyl radical; heptyl radicals such as the n-heptyl radical; octyl radicals such as the n-octyl radical, isooctyl radical and 2,2,4-trimethylpentyl radical; nonyl radicals such as the n-nonyl radical; decyl radicals such as the n-decyl radical; dodecyl radicals such as the n-dodecyl radical; octadecyl radicals such as the n-octadecyl radical, cycloalkyl radicals such as the cyclopentyl, cyclohexyl, cycloheptyl radical and the methylcyclohexyl radical; alkenyl radicals such as the vinyl, 1-propenyl and 2-propenyl radicals; aryl radicals such as phenyl, naphthyl, anthryl and phenanthryl radicals; alkaryl radicals such as o-, m- and p-tolyl radicals; xylyl radical and ethylphenyl radical; and aralkyl radicals, such as the benzyl radical, the α- and β-phenylethyl radicals.

Examples of substituted radicals R are haloalkyl radicals and haloaryl radicals, such as the o-, m- and p-chlorophenyl radicals.

Examples of radicals R ⁵ and R ⁸ are those specified above for the radical R.

In each case independently of one another, the radicals R, R ⁵ and R ⁸ are preferably monovalent, SiC bonded hydrocarbon radicals having 1 to 6 carbon atoms and optionally substituted by halogen atoms, more preferably 1 or an alkyl radical having two carbon atoms, more particularly a methyl radical.

Examples of the radicals R ¹ , R ³ , R ⁶ and R ⁹ are the examples specified for the hydrogen atom and the radical R.

In each occurrence independently of one another, the radicals R ¹ , R ³ , R ⁶ and R ⁹ are preferably hydrogen atoms or alkyl radicals having 1 to 10 carbon atoms and optionally substituted by halogen atoms, more preferably 1 an alkyl radical having from to 4 carbon atoms, more particularly a methyl or ethyl radical.

With particular preference, all of the radicals R ¹ , R ³ , R ⁶ and R ⁹ are methyl radicals.

Examples of radicals R ² , R ⁴ , R ⁷ and R ¹⁰ are a hydrogen atom, the radical specified for the radical R, and also an optionally substituted hydrocarbon radical bonded to a carbon atom via a nitrogen, phosphorus, oxygen, sulfur, carbon or carbonyl group. am.

In each case independently of one another, the radicals R ² , R ⁴ , R ⁷ and R ¹⁰ are preferably a hydrogen atom or a hydrocarbon radical having 1 to 20 carbon atoms, more particularly a hydrogen atom.

Linking groups B ¹ and B ² are each independently preferably -O-, -NH-, -NR'-, -O-CO-NH-, -NH-CO-O-, -NH-CO-NH, - NH-CO-NR'- or -NR'-CO-NH- and the linking group -O-, -O-CO-NH-, -NH-CO-O-, -NH-CO-NR'- or -NR '-CO-NH- is more preferred, more particularly -O-CO-NH- is particularly preferred.

Linking groups B ³ and B ⁴ are independently of each other preferably -O-, -NH-, -NR"-, -O-CO-NH-, -NH-CO-O-, -NH-CO-NH, - NH-CO-NR"- or -NR"-CO-NH- and the linking group -O-, -O-CO-NH-, -NH-CO-O-, -NH-CO-NR"- or -NR "-CO-NH- is more preferred, -O- or -O-CO-NH-, more particularly -O-CO-NH-, is particularly preferred.

Examples of radicals R' and R" are cyclohexyl, cyclopentyl, n- and isopropyl, n-, iso- and tert-butyl radicals, pentyl radicals, hexyl radicals or heptyl radicals, phenyl radicals or the formula -CH(COOR* )-CH ₂ -COOR*, wherein R* is an alkyl radical.

The radicals R′ and R″ independently of one another are preferably the group —CH(COOR*)—CH ₂ —COOR* or an optionally substituted hydrocarbon radical having 1 to 20 carbon atoms, more preferably 1 to 20 carbon atoms. a straight-chain, branched-chain or cyclic alkyl group having carbon atoms, or an aryl group having 6 to 20 carbon atoms, optionally substituted with a halogen atom.

The radical R* is preferably an alkyl group having 1 to 10 carbon atoms, more preferably a methyl, ethyl or propyl radical.

The polymer radicals Y ¹ , Y ² , Y ³ and Y ⁴ are independently of each other preferably the polymer chain is polyoxyalkylene, such as polyoxyethylene, polyoxypropylene, polyoxybutylene, polyoxytetramethylene, polyoxy ethylene-polyoxypropylene copolymers and polyoxypropylene-polyoxybutylene copolymers; hydrocarbon polymers such as polyisobutylene, polyethylene or polypropylene and copolymers of polyisobutylene and isoprene; polyisoprene; Polyurethane; Polyester; polyamide; polyacrylate; polymethacrylate; or an organic polymer radical comprising polycarbonate.

Preferably, the polymer radicals Y ¹ , Y ² , Y ³ and Y ⁴ independently of one another have no groups reactive with water or moisture. In particular, independently of one another, they have no groups reactive with water or moisture and no silicon-containing groups, in particular no alkoxysilyl groups.

In each case independently of one another, the polymer radicals Y ¹ , Y ² , Y ³ and Y ⁴ are more preferably a polyurethane radical and a polyoxyalkylene radical, more particularly a polyurethane radical containing polyoxypropylene or a polyoxypropylene radical am.

When Y ¹ , Y ² , Y ³ and/or Y ⁴ are polyurethane radicals, they are, independently of one another, preferably from straight-chain or branched polyoxyalkylene, more particularly from polypropylene glycol, and from di- or poly It can be prepared from isocyanates.

When Y ¹ , Y ² , Y ³ and/or Y ⁴ are polyoxyalkylene radicals, the radicals are, independently of each other, preferably straight-chain or branched polyoxyalkylene radicals, more preferably polyoxypropylene radicals am.

The polyoxyalkylene radicals Y ¹ , Y ² , Y ³ and Y ⁴ _{independently of each other preferably have a number average molar mass M n} of preferably 10,000 to 30,000 g/mol, more preferably 11,000 to 20,000 g/mol.

where the number average molar mass M _n is determined by size exclusion chromatography (SEC) against polystyrene standards, in THF at 60° C., at a flow rate of 1.2 ml/min and an injection volume of 100 μl from Waters Corp. It is determined by detection by RI (refractive index detector) on a Styragel HR3-HR4HR5-HR5 column set from USA.

The compounds (A1a), (A1b), (A2a) and (A2b) used in the present invention are independently of each other alkoxysilane functionalities at any position in the polymer, such as in the chain and/or at the terminus, preferably at the terminus. can have the

Preferably, independently of one another, the compounds (A1a), (A1b), (A2a) and (A2b) are silane-terminated polyoxyalkylenes, more preferably the formulas (Ia), (Ib), (IIa) and ( silane terminated polyoxypropylene of IIb), wherein R, R ⁵ and R ⁸ are methyl radicals, R ¹ , R ³ , R ⁶ and R ⁹ are methyl or ethyl radicals, more particularly methyl radicals, R ² , R ⁴ , R ⁷ and R ¹⁰ are hydrogen atoms, B ¹ , B ² , B ³ and B ⁴ are -O- or -O-CO-NH-, more particularly -O-CO-NH-, a is 0 or 1, b is 3, c is 1, and d is 1. The silane-terminated polyoxyalkylene preferably comprises exclusively polyether units apart from the silane-functional end groups indicated in the formula.

The polymers (A1a), (A1b) and (A2b) used in the present invention have preferably 2 or 3, more preferably 2 silane functional end groups per molecule. The inventive polymer (A2a) bears exactly one silane functional end group.

Silane-terminated polyoxyalkylenes (A1a), (A1b), (A2a) and (A2b) wherein B ¹ , B ² , B ³ and B ^{4 are —O—CO—NH— are common} polyoxyalkylene, and each of the formulas

OCN-CR ² ₂ -SiR _a (OR ¹ ) _3-a (IIIa),

OCN-(CR ⁴ ₂ ) _b -Si(OR ³ ) ₃ (IIIb),

OCN-CR ⁷ ₂ -SiR ⁵ _c (OR ⁶ ) _3-c (III′a) and

OCN-(CR ¹⁰ ₂ ) _e -SiR ⁸ _d (OR ⁹ ) _3-d (III'b)

(wherein all radicals and indices have one of the definitions given above.)

It can be prepared in a simple manner by the reaction of silanes.

Another general process for the preparation of compounds of formulas (Ib) and/or (IIb) provides for hydrosilylation of the terminally unsaturated polyoxyalkylenes with the corresponding SiH functional silanes.

_{The number average molecular weights M n} of the compounds (A1a), (A1b), (A2a) and (A2b) are each independently preferably from 10,000 g/mol to 30,000 g/mol, more preferably from 11,000 g/mol to 24,000 g /mole, more particularly 11,000 g/mole to 22,000 g/mole.

The viscosities of the compounds (A1a), (A1b), (A2a) and (A2b) used in the present invention, when measured at 20° C. in each case, are each independently preferably 0.2 Pas to 700 Pas, more preferably It is 1　Pas to 100　Pas, very preferably 5　Pas to 100　Pas.

Compounds (A1a), (A1b), (A2a) and (A2b) used in the present invention are each of only one of formulas (Ia), (Ib), (IIa) or (IIb), or otherwise the compound It can represent a mixture of different types of

The compounds (A1a), (A1b), (A2a) and (A2b) used in the present invention are standard commercial products or can be prepared by methods common in the chemical field.

The organosilicon compound (A1) used in the present invention may include only compound (A1a) or only compound (A1b), or a mixture of compound (A1a) and compound (A1b), preferably compound (A1a) or It is a mixture of compounds (A1a) and (A1b), More preferably, it is compound (A1a). When the organosilicon compound (A1) comprises a mixture of the compounds (A1a) and (A1b), the mixing ratio of the compound (A1a) to the compound (A1b) is in each case by weight, preferably 0.1 to 10, More preferably, it is 0.2-5.

The organosilicon compound (A2) used in the present invention may include only compound (A2a) or only compound (A2b), or a mixture of compound (A2a) and compound (A2b), wherein compound (A2) is preferably exclusively compound (A2a) or exclusively compound (A2b).

Preferably at least one of components (K1) or (K2) comprises a polymer having a so-called α-silyl group in which the silane bridging group is separated from the linking group only by a methylene spacer. That is, component (A1) preferably comprises compound (A1a), and/or component (A2) comprises compound (A2a).

In one particularly preferred embodiment of the present invention, component (A1) comprises compound (A1a), component (A2) comprises compound (A2b), more particularly organosilicon compound (A1) comprises compound (A1a) and the organosilicon compound (A2) consists of compound (A2b).

Component (K2) is preferably 20 to 500 parts by weight, more preferably 50 to 200 parts by weight of organosilicon compound (A2), based in each case on 100 parts by weight of organosilicon compound (A1) in component (K1) includes

Component (K2) is preferably in each case 0.1 to 10 parts by weight, more preferably 0.2 to 5 parts by weight, more particularly 0.4 to 3 parts by weight, based on 100 parts by weight of organosilicon compound (A1) in component (K1). Contains wealth of water.

In another preferred embodiment, component (K1) comprises not only compound (A1), preferably (A1a), but also compound (A2a). When component (K1) comprises compound (A2a), the amount included is in each case based on 100 parts by weight of organosilicon compound (A1) in component (K1), preferably 1 to 100 parts by weight, more preferably contains 5 to 50 parts by weight, more particularly 10 to 30 parts by weight of compound (A2a). The use of compounds (A2a) and/or (A2b) in component (K2) according to the invention is not affected by this further use of compound (A2a) in component (K1).

The water used in the present invention may be present directly as is, in the form of an aqueous formulation, or as water contained in or absorbed by solids.

Examples of aqueous preparations are aqueous emulsions, such as, for example, emulsions of water in plasticizers, organic solvents and/or silicone resins. Optionally there may also be present thickeners and/or fillers.

An example of water contained in a solid is water bound to a filler, such as a pulverized filler such as, for example, ground calcium carbonate or hydrophilic silica which may contain at least 1% by weight of surface bound water.

Other examples of water contained in solids are fillers such as precipitated calcium carbonate, zeolite or optionally activated colloidal magnesium aluminum silicate containing water physically bound within the filler particles, or water particles surrounded by wax or resin polymers.

For preparing component (K2) according to the invention, water is preferably used directly as such.

In addition to compounds (A1a), (A1b), (A2a) and/or (A2b) and water, the composition (K) of the present invention has hitherto also been used in crosslinkable compositions and compounds (A1a), (A1b), ( A2a), (A2b) and any further substances different from water, examples of which are organosilicon compounds containing basic nitrogen (B), fillers (C), silicone resins (D), catalysts ( E), adhesion promoter (F), water scavenger (G), thickener (H), non-reactive plasticizer (I), organic solvent (J), additive (L) and adjuvant (M).

The compound (B) optionally used in the composition (K) of the present invention is preferably an organosilicon compound comprising units of the formula:

D _h Si(OR ¹¹ ) _g R ¹² _f O _(4-fgh)/2 (IV)

during the meal,

R ¹¹ , which may be the same or different, represents a hydrogen atom or an optionally substituted hydrocarbon radical,

D, which may be the same or different, represents a monovalent, SiC bonded radical containing basic nitrogen,

R ¹² , which may be the same or different, represents a monovalent, optionally substituted, SiC bonded organic radical free of basic nitrogen,

f is 0, 1, 2 or 3, preferably 1 or 0,

g is 0, 1, 2 or 3, preferably 1, 2 or 3, more preferably 2 or 3,

h is 0, 1, 2, 3 or 4, preferably 1,

provided that the sum of f+g+h is not more than 4, and there is at least one radical D per molecule.

The organosilicon compounds (B) optionally used in the present invention are silanes, i.e. compounds of formula (VI), wherein f+g+h=4, and siloxanes, i.e. compounds of formula (IV) , wherein f+g+h<3 It may be a compound containing units, preferably silane.

Examples of optionally substituted hydrocarbon radicals R ¹¹ are those specified for the radical R.

The radical R ¹¹ is preferably a hydrogen atom, or a hydrocarbon radical having 1 to 18 carbon atoms and optionally substituted with a halogen atom, more preferably a hydrogen atom, or a hydrocarbon radical having 1 to 10 carbon atoms, more particularly methyl or ethyl radical.

Examples of radicals R ¹² are those specified for R.

The radical R ¹² is preferably a hydrocarbon radical having 1 to 18 carbon atoms and optionally substituted with halogen atoms, more preferably a hydrocarbon radical having 1 to 5 carbon atoms, more particularly a methyl radical.

Examples of radicals D are of the formula H ₂ N(CH ₂ ) ₃ -, H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ -, H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₂ NH(CH _{2 )} ) ₃ -, H ₃ CNH(CH ₂ ) ₃ -, C ₂ H ₅ NH(CH ₂ ) ₃ -, C ₃ H ₇ NH(CH ₂ ) ₃ -, C ₄ H ₉ NH(CH ₂ ) ₃ -, C ₅ H ₁₁ NH(CH ₂ ) ₃ -, C ₆ H ₁₃ NH(CH ₂ ) ₃ -, C ₇ H ₁₅ NH(CH ₂ ) ₃ -, H ₂ N(CH ₂ ) ₄ -, H ₂ N- CH ₂ -CH(CH ₃ )-CH ₂ -, H ₂ N(CH ₂ ) ₅ -, cyclo-C ₅ H ₉ NH(CH ₂ ) ₃ -, cyclo-C ₆ H ₁₁ NH(CH ₂ ) ₃ - , phenyl-NH(CH ₂ ) ₃ -, (CH ₃ ) ₂ N(CH ₂ ) ₃ -, (C ₂ H ₅ ) ₂ N(CH ₂ ) ₃ -, (C ₃ H ₇ ) ₂ NH(CH _{2 )} ) ₃ - (C ₄ H ₉ ) ₂ N(CH ₂ ) ₃ -, (C ₅ H ₁₁ ) ₂ N(CH ₂ ) ₃ -, (C ₆ H ₁₃ ) ₂ N(CH ₂ ) ₃ -, (C ₇ H ₁₅ ) ₂ N(CH ₂ ) ₃ -, H ₂ N(CH ₂ )-, H ₂ N(CH ₂ ) ₂ NH(CH ₂ )-, H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₂ NH(CH ₂ )-, H ₃ CNH(CH ₂ )-, C ₂ H ₅ NH(CH ₂ )-, C ₃ H ₇ NH(CH ₂ )-, C ₄ H ₉ NH(CH ₂ )-, C ₅ H ₁₁ NH(CH ₂ )-, C ₆ H ₁₃ NH(CH ₂ )-, C ₇ H ₁₅ NH(CH ₂ )-, cyclo-C ₅ H ₉ NH(CH ₂ )-, cyclo-C ₆ H ₁₁ NH(CH ₂ )-, phenyl-NH(CH ₂ )-, (CH ₃ ) ₂ N(CH ₂ )-, (C ₂ H ₅ ) ₂ N(CH ₂ )-, (C ₃ H ₇ ) ₂ NH(CH ₂ )-, (C ₄ H ₉ ) ₂ NH(CH ₂ )-, (C ₅ H ₁₁ ) ₂ NH(CH ₂ )-, ( C ₆ H ₁₃ ) ₂ NH(CH ₂ )-, (C ₇ H ₁₅ ) ₂ NH(CH ₂ )-, (CH ₃ O) ₃ Si(CH ₂ ) ₃ NH(CH ₂ ) ₃ -, (C ₂ H ₅ O) ₃ Si(CH ₂ ) ₃ NH(CH ₂ ) ₃ -, (CH ₃ O) ₂ (CH ₃ )Si(CH ₂ ) ₃ NH(CH ₂ ) _3- and (C ₂ H ₅ O) ₂ (CH ₃ )Si(CH ₂ ) ₃ NH(CH ₂ ) ₃ - radicals and also the primary amino groups described above, reaction products of compounds comprising epoxide groups or double bonds reactive towards primary amino groups.

The radical D preferably comprises a H ₂ N(CH ₂ ) ₃ -, H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ - or cyclo-C ₆ H ₁₁ NH(CH ₂ ) ₃ radical.

Examples of silanes of formula (IV) optionally used in the present invention are H ₂ N(CH ₂ ) ₃ -Si(OCH ₃ ) ₃ , H ₂ N(CH ₂ ) ₃ -Si(OC ₂ H ₅ ) ₃ , H ₂ N(CH ₂ ) ₃ -Si(OCH ₃ ) ₂ CH ₃ , H ₂ N(CH ₂ ) ₃ -Si(OC ₂ H ₅ ) ₂ CH ₃ , H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ -Si(OCH ₃ ) ₃ , H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ -Si(OC ₂ H ₅ ) ₃ , H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ -Si( OCH ₃ ) ₂ CH ₃ , H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ -Si(OC ₂ H ₅ ) ₂ CH ₃ , H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ -Si( OH) ₃ , H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ -Si(OH) ₂ CH ₃ , H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₂ NH(CH ₂ ) ₃ -Si( OCH ₃ ) ₃ , H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₂ NH(CH ₂ ) ₃ -Si(OC ₂ H ₅ ) ₃ , Cyclo-C ₆ H ₁₁ NH(CH ₂ ) ₃ -Si( OCH ₃ ) ₃ , Cyclo-C ₆ H ₁₁ NH(CH ₂ ) ₃ -Si(OC ₂ H ₅ ) ₃ , Cyclo-C ₆ H ₁₁ NH(CH ₂ ) ₃ -Si(OCH ₃ ) ₂ CH ₃ , Cyclo -C ₆ H ₁₁ NH(CH ₂ ) ₃ -Si(OC ₂ H ₅ ) ₂ CH ₃ , cyclo-C ₆ H ₁₁ NH(CH ₂ ) ₃ -Si(OH) ₃ , cyclo-C ₆ H ₁₁ NH( CH ₂ ) ₃ -Si(OH) ₂ CH ₃ , Phenyl-NH(CH ₂ ) ₃ -Si(OCH ₃ ) ₃ , Phenyl-NH(CH ₂ ) ₃ -Si(OC ₂ H ₅ ) ₃ , Phenyl-NH (CH ₂ ) ₃ -Si(OCH ₃ ) ₂ CH ₃ , Phenyl-NH(CH ₂ ) ₃ -Si(OC ₂ H ₅ ) ₂ CH ₃ , Phenyl-NH(CH ₂ ) ₃ -Si(OH) ₃ , phenyl-NH(CH ₂ ) ₃ -Si (OH) ₂ CH ₃ , HN((CH ₂ ) ₃ -Si(OCH ₃ ) ₃ ) ₂ , HN((CH ₂ ) ₃ -Si(OC ₂ H ₅ ) ₃ ) ₂ , HN((CH ₂ ) ₃ -Si(OCH ₃ ) ₂ CH ₃ ) _2, HN((CH ₂ ) ₃ -Si(OC ₂ H ₅ ) ₂ CH ₃ ) ₂ , Cyclo-C ₆ H ₁₁ NH(CH ₂ )-Si(OCH ₃ ) ₃ , Cyclo-C ₆ H ₁₁ NH(CH ₂ )-Si(OC ₂ H ₅ ) ₃ , Cyclo-C ₆ H ₁₁ NH(CH ₂ )-Si(OCH ₃ ) ₂ CH ₃ , Cyclo-C ₆ H ₁₁ NH(CH ₂ )-Si(OC ₂ H ₅ ) ₂ CH ₃ , Cyclo-C ₆ H ₁₁ NH(CH ₂ )-Si(OH) ₃ , Cyclo-C ₆ H ₁₁ NH(CH ₂ )-Si(OH) ) ₂ CH ₃ , Phenyl-NH(CH ₂ )-Si(OCH ₃ ) ₃ , Phenyl-NH(CH ₂ )-Si(OC ₂ H ₅ ) ₃ , Phenyl-NH(CH ₂ )-Si(OCH ₃ ) ₂ CH ₃ , Phenyl-NH(CH ₂ )-Si(OC ₂ H ₅ ) ₂ CH ₃ , Phenyl-NH(CH ₂ )-Si(OH) ₃ and Phenyl-NH(CH ₂ )-Si(OH) ₂ CH ₃ and also partial hydrolysates thereof, H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ -Si(OCH ₃ ) ₃ , H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ -Si( OC ₂ H ₅ ) ₃ , H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ -Si(OCH ₃ ) ₂ CH ₃ , Cyclo-C ₆ H ₁₁ NH(CH ₂ ) ₃ -Si(OCH ₃ ) ₃ , cyclo-C ₆ H ₁₁ NH(CH ₂ ) ₃ -Si(OC ₂ H ₅ ) ₃ or cyclo-C ₆ H ₁₁ NH(CH ₂ ) ₃ -Si(OCH ₃ ) ₂ CH ₃ and also in each case these partial hydrolysates of H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ -Si(OCH ₃ ) ₃ , H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ -Si(OCH ₃ ) ₂ CH ₃ , Cyclo-C ₆ Particular preference is given to H ₁₁ NH(CH _{2 ) 3} -Si(OCH ₃ ) ₃ or cyclo-C ₆ H ₁₁ NH(CH ₂ ) ₃ -Si(OCH ₃ ) ₂ CH ₃ and also in each case partial hydrolysates thereof. do.

The organosilicon compound (B) optionally used in the present invention may also serve as a curing catalyst or a curing co-catalyst in the composition of the present invention.

In addition, the organosilicon compound (B) optionally used in the present invention may act as an adhesion promoter and/or as a water scavenger.

The organosilicon compound (B) optionally used in the present invention is a standard commercial product or can be prepared by a method conventional in the field of chemistry.

When an organosilicon compound (B) containing basic nitrogen is used, it is preferably a constituent of component (K1).

When component (K1) comprises compound (B), the amounts included are in each case 100 parts by weight of all compounds (A1a), (A1b), (A2a) and/or (A2b) used in the mixture (K). Based on the, preferably 0.1 to 25 parts by weight, more preferably 0.5 to 10 parts by weight. Component (K1) of the present invention preferably comprises compound (B).

The filler (C) optionally used in the composition (K) of the present invention may be any desired filler hitherto known.

Examples of (C) are non-reinforcing fillers, which preferably have ^{a BET surface area of at most 50 m 2} /g, such as quartz, diatomaceous earth, calcium silicate, zirconium silicate, talc, kaolin, zeolites, metal oxide powders such as pulverized and calcined oxides of aluminum, titanium, iron or zinc and/or mixed oxides thereof. Generally speaking, there is no limit to the shape—whether spherical or sharp-edged through a potato shape—because both splitting and grinding grades are available. The size of these fillers is preferably in the range from 0.01 μm to 100 μm, more particularly from 0.1 μm to 50 μm.

Further suitable are salts such as plastic powders such as barium sulfate, calcium carbonate, gypsum, silicon nitride, silicon carbide, boron nitride, glass powder and polyacrylonitrile powder; reinforcing fillers (which are fillers with a BET surface area ^{greater than 50 m 2} /g), such as mixed silicon aluminum oxide of high BET surface area and carbon black such as fumed silica, precipitated silica, precipitated chalk, furnace black and acetylene black; Aluminum trihydroxide, aluminosilicates, clay minerals, magnesium aluminum silicates, such ^{as those obtainable from BASF under the trade name Micro-sorb ®} , fillers in the form of hollow beads such as ceramic microbeads (eg 3M, Neuss, Germany) from Deutschland GmbH under the trade name Zeeospheres™), elastomeric beads such as AKZO NOBEL, Sundsvall, Sweden ^{, sold under the trade name EXPANCEL ®} from Expancel, or glass beads; fibrous fillers such as asbestos and also plastic fibers. The fillers mentioned can be hydrophobized, for example by treatment with organosilanes and/or organosiloxanes or stearic acid or by etherification of hydroxyl groups to form alkoxy groups.

Fillers (C) optionally used are preferably calcium carbonate, talc, silica or aluminum trihydroxide.

Preferably also used in component (K2) is magnesium aluminum silicate, because of the high absorption of water added to this component as well.

Preferred calcium carbonate grades are ground or precipitated and optionally surface treated with a fatty acid such as stearic acid or a salt thereof. Preferred silicas preferably include fumed silica.

The filler (C) used optionally has a moisture content of preferably less than 1% by weight, more preferably less than 0.5% by weight.

The filler (C) here can be a constituent of component (K1) and also a constituent of component (K2). They may also be present in both components (K1) and (K2).

When the composition (K) of the present invention comprises a filler (C), the amounts included are in each case 100 parts by weight of the compounds (A1a), (A1b), (A2a) and/or ( A2b), based on all, preferably 10 to 1,000 parts by weight, more preferably 50 to 500 parts by weight, still more particularly 80 to 300 parts by weight. The composition (K) of the invention preferably comprises a filler (C).

In one preferred embodiment of the present invention, the filler (C) comprised in the composition (K) of the present invention is

a) calcium carbonate, aluminum trihydroxide and/or talc;

b) silica, more particularly fumed silica, and/or

c) colloidal magnesium aluminum silicate

A combination of , is preferably included in component (K2).

If the composition (K) of the invention comprises this particular combination of different fillers (C), they in each case are used in the mixture (K) in 100 parts by weight of the compounds (A1a), (A1b), (A2a) and / or (A2b) based on all, preferably 0 to 80 parts by weight, more preferably 5 to 40 parts by weight silica, more particularly fumed silica, and preferably 10 to 500 parts by weight, more preferably 50 parts by weight to 300 parts by weight of calcium carbonate, aluminum trihydroxide, talc or mixtures of these materials, 0 to 100, preferably 5 to 40 parts by weight of colloidal magnesium aluminum silicate.

The silicone resin (D) optionally used in the composition (K) of the present invention is preferably a phenyl silicone resin.

Component Examples of (D) a silicone resin which can be used as is a standard commercial product, for example, is different SILRES ^® grades, such as ^{SILRES ® IC 368, SILRES ® IC} 678, SILRES ® IC 232, SILRES ® IC 235 from Wacker Chemie AG or SILRES ^® SY231.

When the composition (K) of the present invention comprises a resin (D), the amounts included are in each case 100 parts by weight of the compounds (A1a), (A1b), (A2a) and/or ( A2b), based on all, is preferably 5 to 1,000 parts by weight, more preferably 10 to 500 parts by weight, and still more particularly 50 to 300 parts by weight.

The total amount of the silicone resin (D) in this case may be located entirely in component (K1), entirely in component (K2), or else in each case in parts of the two components (K1) and (K2).

Catalyst (E) optionally used in the composition of the present invention may be any desired catalyst hitherto known for compositions cured by silane condensation.

Examples of the metal-containing curing catalyst (E) are organic titanium and organotin compounds, and examples thereof include titanate esters such as tetrabutyl titanate, tetrapropyl titanate, tetraisopropyl titanate and titanium tetraacetylacetonate; Tin compounds such as dibutyltin dilaurate, dibutyltin maleate, dibutyltin diacetate, dibutyltin dioctanoate, dibutyltin acetylacetonate, dibutyltin oxide and the corresponding dioctyltin compounds am.

Examples of the metal-free curing catalyst (E) include basic compounds such as triethylamine, tributylamine, 1,4-diazabicyclo[2.2.2]octane, 1,5-diazabicyclo[4.3.0 ]Non-5-ene, 1,8-diazabicyclo[5.4.0]undec-7-ene, N,N-bis(N,N-dimethyl-2-amino-ethyl)methylamine, N,N- dimethylcyclohexylamine, N,N-dimethylphenylamine and N-ethylmorpholinine, guanidine derivatives such as mono-, di-, tri, tetra- or pentamethylguanidine.

Likewise compatible with the catalyst (E) are acidic compounds such as phosphoric acid and its esters, toluenesulfonic acid, sulfuric acid, nitric acid or organic carboxylic acids, for example acetic acid and benzoic acid.

When the composition (K) of the present invention comprises a catalyst (E), the catalyst comprised is preferably a low quarry catalyst, more preferably a catalyst (E) free of tin, more particularly a catalyst free of metal catalyst (E).

Catalyst (E) here is preferably used as a constituent of component (K1).

When the composition (K) of the present invention comprises a catalyst (E), the amounts included are in each case 100 parts by weight of the compounds (A1a), (A1b), (A2a) and/or ( A2b) is preferably 0.01 to 20 parts by weight, more preferably 0.05 to 5 parts by weight, based on all of A2b).

If the composition (K) of the invention comprises an undesirable tin catalyst (E), the amount included is such that the weight fraction of tin, based in each case on the total weight of the component (K), is preferably at most 500 ppm by weight, more preferably at most 250 ppm by weight, particularly preferably at most 100 ppm by weight.

Polymers (A1a) and (A2a) are notable for their very high reactivity towards water and therefore usually require only very small amounts of tin catalyst or cure at a sufficient rate, e.g. under completely tin-free catalysis in the presence of an amine catalyst. . Surprisingly, this low-stone or tin-free curing works even when these polymers (A1a) and/or (A2a) are mixed with conventional polymers with low reactivity, ie polymers (A1b) or (A2b). Thus, 2K systems of this kind cure rapidly without tin or with little tin, even when only one of the two components (K1) or (K2) contains a highly reactive polymer (A1a) or (A2a). This is particularly true in the above embodiment of the invention wherein component (K1) comprises compound (A1a) and component (K2) comprises compound (A2b). To this extent, tin-free compositions (K) comprising compounds (A1a) and/or (A2a) represent particularly preferred embodiments of the invention.

The adhesion promoter (F) optionally used in the composition (K) of the present invention may be any desired adhesion promoter different from the compound (B), which has been described so far for system curing by silane condensation.

Examples of adhesion promoters (F) include epoxy silanes such as glycidyloxypropyltrimethoxysilane, glycidyloxypropylmethyldimethoxysilane, glycidyloxypropyltriethoxysilane or glycidyloxypropylmethyldiethoxy Silane, 2-(3-triethoxysilylpropyl)maleic anhydride, N-(3-trimethoxysilylpropyl)urea, N-(3-triethoxysilylpropyl)urea, N-(trimethoxysilyl) Methyl)urea, N-(methyldimethoxysilylmethyl)urea, N-(3-triethoxysilylmethyl)urea, N-(3-methyldiethoxysilylmethyl)urea, O-methyl-carbamatomethyl Methyldimethoxysilane, O-methylcarbamatomethyltrimethoxysilane, O-ethylcarbamatomethylmethyldiethoxysilane, O-ethyl-carbamatomethyltriethoxysilane, 3-methacryloxy Propyltrimethoxysilane, methacryloxymethyltrimethoxysilane, methacryloxymethylmethyldimethoxysilane, methacryloxymethyltriethoxysilane, methacryloxymethylmethyldiethoxysilane, 3-acryloxypropyltrimethoxy silane, acryloxymethyltrimethoxysilane, acryloxymethylmethyldimethoxysilane, acryloxymethyltriethoxysilane and acryloxymethylmethyldiethoxysilane and also partial condensates thereof.

If adhesion promoters (F) are used, they may be included in component (K1) and/or component (K2).

When the composition (K) of the present invention comprises an adhesion promoter (F), the amounts included are in each case 100 parts by weight of the compounds (A1a), (A1b), (A2a) and/or used in the mixture (K). (A2b) Based on all, Preferably it is 0.5-30 weight part, More preferably, it is 1-10 weight part.

The water scavenger (G) optionally used in the composition (K) of the present invention may be any desired water scavenger different from compounds (B) and (F) and described for a system that cures by silane condensation.

Examples of water scavengers (G) include silanes such as vinyltrimethoxysilane, vinyltriethoxysilane, vinylmethyldimethoxysilane, O-methyl-carbamatomethylmethyldimethoxysilane, O-methyl-car Bametomethyltrimethoxysilane, O-ethylcarbamatomethylmethyldiethoxysilane, O-ethylcarbamatomethyltriethoxysilane, and/or partial condensates thereof, and orthoesters such as 1 ,1,1-trimethoxyethane, 1,1,1-triethoxyethane, trimethoxymethane and triethoxymethane.

If a water scavenger (G) is used, it is preferably a constituent of component (K1).

When component (K1) comprises a water scavenger (G), the amounts included are in each case 100 parts by weight of the compounds (A1a), (A1b), (A2a) and/or ( A2b) is preferably 0.5 to 30 parts by weight, more preferably 1 to 10 parts by weight, based on all of A2b). Component (K1) preferably comprises a water scavenger (G).

The thickener (H) optionally used in the composition (K) of the present invention is preferably an organic thickener, more preferably a water-soluble or water-swellable polymer. Examples of the organic thickener (H) include starch, dextrin, oligosaccharide, cellulose, carboxymethyl cellulose, cellulose ether, methylcellulose, cellulose derivatives such as hydroxyethylcellulose or hydroxypropylcellulose, agar, alginate, pectin, gelatin, cara gen, tragans, gum arabic, casein, polyacrylamide, poly(meth)acrylic acid derivatives, polyethylene glycol, polyvinyl ether, polyvinyl alcohol, polyamide or polyamine.

If a thickener (H) is used, it is preferably a constituent of component (K2).

When the composition (K) of the present invention preferably comprises a thickener (H) in the component (K2), the amount included is in each case 100 parts by weight of the compounds (A1a), (A1b) used in the mixture (K) , (A2a) and/or (A2b), preferably 0.5 to 100 parts by weight, more preferably 1 to 30 parts by weight.

Fumed silica, aluminosilicate or clay minerals already described as filler (C) may also have a thickening effect. Accordingly, these fillers (C) can also be used for the purpose of thickening the components (K1) and/or (K2) of the present invention.

The non-reactive plasticizer (I) is preferably phthalic acid ester, adipic acid ester, benzoic acid ester, glycol ester, ester of saturated alkanediol, phosphoric acid ester, sulfone ester, polyester, polyether, polystyrene, polybutadiene, polyisobutyl enes, paraffinic hydrocarbons or high molecular weight branched hydrocarbons.

Using a non-reactive plasticizer (I) having a molar mass of 200 to 20,000 g/mol, more preferably 500 to 10,000 g/mol, more particularly 900 to 8,000 g/mol or an average molar mass M _{n in the case of polymeric plasticizers} it is preferable

The non-reactive plasticizer (I) here may be a constituent of both component (K1) and component (K2). It may also be included in both components (K1) and (K2).

When the composition (K) of the present invention comprises a non-reactive plasticizer (I), the amounts included are in each case 100 parts by weight of the compounds (A1a), (A1b), (A2a) and/or used in the mixture (K). or (A2b), preferably 1 to 200 parts by weight, more preferably 5 to 100 parts by weight, based on all of (A2b). In one preferred embodiment of the invention, the composition (K) of the invention does not comprise non-reactive plasticizers (I).

Examples of solvents (J) are low molecular weight ethers, esters, ketones, aromatic and aliphatic and also optionally halogen-containing hydrocarbons and alcohols, the latter being preferred.

Here the solvent (J) may be a constituent of both component (K1) and component (K2). It may also be included in both components (K1) and (K2).

Preferably no organic solvent (J) is added to the composition (K) of the present invention.

The additive (L) optionally used in the composition of the present invention may be any given additive typical of the silane-crosslinking system, known to date.

Additives (L) optionally used in the present invention are preferably antioxidants, UV stabilizers, such as so-called HALS compounds, bactericides and pigments. In addition, component (K2) may comprise an emulsifier as an additive, which improves the compatibility and/or emulsification of water and the remaining components of this component. The emulsifier may be an ionic or non-ionic emulsifier.

Here, the additive (L) may be a constituent of the component (K1) and the component (K2). It may also be included in both components (K1) and (K2).

When the composition (K) of the present invention comprises an additive (L), the amounts included are in each case 100 parts by weight of the compounds (A1a), (A1b), (A2a) and/or ( A2b), based on all, preferably 0.01 to 30 parts by weight, more preferably 0.1 to 10 parts by weight. The composition (K) of the invention preferably comprises an additive (L).

The auxiliary agent (M) optionally used in the present invention is preferably tetraalkoxysilane, examples being tetraethoxysilane and/or partial condensates thereof, reactive plasticizers, rheology additives or flame retardants.

Preferred reactive plasticizers (M) are compounds containing an alkyl chain having 6 to 40 carbon atoms and having groups reactive toward compounds (A1) and (A2). Examples are isooctyltrimethoxysilane, isooctyltriethoxysilane, N-octyltrimethoxysilane, N-octyltriethoxysilane, decyltrimethoxysilane, decyltriethoxysilane, dodecyltrimethoxysilane, dode siltriethoxysilane, tetradecyltrimethoxysilane, tetradecyltriethoxysilane, hexadecyltrimethoxysilane and also hexadecyltriethoxysilane.

The rheological additive (M) is preferably a polyamide wax, hydrogenated castor oil or stearate.

The flame retardants (M) used may be typical flame retardants of the kind typical for adhesive systems and sealant systems, more particularly halogenated compounds and derivatives, in particular phosphoric acid esters.

The adjuvant (M) here may be a constituent of both component (K1) and component (K2). It may also be included in both components (K1) and (K2).

When the composition (K) of the present invention comprises at least one component (M), the amounts included are in each case 100 parts by weight of the compounds (A1a), (A1b), (A2a) and / or (A2b), based on all, preferably 0.5 to 200 parts by weight, more preferably 1 to 100 parts by weight, still more particularly 2 to 70 parts by weight.

The composition (K) of the present invention is preferably

(A1) an organosilicon compound selected from compounds (A1a) and (A1b);

optionally (B) a compound containing basic nitrogen,

optionally (C) a filler,

optionally (D) a silicone resin,

optionally (E) a catalyst,

optionally (F) an adhesion promoter;

optionally (G) a water scavenger,

optionally (I) a non-reactive plasticizer,

optionally (J) an organic solvent,

optionally (L) an additive, and

optionally (M) adjuvant

A component comprising (K1),

and also in each case based on 100 parts by weight of compound (A1) in component (K1), at least 0.05 parts by weight of water, and also

(A2) 10 to 1,000 parts by weight of an organosilicon compound selected from compounds (A2a) and (A2b);

optionally (C) a filler,

optionally (D) a silicone resin,

optionally (F) an adhesion promoter;

optionally (H) a thickener,

optionally (I) a non-reactive plasticizer,

optionally (J) an organic solvent,

optionally (L) an additive, and

optionally (M) adjuvant

It is a composition consisting of component (K2) containing

The composition (K) of the present invention is more preferably

(A1) 100 parts by weight of an organosilicon compound selected from compounds (A1a) and (A1b);

(B) a compound containing basic nitrogen,

optionally (C) a filler,

optionally (D) a silicone resin,

optionally (E) a catalyst,

optionally (F) an adhesion promoter;

optionally (G) a water scavenger,

optionally (I) a non-reactive plasticizer,

optionally (J) an organic solvent,

optionally (L) an additive, and

optionally (M) adjuvant

A component comprising (K1),

and also in each case based on 100 parts by weight of compound (A1) in component (K1), at least 0.05 parts by weight of water, and also

(A2) 20 to 500 parts by weight of an organosilicon compound selected from compounds (A2a) and (A2b);

optionally (C) a filler,

optionally (D) a silicone resin,

optionally (F) an adhesion promoter;

optionally (H) a thickener,

optionally (I) a non-reactive plasticizer,

optionally (J) an organic solvent,

optionally (L) an additive, and

optionally (M) adjuvant

It is a composition consisting of component (K2) comprising

Component (K1) used in the present invention is preferably compound (A1) and also optionally (B), (C), (D), (E), (F), (G), (H), (I) ), (J), (L), (M) and (A2a) do not contain other components.

Component (K2) used in the present invention is preferably a compound (A2), water and also optionally (B), (C), (D), (E), (F), (G), (H), It does not contain components other than (I), (J), (L) and (M).

The composition (K) of the present invention is preferably a compound (A1a), (A1b), (A2a), (A2b), (B), (C), (D), (E), (F), (G ), (H), (I), (J), (L), (M) and does not contain components other than water.

Each ingredient used in the present invention may comprise one kind of any such ingredient, or may otherwise comprise a mixture of at least two of each ingredient.

The component (K1) used in the present invention has in each case a viscosity of preferably 500 to 1,000,000 mPas, more preferably 1,000 to 500,000 mPas, more particularly 1,000 to 20,000 mPas at 25°C.

The component (K2) used in the present invention has in each case a viscosity of preferably from 500 to 1,000,000 mPas, more preferably from 1,000 to 500,000 mPas, more particularly from 1,000 to 20,000 mPas at 25°C.

The proportions of components (K1) and (K2) can in principle be chosen arbitrarily, provided that the required proportions are achieved between compound (A1) in component (K1) and compound (A2) in component (K2) and also water do. The ratio of (K1) to (K2) is preferably 5:1 to 1:5, more preferably 2:1 to 1:2 by weight in each case.

The components (K1) and (K2) of the present invention may be produced in any desired conventional manner, for example according to techniques and mixing methods of the kind customary for the production of moisture-curing compositions. The order in which the various components are mixed with each other may be arbitrarily changed.

A further subject of the invention is a process for preparing the composition (K) of the invention by mixing together the components (K1) and (K2) and also optionally further components, wherein the individual components optionally It is prepared by mixing together separately in the order of

This mixing can occur at room temperature and ambient atmospheric pressure, ie, between about 900 and 1100 hPa. If desired, this mixing may alternatively take place at a higher temperature, such as a temperature in the range of 30 to 130°C. It is further possible to carry out the mixing temporarily or continuously under reduced pressure, such as an absolute pressure of 30 to 500 hPa, in order to remove volatile compounds and/or air.

The mixing of component (K1) according to the invention preferably takes place in the absence of moisture.

The process of the present invention may be carried out continuously or discontinuously.

The individual components of the compositions of the present invention are storage stable premixes, which may then be mixed, particularly immediately before or during processing, in situ.

The composition (K) of the invention is preferably crosslinked during and/or after contacting the components (K1) and (K2) at room temperature, with mechanical mixing being preferred. If desired, crosslinking may also occur at temperatures above or below room temperature, such as -5°C to 15°C or 30°C to 50°C.

The crosslinking is preferably carried out under a pressure of 100 to 1100 hPa, more particularly under the pressure of the ambient atmosphere.

A further subject of the invention is a molded article produced by crosslinking the composition (K) of the invention.

The molded article of the present invention may comprise any desired molded article, such as, for example, gaskets, compression moldings, extrusion profiles, coatings, impregnations, encapsulations, lenses, prisms, polygonal structures, laminate layers or adhesive layers.

The composition (K) of the present invention is preferably used as an adhesive or sealant. It can be used to join all materials, for example wood, concrete, porous stone, paper, textiles, leather and the like. Unlike one-component compositions, which cure only through contact with atmospheric moisture, they are suitable for bonding water-impermeable materials such as, for example, metals, glass, water-impermeable ceramics, non-porous stones, plastics, painted surfaces, and the like. This is also the case when very deep adhesive seams or very thick layers of adhesive make atmospheric moisture curing impossible or at least significantly slowed down. Here it is possible to combine similar or different materials with each other.

The composition (K) of the invention can also be used to seal any joints between the abovementioned materials.

A further subject of the present invention is a method for bonding or sealing substrates, wherein the components (K1) and (K2) and also optionally further components used in the present invention are first mixed with each other and then applied to the surface of at least one substrate Then, this surface is contacted with the second substrate to be bonded, and the composition (K) of the present invention is then crosslinked.

A further subject of the present invention is a process for the preparation of a coating or encapsulation, wherein the components (K1) and (K2) and also optionally further components used in the present invention are first mixed with each other and then applied to at least one substrate, The composition (K) of the present invention is then crosslinked.

Examples thereof are the production of encapsulation compositions, moldings, composite materials and molded composite parts for LEDs or other electronic components. A molded composite part refers here to a single molding comprising a composite material assembled from at least one substrate and a crosslinked product of the composition of the present invention in such a way that there is a firm and durable bond between the two parts.

An advantage of the composition (K) of the invention is that it is easy to produce.

An advantage of the crosslinkable composition (K) of the invention is that it can be noted a very high storage stability of the individual components.

The advantage of the crosslinkable compositions of the present invention is that after mixing of the components (K1) and (K2) and also any further components they exhibit a high crosslinking rate and are not affected by a high layer thickness and/or water and atmospheric moisture. It cures directly even in a deep adhesive joint between two substrates.

A further advantage of the crosslinkable compositions of the present invention is that they exhibit good adhesion profiles.

Another advantage of the crosslinkable compositions of the present invention is that they can be used to produce adhesives with high lap shear strength.

In the examples described below, all viscosity values are based on a temperature of 25°C. Unless otherwise specified, the following examples are carried out at ambient atmospheric pressure, i.e., about 1,000 hPa, and room temperature, i.e., about 23° C. or the temperature that occurs when the reactants are combined at room temperature without further heating or cooling, and also at about carried out at 50% relative atmospheric humidity. In addition, all figures for parts and percentages represent weight, unless otherwise indicated.

Example

Preparation Example 1-1: Preparation of component (K1) for 2K adhesive formulation (K1-1)

172.4 g of double-sided silane terminated polypropylene glycol having an average molar mass (M _n ) of 12,000 g/mol and end groups of the formula -OC(=O)-NH-CH ₂ -SiCH ₃ (OCH ₃ ) _{2 (Munich, Germany)} ^{sold under the name GENIOSIL ®} STP-E10 from Wacker Chemie AG) with an average molar mass (M _n ) of 5,000 g/mol and the formula -OC(=O)-NH-CH ₂ -SiCH ₃ (OCH ₃ ) ₂ 34.4 g of a single-sided silane terminated polypropylene glycol having end groups of ( ^{commercially available under the name GENIOSIL ®} XM20 from Wacker Chemie AG, Munich, Germany), 10.4 g of vinyltrimethoxysilane and 3.6 g of a stabilizer mixture (20% Irganox ^® 1135 (CAS No. 125643-61-0), a mixture of 40% Tinuvin ^® 571 (CAS No. 23328-53-2) and 40% Tinuvin ^® 765 (CAS No. 41556-26-7)) (BASF, Germany) ^{marketed under the name TINUVIN ®} B 75 from SE) at about 25° C. in a laboratory planetary mixer from PC-Laborsystem equipped with two cross-arm mixers at 200 rpm for 2 minutes.

Thereafter, 69.2 g of stearic acid coated calcium carbonate having an average particle diameter (D50%) of about 2.0 μm (commercially available under the name Omyabond 520 from Omya, Cologne, Germany) and an average particle diameter (D50%) of about 0.07 μm were obtained. 103.6 g of fatty acid coated sedimentation chalk (commercially available under the name Hakuenka CCR S10 from Shiraishi Omya GmbH, Gunmern, Austria) was blended with stirring at 600 rpm for 1 minute. Finally, 6.4 g of N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane were mixed at 200 rpm for 1 minute. Finally, homogenization and aeration were carried out under a pressure of 100 mbar at 600 rpm for 2 minutes and at 200 rpm for 1 minute.

The finished component (K1-1) was transferred to a container with a hermetically sealed facility.

Preparation Example 2-1: Preparation of component (K2) for 2K adhesive formulation (K2-1)

200.0 g of single-sided silane terminated polypropylene glycol having an average molar mass (M _n ) of 5,000 g/mol and end groups of the formula -OC(=O)-NH-CH ₂ -SiCH ₃ (OCH ₃ ) _{2 (Munich, Germany)} from Wacker Chemie AG ^{under the name GENIOSIL ®} XM20), 100.0 g of stearic acid coated calcium carbonate having an average particle diameter (D50%) of about 2.0 μm (sold under the name Omyabond 520 from Omya, Cologne, Germany), 40.0 g of fatty acid coated sedimentation chalk with an average particle diameter (D50%) of about 0.07 μm (sold under the name Hakuenka CCR S10 from Shiraishi Omya GmbH, Gunmer, Austria) and 60 g of heat activated colloidal magnesium aluminum silicate (BASF, Germany) sold under the name Micro-sorb 300 LVM from SE), at about 25° C. with stirring in a laboratory planetary mixer from PC-Laborsystem equipped with two cross-arm stirrers at 600 rpm for 1 minute.

Then, 10 g of water was mixed at 200 rpm for 1 minute. Finally, homogenization and aeration were carried out under a pressure of 100 mbar at 600 rpm for 2 minutes and at 200 rpm for 1 minute.

The finished component (K2-1) was transferred to a container with a hermetically sealed facility.

Preparation 2-2: Preparation of component (K2) for 2K adhesive formulation (K2-2)

The procedure was exactly the same as in Preparation Example 2-1, but ^{200 g of GENIOSIL ®} XM20 was mixed with a single branched silane terminated polypropylene glycol 200 having an end group of the formula -O-(CH ₂ ) _{3 -SiCH 3} (OCH ₃ ) ₂ g (marketed under the name MS 303H from Kaneka, Japan).

Preparation 2-3: Preparation of component (K2) for 2K adhesive formulation (K2-3)

The procedure was exactly the same as in Preparation Example 2-1, but ^{200 g of GENIOSIL ®} XM20 was mixed with 200 g of a linear silane terminated polypropylene glycol having an end group of the _{formula -O-(CH 2} ) ₃ -SiCH ₃ (OCH ₃ ) _{2 (} marketed under the name SAX 750 from Kaneka, Japan).

Preparation 2-4: Preparation of component (K2) for 2K adhesive formulation (K2-4)

The procedure was exactly the same as in Preparation Example 2-1, but ^{200 g of GENIOSIL ®} XM20 was silane-modified with linear silane terminated polypropylene glycol, all having a silyl group of the formula -O-(CH ₂ ) ₃ -SiCH ₃ (OCH ₃ ) ₂ 200 g of a mixture of polyacrylates sold under the name MAX 951 from Kaneka, Japan.

Examples 1 to 4

In each case 60 g of the finished component K1-1, in each case the finished component K2-1 (Example 1), K2-2 (Example 2), K2-3 (Example 3) and K2-4 ( Example 4) 40 g and each were homogeneously mixed. The properties of the obtained four compositions were measured.

Skin Formation Time (SFT)

Skin formation time was determined by applying the resulting two-component crosslinked composition to a PE film, in layers each 2 mm thick, and storing this assembly at standard conditions (23° C. and 50% relative humidity). The skin formation test was performed once per minute during the curing process. For this test, a dry laboratory spatula was carefully placed on the surface of the specimen and pulled upwards. If the sample sticks to the spatula, the skin has not yet formed. When the sample no longer sticks to the spatula, a skin has formed and the time is recorded. The results are shown in Table 1.

mechanical properties

A two-component crosslinked composition was coated onto Teflon plaques milled out to a depth of 2 mm each and cured at 23° C. and 50% relative humidity for 2 weeks.

Shore A hardness was determined according to DIN EN 53505.

The tensile strength was determined according to DIN EN 53504-S1.

The elongation at break was determined according to DIN EN 53504-S1.

The 100% modulus was determined according to DIN EN 53504-S1.

The results are shown in Table 1.

Preparation Example 1-5: Preparation of component (K1) for 2K adhesive formulation (K1-5)

91 g of single-sided silane terminated polypropylene glycol having an average molar mass (M _n ) of 5,000 g/mol and end groups of the formula -OC(=O)-NH-CH ₂ -SiCH ₃ (OCH ₃ ) _{3 (Munich, Germany)} from Wacker Chemie AG ^{under the name GENIOSIL ®} XM25), 4.5 g of vinyltrimethoxysilane and 1.5 g of a mixture of stabilizers (20% Irganox ^® 1135 (CAS No. 125643-61-0), 40% Tinuvin ^® 571) (CAS No. 23328-53-2) and ^{a mixture of 40% Tinuvin ®} 765 (CAS No. 41556-26-7)) (marketed under the name ^{TINUVIN ® B 75 from BASF SE, Germany), about 25} Homogenize for 2 min at 200 rpm in a laboratory planetary mixer from PC-Laborsystem equipped with two cross-arm stirrers at °C.

Then 305 g of spherical aluminum oxide (marketed under the name Alunabeads™ CB A50 from Showa Denko, Tokyo, Japan), 375 g of calcined aluminum oxide (marketed under the name Alumina CL 3000 SG from Almatis, Ludwigshafen, Germany) ), and 220 g of zinc oxide (commercially available under the name Zinc Oxide Grade AZO 66 from US Zinc, Houston) were decomposed with stirring at 600 rpm for 1 minute. Finally, 3 g of N-(2-aminoethyl)-3-aminopropyltrimethoxysilane were mixed at 200 rpm for 1 minute. Finally, homogenization and aeration were carried out under a pressure of 100 mbar, at 600 rpm for 2 minutes and at 200 rpm for 1 minute.

The finished ingredients (K1-5) were transferred to a container with a hermetically sealed facility.

Preparation 2-5: Preparation of component (K2) for 2K adhesive formulation (K2-5)

96.2 g of single-sided silane terminated polypropylene glycol having an average molar mass (M _n ) of 5,000 g/mol and end groups of the formula -OC(=O)-NH-CH ₂ -SiCH ₃ (OCH ₃ ) _{2 (Wacker, Munich, Germany)} 305 g of spherical aluminum oxide (sold under the name Alunabeads™ CB A50 from Showa Denko, Tokyo, Japan), 375 g of calcined aluminum oxide (Almatis, Ludwigshafen, Germany), sold under the name ^{GENIOSIL ®} XM20 from Chemie AG Alumina CL 3000 SG, sold under the name Alumina CL 3000 SG), and 220 g zinc oxide (commercially available under the name Zinc Oxide Grade AZO 66 from US Zinc, Houston, USA) equipped with two cross-arm stirrers at about 25°C. Blended with stirring at 600 rpm for 1 min in a laboratory planetary mixer from PC-Laborsystem. Then, at a temperature of 55° C., under a pressure of 100 mbar, at 200 rpm for 1 minute, while homogenizing and stirring without foam, 3.8 g of water were mixed.

The finished ingredients (K2-5) were transferred to a container with a hermetically sealed facility.

Example 5

Adhesives based on components (K1-5) and (K2-5) were mixed in a mixing ratio of 1:1 by weight in a Speedmixer, and the mixture was left to cure at 23° C. and 50% relative humidity for 2 weeks. Then, in several experiments, the ^{composition was applied between two aluminum plaques with an area of 700 mm 2} , and the thermal conductivity was measured at different gap thicknesses according to ASTM 5470-12. A value of λ greater than 2.8 W/mK was confirmed.

Claims (13)

A multicomponent crosslinkable composition (K) comprising at least one component (K1) and one component (K2), comprising:
Component (K1) comprises an organosilicon compound (A1) selected from the compound (A1a) of the formula (Ia) and the compound (A1b) of the formula (Ib),
Component (K2) comprises, in each case, based on 100 parts by weight of compound (A1) in component (K1), at least 0.05 parts by weight of water, and 10 to 1,000 parts by weight of compounds (A2a) of the formula (IIa) and A multicomponent crosslinkable composition (K), characterized in that it comprises a component (A2) selected from the compound (A2b) of (IIb):
Y ¹ -[B ¹ -CR ² ₂ -SiR _a (OR ¹ ) _3-a ] _x (Ia)
Y ² -[B ² -(CR ⁴ ₂ ) _b -Si(OR ³ ) ₃ ] _y (Ib)
Y ³ -B ³ -CR ⁷ ₂ -SiR ⁵ _c (OR ⁶ ) _3-c (IIa)
Y ⁴ -[B ⁴ -(CR ¹⁰ ₂ ) _e -SiR ⁸ _d (OR ⁹ ) _3-d ] _z (IIb)
In the above formulas (Ia) and (Ib),
Y ¹ is an x-valent polymer radical bonded through carbon,
Y ² is a y-valent polymer radical bonded through carbon,
B ¹ and B ² may be each independently the same or different from each other, and a divalent linking group -O-, -NH-, -NR'-, -O-CO-NH-, -NH-CO-O-, - NH-CO-NH, -NH-CO-NR'-, -NR'-CO-NH-, -NH-CO-, -CO-NH-, -CO-O-, -O-CO-, -O -CO-O-, -S-CO-NH-, -NH-CO-S-, -CO-S-, -S-CO- or -S-;
R', which may be the same or different, is a monovalent, optionally substituted hydrocarbon radical or group -CH(COOR*)-CH ₂ -COOR*, wherein R* is an alkyl radical,
R, which may be the same or different, is a monovalent, optionally substituted, SiC bonded hydrocarbon radical,
R ¹ and R ³ may each independently be the same or different from each other and are a hydrogen atom or a monovalent, optionally substituted hydrocarbon radical,
R ² and R ⁴ are each independently from each other a monovalent, optionally substituted hydrocarbon radical, which may be the same or different and may be attached to a hydrogen atom or a carbon atom via a nitrogen, phosphorus, oxygen, sulfur or carbonyl group,
x and y are each independently an integer from 0 to 10,
a may be the same or different and is 0, 1 or 2, provided that if x=1, then a=0;
b may be the same or different, and is an integer from 3 to 10,
In the above formulas (IIa) and (IIb),
Y ³ is a monovalent polymer radical bonded through carbon,
Y ⁴ is a polymer radical with z bonded through carbon,
B ³ and B ⁴ may be the same or different from each other independently in each case, and a divalent linking group -O-, -NH-, -NR"-, -O-CO-NH-, -NH-CO-O- , -NH-CO-NH, -NH-CO-NR"-, -NR"-CO-NH-, -NH-CO-, -CO-NH-, -CO-O-, -O-CO-, -O-CO-O-, -S-CO-NH-, -NH-CO-S-, -CO-S-, -S-CO- or -S-;
R″, which may be the same or different, is a monovalent, optionally substituted hydrocarbon radical or group —CH(COOR*)—CH ₂ —COOR*, wherein R* is an alkyl radical,
R ⁵ and R ⁸ are each independently from each other, which may be the same or different, and are monovalent, optionally substituted, SiC bonded hydrocarbon radicals,
R ⁶ and R ⁹ may each independently be the same or different, and are a hydrogen atom or a monovalent, optionally substituted hydrocarbon radical,
R ⁷ and R ¹⁰ are each independently from each other, which may be the same or different, a hydrogen atom or a monovalent, optionally substituted hydrocarbon radical which may be attached to a carbon atom via a nitrogen, phosphorus, oxygen, sulfur or carbonyl group,
z is an integer from 1 to 10,
c is 1 or 2,
d can be the same or different and is 1 or 2,
e may be the same or different, and is an integer from 3 to 10. The crosslinkable composition according to claim 1, characterized in that it is a two-component composition consisting of components (K1) and (K2). The crosslinkable composition according to claim 1 or 2, characterized in that component (A1) comprises compound (A1a) and component (A2) comprises compound (A2b). ⁴ . The crosslinkable composition according to claim 1 , wherein the polymer radicals Y ¹ , Y ² , Y ³ and Y 4 independently of one another have no groups reactive with water or moisture. The crosslinkable composition according to any one of claims 1 to 4, comprising an organosilicon compound (B) containing basic nitrogen. 6. A tin catalyst (E) according to any one of the preceding claims, wherein the amount included is such that the weight fraction of tin is at most 500 ppm by weight, based on the total weight of the composition (K). A crosslinkable composition, characterized in that. 6. A crosslinkable composition according to any one of claims 1 to 5, characterized in that it does not contain tin. 8. The method according to any one of claims 1 to 7,
(A1) an organosilicon compound selected from compounds (A1a) and (A1b);
optionally (B) a compound containing basic nitrogen,
optionally (C) a filler,
optionally (D) a silicone resin,
optionally (E) a catalyst,
optionally (F) an adhesion promoter;
optionally (G) a water scavenger,
optionally (I) a non-reactive plasticizer,
optionally (J) an organic solvent,
optionally (L) an additive, and
optionally (M) adjuvant
A component (K1) comprising a, and
based in each case on 100 parts by weight of compound (A1) in component (K1), at least 0.05 parts by weight of water, and (A2) 10 to 1,000 parts by weight of an organosilicon compound selected from compounds (A2a) and (A2b),
optionally (C) a filler,
optionally (D) a silicone resin,
optionally (F) an adhesion promoter;
optionally (H) a thickener,
optionally (I) a non-reactive plasticizer,
optionally (J) an organic solvent,
optionally (L) an additive, and
optionally (M) adjuvant
A component comprising (K2)
A crosslinkable composition, characterized in that it is of a type consisting of. 9 . The crosslinkable composition according to claim 1 , wherein the ratio of (K1) to (K2) is from 5:1 to 1:5 by weight. 10. A process for preparing a composition as claimed in any one of claims 1 to 9 by mixing together components (K1) and (K2) and optionally further components, wherein all of the components of each component are optionally A process in which the individual components are prepared by separately mixing them together in sequence. A molded article produced by crosslinking a composition as claimed in any one of claims 1 to 9 or as claimed in claim 10 . A method of bonding or sealing a substrate, wherein components (K1) and (K2) and optionally further components are first mixed with each other and then applied to the surface of at least one substrate, followed by contacting the surface with a second substrate to be bonded; 11. A method of bonding or sealing followed by crosslinking a composition prepared as claimed in any one of claims 1 to 9 or as claimed in claim 10. A process for the preparation of a coating or encapsulation, wherein the components (K1) and (K2) and optionally further components are first mixed with each other and then applied to at least one substrate, followed by application to at least one substrate. 11. A process for crosslinking a composition prepared as claimed in claim 10 or as claimed in claim 10.