KR20210076600A - Curable composition for inkjet, and organic light emitting display device comprising the same - Google Patents

Abstract

The present invention relates to a composition capable of forming a protective film for protecting and supporting a lower portion of a display panel of a display device, and the display device including the same. The present invention comprises: (a) a display panel including a flexible substrate, a driving circuit unit disposed on one surface of the flexible substrate, and an organic light emitting element unit electrically connected to the driving circuit unit; and (b) a reinforcement unit disposed on the other surface of the flexible substrate and formed by directly coating the above-described curable inkjet composition.

Description

Curable composition for inkjet and organic light emitting display device including same {CURABLE COMPOSITION FOR INKJET, AND ORGANIC LIGHT EMITTING DISPLAY DEVICE COMPRISING THE SAME}

The present invention relates to a curable composition for inkjet and an organic light emitting display device including the same, and more specifically, a reinforcing part having excellent modulus properties, flexibility and adhesion is formed under the display panel of the organic light emitting display through direct coating such as inkjet printing. It relates to a curable composition for inkjet and a display device including the same.

Recently, various flat display devices having excellent thickness reduction, weight reduction, and low power consumption have been developed. Examples of the flat panel display device include a liquid crystal display device (LCD), a plasma display panel device (PDP), a field emission display device (FED), and an electroluminescence display device. Display device: ELD), organic light emitting display device (organic light emitting display device), and the like. Among them, the organic light emitting display device is a self-luminous display device that displays an image including an organic light emitting diode, and has high visibility due to self-luminescence, low power consumption, high luminance, and high response speed. Because of its characteristics, it is currently attracting attention as a display device.

However, the flat panel display device uses a glass substrate due to high heat generated during the manufacturing process, and thus there is a limit to light weight, thinness, and flexibility.

Accordingly, in the related art, a flexible display apparatus capable of bending a screen by using a flexible plastic substrate instead of a non-flexible glass substrate is being developed as a next-generation flat panel display apparatus.

However, while the plastic substrate is flexible, the support capacity of the display panel itself is low. For this reason, in order to support the display panel, a back plate film composed of a polyethylene terephthalate (PET) substrate or polyimide (PI) substrate and an adhesive layer is attached to the lower portion of the flexible substrate.

In addition, as the display device is miniaturized, in order to reduce a bezel area, which is an outer portion of an active area (A/A) of a display panel in the display device, a non-active area (N/A) ) to the back side of the display area is being considered. However, during bending of the substrate, large stress is generated in the bending region of the substrate, and as detachment occurs in some regions of the backplate film, there is a problem that the display region cannot be properly supported, and the flexible substrate is bent before bending of the flexible substrate. A process of cutting and removing a portion of the backplate film corresponding to the area was required. In addition, the backplate film had a cloudiness phenomenon during repeated folding of the flexible substrate.

An object of the present invention is to provide a curable composition for inkjet that can directly form a reinforcing part having excellent modulus properties, flexibility and adhesion under a display panel of an organic light emitting display device through direct coating such as inkjet printing.

Another object of the present invention is to provide an organic light emitting display device having excellent durability and lifespan characteristics by including a reinforcing part formed by directly coating the aforementioned curable composition for inkjet.

Another object of the present invention is to provide a method of manufacturing an organic light emitting display device having excellent efficiency, productivity, and cost reduction effects of a module process by directly coating the above-described curable composition to form a reinforcing part.

In order to achieve the above technical problem, the present invention has a viscosity of 10 to 40 cPs and a surface tension of 18 to 40 dyne / cm under 25 ° C., the cured product of the curable composition is measured according to ASTM D3330 at 25 ° C. provides an inkjet curable composition having an adhesive force of 150 gf/inch or more to an adherend, and a Young's modulus of 20 to 500 MPa at 25°C.

In addition, the present invention (a) a flexible substrate; a driving circuit unit disposed on one surface of the flexible substrate; and a display panel including an organic light emitting element part electrically connected to the driving circuit part, and (b) a reinforcement part disposed on the other surface of the flexible substrate and formed by directly coating the curable composition for inkjet. Part provides an organic light emitting display device, wherein the adhesive force to the flexible substrate at 25°C measured according to ASTM D3330 is 150 gf/inch or more, and the Young's modulus at 25°C is 20 to 500 MPa.

In addition, the present invention comprises the steps of forming a flexible substrate on a carrier substrate; forming a driving circuit unit and an organic light emitting device unit on one surface of the flexible substrate, respectively; forming a thin film encapsulation unit on the organic light emitting device unit; laminating a process protective film on the thin film encapsulation unit; separating the carrier substrate; and directly coating the aforementioned curable composition for inkjet on the other surface of the flexible substrate to form a reinforcing part.

The curable composition for inkjet according to the present invention has excellent straightness, uniformity, and precision of the formed pattern, and can minimize the clogging of the inkjet head outlet and the aggregation of the pattern immediately after printing.

In addition, in the curable composition according to the present invention, the cured product has excellent heat resistance, adhesion (adhesion) and modulus properties. Therefore, when the cured product of the curable composition according to the present invention is applied as a reinforcement part under the display panel in the organic light emitting display device, the flexible substrate of the display panel is stably supported and reinforced to improve the durability and lifespan characteristics of the organic light emitting display device. In addition, it is possible to implement flexibility and large-area of the organic light emitting display device.

In addition, since the curable composition according to the present invention can directly form the reinforcing part under the display panel in the organic light emitting display device through a direct coating method such as inkjet printing, the efficiency, productivity, and cost reduction effect of the module process during manufacturing are improved. can be In addition, since the curable composition according to the present invention can be selectively coated only on the part where the reinforcing part is required, a free design can be implemented.

1 is a cross-sectional view schematically illustrating an organic light emitting display device according to the present invention.
2 is a plan view of a state in which the flexible substrate of the organic light emitting diode display according to the present invention is not bent.
FIG. 3 is an enlarged cross-sectional view illustrating a cross section of a square (□) portion indicated by a broken line in FIG. 1 .
4 to 10 are cross-sectional views illustrating each step of manufacturing the organic light emitting display device of the present invention.

Hereinafter, the present invention will be described in detail. However, it is not limited only by the following content, and each component may be variously modified or selectively mixed as needed. Therefore, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

In addition, in this specification, "(meth)acrylate" refers to acrylate or methacrylate, "(meth)acryl" refers to acryl or methacryl, and "(meth)acryloyl" refers to acryloyl or Methacryloyl.

In the present specification, a monomer is distinguished from an oligomer and a polymer, and refers to a compound having a weight average molecular weight of 1,000 or less.

Here, the "polymerizable functional group" is a group involved in the polymerization reaction, for example, may be a (meth)acrylate group.

In the present invention, the glass transition temperature of the A monomer is a theoretical value, and means the glass transition temperature (Tg) of the homopolymer made of the A monomer.

<Curable composition for inkjet>

The curable composition for inkjet according to the present invention (hereinafter, 'curable composition') is a composition that undergoes photopolymerization by ultraviolet (UV) irradiation, and forms a reinforcing layer capable of supporting and reinforcing the flexible substrate of the display panel in the organic light emitting display device. can do.

However, in the present invention, the curable composition is directly coated on a flexible substrate (eg, polyimide substrate) through a direct coating method such as inkjet printing (specifically, a non-contact direct coating method), as well as selectively coating only a necessary area. , while controlling the viscosity (25° C.) of the curable composition in the range of about 10 to 40 cPs, the surface tension is controlled in the range of about 18 to 40 dyne/cm. If the surface tension of the curable composition is less than about 18 dyne / cm or the viscosity of the curable composition is less than about 10 cPs, the curable composition may have poor straightness when counting or ejecting from the nozzle of the inkjet printing machine. . On the other hand, when the viscosity of the curable composition is greater than about 40 cPs or the surface tension is greater than about 40 dyne/cm, it may not be smoothly discharged from the nozzle.

The cured product of this curable composition has an adhesive force of at least about 150 gf/inch to an adherend (eg, a polyimide substrate) at 25° C. measured according to ASTM 3330, and a Young’s modulus of about 20 to 500 MPa at 25° C. has

In addition, the cured product of the curable composition may have a Young's modulus of 20 to 800 MPa measured at about 25° C. after standing for about 24 hours under conditions of about 85° C. and about 85%.

A cured product of such a curable composition may satisfy Relational Equation 1 below. Using such a curable composition, a reinforcing part having excellent high-temperature durability and lifespan characteristics may be formed on a display device through direct coating.

[Relational Expression 1]

(In the above formula,

M ₁ is the Young's modulus of the cured product measured at about 25 ℃,

M ₂ is the Young's modulus of the cured product measured at about 25° C. after standing for about 24 hours under conditions of about 85° C. and about 85%).

In addition, the cured product of the curable composition may have a surface hardness in the range of about 2 to 20 MPa. As described above, the cured product of the curable composition has excellent impact resistance.

In addition, the cured product of the curable composition may have a thermal decomposition temperature of 3 wt% loss measured by thermogravimetric analysis (TGA) of about 180° C. or higher. The cured product of the curable composition may form a reinforcing part having excellent heat resistance by directly coating the display device.

Accordingly, the curable composition according to the present invention has excellent straightness, uniformity, and precision of the formed pattern, and can minimize inkjet head outlet clogging and pattern aggregation immediately after printing. In addition, the curable composition of the present invention can be easily cured even by a small amount of ultraviolet irradiation. In addition, since the curable composition of the present invention can be selectively coated directly on the base substrate of the display device only in the required region according to the folded region and the non-folded region to form a reinforcing part, unlike the conventional lower protective film, a process of cutting the film, etc. This is not necessary, and thus the manufacturing process of the display device can be simplified. In addition, since the curable composition according to the present invention has excellent impact resistance, bendability, and elasticity, a flexible display device having a large area can be manufactured. In addition, since the curable composition according to the present invention can selectively coat only necessary parts according to various folded and non-folded regions of the display device, it is possible to reduce manufacturing process costs and form reinforcement parts having various designs. have.

According to one example, the curable composition of the present invention may include an oligomer containing at least one selected from the group consisting of a urethane (meth)acrylate oligomer and an epoxy (meth)arrylate oligomer; a reactive monomer containing at least one selected from the group consisting of a monofunctional (meth)acrylate monomer, a bifunctional (meth)acrylate monomer, and a polyfunctional (meth)acrylate monomer; and a photopolymerization initiator. Also, optionally, the oligomer may further contain a phosphate (meth)acrylate oligomer.

Hereinafter, the composition of the curable composition will be described in detail.

(a) oligomers

In the curable composition of the present invention, the reactive oligomer is a main component that forms a coating film after photopolymerization, and forms a crosslinked structure with the reactive monomer to control the modulus properties, flexibility, adhesiveness, etc. of the cured product.

These oligomers may contain at least one selected from the group consisting of urethane (meth)acrylate oligomers and epoxy (meth)arrylate oligomers. Optionally, it may further contain a phosphate (meth)acrylate oligomer.

According to one example, the oligomer may contain a urethane (meth)acrylate oligomer or an epoxy (meth)arrylate oligomer.

According to another example, the oligomer may contain a urethane (meth)acrylate oligomer and a phosphate (meth)acrylate oligomer.

The urethane (meth)acrylate oligomer is a (meth)acrylate oligomer having an intramolecular urethane bond, and may be used without particular limitation as long as it is known in the art. reaction products of, for example, aliphatic or aromatic diisocyanates with hydroxy (meth)acrylate monomers; a reaction product of a hydroxyl-terminated polyurethane and acrylic acid or methacrylic acid; Or it may be a reaction product of an isocyanate group-terminated preliminary polyurethane and hydroxyalkyl (meth)acrylate. Further, it may be a reaction product obtained by esterifying a polyurethane oligomer obtained by reaction of a polyol such as polybutadienediol, polyether polyol, polyester polyol, and polycarbonate diol with polyisocyanate with (meth)acrylic acid.

Examples of the aliphatic or aromatic diisocyanate include 1,4-butylene diisocyanate, 1,6-hexamethylene diisocyanate, cyclopentylene-1,3-diisocyanate, 4,4'-dicyclohexylmethane diisocyanate, iso Phorone diisocyanate, cyclohexene-1,4-diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-methylenebis (phenyl isocyanate), 2,2-diphenylpropane- 4,4'-diisocyanate, p-phenylenediisocyanate, m-phenylenediisocyanate, xylenediisocyanate, 1,4-naphthylenediisocyanate, 1,5-naphthylenediisocyanate, 4,4'-diphenyldi isocyanate, azobenzene-4,4'-diisocyanate, m- or p-tetramethylxylenediisocyanate, 1-chlorobenzene-2,4-diisocyanate, and the like. These may be used alone or in combination of two or more.

In addition, the hydroxy (meth) acrylate monomer is not limited as long as it is generally known in the art, for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate , 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, such as hydroxy (C ₁ ~C ₁₂ ) alkyl (meth) acrylate ; _{There are hydroxy (C 2} ~ C ₁₂ ) alkylene glycol (meth) acrylate, such as 2-hydroxyethylene glycol (meth) acrylate and 2-hydroxypropylene glycol (meth) acrylate, but is not limited thereto. . These may be used alone or in combination of two or more.

The urethane (meth)acrylate oligomer has at least 2 to 4 functional groups with a polymerizable functional group together with an intramolecular urethane bond (-NH-COO-). Accordingly, the urethane (meth)acrylate oligomer may have a viscosity of about 1,000 to 70,000 cPs at about 25° C., and specifically about 1,000 to 40,000 cPs. Here, the polymerizable functional group refers to a group involved in a polymerization reaction, such as a (meth)acrylate group.

In addition, the urethane (meth)acrylate oligomer may have a weight average molecular weight (Mw) of 1,100 to 30,000 g/mol. When manufacturing a cured product within the aforementioned viscosity and molecular weight range, it has excellent processability and excellent physical properties such as heat resistance and moisture resistance.

The epoxy (meth)acrylate oligomer usable in the present invention is a (meth)acrylate oligomer containing an epoxy group in the molecule, for example, a novolak type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a bisphenol S type. and an oligomer obtained by reacting (meth)acrylic acid with an epoxy resin such as an epoxy resin.

According to one example, the epoxy (meth) acrylate oligomer is a novolac epoxy (meth) acrylate oligomer, specifically, a group consisting of a phenol novolac epoxy (meth) acrylate oligomer and a cresol novolak type epoxy (meth) acrylate oligomer It may be one or more selected from.

Such an epoxy (meth)acrylate oligomer may have a viscosity at about 25° C. of about 1,000 to 70,000 cPs, and specifically about 1,000 to 40,000 cPs.

In addition, the epoxy (meth) acrylate oligomer is an oligomer having two or more (specifically, 2 to 4) functional groups of a polymerizable functional group together with an epoxy group in a molecule, and a weight average molecular weight (Mw) is about 1,000 to 50,000 g/mol. Here, the polymerizable functional group refers to a group involved in a polymerization reaction, such as a (meth)acrylate group.

The phosphate (meth)acrylate oligomer usable in the present invention is an oligomer containing a phosphate group and an acrylate group in a molecule, and is not particularly limited as long as it is known in the art. For example, a polymerization reaction product between an acrylic resin and phosphoric acid or , a polymerization reaction product of a phosphate group-containing (meth)acrylate monomer, and the like. For example, the phosphate (meth)acrylate oligomer is an oligomer of phosphate methacrylate.

The phosphate (meth)acrylate oligomer may have a weight average molecular weight (Mw) of about 500 to 2,000 g/mol, and a viscosity (about 25° C.) of about 500 to 3,500 cPs.

In addition, the acid value (acid value) of the phosphate (meth) acrylate oligomer may be about 200 to 400 mgKOH / g.

In the curable composition according to the present invention, the content of the oligomer may be about 3 to 20 wt% based on the total amount of the photoreactive materials (ie, the oligomer and the reactive monomer) combined. That is, the ratio (mixing ratio) of the reactive monomer and the oligomer may be 80:20 to 97:3 by weight. When the content of the oligomer falls within the above range, the adhesion of the cured product may be improved by appropriately adjusting the curing density, and physical properties such as impact resistance, bendability, and heat resistance may be improved.

Here, when the oligomer is a urethane (meth)acrylate oligomer, the content of the urethane (meth)acrylate oligomer is about 3 to 20% by weight based on the total amount of the total photoreactive material (ie, reactive monomer and oligomer). can

In addition, when the oligomer is an epoxy (meth)acrylate oligomer, the content of the epoxy (meth)acrylate oligomer is about 3 to 10% by weight based on the total amount of the total photoreactive material (ie, reactive monomer and oligomer). can

In addition, the oligomer is at least one selected from the group consisting of urethane (meth) acrylate oligomer and epoxy (meth) acrylate oligomer; And when it contains a phosphate (meth)acrylate oligomer, the content of the phosphate (meth)acrylate oligomer is about 0.1 to 5% by weight based on the total amount of the total photoreactive material (ie, reactive monomer and oligomer). and the content of the urethane (meth)acrylate oligomer and/or the epoxy (meth)acrylate oligomer is about 3 to 20 wt% based on the total amount of the total photoreactive material (ie, the reactive monomer and the oligomer).

(b) photoreactive monomers

In the composition of the present invention, the photoreactive monomer is a main component for forming a coating film after photopolymerization, and is a monofunctional (meth) acrylate monomer, a bifunctional (meth) acrylate monomer and a polyfunctional (meth) acrylate monomer. It contains at least one selected from the group consisting of.

According to an example, the photoreactive monomer contains a monofunctional (meth)acrylate monomer, a bifunctional (meth)acrylate monomer, and a polyfunctional (meth)acrylate monomer.

The monofunctional (meth)acrylate monomer is a (meth)acrylate monomer having one polymerizable functional group that is an unsaturated group capable of polymerization. Here, the polymerizable functional group refers to a group involved in a polymerization reaction, such as a (meth)acrylate group.

Monofunctional (meth)acrylate monomers usable in the present invention include C ₁ to C ₃₀ alkyl (meth) acrylate monomers, C ₃ to C ₃₀ alicyclic (meth) acrylate monomers, and 5 to 30 nuclear atoms. heteroalicyclic (meth)acrylate monomers, C ₆ to C ₃₀ aromatic (meth) acrylate monomers, heteroaromatic (meth) acrylate monomers having 5 to 30 nuclear atoms, epoxy mono (meth) acrylates, hydroxyl groups -containing monofunctional (meth)acrylate, alkoxy group-containing monofunctional (meth)acrylate, and the like, and these may be used alone or in combination of two or more. Here, the heteroalicyclic (meth)acrylate monomer and the heteroaromatic (meth)acrylate monomer may contain one or more heteroatoms selected from nitrogen, sulfur, and oxygen.

According to an example, the monofunctional (meth)acrylate monomer is a C ₁ to C ₃₀ alkyl (meth) acrylate monomer, C ₃ to C ₃₀ alicyclic (meth) acrylate monomer, and 5 to 30 nuclear atoms. It may contain two or more selected from the group consisting of heteroalicyclic (meth)acrylate monomers. Optionally, the monofunctional (meth)acrylate monomer may further contain an epoxy mono(meth)acrylate.

Specific examples of the monofunctional (meth)acrylate monomer usable in the present invention include ethyl (meth)acrylate, n-butyl (meth)acrylate, sec-butyl (meth)acrylate, isobutyl acrylate, isopropyl acrylic rate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 2-methoxyethyl acrylate, 2-ethylbutyl (meth)acrylate, nonyl (meth)acrylate [nonyl (meth)acrylate] , n-octyl (meth)acrylate, lauryl (meth)acrylate, decyl (meth)acrylate [decyl (meth)acrylate], tetradecyl (meth)acrylate [tetradecyl (meth)acrylate] ) acrylate], tridecyl acrylate, isodecyl (meth) acrylate, stearyl acrylate (stearyl acrylate), such as C ₁ ~ C ₃₀ alkyl (meth) acrylate monomers; isobornyl (meth)acrylate, cyclohexyl (meth)acrylate, cyclopentyl (meth)acrylate, adamantyl (meth)acrylate, 3,5 _{-C 3} ~ C ₃₀ alicyclic (meth) acrylate monomers such as dimethyl adamantyl (meth) acrylate and 4-t-butylcyclohexyl (meth) acrylate; Nuclei such as tetrahydrofurfuryl (meth)acrylate, Cyclic trimethylolpropane formal (meth)acrylate, Acryloyl morpholine, etc. A heteroalicyclic (meth)acrylate monomer having 5 to 30 atoms; phenyl epoxy acrylate, glycidyl (meth) acrylate, methyl glycidyl (meth) acrylate, 3,4-epoxy cyclohexyl methyl (meth) acrylate, allyl glycidyl ether, etc. epoxy mono(meth)acrylate; aromatic mono(meth)acrylates such as phenol (EO) acrylate (PHEA), phenol (EO) 2 acrylate (PHEA-2), and phenol (EO) 4 acrylate (PHEA-4); caprolactone acrylate, 2-phenoxyethyl acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth)acrylate, hydroxyethyl (meth)acrylamide, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, hydroxy Ethyl (meth)acrylamide, 2-(2-vinyloxyethoxy)ethyl (meth)acrylate, methoxyethylene glycol modified (meth)acrylate, ethoxyethylene glycol modified (meth)acrylate, propoxyethylene glycol There are modified (meth)acrylate, methoxypropylene glycol modified (meth)acrylate, ethoxypropylene glycol modified (meth)acrylate, propoxypropylene glycol modified (meth)acrylate, and the like, but is not limited thereto. These may be used alone or two or more of them may be used in combination.

The monofunctional (meth)acrylate monomer may have a molecular weight of about 100 to 450 g/mol, and a glass transition temperature (Tg) in the range of about -80 to 150°C.

According to one example, the monofunctional (meth) acrylate monomer is a first monofunctional (meth) acrylate monomer having a glass transition temperature of about -80 to -5 ℃; and a second monofunctional (meth)acrylate monomer having a glass transition temperature of greater than about −5° C. to about 150° C. or less. As such, when the monofunctional (meth)acrylate monomers are mixed with two types of monomers having different glass transition temperatures, properties such as modulus properties and heat resistance can be improved. In this case, the ratio (mixing ratio) of the first monofunctional (meth) acrylate monomer and the second monofunctional (meth) acrylate monomer may be 1: 0.3 to 6 by weight.

According to another example, the monofunctional (meth) acrylate monomer is a first monofunctional (meth) acrylate monomer having a glass transition temperature of about -80 to -5 ℃; and a second monofunctional (meth)acrylate monomer having a glass transition temperature of greater than about −5° C. to about 150° C. or less; and an epoxy mono (meth) acrylate monomer. As such, when the monofunctional (meth)acrylate monomer contains an epoxy mono(meth)acrylate monomer together with two types of monomers having different glass transition temperatures, high heat resistance and mechanical properties can be realized. In this case, the ratio (mixing ratio) of the first monofunctional (meth) acrylate monomer and the second monofunctional (meth) acrylate monomer may be 1: 0.3 to 6 weight ratio, and the epoxy mono (meth) The content of the acrylate monomer may be about 5 to 15% by weight based on the total amount of the monofunctional (meth)acrylate monomer.

In the curable composition of the present invention, the bifunctional (meth)acrylate monomer is a (meth)acrylate monomer containing two polymerizable functional groups (eg, (meth)acrylate groups) that are unsaturated groups capable of polymerization.

_{Examples of the bifunctional (meth)acrylate monomer include: C 2} to C ₃₀ alkylene glycol di(meth)acrylate monomer having an (meth)acrylate group and an alkylene structure in the molecule; There are ethoxylate di(meth)acrylate monomers having an ethylene oxide group in the molecule and having a (meth)acrylate group at the terminal by ethoxylation, but is not limited thereto. These may be used alone or two or more of them may be used in combination.

Specifically, 1,6-hexanediol diacrylate (HDDA), 1,6-hexanediol dimethacrylate (HDDMA), tripropylene glycol diacrylate (TPGDA), dipropylene glycol diacrylate (DPGDA), Polyethylene glycol 200 dimethacrylate (PEG200DMA), polyethylene glycol 300 diacrylate (PEG300DA), polyethylene glycol diacrylate (PEGDA), glycerin diacrylate, diethylene glycol diacrylate Alkylene glycol di(s) such as derate (DEGDA), triethylene glycol dimethacrylate (TEGDMA), tetraethylene glycol diacrylate (TTEGDA), hydroxypivalate neopentyl glycol diacrylate (HPNDA), etc. meth)acrylate monomers; There are ethoxylated di(meth)acrylate monomers such as ethoxylated polypropylene glycol di(meth)acrylate and ethoxylated bisphenol A glycol dimethacrylate (Bis-EMA). not limited According to an example, the bifunctional (meth)acrylate monomer is an alkylene glycol di(meth)acrylate monomer, more specifically 1,6-hexanediol diacrylate (HDDA), 1,6-hexanediol dimethacrylic rate (HDDMA), tripropylene glycol diacrylate (TPGDA), tripropylene glycol dimethacrylate, dipropylene glycol diacrylate (DPGDA), and dipropylene glycol dimethacrylate may be at least one selected from the group consisting of have.

The molecular weight of the bifunctional (meth)acrylate monomer is about 200 to 750 g/mol, and the glass transition temperature (Tg) may be in the range of about -45 to 110 °C.

In the curable composition of the present invention, the polyfunctional (meth)acrylate monomer has 3 or more (eg, 3 to 6, specifically 3 or 4) polymerizable functional groups that are unsaturated groups capable of polymerization (meth) It is an acrylate monomer. Such a polyfunctional (meth)acrylate monomer can improve the adhesion of the coating film while improving the flowability, leveling property and workability of the composition. Here, the "polymerizable functional group" refers to a group involved in a polymerization reaction, such as a (meth)acrylate group.

Non-limiting examples of such polyfunctional (meth)acrylate monomers include trimethylolpropane tri(meth)acrylate, ethoxylated glycerin tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, trimethylolpropane trifunctional (meth)acrylate monomers such as tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, and pentaerythritol tri(meth)acrylate; tetrafunctional (meth) such as pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, ditrimethylolpropane tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, etc. acrylate monomers; There are dipentaerythritol polyacrylate and the like, and these may be used alone or in combination of two or more. As an example, the polyfunctional (meth)acrylate monomer may be trimethylolpropane tri(meth)acrylate.

The molecular weight of this trifunctional (meth)acrylate monomer is about 250 to 700 g/mol, and the glass transition temperature (Tg) may be in the range of about -10 to 280 °C. In addition, the molecular weight of the tetrafunctional (meth)acrylate monomer is about 300 to 700 g/mol, and the glass transition temperature (Tg) may be in the range of about 0 to 300 ℃.

In the reactive monomer, the proportion of monofunctional (meth) Difunctional (meth) acrylate monomers and polyfunctional (meth) the total amount of acrylate monomer on the content of the acrylate monomer (W ₁₎ (W ₂ + W ₃₎ [(W ₂ +W ₃ )/W ₁ ] may range from about 0.1 to 0.25. If the weight ratio between the above-mentioned monomers is less than about 0.1, heat resistance and modulus are low, while when the weight ratio between the monomers is more than about 0.25, adhesive strength and rigid properties are low and small warpage Also, the reinforcing part may be peeled off from the flexible substrate or cracks may occur.

In the curable composition according to the present invention, the content of the reactive monomer may be about 80 to 97 wt% based on the total weight of the oligomer and the reactive monomer, as described above. When the content of the reactive monomer falls within the above range, the adhesion of the cured product may be improved by appropriately adjusting the curing density, and physical properties such as impact resistance and bendability may be improved.

If the reactive monomer includes a monofunctional (meth) acrylate monomer, a bifunctional (meth) acrylate monomer, and a polyfunctional (meth) acrylate monomer, a monofunctional (meth) acrylate monomer, a bifunctional ( The ratio (mixing ratio) of the meth)acrylate monomer and the polyfunctional (meth)acrylate monomer may be 6-18: 1-5: 1 by weight.

(c) photopolymerization initiator

In the curable composition according to the present invention, the photopolymerization initiator is a component that is excited by ultraviolet rays or the like to initiate photopolymerization, and a conventional photopolymerization initiator in the art may be used without limitation.

Non-limiting examples of the photopolymerization initiator usable in the present invention include 2,4,6-trimethylbenzoyldiphenyl phosphine oxide (TPO), Ethyl phenyl(2,4,6-trimethylbenzoyl)phosphinate (TPO-L), 2,2-Dimethoxy- 2-phenylacetophenone (DMPA), Irgacure 184, Irgacure 127, Irgacure 369, Irgacure 651, Irgacure 819, Irgacure 907, Benzionalkylether, Benzophenone, Benzyl dimethyl BDK, Benzyl dimethyl BDK Cyclohexylphenylacetone (Hydroxycyclohexyl phenylacetone), chloroacetophenone (Chloroacetophenone), 1,1-dichloro acetophenone (1,1-Dichloro acetophenone), diethoxy acetophenone (Diethoxy acetophenone), hydroxyacetophenone (Hydroxy Acetophenone), 2-chlorothioxanthone (2-Choro thioxanthone), 2-ETAQ (2-EthylAnthraquinone), 1-hydroxy-cyclohexyl-phenyl-ketone (1-Hydroxy-cyclohexyl-phenyl-ketone), 2-Hydroxy-2-methyl-1-phenyl-1-propanone (2-Hydroxy-2-methyl-1-phenyl-1-propanone), 2-hydroxy-1-[4- (2-hydroxyl) Ethoxy)phenyl]-2-methyl-1-propanone (2-Hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone), methylbenzoylformate, etc. These may be used alone or in combination of two or more.

The maximum absorption wavelength of the photopolymerization initiator is not particularly limited as long as it can absorb ultraviolet rays, and may be, for example, in the range of about 200 to 450 nm.

The content of the photopolymerization initiator may be about 0.1 to 10 parts by weight based on 100 parts by weight of the total amount of the oligomer and the photoreactive monomer. When the content of the photopolymerization initiator falls within the above-described range, hardness, adhesion, and the like of the cured product may be improved.

(d) additives

The curable composition of the present invention is an antistatic agent, hydrolysis inhibitor, silane-based compound, UV stabilizer, UV absorber, antioxidant, dispersant, antifoaming agent, as long as it does not affect the physical properties of the composition, in addition to the above-described oligomer, photoreactive monomer and photopolymerization initiator , a thickener, a plasticizer, a tackifying resin, and an additive such as a polymerization inhibitor may be further included.

According to one example, the additive may include at least one selected from the group consisting of an antistatic agent, a hydrolysis inhibitor, and a silane-based compound.

These additives may be used in a content range conventionally used in the art, for example, about 0.001 to 10 wt%, specifically about 0.01 to 5 wt%, more specifically about 0.1 to 5 wt%, based on the total amount of the composition can be

The antistatic agent usable in the present invention can be used without limitation as long as it is a material capable of preventing static electricity in the art. For example, metal cations (eg, alkali metal cations, alkaline earth cations, specifically lithium (Li) cations) and anions (eg, bis(trifluoromethanesulfonyl)imide, tetrafluoroborate, hexafluorophosphate, bis(pentafluoroethanesulfonyl)imide, perfluorobutanesulfonate, heptafluorophosphate, (trifluoromethanesulfonyl)trifluoroacetamide, etc.]. In addition, examples of the antistatic agent include alkylammonium acetates, alkyldimethylbenzylammonium salts, alkyltrimethylammonium salts, dialkyldimethylammonium salts, dodecyltrimethylammonium chloride, cetrimonium ammonium chloride, octadecyltrimethylammonium chloride, alkylpyridinium cationic surfactants such as salts, oxyalkylenealkylamines, and polyoxyalkylenealkylamines; Fatty acid soda soaps (eg sodium stearate soap, etc.), alkyl sulfates (eg sodium lauryl sulfate, etc.), alkyl ether sulfates, sodium alkylbenzenesulfonates, sodium alkylnaphthalenesulfonates, dialkylsulfosuccinates, alkyl anionic surfactants such as phosphates and alkyldiphenyletherdisulfonates; amphoteric surfactants such as alkylcarboxybetaines; Fatty acid alkylolamide, di(2-hydroxyethyl)alkylamine, polyoxyethylenealkylamine, fatty acid glycerin ester, polyoxyethylene glycol fatty acid ester, sorbitan fatty acid ester, polyoxysorbitan fatty acid ester, polyoxyethylenealkylphenyl Ether, polyoxyethylene alkyl ether, polyethylene glycol, polyoxyethylene diamine, copolymer composed of polyether, polyester and polyamide, conductive polymer such as PEDOT:PSS [poly(3,4-ethylenedioxythiophene) polystyrene sulfonate], and nonionic surfactants such as oxypolyethylene glycol (meth) acrylate, and these may be used alone or in combination of two or more. According to one example, the antistatic agent may be lithium bis (trifluoromethylsulfonyl) imide [Lithium bis (trifluoromethylsulfonyl) imide].

The content of the antistatic agent may be about 0.01 to 5 parts by weight, specifically about 0.1 to 5 parts by weight, based on 100 parts by weight, which is the total amount of the oligomer and the photoreactive monomer.

The hydrolysis inhibitor that can be used in the present invention is a component that imparts hydrolysis resistance of the cured product, and is not particularly limited as long as it is generally known in the art. For example, a carbodiimide-based compound, an epoxy compound, an isocyanate-based compound. compounds, oxazoline-based compounds, and the like. According to one example, the hydrolysis inhibitor may be a carbodiimide-based compound.

A carbodiimide-based compound is a compound containing a carbodiimide group (-N=C=N-) in a molecule, and includes an aliphatic carbodiimide compound, an alicyclic carbodiimide compound, and an aromatic carbodiimide compound. In this case, an aromatic carbodiimide-based compound is preferable in consideration of the hydrolysis resistance of the cured product and the dispersibility of the oligomer and the monomer in the composition.

Examples of the aromatic carbodiimide compound include bis(2,6-dimethylphenyl)carbodiimide, bis(2,6-diisopropylphenyl)carboimide, bis(2,6-dit-butylphenyl)carboy bis(diC1-10 alkylphenyl)carboimide such as mide; diarylcarbodiimides such as diphenylcarbodiimide; bis(triC1-10 alkylphenyl)carboimide such as bis(2,4,6-triisopropylphenyl)carboimide, and the like, but is not limited thereto. These can be used individually or in combination of 2 or more types.

The content of the hydrolysis inhibitor may be about 0.01 to 5 parts by weight, specifically about 0.1 to 5 parts by weight, based on 100 parts by weight, which is the total amount of the oligomer and the photoreactive monomer.

The silane-based compound (silane-based coupling agent) usable in the present invention is not particularly limited as long as it is known in the art, for example, 3-(glycidyloxy)propyltrimethoxysilane, 3-(glycidyloxy)propyltri Epoxy such as ethoxysilane, 2-(3,4-epoxycyclohexyl)ethyl trimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyl triethoxysilane, epoxypropoxypropyl trimethoxysilane, etc. silane coupling agents; amino-based silane coupling agents such as 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane and N-2-(aminoethyl)-3-aminopropyltrimethoxysilane; and a vinyl-based silane coupling agent such as 3-methacryloxypropyl trimethoxysilane. According to one example, the silane-based compound may be an epoxy-based silane coupling agent.

The content of the silane-based compound may be about 0.01 to 5 parts by weight, specifically about 0.1 to 5 parts by weight, based on 100 parts by weight, which is the total amount of the oligomer and the photoreactive monomer.

The curable composition according to the present invention may be applied to an organic light emitting display device through various coating methods known in the art.

Examples of coating methods usable in the present invention include inkjet printing, screen printing, transfer printing, spin coating, spray coating, dip coating, flow coating, doctor blade (doctor blade), dispensing (dispensing), flexographic printing (flexographic printing), gravure printing (gravure printing), offset printing (offset printing), gravure-offset printing, pad (pad) printing and the like.

However, in the present invention, the above-described curable composition is directly coated on the flexible substrate for a display panel, but in order to coat only the required region according to the bending region and the non-bending region of the flexible substrate, a non-contact direct coating method such as inkjet printing Through this, it is possible to directly form a layer (hereinafter, 'reinforcing part') capable of supporting and reinforcing the substrate on the flexible substrate. In particular, inkjet printing can spray the curable composition at a desired position according to a computer-designed pattern, and at this time, since pressure is not applied to the flexible substrate, it is preferable to prevent damage to the flexible substrate.

<Display device and manufacturing method thereof>

1 is a cross-sectional view schematically showing an organic light emitting display device according to the present invention, FIG. 2 is a plan view of the organic light emitting display device according to the present invention in a state in which the flexible substrate is not bent, and FIG. It is a cross-sectional view showing an enlarged cross section of the square (□) part.

1 to 3 , the organic light emitting diode display 10 of the present invention includes a flexible substrate 110 , a driving circuit unit 130 disposed on one surface of the flexible substrate 110 , and an organic light emitting device. a display panel 100 including a unit 130; and a reinforcing part 200 sequentially disposed on the other surface of the flexible substrate 110 of the display panel 100 . In this case, the reinforcing part 200 is formed by directly coating the above-described curable composition for inkjet, and has an adhesive force of about 150 gf/inch or more to the flexible substrate at about 25° C. measured according to ASTM D3330, and about 25° C. The Young's modulus at is about 20 to 500 MPa. Accordingly, since the reinforcing part 200 has high modulus characteristics and excellent flexibility and adhesiveness, it is possible to stably support and reinforce the flexible substrate 110 of the display panel 100 . Accordingly, in the organic light emitting display device 10 of the present invention, the efficiency, productivity, and cost reduction effect of the module process during manufacturing may be improved, and durability and lifespan characteristics may be improved.

Hereinafter, each configuration of the organic light emitting display device according to the present invention will be described with reference to FIGS. 1 to 3 .

(1) Display panel

The display panel 100 is a portion that displays an image, and is an active area (A) in which pixels that actually emit light through the driving circuit unit 130 and the organic light emitting device 140 are disposed on the flexible substrate 110 . /A) and a non-active area (N/A) surrounding an edge of the display area A/A (refer to FIG. 2 ). At this time, FIG. 2 is a plan view of a state in which the flexible substrate 110 of the organic light emitting diode display 10 according to the present invention is not bent.

The flexible substrate 110 supports and protects components of the organic light emitting display device 100 disposed thereon, and as shown in FIG. 1 , includes a first region P1; a bending region BP extending from one side of the first region P1; and a second region P2 extending from one side of the bending region B, wherein the second region P2 of the flexible substrate 110 faces at least a portion of the first region P1.

The first area P1 is disposed in the display area A/A including pixels that actually emit light through the organic light emitting device 140 , and the bending area BP and the second area P2 are It is disposed in the non-display area N/A.

The non-display area N/A of the flexible substrate 110 is a portion where wirings and driving circuits for driving a screen are disposed, and the wirings and driving circuits are formed on the substrate 110 as a gate in panel (GIP). It may be disposed or may be connected to the substrate 110 in a Tape Carrier Package (TCP) or Chip on Film (COF) method. Since the non-display area N/A of the flexible substrate 110 is not an area on which an image is displayed, it is not necessary to be visually recognized from the upper surface of the flexible substrate 110 . Accordingly, in the present invention, a portion of the non-display area N/A of the flexible substrate 110 is bent to secure an area for wiring and a driving circuit while reducing the bezel area. Accordingly, as shown in FIG. 1 , a portion of the first region P1 and the second region P2 of the flexible substrate 110 are disposed to face each other, and at this time, the reinforcement disposed in each region P1 and P2 The parts 200 are attached to each other.

The wiring 120 formed in the non-display area N/A may transmit a signal by connecting a driving circuit, a gate driver, a data driver, or the like. Also, the wiring may be formed in the display area A/A. The wiring may be formed of a conductive material such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), or nickel (Ni).

The flexible substrate 110 usable in the present invention is a plastic substrate in the form of a thin film made of a flexible material having flexible characteristics, and is not particularly limited as long as it is a curved surface and an insulating and heat-resistant polymer substrate. Materials of such a flexible substrate include polyimide (PI), polyethersulfone (PES, polyethersulphone), polyacrylate (PAR, polyacrylate), polyetherimide (PEI, polyetherimide), and polyethylene naphthalate (PEN, polyethyelenen napthalate). , polyethylene terephthalate (PET, polyethyeleneterepthalate), polyphenylene sulfide (PPS), polyallylate, polycarbonate (PC), cellulose triacetate (TAC), cellulose acetate propionate : CAP), poly(aryleneether sulfone), etc., which may be used alone or in combination of two or more. According to one example, the flexible substrate 100 may be a polyimide substrate. In this case, since the polyimide has excellent mechanical strength and excellent heat resistance at a glass transition temperature of about 450° C., even if the manufacturing process of the display device is performed at a high temperature, it can stably serve as a substrate.

A buffer layer (not shown) may be further disposed on the flexible substrate 110 as described above. The buffer layer may include at least one layer selected from among various inorganic layers and organic layers. Such a buffer layer may be omitted.

In the display panel 100 of the present invention, the driving circuit unit 130 is disposed on the flexible substrate 110 . The driving circuit unit 130 includes a plurality of thin film transistors 131 and a power storage device (not shown), and drives the organic light emitting device 140 . That is, the organic light emitting device 140 displays an image by emitting light according to the driving signal received from the driving circuit unit 130 .

In the driving circuit unit 130 , the thin film transistor 131 includes a gate electrode 132 , a source electrode 133 , a drain electrode 134 , and a semiconductor layer 135 , which are electrically connected to each other. In addition, between the gate electrode 132 , the source electrode 133 , and the drain electrode 134 are insulated by the interlayer insulating film 160 , and the gate insulating film 150 is between the gate electrode 132 and the semiconductor layer 135 . insulated by The drain electrode 134 is electrically connected to the first electrode 141 of the organic light emitting device 140 through a contact hole provided in the planarization layer 170 .

For convenience of explanation, only the driving thin film transistor among the thin film transistors is illustrated in FIG. 3 . However, a switching thin film transistor or the like may also be included in the display device. In this case, when a signal is applied from the gate line, the switching thin film transistor transfers the signal from the data line to the gate electrode of the driving thin film transistor. The driving thin film transistor transmits a current transmitted through a power supply line to an anode according to a signal received from the switching thin film transistor, and light emission is controlled by the current transmitted to the anode.

In the display panel 100 of the present invention, the organic light emitting device 140 emits light according to a driving signal transmitted from the driving circuit unit 130 to display an image, and as shown in FIG. 3 , the flexible A first electrode 141 , a light emitting layer 142 , and a second electrode 143 are sequentially stacked on the substrate 110 . In this case, the first electrode 141 is electrically connected to the drain electrode 134 of the thin film transistor 131 through a contact hole.

In the organic light emitting device 140 , the first electrode 141 may be an anode, and the second electrode 143 may be a cathode, and vice versa. For example, when the first electrode 141 is an anode and the second electrode 143 is a cathode, the light generated from the emission layer 142 passes through the second electrode 143 to emit light. In this case, the organic light emitting diode display according to the present invention has a top emission type structure.

The anode is disposed on the substrate, and may be electrically connected to the driving thin film transistor to receive a driving current from the driving thin film transistor. Since the anode is formed of a material having a relatively high work function, holes are injected into an adjacent organic material layer, that is, a hole transport region (eg, a hole injection layer (not shown)).

The material for forming such a positive electrode is not particularly limited, and a conventional one known in the art may be used. For example, metals, such as vanadium, chromium, copper, zinc, and gold|metal; alloys thereof; metal oxides such as zinc oxide, indium oxide, indium tin oxide (ITO), and indium zinc oxide (IZO); combinations of metals and oxides such as ZnO:Al and SnO2:Sb; conductive polymers such as polythiophene, poly(3-methylthiophene), poly[3,4-(ethylene-1,2-dioxy)thiophene](PEDT), polypyrrole, and polyaniline; and carbon black, but is not limited thereto.

A cathode is disposed opposite to the anode, and specifically disposed on the electron transport region. Since the cathode is made of a material having a relatively low work function, electrons are injected into an adjacent organic material layer, that is, an electron transport region (eg, an electron injection layer (not shown)).

The material for forming the negative electrode is not particularly limited, and a conventional one known in the art may be used. For example, metals, such as magnesium, calcium, sodium, potassium, titanium, indium, yttrium, lithium, gadolinium, aluminum, silver (Ag), tin, and lead; alloys thereof; and a multilayer structure material such as LiF/Al or LiO ₂ /Al, but is not limited thereto.

In the organic light emitting device 140 , the light emitting layer 142 is a kind of organic material layer in which excitons are formed by combining holes and electrons respectively injected from the first electrode 141 and the second electrode 143 . The emission color of the organic electroluminescent device may vary depending on the material constituting it. The light emitting layer material is not particularly limited as long as it is a material for forming the light emitting layer known in the art. For example, the light emitting layer 142 is CBP (4,4'-bis(N-carbazolyl)-1,1'-biphenyl, 4,4'-bis(N-carbazolyl)-1,1'-biphenyl) ), PVK (poly(n-vinylcabazole), poly(n-vinylcarbazole)), ADN (9,10-di(naphthalene-2-yl)anthracene, 9,10-di(naphthalen-2-yl)anthracene ) and the like host materials; and phosphorescent or fluorescent dopants such as organometallic complexes including Ir, Pt, Os, Re, Ti, Zr, Hf, or combinations of two or more thereof.

Although not shown in the drawings, a hole transport region, specifically, at least one of a hole injection layer and a hole transport layer may be further disposed between the first electrode 141 and the emission layer 142 . In addition, an electron transport region, specifically, at least one of an electron transport layer and an electron injection layer may be further disposed between the emission layer 142 and the second electrode 143 . Each of the hole injection layer, the hole transport layer, the electron transport layer and the electron injection layer may be formed using a low molecular weight organic material or a high molecular weight organic material commonly known in the art.

A pixel defining layer 180 partitioning each pixel is disposed on the edges of the planarization layer 170 and the first electrode 141 . The pixel defining layer 180 has an opening. The opening of the pixel defining layer 180 exposes a portion of the first electrode 141 . An emission layer 142 and a second electrode 143 are sequentially stacked on the first electrode 141 in the opening of the pixel defining layer 180 . In this case, the second electrode 143 may be formed not only on the emission layer 142 but also on the pixel defining layer 180 . Meanwhile, the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer may also be disposed between the pixel defining layer 180 and the second electrode 143 . The organic light emitting device 140 emits light from the light emitting layer 142 positioned in the opening of the pixel defining layer 180 . Accordingly, the pixel defining layer 180 may define an emission region.

Although not shown in the drawings, a capping layer may be disposed on the second electrode 143 . The capping layer serves to protect the organic light emitting device 140 while helping the light generated from the light emitting layer to be efficiently emitted to the outside. In particular, the capping layer may prevent loss of light from the second electrode through total reflection of light in the top emission type organic light emitting diode. The capping layer is not particularly limited as long as it is a material that typically forms the capping layer in the art.

The display panel 100 of the present invention includes a thin film encapsulation layer 190 disposed on the second electrode 143 .

The thin film encapsulation layer 190 is a layer that protects the organic light emitting device 140 , and may have, for example, a structure in which inorganic layers 191 and 193 and organic layers 192 are alternately stacked. In FIG. 3 , the thin film encapsulation layer 190 includes two inorganic films 191 and 193 and one organic film 192 , but is not limited thereto. The thin film encapsulation layer 190 prevents external air, such as moisture or oxygen, from penetrating into the organic light emitting device 140 .

The inorganic layers 191 and 193 include an inorganic material selected from Al ₂ O ₃ , TiO ₂ , ZrO, SiO ₂ , AlON, AlN, SiON, Si ₃ N4, ZnO, and Ta ₂ O ₅ . The inorganic films 191 and 193 may be formed through a chemical vapor deposition (CVD) method or an atomic layer deposition (ALD) method, but is not limited thereto, and the inorganic films 191 and 193 are not limited thereto. may be formed through various methods known to those skilled in the art. Such an inorganic film can suppress the penetration of moisture and oxygen.

The organic layer 192 is a thin film made of a polymer such as acrylic resin, epoxy resin, polyimide, and polyethylene, and may be formed through various methods known in the art, such as a thermal evaporation process. In addition to suppressing moisture permeation, the organic layer serves as a buffer layer for reducing stress between the inorganic layer 191 and the inorganic layer 193 , and allows the uppermost surface of the thin film encapsulation layer 190 to be flat.

The thin film encapsulation layer 190 may be used instead of the encapsulation substrate serving to encapsulate the organic light emitting device. In this case, the organic light emitting display device may be a flexible display device.

Although not shown in the drawings, an encapsulation substrate may be further disposed on the second electrode 143 . The encapsulation substrate serves to encapsulate the organic light emitting device 140 together with the flexible substrate 110 . Like the flexible substrate 110 , the encapsulation substrate may be a plastic substrate.

(2) Reinforcement

In the organic light emitting display device according to the present invention, the reinforcing part 200 is a part disposed on the other surface of the flexible substrate 110 of the above-described display panel 100 as shown in FIGS. 1 to 3 , and is flexible. The substrate 110 may be supported and reinforced, and moisture or impurities may be prevented from penetrating from the outside.

Specifically, the reinforcing part 200 is a surface opposite to the surface on which the organic light emitting diode 140 is disposed in the first area P1 and the second area P2 of the flexible substrate 110 except for the bending area BP. placed on top In this case, the reinforcing part 200 may be disposed over the entire first area P1 , and may optionally be disposed over the entire second area P2 . That is, the reinforcing part 200 is formed by directly coating the inkjet curable composition on only a desired region according to the folded region and the non-folded region. Except for the bending region BP of the flexible substrate 110 , the remaining region of the first one side of the area P1; and one surface of the first area P1 among surfaces of the second area P2. Accordingly, when the flexible substrate 110 is bent, the reinforcing parts 200 respectively disposed in the first region P1 and/or the second region P2 are attached to face each other.

The reinforcing part 200 is a cured product of the aforementioned curable composition for inkjet, and has an adhesive force to the flexible substrate of about 150 gf/inch or more at about 25° C. measured according to ASTM D3330, and a Young’s modulus at about 25° C. about 20 to 500 MPa. As such, the reinforcing part 200 has a high modulus characteristic, and has excellent flexibility and adhesiveness. For this reason, the reinforcing part 200 offsets the stress generated in the area in contact with the flexible substrate 110 without separation (desorption) from the flexible substrate 110 when the flexible substrate 110 is bent, while the flexible substrate 110 is bent. ) can be stably supported and reinforced. Accordingly, the organic light emitting diode display according to the present invention may have improved durability and lifespan characteristics. In addition, since the reinforcing part 200 is formed by directly coating the aforementioned curable composition for inkjet on a flexible substrate and selectively coating only a partial region, the organic light emitting diode display 10 of the present invention is manufactured The efficiency, productivity and cost savings of the city module process can be improved.

According to an example, the reinforcing part 200 may have a Young's modulus of about 20 to 800 MPa measured at about 25°C after being left for about 24 hours under conditions of about 85°C and about 85%.

According to another example, the reinforcing part 200 may satisfy Relation 1 below.

[Relational Expression 1]

(In the above formula,

M ₁ is the Young's modulus of the reinforcing part measured at about 25 °C,

M ₂ is the Young's modulus of the reinforcing part measured at about 25° C. after standing for about 24 hours under the conditions of about 85° C. and about 85%).

As described above, since the reinforcing part 200 of the present invention has a change in Young's modulus over time of 0.3 or more, the organic light emitting display device of the present invention may have excellent high-temperature durability and lifespan characteristics.

According to another example, the reinforcing part 200 may have a surface hardness in the range of about 2 to 20 MPa. As such, since the reinforcing part 200 has a high surface hardness, it is possible to protect the surface of the flexible substrate 110 from external impact.

According to another example, the reinforcing part 200 has a 3 wt% loss temperature measured by thermogravimetric analysis (TGA) of about 180 ° C. or more, specifically, about 180 to 255 ° C., and has excellent heat resistance. For this reason, the organic light emitting display device of the present invention is excellent in high temperature reliability.

The thickness of the reinforcing part 200 is not particularly limited, and may be, for example, in the range of about 20 to 200 μm. However, it is preferable to adjust the thickness of the reinforcing part in consideration of the thickness of the flexible substrate 110 . According to an example, the ratio (T ₂ /T ₁ ) of the thickness of the reinforcing part (T _{2 ) to the thickness (T 1} ) of the flexible substrate may be in the range of about 1 to 5.

(3) Meanwhile, the spacer 300 may be additionally further included between the reinforcing parts 200 respectively disposed in the first region P1 and the second region P2 opposite to each other. Such spacers 300 may be omitted.

The spacer 300 may fill a space between the reinforcing parts 200 respectively disposed in the first and second regions P1 and P2 facing each other to maintain a constant desired radius of curvature. In addition, the radius of curvature of the bending region BP of the flexible substrate 110 may be easily adjusted by the spacer 300 .

The spacer 300 may be a foam tape made of various materials, but is not limited thereto.

(4) Meanwhile, although not shown in the drawings, the organic light emitting display device of the present invention may include a touch panel and/or a cover window respectively positioned on the display panel 100 .

The touch panel includes a touch sensor and is positioned on the display panel 100 through an optical adhesive layer. The configuration and structure of the touch panel is not particularly limited, and may be a configuration and structure known in the art, and each configuration may be formed of a material known in the art.

In addition, the cover window is attached to the touch panel through an optical adhesive to transmit light emitted from the display panel while protecting the display panel and the touch panel from external impact so that an image displayed on the display panel is visible from the outside. Such a cover window may be made of a conventional material known in the art.

The organic light emitting display device of the present invention described above may be manufactured by various methods. However, in the present invention, the reinforcing part 200 is formed on the surface opposite to the surface of the flexible substrate 110 on which the organic light emitting device is disposed through a direct coating method when manufacturing the organic light emitting display device. In this case, the reinforcing part 200 may be selectively formed only in the remaining regions P1 and P2 except for the bending region BP of the flexible substrate 110 . For this reason, unlike the conventional lower reinforcement film made of an adhesive layer and a PET film, there is no need to remove the portion of the reinforcement portion 200 corresponding to the bending region BP of the flexible substrate 110 . Accordingly, in the method of manufacturing an organic light emitting display device according to the present invention, efficiency can be improved by simplifying the module process of the display device, productivity can be improved by shortening the process time, and manufacturing cost can be reduced. In addition, the present invention can realize a large area of the organic light emitting display device because the reinforcing portion is formed by selectively coating the flexible substrate directly.

According to an example, a method of manufacturing an organic light emitting display device according to the present invention includes forming a flexible substrate on a carrier substrate; forming a driving circuit unit and an organic light emitting device unit on one surface of the flexible substrate, respectively; forming a thin film encapsulation layer on the organic light emitting device unit; laminating a process protective film on the thin film encapsulation layer; separating the carrier substrate; and directly coating the aforementioned curable composition for inkjet on the other surface of the flexible substrate to form a reinforcing part. However, it is not limited only by the manufacturing method, and the steps of each process may be modified or selectively mixed as needed.

Hereinafter, each step of manufacturing the organic light emitting display device according to the present invention will be described with reference to FIGS. 4 to 10 .

(a) As shown in FIG. 4 , a flexible substrate 110 is formed on a carrier substrate 1 .

According to an example, a polyamic acid solution may be applied to one surface of the carrier substrate and dried to form the polyimide substrate 110 .

In this step, the occurrence of defects due to the flexible characteristics of the flexible substrate 110 during the manufacturing process of the carrier substrate may be minimized. The carrier substrate 1 is not particularly limited as long as it is generally known in the art, and for example, a carrier glass substrate or the like.

The polyamic acid solution usable in the present invention is not particularly limited as long as it is generally known in the art.

(b) Thereafter, the driving circuit unit 130 of the display panel 100 and the organic light emitting device 140 are respectively formed on one surface of the flexible substrate 110 , and then a thin film is encapsulated on the organic light emitting device 140 . A layer is formed (see FIGS. 5 and 6 ).

Specifically, a gate electrode 132 , a source electrode 133 , a drain electrode 134 , and a semiconductor layer 135 on one surface of the flexible substrate 110 through a predetermined thin film transistor (TFT) forming process known in the art. ) to form a plurality of thin film transistors 131 including. In this case, the interlayer insulating layer 160 is formed between the gate electrode 132 , the source electrode 133 , and the drain electrode 134 , and the gate insulating layer 150 is formed between the gate electrode 132 and the semiconductor layer 135 . do. The drain electrode 134 is electrically connected to the first electrode 141 of the organic light emitting device 140 through a contact hole provided in the planarization layer 170 .

Thereafter, a planarization film 170 is formed on the entire surface of the flexible substrate 110 including the driving circuit unit 130 , and then a contact hole is formed in the planarization film 170 , and then the thin film transistor 131 ) A first electrode 131 electrically connected to the drain electrode 134 of Next, a pixel defining layer 180 is formed on the planarization layer 170 . In this case, the pixel defining layer 180 is formed to surround each pixel and overlap the edge of the first electrode 141 when viewed from the top, but is formed in a grid shape having a plurality of openings when viewed as a whole of the display panel. . Thereafter, a light emitting layer 142 is formed on the first electrode 141 . However, the emission layer 142 may be formed on the pixel defining layer 180 as well as the first electrode 141 . In this case, a hole injection layer and/or a hole transport layer may be positioned between the first electrode 141 and the emission layer 142 . Next, the second electrode 143 is formed on the entire surface of the substrate including the emission layer 142 . In this case, the second electrode 143 may be formed only on the emission layer 142 . The inorganic layers 191 and 193 and the organic layer 192 of the thin film encapsulation layer 190 may be sequentially formed on the second electrode 142 .

Meanwhile, although not shown in the drawings, in addition to the above-described driving circuit unit 130 , the organic light emitting device 140 , the planarization layer 170 , the pixel defining layer 180 , and the thin film encapsulation layer 190 , others generally known in the art Other configurations of the display panel may be formed through methods known in the art.

(c) As shown in FIG. 7 , a process film 2 may be attached on the display panel 100 .

The process film 2 is a film for protecting the upper part of the display panel, and is a peelable release protective film.

The process film 2 may be applied without limitation as long as it is a protective film for processes known in the art. For example, polyester films, such as polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate, polyethylene film, polypropylene film, cellophane, diacetyl cellulose film, triacetyl cellulose film, acetyl cellulose butyrate film, polychloride Vinyl film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, polycarbonate film, polymethylpentene film, polysulfone film, polyetheretherketone film, polyethersulfone Films, polyetherimide films, polyimide films, fluororesin films, polyamide films, acrylic resin films, norbornene-based resin films, cycloolefin resin films, and the like.

(d) As shown in FIG. 8 , the carrier substrate 1 is separated and removed.

(e) Thereafter, as shown in FIG. 9(a) , the above-described curable composition for inkjet is applied on the other surface of the flexible substrate 110 of the display panel 100 from which the carrier substrate 1 is removed and photocured. to form the reinforcing part 200 .

In the present invention, the curable composition for inkjet is directly coated on the flexible substrate 110 through a direct coating method such as inkjet printing, and the remaining region excluding the bending region BP of the flexible substrate 110, that is, the first region ( The reinforcing part 200 is formed by photocuring the curable composition by UV irradiation while selectively coating only P1) and the second region P2. Therefore, unlike the prior art, even without a partial cutting process of the film, as shown in FIG. 9( b ), the remaining areas other than the bending area BP of the flexible substrate 110 (that is, the first area P1 and the first area P1 ) The reinforcing part 200 may be easily formed only in the second region P2].

The ultraviolet irradiation may be performed at about 50 to 5,000 mJ for about 1 to 10 seconds. In this case, the curing rate of the curable composition may be about 80% or more.

(f) Thereafter, the flexible substrate 110 is bent so that the reinforcing parts 200 respectively disposed in the first region P1 and the second region P2 of the flexible substrate 110 face each other ( see Fig. 10). In this case, a part of the reinforcement part 200 disposed on the first region P1 and the reinforcement part 200 disposed on the second region P2 are adhered to each other.

Optionally, a spacer 300 may be additionally further disposed between the reinforcing parts 200 respectively disposed in the first region P1 and the second region P2 opposite to each other.

(g) Subsequently, by separating and removing the process film 2 from the bent display panel 100 , the organic light emitting diode display 10 illustrated in FIG. 1 may be obtained.

Hereinafter, the present invention will be described in detail with reference to Examples, but the following Examples and Experimental Examples are merely illustrative of one aspect of the present invention, and the scope of the present invention is not limited by the Examples and Experimental Examples .

<Examples 1 to 7 and Comparative Examples 1 to 4>

Curable compositions for inkjets of Examples 1 to 7 and Comparative Examples 1 to 4 were prepared by mixing each component according to the composition shown in Table 1 below. In Table 1 below, the content unit of the oligomer and the reactive monomer is based on the total content of the oligomer and the reactive monomer in weight %, and the content unit of the photoinitiator and the auxiliary additive is in parts by weight, the total weight of the oligomer and the reactive monomer 100 weight based on wealth. In addition, the specifications of the raw materials constituting each composition described in Table 1 are shown in Table 2 below.

Example comparative example One 2 3 4 5 6 7 One 2 3 4 oligomer A1 15 - 15 - - 10 - - - - - A2 - 15 - - - - 10 - - - 10 A3 2 2 2 - - - - - - - - A4 - - - 5 - - - - 5 - - A5 - - - - 3 - - 13 - 15 - photocurable
monomer B1 a 10 - - - 5 10 15 5 - - 40 b - - 10 5 - 20 - - - - - c - 20 - 40 35 20 7 24 - - - d 50 30 35 10 20 - 18 30 - - - e - 15 - - - 20 - - - - f - 10 - - 9 20 12 - - - 45 g - - - 10 - - 5 - - - - h - 9 - 5 5 7 - 10 85 75 - B2 a 18 7 18 18 14 - - 10 - - - b - - - - - 8 - - 5 - 5 c - - - - - - 8 - - 5 - B3 a 5 7 5 7 9 5 5 8 5 5 - photoinitiator C1 - - - 3 - 3 3 3 3 3 3 C2 2.5 2.5 2.5 - 3 - - - - - - C3 0.5 0.5 0.5 - - - - - - - - auxiliary additive D1 2 2 2 - - - - - - - - D2 0.5 - 0.5 0.5 - - - - - - - D3 - - - 1.0 - - - - - - Viscosity (cPs) 27 25 26 26 28 26 24 43 29 49 27 Surface tension (dyne/cm) 32 30 32 35 33 34 32 37 41 43 36 adhesion
(gf/icnh) 420 500 350 200 150 290 300 60 100 140 550 Modulus
(@ 25℃) 430 240 100 470 500 180 22 580 16 28 4

<Experimental Example 1> - Evaluation of physical properties of the composition

The physical properties of the curable compositions for inkjet prepared in Examples 1 to 7 and Comparative Examples 1 to 4 were respectively measured according to the following measuring methods, and the results are shown in Table 3 below.

1) Viscosity

Viscosity was measured using Brookfield's LVT model under the condition of #62 spindle, 200 rpm.

2) surface tension

The surface tension was measured at 25℃ using the DST-30 model of SEO company in the ring method method.

3) Clogging

After discharging for 1 hour using Dimatix's DMP-2831 model, discharging was stopped for 30 minutes, and then the clogging phenomenon was confirmed by discharging again for 2 hours.

4) Discharge straightness

After discharging for 1 hour using Dimatix's DMP-2831 model, discharging was stopped for 30 minutes, and then discharging straightness was confirmed by performing a discharge test for 2 hours again.

Example comparative example One 2 3 4 5 6 7 One 2 3 4 Viscosity (cPs) 27 25 26 26 28 26 24 43 29 49 27 Surface tension (dyne/cm) 32 30 32 35 33 34 32 37 41 43 36 Clogging
(180 minutes) X X X X X X X O X O O Discharge straightness O O O O O O O O X X O

<Experimental Example 2> - Evaluation of the physical properties of the reinforcing part in the organic light emitting display device

Reinforcing parts in the display device were formed using the inkjet curable compositions of Examples 1 to 7 and Comparative Examples 1 to 4 as follows, and then the physical properties of the reinforcement parts were measured according to the following measurement methods, and the results are shown in the table below. 4 is shown.

Each inkjet curable composition is directly printed on the surface of a polyimide substrate (thickness: 20 μm), which is a flexible substrate of a flexible display panel, using an inkjet printer, and the amount of light is 1,000 from an LED UV lamp (wavelength: 365 nm) in a nitrogen atmosphere. A reinforcing portion (thickness: 50 μm) was formed by photocuring under conditions of mW and 2 seconds. At this time, the reinforcing part was formed by selectively coating the curable composition on only the area other than the bending area on the surface of the polyimide substrate.

1) Adhesion

After coating the composition on a flexible substrate (PI substrate), it is cured under the conditions of about 1,000 mW of light and 2 seconds in an LED UV lamp (wavelength: about 365 nm) in a nitrogen atmosphere, and then the adhesive strength between the cured product and the flexible substrate according to ASTM 3330 method was measured.

2) Young's modulus

① M ₁ Measurement: After coating a photocurable composition to a thickness of 200 μm on a silicone release film, it was cured under conditions of about 1,000 mW of light and 2 seconds in an LED UV lamp (wavelength: 365 nm) in a nitrogen atmosphere. After the cured composition was separated from the silicone release film, a specimen having a size of 0.4 mm × 40 mm was prepared. The Young's modulus of the prepared specimen was measured at 25 °C under a temperature increase condition of about 5 °C/min from about -40 °C to about 200 °C using Model Q800 of TA INSTRUMENTS.

② M ₂ Measurement: After coating a photocurable composition to a thickness of 200 μm on a silicone release film, it was cured under conditions of about 1,000 mW of light and 2 seconds in an LED UV lamp (wavelength: 365 nm) in a nitrogen atmosphere. After the cured composition was separated from the silicone release film, a specimen having a size of 0.4 mm × 40 mm was prepared. After that, the prepared specimen was left in an environment of about 85°C and about 85% for 24 hours, and then, using Model Q800 of TA INSTRUMENTS, from about -40°C to about 200°C, under a temperature rise condition of 5°C/min at 25°C. The Young's modulus was measured.

③ ΔM was calculated using the values of _{Young's modulus M 1} and M ₂ measured according to Equation 1 below.

[Equation 1]

3) Surface hardness

A composition cured under conditions of about 1,000 mW of light and 2 seconds in an LED UV lamp (wavelength: 365nm) in a nitrogen atmosphere was measured under ISO 14577-1 conditions using a nanoindenter manufactured by Micro Materials.

4) TGA

The 3 wt% loss temperature point of the reinforcing part was measured using the TGA 550 (TA instruments) equipment for the composition cured under the conditions of about 1,000 mW of light and 2 seconds in an LED UV lamp (wavelength: 365 nm) in a nitrogen atmosphere.

Example comparative example One 2 3 4 5 6 7 One 2 3 4 adhesion
(gf/inch) 420 500 350 200 150 290 300 60 100 140 550 Young's modulus M ₁ (MPa) 260 120 180 470 320 180 22 580 16 28 4 M ₂ (MPa) 320 330 181 720 360 220 40 880 90 180 30 ΔM 0.81 0.36 0.99 0.76 0.89 0.82 0.55 0.66 0.18 0.16 0.13 Surface hardness (MPa) 7 10 9 17 20 5 4 22 3 5 2 TGA
(3 wt% loss)
(℃) 240 190 198 248 252 185 180 256 176 196 142

10: organic light emitting display device,
100: a display panel, 110: a flexible substrate,
120: circuit wiring, 130: driving circuit unit,
131: thin film transistor, 132: gate electrode;
133: source electrode, 134: drain electrode;
135: semiconductor layer, 140: organic light emitting device,
141: a first electrode, 142: a light emitting layer,
143: a second electrode, 150: a gate insulating film,
160: interlayer insulating film, 170: planarization film,
180: pixel defining layer, 190: thin film encapsulation layer;
191, 193: inorganic film, 192: organic film,
200: reinforcement

Claims (21)

having a viscosity of 10 to 40 cPs under 25° C. and a surface tension of 18 to 40 dyne/cm,
A curable composition for inkjet, wherein the cured product of the curable composition has an adhesive force of 150 gf/inch or more to an adherend at 25°C measured according to ADTM D3330, and a Young's modulus of 20 to 500 MPa at 25°C. According to claim 1,
The cured product of the curable composition satisfies the following relation 1, the curable composition for inkjet:
[Relational Expression 1]

(In the above formula,
M ₁ is the Young's modulus of the cured product measured at 25 ℃,
M ₂ is the Young's modulus of the cured product measured at 25° C. after standing for 24 hours under 85° C. and 85% conditions). According to claim 1,
The curable composition for inkjet, wherein the cured product of the curable composition has a Young's modulus of 20 to 800 MPa measured at 25°C after being left for 24 hours under 85°C and 85% conditions. According to claim 1,
The cured product of the curable composition has a surface hardness in the range of 2 to 20 MPa, the curable composition for inkjet. According to claim 1,
The curable composition for inkjet, wherein the cured product of the curable composition has a thermal decomposition temperature of 3 wt% loss measured by thermogravimetric analysis (TGA) of 180 ° C. or higher. According to claim 1,
The composition may include a reactive monomer containing at least one selected from the group consisting of a monofunctional (meth)acrylate monomer, a bifunctional (meth)acrylate monomer, and a polyfunctional (meth)acrylate monomer;
an oligomer containing at least one selected from the group consisting of urethane (meth)acrylate oligomers and epoxy (meth)arrylate oligomers; and
photopolymerization initiator
A curable composition for inkjet comprising a. 7. The method of claim 6,
The use ratio of the reactive monomer and the oligomer is 80:20 ~ 97:3 weight ratio of the inkjet curable composition. 7. The method of claim 6,
The reactive monomer is a monofunctional (meth) acrylate monomer, a bifunctional (meth) acrylate monomer and a polyfunctional (meth) acrylate monomer, the curable composition for inkjet containing the monomer. 9. The method of claim 8,
The monofunctional (meth) acrylate monomer, the bifunctional (meth) acrylate monomer and the polyfunctional (meth) acrylate monomer are 6 to 18: 1 to 5: 1 to be included in a weight ratio of 1, the inkjet curability composition. 7. The method of claim 6
The monofunctional (meth) acrylate monomer is a first monofunctional (meth) acrylate monomer having a glass transition temperature (Tg) of -80 to -5 ℃; And - a second monofunctional (meth) acrylate monomer having a glass transition temperature of more than 5 ° C. to 150 ° C., the inkjet curable composition. 11. The method of claim 10,
The first monofunctional (meth) acrylate monomer and the second monofunctional (meth) acrylate monomer are included in a weight ratio of 1: 0.3 to 6, the curable composition for inkjet. 11. The method of claim 10,
The monofunctional (meth) acrylate monomer further contains an epoxy mono (meth) acrylate, the inkjet curable composition. 13. The method of claim 12,
The content of the epoxy mono (meth) acrylate is in the range of 5 to 15 wt % based on the total amount of the monofunctional (meth) acrylate monomer, the curable composition for inkjet. 7. The method of claim 6,
The urethane (meth) acrylate oligomer and the epoxy (meth) acrylate oligomer has a viscosity of 1,000 to 70,000 cPs at 25 °C, respectively, a curable composition for inkjet. 15. The method of claim 14,
The urethane (meth) acrylate oligomer has a weight average molecular weight (Mw) of 1,100 to 30,000 g/mol, and an oligomer having 2 to 4 polymerizable functional groups, a curable composition for inkjet. 15. The method of claim 14,
The epoxy (meth)acrylate oligomer has a weight average molecular weight (Mw) of 1,000 to 70,000 g/mol, and an oligomer having 2 to 4 polymerizable functional groups, a curable composition for inkjet. 7. The method of claim 6,
The oligomer further contains a phosphate (meth)acrylate oligomer, the curable composition for inkjet. 18. The method of claim 17,
The content of the phosphate (meth)acrylate oligomer is in the range of 0.1 to 5% by weight based on the total amount of the oligomer and the reactive monomer, the curable composition for inkjet. flexible substrate; a driving circuit unit disposed on one surface of the flexible substrate; and a display panel including an organic light emitting element unit electrically connected to the driving circuit unit; and
A reinforcing part disposed on the other surface of the flexible substrate and formed by directly coating the curable composition according to any one of claims 1 to 18
including,
The reinforcing part has an adhesive force of 150 gf/inch or more to the flexible substrate at 25° C. measured according to ASTM D3330, and a Young’s modulus at 25° C. of 20 to 500 MPa. 20. The method of claim 19,
The flexible substrate may include a first region; a bending region extending from one side of the first region; and a second region extending from one side of the bending region and facing at least a portion of the first region,
The reinforcing part may include one surface of the first region; and one of the surfaces of the second area, which is disposed on the same surface as one surface of the first area. forming a flexible substrate on a carrier substrate;
forming a driving circuit unit and an organic light emitting device unit on one surface of the flexible substrate, respectively;
forming a thin film encapsulation unit on the organic light emitting device unit;
laminating a process protective film on the thin film encapsulation unit;
separating the carrier substrate; and
Forming a reinforcing part by directly coating the curable composition according to any one of claims 1 to 18 on the other surface of the flexible substrate.
A method of manufacturing an organic light emitting display device comprising a.

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