KR20210069331A - Organic light emitting pannel and including organic light emitting display - Google Patents

Abstract

Embodiments of the present invention relate to an organic light emitting display panel and an organic light emitting display device including the same. More specifically, the organic light emitting display panel includes: at least one pad electrode disposed on a first substrate and provided in a pad region; an insulating layer disposed to expose a portion of the upper surface of the pad electrode; a structure disposed on the insulating layer and disposed to surround the pad region; an active region and an organic layer of the organic light emitting element disposed between the active region and the structure; and an encapsulation layer disposed on the organic layer. In the non-active region, the organic layer is disposed to expose the pad region, but is disposed to be spaced apart from the side surface of the structure. The encapsulation layer is disposed to expose the pad region, and surrounds the top and side surfaces of the organic layer. It is possible to provide the organic light emitting display panel including a reliable organic light emitting diode and the organic light emitting display device including the same.

Description

Organic light emitting display panel and organic light emitting display device including same

Embodiments of the present invention relate to an organic light emitting display panel and an organic light emitting display device including the same.

Recently, development of various flat panel displays (FPDs) is accelerating. Among them, in particular, the organic light emitting display device has advantages of fast response speed, high luminous efficiency, luminance and viewing angle by using self-luminous self-emitting devices.

However, the organic light emitting display device is deteriorated due to internal factors such as deterioration of the electrode and the light emitting layer by oxygen and deterioration due to the reaction between the light emitting layer and the interface, and at the same time, it is easily deteriorated by external factors such as moisture and oxygen. Therefore, packaging and encapsulation of the organic light emitting diode display are very important.

In particular, when an encapsulation layer is applied to an organic light emitting display device, it is necessary to open a pad region existing on one side of the substrate, and a separate shadow mask is used to open the pad region.

Accordingly, the number of processes increases, and reliability problems of the organic light emitting device due to the use of a mask may occur.

Embodiments of the present invention may provide an organic light emitting display panel without a short between a pad electrode disposed in a pad region and a source-side circuit film, and an organic light emitting display device including the same.

Also, embodiments of the present invention can provide an organic light emitting display panel capable of opening a pad area without using a shadow mask in an organic light emitting display panel including an encapsulation layer, and an organic light emitting display device including the same.

In addition, embodiments of the present invention may provide an organic light emitting display panel having no encapsulation layer and a residual film of an organic layer of an organic light emitting device in a pad region, and an organic light emitting display device including the same.

Further, since the encapsulation layer does not float in the embodiments of the present invention, it is possible to provide an organic light emitting display panel including a reliable organic light emitting device and an organic light emitting display device including the same.

In one aspect, embodiments of the present invention provide an organic light emitting display panel including an active area in which a plurality of organic light emitting devices are disposed and a non-active area disposed outside the active area and having a pad area, a first substrate and Doedoe disposed on the first substrate, at least one pad electrode provided in the pad region, an insulating layer disposed to expose a portion of an upper surface of the pad electrode, a structure disposed on the insulating layer and disposed to surround the pad region; an organic layer of the organic light emitting device disposed between the region and the active region and the structure, and an encapsulation layer disposed on the organic layer, wherein in the non-active region, the organic layer is disposed to expose the pad region and spaced apart from the side surface of the structure, The encapsulation layer is disposed to expose the pad region, and an organic light emitting display panel surrounding the top and side surfaces of the organic layer and an organic light emitting display device including the same may be provided.

In another aspect, embodiments of the present invention drive an organic light emitting display panel and an organic light emitting display panel including an active area in which a plurality of organic light emitting devices are disposed and a non-active area disposed outside the active area but having a pad area doedoe disposed on the substrate and the substrate, at least one pad electrode provided in the pad region, an insulating layer disposed to expose a portion of the upper surface of the pad electrode, and disposed on the insulating layer, the pad region a structure disposed to surround the active region, an organic layer of the organic light emitting device disposed between the active region and the structure, and an encapsulation layer disposed on the organic layer in the non-active region, wherein in the non-active region, the organic layer exposes the pad region It is possible to provide an organic light emitting display panel disposed to be spaced apart from the side surface of the structure, the encapsulation layer being disposed to expose the pad area, and surrounding the top and side surfaces of the organic layer, and an organic light emitting display device including the same.

According to embodiments of the present invention, an organic light emitting display panel and the same without a short circuit between the pad electrode and the source side circuit film disposed in the pad area by disposing the organic layer and the encapsulation layer of the organic light emitting device to expose the pad area It is possible to provide an organic light emitting display device including.

Further, according to embodiments of the present invention, an organic light emitting display panel capable of opening a pad area without using a shadow mask by disposing an organic layer material of the organic light emitting device between the encapsulation layer material and the pad electrode, and an organic light emitting display panel including the same An organic light emitting display device may be provided.

In addition, according to embodiments of the present invention, at least one structure surrounding the outer portion of the pad area is disposed so that the pad area does not have an encapsulation layer and a residual film of the organic layer of the organic light emitting device, and an organic light emitting display panel including the same A light emitting display device can be provided.

In addition, according to embodiments of the present invention, the thickness of the encapsulation layer is adjusted using at least one structure disposed in the non-active region, and the encapsulation layer is peeled, thereby preventing the encapsulation layer from lifting and providing reliable organic light emission. An organic light emitting display panel including an element and an organic light emitting display device including the same can be provided.

1 is an exemplary system implementation diagram of an organic light emitting display device according to embodiments of the present invention.
2 is a plan view schematically illustrating a panel structure of an organic light emitting diode display according to embodiments of the present invention.
FIG. 3 is a cross-sectional view taken along line AB of FIG. 2 .
4 to 8 are diagrams illustrating a process of removing a portion of an organic layer and an encapsulation layer of an organic light emitting diode disposed in a non-active area in an organic light emitting display panel according to embodiments of the present invention.
9 is a cross-sectional view illustrating an organic light emitting display panel according to another exemplary embodiment of the present invention.
10 and 11 are diagrams illustrating a cross-sectional structure of an organic light emitting display panel according to still another exemplary embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In adding reference numerals to components of each drawing, the same components may have the same reference numerals as much as possible even though they are indicated in different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted. When "includes", "has", "consisting of", etc. mentioned in this specification are used, other parts may be added unless "only" is used. When a component is expressed in a singular, it may include a case in which the plural is included unless otherwise explicitly stated.

In addition, in describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, order, or number of the elements are not limited by the terms.

In the description of the positional relationship of the components, when two or more components are described as being "connected", "coupled" or "connected", the two or more components are directly "connected", "coupled" or "connected" ", but it will be understood that two or more components and other components may be further "interposed" and "connected," "coupled," or "connected." Here, other components may be included in one or more of two or more components that are “connected”, “coupled” or “connected” to each other.

In the description of the temporal flow relation related to the components, the operation method, the manufacturing method, etc., for example, a temporal precedence relationship such as "after", "after", "after", "before", etc. Or, when a flow precedence relationship is described, it may include a case where it is not continuous unless "immediately" or "directly" is used.

On the other hand, when numerical values or corresponding information (eg, level, etc.) for a component are mentioned, even if there is no explicit description, the numerical value or the corresponding information is based on various factors (eg, process factors, internal or external shock, Noise, etc.) may be interpreted as including an error range that may occur.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 is an exemplary system implementation diagram of an organic light emitting display device according to embodiments of the present invention.

First, referring to FIG. 1 , a display device 100 according to embodiments of the present invention includes a panel PNL for displaying an image or outputting light, and a driving circuit for driving the panel PNL. can do.

In the panel PNL, a plurality of data lines and a plurality of gate lines are disposed, and a plurality of subpixels SP defined by the plurality of data lines and the plurality of gate lines may be arranged in a matrix type.

The panel PNL may include an active area AA in which an image (video) is displayed and a non-active area NA outside the active area NA in which an image is not displayed. Here, the non-active area NA is also referred to as a bezel area.

A plurality of sub-pixels SP for displaying an image are disposed in the active area AA. Each subpixel SP may include at least one light emitting area.

A pad area for electrically connecting a data driver may be disposed in the non-active area NA, and a plurality of data link lines for connecting the pad area and a plurality of data lines may be disposed.

In the organic light emitting diode display 100 according to the embodiments of the present invention, the data driver is implemented as a COF (Chip On Film) type among various types (TAB, COG, COF, etc.), and the gate driver includes various types ( TAB, COG, COF, GIP, etc.) can be implemented as a GIP (Gate In Panel) type.

The data driver may be implemented with one or more source driver integrated circuits (SDICs). 1 illustrates a case in which a data driver is implemented with a plurality of source driver integrated circuits (SDICs).

When the data driver is implemented as a COF type, each source driver integrated circuit SDIC implementing the data driver may be mounted on the source side circuit film SF.

One side of the source-side circuit film SF may be electrically connected to a pad area (a collection of pads) existing in the non-active area NA of the panel PNL.

Wires (eg, a plurality of signal lines) for electrically connecting the source driver integrated circuit SDIC and the panel PNL may be disposed on the source-side circuit film SF.

The organic light emitting display device includes one or more source printed circuit boards (SPCBs) for circuit connection between a plurality of source driver integrated circuits (SDICs) and other devices, and control printing for mounting control components and various electrical devices. It may include a circuit board (CPCB).

One side of the source side circuit film SF on which the source driver integrated circuit SDIC is mounted is electrically connected to the non-active area NA of the panel PNL, and the other side is electrically connected to the source printed circuit board (SPCB) and the source side circuit film SF. can be electrically connected.

A controller CTR for controlling operations such as a data driver and a gate driver may be disposed on the control printed circuit board CPCB.

The source printed circuit board SPCB and the control printed circuit board CPCB may be circuitly connected through at least one connecting member CBL. Here, the connecting member CBL may be, for example, a flexible printed circuit (FPC), a flexible flat cable (FFC), or the like.

When the gate driver is implemented as a gate in panel (GIP) type, the plurality of gate driving circuits GDC included in the gate driver may be directly formed on the non-active region NA of the panel PNL.

Each of the plurality of gate driving circuits GDC may output a corresponding scan signal SCAN to a corresponding gate line GL disposed in the active area AA of the panel PNL.

The gate driving related wirings disposed in the non-active area NA may be electrically connected to the source-side circuit film SF disposed closest to the plurality of gate driving circuits GDC.

At least one structure disposed to surround the periphery of the above-described pad area may be disposed in the non-active area NA.

This will be reviewed with reference to FIG. 2 as follows.

2 is a plan view schematically illustrating a panel structure of an organic light emitting diode display according to embodiments of the present invention.

Referring to FIG. 2 , in the organic light emitting display panel PNL of the organic light emitting diode display according to embodiments of the present invention, an active area AA in which an image is displayed and a non-active area surrounding the active area AA are non-active areas. (NA).

The non-active area NA may include a pad area PAD connected to the source driver integrated circuit SDIC.

A plurality of pad electrodes electrically connected to the source driver integrated circuit SDIC may be disposed in the pad area PAD.

In addition, the organic light emitting display panel PNL may include at least one structure 210 disposed on the first substrate 200 . The at least one structure 210 may be disposed to surround the outside of the pad area PAD.

In this case, at least the honey structure 210 may not overlap the pad electrodes provided in the pad area PAD.

In plan view, the structure 210 may have a closed curve shape.

And, as shown in FIG. 2 , the structure 210 may have a round shape in at least one corner region X of the structure 210 .

Although not shown in FIG. 2 , a plurality of signal lines may be disposed on the first substrate 200 of the organic light emitting display panel PNL. For example, a plurality of signal lines electrically connecting the source driver integrated circuit SDIC and the plurality of pad electrodes disposed in the pad area PAD may be disposed. In addition, a plurality of signal lines electrically connecting the plurality of pad electrodes disposed in the pad area PAD and the active area AA may be disposed.

A portion of the structure 210 may overlap at least one signal line connecting the source driver integrated circuit SDIC and the pad electrode disposed in the pad area PAD. In addition, a portion of the structure 201 may also overlap with at least one signal line electrically connecting the pad electrode disposed in the pad area PAD and the active area AA.

Meanwhile, the plurality of pad electrodes disposed in the pad area PAD may be electrically connected to the source driver integrated circuit SDIC by being connected to the source-side circuit film SF illustrated in FIG. 1 .

In other words, other components may not be disposed on the plurality of pad electrodes so that the plurality of pad electrodes disposed in the pad area PAD may be electrically connected to the source-side circuit film SF.

In order to expose the plurality of pad electrodes, components such as an insulating film disposed on the plurality of pad electrodes may be peeled off.

However, in this process, a residual film such as an insulating film or the like may be generated, or a lifting phenomenon of the insulating film may occur, which may cause a decrease in reliability of the organic light emitting display panel PNL. Accordingly, in the embodiments of the present invention, by disposing at least one structure 210 surrounding the outer portion of the pad area PAD in which the plurality of pad electrodes are disposed, the configuration of the insulating film disposed on the plurality of pad electrodes is reduced. In the step of peeling, it is possible to prevent the occurrence of a residual film such as an insulating film, or occurrence of floating.

The structure of the organic light emitting display panel PNL on which the structure 210 is disposed will be reviewed in detail with reference to FIG. 3 .

3 is a cross-sectional view taken along line A-B of FIG. 2 .

Referring to FIG. 3 , an organic light emitting display panel PNL according to embodiments of the present invention includes at least one transistor Tr, at least one organic light emitting diode OLED, and at least one transistor Tr disposed on a first substrate 200 . At least one structure 210 may be included.

The transistor Tr may include an active layer 310 , a gate electrode 303 , a source electrode 330 , and a drain electrode 335 .

The organic light emitting diode OLED may include a first electrode 350 , an organic layer 360 including at least one light emitting layer, and a second electrode 370 .

Specifically, the organic light emitting display panel PNL may be divided into an active area AA and a non-active area NA.

At least one light blocking layer 301 may be disposed on the first substrate 200 in the active area AA.

Here, the first substrate 200 may include at least one of glass, metal, or a polymer material such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide. , the present invention is not limited thereto.

The light blocking layer 301 may include a metal material or carbon black, but the present invention is not limited thereto. In an embodiment of the present invention, it is sufficient if the light blocking layer 301 includes a material capable of blocking light. Do.

At least one buffer layer 302 may be disposed on the first substrate 200 on which the light blocking layer 301 is disposed.

The buffer layer 302 may be made of an inorganic insulating material such as silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON), but the present invention is not limited thereto.

Although the structure in which the buffer layer 302 is a single layer is illustrated in FIG. 3 , the present invention is not limited thereto, and the buffer layer 302 may have a structure in which a plurality of thin films are deposited. When the buffer layer 302 has a structure in which a plurality of thin films are deposited, at least two inorganic insulating films of an inorganic material such as silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON) are alternately disposed. structure, but the present invention is not limited thereto.

In the following description, for convenience of description, the buffer layer 302 will be described as a single layer structure.

In the active area AA, the active layer 310 of the thin film transistor Tr may be disposed on the buffer layer 302 . The active layer 310 may be various types of semiconductor layers. For example, the active layer 310 may be a semiconductor layer including silicon or a semiconductor layer including a metal oxide, but the present invention is not limited thereto.

A gate insulating layer 303 may be disposed on the active layer 310 .

The gate insulating layer 303 may be disposed to overlap the channel region of the active layer 310 .

Although not shown in the drawing, the active layer 310 includes a source region connected to the source electrode 330 of the transistor Tr and a drain region connected to the drain electrode 335 , and is provided between the source region and the drain region. It may include a channel region that becomes When the transistor Tr is in an ON state, carriers may move through the channel region of the active layer 310 . In other words, the channel region of the active layer 310 may be a passage through which carriers move when the thin film transistor Tr is in an on state.

Meanwhile, although FIG. 3 shows a structure in which the gate insulating layer 303 overlaps the channel region of the active layer 310 , the present invention is not limited thereto. For example, the gate insulating layer 303 may be disposed to cover the active layer 310 in the active area AA and may be disposed to extend to the non-active area NA.

Also, the gate electrode 320 of the transistor Tr may be disposed on the gate insulating layer 303 in the active area AA.

The gate electrode 320 may include aluminum (Al), silver (Ag), gold (Au), tungsten (W), magnesium (Mg), copper (Cu), molybdenum (Mo), chromium (Cr), and tantalum (Ta). , a metal such as titanium (Ti), or an alloy thereof, etc., but the present invention is not limited thereto.

In FIG. 3 , the gate electrode 320 is illustrated as a single-layer structure, but the present invention is not limited thereto, and the gate electrode 320 may be formed of a multi-layer structure.

A first pad electrode 325 may be disposed on the buffer layer 302 in the non-active area NA. The first pad electrode 325 may be provided in the pad area PAD in the non-active area NA.

The first pad electrode 325 may include the same material as the gate electrode 320 , but the present invention is not limited thereto. In addition, although the structure of the first pad electrode 325 is illustrated in FIG. 3 as a single layer, the present invention is not limited thereto, and the first pad electrode 325 may be formed of multiple layers.

A first interlayer insulating layer 304 and a second interlayer insulating layer 305 may be disposed on the gate electrode 320 and the first pad electrode 325 . In other words, the first and second interlayer insulating layers 304 and 305 may be disposed in the active area AA and the non-active area NA.

The first and second interlayer insulating layers 304 and 305 may include an inorganic insulating material such as silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON), but the present invention is not limited thereto. does not

For example, only one interlayer insulating layer may be disposed on the gate electrode 320 .

A source electrode 330 and a drain electrode 335 of the transistor Tr may be disposed on the second interlayer insulating layer 305 in the active area AA to be spaced apart from each other.

Although FIG. 3 illustrates a structure in which each of the source electrode 330 and the drain electrode 335 is a single layer, the present invention is not limited thereto, and at least one of the source and drain electrodes 330 and 335 has a multilayer structure. can be made with

Each of the source electrode 330 and the drain electrode 335 is aluminum (Al), silver (Ag), gold (Au), tungsten (W), magnesium (Mg), copper (Cu), molybdenum (Mo), chromium ( Cr), a metal such as tantalum (Ta), titanium (Ti), or an alloy thereof may be included, but the present invention is not limited thereto.

As described above, the source electrode 330 may be connected to the source region of the active layer 310 . For example, the source electrode 330 is provided in the first and second interlayer insulating layers 304 and 305 , and is formed through a contact hole exposing a portion of the top surface of the source region of the active layer 310 . It may be connected to the source region.

The drain electrode 335 may be connected to a drain region of the active layer 310 . For example, the drain electrode 335 is provided in the first and second interlayer insulating layers 304 and 305 , and is formed through a contact hole exposing a portion of the upper surface of the drain region of the active layer 310 . It may be connected to the drain region.

Meanwhile, in FIG. 3 , 330 is a source electrode and 335 is a drain electrode has been mainly described, but the present invention is not limited thereto. For example, 330 may be a drain electrode and 335 may be a source electrode.

A second pad electrode 340 may be disposed on the second interlayer insulating layer 305 in the non-active area NA. The second pad electrode 340 may be provided in the pad area PAD in the non-active area NA.

The second pad electrode 340 is disposed on the same layer as the source electrode 330 and the drain electrode 335 and may include the same material, but the present invention is not limited thereto.

The second pad electrode 340 may be electrically connected to the first pad electrode 325 through contact holes provided in the first and second interlayer insulating layers 304 and 305 .

Meanwhile, in FIG. 3 , the first and second pad electrodes 325 and 340 disposed in the pad area PAD are disposed on different layers, and contact holes provided in the first and second interlayer insulating layers 304 and 305 . Although the structure electrically connected through the is shown, the present invention is not limited thereto.

For example, the pad area PAD of the organic light emitting display panel PNL according to the exemplary embodiments includes a region in which only the first pad electrode 325 or only the second pad electrode 340 is disposed. can do.

A protective layer 306 may be disposed on the first substrate 200 on which the source electrode 330 of the transistor Tr, the drain electrode 335, and the second pad electrode 340 disposed in the pad region PAD are disposed. can In other words, the passivation layer 306 may be disposed in the active area AA and the non-active area NA.

The protective layer 306 may be made of an inorganic insulating material such as silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON), but the present invention is not limited thereto.

The passivation layer 306 may be disposed to expose a portion of the top surface of the second pad electrode 340 in the non-active area NA.

A planarization layer 307 (or an insulating layer) may be disposed on the passivation layer 306 .

The planarization layer 307 may include an organic insulating material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin. However, the present invention is not limited thereto, and the planarization layer 307 includes an insulating material capable of planarizing a step caused by components (eg, transistors) disposed on the first substrate 200 . configuration is sufficient.

The planarization layer 307 may be disposed in the active area AA and the non-active area NA to expose a portion of the top surface of the second pad electrode 340 disposed in the pad area PAD.

The first electrode 350 of the organic light emitting device OELD may be disposed on the planarization layer 307 in the active area AA. Here, the first electrode 350 may be an anode electrode of the organic light emitting diode (OLED).

The first electrode 350 of the organic light emitting diode OLED may be electrically connected to the drain electrode 335 of the transistor Tr through a contact hole provided in the planarization layer 307 and the passivation layer 306 .

A bank 308 may be disposed on the planarization layer 307 on which the first electrode 350 of the organic light emitting diode (OLED) is disposed.

Specifically, the bank 308 may overlap a portion of the top surface of the first electrode 350 of the organic light emitting diode OLED, and may overlap a portion of the top surface of the planarization layer 307 .

Also, in the non-active area NA, a structure 210 surrounding the pad area PAD may be disposed on the planarization layer 307 .

Here, the width of the structure 210 may be increased based on the same direction as the direction in which the protective layer 306 and the planarization layer 307 are stacked on the first substrate 200 . In another aspect, the structure 210 may include a region in which the slope of the side is negative with respect to the first substrate 200 .

For example, the structure 210 may have a reverse tapered shape as shown in FIG. 3 , but the present invention is not limited thereto.

The structure 210 may include a negative photosensitive organic material, but the present invention is not limited thereto.

An organic layer 360 of the organic light emitting device OLED may be disposed on the first electrode 350 and the bank 308 of the organic light emitting device 0LED. The organic layer 360 may include at least one light emitting layer.

The organic layer 360 may be disposed up to a portion of the non-active area NA.

For example, as shown in FIG. 3 , the organic layer 360 may be disposed in the non-active area NA, but may be spaced apart from the structure 210 and the pad area PAD.

The organic layer 360 may be formed by a deposition or coating method having linearity.

For example, the organic layer 360 may be formed by an evaporation method. Therefore, when the organic layer 360 is formed, the organic layer 360 is not formed on the side surface of the structure 210 and the planarization layer 307 adjacent to the side surface of the structure 210 because the organic layer material is blocked on the upper surface of the structure 210 having a wide width. There may be regions in which they are disposed. Here, the region of the planarization layer 307 adjacent to the side surface of the structure 210 may be a region overlapping the top surface of the structure 210 , and the organic layer 360 may be the planarization layer 307 overlapping the top surface of the structure 210 . ) may not be arranged in some areas.

In addition, the organic layer 360 may be disposed on the top surface of the structure in the non-active area NA, the top surface of the planarization layer 307 provided in the pad area PAD, and the second pad electrode 340 , but an etching process is performed. can be removed through

In other words, the organic layer 360 may be disposed on a portion of the top surface of the planarization layer 307 provided in the non-active area NA.

In addition, the organic layer 360 is not disposed on the top surface and the side surface of the structure 210 in the non-active area NA, and the top surface and the pad of the planarization layer 307 disposed between the pad area PAD and the structure 210 . It may not be disposed on the top surface of the planarization layer 307 disposed in the area PAD and the top surface of the second pad electrode 340 .

The organic layer 360 may also be formed on a partial region of the top surface of the planarization layer 307 overlapping the structure 210 . For example, in a process of forming the organic layer 360 through an evaporation process, a material of the organic layer 360 may partially penetrate into a partial region of the upper surface of the planarization layer 307 overlapping the structure 210 .

Here, the thickness T1 (referred to as a first thickness) of the organic layer 360 disposed in the region not overlapping the structure 210 is the thickness T2 of the organic layer 360 disposed in the region overlapping the structure 210 . , referred to as the second thickness). Here, the first thickness and the second thickness mean the shortest distance between the upper and lower surfaces of the organic layer 360 .

In the active area AA, the second electrode 370 of the organic light emitting device OLED may be disposed on the organic layer 360 of the organic light emitting device OLED. Here, the second electrode 370 may be a cathode electrode of the organic light emitting diode (OLED).

Meanwhile, the organic light emitting diode (OLED) according to embodiments of the present invention may include at least one transparent conductive material among the first electrode 350 and the second electrode 370 .

In addition, the other electrode 350 may include a reflective metal or may be formed of a multilayer including a reflective metal.

For example, the second electrode 370 of the organic light emitting diode (OLED) includes a transparent conductive material, and the first electrode 350 is a single-layer electrode including a reflective metal or an electrode layer including a transparent conductive material. It may have a structure in which an electrode layer including a reflective metal is additionally disposed below. In this case, the organic light emitting device OLED disposed in the active area AA is a top emission type organic light emitting device in which light emitted from the organic layer 360 is finally emitted toward the second electrode 370 . (OLED).

Conversely, the first electrode 350 of the organic light emitting diode (OLED) includes a transparent conductive material, and the second electrode 370 is a single-layer electrode including a reflective metal, or one surface of an electrode layer including a transparent conductive material. It may have a structure in which an electrode layer including a reflective metal is additionally disposed. In this case, the organic light emitting diode OLED disposed in the active area AA is a top emission type organic light emitting device in which light emitted from the organic layer 360 is finally emitted toward the first electrode 350 . It may be an element (OLED).

In addition, when both the first and second electrodes 350 and 370 of the organic light emitting diode (OLED) include a transparent conductive material, or at least one electrode includes a transparent conductive material, and the other electrode is made of a semi-transmissive conductive layer The organic light emitting diode (OLED) may be a double-sided light emitting device in which light emitted from the organic layer 360 is emitted toward the first and second electrodes 350 and 370 .

An encapsulation layer 380 may be disposed on the first substrate 200 on which the second electrode 370 of the organic light emitting diode (OLED) is disposed.

Here, the encapsulation layer 380 may have a single-layer structure including an inorganic insulating material, but the present invention is not limited thereto. For example, the encapsulation layer 380 may have a multi-layered structure, and in this case, at least one encapsulation layer may include an organic insulating material.

The encapsulation layer 380 may serve to prevent foreign substances such as moisture and oxygen from penetrating into the plurality of organic light emitting diodes (OLEDs) disposed in the active area AA.

The encapsulation layer 380 may be formed by a deposition or coating method with non-uniform directionality. For example, the encapsulation layer 380 may be formed through a sputtering method or a chemical vapor deposition (CVD) method. This method has excellent step coverage, so that the encapsulation layer 380 can be easily formed even in a structure having a stepped or reverse tapered shape.

In the case of the sputtering method or the chemical vapor deposition method, it is a deposition method that has better step coverage than the evaporation method, and the evaporation method allows material to be deposited up to an area not deposited.

The encapsulation layer 380 may be disposed on the entire surface of the first substrate 200 , but for electrical connection between the second pad electrode 340 and the source-side circuit film SF, the pad area PAD and the pad area PAD ), the encapsulation layer 380 disposed on the periphery of the region may be peeled off through a peeling process.

Accordingly, the encapsulation layer 380 is disposed to cover the organic layer 360 of the organic light emitting diode OLED, and may be disposed from the non-active area NA to a portion of the side surface of the structure 210 .

At this time, as shown in FIG. 3 , the encapsulation layer 380 may be disposed to expose a portion of a side surface of the structure 210 and an upper surface of the structure 210 , and the pad area PAD and the structure 210 . It may not be disposed on the top surface of the planarization layer 307 disposed therebetween, the top surface of the planarization layer 307 disposed in the pad area PAD, and the top surface of the second pad electrode 340 .

The structures of the organic layer 360 and the encapsulation layer 380 in the non-active area NA are as follows.

The organic layer 360 of the organic light emitting diode (OLED) may be disposed to be spaced apart from the structure 210 in the non-active area NA, and may be disposed to surround the periphery of the structure 210 .

In this case, the organic layer 360 may not be disposed in the inner region of the structure 210 .

Specifically, the organic layer 360 may not be disposed in an area corresponding to the pad area PAD in which the plurality of pad electrodes 325 and 340 are disposed, and may be disposed between the pad area PAD and the structure 210 . It may not be disposed on the planarization layer 307 . In addition, the organic layer 360 may not be disposed on the upper surface and the side surface of the structure 210 . In addition, the organic layer 360 may not be disposed on a portion of the upper surface of the planarization layer 307 overlapping the structure 210 outside the structure 210 .

The encapsulation layer 380 may also be disposed to surround the periphery of the structure 210 .

In this case, the encapsulation layer 380 may not be disposed in an area corresponding to the pad area PAD, which is an area provided inside the structure 210 , and is provided between the pad area PAD and the structure 210 . It may not be disposed on the planarization layer 307 . Also, the encapsulation layer 380 may not be disposed on the upper surface of the structure 210 , and may be disposed to expose a portion of the side surface of the structure 210 .

Specifically, in the area between the active area AA and the structure 210 , the encapsulation layer 380 may be disposed on the planarization layer 307 disposed in the area overlapping the structure 210 , and the encapsulation layer 380 may be disposed to extend to a portion of the side of the structure 210 .

In addition, in a region between the structure 210 and the outer portion of the first substrate 200 , the encapsulation layer 380 may be disposed on the upper surface of the planarization layer 307 disposed in an area overlapping the structure 210 . The encapsulation layer 380 may be disposed to contact a portion of the side surface of the structure 210 .

In other words, the encapsulation layer 380 may include a region overlapping the structure 210 in the non-active region.

At this time, the thickness (T3, referred to as a third thickness) of the encapsulation layer 380 that does not overlap the structure 210 is the thickness (T4, the fourth thickness) of the encapsulation layer 380 overlaps the structure 210 . may be thicker than the named). Here, the third thickness and the fourth thickness mean the shortest distance between the upper surface and the lower surface of the encapsulation layer 380 .

The thickness of the organic layer 360 and the encapsulation layer 380 of the organic light emitting diode (OLED) in the region overlapping the structure 210 is the organic layer 360 of the organic light emitting diode (OLED) in the region that does not overlap the structure 210 . ) and the thickness of the encapsulation layer 380 may be thinner.

In other words, the thickness of the organic layer 360 and the encapsulation layer 380 may become thinner as it approaches the side surface of the structure 210 . Accordingly, in the process of removing the organic layer 360 and the encapsulation layer 380 , a residual film is not left and the organic layer 360 and the encapsulation layer 380 can be removed without floating. This will be discussed in detail in the following description.

An adhesive layer 390 may be disposed on the encapsulation layer 380 .

A second substrate 395 may be disposed on the adhesive layer 390 .

The adhesive layer 390 may serve to bond the encapsulation layer 390 disposed on the first substrate 200 and the second substrate 395 to each other.

The second substrate 395 may include at least one of glass, metal, or a polymer material such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide. The invention is not limited thereto.

The adhesive layer 390 and the second substrate 395 may be disposed to expose some or all of the non-active area NA including the pad area PAD.

As described above, the structure 210 is disposed to surround the outside of the pad area PAD disposed in the non-active area NA, so that the organic light emitting diode is disposed around the pad area PAD and the pad area PAD. The organic layer 360 and the encapsulation layer 380 of the device OLED may be easily removed.

This will be reviewed with reference to FIGS. 4 to 8 as follows.

4 to 8 are views illustrating a process of removing a portion of an organic layer and an encapsulation layer of an organic light emitting diode disposed in a non-active area in an organic light emitting display panel according to embodiments of the present invention.

In the following description, contents (configuration, effects, etc.) that overlap with the above-described embodiments may be omitted.

Referring to FIG. 4 , the transistor Tr may be disposed in the active area AA, and a plurality of pad electrodes 325 and 340 may be disposed in the non-active area NA.

In the active area AA, the first electrode 350 of the organic light emitting diode OLED electrically connected to the transistor Tr and the bank 308 overlapping a portion of the upper surface of the first electrode 350 are planarized layers. 307 may be disposed on.

At least one structure 210 surrounding the outside of the pad area PAD in which the plurality of pad electrodes 325 and 340 are disposed in the non-active area NA may be disposed on the planarization layer 307 .

Here, the bank 308 may include a positive photosensitive organic material and the structure 210 may include a negative photosensitive organic material. Accordingly, the cross section of at least one side of the bank 308 may be a forward taper shape, and the cross section of the structure 210 may have a reverse taper shape at least on one side.

Next, referring to FIG. 5 , the organic layer material of the organic light emitting device OLED is disposed on the first substrate 200 on which the first electrode 350 , the bank 308 , and the structure 210 are disposed. 360a may be disposed. The organic layer material 360a may be disposed in a portion of the non-active area NA including the active area AA and the pad area PAD.

Specifically, the organic layer material 360a is formed by a deposition or coating method having a straightness, so that the organic layer material 360a is blocked on the upper surface of the structure 210 having a wide width, and the side surface of the structure 210 and the upper surface of the structure 210 . The organic layer material 360a may not be disposed on a partial region of the upper surface of the planarization layer 307 overlapping with the upper surface of the planarization layer 307 .

Here, the organic layer material 360a may be formed by penetrating into a portion of the upper surface of the planarization layer 307 overlapping the upper surface of the structure 210 , and may be formed on the planarization layer 307 overlapping the upper surface of the structure 210 . The thickness of the organic layer material 360a disposed on the layer may be smaller than the thickness of the organic layer material 360a in the remaining regions (eg, the active region, the upper surface of the structure, and the non-active region that does not overlap the structure).

Since the structure 210 has a shape that becomes narrower from the top to the bottom, when the organic layer material 360a is formed, the organic layer material 360a on the top surface of the planarization layer 307 disposed in the region overlapping the structure 210 ) A region in which the thickness of is formed to be thinner than the thickness of the organic layer material 360a disposed in a region that does not overlap the structure 210 and a region in which the organic layer material 360a is not formed may exist.

The second electrode 370 of the organic light emitting diode (OLED) may be disposed on the first substrate 200 on which the organic layer material 360a is disposed. As shown in FIG. 5 , the second electrode 370 is disposed on the entire surface of the active area AA, but may not be disposed on the non-active area NA.

Thereafter, as shown in FIG. 6 , an encapsulation layer material 380a may be disposed on the first substrate 200 on which the second electrode 370 is disposed.

The encapsulation layer material 380a may be disposed in the non-active area NA including the active area AA and the pad area PAD by being formed by a deposition or coating method having a non-uniform directionality. In other words, the encapsulation layer material 380a may be disposed on the entire surface of the first substrate 200 . A separate mask may not be used in the process of forming the encapsulation layer material 380a.

In particular, as shown in FIG. 6 , the encapsulation layer material 380a may also be formed on the upper surface of the planarization layer 307 disposed in the region overlapping the structure 210 and the side surface of the structure 210 .

However, the thickness of the encapsulation layer material 380a formed on the top surface of the planarization layer 307 disposed in the region overlapping the structure 210 and the side surface of the structure 210 is different from the remaining regions (eg, the active region and the thickness of the structure). It may be thinner than the thickness of the encapsulation layer material 380a formed on the top surface and the non-active region that does not overlap the structure.

Thereafter, the encapsulation layer material 380a disposed on a portion of the non-active area NA may be peeled off from the first substrate 200 .

Specifically, a peeling film (eg, an adhesive film) is attached to the pad area PAD and the encapsulation layer material 380a disposed in a partial area of the non-active area NA surrounding the pad area PAD. can do.

After attaching the encapsulation layer material 380a to the release film, when an external force is applied to the release film in a direction corresponding to the direction in which the first electrode 350 and the bank 308 are stacked, the encapsulation layer material due to the release film The 380a may be peeled from the first substrate 200 .

At this time, the encapsulation layer material 380a is peeled off and removed from the pad area PAD and a portion of the non-active area NA surrounding the pad area PAD, so that the encapsulation layer 380 of FIG. 7 is formed. can

Specifically, the encapsulation layer 380 formed by removing a portion of the encapsulation layer material 380a may be disposed to surround the periphery of the structure 210 , and the encapsulation layer 380 may be formed with a portion of the side surface of the structure 210 and may be placed in contact.

In other words, the encapsulation layer 380 may not be disposed in an area corresponding to the pad area PAD, which is an area provided inside the closed curved structure 210 . In addition, the encapsulation layer 380 is not disposed on the planarization layer 307 provided between the structure 210 and the pad area PAD, and is provided between the structure 210 and the pad area PAD. 307) and may not be disposed on one side of the structure 210 and the upper surface of the structure 210 .

Meanwhile, since the structure 210 has a shape that becomes narrower from the top to the bottom, the encapsulation layer on the upper surface of the planarization layer 307 disposed in the area overlapping the structure 210 when the encapsulation layer material 380a is formed. A region in which the thickness of the material 380a is thinner than the thickness of the encapsulation layer material 380a formed in a region that does not overlap the structure 210 may exist.

Also, when the encapsulation layer material 380a is peeled off, the encapsulation layer material 380a may come off from a portion where the thickness of the encapsulation layer material 380a is thin.

Accordingly, as shown in FIG. 7 , the encapsulation layer 380 formed by removing a portion of the encapsulation layer material 380a may be disposed to surround the periphery of the structure 210 , and the encapsulation layer 380 may include the structure ( 210) may be disposed in contact with a portion of the side surface.

As described above, as the encapsulation layer material 380a is separated from the portion where the thickness of the encapsulation layer material 380a is thin, the end of the encapsulation layer 380 remaining on the first substrate 200 becomes the planarization layer ( 307), the organic layer 360 or the structure 210 may not be lifted, and a residual film may be peeled off without being generated.

When a residual film is generated in the process of exfoliating the encapsulation layer material 380a, it may act as a foreign material in a subsequent process, which may cause a problem in the reliability of the organic light emitting display panel (PNL). In the display panel PNL, since the encapsulation layer material 380a is thinly formed in a region corresponding to a portion of the side surface of the structure 210 , the encapsulation layer material 380a may be peeled off without a residual film.

In addition, after peeling off the encapsulation layer material 380a, a lifting phenomenon occurs in which the encapsulation layer 380 remaining on the first substrate 200 is separated from other components disposed on the first substrate 200 . In this case, foreign substances such as moisture and oxygen may penetrate into the organic layer 360 of the organic light emitting diode (OLED) disposed under the encapsulation layer 380 . However, in the organic light emitting display panel PNL according to embodiments of the present invention, since the encapsulation layer material 380a is thinly formed in a region corresponding to a portion of the side surface of the structure 210 , a portion of the encapsulation layer material 380a is formed. The encapsulation layer 380 is not separated from the other components and is formed without lifting even after peeling, and may be disposed to surround the top and side surfaces of the organic layer of the organic light emitting diode (OLED) disposed in the non-active area NA. . Accordingly, it is possible to prevent foreign substances such as moisture and oxygen from penetrating into the organic layer 360 .

In addition, as shown in FIG. 2 , since the structure 210 has a round shape in at least one corner region X of the structure 210 , when the encapsulation layer material 380a is peeled off, the edge of the structure 210 is In the region X, an external force (force applied to the encapsulation layer material when the encapsulation layer is peeled off) received by the encapsulation layer material 380a may be increased, and thus, a residual film of the encapsulation layer material 380a may be easily peeled off without being generated. have.

As shown in FIG. 7 , a region in which the top surface of the organic layer material 360a is exposed may exist in a region where the encapsulation layer material 380a is peeled off from a portion of the non-active region NA.

Thereafter, as shown in FIG. 8 , the organic layer material 360a provided in the non-active area NA is removed from a portion of the non-active area NA through a dry etching or wet etching process to remove the organic layer 360 . can be formed.

Accordingly, the organic layer 360 may be disposed on a portion of the top surface of the planarization layer 307 disposed outside the structure 210 in the non-active area NA.

In addition, the organic layer 360 is not disposed on the top surface and the side surface of the structure 210 in the non-active area NA, and the top surface and the pad of the planarization layer 307 disposed between the pad area PAD and the structure 210 . It may not be disposed on the top surface of the planarization layer 307 disposed in the area PAD and the top surface of the second pad electrode 340 .

Meanwhile, in the region where the organic layer material 360a is removed, the organic layer material 360a may be disposed between the second pad electrode 340 and the encapsulation layer material 380a to serve as a sacrificial layer.

Specifically, when the organic layer material 360a is not disposed between the second pad electrode 340 and the encapsulation layer material 380a, the adhesion between the encapsulation layer material 380a and the second pad electrode 340 is strong, It may be difficult to peel off the encapsulation layer material 380a disposed on the second pad electrode 340 without a mask process.

However, in the organic light emitting display panel PNL according to embodiments of the present invention, the organic layer material 360a is disposed between the second pad electrode 340 and the encapsulation layer material 380a, so that the encapsulation layer material 380a is formed. There is an effect that it can be easily peeled off from the organic layer material 360a.

In the process of forming the encapsulation layer 380 , when a mask is used, poor permeation film formation (or shadow) due to misalignment of the mask, deterioration of film formation quality due to induction of foreign matter, and arc generation in the process chamber and a change in characteristics of the deposition film due to arcing. In particular, a foreign material generated during the formation of the encapsulation layer material 380a may be a factor degrading the reliability of the organic light emitting diode (0LED).

In the organic light emitting display panel PNL according to embodiments of the present invention, since a mask process is unnecessary in the process of forming the encapsulation layer 380 , the penetrating film formation phenomenon of the encapsulation layer 380 caused during the mask process does not occur. It has the effect of realizing a narrow bezel.

In addition, since a mask process is not performed when the encapsulation layer 380 is formed, the film quality of the encapsulation layer 380 may be improved, and high reliability of the organic light emitting diode (OLED) may be obtained.

In addition, the structure 210 is disposed to not overlap the pad electrodes 325 and 340 disposed in the pad area PAD, so that the organic layer material 360a and the encapsulation layer material 380a are formed on the first and second pad electrodes. It can be removed from the outside of (325, 340). Therefore, finally, the organic layer 360 and the encapsulation layer 380 may not overlap the first and second pad electrodes 325 and 340 .

Meanwhile, in FIGS. 3 to 8 , the cross-sectional structure of the structure 210 has a reverse tapered shape, but the shape of the structure 210 of the present invention is not limited thereto.

Referring to FIG. 9 , another shape of the structure will be reviewed as follows.

9 is a cross-sectional view illustrating an organic light emitting display panel according to another exemplary embodiment of the present invention.

In the following description, contents (configuration, effects, etc.) that overlap with the above-described embodiments may be omitted.

Referring to FIG. 9 , in the organic light emitting display panel PNL according to another exemplary embodiment of the present invention, at least one structure 910 disposed to surround the outside of the pad area PAD provided in the non-active area NA. may include.

The at least one structure 910 may be disposed on a portion of the top surface of the planarization layer 307 disposed outside the structure 910 of the non-active area NA.

The structure 910 may include a lower region 911 having one surface in contact with the planarization layer 307 and an upper region 912 disposed on the lower region 911 . Here, the lower region 911 and the upper region 912 may be formed integrally, but the present invention is not limited thereto.

9 , the width W1 of the lower region 911 of the structure 910 may be narrower than the width W2 of the upper region 912 .

Here, the width W1 of the lower region 911 and the width W2 of the upper region 912 are the second protective layer 306 and the planarization layer 307 disposed on the first substrate 200 are stacked. It may mean a length of each region based on a direction perpendicular to the direction.

Meanwhile, although FIG. 9 shows a structure in which the cross-sectional shape of the structure 910 is a 'T' shape, the present invention is not limited thereto, and the cross-sectional shape of the structure 910 according to an embodiment of the present invention is the structure ( It is sufficient if the width W1 of the lower region 911 of the 910 is narrower than the width W2 of the upper region 912 .

Since the width W1 of the lower region 911 of the structure 910 is narrower than the width W2 of the upper region 912 , the organic layer 360 material is deposited on the upper portion of the structure 910 during the formation of the organic layer 360 . An undisposed region may exist on a portion of the upper surface of the planarization layer 307 overlapping the region 912 . In addition, the organic layer 360 is disposed on a portion of the remaining top surface of the planarization layer 307 overlapping the upper area 912 of the structure 910 , and is thinner than the thickness of the organic layer 360 disposed in the active area AA. can be formed.

An encapsulation layer 380 may be disposed on the organic layer 360 .

In the non-active area NA, the encapsulation layer 380 may be disposed to surround the top and side surfaces of the organic layer 360 .

In this case, the encapsulation layer 380 may contact one side of the structure 910 , and specifically, may contact a portion of one side of the lower region 911 of the structure 910 .

In addition, the encapsulation layer 380 may be disposed to expose a portion of a side surface of the structure 910 and a top surface of the structure 210 , and a planarization layer 307 disposed between the pad area PAD and the structure 210 . It may be disposed to expose the top surface of the , the top surface of the planarization layer 307 disposed in the pad area PAD, and the top surface of the second pad electrode 340 .

Meanwhile, the positions of the encapsulation layer 380 and the organic layer 360 remaining on the first substrate 200 may vary depending on the adhesive strength of the peeling film used when the material of the encapsulation layer 380 is peeled off.

This will be reviewed with reference to FIGS. 10 and 11 as follows.

10 and 11 are diagrams illustrating a cross-sectional structure of an organic light emitting display panel according to still another exemplary embodiment of the present invention.

In the following description, contents (configuration, effects, etc.) that overlap with the above-described embodiments may be omitted.

First, referring to FIG. 10 , the organic layer 1060 may have a structure disposed on a portion of the upper surface of the structure 210 in the structure of FIG. 3 .

In other words, the organic layer 1060 may be disposed to surround the periphery of the structure 210 , and may be disposed on a portion of the upper surface of the planarization layer 307 overlapping the structure 210 at the periphery of the structure 210 , , may also be disposed on a portion of the upper surface of the structure 210 .

The organic layer 1060 may not be disposed on a portion and side surfaces of the upper surface of the structure 210 in the non-active area NA. In addition, the organic layer 1060 includes a top surface of the planarization layer 307 disposed between the pad area PAD and the structure 210 , a top surface of the planarization layer 307 disposed in the pad area PAD, and a second pad electrode ( 340) may not be disposed on the upper surface.

An encapsulation layer 1080 may be disposed on the organic layer 1060 .

The encapsulation layer 1080 may be disposed to surround the top and side surfaces of the organic layer 1060 .

In detail, the encapsulation layer 1080 may be disposed to extend from the active area AA and extend to a portion of the non-active area NA. Here, the encapsulation layer 1080 may be disposed to extend to one side and a portion of the top surface of the structure 210 disposed in the non-active area NA. The encapsulation layer 1080 may be disposed to cover the top and side surfaces of the organic layer 1060 in the non-active area NA.

Here, the thickness of the encapsulation layer 1080 in the portion where the encapsulation layer 1080 is disposed on the upper surface of the planarization layer 307 overlapping the structure 210 and the portion disposed on one side of the structure 210 is the encapsulation layer ( 1080 may be thinner than the thickness of the encapsulation layer 1080 in the portion disposed on the upper surface of the structure 210 .

This is because it is difficult for the material of the encapsulation layer 1080 to reach the upper surface of the planarization layer 307 overlapping the structure 210 and one side of the structure 210 by the inverted tapered structure 210 .

In addition, the encapsulation layer 1080 may not be disposed on a portion of the upper surface of the structure 210 and one side of the structure 210 in the non-active area NA. In addition, the encapsulation layer 1080 includes an upper surface of the planarization layer 307 disposed between the pad area PAD and the structure 210 , an upper surface of the planarization layer 307 disposed in the pad area PAD, and a second pad electrode. It may not be disposed on the upper surface of the 340 .

As such, the organic layer 1060 and the encapsulation layer 1080 are disposed to expose a portion of the upper surface of the second pad electrode 340 , so that there is no short circuit between the second pad electrode 340 and the source-side film SF. can be connected

The positions of the organic layer 1060 and the encapsulation layer 1080 are not limited thereto.

Referring to FIG. 11 , the organic layer 1160 is disposed to surround the structure 210 in the non-active area NA, and may be disposed to be spaced apart from the side surface of the structure 210 . Also, the organic layer 1160 may be disposed to contact the upper surface of the structure 210 .

In other words, the organic layer 1160 may be disposed on a portion of the top surface of the planarization layer 307 disposed between the pad area PAD and the structure 210 , and the top surface of the planarization layer 307 outside the structure 210 . It may also be placed in a part of Also, the organic layer 1160 may be disposed on the upper surface of the structure 210 .

In this case, the organic layer 1160 may be disposed to expose a portion of the upper surface of the second pad electrode 340 disposed in the pad area PAD.

Also, the encapsulation layer 1180 may be disposed to surround the top and side surfaces of the organic layer 1160 .

In detail, the encapsulation layer 1180 may be disposed to extend from the active area AA and extend to a portion of the non-active area NA. Here, the encapsulation layer 1180 may be disposed to cover the side and top surfaces of the structure 210 disposed in the non-active area NA, and a planarization layer ( PAD) disposed on the pad area PAD and the structure 210 . 307) may be disposed to extend to a portion of the upper surface.

The encapsulation layer 1180 may also be disposed to expose a portion of the top surface of the second pad electrode 340 disposed in the pad area PAD.

Through this, the second pad electrode 340 and the source-side film SF may be connected without a short circuit.

According to embodiments of the present invention, an organic light emitting display panel and the same without a short circuit between the pad electrode and the source side circuit film disposed in the pad area by disposing the organic layer and the encapsulation layer of the organic light emitting device to expose the pad area It is possible to provide an organic light emitting display device including.

Further, according to embodiments of the present invention, an organic light emitting display panel capable of opening a pad area without using a shadow mask by disposing an organic layer material of the organic light emitting device between the encapsulation layer material and the pad electrode, and an organic light emitting display panel including the same An organic light emitting display device may be provided.

In addition, according to embodiments of the present invention, at least one structure surrounding the outer portion of the pad area is disposed so that the pad area does not have an encapsulation layer and a residual film of the organic layer of the organic light emitting device, and an organic light emitting display panel including the same A light emitting display device can be provided.

In addition, according to embodiments of the present invention, the thickness of the encapsulation layer is adjusted using at least one structure disposed in the non-active region, and the encapsulation layer is peeled, thereby preventing the encapsulation layer from lifting and providing reliable organic light emission. An organic light emitting display panel including an element and an organic light emitting display device including the same can be provided.

The above description is merely illustrative of the technical spirit of the present invention, and various modifications and variations will be possible without departing from the essential characteristics of the present invention by those skilled in the art to which the present invention pertains. In addition, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but rather to explain the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

200: first substrate
210: structure
307: planarization layer
350: first electrode
360: organic layer
370: second electrode
380: encapsulation layer

Claims (19)

An organic light emitting display panel comprising an active area in which a plurality of organic light emitting devices are disposed and a non-active area disposed outside the active area and having a pad area, the organic light emitting display panel comprising:
a first substrate; and
at least one pad electrode disposed on the first substrate and provided in the pad region;
an insulating layer disposed to expose a portion of an upper surface of the pad electrode;
a structure disposed on the insulating layer and disposed to surround the pad area;
an organic layer of the organic light emitting device disposed between the active region and the active region and the structure;
an encapsulation layer disposed on the organic layer;
In the non-active area, the organic layer is disposed to expose the pad area and is spaced apart from the side surface of the structure,
The encapsulation layer is disposed to expose the pad area, and surrounds an upper surface and a side surface of the organic layer. The method of claim 1,
and the structure includes a region in which a side slope is negative with respect to the substrate. The method of claim 1,
The width of the lower region of the structure is narrower than the width of the upper region of the organic light emitting display panel. The method of claim 1,
The structure is an organic light emitting display panel having an inverted taper shape. The method of claim 1,
The structure has a closed curve shape,
An organic light emitting display panel having a round shape in at least one corner area. The method of claim 1,
In the non-active region, the thickness of the organic layer and the encapsulation layer becomes thinner as it approaches a side surface of the structure. The method of claim 1,
In the non-active region, the organic layer is disposed to expose a top surface of the insulating layer provided between the pad region and the structure, and to expose the top surface and side surfaces of the structure. 8. The method of claim 7,
In the non-active area, the encapsulation layer is disposed on an upper surface of an insulating layer disposed in an area overlapping the structure outside the structure and on a portion of one side of the structure. 8. The method of claim 7,
The organic layer is further disposed on a portion of an upper surface of the structure. 10. The method of claim 9,
In the non-active region, the encapsulation layer is disposed on an upper surface of an insulating layer provided in an area overlapping the structure outside the structure, one side of the structure, and a portion of the upper surface of the structure. 11. The method of claim 10,
The thickness of the encapsulation layer disposed on the upper surface of the structure is greater than the thickness of the encapsulation layer disposed on the upper surface of the insulating layer provided in a region overlapping the structure at one side of the structure and the outside of the structure. 10. The method of claim 9,
The organic layer is further disposed on a portion of an upper surface of the insulating layer provided between the pad region and the structure. 13. The method of claim 12,
In the non-active region, the encapsulation layer is disposed on an upper surface of an insulating layer provided in a region overlapping the structure at the outer edge of the structure, a side surface of the structure, and an upper surface of the structure,
The organic light emitting display panel is further disposed on a portion of an upper surface of the insulating layer provided between the pad region and the structure. The method of claim 1,
At least one signal line connecting the pad electrode and the active region is disposed in the non-active region;
The structure overlaps the signal line and does not overlap the pad electrode. The method of claim 1,
The encapsulation layer includes an inorganic insulating material. The method of claim 1,
The organic light emitting display panel comprising: an adhesive layer disposed on the encapsulation layer to expose the pad region; and a second substrate disposed on the adhesive layer. An organic light emitting display panel comprising: an organic light emitting display panel including an active area in which a plurality of organic light emitting devices are disposed and a non-active area disposed outside the active area and having a pad area;
a driving circuit for driving the organic light emitting display panel;
Board; and
at least one pad electrode disposed on the substrate and provided in the pad region;
an insulating layer disposed to expose a portion of an upper surface of the pad electrode;
a structure disposed on the insulating layer and disposed to surround the pad area;
an organic layer of the organic light emitting device disposed between the active region and the active region and the structure;
an encapsulation layer disposed on the organic layer in the non-active region;
In the non-active area, the organic layer is disposed to expose the pad area and is spaced apart from the side surface of the structure,
The encapsulation layer is disposed to expose the pad area, and surrounds an upper surface and a side surface of the organic layer. 18. The method of claim 17,
The structure has a closed curve shape,
An organic light emitting diode display having a round shape in at least one corner area. 18. The method of claim 17,
In the non-active region, the thickness of the organic layer and the encapsulation layer becomes thinner as it approaches a side surface of the structure.

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