KR20210062607A - Film forming apparatus, film forming method, and manufacturing method of electronic device - Google Patents

Abstract

The present invention provides a film forming device for forming a film forming material on a substrate through a mask, comprising: a vacuum container; a substrate adsorption means installed in the vacuum container to adsorb and hold the substrate; a mask support unit installed in the vacuum container to support the mask; a magnetic levitation stage mechanism installed in the vacuum container to adjust the position of the substrate adsorption means; and a mask support unit moving mechanism for moving the mask support unit so that the mask support unit approaches or separates in a direction perpendicular to the adsorption surface of the substrate adsorption means.

Description

Film forming apparatus, film forming method, and electronic device manufacturing method {FILM FORMING APPARATUS, FILM FORMING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE}

The present invention relates to a film forming apparatus, a film forming method, and an electronic device manufacturing method.

Organic EL display devices (organic EL displays) are expanding their application fields to VR HMD (Virtual Head Mount Display), as well as smartphones, televisions, and automobile displays. It is required to form a pixel pattern with high precision in order to prevent dizziness.

In the manufacture of an organic EL display device, when forming the organic light emitting device (organic EL device; OLED) constituting the organic EL display device, the film formation material emitted from the film formation source of the film formation device is transferred to a substrate through a mask on which a pixel pattern is formed. By forming a film on, an organic material layer or a metal layer is formed.

In such a film-forming apparatus, in order to increase the film-forming accuracy, the relative position between the substrate and the mask is measured, and if the relative position is shifted, the substrate and/or the mask are relatively moved to adjust the position (alignment).

At the time of such alignment between the substrate and the mask, the operation of approaching or separating the relative distance between the substrate and the mask, and the operation of adjusting the relative positional deviation in the horizontal plane are repeatedly performed, and for this purpose, means for supporting the substrate and/or A drive mechanism for mutually moving the means for supporting the mask is provided in the film forming apparatus.

The present invention improves the configuration of a drive mechanism for moving such a substrate support means and/or a mask support means, thereby efficiently and highly precise the proximity/separation operation between the substrate and the mask during alignment and the relative position adjustment operation in the horizontal plane. It is aimed at what you want to do again.

A film forming apparatus according to an embodiment of the present invention is a film forming apparatus for depositing a film forming material on a substrate through a mask, comprising: a vacuum container; a substrate adsorption means for adsorbing and holding the substrate; , A mask support unit installed in the vacuum container for supporting the mask, a magnetic levitation stage mechanism installed in the vacuum container for adjusting the position of the substrate adsorption means, and an adsorption surface of the substrate adsorption means. And a mask support unit moving mechanism for moving the mask support unit so that the mask support unit is close to or spaced apart from each other in a vertical direction.

In one embodiment of the present invention, a film formation method is a film formation method for depositing a film formation material on a substrate through a mask, the step of supporting a mask carried into the film formation apparatus with a mask support unit, and a substrate carried into the film formation apparatus. Adsorption by the substrate adsorption means, and a relative between the substrate and the mask in a plane parallel to the adsorption surface of the substrate adsorption means while moving the mask support unit to be close to or spaced apart from the substrate adsorption means. An alignment step of adjusting the positional shift, and a step of depositing a film formation material scattered from a film formation source on the substrate through the mask, wherein in the alignment step, the mask support unit is brought close to the substrate adsorption means or The spaced movement is performed by a mask support unit moving mechanism including a drive motor and a drive force transmission mechanism that converts the rotational drive force of the drive motor into a linear drive force and transmits it to the mask support unit. Adjusting the relative positional shift between the substrate and the mask in a plane parallel to the suction surface is performed by adjusting the position of the substrate suction means by a magnetic levitation stage mechanism.

An electronic device manufacturing method according to an embodiment of the present invention is characterized in that an electronic device is manufactured using the film forming method.

Advantageous Effects of Invention According to the present invention, it is possible to efficiently and accurately perform the proximity/separation operation between the substrate and the mask at the time of alignment and the relative position adjustment operation in the horizontal plane.

1 is a schematic diagram of a part of an electronic device manufacturing apparatus.
2 is a schematic diagram of a film forming apparatus according to an embodiment of the present invention.
3A to 3D are schematic diagrams of a magnetic levitation stage mechanism according to an embodiment of the present invention.
4 is a view for explaining the configuration of a mask support unit and a mask support unit lifting mechanism according to an embodiment of the present invention.
Fig. 5 is a diagram showing a configuration of a modified example regarding the installation of a mask pickup.
6 is a schematic diagram showing an electronic device manufactured by a film forming method according to an embodiment of the present invention.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In addition, in the following description, the hardware configuration and software configuration of the device, processing flow, manufacturing conditions, size, material, shape, etc. are intended to limit the scope of the present invention to this, unless otherwise specifically stated. no.

The present invention can be applied to an apparatus for depositing various materials on the surface of a substrate to perform film formation, and can be preferably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum evaporation.

As the material of the substrate, any material such as a semiconductor (eg, silicon), glass, a film of a polymer material, or a metal may be selected. For example, the substrate is a silicon wafer, or a film such as polyimide is laminated on a glass substrate. It may be a substrate. Further, as the film forming material, an arbitrary material such as an organic material and a metallic material (metal, metal oxide, etc.) can be selected.

The present invention can be applied to a film forming apparatus including a sputtering apparatus and a CVD (Chemical Vapor Deposition) apparatus in addition to a vacuum vapor deposition apparatus by heating evaporation. Specifically, the technology of the present invention can be applied to various electronic devices such as semiconductor devices, magnetic devices, and electronic parts, and manufacturing apparatuses such as optical parts. As a specific example of an electronic device, a light emitting element, a photoelectric conversion element, a touch panel, etc. are mentioned.

The present invention is particularly suitably applicable to an apparatus for manufacturing an organic light-emitting element such as an OLED or an organic photoelectric conversion element such as an organic thin-film solar cell. In addition, the electronic device in the present invention includes a display device (e.g., organic EL display device) including a light emitting device, a lighting device (eg, organic EL lighting device), and a sensor (eg, organic CMOS device) including a photoelectric conversion device. Image sensor).

<Electronic device manufacturing apparatus>

1 is a plan view schematically showing a configuration of a part of an electronic device manufacturing apparatus.

The manufacturing apparatus of FIG. 1 is used for manufacturing a display panel of an organic EL display device for a VR HMD, for example. In the case of a display panel for VR HMD, for example, after forming a film for formation of an organic EL element on a silicon wafer of a predetermined size, the silicon wafer is cut out along the region (scribe region) between the element formation regions. It is made from a plurality of small sized panels.

The electronic device manufacturing apparatus according to the present embodiment generally includes a plurality of cluster devices 1 and a relay device that connects the cluster devices 1.

The cluster device 1 includes a film forming device 11 that performs processing (e.g., film forming) on the substrate W, a mask stock device 12 storing a mask before and after use, and a transfer chamber disposed in the center thereof. (13) (transport device) is provided. The transfer chamber 13 is connected to each of the plurality of film forming apparatuses 11 and mask stock apparatuses 12 as shown in FIG. 1.

In the transfer chamber 13, a transfer robot 14 that transfers the substrate W and the mask is disposed. The transfer robot 14 may be, for example, a robot having a structure in which a robot hand holding a substrate W or a mask is mounted on an articulated arm.

In the film forming apparatus 11, the film forming material emitted from the film forming source is deposited on the substrate W through a mask. A series of film formation processes such as transfer of the substrate W with the transfer robot 14, adjustment (alignment) of the relative position of the substrate W and the mask, fixing of the substrate W onto the mask, and film formation, etc. It is performed by the film forming apparatus 11.

In a manufacturing apparatus for manufacturing an organic EL display device, the film forming device 11 can be divided into an organic film forming device and a metal film forming device according to the type of material to be formed, and the organic film forming device is a deposition or sputtering of an organic film forming material. A film is formed on the substrate W by means of a metal film forming apparatus, and a metallic film forming material is deposited on the substrate W by vapor deposition or sputtering.

In a manufacturing apparatus for manufacturing an organic EL display device, which film-forming device is disposed at which position may vary depending on the stacked structure of the organic EL element to be manufactured, and a plurality of layers for forming it according to the stacked structure of the organic EL device A film forming apparatus is arranged.

In the case of an organic EL device, in general, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a cathode are stacked in this order on the substrate W on which the anode is formed. An appropriate film forming apparatus is disposed along the flow direction of the substrate so that the film can be sequentially formed.

For example, in FIG. 1, the film forming apparatus 11a forms a hole injection layer (HIL) and/or a hole transport layer (HTL), the film forming apparatuses 11b and 11f form a blue light-emitting layer, and the film-forming device 11c is a red light-emitting layer. The film forming apparatuses 11d and 11e are arranged to form a green light-emitting layer, the film-forming device 11g is arranged to form an electron transport layer and/or an electron injection layer, and the film-forming device 11h is arranged to form a cathode metal film. In the embodiment shown in Fig. 1, due to the characteristics of the material, the film formation speed of the blue light-emitting layer and the green light-emitting layer is slower than that of the red light-emitting layer. Although the film was formed, the present invention is not limited thereto, and other arrangement structures may be used.

In the mask stock apparatus 12, a new mask and a used mask to be used in the film forming process in the film forming apparatus 11 are divided into a plurality of cassettes and accommodated. The transfer robot 14 transfers the used mask from the film forming apparatus 11 to the cassette of the mask stock apparatus 12, and transfers a new mask stored in the other cassette of the mask stock apparatus 12 to the film forming apparatus 11 Return to.

The relay device that connects the plurality of cluster devices 1 includes a pass chamber 15 for conveying the substrate W between the cluster devices 1.

The transfer robot 14 of the transfer chamber 13 receives the substrate W from the pass chamber 15 on the upstream side, and one of the film deposition apparatuses 11 in the cluster apparatus 1 (e.g., the film deposition apparatus 11a) ) To return. Further, the transfer robot 14 receives the substrate W on which the film formation process in the cluster device 1 has been completed, from one of the plurality of film formation devices 11 (e.g., the film formation device 11b), and is connected to the downstream side. It is conveyed to the pass chamber 15.

In addition to the pass chamber 15, the relay device is a buffer chamber (not shown) for absorbing the difference in the processing speed of the substrate W in the upstream and downstream cluster devices 1 and for changing the direction of the substrate W. It may further include a turning room (not shown). For example, the buffer chamber includes a substrate loading unit for temporarily storing a plurality of substrates W, and the turning chamber includes a substrate rotation mechanism (eg, a rotation stage or a transfer robot) for rotating the substrate W by 180 degrees. Accordingly, in the upstream cluster device and the downstream cluster device, the direction of the substrate W becomes the same, so that the substrate processing is facilitated.

The pass chamber according to an embodiment of the present invention may include a substrate loading portion (not shown) for temporarily loading a plurality of substrates W and a substrate rotating mechanism. That is, the pass chamber 15 may also function as a buffer chamber and a turning chamber.

The film forming apparatus 11, the mask stock apparatus 12, and the transfer chamber 13 constituting the cluster apparatus 1 are maintained in a high vacuum state during the manufacturing process of the organic light emitting element. The pass chamber 15 of the relay device is usually maintained in a low vacuum state, but may be maintained in a high vacuum state if necessary.

The substrate (W) on which the film formation of the plurality of layers constituting the organic EL element has been completed is transferred to a sealing device (not shown) for sealing the organic EL element or a cutting device (not shown) for cutting the substrate into a predetermined panel size. do.

In this embodiment, the configuration of an electronic device manufacturing apparatus has been described with reference to FIG. 1, but the present invention is not limited thereto, and other types of apparatuses or chambers may be provided, and arrangements between these apparatuses or chambers may vary. have.

For example, the electronic device manufacturing apparatus according to an embodiment of the present invention may be of an in-line type instead of the cluster type shown in FIG. 1. That is, it may have a configuration in which a substrate W and a mask are mounted on a carrier to perform film formation while transporting the inside of a plurality of film forming apparatuses arranged in a row. In addition, it may have a structure in which a cluster type and an inline type are combined. For example, the formation of the organic layer may be performed in a cluster-type manufacturing apparatus, and the electrode layer (cathode layer) forming process, a sealing process, a cutting process, and the like may be performed in an in-line-type manufacturing apparatus.

Hereinafter, a specific configuration of the film forming apparatus 11 will be described.

<Film-forming device>

2 is a schematic diagram showing a configuration of a film forming apparatus 11 according to an embodiment of the present invention. In the following description, an XYZ rectangular coordinate system in which the vertical direction is the Z direction and the horizontal plane is the XY plane is used. In addition, the rotation angle around the X axis is expressed _{as θ X} , the rotation angle around the Y axis _{is expressed as θ Y} , and the rotation angle around the Z axis _{is expressed as θ Z.}

FIG. 2 shows an example of a film-forming apparatus 11 which evaporates or sublimates by heating a film-forming material to form a film on a substrate W through a mask M. As shown in FIG.

The film forming apparatus 11 includes a vacuum container 21 maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas, and is installed in the vacuum container 21 so that the position of the substrate W is at least in the X direction, the Y direction, and θ. _{A magnetic levitation stage mechanism 22 for adjusting in the Z} direction, a mask support unit 23 installed in the vacuum container 21 to support the mask M, and a substrate W installed in the vacuum container 21 And a substrate adsorption means 24 for adsorbing and holding a film, and a film forming source 25 installed in the vacuum container 21 to receive a film-forming material and to form particles and discharge the film-forming material at the time of film-forming.

The film forming apparatus 11 according to an embodiment of the present invention may further include a magnetic force applying means 26 for intimate contact with the mask M toward the substrate W by magnetic force.

The vacuum container 21 of the film forming apparatus 11 according to an embodiment of the present invention includes a first vacuum container part 211 in which the magnetic levitation stage mechanism 22 is disposed and a second vacuum container part 211 in which the film forming source 25 is disposed. It includes a vacuum container part 212. In addition to the magnetic levitation stage mechanism 22, a mask support unit 23 and a substrate adsorption means 24 may also be disposed in the first vacuum container portion 211. The vacuum container 21 is maintained in a high vacuum state by, for example, a vacuum pump (not shown) connected to the second vacuum container portion 212.

In addition, a stretchable member 213 is installed between at least the first vacuum container part 211 and the second vacuum container part 212. The expandable member 213 is configured to prevent vibration from a vacuum pump connected to the second vacuum container part 212 or from a floor or floor on which the film forming device 11 is installed, through the second vacuum container part 212. 1 It reduces the transfer to the vacuum container 211. The expandable member 213 may be, for example, a bellows, but the present invention is not limited thereto, and the transmission of vibration between the first vacuum container part 211 and the second vacuum container part 212 can be reduced. One other member may be used.

In order to deposit a fine pattern on a substrate W such as a silicon wafer with high precision, the angle at which the granulated film formation material enters the substrate W through the mask M from the film formation source 25 is increased (i.e. , Incident to the film formation surface of the substrate W almost perpendicularly) is preferable. For this purpose, it is common to increase the distance from the film formation source 25 to the substrate W. In this configuration, since the alignment stage mechanism for adjusting the position of the substrate W is installed at a relatively high place, it is greatly affected by disturbances such as vibration from a vacuum pump or a floor. This lowers the precision of the position adjustment of the substrate by the alignment stage mechanism, lowers the alignment precision of the substrate W with respect to the mask M, and consequently becomes a major factor in lowering the film formation precision.

In order to solve this problem, in the film forming apparatus 11 according to an embodiment of the present invention, the vacuum container 21 is provided with a plurality of container parts (the first vacuum container part 211 and the second vacuum container part 212). ), and by providing the expandable member 213 therebetween, the transmission of external vibration to the first vacuum container portion 211 in which the magnetic levitation stage mechanism 22 is installed is reduced.

The vacuum container 21 further includes a reference plate 214 to which the magnetic levitation stage mechanism 22 is fixedly connected, and a reference plate support 215 for supporting the reference plate 214 to a predetermined height. In an embodiment of the present invention, as shown in FIG. 2, a stretchable member 213 may be further installed between the reference plate 214 and the first vacuum container 211. Through this, it is possible to further reduce the transmission of external vibrations to the magnetic levitation stage mechanism 22 through the reference plate 214.

Between the reference plate support 215 and the mounting base 217 of the film forming apparatus, a vibration suppression unit for reducing the transmission of vibration from the floor or the floor to the reference plate support 215 through the mounting mount 217 of the film forming apparatus ( 216) is installed.

The magnetic levitation stage mechanism 22 is a stage mechanism for adjusting the position of the substrate W or the substrate adsorption means 24 by a magnetic levitation linear motor, at least in the X direction, Y direction, and θ _Z direction, Preferably, the positions of the substrate W or the substrate adsorption means 24 in six directions in the X direction, Y direction, Z direction, θ _X direction, θ _Y direction, and θ _{Z direction are adjusted.}

The magnetic levitation stage mechanism 22 includes a stage reference plate portion (a first plate portion, 221) functioning as a fixed stand, a fine-moving stage plate portion (second plate portion, 222) functioning as a movable stand, and a fine moving stage plate portion ( It includes a magnetic levitation unit 223 for magnetic levitation and movement of the 222 with respect to the stage reference plate portion 221. The specific configuration of the magnetic levitation stage mechanism 22 will be described later with reference to FIG. 3.

The mask holding unit 23 is a means for receiving and holding the mask M that has been conveyed by the conveying robot 14 installed in the conveying chamber 13, and is also referred to as a mask holder.

The mask support unit 23 is provided so as to be able to move up and down at least in the vertical direction (Z direction) by the lifting mechanism. Through this, the distance between the substrate W and the mask M in the vertical direction can be easily adjusted. Further, according to an embodiment of the present invention, the mask support unit 23 may be installed so as to be movable also _{in the horizontal direction (ie, the XYθ Z direction).} A specific configuration of the mask support unit 23 and the lifting mechanism for lifting the mask support unit will be described later with reference to FIG. 4.

The mask M has an opening pattern corresponding to a thin film pattern to be formed on the substrate W, and is supported by the mask support unit 23. For example, the mask M used to manufacture an organic EL display panel for VR HMD includes a fine metal mask, which is a metal mask having a fine opening pattern corresponding to the RGB pixel pattern of the light emitting layer of the organic EL device, It includes an open mask used to form a common layer (hole injection layer, hole transport layer, electron transport layer, electron injection layer, etc.) of an organic EL device.

The opening pattern of the mask M is defined by a blocking pattern that does not allow particles of the film-forming material to pass through.

The substrate adsorption means 24 is a means for adsorbing and holding the substrate W as a film-forming object carried by the transfer robot 14 installed in the transfer chamber 13. The substrate adsorption means 24 is provided on a fine moving stage plate portion 222 that is a movable table of the magnetic levitation stage mechanism 22.

The substrate adsorption means 24 may be, for example, an electrostatic chuck having a structure in which an electric circuit such as a metal electrode is embedded in a matrix of a dielectric/insulator (eg, ceramic material).

The electrostatic chuck as the substrate adsorption means 24 may be a Coulomb-force type electrostatic chuck in which a dielectric having a relatively high resistance is interposed between the electrode and the adsorption surface, and adsorption is performed by the Coulomb force between the electrode and the adherend. It may be a Johnson-Rabeck force type electrostatic chuck where a dielectric with relatively low resistance is interposed between the surfaces and is adsorbed by the Johnson Rabeck force generated between the surface of the dielectric and the object to be adsorbed, and the adsorbed object is adsorbed by a non-uniform electric field. It may be a gradient force type electrostatic chuck.

When the adherend is a conductor or a semiconductor (silicon wafer), it is preferable to use a coulomb force type electrostatic chuck or a Johnson-Ravec force type electrostatic chuck. It is preferable to use a chuck.

The electrostatic chuck may be formed of one plate or may be formed to have a plurality of subplates. In addition, even when formed as a single plate, it has a plurality of electric circuits therein, and the electrostatic manpower may be controlled to be different depending on the position within the single plate.

Although not shown in FIG. 2, the film forming apparatus 11 temporarily holds the substrate W carried in the vacuum container 21 by the transfer robot 14 by the substrate adsorption means 24. A substrate support unit for holding the substrate W may be further included. For example, the substrate support unit may be provided on the mask support unit 23 so as to have a separate substrate support surface, and may be installed so as to elevate in accordance with the elevation of the mask support unit 23.

Although not shown in FIG. 2, a cooling means (e.g., a cooling plate) is installed on the side opposite to the adsorption surface of the substrate adsorption means 24 to suppress the temperature rise of the substrate W, and is deposited on the substrate W. It may be configured to suppress the deterioration or deterioration of the organic material.

The film-forming source 25 is a crucible (not shown) in which the film-forming material to be deposited on the substrate W is accommodated, a heater for heating the crucible (not shown), and the film-forming material is applied to the substrate until the evaporation rate from the film-forming source becomes constant. It includes a shutter (not shown) and the like to prevent scattering by (W). The film formation source 25 may have a variety of configurations depending on a purpose, such as a point film formation source or a linear film formation source.

The film formation source 25 may include a plurality of crucibles for storing different film formation materials. In such a configuration, a plurality of crucibles containing different film-forming materials may be provided so as to be movable to the film-forming position so that the film-forming material can be changed without opening the vacuum container 21 to the atmosphere.

The magnetic force applying means 26 is a means for pulling the mask M toward the substrate W side by magnetic force during the film forming process and making the mask M in close contact with each other, and an elevating mechanism disposed on the upper outside (atmospheric side) of the vacuum container 21 ( 261) is installed so as to be able to move up and down in the vertical direction. For example, the magnetic force applying means 26 may be composed of an electromagnet and/or a permanent magnet.

Although not shown in Fig. 2, the film forming apparatus 11 may include a film thickness monitor (not shown) and a film thickness calculating unit (not shown) for measuring the film thickness deposited on the substrate.

The film forming apparatus 11 according to an embodiment of the present invention is installed on the upper outside (atmospheric side) of the vacuum container 21 for alignment for photographing alignment marks formed on the substrate W and the mask M. It further includes a camera unit (27).

In this embodiment, the alignment camera unit 27 includes a rough alignment camera used to roughly adjust the relative position of the substrate W and the mask M, and the substrate W and the mask M. It may include a camera for fine alignment used to adjust the relative position with high precision.

A camera for rough alignment has a relatively wide viewing angle and low resolution, and a camera for fine alignment is a camera with a narrow viewing angle but high resolution. The camera for rough alignment and the camera for fine alignment are installed at positions corresponding to alignment marks formed on the substrate W and the mask M. For example, the camera for fine alignment may be installed so that four cameras form four rectangular corners, and the camera for rough alignment may be installed at the center of two opposite sides of a rectangle. However, the present invention is not limited thereto, and different arrangements may be made according to the positions of the alignment marks of the substrate W and the mask M.

As shown in FIG. 2, the camera unit 27 for alignment of the film forming apparatus 11 according to an embodiment of the present invention is provided with a vacuum container through the reference plate 214 from the upper atmosphere side of the vacuum container 21. (21) It is installed to come in. To this end, the alignment camera unit 27 includes a vacuum counter (not shown) that surrounds and seals the alignment camera disposed on the atmosphere side.

In this way, by installing the camera for alignment into the vacuum container 21 through the vacuum counterpart, the substrate W and the mask M are relative from the reference plate 214 due to the interposition of the magnetic levitation stage mechanism 22. Even if they are supported away from each other, it is possible to focus on the alignment marks formed on the substrate W and the mask M. The position of the lower end of the vacuum counter can be appropriately determined according to the depth of focus of the alignment camera and the distance the substrate W/mask M is away from the reference plate 214.

Although not shown in FIG. 2, since the inside of the vacuum container 21 that is sealed during the film forming process is dark, in order to photograph the alignment mark by an alignment camera that is inserted into the vacuum container 21, an illumination that illuminates the alignment mark from below A light source may be provided.

The film forming apparatus 11 includes a control unit (not shown). The control unit has functions such as control of conveyance and alignment of the substrate W/mask M, control of film formation, and the like. The control unit may also have a function of controlling the application of voltage to the electrostatic chuck.

The control unit can be configured by, for example, a computer having a processor, memory, storage, I/O, and the like. In this case, the function of the control unit is realized by the processor executing a program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded type computer or a programmable controller (PLC) may be used. Alternatively, some or all of the functions of the control unit may be configured with a circuit such as an ASIC or an FPGA. Further, a control unit may be provided for each film forming apparatus, or one control unit may be configured to control a plurality of film forming apparatuses.

<Magnetic levitation stage mechanism>

3A to 3D are schematic plan views and schematic cross-sectional views of a magnetic levitation stage mechanism 22 according to an embodiment of the present invention.

As described above, the magnetic levitation stage mechanism 22 uses the stage reference plate part 221 functioning as a fixed base, the fine stage plate part 222 functioning as a movable base, and the micro-moving stage plate part 222 as a stage reference. It includes a magnetic levitation unit 223 for magnetic levitation and movement with respect to the plate portion 221.

The stage reference plate portion 221 is a member that serves as a reference for movement of the fine moving stage plate portion 222 and is installed so that the position thereof is fixed. For example, as shown in FIG. 2, the stage reference plate portion 221 is installed so as to be fixed to the reference plate 214 of the vacuum container 21 in parallel to the XY plane. However, the present invention is not limited thereto, and the stage reference plate part 221 is not directly fixed to the reference plate 214 as long as its position can be fixed, but is installed on another member (eg, a separate reference frame) May be.

Since the stage reference plate part 221 is a member that serves as a reference for the movement of the micro-moving stage plate part 222, it is influenced from disturbances such as vibration from the vacuum pump or the floor by the expandable member 213 and the vibration suppression unit 216. It is desirable to be installed so as not to receive.

The micro-moving stage plate part 222 is installed to be movable with respect to the stage reference plate part 221, and a substrate adsorption means 24 such as an electrostatic chuck is installed on one main surface (eg, lower surface) of the micro-moving stage plate part 222 do. Accordingly, the position of the substrate adsorption means 24 and the substrate W adsorbed thereto may be adjusted through the movement of the fine stage plate part 222.

The magnetic levitation unit 223 according to an embodiment of the present invention includes a magnetic levitation linear motor 31 for generating a driving force for moving the fine moving stage plate part 222 as a movable table with respect to the stage reference plate part 221 as a fixed table. ), a position measuring means for measuring the position of the fine moving stage plate part 222, and a fine moving stage plate part by providing a levitation force for floating the fine moving stage plate part 222 relative to the stage reference plate part 221 ( It includes a self-weight compensation means 33 for compensating the gravity applied to the 222, and an origin positioning means 34 for determining the origin position of the fine moving stage plate portion 222.

The magnetic levitation linear motor 31 is a driving source for generating a driving force for moving the fine moving stage plate part 222, for example, for moving the fine moving stage plate part 222 in the X direction, as shown in FIG. 3A. Two X-direction magnetic levitation linear motors 311 generating driving force, two Y-direction magnetic levitation linear motors 312 generating driving force for moving the fine stage plate portion 222 in the Y direction, and a fine moving stage It includes three Z-direction magnetic levitation linear motors 313 that generate driving force for moving the plate portion 222 in the Z-direction.

Each magnetic levitation linear motor 31 includes a stator installed on the stage reference plate portion 221 and a movable member installed on the fine moving stage plate portion 222. The stator of the magnetic levitation linear motor 31 includes a magnetic field generating means, for example, a coil through which a current flows, and the movable member includes a magnetic material, for example, a permanent magnet. That is, as a configuration in which a driving force is applied to the permanent magnet of the mover by a magnetic field generated by passing a current through the coil of the stator, the magnetic levitation linear motor 31 adjusts the direction of the current flowing in the stator to the mover. The direction of the applied force can be adjusted.

In one embodiment of the present invention, using these plurality of magnetic levitation linear motors 31, the fine moving stage plate portion 222 is divided into six degrees of freedom (X direction, Y direction, Z direction, θ _X direction, θ _Y Direction, θ _Z direction).

The magnetic levitation unit 223 according to an embodiment of the present invention includes a position measuring means for measuring the position of the fine moving stage plate part 222, and the fine moving stage plate part 222 on the stage reference plate part 221. It may further include a self-weight compensation means 33 for compensating the gravity applied to the fine-moving stage plate portion 222 by providing a levitation force to levitate against.

The position measuring means for measuring the position of the fine moving stage plate part 222 includes a laser interferometer 32 and a reflecting part 324 provided on the fine moving stage plate part 222 so as to face it. That is, the measurement beam is irradiated from the laser interferometer 32 toward the reflecting unit 324 provided in the fine moving stage plate unit 222, and the reflected beam is detected to measure the position of the fine moving stage plate unit 222. The laser interferometer 32 and the reflecting unit 324 may be installed in each direction of the micro-moving stage plate unit 222 (the X-direction laser interferometer 321 and the X-direction reflecting unit 3241 disposed opposite to the laser interferometer 321). , Y-direction laser interferometer 322 and Y-direction reflector 3242 disposed opposite to it, Z-direction laser interferometer 323 and Z-direction reflector 3243 disposed opposite to it, thereby six degrees of freedom In (degree of freedom), the position of the fine moving stage plate portion 222 can be accurately measured.

The control unit of the film forming apparatus 11 controls the magnetic levitation linear motor 31 based on the position information of the micro-moving stage plate portion 222 (or the substrate adsorption unit 24 installed therein) measured by the position measuring means. As a result, the micro-moving stage plate portion 222 (or the substrate adsorption means 24 provided thereto) is moved to the positioning target position determined by the relative positional shift amount between the substrate W and the mask M. Accordingly, the position of the micro-moving stage plate portion 222 (or the substrate adsorption means 24 installed thereon) can be controlled with high precision in nano units.

The self-weight compensation means 33 is a means for compensating the weight of the fine moving stage plate portion 222. That is, by using the repulsive force or suction force between the first magnet portion 331 installed on the stage reference plate portion 221 side and the second magnet portion 332 installed on the fine moving stage plate portion 222 side, the fine moving stage plate portion ( By providing a levitation force of a magnitude corresponding to the gravity applied to the 222, the gravity applied to the fine moving stage plate portion 222 is canceled.

As described above, in the film forming apparatus according to an embodiment of the present invention, by employing the self-weight compensation means 33, the load of the magnetic levitation linear motor 31 is reduced, and the heat generated from the magnetic levitation linear motor 31 is reduced. Can be reduced. Thereby, it is possible to suppress the thermal denaturation of the organic material deposited on the substrate W.

That is, when trying to support the weight of the fine moving stage plate portion 222 only with the Z-direction magnetic levitation linear motor 313 without using the self-weight compensation means 33, an excessive load is applied to the Z-direction magnetic levitation linear motor 313 A considerable amount of heat is generated, and there is a concern that this may cause degeneration of the organic material deposited on the substrate W. In this embodiment, since the gravity applied to the fine-moving stage plate portion 222 is canceled by the self-weight compensation means 33, the Z-direction magnetic levitation linear motor is the fine-moving stage plate portion 222 floating by the self-weight compensation means 33. ), only the driving force for fine movement in the Z direction is provided, so the load is reduced.

The magnetic levitation unit 223 according to an embodiment of the present invention may further include an origin positioning means 34 for determining an origin position of the fine moving stage plate portion 222. That is, for example, as shown in FIG. 3C, a triangular pyramid-shaped groove 341 provided on the stage reference plate portion 221 side, and a hemispherical protrusion 342 provided on the fine moving stage plate portion 222 side. When the hemispherical protrusion 342 is inserted into the triangular pyramid-shaped groove 341 by configuring a kinematic coupling, the hemispherical protrusion 342 is formed in the triangular pyramid-shaped groove at three points. By contacting the inner surface of 341), the position of the fine moving stage plate portion 222 can be determined.

Three such kinematic coupling-type origin positioning means 34 at equal intervals (e.g., 120° intervals) symmetrically around the center of the micro-moving stage plate portion 222, as shown in FIG. 3A. By installing, the position of the center of the fine moving stage plate portion 222 can be determined to be constant.

<Mask support unit and mask support unit lifting mechanism>

As described above, in the present invention, during the alignment operation with the mask M, as a means for moving the substrate adsorption means 24 and the substrate W adsorbed thereto relative to the mask M, the motor and the ball screw / Instead of a mechanical alignment stage using a linear guide or the like, a magnetic levitation stage mechanism 22 is employed. Therefore, compared to the conventional mechanical control method, it is possible to improve the precision of the position adjustment of the substrate W with respect to the mask M.

Further, unlike the mechanical stage mechanism, the magnetic levitation stage mechanism 22 is less likely to be contaminated by particles or contaminated by evaporation of the lubricant, and thus can be installed in the vacuum container 21. Thereby, since the distance between the holding means of the substrate W, that is, the substrate adsorption means 24 and the stage mechanism, is reduced, the influence of the fluctuation or disturbance at the time of driving the stage mechanism affects the substrate adsorption means 24 It becomes possible to suppress the amplification.

On the other hand, with the magnetic levitation stage mechanism 22 as a means of moving the substrate adsorption means 24 (and the substrate W adsorbed thereto), a means for approaching or separating the mask M toward the substrate W As the lifting mechanism of the in-mask support unit 23, the present invention employs a mechanical lifting drive mechanism constituted by a motor, a ball screw/guide, or the like. That is, a magnetic levitation stage mechanism as a substrate moving device and a mechanical stage lifting mechanism as a mask moving mechanism are used in combination.

As will be described later, at the time of alignment between the substrate W and the mask M, an operation of approaching or separating the relative distance between the substrate W and the mask M is repeatedly performed.

In order to adjust the relative distance (interval between the substrate and the mask) in the vertical direction (Z direction) between the substrate W and the mask M, the present invention makes the mask M a moving object. That is, the mask support unit 23 supporting the mask M is lifted and lowered using an elevating mechanism to adjust the relative distance in the Z direction with the substrate W, and the mask support unit elevating mechanism at this time is mechanical Use the stage lifting mechanism.

In connection with the movement in the Z direction, the substrate W is masked by using the Z-direction magnetic levitation linear motor 313 among the magnetic levitation linear motors 31 that magnetically levitate the substrate adsorption means 24. Although it may be considered to relatively raise and lower toward, as described above, there is a limit to the possible elevation range using a magnetic levitation linear motor. That is, as described above, the micro-moving stage plate portion 222 on which the substrate adsorption means 24 is installed is supported by only a magnetic levitation linear motor, and furthermore, it is in proximity (including contact) and spaced apart state with the mask M. In the case of moving a relatively long distance for conversion of the magnetic levitation linear motor, excessive load is applied to the magnetic levitation linear motor, and the organic material deposited on the substrate W is denatured due to the heat generated at this time. I can. Accordingly, the weight of the fine-moving stage plate part 222 is offset by installing a separate self-weight compensation means 33, and a magnetic levitation linear motor enables fine movement of the fine-moving stage plate part 222 in a magnetic levitation state. It is intended to provide only the driving force to be used.

Referring to FIG. 4, detailed configurations of the mask support unit 23 supporting the mask M and the mask support unit lifting mechanism for lifting the mask support unit 23 will be described. For convenience of understanding, in FIG. 4, the second vacuum container portion in which the film formation source described in FIG. 2 is disposed, a magnetic force applying means disposed above the magnetic levitation stage mechanism, and an elevating mechanism thereof, an alignment camera unit, etc. The city is omitted.

A mask support unit lifting mechanism 231 for lifting the mask support unit 23 up and down in the Z direction is provided on the upper outside (atmospheric side) of the vacuum container 21, that is, on the reference plate 214.

The mask support unit lifting mechanism 231 is a linear guide as a driving force transmission mechanism for transmitting the driving force of the mask support unit lifting drive motor 2311 and the mask support unit lifting drive motor 2311 to the mask support unit 23. Including (2312). In the present embodiment, the linear guide 2312 is used as the lifting driving force transmission mechanism of the mask support unit, but the present invention is not limited thereto, and a ball screw or the like may be used.

The mask support unit 23 (and the mask M supported thereon) is raised and lowered in the vertical direction (Z direction) by such a mask support unit lifting mechanism 231, so that during the alignment operation, the substrate W and the mask M The relative distance between) can be easily adjusted.

The mask support unit 23 may be installed so as to be movable in a horizontal direction (that is, in the XYθ _{Z direction) in addition to the lifting in the Z direction.} To this end, the mask support unit lifting mechanism 231 is mounted on the alignment stage 232. The alignment stage 232 receives a driving force in _{the horizontal direction (XYθ Z} direction) through a linear guide from the alignment stage driving motor 2321 fixed to the outer upper surface of the vacuum container 21. That is, a guide rail (not shown) is fixedly installed on the outer upper surface of the vacuum container 21, a linear block is movably installed on the guide rail, and an alignment stage 232 is mounted on the linear block. _{Therefore, by moving the linear block in the horizontal direction (XYθ Z} direction) by the driving force from the alignment stage driving motor 2321 fixed to the outer upper surface of the vacuum container 21, the alignment stage 232 and the alignment stage 232 ) The mask support unit lifting mechanism 231 mounted on it can be moved in the _{horizontal direction (XYθ Z direction) as a whole.}

Through the movement of the mask support unit 23 in the horizontal direction (i.e., the XYθ _Z direction), even when the mask M deviates from the field of view of the alignment camera in the case of rough alignment to be described later, it can be quickly moved into the field of view. I can.

The mask support unit 23 further includes a mask pickup 233 for temporarily receiving the mask M carried into the vacuum container 21 by the transfer robot 14.

The mask pickup 233 is configured to be able to move up and down relatively with respect to the mask support surface of the mask support unit 23. For example, as shown, the mask pickup 233 is relative to the mask support surface of the mask support unit 23 by the mask pickup lifting mechanism 2331 disposed on the upper outside (atmospheric side) of the vacuum container 21. It can be configured to elevate. The mask pickup lifting mechanism 2331 is mounted on the alignment stage 232 similarly to the mask support unit lifting mechanism 231 described above, and when the alignment stage 232 moves in the horizontal direction (XYθ _Z direction), It can be moved in the _{horizontal direction (XYθ Z} direction) together with the mask support unit lifting mechanism 231.

In a state in which the mask pickup 233 is relatively raised from the mask support surface of the mask support unit 23, the hand of the transfer robot 14 on which the mask M is placed enters the film forming apparatus 11. Subsequently, the hand of the transfer robot 14 descends toward the mask pickup 233 to place the mask M on the mask pickup 233, and the hand of the transfer robot 14 retracts out of the film forming apparatus 11. . Subsequently, the mask pickup 233 having received the mask M is relatively lowered toward the mask supporting surface of the mask supporting unit 23 to lower the mask M on the mask supporting unit 23. In this way, when the mounting of the mask M on the mask support unit 23 is completed, alignment with the substrate W described later is performed, and then film formation is performed. In the case of carrying out the used mask M, through the reverse process, the mask M is lifted from the mask support surface of the mask support unit 23 by the mask pickup 233, and then the transfer robot 14 The mask M is taken out to the outside of the film forming apparatus 11 through the hand of.

As described above, in the present invention, by using the magnetic levitation stage mechanism as the substrate moving means and the mechanical stage lifting mechanism as the mask moving mechanism in combination, the proximity/separation operation between the substrate W and the mask M at the time of alignment. And the relative position adjustment operation in the horizontal plane can be performed efficiently and with high precision.

In the above description, a configuration in which the mask pickup 233 moves up and down relative to the mask support surface of the mask support unit 23 by the mask pickup lifting mechanism 2331 has been described, but the present invention is not limited thereto. That is, as long as the mask support surfaces of the mask pickup 233 and the mask support unit 23 are relatively elevating, they may be configured differently. 5 shows a configuration of a modified example regarding the installation of such a mask pickup 233. As shown in FIG.

That is, as shown in FIG. 5, the mask pickup 233 is fixed to the reference plate 214 and installed (or fixed to the stage reference plate 221 of the magnetic levitation stage mechanism 22). Instead of, by raising and lowering the mask support unit 23, the mask pickup 233 may be configured to be raised and lowered relative to the mask support surface of the mask support unit 23. Alternatively, it is also possible to configure both the mask pickup 233 and the mask support unit 23 to be elevating and descending by combining the configurations of the above embodiment and the modified example.

In addition, in the above-described embodiment, a configuration in which the mask support unit lifting mechanism 231 for lifting the mask support unit 23 is disposed on the upper outside (atmospheric side) of the first vacuum container part 211 has been described. It is not limited thereto, and for example, the outer atmosphere between the first vacuum container 211 and the second vacuum container part 212 connected by the lower air side of the first vacuum container 211 (extensible member 213) Area). In other words, the mask support unit lifting mechanism may be disposed below the mask support unit 23 in the vertical direction.

<Alignment method>

Hereinafter, an alignment method for adjusting the relative position between the substrate W and the mask M using the magnetic levitation stage mechanism 22 of the present invention will be described.

First, the mask M and the substrate W are carried into the film forming apparatus 11 and supported by the mask support unit 23 and the substrate support unit, respectively. When the mask M is received by the mask support unit 23, as described above, relative elevation between the mask pickup 233 and the mask support surface of the mask support unit 23 is performed, and the mask M becomes a mask. It is received and supported by the support unit 23.

The substrate W supported by the substrate support unit is moved toward the substrate adsorption means 24 provided in the fine moving stage plate portion 222 of the magnetic levitation stage mechanism 22. At this time, by pulling the fine moving stage plate portion 222 of the magnetic levitation stage mechanism 22 toward the stage reference plate portion 221 by the Z-direction magnetic levitation linear motor 313, the origin positioning means 34 As a result, the position of the origin of the fine stage plate portion 222 is measured by the laser interferometer 32.

When the substrate W is sufficiently close to the substrate adsorption means 24, a substrate adsorption voltage is applied to the substrate adsorption means 24, and the substrate W is adsorbed to the substrate adsorption means 24 by electrostatic force. In adsorbing the substrate W to the substrate adsorption means 24, the entire surface of the substrate W may be simultaneously adsorbed on the entire adsorption surface of the substrate adsorption means 24, and a plurality of regions of the substrate adsorption means 24 The substrate W may be sequentially adsorbed from one of the regions toward the other region.

Subsequently, the control unit of the film forming apparatus 11 drives the mask support unit lifting mechanism 231 to make the substrate adsorption means 24 and the mask support unit 23 relatively close to each other. At this time, the control unit is configured until the distance d between the substrate W adsorbed by the substrate adsorbing means 24 and the mask M supported by the mask support unit 23 becomes a preset rough alignment measurement distance. , The substrate adsorption means 24 and the mask support unit 23 are relatively approached (for example, the mask support unit 23 is raised).

When the distance between the substrate (W) and the mask (M) with a predetermined rough alignment measurement distance, by for rough alignment camera, to image the alignment marks of the substrate (W) and the mask (M), in the XYθ _Z direction The relative position of the substrate W and the mask M is measured, and the relative positional displacement amount between them is calculated based on this.

The control unit is based on the position of the fine moving stage plate unit 222 or the substrate adsorption means 24 measured by the laser interferometer 32 and the positional displacement amount calculated by the rough alignment camera, the fine moving stage plate unit 222 Alternatively, the coordinates of the moving target position of the substrate adsorption means 24 are calculated.

_{Based on the coordinates of the moving target position, the fine moving stage plate part 222 in the XYθ Z} direction by the magnetic levitation linear motor 31 while measuring the position of the fine moving stage plate part 222 with the laser interferometer 32 or By driving the substrate adsorption means 24 to the movement target position, the relative position of the substrate W and the mask M is adjusted. In the rough alignment, in addition to moving the fine-moving stage plate part 222 by the magnetic levitation linear motor 31 as described above, the mask is supported as described above according to the amount of positional displacement between the substrate W and the mask M. by the movement of the unit 23 to the XYθ _Z direction, the rough alignment may be performed.

When the rough alignment is completed, the mask support unit 23 is further raised by the mask support unit lifting mechanism 231 so that the mask M comes to a fine alignment measurement position with respect to the substrate W.

When the mask M comes to the fine alignment measurement position with respect to the substrate W, the alignment mark between the substrate W and the mask M is photographed with a fine alignment camera, and the relative displacement in the _{XYθ Z direction is measured.} .

When the relative positional deviation between the substrate W and the mask M at the fine alignment measurement position is greater than a predetermined threshold, the mask M is lowered again by driving the mask support unit lifting mechanism 231, and the substrate W ) And the mask (M) are spaced apart from each other, based on the position of the fine stage plate portion 222 measured by the laser interferometer 32 and the relative positional displacement between the substrate (W) and the mask (M), The moving target position of the fine stage plate part 222 is calculated.

Based on the calculated movement target position, while measuring the position of the fine moving stage plate unit 222 by the laser interferometer 32, the fine moving stage plate unit 222 is moved in the XYθ _Z direction by the magnetic levitation linear motor 31. By driving to the movement target position, the relative position of the substrate W and the mask M is adjusted.

This process is repeated until the amount of relative positional shift between the substrate W and the mask M becomes smaller than a predetermined threshold.

When the relative positional deviation between the substrate W and the mask M is smaller than a predetermined threshold, the deposition position in which the deposition surface of the substrate W adsorbed by the substrate adsorption means 24 contacts the upper surface of the mask M As much as possible, the mask support unit 23 is raised.

When the deposition position where the substrate W and the mask M are in contact is reached, the magnetic force application means 26 is lowered and the mask M is pulled over the substrate W, thereby forming the substrate W and the mask M. Make it close together.

In this process, in order to check whether a positional displacement between the substrate W and the mask M in the XYθ _Z direction has occurred, a fine alignment camera is used to measure the relative position between the substrate W and the mask M. , When the measured deviation of the relative position is more than a predetermined threshold, the substrate W and the mask M are separated again by a predetermined distance (for example, the mask support unit 23 is lowered), and then the substrate W and the mask M are separated from each other by a predetermined distance. The relative positions between the masks M are adjusted (S55), and the same process is repeated.

In the state where the substrate W and the mask M are positioned at the evaporation position, when the amount of the relative positional shift between the substrate W and the mask M is smaller than a predetermined threshold, the film forming process is started.

<Method of film formation>

Hereinafter, a film forming method employing an alignment method according to an embodiment of the present invention will be described.

In the state where the mask M is supported by the mask support unit 23 in the vacuum container 21, the transfer robot 14 of the transfer chamber 13 moves the substrate ( W) is brought in.

The hand of the transfer robot 14 entering the vacuum container 21 places the substrate W on the support portion of the substrate support unit.

After the substrate support unit is sufficiently close to or in contact with the substrate adsorption means 24, a substrate adsorption voltage is applied to the substrate adsorption means 24 to adsorb the substrate W.

In a state in which the substrate W is adsorbed by the substrate adsorbing means 24, the alignment process is performed according to the above-described alignment method according to the present embodiment.

According to the alignment method of the present embodiment, when the relative position shift amount between the substrate W and the mask M is smaller than a predetermined threshold, the shutter of the film forming source 25 is opened, and the film forming material is transferred to the substrate W through the mask. To the tabernacle.

After the film is formed to a desired thickness, the mask M is separated by raising the magnetic force applying means 26, and the mask supporting unit 23 is lowered.

Subsequently, the hand of the transfer robot 14 enters the vacuum container 21 of the film forming apparatus 11, and a zero (0) or reverse polarity substrate separation voltage is applied to the electrode portion of the substrate adsorption means 24, Separate (W) from the substrate adsorption means (24). The separated substrate is taken out from the vacuum container 21 by the transfer robot 14.

In the above description, the film forming apparatus 11 has a configuration of a so-called depo-up method in which the film is formed while the film forming surface of the substrate W faces downward in the vertical direction, but is not limited thereto. A configuration may be employed in which (W) is disposed in a state vertically erected on the side surface of the vacuum container 21, and film formation is performed in a state in which the film-forming surface of the substrate W is parallel to the direction of gravity.

<Method of manufacturing electronic device>

Next, an example of a method of manufacturing an electronic device using the film forming apparatus of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device are illustrated as examples of electronic devices.

First, an organic EL display device to be manufactured will be described. Fig. 6(a) is an overall view of the organic EL display device 60, and Fig. 6(b) shows a cross-sectional structure of one pixel.

As shown in Fig. 6A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix form. Details will be described later, but each of the light emitting devices has a structure including an organic layer sandwiched between a pair of electrodes. In addition, the pixel referred to herein refers to a minimum unit capable of displaying a desired color in the display area 61. In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that exhibit different light emission. Has been. The pixel 62 is often composed of a combination of a red light-emitting device, a green light-emitting device, and a blue light-emitting device, but may be a combination of a yellow light-emitting device, a cyan light-emitting device, and a white light-emitting device. no.

Fig. 6(b) is a schematic partial cross-sectional view taken along line A-B in Fig. 6(a). The pixel 62 has an organic EL element including an anode 64, a hole transport layer 65, an emission layer 66R, 66G, 66B, an electron transport layer 67, and a cathode 68 on the substrate 63. . Among these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In addition, in this embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements (also referred to as organic EL elements) emitting red, green, and blue colors, respectively. In addition, the anode 64 is formed separately for each light emitting device. The hole transport layer 65, the electron transport layer 67, and the cathode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, 62B, or may be formed for each light emitting element. Further, in order to prevent the anode 64 and the cathode 68 from being short-circuited by foreign substances, an insulating layer 69 is provided between the anode 64. Further, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture or oxygen is provided.

In FIG. 6(b), the hole transport layer 65 or the electron transport layer 67 is illustrated as one layer, but depending on the structure of the organic EL display device, a plurality of layers including a hole block layer or an electron block layer may be formed. May be. In addition, a hole injection layer having an energy band structure capable of smoothly injecting holes from the anode 64 to the hole transport layer 65 may be formed between the anode 64 and the hole transport layer 65. . Likewise, an electron injection layer may be formed between the cathode 68 and the electron transport layer 67.

Next, an example of a method of manufacturing an organic EL display device will be described in detail.

First, a substrate 63 on which a circuit (not shown) for driving an organic EL display device and an anode 64 are formed is prepared.

On the substrate 63 on which the anode 64 is formed, an acrylic resin is formed by spin coating, and the acrylic resin is patterned to form an opening in the portion where the anode 64 is formed by a lithography method to form the insulating layer 69. This opening corresponds to a light-emitting region in which the light-emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is carried into the first organic material film forming apparatus, and the substrate is held with an electrostatic chuck, and the hole transport layer 65 is formed as a common layer on the anode 64 in the display area. do. The hole transport layer 65 is formed by vacuum evaporation. Actually, since the hole transport layer 65 is formed to have a size larger than that of the display area 61, a high-precision mask is not required.

Next, the substrate 63 formed up to the hole transport layer 65 is carried into the second organic material film forming apparatus, and is held by an electrostatic chuck. The substrate and the mask are aligned, and a light emitting layer 66R emitting red is formed on a portion of the substrate 63 in which an element emitting red is disposed.

Similar to the deposition of the light-emitting layer 66R, the light-emitting layer 66G emitting green is formed by the third organic material film forming apparatus, and further, the light-emitting layer 66B emitting blue color is formed by the fourth organic material film-forming device. After the formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display region 61 by the fifth organic material film forming apparatus. The electron transport layer 67 is formed as a layer common to the three-color light emitting layers 66R, 66G, and 66B.

The substrate formed up to the electron transport layer 67 is transferred to a metal material film forming apparatus to form a cathode 68. At this time, the metal material film forming apparatus may be a film forming apparatus of a heat evaporation method or a film forming apparatus of a sputtering method.

After that, it is transferred to a plasma CVD device to form a protective layer 70 to complete the organic EL display device 60.

From the time when the substrate 63 on which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, when exposed to an atmosphere containing moisture or oxygen, the light-emitting layer made of an organic EL material is formed. There is a risk of deterioration due to moisture or oxygen. Therefore, in this example, the carrying in and carrying out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

The above embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, and may be appropriately modified within the scope of the technical idea.

11: tabernacle device
21: vacuum vessel
22: magnetic levitation stage mechanism
23: mask support unit
231: mask support unit lifting mechanism
232: alignment stage
233: mask pickup
2331: mask pickup lifting mechanism
24: substrate adsorption means

Claims (11)

A film forming apparatus for forming a film on a substrate through a mask,
A vacuum vessel,
A substrate adsorption means installed in the vacuum container and having an adsorption surface for adsorbing the substrate so that the film-forming surface of the substrate faces downward in a vertical direction;
A mask support unit installed in the vacuum container and configured to support the mask,
A film-forming source installed in the film-forming container and discharging a film-forming material;
And magnetic levitation means for floating the substrate adsorption means by magnetic force and for moving the substrate adsorption means in a first direction along the adsorption surface by magnetic force. The method of claim 1,
The magnetic levitation means,
A linear motor for generating a driving force for moving the substrate adsorption means in the first direction,
And a magnetic force generating unit that provides a levitation force for floating the substrate adsorption means. The method of claim 1,
The magnetic levitation means moves the substrate adsorption means by magnetic force in a second direction crossing the first direction and along the adsorption surface, and in a direction perpendicular to the adsorption surface. The method of claim 1,
The magnetic levitation means may magnetically force the substrate adsorption means in either the first direction, or a second direction along the adsorption surface and perpendicular to the adsorption surface as an axis. A film forming apparatus characterized by being rotated by means of. The method of claim 1,
And a position detecting means for detecting a position of the substrate adsorbing means. The method of claim 1,
The substrate adsorption means has an electrostatic chuck for adsorbing the substrate by electrostatic force. The method of claim 1,
And a mask support unit moving mechanism for moving the mask support unit so that the mask support unit is close to or spaced apart from each other in a direction perpendicular to the adsorption surface,
The mask support unit moving mechanism includes a driving motor and a driving force transmission mechanism for converting a rotational driving force of the driving motor into a linear driving force and transmitting it to the mask support unit. The method of claim 7,
And the mask support unit moving mechanism is mounted on a stage mechanism for moving the mask support unit in a plane parallel to the adsorption surface of the substrate adsorption means. The method of claim 7,
And the mask support unit moving mechanism and the stage mechanism are provided on an external atmosphere side of the vacuum container opposite to the mask support unit with the substrate adsorption means therebetween. A film formation method comprising a step of forming a film on a substrate through a mask using the film formation apparatus according to any one of claims 1 to 9. An electronic device manufacturing method comprising a step of forming a film on a substrate through a mask using the film forming apparatus according to any one of claims 1 to 9.

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