KR20210059825A - Apparatus for manufacturing Particles - Google Patents

Abstract

The present invention relates to an apparatus for preparing silicon oxide particles. The apparatus according to the present invention includes: a main body unit; a receiving unit disposed inside the main body unit, opened at the top and having an internal space; a mounting unit disposed in the internal space of the receiving unit for mounting powder containing silicon and silicon oxide therein; a heating unit disposed in the main body unit and configured to heat the receiving unit to melt the powder so that silicon oxide gas may be evaporated from the molten powder; a collection unit linked to the main body unit and configured to collect the particles contained in the evaporated silicon oxide gas; and a gas supplying unit linked to the receiving unit and configured to supply a carrier gas from the bottom of the loading unit upwardly to force the evaporated silicon oxide gas to flow toward the collection unit.

Description

Silicon oxide particle manufacturing apparatus {Apparatus for manufacturing Particles}

The present invention relates to an apparatus for producing silicon oxide particles.

In general, silicon (Si) or silicon oxide (SiOx) is used as a photoelectric conversion and photoconversion material such as a solar cell, a lithium ion secondary battery negative electrode material, and a light emitting device (LED).

The silicon oxide as described above is manufactured through a wet method or a dry method.

Most of the wet method uses a sol-gel method. Since the wet method undergoes a multi-step chemical process of several tens of hours, mass production is difficult and the particle composition of silicon oxide is non-uniform.

In addition, in the dry method, silicon oxide gas is generated through a steam furnace or plasma such as a high temperature crucible. In the drying method, the silicon oxide gas generated as described above is cooled and agglomerated and recovered as fine particles.

As the silicon is heated in the crucible, it forms a silicon oxide gas and evaporates. Silicon oxide particles are contained in the evaporating silicon oxide gas.

In the oxide gas, silicon oxide particles are moved to the collecting portion by the flow of the gas.

In this case, when the silicon oxide particles are moved only depending on the flow of the evaporated gas, they are deposited on the inner wall of the chamber of the device including the crucible, so that the silicon oxide particles cannot be efficiently collected.

Accordingly, in recent years, there is a need to develop a technology capable of forcing the flow of silicon oxide gas and increasing the collection rate without changing the properties of the particles.

Korean Patent Application Publication No. 10-2014-0098547 (Publication date: August 08, 2014)

It is an object of the present invention to provide a silicon oxide particle manufacturing apparatus capable of increasing the collecting rate of silicon oxide particles by forcibly moving the flow of the evaporated silicon oxide gas to the collecting portion.

In addition, another object of the present invention is to provide a silicon oxide particle manufacturing apparatus capable of preventing a change in intrinsic properties of the particles by preventing evaporation of the silicon oxide gas from being deposited on the inner wall of the chamber.

In order to achieve the above object, the present invention comprises a device body; A receiving portion disposed inside the device body portion and having an upper portion open and an inner space formed therein; A seating portion disposed in the inner space of the receiving portion and on which a powder including silicon and silicon oxide is seated; A heating unit disposed in the body of the apparatus and heating the receiving unit to melt the powder, thereby evaporating silicon oxide gas from the molten powder; A collecting unit connected to the device body and collecting particles contained in the evaporated silicon oxide gas; And a gas supply unit connected to the receiving unit and supplying a carrier gas from a lower portion of the seating unit along the upper side to forcibly flow the evaporated silicon oxide gas to the collecting unit. .

Here, the seating portion may include a support member having a hollow shape whose lower end is supported on the bottom surface of the inner space of the receiving portion, and a seating plate disposed on the upper end of the support member, forming spray holes, and seating the powder. have.

According to the above solution, the apparatus for producing silicon oxide particles according to the present invention has the effect of increasing the collecting rate of silicon oxide particles by forcibly moving the flow of the evaporated silicon oxide gas to the collecting unit.

In addition, the silicon oxide particle manufacturing apparatus according to the present invention has an effect of preventing a change in intrinsic properties of the particles by preventing silicon oxide gas from being deposited on the inner wall of the chamber.

1 is a view showing the overall configuration of a silicon oxide particle manufacturing apparatus according to the present invention.
2 is a perspective view showing an arrangement configuration of a receiving portion, a seating portion, and a collecting member according to the present invention.
3 is a cross-sectional view showing the configuration of a silicon oxide particle manufacturing apparatus according to the present invention.
4 is a cross-sectional view showing a first example of a seating unit according to the present invention.
5 is a cross-sectional view showing the seating plate of FIG. 4.
6 is a cross-sectional view showing a second example of a seating unit according to the present invention.
7 is a view showing an example of the hole size of the injection hole according to the present invention.
8 is a cross-sectional view showing another example of the seating plate according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings so that those of ordinary skill in the art may easily implement the present invention.

The present invention may be implemented in various different forms and is not limited to the embodiments described herein.

In order to clearly describe the present invention, parts irrelevant to the description have been omitted, and the same reference numerals are attached to the same or similar components throughout the specification.

Hereinafter, it means that an arbitrary configuration is provided or disposed on the "top (or bottom)" of the base material or the "top (or bottom)" of the base material is provided or disposed in contact with the top (or bottom) of the base material. Means that.

In addition, it is not limited to not including other configurations between the base material and any configurations provided or disposed on (or under) the base material.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings so that those of ordinary skill in the art may easily implement the present invention.

The present invention may be implemented in various different forms and is not limited to the embodiments described herein.

In order to clearly describe the present invention, parts irrelevant to the description have been omitted, and the same reference numerals are attached to the same or similar components throughout the specification.

Hereinafter, it means that an arbitrary configuration is provided or disposed on the "top (or bottom)" of the base material or the "top (or bottom)" of the base material is provided or disposed in contact with the top (or bottom) of the base material. Means that.

In addition, it is not limited to not including other configurations between the base material and any configurations provided or disposed on (or under) the base material.

Hereinafter, an apparatus for manufacturing silicon oxide particles according to the present invention will be described with reference to the accompanying drawings.

1 is a view showing the overall configuration of a silicon oxide particle manufacturing apparatus according to the present invention. 2 is a perspective view showing an arrangement configuration of a receiving portion, a seating portion, and a collecting member according to the present invention. 3 is a cross-sectional view showing the configuration of a silicon oxide particle manufacturing apparatus according to the present invention.

1 to 3, the silicon oxide particle manufacturing apparatus according to the present invention is largely a device body part 100, a receiving part 200, a seating part 300, a heating part 400, and a collecting part. It has 500 and a gas supply part 600.

Each of the above configurations will be described.

Device body part (100)

The device body 100 is a chamber in which a space is formed.

Receptacle

The receiving part 200 according to the present invention is disposed in the inner space of the device body part 100. It is preferable that the receiving part 200 is a graphite crucible.

An inner space is formed in the receiving part 200. The upper end of the receiving part 200 is opened.

Heating part 400

The heating part 400 according to the present invention may be installed to surround the outer periphery of the receiving part 200. The heating unit 400 receives a predetermined current from the outside and heats the receiving unit 200 to a predetermined temperature.

In addition, the outer periphery of the heating unit 400 may be surrounded by the insulator 110.

The heating unit 400 heats the powder including silicon and silicon oxide mounted on the mounting plate 320 to be described later to a set temperature to melt the powder. Accordingly, the silicon oxide gas may be evaporated from the molten powder.

Seating part (300)

4 is a cross-sectional view showing a first example of a seating unit according to the present invention. 5 is a cross-sectional view showing the seating plate of FIG. 4.

1 to 5, the seating part 300 according to the present invention is disposed in the inner space of the receiving part 200.

The seating part 300 according to the present invention has a support member 310 forming a hollow and a seating plate 320.

The support member 310 achieves a set height. The lower end of the support member 310 is fixed to the bottom of the inner space of the receiving part 200.

Although not shown in the drawings, the lower end of the support member 310 may be fitted and fixed in a groove formed in the bottom of the inner space of the receiving part 200. In addition, the lower end of the support member 310 and the groove may be coupled by a screw method.

Here, between the lower end of the support member 310 and the bottom of the inner space of the receiving part 200 may be airtight through a separate heat-resistant airtight member (not shown).

The mounting plate 320 is disposed on the upper end of the support member 310. The seating plate 320 is formed in a plate shape having a set thickness.

The seating plate 320 may be formed integrally with the upper end of the support member 310. Of course, the mounting plate 320 may be coupled to the upper end of the support member 310 in a screw manner to be detachable. Accordingly, another seating plate may be adopted for the support member.

Injection holes 321 are formed in the mounting plate 320. The injection holes 321 may be equally spaced.

The powder including silicon and silicon oxide may be mounted on the mounting plate 320.

Meanwhile, the hollow upper end of the support member 310 is surrounded by the seating plate 320 to form a predetermined space.

The support member 310 serves as a spacer to space the seating plate 320 upward from the bottom of the inner space of the receiving part 200 to a predetermined height.

Although not shown in the drawings, the support member 310 according to the present invention may be configured by stacking unit support members. The unit support members may be screw-coupled to each other.

Accordingly, the upper and lower positions of the seating plate 320 may be variably adjusted according to the number of couplings of the unit support members. At the same time, the volume of the hollow space of the support member 310 can be adjusted.

Collection unit (500)

The collecting part 500 according to the present invention has a collecting member 560, a collecting pipe 510, a storage part 520, a discharge pipe 530, and a vacuum pump 540.

One end of the collecting pipe 510 is disposed above the receiving part 200. Preferably, one end of the collecting pipe 510 is disposed at a position spaced apart from the upper end of the mounting plate 320 by a predetermined height.

The other end of the collecting pipe 510 passes through the upper end of the device body 100 and extends to the outside.

The collecting member 560 is provided at one end of the collecting pipe 510.

The collecting member 560 is formed in the shape of a funnel that is opened downward. The center of the collecting member 560 communicates with one end of the collecting pipe 510. The collecting member 560 is formed in a shape in which the inner diameter gradually opens from the upper center to the lower end.

Preferably, the lower inner diameter of the collecting member 560 is substantially the same as or larger than the upper inner diameter of the receiving portion 200.

Accordingly, the collecting member 560 may be seated on the mounting plate 320 and evaporated to collect the silicon oxide gas flowing upward and induce it to be collected in the collecting pipe 510.

The other end of the collection pipe 510 is connected to the storage unit 520. The storage unit 520 has a storage space therein.

The discharge pipe 530 is connected to the storage unit 520. The vacuum pump 540 is installed on the discharge pipe 530.

The vacuum pump 540 forcibly sucks the silicon oxide gas through the collecting pipe 510 by forming a vacuum to flow to the storage unit 520. Then, the silicon oxide gas flowing to the storage unit 520 is discharged to the outside.

Here, a porous ceramic filter 550 connected to one end of the discharge pipe 530 is disposed inside the storage unit 520.

Accordingly, the silicon oxide gas flows to the storage unit 520. Particles included in the gas are filtered by the porous ceramic filter 550. And only the remaining gas except for the particles is discharged to the outside through the discharge pipe 530.

In addition, the collecting member 560 is disposed to be spaced apart from the upper portion of the receiving part 200.

Here, a guide 700 having a hollow shape is installed around the outer periphery of the receiving part 200. The lower end of the guide 700 is fitted around the outer periphery of the receiving part 200, and the upper end protrudes upward of the receiving part 200.

The upper end of the guide 700 protruding upward of the receiving part 200 is in close contact with the outer periphery of the collecting member 560.

Accordingly, between the collecting member 560 and the receiving part 200 may be surrounded by the guide 700.

Gas supply unit (600)

The gas supply unit 600 according to the present invention supplies a carrier gas from the lower portion of the seating unit 300 along the upper side to forcibly flow the evaporated silicon oxide gas to the collecting unit 500.

The gas supply unit 610 includes a gas supply pipe 610 and a gas supply unit 620.

The gas supplier 620 supplies a carrier gas such as argon through the gas supply pipe 610.

2 and 3, a gas supply hole 210 is formed at the lower end of the receiving part 200 according to the present invention.

The gas supply hole 210 is connected to one end of the gas supply pipe 610.

The gas supply hole 210 is exposed to the hollow of the support member 310 described above. Preferably, the perforation position of the gas supply hole 210 is a hollow center position of the support member.

In addition, the inner diameter of the gas supply hole 210 may be formed in a shape that gradually opens from the bottom to the top.

Accordingly, the carrier gas supplied to the gas supply pipe 610 is forcibly supplied to the lower end of the seating plate 320 through the hollow of the support member 310. The carrier gas may be injected upward through the injection holes 321 formed in the mounting plate 320.

Next, with reference to the above configuration and FIGS. 1 to 5, the operation of the apparatus for manufacturing silicon oxide particles having a first example of the seating portion according to the present invention will be described.

Referring to FIGS. 1 to 5, the powder including silicon and silicon oxide is mounted on the mounting plate 320 in a predetermined amount.

A controller (not shown) drives the heating unit 400. The heating unit 400 heats the receiving unit 200 to a predetermined temperature. The inner space of the receiving part 200 is heated to a certain temperature.

The powder seated on the seating plate 320 is melted. At this time, silicon oxide gas is evaporated from the melted powder.

At the same time or prior to this, the controller drives the gas supply 620.

The gas supplier 620 supplies a carrier gas such as argon to the gas supply pipe 610 at a set supply pressure.

The carrier gas supplied to the gas supply pipe 610 is forcibly supplied into the hollow of the support member 310 through the gas supply hole 210 drilled in the bottom of the receiving part 200.

Subsequently, the carrier gas is injected along the upper side through the injection hole 321 formed in the mounting plate 320.

Accordingly, the silicon oxide gas generated as it is evaporated is forcibly flowed upward by the injection pressure of the carrier gas injected through the injection hole 321.

The silicon oxide gas that is forcibly flowed is forcibly flowed into the collecting pipe 510 while being collected by the collecting member 560.

In addition, the silicon oxide gas is filtered by the filter 550 in the storage unit 520 as described above, and other gases are forcibly discharged through the discharge pipe 530.

Accordingly, the present invention can increase the collection rate of silicon oxide particles by forcibly moving the flow of the evaporated silicon oxide gas to the collecting unit 500.

In addition, according to the present invention, since the silicon oxide gas is not deposited on the inner wall of the chamber, it is possible to prevent changes in the inherent properties of the particles.

In addition, the seating plate according to the present invention is disposed at a position that forms less than half the height of the receiving portion.

Accordingly, in the present invention, a space in which the evaporated gas flows upward and moves can be secured more than a certain amount.

6 is a cross-sectional view showing a second example of a seating unit according to the present invention.

A second example of the seating part 800 according to the present invention will be described with reference to FIG. 6.

Here, the rest of the configuration except for the seating part 800 is substantially the same as the example described with reference to FIGS. 1 to 5 and will be omitted in the following description.

Referring to Figure 6, the seating portion 800 according to the present invention has a seating portion body 810. The seating part body 810 is opened upward. A flow space is formed inside the seat body 810. The seating part body 810 has a bottom and a side wall.

A seating plate 820 is formed integrally with the seating portion body 810 at an upper end of the seating portion body 810.

Injection holes 821 are formed in the mounting plate 820. The injection holes 821 may be the same as in the first example described above.

Accordingly, the seating portion 800 according to the second example has a flow space formed therein, and the flow space is exposed upward through the injection holes 821.

However, the gas supply hole is not formed at the lower end of the receiving part 200 in the first example.

The seating part body 810 according to the present invention is preferably installed on the floor of the inner space of the receiving part 200.

In addition, one end of the gas supply pipe 610 is installed to be connected to the flow space.

One end of the gas supply pipe 610 may be installed through an edge region of the mounting plate 820. The gas supply pipe 610 is formed in an upright state and is disposed in the inner space of the receiving part 200.

The other end of the gas supply pipe 610 extends above the receiving portion 200 and is connected to the gas supply 620 described above.

Of course, the gas supply pipe 610 may be installed to pass through the lower end or the side of the receiving unit 200 and pass through the receiving unit body 810 so that one end thereof is exposed to the flow space.

According to the above configuration, the gas supplier 620 forcibly supplies the carrier gas to the flow space of the seating unit 800 through the gas supply pipe 610.

The carrier gas may be injected along the upper side by forming a predetermined injection pressure through the injection holes 821 in the flow space.

Accordingly, as described above, the silicon oxide gas generated by evaporation is forcibly flowed upward by the injection pressure of the carrier gas injected through the injection hole 821.

The silicon oxide gas that is forcibly flowed is forcibly flowed into the collecting pipe 510 while being collected by the collecting member 560.

7 is a view showing an example of the hole size of the injection hole according to the present invention.

Referring to FIG. 7, the hole size d1 of the injection holes 321 according to the present invention is formed smaller than the size d2 of the particle.

Accordingly, particles included in the silicon oxide gas are prevented from flowing back into the hollow or flow space of the support member 310 through the injection hole 321.

That is, when the supply of the carrier gas is temporarily interrupted due to a temporary or process suspension, back pressure may be formed in the gas supply pipe 610.

In this case, the particles included in the silicon oxide gas may not be introduced into the hollow or flow space of the support member 310 through the injection hole 321 smaller than the diameter thereof.

Accordingly, it is possible to prevent a problem that the interior space of the seating portion 300 is blocked or the injection holes 321 are clogged by preventing the particles from being filled inside the seating portion 300.

In addition, although not shown in the drawings, the injection holes 321 according to the present invention may be formed in different shapes.

That is, by forming the shape of the injection hole 321 in a circular, square, or polygonal shape according to the formation position of the injection holes 321, the injection pressure may be set in advance to be different from each other according to the position of the injection holes 321 .

8 is a cross-sectional view showing another example of the seating plate according to the present invention.

Referring to FIG. 8, the upper surface of the seating plate 320 ′ according to the present invention may form a concave surface 320a along the center at the edge of the seating plate 320 ′.

The powder is seated on the upper end of the seating plate 320'. The powder may have a larger capacity at the center of the edge site of the seating plate 320 ′.

Accordingly, when the powder is melted, the amount of gas generated may be greater than the edge at the center of the seating plate 320 ′.

When the gas is forcibly flowed upward by the flow of the carrier gas by focusing the amount of gas generated in the center of the seating plate 320', the collecting member 560 disposed above the seating plate 320' ) Can be easily introduced into the center of the inside.

Although not shown in the drawings, in this case, it may be preferable that the injection holes 321 ′ are formed to be more airtight at the center of the mounting plate 320 ′ than the edge.

As described above, specific embodiments related to the present invention have been described, but it is obvious that various implementation modifications are possible within the limit not departing from the scope of the present invention.

Therefore, the scope of the present invention is limited to the described embodiments and should not be transmitted, and should be defined by the claims and equivalents as well as the claims to be described later.

100: device body 200: accommodating portion
300: seating part 400: heating part
500: collection unit 510: collection tube
520: storage unit 530: discharge pipe
540: vacuum pump 550: porous ceramic filter
560: collecting member 600: gas supply unit
700: guide 800: seat
810: seat body 820: seat plate

Claims (10)

Device body;
A receiving portion disposed inside the device body portion and having an upper portion open and an inner space formed therein;
A seating portion disposed in the inner space of the receiving portion and on which a powder including silicon and silicon oxide is seated;
A heating unit disposed on the body of the device and heating the receiving unit to melt the powder, thereby evaporating silicon oxide gas from the molten powder;
A collecting unit connected to the device body and collecting particles contained in the evaporated silicon oxide gas; And,
A gas supply unit connected to the receiving unit and supplying a carrier gas from a lower portion of the seating unit upwardly to force the evaporated silicon oxide gas to flow to the collecting unit;
Containing,
Silicon oxide particle manufacturing apparatus.
The method of claim 1,
The seating part,
A hollow support member whose lower end is supported on the bottom surface of the inner space of the accommodating part,
A seating plate disposed on an upper end of the support member, having spray holes formed thereon, and seating the powder;
Having,
Silicon oxide particle manufacturing apparatus.
The method of claim 2,
The support member and the seating plate are detachable,
Silicon oxide particle manufacturing apparatus.
The method according to claim 2 or 3,
At the bottom of the receiving part,
A gas supply hole for guiding the supply of the carrier gas through the hollow of the support member is formed,
Silicon oxide particle manufacturing apparatus.
The method of claim 1,
The seating part,
A flow space is formed inside, and injection holes communicating with the flow space are formed at the top,
The gas supply unit,
Including a gas supply pipe for supplying the carrier gas to the flow space,
Silicon oxide particle manufacturing apparatus.
The method of claim 5,
The seating part,
A seating part body having the flow space formed therein and opening the upper side thereof,
A seating plate formed on an upper end of the seating body to cover an upper portion of the flow space, and having the injection holes formed therein;
Having,
Silicon oxide particle manufacturing apparatus.
The method according to claim 2 or 5,
The hole size of the injection holes,
Formed smaller than the size of the particles,
Silicon oxide particle manufacturing apparatus.
The method according to claim 2 or 5,
The injection holes are formed in different shapes,
Silicon oxide particle manufacturing apparatus.
The method according to claim 2 or 6,
The upper surface of the seating plate,
Forming a concave shape along the center at the edge of the seating plate,
Silicon oxide particle manufacturing apparatus.
The method according to claim 2 or 6,
The seating plate,
Arranged in a position that forms less than half the height of the receiving portion,
Silicon oxide particle manufacturing apparatus.

Images