KR20210052134A - temperature sensing device for switchboard, and collection system of temperature information for group switchboard using the same - Google Patents

Abstract

The present invention relates to technology for preventing a fire from occurring on a distribution board by monitoring whether temperature is high on a plurality of positions of the distribution board with respect to the distribution board enabling system input to be supplied to an equipment load provided in a semiconductor process line and, more specifically, to technology for preventing a fire from occurring from a distribution board by monitoring heat produced from a plurality of connection parts between a busbar, a system input wire, a busbar and a system output wire, which are internal components of the distribution board. In accordance with the present invention, as each distribution board temperature sensing device which is formed into a thin film shape is attached to a plurality of local positions in a distribution board, the temperature can be individually monitored with respect to the plurality of corresponding positions.

Description

Switchboard temperature sensing device and temperature information collection system of group switchboard using the same {temperature sensing device for switchboard, and collection system of temperature information for group switchboard using the same}

The present invention relates to a technology for preventing the occurrence of a fire in a switchboard by monitoring whether a high temperature exists in a plurality of locations of the switchboard for supplying a system input to an equipment load provided in a semiconductor process line.

In more detail, the present invention monitors heat generated in a plurality of connection parts between a bus bar, a system input wire, a bus bar, and a system output wire, which are components inside the switchboard, thereby preventing fire that may occur from the switchboard in advance. It's technology.

1 is an exemplary diagram schematically showing a plurality of switchboards installed in a semiconductor process line. Referring to [Fig. 1], a system power (eg, three-phase power) input from the outside may be provided to a line equipment load of a semiconductor process line through each switchboard.

In addition, a plurality of switchboards may be arranged according to the scale of a semiconductor process line, and a plurality of breakers may be individually provided in one switchboard corresponding to the scale of the LINE equipment that the switchboard is responsible for.

Here, referring to [Fig. 1], a grid input wire for inputting three-phase power from the outside as a reference to one switchboard and a grid output wire for supplying the grid power provided through the grid input wire to the LINE equipment are provided. do.

In addition, the grid input wire and the grid output wire are connected to each other through a plurality of so-called'busbars', and a breaker is connected to the bus bar for switching on and off the bus bar.

As such, in the switchboard, since each component is connected at a plurality of locations to supply the grid power, the resistance increases at the connection part, resulting in a phenomenon in which heat is easily generated.

At this time, if the connection between each component in the switchboard is not properly made, heat at a level of fire risk may occur, and even if the capacity of the breaker is incorrect or defective, heat at the level of fire risk may occur within the switchboard.

Like this, since heat generation that causes fire is frequent in the switchboard, it is necessary to effectively monitor the temperature inside the switchboard. The prior art such as "prediction system" has a problem in that a complex additional configuration (eg, a circuit patterned bus bar) must be provided in order to check the temperature inside the switchboard.

Accordingly, there is a need to implement a technology capable of solving the problems of the prior art by effectively monitoring heat generation in the switchboard while using the switchboard in the existing installed state as it is.

The present invention has been proposed in view of the above points, and an object of the present invention is a switchboard temperature sensing device capable of monitoring heat generation in the switchboard without a separate configuration change for the previously installed switchboard, and temperature information of the group switchboard using the same It is to provide a collection system.

In addition, it is an object of the present invention to provide a switchboard temperature sensing device capable of individually sensing temperatures for a plurality of local locations within a switchboard, and a system for collecting temperature information of a group switchboard using the same.

In order to achieve the above object, the present invention is made in the form of a thin film to be attached to the switchboard, operates by receiving power in a contactless type from the outside, and transmits temperature sensing data for the switchboard to the outside through short-range wireless communication. A sensing device, comprising: a thin film member 110; A temperature sensor member 120 for sensing the temperature of the switchboard; A response antenna member that is laminated in the form of a thin film on the upper surface of the film member and receives power from the outside by performing RF communication with the outside while connected to the temperature sensor member and transmitting the temperature data sensed by the temperature sensor member to the outside through RF communication. (130); A control module 140 that operates with power supplied from the response antenna member while connected to the response antenna member, controls the operation of the temperature sensor member and controls the operation of the response antenna member to transmit temperature data by the temperature sensor member to the outside. ; It includes a film member, a temperature sensor member, a response antenna member, and a connection member (150, 150') for interfacing so that the control module is integrally attached to the switchboard.

In this case, the response antenna member 130 may be configured to generate power excited from an RF signal provided from the outside.

In the connection member 150 according to an embodiment a of the present invention, an adhesive layer that can be attached to the switchboard may be connected to the lower surface of the film member.

The connection member 150' according to the embodiment b of the present invention is made in the form of a flat pad, and a film member, a response antenna member, a temperature sensor member, and a control module are integrally fixed on one side of the switchboard facing the electric wire, but the film member Is disposed on the outermost side, and the film member may be wound around the electric wire so as to contact the electric wire and fixed.

On the other hand, the present invention is a plurality of bus bars in the form of a bar for individually interconnecting a plurality of system input wires 11, a plurality of grid output wires 12, a plurality of grid input wires and a plurality of grid output wires ( 13), a group switchboard using a switchboard temperature sensing device that individually collects temperature information for a plurality of locations in a group switchboard in which a plurality of single switchboard units having a circuit breaker 14 for switching on and off a plurality of bus bars are arranged. A system for collecting temperature information, comprising: a plurality of switchboard temperature sensing devices 100 according to claim 1 or 2 arranged at each heating position of a single switchboard unit; A request antenna member 210 for acquiring a plurality of temperature data from a plurality of response antenna members by performing RF communication with a plurality of response antenna members provided in a plurality of switchboard temperature sensing devices located within the RF communication coverage, and a plurality of responses An RF modulator 220 that adjusts the frequency of the requesting antenna member so that the antenna member and the requesting antenna member perform RF communication, and a data transmission interface unit 230 that transmits a plurality of temperature data obtained by the requesting antenna member to the outside. , A request antenna member, an RF modulator, and a data collection and transmission device 200 including a collection and transmission controller 240 for controlling the operation of the data transmission interface unit.

In addition, the switchboard temperature sensing device 100 includes a local part of each bus bar adjacent to a plurality of system input wires, a circuit breaker, a local part of each bus bar adjacent to a plurality of system output wires, and a plurality of systems. It can be attached individually to each surface of the output wire.

On the other hand, in the temperature information collection system of the group switchboard using the switchboard temperature sensing device according to the first and second embodiments of the present invention, the control module 140 provides a single temperature data provided by the response antenna member 130 to the request antenna member. It may be configured to synchronize the identification information of the switchboard unit.

And, in the temperature information collection system of the group switchboard using the switchboard temperature sensing device according to the third and fourth embodiments of the present invention, the control module 140 includes a plurality of temperature data provided by the response antenna member 130 to the request antenna member. It can be configured to synchronize individual identification information for the temperature sensing device of the switchboard.

On the other hand, the system for collecting temperature information of a group switchboard using the switchboard temperature sensing device according to the present invention includes a data receiving interface unit 310 receiving a plurality of temperature data transmitted by a data transmitting interface unit, and a plurality of receiving data receiving interface units. A switchboard unit identification unit 320 that obtains unit identification information for each single switchboard unit corresponding to each temperature data from the temperature data of, and a predetermined ratio of the plurality of single switchboard units corresponding to the plurality of temperature data than the surroundings The switchboard monitoring server 300 having a heating unit identification unit 330 for identifying a single switchboard unit in which one or more high-temperature temperature data exceeding is distributed; may be configured to further include.

In addition, a unit identification for each single switchboard unit corresponding to each temperature data from the data receiving interface unit 310 receiving a plurality of temperature data transmitted by the data transmission interface unit and a plurality of temperature data received by the data receiving interface unit A switchgear unit identification unit 320 that acquires information, and heat generation to identify a single switchboard unit in which one or more high-temperature temperature data exceeding a predetermined value exceeding a predetermined value among a plurality of single switchboard units corresponding to a plurality of temperature data are distributed. The switchboard monitoring server 300 having a unit identification unit 330; may be configured to further include.

In addition, the data receiving interface unit 310' for receiving a plurality of temperature data transmitted by the data transmission interface unit, and each switchboard temperature sensing device corresponding to each temperature data from a plurality of temperature data received by the data receiving interface unit. A sensing device identification unit (320') for acquiring device identification information, and a switchboard temperature sensing device in which one or more high-temperature temperature data exceeding a predetermined ratio is distributed among a plurality of switchboard temperature sensing devices corresponding to a plurality of temperature data. A switchboard monitoring server 300' having a heating device identification unit 330' for identifying the device; may be further included.

In addition, the data receiving interface unit 310' for receiving a plurality of temperature data transmitted by the data transmission interface unit, and each switchboard temperature sensing device corresponding to each temperature data from a plurality of temperature data received by the data receiving interface unit. A sensing device identification unit (320') for acquiring device identification information, and a switchboard temperature sensing device in which one or more high-temperature temperature data exceeding a predetermined value is distributed among a plurality of switchboard temperature sensing devices corresponding to a plurality of temperature data. A switchboard monitoring server 300' having a heating device identification unit 330' for identifying the device; may be further included.

The present invention is made in the form of a thin film so that it can be attached to a switchboard, operates by receiving power in a contactless type from an external (for example, a data collection and transmission device), and transmits temperature sensing data for the switchboard to the outside (for example, a data collection and transmission device). ), it is composed of a switchboard temperature sensing device that transmits through short-range wireless communication (eg, RF communication), it shows the advantage of being able to effectively monitor the heat generated in the switchboard without a separate configuration change for the previously installed switchboard.

In addition, the present invention also shows the advantage of being able to individually monitor the temperature for a plurality of corresponding positions by attaching each switchboard temperature sensing device in the form of a thin film to a plurality of local positions in the switchboard.

[Fig. 1] is an exemplary diagram schematically showing a plurality of switchboards installed in a semiconductor process line,
[Fig. 2] is an exemplary view showing a state in which the switchboard temperature sensing device according to the present invention is installed in the switchboard,
[Fig. 3] is a diagram showing a combined state and a separated state of the switchboard temperature sensing device according to an embodiment a of the present invention;
[Fig. 4] is a diagram showing a combined state and a separated state of the switchboard temperature sensing device according to Embodiment b of the present invention;
[Fig. 5] is an exemplary view showing a system for collecting temperature information of a group switchboard using the switchboard temperature sensing device according to the present invention,
[Fig. 6] is a block diagram showing the excerpt of the switchboard temperature sensing device and the data collection and transmission device from [Fig. 5],
[Fig. 7] is a block diagram of the temperature information collection system according to the first and second embodiments, showing the extract of the data collection and transmission device and the switchboard monitoring server in [Fig. 5],
[Fig. 8] is a block diagram of the temperature information collection system according to the third and fourth embodiments, showing the extract of the data collection and transmission device and the switchboard monitoring server in [Fig. 5].

Hereinafter, the present invention will be described in detail with reference to the drawings.

[Fig. 2] is an exemplary diagram showing a state in which the switchboard temperature sensing device according to the present invention is installed in the switchboard, and [Fig. 3] is a state in which the switchboard temperature sensing device according to an embodiment a of the present invention is coupled and separated It is a diagram showing.

Referring to [Fig. 2] and [Fig. 3], the present invention is made in the form of a thin film to be attached to the switchboard 10 and operates by receiving power from the outside in a contactless type, and As a switchboard temperature sensing device that transmits the temperature sensing data to the outside through short-range wireless communication (eg, RF communication), a film member 110, a temperature sensor member 120, a response antenna member 130, and a control module 140 , It may be configured to include a connection member (150, 150').

First, although one circuit breaker 14 is conceptually illustrated in the switchboard 10 in FIG. 2, a plurality of circuit breakers 14 may be provided in one switchboard 10.

Referring to FIG. 2, one circuit breaker 14 conceptually illustrated in the switchboard 10 may be connected to the corresponding bus bar 13 so as to switch on and off the plurality of bus bars 13.

In addition, the system power provided from the outside is the line of the semiconductor process line through each bus bar 13 through one or more system input wires 11 and each system output wire 12 as shown in [Fig. 2]. It is supplied to the equipment load.

At this time, a plurality of bus bars 13 interconnecting each of the system input wires 11 and each of the grid output wires 12 are connected to each of the wires 11 and 12 at their both ends as shown in [Fig. 2]. Because it is connected, the possibility of heat generation increases due to relatively more electrical resistance than the surrounding area.

In addition, since the circuit breaker 14 is also configured to switch on and off each bus bar 13, the possibility of heat generation by relatively more electric resistance than the surroundings at the switching on/off position increases.

As described above, since there are many local parts connected to each other in the structure of the switchboard 10, it is effective to prevent the occurrence of a fire from the inside of the switchboard 10 to sense whether or not heat is generated at each corresponding connection part.

Hereinafter, the present invention for safely preventing the occurrence of fire from the switchboard 10 will be described in detail by precisely sensing whether or not heat is generated at various locations within the switchboard 10 as shown in [Fig. 2]. .

As shown in Fig. 3, the film member 110 to which the temperature sensor member 120 is attached is formed in the form of a thin film, so that the temperature of the temperature sensor member 120 is attached to the surface of the switchboard 10 Sensing is advantageous.

The temperature sensor member 120 senses the temperature of a corresponding component in the switchboard 10 while being attached to the film member 110 in the form of a thin film.

The response antenna member 130 is preferably made of a metallic antenna, is laminated in the form of a thin film on the upper surface of the film member 110 as shown in [Fig. 3], and is connected to the temperature sensor member 120 to the outside (for example: The data collection and transmission device 200 performs RF communication to receive power from the outside and transmits the temperature data sensed by the temperature sensor member 120 to the outside (for example, a data collection and transmission device 200) through RF communication.

The control module 140 is preferably connected to the response antenna member 130 and operates with power supplied from the response antenna member 130, and is preferably configured in a one-chip form with the response antenna member 130 to provide a temperature sensor. The operation of the response antenna member 130 is controlled to control the operation of the member 120 and transmit temperature data by the temperature sensor member 120 to the outside.

That is, when the response antenna member 130 receives an RF signal by RF communication from the request antenna member 210 of the data collection and transmission device 200, the power to the response antenna member 130 from the request antenna member 210 Can be here.

As shown in [Fig. 3], the connection member 150 according to the embodiment a of the present invention is preferably applied to the lower surface of the film member 110 and attached to the surface of each component provided in the switchboard 10 As a result, the film member 110 is fixed in the switchboard 10.

On the other hand, [Fig. 4] is a view showing a state in which the switchboard temperature sensing device according to Embodiment b of the present invention is coupled and separated, as shown in [Fig. 4], a connection member according to Embodiment b of the present invention (150') is preferably a connection member (150') is made in the form of a flat pad, a film member 110, a response antenna on its one side facing the wire (eg, system output wire; 12) of the switchboard 10 The member 130, the temperature sensor member 120, and the control module 140 are integrally fixed, and the film member 10 is placed on the outermost side, and the film member 10 is provided on the switchboard 10. 12) may be wound around the system output wire 12 so as to be fixed.

Here, the connection member 150 ′ may be made of a fabric structure, and as shown in (a) of FIG. 4, predetermined portions of the upper and lower portions are folded forward based on each folding line 151', 151", and [ It can be made as shown in (b) of FIG. 4].

At this time, as shown in (b) of FIG. 4, each folded portion based on each folding line 151 ′ and 151 ″ may be sewn long to the left and right along each sewing line 152 ′ and 152 ″. Subsequently, as shown in (b) of FIG. 4, the first Velcro 153' may be attached to the front end of one end of the connection member 150'.

In addition, the rear surface of the connection member 150 ′ in FIG. 4 may be formed of a second velcro so that the first Velcro 153 ′ and the so-called clamp male and female can be coupled.

Subsequently, in the process of rolling and connecting the connection member 150' to the system output wire 12, the film member 110 is in contact with the system output wire 12, as shown in (c) of [Fig. 4]. It is preferable to place 110) on the outermost side.

In addition, the response antenna member 130, the control module 140, the temperature sensor member 120 is integrally connected to the film member 110 and the system output wire 12 as shown in (c) of [Fig. 4] If the connection member 150' is rolled continuously along the circumference of the system output wire 12 while the connection member 150' is disposed in front of the connection member 150', the first Velcro 153' and the second Velcro can contact and be fixed. have.

When the connection member 150' according to the embodiment b of the present invention is adopted as shown in [Fig. 4], the temperature sensor member 120 may be effectively attached to the electric wire provided in the switchboard 10, but the temperature sensor member ( Since the connection member 150', which is a pad-shaped fabric structure, can sufficiently cover the 120), the temperature sensor member 120 is less affected by the outside air, and thus, the temperature measurement of the switchboard 10 is more accurate. You can do it.

As such, the switchboard temperature sensing device 100 is formed in the form of a thin film as shown in [Fig. 3] and [Fig. 4], and is attached to the surface of each component in the switchboard 10 and senses the temperature of the corresponding location and senses the temperature. Since it is configured to transmit one temperature data to the outside in a contactless type, it is possible to effectively detect whether there is heat in each location of the switchboard 10 without a separate configuration change for the previously installed switchboard 10.

[Fig. 5] is an exemplary view showing a system for collecting temperature information of a group switchboard using a switchboard temperature sensing device according to the present invention, and [Fig. 6] is an excerpt of a switchboard temperature sensing device and a data collection and transmission device from [Fig. 5] This is a block diagram shown.

5 and 6, the present invention provides a plurality of system input wires 11, a plurality of system output wires 12, a plurality of system input wires 11, and a plurality of system output wires. A plurality of single switchboard units 10 including a plurality of bar-shaped bus bars 13 for individually interconnecting 12 and a circuit breaker 14 for switching on and off the plurality of bus bars 13 are arranged. As a temperature information collection system of a group switchboard using a switchboard temperature sensing device that individually collects temperature information for a plurality of locations in the group switchboard, it will be configured to include a switchboard temperature sensing device 100 and a data collection and transmission device 200. I can.

The switchboard temperature sensing device 100 is the same as described above and may be disposed at each heating position in the single switchboard unit 10 (eg, connection portions of each component in the single switchboard unit).

Here, the switchboard temperature sensing device 100 is preferably a local portion of each bus bar 13 adjacent to the plurality of system input wires 11, a circuit breaker 14, and a plurality of A local portion of each bus bar 13 adjacent to the system output wire 12 and may be individually attached to each surface of the plurality of system output wires 12.

As a result, it is possible to effectively monitor whether or not heat is generated in a plurality of locations in the switchboard without changing the components in the switchboard when sensing whether there is heat generation in the previously installed switchboard.

The data collection and transmission device 200 is made to transmit and receive data through short-range wireless communication (eg, RF communication) with the switchboard temperature sensing device 100 as shown in [Fig. 6], and the request antenna member 210, RF It may be configured to include a modulator 220, a data transmission interface unit 230, and a collection and transmission controller 240.

As the request antenna member 210 performs RF communication with the plurality of response antenna members 130 provided in the plurality of switchboard temperature sensing devices 100 located within the RF communication coverage as shown in [Fig. 5], the plurality of response antennas A plurality of temperature data may be obtained from the member 130.

As a result, even through one data collection and transmission device 200, it is possible to monitor whether heat is generated for a group switchboard consisting of a plurality of switchboard temperature sensing devices 100 or a plurality of single switchboard units 10 as in [Fig. 5]. There will be.

The RF modulator 220 may be configured to adjust the frequency of the request antenna member 210 so that the plurality of response antenna members 130 and the request antenna member 210 perform RF communication.

As the RF modulator 220 adjusts the frequency of the request antenna member 210, the request antenna member 210 and the response antenna member 130 capable of RF communication within the RF communication coverage are found and paired.

The data transmission interface unit 230 transmits a plurality of temperature data acquired by the request antenna member 210 from the plurality of switchboard temperature sensing devices 100 to an external device (eg, switchboard monitoring server; 300, 300').

The collection/transmission controller 240 is configured to control the overall operation of the data collection/transmission device 200, and specifically, the request antenna member 210, the RF modulator 220, and the data transmission interface unit 230 are controlled. I can.

Then, the SMPS 250 converts AC supplied from the outside into DC and supplies it to each component of the data collection and transmission device 200.

Here, the SMPS 250 may be configured to collect the secondary current AC generated in a contactless form from the primary current flowing through the system output wire 12 in [FIG. 2] and convert it to DC.

On the other hand, in the temperature information collection system of the group switchboard using the switchboard temperature sensing device according to the first and second embodiments of the present invention, the control module 140 provides the temperature provided by the response antenna member 130 to the request antenna member 210. It may be configured to synchronize the identification information of the single switchboard unit 10 with the data.

As a result, in each temperature data that the data collection and transmission device 200 transmits to the outside, it is possible to display which single switchboard unit 10 the temperature data corresponds to.

On the other hand, in the temperature information collection system of the group switchboard using the switchboard temperature sensing device according to the third and fourth embodiments of the present invention, the control module 140 provides the response antenna member 130 to the request antenna member 210. It may be configured to synchronize individual identification information for the plurality of switchboard temperature sensing devices 100 with the temperature data.

As a result, in the temperature data transmitted by the data collection and transmission device 200 to the outside, it is possible to display which switchboard temperature sensing device 100 corresponds to the temperature data.

[Fig. 7] is a block diagram of the temperature information collection system according to the first and second embodiments, showing the extract of the data collection and transmission device and the switchboard monitoring server in [Fig. 5].

Referring to [Fig. 7], the temperature information collection system according to the first embodiment of the present invention monitors a switchboard including a data receiving interface unit 310, a switchboard unit identification unit 320, and a heat generating unit identification unit 330 It may be configured to further include a server 300.

The data reception interface unit 310 is configured to receive a plurality of temperature data transmitted by the data transmission interface unit 230 of the data collection and transmission device 200 as shown in FIGS. 5 and 7.

The switchboard unit identification unit 320 acquires unit identification information for each single switchboard unit 10 corresponding to each temperature data from a plurality of temperature data received by the data receiving interface unit 310.

The heating unit identification unit 330 is a single switchboard in which one or more high-temperature temperature data exceeding a predetermined ratio (e.g., 150%) is distributed among a plurality of single switchboard units 10 corresponding to the plurality of temperature data. Identify the unit.

For example, when the average heating temperature indicated by a plurality of adjacent single switchboard units 10 is approximately 20°C, a predetermined ratio when the average heating temperature indicated by one adjacent single switchboard unit 10 is approximately 31°C. It is identified as exceeding 150% phosphorus.

Referring to FIG. 7, the temperature information collection system according to the second embodiment of the present invention includes a data receiving interface unit 310, a switchboard unit identification unit 320, and a heat generating unit identification unit 330. It may be configured to further include a server 300.

The data reception interface unit 310 is configured to receive a plurality of temperature data transmitted by the data transmission interface unit 230 of the data collection and transmission device 200 as shown in FIGS. 5 and 7.

The switchboard unit identification unit 320 acquires unit identification information for each single switchboard unit 10 corresponding to each temperature data from a plurality of temperature data received by the data receiving interface unit 310.

The heating unit identification unit 330 is a single switchboard in which one or more high-temperature temperature data exceeding a predetermined value (eg, 60° C.) is distributed among a plurality of single switchboard units 10 corresponding to the plurality of temperature data. Identify the unit.

For example, regardless of the average heating temperature represented by a plurality of adjacent single switchboard units 10, if the average heating temperature represented by any single switchboard unit 10 is approximately 61°C, a predetermined value (e.g. 60°C) ) Is exceeded.

[Fig. 8] is a block diagram of the temperature information collection system according to the third and fourth embodiments, showing the extract of the data collection and transmission device and the switchboard monitoring server in [Fig. 5].

8, the temperature information collection system according to the first embodiment of the present invention includes a data receiving interface unit 310', a sensing device identification unit 320', and a heating device identification unit 330'. It may be configured to further include a switchboard monitoring server (300').

The data reception interface unit 310' is configured to receive a plurality of temperature data transmitted by the data transmission interface unit 230 of the data collection and transmission device 200 as shown in [FIG. 5] and [FIG. 8].

The sensing device identification unit 320 ′ obtains device identification information for each switchboard temperature sensing device 100 corresponding to each temperature data from a plurality of temperature data received by the data receiving interface unit 310 ′.

The heating device identification unit 330' is a switchboard temperature in which one or more high-temperature temperature data exceeding a predetermined ratio (150%) of the plurality of switchboard temperature sensing devices 100 corresponding to the plurality of temperature data are distributed. The sensing device 100 is identified.

For example, when the average heating temperature indicated by a plurality of adjacent switchboard temperature sensing devices 100 is approximately 20°C, the average heating temperature indicated by one adjacent switchboard temperature sensing device 100 is approximately 31°C. It is identified as exceeding the set ratio of 150%.

8, the temperature information collection system according to the second embodiment of the present invention includes a data receiving interface unit 310', a sensing device identification unit 320', and a heating device identification unit 330'. It may be configured to further include a switchboard monitoring server (300').

The data reception interface unit 310' is configured to receive a plurality of temperature data transmitted by the data transmission interface unit 230 of the data collection and transmission device 200 as shown in [FIG. 5] and [FIG. 8].

The sensing device identification unit 320 ′ obtains device identification information for each switchboard temperature sensing device 100 corresponding to each temperature data from a plurality of temperature data received by the data receiving interface unit 310 ′.

The heating device identification unit 330 ′ includes one or more distribution of high temperature temperature data exceeding a predetermined value (eg, 60° C.) among the plurality of switchboard temperature sensing devices 100 corresponding to the plurality of temperature data. The switchboard temperature sensing device 100 is identified.

For example, regardless of the average heating temperature represented by a plurality of adjacent switchboard temperature sensing devices 100, when the average heating temperature represented by any one switchgear temperature sensing device 100 is approximately 61°C, a predetermined value (eg: 60 ℃).

10: single switchboard unit (switchboard)
11: system input wire
12: system output wire
13: busbar
14: circuit breaker
100: switchboard temperature sensing device
110: film member
120: temperature sensor member
130: No response antenna
140: control module
150, 150': connection member
151', 151": folding line
152', 152": sewing line
153': 1st Velcro
200: data collection and transmission device
210: request antenna absence
220: RF modulator
230: data transmission interface unit
240: collection and transmission controller
250: SMPS
300, 300': switchboard monitoring server
310, 310': Data receiving interface unit
320: switchboard unit identification unit
320': sensing device identification unit
330: heating unit identification unit
330': heating device identification unit

Claims (12)

As a switchboard temperature sensing device that is made in the form of a thin film to be attached to the switchboard, operates by receiving power in a contactless type from the outside, and transmits temperature sensing data for the switchboard to the outside through short-range wireless communication,
A thin film member 110;
A temperature sensor member 120 for sensing the temperature of the switchboard;
It is laminated in the form of a thin film on the upper surface of the film member and is connected to the temperature sensor member and performs RF communication with the outside to receive power from the outside and transmit the temperature data sensed by the temperature sensor member to the outside through RF communication. Response antenna member 130;
Controls the operation of the response antenna member so as to operate with power supplied from the response antenna member while being connected to the response antenna member to control the operation of the temperature sensor member and to transmit temperature data by the temperature sensor member to the outside. Control module 140;
A connection member (150, 150') for interfacing the film member, the temperature sensor member, the response antenna member, and the control module to be integrally attached to the switchboard;
Switchboard temperature sensing device comprising a.
The method according to claim 1,
The response antenna member 130 generates power to be excited from an RF signal provided from an external device.
The method according to claim 2,
The connection member 150 is a switchboard temperature sensing device, characterized in that the adhesive layer that can be attached to the switchboard is connected to the lower surface of the film member.
The method according to claim 2,
The connection member 150 ′ is formed in the form of a flat pad, and the film member, the response antenna member, the temperature sensor member, and the control module are integrally fixed on one side of the switchboard facing the electric wire. A switchboard temperature sensing device, which is disposed on the outermost side and is wound around and fixed to the electric wire so that the film member contacts the electric wire.
A plurality of system input wires 11, a plurality of system output wires 12, a plurality of bus bars 13 in the form of bars for individually interconnecting the plurality of system input wires and the plurality of system output wires, Temperature information of a group switchboard using a switchboard temperature sensing device that individually collects temperature information for a plurality of positions in a group switchboard in which a plurality of single switchboard units having a circuit breaker 14 for switching on and off the plurality of bus bars are arranged. As a collection system,
A plurality of switchgear temperature sensing devices (100) according to claim 1 or claim 2 disposed at each heating position of the single switchboard unit;
A request antenna member 210 for acquiring a plurality of temperature data from the plurality of response antenna members by performing RF communication with the plurality of response antenna members provided in the plurality of switchboard temperature sensing devices located within the RF communication coverage; An RF modulator 220 that adjusts the frequency of the request antenna member so that the plurality of response antenna members and the request antenna member perform RF communication, and data for transmitting a plurality of temperature data obtained by the request antenna member to the outside. A data collection and transmission device 200 including a transmission interface unit 230 and a collection and transmission controller 240 for controlling the operation of the request antenna member, the RF modulator, and the data transmission interface unit;
A system for collecting temperature information of a group switchboard using a switchboard temperature sensing device, comprising: a.
The method of claim 5,
The switchboard temperature sensing device 100 includes a local portion of each of the bus bars adjacent to the plurality of system input wires, the breaker, and a local portion of each of the bus bars adjacent to the plurality of system output wires. , Temperature information collection system of a group switchboard using a switchboard temperature sensing device, characterized in that attached individually to each surface of the plurality of grid output wires.
The method of claim 6,
The control module 140 is configured to synchronize the identification information of the single switchboard unit with temperature data provided by the response antenna member 130 to the request antenna member. Temperature information collection system.
The method of claim 6,
The control module 140 is configured to synchronize individual identification information of the plurality of switchboard temperature sensing devices with temperature data provided by the response antenna member 130 to the request antenna member. Group switchboard temperature information collection system using.
The method of claim 7,
A data receiving interface unit 310 for receiving a plurality of temperature data transmitted by the data transmission interface unit, and a unit for each of the single switchboard units corresponding to each temperature data from a plurality of temperature data received by the data receiving interface unit A switchboard unit identification unit 320 for acquiring identification information, and a single switchboard unit in which one or more high-temperature temperature data exceeding a predetermined ratio of the surroundings is distributed among the plurality of single switchboard units corresponding to the plurality of temperature data. Switchboard monitoring server 300 having a heating unit identification unit 330 to identify;
A system for collecting temperature information of a group switchboard using a switchboard temperature sensing device, characterized in that it further comprises.
The method of claim 7,
A data receiving interface unit 310 for receiving a plurality of temperature data transmitted by the data transmission interface unit, and a unit for each of the single switchboard units corresponding to each temperature data from a plurality of temperature data received by the data receiving interface unit A switchboard unit identification unit 320 for acquiring identification information, and a single switchboard unit in which one or more high-temperature temperature data exceeding a predetermined value exceeding a predetermined value among the plurality of single switchboard units corresponding to the plurality of temperature data are distributed. Switchboard monitoring server 300 having a heating unit identification unit 330 to identify;
A system for collecting temperature information of a group switchboard using a switchboard temperature sensing device, characterized in that it further comprises.
The method of claim 8,
A data receiving interface unit 310' receiving a plurality of temperature data transmitted by the data transmission interface unit, and a plurality of temperature data received by the data receiving interface unit to each of the switchboard temperature sensing devices corresponding to each temperature data. A sensing device identification unit (320') for acquiring device identification information for, and one or more high-temperature temperature data exceeding a predetermined ratio among the plurality of switchboard temperature sensing devices corresponding to the plurality of temperature data are distributed. A switchboard monitoring server 300' having a heat generating device identification unit 330' for identifying the switchboard temperature sensing device;
A system for collecting temperature information of a group switchboard using a switchboard temperature sensing device, characterized in that it further comprises.
The method of claim 8,
A data receiving interface unit 310' receiving a plurality of temperature data transmitted by the data transmission interface unit, and a plurality of temperature data received by the data receiving interface unit to each of the switchboard temperature sensing devices corresponding to each temperature data. A sensing device identification unit (320') for acquiring device identification information for, and one or more high-temperature temperature data exceeding a predetermined value among the plurality of switchboard temperature sensing devices corresponding to the plurality of temperature data are distributed. A switchboard monitoring server 300' having a heat generating device identification unit 330' for identifying the switchboard temperature sensing device;
A system for collecting temperature information of a group switchboard using a switchboard temperature sensing device, characterized in that it further comprises.

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