KR20210042611A - Curling control system for preparing complex sheet, Manufacturing method of complex - Google Patents

Abstract

The present invention provides a curling control system capable of minimizing and/or preventing the occurrence of curling in a sheet bonded with a metal sheet when manufacturing a complex sheet using the metal sheet, a method for manufacturing the complex sheet introducing the same and a method for manufacturing an encapsulant for an organic electronic device using the complex sheet manufactured thereby.

Description

Curling control system for manufacturing a composite sheet, a method for manufacturing a composite sheet using the same, and a method for manufacturing an encapsulant for an organic electronic device {Curling control system for preparing complex sheet, Manufacturing method of complex}

The present invention is a curling control system for manufacturing a composite sheet capable of minimizing and/or preventing curling from occurring in a sheet laminated with a metal sheet when manufacturing a composite sheet using a metal sheet, a composite sheet manufacturing method and an organic electronic device using the same It is intended to provide a method of manufacturing a sealing material for use.

An organic light emitting diode (OLED) is a light emitting diode in which an emission layer is formed of a thin organic compound, and uses an electroluminescence phenomenon in which light is generated by passing an electric current through a fluorescent organic compound. These organic light-emitting diodes generally implement major colors in a three-color (Red, Green, Blue) independent pixel method, a biotransformation method (CCM), and a curly filter method. Accordingly, it is classified into a low-molecular organic light-emitting diode and a high-molecular organic light-emitting diode. In addition, according to the driving method, it may be classified into a passive driving method and an active driving method.

These organic light-emitting diodes have features such as high efficiency, low voltage driving, and simple driving by self-luminescence, and thus have the advantage of expressing high-definition moving pictures. In addition, applications to flexible displays and organic electronic devices using the flexible properties of organic materials are also expected.

The organic light emitting diode is manufactured in a form in which an organic compound, which is a light emitting layer, is stacked on a substrate in the form of a thin film. However, the organic compound used in the organic light emitting diode is very sensitive to impurities, oxygen, and moisture, and thus has a problem that properties are easily deteriorated due to external exposure or penetration of moisture or oxygen. The deterioration of the organic material affects the light-emitting characteristics of the organic light-emitting diode and shortens the lifespan of the organic light-emitting diode. In order to prevent this phenomenon, a thin film encapsulation process is required to prevent the introduction of oxygen, moisture, etc. into the organic electronic device.

Conventionally, a metal can or glass was processed in the form of a cap to have a groove, and a desiccant for moisture absorption was mounted in the groove in the form of a powder, but in this method, the sealed organic electronic device is used to remove the desired level of moisture permeation. There is a problem in that it is difficult to block the organic electronic device from accessing substances that are cause of defects such as moisture and impurities, do not cause the delamination phenomenon that may occur when moisture is removed, and have excellent effects in moisture resistance and heat resistance at the same time.

As a thin film encapsulation material, a composite sheet in which a metal sheet and an encapsulation resin sheet are laminated can be applied. When the composite sheet, which is a thin film encapsulation material, is applied to an organic electronic device, processing (or cutting) is performed in an appropriate size and shape, and the processing process The composite sheet applied to is provided in the form of a wound roll. During the manufacture of the rolled composite sheet in the form of a roll, a curl occurs in the encapsulating resin sheet laminated to the metal sheet, and a part of the encapsulating resin sheet is peeled off from the metal sheet, resulting in defective products when processed into an appropriate size and shape. . Therefore, there is a need for a method of minimizing or preventing the occurrence of curling occurring in the other sheet when manufacturing a composite sheet including a metal sheet in a roll form by laminating and winding it with other sheets such as encapsulating resin sheets. It is increasing in the industry.

Korean Patent Registration No. 10-1717472 (announcement date: 2017.03.17) Japanese Unexamined Patent Publication No. 2016-24240 (Publication date: 2016.02.08)

The present invention was conceived to solve the above problem, and a curling control system capable of minimizing the occurrence of curling of a sheet during manufacture by laminating two or more types of sheets by a roll-to-roll process of a composite sheet, and a composite sheet manufactured by applying the same It is intended to provide a manufacturing method and a method of manufacturing an encapsulant for an organic electronic device.

The present invention for solving the above problems relates to a curling control system for manufacturing a composite sheet, and when manufacturing a composite sheet by laminating an encapsulating resin sheet and a metal sheet in a roll-to-roll process, a fixed roll, a supporting curling roll , A first curl roll, a second curl roll, an upper laminator roll, and a lower laminator roll.The encapsulation resin sheet and metal sheet are laminated by the pressure of the upper roll laminate and the lower roll laminate, and then composite. It is wound up by a sheet winding roll.

In a preferred embodiment of the present invention, the encapsulating resin sheet may be a single-layered sheet of an encapsulating resin layer or a multilayered sheet in which an encapsulating resin layer and a release layer are laminated.

In a preferred embodiment of the present invention, the metal sheet may be supplied between an upper laminator roll and a lower laminator roll by a fixed roll, a supporting curl roll, and a first curl roll.

As a preferred embodiment of the present invention, when the winding speed of the laminated composite sheet is 5 to 20 mpm, the tension applied to the metal sheet between the fixed roll and the laminate roll, and the composite sheet between the laminate roll and the composite sheet winding roll The applied tension is a curling control system for manufacturing a composite sheet, characterized in that it satisfies the following Equation 1;

[Equation 1]

T1 = (1.00 ~ 1.30)×T2

In Equation 1, T1 is the tension applied to the metal sheet between the fixed roll and the laminate roll (kgf/cm), and T2 is the tension applied to the composite sheet between the laminate roll and the composite sheet winding roll (kgf/cm). do.

As a preferred embodiment of the present invention, when the roll lamination machine is viewed from the side, the bonding point (M) and the supporting curl roll center position (H), which are the points where the encapsulating resin sheet and the metal sheet are first laminated, satisfy Equation 1 below. I can.

[Equation 1]

-40cm ≤ H ≤ M

In Equation 1, M is 0 on the xy coordinate.

As a preferred embodiment of the present invention, when the roll lamination device is viewed from the side, the center position h1 of the first curl and the center position h2 of the second curl may satisfy Equations 2 to 3 below.

[Equation 2]

-40cm≤ h1 ≤0

[Equation 3]

-60cm≤ h2 ≤20 cm

In Equations 2 and 3, each of h1 and h2 represents the y-coordinate position on the xy coordinate when the bonding point, which is the first bonding point of the encapsulant sheet and the metal sheet, is 0 on the xy coordinate. .

As a preferred embodiment of the present invention, when the winding speed of the laminated composite sheet is 5 to 20 mpm, and the tension (T1) applied to the metal sheet between the fixed roll and the laminate roll is 75 kgf/cm or more, the second curl The center position h2 may satisfy Equation 4 below.

[Equation 4]

0cm≤ h2 ≤20 cm

In Equation 4, h2 represents the y-coordinate position of the center position of h2 on the xy coordinate when the bonding point, which is the first bonding point of the encapsulating resin sheet and the metal sheet, is 0 on the xy coordinate.

In a preferred embodiment of the present invention, the metal sheet is supplied from a metal sheet unwinding roll (or a metal sheet supplying unit), and the encapsulating resin sheet may be supplied from an encapsulating resin sheet unwinding roll (or an encapsulating resin sheet supplying unit).

As a preferred embodiment of the present invention, the encapsulation resin sheet is supplied by the encapsulation resin unwinding roll at a position higher than the lamination point, and the metal sheet may be supplied to the metal sheet unwinding roll at a position higher or lower than the lamination point. , The encapsulation suit sheet unwinding roll may be supplied at a higher position than the metal sheet unwinding roll.

As a preferred embodiment of the present invention, when laminating a metal sheet and an encapsulating resin sheet, the lower laminate roll temperature may be 40 to 100°C, and the upper laminate roll temperature may be 40 to 100°C.

As a preferred embodiment of the present invention, the pressure applied by the upper and lower laminate rolls when laminating the encapsulant sheet and the metal sheet may be ^{1 to 8kgf/cm 2.}

As a preferred embodiment of the present invention, when the winding speed of the laminated composite sheet is 5 to 20 mpm, the metal sheet tension between the fixed roll and the laminate roll is 50 to 85 kgf/cm, and the laminate roll and the composite sheet winding roll The tension between the metal sheets may be 40 to 70 kgf/cm.

Another object of the present invention is to provide a method of manufacturing a composite sheet using the curling control system described above.

Another object of the present invention is to provide an encapsulant for an organic electronic device using the composite sheet manufactured by the above method.

As a preferred embodiment of the present invention, a method of manufacturing the encapsulant for an organic electronic device includes a first step of preparing a composite sheet manufactured by the method; A second step of performing slitting cutting on both sides of the composite sheet in the long side direction; And a three step of performing shearing cutting of the composite sheet subjected to the slitting cutting in a short side direction, and the second and third steps may be continuous processes.

The curling control system for manufacturing a composite sheet of the present invention can minimize and/or prevent the occurrence of curling in the sheet laminated with the metal sheet when manufacturing a composite sheet using a metal sheet, and defects in the composite sheet manufactured using this can be minimized and/or prevented. Can increase productivity and economy. In addition, when the sealing material for an organic electronic device is processed (or cut) by a mechanical cutting method using such a composite sheet, it is possible to improve the productivity of the sealing material by preventing separation and peeling between sheets.

1 is a schematic diagram of a curling control system for manufacturing a composite sheet of the present invention.
FIG. 2 shows the positions of the supporting curling roll, the first curling roll, the second curling roll, the upper laminator roll, and the lower laminator roll of the curling control system applied on xy coordinates.
3A and 3B are schematic cross-sectional views of a composite sheet and an organic electronic device encapsulant according to an embodiment of the present invention.
4 is a schematic diagram of slitting cutting.
5A and 5B are schematic views of sharing cutting and a top coat and a bottom knife used therein, and FIG. 5C is a schematic view for explaining a cut surface of a composite sheet.
6 is an SEM measurement image of a slit-cut long-side cut surface.
7 is an SEM measurement image of a cut surface cut by shearing by a top coat and a bottom coat knife.
8 shows a SEM image and a schematic diagram of the cut surface of the laser-cut composite sheet.
9 is a schematic diagram illustrating a description of a taper length and a taper angle.
10 is a photograph of the device and the performance used to measure the initial peel force of the release sheet of the composite sheet carried out in Experimental Example 2.
11 is an initial peel force measurement result of a release sheet of a composite sheet carried out in Experimental Example 2.

Hereinafter, the present invention will be described in more detail.

The curling control system for manufacturing a composite sheet of the present invention relates to a curling control system applied when manufacturing a composite sheet by laminating an encapsulating resin sheet and a metal sheet in a roll-to-roll process.

After each sheet is unwound from the rolled metal sheet supply unit (or metal sheet unwinding roll) and the encapsulation resin sheet supply unit (or the encapsulation resin sheet unwinding roll), the metal sheet and the encapsulation resin sheet are laminated through a roll lamination machine. , It is possible to manufacture a composite sheet by winding the laminated sheet with a composite sheet winding roll.

The roll lamination device of the curling control system includes a fixed roll (1), a supporting curl roll (2), a first curl roll (3), a second curl roll (4), an upper laminator roll (10), and It includes a lower laminator roll 20, and the encapsulating resin sheet and the metal sheet are laminated by the pressure of the upper roll laminate and the lower roll laminate.

Although not shown in the drawings, the curling control system may further include a metal sheet unwinding roll, an encapsulating resin sheet unwinding roll, and a composite sheet winding roll.

The metal sheet unwound from the metal sheet supply unit (or metal sheet unwinding roll) is supplied between the upper laminator roll and the lower laminator roll by a fixed roll, a supporting curl roll, and a first curl roll. Accordingly, after lamination with the encapsulation resin sheet, the presence or absence of curling and the frequency of the encapsulation resin sheet are affected.

In addition, by adjusting the positions of the supporting curl roll, the first curl roll and/or the second curl roll, the degree of curling of the supplied metal sheet can be controlled. When the winding speed of the laminated composite sheet is 5 to 20 mpm, the metal The tension applied to the metal sheet between the sheet unwinding roll or fixing rule, and the laminate roll is 50 to 85 kgf/cm, and the tension applied between the laminate roll and the composite sheet winding roll may be about 40 to 70 kgf/cm, , Preferably, when the winding speed is 5 to 20 mpm, the tension applied to the metal sheet between the fixed roll and the laminate roll and the tension applied to the composite sheet between the laminate roll and the composite sheet winding roll must satisfy Equation 1 below. I can.

[Equation 1]

T1 = (1.00 to 1.30) × T2, preferably T1 = (1.05 to 1.20) × T2, more preferably T1 = (1.08 to 1.15) × T2

In Equation 1, T1 is the tension applied to the metal sheet between the fixed roll and the laminate roll (kgf/cm), and T2 is the tension applied to the composite sheet between the laminate roll and the composite sheet winding roll (kgf/cm). do.

In Equation 1, if T1 (tension 1) exceeds 1.3 times T2 (tension 2), a problem of misalignment of the winding roll may occur when winding the laminated composite sheet, and T1 (tension 1) becomes T2 (tension 2). If it is less than ), there may be a problem in which the frequency of occurrence of curling and the degree of curling occur rapidly increase.

The positions of each roll to prevent curling of the composite sheet laminated by the laminate roll are as follows, and when the roll lamination machine is viewed from the side, the positions of each of these rolls are shown on the xy coordinate of FIG. .

In addition, the bonding point (M) and the center position of the supporting curl roll (H), which are the points where the encapsulating resin sheet and the metal sheet are first laminated on the xy coordinate of FIG. 2, may satisfy Equation 1 below, and satisfying this range minimizes curling. It is preferable from the side.

[Equation 1]

-40 cm≤ H ≤ M

In Equation 1, M is 0 on the xy coordinate.

In addition, on the xy coordinate of FIG. 2, the bonding point (M), which is the point at which the encapsulating resin sheet and the metal sheet are first laminated, the center position of the first curl (h1), and the center position of the second curl (h2), are from the following equations 2 to Equation 3 can be satisfied.

[Equation 2]

-40cm≤ h1 ≤0

[Equation 3]

-60cm≤ h2 ≤20 cm

In Equations 2 and 3, each of h1 and h2 represents the y-coordinate position on the xy coordinate when the bonding point, which is the first bonding point of the encapsulant sheet and the metal sheet, is 0 on the xy coordinate. .

And, when the winding speed is 5 ~ 20mpm, and the tension (T1) applied to the metal sheet between the fixed roll and the laminate roll is 75 kgf/cm or more, the center position (h2) of the second curling roll may satisfy Equation 4 below. have.

[Equation 4]

0cm≤ h2 ≤20 cm

In Equation 4, h2 represents the y-coordinate position of the center position of h2 on the xy coordinate when the bonding point, which is the first bonding point of the encapsulating resin sheet and the metal sheet, is 0 on the xy coordinate.

In addition, when laminating the metal sheet and the encapsulation resin sheet, the temperature of each of the lower laminate roll and the upper laminate roll may be 40 to 100°C, preferably 50 to 95°C, and more preferably 65 to 90°C. At this time, if the temperature of the laminate roll is less than 40°C, there may be a problem that lamination failure occurs, and if it exceeds 100°C, there may be a problem that the curl of the composite sheet increases.

In addition, the pressure applied by the upper and lower laminate rolls when laminating the encapsulating resin sheet and metal sheet is 1 to 8 kgf/cm ² , preferably 2.0 to 6.0 kgf/cm ² , more preferably 2.5 to 5.0 kgf/cm ^It can be 2. At this time, if the pressure exceeds 8 kgf/cm ² , there may be a problem that the curl of the composite sheet increases, and if the pressure is too weak, the composite sheet may not be laminated well, or the encapsulant sheet may come off after being laminated. There may be.

And, after lamination, the metal sheet may have a thickness of 60 µm to 150 µm, preferably 70 µm to 120 µm, and more preferably 75 µm to 105 µm.

And, after lamination, when the encapsulation resin sheet is an encapsulation resin layer alone, the thickness may be 30 µm to 100 µm, preferably 40 µm to 80 µm, more preferably 45 µm to 75 µm.

And, after lamination, when the encapsulation resin sheet has a two-layer structure of an encapsulation resin layer and a release layer, the encapsulation resin layer has a thickness of 30 µm to 100 µm, preferably 40 µm to 80 µm, more preferably 45 µm to 75 µm. Μm, and the release layer may have a thickness of 15 µm to 75 µm, preferably 25 µm to 60 µm, and more preferably 35 µm to 55 µm.

The total thickness of the composite sheet manufactured using the curling control system described above may be 120 μm to 280 μm, preferably 125 to 220 μm, more preferably 128 μm to 200 μm.

In addition, the laminated composite sheet includes a composite sheet 10 including a metal layer 14, an encapsulation resin layer 15, and a release layer 13, as shown in a schematic diagram in FIG. 3A as a preferred embodiment. It may include, or may include a composite sheet including the metal layer 14 and the encapsulation resin layer 15, the release layer is peeled off.

The composite sheet may further include a layer (or sheet) of a component different from the metal layer and the encapsulation resin layer and/or between the metal layer and the encapsulation resin layer, and between the encapsulation resin layer and the release layer It may further include a layer (or sheet) serving as a layer and/or of a component different from the encapsulation resin layer and the release layer.

And, as shown in schematic diagrams in A and B of Fig. 3, the encapsulation resin layer may include a single layer of pressure-sensitive adhesive layer or a multi-layered pressure-sensitive adhesive layer of two or more layers, and the encapsulation resin layer is composed of a multi-layered pressure-sensitive adhesive layer. If so, each layer of the pressure-sensitive adhesive layer may be composed of a pressure-sensitive adhesive component of a different composition and/or composition ratio.

A preferred embodiment of the metal sheet and the encapsulation resin sheet used for manufacturing the composite sheet will be described as follows.

[Metal sheet]

The metal sheet is iron (Fe), bismuth (Bi), tin (Sn), indium (In), silver (Ag), copper (Cu), zinc (Zn), antimony (Sb), nickel (Ni), chromium (Cr), aluminum (Al), cobalt (Co), manganese (Mn), titanium (Ti), molybdenum (Mo), silicon (Si), magnesium (Mg), tungsten (W) and alloys thereof It may contain one or more.

For example, bismuth (Bi), tin (Sn), indium (In), silver (Ag), copper (Cu), zinc (Zn), antimony (Sb), nickel (Ni), chromium (Cr), etc. A metal sheet (including inevitable impurities other than nickel and iron) comprising a metal sheet made of stainless steel, and more preferably an alloy containing 34 to 38% by weight of nickel and a balance of iron (Fe). I can.

[Encapsulation resin sheet]

The encapsulation resin layer of the encapsulation resin sheet can be made of an adhesive composition containing a polyolefin-based adhesive resin, and the polyolefin-based resin is poly(C ₂ ~) such as polyethylene, polypropylene, polypropylene, and polyisobutylene. C ₆ )alkylene resin; And a random copolymer resin in which ethylene, propylene and/or a diene-based compound is copolymerized. It may include one or two or more selected from.

For a preferred example, the polyolefin-based adhesive resin may include a compound represented by the following formula (1).

[Formula 1]

In Formula 1, R ¹ is a hydrogen atom or a straight chain alkenyl group of _{C 3} to C ₁₀ or a pulverized alkenyl group of _{C 4} to C ₁₀ ^{, preferably R 1} is a hydrogen atom, C ₄ to C ₈ It may be a straight-chain alkenyl group or a pulverized alkenyl group of _{C 4} to C _8. And, the n is a rational number that satisfies the weight average molecular weight of the compound represented by Formula 1 10,000 to 2,000,000, preferably satisfies the weight average molecular weight 30,000 to 1,550,000, more preferably satisfies the weight average molecular weight 40,000 to 1,500,000 It can be a rational number. If the weight average molecular weight is less than 10,000, panel sagging may occur due to a decrease in modulus, heat resistance may decrease, and reliability may decrease as the filling property of the desiccant decreases, and mechanical properties may decrease. , Lifting up with the substrate may occur due to the expansion of the volume of the desiccant due to the decrease in elasticity. In addition, when the weight average molecular weight exceeds 2,000,000, adhesion to the substrate may decrease due to a decrease in wettability, and adhesion to the panel may decrease according to an increase in modulus.

The compound represented by Formula 1 may have a crystallization temperature of 100°C to 140°C, preferably 110 to 130°C, and more preferably 115°C to 125°C, as measured by the following measurement method.

[How to measure]

_{The crystallization temperature (T c} ) is measured through peak analysis of the cooling curve of the heat flow measured by Differential Scanning Calorimetry (DSC) while cooling from 200℃ to -150℃ at a rate of 10℃.

In addition, the polyolefin-based adhesive resin may include a random copolymer in which ethylene, propylene, and a diene-based compound are copolymerized. In this case, ethylene and propylene may be randomly copolymerized in a weight ratio of 1: 0.3 to 1.4, preferably 1: 0.5 to 1.2. If the weight ratio of ethylene and propylene to be copolymerized is less than 1:0.3, it may cause a defect in panel adhesion due to an increase in modulus and hardness, and a problem of lowering the adhesive strength with the substrate and physical properties at low temperatures occurs, and the elastic modulus decreases. Accordingly, it may adversely affect the volume expansion of the desiccant. If the weight ratio exceeds 1:1.4, panel sag may occur due to a decrease in modulus and hardness, and a decrease in mechanical properties leads to a decrease in the mechanical properties of the product. Due to the difficulty of high filling, there may be a problem that the reliability is deteriorated. In addition, the diene-based compound may be included in an amount of 2 to 15% by weight, preferably 7 to 11% by weight, based on the total weight of the random copolymer copolymerized with ethylene, propylene, and the diene-based compound. If the diene-based compound is less than 2% by weight, it may cause a problem of panel sagging due to a decrease in modulus due to a low curing rate and curing density, and heat resistance may decrease. If it exceeds 15% by weight, adhesion with the substrate decreases due to lack of wettability due to high curing density, compatibility between resins decreases, panel adhesion decreases due to high modulus, and yellowing due to heat May result.

The polyolefin-based adhesive resin may be used by mixing two types of adhesive resins in terms of improving physical properties such as increasing elasticity, and a preferred example thereof is a random copolymer in which the ethylene, propylene and diene-based compounds are copolymerized (first adhesive Resin) and the compound represented by Formula 1 (second adhesive resin), preferably the first adhesive resin and the second adhesive resin in a weight ratio of 1: 0.1 to 10, preferably 1: 1 to It may be included in a weight ratio of 9, more preferably in a weight ratio of 1: 1.1 to 5. At this time, if the weight ratio exceeds 1:10, a problem of lowering the elastic force may occur, so when using the first adhesive resin and the second adhesive resin in combination, it is preferable to use within the above range.

The adhesive composition used for manufacturing the encapsulation resin layer may further include additives such as a tackifier, a desiccant, a curing agent, a photoinitiator, and an antioxidant in addition to the polyolefin-based adhesive resin described above.

Among the additives, the tackifier may be included without limitation as long as it is an adhesive resin commonly used in an adhesive composition for an organic electronic device encapsulant, and preferably hydrogenated petroleum resin, hydrogenated rosin paper, hydrogenated rosin ester resin, hydrogenated terpene resin, hydrogenated It may include at least one selected from a terpene phenol resin, a polymerized rosin resin, and a polymerized rosin ester resin. In addition, the tackifier is preferably used in an amount of 50 to 300 parts by weight, preferably 80 to 280 parts by weight, based on 100 parts by weight of the polyolefin-based adhesive resin. If the tackifier is less than 50 parts by weight per 100 parts by weight of the mixed resin, moisture resistance may not be secured, and if it is used in excess of 300 parts by weight, durability and moisture resistance may be deteriorated due to brittle. .

Among the additives, the desiccant may be used without limitation, as long as it is a desiccant commonly used in packaging of organic electronic devices, and preferably at least one of a desiccant including zeolite, titania, zirconia or montmorillonite as a component, a metal salt, and a metal oxide. It may include, and more preferably, a metal oxide.

Metal oxides include silica (SiO ₂ ), alumina (Al ₂ O ₃ ), lithium oxide (Li ₂ O), sodium oxide (Na2O), barium oxide (BaO), calcium oxide (CaO), or magnesium oxide (MgO). It may contain at least one of a metal oxide, an organic metal oxide, and phosphorus pentoxide (P ₂ O _{5 ).}

Metal salts are lithium sulfate (Li ₂ SO ₄ ), sodium sulfate (Na ₂ SO ₄ ), calcium sulfate (CaSO ₄ ), magnesium sulfate (MgSO ₄ ), cobalt sulfate (CoSO ₄ ), gallium sulfate (Ga ₂ (SO ₄ ) ₃ ), titanium sulfate (Ti(SO ₄ ) ₂ ) or nickel sulfate (NiSO ₄ ) sulfate, calcium chloride (CaCl ₂ ), magnesium chloride (MgCl ₂ ), strontium chloride (SrCl ₂ ), yttrium salt (YCl ₃ ), Copper chloride (CuCl ₂ ), cesium fluoride (CsF), tantalum fluoride (TaF ₅ ), niobium fluoride _{(NbF 5} ), lithium bromide (LiBr), calcium bromide (CaBr ₂ ), cesium bromide (CeBr ₃ ), selenium bromide ( Metal halides such as SeBr ₄ ), vanadium bromide (VBr ₃ ), magnesium bromide (MgBr ₂ ), barium iodide (BaI ₂ ) or magnesium iodide (MgI ₂ ), and barium perchlorate (Ba (ClO ₄ ) ₂ ) or magnesium perchlorate (Mg(ClO ₄ ) ₂ ) It may contain one or more of metal chlorate.

It is recommended to use a desiccant with a purity of 95% or more, and if the purity is less than 95%, not only does the moisture absorption function deteriorate, but the material contained in the desiccant acts as an impurity, which may cause defects in the adhesive film. It may affect, but is not limited thereto.

When using the desiccant, the appropriate amount may include 10 to 550 parts by weight, preferably 20 to 520 parts by weight, based on 100 parts by weight of the polyolefin-based adhesive resin. If the amount of the desiccant is less than 10 parts by weight, the durability of the organic electronic device is deteriorated and the moisture removal effect is significantly reduced. The reliability of the organic electronic device is deteriorated due to poor adhesion such as adhesion and adhesion to the organic electronic device, and as a phenomenon occurs due to excessive volume expansion when moisture is absorbed, the lifespan of the organic electronic device may be shortened.

Among the additives, the curing agent may be included without limitation as long as it is a material that can be used as a curing agent in general, and preferably may include a material capable of securing a sufficient crosslinking density of the adhesive film by acting as a crosslinking agent, and more preferably May include at least one selected from a urethane acrylate-based curing agent having a weight average molecular weight of 100 to 1500 and an acrylate-based curing agent having a weight average molecular weight of 100 to 1500. If the weight average molecular weight of the curing agent is less than 100, the adhesion to the panel and adhesion to the substrate decrease due to the increase in hardness, and outgas of the unreacted curing agent may occur. If the weight average molecular weight exceeds 1500, the softening property ( There may be a problem in that mechanical properties are deteriorated due to an increase in softness). In addition, the appropriate amount of the curing agent may be 2 to 50 parts by weight, preferably 5 to 40 parts by weight, based on 100 parts by weight of the polyolefin-based adhesive resin. If less than 2 parts by weight of the curing agent is used, the desired gelation rate and modulus cannot be achieved, and elasticity may be deteriorated, and if it is used in excess of 50 parts by weight, panel adhesion failure and wettability due to high modulus and hardness A problem of lowering adhesive strength may occur due to the deterioration.

Among the additives, the photoinitiator may be included without limitation as long as it is used as a commonly used photoinitiator, and preferred examples include Mono Acyl Phosphine, Bis Acyl Phosphine, and α- Hydroxyketone (α-Hydroxyketone), α-aminoketone (α-Aminoketone), phenylglyoxylate (Phenylglyoxylate), benzyl dimethyl-ketal (Benzyldimethyl-ketal) may contain at least one selected from. In addition, an appropriate amount of the photoinitiator may be used in an amount of 0.1 to 10 parts by weight, preferably 0.5 to 8 parts by weight, based on 100 parts by weight of the polyolefin-based adhesive resin. If the photoinitiator is used in an amount of less than 0.1 parts by weight, heat resistance may be poor due to poor curing, and if it is used in excess of 10 parts by weight, heat resistance may be poor due to a decrease in curing density.

The adhesive composition used in manufacturing the encapsulation resin layer may have a viscosity of 100,000 to 300,000 Pa·s (50°C), preferably a viscosity of 120,000 to 280,000 Pa·s (50°C). If the viscosity is less than 100,000 Pa·s (50℃), the processability becomes poor due to the increase in tack, which may cause a problem that the release layer (or release sheet) cannot be peeled off, and the viscosity is 300,000 Pa·s (50 ℃), the adhesive strength with the substrate may be too low due to a decrease in tack.

The encapsulation resin layer may be prepared as a single layer or a multilayer pressure-sensitive adhesive layer as described above by using the adhesive composition, and a preferred example is as follows. However, this is an example for helping the understanding of the present invention and should not be interpreted to limit the present invention.

When the encapsulation resin layer is a pressure-sensitive adhesive layer having a single-layer structure, the glass adhesion may be 1500 gf/25 mm or more, preferably 1600 gf/25 mm or more. At this time, for adhesion, an adhesion measuring tape (7475, TESA) is laminated on the upper surface of the adhesive film through a hand roller (2Kg Hand Roller), and the sample is cut into a width of 25 mm and a length of 120 mm, and then the lower surface of the adhesive film is glassed at 80°C. After lamination, the prepared sample was allowed to stand at room temperature for 30 minutes, and the glass adhesion was measured at a speed of 300 mm/min.

에서 접착필름 상면을 두께 80㎛의 Ni 합금에 라미네이션하고, 핸드롤러(2Kg Hand Roller)를 통해 점착력 측정 테이프(7475, TESA)을 접착필름 하면에 라미네이션하여, 시료를 폭 25㎜ 및 길이 120㎜ 재단한 후, 준비된 시료를 30분 상온 방치하고, 300㎜/min 속도로 점착력을 측정한 것이다.And the adhesion of the encapsulation resin layer to the metal layer may be 1000 gf/25 mm or more, preferably 1100 gf/25 mm or more. At this time, the adhesion to the metal layer is 80

The upper surface of the adhesive film is laminated on an 80㎛ thick Ni alloy, and an adhesive force measuring tape (7475, TESA) is laminated to the lower surface of the adhesive film through a hand roller (2Kg Hand Roller), and the sample is cut by 25mm in width and 120mm in length. After that, the prepared sample was allowed to stand at room temperature for 30 minutes, and the adhesive strength was measured at a speed of 300 mm/min.

In addition, the encapsulation resin layer may be formed of a pressure-sensitive adhesive layer having a two-layer structure of the first pressure-sensitive adhesive layer 11 and the second pressure-sensitive adhesive layer 12, as shown in the schematic diagram in FIG. 1B.

The first pressure-sensitive adhesive layer 11 is a layer that directly contacts the organic electronic device, and may include a first mixed resin 11b, a tackifier, and a first absorbent 11a. At this time, the first mixed resin 11b may include a first adhesive resin and a second adhesive resin, and the tackifier may include a first adhesive agent, and may further include a second adhesive agent. have.

The polyolefin-based adhesive resin 11b of the first pressure-sensitive adhesive layer may include the first adhesive resin and the second adhesive resin. In addition, the tackifier of the first pressure-sensitive adhesive layer 11 may include one or two tackifiers (first and second tackifiers). At this time, the tackifier may be of the type described above, and preferably may include a hydrogenated petroleum resin having a different softening point. For example, when hydrogenated petroleum resins with different softening points are included, the softening point of the first tackifier may be smaller than that of the second tackifier, and the mixed amount of the first tackifier and the second tackifier is 1 : In a weight ratio of 0.5 to 1.5, preferably 1: It may be included in a weight ratio of 0.6 to 1.4. If the weight ratio of the first tackifier and the second tackifier is less than 1:0.5, a problem of lowering the heat resistance may occur, and if the weight ratio exceeds 1:1.5, the adhesive strength with the substrate decreases due to a decrease in adhesion and wettability. Problems can arise.

And, the first moisture absorbent (11a) used in the production of the first pressure-sensitive adhesive layer can be used without limitation, as long as it is a material that can be used as a conventional desiccant, preferably, the BET specific surface area is 2 to 20 m ² /g, preferably Silica having a BET specific surface area of 3 to 14 m ² /g, more preferably a BET specific surface area of 4 to 8 m ² /g may be used. As silica is used as the first absorbent 11a, the moisture removal performance is excellent, the separation of the organic electronic device and the encapsulant can be prevented, and durability of the organic electronic device can be significantly increased.

The adhesive composition used to manufacture the second pressure-sensitive adhesive layer 12 may include a polyolefin-based adhesive resin 12b, a tackifier, and a second absorbent 12a. At this time, the polyolefin-based adhesive resin 12b may include a first adhesive resin and a second adhesive resin, and the tackifier is a first pressure reducing agent using a mixture of two types of tackifiers, the first and second tackifiers. Unlike the pressure-sensitive adhesive layer, only the first adhesive imparting agent may be used. In addition, as the moisture absorbing agent, the same moisture absorbing agent used in the manufacture of the first pressure sensitive adhesive layer may be used, and calcium oxide may be preferably used.

[Release layer]

In the composition of the encapsulating resin sheet, the release layer may be a release sheet material commonly used in the art as a liner sheet material, and preferred examples include PET (polyethylene terephthalate), paper, and PI ( Poly Imide) and PE (Poly Ester).

The composite sheet manufactured using the curling control system described above can be processed (or cut) by the mechanical cutting method as follows to manufacture an encapsulant for an organic electronic device, for example, manufactured by the above method. The resulting composite sheet can be manufactured by cutting the long side of the composite sheet through slitting cutting and cutting the short side of the composite sheet through shearing cutting by mechanical cutting, thereby manufacturing an encapsulant for an organic electronic device.

In more detail, the method of manufacturing the encapsulant for an organic electronic device of the present invention comprises: 1 step of preparing a composite sheet; A second step of performing slitting cutting on both sides of the composite sheet in the long side direction; And a 3 step of performing the sharing-cutting of the composite sheet subjected to the slitting cutting in the short side direction, thereby manufacturing an encapsulant for an organic electronic device.

As described above, the composite sheet of step 1 includes a metal layer, an encapsulation resin layer, and a release layer, and in addition to these layers, between the metal layer and the encapsulation resin layer, a layer of a component different from the metal layer and the encapsulation resin layer and/ Alternatively, a layer serving as a role may be further included, and a layer of a component different from the encapsulation resin layer and the release layer and/or a layer serving as a layer may be further included between the encapsulation resin layer and the release layer. In addition, the composition, physical properties, and characteristics of the metal layer, the encapsulation resin layer, and the release layer are as described above.

As described above, the composite sheet in step 1 of the present invention may be a composite sheet manufactured using a curling control system.

The slit cutting of the second step may be performed with a slit cutting machine including a top coat knife in the form of a rotary blade and a bottom coat knife in which an insertion portion for the top coat knife is formed, as shown in the schematic diagram in FIG. 4. In addition, it is preferable in terms of cutting quality to use a high-cement knife for the top coat knife and a carbide knife for the bottom coat knife. In addition, the land value of the top coat knife of the slitting cutter is preferably 0.10 to 0.30 mm, preferably 0.15 to 0.25 mm, more preferably 0.18 to 0.22 mm, and if the land value is less than 0.10 mm, the knife There may be a problem in the durability of the product, and if the land value exceeds 0.30 mm, there may be a problem in the cutting quality, and thus there may be a problem that the taper angle increases.

The side pressure applied to the top coat knife during slitting cutting is 0.5 to 2.5 kgf/cm2, preferably 0.5 to 1.8 kgf/cm2, more preferably 0.8 to 1.2 kgf/cm2, and at this time, the side pressure is 0.5 kgf. If it is less than /cm2, there may be a problem with the uniformity of the cut surface, and if the side pressure exceeds 2.5 kgf/cm2, there may be a problem that the off-set generation area increases.

And, the insertion depth of the upper coat knife into the lower coat knife during the slitting cutting is preferably 0.3 to 2.0 mm, preferably 0.5 to 1.5 mm, more preferably 0.6 to 1.3 mm, and at this time, if the insertion depth is 0.3 mm There may be a problem that a portion that is not cut may occur, and if the insertion depth exceeds 2.0 mm, there may be a problem that the pressure-sensitive adhesive layer collapses (clumps).

In addition, during slitting and cutting, the rotational speed of the rotary blade, which is the top knife, is preferably rotated at the same speed as that of the composite sheet.

In addition, after the second-stage slitting cutting, a process of continuously wet cleaning the slit-cut long side portion of the composite sheet may be further performed.

The wet cleaning can be performed by a general wet cleaning method used in the art, and preferably, an edge cleaner process is performed with a wet cleaning system in which two sets of wet cleaners constitute one set, and the wet cleaning system A clamp is positioned at each of the upper and lower portions of the long side of the composite sheet, and a cleaning paper is continuously supplied between the clamp and the composite sheet, and the supply direction of the cleaning paper may be supplied in a direction perpendicular to the progression direction of the composite sheet.

As shown in the schematic diagrams in FIGS. This can be done using The top coat knife is preferably a blade angle of 0.140° to 0.300°, preferably 0.143° to 0.287°, more preferably 0.143° to 0.225°, and at this time, if the blade angle is less than 0.140°, damage to the composite sheet There may be a problem that is applied, and when the blade angle of the top coat knife exceeds 0.300°, the cutting surface may be pushed, resulting in a problem of dimensional uniformity.

In addition, it is appropriate that the gap between the upper coat knife and the lower coat knife is 0.5 μm to 50 μm, preferably 1 μm to 25 μm, more preferably 2 μm to 10 μm, and if the distance exceeds 50 μm There may be a problem with the release sheet being lifted.

In addition, it is appropriate that the gap between the upper coat knife and the lower coat knife is 0.5 μm to 50 μm, preferably 1 μm to 25 μm, more preferably 2 μm to 10 μm, and if the distance exceeds 50 μm There may be a problem with the release sheet being lifted.

In addition, the land value of the top coat knife used for sharing cutting is 0.10 to 3.00 mm, preferably the land value of the top coat knife is 0.10 to 2.00 mm. More preferably 0.15 to 2.00 mm, even more preferably the land value of the top coat knife is preferably 0.18 to 1.80 mm, and at this time, if the land value of the top coat knife is less than 0.10 mm, there may be a problem in the durability of the knife. If the land value of the knife exceeds 3.0mm, there may be a problem with the cutting quality.

In addition, the sharing cutting speed may be adjusted according to the composite sheet progression speed and the size of the composite sheet to be manufactured, preferably 150 to 300 mm/sec, more preferably 180 to 250 mm/sec.

Next, after the three-step sharing cutting, a process of continuously dry-free cleaning the composite sheet may be performed.

The dry cotton cleaning can be performed by a general dry cleaning method used in the art, and preferably, the dry cotton cleaning can continuously perform a static electricity removal process, an air shower process, a static electricity removal process, a wiping process, and a static electricity removal process. And, preferably, it is possible to use a dry cleaning machine configured as shown in the schematic diagram of FIG. It is preferable to use a hurricane cleaner in which an inonizer, an air knife, a rotary brush, and a cleaner equipped with suction are provided above and below the composite sheet.

The inonizer is a device for removing static electricity through physical friction between the ionizer and the sheet before the air shower process, before the whisk process, and after the whisk process.

In addition, the air knife is a device for performing an air shower process, and the rotating brush is a device for performing a whisking process. In addition, the suction is a device for discharging the floating matter generated in the air shower process and the whisking process to the outside.

And, the upper brush rotation direction is the reverse direction of the sheet travel direction (rotation speed about 200 ~ 400 rpm), the lower brush rotation direction is the forward direction of the sheet movement direction (rotation speed about 200 ~ 400 rpm), and the suction suction pressure is 5 ~ It is better to be around 20 CMM.

The structure of each layer of the encapsulant for an organic electronic device of the present invention is the same as that of the composite sheet described above.

In addition, the encapsulant may be a sheet having a cut surface formed at a plurality of ends, preferably a sheet including four ends, and having a cut surface formed at each end thereof.

In the encapsulant, the cut surface is a cut surface formed by a mechanical cutting method, and the encapsulant of the present invention may have four cut surfaces, and two of the four cut surfaces are slitting-cut long-side cut surfaces, and the other 2 The cut surfaces of the dogs may be short-side cut surfaces cut by sharing.

The cut surface may have two long-side cut surfaces (slit-cut cut-off plane) and two short-side cut planes (sharing cut cut-off planes) satisfying Equation 1 below.

[Equation 1]

Average taper angle of short side cuts ≤ Average taper angle of long side cuts

In Equation 1, the taper angle refers to the angle between the lowermost surface end of the lowermost layer of the cut surface and the uppermost surface end of the uppermost layer of the cut surface when viewed from the side direction of the cut surface to be tapered. .

The two long-side cut surfaces are cut surfaces formed by slitting cutting, and the surface of the long side cut surfaces has a comb pattern.

Each of the two long-side cut surfaces may have the same or different taper angle from each other, and each of the two short-side cut surfaces may have the same or different taper angle from each other, preferably the two long-side cut surfaces and the The two short-side cut surfaces may satisfy Equation 2 below.

[Equation 2]

Taper angle deviation of the long side cut surface <Taper angle deviation of the short side cut plane

In Equation 2, the taper angle deviation of the long-side cut surface means the difference in the taper angle of each of the two long-side cut surfaces, and the taper angle deviation of the short-side cut surface means the difference in the taper angle of each of the two short-side cut surfaces.

In the encapsulant of the present invention, the taper angle of the long-side cut surface, which is the cut surface formed by the slitting cutting, may be 80° to 90°, preferably 82° to 90°.

More specifically, in the case of a composite sheet including a metal layer, an encapsulation resin layer, and a release layer, the taper angle of the slitting-cut cut surface may be 83˚ to 90˚, preferably 85˚ to 90˚. In addition, in the case of the composite sheet including the metal layer and the encapsulation resin layer from which the release layer has been removed, the taper angle of the slitting-cut cut surface may be 80˚ to 90˚, preferably 81˚ to 89˚.

In addition, the tapered length of the long-side cut surface is 20 μm or less, and the cut scrap of the long-side cut surface can be removed through a scrap winder.

And, in the case of the composite sheet (encapsulation material) including the metal layer, the encapsulation resin layer and the release layer, the shearing-cut cutting surface is formed by the first cutting surface formed by the undercutting knife of the sharing cutting knife and the upper coating knife of the sharing cutting knife. The second cut surface may have a taper angle of 73° to 90° (or 0° to -17°), and the second cut surface may have a taper angle of 73° to 90°. In this case, the taper length of the first cut surface is 0 to +60 μm, preferably 0 to +50 μm, and the taper length of the second cut surface is 0 to +60 μm (or 0 to -60 μm), preferably For example, it may be 0 to +50 µm (or 0 to -50 µm).

In addition, in the case of a composite sheet (encapsulation material) including a metal layer and an encapsulation resin layer from which the release layer has been removed, the first cutting surface has a taper angle of 67˚ to 90˚ (or 0˚ to -23˚), and the The second cut surface may have a taper angle of 68˚ to 88˚. At this time, the taper length of the first cut surface is 0 to +60 μm, preferably 0 to +50 μm, and the taper length of the second cut surface is 0 to +60 μm (or 0 to -60 μm), preferably 0 It may be ~ +50㎛ (or 0 ~ -50㎛).

The taper angle and taper length of the long-side cut surface and the short side cut surface are relatively high taper angles and low taper lengths compared to the cut plane formed by the laser cutting method, which is an off-set formed by the laser cutting method. This is because the region does not occur on the cut surface of the mechanical cutting method or is very low.

For example, in order to process the composite sheet 10 including the metal layer 14, the encapsulation resin layer 15, and the release layer 13 to an appropriate size, mechanical cutting, that is, in the long side (longitudinal direction) Silver slitting cutting is performed, and sharing cutting is performed in the short side direction, and the encapsulant thus manufactured has 4 ends and 4 cut surfaces, and the long side cut surface and the short side cut surface have different cut surface shape, taper angle, and taper length. , The first short-side cut surface formed by the lowering knife of the sharing cutting knife of the short-side cut surface and the second short-side cut surface formed by the upper-cutting knife of the sharing cutting knife may have different taper angles and taper lengths.

In addition, the metal layer may have a thickness of 60 µm to 150 µm, preferably 70 µm to 120 µm, and more preferably 75 µm to 105 µm.

In addition, the encapsulation resin layer may have a thickness of 30 µm to 100 µm, preferably 40 µm to 80 µm, and more preferably 45 µm to 75 µm.

In addition, the release layer may have a thickness of 15 µm to 75 µm, preferably 25 µm to 60 µm, and more preferably 35 µm to 55 µm.

The encapsulant of the present invention may have a total thickness of 120 µm to 280 µm, preferably 125 to 220 µm, and more preferably 128 µm to 200 µm.

The encapsulant of the present invention prepared in this way is under the conditions of a jig descending speed and a rising speed of 1.0 mm/sec, a dwell force of 800 gf and a dwell time of 10.0 seconds, when measuring the initial peel force by the UTM method. , The initial peeling force of the corner of the release layer may be 200 to 400 gf, preferably 250 to 380 gf, more preferably 300 to 370 gf. The initial peel force value of this encapsulant is relatively very low compared to that of the encapsulant manufactured by laser cutting with an initial peel force of 500 gf or more, which is generated and formed on the cut surfaces of the release layer and the encapsulation resin layer during laser cutting. This is due to the difference in the presence or absence of residues.

In the encapsulant of the present invention, the release layer surface has a height deviation of 0 to 4 µm, preferably 0 to 2 µm, and more preferably 0 to 1.5 µm. Here, the height of the height deviation means a height in the vertical direction from the lower surface of the release layer at the junction between the encapsulation resin layer and the release layer to the upper surface corresponding to the lower surface of the release layer.

[Equation 1]

Height deviation = (Maximum height of the edge of the release layer)-(Height of the center of the release layer)

In Equation 1, the edge of the release layer means a portion of the surface of the release layer up to 1 mm in the direction from the cut surface to the inside of the release layer.

Compared with the high height deviation due to the formation of a barrier at the end of the release layer by thermal fusion, the sealing material of the present invention has a very low or no height deviation because such a barrier hardly occurs. .

Hereinafter, the present invention will be described in more detail through examples. However, the following examples do not limit the scope of the present invention, which should be construed to aid understanding of the present invention.

[Example]

Preparation Example 1-1: Preparation of encapsulation resin sheet

(1) Preparation of polyolefin-based adhesive resin

A polyolefin-based adhesive resin was prepared by mixing a random copolymer copolymerized with ethylene, propylene, and a diene-based compound (first adhesive resin) and a compound represented by the following formula (1) (second adhesive resin) in a weight ratio of 1: 2.33.

The first adhesive resin was prepared by copolymerizing ethylene and propylene monomers in a weight ratio of 1:0.85, and copolymerizing a diene-based compound at 9% by weight based on the total weight of the random copolymer, and the diene-based compound was ethylidene norbornene ( ethylidene norbornene) is a random copolymer with a weight average molecular weight of 500,000.

[Formula 1]

In Formula 1, R ¹ is isoprene, and n is a rational number that satisfies the weight average molecular weight of 400,000 of the compound represented by Formula 1.

For each of the first adhesive resin and the second adhesive resin, the peak analysis of the cooling curve of the heat flow measured by a differential scanning calorimetry (DSC) was performed while cooling at a rate of 10 °C from 200 °C to -150 °C. The crystallization temperature (Tc) was measured through, the crystallization temperature was not measured for the first adhesive resin, and the second adhesive resin was measured at 120°C.

(2) Preparation of encapsulating resin sheet

80 parts by weight of a first adhesive agent (SU-90, Kolon Industries) and 50 parts by weight of a second adhesive agent (SU-100, Kolon Industries) based on 100 parts by weight of the previously prepared polyolefin-based adhesive resin (first adhesive resin). Part by weight, 11 parts by weight of acrylate (M200, Miwon Specialty Chemical) having a weight average molecular weight of 226 as a curing agent, 3 parts by weight of a photoinitiator (irgacure TPO, Ciba), and 24 parts by weight of silica having an average particle diameter of 0.5 µm were added and stirred. . After removing foreign substances by passing through a capsule filter, the mixture is applied with a slot die coater on a 38㎛ thick peeling release PET (REL382, Toray Advance Materials), and then dried at 120℃ to remove the solvent. A first pressure sensitive adhesive layer having a final thickness of 10 μm was formed.

Next, based on 100 parts by weight of the polyolefin-based adhesive resin (second adhesive resin) prepared above, 150 parts by weight of the first adhesive imparting agent (SU-90, Kolon Industries), acrylate having a weight average molecular weight of 226 as a curing agent as a curing agent. (M200, Miwon Specialty Chemical) 17 parts by weight, 3 parts by weight of a photoinitiator (irgacure TPO, Ciba), and 100 parts by weight of calcium oxide having an average particle diameter of 3 µm were added and stirred. After the mixture was stirred, the viscosity was adjusted to 800 cps at 20℃, passed through a capsule filter to remove foreign substances, and then applied to a light peeling release PET (TG65R, SKC) having a thickness of 36um using a slot die coater, and then dried at 120℃. To remove the solvent to form a second pressure sensitive adhesive layer having a final thickness of 40 μm.

The prepared first pressure-sensitive adhesive layer is laminated to face the second pressure-sensitive adhesive layer and passed through a 70° C. lami roll to encapsulate an organic electronic device. An adhesive sheet was prepared (see Fig. 1 b).

In addition, a PET release sheet was laminated on the second pressure-sensitive adhesive layer to prepare an encapsulating resin sheet, and then wound up to prepare an encapsulating resin sheet.

Preparation Example 2: Face Seal Metal Sheet Preparation

A metal sheet having an average thickness of 80 μm with a density (d) of 8.1 and a Vickers hardness of 200HV was prepared, containing about 36% by weight of Ni and the balance of iron (Fe) (including essential impurities). Prepared by winding up.

Example 1: Preparation of composite sheet (FSPM sheet) 1

A composite sheet (FSPM) was prepared by laminating the encapsulating resin sheet of Preparation Example 1-1 and the metal sheet of Preparation Example 2 by a roll-to-roll process, but through a curling control system using a roll lamination device shown in a schematic diagram in FIG. 1 The sheet was prepared.

At this time, the roll lamination device includes a fixed roll, a supporting curl roll, a first curl roll, a second curl roll, an upper laminator roll, and a lower laminator roll, and the metal sheet is unwound from the metal sheet supply unit (metal sheet unwinding roll), and the fixed roll and the supporting curl roll , While passing through the first curled roll, it was made to be supplied between the upper and lower roll laminates. In addition, the encapsulation resin sheet is supplied from the encapsulation resin sheet supply unit (encapsulation resin unwinding roll) to the upper and lower roll laminates, but based on the lamination point of the upper and lower roll laminates, the encapsulation resin sheet supply unit is a metal sheet supply unit (metal sheet unwinding roll). It is located on a higher level.

And, the positions of the fixed roll, the supporting curl roll, the first curl roll, and the second curl roll are shown in Table 1 below. At this time, Table 1 below shows the positions of each of these rolls in xy coordinates, and the point 0 in the xy coordinates is the point (M) at which the metal sheet and the encapsulant sheet are laminated between the upper laminator roll and the lower laminator roll (Fig. 2).

And, by winding the laminated composite sheet with a winding roll (winding speed 15 mpm). An FSPM sheet (composite sheet) having a three-layer structure (metal layer (80 µm)-encapsulation resin layer (50 µm)-release layer (38 µm)) was prepared.

division
(in xy coordinates
location) Example 1 x coordinate y coordinate
(Height) Laminate Roll (Laminate Point, M) 0 cm 0 cm Supporting Curl -45cm -10cm 1st curl -26cm -20cm 2nd curl 98 cm -45cm Top laminate roll temperature 80 ℃ Bottom laminate roll temperature 80 ℃ Laminate roll pressure 3 kgf / cm ²

Examples 2 to 13 and Comparative Examples 1 to 7

The FSPM sheet, which is a composite sheet, was manufactured in the same manner as in Example 1, but after designing a curling control system with different y coordinates of the first curl roll and the second curl roll, a three-layer structure (metal layer (80 μm)) was used. FSPM sheets of -encapsulation resin layer (50 µm)-release layer (38 µm)) were prepared as shown in Table 2 below.

In addition, the measurement results of the tension applied to the metal sheet from the fixed roll to the laminate roll (tension 1, T1) and the tension applied to the metal sheet from the laminate roll to the composite sheet winding roll (tension 2, T2) are shown in Table 2 below. Indicated.

In addition, the degree of curling occurring in the encapsulating resin sheet of the laminated composite sheet was measured using a steel ruler, and the results are shown in Table 2 below.

The degree of curling occurrence is in the range of 0 ~ 5 mm, and the measured curling value is negative or exceeds +5 mm, it is judged as a defect.

division Winding
Speed(mpm)/
Supporting Curl
y coordinate (cm) Tension 1
(kgf/cm,
T1) Tension 2
(kgf/cm,
T2) 1st curl
y coordinate
(cm,h1) 2nd curl
y coordinate
(cm,h2) curling
Occur
Degree
(mm) Example 1 15/-10 55 50 -20 -45 2.0 Example 2 15/-10 55 50 -10 -45 3.0 Example 3 15/-10 55 50 -30 -45 1.5 Example 4 15/-10 55 50 -40 -45 1.0 Example 5 15/-10 55 50 -10 0 5.0 Example 6 15/-10 55 50 -10 -10 4.5 Example 7 15/-10 55 50 -10 -30 3.5 Example 8 15/-10 55 50 -10 -50 2.0 Example 9 15/-10 55 50 -10 -60 1.7 Example 10 15/-10 85 75 -10 +15 2.5 Example 11 15/-10 70 55 -10 +15 5.0 Example 12 10/-10 55 50 -20 -45 3.0 Comparative Example 1 15 55 50 -50 -45 -0.5 Comparative Example 2 15 55 50 +5 -45 6.0 Comparative Example 3 15 55 50 -10 +25 7.5 Comparative Example 4 15 55 50 -10 -65 -1.0 Comparative Example 5 15/-10 100 88 -10 +15 -2.5 Comparative Example 6 15/-10 80 55 -10 0 3.5 Comparative Example 7 15/-10 85 75 -20 -10 -1.0

Looking at the curling measurement results in Table 2, in the case of Examples 1 to 12, when curling occurred, it was confirmed that curling occurred within the range of 0 to 5 mm, thereby minimizing the degree of curling occurrence.

In contrast, in the case of Comparative Example 2 in which the position of the first curled roll exceeded 0 in the y-coordinate and Comparative Example 3 in which the position of the second curled roll exceeded 20 cm in the y-coordinate, there was a problem that curls exceeded 5 mm.

In addition, Comparative Example 1 in which the first curl position was too low, Comparative Example 4 in which the second curl position was less than -60 cm in the y coordinate, and the tension (tension 1) applied to the metal sheet from the fixed roll to the laminate roll was excessive. In the case of Example 5 and Comparative Example 7, in which the position of the second curled roll was less than 0 cm in the state where the tension 1 exceeded 75 kgf/cm, there was a problem that the generated curling value was negative.

And, in the case of Comparative Example 6 where the difference between the tension 1 (T1) and the tension 2 (T2) was very large, the curling value was appropriate, but there was a problem in that the alignment of the winding roll was distorted when winding the laminated composite sheet.

Examples 13 to 15 and Comparative Examples 8 to 10

A composite sheet was prepared under the same winding speed, tension 1, tension 2, first curl position and second curl position conditions as in Example 1, but the degree of curling occurrence by varying the temperatures of the upper and lower laminate rolls as shown in Table 3 below. Was measured.

division Top
Laminate roll temperature (℃) lower
Laminate roll temperature (℃) Laminate roll pressure
(kgf/cm ² ) curling
(mm) Paper
Bad Example 1 80℃ 80℃ 3.0 2.0 pass Example 13 50℃ 50℃ 3.0 1.0 pass Example 14 95℃ 95℃ 3.0 4.5 pass Example 15 80℃ 80℃ 7.0 4.0 pass Comparative Example 8 35℃ 35℃ 3.0 1.0 Bad Comparative Example 9 110℃ 110℃ 3.0 7.5 pass Comparative Example 10 80℃ 80℃ 9.0 7.0 pass

Looking at the degree of occurrence of curling in Table 3, in the case of Comparative Example 8, the degree of occurrence of curling was appropriate, but a defect in lamination of the composite sheet occurred.

In addition, in the case of Comparative Example 9 in which the laminate roll temperature was too high, compared with Example 14, there was a problem in that curling rapidly increased, and in the case of Comparative Example 10 in which the ^{roll pressure exceeded 8 kgf/cm 2, Example} Compared with 15, there was a problem that the curling increased sharply.

Manufacturing Example 1: Manufacturing of an organic electronic device encapsulant through SSC (Slitting & Shearing Cutting) process

The FSPM sheet, which is the rolled and wound composite sheet of Example 1, is an SSC (Slitting & Shearing Cutting) automation device: a cutting object supply part, a slitting cutting part, an edge cleaner part, an automatic dimension inspection part, a sharing cutting part, and a dry type. Includes tax-free government.

(1) slitting cutting process

As shown in the schematic diagram in Figure 4, the slitting cutting unit includes a top coat that is a circular knife with a diameter of 150 mm as a cutting blade and a bottom coat that is a circular knife with a diameter of 150 mm, and the top coat is made of a highce material, and the bottom coat is It is a carbide material, and the land values of the top and bottom are 0.2mm each.

The rolled composite sheet supplied from the cutting object supply part was simultaneously slit-cutting both long sides in the longitudinal direction of the slitting cutting part, and cutting was performed so that the release layer of the FSPM sheet faced the top coat direction during cutting. In addition, the lateral pressure applied to the rotary blade for slitting cutting was 1.0 kgf/cm2, and the depth of the rotary blade, which is the upper coating based on the surface of the undercoat during cutting, was cut under the condition of 0.8mm. In addition, the cut scrap was removed through a scrap winder.

(2) Shearing cutting process

After performing an automatic inspection of performing dimensional correction by checking the position value of the FSPM sheet subjected to slitting cutting through a camera, a shearing cutting process of cutting the short side of the FSPM sheet was performed.

In the sharing process, as shown in Figs. 3A and 3B, cutting is performed through the vertical motion of the top coat, the gap between the bottom knife and the top knife in the sharing cutting process is 5 μm, and the blade angle (Slope) of the top knife Is 0.143*, and the primer knife has no slope. In addition, the material of the knife was a high-ce material for the top coat, and a carbide material for the bottom coat. And, the cutting speed was 200mm/Sec.

Fig. 6 shows a SEM measurement photograph of the slit-cut cut surface (long side) of the prepared encapsulant for an organic electronic device.

Looking at the slit-cut cut surface, a comb pattern is formed on the slit-cut cut surface, which is considered to be formed by a rotating blade.

In addition, SEM measurement pictures of the shearing-cut cut surface (bottom cut) of the prepared encapsulant for organic electronic devices are shown in FIG. 7A, and the SEM measurement pictures of the sharing-cut bottom and top cut surfaces are shown in FIG. 7B.

When manufacturing the encapsulant according to the SSC process of the present invention, when viewed in the direction of progression of the composite sheet (FSPM sheet), the front short side is formed by the undercoat knife for sharing cutting, and the rear short side is formed by the topcoat knife for sharing cutting. A cut surface is formed. Accordingly, referring to FIG. 5, unlike the slit-cut cut surface, the sharing-cut cut surface has no comb pattern, and a line pattern is formed in the vertical direction. In addition, it can be seen that the cross-sectional shape of the top and bottom cuts is different, and the off-set area is hardly formed on the short side of the bottom cut, and the off-set area of the short side is slightly different. I was able to confirm that.

Comparative Production Example 1

The same composite sheet (FSPM sheet) as the rolled composite sheet of Example 1 was prepared.

Next, the composite sheet was _first cut the encapsulation resin layer and the release layer by a CO 2 laser cutting method.

Next, the metal layer of the composite sheet was secondarily cut using an optical fiber laser to prepare an encapsulant prepared by a laser cutting method.

At this time, _{the power of CO 2} laser cutting was about 140 W/cm ² , and the power of fiber laser cutting was 170 W/cm ² .

The SEM measurement photograph of the manufactured encapsulant is shown in FIG. 8, and a conceptual diagram of the barrier formed at the end of the release layer, the residues present in the release layer and the encapsulation resin layer, and off-set regions that can be seen from the SEM image Is shown in FIG. 8.

Referring to FIGS. 6 to 7, in the case of Comparative Production Example 1 manufactured by laser cutting, unlike Preparation Example 1 in which there is no barrier and residue, and there is no or minimized off-set region, a barrier is formed on the upper surface of the release layer, and release It was confirmed that the residues present in the layer and the encapsulation resin layer were formed, and the off-set region was largely formed. This is caused by thermal deformation of the release layer and the encapsulation resin layer due to heat generated during laser cutting.

Experimental Example 1: Tapered angle measurement

(1) Measuring the taper angle of the encapsulant manufactured by the laser cutting method

After preparing a composite sheet having a thickness as shown in Table 4 below, it was laser cut in the same manner as in Comparative Example 1 to prepare an encapsulant. In this case, the composite sheet is manufactured by varying the thickness of the metal layer and the release layer.

In addition, the taper length is the difference in length between the lowermost surface end of the metal layer and the uppermost surface end of the release layer of the cut surface when viewed from the side direction of the cut surface to be tapered (the longest length of the off-set region).

In addition, the taper angle refers to the angle between the end of the lowermost surface of the metal layer of the cut surface and the end of the uppermost surface of the release layer of the cut surface with respect to the lowermost surface of the metal layer of the cut surface when viewed from the side of the cut surface to be measured. For this purpose, the taper length and taper angle are schematically shown in Figs. 8 (Comparative Example 1) and Fig. 7B (top view sharing cut surface of Example 1).

In addition, 10 of the encapsulants produced by performing the laser process were randomly selected, and their average taper length and taper angle were measured, and are shown in Table 4 below.

According to Off-Set area
Change in taper angle (˚) Encapsulant thickness 168㎛ 180㎛ 188㎛ 200㎛ Release sheet thickness 38㎛ 50㎛ 38㎛ 50㎛ Encapsulation sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 80㎛ 100㎛ 100㎛ Taper
Length 20㎛ 83.21 83.66 83.93 84.30 30㎛ 79.88 80.54 80.93 81.47 50㎛ 73.43 74.48 75.11 75.96 100㎛ 59.24 60.95 62.00 63.40 150㎛ 48.28 50.20 51.34 53.06 180㎛ 43.00 45.00 46.10 48.00 250㎛ 33.90 35.75 36.94 38.67 Average 111.4㎛ 60.13 61.51 62.34 63.55

Looking at Table 4, it can be seen that the taper angle tends to increase as the thickness of the FSPM sheet increases, and the taper angle tends to decrease as the taper length increases. And, it was confirmed that the encapsulant using the laser cutting method had a taper angle in the range of 33.9 ˚ to 84.30 ˚ when the thickness of the encapsulant was 168 to 200 µm.

(2) Measurement of taper angle of Example 1 sealing material manufactured by the SSC method

After preparing the FSPM sheet having the thickness as shown in Table 5 below, slitting cutting and sharing cutting were performed in the same manner as in Preparation Example 1 to prepare an encapsulant. In this case, the FSPM sheet is manufactured by varying the thickness of the metal layer and the release layer. In addition, in the same manner as in Table 4, the taper length and the taper angle of the cut side of the short side of the encapsulant were measured, respectively, and are shown in Table 6 below.

In addition, 10 of the encapsulants were randomly selected among the manufactured encapsulants by performing the slit cutting and sharing cutting processes in an automatic process, and the average taper length and taper angle thereof were measured as shown in Table 6 below.

According to sharing cutting
Change in taper angle (˚) Encapsulant thickness 168㎛ 180㎛ 188㎛ 200㎛ Release sheet thickness 38㎛ 50㎛ 38㎛ 50㎛ Encapsulation sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 80㎛ 100㎛ 100㎛ Taper
Length Short side
Subsection 10㎛ 86.59 86.82 86.96 87.14 20㎛ 83.21 83.66 83.93 84.29 30㎛ 79.88 80.54 80.93 81.47 40㎛ 76.60 77.47 77.99 78.69 50㎛ 73.43 74.48 75.11 75.96 Average 30㎛ 79.94 80.59 80.98 81.51 Short side
Top cutting surface -10㎛ 86.59 86.82 86.96 87.14 -20㎛ 83.21 83.66 83.93 84.29 -30㎛ 79.88 80.54 80.93 81.47 -40㎛ 76.60 77.47 77.99 78.69 -50㎛ 73.43 74.48 75.11 75.96 Average -30㎛ 79.94 80.59 80.98 81.51

According to slitting cutting
Change in taper angle (˚) Encapsulant thickness 168㎛ 180㎛ 188㎛ 200㎛ Release sheet thickness 38㎛ 50㎛ 38㎛ 50㎛ Encapsulation sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 80㎛ 100㎛ 100㎛ Taper
Length Long side
Subsection 0㎛ 90.00 90.00 90.00 90.00 10㎛ 86.59 86.82 86.96 87.14 20㎛ 83.21 83.66 83.93 84.29 Average 10㎛ 86.60 86.83 86.96 87.14

In addition, looking at Table 5, in the case of the encapsulant manufactured by the SSC process, the cut surfaces of the upper and lower sides of the short side have no or very short taper length, which is the length of the off-set area, so it can be confirmed that the taper angle is 73° to 90°. Through this, it was confirmed that the encapsulant manufactured by the SSC process had a very low off-set area unlike the encapsulant manufactured by laser cutting.

In addition, the taper angle of the slitting cut surface is shown in Table 6 above. The angle at this time was able to confirm the tolerance range of 83˚ to 90˚, which is a smaller tapered angle than the short side.

(3) Preparation Example 1 Measurement of the taper angle after the release sheet of the encapsulant was removed

After removing the release sheet of the encapsulant manufactured and taper angle measured in Preparation Example 1, the taper angles of the long and short side cut surfaces of the encapsulant (metal sheet-encapsulation sheet) were measured, and the results are shown in Tables 7 and 8 below. I got it.

According to sharing cutting
Change in taper angle (˚) Encapsulant thickness (remove release layer) 130㎛ 150㎛ Encapsulation sheet thickness 50㎛ 50㎛ Metal sheet thickness 80㎛ 100㎛ Taper
Length Short side
Subsection 10㎛ 85.60 86.19 20㎛ 81.25 82.40 30㎛ 77.01 78.69 40㎛ 72.90 75.07 50㎛ 68.96 71.57 Average 30㎛ 77.67 78.96 Short side
Top cutting surface -10㎛ 85.60 86.19 -20㎛ 81.25 82.40 -30㎛ 77.01 78.69 -40㎛ 72.90 75.07 -50㎛ 68.96 71.57 Average -30㎛ 77.14 78.78

According to slit ring cutting
Change in taper angle (˚) Encapsulant thickness (remove release layer) 130㎛ 150㎛ Encapsulation sheet thickness 50㎛ 50㎛ Metal sheet thickness 80㎛ 100㎛ Taper
Length Long side
Subsection 0㎛ 90.00 90.00 10㎛ 85.60 86.19 20㎛ 81.25 82.40 Average 10㎛ 85.62 86.20

Comparing the taper angles of Tables 7 and 8 with Tables 4 to 6, it can be seen that the taper angle tends to slightly decrease due to the removal of the release sheet.

In addition, it was confirmed that the taper angle of the shearing cutting cut surface was 67° to 90°, and the taper angle of the slitting cutting cut surface was 80° to 90°.

Experimental Example 2: Measurement of initial peel force of the release layer

Composite sheets (FSPM sheets) prepared in Preparation Example 1 and Comparative Preparation Example 1 were prepared, respectively.

Next, using UTM, the initial peel force for the release layers at four corners of each of the FSPM sheets of Preparation Example 1 and Comparative Preparation Example 1 was measured through a probe tack test.

The measuring method was a jig descending speed and a rising speed of 1.0 mm/sec, a dwell force of 800 gf, and a dwell time of 10 seconds.

The equipment used in the experiment and the photographs of the experiment are shown as photographs in A and B of FIG. 10, and a schematic diagram of a ball-shaped jig approaching the edge of the sheet, maintaining contact, and separating the release layer are shown in FIG. 10C. In addition, the initial peel force measurement results of Preparation Example 1 and Comparative Preparation Example 1 are shown in A and B of FIG. 11, and C of FIG. 11 shows an average value of the initial peel force (gf). In A and B of Fig. 11, L/C-1 to L/C-5 and SSC-1 to SSC-5 each randomly select the encapsulant prepared in Preparation Example 1 and/or Comparative Preparation Example 1 to obtain an initial peel force. It means the measured encapsulant.

Referring to FIG. 11, in the case of the encapsulant manufactured by the laser cutting method (Comparative Preparation Example 1), the initial peel force of the release layer to the encapsulation resin layer is 500 to 500 gf, whereas the encapsulant manufactured by the SSC processing method In the case of (Production Example 1), it was confirmed that the initial peel force of the release layer to the encapsulation resin layer was 300 to 350 gf, and the initial peel force was significantly low. This difference is a factor in which, in the case of Comparative Production Example 1, thermal deformation occurs in the release layer and/or the encapsulation resin layer during laser cutting, and a residue is formed on the cut surface of the release layer and the encapsulation resin layer, thereby increasing the initial peel force Because it worked.

Manufacturing Example 2

(1) In the same manner as in Preparation Example 1, the rolled composite sheet (FSPM sheet) of Example 1 was manufactured using an SSC (Slitting & Shearing Cutting) automation device to prepare an organic electronic device encapsulant, as shown in Table 9 below. , Slit cutting was performed on the long side of the composite sheet by varying the side pressure and the insertion depth of the top knife during slitting cutting.

division Top coat knife side pressure (kgf/㎠) 0.5 1.0 2.0 2.5 2.7 normal course
knife
insertion
depth
(mm) 0.3 A B C D E 1.0 F G H I J 1.5 K L M N O 2.0 P Q R S T 2.2 U V W X Y

In the case of 2.2 mm with a top coat knife insertion depth exceeding 2.0 mm, the pressure-sensitive adhesive layer collapses, and it can be confirmed that the cutting quality is not good because the division of each layer is unclear. In addition, in the case of 2.7kgf in which the lateral pressure applied to the top coat knife exceeds 2.5kgf, it was confirmed that there is a problem of poor quality due to excessive taper and poor uniformity.

(2) Taper angle according to top coat knife condition

The taper angle of the slit-cut cut surface with respect to the undercoat cut surface was measured according to the upper coat knife insertion depth and side pressure conditions in Table 9, and the results are shown in Table 9 below. The alphabet in Table 10 below means the top coat knife conditions in Table 9.

According to slit ring cutting
Change in taper angle (˚) Encapsulant thickness 168㎛ 180㎛ 188㎛ 200㎛ Release sheet thickness 38㎛ 50㎛ 38㎛ 50㎛ Encapsulation sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 80㎛ 100㎛ 100㎛ A 88.98 89.05 89.39 89.42 B 88.64 88.73 88.78 88.85 C 88.30 88.41 88.78 88.85 D 84.90 85.24 85.74 85.43 E 79.88 79.00 78.58 78.14 F 88.64 89.05 88.78 88.85 G 88.64 88.41 88.48 88.85 H 88.30 88.41 88.17 88.85 I 84.90 84.92 85.44 85.43 J 78.56 78.08 77.99 77.59 K 88.64 89.05 88.78 88.85 L 88.64 88.41 88.48 88.85 M 88.30 88.41 88.17 88.85 N 84.90 84.92 85.44 85.43 O 77.58 77.77 77.70 76.78 P 88.98 89.05 88.78 88.85 Q 88.64 88.41 88.48 88.85 R 88.30 88.41 88.17 88.85 S 84.90 84.92 85.44 85.43 T 82.87 83.03 83.03 82.87 U 82.54 82.72 82.43 82.03 V 81.87 81.78 81.23 80.35 W 81.53 80.85 80.64 80.07 X 79.88 78.38 76.54 76.23 Y 77.25 76.86 75.96 75.96

Looking at Table 10, in the case of 2.2 mm in which the top coat knife insertion depth exceeds 2.0 mm, or when the lateral pressure applied to the top coat knife exceeds 2.5 kgf, the taper length (off-set area) increases and the taper angle is low. It can be seen that there is a tendency to lose.

Manufacturing Example 3

(1) When sharing cutting, the taper angle of the cutting surface of the top coat according to the blade angle of the top coat knife

In the same manner as in Preparation Example 1, the rolled composite sheet (FSPM sheet) of Example 1 was manufactured using an automated SSC (Slitting & Shearing Cutting) machine to manufacture an organic electronic device encapsulant. Table 11 shows the results of measuring the taper angle of the cutting surface of the short side top view cut after performing the sharing cutting by varying the blade angle.

According to sharing cutting
Change in taper angle (˚) Encapsulant thickness 168㎛ 180㎛ 188㎛ 200㎛ Release sheet thickness 38㎛ 38㎛ 38㎛ 50㎛ Encapsulation sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 92㎛ 100㎛ 100㎛ normal course
knife
Blade angle 0.135* 76.61 76.87 76.83 77.05 0.143* 82.54 82.72 82.73 82.88 0.215* 84.22 84.29 83.93 84.00 0.285* 85.58 85.55 85.44 85.43 0.316* 75.00 75.07 74.54 75.14

(2) When sharing cutting, the taper angle of the cutting surface of the top coat according to the land value of the top coat knife

One) In the same manner as in Preparation Example 1, the rolled composite sheet (FSPM sheet) of Example 1 was manufactured using an automated SSC (Slitting & Shearing Cutting) machine to manufacture an organic electronic device encapsulant. Table 12 shows the results of measuring the taper angle of the cutting surface of the short side top view after sharing cutting was performed by varying the land value. At this time, the land value of the primer knife was fixed to 0.50mm.

2) Measurement of durability of sharing knife

The shearing knife applied to the actual cutting process cuts the composite sheet including the high-strength metal sheet in tens to millions of times, and thus the long-term durability stability of the knife is very important.

Since the durability of the sharing knife was actually cut tens to millions of times and the durability could not be measured, the durability of the sharing topcoat knife was measured by replacing the sheet with high mechanical strength, not the composite sheet of the present invention as a cutting object.

Specifically, a sheet of SUS431, a martensitic stainless steel having a hardness of 2.5 to 3 times noon than the metal sheet (thickness 80 μm, Vickers hardness 200 HV) of Preparation Example 2 (100 μm, Brinell hardness of about 400 to 400 Hb) was prepared. Thereafter, the sharing cutting was performed in the same manner as in (1) with a sharing cutter composed of top coat knives having different land values in Table 12 below.

In addition, the durability evaluation was evaluated by whether or not micro-cracks occurred on the blade surface of the top coat knife by using a scanning electron microscope after the SUS431 sheet was sheared 10,000 times.

According to sharing cutting
Change in taper angle (˚) Encapsulant thickness durability
Measure 168㎛ 180㎛ 200㎛ 188㎛ Release sheet thickness 38㎛ 38㎛ 50㎛ 38㎛ Encapsulation sheet thickness 50㎛ 50㎛ 50㎛ 50㎛ Metal sheet thickness 80㎛ 92㎛ 100㎛ 100㎛ normal course
knife
Land value 0.08mm 88.30 86.57 87.77 87.56 Cracking 0.12mm 86.59 85.14 85.87 85.44 Crack x 0.80mm 85.91 85.55 85.14 85.28 Crack x 1.20mm 84.22 82.88 83.97 83.63 Crack x 1.80mm 77.26 77.05 76.87 76.83 Crack x 2.20mm 71.26 72.78 71.85 72.02 Crack x

Looking at Table 12, it was confirmed that the higher the land value of the top coat knife, the lower the taper angle. In the case of a top coat knife having a land value of 2.2 mm with a land value exceeding 2.0 mm, the taper angle is less than 73°, and a top coat knife having a land value of less than 0.10 mm has a high taper angle. However, in the case of a topcoat knife having a land value of 0.08 mm, it was confirmed that the cutting power was very excellent, but the blade durability was weak, and thus it was found that there is a problem that is unsuitable for use as a sharing cutting knife for a composite sheet including a metal sheet.

Through the above Examples and Experimental Examples, the composite sheet manufactured using the curling control system of the present invention has a low occurrence of curling, and the composite sheet manufactured using this has low occurrence of residues and burrs through mechanical processing. It was confirmed that it was possible to provide an encapsulant for an organic electronic device in an off-set and off-set area.

Claims (11)

As a method of manufacturing a composite sheet by laminating an encapsulating resin sheet and a metal sheet in a roll-to-roll process,
It is manufactured using a roll lamination machine including a fixed roll, a supporting curl roll, a first curl roll, a second curl roll, an upper laminator roll and a lower laminator roll,
The encapsulating resin sheet and the metal sheet are laminated by the pressure of the upper roll laminate and the lower roll laminate, and then wound by the composite sheet winding roll.
The curling control system according to claim 1, wherein the encapsulation resin sheet is a single-layer sheet of an encapsulation resin layer or a multilayer sheet in which an encapsulation resin layer and a release layer are laminated.
The curling control system according to claim 1, wherein the metal sheet is supplied by a fixed roll, a supporting curl roll, and a first curl roll.
The method of claim 1, wherein when the winding speed of the laminated composite sheet is 5 to 20 mpm,
A curling control system for manufacturing a composite sheet, characterized in that the tension applied to the metal sheet between the fixed roll and the laminate roll and the tension applied to the composite sheet between the laminate roll and the composite sheet winding roll satisfies Equation 1 below;
[Equation 1]
T1 = (1.00 ~ 1.30)×T2
In Equation 1, T1 is the tension applied to the metal sheet between the fixed roll and the laminate roll (kgf/cm), and T2 is the tension applied to the composite sheet between the laminate roll and the composite sheet winding roll (kgf/cm). do.
The method of claim 1, wherein when the roll lamination machine is viewed from a side direction,
The bonding point (M), which is the point where the encapsulating resin sheet and the metal sheet are first laminated, and the center position of the supporting curl roll (H) satisfy the following equation 1,
A curling control system for manufacturing a composite sheet, characterized in that the encapsulating resin sheet is supplied from a position higher than the lamination point, and the metal sheet is supplied from a position lower than the lamination point;
[Equation 1]
-40cm ≤ H ≤ M
In Equation 1, M is 0 on the xy coordinate.
The method of claim 1, wherein when the roll lamination machine is viewed from a side direction,
The center position (h1) of the first curl and the center position (h2) of the second curl satisfy the following Equations 2 to 3,
The encapsulation resin sheet is a curling control system for manufacturing a composite sheet, characterized in that supplied by the encapsulation resin unwinding roll at a position higher than the lamination point;
[Equation 2]
-40cm≤ h1 ≤0
[Equation 3]
-60cm≤ h2 ≤20 cm
In Equations 2 and 3, each of h1 and h2 represents the y-coordinate position on the xy coordinate when the bonding point, which is the first bonding point of the encapsulant sheet and the metal sheet, is 0 on the xy coordinate. .
The method of claim 6, wherein the winding speed of the laminated composite sheet is 5 to 20 mpm,
When the tension (T1) applied to the metal sheet between the fixed roll and the laminate roll is 75 kgf/cm or more, the center position (h2) of the second curling roll satisfies Equation 4 below. ;
[Equation 4]
0cm≤ h2 ≤20 cm
In Equation 4, h2 represents the y-coordinate position of the center position of h2 on the xy coordinate when the bonding point, which is the first bonding point of the encapsulating resin sheet and the metal sheet, is 0 on the xy coordinate.
According to claim 1, wherein the lower laminate roll temperature is 40 to 100 ℃, the upper laminate roll temperature is 40 to 100 ℃,
When laminating the encapsulating resin sheet and the metal sheet, the pressure applied by the upper and lower laminate rolls is 1 to 8 kgf/cm ² , wherein the curling control system for manufacturing a composite sheet.
A method of manufacturing a composite sheet using the curling control system for manufacturing a composite sheet according to any one of claims 1 to 8.
1 step of preparing the composite sheet manufactured by the method of claim 9;
A second step of performing slitting cutting on both sides of the composite sheet in the long side direction; And
Performs a process including three steps of shearing cutting the composite sheet subjected to slitting cutting in the short side direction,
The 2nd and 3rd steps are a continuous process, characterized in that A method of manufacturing an organic electronic device encapsulant.
11. The method of claim 10, wherein the long-side cut surface of the slit-cut composite sheet and the short-side cut surface of the sharing-cut composite sheet have a taper angle satisfying Equation 6 below;
[Equation 6]
Average taper angle of short side cuts ≤ Average taper angle of long side cuts
In Equation 6, the taper angle refers to the angle between the lowermost surface end of the lowermost layer of the cut surface and the uppermost surface end of the uppermost layer of the cut surface when viewed from the side direction of the cut surface to be tapered. .

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