KR20210041221A - Organic Light Emitting Display device - Google Patents

Abstract

According to an embodiment of the present specification, an organic light emitting display device includes: a substrate comprising a display area and a non-display area in the periphery of the display area; and a display pad disposed in the non-display area of the substrate to transmit a signal to the display area. An insulating layer covering an upper portion of the substrate and a portion of the plurality of display pads may be arranged. A protrusion pattern may be positioned between the plurality of display pads. The protrusion pattern may protrude upward from the substrate. Accordingly, when a driving IC of the organic light emitting display device is mounted on the substrate, it is possible to prevent the display pads to which the driving IC is attached from being short-circuited due to aggregation of conductive balls of an ACF during an attaching process. Therefore, it is possible to provide the organic light emitting display device having improved reliability by preventing display defects of the display device.

Description

Organic Light Emitting Display device

The present specification relates to an organic light emitting display device, and more particularly, to an organic light emitting display device having improved durability of a connection pad portion.

As information technology develops, the market for display devices, which is a connection medium between users and information, is growing. Accordingly, the use of display devices such as an organic light emitting display (OLED) and a liquid crystal display (LCD) is increasing.

The display device includes a display panel including a plurality of sub-pixels, a driver driving the display panel, and the like. The driver includes a scan driver that supplies a scan signal (or a gate signal) to the display panel, and a data driver that supplies a data signal to the display panel. In the above display device, when a scan signal and a data signal are supplied to subpixels arranged in a matrix form, the selected subpixel emits light, thereby displaying an image.

Meanwhile, some of the display devices described above manufacture a display panel based on a soft substrate instead of a hard substrate. Since a display device manufactured based on a soft substrate can impart ductility, the display panel can be bent in a specific shape.

In addition, such a display device composes an interface with a user using various input devices. The demand for an input device that is convenient, simple and capable of reducing malfunctions is increasing day by day. Accordingly, a touch device has been proposed in which a user directly contacts a screen to input information. Particularly, when applied to an organic light emitting display device, elements constituting a touch device may be formed on or under an encapsulation film for protecting a light emitting portion of the electroluminescent display device. That is, the touch driving electrodes constituting the touch driving signal transmission channel and the touch sensing electrodes constituting the touch recognition signal receiving channel are on the upper surface and/or the lower surface of the encapsulation film covering the display elements of the electroluminescent display device. Is formed.

In such a display device, an image is displayed on a screen of a display panel in which data lines and gate lines (or scan lines) intersect, and pixels are arranged in a matrix form. A driver for driving at least one of data lines and gate lines of a flat panel display device may be implemented as an integrated circuit (IC) mounted on a chip.

In addition, a chip on panel (COP) in which a driving IC is attached to a substrate of a display panel is preferred for cost reduction and structural convenience of a driving IC driving data lines and/or gate lines of a display device.

An object of the present specification is to propose a structure of a display pad on a display panel that is electrically connected to a driving IC in a chip on panel (COP) structure of an organic light emitting display device. The tasks of the present specification are not limited to the tasks mentioned above, and other tasks that are not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the object as described above, the organic light emitting display device according to an embodiment of the present invention includes a substrate having a display area and a non-display area surrounding the display area, and a substrate to transmit signals to the display area. A display pad disposed in a non-display area of may be included. An insulating layer may be disposed on the substrate and partially covering the display pads. A protrusion pattern may be positioned between the display pads. The protrusion pattern may protrude upward from the substrate. Specifically, the protrusion pattern may be made of the same material as the planarization layer on the thin film transistor in the display area. The protrusion pattern may have a stripe structure extending in the same direction as the direction in which the display pad is extended.

Details of other embodiments are included in the detailed description and drawings.

When the driving IC is mounted on a substrate according to the present invention, the display pad to which the driving IC is attached is prevented from shorting the display pads due to agglomeration of conductive balls of an anisotropic conductive film (ACF) during the attaching process. I can. This has an effect of preventing display defects of the display device and providing an organic light emitting display device with improved reliability.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is an exploded perspective view illustrating an organic light emitting display device in which a touch sensor is integrated.
FIG. 2 is a plan view illustrating the organic light emitting display device illustrated in FIG. 1.
3 is a cross-sectional view illustrating an organic light emitting display device taken along line “I-I” in FIG. 2.
FIG. 4 is a plan view showing detail A of FIG. 2.
5 is a cross-sectional view illustrating an embodiment of an organic light emitting display device taken along line "II-II" in FIG. 4.
6 is a diagram illustrating a display area when a display pad is short-circuited.
7 is a cross-sectional view illustrating another embodiment of an organic light emitting display device.
8 is a perspective view schematically showing the structure of the pad unit according to the present invention.
9A and 9B are perspective views schematically showing the structure of a protrusion pattern (short circuit prevention structure) according to the present invention.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms different from each other, and only these embodiments make the disclosure of the present invention complete, and common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the scope of the invention to the possessor, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are exemplary, and thus the present invention is not limited to the illustrated matters. The same reference numerals refer to the same elements throughout the specification. In addition, in describing the present invention, when it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. When'include','have','consists of' and the like mentioned in the present specification are used, other parts may be added unless'only' is used. In the case of expressing the constituent elements in the singular, it includes the case of including the plural unless specifically stated otherwise.

In interpreting the constituent elements, it is interpreted as including an error range even if there is no explicit description.

In the case of a description of the positional relationship, for example, if the positional relationship of two parts is described as'upper','upper of','lower of','next to', etc.,'right' Or, unless'direct' is used, one or more other parts may be located between the two parts.

When an element or layer is referred to as “on” another element or layer, it includes all cases in which another layer or another element is interposed directly on or in the middle of another element.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another component. Accordingly, the first component mentioned below may be a second component within the technical idea of the present invention.

The same reference numerals refer to the same elements throughout the specification.

The size and thickness of each component shown in the drawings are illustrated for convenience of description, and the present invention is not necessarily limited to the size and thickness of the illustrated component.

Each of the features of the various embodiments of the present invention may be partially or entirely combined or combined with each other, and as a person skilled in the art can fully understand, technically various interlocking and driving are possible, and each of the embodiments may be independently implemented with respect to each other. It may be possible to do it together in a related relationship.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating an organic light emitting display device having a touch sensor according to the present invention.

The organic light emitting display device having the touch sensor shown in FIG. 1 is mutual capacitance (Cm; touch sensor) caused by a user's touch through the touch electrodes 152e and 154e shown in FIG. 2 during a touch period. By detecting the amount of change of, the presence or absence of a touch and the touch position are sensed. In addition, the organic light emitting display device having the touch sensor illustrated in FIG. 1 displays an image through a unit pixel including the light emitting element 120. The unit pixel is composed of red (R), green (G), and blue (B) sub-pixels (PXL), or red (R), green (G), blue (B), and white (W) sub-pixels (PXL) It consists of

To this end, the organic light emitting display device illustrated in FIG. 1 includes a plurality of sub-pixels PXL arranged in a matrix form on a substrate 111 and an encapsulation part 140 disposed on the plurality of sub-pixels PXL. ) And a mutual capacitance Cm disposed on the encapsulation part 140.

Each of the plurality of sub-pixels PXL includes a pixel driving circuit and a light emitting element 120 connected to the pixel driving circuit.

The pixel driving circuit includes a switching transistor T1, a driving transistor T2, and a storage capacitor Cst.

The switching transistor T1 is turned on when a scan pulse is supplied to the scan line SL and supplies a data signal supplied to the data line DL to the storage capacitor Cst and the gate electrode of the driving transistor T2.

The driving transistor T2 controls the current supplied to the light emitting device 120 from the high voltage (VDD) supply line in response to a data signal supplied to the gate electrode of the driving transistor T2. Will be adjusted. In addition, even if the switching transistor T1 is turned off, the driving transistor T2 supplies a constant current until the data signal of the next frame is supplied by the voltage charged in the storage capacitor Cst so that the light emitting element 120 is turned off. Keeps luminescence.

As shown in FIG. 3, the driving thin film transistors T2 and 130 include a gate electrode 132, a semiconductor layer 134 overlapping the gate electrode 132 with the gate insulating layer 112 therebetween, and an interlayer insulating layer. Source and drain electrodes 136 and 138 are formed on 114 and in contact with the semiconductor layer 134. The gate electrode 132 is a variety of conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof. It can be formed by the like.

The gate insulating layer 112 may be formed of an insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx), or may be formed of an insulating organic material.

Here, the semiconductor layer 134 is formed of at least one of an amorphous semiconductor material, a polycrystalline semiconductor material, and an oxide semiconductor material on the gate insulating layer 112.

The planarization layer 118 may be positioned on the thin film transistor. The planarization layer 118 has a contact hole exposing the drain electrode 138 of the thin film transistor. The planarization layer 118 functions to make the roughness of the substrate surface uniform in order to apply the light emitting stack 124 constituting the organic light emitting device in a smooth flat state. The planarization layer 118 may be formed in various forms, and may be formed of an organic insulating film such as benzocyclobutene (BCB) or acryl, or an inorganic insulating film such as a silicon nitride film (SiNx) or a silicon oxide film (SiOx), Various modifications are possible, such as being formed as a single layer or may be composed of double or multiple layers.

The light emitting device 120 includes an anode electrode 122, at least one light emitting stack 124 formed on the anode electrode 122, and a cathode electrode 126 formed on the light emitting stack 124. The anode electrode 122 is electrically connected to the drain electrode 138 of the driving thin film transistors 130 and T2 exposed through the pixel contact hole 148 penetrating the passivation layer 116.

At least one light emitting stack 124 is formed on the anode electrode 122 in the light emitting area provided by the bank 128. At least one light-emitting stack 124 is formed by stacking a hole-related layer, an organic light-emitting layer, and an electron-related layer on the anode electrode 122 in the order or reverse order. In addition, the light emitting stack 124 may include first and second light emitting stacks facing each other with a charge generation layer (CGL) therebetween. In this case, one organic emission layer of the first and second emission stacks generates blue light, and the other organic emission layer of the first and second emission stacks generates yellow-green light, thereby forming the first and second emission stacks. White light is generated through it. The white light generated by the light-emitting stack 124 is incident on a color filter (not shown) positioned above or below the light-emitting stack 124, so that a color image can be implemented. In addition, a color image may be implemented by generating color light corresponding to each sub-pixel in each light emitting stack 124 without a separate color filter. That is, the emission stack 124 of the red (R) sub-pixel generates red light, the emission stack 124 of the green (G) sub-pixel generates green light, and the emission stack 124 of the blue (B) sub-pixel generates blue light. You may.

The cathode electrode 126 is formed to face the anode electrode 122 with the light emitting stack 124 interposed therebetween, and is connected to a low voltage (VSS) supply line.

The bank 128 is formed in the remaining areas except for the light emitting area. Accordingly, the bank 128 has a bank hole exposing the anode electrode 122 corresponding to the light emitting area. The bank 128 may be made of an inorganic insulating material such as a silicon nitride film (SiNx) or a silicon oxide film (SiOx), or an organic insulating material such as BCB, an acrylic resin, or an imide resin.

Spacers may be formed on the banks 128. The spacer may be formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin. The spacer can be omitted.

The encapsulation part 140 blocks the penetration of external moisture or oxygen into the light emitting device 120 vulnerable to external moisture or oxygen. To this end, the encapsulation unit 140 includes a plurality of inorganic encapsulation layers 142 and 146 and an organic encapsulation layer 144 disposed between the plurality of inorganic encapsulation layers 142 and 146, and the inorganic encapsulation layer (146) should be placed on the top floor. In this case, the encapsulation part 140 includes at least two inorganic encapsulation layers 142 and 146 and at least one organic encapsulation layer 144. In the present invention, a structure of the encapsulation part 140 in which the organic encapsulation layer 144 is disposed between the first and second inorganic encapsulation layers 142 and 146 will be described as an example.

The first inorganic encapsulation layer 142 is formed on the substrate 111 on which the cathode electrode 126 is formed so as to be closest to the light emitting device 120. The first inorganic encapsulation layer 142 is formed of an inorganic insulating material capable of low-temperature deposition such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3). Accordingly, since the first inorganic encapsulation layer 142 is deposited in a low temperature atmosphere, it is possible to prevent damage to the light emitting stack 124 vulnerable to a high temperature atmosphere during the deposition process of the first inorganic encapsulation layer 142.

The organic encapsulation layer 144 serves as a buffer to relieve stress between layers due to bending of the OLED display, and enhances planarization performance. Silicon oxycarbon (SiOCz) may be used, or acrylic or epoxy resin may be used, but the present invention is not limited thereto. For example, when the organic encapsulation layer 144 is formed of SiOCz, the organic encapsulation layer 144 may be formed by a CVD process. SiOCz is an inorganic substance, but can be classified as an organic substance under certain conditions. Specifically, the flowability of SiOCz varies depending on the atomic ratio (C/Si) of silicon and carbon. For example, if the flowability of SiOCz deteriorates, it has characteristics close to inorganic substances, so the performance of compensating for foreign substances decreases. If the flowability improves, the performance of compensating for foreign substances is improved because it has characteristics close to organic substances. The C/Si ratio of SiOCz can be controlled by adjusting the ratio of oxygen (O2) and hexamethyldisiloxane (HMDSO) during the CVD process. In particular, when the organic encapsulation layer 144 is formed of SiOCz, the thickness of the encapsulation part 140 may be very thin, and the thickness of the organic light emitting display device may be reduced.

For example, when the organic encapsulation layer 144 is formed of acrylic or epoxy resin, the organic encapsulation layer 144 may be formed by a slit coating or screen printing process. At this time, the epoxy-based resin can be used such as high viscosity bisphenol-A-epoxy (Bisphenol-A-Epoxy) or low viscosity bisphenol-F-epoxy (Bisphenol-F-Epoxy). The organic encapsulation layer 144 may further include an additive. For example, a wetting agent to reduce the surface tension of the resin to improve the uniformity of the resin, a leveling agent to improve the surface flatness of the resin, and a defoaming agent to remove air bubbles contained in the resin ( Defoaming agent) may be further added as an additive. The organic encapsulation layer 144 may further include an initiator. For example, it is possible to use an antimony-based initiator or anhydride-based initiator that cures a liquid resin by initiating a chain reaction by heat.

In addition, when the temperature of the resin increases, the viscosity of the liquid resin rapidly decreases, and after a certain period of time, curing begins and the viscosity increases rapidly to complete curing. However, since the resin has high fluidity during a certain period of time when the viscosity decreases, the possibility of overcoating occurs especially increases.

The organic encapsulation layer 144 functions to cover foreign substances or particles that may occur during a process. For example, defects due to cracks generated by foreign substances or particles may exist in the first inorganic encapsulation layer 142. However, such bends and foreign matter may be covered by the organic encapsulation layer 144, and the upper surface of the organic encapsulation layer 144 is flattened. That is, the organic encapsulation layer 144 compensates for foreign substances and flattens the display area. As a result, the organic encapsulation layer 144 may also be referred to as a compensation layer.

The second inorganic encapsulation layer 146 is formed to cover the upper surface and side surfaces of the organic encapsulation layer 144 and the upper surface of the first inorganic encapsulation layer 142 exposed by the organic encapsulation layer 144. Accordingly, the second inorganic encapsulation layer 146 minimizes or blocks the penetration of external moisture or oxygen into the first inorganic encapsulation layer 142 and the organic encapsulation layer 144. The second inorganic encapsulation layer 146 is formed of an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3). The first and second inorganic encapsulation layers 142 and 146 may be made of the same material, and each may be a plurality of layers.

The encapsulation part 140 is preferably formed to have a total thickness of 10 µm to 30 µm to sufficiently prevent moisture penetration from the outside and prevent the flow of internal particles and the influence of the internal particles.

On the other hand, the encapsulation part 140 covers at least the active area, and thus a side portion is located in the inactive area. In addition, exposure to the side of the inactive region is limited to the inorganic encapsulation layer so as to effectively prevent penetration of outside air. That is, the organic encapsulation layer 144 is located in an inner region closer to the active region AA than the upper and lower inorganic encapsulation layers 142 and 146, and the second inorganic encapsulation layer 146 on the upper side is the organic encapsulation layer 144 ) Is formed to extend from the organic encapsulation layer 144 so as to meet the first inorganic encapsulation layer 142 protruding from the organic encapsulation layer 144 from the side and cover the upper and side portions together.

On the encapsulation unit 140, the touch sensing line 154 and the touch driving line 152 are disposed to cross each other with the touch insulating layer 158 therebetween. A mutual capacitance Cm is formed at the intersection of the touch sensing line 154 and the touch driving line 152. Accordingly, the mutual capacitance Cm serves as a touch sensor by charging electric charges by a touch driving pulse supplied to the touch driving line 152 and discharging the charged electric charges to the touch sensing line 154.

The touch driving line 152 includes a plurality of first touch electrodes 152e and first bridges 152b electrically connecting the plurality of first touch electrodes 152e.

The plurality of first touch electrodes 152e are spaced apart at regular intervals along the Y direction, which is the first direction, on the second inorganic encapsulation layer 146. Each of the plurality of first touch electrodes 152e is electrically connected to an adjacent first touch electrode 152e through a first bridge 152b.

The first bridge 152b is disposed on the second inorganic encapsulation layer 146 that is the same plane as the first touch electrode 152e and is electrically connected to the first touch electrode 152e without a separate contact hole.

The touch sensing line 154 includes a plurality of second touch electrodes 154e and second bridges 154b electrically connecting the plurality of second touch electrodes 154e.

The plurality of second touch electrodes 154e are spaced apart on the second inorganic encapsulation layer 146 at regular intervals along the X direction, which is the second direction. Each of the plurality of second touch electrodes 154e is electrically connected to an adjacent second touch electrode 154e through a second bridge 154b.

The second bridge 154b is formed on the touch insulating layer 158 and exposed through the touch contact hole 150 penetrating the touch insulating layer 158 to be electrically connected to the second touch electrode 154e. Since the second bridge 154b is disposed to overlap the bank 128 like the first bridge 152b, it is possible to prevent a decrease in the aperture ratio by the first and second bridges 152b and 154b.

Each of the first and second touch electrodes 152e and 154e and the first and second bridges 152b and 154b is a single layer using a conductive layer having strong corrosion resistance and acid resistance and good conductivity such as Al, Ti, Cu, and Mo. Or it is formed in a multilayer structure. For example, each of the first and second touch electrodes 152e and 154e, and the first and second bridges 152b and 154b is formed in a three-layer structure such as Ti/Al/Ti or Mo/Al/Mo. do.

Each of the first and second touch electrodes 152e and 154e and the first and second bridges 152b and 154b is formed in a mesh shape. Accordingly, resistance and capacitance of the first and second touch electrodes 152e and 154e and the first and second bridges 152b and 154b itself are reduced, thereby reducing the RC time constant, thereby improving touch sensitivity. In addition, the mesh-shaped first and second touch electrodes 152e and 154e and the first and second bridges 152b and 154b each have a very thin line width, so that the mesh-shaped first and second touch electrodes 152e and 154e , It is possible to prevent the aperture ratio and transmittance from being lowered due to the first and second bridges 152b and 154b.

Each of the touch driving line 152 and the touch sensing line 154 of the present invention is connected to a touch driver (not shown) through a routing line 156 and a touch pad 170 disposed in an inactive (bezel) area. do.

Accordingly, the routing line 156 transmits the touch driving pulse generated by the touch driver to the touch driving line 152 through the touch pad 170, and transmits a touch signal from the touch sensing line 154 to the touch pad 170. ). The routing line 156 is disposed between each of the first and second touch electrodes 152e and 154e and the touch pad 170, and includes each of the first and second touch electrodes 152e and 154e without a separate contact hole. It is directly connected. Since the routing line 156 is formed of the same material as the first bridge 152b by the same mask process as the first bridge 152b, it is protected by the touch insulating layer 158.

As shown in FIG. 2, the routing line 156 connected to the first touch electrode 152e extends to at least one of the upper and lower sides of the active area and is connected to the touch pad 170. The routing line 156 connected to the second touch electrode 154e extends to at least one of the left and right sides of the active area and is connected to the touch pad 170. Meanwhile, the arrangement of the routing line 156 is not limited to the structure of FIG. 2 and may be variously changed according to design items of the display device.

1 and 2, in the organic light emitting display device, sub-pixels PXL and a data driver may be formed on the substrate 111. This is a structure capable of forming a chip on the substrate 111 and is referred to as a “Chip on Panel (COP)”, and a pad part that enables this is referred to as a “COP Pad”.

5 is an exemplary cross-sectional view illustrating an example of the organic light emitting display device of the present specification.

As illustrated in FIG. 5, the organic light emitting display device may include a substrate 111 including a display area and a non-display area surrounding the display area. 4 illustrates a non-display area in which the display pad 180 is located. The display pad 180 may be disposed in a non-display area of the substrate 111 to transmit a signal to the display area. The display pad 180 may include a first electrode layer 162, a second electrode layer 164, and a third electrode layer 168 sequentially stacked from the substrate 111. The first electrode layer 162 may be made of the same metal as the gate electrode 132 in the display area. A first insulating layer 163 covering an upper portion of the first electrode layer 162 may be disposed. For example, the first insulating layer 163 may be made of the same material as the gate insulating layer 112 and/or the interlayer insulating layer 114 in the display area. Although not shown in the drawing, the first electrode layer 162 and the second electrode layer 164 may be electrically connected through a contact hole of the first insulating layer 163. The second electrode layer 164 may be formed of the same metal as the source and drain electrodes 136 and 138 in the display area. The third electrode layer 168 may be made of the same material as the touch electrodes 152e and 154e.

On the display pad 180, there may be at least one driving IC 1510 and at least one connection electrode 1520 that transmits a signal generated from the driving IC 1510 to the display pad 180. The connection electrode 1520 may be disposed to protrude under the driving IC 1510. An adhesive member 1600 may be further included between the connection electrode 1520 and the display pad 180 to attach and electrically connect the connection electrode 1520 and the display pad 180. For example, the adhesive member 1600 may be an anisotropic conductive film (ACF). The adhesive member 1600 may include an adhesive layer 1610 and a conductive ball 1620 inside the adhesive layer 1610. The connection electrode 1520 of the driving IC 1510 and the display pad 180 on the substrate are electrically contacted by conductive balls of the adhesive member 1600.

As described above, the data driver 1500 including the data driving IC 1510 may be attached to the display pad 180 on the substrate 111 to form a chip on panel (COP) structure, but the inventors of the present specification They have found that there is also a problem related to the display pad 180 having the above-described structure. In other words, the conductive balls 1620 are irregularly arranged in the adhesive member 1600 connecting the connection electrode 1520 of the driving IC 1510 and the display pad 180 to completely eliminate the gap between the conductive balls 1620. It cannot be adjusted. As a result, the conductive balls 1620 are gathered between the display pads 180 and the display pads 180 adjacent to each other are electrically shorted. The phenomenon in which adjacent display pads 180 are electrically connected, as shown in FIG. 6, is that the luminance is not uniform compared to the normal pixel, or the pixels that should not emit light due to unnecessary driving signals emit light, and thus the display quality of the display device. It can cause defects. Accordingly, the present inventors devised an improved structure capable of preventing an electrical short circuit of the display pad 180 due to agglomeration of the conductive balls 1610.

7 is an exemplary diagram showing another embodiment of the present specification. As illustrated in FIG. 7, the organic light emitting display device may include a substrate 111 including a display area and a non-display area surrounding the display area. The substrate 111 may support various components of the organic light emitting display device. The substrate may include glass, metal, or plastic, and may be formed of a flexible material. As non-limiting examples, polyethersulfone, polyacrylate, polyether imide, polyethylene naphthalate, polyethylene terephthalide, polyphenylene sulfide, polyallylate, polyimide, polycarbonate, cellulose triacetate, cellulose acetate Propionate, etc. may be included. 7 illustrates a non-display area in which the display pad 180 is located. The display pad 180 may be disposed in a non-display area of the substrate 111 to transmit a signal to the display area. The display pad 180 may include a first electrode layer 162, a second electrode layer 164, and a third electrode layer 168 sequentially stacked from the substrate 111. The first electrode layer 162 may be made of the same metal as the gate electrode 132 in the display area. The second electrode layer 164 may be formed of the same metal as the source and drain electrodes 136 and 138 in the display area. The third electrode layer 168 may be made of the same material as the touch electrodes 152e and 154e.

On the display pad 180, there may be at least one driving IC 1510 and at least one connection electrode 1520 that transmits a signal generated from the driving IC 1510 to the display pad 180. The connection electrode 1520 may be disposed to protrude from the lower portion of the driving IC 1510. An adhesive member 1600 may be further included between the connection electrode 1520 and the display pad 180 to attach and electrically connect the connection electrode 1520 and the display pad 180. For example, the adhesive member 1600 may be an anisotropic conductive film (ACF). The adhesive member 1600 may include an adhesive layer 1610 and a conductive ball 1620 inside the adhesive layer 1610. The connection electrode 1520 of the driving IC 1510 and the display pad 180 on the substrate are electrically contacted by the conductive balls 1620 of the adhesive member 1600.

An insulating layer 167 may be disposed on the substrate 111 and partially covering the display pads 180. For example, the insulating layer 167 is a side surface of the second electrode layer 164 and a portion of the upper surface of the second electrode layer 164 so as to expose the upper surface of the central portion of the second electrode layer 164 of the display pad 180. Can be covered. A third electrode layer 168 may be positioned on the upper surface of the second electrode layer 164 exposed by the insulating layer 167. The third electrode layer 168 may directly contact the second electrode layer 164. The insulating layer 167 may be made of the same material as the touch insulating layer 158. Unlike the exemplary embodiment of FIG. 5, the protrusion pattern 165 may be positioned between the display pads 180. The protrusion pattern 165 may protrude upward from the substrate 111. The protrusion pattern 165 may be made of the same material as the planarization layer 118 on the thin film transistor in the display area. The protrusion pattern 165 may have a stripe structure that extends in the same direction as the direction in which the display pad 180 extends. The length of the protrusion pattern 165 may be equal to or longer than the length of the display pad 180 so that adjacent display pads 180 are not short-circuited by a bunch of conductive balls. The distance between the protruding pattern 165 and the driving IC 1510 may be smaller than the diameter of the conductive ball 1620 so that the conductive ball 1620 cannot be positioned above the protruding pattern 165.

As described above, in order to attach the display pad 180 and the data driver 1500 on the substrate 111, the anisotropic conductive film 1600 is positioned at the corresponding position, and data is High temperature/pressurization must be applied to the driving unit 1500. In this embodiment, since the protrusion pattern 165 is positioned between the display pads 180, when the display pad 180 and the data driver 1500 are attached, the conductive balls 1620 are formed by the protrusion pattern 165. 180) can minimize the phenomenon of clumping. Accordingly, the protrusion pattern 165 may be referred to as a short-circuit prevention structure.

The protrusion patterns 165 positioned between the display pads 180 can be variously implemented as long as the pads adjacent to each other are not electrically connected to each other by preventing agglomeration of conductive balls.

Referring to FIG. 8, the protrusion pattern may be an integrated structure formed in a stripe shape. This is the most optimized form in terms of a short-circuit prevention rate between pads by minimizing agglomeration of conductive balls between display pads.

9A and 9B are perspective views schematically showing the shape of a protrusion pattern according to the present invention.

Referring to FIGS. 9A and 9B, the protrusion pattern may be formed in an island-shaped separated structure, rather than an integral structure formed in a stripe shape as in FIG. 8. The spacing between the protruding patterns may be smaller than the diameter of the conductive balls. Even in this case, it is possible to minimize the short circuit between the pads. An organic light emitting display device according to various embodiments of the present invention may be described as follows.

An organic light emitting display device according to an embodiment of the present invention includes a substrate having a display area and a non-display area surrounding the display area, and includes a display pad located in the non-display area and configured to transmit a signal to the display area. . An insulating layer may be included on the substrate and covering a portion of the plurality of display pads. A protrusion pattern protruding upward from the substrate may be included between the plurality of display pads.

The display pad may include at least one driving IC and at least one connection electrode for transmitting a signal generated from the driving IC. It may further include an adhesive member connecting the connection electrode and the display pad. The adhesive member may include an adhesive layer and a conductive ball, which is a conductive material dispersed inside the adhesive layer. The display pad may include a first electrode, a second electrode, and a third electrode sequentially stacked. A plurality of touch electrodes disposed to cross each other and a touch insulating layer insulating the touch electrodes may be further included on the substrate. The third electrode may be made of the same material as the touch electrode. The insulating layer covering the upper portion of the substrate and a portion of the display pads may be made of the same material as the touch insulating layer.

The display area may further include at least one thin film transistor and an organic light emitting device electrically connected to the thin film transistor. A planarization layer for flattening the top of the thin film transistor may be disposed on the thin film transistor. The protrusion pattern may be made of the same material as the planarization layer. The length of the protrusion pattern may be equal to or longer than the length of the display pad.

The conductive material is a spherical shape having a predetermined diameter, and the distance between the protrusion pattern and the driving IC may be smaller than the diameter of the conductive material.

An organic light emitting display device according to another exemplary embodiment of the present invention includes a substrate including a display area and a non-display area surrounding the display area. At least one thin film transistor and an organic light emitting device electrically connected to the thin film transistor may be disposed in the display area. A plurality of display pads may be provided in the non-display area to transmit signals to the display area. The display pad may include a first electrode, a second electrode, and a third electrode sequentially stacked. The display pad may include at least one driving IC and at least one connection electrode for transmitting a signal generated from the driving IC.

The adhesive member electrically connecting the connection electrode and the display pad may include a conductive ball. A short-circuit prevention structure may be included to prevent two adjacent display pads from being short-circuited to each other due to aggregation of conductive balls among the plurality of display pads. The short-circuit prevention structure may be formed of an organic insulating layer and may be positioned between the two display pads.

The organic light-emitting display device may further include a touch device on an upper portion of the organic light-emitting device, and the touch device may include a plurality of touch electrodes and a touch insulating layer. The third electrode of the display pad may be formed of the same material as the touch electrode. It may include an insulating layer covering an upper portion of the substrate, a side surface of the second electrode, and a portion of an upper surface of the second electrode. The insulating layer can completely cover the short-circuit protection structure. The insulating layer may be made of the same material as the touch insulating layer.

The short-circuit prevention structure may be formed of the same material as the planarization layer that makes the upper portion of the thin film transistor flat. The length of the short-circuit prevention structure may be equal to or longer than the length of the display pad. The distance between the short-circuit prevention structure and the driving IC may be smaller than the diameter of the conductive ball.

Although the embodiments of the present specification have been described in detail with reference to the accompanying drawings, the present specification is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical idea. Accordingly, the embodiments disclosed in the present specification are not intended to limit the technical idea of the present disclosure, but to explain the technical idea, and the scope of the technical idea of the present disclosure is not limited by these embodiments. Each of the features of the various embodiments of the present invention can be partially or entirely combined or combined with each other, and can be technically variously linked and driven by a person skilled in the art, and each of the embodiments can be independently implemented with respect to each other or together in an association relationship. It can also be implemented. The scope of protection of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

111: substrate
120: light-emitting element
130: driving thin film transistor
140: encapsulation layer
162: first electrode layer
163: first insulating layer
164: second electrode layer
165: protrusion pattern
167: insulating layer
168: third electrode layer
170: touch pad
180: display pad
1500: drive unit
1510: driver IC
1520: connecting electrode
1600: adhesive member
1610: adhesive layer
1620: Challenge Ball

Claims (21)

A substrate including a display area and a non-display area surrounding the display area;
A plurality of display pads in the non-display area and configured to transmit signals to the display area;
An insulating layer covering an upper portion of the substrate and a portion of the plurality of display pads; And
Including a protrusion pattern between the plurality of display pads,
The protrusion pattern protrudes upward from the substrate. The method of claim 1,
At least one driving IC on the display pad and at least one connection electrode for transmitting a signal generated from the driving IC; And
An organic light emitting display device further comprising an adhesive member connecting the connection electrode and the display pad. The method of claim 2,
The adhesive member includes an adhesive layer and a conductive material dispersed in the adhesive layer. The method of claim 1,
The display pad includes a first electrode, a second electrode, and a third electrode sequentially stacked. The method of claim 4,
An organic light emitting display device further comprising a plurality of touch electrodes and a touch insulating layer disposed to cross each other on the substrate. The method of claim 5,
The third electrode is made of the same material as the touch electrode. The method of claim 5,
The insulating layer is made of the same material as the touch insulating layer. The method of claim 1,
An organic light emitting display device further comprising at least one thin film transistor disposed in the display area and an organic light emitting device electrically connected to the thin film transistor. The method of claim 8,
The protrusion pattern is made of the same material as the planarization layer on the thin film transistor. The method of claim 9,
The length of the protrusion pattern is equal to or longer than the length of the display pad. The method of claim 3,
The conductive material is a spherical shape having a predetermined diameter,
An organic light-emitting display device in which a distance between the protruding pattern and the driving IC is smaller than a diameter of the conductive material. A substrate including a display area and a non-display area surrounding the display area;
At least one thin film transistor disposed in the display area and an organic light emitting device electrically connected to the thin film transistor;
A plurality of display pads in the non-display area and provided to transmit signals to the display area;
At least one driving IC on the display pad and at least one connection electrode for transmitting a signal generated from the driving IC;
An adhesive member including a conductive ball and electrically connecting the connection electrode and the display pad through the conductive ball; And
And a short-circuit preventing structure for preventing two adjacent display pads from shorting to each other due to aggregation of the conductive balls, among the plurality of display pads,
The short-circuit prevention structure is formed of an organic insulating layer, the organic light emitting display device including an organic insulating layer positioned between the two display pads. The method of claim 12,
The display pad includes a first electrode, a second electrode, and a third electrode sequentially stacked. The method of claim 13,
Further comprising a touch device on the upper portion of the organic light emitting device,
The touch device includes a plurality of touch electrodes and a touch insulating layer. The method of claim 14,
The third electrode is made of the same material as the touch electrode. The method of claim 14,
An organic light emitting display device comprising an insulating layer covering an upper portion of the substrate, a side surface of the second electrode, and a portion of an upper surface of the second electrode. The method of claim 16,
The insulating layer covers the short-circuit prevention structure. The method of claim 16 or 17,
The insulating layer is made of the same material as the touch insulating layer. The method of claim 12,
The short-circuit prevention structure is made of the same material as the planarization layer on the thin film transistor. The method of claim 12,
The length of the short-circuit prevention structure is equal to or longer than the length of the display pad. The method of claim 12,
An organic light emitting display device having a distance between the short-circuit preventing structure and the driving IC is smaller than a diameter of the conductive ball.

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