KR20210024794A - Board Cleaning Equipment - Google Patents

Board Cleaning Equipment Download PDF

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Publication number
KR20210024794A
KR20210024794A KR1020190104399A KR20190104399A KR20210024794A KR 20210024794 A KR20210024794 A KR 20210024794A KR 1020190104399 A KR1020190104399 A KR 1020190104399A KR 20190104399 A KR20190104399 A KR 20190104399A KR 20210024794 A KR20210024794 A KR 20210024794A
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KR
South Korea
Prior art keywords
substrate
cleaning
present
cleaning solution
spraying
Prior art date
Application number
KR1020190104399A
Other languages
Korean (ko)
Inventor
한승택
육종국
장병훈
천승환
허정호
김경수
이종규
Original Assignee
주식회사 에이케이테크
천승환
한승택
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 에이케이테크, 천승환, 한승택 filed Critical 주식회사 에이케이테크
Priority to KR1020190104399A priority Critical patent/KR20210024794A/en
Publication of KR20210024794A publication Critical patent/KR20210024794A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Abstract

In the present invention, a cleaning solution can be discharged without leaking as much as possible after a substrate is washed. To this end, a substrate cleaning device comprises: a substrate moving member on which the substrate is mounted, and which moves the substrate up and down and rotates the substrate; a cleaning solution spraying member for spraying the cleaning solution on an upper portion of the substrate; and a body member which moves up and down in a state of surrounding the substrate moving member, and discharges the cleaning solution scattered from the substrate to the outside.

Description

기판 세정장치{Board Cleaning Equipment}Substrate cleaning equipment {Board Cleaning Equipment}

본 발명은 기판 세정장치에 관한 것으로서, 기판을 세척한 후 세정액이 최대한 세지 않고 배출시킬 수 있는 기판 세정장치에 관한 것이다.The present invention relates to a substrate cleaning apparatus, and to a substrate cleaning apparatus capable of discharging a cleaning solution without as much force as possible after cleaning a substrate.

일반적으로, 웨이퍼(wafer) 등의 기판은 웨이퍼제조공정, 산화공정, 포토공정, 식각공정, 박막공정, 금속배선공정, EDS공정 및 패키징 등의 공정을 통해 제조되어 진다.In general, a substrate such as a wafer is manufactured through processes such as a wafer manufacturing process, an oxidation process, a photo process, an etching process, a thin film process, a metal wiring process, an EDS process, and packaging.

한편, 각각의 공정을 수행하는 과정에서 기판에 부착된 각종 오염물을 제거하기 위하여 약액(chemical)으로 기판상에 오염물질을 제거하는 약액 처리 공정, 순수(pure water)로 기판 상에 잔류하는 약액을 제거하는 세척 공정(wet cleaning process), 그리고 건조 유체를 공급하여 기판 표면에 잔류하는 순수를 건조하는 위한 건조 공정(drying process) 등으로 수행되는 세정 공정이 실행된다.Meanwhile, in order to remove various contaminants attached to the substrate in the process of performing each process, a chemical solution treatment process that removes contaminants on the substrate with a chemical solution, and a chemical solution remaining on the substrate with pure water is removed. A cleaning process performed by a wet cleaning process to remove and a drying process for drying pure water remaining on the substrate surface by supplying a drying fluid is performed.

이와 같은 세정 공정은 기판을 세정하는 장치를 통해 이루어진다.Such a cleaning process is performed through an apparatus for cleaning the substrate.

이러한 세정장치는 약액회수본체 내측에 형성된 배수로로 세척된 후의 약액이 최대한 세지 않고 외부의 저장통으로 이동되는 것을 가장 큰 이슈로 보고 있다.The biggest issue is that such a cleaning device is moved to an external reservoir without counting as much as possible after being washed through a drainage channel formed inside the chemical liquid recovery body.

특허문헌 1: 대한민국 등록특허공보 제10-0740471호Patent Document 1: Korean Registered Patent Publication No. 10-0740471

본 발명은 상술한 문제점을 해결하고자 안출된 것으로서, 본 발명의 목적은 기판을 세척한 후 세정액이 최대한 세지 않고 배출시킬 수 있는 기판 세정장치를 제공하는 것이다.The present invention has been conceived to solve the above-described problems, and an object of the present invention is to provide a substrate cleaning apparatus capable of discharging the cleaning liquid without as much force as possible after cleaning a substrate.

상기와 같은 문제점을 해결하기 위하여, 본 발명에 따른 기판 세정장치는, 기판이 거치되고, 상기 기판을 상, 하방향으로 이동시키며, 상기 기판을 회전시키는 기판이동부재와, 상기 기판의 상부에 세정액을 분사하는 세정액분사부재와, 상기 기판이동부재()를 감싼 상태에서 상, 하방향으로 이동되고, 상기 기판으로부터 비산되는 세정액을 외부로 배출시키는 본체부재;로 구성되는 것을 특징으로 한다.In order to solve the above problems, the substrate cleaning apparatus according to the present invention includes a substrate moving member on which a substrate is mounted, moving the substrate upward and downward, and rotating the substrate, and a cleaning liquid on the upper portion of the substrate. And a cleaning liquid spraying member for spraying the substrate, and a main body member that moves upward and downward while surrounding the substrate moving member () and discharges the cleaning liquid scattered from the substrate to the outside.

이상, 상술한 바와 같이 본 발명에 따르면, 기판을 세척한 후 세정액이 최대한 세지 않고 배출시킬 수 있다는 장점이 있다.As described above, according to the present invention, after cleaning the substrate, there is an advantage that the cleaning solution can be discharged without as much force as possible.

도 1은 본 발명의 바람직한 실시예에 따른 기판 세정장치의 작동모습을 보인 모식도1 is a schematic diagram showing the operation of a substrate cleaning apparatus according to a preferred embodiment of the present invention

이하에서는 첨부된 도면을 참조로 하여, 본 발명의 일 실시예에 따른 기판 세정장치를 상세히 설명한다. 우선, 도면들 중, 동일한 구성요소 또는 부품들은 가능한 한 동일한 참조부호로 나타내고 있음에 유의하여야 한다. 본 발명을 설명함에 있어, 관련된 공지 기능 혹은 구성에 관한 구체적인 설명은 본 발명의 요지를 모호하지 않게 하기 위하여 생략한다.Hereinafter, a substrate cleaning apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. First of all, it should be noted that in the drawings, the same components or parts are denoted by the same reference numerals as much as possible. In describing the present invention, detailed descriptions of related known functions or configurations are omitted so as not to obscure the subject matter of the present invention.

본 발명은 기판이동부재, 세정액분사부재 및 본체부재를 통해 기판을 세척한 후 세정액이 최대한 세지 않고 배출시킬 수 있는 것이 가능하다.In the present invention, after cleaning the substrate through the substrate moving member, the cleaning liquid spraying member, and the main body member, it is possible to discharge the cleaning liquid without as much force as possible.

도면과 명세서에서 최적 실시 예들이 개시되었다. 여기서 특정한 용어들이 사용되었으나, 이는 단지 본 발명을 설명하기 위한 목적에서 사용된 것이지 의미한정이나 특허청구범위에 기재된 본 발명의 범위를 제한하기 위하여 사용된 것은 아니다. 그러므로 본 기술 분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시 예가 가능하다는 점을 이해할 것이다. 따라서 본 발명의 진정한 기술적 보호범위는 첨부된 특허청구범위의 기술적 사상에 의해 정해져야 할 것이다.Optimal embodiments have been disclosed in the drawings and specification. Although specific terms have been used herein, these are only used for the purpose of describing the present invention, and are not used to limit the meaning or the scope of the present invention described in the claims. Therefore, those of ordinary skill in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

Claims (1)

기판이 거치되고, 상기 기판을 상, 하방향으로 이동시키며, 상기 기판을 회전시키는 기판이동부재;
상기 기판의 상부에 세정액을 분사하는 세정액분사부재;
상기 기판이동부재()를 감싼 상태에서 상, 하방향으로 이동되고, 상기 기판으로부터 비산되는 세정액을 외부로 배출시키는 본체부재;로 구성되는 것을 특징으로 하는 기판 세정장치.


A substrate moving member on which a substrate is mounted, moving the substrate upward and downward, and rotating the substrate;
A cleaning liquid spraying member for spraying a cleaning liquid onto the substrate;
And a main body member that moves upward and downward while surrounding the substrate moving member () and discharges the cleaning liquid scattered from the substrate to the outside.
KR1020190104399A 2019-08-26 2019-08-26 Board Cleaning Equipment KR20210024794A (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100740471B1 (en) 1999-12-23 2007-07-19 램 리써치 코포레이션 Hollow Core Spindle and Spin, Rinse, and Dry Module Including the Same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100740471B1 (en) 1999-12-23 2007-07-19 램 리써치 코포레이션 Hollow Core Spindle and Spin, Rinse, and Dry Module Including the Same

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