KR20210014514A - Method and apparatus for producing sensor based on palladium - Google Patents

Abstract

According to one embodiment of the present invention, a method for manufacturing a palladium-based sensor comprises: a step of forming an assembly having porosity on a first substrate by using electric radiation; a step of depositing the palladium on the assembly at predetermined thickness; a step of arranging the assembly where the palladium is deposited on a second substrate; a step of forming a palladium tube having an assembly-shaped space based on the assembly disposed on the substrate molten by using an organic solvent; and a step of manufacturing a palladium-based sensor by using the second substrate and the palladium tube.

Description

Palladium-based sensor manufacturing method and apparatus {METHOD AND APPARATUS FOR PRODUCING SENSOR BASED ON PALLADIUM}

The present invention relates to a method and apparatus for manufacturing a palladium based sensor using a soluble porous aggregate.

Hydrogen is a newly spotlighted energy resource, and the hydrogen economy, which is an economic industrial structure that uses hydrogen as a major energy source, is drawing attention as a next-generation energy ecosystem. In order to maintain a stable hydrogen economy, the overall safety of the hydrogen economy, such as resources, infrastructure and fuel storage systems, is required. In this respect, a sensor that detects the leakage of hydrogen plays an important role in maintaining a safe hydrogen economy.

There are many sensors that operate on a variety of principles in the sensor for detecting the leakage of hydrogen, among which palladium-based sensors have the advantage of being able to operate with low power and high detection speed, so a lot of research has been conducted on this.

The palladium-based sensor is a sensor using the principle that resistance is changed by the formation of palladium hydride (PdHx) generated from absorption of palladium by hydrogen molecules and dissociation diffusion. One of the ways to improve the performance of a palladium-based sensor is to form a nanostructure to increase the volume versus surface area of palladium.

In order to form a nanostructure, a photolithography process or the like must be used, but this process has disadvantages that the manufacturing cost is high or the manufacturing process is somewhat complicated. Accordingly, there is a need for a method for manufacturing a palladium-based sensor in a simpler and easier method.

Korean Patent Publication No. 10-2018-0119151 (published on November 01, 2018)

The problem to be solved by the present invention is to provide a method and apparatus for manufacturing a palladium-based sensor more easily and inexpensively by forming palladium using a soluble porous aggregate.

However, the problems to be solved by the present invention are not limited as mentioned above, and are not mentioned, but include objects that can be clearly understood by those of ordinary skill in the art from the following description. can do.

A method of manufacturing a palladium-based sensor according to an embodiment of the present invention includes forming an aggregate having a porosity on a first substrate using electrospinning, depositing palladium to a predetermined thickness on the aggregate, and the palladium Arranging the deposited aggregate on a second substrate, and forming a palladium tube including the aggregate-shaped space based on melting the aggregate disposed on the second substrate using an organic solvent And, it may include the step of manufacturing a palladium-based sensor using the second substrate and the palladium tube.

In addition, the forming of the aggregate may be based on the fact that a predetermined voltage is applied between the first substrate and the object having an opening of a predetermined size and containing a material constituting the assembly therein so that the material is discharged through the opening. By doing so, it may include the step of forming an aggregate having the porosity.

In addition, the aggregate having the porosity may be composed of polyvinyl alcohol (PVA).

In addition, depositing the palladium may include depositing the palladium in the vacuum chamber based on the assembly being located in the vacuum chamber.

In addition, the porous aggregate may have the porosity based on the fact that the thread-shaped material is grouped to include a space therein, and the cross-section of the thread-shaped material may be circular.

In addition, the palladium tube may have a shape of a half pipe.

In addition, the first substrate may have a hole of a predetermined size, and at least a part of the assembly may be formed while floating above the hole of the first substrate.

An apparatus for manufacturing a palladium-based sensor according to an embodiment of the present invention includes an assembly forming unit for forming an aggregate having porosity on a first substrate by using electrospinning, and a deposition unit for depositing palladium at a predetermined thickness on the assembly, On the basis of dissolving the assembly disposed on the second substrate using an organic solvent and an arrangement portion for disposing the assembly on which the palladium is deposited on a second substrate to form a sensor, the assembly-shaped space is A tube forming unit for forming a palladium tube including, and a sensor manufacturing unit for manufacturing a palladium-based sensor using the second substrate and the palladium tube.

In addition, the assembly forming unit has an opening of a predetermined size, and a predetermined voltage is applied between the first substrate and the object containing the material constituting the assembly, so that the porosity is discharged through the opening. Can form an aggregate with

In addition, the aggregate having the porosity may be composed of polyvinyl alcohol (PVA).

In addition, the deposition unit may deposit the palladium in the vacuum chamber based on the assembly being located in the vacuum chamber.

In addition, the porous aggregate may have the porosity based on the fact that the thread-shaped material is grouped to include a space therein, and the cross-section of the thread-shaped material may be circular.

In addition, the palladium tube may have a shape of a half pipe.

In addition, the first substrate may have a hole of a predetermined size, and the assembly forming part may form at least a part of the assembly while floating above the hole of the first substrate.

A palladium-based sensor according to an embodiment of the present invention includes a substrate and a palladium tube in the form of a half pipe disposed on the substrate, and the palladium tube has a predetermined thickness on a porous assembly formed using electrospinning. Palladium is deposited, and the aggregate on which the palladium is deposited is disposed on the substrate, and thus the aggregate may be formed on the basis of melting by an organic solvent.

In the method and apparatus for manufacturing a palladium-based sensor according to an embodiment of the present invention, a palladium-based sensor can be manufactured more easily and inexpensively by forming palladium using a soluble porous aggregate.

However, the effects obtainable in the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those of ordinary skill in the art from the following description. I will be able to.

1 conceptually shows an example of a method for manufacturing a palladium-based sensor according to an embodiment of the present invention.
2 shows an example of a functional block diagram of an apparatus for manufacturing a palladium-based sensor according to an embodiment of the present invention.
3 shows the flow of each step of the method for manufacturing a palladium-based sensor according to an embodiment of the present invention.
4 shows an example of experimental results derived in the manufacturing process of a palladium-based sensor according to an embodiment of the present invention.
5 conceptually illustrates an example of a palladium-based sensor according to an embodiment of the present invention.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only these embodiments make the disclosure of the present invention complete, and those skilled in the art to which the present invention pertains. It is provided to fully inform the person of the scope of the invention, and the scope of the invention is only defined by the claims.

In describing the embodiments of the present invention, detailed descriptions of known functions or configurations will be omitted except when actually necessary in describing the embodiments of the present invention. In addition, terms to be described later are terms defined in consideration of functions in an embodiment of the present invention, which may vary according to the intention or custom of users or operators. Therefore, the definition should be made based on the contents throughout this specification.

Since the present invention can make various changes and include various embodiments, specific embodiments will be illustrated in the drawings and described in the detailed description. However, this is not intended to limit the present invention to a specific embodiment, and should be understood as including all changes, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including an ordinal number such as first and second may be used to describe various elements, but the corresponding elements are not limited by these terms. These terms are only used for the purpose of distinguishing one component from another.

When a component is referred to as being'connected' or'connected' to another component, it is understood that it may be directly connected or connected to the other component, but other components may exist in the middle. Should be.

1 conceptually shows an example of a method for manufacturing a palladium-based sensor according to an embodiment of the present invention. Specifically, FIG. 1 shows the steps of a method for manufacturing a palladium-based sensor and a result obtained step by step.

According to reference number 1a, a material that will constitute the aggregate 20 having porosity on the first substrate 30 may be radiated from the object 10. The object 10 may be made of a material having conductivity and may include an opening 11 having a predetermined size. In addition, the material may be made of various materials that can be dissolved by an organic solvent. For example, the material may be made of polyvinyl alcohol (PVA).

The first substrate 30 may be a conductor, and a hole (or hollow) having a predetermined size may be formed in the first substrate 30.

A predetermined voltage may be applied between the object 10 and the first substrate 30. Accordingly, the material injected into the object 10 is ejected through the opening 11 and the first substrate 30 and the object ( 10) The material is radiated through the gap and randomly twisted (or lumped together) to form an aggregate 20 having a porosity. Radiation of a material based on the application of such a voltage may be referred to as electrospinning.

Specifically, the aggregate 20 may have porosity by being spewed out in the form of a thread (or fiber) having a diameter less than or equal to a predetermined diameter to form a bundle of threads. The cross-section of the material in the form of a thread constituting the assembly 20 may be circular as shown in reference number 2a, and the diameter thereof may be less than a predetermined value and may have a fine size of a nano level.

In some cases, a cross section such as reference numeral 2a may correspond to the shape of the opening 11. That is, based on the opening 11 having a fine size of a nano level, a cross section having a fine size of a nano level may be formed as the material is radiated.

Meanwhile, the holes of the first substrate 30 may be formed to be smaller than or equal to the assembly 20, and based on this, at least a part of the assembly 20 may be formed while floating above the hole of the first substrate 30. I can. It will be described later, but accordingly, the assembly 20 formed while floating in the air can be easily separated from the first substrate 30, and thus can be more easily transferred to another substrate (for example, the second substrate 50) ( Or can be transferred).

In this regard, for an example of the first substrate 30 including a hole, reference numeral 3a of FIG. 4 may be referred to. Meanwhile, the assembly 20 formed on the first substrate 30 may be transparent, and an example of this may refer to reference numeral 3b of FIG. 4.

According to reference numeral 1b shown in FIG. 1, palladium may be deposited on the assembly 20. The palladium 40 may be deposited in the vacuum chamber by moving the assembly 20 into the vacuum chamber. The deposition of palladium 40 is made only on a part of the assembly 20, for example, a part exposed to the outside of the assembly 20 or a part of the assembly 20 exposed to the outside while facing the first substrate 30. I can.

For example, a cross section of a material (or a material in the form of a thread) constituting the aggregate 40 on which palladium is deposited may be implemented as shown in reference number 2b. According to reference number 2b, palladium is deposited only on at least a portion of the assembly 20 (eg, the upper portion of the assembly 20), so that palladium may be in the form of a half pipe. However, since the deposition of palladium occurs on the part exposed to the outside of the assembly 20, the shape of palladium is not limited to that shown in reference number 2b, and corresponds to the shape of the part exposed to the outside of the assembly 20 As long as it is possible, it can be formed into various shapes (eg, curved surfaces having various lengths).

According to reference number 1c, the aggregate 40 on which palladium is deposited may be transferred to the second substrate 50, which is a substrate constituting the sensor. The aggregate 40 on which palladium is deposited can be dissolved (or dissolved) by an organic solvent, and thus, only palladium excluding the aggregate 20 radiated through the object 10 on the second substrate 50 This can be left behind.

In the aggregate 40 on which palladium is deposited as described above, only the palladium portion excluding the aggregate 20 may be separated and referred to as a palladium tube. Since the palladium tube is formed based on the shape of the assembly 20, the palladium tube assembly 60 can be formed by being aggregated into a shape similar to the shape of the assembly 20.

The cross section of the palladium tube may be, for example, a curved shape or a half pipe shape. In addition, in some cases, palladium may have transmittance (or transparency) of a predetermined value or more, and accordingly, the palladium tube assembly 60 may also have transmittance and may be positioned on the second substrate 60.

The cross section of the palladium tube constituting the palladium tube assembly 60 may be the same as the reference number 2c. The palladium tube assembly 60 may be implemented in an irregularly entangled form, that is, in the form of a bundle of threads, and an example of this form may be referred to reference numeral 3c of FIG. 4.

2 shows an example of a functional block diagram of an apparatus for manufacturing a palladium-based sensor according to an embodiment of the present invention. Used below'… A term such as'negative' means a unit that processes at least one function or operation, which may be implemented by hardware or software, or a combination of hardware and software. Hereinafter, in the description of FIG. 2, content overlapping with FIG. 1 may be omitted.

2, the palladium-based sensor manufacturing apparatus 100 includes an assembly forming unit 110, a deposition unit 120, a placement unit 130, a tube assembly forming unit 140, and a sensor manufacturing unit 150 can do. The assembly forming unit 110 may be implemented by a computing device including a microprocessor, which will be described later with a deposition unit 120, a placement unit 130, a tube assembly forming unit 140, and a sensor manufacturing unit. The same is true for (150).

The assembly forming unit 110 may form the assembly 20 having porosity on the first substrate by using electrospinning. Specifically, the assembly forming unit 110 has an opening 11 of a predetermined size and a predetermined voltage is applied between the object 10 and the first substrate 30 in which the material constituting the assembly 20 is contained. Accordingly, the aggregate 20 having a porosity may be formed based on the material being discharged through the opening 11.

In this case, the porous aggregate may be composed of a material, such as PVA, which is dissolved by an organic solvent. Aggregates having porosity may have porosity based on the presence of spaces within the yarn-shaped materials grouped. The cross section of the thread-shaped material may be, for example, a circular (or elliptical) shape, but is not limited thereto. That is, the cross section of the thread-shaped material may have various shapes according to the shape of the opening 11.

The first substrate 30 may have a hole of a predetermined size, and at least a part of the assembly 20 may be formed while floating above the hole of the first substrate 30.

The deposition unit 120 may deposit palladium on the assembly 20 to a predetermined thickness. Specifically, the deposition unit 120 may deposit palladium in the vacuum chamber based on the assembly 20 being positioned in the vacuum chamber. The deposition unit 120 may control a deposition time to deposit palladium on an upper portion of the assembly 20 by a predetermined thickness. That is, palladium may be deposited on at least a part of the assembly 20, and the deposited portion may be a part of the assembly 20 exposed to the outside (or surrounding space).

The placement unit 130 may place (or transfer) the aggregate 40 on which palladium is deposited on the second substrate 50. The second substrate 50 may be a substrate of a sensor to be manufactured.

Meanwhile, the first substrate 30 may have a hole less than or equal to the size of the assembly 20, and accordingly, the assembly 40 on which palladium is deposited may be formed in a form floating above the hole. Accordingly, the assembly 40 on which palladium is deposited may be easily separated from the first substrate 30 and the assembly 40 may be more easily disposed on the second substrate 60 based on this.

The tube assembly forming unit 140 may form a palladium tube assembly 60 by melting the assembly 20 disposed on the second substrate 50 using an organic solvent. That is, the palladium tube assembly 60 is formed in the shape of a skein having the same shape as the assembly 20, but the shape of the skein forming the skein may take the shape of a curved surface (eg, a half pipe).

On the other hand, the length of the curved surface appearing on the cross section of the palladium tube constituting the palladium tube assembly 60 may not be constant, and in some cases, the cross section may be composed of only a semicircle or at least a part of a circle. However, the spirit of the present invention is not limited thereto.

The sensor manufacturing unit 150 may manufacture a palladium-based sensor using the second substrate 50 and the palladium tube assembly 60. Specifically, the sensor manufacturing unit 150 may manufacture a sensor such that the palladium tube assembly 60 formed on the second substrate 50 is included. In this regard, an example of the manufactured sensor may refer to FIG. 5.

3 shows the flow of each step of the method for manufacturing a palladium-based sensor according to an embodiment of the present invention. In addition, it goes without saying that each step of the method illustrated in FIG. 3 may be performed in a different order as illustrated in the drawings depending on the case.

Referring to FIG. 3, the assembly forming unit 110 may form an assembly having porosity on the first substrate 30 (S110 ). The assembly forming unit 110 may use the principle of electrospinning to form an assembly.

For example, the assembly forming part 110 has an opening 11 of a predetermined size and a predetermined voltage is applied between the object 10 and the first substrate 30 in which a material soluble in an organic solvent is injected therein. Thus, the material may be released in the form of a thread (or fiber) through the opening 11 and lumped together in the form of a skein (or a bundle of threads) to form a porous assembly 20.

In some cases, holes having a predetermined size may be included in the first substrate 30, and an aggregate 20 having a porosity may be formed in a form floating on the holes.

The deposition unit 120 may deposit palladium in a predetermined thickness on the assembly 20 (S120). Specifically, after moving the assembly 20 to the vacuum chamber, the deposition unit 120 may perform the deposition of palladium on the assembly 20 for a predetermined time.

Meanwhile, the deposition time at which palladium is deposited may be predetermined, and the deposition unit 120 may adjust the thickness at which palladium is deposited based on controlling the deposition time of palladium. For example, the deposition time of palladium may be increased so that the palladium is deposited thicker, or the deposition time of palladium may be reduced to allow the palladium to be deposited thinner.

The placement unit 130 may arrange the aggregate 40 on which palladium is deposited on the second substrate 50 (S130). Here, the second substrate 50 may be a substrate for configuring the sensor. Since the above-described palladium-deposited assembly 40 is on the first substrate 30 having holes, the second substrate 50 ) Can be transferred.

The tube assembly forming unit 140 may form a palladium tube assembly including an aggregate-shaped space based on melting the assembly disposed on the second substrate 50 using an organic solvent (S140). Specifically, the tube assembly forming unit 140 may form a palladium tube assembly 60 in which a united form corresponds to the assembly 20, but the element constituting the assembly 20 is a palladium tube.

The sensor manufacturing unit 150 may manufacture a palladium-based sensor using the second substrate 50 and the palladium tube assembly 60 (S150). Specifically, the sensor manufacturing unit 150 may manufacture the sensor by allowing the second substrate 50 and the palladium tube assembly 60 on the second substrate 50 to be included in the sensor.

4 shows an example of experimental results derived in the manufacturing process of a palladium-based sensor according to an embodiment of the present invention.

Reference numeral 3a denotes an example of the first substrate 30 having holes. The first substrate 30 may have a predetermined hole in the middle as shown. Meanwhile, in reference numeral 3a, the hole of the first substrate 30 has a rectangular shape, but is not limited thereto and may be implemented in various shapes.

Reference number 3b is a diagram for indicating that the assembly 20 is transparent when the assembly 20 is formed on the first substrate 30. According to this, although at least a part of the assembly 20 is positioned on at least a portion of the first substrate 30, it can be seen that the rear surface of the hole of the first substrate 30 is visible because the assembly 20 is transparent.

Reference number 3c shows an enlarged example of a part of the palladium tube assembly 60. According to this, the palladium tube assembly 60 may be irregularly arranged to have porosity, similar to the porosity assembly 20.

5 conceptually illustrates an example of a palladium-based sensor according to an embodiment of the present invention. The sensor of FIG. 5 is manufactured by the above-described sensor manufacturing method, and may be a hydrogen sensor for detecting the presence of hydrogen. In this regard, contents overlapping with those described with reference to FIGS. 1 to 4 will be omitted.

Referring to FIG. 5, a palladium tube assembly 60 may be formed on the second substrate 50, and the sensor 1 may be implemented to include it. Although an example of the sensor is simply illustrated in FIG. 5, it is not limited thereto, and it is a matter of course that various components constituting the sensor may be further included.

Meanwhile, the sensitivity of the sensor may vary according to the thickness of palladium. For example, as the thickness of palladium decreases, the volume versus surface area of palladium increases, so the sensitivity of a palladium-based sensor may increase. The thickness may be adjusted based on the palladium deposition time being controlled by the deposition unit 120 of the sensor manufacturing apparatus 100 described above.

In the method and apparatus for manufacturing a palladium-based sensor according to an embodiment of the present invention, since it is possible to manufacture a palladium nanostructure without using a photomask or nanolithography, a sensor can be manufactured more easily and efficiently. In addition, since the sensor manufacturing method is simple, manufacturing cost can also be reduced.

In the method and apparatus for manufacturing a palladium-based sensor according to an embodiment of the present invention, by controlling the thickness of palladium constituting the palladium tube assembly 60 by adjusting the deposition time, the sensitivity can be more efficiently and easily adjusted. have.

The method and apparatus for manufacturing a palladium-based sensor according to an embodiment of the present invention facilitates transfer to various substrates by forming the assembly 20 and depositing palladium using the first substrate 30 having holes. It can be done in a way.

Combinations of each block of the block diagram attached to the present specification and each step of the flowchart may be performed by computer program instructions. Since these computer program instructions can be mounted on a processor of a general purpose computer, special purpose computer, or other programmable data processing equipment, the instructions executed by the processor of the computer or other programmable data processing equipment are shown in each block or flow chart of the block diagram. Each step will create a means to perform the functions described. These computer program instructions can also be stored in computer-usable or computer-readable memory that can be directed to a computer or other programmable data processing equipment to implement a function in a particular way, so that the computer-usable or computer-readable memory It is also possible to produce an article of manufacture in which the instructions stored in the block diagram contain instruction means for performing the functions described in each block or flow chart. Computer program instructions can also be mounted on a computer or other programmable data processing equipment, so that a series of operating steps are performed on a computer or other programmable data processing equipment to create a computer-executable process to create a computer or other programmable data processing equipment. It is also possible for the instructions to perform the processing equipment to provide steps for performing the functions described in each block of the block diagram and each step of the flowchart.

In addition, each block or each step may represent a module, segment, or part of code comprising one or more executable instructions for executing the specified logical function(s). In addition, it should be noted that in some alternative embodiments, functions mentioned in blocks or steps may occur out of order. For example, two blocks or steps shown in succession may in fact be performed substantially simultaneously, or the blocks or steps may sometimes be performed in the reverse order depending on the corresponding function.

The above description is merely illustrative of the technical idea of the present invention, and those of ordinary skill in the art to which the present invention pertains will be able to make various modifications and variations without departing from the essential quality of the present invention. Accordingly, the embodiments disclosed in the present specification are not intended to limit the technical idea of the present disclosure, but to explain the technical idea, and the scope of the technical idea of the present disclosure is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

10: object 20: aggregate
30: first substrate 40: aggregate on which palladium is deposited
50: second substrate 60: palladium tube assembly
100: sensor manufacturing device 110: assembly forming unit
120: evaporation unit 130: placement unit
140: tube assembly forming unit 150: sensor manufacturing unit

Claims (15)

Forming an aggregate having porosity on the first substrate by using electrospinning,
Depositing palladium with a predetermined thickness on the aggregate,
Disposing the aggregate on which the palladium is deposited on a second substrate,
Forming a palladium tube assembly corresponding to the shape of the aggregate but composed of palladium based on melting the aggregate disposed on the second substrate using an organic solvent; and
Including the step of manufacturing a palladium-based sensor using the second substrate and the palladium tube assembly
Palladium-based sensor manufacturing method. The method of claim 1,
The step of forming the aggregate,
Forming an aggregate having the porosity based on the release of the material through the opening by applying a predetermined voltage between the first substrate and an object having an opening having a predetermined size and including a material constituting the assembly therein Including
Palladium-based sensor manufacturing method. The method of claim 1,
The aggregate having the porosity,
Consisting of PVA (polyvinyl alcohol)
Palladium-based sensor manufacturing method. The method of claim 1,
The step of depositing the palladium,
Based on the assembly being placed in a vacuum chamber, depositing the palladium in the vacuum chamber.
Palladium-based sensor manufacturing method. The method of claim 1,
The aggregate having the porosity,
The material in the form of a thread is grouped to have the porosity based on the space inside,
The cross section of the thread-shaped material is circular
Palladium-based sensor manufacturing method. The method of claim 1,
The palladium tube constituting the palladium tube assembly,
Half-pipe
Palladium-based sensor manufacturing method. The method of claim 1,
The first substrate has a hole of a predetermined size,
At least a portion of the assembly is formed while floating above the hole of the first substrate
Palladium-based sensor manufacturing method. An assembly forming portion for forming an aggregate having porosity on the first substrate by using electrospinning,
A deposition unit for depositing palladium in a predetermined thickness on the assembly,
A placement unit for disposing the aggregate on which the palladium is deposited on a second substrate to constitute a sensor,
A tube forming part corresponding to the shape of the aggregate but forming a palladium tube assembly composed of palladium based on melting the aggregate disposed on the second substrate using an organic solvent;
Including a sensor manufacturing unit for manufacturing a palladium-based sensor using the second substrate and the palladium tube assembly
Palladium-based sensor manufacturing device. The method of claim 8,
The assembly forming part,
Forming the aggregate having the porosity based on the release of the material through the opening by applying a predetermined voltage between the object and the first substrate having an opening of a predetermined size and the material constituting the assembly therein.
Palladium-based sensor manufacturing device. The method of claim 8,
The aggregate having the porosity,
Consisting of PVA (polyvinyl alcohol)
Palladium-based sensor manufacturing device. The method of claim 8,
The deposition unit,
Based on the assembly being placed in a vacuum chamber, depositing the palladium in the vacuum chamber
Palladium-based sensor manufacturing device. The method of claim 8,
The aggregate having the porosity,
The material in the form of a thread is grouped to have the porosity based on the space inside,
The cross section of the thread-shaped material is circular
Palladium-based sensor manufacturing device. The method of claim 8,
The palladium tube constituting the palladium tube assembly,
Half-pipe
Palladium-based sensor manufacturing device. The method of claim 8,
The first substrate has a hole of a predetermined size,
The assembly forming part,
Forming at least a part of the assembly while floating above the hole of the first substrate
Palladium-based sensor manufacturing device. The substrate,
Including a palladium tube assembly disposed on the substrate,
The palladium tube assembly,
On the basis of the deposition of palladium to a predetermined thickness on the porous aggregate formed by electrospinning, and the palladium-deposited aggregate is disposed on the substrate, a portion corresponding to the aggregate of the palladium-deposited aggregate is an organic solvent Formed on the basis of melting by the agent
Palladium-based sensor.

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