KR20210006150A - Apparatus for treating substrate - Google Patents

Abstract

Provided is an apparatus for processing a substrate. The apparatus for processing a substrate comprises: a substrate support unit supporting a substrate and capable of fixing the substrate with constant power; a lift pin movable along the through hole formed in the substrate support unit and lifting the substrate seated on the substrate support unit; and a conductive pin movable along a hollow hole formed in the lift pin and contacting the substrate to ground the substrate.

Description

Substrate processing apparatus {Apparatus for treating substrate}

The present invention relates to a substrate processing apparatus.

When manufacturing a semiconductor device or a display device, various processes such as photography, etching, ashing, ion implantation, thin film deposition, and cleaning are performed. Here, the photographic process includes coating, exposure, and development processes. A photoresist is applied on a substrate (ie, a coating process), a circuit pattern is exposed on a substrate on which a photoresist film is formed (ie, an exposure process), and an exposed area of the substrate is selectively developed (ie, a developing process).

In the process chamber, the substrate may be supported by an electrostatic chuck. The electrostatic chuck may fix the substrate with constant power generated by electrostatic induction.

The problem to be solved by the present invention is to provide a substrate processing apparatus.

The problems of the present invention are not limited to the problems mentioned above, and other problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

One aspect of the substrate processing apparatus of the present invention for achieving the above object is a substrate support that supports a substrate and is capable of fixing the substrate with constant power, and is movable along a through hole formed in the substrate support, And a lift pin for lifting a substrate mounted on the substrate support portion, and a conductive pin movable along a hollow hole formed in the lift pin and contacting the substrate to ground the substrate.

The substrate support part includes an electrostatic puck facing one surface of the substrate and having an electrostatic electrode to fix the substrate with an electrostatic force, and an electrostatic body supporting the electrostatic puck.

The substrate processing apparatus further includes a current sensing unit that is electrically connected to the conductive pin to sense a current flowing from the conductive pin.

The substrate processing apparatus further includes a controller configured to control an operation of the lift pin by referring to a detection result of the current sensing unit.

Details of other embodiments are included in the detailed description and drawings.

1 is a view showing a substrate processing apparatus according to an embodiment of the present invention.
2 is an enlarged view of A shown in FIG. 1.
3 is a diagram illustrating that a process is performed on a substrate supported by the substrate processing apparatus shown in FIG. 1.
FIG. 4 is a view showing plasma for discharge is generated on the substrate on which the process is completed in FIG. 3.
FIG. 5 is a diagram illustrating that a substrate discharged by plasma in FIG. 4 is discharged by a conductive pin.
6 is a view showing that the substrate discharged by the conductive pin in FIG. 5 is lifted by the lift pin.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments to be posted below, but may be implemented in a variety of different forms, and only these embodiments make the posting of the present invention complete, and common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the scope of the invention to those who have it, and the invention is only defined by the scope of the claims. The same reference numerals refer to the same components throughout the specification.

When an element or layer is referred to as “on” or “on” of another element or layer, it is possible to interpose another layer or other element in the middle as well as directly above the other element or layer. All inclusive. On the other hand, when a device is referred to as "directly on" or "directly on", it indicates that no other device or layer is interposed therebetween.

Spatially relative terms "below", "beneath", "lower", "above", "upper", etc., as shown in the figure It may be used to easily describe the correlation between the device or components and other devices or components. Spatially relative terms should be understood as terms including different directions of the device during use or operation in addition to the directions shown in the drawings. For example, if an element shown in the figure is turned over, an element described as “below” or “beneath” of another element may be placed “above” another element. Accordingly, the exemplary term “below” may include both directions below and above. The device may be oriented in other directions, and thus spatially relative terms may be interpreted according to the orientation.

Although the first, second, etc. are used to describe various elements, components and/or sections, of course, these elements, components and/or sections are not limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Therefore, it goes without saying that the first element, the first element, or the first section mentioned below may be a second element, a second element, or a second section within the technical scope of the present invention.

The terms used in the present specification are for describing exemplary embodiments and are not intended to limit the present invention. In this specification, the singular form also includes the plural form unless specifically stated in the phrase. As used in the specification, "comprises" and/or "comprising" refers to the presence of one or more other components, steps, actions and/or elements, and/or elements, steps, actions and/or elements mentioned. Or does not preclude additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used as meanings that can be commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in a commonly used dictionary are not interpreted ideally or excessively unless explicitly defined specifically.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, identical or corresponding components are assigned the same reference numerals and duplicated Description will be omitted.

1 is a view showing a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is an enlarged view of A shown in FIG. 1.

Referring to FIG. 1, the substrate processing apparatus 10 includes a substrate support part 100, a lift pin 200, a conductive pin 300, a power supply part 400, a current sensing part 500, and a control unit (not shown). It consists of including.

The substrate support 100 may support a substrate. In addition, the substrate support part 100 may fix static power to the supported substrate. The substrate support 100 includes an electrostatic body 110 and an electrostatic puck 120.

The electrostatic body 110 may support the electrostatic puck 120. In addition, the electrostatic body 110 may separate the electrostatic puck 120 by a predetermined distance from the bottom surface of the space in which the substrate support part 100 is provided.

The electrostatic puck 120 serves to support the substrate. One surface of the substrate may face the electrostatic puck 120, and the substrate may be supported in close contact with the support surface of the electrostatic puck 120.

The electrostatic puck 120 may fix the substrate with constant power. To this end, the electrostatic puck 120 may include an electrostatic electrode 130. The electrostatic electrode 130 may be electrically connected to the power supply unit 400. The electrostatic electrode 130 may generate an electrostatic force by power supplied from the power supply unit 400. Power supplied by the power supply unit 400 may be DC power. The substrate may be adsorbed to the electrostatic puck 120 by the electrostatic force of the electrostatic electrode 130.

A through hole H1 may be formed in the substrate support 100. The through hole H1 may be formed sequentially across the electrostatic body 110 and the electrostatic puck 120. The lift pin 200 may move along the through hole H1. That is, the lift pin 200 may move in the length direction of the through hole H1.

The lift pin 200 serves to lift a substrate mounted on the substrate support 100. An opening is formed in the support surface of the electrostatic puck 120 by the through hole H1 of the substrate support part 100, and the lift pin 200 is protruded or inserted through the opening to lift the substrate. Although not shown, a driving unit (not shown) for raising and lowering the lift pin 200 along the through hole H1 may be provided.

A hollow hole H2 may be formed in the lift pin 200. For example, a hollow hole H2 may be formed in the longitudinal direction along the center line of the lift pin 200. The conductive pin 300 may move along the hollow hole H2 formed in the lift pin 200. That is, the conductive pin 300 may move in the length direction of the hollow hole H2. Although not shown, a driving unit (not shown) for raising and lowering the conductive pin 300 along the hollow hole H2 may be provided.

Since the conductive pin 300 is movable along the hollow hole H2 of the lift pin 200, the grounding and de-grounding of the substrate can be easily performed, and a separate space for a configuration for grounding the substrate is provided. The need can be eliminated.

The conductive pin 300 contacts the substrate and serves to ground the substrate. Charges contained in the substrate may be removed by moving through the conductive pins 300. To this end, the conductive pin 300 is preferably made of a material having high conductivity.

The current sensing unit 500 is electrically connected to the conductive pin 300 to detect a current flowing from the conductive pin 300. When the current sensing unit 500 senses the current, it may be determined that electric charges still exist on the substrate. On the other hand, when the current sensing unit 500 does not detect the current, it may be determined that there is no charge on the substrate.

The detection result of the current sensing unit 500 may be transmitted to the control unit. The control unit serves to control the operation of the lift pin 200 and the conductive pin 300 by referring to the detection result of the current detection unit 500. For example, when the current sensing unit 500 senses a current, the lift pin 200 may maintain a state in which the conductive pin 300 is in contact with the substrate. On the other hand, when the current sensing unit 500 does not detect the current, the controller may move the conductive pin 300 to release contact with the substrate, and move the lift pin 200 to lift the substrate.

Hereinafter, a process in which the substrate is discharged will be described with reference to FIGS. 3 to 6.

FIG. 3 is a diagram showing that a process is performed on a substrate supported by the substrate processing apparatus shown in FIG. 1, and FIG. 4 is a view showing plasma for discharge is generated on the substrate on which the process is completed in FIG. 5 is a view showing that the substrate discharged by the plasma in FIG. 4 is discharged by the conductive pin, and FIG. 6 is a view showing that the substrate discharged by the conductive pin in FIG. 5 is lifted by the lift pin.

Referring to FIG. 3, a process may be performed on the substrate W supported by the substrate support 100. For example, a process such as etching, thin film deposition or cleaning may be performed on the substrate W. In this case, a process by the plasma 20 may be performed.

In order to process the substrate W, the electrostatic puck 120 may fix the substrate W with electrostatic force. In this case, one surface of the substrate W in contact with the electrostatic puck 120 may be charged with an opposite charge to the electrostatic electrode 130.

Referring to FIG. 4, plasma 30 for discharging may be generated on the substrate W on which the process has been completed. Although not shown, a plasma generator (not shown) for generating the plasma for discharge 30 may be provided. Some of the charges charged on the substrate W may be discharged by the plasma 30 for discharge. The discharge plasma 30 may be the same as the process plasma 20.

The lift pin 200 may support the substrate W before or during the discharge by the discharge plasma 30 is performed. The lift pin 200 may space the substrate W apart from the surface of the electrostatic puck 120 by a predetermined distance. Plasma for discharge 30 may permeate between the substrate W and the electrostatic puck 120, and discharge may be performed on the lower surface of the substrate W.

Referring to FIG. 5, the conductive pin 300 may contact the substrate W to ground the substrate W.

The conductive pin 300 may move along the hollow hole H2 of the lift pin 200 to contact the substrate W. Accordingly, the electric charge remaining on the substrate W may move through the conductive pin 300.

The electric charge may pass through the current sensing unit 500, and the current sensing unit 500 may detect the magnitude of the current.

The control unit may continuously monitor the detection result of the current detection unit 500. Thus, when the magnitude of the current is greater than or equal to or greater than zero, the control unit can maintain the discharge by the conductive pin 300 as it is. On the other hand, when the magnitude of the current is smaller than or equal to a predetermined threshold magnitude, the controller may cause the lift pin 200 to lift the substrate W.

Referring to FIG. 6, the lift pin 200 may lift the substrate W. The substrate W may be spaced apart from the surface of the electrostatic puck 120 by a predetermined distance by the lift pin 200.

Since the electric charge is removed from the substrate W, the electrostatic force between the substrate W and the electrostatic puck 120 is extinguished, and separating the substrate W from the electrostatic puck 120 can be easily performed. The substrate W separated from the electrostatic puck 120 may be transported by a separate transfer robot (not shown).

Although the embodiments of the present invention have been described with reference to the above and the accompanying drawings, those of ordinary skill in the art to which the present invention pertains can implement the present invention in other specific forms without changing the technical spirit or essential features. You can understand that there is. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not limiting.

10: substrate processing apparatus 100: substrate support
200: lift pin 300: conductive pin
400: power supply 500: current sensing unit

Claims (4)

A substrate support portion supporting a substrate and capable of fixing the substrate with constant power;
A lift pin that is movable along the through hole formed in the substrate support and lifts and lowers the substrate mounted on the substrate support; And
A substrate processing apparatus comprising a conductive pin movable along a hollow hole formed in the lift pin and contacting the substrate to ground the substrate. The method of claim 1,
The substrate support,
An electrostatic puck facing one surface of the substrate and provided with an electrostatic electrode to fix the substrate with constant power; And
A substrate processing apparatus comprising an electrostatic body supporting the electrostatic puck. The method of claim 1,
The substrate processing apparatus further comprises a current sensing unit electrically connected to the conductive pin to sense a current flowing from the conductive pin. The method of claim 3,
The substrate processing apparatus further comprises a controller configured to control an operation of the lift pin by referring to a detection result of the current sensing unit.

Images