KR20210002458U - Heat sink for m.2 type ssd - Google Patents

Abstract

The present invention relates to an M.2 SSD heat dissipation mechanism.
In the present invention, it has a rectangular parallelepiped shape in which the left and right side surfaces and the upper surface are open, and at least a portion of the front and rear upper surfaces is provided with a bent end bent inwardly downward, and the bent end forms a concave portion that is concavely formed from the inside to the top. an upper heat sink including a lower heat sink and a seating portion concave in the downward direction at a position in a vertical downward direction opposite to the recess portion on the upper surface, the upper heat sink including a close contact transmission portion placed in the upper region of the lower surface of the lower heat sink and seating with the recess Disclosed is an M.2 SDD heat dissipation mechanism, comprising a spring-fixed club inserted between the parts to apply vertical elasticity, wherein the M.2 SDD is interposed in a space between the lower heat sink and the upper heat sink.
Since the M.2 SSD heat dissipation mechanism according to the present invention can be installed only by inserting the spring fixing clip, it can be easily assembled without a separate tool.

Description

M.2 SSD heat dissipation mechanism {HEAT SINK FOR M.2 TYPE SSD}

The present invention relates to an M-point-to-SSD heat dissipation mechanism, and more specifically, to an M-point-to-point SSD heat dissipation mechanism with high heat dissipation efficiency by firmly coupling a heat sink and an M.2 SSD by spring coupling without screwing.

A solid state drive (SSD) is a high-speed auxiliary storage device that replaces a slow-speed hard disk drive (HDD). 1 shows two types of SSD photos. 1(a) shows a SATA type SSD having a rectangular parallelepiped shape with a low height as a shape similar to a general HDD (Hard Disk Drive), and FIG. 1(b) shows a shape similar to a RAM (Random Access Memory). It shows an M.2 SSD with

M.2 SSD is an SSD standard that is being proposed as a standard for next-generation storage devices. In the M.2 slot specification, there are two specifications: SATA and PCIe, which is faster than SATA. PCIe M.2 is known to be about 60% faster than SATA3. The present invention relates to a heat dissipation mechanism applicable to an M.2 SSD inserted and installed in an M.2 slot.

2 is an exploded perspective view of a conventional M.2 SSD heat dissipation mechanism used in the M.2 SSD. The conventional M.2 SSD heat dissipation mechanism consists of a lower heat sink 10 , a lower thermal pad 20 , an upper thermal pad 20 , and an upper heat sink 50 . The lower thermal pad 20, the M.2 SSD 30, the upper thermal pad 40, and the upper heat sink 50 are sequentially stacked on the lower heat sink 10, and then the lower heat sink 10 and It is assembled by fastening the upper heat sink 50 . In order to fasten the screws 60a and 60b, two through holes 10a and 10b are provided in the lower heat sink 10, and two screw fastening grooves 50a and 50b are provided on the front surface of the upper heat sink 50 corresponding thereto. this is provided

However, since the conventional heat dissipation mechanism as shown in FIG. 2 requires screw fastening, (1) a separate tool such as a screwdriver is required for fastening, (2) assembly is not easy, and (3) the manufacturing tolerance of each part is required for accurate screw fastening. (3) When used for a long time, the upper and lower thermal pads become thinner due to heat, so the lower thermal pad 20, M.2 SSD 30, upper thermal pad 20, and upper heat sink 50 are completely in close contact. There was a problem in that the heat dissipation efficiency was lowered because a space was generated between them.

Republic of Korea Patent Publication No. 10-2017-0042025 (2017.04.18, published)

The present invention is to solve the problems of the conventional M.2 SSD heat dissipation mechanism, it can be easily assembled without a separate tool, can take a large manufacturing tolerance during product production, and can continuously use the heat sink and M.2 SSD even for a long time. An object of the present invention is to provide an M.2 SSD heat dissipation mechanism that can maintain the heat dissipation effect by closely adhering it.

The above object of the present invention is an M.2 SDD heat dissipation mechanism for dissipating heat generated from the M.2 SDD inserted and installed in the M.2 slot, and has a rectangular parallelepiped shape with left and right sides and top surfaces open, front and rear upper at least a portion of the lower heat sink having a bent end bent inwardly, the bent end forming a concave portion concave from the inside to the upper direction, and on the upper surface of the lower heat sink at a position in a vertical downward direction opposite to the concave portion An upper heat sink having a seating portion concavely formed with a seat portion, the upper heat sink including a close contact transmission portion placed on the upper region of the lower surface of the lower heat sink, and a spring fixing club inserted between the recess and the seating portion to apply elasticity in the vertical direction, , M.2 SDD can be achieved by the M.2 SDD heat dissipation mechanism, characterized in that interposed in the space between the lower heat sink and the upper heat sink.

More specifically, it further includes a lower thermal pad stacked on the lower surface of the lower heat sink and an upper thermal pad stacked on top of the M.2 SDD, and the upper heat sink is stacked on the upper thermal pad so that it is in close contact with the M.2 SSD. It is possible to increase the heat dissipation efficiency.

Since the M.2 SSD heat dissipation mechanism according to the present invention can be installed only by inserting the spring fixing clip, it can be easily assembled without a separate tool.

In addition, since the lower heat sink and the upper heat sink are combined by the elasticity of the spring fixing clip, when used for a long time, even if the thermal pad becomes thin, there is no space between the lower heat sink, the lower thermal pad, the M.2 SSD, the upper thermal pad and the upper heat sink. It can be attached to each other without any pressure, so that the excellent heat dissipation effect can be maintained.

1 is a picture of two types of SSD.
Figure 2 is an exploded perspective view of a conventional M.2 SSD heat dissipation mechanism used in the M.2 SSD.
3 is an exploded perspective view of an M.2 SSD heat dissipation mechanism according to an embodiment of the present invention;
Figure 4 is a combined perspective view of the M.2 SSD heat dissipation mechanism of an embodiment according to the present invention.
5 is a perspective view of a lower heat sink and a cross-sectional view in BB'direction;
6 is a perspective view of an upper heat sink and a cross-sectional view in CC′ direction;
7 is a perspective view of a spring fixing clip.
Fig. 8 is a cross-sectional view taken along the AA' of Fig. 4;

The terms used in the present invention are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In this specification, terms such as "comprises" or "have" are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification exist, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

In addition, in this specification, "on or on top of" means to be located above or below the target part, and does not necessarily mean to be located above the direction of gravity. Also, when a part of a region, plate, etc. is said to be “on or on” another part, it is not only when another part is in contact with or spaced “on or on” another part, but also when another part is in the middle. Including cases where there is

In addition, in this specification, when a component is referred to as "connected" or "connected" with another component, the component may be directly connected or directly connected to the other component, but in particular It should be understood that, unless there is a description to the contrary, it may be connected or connected through another element in the middle.

Also, in this specification, terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another.

Hereinafter, preferred embodiments, advantages and features of the present invention will be described in detail with reference to the accompanying drawings.

3 is an exploded perspective view of an M.2 SSD heat dissipation mechanism according to an embodiment according to the present invention, and FIG. 4 is a combined perspective view. 3 and 4, the M.2 SSD 30 is a component into which the heat dissipation mechanism according to the present invention is inserted, and does not belong to the heat dissipation mechanism of the present invention. The M.2 SSD heat dissipation mechanism according to the present invention is composed of a lower heat sink 110 , a lower thermal pad 20 , an upper thermal pad 40 , and an upper heat sink 150 . After the lower thermal pad 20, the M.2 SSD 30, the upper thermal pad 40, and the upper heat sink 150 are sequentially stacked on the lower heat sink 110, the lower heat sink 10 and the upper heat sink 50 ), the fastening is completed when the spring fixing clips 170a, 170b are inserted from left to right or from right to left in the drawing. When the assembly of the heat dissipation mechanism is completed in this way, it is configured in the form shown in FIG. 4 . As shown in FIG. 4 , after assembling the M.2 SSD heat dissipation mechanism, the M.2 SSD 30 has a shape in which only the slot insertion part 33 protrudes to the right. For convenience of explanation, in describing each component based on the coordinate system shown in FIG. 3 , the y-axis direction will be described as the front/rear surface, the x-axis direction will be described as left and right sides, and the z-axis direction will be described as upper and lower surfaces.

5 is a perspective view and a cross-sectional view in the B-B' direction of the lower heat sink; The lower heat sink 110 has a rectangular parallelepiped shape in which left and right side surfaces and an upper surface are open, and at least a portion of the upper portion of the front and rear surfaces is formed to have bent ends 110a and 110b bent inwardly downward. The bent bent ends (110a, 110b) formed downward inward form the recesses (113a, 113b) to which the upper end of the spring fixing clip is fixed.

The lower thermal pad 20 and the upper thermal pad 40 have a plate shape having a constant thickness, and the description thereof will be omitted since they are the same as in the prior art.

6 is a perspective view and a cross-sectional view in the C-C' direction of the upper heat sink. The upper heat dissipation plate 150 has a plurality of protrusions because it is preferable to form a surface area in contact with air as wide as possible in order to increase the heat dissipation effect. As shown in the cross-sectional view of Figure 6 (b), the upper heat dissipation plate 150 is largely the upper thermal pad 40 and the lower surface are closely coupled to the close contact transmission portion 150a, a portion of the close contact transmission portion 150a in the upper direction from the upper surface. It is formed in connection with the upper part of the connection part 150b and the connection part 150b, which is formed to be connected in succession, and is formed to have a width approximately similar to the left and right width of the close contact transmission part 150a in the horizontal direction. It consists of a heat dissipation part 150c . The connection portion 150b and the air heat dissipation unit 150c are portions formed to increase the heat dissipation effect, and do not necessarily have to be provided when the close contact transmission unit 150a alone has a sufficient heat dissipation effect.

As described above, the lower surface of the close contact transfer unit 150a is coupled to the upper surface of the upper thermal pad 40, and a concave shape seating for seating the spring fixing clip to be described later on the front and rear portions of the upper surface of the close contact transfer unit 150a. Portions 153a and 153b are formed. A plurality of protrusions 155 are formed on the upper surface of the close contact transfer unit 150a to protrude.

7 is a perspective view of the spring fixing clip. As shown in FIG. 7, the spring fixing clips 170a and 170b are formed as a single linear member. The spring fixing clips 170a and 170b are bent downwardly at both ends of the spring upper part 171 formed on the upper part to have a convex shape in the upward direction with respect to the horizontal line H, and the upper part of the spring 171 is bent downward. It is composed of a spring lower portion 173 having a convex shape.

FIG. 8 is a cross-sectional view taken along AA′ of FIG. 4 . 8 (a) is a cross-sectional view of the state before the assembly of the M.2 SSD heat dissipation mechanism is completed and the spring fixing clips 170a and 170b are inserted, and FIG. 8 (b) is the spring fixing clips 170a and 170b inserted. This is a cross-sectional view viewed from the right. The spring fixing clips 170a and 170b are inserted into the insertion spaces 200a and 200b formed between the recesses 113a and 113b of the lower heat sink 110 and the seating portions 153a and 153b of the upper heat sink 150. Provides elasticity. The lower heat dissipation plate 110, the lower thermal pad 20, the upper thermal pad 40 and the upper heat dissipation plate 150 are in close contact with each other without empty space by the elastic force of the spring fixing clips 170a and 170b.

In the above, preferred embodiments of the present invention have been described using specific terms, but such terms are only for clearly describing the present invention, and the embodiments and described terms of the present invention depart from the spirit and scope of the following claims. It is self-evident that various changes and changes can be made without being performed. Such modified embodiments should not be individually understood from the spirit and scope of the present invention, but should be said to fall within the scope of the claims of the present invention.

10, 110: lower heat sink 10a, 10b: through hole
20: lower thermal pad 30: M.2 SSD
33: M.2 slot insert 40: upper thermal pad
50, 150: upper heat sink 50a, 50b: screw fastening groove
110a, 110b: bent end 113a, 113b: concave
150a: close transmission unit 150b: connection unit
150c: air heat dissipation unit
153a, 153b: seating portion 170a, 170b: spring fixing clip
171: upper spring 173: lower spring
200a, 200b: insertion space part

Claims (2)

As an M.2 SDD heat dissipation mechanism that radiates heat generated from the M.2 SDD inserted and installed in the M.2 slot,
A lower heat sink having a rectangular parallelepiped shape in which left and right side surfaces and an upper surface are openly formed, and at least a portion of the front and rear upper portions has a bent end bent inwardly downwardly, the bent end portion forming a concave portion concave from the inside to the upper direction class,
An upper heat sink having a seating portion concave in a downward direction at a position in a vertical downward direction opposite to the concave portion on the upper surface, the upper heat sink including a close contact transmission portion placed in an upper region of the lower surface of the lower heat sink;
and a spring fixing club inserted between the recess and the seating part to apply elasticity in the vertical direction,
The M.2 SDD heat dissipation mechanism, characterized in that interposed between the lower heat sink and the upper heat sink.
According to claim 1,
a lower thermal pad laminated on the lower surface of the lower heat sink; and
- The M.2 SDD is stacked on the upper surface of the lower thermal pad -
Further comprising an upper thermal pad stacked on the M.2 SDD,
M.2 SDD heat dissipation mechanism, characterized in that the upper heat sink is laminated on the upper portion of the thermal pad.

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