KR20210001285A - Circuit board on which single magnet part is installed and method of installing single magnet using surface mount technology device - Google Patents

Abstract

A circuit board of the present invention includes a magnet as a separate component and can be used as one component of a magnet circuit or replace a separate instrument design by using the same as a separate component not a part of an assembly. In addition, the magnet can be used for an SMT process or the like using a shield or a bracket, and the magnet can be mounted through the SMT process to improve work efficiency and manufacturing costs.

Description

Circuit board including independent magnetic parts and magnet mounting method using SMT equipment {CIRCUIT BOARD ON WHICH SINGLE MAGNET PART IS INSTALLED AND METHOD OF INSTALLING SINGLE MAGNET USING SURFACE MOUNT TECHNOLOGY DEVICE}

The present invention relates to a circuit board and mounting technology including a single magnetic component, and more particularly, a circuit board using the magnet as a single component rather than a specific assembly, and a magnet using a surface mount technology (SMT) equipment. It relates to a mounting method for mounting on a substrate.

While all magnets used in tablets, mobile phones, and other accessories are applied in various ways in the field of product appliance design, they are not applied as independent parts in circuit fields such as printed circuit boards (PCBs).

Of course, BLDC motors, Hall sensor chips, or camera modules are mounted directly on the circuit board, and there are cases where magnets are included in these assembly parts, but these too cannot be regarded as single parts, and are mounted on the inner housing. There is little external influence and the mounting method is not difficult, so there is no need to pay special attention.

However, the fact that smart devices (mobile communication terminals) such as smartphones and tablet PCs that can be manufactured in various forms such as foldable or slide type are gradually becoming slim, and that a magnet is separately installed inside the housing saves space wasted space. It occurs, and the manufacturing process can also cause trouble in that the magnet must be attached to the inner wall of the housing.

Referring to Registration Patent No. 10-1794445 (registered on October 31, 2017), "a portable terminal in which a main body and a cover are coupled by a shielding magnetic module" is disclosed. In the terminal, a magnet is also mounted in the main body, and a shield member or yoke, that is, a shield, can be used to prevent the magnetic flux from shifting into the housing. However, in order for the magnet and the shield to be mounted inside the housing, a separate mechanism design must be followed, and other circuit configurations cannot be provided because the magnet is disposed at the corresponding position spatially.

The present invention provides a technique in which a magnet is applied to a circuit board as a single component and a mounting method thereof.

The present invention provides a circuit board structure and a mounting method thereof that can provide a basis on which various board structures, circuit effects, and circuit technologies can be developed by applying a magnet as a single component to a circuit.

The present invention provides a circuit board and a method of mounting the circuit board capable of solving internal configuration assembly without mechanism design by simply mounting the board without the existing magnet-related engineering design by mounting a magnet as a single component on the circuit board.

The present invention provides a method for mounting a circuit board capable of automating mounting of a magnet as a single component using surface mounting technology (SMT).

According to an exemplary embodiment of the present invention for achieving the objects of the present invention described above, the circuit board of the present embodiment includes a magnet as a single component, and is used as a single component rather than a part of an assembly, thereby making the circuit of the magnet It can be used as an element or can replace a separate instrument design. Using a shield or bracket, a magnet can be used for the SMT process, and the work efficiency and manufacturing cost can be improved by mounting the magnet through the SMT process.

Conventional magnets used in tablets, mobile phones, and other accessories are widely applied in the field of product appliance design, but in circuit fields such as PCBs and FPCBs, the relationship with other components is not clearly defined, so it is used as a single component on the circuit board. Did not apply.

However, mutual interference occurs at the installation position between the circuit board and the magnet inside the terminal, and the advantage of the circuit due to the magnet on the circuit board is found.The effect of the magnet due to the electromagnetic wave problem is minimized through effective blocking using a shield, etc. The possibility to do with is being discovered.

Accordingly, in the present invention, in a smart device such as a smart phone and a tablet PC that can be manufactured in various forms such as a foldable or slide method, the magnet is directly mounted on a circuit board as a single component, thereby realizing the manufacture of a smart device having a more diverse structure.

Additionally, a shield may be included to shield at least one surface of the magnet, and the magnet may be attached to the circuit board by using the shield.

The shield may include a seat portion protruding from a portion seated on the circuit board to the side, and may be fixed by manual soldering or a solder paste in an SMT process through the seat portion. In addition, in the case of a shield or magnet, the outer surface may be formed by nickel/chromium plating, and nickel/chromium plating may form a weak bonding force in soldering or soldering. Accordingly, in order to overcome this, partial plating using gold or silver, etc. may be formed on the seating portion, and soldering having a relatively strong bonding force may be formed using the partially plated region.

In addition to the shield, a bracket partially accommodating the magnet and spaced apart from the surface of the circuit board may be included. The bracket may use the same magnetic material as the shield, but may be formed using other metals or synthetic resins in some cases.

The bracket may be used not only to separate the magnet from the surface of the circuit board by a certain height, but also to adjust the mounting angle, posture, and arrangement of the magnet.

In some cases, the magnet may be partially seated on the circuit board. To this end, a shield partially accommodating the magnet may be included, and the magnet may be seated in a mounting hole formed on the circuit board by using the shield.

A cap for preventing thermal demagnetization may be added to the magnet. Because, in the case of some magnets, it is possible to experience a decrease in magnetism in the reflowing step of the SMT process, and at this time, it is possible to prevent the thermal demagnetization phenomenon by protecting the magnet using a relatively ferromagnetic cap. At this time, the cap for preventing thermal demagnetization may be formed using SPCC, or the like, and the cap may be formed through CNC, press, laser, wire processing, or the like. The cap of the ferromagnetic material may increase the magnetic permeance together with the shield by forming a magnetic field line closed circuit.

Of course, NdFeB magnets or SmCo magnets with good thermal properties and high coercivity from the beginning can be used, and a method of magnetizing non-magnetized products or products with loss of magnetic force can also be applied in the post-assembly process. In addition, the concept of mounting the magnet may include mounting the non-magnetized material, and forming a magnet by magnetizing the non-magnetized material after the mounting or before and after the reflowing step.

According to an exemplary embodiment of the present invention for achieving the objects of the present invention described above, a method of mounting at least one magnet on a circuit board as a single component includes the steps of providing a circuit board, corresponding to the position of the magnet. Thus, it may include applying a solder paste on the circuit board, mounting a magnet on the circuit board corresponding to the solder paste location, and a reflowing step of passing the circuit board on which the magnet is mounted through a reflow device. have.

In the step of mounting the magnet, the magnet is fixed to a shield that shields at least one side of the magnet, and the magnet can be mounted on the circuit board through the shield, and the shield is seated protruding from the part seated on the circuit board to the side. It is also possible to mount the magnet on the circuit board using a solder paste that includes a portion and is applied on the circuit board corresponding to the seating portion.

Partially plated with gold or silver, etc. on the seating portion, and the magnet can be mounted on the circuit board using the partially plated portion.

In the step of mounting the magnet, it is possible to provide a bracket that partially accommodates the magnet and is spaced a certain height from the surface of the circuit board, and it is also possible to mount the magnet on the circuit board through the bracket.

In addition, it is possible to mount the magnet on the circuit board by providing a shield partially accommodating the magnet, providing a mounting hole for mounting the shield on the circuit board, and mounting the shield in the mounting hole.

In the step of mounting the magnet, a mounting jig in which a magnetic element is disposed corresponding to each magnet is provided at the lower part of the circuit board, and the magnet can be temporarily fixed on the circuit board by using the attraction between the magnetic element and the magnet. . Here, the mounting jig may include a magnetic element for temporarily fixing the magnet on the circuit board, wherein the magnetic element may be a permanent magnet or an electromagnet.

If it is assumed that two or more magnets are arranged on a circuit board, the arrangement of the magnets may be shaken by the surrounding magnetic material, but the arrangement of the magnets may be shaken by mutual attraction or repulsive force between the magnets. However, if the magnetic element of the mounting jig can fix the magnet on the substrate with a relatively large magnetic force, the magnet can be stably fixed while going through the mounting fixing or reflowing process.

The mounting jig may be separated from the circuit board before the reflowing step or may be magnetically separated by weakening the binding force with the magnet. Of course, the mounting jig can maintain magnetic binding even within the reflowing equipment, and can maintain magnetic binding during separation or until the reflowing process is finished.

In the step of mounting the magnet, a film to which at least one magnet is attached may be provided and the film may be laminated on a circuit board. In the reflowing step, a reflowing process is performed while the film and the circuit board are attached to each other. After that, you can complete the soldering. And after the reflowing step, the film can be separated from the circuit board.

In particular, in the case of arranging a plurality of magnets, the magnets can be placed and fixed at once through a film, and the arrangement of the magnets can be stably maintained even in mounting or reflowing fixing. In addition, in the case of using a material in which the pressure-sensitive adhesive loses adhesion due to heat, it is possible to easily separate the film after the reflowing process or to automatically separate it.

An exposed hole for mounting other parts other than magnets can be formed on the film, and other parts can be mounted on the exposed circuit board through the exposed hole, and heat on the opposite side of the film in response to at least one of the magnets. It is also possible to form a demagnetization pattern.

According to the circuit board and mounting method of the present invention, the magnet is applied to the circuit board as a single component, thereby providing a basis for developing various board structures, circuit effects, and circuit technologies.

In addition, by mounting the magnet as a single component on the circuit board, it is possible to assemble the internal configuration without designing the mechanism by simply mounting the board without the existing magnet-related engineering design.

In addition, by using surface mount technology (SMT), magnet mounting as a single component can be automated, and automatic mounting can be enabled using a shield, and when nickel/chromium plating is used, gold or silver can be used. Through partial plating, the bonding force by soldering can be strengthened.

1 to 8 are views for explaining circuit boards including a single magnetic component according to various embodiments of the present invention, and FIG. 9 is a diagram illustrating a method of mounting a magnet on a circuit board using the SMT process of the present invention. to be.
10 is a diagram illustrating a circuit board in which a magnet is used as a single component according to another embodiment of the present invention.
11 and 12 are diagrams for explaining a circuit board in which a magnet is used as a single component and a magnet mounting method according to an embodiment of the present invention.
13 is a view for explaining a circuit board in which a magnet is used as a single component and a magnet mounting method according to an embodiment of the present invention.
14 is a view showing a film for explaining a magnet mounting method according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and contents described in other drawings under the above rules may be cited and described, and contents that are determined to be obvious to those skilled in the art or repeated may be omitted.

1 to 8 are views for explaining circuit boards including a single magnetic component according to various embodiments of the present invention, and FIG. 9 is a diagram illustrating a method of mounting a magnet on a circuit board using the SMT process of the present invention. to be.

Referring to Figure 1 (a), the circuit board 100 according to the present embodiment may include a magnet 120 and other circuit components (111 to 113), circuit components (111 to 113) The connecting wires may be formed on the surface or inside of the substrate 110 by printing or etching. The conductive wires may be designed to pass through the periphery of the magnet 120 or to pass through the lower portion of the magnet 120.

The magnet 120 is mounted on the substrate 110 as a single component, and may be fixed on the substrate 110 through manual soldering or an SMT process to be described later. The magnet 120 may be used as a single component that is not part of an assembly such as a hall sensor, a camera module, and a motor.

The magnet 120 on the substrate 110 may be a single-pole magnet or a multi-pole magnet, and may be fixed in various postures according to the arrangement of polarities.

Referring to Figure 2, in order to place the magnet 120 in a conventional tablet, mobile phone, and other accessories, etc., a seating seat 12 for the magnet 120 in the housing 10 is designed by a mechanism design, and these positions are It should be selected as a position that does not overlap with the substrate 110 (a).

However, as in this embodiment, in the case of directly mounting the magnet 120 on the substrate 110, it is possible to more closely contact the substrate 110 to the housing 10, and the seating position for the magnet is designed as a mechanism. There is no need to form. In fact, it can be seen that the distance (D) between the conventional substrate and the housing should be secured larger than the distance (d) between the substrate and the housing according to the present embodiment.

Referring to FIG. 1B, the magnet 120 may further include a seating portion 122 protruding laterally from a portion seated on the substrate 110. A large area in contact with a solder paste in a manual soldering process or an SMT process may be formed through the seating portion 122.

Referring to (c) of Figure 1, in the case of the magnet 120 on the market, the outer surface may be formed with nickel/chromium plating 126 to prevent corrosion, etc., but the nickel/chromium plating 126 is used in soldering or soldering. It can form a weak bond. Accordingly, in order to overcome this, a partial plating layer 126 using gold or silver, etc. is formed on the seating portion 122, and soldering having a relatively strong bonding force can be formed by using the partial plating layer 126.

For reference, in the present embodiment, the substrate 110 assumes a general PCB, but is not limited thereto, and may be applied to various substrates such as an FPCB or a sapphire substrate.

Referring to FIG. 3A, a shield 130 may be used to mount the magnet 120 on the substrate 110. The shield 130 may be formed of a magnetic material, and is provided adjacent to the magnet 120, so that electromagnetic wave shielding of the corresponding portion and formation of a strong magnetic field in the opposite direction can be expected.

In addition, compared to the magnet 120, it is relatively easy to select a material and easy to form, so that it can be used in the circuit board 100 for various purposes. In this embodiment, the upper surface of the magnet 120 is shown to be opened by the shield 130, but in other embodiments, the side may be opened, and the side angle to be opened may be variously selected from 360 degrees or less. It is also possible to be partially open.

Referring to (b) of FIG. 3, the shield 130' may include a seating portion 132 protruding laterally from a portion seated on the substrate 110, and the shield 130' and the magnet 120 It may be fixed by manual soldering or a solder paste in the SMT process through the silver seating part 132.

In addition, the shield 130" may also have an outer surface formed by nickel/chrome plating to prevent corrosion. As in (c), a partial plating layer 134 using gold or silver is formed on the seating portion 132 , By using the partial plating layer 134, soldering having a relatively strong bonding force may be formed.

Referring to FIG. 4, in addition to the shield, a bracket 135 may be included that partially accommodates the magnet 120 and is spaced apart from the surface of the substrate 110 by a predetermined height. The bracket 135 may use the same magnetic material as the shield, but may be formed using another metal or synthetic resin in some cases.

The bracket 135 may be used not only to separate the magnet from the surface of the substrate 110 by a certain height, but also to adjust the mounting angle, posture, and arrangement of the magnet.

Referring to FIG. 5A, the bracket 136 may be arranged to tilt the magnet 120 relative to the substrate 110 by a certain angle, and the tilt angle may be variously changed according to the intention of the designer.

In addition, as shown in (b) of FIG. 5, a plurality of magnets 120 may be vertically disposed on another bracket 138, and these magnets 120 may have various polarity arrangements. In the illustrated embodiment, the magnet 120 is arranged in a polarity that acts on a repulsive force, but may be arranged in an arrangement that otherwise acts on an attractive force or enhances magnetic flux.

The mounting portion 132 may be formed in the bracket as well, and the magnet 120 may be fixed by manual soldering or solder paste in the SMT process through the mounting portion 132 which is relatively stable and provides a wide contact surface. Further, although not shown, a partial plating layer using gold or silver may be formed on the seating portion 132.

Referring to FIG. 6, the shield 140 for fixing the magnet 120 to the substrate 110 may have a bottom surface open. In this case, as can be seen through the illustrated magnetic force line MF, magnetic flux toward the substrate 110, that is, in a downward direction, may be strengthened, and an electromagnetic wave or the like toward the upper portion of the substrate 110 may be shielded. As described above, the shield 140 may also include a seating portion 142, and the seating portion 140 may be partially protruded or formed around the shield 140 as if it were a flange. have. This can also be applied in other embodiments.

7 and 8, the magnet 120 and the shield 150 may be provided by being partially impregnated in the substrate 115. To this end, a mounting hole 117 may be formed in the substrate 115.

The seating portion 152 may protrude from the upper side of the shield 150, and the seating portion 152 may be seated on the solder paste 118, and may be fixed by soldering through a reflowing process described later. .

As shown in FIG. 8, when the magnet 120 is mounted or impregnated on the substrate 115, the overall thickness of the circuit board can be formed to be thin, and it is possible to further close the substrate 115 to the housing 10. As a result, this close contact may be applied to a structure that is magnetically coupled to a cover or the like outside the housing 10.

In general, according to the SMT process, the substrate is a printing process that automatically applies solder paste, a mounting process that automatically mounts chips or IC components on the PCB on which the solder paste has been applied, and ripples that solder while the PCB passes through the reflow equipment. It goes through an inspection process to inspect the soldering state using a rowing process, AOI (Automatic Optical Inspection), Visual Inspection, and X-ray.

9 may partially describe a mounting fixing and reflowing process among them, and through this, a method of mounting a magnet according to the SMT process may be described. For reference, although the process of mounting one magnet 120 is described in FIG. 9, it may be applied to the case of mounting two or more of the same type or different types of magnets.

Referring to FIG. 9, a substrate 110 may be provided for an SMT process. A solder paste 118 may be applied on the substrate 110 to correspond to the position of the magnet 120 to be mounted. The magnet 120 and the shield 130 may be provided on the mounting equipment, and may be mounted separately or together with other components. In this embodiment, the magnet 120 and the shield 130 are described as being mounted by a mounting device, but may be mounted on a separate release mount or a work table.

When the magnet 120 and the shield 130 are mounted on the substrate 110 in response to the position of the solder paste 118, the substrate 110 on which the magnet 120 is mounted passes through the reflowing equipment and a reflowing step Can go through.

In this embodiment, the magnet 120 and the shield 130 are mounted, but only the magnet can be mounted without a shield, and a separate seating part may be formed on the shield, and as described above, a shield mounted on a bracket or a substrate Can be used.

In the present embodiment, in the step of mounting the magnet 120, a mounting jig 170 in which magnetic elements 172 are disposed corresponding to each magnet may be provided under the substrate 110. The magnet 120 may be temporarily fixed on the substrate 110 by using the attractive force between the magnetic element 172 and the magnet 120, and the position and direction of the magnet 120 according to the arrangement of the magnetic element 172 This can be kept solid. The mounting jig 170 may move like the substrate 110 through a rail, a chain 162 of the transfer device 160, and the like, and the magnetic element 172 may be provided using a permanent magnet or an electromagnet.

If it is assumed that two or more magnets are arranged on a circuit board, the arrangement of the magnets may be shaken by the surrounding magnetic material, but the arrangement of the magnets may be shaken by mutual attraction or repulsive force between the magnets. However, if the magnetic element of the mounting jig can fix the magnet on the substrate with a relatively large magnetic force, the magnet can be stably fixed while going through the mounting fixing or reflowing process.

The mounting jig 170 may maintain a magnetically bound relationship with the substrate 110 until the reflowing step is completed, but may otherwise be physically or magnetically separated from the substrate 110 before that.

10 is a diagram illustrating a circuit board in which a magnet is used as a single component according to another embodiment of the present invention.

Referring to FIG. 10, a cap 126 for preventing thermal demagnetization may be added to the magnet 120. For some magnets, the magnetism may be reduced in the reflowing step of the SMT process. However, by protecting the magnet by using a cap 126, which is a ferromagnetic, it is possible to prevent a thermal magnetic phenomenon. At this time, the cap 126 for preventing thermal demagnetization may be formed using SPCC, or the like, and the cap may be formed through CNC, press, laser, wire processing, or the like. The cap 126 of the ferromagnetic material may increase the magnetic permeance together with the shield by forming a magnetic field line closed circuit.

As shown, the cap 126 may cover the magnet 120 (a), but may cover the magnet 120 together with the shield 130 ′ to form a magnetic field line closed circuit (b), and a bracket ( It may be provided to cover the upper portion of 135) (c).

Of course, NdFeB magnets or SmCo magnets with good thermal properties and high coercivity from the beginning can be used, and a method of magnetizing non-magnetized products or products with loss of magnetic force can also be applied in the post-assembly process.

For reference, in the embodiment described in the present specification, a case of mounting a magnetized magnet is described, but in the present invention, a magnetized material is mounted, and a magnet is formed by magnetizing an unmagnetized material after the mounting step or before and after the reflowing step. It can also include.

11 and 12 are diagrams for explaining a circuit board in which a magnet is used as a single component and a magnet mounting method according to an embodiment of the present invention.

11 and 12, a plurality of magnets 120-1 to 120-4 can be simply mounted using a film 190. In (a), a plurality of components 111 and a plurality of magnets 120-1 to 120-4 are mounted on one substrate 110, and the magnets 120-1 to 120-4 are adjacent to each other. By forming attractive force or repulsive force, there may be cases where the arrangement is disorganized or mutually attached before soldering during the mounting process.

Therefore, as shown in (b), by providing the magnets 120-1 to 120-4 in a state attached to the film 190 in advance, the arrangement of the magnets 120-1 to 120-4 is prevented from being disturbed after mounting. Can be prevented. In this case, the component 111 may be pre-mounted on the substrate 110.

Referring to FIG. 12, a film 190 to which magnets 120-1 to 120-4 are pre-attached may be provided on the substrate 110 on which the component 111 is mounted (a). Of course, this may be provided by providing a film to the roller and cutting it into necessary units, and a film may be provided for each magnet separately.

The film 190 to which the magnets 120-1 to 120-4 are adhered may be laminated to the substrate 110 so that the substrate 110 and the film 190 may be stacked up and down (b). In addition, the substrate 110 may be passed through the reflowing process while the film is attached.

After the reflowing process, the magnets 120-1 to 120-4 may be fixed to the substrate 110 by soldering, and the magnets 120-1 to 120-4 in the film 190 by peeling off the film 190 120-4) may be transferred to the substrate 110.

In the step of mounting a plurality of magnets 120-1 to 120-4, the film 190 to which the magnets 120-1 to 120-4 are attached is provided, and the film 190 is laminated on the substrate 110. Thus, it can be stably fixed at once. And, as described later, peeling of the film 190 can be facilitated by using an adhesive whose adhesive strength is reduced by heat.

In addition, it is possible to place and fix the magnets (120-1 to 120-4) at once through the film 190, and stably maintain the placement of the magnets (120-1 to 120-4) even in mounting or reflowing fixing. I can.

13 is a diagram for explaining a circuit board in which a magnet is used as a single component and a magnet mounting method according to an embodiment of the present invention, and FIG. 14 is a diagram for explaining a magnet mounting method according to an embodiment of the present invention It is a drawing showing a film.

Referring to FIG. 13, exposure holes 192 and 194 for mounting components other than magnets may be formed in the film 190, and on the substrate 110 exposed through the exposure holes 192 and 194, Other components 111 can be mounted.

To this end, a film 191 to which magnets 120-1 to 120-4 are adhered may be provided on the substrate 110, and exposure holes 192 and 194 may be formed in the film 191 (a ). In addition, the film 191 may be laminated on the substrate 110 to perform lamination (b). Here, a solder paste may be previously applied on the substrate 110.

In addition, other components 111 can be additionally mounted through the automatic mounting equipment, and the substrate 110 can be introduced into the reflowing equipment with the film 191 attached thereto.

After the reflowing process, the magnets 120-1 to 120-4 can be fixed to the substrate 110 by soldering, and the film 191 with the exposed holes 192 and 194 formed thereon is peeled off. The magnets 120-1 to 120-4 in) can be transferred to the substrate 110.

Referring to FIG. 14, a pressure-sensitive adhesive 198 is applied to the bottom surface of the film 190, and as described above, the pressure-sensitive adhesive 198 may have a property of reducing adhesive strength by heat. In addition, a thermal demagnetization prevention pattern 196 may be formed on the upper surface of the film 190 corresponding to the position of the magnet 120. The thermal demagnetization prevention pattern 196 may be formed using a ferromagnetic material, and it is possible to prevent the magnetic force of the magnet 120 from being lowered during reflowing fixing.

As described above, although it has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention described in the following claims. You will understand that you can do it.

100: circuit board 110: board
120: magnet 130, 140, 150: shield
132: seating part 135: bracket
170: mounting jig 190, 191: film

Claims (21)

In the circuit board,
A circuit board containing a magnet as a single component. The method of claim 1,
And a shield shielding at least one surface of the magnet, and wherein the magnet is attached to the circuit board using the shield. The method of claim 2,
The circuit board, wherein the shield includes a mounting portion protruding laterally from a portion mounted on the circuit board. The method of claim 3,
A circuit board, characterized in that the partial plating is formed on the mounting portion. The method of claim 1,
And a bracket partially accommodating the magnet and spaced apart from the surface of the circuit board by a predetermined height, and the magnet is attached to the circuit board by using the bracket. The method of claim 5,
The circuit board, characterized in that it is possible to adjust the mounting angle of the magnet by the bracket. The method of claim 1,
And a shield partially accommodating the magnet, wherein the magnet is seated in a mounting hole formed in the circuit board by using the shield. The method of claim 1,
A circuit board, characterized in that a cap for preventing thermal demagnetization is added to the magnet. In the method of mounting at least one magnet on a circuit board as a single component,
Providing a circuit board;
Applying a solder paste on the circuit board corresponding to the position of the magnet;
Mounting the magnet on the circuit board corresponding to the solder paste location; And
Magnet mounting method comprising a; reflowing step of passing the circuit board the magnet is mounted through a reflowing equipment. The method of claim 9,
In the step of mounting the magnet,
The magnet mounting method, comprising fixing the magnet to a shield shielding at least one surface of the magnet, and mounting the magnet on the circuit board via the shield. The method of claim 10,
The shield includes a seating portion protruding from a portion seated on the circuit board to a side, and mounting the magnet on the circuit board using the solder paste applied on the circuit board corresponding to the seating portion Magnet mounting method characterized by. The method of claim 11,
And forming a partial plating on the seating portion, and mounting the magnet on the circuit board using the partially plated portion. The method of claim 9,
In the step of mounting the magnet,
A magnet mounting method comprising: providing a bracket for partially accommodating the magnet and spaced apart from the surface of the circuit board by a predetermined height, and mounting the magnet on the circuit board via the bracket. The method of claim 9,
The magnet is mounted on the circuit board by providing a shield partially accommodating the magnet, providing a mounting hole for mounting the shield on the circuit board, and mounting the shield in the mounting hole Magnet mounting method. The method of claim 9,
In the step of mounting the magnet,
A mounting jig in which a magnetic force element is disposed corresponding to each of the magnets is provided under the circuit board, and the magnet is temporarily fixed on the circuit board by using an attractive force between the magnetic element and the magnet. Magnet mounting method. The method of claim 15,
The mounting jig is magnetically separated from the circuit board before and after turning during the reflowing step. The method of claim 9,
In the step of mounting the magnet, providing a film to which the at least one magnet is attached, and laminating the film on the circuit board,
In the reflowing step, passing the film and the circuit board together through the reflowing equipment,
The magnet mounting method, characterized in that separating the film from the circuit board after the reflowing step. The method of claim 17,
A magnet mounting method, characterized in that an exposed hole for mounting other components other than the magnet is formed in the film, and the other component is mounted on the circuit board exposed through the exposure hole. The method of claim 17,
Magnet mounting method, characterized in that forming a thermal demagnetization prevention pattern on the opposite surface of the film corresponding to at least one of the magnets. The method of claim 9,
Magnet mounting method, characterized in that adding a cap for preventing thermal demagnetization to the magnet. The method of claim 9,
The magnet mounting method, characterized in that in the step of mounting the magnet, a magnetless material is mounted, and the magnetless material is magnetized after the mounting to form the magnet.

Images