KR20200140295A - Curable resin composition - Google Patents
Curable resin composition Download PDFInfo
- Publication number
- KR20200140295A KR20200140295A KR1020207030730A KR20207030730A KR20200140295A KR 20200140295 A KR20200140295 A KR 20200140295A KR 1020207030730 A KR1020207030730 A KR 1020207030730A KR 20207030730 A KR20207030730 A KR 20207030730A KR 20200140295 A KR20200140295 A KR 20200140295A
- Authority
- KR
- South Korea
- Prior art keywords
- meth
- acrylate
- resin composition
- curable resin
- weight
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 83
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 66
- 229920005989 resin Polymers 0.000 claims abstract description 61
- 239000011347 resin Substances 0.000 claims abstract description 61
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 45
- 239000011248 coating agent Substances 0.000 claims abstract description 39
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 146
- -1 acrylate ester Chemical class 0.000 claims description 46
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 28
- 229920000178 Acrylic resin Polymers 0.000 claims description 21
- 239000004925 Acrylic resin Substances 0.000 claims description 21
- 239000000178 monomer Substances 0.000 claims description 21
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 230000009477 glass transition Effects 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 239000004645 polyester resin Substances 0.000 claims description 5
- 229920001225 polyester resin Polymers 0.000 claims description 5
- 239000011247 coating layer Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 abstract description 32
- 238000001035 drying Methods 0.000 abstract description 21
- 238000005299 abrasion Methods 0.000 abstract description 18
- 239000000203 mixture Substances 0.000 description 26
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 19
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 19
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 16
- 229920005862 polyol Polymers 0.000 description 16
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 15
- 229920001296 polysiloxane Polymers 0.000 description 15
- 150000003077 polyols Chemical class 0.000 description 14
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 13
- 125000000524 functional group Chemical group 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 10
- 239000012948 isocyanate Substances 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 239000005056 polyisocyanate Substances 0.000 description 6
- 229920001228 polyisocyanate Polymers 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 150000002009 diols Chemical class 0.000 description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 3
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 3
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 125000005396 acrylic acid ester group Chemical group 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000005907 alkyl ester group Chemical group 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- BYPFICORERPGJY-UHFFFAOYSA-N 3,4-diisocyanatobicyclo[2.2.1]hept-2-ene Chemical compound C1CC2(N=C=O)C(N=C=O)=CC1C2 BYPFICORERPGJY-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 2
- 239000004386 Erythritol Substances 0.000 description 2
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- KLDXJTOLSGUMSJ-JGWLITMVSA-N Isosorbide Chemical compound O[C@@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 KLDXJTOLSGUMSJ-JGWLITMVSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 235000019437 butane-1,3-diol Nutrition 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 2
- 235000019414 erythritol Nutrition 0.000 description 2
- 229940009714 erythritol Drugs 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 229960002479 isosorbide Drugs 0.000 description 2
- 150000002596 lactones Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical class O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- 125000004191 (C1-C6) alkoxy group Chemical group 0.000 description 1
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- MLKIVXXYTZKNMI-UHFFFAOYSA-N 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one Chemical compound CCCCCCCCCCCCC1=CC=C(C(=O)C(C)(C)O)C=C1 MLKIVXXYTZKNMI-UHFFFAOYSA-N 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- NKYRAXWYDRHWOG-UHFFFAOYSA-N 12-hydroxydodecyl prop-2-enoate Chemical compound OCCCCCCCCCCCCOC(=O)C=C NKYRAXWYDRHWOG-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- UXCIJKOCUAQMKD-UHFFFAOYSA-N 2,4-dichlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC(Cl)=C3SC2=C1 UXCIJKOCUAQMKD-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LZHUBCULTHIFNO-UHFFFAOYSA-N 2,4-dihydroxy-1,5-bis[4-(2-hydroxyethoxy)phenyl]-2,4-dimethylpentan-3-one Chemical compound C=1C=C(OCCO)C=CC=1CC(C)(O)C(=O)C(O)(C)CC1=CC=C(OCCO)C=C1 LZHUBCULTHIFNO-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
- C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
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Abstract
얻어지는 경화물이, 양호한 내마모성 및 내찰상성, 그리고 높은 표면 경도를 가질뿐만 아니라, 도막 건조 후의 점착성이 낮은(무점착성이 우수한) 경화성 수지 조성물을 제공한다. 또한, 상기 경화성 수지 조성물로부터 얻어지는, 양호한 내마모성 및 내찰상성, 그리고 높은 표면 경도를 갖는 경화물을 제공한다. 본 발명의 경화성 수지 조성물은, 열가소성 수지 (A) 및 (메트)아크릴로일기를 5 이상 갖는 수지 (B)를 포함하는 경화성 수지 조성물이며, 열가소성 수지 (A)의 함유량이, 경화성 수지 조성물의 수지분 전량에 대하여, 42중량% 이상인 것을 특징으로 한다.The resulting cured product not only has good abrasion resistance and scratch resistance, and high surface hardness, but also provides a curable resin composition having low tackiness after drying of the coating film (excellent in tack-free property). Further, a cured product having good abrasion resistance and scratch resistance, and high surface hardness obtained from the curable resin composition is provided. The curable resin composition of the present invention is a curable resin composition comprising a thermoplastic resin (A) and a resin (B) having 5 or more (meth)acryloyl groups, and the content of the thermoplastic resin (A) is the number of the curable resin composition. It is characterized in that it is 42% by weight or more with respect to the total amount of the stake.
Description
본 발명은 경화성 수지 조성물 및 그의 경화물에 관한 것이다. 본원은, 2018년 3월 30일에 일본에 출원한 일본 특허 출원 제2018-066687호의 우선권을 주장하며, 그 내용을 여기에 원용한다.The present invention relates to a curable resin composition and a cured product thereof. This application claims the priority of Japanese Patent Application No. 2018-066687 for which it applied to Japan on March 30, 2018, and uses the content here.
아크릴계 수지, 폴리카르보네이트 수지, ABS 수지, 우레탄 수지, 폴리에틸렌 등의 열가소성 수지는, 경량으로 내충격성, 투명성이 우수해 성형이 용이하다는 관점에서 코트제로서 널리 사용되고 있다. 그러나, 이들 열가소성 수지의 성형품은, 마찰 등에 의해 용이하게 흠집 발생, 그 투명도가 저하되거나, 외관이 손상되거나 하는 등의 문제가 있었다. 그 때문에, 그 성형품에 대하여 표면 코팅을 실시하고, 내마모성이나 내찰상성, 표면 경도 등을 향상시키는 시도가 이루어져 왔다. 예를 들어, 특허문헌 1에는, 열가소성 수지에 특정의 (메트)아크릴로일기를 갖는 화합물을 배합함으로써, 그의 경화물에 내마모성이나 내찰상성을 부여하는 기술이 기재되어 있다.Thermoplastic resins, such as acrylic resins, polycarbonate resins, ABS resins, urethane resins, and polyethylene, are widely used as coating agents from the viewpoint of easy molding due to their light weight and excellent impact resistance and transparency. However, the molded articles of these thermoplastic resins have problems such as easily scratching due to friction or the like, their transparency is lowered, or their appearance is damaged. Therefore, attempts have been made to apply a surface coating to the molded article to improve abrasion resistance, scratch resistance, and surface hardness. For example, Patent Document 1 describes a technique for imparting abrasion resistance and scratch resistance to a cured product thereof by blending a thermoplastic resin with a compound having a specific (meth)acryloyl group.
그러나, 특허문헌 1에 기재되는 조성물을 기재에 도포ㆍ건조하여 얻어지는 도막(미경화물)은 그의 표면에 끈적거리고, 즉 점착성이 생긴다고 하는 문제가 있었다.However, a coating film (uncured product) obtained by applying and drying the composition described in Patent Literature 1 to a substrate has a problem that the surface thereof is sticky, that is, adhesiveness occurs.
점착성이 낮은 조성물은, 예를 들어 도막의 건조 후에 손이나 물(物)이 접촉해도 도막의 파괴가 일어나기 어려운 것, 도막끼리를 겹친 경우에도 이들이 첩부되지 않는 것, 일정 시간 경과 후에 경화되는 경우에도 표면에 먼지가 붙지 않는다는 점에서, 합지가 불필요한 등의 이점이 있고, 작업성이 우수하다고 한 이점이 있다. 또한, 예를 들어 상기 조성물을 인쇄층으로서 사용하는 경우에도, 도막을 겹쳐서 형성할 수 있고, 마지막으로 활성 에너지선의 조사나 가열에 의해 일괄하여 경화하는 것이 가능하다고 한 이점이 있다. 이 때문에, 도막 건조 후의 점착성이 낮다는(무점착성이 우수하다는) 것은 중요한 특성이라고 할 수 있다.Compositions with low adhesiveness are, for example, that the coating film is difficult to be destroyed even when hands or objects come into contact with the coating film after drying, even when the coating films are overlapped, they are not adhered, and cured after a certain period of time. There is an advantage in that no dust adheres to the surface, such as unnecessary lamination, and an advantage of excellent workability. Further, for example, even when the composition is used as a printing layer, there is an advantage in that it is possible to form a coating film overlaid, and finally, it is possible to collectively cure by irradiation or heating of an active energy ray. For this reason, it can be said that it is an important characteristic that the adhesiveness after drying of a coating film is low (excellent adhesiveness-free property).
따라서, 본 발명의 목적은, 얻어지는 경화물이, 양호한 내마모성 및 내찰상성, 그리고 높은 표면 경도를 가질 뿐만 아니라, 도막 건조 후의 점착성이 낮은(무점착성이 우수한) 경화성 수지 조성물을 제공하는 데 있다. 또한, 상기 경화성 수지 조성물로부터 얻어지는, 양호한 내마모성 및 내찰상성, 그리고 높은 표면 경도를 갖는 경화물을 제공하는 데 있다.Accordingly, an object of the present invention is to provide a curable resin composition in which the obtained cured product not only has good abrasion resistance and scratch resistance, and high surface hardness, but also has low tackiness after drying of the coating film (excellent in tack-free property). Further, it is to provide a cured product having good abrasion resistance and abrasion resistance, and high surface hardness obtained from the curable resin composition.
본 발명자는, 상기 목적을 달성하기 위해 예의 검토한 결과, 특정량의 열가소성 수지와, (메트)아크릴로일기를 5 이상 갖는 수지를 적어도 포함하는 경화성 수지 조성물이, 도막 건조 후의 점착성이 낮고, 경화하였을 때 유용한 경화물을 부여하는 것을 알아내어 본 발명을 완성시켰다.The inventors of the present invention, as a result of careful examination in order to achieve the above object, showed that a curable resin composition containing at least a specific amount of a thermoplastic resin and a resin having 5 or more (meth)acryloyl groups has low adhesiveness after drying of the coating film, and curing The present invention was completed by finding out that it gives a useful cured product.
즉, 본 발명은 열가소성 수지 (A) 및 (메트)아크릴로일기를 5 이상 갖는 수지 (B)를 포함하는 경화성 수지 조성물이며,That is, the present invention is a curable resin composition comprising a thermoplastic resin (A) and a resin (B) having 5 or more (meth)acryloyl groups,
열가소성 수지 (A)의 함유량이, 경화성 수지 조성물의 수지분 전량에 대하여, 42중량% 이상인 것을 특징으로 하는 경화성 수지 조성물을 제공한다.There is provided a curable resin composition wherein the content of the thermoplastic resin (A) is 42% by weight or more with respect to the total amount of the resin content of the curable resin composition.
또한, 상기 열가소성 수지 (A)의 유리 전이 온도는 60 내지 140℃인 것이 바람직하다.Further, it is preferable that the glass transition temperature of the thermoplastic resin (A) is 60 to 140°C.
또한, 상기 열가소성 수지 (A)는, 아크릴계 수지 및/또는 폴리에스테르 수지인 것이 바람직하다.Further, it is preferable that the thermoplastic resin (A) is an acrylic resin and/or a polyester resin.
또한, 상기 아크릴계 수지는, 모노머 단위로서 (메트)아크릴산알킬에스테르를 적어도 포함하는 것이 바람직하다.Further, the acrylic resin preferably contains at least an alkyl (meth)acrylate as a monomer unit.
또한, 상기 (메트)아크릴산알킬에스테르는, (메트)아크릴산메틸인 것이 바람직하다.Moreover, it is preferable that the said alkyl (meth)acrylate is methyl (meth)acrylate.
또한, 상기 (메트)아크릴로일기를 5 이상 갖는 수지 (B)는, 디펜타에리트리톨펜타(메트)아크릴레이트와, 디펜타에리트리톨헥사(메트)아크릴레이트를 포함하는 것이 바람직하다.Moreover, it is preferable that the said resin (B) which has 5 or more (meth)acryloyl groups contains dipentaerythritol penta(meth)acrylate and dipentaerythritol hexa(meth)acrylate.
또한, 본 발명의 경화성 수지 조성물은, 코트제로서 사용되는 것이 바람직하다.Moreover, it is preferable that the curable resin composition of this invention is used as a coating agent.
또한, 본 발명에서는, 상기 경화성 수지 조성물의 경화물에 대해서도 제공한다.In addition, in the present invention, a cured product of the curable resin composition is also provided.
또한, 본 발명에서는 상기 경화물인 코트층에 대해서도 제공한다.Further, in the present invention, a coating layer which is the cured product is also provided.
본 발명의 경화성 수지 조성물은, 얻어지는 경화물이, 양호한 내마모성 및 내찰상성, 그리고 높은 표면 경도를 가질뿐만 아니라, 도막 건조 후의 점착성이 낮다. 또한, 상기 경화성 수지 조성물의 경화물은 양호한 내마모성 및 내찰상성, 그리고 높은 표면 경도를 갖는다.In the curable resin composition of the present invention, the obtained cured product not only has good abrasion resistance and scratch resistance, and high surface hardness, but also has low adhesiveness after drying the coating film. Further, the cured product of the curable resin composition has good wear resistance and scratch resistance, and high surface hardness.
본 발명의 경화성 수지 조성물은, 열가소성 수지 (A) 및 (메트)아크릴로일기를 5 이상 갖는 수지 (B)를 포함하고, 열가소성 수지 (A)의 함유량이, 경화성 수지 조성물의 수지분 전량에 대하여, 42중량% 이상인 것을 특징으로 한다. 또한, 본 발명의 경화성 수지 조성물은, 상기 수지 이외에도, 광중합 개시제(C)나 휘발성 용매 (D)를 포함하고 있어도 된다. 또한, 수지분으로서는, 예를 들어 열가소성 수지 (A), (메트)아크릴로일기를 5 이상 갖는 수지 (B), 후술하는 그 밖의 수지를 들 수 있지만, 이들에 한정되지 않는다.The curable resin composition of the present invention contains a thermoplastic resin (A) and a resin (B) having 5 or more (meth)acryloyl groups, and the content of the thermoplastic resin (A) is based on the total amount of the resin content of the curable resin composition. , It is characterized in that 42% by weight or more. Moreover, the curable resin composition of this invention may contain a photoinitiator (C) and a volatile solvent (D) other than the said resin. In addition, examples of the resin powder include thermoplastic resin (A), resin (B) having 5 or more (meth)acryloyl groups, and other resins described later, but are not limited thereto.
[열가소성 수지 (A)][Thermoplastic resin (A)]
열가소성 수지 (A)로서는 가열에 의해 연화되는 수지 고분자라면 특별히 한정되지 않는다. 열가소성 수지 (A)의 유리 전이 온도는 특별히 한정되지 않지만, 그의 하한값은, 예를 들어 -120℃가 바람직하고, 보다 바람직하게는 60℃, 더 바람직하게는 100℃이고, 상한값은, 예를 들어 200℃가 바람직하고, 보다 바람직하게는 140℃, 더 바람직하게는 110℃이다. 하한값이 상기 범위인 것에 의해 도막 건조 후의 무점착성이 우수한 경향이 있다. 또한, 상한값이 상기 범위인 것에 의해 경화성 수지 조성물의 취급이 우수한 경향이 있다. 또한, 유리 전이 온도는 시차 주사 열량계(DSC)법에 의해 측정한 것이다.The thermoplastic resin (A) is not particularly limited as long as it is a resin polymer softened by heating. The glass transition temperature of the thermoplastic resin (A) is not particularly limited, but the lower limit thereof is preferably -120°C, more preferably 60°C, more preferably 100°C, and the upper limit is, for example It is preferably 200°C, more preferably 140°C, and still more preferably 110°C. When the lower limit is in the above range, there is a tendency for excellent adhesion-free properties after drying the coating film. Moreover, when the upper limit is in the above range, there is a tendency for excellent handling of the curable resin composition. In addition, the glass transition temperature was measured by a differential scanning calorimeter (DSC) method.
열가소성 수지 (A)의 중량 평균 분자량은 특별히 한정되지 않지만, 그의 하한값은, 예를 들어 1000이 바람직하고, 보다 바람직하게는 5000, 더욱 바람직하게는 10000이다. 또한, 상한값은, 예를 들어 250000이 바람직하고, 보다 바람직하게는 140000, 더욱 바람직하게는 130000이다. 하한값이 상기 범위인 것에 의해, 기재와의 밀착성이 우수한 경향이 있다. 상한값이 상기 범위인 것에 의해 경화물의 표면 경도가 우수한 경향이 있다. 또한, 중량 평균 분자량은 표준 물질을 폴리스티렌으로서 겔 투과 크로마토그래프(GPC)법으로 측정한 것이다.The weight average molecular weight of the thermoplastic resin (A) is not particularly limited, but the lower limit thereof is, for example, preferably 1000, more preferably 5000, still more preferably 10000. In addition, the upper limit is preferably 250000, more preferably 140000, and still more preferably 130000, for example. When the lower limit is in the above range, there is a tendency for excellent adhesion to the substrate. When the upper limit is in the above range, the surface hardness of the cured product tends to be excellent. In addition, the weight average molecular weight is a standard substance measured as polystyrene by a gel permeation chromatography (GPC) method.
열가소성 수지 (A)로서는 특별히 한정되지 않지만, 예를 들어 폴리에틸렌, 폴리프로필렌, 폴리염화비닐, 폴리스티렌, AS 수지, ABS 수지, 폴리에틸렌테레프탈레이트, 아크릴계 수지, 폴리비닐알코올, 폴리염화비닐리덴, 폴리카르보네이트 수지, 우레탄 수지, 폴리에스테르 수지를 들 수 있으며, 그 중에서 아크릴계 수지, 폴리에스테르 수지가, 무점착성의 관점에서 바람직하다. 단, 열가소성 수지 (A)에는, 후술하는 (메트)아크릴로일기를 5 이상 갖는 수지 (B)에 해당하는 것은 포함되지 않는다. 열가소성 수지 (A)는, 광 또는 열경화성 기(예를 들어, (메트)아크릴로일기, 비닐기, 에폭시기, 글리시딜기, 옥세타닐기)를 갖고 있어도 되지만, 갖지 않는 것이 바람직하다. 본 발명의 경화성 수지 조성물을 코트제로서 사용하는 경우, 열가소성 수지 (A)는, 기재와의 밀착성에 따라, 적절하게 선택하여 사용하는 것이 가능하다. 또한, 이들은, 1종을 단독으로 사용할 수도 있고, 2종 이상을 조합하여 사용할 수도 있다.Although it does not specifically limit as a thermoplastic resin (A), For example, polyethylene, polypropylene, polyvinyl chloride, polystyrene, AS resin, ABS resin, polyethylene terephthalate, acrylic resin, polyvinyl alcohol, polyvinylidene chloride, polycarbo Nate resin, urethane resin, and polyester resin are mentioned, Among them, acrylic resin and polyester resin are preferable from the viewpoint of non-adhesiveness. However, the thermoplastic resin (A) does not include those corresponding to the resin (B) having 5 or more (meth)acryloyl groups described later. Although the thermoplastic resin (A) may have a photo or thermosetting group (for example, a (meth)acryloyl group, a vinyl group, an epoxy group, a glycidyl group, or an oxetanyl group), it is preferable not to have it. When using the curable resin composition of the present invention as a coating agent, the thermoplastic resin (A) can be appropriately selected and used depending on the adhesion to the substrate. Moreover, these may be used individually by 1 type, and may be used in combination of 2 or more types.
아크릴계 수지란, 모노머 단위로서 (메트)아크릴산에스테르를 주로 포함하는 수지를 의미한다. 아크릴계 수지로서는, 예를 들어 [1] 모노머 단위로서 1종의 (메트)아크릴산에스테르만을 포함하는 수지(즉, (메트)아크릴산에스테르의 단독 중합체), [2] 모노머 단위로서 2종 이상의 (메트)아크릴산에스테르를 포함하는 수지(즉, 2종 이상의 (메트)아크릴산에스테르의 공중합체), [3] 모노머 단위로서, (메트)아크릴산에스테르와, (메트)아크릴산에스테르 이외의 모노머를 포함하는 수지((메트)아크릴산에스테르와, (메트)아크릴산에스테르 이외의 모노머의 공중합체)를 들 수 있다. 또한, (메트)아크릴산에스테르라 함은 아크릴산에스테르 및/또는 메타크릴산에스테르를 의미한다.The acrylic resin means a resin mainly containing a (meth)acrylic acid ester as a monomer unit. As an acrylic resin, for example, [1] a resin containing only one type of (meth)acrylic acid ester as a monomer unit (ie, a homopolymer of (meth)acrylic acid ester), and [2] two or more types of (meth) as monomer units A resin containing an acrylic acid ester (ie, a copolymer of two or more (meth)acrylic acid esters), [3] As a monomer unit, a resin containing a (meth)acrylic acid ester and a monomer other than (meth)acrylic acid ester (( Copolymers of monomers other than meth)acrylic acid ester and (meth)acrylic acid ester) are mentioned. In addition, (meth)acrylic acid ester means acrylic acid ester and/or methacrylic acid ester.
본 발명에 있어서, 열가소성 수지 (A)는, 기재와의 밀착성 향상의 관점에서 아크릴계 수지를 포함하는 것이 바람직하고, 모노머 단위로서 (메트)아크릴산알킬에스테르를 포함하는 아크릴계 수지가 보다 바람직하다. 아크릴계 수지에 있어서의 (메트)아크릴산알킬에스테르의 비율은, 아크릴계 수지의 모노머 단위 전량에 대하여 30중량% 이상(예를 들어, 30 내지 99.9중량%)이 바람직하고, 보다 바람직하게는 60중량% 이상, 더욱 바람직하게는 80중량% 이상, 가장 바람직하게는 95중량% 이상이다.In the present invention, the thermoplastic resin (A) preferably contains an acrylic resin from the viewpoint of improving the adhesion to the substrate, and more preferably an acrylic resin containing an alkyl (meth)acrylate as a monomer unit. The ratio of the alkyl (meth)acrylate in the acrylic resin is preferably 30% by weight or more (for example, 30 to 99.9% by weight), more preferably 60% by weight or more with respect to the total amount of the monomer units of the acrylic resin. , More preferably 80% by weight or more, and most preferably 95% by weight or more.
(메트)아크릴산알킬에스테르로서는 특별히 한정되지 않지만, 예를 들어 탄소수 1 내지 20의 직쇄 또는 분지쇄상의 알킬기를 갖는 (메트)아크릴산알킬에스테르를 들 수 있다. 탄소수 1 내지 20의 알킬기를 갖는 (메트)아크릴산알킬에스테르로서는, 예를 들어 (메트)아크릴산메틸, (메트)아크릴산에틸, (메트)아크릴산프로필, (메트)아크릴산이소프로필, (메트)아크릴산부틸, (메트)아크릴산이소부틸, (메트)아크릴산s-부틸, (메트)아크릴산t-부틸, (메트)아크릴산펜틸, (메트)아크릴산이소펜틸, (메트)아크릴산헥실, (메트)아크릴산헵틸, (메트)아크릴산옥틸, (메트)아크릴산2-에틸헥실(2-에틸헥실(메트)아크릴레이트), (메트)아크릴산이소옥틸, (메트)아크릴산노닐, (메트)아크릴산이소노닐, (메트)아크릴산데실, (메트)아크릴산이소데실, (메트)아크릴산운데실, (메트)아크릴산도데실, (메트)아크릴산트리데실, (메트)아크릴산테트라데실, (메트)아크릴산펜타데실, (메트)아크릴산헥사데실, (메트)아크릴산헵타데실, (메트)아크릴산옥타데실, (메트)아크릴산노나데실, (메트)아크릴산에이코실 등의 (메트)아크릴산C1-20알킬에스테르[바람직하게는 (메트)아크릴산C1-14알킬에스테르, 더욱 바람직하게는 (메트)아크릴산C1-10알킬에스테르]를 들 수 있다. 이 중에서도 (메트)아크릴산메틸이 가장 바람직하다. 이들은, 1종을 단독으로 사용할 수도 있고, 2종 이상을 조합하여 사용할 수도 있다.Although it does not specifically limit as (meth)acrylate alkyl ester, For example, (meth)acrylate alkyl ester which has a C1-C20 linear or branched alkyl group is mentioned. As an alkyl (meth)acrylate having an alkyl group having 1 to 20 carbon atoms, for example, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, Isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, isopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, (meth) ) Octyl acrylate, (meth) acrylate 2-ethylhexyl (2-ethylhexyl (meth) acrylate), (meth) acrylate isooctyl, (meth) acrylate, isononyl (meth) acrylate, (meth) acrylate , Isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, (Meth)acrylic acid C 1-20 alkyl esters such as heptadecyl (meth)acrylate, octadecyl (meth)acrylate, nonadecyl (meth)acrylate, and eicosyl (meth)acrylate [preferably (meth)acrylic acid C 1- 14 alkyl ester, more preferably (meth)acrylic acid C 1-10 alkyl ester] is mentioned. Among these, methyl (meth)acrylate is most preferred. These may be used alone or in combination of two or more.
(메트)아크릴산알킬에스테르 이외의 (메트)아크릴산에스테르로서는, 예를 들어 시클로펜틸(메트)아크릴레이트, 시클로헥실(메트)아크릴레이트, 이소보르닐(메트)아크릴레이트 등의 지환식 탄화수소기를 갖는 (메트)아크릴산에스테르; 페닐(메트)아크릴레이트 등의 방향족 탄화수소기를 갖는 (메트)아크릴산에스테르; 테르펜 화합물 유도체 알코올로부터 얻어지는 (메트)아크릴산에스테르를 들 수 있다. 이들은, 1종을 단독으로 사용할 수도 있고, 2종 이상을 조합하여 사용할 수도 있다.Examples of (meth)acrylic acid esters other than the (meth)acrylate alkyl esters include cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate having alicyclic hydrocarbon groups ( Meth)acrylic acid ester; (Meth)acrylic acid ester having an aromatic hydrocarbon group such as phenyl (meth)acrylate; The (meth)acrylic acid ester obtained from the terpene compound derivative alcohol is mentioned. These may be used singly or in combination of two or more.
상술한 바와 같이, 아크릴계 수지는, 표면 경도 등의 개질을 목적으로 하여, 필요에 따라, 상기 (메트)아크릴산에스테르 이외의 모노머(이하, 간단히 「다른 모노머 성분」이라고 칭함)를 포함하고 있어도 된다.As described above, the acrylic resin may contain a monomer other than the (meth)acrylic acid ester (hereinafter, simply referred to as “another monomer component”) as needed for the purpose of modification such as surface hardness.
다른 모노머 성분으로서는, 예를 들어 (메트)아크릴산, 카르복시에틸(메트)아크릴레이트, 카르복시펜틸(메트)아크릴레이트, 이타콘산, 말레산, 푸마르산, 크로톤산, 이소크로톤산 등의 카르복실기 함유 모노머; (메트)아크릴산히드록시에틸, (메트)아크릴산히드록시프로필, (메트)아크릴산히드록시부틸, (메트)아크릴산히드록시헥실, (메트)아크릴산히드록시옥틸, (메트)아크릴산히드록시데실, (메트)아크릴산히드록시라우릴, (4-히드록시메틸시클로헥실)메틸메타크릴레이트 등의 (메트)아크릴산히드록시알킬 등의 수산기 함유 모노머; 무수 말레산, 무수 이타콘산 등의 산 무수물기 함유 모노머; 에틸렌, 부타디엔, 이소프렌, 이소부틸렌 등의 올레핀계 모노머; 메틸비닐에테르, 에틸비닐에테르 등의 비닐에테르계 모노머; 비닐톨루엔, 스티렌 등의 방향족 비닐 모노머를 들 수 있다. 이들은, 1종을 단독으로 사용할 수도 있고, 2종 이상을 조합하여 사용할 수도 있다.Examples of the other monomer components include carboxyl group-containing monomers such as (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isocrotonic acid; Hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxyhexyl (meth)acrylate, hydroxyoctyl (meth)acrylate, hydroxydecyl (meth)acrylate, (meth)acrylate ) Hydroxyl group-containing monomers such as hydroxyalkyl (meth)acrylates such as hydroxylauryl acrylate and (4-hydroxymethylcyclohexyl)methylmethacrylate; Acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride; Olefinic monomers such as ethylene, butadiene, isoprene, and isobutylene; Vinyl ether-based monomers such as methyl vinyl ether and ethyl vinyl ether; And aromatic vinyl monomers such as vinyl toluene and styrene. These may be used singly or in combination of two or more.
열가소성 수지 (A)로서는 시판품을 사용할 수 있고, 예를 들어 제품명 「파랄로이드 A-21」(아크릴계 수지(메타크릴산메틸의 단독 중합체), 다우 케미컬사제)을 들 수 있다.As the thermoplastic resin (A), a commercial item can be used, and for example, a product name "Paraloid A-21" (acrylic resin (a homopolymer of methyl methacrylate), manufactured by Dow Chemical) can be mentioned.
경화성 수지 조성물의 수지분 전량에 대한 열가소성 수지 (A)의 함유량은, 42중량% 이상이면 특별히 한정되지 않지만, 44 내지 95중량%가 보다 바람직하고, 특히 바람직하게는 47 내지 90중량%, 가장 바람직하게는 48 내지 80중량%이다. 열가소성 수지 (A)가 상기 범위에 있음으로써, 기재와의 밀착성이 향상되고, 도막 건조 후의 점착성이 개선되는 경향이 있다.The content of the thermoplastic resin (A) relative to the total amount of the resin content of the curable resin composition is not particularly limited as long as it is 42% by weight or more, but is more preferably 44 to 95% by weight, particularly preferably 47 to 90% by weight, most preferably It is preferably 48 to 80% by weight. When the thermoplastic resin (A) is in the above range, the adhesion to the substrate is improved, and the adhesion after drying the coating film tends to be improved.
경화성 수지 조성물의 불휘발분 전량에 대한 열가소성 수지 (A)의 함유량은 특별히 한정되지 않지만, 예를 들어 42중량% 이상이 바람직하고, 보다 바람직하게는 44 내지 95중량%, 특히 바람직하게는 47 내지 90중량%, 가장 바람직하게는 48 내지 80중량%이다. 열가소성 수지 (A)가 상기 범위에 있음으로써, 기재와의 밀착성이 향상되고, 도막 건조 후의 점착성이 개선되는 경향이 있다.The content of the thermoplastic resin (A) relative to the total amount of the nonvolatile matter in the curable resin composition is not particularly limited, but, for example, 42% by weight or more is preferable, more preferably 44 to 95% by weight, particularly preferably 47 to 90 % By weight, most preferably 48 to 80% by weight. When the thermoplastic resin (A) is in the above range, the adhesion to the substrate is improved, and the adhesion after drying the coating film tends to be improved.
[(메트)아크릴로일기를 5 이상 갖는 수지 (B)][Resin (B) having 5 or more (meth)acryloyl groups]
(메트)아크릴로일기를 5 이상 갖는 수지 (B)로서는 특별히 한정되지 않지만, 예를 들어 디펜타에리트리톨펜타(메트)아크릴레이트, 디펜타에리트리톨헥사(메트)아크릴레이트, 트리펜타에리트리톨펜타(메트)아크릴레이트, 트리펜타에리트리톨헥사(메트)아크릴레이트, 트리펜타에리트리톨헵타(메트)아크릴레이트 및 트리펜타에리트리톨옥타(메트)아크릴레이트 등의 (메트)아크릴로일기를 5 이상 갖는 저분자(예를 들어, 분자량이 200 내지 800) 화합물, (메트)아크릴로일기를 5 이상 갖는 실리콘(메트)아크릴레이트, (메트)아크릴로일기를 5 이상 갖는 우레탄(메트)아크릴레이트를 들 수 있다. 이들은, 1종을 단독으로 사용할 수도 있고, 2종 이상을 조합하여 사용할 수도 있다.Although it does not specifically limit as resin (B) which has 5 or more (meth)acryloyl groups, For example, dipentaerythritol penta (meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol penta Having 5 or more (meth)acryloyl groups such as (meth)acrylate, tripentaerythritol hexa (meth)acrylate, tripentaerythritol hepta (meth)acrylate and tripentaerythritol octa (meth)acrylate Low molecular weight (e.g., 200 to 800 molecular weight) compounds, silicone (meth)acrylates having 5 or more (meth)acryloyl groups, and urethane (meth)acrylates having 5 or more (meth)acryloyl groups. have. These may be used singly or in combination of two or more.
(메트)아크릴로일기를 5 이상 갖는 실리콘(메트)아크릴레이트로서는, 예를 들어 5 이상의 (메트)아크릴로일기와 오르가노실록산 단위[-Si(-R)2-O-](R은 유기기를 나타낸다.)를 갖는 화합물을 들 수 있다. 상기 실리콘(메트)아크릴레이트는, 평균 (메트)아크릴로일기 수가 5 이상인 실리콘(메트)아크릴레이트이어도 된다. 상기한 R은 유기기이면 특별히 한정되지 않지만, 예를 들어 C1-6알킬기, C1-6알콕시기를 들 수 있다. 상기 실리콘(메트)아크릴레이트 1분자 중의 Si 원자(또는 오르가노실록산 단위)는, 예를 들어 1 내지 30이고, 바람직하게는 1 내지 20, 더욱 바람직하게는 1 내지 15이다. 상기 실리콘(메트)아크릴레이트에 있어서의 (메트)아크릴로일기의 수(또는 평균 (메트)아크릴로일기 수)는 5 이상이면 특별히 한정되지 않지만, 예를 들어 5 내지 20, 바람직하게는 5 내지 15, 더욱 바람직하게는 5 내지 10이다.As a silicone (meth)acrylate having 5 or more (meth)acryloyl groups, for example, 5 or more (meth)acryloyl groups and organosiloxane units [-Si(-R) 2 -O-] (R is organic A group is shown.). The silicone (meth)acrylate may be a silicone (meth)acrylate having an average number of (meth)acryloyl groups of 5 or more. The above-described R is not particularly limited as long as it is an organic group, and examples thereof include a C 1-6 alkyl group and a C 1-6 alkoxy group. The Si atom (or organosiloxane unit) in one molecule of the silicon (meth)acrylate is, for example, 1 to 30, preferably 1 to 20, and more preferably 1 to 15. The number of (meth)acryloyl groups in the silicone (meth)acrylate (or the average number of (meth)acryloyl groups) is not particularly limited as long as it is 5 or more, but for example 5 to 20, preferably 5 to 15, more preferably 5 to 10.
여기서, 「평균 (메트)아크릴로일기 수」란, 실리콘(메트)아크릴레이트 1분자당 (메트)아크릴로일기의 수의 평균값이라고 정의할 수 있다. 예를 들어, 디알킬디알콕시실란 또는 그의 중합체와, (메트)아크릴로일기를 2개 갖는 알콕시실란 및 (메트)아크릴로일기를 3개 갖는 알콕시실란의 혼합물(몰비는 1:1)을 반응하여 얻어지는 실리콘(메트)아크릴레이트의 평균 (메트)아크릴로일기 수는 5가 된다.Here, the "average number of (meth)acryloyl groups" can be defined as an average value of the number of (meth)acryloyl groups per molecule of silicone (meth)acrylate. For example, a mixture of a dialkyldialkoxysilane or a polymer thereof and an alkoxysilane having two (meth)acryloyl groups and an alkoxysilane having three (meth)acryloyl groups (molar ratio is 1:1) is reacted. The average number of (meth)acryloyl groups in the obtained silicone (meth)acrylate is 5.
또한, 실리콘(메트)아크릴레이트는, 평균 관능기 수가 동일한 것 또는 상이한 것의 2종 이상 혼합물이어도 된다. 상기 혼합물의 평균 관능기 수는 가중 평균에 의해 구할 수도 있다. 예를 들어, 평균 관능기 수가 4인 실리콘(메트)아크릴레이트 0.6몰과, 평균 관능기 수가 6인 실리콘(메트)아크릴레이트 0.4몰의 혼합물의 경우, 실리콘(메트)아크릴레이트의 평균 관능기 수는, 다음 식을 따라서 계산할 수 있고, 4.8이 된다.Further, the silicone (meth)acrylate may be a mixture of two or more of the same or different average number of functional groups. The average number of functional groups in the mixture can also be determined by weighted average. For example, in the case of a mixture of 0.6 moles of silicone (meth)acrylate having an average number of functional groups of 4 and 0.4 moles of silicone (meth)acrylate having an average number of functional groups of 6, the average number of functional groups of the silicone (meth)acrylate is: It can be calculated according to the equation, and it becomes 4.8.
(4×0.6+6×0.4)/(0.6+0.4)=4.8(4×0.6+6×0.4)/(0.6+0.4)=4.8
(메트)아크릴로일기를 5 이상 갖는 우레탄(메트)아크릴레이트란, 구체적으로는 평균 (메트)아크릴로일기 수가 5 이상인 우레탄(메트)아크릴레이트를 가리킨다. 상기 우레탄(메트)아크릴레이트는, 예를 들어 폴리올(X), 폴리이소시아네이트(Y) 및 히드록시기 함유 (메트)아크릴레이트(Z)를 반응시킴으로써 얻어지는 것(즉, 이들의 반응물)이어도 된다.The urethane (meth)acrylate having 5 or more (meth)acryloyl groups specifically refers to a urethane (meth)acrylate having an average number of (meth)acryloyl groups 5 or more. The urethane (meth)acrylate may be, for example, one obtained by reacting a polyol (X), a polyisocyanate (Y), and a hydroxy group-containing (meth)acrylate (Z) (that is, a reactant thereof).
여기서, 「평균 (메트)아크릴로일기 수」란, 우레탄(메트)아크릴레이트 1분자당(메트)아크릴로일기의 수의 평균값이다. 예를 들어, 폴리올(X)로서의 디올(X1) 1몰과, 폴리이소시아네이트(Y)로서의 디이소시아네이트(Y1) 2몰과, 히드록시기 함유 (메트)아크릴레이트(Z)로서의 하나의 히드록시기와 하나의 (메트)아크릴로일기를 갖는 화합물(Z1) 1몰 및 하나의 히드록시기와 3개의 (메트)아크릴로일기를 갖는 화합물(Z2) 1몰을 반응시킨 경우에 얻어지는 우레탄(메트)아크릴레이트의 평균 (메트)아크릴로일기 수는 4가 된다(얻어지는 우레탄(메트)아크릴레이트의 구조를 이하에 모식적으로 나타낸다).Here, the "average number of (meth)acryloyl groups" is an average value of the number of (meth)acryloyl groups per molecule of urethane (meth)acrylate. For example, 1 mole of diol (X1) as polyol (X), 2 moles of diisocyanate (Y1) as polyisocyanate (Y), and one hydroxyl group as a hydroxy group-containing (meth)acrylate (Z) and one ( Average of urethane (meth)acrylate obtained by reacting 1 mol of a compound (Z1) having a meth)acryloyl group and 1 mol of a compound (Z2) having one hydroxyl group and three (meth)acryloyl groups (meth) ) The number of acryloyl groups is 4 (the structure of the obtained urethane (meth)acrylate is schematically shown below).
(Z1)-(Y1)-(X1)-(Y1)-(Z2)(Z1)-(Y1)-(X1)-(Y1)-(Z2)
예를 들어, 1,3-부탄디올 1몰과, 1,6-헥산디이소시아네이트 2몰과, 2-히드록시에틸(메트)아크릴레이트 1몰 및 펜타에리트리톨트리(메트)아크릴레이트 1몰의 혼합물을 반응시킨 경우가 상기에 해당한다. 또한, 상기 모노머의 몰비는, 1:2:1:1이다.For example, a mixture of 1 mole of 1,3-butanediol, 2 moles of 1,6-hexanediisocyanate, 1 mole of 2-hydroxyethyl (meth)acrylate and 1 mole of pentaerythritol tri(meth)acrylate The above is the case where the reaction is made. In addition, the molar ratio of the monomer is 1:2:1:1.
또한, 우레탄(메트)아크릴레이트는, 평균 관능기 수가 동일한 것 또는 상이한 것의 2종 이상 혼합물이어도 된다. 상기 혼합물의 평균 관능기 수는 가중 평균에 의해 구할 수도 있다. 예를 들어, 평균 관능기 수가 2인 우레탄(메트)아크릴레이트 0.4몰과, 평균 관능기 수가 4인 우레탄(메트)아크릴레이트 0.6몰의 혼합물인 경우, 우레탄(메트)아크릴레이트의 평균 관능기 수는, 다음 식을 따라 계산할 수 있고, 3.2가 된다.Further, the urethane (meth)acrylate may be a mixture of two or more of the same or different average number of functional groups. The average number of functional groups in the mixture can also be determined by weighted average. For example, in the case of a mixture of 0.4 mol of urethane (meth)acrylate having an average number of functional groups of 2 and 0.6 mol of urethane (meth)acrylate having an average number of functional groups of 4, the average number of functional groups of urethane (meth)acrylate is: It can be calculated according to the equation, and it becomes 3.2.
(2×0.4+4×0.6)/(0.4+0.6)=3.2(2×0.4+4×0.6)/(0.4+0.6)=3.2
폴리올(X)은, 분자 중에 2개 이상의 히드록시기를 갖는 화합물이다. 단, 폴리올(X)에는, 히드록시기 함유 (메트)아크릴레이트(Z)에 대응하는 화합물은 포함되지 않는 것으로 한다. 또한, 폴리올(X)은, 1종을 단독으로 사용할 수도 있고, 2종 이상을 조합하여 사용할 수도 있다.Polyol (X) is a compound having two or more hydroxy groups in a molecule. However, it is assumed that the compound corresponding to the hydroxy group-containing (meth)acrylate (Z) is not contained in the polyol (X). Moreover, polyol (X) may be used individually by 1 type, and may be used in combination of 2 or more types.
폴리올(X)로서는, 분자 중에 2개 이상의 히드록시기를 갖는 화합물로서 공지 내지 관용의 것을 사용할 수 있고, 특별히 한정되지 않지만, 예를 들어 에틸렌글리콜, 프로필렌글리콜, 트리메틸렌글리콜, 테트라메틸렌글리콜, 1,3-부탄디올, 1,4-부탄디올, 1,6-헥산디올, 네오펜틸글리콜, 디에틸렌글리콜, 트리에틸렌글리콜, 디프로필렌글리콜, 폴리옥시C2-4알킬렌글리콜(폴리에틸렌글리콜, 폴리프로필렌글리콜, 폴리옥시테트라메틸렌글리콜 등), 폴리에스테르디올, 폴리에테르디올, 폴리카르보네이트디올, 비스페놀 A 및 그의 알킬렌옥사이드 부가체, 비스페놀 F 및 그의 알킬렌옥사이드 부가체, 수소화 비스페놀 A 및 그의 알킬렌옥사이드 부가체, 수소화 비스페놀 F 및 그의 알킬렌옥사이드 부가체, 시클로헥산디올, 시클로헥산디메탄올, 트리시클로데칸디메탄올, 이소소르바이드, 크실렌글리콜 등의 디올; 글리세린, 1,1,1-트리스(히드록시메틸)프로판, D-소르비톨, 크실리톨, D-만니톨, D-만니트, 디글리세린, 폴리글리세린, 트리메틸올에탄, 트리메틸올프로판, 펜타에리트리톨, 폴리에테르폴리올, 폴리에스테르폴리올, 폴리카르보네이트폴리올, 아크릴폴리올, 에폭시폴리올, 천연 오일 폴리올, 실리콘 폴리올, 불소 폴리올, 폴리올레핀폴리올 등의 분자 중에 3개 이상의 히드록시기를 갖는 폴리올을 들 수 있다.As the polyol (X), a compound having two or more hydroxy groups in the molecule may be known or commonly used, and although not particularly limited, for example, ethylene glycol, propylene glycol, trimethylene glycol, tetramethylene glycol, 1,3 -Butanediol, 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, diethylene glycol, triethylene glycol, dipropylene glycol, polyoxyC 2-4 alkylene glycol (polyethylene glycol, polypropylene glycol, poly Oxytetramethylene glycol, etc.), polyesterdiol, polyetherdiol, polycarbonate diol, bisphenol A and its alkylene oxide adduct, bisphenol F and its alkylene oxide adduct, hydrogenated bisphenol A and its alkylene oxide addition Diols such as sieve, hydrogenated bisphenol F and alkylene oxide adducts thereof, cyclohexanediol, cyclohexanedimethanol, tricyclodecanedimethanol, isosorbide, and xylene glycol; Glycerin, 1,1,1-tris(hydroxymethyl)propane, D-sorbitol, xylitol, D-mannitol, D-mannite, diglycerin, polyglycerin, trimethylolethane, trimethylolpropane, pentaerythritol , Polyether polyols, polyester polyols, polycarbonate polyols, acrylic polyols, epoxy polyols, natural oil polyols, silicone polyols, fluorine polyols, polyolefin polyols, and other polyols having three or more hydroxyl groups in the molecule.
폴리올(X)로서는 시판품을 사용할 수 있고, 예를 들어 제품명 「TCD alcohol DM」(트리시클로데칸디메탄올, 옥세아사제), 제품명 「이소소르바이드」(이소소르바이드, 토에이 케미칼사제), 제품명 「PEG-400」(수 평균 분자량 400의 폴리에틸렌글리콜, 산요 가세이 고교사제)을 들 수 있다.Commercially available products can be used as the polyol (X). For example, the product name ``TCD alcohol DM'' (Tricyclodecane dimethanol, manufactured by Oxea Corporation), the product name ``Isosorbide'' (Isosorbide, manufactured by Toei Chemical), and the product name `` PEG-400" (polyethylene glycol having a number average molecular weight of 400, manufactured by Sanyo Kasei Kogyo Corporation) is mentioned.
폴리이소시아네이트(Y)는, 분자 중에 2개 이상의 이소시아네이트기를 갖는 화합물이다. 또한, 우레탄(메트)아크릴레이트의 원료로서 폴리이소시아네이트(Y)는, 1종을 단독으로 사용할 수도 있고, 2종 이상을 조합하여 사용할 수도 있다.Polyisocyanate (Y) is a compound having two or more isocyanate groups in a molecule. Further, as a raw material for urethane (meth)acrylate, polyisocyanate (Y) may be used singly or in combination of two or more.
폴리이소시아네이트(Y)으로서는, 예를 들어 방향족계 이소시아네이트, 지방족계 이소시아네이트, 환식 지방족계 이소시아네이트, 지환식 이소시아네이트, 이들의 혼합물, 상기 이소시아네이트의 부가물, 상기 이소시아네이트의 변성물, 상기 이소시아네이트의 중합물 등의 공지된 이소시아네이트류를 들 수 있다. 보다 구체적으로는, 예를 들어 톨릴렌디이소시아네이트(TDI), 디페닐메탄디이소시아네이트(MDI), 수소 첨가화 디페닐메탄디이소시아네이트(H12MDI), 폴리페닐메탄이소시아네이트 화합물(크루드 MDI), 변성 디페닐메탄디이소시아네이트(변성 MDI), 크실릴렌디이소시아네이트(XDI), 수소 첨가화 크실릴렌디이소시아네이트(H-XDI), 헥사메틸렌디이소시아네이트(HDI), 트리메틸헥사메틸렌디이소시아네이트(TMXDI), 이소포론디이소시아네이트(IPDI), 노르보르넨디이소시아네이트(NDI)를 들 수 있다.As polyisocyanate (Y), for example, aromatic isocyanates, aliphatic isocyanates, cyclic aliphatic isocyanates, alicyclic isocyanates, mixtures thereof, adducts of the isocyanates, modified products of the isocyanates, polymers of the isocyanates, etc. Isocyanates which have been made are mentioned. More specifically, for example, tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), hydrogenated diphenylmethane diisocyanate (H12MDI), polyphenylmethane isocyanate compound (crude MDI), modified diphenyl Methane diisocyanate (modified MDI), xylylene diisocyanate (XDI), hydrogenated xylylene diisocyanate (H-XDI), hexamethylene diisocyanate (HDI), trimethylhexamethylene diisocyanate (TMXDI), isophorone diisocyanate (IPDI) and norbornene diisocyanate (NDI) are mentioned.
폴리이소시아네이트(Y)로서는 시판품을 사용할 수 있고, 예를 들어 제품명 「스미두르 N3300」(1,6-헥사메틸렌디이소시아네이트 유래의 누레이트 화합물, 스미토모 바이엘 우레탄사제), 제품명 「VESTANAT IPDI」(이소포론디이소시아네이트, 에보닉사제)을 들 수 있다.As the polyisocyanate (Y), a commercial item can be used, and for example, the product name ``Smidur N3300'' (a nurate compound derived from 1,6-hexamethylene diisocyanate, manufactured by Sumitomo Bayer Urethane), and the product name ``VESTANAT IPDI'' (isophorone) Diisocyanate, the product made by Evonik) can be mentioned.
히드록시기 함유 (메트)아크릴레이트(Z)는, 분자 중에 하나 이상의 히드록시기를 가지며, 또한 분자 중에 하나 이상의 (메트)아크릴로일기를 갖는 화합물이다. 또한, 우레탄(메트)아크릴레이트의 원료로서 히드록시기 함유 (메트)아크릴레이트(Z)는, 1종을 단독으로 사용할 수도 있고, 2종 이상을 조합하여 사용할 수도 있다.The hydroxy group-containing (meth)acrylate (Z) is a compound having at least one hydroxy group in the molecule and at least one (meth)acryloyl group in the molecule. In addition, as a raw material for urethane (meth)acrylate, the hydroxyl group-containing (meth)acrylate (Z) may be used singly or in combination of two or more.
히드록시기 함유 (메트)아크릴레이트(Z)로서는, 예를 들어 2-히드록시에틸(메트)아크릴레이트, 2-히드록시프로필(메트)아크릴레이트, 4-히드록시부틸(메트)아크릴레이트, 2-히드록시-3-메톡시프로필(메트)아크릴레이트, 이들 락톤 부가물(카프로락톤 부가물 등) 등의 히드록실기를 갖는 단관능의 (메트)아크릴레이트 화합물; 펜타에리트리톨트리(메트)아크릴레이트, 디펜타에리트리톨펜타(메트)아크릴레이트, 디펜타에리트리톨테트라(메트)아크릴레이트, 디펜타에리트리톨트리(메트)아크릴레이트, 이들 락톤 부가물(카프로락톤 부가물 등) 등의 히드록실기를 갖는 다관능의 (메트)아크릴레이트 화합물을 들 수 있다. 히드록시기 함유 (메트)아크릴레이트(Z)는, 1종 단독으로 사용해도 되고, 2종 이상을 조합하여 사용해도 된다.As a hydroxy group-containing (meth)acrylate (Z), for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2- Monofunctional (meth)acrylate compounds having a hydroxyl group such as hydroxy-3-methoxypropyl (meth)acrylate and these lactone adducts (caprolactone adducts, etc.); Pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol tri(meth)acrylate, these lactone adducts (caprolactone And polyfunctional (meth)acrylate compounds having a hydroxyl group such as adducts and the like). The hydroxy group-containing (meth)acrylate (Z) may be used singly or in combination of two or more.
히드록시기 함유 (메트)아크릴레이트(Z)으로서는 시판품을 사용할 수 있고, 예를 들어 제품명 「BHEA」(아크릴산2-히드록시에틸, 닛폰 쇼쿠바이사제), 제품명 「CHDMA」(시클로헥산디메탄올 모노아크릴레이트, 니혼 가세이사제), 제품명 「PETRA」(펜타에리트리톨트리아크릴레이트와 펜타에리트리톨테트라아크릴레이트의 혼합물, 올넥스사제)를 들 수 있다.As the hydroxy group-containing (meth)acrylate (Z), commercially available products can be used. For example, the product name "BHEA" (2-hydroxyethyl acrylate, manufactured by Nippon Shokubai Co., Ltd.), and the product name "CHDMA" (cyclohexanedimethanol monoacrylic) Rate, Nippon Kasei Co., Ltd.), and a product name "PETRA" (a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate, Allnex company make).
(메트)아크릴로일기를 5 이상 갖는 수지 (B)로서는, 경화물의 내마모성, 내찰상성 및 표면 경도의 관점에서, (메트)아크릴로일기를 5 이상 갖는 저분자(예를 들어, 분자량이 200 내지 800) 화합물이 바람직하고, 디펜타에리트리톨펜타(메트)아크릴레이트, 디펜타에리트리톨헥사(메트)아크릴레이트가 보다 바람직하고, 디펜타에리트리톨펜타(메트)아크릴레이트 및 디펜타에리트리톨헥사(메트)아크릴레이트를 동시에 포함하는 것이 특히 바람직하다.As the resin (B) having 5 or more (meth)acryloyl groups, from the viewpoint of abrasion resistance, scratch resistance and surface hardness of the cured product, a low molecular weight having 5 or more (meth)acryloyl groups (for example, a molecular weight of 200 to 800 ) Compounds are preferred, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate are more preferred, dipentaerythritol penta (meth) acrylate and dipentaerythritol hexa (meth) ) It is particularly preferred to include an acrylate at the same time.
(메트)아크릴로일기를 5 이상 갖는 수지 (B)로서, 디펜타에리트리톨펜타(메트)아크릴레이트 및 디펜타에리트리톨헥사(메트)아크릴레이트를 동시에 포함하는 경우, 이들의 비율은 특별히 한정되지 않지만, 예를 들어 디펜타에리트리톨펜타(메트)아크릴레이트 및 디펜타에리트리톨헥사(메트)아크릴레이트의 합계량에 대한, 디펜타에리트리톨펜타(메트)아크릴레이트의 함유량이, 1 내지 90중량%인 것이 바람직하고, 보다 바람직하게는 5 내지 80중량%, 더욱 바람직하게는 8 내지 60중량%, 특히 바람직하게는 10 내지 50중량%이다. 디펜타에리트리톨펜타(메트)아크릴레이트의 함유량이 상기 범위에 있음으로써, 얻어지는 경화물의 내마모성, 내찰상성, 표면 경도가 향상되고, 도막 건조 후의 점착성이 개선되는 경향이 있다.As the resin (B) having 5 or more (meth)acryloyl groups, when simultaneously containing dipentaerythritol penta (meth) acrylate and dipentaerythritol hexa (meth) acrylate, the ratio thereof is not particularly limited. However, for example, the content of dipentaerythritol penta (meth)acrylate relative to the total amount of dipentaerythritol penta (meth) acrylate and dipentaerythritol hexa (meth) acrylate is 1 to 90% by weight It is preferably, more preferably 5 to 80% by weight, still more preferably 8 to 60% by weight, particularly preferably 10 to 50% by weight. When the content of dipentaerythritol penta (meth)acrylate is in the above range, the abrasion resistance, scratch resistance, and surface hardness of the resulting cured product are improved, and the adhesion after drying of the coating film tends to be improved.
(메트)아크릴로일기를 5 이상 갖는 수지 (B)로서는 시판품을 사용할 수 있고, 예를 들어 제품명 「KAYATAD DPHA」(디펜타에리트리톨펜타아크릴레이트와 디펜타에리트리톨헥사아크릴레이트의 혼합물, 닛폰 가야쿠사제), 제품명 「아로닉스 M-403」(디펜타에리트리톨펜타아크릴레이트와 디펜타에리트리톨헥사아크릴레이트의 혼합물, 디펜타에리트리톨펜타아크릴레이트의 비율(함유량)이 50 내지 60중량%), 제품명 「아로닉스 M-400」(디펜타에리트리톨펜타아크릴레이트와 디펜타에리트리톨헥사아크릴레이트의 혼합물, 디펜타에리트리톨펜타아크릴레이트의 비율(함유량)이 40 내지 50중량%), 제품명 「아로닉스 M-402」(디펜타에리트리톨펜타아크릴레이트와 디펜타에리트리톨헥사아크릴레이트의 혼합물, 디펜타에리트리톨펜타아크릴레이트의 비율(함유량)이 30 내지 40중량%), 제품명 「아로닉스 M-404」(디펜타에리트리톨펜타아크릴레이트와 디펜타에리트리톨헥사아크릴레이트의 혼합물, 디펜타에리트리톨펜타아크릴레이트의 비율(함유량)이 30 내지 40중량%), 제품명 「아로닉스 M-406」(디펜타에리트리톨펜타아크릴레이트와 디펜타에리트리톨헥사아크릴레이트의 혼합물, 디펜타에리트리톨펜타아크릴레이트의 비율(함유량)이 25 내지 35중량%), 제품명 「아로닉스 M-405」(디펜타에리트리톨펜타아크릴레이트와 디펜타에리트리톨헥사아크릴레이트의 혼합물, 디펜타에리트리톨펜타아크릴레이트의 비율(함유량)이 10 내지 20중량%) 등의 제품명 「아로닉스 M」 시리즈(도아 고세사제), 제품명 「DPHA」(디펜타에리트리톨펜타아크릴레이트와 디펜타에리트리톨헥사아크릴레이트의 혼합물, 올넥스사제), 제품명 「에베크릴(에베크릴) 1360」(실리콘 헥사아크릴레이트, 올넥스사제), 제품명 「KRM8452」(관능기((메트)아크릴로일기) 수가 10인 지방족 우레탄아크릴레이트, 다이셀ㆍ올넥스사제) 등을 들 수 있다.As the resin (B) having 5 or more (meth)acryloyl groups, commercially available products can be used, for example, the product name ``KAYATAD DPHA'' (a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, Nippon Gaya Cousa), the product name "Aronix M-403" (a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, the ratio (content) of dipentaerythritol pentaacrylate is 50 to 60% by weight) , Product name "Aronix M-400" (a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, the ratio (content) of dipentaerythritol pentaacrylate is 40 to 50% by weight), product name " Aaronix M-402" (a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, the ratio (content) of dipentaerythritol pentaacrylate is 30 to 40% by weight), the product name "Aronix M -404" (a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, the ratio (content) of dipentaerythritol pentaacrylate is 30 to 40% by weight), product name "Aronix M-406" (The mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, the ratio (content) of dipentaerythritol pentaacrylate is 25 to 35% by weight), product name "Aronix M-405" (Dipenta Product names such as a mixture of erythritol pentaacrylate and dipentaerythritol hexaacrylate and the ratio (content) of dipentaerythritol pentaacrylate is 10 to 20% by weight), etc. Product name "DPHA" (a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, manufactured by Allnex), product name "Evecryl (Evecryl) 1360" (silicone hexaacrylate, manufactured by Allnex), product name "KRM8452" (an aliphatic urethane acrylate having a number of functional groups ((meth)acryloyl group) of 10, manufactured by Daicel Allnex Corporation), and the like.
경화성 수지 조성물의 수지분 전량에 대한 (메트)아크릴로일기를 5 이상 갖는 수지 (B)의 함유량은 특별히 한정되지 않지만, 예를 들어 58중량% 이하인 것이 바람직하고, 보다 바람직하게는 5 내지 56중량%, 특히 바람직하게는 10 내지 53중량%, 가장 바람직하게는 20 내지 52중량%이다. (메트)아크릴로일기를 5 이상 갖는 수지 (B)가 상기 범위에 있음으로써, 얻어지는 경화물의 내마모성, 내찰상성, 표면 경도가 향상되고, 도막 건조 후의 점착성이 개선되는 경향이 있다.Although the content of the resin (B) having 5 or more (meth)acryloyl groups relative to the total amount of the resin content of the curable resin composition is not particularly limited, it is preferably 58% by weight or less, and more preferably 5 to 56% by weight. %, particularly preferably 10 to 53% by weight, most preferably 20 to 52% by weight. When the resin (B) having 5 or more (meth)acryloyl groups is in the above range, the abrasion resistance, abrasion resistance, and surface hardness of the resulting cured product are improved, and the adhesion after drying the coating film tends to be improved.
경화성 수지 조성물의 불휘발분 전량에 대한 (메트)아크릴로일기를 5 이상 갖는 수지 (B)의 함유량은 특별히 한정되지 않지만, 예를 들어 58중량% 이하인 것이 바람직하고, 보다 바람직하게는 5 내지 56중량%, 특히 바람직하게는 10 내지 53중량%, 가장 바람직하게는 20 내지 52중량%이다. (메트)아크릴로일기를 5 이상 갖는 수지 (B)가 상기 범위에 있음으로써, 얻어지는 경화물의 내마모성, 내찰상성, 표면 경도가 향상되고, 도막 건조 후의 점착성이 개선되는 경향이 있다.The content of the resin (B) having 5 or more (meth)acryloyl groups relative to the total amount of nonvolatile matter of the curable resin composition is not particularly limited, but is preferably 58% by weight or less, and more preferably 5 to 56% by weight. %, particularly preferably 10 to 53% by weight, most preferably 20 to 52% by weight. When the resin (B) having 5 or more (meth)acryloyl groups is in the above range, the abrasion resistance, abrasion resistance, and surface hardness of the resulting cured product are improved, and the adhesion after drying the coating film tends to be improved.
경화성 수지 조성물에 있어서의, 열가소성 수지 (A) 전량에 대한 (메트)아크릴로일기를 5 이상 갖는 수지 (B)의 함유량은, 예를 들어 45 내지 90중량%인 것이 바람직하고, 보다 바람직하게는 50 내지 80중량%, 더욱 바람직하게는 55 내지 75중량%이다. (메트)아크릴로일기를 5 이상 갖는 수지 (B)가 상기 범위에 있음으로써, 얻어지는 경화물의 내마모성, 내찰상성, 표면 경도가 향상되고, 도막 건조 후의 점착성이 개선되는 경향이 있다.In the curable resin composition, the content of the resin (B) having 5 or more (meth)acryloyl groups relative to the total amount of the thermoplastic resin (A) is, for example, preferably 45 to 90% by weight, more preferably It is 50 to 80% by weight, more preferably 55 to 75% by weight. When the resin (B) having 5 or more (meth)acryloyl groups is in the above range, the abrasion resistance, abrasion resistance, and surface hardness of the resulting cured product are improved, and the adhesion after drying the coating film tends to be improved.
[광중합 개시제(C)][Photopolymerization initiator (C)]
광중합 개시제(C)로서는, 예를 들어 1-히드록시시클로헥실페닐케톤, 2-히드록시-2-메틸-1-페닐프로판-1-온, 디에톡시아세토페논, 1-(4-이소프로필페닐)-2-히드록시-2-메틸프로판-1-온, 1-(4-도데실페닐)-2-히드록시-2-메틸프로판-1-온, 4-(2-히드록시에톡시)-페닐(2-히드록시-2-프로필)케톤, 2-메틸-1-[4-(메틸티오)페닐]-2-모르폴리노프로판-1, 벤조인, 벤조인메틸에테르, 벤조인에틸에테르, 벤조인이소프로필에테르, 벤조인n-부틸에테르, 벤조인페닐에테르, 벤질디메틸케탈, 벤조페논, 벤조일벤조산, 벤조일벤조산메틸, 4-페닐벤조페논, 히드록시벤조페논, 아크릴화 벤조페논, 4-벤조일-4'-메틸디페닐술피드, 3,3'-디메틸-4-메톡시벤조페논, 티오크산톤, 2-클로르티오크산톤, 2-메틸티오크산톤, 2,4-디메틸티오크산톤, 이소프로필티오크산톤, 2,4-디클로로티오크산톤, 2,4-디에틸티오크산톤, 2,4-디이소프로필티오크산톤, 2,4,6-트리메틸벤조일디페닐포스핀옥사이드, 메틸페닐글리옥실레이트, 벤질, 캄포퀴논 등을 들 수 있다. 이들은, 1종을 단독으로 사용할 수도 있고, 2종 이상을 조합하여 사용할 수도 있다.As a photoinitiator (C), for example, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, diethoxyacetophenone, 1-(4-isopropylphenyl) )-2-hydroxy-2-methylpropan-1-one, 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one, 4-(2-hydroxyethoxy) -Phenyl(2-hydroxy-2-propyl)ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1, benzoin, benzoin methyl ether, benzoin ethyl Ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin phenyl ether, benzyl dimethyl ketal, benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxybenzophenone, acrylated benzophenone, 4 -Benzoyl-4'-methyldiphenylsulfide, 3,3'-dimethyl-4-methoxybenzophenone, thioxanthone, 2-chlor thioxanthone, 2-methyl thioxanthone, 2,4-dimethyl tea Oxanthone, isopropyl thioxanthone, 2,4-dichloro thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2,4,6-trimethylbenzoyldiphenylphosphine Pin oxide, methylphenyl glyoxylate, benzyl, campoquinone, and the like. These may be used singly or in combination of two or more.
광중합 개시제(C)로서는 시판품을 사용할 수 있고, 예를 들어 제품명 「IRGACURE184」(1-히드록시시클로헥실페닐케톤, BASF사제)를 들 수 있다.As the photoinitiator (C), a commercial item can be used, and for example, the product name "IRGACURE184" (1-hydroxycyclohexylphenyl ketone, manufactured by BASF) can be mentioned.
경화성 수지 조성물의 수지분 전량에 대한 광중합 개시제(C)의 함유량은 특별히 한정되지 않지만, 예를 들어 0.01 내지 10중량%가 바람직하고, 보다 바람직하게는 0.1 내지 8중량%, 더욱 바람직하게는 0.5 내지 5중량%이다.The content of the photopolymerization initiator (C) relative to the total amount of the resin content of the curable resin composition is not particularly limited, but, for example, 0.01 to 10% by weight is preferable, more preferably 0.1 to 8% by weight, even more preferably 0.5 to It is 5% by weight.
[휘발성 용매 (D)][Volatile solvent (D)]
휘발성 용매 (D)로서는, 경화성 수지 조성물을 기재에 도포하여 건조하였을 때 휘발하는 용매라면 특별히 한정되지 않지만, 예를 들어 케톤류(아세톤, 메틸에틸케톤, 메틸이소부틸케톤, 시클로헥사논 등), 에테르류(디옥산, 테트라히드로푸란 등), 지방족 탄화수소류(헥산 등), 지환식 탄화수소류(시클로헥산 등), 방향족 탄화수소류(벤젠 등), 할로겐화 탄화수소류(디클로로메탄, 디클로로에탄 등), 에스테르류(아세트산에틸 등), 알코올류(에탄올, 시클로헥사놀 등), 셀로솔브류(메틸셀로솔브, 에틸셀로솔브 등), 셀로솔브아세테이트류, 아미드류(디메틸포름아미드, 디메틸아세트아미드 등)을 들 수 있다. 이들은, 1종을 단독으로 사용할 수도 있고, 2종 이상을 조합하여 사용할 수도 있다.The volatile solvent (D) is not particularly limited as long as it is a solvent that volatilizes when a curable resin composition is applied to a substrate and dried. For example, ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, etc.), ether Compounds (dioxane, tetrahydrofuran, etc.), aliphatic hydrocarbons (hexane, etc.), alicyclic hydrocarbons (cyclohexane, etc.), aromatic hydrocarbons (benzene, etc.), halogenated hydrocarbons (dichloromethane, dichloroethane, etc.), esters Compounds (ethyl acetate, etc.), alcohols (ethanol, cyclohexanol, etc.), cellosolves (methyl cellosolve, ethyl cellosolve, etc.), cellosolve acetates, amides (dimethylformamide, dimethylacetamide, etc.) ). These may be used singly or in combination of two or more.
본 발명의 경화성 수지 조성물이 용매를 포함하는 경우, 용매는, 경화성 수지 조성물에 포함되는 수지분 전량의 농도가, 예를 들어 10 내지 80중량% 정도, 바람직하게는 20 내지 70중량%, 특히 바람직하게는 30 내지 60중량%가 되는 범위에서 사용하는 것이 바람직하다. 상기 범위에서 사용함으로써, 경화성 수지 조성물의 점도가 적당한 값을 나타내기 때문에, 원하는 막 두께의 코트층을 형성하는 것이 가능하게 되는 경향이 있다.When the curable resin composition of the present invention contains a solvent, the concentration of the total amount of the resin powder contained in the curable resin composition is, for example, about 10 to 80% by weight, preferably 20 to 70% by weight, particularly preferably It is preferably used in the range of 30 to 60% by weight. By using within the above range, since the viscosity of the curable resin composition exhibits an appropriate value, there is a tendency that it becomes possible to form a coat layer having a desired film thickness.
[그 밖의 수지][Other resin]
본 발명의 경화성 수지 조성물은, 열가소성 수지 (A) 및 (메트)아크릴로일기를 5 이상 갖는 수지 (B) 이외의 수지(「그 밖의 수지」라고 칭하는 경우가 있음) 를 포함하고 있어도 된다. 그 밖의 수지로서는, (메트)아크릴로일기를 4 이하 갖는 수지 등을 들 수 있지만, 경화성 수지 조성물의 수지분 전량에 대한 그 밖의 수지의 함유량은, 예를 들어 30중량% 이하가 바람직하고, 보다 바람직하게는 10중량% 이하, 더욱 바람직하게는 5중량% 이하, 특히 바람직하게는 1중량% 이하, 가장 바람직하게는 0중량%(실질적으로 포함되지 않는 것)이다.The curable resin composition of the present invention may contain resins other than the thermoplastic resin (A) and the resin (B) having 5 or more (meth)acryloyl groups (sometimes referred to as "other resins"). Examples of other resins include resins having 4 or less (meth)acryloyl groups, but the content of other resins relative to the total amount of the resin content of the curable resin composition is preferably, for example, 30% by weight or less. It is preferably 10% by weight or less, more preferably 5% by weight or less, particularly preferably 1% by weight or less, and most preferably 0% by weight (substantially not included).
(메트)아크릴로일기를 4 이하 갖는 수지로서는, (메트)아크릴로일기를 1개 갖는 화합물, (메트)아크릴로일기를 2 내지 4개 갖는 화합물 등을 들 수 있다. (메트)아크릴로일기를 1개 갖는 화합물로서는, 예를 들어 메틸(메트)아크릴레이트, 에틸(메트)아크릴레이트, 프로필(메트)아크릴레이트, 부틸(메트)아크릴레이트, 이소부틸(메트)아크릴레이트 등의 직쇄상 또는 분지쇄상 탄화수소기를 갖는 (메트)아크릴산에스테르; 시클로헥실(메트)아크릴레이트 등의 지환식 탄화수소기를 갖는 (메트)아크릴산에스테르; 벤질(메트)아크릴레이트 등의 방향족 탄화수소기를 갖는 (메트)아크릴산에스테르; 글리시딜(메트)아크릴레이트, 2-메틸글리시딜(메트)아크릴레이트, 2-옥시라닐에틸(메트)아크릴레이트, 2-글리시딜옥시에틸(메트)아크릴레이트, 3-글리시딜옥시프로필(메트)아크릴레이트, 글리시딜옥시페닐(메트)아크릴레이트, 3,4-에폭시시클로헥실메틸(메트)아크릴레이트 등의 분자 내에 에폭시기를 갖는 아크릴산에스테르를 들 수 있다. (메트)아크릴로일기를 2 내지 4개 갖는 화합물로서는, 예를 들어 1,6-헥산디올디(메트)아크릴레이트, 트리프로필렌글리콜디(메트)아크릴레이트, 폴리에틸렌글리콜디(메트)아크릴레이트, 트리메틸올프로판트리(메트)아크릴레이트, 펜타에리트리톨트리(메트)아크릴레이트, 펜타에리트리톨테트라(메트)아크릴레이트를 들 수 있다.Examples of the resin having 4 or less (meth)acryloyl groups include compounds having one (meth)acryloyl group, compounds having 2 to 4 (meth)acryloyl groups, and the like. As a compound having one (meth)acryloyl group, for example, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylic (Meth)acrylic acid ester having a linear or branched hydrocarbon group such as rate; (Meth)acrylic acid ester having an alicyclic hydrocarbon group such as cyclohexyl (meth)acrylate; (Meth)acrylic acid ester having an aromatic hydrocarbon group such as benzyl (meth)acrylate; Glycidyl (meth)acrylate, 2-methylglycidyl (meth)acrylate, 2-oxyranylethyl (meth)acrylate, 2-glycidyloxyethyl (meth)acrylate, 3-glycidyl Acrylic acid esters having an epoxy group in a molecule, such as oxypropyl (meth)acrylate, glycidyloxyphenyl (meth)acrylate, and 3,4-epoxycyclohexylmethyl (meth)acrylate, are mentioned. Examples of the compound having 2 to 4 (meth)acryloyl groups include 1,6-hexanediol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, Trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, and pentaerythritol tetra(meth)acrylate are mentioned.
[첨가제][additive]
본 발명의 경화성 수지 조성물은, 상술한 성분 이외에도, 레벨링제, 산화 방지제, 자외선 흡수제, 내광안정제, 열안정제, 결정핵제, 난연제, 난연 보조제, 충전제, 내충격성 개량제, 보강제, 분산제, 대전 방지제, 발포제, 항균제, 착색제 등의 첨가제를 더 포함하고 있어도 된다. 이들 첨가제의 함유량(배합량)은 특별히 한정되지 않고 경화성 수지 조성물에 있어서 통상 사용되는 양으로부터 적절하게 설정할 수 있다.In addition to the above-described components, the curable resin composition of the present invention includes a leveling agent, an antioxidant, an ultraviolet absorber, a light stabilizer, a heat stabilizer, a crystal nucleating agent, a flame retardant, a flame retardant auxiliary agent, a filler, an impact resistance improving agent, a reinforcing agent, a dispersant, an antistatic agent, a foaming agent , An additive such as an antibacterial agent or a colorant may be further included. The content (mixing amount) of these additives is not particularly limited, and can be appropriately set from the amount usually used in the curable resin composition.
<경화제><hardener>
본 발명의 경화성 수지 조성물은, (메트)아크릴로일기를 5 이상 갖는 수지 (B)의 중합 반응을 진행시킴으로써 경화시킬 수 있고, 이에 의해 경화물을 형성할 수 있다. 경화의 방법은, 주지의 방법보다 적절하게 선택할 수 있고, 특별히 한정되지 않지만, 예를 들어 활성 에너지선의 조사를 들 수 있다. 활성 에너지선으로서는, 예를 들어 적외선, 가시광선, 자외선, X선, 전자선, α선, β선, γ선 등의 어느 것을 사용할 수도 있다. 그 중에서도 취급성이 우수한 점에서, 자외선이 바람직하다.The curable resin composition of the present invention can be cured by advancing the polymerization reaction of the resin (B) having 5 or more (meth)acryloyl groups, and thereby a cured product can be formed. The method of curing can be appropriately selected from a known method, and is not particularly limited, but an active energy ray irradiation is mentioned, for example. As the active energy ray, for example, infrared ray, visible ray, ultraviolet ray, X ray, electron ray, α ray, β ray, γ ray, or the like may be used. Among them, ultraviolet rays are preferred from the viewpoint of excellent handling properties.
본 발명의 경화성 수지 조성물을 활성 에너지선의 조사에 의해 경화시킬 때의 조건(활성 에너지선의 조사 조건 등)은, 조사하는 활성 에너지선의 종류나 에너지, 경화물의 형상이나 사이즈 등에 따라 적절히 조정할 수 있고, 특별히 한정되지 않지만, 자외선을 조사하는 경우에는, 예를 들어 1 내지 1000mJ/㎠ 정도로 하는 것이 바람직하다. 또한, 활성 에너지선의 조사에는, 예를 들어 고압 수은 램프, 초고압 수은 램프, 크세논 램프, 카본 아크, 메탈 할라이드 램프, 태양광, LED 램프, 레이저 등을 사용할 수 있다. 활성 에너지선의 조사 후에는, 또한 가열 처리(어닐, 에이징)를 실시하여 추가로 경화 반응을 진행시킬 수 있다.Conditions when curing the curable resin composition of the present invention by irradiation with active energy rays (irradiation conditions with active energy rays, etc.) can be appropriately adjusted according to the type and energy of the active energy rays to be irradiated, the shape or size of the cured product, etc. Although not limited, in the case of irradiating ultraviolet rays, it is preferably about 1 to 1000 mJ/cm 2, for example. In addition, for the irradiation of the active energy ray, for example, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a carbon arc, a metal halide lamp, sunlight, an LED lamp, a laser, or the like can be used. After irradiation of the active energy ray, further heat treatment (annealing, aging) can be performed to further advance the curing reaction.
본 발명의 경화성 수지 조성물은, 기재 상에 도포ㆍ건조하여 도막을 제작하고, 또한 상기 도막을 경화함으로써 코트층으로서 얻을 수 있다. 즉, 본 발명의 경화성 수지 조성물은 코트제(코트제 조성물)로서 사용할 수 있다.The curable resin composition of the present invention can be obtained as a coat layer by applying and drying on a substrate to prepare a coating film, and curing the coating film. That is, the curable resin composition of the present invention can be used as a coating agent (coating agent composition).
기재로서는 특별히 한정되지 않지만, 예를 들어 플라스틱 기재, 금속 기재, 세라믹스 기재, 반도체 기재, 유리 기재, 종이 기재, 나무 기재(목제 기재), 표면이 도장 표면인 기재 등의 공지 내지 관용의 기재를 사용할 수 있고, 특별히 한정되지 않는다.Although it does not specifically limit as a base material, For example, a plastic base material, a metal base material, a ceramics base material, a semiconductor base material, a glass base material, a paper base material, a wooden base material (wood base material), a base material which is a coating surface, etc. can be used. Can be, and is not particularly limited.
도포의 방법은, 특별히 한정되지 않고 에어리스 스프레이, 에어 스프레이, 롤 코트, 바 코트, 그라비아 코트, 다이 코트 등의 공지 내지 관용의 수단을 이용하여 실시할 수 있다.The method of application is not particularly limited, and can be carried out using known or commonly used means such as airless spray, air spray, roll coat, bar coat, gravure coat, and die coat.
도막의 건조 온도라 함은, 예를 들어 30 내지 150℃가 바람직하고, 보다 바람직하게는 50 내지 120℃, 보다 바람직하게는 60 내지 100℃이다. 건조 시간은, 예를 들어 0.1 내지 10분이 바람직하고, 보다 바람직하게는 0.3 내지 5분, 보다 바람직하게는 0.5 내지 2분이다.The drying temperature of the coating film is preferably 30 to 150°C, more preferably 50 to 120°C, and more preferably 60 to 100°C, for example. The drying time is preferably 0.1 to 10 minutes, more preferably 0.3 to 5 minutes, and more preferably 0.5 to 2 minutes, for example.
실시예Example
이하에, 실시예에 기초하여 본 발명을 보다 상세하게 설명하지만, 본 발명은 이들 실시예에 의해 전혀 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited at all by these examples.
(실시예 1)(Example 1)
400중량부의 파랄로이드 A-21과, 100중량부의 아로닉스 M-402와, 750중량부의 메틸에틸케톤을 혼합하고, 60℃에서 파랄로이드 A-21이 용해될 때까지 교반을 계속하였다. 얻어진 용액에 6중량부의 IRGACURE184를 첨가하여 경화성 수지 조성물을 조제하였다.400 parts by weight of Paraloid A-21, 100 parts by weight of Aaronix M-402, and 750 parts by weight of methyl ethyl ketone were mixed, and stirring was continued at 60° C. until the paraloid A-21 was dissolved. To the obtained solution, 6 parts by weight of IRGACURE184 was added to prepare a curable resin composition.
(실시예 2 내지 5, 비교예 1)(Examples 2 to 5, Comparative Example 1)
표에 기재한 배합량으로 한 것 이외에는 실시예 1과 마찬가지로 하여 경화성 수지 조성물을 조제하였다.A curable resin composition was prepared in the same manner as in Example 1, except that the compounding amount described in the table was used.
(실시예 6 내지 10)(Examples 6 to 10)
표에 기재한 성분을 특정량 배합한 것 이외에는 실시예 1과 마찬가지로 하여 경화성 수지 조성물을 조제하였다.A curable resin composition was prepared in the same manner as in Example 1, except that the components described in the table were blended in a specific amount.
[평가 방법][Assessment Methods]
실시예 및 비교예에서 얻어진 경화성 수지 조성물을 사용하여 평가 시험용 기재를 제작하고, 하기에서 나타내는 측정 방법에 기초하여, 연필 경도, 도막 건조 후의 무점착성 평가를 행하고, 표 1에 기재하였다.The base material for evaluation test was produced using the curable resin composition obtained in Examples and Comparative Examples, and based on the measurement method shown below, pencil hardness and the non-adhesive evaluation after coating film drying were performed, and it shows in Table 1.
(연필 경도)(Pencil hardness)
실시예 및 비교예에서 얻어진 경화성 수지 조성물을, 경화 후의 도막의 두께가 10㎛가 되도록, PET제의 기재에 도포, 건조(온도: 80℃, 시간: 10분간)한 후, 자외선 조사(고압 수은등, 2kW, 라인 스피드: 6m/분, 조사 횟수: 1회, 적산 광량: 224mJ/㎠)를 행하고, 표면에 경화 도막을 갖는 시험 평가용 기재를 제작하였다. 상기 조작으로 얻어진 표면에 경화 도막을 갖는 PET제의 기재를 사용하고, 하중을 500g로 한 것 이외에는 JIS K-5600에 준하여 연필 경도를 측정하고, 이하와 같이 판단하였다.The curable resin composition obtained in Examples and Comparative Examples was applied to a PET substrate and dried (temperature: 80° C., time: 10 minutes) so that the cured coating film had a thickness of 10 μm, followed by UV irradiation (high pressure mercury lamp). , 2 kW, line speed: 6 m/min, irradiation frequency: once, accumulated light amount: 224 mJ/cm 2 ), and a substrate for test evaluation having a cured coating film on the surface was prepared. A PET base material having a cured coating film was used on the surface obtained by the above operation, and the pencil hardness was measured according to JIS K-5600, except that the load was 500 g, and judged as follows.
HB 이상: ○HB or higher: ○
HB 미만: ×Less than HB: ×
(무점착성(1)-지촉)(Tack-free (1)-touch)
실시예 및 비교예에서 얻어진 경화성 수지 조성물을, 건조 후의 도막 두께가 10㎛가 되도록, PET제의 기재에 도포하고, 내온을 80℃에서 가온한 오븐 내에 1분간 정치하고, 시험편을 제작하였다. 시험편의 도막 표면의 태크를 지촉에 의해 평가하고, 이하와 같이 판단하였다.The curable resin composition obtained in Examples and Comparative Examples was applied to a substrate made of PET so that the coating film thickness after drying was 10 µm, and the inner temperature was allowed to stand in an oven heated at 80° C. for 1 minute to prepare a test piece. The tag on the surface of the coating film of the test piece was evaluated by the touch, and judged as follows.
태크 없음: ○No tag: ○
태크 있음: ×With tag: ×
(무점착성(2)-도포면끼리의 접합)(No-adhesion (2)-bonding between coated surfaces)
실시예 및 비교예에서 얻어진 경화성 수지 조성물을, 건조 후의 도막 두께가 10㎛가 되도록, PET제의 기재에 도포하고, 내온을 80℃에서 가온한 오븐 내에 1분간 정치하고, 시험편을 제작하였다. 시험편의 도포면끼리를 맞대어 붙인 후에 박리하고, 한쪽 도막이 다른 쪽에 옮겨지는 것에 의해 생기는 도막 결손의 유무를 눈으로 보아 관찰하고, 이하와 같이 판단하였다.The curable resin composition obtained in Examples and Comparative Examples was applied to a substrate made of PET so that the coating film thickness after drying was 10 µm, and the inner temperature was allowed to stand in an oven heated at 80° C. for 1 minute to prepare a test piece. It peeled after the applied surfaces of the test piece were butted against each other, and the presence or absence of a coating film defect caused by transfer of one coating film to the other was visually observed, and judged as follows.
도막 결손 없음: ○No film defect: ○
도막 결손 있음: ×There is a film defect: ×
이하에, 실시예 및 비교예에서 사용된 성분의 상세에 대하여 설명한다.Hereinafter, details of the components used in Examples and Comparative Examples will be described.
[열가소성 수지 (A)][Thermoplastic resin (A)]
A-21: 제품명 「파랄로이드 A-21」, 아크릴계 수지(메타크릴산메틸의 단독 중합체), 중량 평균 분자량 120000, 유리 전이 온도 105℃A-21: Product name "Paraloid A-21", acrylic resin (methyl methacrylate homopolymer), weight average molecular weight 120000, glass transition temperature 105°C
[(메트)아크릴로일기를 5 이상 갖는 수지 (B)][Resin (B) having 5 or more (meth)acryloyl groups]
M-402: 제품명 「아로닉스 M-402」, 디펜타에리트리톨펜타아크릴레이트와 디펜타에리트리톨헥사아크릴레이트의 혼합물(디펜타에리트리톨펜타아크릴레이트의 비율(함유량)이 30 내지 40중량%)M-402: Product name "Aronix M-402", a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate (the ratio (content) of dipentaerythritol pentaacrylate is 30 to 40% by weight)
M-400: 제품명 「아로닉스 M-400」, 디펜타에리트리톨펜타아크릴레이트와 디펜타에리트리톨헥사아크릴레이트의 혼합물(디펜타에리트리톨펜타아크릴레이트의 비율(함유량)이 40 내지 50중량%)M-400: Product name "Aronix M-400", a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate (the ratio (content) of dipentaerythritol pentaacrylate is 40 to 50% by weight)
M-405: 제품명 「아로닉스 M-405」, 디펜타에리트리톨펜타아크릴레이트와 디펜타에리트리톨헥사아크릴레이트의 혼합물(디펜타에리트리톨펜타아크릴레이트의 비율(함유량)이 10 내지 20중량%)M-405: Product name "Aronix M-405", a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate (the ratio (content) of dipentaerythritol pentaacrylate is 10 to 20% by weight)
KRM8452: 제품명 「KRM8452」, 관능기(평균 (메트)아크릴로일기) 수가 10인 지방족 우레탄아크릴레이트KRM8452: Product name "KRM8452", aliphatic urethane acrylate having 10 functional groups (average (meth)acryloyl groups)
EB1360: 제품명 「에베크릴 1360」, 실리콘 헥사아크릴레이트(평균 (메트)아크릴로일기 수가 6)EB1360: Product name "Ebecryl 1360", silicone hexaacrylate (average number of (meth)acryloyl groups 6)
[개시제(C)][Initiator (C)]
IRG184: 제품명 「IRGACURE184」, 1-히드록시시클로헥실페닐케톤IRG184: Product name "IRGACURE184", 1-hydroxycyclohexylphenylketone
[용제 (D)][Solvent (D)]
MEK: 메틸에틸케톤, 특급, 와코 쥰야쿠 고교사제MEK: methyl ethyl ketone, limited express, manufactured by Wako Junyaku High School
이상의 정리로서, 본 발명의 구성 및 그의 베리에이션을 이하에 부기해 둔다.As the above summary, the configuration of the present invention and variations thereof are added below.
[1][One]
열가소성 수지 (A) 및 (메트)아크릴로일기를 5 이상 갖는 수지 (B)를 포함하는 경화성 수지 조성물이며,It is a curable resin composition comprising a thermoplastic resin (A) and a resin (B) having 5 or more (meth)acryloyl groups,
열가소성 수지 (A)의 함유량이, 경화성 수지 조성물의 수지분 전량에 대하여, 42중량% 이상인 것을 특징으로 하는 경화성 수지 조성물.A curable resin composition, wherein the content of the thermoplastic resin (A) is 42% by weight or more with respect to the total amount of the resin content of the curable resin composition.
[2][2]
열가소성 수지 (A)의 유리 전이 온도의 하한값이, -120℃, 60℃, 또는 100℃이고, 상한값이 200℃, 140℃, 또는 110℃인 [1]에 기재된 경화성 수지 조성물.The curable resin composition according to [1], wherein the lower limit of the glass transition temperature of the thermoplastic resin (A) is -120°C, 60°C, or 100°C, and the upper limit is 200°C, 140°C, or 110°C.
[3][3]
열가소성 수지 (A)의 중량 평균 분자량의 하한값이, 1000, 5000, 또는 10000이며, 상한값이, 250000, 140000, 또는 130000인 [1] 또는 [2]에 기재된 경화성 수지 조성물.The curable resin composition according to [1] or [2], wherein the lower limit of the weight average molecular weight of the thermoplastic resin (A) is 1000, 5000, or 10000, and the upper limit is 250000, 140000, or 130000.
[4][4]
열가소성 수지 (A)가 폴리에틸렌, 폴리프로필렌, 폴리염화비닐, 폴리스티렌, AS 수지, ABS 수지, 폴리에틸렌테레프탈레이트, 아크릴계 수지, 폴리비닐알코올, 폴리염화비닐리덴, 폴리카르보네이트 수지, 우레탄 수지 및 폴리에스테르 수지로 이루어지는 군에서 선택되는 적어도 하나인 [1] 내지 [3] 중 어느 것에 기재된 경화성 수지 조성물.Thermoplastic resin (A) is polyethylene, polypropylene, polyvinyl chloride, polystyrene, AS resin, ABS resin, polyethylene terephthalate, acrylic resin, polyvinyl alcohol, polyvinylidene chloride, polycarbonate resin, urethane resin and polyester The curable resin composition according to any one of [1] to [3], which is at least one selected from the group consisting of resins.
[5][5]
열가소성 수지 (A)가 아크릴계 수지 및/또는 폴리에스테르 수지인 [1] 내지 [4] 중 어느 것에 기재된 경화성 수지 조성물.The curable resin composition according to any one of [1] to [4], wherein the thermoplastic resin (A) is an acrylic resin and/or a polyester resin.
[6][6]
열가소성 수지 (A)가 아크릴계 수지이며, 아크릴계 수지가 모노머 단위로서 (메트)아크릴산알킬에스테르를 적어도 포함하는 [1] 내지 [5] 중 어느 것에 기재된 경화성 수지 조성물.The curable resin composition according to any one of [1] to [5], wherein the thermoplastic resin (A) is an acrylic resin, and the acrylic resin contains at least an alkyl (meth)acrylate as a monomer unit.
[7][7]
(메트)아크릴산알킬에스테르가 (메트)아크릴산메틸인 [1] 내지 [6] 중 어느 것에 기재된 경화성 수지 조성물.The curable resin composition according to any one of [1] to [6], wherein the alkyl (meth)acrylate ester is methyl (meth)acrylate.
[8][8]
경화성 수지 조성물의 수지분 전량에 대한 열가소성 수지 (A)의 함유량이, 42중량% 이상, 44 내지 95중량%, 47 내지 90중량%, 또는 48 내지 80중량%인 [1] 내지 [7] 중 어느 것에 기재된 경화성 수지 조성물.[1] to [7], wherein the content of the thermoplastic resin (A) relative to the total amount of the resin content of the curable resin composition is 42% by weight or more, 44 to 95% by weight, 47 to 90% by weight, or 48 to 80% by weight The curable resin composition according to any one.
[9][9]
경화성 수지 조성물의 불휘발분 전량에 대한 열가소성 수지 (A)의 함유량이, 42중량% 이상, 44 내지 95중량%, 47 내지 90중량%, 또는 48 내지 80중량%인 [1] 내지 [8] 중 어느 것에 기재된 경화성 수지 조성물.In [1] to [8], wherein the content of the thermoplastic resin (A) relative to the total amount of the nonvolatile matter of the curable resin composition is 42% by weight or more, 44 to 95% by weight, 47 to 90% by weight, or 48 to 80% by weight The curable resin composition according to any one.
[10][10]
(메트)아크릴로일기를 5 이상 갖는 수지 (B)가 디펜타에리트리톨펜타(메트)아크릴레이트, 디펜타에리트리톨헥사(메트)아크릴레이트, 트리펜타에리트리톨펜타(메트)아크릴레이트, 트리펜타에리트리톨헥사(메트)아크릴레이트, 트리펜타에리트리톨헵타(메트)아크릴레이트 및 트리펜타에리트리톨옥타(메트)아크릴레이트 등의 (메트)아크릴로일기를 5 이상 갖는 저분자(예를 들어, 분자량이 200 내지 800) 화합물, (메트)아크릴로일기를 5 이상 갖는 실리콘(메트)아크릴레이트, 그리고 (메트)아크릴로일기를 5 이상 갖는 우레탄(메트)아크릴레이트로 이루어지는 군에서 선택되는 적어도 하나를 포함하는 [1] 내지 [9] 중 어느 것에 기재된 경화성 수지 조성물.Resin (B) having 5 or more (meth)acryloyl groups is dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tripentaerythritol penta (meth) acrylate, tripenta Low molecular weight having 5 or more (meth)acryloyl groups such as erythritol hexa (meth) acrylate, tripentaerythritol hepta (meth) acrylate, and tripentaerythritol octa (meth) acrylate (e.g., 200 to 800) compound, a silicone (meth)acrylate having 5 or more (meth)acryloyl groups, and at least one selected from the group consisting of urethane (meth)acrylate having 5 or more (meth)acryloyl groups The curable resin composition according to any one of [1] to [9].
[11][11]
(메트)아크릴로일기를 5 이상 갖는 수지 (B)가 디펜타에리트리톨펜타(메트)아크릴레이트 및 디펜타에리트리톨헥사(메트)아크릴레이트를 포함하는 [1] 내지 [10] 중 어느 것에 기재된 경화성 수지 조성물.The resin (B) having 5 or more (meth)acryloyl groups described in any of [1] to [10] containing dipentaerythritol penta (meth) acrylate and dipentaerythritol hexa (meth) acrylate Curable resin composition.
[12][12]
(메트)아크릴로일기를 5 이상 갖는 수지 (B)로서, 디펜타에리트리톨펜타(메트)아크릴레이트 및 디펜타에리트리톨헥사(메트)아크릴레이트를 동시에 포함하는 경우, 디펜타에리트리톨펜타(메트)아크릴레이트 및 디펜타에리트리톨헥사(메트)아크릴레이트의 합계량에 대한, 디펜타에리트리톨펜타(메트)아크릴레이트의 함유량이, 1 내지 90중량%, 5 내지 80중량%, 8 내지 60중량%, 또는 10 내지 50중량%인 [1] 내지 [11] 중 어느 것에 기재된 경화성 수지 조성물.As a resin (B) having 5 or more (meth)acryloyl groups, when dipentaerythritol penta (meth) acrylate and dipentaerythritol hexa (meth) acrylate are simultaneously included, dipentaerythritol penta (meth) ) The content of dipentaerythritol penta (meth)acrylate relative to the total amount of acrylate and dipentaerythritol hexa(meth)acrylate is 1 to 90% by weight, 5 to 80% by weight, 8 to 60% by weight Or the curable resin composition in any one of [1]-[11] which is 10-50 weight%.
[13][13]
경화성 수지 조성물의 수지분 전량에 대한 (메트)아크릴로일기를 5 이상 갖는 수지 (B)의 함유량이, 58중량% 이하, 5 내지 56중량%, 10 내지 53중량%, 또는 20 내지 52중량%인 [1] 내지 [12] 중 어느 것에 기재된 경화성 수지 조성물.The content of the resin (B) having 5 or more (meth)acryloyl groups relative to the total amount of the resin content of the curable resin composition is 58% by weight or less, 5 to 56% by weight, 10 to 53% by weight, or 20 to 52% by weight The curable resin composition according to any one of phosphorus [1] to [12].
[14][14]
경화성 수지 조성물의 불휘발분 전량에 대한 (메트)아크릴로일기를 5 이상 갖는 수지 (B)의 함유량이, 58중량% 이하, 5 내지 56중량%, 10 내지 53중량%, 또는 20 내지 52중량%인 [1] 내지 [13] 중 어느 것에 기재된 경화성 수지 조성물.The content of the resin (B) having 5 or more (meth)acryloyl groups relative to the total amount of the nonvolatile matter of the curable resin composition is 58% by weight or less, 5 to 56% by weight, 10 to 53% by weight, or 20 to 52% by weight The curable resin composition according to any one of phosphorus [1] to [13].
[15][15]
경화성 수지 조성물에 있어서의, 열가소성 수지 (A) 전량에 대한 (메트)아크릴로일기를 5 이상 갖는 수지 (B)의 함유량이, 45 내지 90중량%, 50 내지 80중량%, 또는 55 내지 75중량%인 [1] 내지 [14] 중 어느 것에 기재된 경화성 수지 조성물.The content of the resin (B) having 5 or more (meth)acryloyl groups relative to the total amount of the thermoplastic resin (A) in the curable resin composition is 45 to 90% by weight, 50 to 80% by weight, or 55 to 75% by weight The curable resin composition in any one of [1] to [14] which is %.
[16][16]
경화성 수지 조성물의 수지분 전량에 대한 광중합 개시제(C)의 함유량이, 0.01 내지 10중량%, 0.1 내지 8중량%, 또는 0.5 내지 5중량%인 [1] 내지 [15] 중 어느 것에 기재된 경화성 수지 조성물.The curable resin according to any one of [1] to [15], wherein the content of the photopolymerization initiator (C) relative to the total amount of the resin content of the curable resin composition is 0.01 to 10% by weight, 0.1 to 8% by weight, or 0.5 to 5% by weight. Composition.
[17][17]
코트제로서 사용된 [1] 내지 [16] 중 어느 것에 기재된 경화성 수지 조성물.The curable resin composition according to any one of [1] to [16] used as a coating agent.
[18][18]
[1] 내지 [17] 중 어느 것에 기재된 경화성 수지 조성물의 경화물.A cured product of the curable resin composition according to any one of [1] to [17].
[19][19]
[18]에 기재된 경화물인 코트층.A coating layer which is a cured product according to [18].
본 발명의 경화성 수지 조성물은 얻어지는 경화물이, 양호한 내마모성 및 내찰상성, 그리고 높은 표면 경도를 가질뿐만 아니라, 도막 건조 후의 점착성이 낮다. 또한, 상기 경화성 수지 조성물의 경화물은, 양호한 내마모성 및 내찰상성, 그리고 높은 표면 경도를 갖는다.In the curable resin composition of the present invention, the obtained cured product not only has good abrasion resistance and scratch resistance, and high surface hardness, but also has low adhesion after drying the coating film. Further, the cured product of the curable resin composition has good abrasion resistance and scratch resistance, and high surface hardness.
Claims (9)
열가소성 수지 (A)의 함유량이, 경화성 수지 조성물의 수지분 전량에 대하여, 42중량% 이상인 것을 특징으로 하는 경화성 수지 조성물.It is a curable resin composition comprising a thermoplastic resin (A) and a resin (B) having 5 or more (meth)acryloyl groups,
The content of the thermoplastic resin (A) is 42% by weight or more with respect to the total amount of the resin content of the curable resin composition.
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