KR20200136786A - Apparatus for monitoring the deterioration of electrolytic gold deposit amount - Google Patents

Abstract

An objective of the present invention is to provide a method for monitoring the deterioration of an electrolytic gold plating solution and an apparatus for monitoring the deterioration of the electrolytic gold plating solution, in which a deteriorated state of a gold sulfite deposit plating solution is continuously detected, thereby enabling gold-plating to be always stably performed. The present invention provides an electrolytic gold plating method for performing electrolytic gold plating on the surface of a substrate body by using a gold sulfite plating solution, wherein gold plating is performed while the deterioration of a plating solution is constantly or intermittently detected during plating. In addition, the present invention provides an electrolytic gold plating device for performing electrolytic gold plating on the surface of a substrate body by using a gold sulfite plating solution, wherein the device comprises a detection means for constantly or intermittently detecting the deterioration of the plating solution and a monitoring unit for displaying the degree of the deterioration.

Description

Device for monitoring the deterioration of electrolytic gold deposit amount

The present invention relates to a novel electrolytic gold plating method in which the degree of deterioration of a gold plating solution of a sulfite complex is measured and monitored, and an apparatus for the electrolytic gold plating method.

As a conventional electrolytic gold plating method, a gold cyanide plating method is known in which a gold cyanide complex is used as a main component of a plating solution. Since the cyanide gold plating solution is very stable, abnormal deposition of metallic gold does not occur. However, since cyanide compounds have strong toxicity and thus have environmental problems, a non-cyanide plating method has been developed and has been actually used.

In recent years, gold sulfite plating solutions having a main component of gold sulfite complexes have been increasingly widely used. As described above, since the gold sulfite plating solution has no toxicity and environmental influences are sufficiently considered, pollution-free electrolytic gold plating has become possible. However, even if the environmental influence of the gold sulfite plating solution is sufficiently considered, the stability of the solution is not sufficient, and therefore abnormal deposition of metal gold is liable to occur during use. The reason lies in the instability of the sulfite complex. That is, the stability of the gold sulfite complex is very small compared to the stability of the gold cyanide complex. The gold sulfite complex deteriorates and decomposes to form monovalent free gold ions, and the gold ions form metallic gold through disproportionation reaction. The metal gold is in the form of very small particles in the initial state, but the gold particles grow by condensation of the particles. Thereafter, metal gold is abnormally deposited on the surface of the components of the apparatus inside the plating bath, irrespective of current-carrying. This phenomenon causes a problem that makes normal gold plating impossible. The gold plating amount using a sulfurous acid gold complex is disclosed in Japanese Unexamined Patent Publication No. 9-59792, Japanese Unexamined Patent Publication No. 10-251887, and Japanese Unexamined Patent Publication No. 11-61480.

When the above-described abnormal gold deposition occurs, the solution must be discharged from the plating apparatus to clean the interior of the apparatus. However, gold is a very stable metal and therefore cannot be dissolved and removed using solvents such as ordinary acids.

Therefore, the plating apparatus must be cleaned to return to its initial state. Hence, this requires a lot of time and money and is extremely uneconomical.

Further, in the above-described publication, when gold plating is performed using the above solution, there is no description of deterioration of the gold sulfite complex plating solution.

It is an object of the present invention to always stably perform electrolytic gold plating, and to prevent the impossibility of performing electrolytic gold plating by continuously or intermittently detecting the deterioration state of the sulfite complex plating solution while gold plating is performed using a sulfite complex plating solution. It is to provide an electrolytic gold plating method and an electrolytic gold plating device capable of being performed.

The present invention is characterized by an electrolytic gold plating method in which electrolytic gold plating is performed on the surface of a substrate body using a gold sulfite plating solution, the method comprising detecting the degree of deterioration of the plating solution and performing the plating. It is preferable that the detection of the degree of deterioration of the plating solution is always or intermittently performed before starting or during plating.

With regard to the detection of the degree of deterioration, after irradiating the plating solution with light, it is preferable to measure the luminous intensity at a specific absorption wavelength, preferably at a specific absorption wavelength of 310 nm. It is preferable to perform at least one of the detection of the amount of colloidal gold formed in the plating solution, the measurement of the pH of the plating solution, the measurement of the sulfurous acid concentration of the gold sulfite complex in the plating solution, and the measurement of the concentration of sulfuric acid in the plating solution.

1) By adjusting the object to be plated and setting it vertically, the effect of the remaining air bubbles on the plated surface and the effect of separating the black film from the anode plate are suppressed, so that a high-quality plated film surface can be formed. have.

2) Since the plating process adjusting mechanism can be disposed between the object to be plated and the positive electrode plate arranged vertically opposite the object to be plated, the plated film thickness distribution can be easily controlled.

3) By adopting a structure in which the object to be plated is pressed and pushed against the opening on the side of the plating bath using the substrate stage, the holder for holding the object to be plated used in the conventional dip method device can be removed. Thus, design for the purpose of a fully automatic plating apparatus can be easily performed.

4) By making an opening provided in the side plate of the plating bath and the plated object vacuum holding part of the detachable substrate stage, the plating process of plural kinds of semiconductor substrates (to be plated) having different diameters can be performed by a single plating apparatus. .

5) Since the plating bath and the substrate stage are paired with one unit, an expandable fully automatic plating apparatus can be provided.

FIG. 1 is a graph showing the change in absorbance of a specific absorption wavelength with respect to the plating duration of an gold sulfite complex plating solution with time;
2 is a graph showing the change of sulfurous acid concentration over time for air oxidation of a gold sulfite complex plating solution
3 is a block diagram showing a detail of the vertical holder type electrolytic gold plating apparatus according to the present invention,
4 is a cross-sectional view showing an embodiment of a plating apparatus according to the present invention,
5 is a detailed view showing a circular opening of the plating bath.

The present invention measures at least one of the addition of the plating solution, the adjustment of the pH, the adjustment of the sulfurous acid concentration and the amount of colloidal gold in the plating solution, the pH value of the plating solution, the sulfurous acid concentration of the gold sulfite complex in the plating solution, and the sulfuric acid concentration in the plating solution. Characterized by an electrolytic gold plating method comprising the step of performing at least one of adjustment of sulfuric acid based on the obtained value.

The present invention is characterized by an electrolytic gold plating apparatus for performing electrolytic gold plating on the surface of a substrate body using a gold sulfite plating solution, wherein the apparatus comprises a detection means for detecting the degree of deterioration of the plating solution, and the degree of deterioration It is characterized by an electrolytic gold plating device comprising a monitoring unit that displays. It is preferable that the detection of the degree of deterioration of the plating solution is always or intermittently performed before starting or during plating.

Including at least one of a means for irradiating the plating solution with light and measuring the light intensity after the irradiation, a means for measuring the pH of the plating solution, a means for measuring the sulfurous acid of the sulfite metal complex in the plating solution, and a means for measuring sulfuric acid in the plating solution. desirable.

The means for measuring the light intensity is an absorbance photometer, the means for measuring the pH is a pH meter using a glass electrode, and the means for measuring the sulfurous acid in the complex is an automatic titrator or a liquid chromatograph. It is preferable to be.

That is, the inventors of the present invention conducted a detailed study on the gold sulfite plating solution, and found that the absorption characteristics of the plating solution, the pH of the plating solution, the concentration of sulfurous acid in the plating solution, and the concentration of sulfuric acid changed as the solution deteriorated. As the solution deteriorates, the absorption strength of a specific wavelength of the plating solution increases, the pH and the concentration of sulfurous acid in the complex decrease, and the concentration of sulfuric acid increases. Therefore, they are detected to be used as the degree of deterioration of the plating liquid.

In addition, the present invention makes it possible to stably perform gold plating by detecting and analyzing one or more types of combinations of the above-described factors so as to monitor the deterioration state of the gold sulfite plating solution. It is desirable that abnormal accumulation of gold is predicted and an alarm is output.

Further, the present invention is an automatic addition solution supply unit for adding a plating solution based on a value obtained by measuring at least one of the amount of gold colloids in the plating solution, the pH value of the plating solution, the sulfite concentration of the gold sulfite complex in the plating solution, and the sulfuric acid concentration of the plating solution. It is characterized by an electrolytic gold plating apparatus comprising an automatic pH adjustment unit for adjusting the pH and an automatic water supply unit for supplying water for the evaporated water.

The present invention is effective in electrolytic gold plating for forming lead terminals and wires used in semiconductor devices.

(Example 1)

A commercially available gold sulfite plating solution was used as the gold plating solution, and a plating apparatus to be described later was used as the electrolytic gold plating device. As the substrate body to be plated, a 6-inch Si wafer with an Au solid film formed by sputtering on the surface was used, and for gold plating, air was introduced into the solution under the conditions of a liquid temperature of 65°C and a current density of 10mA/cm 2. It was done while being blown and stirred. During plating, the plating solution was sampled at an arbitrary time five times, and the light absorption spectrum was measured.

1 is a graph showing the relationship between absorbance and wavelength. Line ① shows the absorption spectrum of the new gold sulfite plating solution, and lines ②, ③, ④, ⑤ show the absorption spectrum of the gold plating time in order. As the gold plating continued, the absorption strength of the specific absorption wavelength of 310 nm shown in the figure increased, and abnormal deposition of gold was observed after the plating time elapsed a predetermined time.

From these results, it was found that the deterioration of the gold plating solution can be detected by measuring the absorption intensity of the specific absorption wavelength.

(Example 2)

The deterioration of the gold sulfite plating solution due to oxidation was measured by blowing air into the solution under the condition of a liquid temperature of 65° C. using a commercially available gold sulfite plating solution as the gold plating solution. Sulfuric acid is a substance that is unstable to oxidation, and the gold sulfite complex is also decomposed while being oxidized according to the equation (1).

Scheme 1

Au(SO ₃ ) ₂ ^3- + O ₂ → Au(I) + 2SO ₄ ^2-

As a result, monovalent gold is produced. In addition, the monovalent gold ions become non-ionized gold and trivalent gold through the disproportionation reaction shown in Scheme (2).

Scheme 2

3Au(I) → 2Au(0) + Au(III)

The resulting non-ionized gold is a metallic gold that causes abnormal deposition. Therefore, taking into account the change in the amount of sulfurous acid due to oxidation indicated in Reaction Formula (1), the inventors of the present invention sampled the plating solution at an arbitrary time while blowing air into the gold plating solution, and measured the concentration of sulfurous acid from the sample.

2 is a graph showing the change in the concentration of sulfurous acid over time. Here, total sulfurous acid is the concentration of sulfurous acid measured through iodine titration, free sulfurous acid is the concentration of sulfurous acid measured by ion exclusion liquid chromatography using a cation exchange resin, and the sulfurous acid of the complex is the free sulfurous acid in the total sulfurous acid. It is calculated by subtracting. It can be seen that the concentration of total sulfurous acid and free sulfurous acid decreases over time. In addition, the concentration of sulfurous acid in the complex also decreases within a certain range in proportion to the decrease of total sulfurous acid. It is clear from the above results that the degree of deterioration of the gold plating solution can be detected by measuring the concentration of total sulfurous acid or the concentration of free sulfurous acid in the plating solution.

(Example 3)

3 is a block diagram showing a detail of a vertical holder type electrolytic gold plating apparatus having a monitoring unit according to the present invention. The plating solution is introduced from the plating bath 1 into the absorbance photometer 3 through the sampling tube 2. In the apparatus, in order to prevent the plating solution from directly contacting the pump, the inside of the tank 5 is brought into a negative pressure state through the tube 6 by the start of the vacuum pump 7 and from the plating bath 1 It has a structure capable of inhaling a solution transferred into the absorbance photometer (3). The absorbance photometer 3 is a device for measuring the absorption intensity of the plating solution at a specific absorption wavelength of 310 nm, and the degree of deterioration of the plating solution is measured by inputting data to the control personal computer 8. One of the results is shown in Example 1.

In addition, in parallel to the above, a certain amount of the plating solution is sampled from the plating bath 1 through the sampling tube 9 using a pipette 10, and transferred to the automatic titrator 12 through the sampling tube 11. Is transported. The automatic titrator 12 receives the sampled plating solution, and then the iodine solution is pipetted to the automatic titrator 12 by the pipette 13 through the tube 14, and the acetate-sodium acetate buffer The solution is also pipetted to the automatic titrator 12 by the pipetter 15 through the tube 16. Thereafter, the automatic titrator 12 starts measuring the concentration of sulfurous acid in the gold plating solution, and after completion of the measurement, data is input to the control personal computer 8 to measure the degree of deterioration of the gold plating solution. The measured solution is discharged to the tank 5 through the tube 17 by the start of the vacuum pump 7 and makes the inside of the tank 5 into a negative pressure state through the tube 6. Waste liquid and the like stored in the tank 5 are discharged to the drainage tank 19 through the pipe 18 after the vacuum state of the tank 5 is broken. The method of measuring the concentration of sulfurous acid through iodine titration of the automatic titrator 12 is carried out in accordance with JIS K0101.

Further, in parallel with the above, the pH of the gold plating solution is measured by using the pH meter 21 by inserting the glass electrode for pH measurement into the gold plating solution of the gold plating bath 1. The measured value is inputted to the control personal computer 8 to measure the degree of deterioration of the plating solution.

Although the measurement of the degree of deterioration can be performed by one of the above-described analysis means for the gold plating solution, the degree of deterioration of the gold plating solution can be detected more precisely by combining the above means.

The above-described plating apparatus vacuum-holds an opening plated object disposed on a side surface of the plating bath, and the plating is in a state that closes the opening of the plated object vertically arranged opposite the anode. And a substrate stage detachably attached to the bath and a pushing unit for pushing and releasing the substrate stage to and from the opening, wherein the object to be plated is in contact with the plating solution in the plating bath. It characterized in that it is located in.

According to the present embodiment, by cross-monitoring the solution deterioration due to oxidation of the sulfurous acid complex and the deposition of gold due to the disproportionation reaction of gold ions, high precision deterioration monitoring can be performed. Further, the time to replace the plating solution can be appropriately determined by the monitoring. Further, since cleaning of the device due to abnormal deposition can be excluded, the usefulness of the plating device can be improved. Also, by measuring the accumulated current value and the concentration of gold, the timing of supplying water can be appropriately set.

In addition, the plating apparatus of the present invention includes a plating liquid storage tank connected to the plating bath so that the plating apparatus holds the plating liquid in the plating bath, and the liquid level of the plating liquid reaches a position higher than the upper end of the above-described opening. The plating apparatus has a sufficient capacity to fill the plating bath, and the plating apparatus includes a plating solution stirring mechanism disposed at a position near the opening of the plating bath, and the above-described opening is formed on the detachable side plate constituting the plating bath, and the pressing unit is a substrate The stage can be rotated and moved, and the substrate stage is detachable from the stage body, and the plated water vacuum holding part for vacuum holding the object to be plated is mounted on the stage body and is detachable from the stage body. Has a substrate stage pushing power portion, and a spherical bearing is disposed in the substrate stage pushing power portion, and the spherical bearing is a seal portion of the substrate stage with respect to the opening when the substrate stage is pushed against the opening. It rotates and adheres closely, and has a structure that is fixed when the object to be plated is held on the substrate stage.

4 is a cross-sectional view showing a plating apparatus used in the above-described embodiment. The plating apparatus includes a plating bath 31 and a substrate stage 32. The plating bath 31 is molded in a box shape, made of resin, and has a circular opening 33 at its side. Further, the plating bath 31 has a partition plate 48 therein, and the plating bath is divided into two sections. The plating liquid drainage pipe 49 is connected to one of the rooms 42 and 43, and the plating liquid inlet pipe 46 is connected to the other one of the rooms. When the circular opening 33 is closed by the substrate 34, the room 43 is filled with the plating solution 47 so that the plating solution overflows the partition plate 48. The plating apparatus includes a unit for measuring deterioration of the plating solution and the personal computer 8 for control shown in Fig. 3, but is not shown in this figure.

The cathode electrode 45 is disposed at a position near the opening 44 of the circular opening 33. In addition, the plating bath 31 is provided with a plating liquid stirrer 40 including a plating liquid stirring member disposed between the substrate 34 and the positive electrode plate 25. By arranging such a plating control mechanism, it becomes easy to control the thickness distribution of the plating film.

The substrate stage 32 is formed by combining a substrate table 35 having a vacuum holding mechanism for a substrate 34 and a body portion 36 and a rotation shaft 37 as a stage body, and the rotation shaft 37 It is rotatably supported by a bearing 39 included in the bracket 38, and rotates the substrate stage 32 from a horizontal position to a vertical position through a power transmission belt 50 using a motor 51. Reverse operation is also possible. The bracket 38 is disposed on the rail 52 and is moved by the motor 53 through a ball screw 54. The substrate table 35 is pushed against the circular opening using the substrate stage pushing power portion in order to close the opening 44, as described later.

The circular opening 33 is detachably attached to the side plate of the plating bath 31. Since the circular opening 33 of the plating bath 31 and the substrate table 35 as a vacuum holding part of the plated object of the substrate stage 34 are detachable from the plating bath, a plurality of types of semiconductor substrates having different diameters Plated) can be plated using a single device.

The plating bath 31 and the substrate stage 34 are paired into one unit. Accordingly, the arrangement and structure can be changed in response to the plating process, and accordingly, an expandable fully automatic plating apparatus can be provided. After the semiconductor substrate (substrate to be plated) is completely automatically removed from the cassette, it is possible to finally return to the cassette after completing a series of plating processes.

After placing the object to be plated horizontally outside the plating bath 31 and vacuum holding the object to be plated, rotating the vacuum holding object to be set vertically to the opening provided on the side of the plating bath, Plating is performed by injecting.

The plating is performed by bringing one side of the object into contact with a plating solution to plate, and vacuum holding the other side in an atmospheric environment outside the plating bath. The object to be plated is held in the cassette under the atmospheric environment, set horizontally under the atmospheric environment, and rotated and moved under the atmospheric environment.

In the plating, the semiconductor substrate is removed from the substrate cassette under an atmospheric environment, the semiconductor substrate is placed horizontally, and the substrate stage is rotated and moved under the atmospheric environment, so that the semiconductor substrate is placed opposite the positive electrode plate vertically disposed inside the plating bath. It is set vertically and is performed by making one side of the semiconductor substrate in contact with the plating solution.

5 is a detailed view showing the circular opening 33 of the plating bath 31. The circular opening 33 on the side of the plating bath 31 is a cathode electrode 45 for energization from the plating power supply 23 and a seal mechanism for sealing between the substrate 34 and the plating bath 31. mechanism 57). In addition, the circular opening 33 has a tapered guide portion 58 that suppresses displacement when the substrate table 35 is pushed to the circular portion, and a waste liquid port that collects a small amount of plating liquid leaking out to one place. (59) is also provided.

Further, since the circular opening 33 is provided with a packing 60 and is fixed to the plating bath 31 with a bolt 61, the negative electrode 45 and the sealing mechanism 57 are provided with a circular opening 33 It can be easily exchanged with a scheduled exchanging by removing. In addition, by replacing only the circular opening 33 without replacing the main body of the plating bath 31, the plating apparatus can cope with the processing of substrates having various diameters. This plating apparatus has the following effects.

1) By adjusting the object to be plated and setting it vertically, the effect of the remaining air bubbles on the plated surface and the effect of separating the black film from the anode plate are suppressed, so that a high-quality plated film surface can be formed. have.

2) Since the plating process adjusting mechanism can be disposed between the object to be plated and the positive electrode plate arranged vertically opposite the object to be plated, the plated film thickness distribution can be easily controlled.

3) By adopting a structure in which the object to be plated is pressed and pushed against the opening on the side of the plating bath using the substrate stage, the holder for holding the object to be plated used in the conventional dip method device can be removed. Thus, design for the purpose of a fully automatic plating apparatus can be easily performed.

4) By making an opening provided in the side plate of the plating bath and a vacuum holding part of the plated object of the detachable substrate stage,

A plating process of a plurality of types of semiconductor substrates (to be plated) having a single plating apparatus may be performed.

5) Since the plating bath and the substrate stage are paired with one unit, an expandable fully automatic plating apparatus can be provided.

The above effects are finalized after the semiconductor substrate (substrate to be plated) is completely automatically removed from the cassette, and after a series of plating processes are completed.

Since it can be returned to the above cassette, it is possible to improve the throughput of plating work, ease of connection to the plating process before and after, plating

The effect is great from the viewpoint of improving the quality of the membrane and the space saving of installation.

This embodiment can be similarly applied to a vertical holder type plating apparatus.

In this embodiment, a uniform film can be formed in electrolytic gold plating to form lead terminals and wires used in semiconductor devices.

In addition, it is possible to form a plated film in which each plated film is not non-uniform in forming a continuous plated film.

(Example 4)

In addition to Example 3, this example is an automatic titrator that measures the concentration of at least one of sulfurous acid or sulfuric acid in the plating solution, a pH meter that measures the pH of the plating solution, with an absorbance photometer that measures the light intensity after the irradiation. Alternatively, a concentration measuring unit composed of a liquid chromatograph is used to measure at least one of the amount of colloidal gold in the plating solution, the pH value of the plating solution, the sulfite concentration of the gold sulfite complex in the plating solution, and the sulfuric acid concentration in the plating solution. It characterized in that it further comprises an automatic supplementary solution supply unit for adding a plating solution based on the value obtained by doing so, an automatic pH adjustment unit for adjusting pH, and an automatic water supply unit for supplying water for the evaporated water.

In this embodiment, a uniform film may be formed in electrolytic gold plating for forming lead terminals and wires used in semiconductor devices, and a plated film in which each plated film is not non-uniform for a long time can be formed in continuous plating film formation.

According to the present invention, since the deterioration state of the gold sulfite complex plating solution is continuously or intermittently detected during gold plating, it is possible to stably perform gold plating and prevent the inability to perform electrolytic gold plating.

Claims (16)

An electrolytic gold plating method in which electrolytic gold plating is performed on the surface of a substrate body using a gold sulfite plating solution, comprising the step of detecting a degree of deterioration of the plating solution and performing the plating. Gold plating method. An electrolytic gold plating method for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, comprising: irradiating the plating solution with light, measuring a light intensity after the irradiation, and performing the plating Electrolytic gold plating method. An electrolytic gold plating method for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, comprising the steps of measuring a pH of the plating solution and performing the plating. An electrolytic gold plating method in which electrolytic gold plating is performed on a surface of a substrate body using a gold sulfite plating solution, comprising the step of measuring the sulfurous acid of a sulfite complex in the plating solution and performing the plating. Way. An electrolytic gold plating method for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, comprising the steps of measuring sulfuric acid in the plating solution and performing the plating. In the electrolytic gold plating method of performing electrolytic gold plating on the surface of a substrate body using a gold sulfite plating solution, the amount of gold colloids in the plating solution, the pH value of the plating solution, the sulfite concentration of the sulfite gold complex in the plating solution, and sulfuric acid in the plating solution Measuring at least one of the concentrations, calculating a degree of deterioration of the plating solution based on the measured value, and performing the plating based on the degree of deterioration. The method according to any one of claims 1 to 6, wherein the plating solution is added, the pH is adjusted, the sulfurous acid concentration is adjusted, and the amount of colloidal gold in the plating solution, the pH value of the plating solution, the
And performing at least one of adjustment of sulfuric acid based on a value obtained by measuring at least one of the sulfurous acid concentration of the gold sulfite complex in the plating solution and the sulfuric acid concentration in the plating solution. An electrolytic gold plating apparatus for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, comprising: detecting means for detecting a degree of deterioration of the plating solution. An electrolytic gold plating apparatus for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, comprising: a means for irradiating the plating solution with light and measuring light intensity after the irradiation; a means for measuring the pH of the plating solution; and the plating solution An electrolytic gold plating apparatus comprising at least one of a means for measuring sulfurous acid in the gold sulfite complex and means for measuring sulfuric acid in the plating solution. The electrolytic gold plating apparatus according to claim 9, wherein the means for measuring the light intensity is an absorbance photometer. The electrolytic gold plating apparatus according to claim 9 or 10, wherein the means for measuring the pH is a pH meter using a glass electrode. The electrolytic gold plating apparatus according to any one of claims 9 to 11, wherein the means for measuring the sulfurous acid or sulfuric acid in the complex is an automatic titrator or a liquid chromatograph. A value measured by at least one of the means for measuring light intensity, the means for measuring the pH, the means for measuring sulfurous acid, and the means for measuring sulfuric acid. Electrolytic gold plating apparatus comprising a monitoring unit for displaying. In an electrolytic gold plating apparatus for performing electrolytic gold plating on a surface of a substrate body in a gold plating bath containing a gold sulfite plating solution, the plating solution is irradiated with light, and an absorbance photometer that measures light intensity after the irradiation, and the pH of the plating solution A pH meter to measure, an automatic titrator to measure the concentration of at least one of sulfurous acid or sulfuric acid in the plating solution, or a concentration measuring unit composed of a liquid chromatograph, the absorbance photometer, the pH meter, and the concentration measuring unit separately in the gold plating bath. And a personal computer that displays the quality of the plating solution based on a value measured by at least one of the absorbance photometer, the pH meter, and the concentration measuring unit, and a tube for connecting and passing the plating solution. Electrolytic gold plating device. The plating according to any one of claims 8 to 14, wherein the amount of colloidal gold in the plating solution, the pH value of the plating solution, the concentration of sulfurous acid in the gold sulfite complex of the plating solution, and the plating
An automatic addition solution supply unit that adds the plating solution based on a value obtained by measuring at least one of the sulfuric acid concentration of the solution, an automatic pH adjustment unit that adjusts the pH, and an automatic water supply unit that supplies water for the evaporated water. Electrolytic gold plating apparatus comprising a. The method according to any one of claims 8 to 15, wherein an anode disposed vertically, an object to be plated disposed opposite to the anode, and an opening of the plating bath disposed on a side of the plating bath, and the object to be plated are vacuumed. -Comprising a substrate stage detachably attached to the plating bath while holding and blocking the opening, and a pushing unit for pushing and releasing the substrate stage to and from the opening
Electrolytic gold plating device, characterized in that.

Images