KR20200125124A - Substrate Side Deposition Apparatus Improved Deposition Adhesive Force - Google Patents

Abstract

The present invention relates to a substrate deposition apparatus and, more specifically, to a substrate side deposition apparatus with improved deposition adhesive force which comprises a substrate mounting drum to mount at least one substrate to allow a substrate side to protrude from the circumferential surface, at least one source target to deposit a wire on the substrate side, and an ion beam processing module to perform ion beam processing on the substrate side, wherein the ion beam processing module is configured to modify the surface of a connection terminal layer formed on the substrate side and remove a terminal protection layer on the connection terminal layer to improve the deposition adhesive force to the substrate and minimize time, effort, and costs for processing the substrate. The substrate side deposition apparatus with improved deposition adhesive force comprises: a substrate mounting drum which is rotatably arranged in a chamber, and allows at least one substrate to be inserted and mounted from the circumferential surface to the center; at least one source target to deposit a wire on the substrate side exposed by protruding from the circumferential surface of the substrate mounting drum; and an ion beam processing module to perform ion beam processing on the substrate side, remove a terminal protection layer formed to protect a connection terminal layer provided on the substrate side, and process surface modification of the connection terminal layer.

Description

Substrate Side Deposition Apparatus Improved Deposition Adhesive Force}

The present invention relates to a substrate deposition apparatus, and in particular, a substrate mounting drum for mounting at least one substrate such that a side surface of the substrate protrudes from a peripheral surface, at least one source target for depositing a wire on the side surface of the substrate, and an ion beam for the side surface of the substrate. Including an ion beam processing module to perform the treatment, wherein the ion beam processing module is configured to remove the terminal protective layer on the connection terminal layer as well as surface modification of the connection terminal layer formed on the side surface of the substrate, thereby depositing adhesion to the substrate The present invention relates to an apparatus for depositing a side surface of a substrate with improved deposition adhesion, which can minimize time, effort, and cost for processing a substrate while improving

Circuit wiring for connection between devices or for supplying power and transmitting and receiving electric signals is formed on a substrate on which various semiconductors and electronic devices are mounted. Various wiring formation methods may be applied to the wiring formed on such a substrate.

Recently, silk printing technology has been applied to form the wiring of the substrate. That is, a method of forming a wiring line on a substrate using such a silk printing technique is a method of forming wiring having high conductivity by applying a silver paste to a substrate using a silk printing technique.

However, such a conventional method of wiring a substrate using a silk printing technique has a disadvantage in that the electrical characteristics may be non-uniform when implementing a circuit due to the high resistance of the wiring and the external influence of the material to be coated and low uniformity during application. In addition, when the wet process is applied as described above, there is a disadvantage that contamination by impurities may affect the physical and electrical properties of the final product.

Meanwhile, interest in a technology for forming a bezel-free substrate for realizing a large-area and clear display is increasing. In order to provide a substrate without the bezel, a technique of implementing wiring on the side of the substrate is required.

Regarding the technology of providing the bezel-free substrate, Korean Patent Registration No. 10-1613773 (hereinafter referred to as "prior technical document 1") refers to a Tx electrode pattern and a metal wire connected to the Rx electrode pattern on the side of the display device. And a touch panel capable of reducing a width of a bezel and increasing an active area by extending and connecting to the rear surface.

However, the prior art document merely discloses a panel in which the width of the bezel is reduced by simply forming wiring to the side of the substrate, and does not suggest a specific device and method for forming a wiring to the side of the substrate corresponding to the side of the substrate. I can't.

In addition, conventional evaporation apparatuses have not been able to propose an apparatus and method for forming wiring to the side of the substrate by evaporation. Also, the circuit pattern provided on the side of the substrate, that is, for the connection terminal layer, before the deposition process is performed. There is no suggestion of an apparatus and method for surface modification, and furthermore, an apparatus and method for removing a terminal protective layer formed to protect the connection terminal layer.

In addition, furthermore, the prior art document does not propose at all for a specific device for forming a wiring on the side of a substrate having low resistance and excellent electrical properties.

In addition, when the existing in-line sputtering evaporation apparatus is applied to deposit the wiring on the side of the substrate, the length of the equipment is very long, it is necessary to configure each source target toward both sides of the substrate, and the deposition angle of the source target is adjustable Because it has to be, there is a disadvantage that the time, effort, and cost for the entire facility configuration are increased.

Prior Art Document 1: Republic of Korea Patent Registration No. 10-1613773 (announcement date: April 19, 2016, title of invention: touch panel and its manufacturing method)

The present invention was devised to solve the problems of the prior art as described above. And an ion beam processing module for performing ion beam processing on the side surface of the substrate, wherein the ion beam processing module is configured to remove a terminal protective layer on the connection terminal layer as well as surface modification of the connection terminal layer formed on the side surface of the substrate. By doing so, it is an object of the present invention to provide an apparatus for depositing a side surface of a substrate with improved deposition adhesion, which can minimize time, effort, and cost for substrate treatment while improving deposition adhesion to a substrate.

In addition, the present invention further comprises a substrate heating module capable of improving the film quality of the substrate thin film and a plasma processing module capable of removing the terminal protective layer as well as surface modification of the connection terminal layer on the substrate. It is an object of the present invention to provide an apparatus for depositing a side surface of a substrate with improved deposition adhesion, which can further improve the removal efficiency of the terminal protective layer and further improve the deposition adhesion to the connection terminal layer.

In addition, the present invention includes a substrate mounting drum for mounting at least one substrate so as to protrude from the circumferential surface of the substrate, at least one source target for depositing wiring on the side surface of the substrate, and a shield for partitioning the sputtered portion of the source target. However, by providing a shield cooling line for cooling the source target in the shield, the deposition adhesion is improved to prevent damage to the source target by improving the cooling efficiency of the source target. Its purpose is to provide a device.

In addition, the present invention adopts and applies the shield cooling line as a modularized shield cooling line manufactured in advance corresponding to the shield, thereby minimizing the time, effort, and cost for constructing a shield with a shield cooling line. It is an object of the present invention to provide an apparatus for depositing a side surface of a substrate having improved adhesion.

In addition, the present invention is to improve the cooling efficiency of the source target in a state where cooling loss can be minimized by attaching and disposing the modularized shield cooling line to the inner surface of the shield that can face the source target. It is an object of the present invention to provide an apparatus for depositing a side surface of a substrate with improved adhesion to the deposition.

In addition, in the present invention, at least one substrate is mounted on the substrate mounting drum so that the side surface of the substrate faces the source target, and each of the substrates is cooled by at least one cooling block disposed inside the substrate mounting drum. Accordingly, it is an object of the present invention to provide an apparatus for depositing a side surface portion of a substrate with improved deposition adhesion, which can improve cooling efficiency for a substrate while minimizing cooling loss.

In addition, the present invention allows the substrate to be mounted on the cooling block, and furthermore, the substrate is mounted on the cooling block by fixing and mounting the substrate mounting jig so that the substrate is in surface contact with the substrate mounting jig. It is an object of the present invention to provide an apparatus for depositing a side surface of a substrate with improved deposition adhesion, which can stably and firmly mount the mounted substrate mounting jig and further improve cooling efficiency for the substrate.

In addition, the present invention is configured to be mounted with a close contact spring interposed between the edge portion of the mounting plate and the bracket, so that the mounting plate can be elastically supported by the bracket, thereby mounting the substrate on which the substrate is mounted It is an object of the present invention to provide a substrate side deposition apparatus having improved deposition adhesion to enable a jig to be fixedly mounted more stably and steadily, and furthermore, to allow the substrate mounting jig on which the substrate is mounted to be easily detached.

In addition, the present invention mounts at least one substrate on the substrate mounting drum so that the side surface of the substrate faces the source target, and by configuring the substrate mounting drum to be rotated, uniform and improved three-dimensional deposition on the side surface of the substrate is performed. It is an object of the present invention to provide an apparatus for depositing a side surface of a substrate with improved deposition adhesion that enables it.

In addition, the present invention comprises a plurality of source targets, all of which are composed of the same metal target or different metal targets, thereby reducing time, effort, and cost for manufacturing a substrate and a display device including the substrate. It is an object of the present invention to provide an apparatus for depositing a side surface of a substrate with improved deposition adhesion, which can improve manufacturing efficiency.

In addition, the present invention includes a target shutter that covers the surface of another source target adjacent to the source target currently performing sputtering when a plurality of source targets are composed of different metal targets, thereby sputtering the adjacent source target. To provide a substrate side deposition apparatus with improved deposition adhesion that prevents contamination of adjacent source targets by blocking the deposition of the metal of the source target performing the process, and thereby improves the wiring deposition quality and efficiency of the substrate. For that purpose.

In addition, the present invention is configured so that the upper circuit pattern and the lower circuit pattern of the substrate can be electrically connected through wiring formed through deposition on the side surface of the substrate, thereby eliminating the bezel. It is an object of the present invention to provide a deposition apparatus on a side surface of a substrate with improved deposition adhesion that enables a clear display device to be manufactured.

In order to solve the above problems, the constituent means constituting the substrate side part deposition apparatus with improved deposition adhesion, which is the present invention, is rotatably disposed in the chamber, and at least one substrate is inserted and mounted in the center direction from the circumferential surface. Substrate mounting drum, at least one source target for depositing wiring on the side surface of the substrate protruding from the circumferential surface of the substrate mounting drum and performing ion beam treatment on the side surface of the substrate, and a connection terminal layer provided on the side surface of the substrate It is characterized in that it comprises an ion beam processing module for removing the terminal protective layer formed to protect the surface and simultaneously processing the surface modification of the connection terminal layer.

Here, it is characterized in that it further comprises at least one of a substrate heating module that performs a heating process on the side surface of the substrate and a plasma processing module that performs a plasma process on the side surface of the substrate.

Here, in the case of including the substrate heating module and the plasma processing module, a process of performing heating treatment on the side surface of the substrate by driving the substrate heating module while rotating the substrate mounting drum, and the A process of performing a heating treatment on the side surface of the substrate by driving a plasma processing module and a process of performing an ion beam treatment on the side surface of the substrate by driving the ion beam processing module while rotating the substrate mounting drum are sequentially performed. To do.

According to the substrate side portion deposition apparatus having improved deposition adhesion according to the present invention having the above problems and solutions, a substrate mounting drum for mounting at least one substrate so that the side surface portion of the substrate protrudes from the circumferential surface, and depositing wiring on the side surface of the substrate. An ion beam processing module for performing ion beam processing on at least one source target and a side portion of the substrate, wherein the ion beam processing module not only modifies the surface of the connection terminal layer formed on the side surface of the substrate, but also provides a terminal protective layer on the connection terminal layer. Since it is configured to be removed, the advantage of improving deposition adhesion to the substrate and minimizing time, effort, and cost for processing the substrate occurs.

In addition, according to the present invention, since the substrate heating module capable of improving the film quality of the substrate thin film and the plasma processing module capable of removing the terminal protective layer as well as surface modification of the connection terminal layer on the substrate are additionally configured, the connection It is possible to further improve the removal efficiency of the terminal protective layer on the terminal layer and to further improve the deposition adhesion to the connection terminal layer.

In addition, according to the present invention, a substrate mounting drum for mounting at least one substrate so as to protrude from the circumferential surface of the substrate, at least one source target for depositing wiring on the side surface of the substrate, and a shield for partitioning the sputtering portion of the source target Including, but since the shield is provided with a shield cooling line capable of cooling the source target, there is an effect of preventing damage to the source target by improving the cooling efficiency of the source target.

In addition, according to the present invention, since the shield cooling line is adopted and applied as a modularized shield cooling line manufactured in advance corresponding to the shield, time, effort, and cost for constructing a shield with a shield cooling line can be minimized. There is an advantage of being able to do so.

In addition, according to the present invention, since the modularized shield cooling line is attached and arranged in contact with the inner surface of the shield that can face the source target, cooling efficiency for the source target is improved while cooling loss can be minimized. There is an effect that allows you to do it.

In addition, according to the present invention, at least one substrate is mounted on the substrate mounting drum so that the side surface of the substrate faces the source target, and each of the substrates can be cooled by at least one cooling block disposed inside the substrate mounting drum. Since it is configured so that it is possible to minimize the cooling loss, the advantage of improving the cooling efficiency for the substrate is generated.

In addition, according to the present invention, since the substrate is mounted on the cooling block, and furthermore, the substrate mounting jig is fixedly mounted on the cooling block so that the substrate is in surface contact after mounting the substrate to the substrate mounting jig. The substrate mounting jig on which the substrate is mounted can be fixedly mounted stably and firmly, and the cooling efficiency for the substrate can be further improved.

In addition, according to the present invention, since the mounting plate is configured to be mounted with a close contact spring interposed between the edge portion of the mounting plate and the bracket, the mounting plate can be elastically supported by the bracket, through which the substrate is mounted. There is an effect of allowing the mounted substrate mounting jig to be fixedly mounted more stably and steadily, and further, allowing the substrate mounting jig on which the substrate is mounted to be easily detached.

Further, according to the present invention, at least one substrate is mounted on the substrate mounting drum so that the side surface of the substrate faces the source target, and the substrate mounting drum is configured to be rotated. The advantage of enabling dimensional deposition arises.

In addition, according to the present invention, since the source target is composed of a plurality, but all of the source targets are composed of the same metal target or different metal targets, time, effort and time for manufacturing a substrate and a display device including the substrate There is an effect of reducing cost and improving manufacturing efficiency.

In addition, according to the present invention, when a plurality of source targets are composed of different metal targets, since a target shutter that covers the surface of another source target adjacent to the source target currently performing sputtering is configured, adjacent sources By blocking the deposition of the metal of the source target performing sputtering on the target, contamination of the adjacent source target is prevented, thereby improving the wiring deposition quality and efficiency of the substrate.

In addition, according to the present invention, since the upper circuit pattern and the lower circuit pattern of the substrate are configured to be electrically connected through wiring formed through sputtering on the side surface of the substrate, the bezel can be eliminated. The effect of making it possible to manufacture a large-area and clear display device occurs.

1 is a schematic cross-sectional view of an apparatus for depositing a side surface of a substrate with improved deposition adhesion according to an embodiment of the present invention.
2 is a schematic cross-sectional view for explaining a terminal protective layer that is removed through a deposition apparatus on a side of a substrate having improved deposition adhesion according to an embodiment of the present invention.
3 is a flowchart illustrating an operation of a deposition apparatus on a side of a substrate with improved deposition adhesion according to an embodiment of the present invention.
4 is a layout diagram of a source target and a shield constituting a deposition apparatus on a side of a substrate with improved deposition adhesion according to an embodiment of the present invention.
5 is an enlarged view of a source target and a shield constituting a deposition apparatus on a side surface of a substrate having improved deposition adhesion according to an embodiment of the present invention.
6 is a block diagram of a shield constituting a deposition apparatus on a side surface of a substrate having improved deposition adhesion according to an embodiment of the present invention.
7 is a perspective view of a modular shield cooling line constituting an apparatus for depositing a side surface of a substrate with improved deposition adhesion according to an embodiment of the present invention.
FIG. 8 is an exploded perspective view illustrating a form of coupling a modular shield cooling line to an outer surface of a shield constituting a deposition apparatus on a side surface of a substrate with improved deposition adhesion according to an embodiment of the present invention.
9 is an exploded perspective view for explaining a form in which a modular shield cooling line is coupled to an inner surface of a shield constituting a deposition apparatus on a side of a substrate with improved deposition adhesion according to an embodiment of the present invention.
10 is a perspective view of a substrate mounting drum constituting an apparatus for depositing a side surface of a substrate with improved deposition adhesion according to an embodiment of the present invention.
11 is a partially enlarged view of a substrate mounting drum constituting a substrate side deposition apparatus with improved deposition adhesion according to an embodiment of the present invention.
12 is a perspective view of cooling blocks disposed inside a substrate mounting drum constituting an apparatus for depositing a side surface of a substrate with improved deposition adhesion according to an embodiment of the present invention.
13 is a perspective view of a substrate mounting jig constituting an apparatus for depositing a side surface of a substrate with improved deposition adhesion according to an embodiment of the present invention.
14 is an internal layout view of a substrate mounting drum constituting an apparatus for depositing a side surface of a substrate with improved deposition adhesion according to an embodiment of the present invention.
15 is an enlarged view of an inner portion of a substrate mounting drum constituting an apparatus for depositing a side surface of a substrate with improved deposition adhesion according to an exemplary embodiment of the present invention.
16 is an inner partial cross-sectional view of a substrate mounting drum constituting an apparatus for depositing a side surface portion of a substrate with improved deposition adhesion according to an embodiment of the present invention.
FIG. 17 is a schematic plan view showing an arrangement relationship between a source target, a target shutter, and a moving rail constituting an apparatus for depositing a side surface of a substrate with improved deposition adhesion according to an embodiment of the present invention.
18 is a cross-sectional view of an exemplary substrate in which wiring is formed on the side surface by applying the substrate side deposition apparatus with improved deposition adhesion according to an embodiment of the present invention.
19 is a cross-sectional view of a substrate in a state in which wiring is formed on the side of the substrate by applying the deposition apparatus on the side of the substrate having improved deposition adhesion according to an embodiment of the present invention.

Since the present invention can apply various transformations and have various embodiments, specific embodiments are illustrated in the drawings and will be described in detail in the detailed description. Effects and features of the present invention, and a method of achieving them will be apparent with reference to the embodiments described later in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when describing with reference to the drawings, the same or corresponding components are assigned the same reference numerals, and redundant descriptions thereof will be omitted. .

In the following embodiments, terms such as include or have means that the features or elements described in the specification are present, and do not preclude the possibility of adding one or more other features or elements in advance.

In the drawings, components may be exaggerated or reduced in size for convenience of description. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, and the present invention is not necessarily limited to what is shown.

When a certain embodiment can be implemented differently, a specific process order may be performed differently from the described order. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in an order opposite to the described order.

1 is a schematic cross-sectional view of an apparatus for depositing a side surface of a substrate with improved deposition adhesion according to an embodiment of the present invention. 2 is a schematic cross-sectional view for explaining a terminal protective layer that is removed through a deposition apparatus on a side of a substrate having improved deposition adhesion according to an embodiment of the present invention. 3 is a flowchart illustrating an operation of a deposition apparatus on a side of a substrate with improved deposition adhesion according to an embodiment of the present invention.

As shown in FIG. 1, the substrate side deposition apparatus 200 having improved deposition adhesion according to an embodiment of the present invention includes a substrate mounting drum 170 for mounting at least one substrate 30 in a radial direction, and the At least one source target 130 disposed adjacent to the circumferential surface of the substrate mounting drum 170 to perform wiring deposition on the side surface 10 of the substrate, and ion beam treatment on the side surface 10 of the substrate, An ion beam processing module 125 for removing the terminal protective layer 25 formed to protect the connection terminal layer 20 provided on the side surface portion 10 of the substrate and processing the surface modification of the connection terminal layer 20 It consists of including. In addition, in some cases, it is configured to further include a target shutter 190 for preventing contamination of adjacent source targets.

The substrate mounting drum 170 has a cylindrical shape or a polygonal shape and is rotatably disposed in the vacuum chamber 110. In addition, the substrate mounting drum 170 allows at least one substrate 30 to be inserted and mounted in a radial direction, that is, in the central direction from the circumferential surface 171. That is, the substrate mounting drum 170 applied to the present invention is rotatably disposed in the chamber 110, and at least one substrate 30 is inserted and mounted from the circumferential surface 171 in the center direction.

Specifically, the substrate mounting drum 170 has a cylindrical shape or a polygonal cylindrical shape, but as shown in FIG. 10, the substrate 30 is mounted in the center direction from the peripheral surface 171 so that a plurality of substrates It is mounted in a radial direction. The substrate mounting drum 170 is rotatably mounted and coupled in the vacuum chamber 110 through various methods and structures. As a result, the substrate mounting drum 170 is rotatably disposed in the vacuum chamber 110 with at least one substrate mounted in the radial direction.

In this way, since the at least one substrate 30 is inserted and mounted in the substrate mounting drum 170 in a radial direction, the side portion 10 is disposed to protrude from the circumferential surface 171 of the substrate mounting drum 170 can do. Since the substrate side portion deposition apparatus 200 having improved deposition adhesion according to the present invention is a deposition apparatus for wiring deposition to the side portion 10 of the substrate 30, the side portion 10 of the substrate 30 is It is disposed to be exposed from the circumferential surface 171 of the substrate mounting drum 170.

As described above, the at least one side surface portion 10 protruding from the circumferential surface 171 of the substrate mounting drum 170 and exposed is sputtered by the at least one source target 130. Accordingly, the at least one source target 130 is disposed to deposit a predetermined wiring pattern on the side surface 10 of the substrate. That is, the at least one source target 130 performs an operation of depositing a wire through sputtering on the side surface 10 of the substrate 30 exposed by protruding from the circumferential surface 171 of the substrate mounting drum 170. Perform.

The source target 130 is formed as a metal target to be deposited on the side surface 10 of the substrate, and the metal target acts as a cathode in the sputtering process. The source target 130 corresponding to the metal target acting as the cathode deposits a wire formed of a predetermined metal layer on the side surface 10 of the substrate.

However, in the process of sputtering performed by the source target 130, the substrate mounting drum 170 operates to rotate, so that the source target 130 is in the end 3D with respect to the side surface 10 of the substrate ( Specifically, deposition of the side surface of the substrate and the upper and lower surfaces of the substrate adjacent to the side surface) is performed.

Accordingly, the substrate side deposition apparatus 200 according to the present invention performs deposition by sputtering on the side surface of the substrate and the upper and lower surfaces of the substrate adjacent to the side surface for three-dimensional deposition on the side surface 10 of the substrate. It is not necessary to have each of the source targets, and 3D deposition can be performed on the side surface 10 of the substrate using one source target. As a result, the apparatus 200 for depositing a side surface portion of a substrate according to the present invention has an advantage of minimizing time, effort, and cost for configuring equipment adopted and applied for 3D deposition on the side surface portion 10 of the substrate.

As described above, the substrate side portion deposition apparatus 200 having improved deposition adhesion according to the present invention does not perform deposition on the upper or lower surface of the substrate 30, but is deposited on the side surface 10 of the substrate. This corresponds to a device for forming wiring.

The substrate side portion 10 applied to the present invention includes a side surface of the substrate 30 (indicated by reference numeral 11 in FIGS. 18 and 19), and an upper surface of the substrate adjacent to the side surface 11 (FIGS. 18 and 19 ). 13) and a lower surface (indicated by reference numeral 15 in FIGS. 18 and 19), and the wiring on the side surface 10 of the substrate is formed on the upper surface of the substrate 30 The circuit pattern (indicated by reference numeral 60 in FIGS. 18 and 19) and the lower circuit pattern formed on the lower surface of the substrate 30 (indicated by reference numeral 80 in FIGS. 18 and 19) can be electrically connected. Is formed so that

On the other hand, the wiring of the side surface portion 10 of the substrate is formed to electrically connect the upper circuit pattern 60 and the lower circuit pattern 80, and more specifically, the wiring of the side surface portion 10 of the substrate 2 electrically connects the upper circuit pattern 60 and the lower circuit pattern 80 via the connection terminal layer 20 shown in FIG. 2.

More specifically, a connection terminal circuit pattern, that is, a connection terminal layer 20, to connect the wiring of the upper circuit pattern 60 and the side surface 10 of the substrate 30 is formed on the edge portion of the upper surface of the substrate 30 In addition, a connection terminal circuit pattern, that is, a connection terminal layer 20, to connect the lower circuit pattern 80 and the wiring of the side surface 10 of the substrate 30 is formed on an edge portion of the lower surface of the substrate 30.

In the substrate configured as described above, portions other than the substrate side portion 10 are masked in order to form a wiring with respect to the substrate side portion 10. In addition, the metal thin film formed on the side surface portion 10 of the substrate, that is, the connection terminal layer 20 is exposed to the outside. Accordingly, the connection terminal layer 20 may be oxidized or damaged during handling. To this end, the substrate comes into a state in which a terminal protective layer 15 is formed on the connection terminal layer 20.

After the substrate enters with the terminal protective layer 15 formed on the connection terminal layer 20, the terminal protective layer 15 is removed in order to form a wiring for the side surface 10 of the substrate through evaporation. Should be. The terminal protective layer 15 may be removed through a laser prior to the deposition process on the side surface 10 of the substrate, may be removed by chemicals, or may be removed by dry etching through gas in a separate chamber.

After removing the terminal protection layer 15 using such a separate process and apparatus, the substrate treatment is performed through a process of forming a wiring for the side surface portion 10 of the substrate using the substrate side portion deposition apparatus according to the present invention. , There is a disadvantage of increasing time, effort, and cost due to the increase in processes and equipment for processing the substrate. In order to solve such a problem, the present invention is configured to include an ion beam processing module 125, which will be described later.

Meanwhile, the technical characteristics of the substrate 30 and the side surface 10 applied to the present invention will be described in detail.

In order to deposit the wiring on the side surface portion 10 of the substrate using the substrate side portion deposition apparatus 200 according to an exemplary embodiment of the present invention, first, masking is performed on the side surface portion 10 on which the wiring is to be formed. Specifically, since the deposition method through sputtering is applied to the deposition of the wiring on the side surface of the substrate according to the present invention, a deposition mask is attached to the substrate to mask the side surface 10 of the substrate to form the wiring.

The masking of the substrate side portion 10 corresponds to a process of attaching a deposition mask to the substrate 30 so that wiring can be deposited on the side surface portion 10 through sputtering. The deposition mask is formed in a "c" shape and is attached to the upper and lower portions of the substrate as well as the side surface 10 of the substrate 30.

The deposition mask may be formed by film, metal, or ink printing. In particular, the deposition mask may be formed of a PI film. When the deposition mask is formed of a PI film and applied, the deposition mask is in close contact with the substrate 30 including the side surface 10 of the substrate through various types of adhesives.

The PI film mask is provided with an adhesive material interposed between the substrate and the substrate 30 is preferentially bonded to the substrate 30 under predetermined process conditions, and is applied to the substrate 30 under predetermined process conditions. It is desirable to perform an intimate process that can be intact.

When the process of performing masking by attaching a deposition mask to the substrate 30 including the substrate side portion 10 to form a wiring as described above is completed, a sputtering process is performed on the masked substrate 30. That is, the masked substrate 30 is inserted into the vacuum chamber 110 and mounted on the substrate mounting drum 170, and the substrate side portion 10 is mounted so that only the side surface portion 10 is exposed, and then the substrate side portion 10 through sputtering. ) To form the deposition wiring.

The wiring to the side surface portion 10 of the substrate according to the present invention is formed by sputtering in the vacuum chamber 110. Therefore, the substrate 30 is introduced into the chamber 100 capable of sputtering when a “c”-shaped deposition mask is attached to a portion including the substrate side portion 10 on which the wiring is formed. The sputtering process is performed while being mounted on the mounting drum 170.

The sputtering process is performed so that deposition can be concentrated on the side surface portion 10 of the substrate where the wiring is to be formed. That is, sputtering applied in the present invention is not performed on the entire substrate 30, but is performed so that it can be deposited on the side surface portion 10 of the substrate.

The substrate side deposition apparatus 200 according to the present invention is an apparatus for forming a deposition wiring through sputtering on the side portion of the substrate 30, and the applied substrate 30 needs to form a circuit pattern, and through the side portion Any substrate on which circuit patterns need to be connected can be applied. That is, the substrate 30 applied to the present invention is a concept including all substrates on which circuit patterns such as glass, plastic, film, etc. are formed, and wirings may be formed on side surfaces to electrically connect the circuit patterns.

Particularly, the substrate 30 applied to the present invention is preferably a substrate on which various devices may be mounted on top and bottom, and circuit patterns are formed on the top and bottom, respectively. In addition, the substrate side portion 10 on which the wiring is formed is a side surface 11 of a substrate forming an edge portion of the substrate as shown in FIG. 18, an upper surface of the substrate 30 adjacent to the side surface 11 of the substrate, That is, a portion including the side adjacent upper surface 13 and the lower surface of the substrate 30 adjacent to the side surface 11 of the substrate, that is, the side adjacent lower surface 15.

Specifically, the substrate side portion 10 applied to the present invention is the side surface 11 of the substrate and the upper surface of the substrate adjacent to the side surface 11 of the substrate (the upper surface 13 adjacent to the side surface 13), as shown in FIG. )) and a lower surface (the lower surface 15 adjacent to the side surface), and the wiring to the side surface portion 10 of the substrate, that is, the wiring at the side surface (indicated by reference numeral 90 in FIG. 19) is the upper surface of the substrate 30 It is formed to electrically connect the upper circuit pattern 60 formed on the substrate and the lower circuit pattern 80 formed on the lower surface of the substrate.

More specifically, the substrate 30 applied to the present invention may be a substrate applied to various devices, devices, and devices. For example, the substrate 30 applied to the present invention can be applied for the display device 100 as shown in FIG. 18. Accordingly, display elements 50, for example, LCD, OLED, and micro LED are mounted on the substrate 30 to form a display element matrix. In addition, a controller element 70 for controlling the display elements 50 and transmitting and receiving electric signals and various related elements may be formed under the substrate 30.

A wiring for the display elements 50, that is, an upper circuit pattern 60 is formed on the substrate 30, and a wiring for the controller elements 70, etc. is formed on the lower portion of the substrate 30 That is, the lower circuit pattern 80 is formed. Accordingly, a side wiring 90 for electrically connecting the upper circuit pattern 60 and the lower circuit pattern 80 to the substrate side portion 10 should be formed as shown in FIG. 19. Specifically, the upper circuit pattern 60 and the lower circuit pattern 80 are electrically connected via the connection terminal layer 20 as described above.

Since the side wiring 90 formed on the side surface portion 10 of the substrate must be formed to electrically connect the upper circuit pattern 60 and the lower circuit pattern 80, as shown in FIG. 19, The cross section has a "c" shape. As described above, since the side wiring 90 has a "c" shape capable of electrically connecting the upper circuit pattern 60 and the lower circuit pattern 80, the substrate on which the side wiring 90 is formed As illustrated in FIG. 18, the side portion 10 corresponds to a portion including the side adjacent upper surface 13 and the side adjacent lower surface 15 as well as the side surface 11 of the substrate.

As described above, the masked substrate 30 is introduced into the vacuum chamber 110 and subjected to sputtering, as shown in FIG. 1. By the way, sputtering in the vacuum chamber 110 is a process for forming the side wiring 90 on the side surface 10 of the substrate. Accordingly, sputtering in the vacuum chamber 110 is performed so that deposition can be concentrated on the side surface 10 of the substrate.

To this end, the wiring (that is, the side wiring 90) formed on the side surface of the substrate according to the present invention is applied to the source target 130 while the substrate mounting drum 170 is rotated in the chamber 110. Evaporation is formed by sputtering through. That is, in the process of sputtering the source target 130, the substrate mounting drum 170 on which the substrate is mounted by exposing only the side portion 10 of the substrate 30 toward the source target 130 Since it is operated to rotate, three-dimensional deposition on the side surface portion 10 of the substrate is possible, and through this, the side surface portion 10 of the substrate, that is, the side surface 11, the side adjacent top surface 13, and the side adjacent side A three-dimensional deposition wiring may be formed on the lower surface 15.

According to the substrate side portion deposition apparatus 200 having improved deposition adhesion according to the present invention described above, at least one substrate 30 is mounted on the substrate mounting drum 170 so that the substrate side portion 10 faces the source target 130. However, since the substrate mounting drum 170 is configured to be rotated, the advantage of enabling a uniform and improved three-dimensional deposition of the substrate side portion 10 is generated.

On the other hand, the substrate side deposition apparatus 200 having improved deposition adhesion according to the present invention performs surface modification on the above-described connection terminal layer 20, and furthermore, a terminal protection layer that can be performed in a separate process and apparatus ( 25) is configured to include an ion beam treatment module 125 capable of being removed.

The ion beam processing module 125 performs ion beam treatment on the side surface 10 of the substrate, but removes the terminal protection layer 25 formed to protect the connection terminal layer 20 provided on the side surface 10 of the substrate. At the same time, the surface modification of the connection terminal layer 20 is performed.

That is, the ion beam processing module 125 includes a connection terminal layer 20 formed on the side surface 10 of the substrate prior to the step of depositing a wire on the side surface 10 of the substrate through sputtering by the source target 130 An operation of removing the terminal protection layer 25 to be exposed is performed, and an operation of processing surface modification by changing the surface roughness of the exposed connection terminal layer 20 is performed.

When the terminal protection layer 25 is removed by the ion beam processing module 125 and the surface modification of the connection terminal layer 20 is processed, the side surface portion 10 of the substrate is sputtered by the source target 130. ) To perform the step of depositing the wiring.

On the other hand, the substrate side deposition apparatus 200 having improved deposition adhesion according to the present invention improves the surface modification efficiency of the connection terminal layer 20 and at the same time improves the removal efficiency of the terminal protection layer 25 As shown in FIG. 1, a substrate heating module 120 capable of heating a substrate and/or a plasma processing module 123 capable of surface-treating the substrate may be additionally included. That is, the substrate side part deposition apparatus 200 having improved deposition adhesion according to the present invention performs a substrate heating module 120 for performing a heating treatment on the substrate side part 10 and a plasma treatment for the substrate side part 10. It is preferable to further include at least one of the plasma processing modules 123 to be performed.

The substrate heating module 120 improves the film quality of the metal thin film of the substrate 30 to improve deposition efficiency, and at the same time, heats the terminal protection layer 25 to proceed with the terminal protection layer. (25) It is possible to shape the removal efficiency. The substrate mounting drum 170 is rotated to enable heating of at least one edge portion of the substrate mounted on the substrate mounting drum 170 by the substrate heating module 120, that is, a side portion of the substrate. The operation of the substrate heating module 120 may be stopped while the plasma processing module 123 and the ion beam processing module 125 to be described later are driven, but may be continuously operated during the driving process.

The plasma processing module 123 performs plasma processing on the side surface portion 10 of the substrate, so that the removal efficiency of the terminal protection layer 25 by the ion beam processing module 125 and the surface of the connection terminal layer 20 It allows the reforming efficiency to be doubled. That is, the plasma processing module 123 activates the terminal protective layer 25 formed on the side surface 10 of the substrate to be removed through plasma, and further modifies the surface of the connection terminal layer 20 Allows the deposition adhesion to be improved.

In this way, the plasma processing module 123 is a pretreatment step for the ion beam processing module 125 so that the processing effect of the ion beam processing module 125 can be doubled, and furthermore, the ion beam processing module 125 To reinforce the processing efficiency of As a result, while continuously processing the plasma processing module 123 and the ion beam processing module 125, the removal efficiency of the terminal protective layer 25 formed on the side surface 10 of the substrate further increases and is completely removed. The deposition adhesion of the wiring to the side of the substrate may be improved, and the surface modification efficiency of the connection terminal layer 20 may also be improved, so that the deposition adhesion may be further improved.

The present invention may be configured to include at least one of the above-described substrate heating module 120 and the plasma processing module 123, but it is preferable that all are included in order to improve deposition adhesion. That is, it is preferable that the substrate side deposition apparatus 200 having improved deposition adhesion according to the present invention includes the substrate heating module 120 and the plasma processing module 123.

As described above, when the substrate side deposition apparatus 200 having improved deposition adhesion according to the present invention includes the substrate heating module 120 and the plasma processing module 123, while rotating the substrate mounting drum 170 A process of driving the substrate heating module 120 to perform a heating treatment on the side surface portion 10 of the substrate. The plasma processing module 123 is driven while rotating the substrate mounting drum 170 to form the side surface portion 10 of the substrate. ), and the process of performing the ion beam treatment on the side surface 10 of the substrate by driving the ion beam processing module 125 while rotating the substrate mounting drum 170 are successively and sequentially performed. do.

Specifically, as shown in FIG. 3, the method of depositing a side surface portion of a substrate through the substrate side portion deposition apparatus 200 having improved deposition adhesion according to the present invention includes first, the substrate heating module while rotating the substrate mounting drum 170. A substrate heating step of heating the side surface portion 10 of the substrate by 120 is performed (s11). The heating process by the substrate heating module 120 may be stopped before a subsequent step is performed, but may be continuously maintained even in a subsequent step. Since the substrate mounting drum 170 is rotated in the process of the substrate heating step, a heating process may be performed on the side surfaces 10 of the substrates of all of the at least one substrate mounted on the substrate mounting drum 170. have.

When the substrate side portion 10 is heated by the substrate heating module 120, next, the substrate side portion 10 is plasma-treated by the plasma processing module 123 while rotating the substrate mounting drum 170. The substrate plasma processing step is performed (s13). Since the substrate mounting drum 170 is rotated in the process of the substrate plasma processing step, plasma processing is performed on the substrate side portions 10 of all of the at least one substrate mounted on the substrate mounting drum 170. I can.

When the side surface portion 10 of the substrate is plasma-treated by the plasma processing module 123, next, the side surface portion 10 of the substrate 10 is ion beamed by the ion beam processing module 125 while rotating the substrate mounting drum 170. An ion beam treatment step of the substrate to be processed is performed (s10). Since the substrate mounting drum 170 is rotated in the course of the substrate ion beam treatment step, ion beam treatment is performed on the side surfaces 10 of the substrates of all of the at least one substrate mounted on the substrate mounting drum 170. I can.

When such a series of steps is performed, the terminal protection layer 25 formed on the side surface portion 10 of the substrate is removed cleanly to improve deposition adhesion to be carried out later, and furthermore, provided on the side surface portion 10 of the substrate. Surface modification of the connection terminal layer 20 is efficiently performed, so that the deposition adhesion of the wiring to be performed later can be further improved.

In this way, when the terminal protective layer 25 formed on the side surface portion 10 of the substrate is efficiently removed, and the surface modification of the connection terminal layer 20 is efficiently completed, while rotating the substrate mounting drum 170 By driving the source target 130, a step of forming a wiring through sputtering on the side surface portion 10 of the substrate is performed (s30).

According to the substrate side deposition apparatus having improved deposition adhesion according to the present invention described above, a substrate mounting drum for mounting at least one substrate so that the side surface of the substrate protrudes from the circumferential surface, and at least one source target for depositing wiring on the side surface of the substrate, Including an ion beam processing module for performing ion beam processing on the side surface of the substrate, wherein the ion beam processing module is configured to remove a terminal protective layer on the connection terminal layer as well as surface modification of the connection terminal layer formed on the side surface of the substrate. Therefore, the advantage of improving deposition adhesion to the substrate and minimizing the time, effort, and cost for processing the substrate occurs.

In addition, according to the present invention, since the substrate heating module capable of improving the film quality of the substrate thin film and the plasma processing module capable of removing the terminal protective layer as well as surface modification of the connection terminal layer on the substrate are additionally configured, the connection It is possible to further improve the removal efficiency of the terminal protective layer on the terminal layer and to further improve the deposition adhesion to the connection terminal layer.

Meanwhile, the deposition apparatus 200 on the side of the substrate having improved deposition adhesion according to the present invention is configured to further include a shield 140 provided with a shield cooling line 141 as shown in FIGS. 4 to 9. desirable. The source target 130 is guided by the shield 140 to perform uniform sputtering and partition the sputtering portion. The shield 140 covers the source target 130 but has an upper side open to partition the sputtering portion of the source target 130.

Specifically, the shield 140 according to the present invention includes a shield cooling line 141 for cooling the source target 130 so that the source target 130 can be efficiently cooled. As described above, the shield 140 according to the present invention divides the sputtering portion of the source target 140 and includes a shield cooling line 141 for cooling the source target.

Unlike the existing ones, since the shield 140 according to the present invention directly includes the shield cooling line 141, the source target 130 disposed below and at the side thereof can be efficiently cooled. Accordingly, the possibility of damage due to overheating of the source target 130 may be reduced.

The shield cooling line 141 is preferably formed on at least one of an inner surface, an outer surface, and an inner surface of the shield. That is, the shield cooling line 141 may be disposed to penetrate and be disposed inside the shield 140, and may be formed on at least one of the outer and inner surfaces of the shield 140 separately or in addition to this. May be. However, when the shield cooling line 141 is formed inside the shield, it is preferable to be added to the inner surface of the shield 140 in order to be disposed to face the shield. Of course, the shield cooling line 141 may not be formed inside the shield 140 but may be formed only on the inner surface of the shield 140.

Meanwhile, the shield cooling line 141 is most preferably a modularized shield cooling line manufactured in advance. The modularized shield cooling line 141 may be fitted to the outer surface of the shield 140 and attached to the outer surface of the shield 140 as shown in FIG. 8. As shown in FIG. 9, the shield 140 It can also be attached to the surface by being fitted to the inner surface of the.

That is, the shield cooling line 141 applied to the present invention is a modularized shield cooling line manufactured in advance corresponding to the shield 140, and the modularized shield cooling line is an outer surface of the shield 140 and It is attached and disposed in contact with at least one of the inner surfaces. However, in order to reduce the overall manufacturing cost of the shield 140 and improve cooling efficiency for the source target 130, the shield cooling line 141 is a modularized shield cooling line 141, and the Most preferably, the modularized shield cooling line 141 is attached and disposed in contact with the inner surface of the shield 140. In this case, the modularized shield cooling line 141 may be simply attached to and disposed on the inner surface of the shield, and is disposed opposite to the source target 130, thereby reducing the cooling efficiency for the source target 130. Can be improved.

According to the substrate side deposition apparatus having improved deposition adhesion according to the present invention described above, a substrate mounting drum for mounting at least one substrate so that the side surface of the substrate protrudes from the circumferential surface, and at least one source target for depositing wiring on the side surface of the substrate, Including a shield that partitions the sputtering portion of the source target, and since the shield has a shield cooling line capable of cooling the source target, the source target is prevented from being damaged by improving the cooling efficiency for the source target. There is an effect that allows it to be prevented.

In addition, according to the present invention, since the shield cooling line is adopted and applied as a modularized shield cooling line manufactured in advance corresponding to the shield, time, effort, and cost for constructing a shield with a shield cooling line can be minimized. There is an advantage of being able to do so.

In addition, according to the present invention, since the modularized shield cooling line is attached and arranged in contact with the inner surface of the shield that can face the source target, cooling efficiency for the source target is improved while cooling loss can be minimized. There is an effect that allows you to do it.

On the other hand, in the process of performing the deposition process using the deposition apparatus on the side of the substrate having improved deposition adhesion, the present inventor described above, the temperature inside the vacuum chamber 110 increases, which may cause a problem that the deposition efficiency is deteriorated. The substrate may be damaged, and furthermore, the masking film attached to the substrate may adhere to the substrate, making it very difficult to remove the masking film, which may damage the substrate.

In order to solve such a problem, the substrate side deposition apparatus 200 having improved deposition adhesion according to the present invention is disposed inside the substrate mounting drum 170 to accommodate each of the substrates, as shown in FIGS. 10 to 16. It is configured to include at least one cooling block 160 to cool.

Since the cooling block 160 is mounted and disposed inside the substrate mounting drum 170, compared to a structure disposed in the vacuum chamber 110 outside the substrate mounting drum 170, it is possible to reduce cold loss by default. There is an advantage. In addition, since the cooling block 160 according to the present invention is mounted and disposed inside the substrate mounting drum 170 to correspond to each of the at least one substrate to cool the substrate, the overall cooling efficiency for the substrate can be improved. I can. As a result, the substrate mounting drum 170 according to the present invention can improve the cooling efficiency of the substrate.

The cooling block 160 according to the present invention has a structure that enables a corresponding substrate to be fixed and at the same time improves the cooling efficiency of the substrate. To this end, the cooling block 160 according to the present invention includes a cooling plate 161 disposed opposite to the substrate 30, a substrate cooling line 163 for circulating cooling water into the cooling plate 161, and the substrate. It is configured to include a bracket 165 formed on the cooling plate 161 to allow the 30 to be fixedly mounted.

Since the cooling plate 161 is disposed opposite to each of the corresponding substrates 30, the cooling plate 161 is mounted in the center direction, that is, in the direction of the direction inside the substrate mounting drum 170. The cooling plate 161 has a plate shape, and a space through which the substrate cooling line 163 can pass is formed therein.

Since the cooling plate 161 is disposed opposite to the substrate 30, it may be in direct surface contact with the substrate 30 or may be in surface contact with the mounting plate 151 of the substrate mounting jig 150 to be described later. have. Here, since the cooling plate 161 performs a cooling function on the substrate by facing or in surface contact with the substrate 30 disposed oppositely, the cooling plate 161 is more than the substrate 30 or the substrate 30 in order to improve cooling efficiency. It is preferable to have a wider interview than the mounting plate 151 that is mounted and mounted in face contact.

The substrate cooling line 163 performs an operation of circulating cooling water into the cooling plate 161. The substrate cooling line 163 may be formed in the form of a cooling pipe, and the cooling water moves through the inside. The substrate cooling line 163 is introduced to one side of the cooling plate 161 (any one of the side surfaces adjacent to the mounting surface in contact with the substrate 30 or the mounting plate 151) After being disposed so as to pass through the inside of the cooling plate 151 at least once, it is drawn out from the cooling plate 161. The drawn out substrate cooling line 163 is introduced into another adjacent cooling plate 161 and disposed in the same shape. Through such a connection structure, the substrate cooling line 163 may be disposed to pass through the inside of the cooling plates 161 constituting the at least one cooling block 160.

The cooling plate 151 on which the substrate cooling line 163 is disposed is in direct surface contact with the substrate 30 or a surface with the mounting plate 151 on which the substrate 30 is seated in surface contact. Contact to cool the substrate 30. Accordingly, the substrate 30 or the mounting plate 151 needs to maintain a solid and stable state in a state of surface contact with the cooling plate 151.

To this end, a bracket 165 is formed on the cooling plate 151 to directly fix the substrate 30 or to fix the mounting plate 151 for mounting and fixing the substrate 30. . That is, the bracket 165 is formed on the cooling plate 161 so that the substrate 30 can be fixedly mounted.

The brackets 151 are disposed on both sides of the mounting surface of the cooling plate 161 in surface contact with the substrate 30 or the mounting plate 151. The bracket 165 supports and fixes the edge portion of the substrate 30 or the mounting plate 151 that is seated in surface contact with the cooling plate 161. Accordingly, the substrate 30 or the mounting plate 151 slides in surface contact with the cooling plate 161 and the edge portion is fixed by the bracket 151. As a result, the bracket 165 is preferably a Z-bracket.

The substrate 30 may be mounted to be in direct surface contact on the cooling block 160 described above. In this case, the cooling effect for the substrate 30 may be greatest. However, when the substrate 30 is mounted in direct surface contact with the cooling block 160, the edge portion may be damaged by the bracket 165, and further, the contact surface may be damaged. Therefore, it is more preferable that the substrate 30 is mounted on the cooling block 160 while being mounted on the substrate mounting jig 150 shown in FIG. 13.

As described above, the substrate side deposition apparatus 200 having improved deposition adhesion according to the present invention is configured to further include a substrate mounting jig 150 for mounting the substrate 30. The substrate mounting jig 150 includes the mounting plate 151 for mounting the substrate 30 by making the surface contact, and the mounting plate 151 is in a state of surface contact with the cooling plate 161 and the bracket The edge portion is fixed and mounted by 165.

As described above, since the substrate mounting jig 150 is mounted on the cooling plate 161 of the cooling block 160 while the substrate 30 is mounted, the possibility of damage to the substrate 30 is eliminated. In addition, since the substrate 30 is mounted to be in surface contact with the mounting plate 151 of the substrate mounting jig 150, and the mounting plate 151 is mounted to be in surface contact with the cooling plate 161, the The substrate 30 may be efficiently cooled by the cooling plate 161 via the mounting plate 151.

The substrate mounting jig 150 may be stably mounted by contacting the substrate 30 with the surface, and is preferably configured to be rigidly and stably coupled to the substrate mounting drum 170. To this end, the substrate mounting jig 150 includes a mounting plate 151 that contacts the substrate 30 to be mounted thereon. The mounting plate 151 is firmly and stably coupled to the cooling plate 161 while being mounted so as to be in surface contact.

The mounting plate 151 may be fixed by supporting an edge portion by the bracket 165, and further, may be fastened to the cooling block 160 or the like through a separate fastener. It may be fixed to the mounting drum 170. However, the mounting plate 151 must be easily detachable from the cooling plate 161 by an operator, and must be easily detachable from the substrate mounting drum 170 by an operator. To this end, the substrate mounting jig 150 is preferably connected to the mounting plate 151 and includes a fixing plate 153 that can be mounted on the circumferential surface 171 of the substrate mounting drum 170.

The fixing plate 153 is formed in the form of a bar or plate, is connected to the side of the mounting plate 151, and is attached to and fastened to the circumferential surface 171 of the substrate mounting drum 170. Accordingly, the mounting plate 151 on which the substrate 30 is mounted can be mounted on the cooling plate 161 through the opening 172 formed in the circumferential surface 171 of the substrate mounting drum 170. In addition, by attaching and fastening the fixing plate 153 to the circumferential surface 171 of the substrate mounting drum 170, it can be firmly and stably fixed.

The fixing plate 153 may be attached to and fixed to the circumferential surface 171 of the substrate mounting drum 170 by various configurations and methods. For example, the fixing plate 153 has latches 154 at both ends, and the latches 154 are latches provided on both sides of the substrate mounting drum 170, as shown in FIG. It is concluded by (173). As a result, the fixing plate 153 may be firmly and stably attached and fixed to the circumferential surface 171 of the substrate mounting drum 170 by fastening the latch 173 to the latch 154. For this reason, the mounting plate 151 can also be mounted on the cooling plate 161 and maintain a strong and stable state. When the deposition process for the substrate is completed, the operator removes the clasp 173 from the clasp 154, and then grasps the fixing plate 153 and pulls the mounting plate 151 to the cooling plate 161 Can be removed from.

Meanwhile, the mounting plate 151 is mounted on the cooling plate 161 in surface contact, and the edge portion is supported and fixed by the bracket 165. At this time, the mounting plate 151 needs to be easily removed from the bracket 165 while the edge portion thereof is firmly and stably supported by the bracket 165.

To this end, the substrate side deposition apparatus 200 having improved deposition adhesion according to the present invention is mounted so as to be interposed between the edge portion of the mounting plate 151 and the bracket 165 so that the mounting plate 151 is attached to the bracket. It is configured to further include a contact spring 155 to be elastically supported by the (165).

The contact spring 155 is mounted at an edge portion of the mounting plate 151 or a lower portion of the bracket 165 so that when the mounting plate 151 is mounted on the cooling plate 161, the edge portion is attached to the bracket 165 ) To be elastically supported. Accordingly, the edge portion of the mounting plate 151 may be firmly and stably fixed by the bracket 165 via the contact spring 155.

The contact spring 155 may be coupled to the bracket 165 as described above or may be coupled to an edge portion of the mounting plate 151. However, it is more preferable to mount the contact spring 155 on the mounting plate 151 that can be easily removed to the outside of the substrate mounting drum 170 to facilitate maintenance and replacement.

Accordingly, FIGS. 10 to 16 show that the contact spring 155 is coupled to the edge portion of the mounting plate 151. The contact springs 155 are coupled to both edge portions of the mounting plate 151 and are coupled to be disposed at positions corresponding to the brackets 165. Each of the contact springs 155 has a shape in which both sides are coupled to an edge portion of the mounting plate 151 and a center portion is convex upward. Accordingly, the contact spring 155 may be in close contact with the lower portion of the bracket 165 when the mounting plate 151 is mounted on the cooling plate 161, and as a result, the mounting plate 151 ) To be elastically supported.

According to the substrate side deposition apparatus having improved deposition adhesion as described above, at least one substrate is mounted on the substrate mounting drum so that the side surface of the substrate faces the source target, and at least one cooling block disposed inside the substrate mounting drum As a result, each of the substrates is configured to be cooled, so that the cooling efficiency for the substrate can be improved while the cooling loss can be minimized.

In addition, according to the present invention, since the substrate is mounted on the cooling block, and furthermore, the substrate mounting jig is fixedly mounted on the cooling block so that the substrate is in surface contact after mounting the substrate to the substrate mounting jig. The substrate mounting jig on which the substrate is mounted can be fixedly mounted stably and firmly, and the cooling efficiency for the substrate can be further improved.

In addition, according to the present invention, since the mounting plate is configured to be mounted with a close contact spring interposed between the edge portion of the mounting plate and the bracket, the mounting plate can be elastically supported by the bracket, through which the substrate is mounted. There is an effect of allowing the mounted substrate mounting jig to be fixedly mounted more stably and steadily, and further, allowing the substrate mounting jig on which the substrate is mounted to be easily detached.

Hereinafter, more detailed technical features and additional technical features of the substrate side deposition apparatus 200 having improved deposition adhesion according to the present invention will be described in detail.

As shown in FIG. 1, the deposition apparatus 200 on the side of the substrate having improved deposition adhesion according to an exemplary embodiment of the present invention may include a plurality of source targets 130. That is, the source target 130 may be formed as one and 3D wiring deposition may be performed on the side portions 10 of the plurality of substrates 30 rotated in the vacuum chamber 110, but a plurality of source targets ( 3D wiring deposition may be performed on the side portions 10 of the plurality of substrates 30 configured and rotated by 131, 133, and 135. In FIG. 1, it is exemplified that the source target 130 is composed of three source targets, that is, a first source target 131, a second source target 133, and a third source target 135.

As described above, when the source target 130 is composed of a plurality, the plurality of source targets (for example, the first source target 131, the second source target 133, and the third source target in FIG. 1 (135)) may be composed of cathode targets formed of the same metal, that is, the same metal targets, and in some cases, cathode targets formed of different metals, that is, may be composed of different metal targets.

As described above, the source target 130 applied to the present invention is composed of a plurality (131, 133, 135), and the plurality of source targets (for example, the first source target 131 in FIG. The second source target 133 and the third source target 135 are formed of the same metal target or different metal targets.

In the former case (where a plurality of source targets are formed, and a plurality of source targets are formed of the same metal target), it is applied to form a wiring composed of only one metal layer on the side surface portion 10 of the substrate. That is, the plurality of source targets are composed of the same metal target formed of the same metal.

In this way, when a plurality of source targets 130 composed of the same metal target are applied, the plurality of substrates 30 may be continuously sputtered while the substrate mounting drum 170 is rotated to deposit wiring. have. As a result, wiring deposition on the side surfaces of the plurality of substrates 30 can be carried out more rapidly, thereby improving production efficiency and deposition efficiency.

As described above, when the source target 130 is composed of a plurality of, but composed of the same metal target, the plurality of substrates are mounted at equal intervals (that is, the angles between adjacent substrates are equally mounted), and the plurality of The source targets 130 are also disposed at the same distance, but are preferably disposed at the same distance as the distance between the side surfaces 10 of the adjacent substrates.

In this way, when the plurality of substrates are mounted at the same angle, and at the same time, the plurality of source targets 130 are also disposed at the same distance as the distance between the side surfaces 10 of the adjacent substrates. In the process of rotating the mounting drum 170, the same and uniform deposition may be made between the side portions 10 of each of the substrates, and the wiring deposition of the side portions 10 of each substrate may also have improved uniformity. .

Next, in the latter case (where a plurality of source targets are formed, and a plurality of source targets are formed of different metal targets), it is applied to form a wiring composed of a plurality of metal layers on the side surface portion 10 of the substrate. That is, the plurality of source targets are composed of different metal targets formed of different metals.

For example, as shown in FIG. 1, the source target 130 is composed of three source targets, namely, a first source target 131, a second source target 133, and a third source target 135. In this case, the first source target 131, the second source target 133, and the third source target 135 are formed of different metal targets. In this case, the first source target 131 deposits a first metal layer on the side surface 10 of the substrate, and the second source target 133 deposits a second metal layer on the first metal layer, The third source target may be formed by depositing a third metal layer on the second metal layer. In this case, the wiring deposited on the side surface portion 10 of the substrate is formed by sequentially depositing a first metal layer, a second metal layer, and a third metal layer.

In this way, when the source target 130 is composed of a plurality and the plurality of source targets 130 are composed of different metal targets, only the specific source target 130 is operated to perform sputtering, and the remaining source targets perform sputtering. I never do that. That is, only one source target is operated and the other source targets are controlled so that they are not operated.

When only one of the source targets is operated to perform sputtering, as the substrate mounting drum 170 rotates, for a plurality of substrates mounted on the substrate mounting drum 170, in particular, for the substrate side portion 10 Three-dimensional deposition can be performed. That is, a first metal constituting a source target for performing the sputtering is deposited on side surfaces of a plurality of substrates mounted on the substrate mounting drum 170 to form a first metal layer. For example, in FIG. 1, when only the first source target 131 is operated to perform sputtering and the second source target 133 and the third source target 135 are not operated, the plurality of side surfaces of the substrates 10 The first metal constituting the first source target 131 is sputtered to form a first metal layer.

When the deposition of the first metal layer is completed, only another source target (eg, the second source target 133) adjacent to the source target (eg, the first source target 131) for sputtering the first metal layer is operated. Thus, sputtering is performed, and the remaining source targets (eg, the first source target 131 and the third source target 135) are not operated. As a result, the second metal constituting the second source target 133 is sputtered on the side surfaces 10 of the plurality of substrates to form a second metal layer deposited on the first metal layer.

When the deposition of the second metal layer is completed, only another source target (eg, the third source target 135) adjacent to the source target (eg, the second source target 133) for sputtering the second metal layer is operated. Then, sputtering is performed, and the remaining source targets (eg, the first source target 131 and the second source target 133) are not operated. As a result, the third metal constituting the third source target 135 is sputtered on the side surfaces 10 of the plurality of substrates, and a third metal layer is deposited on the second metal layer.

In this way, the plurality of source targets 130 are sequentially operated to sequentially stack corresponding metal layers on the side surfaces 10 of the substrate through sputtering, respectively, to finally form a wiring consisting of a plurality of metal layers on the side surfaces 10 of the substrate. .

In this way, when the source target 130 is composed of a plurality, and the plurality of source targets 130 are composed of different metal targets, among the plurality of source targets, any one source target constituting a specific metal target Only is operated to control the sputtering of the metal corresponding to the specific metal target on the side surface of the substrate.

In such an operation process, another source target (eg, the second source target 133) adjacent to one of the source targets (eg, the first source target 131) is It should not be contaminated by sputtering of the metal target constituting the. That is, it is necessary to prevent the metal of a specific metal target constituting any one of the source targets from being deposited on other metal targets constituting another adjacent source target.

To this end, as shown in FIGS. 1 and 17, the deposition apparatus 200 on the side of the substrate with improved deposition adhesion according to the present invention prevents the metal of a source target performing sputtering from being deposited on another adjacent source target. For this purpose, it is preferable to further include a target shutter 190 that covers the surface of another adjacent source target. That is, in the present invention, when the plurality of source targets 130 are composed of different metal targets, a target shutter 190 covering the surface of another source target 130 adjacent to the source target 130 performing sputtering ) Is further included.

1 and 17, the target shutter 190 is disposed to be movable along the moving rail 195. A pair of the moving rails 195 are disposed along both sides of each target source so as not to interfere with sputtering of the plurality of target sources 131, 133, and 135. In addition, the target shutter 190 is disposed in a state in which both sides of the target shutter 190 are engaged with a pair of moving rails disposed along both sides of each target source.

Accordingly, the target shutter 190 may move along the pair of rails 195, and the target shutter 190 may cover the surface of another source target adjacent to a specific source target performing stuttering. Operation is controlled to move and place. As a result, during the sputtering operation of the specific source target, metal components of the metal target constituting the specific source target may be deposited on the adjacent other source target to prevent contamination.

17 illustrates that the target shutter 190 is configured as one and disposed to be movable on the pair of rails 195, but in some cases, the two target shutters 190 are provided with the pair of rails ( 195) may be disposed to be movable. In this case, as shown in FIG. 17, when the center source target 133 is controlled to perform sputtering in a state consisting of three source targets 131, 133, 135, the two target shutters 190 May be controlled to move one by one to the other two adjacent source targets 131 and 135 to cover the surface of each source target.

As described above, according to the present invention, since the source target 130 is composed of a plurality, but all of the source targets 130 are composed of the same metal target or different metal targets, the manufacturing of the substrate and the display device including the substrate The effect of reducing time, effort, and cost for manufacturing and improving manufacturing efficiency occurs.

In addition, according to the present invention, when a plurality of source targets are composed of different metal targets, since a target shutter that covers the surface of another source target adjacent to the source target currently performing sputtering is configured, adjacent sources By blocking the deposition of the metal of the source target performing sputtering on the target, contamination of the adjacent source target is prevented, thereby improving the wiring deposition quality and efficiency of the substrate.

As described above, preferred embodiments of the present invention have been described with reference to the drawings, but those skilled in the art will variously modify the present invention within the scope not departing from the spirit and scope of the present invention described in the following claims. Can be modified or changed.

10: substrate side portion 11: side
13: side adjacent upper surface 15: side adjacent lower surface
20: connection terminal layer 25: terminal protective layer
30: substrate 50: display element
60: upper circuit pattern 70: controller element
80: lower circuit pattern 90: side wiring
100: display device 110: vacuum chamber
120: substrate heating module 123: plasma processing module
125: ion beam processing module
130: source target 131: first source target
133: second source target 135: third source target
140: shield (shield) 141: shield cooling line
150: board mounting jig 151: mounting plate
153: fixing plate 154: catch
155: contact spring 160: cooling block
161: cooling plate 163: substrate cooling line
165: bracket 170: substrate mounting drum
171: circumferential surface 172: opening
173: clasp 190: target shutter
195: moving rail
200: Side substrate deposition apparatus with improved deposition adhesion

Claims (3)

A substrate mounting drum which is rotatably disposed in the chamber and configured to insert and mount at least one substrate in a central direction from a circumferential surface;
At least one source target for depositing a wire on a side surface of the substrate exposed by protruding from the peripheral surface of the substrate mounting drum;
Performing ion beam treatment on the side surface of the substrate, and including an ion beam treatment module for removing the terminal protective layer formed to protect the connection terminal layer provided on the side surface of the substrate and processing the surface modification of the connection terminal layer. A deposition apparatus on the side of a substrate having improved deposition adhesion, characterized in that
The method according to claim 1,
A substrate side deposition apparatus with improved deposition adhesion, characterized in that further comprising at least one of a substrate heating module that performs a heating treatment on the side surface of the substrate and a plasma treatment module that performs a plasma treatment on the side surface of the substrate .
The method according to claim 2,
In the case of including the substrate heating module and the plasma processing module,
The process of performing heating treatment on the side surface of the substrate by driving the substrate heating module while rotating the substrate mounting drum, and performing heating treatment on the side surface of the substrate by driving the plasma processing module while rotating the substrate mounting drum A process and a process of performing ion beam treatment on the side surface of the substrate by driving the ion beam processing module while rotating the substrate mounting drum are sequentially performed.

Images