KR20200121728A - Substrate processing apparatus and method of manufacturing article - Google Patents

Abstract

The present invention relates to a substrate processing apparatus for processing a substrate, which is advantageous in adjusting the temperature of a unit which generates heat according to an operation for processing the substrate and, more specifically, to a substrate processing apparatus comprising: a unit that generates heat according to an operation for processing the substrate; a temperature adjusting part which adjusts the temperature of the unit; and a setting part setting a control parameter for adjusting the temperature of the unit by the temperature adjusting part before the start of the operation based on the information for controlling the operation of the unit.

Description

Substrate processing apparatus and manufacturing method of article TECHNICAL FIELD {SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING ARTICLE}

The present invention relates to a substrate processing apparatus and a method for manufacturing an article.

In the manufacturing process of various devices such as semiconductor devices and liquid crystal display devices, as a substrate processing apparatus, a pattern of an original plate (mask) is projected onto a substrate (wafer), and a photosensitive agent (resist) supplied (applied) on the substrate is exposed. The exposure apparatus to be used is. In such an exposure apparatus, in order to further improve accuracy and productivity (so-called throughput), various improvements such as change of the exposure sequence, the speed profile of the substrate stage, and improvement of the top surface illuminance have been implemented.

For example, in order to improve the throughput, speeding up of a driving unit such as a substrate stage or an original stage has progressed, but accordingly, the amount of heat generated by the related driving unit is increasing. Refrigerant such as water or an inert liquid is used to cool the heat generating unit represented by such a driving unit. The refrigerant whose temperature has risen by absorbing the heat generated by the heat generating unit is temperature controlled (temperature controlled) through a cooler or heat exchange system installed inside or outside the exposure apparatus, and its accuracy is 0.1 in order to maintain the performance of the exposure apparatus. About 0.01 degrees from degrees is required. Techniques relating to such temperature control are proposed in Patent Publication No. 5641709, Japanese Patent Publication No. 2003-133211, and Patent Publication No. 4505668.

However, in recent years, due to an increase in sequence speed due to an improvement in the throughput of the exposure apparatus, there is a characteristic that rapid heat generation and stoppage of heat generation are repeated in a driving unit such as a substrate stage or an original stage. In order to realize the temperature control of the drive unit having such a characteristic, in addition to the feedback control, it is necessary to improve the responsiveness of the feed forward control and the temperature control system itself. However, in recent years, due to the improvement of the performance of the exposure apparatus, the response of temperature control is sometimes not sufficient. Even in such a case, a method of realizing temperature control without deteriorating the performance is required.

In addition, in the exposure apparatus, it is necessary to process various process substrates depending on the user's production cycle or product, so the operating state is not always limited, and heat generation inside the exposure apparatus is also at various timings. Occurs. Therefore, not only is the case in which the response of the temperature control is insufficient is limited, but also the amount of heat generated and the timing are wide, and uniform temperature control is difficult.

The present invention provides a substrate processing apparatus which is advantageous for adjusting the temperature of a unit that generates heat according to an operation for processing a substrate.

A substrate processing apparatus as an aspect of the present invention is a substrate processing apparatus that processes a substrate, a unit that generates heat according to an operation for processing the substrate, a temperature controller that adjusts the temperature of the unit, and the operation of the unit And a setting unit configured to set a control parameter for adjusting the temperature of the unit to the temperature adjusting unit, based on the information for controlling the temperature.

Further objects or other aspects of the present invention will be revealed by the embodiments described below with reference to the accompanying drawings.

According to the present invention, for example, it is possible to provide a substrate processing apparatus which is advantageous for adjusting the temperature of a unit that generates heat according to an operation for processing a substrate.

1 is a schematic diagram showing the configuration of an exposure apparatus as an aspect of the present invention.
Fig. 2 is a diagram showing an example of temperature change of a substrate stage.
3 is a diagram showing an example of temperature change of a substrate stage.
4 is a flowchart for explaining the operation of the exposure apparatus shown in FIG. 1.
Fig. 5 is a timing chart showing the timing of changing the control parameters set in the temperature adjusting unit.
6 is a flowchart for explaining the operation of the exposure apparatus shown in FIG. 1.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. In addition, the following embodiment does not limit the invention pertaining to a claim. Although a plurality of features are described in the embodiment, all of the plurality of features are not limited to being essential for the invention, and a plurality of features may be arbitrarily combined. In addition, in the accompanying drawings, the same reference numerals are assigned to the same or the same configuration, and duplicate descriptions are omitted.

1 is a schematic diagram showing the configuration of an exposure apparatus 100 as an aspect of the present invention. The exposure apparatus 100 is a lithographic apparatus used in a photolithography process, which is a device manufacturing process, and is embodied as a substrate processing apparatus for forming a pattern on the substrate 4 in this embodiment, which processes the substrate 4 .

In addition, the present invention is not limited to the substrate processing apparatus to the exposure apparatus, but can also be applied to an imprint apparatus or a drawing apparatus. Here, the imprint apparatus forms a pattern of the cured product to which the pattern of the mold has been transferred by bringing the imprint material supplied on the substrate into contact with the mold and giving the imprint material energy for curing. The drawing apparatus forms a pattern (latent image pattern) on a substrate by drawing on a substrate with a charged particle beam (electron beam) or a laser beam. Further, the present invention can be applied to apparatuses for processing substrates such as various precision processing apparatuses and various precision measurement apparatuses.

As shown in FIG. 1, the exposure apparatus 100 includes an illumination optical system 1 that illuminates the mask 2, and a projection optical system 3 that projects the pattern image of the mask 2 onto the substrate 4 Wow, it has a board|substrate stage 5 which holds and moves the board|substrate 4, and the control part 17.

The exposure apparatus 100 employs a step-and-scan method or a step-and-repeat method. The exposure apparatus 100 irradiates the mask 2 with the i-line or light emitted from a light source such as a KrF excimer laser or an ARF excimer laser through the illumination optical system 1. The light that has passed through the mask 2 is reduced by the projection optical system 3 and is projected onto the substrate 4 to transfer the pattern of the mask 2 to the substrate 4. In the step-and-scan method, the substrate 4 is exposed while synchronously scanning the mask 2 and the substrate 4, and in the step-and-repeat method, the substrate 4 is stopped while the substrate 4 is stopped. To expose.

The substrate stage 5 is a unit (drive unit) that includes the motor unit 6 and operates (moves) by the motor unit 6. In the present embodiment, the substrate stage 5 is moved (for example, step movement) and stopped in the exposure process of forming a pattern on the substrate 4 by exposing the substrate 4 through the mask 2 in this embodiment. Is repeated at high speed. Since the substrate stage 5, in detail, the motor unit 6 generates heat by repeating such movement and stop, it is necessary to suppress the heat generation of the motor unit 6 and maintain the substrate stage 5 at a target temperature. There is.

There, the exposure apparatus 100 has a temperature adjustment unit 10 that cools the motor unit 6 using a coolant and adjusts the temperature of the substrate stage 5 (temperature adjustment). The temperature adjustment unit 10 includes a tank 11, a pump 12, a heater 13, a cooler 14, and sensors 15 and 16. In this embodiment, the temperature adjustment unit 10 constitutes a circulation system for circulating a refrigerant using the pump 12 as a power source. The temperature control unit 10 stores the refrigerant cooled in the cooler 14 in the tank 11, makes the temperature of the refrigerant in the tank 11 familiar, so that the temperature measured by the sensors 15 and 16 becomes a predetermined temperature. By heating the refrigerant with the heater 13, the temperature of the substrate stage 5 is maintained at the target temperature.

The control unit 17 is constituted by a computer including a CPU, a memory, etc., and operates the exposure apparatus 100 by collectively controlling each part of the exposure apparatus 100 according to a program stored in the storage unit. The control unit 17 controls exposure processing and processing related to exposure processing. In the present embodiment, the control unit 17 controls the temperature adjustment unit 10 so that the temperature of the substrate stage 5 (motor unit 6) becomes a target temperature. As described later, the control unit 17, based on the information for controlling the operation of the substrate stage 5, prior to the start of the operation of the substrate stage 5, the temperature adjusting unit 10 with respect to the temperature adjusting unit 10 ) Functions as a setting unit for setting control parameters for adjusting the temperature of the substrate stage 5.

The temperature control of the substrate stage 5 in the control unit 17 will be described. The control unit 17 normally controls the temperature adjustment unit 10 to feed back so that the temperature measured by the sensors 15 and 16 becomes a predetermined temperature Tv1. Here, the predetermined temperature TDP1 is a control parameter set for the temperature adjustment unit 10 in order to make the temperature of the substrate stage 5 a target temperature. Accordingly, the temperature measured by the sensors 15 and 16 when the substrate stage 5 is the target temperature is set at a predetermined temperature Tv1. However, if there is no difference between the temperature measured by the sensors 15 and 16 and the temperature of the substrate stage 5, the target temperature of the substrate stage 5 may be set at a predetermined temperature Tv1.

On the other hand, the exposure apparatus 100 has recently been required to further improve throughput. Therefore, due to an increase in the amount of heat generated by the motor unit 6 due to an increase in the speed of the substrate stage 5 (higher acceleration or higher speed), or reduction of wasted time of the sequence by optimizing the software of the exposure apparatus 100 The driving frequency of the substrate stage 5 is increasing. Therefore, since the amount of heat generated per unit time of the substrate stage 5 (motor part 6) tends to increase, there is a possibility that the heat generation of the motor part 6 exceeds the temperature adjustment performance of the temperature adjusting part 10. have. The temperature of the substrate stage 5 (motor part 6) temperature-controlled in this state exhibits the behavior shown in Fig. 2, and may exceed the allowable temperature threshold TDM2 of the substrate stage 5. It is a figure showing an example of temperature change of the substrate stage 5, the vertical axis represents the temperature of the substrate stage 5, and the horizontal axis represents time.

In this embodiment, as shown in Fig. 3, the timing before the substrate stage 5 generates heat, that is, before the start of the operation of the substrate stage 5, the temperature adjustment unit 10 is On the other hand, as a control parameter for adjusting the temperature of the substrate stage 5, a temperature Tv1' is set. Specifically, before starting the operation of the substrate stage 5, the control parameter set for the temperature adjustment unit 10 is changed from a predetermined temperature Tv1 (first control parameter) to a temperature Tv1' (second control parameter). do. In addition, the temperature Tv1' is a temperature different from the predetermined temperature Tv1, specifically, a temperature lower than the predetermined temperature Tv1. Accordingly, as shown in Fig. 3, the temperature change (shake width) of the substrate stage 5 (motor part 6) can be reduced, and the temperature of the substrate stage 5 is accommodated within the range of the allowable temperature threshold TDM2. It becomes possible to do. 3 is a diagram showing an example of temperature change of the substrate stage 5 in the present embodiment, the vertical axis indicates the temperature of the substrate stage 5, and the horizontal axis indicates time.

In the exposure apparatus 100, the timing of setting (changing) a control parameter for the temperature adjustment unit 10 is provided for controlling the sequence information of the exposure apparatus 100, specifically, the operation of the substrate stage 5 Decide from information. Accordingly, it is possible to change the control parameters set in the temperature adjustment unit 10 at a timing earlier than the actual operation command is given to the substrate stage 5 and the substrate stage 5 generates heat. Accordingly, it is possible to reduce the temperature change of the substrate stage 5 and improve the accuracy of temperature control of the substrate stage 5.

In addition, if the sequence ends while changing the control parameters set in the temperature adjustment unit 10 and the heat generation of the substrate stage 5 (motor unit 6) stops, the temperature of the substrate stage 5 may drop excessively. There is this. From there, in the present embodiment, when the sequence ends, the control parameters set in the temperature adjustment unit 10 are returned to their original values. Specifically, after the operation of the substrate stage 5 is finished, the control parameter set for the temperature adjustment unit 10 is changed from the temperature TDP1' to the predetermined temperature TDP1. In addition, regarding the timing of returning the control parameters set for the temperature adjustment unit 10 to the original, information for each sequence of the exposure apparatus 100, specifically, information for controlling the operation of the substrate stage 5 Decide.

Referring to Fig. 4, the operation of the exposure apparatus 100 will be described in detail. Here, as the operation of the exposure apparatus 100, a case where the plurality of substrates 4 are continuously exposed will be described as an example.

In S402, the substrate 4 is loaded into the exposure apparatus 100. In S404, the temperature of the substrate 4 carried in the exposure apparatus 100 is adjusted to a temperature suitable for processing in the exposure apparatus 100. In S406, pre-alignment is performed. In pre-alignment, the orientation of the substrate 4 is corrected based on the outer shape of the substrate 4, and the associated substrate 4 is transferred to the substrate stage 5 (substrate 4 is transferred to the substrate stage 5). To hold).

In S408, it is determined whether the substrate stage 5 is operating (ie, operating). When the substrate stage 5 is in operation, the process proceeds to S410. On the other hand, when the substrate stage 5 is not in operation, the process proceeds to S422.

In S410, focus measurement is performed. In the focus measurement, the focus (position of the substrate 4 in the height direction) is measured at each measurement point on the substrate held in the substrate stage 5. In S412, alignment measurement is performed. Alignment measurement is a process of measuring the displacement of the substrate 4, for example, a process of measuring the displacement of the substrate 4 and the substrate stage 5, or the mask 2 and the substrate 4 It includes a process of measuring the positional shift between and.

In S414, exposure is performed. In exposure, based on the result of the focus measurement in S410 or the result of the alignment measurement in S412, the substrate 4 is synchronously scanned with the mask 2 and the substrate 4, or while the substrate 4 is stopped. ) Is exposed.

In exposure, since the substrate stage 5 repeats movement and stop at high speed, and the motor unit 6 generates heat, as described above, the substrate stage 5 is normally controlled by feedback control of the temperature controller 10. ) To control the temperature. However, after the exposure is started, that is, after the operation of the substrate stage 5 is started, the response of the temperature control of the temperature adjustment unit 10 is changed by changing the control parameter set in the temperature adjustment unit 10 In some cases, it is not enough, and the temperature rise of the substrate stage 5 (motor part 6) cannot be completely suppressed.

In this embodiment, as shown in Fig. 4, it is the timing between the pre-alignment (S406) and the focus measurement (S410) before the start of the operation of the substrate stage 5, specifically, the substrate When the stage 5 is not in operation, S422 is performed. In S422, the control parameter set for the temperature adjustment unit 10 is changed. Specifically, as described above, the control parameter set for the temperature adjustment unit 10 is changed from the predetermined temperature Tv1 to the temperature Tv1'. Accordingly, the refrigerant can be lowered in advance with respect to heat generated by the substrate stage 5 (motor unit 6), and as shown in Fig. 3, the temperature change of the substrate stage 5 is reduced, and the substrate stage 5 The temperature of can be accommodated within the range of the permissible temperature threshold Tv2.

In S416, it is determined whether or not the substrate 4 exposed in S414 is the final substrate. For example, when one lot includes 25 substrates 4, the 25th substrate is the final substrate. When the substrate 4 exposed in S414 is not the final substrate, the process proceeds to S418. In S418, the substrate 4 is taken out from the exposure apparatus 100. On the other hand, when the substrate 4 exposed in S414 is the final substrate, the process proceeds to S424. When the exposure of the final substrate is completed, the substrate stage 5 does not generate heat. In S424, the control parameters set for the temperature adjustment unit 10 are changed (return to the original control parameters). Specifically, as described above, the control parameter set for the temperature adjustment unit 10 is changed from the temperature Tv1' to the predetermined temperature Tv1. Accordingly, it is possible to prevent the temperature of the substrate stage 5 from dropping excessively, and to maintain the temperature of the substrate stage 5 at the target temperature.

In the case of continuously exposing the plurality of substrates 4, the sequence shown in Fig. 4 is repeated. In this case, a timing chart showing at what timing the control parameters set in the temperature adjustment unit 10 are changed is shown in FIG. Referring to Fig. 5, with respect to the first substrate 4 carried in the exposure apparatus 100, as described above, steps S402 to S418, and S422 are performed, but this is not the final substrate. The process of S424 is not performed.

Next, with respect to the second substrate 4 carried in the exposure apparatus 100, each step is performed in the same manner as the first substrate 4, but the pre-alignment (S406) of the second substrate 4 The timing overlaps the timing of the exposure (S414) of the first substrate 4. Therefore, since the substrate stage 5 is in operation, the step S422 is not performed. In this way, in the processing of the second substrate 4, whether the substrate stage 5 is already operating at the timing of the pre-alignment (S406), and the control parameters set in the temperature adjustment unit 10 have already been changed. Check if there is. Then, the control parameter is changed only when the substrate stage 5 is not operating and the control parameter set in the temperature adjustment unit 10 is not changed. In the same manner as the processing for the first substrate 4, in the processing for the second substrate 4, since it is not the final substrate, the step S424 is not performed. Until the processing to the N-th substrate 4, the same processing is performed.

Next, with respect to the final substrate carried into the exposure apparatus 100, each process is performed in the same manner as the first substrate 4, but the process of S422 is not performed similarly to the process up to the N-th substrate 4 Does not. However, when the exposure (S414) of the final substrate is completed, the substrate stage 5 does not generate heat, so the step of S424 is performed.

In the present embodiment, it is assumed that the control parameters set for the temperature adjustment unit 10 are changed at the timing of starting the pre-alignment, specifically, the timing of starting the measurement of the outer shape of the substrate 4. It is not limited to For example, at the timing at which the measurement of the outer shape of the substrate 4 ends, the timing to start correction of the direction of the substrate 4, or the timing at which the correction of the direction of the substrate 4 ends, the temperature adjustment unit 10 You may change the control parameters set for ).

In addition, in the present embodiment, the case of changing the control parameters set for the temperature adjusting unit 10 in the timing of pre-alignment of the first substrate 4 and the timing of exposure of the final substrate has been described as an example. It is not limited to this. In consideration of the temperature adjustment performance and responsiveness of the temperature adjustment unit 10 of the exposure apparatus 100, the control parameter may be changed at other timings.

In the present embodiment, the control parameters set for the temperature adjustment unit 10 are changed at the timing of pre-alignment, but the temperature adjustment unit 10 at the previous step, that is, the timing at which the substrate 4 is loaded. You may change the set control parameter. In this case, for example, it is possible to change the control parameters set for the temperature adjustment unit 10 at the timing of handing the substrate 4 to the substrate hand or the timing of transporting the substrate 4 to the pre-alignment position. .

In addition, in S404, as described above, the temperature of the substrate 4 is adjusted to a temperature (optimum temperature) suitable for processing in the exposure apparatus 100. Accordingly, the timing at which the subsequent processes are started varies depending on the timing at which the temperature of the substrate 4 is accommodated in the allowable range with respect to the optimum temperature or the timing at which the temperature of the substrate 4 reaches the optimum temperature. There, you may change the control parameter set with respect to the temperature adjustment part 10 at the related timing.

Thus, before the start of the operation of the substrate stage 5, it is possible to change the control parameters set for the temperature adjustment unit 10. Specifically, at any one timing of carrying in the substrate 4 (S402), temperature adjustment (S404), pre-alignment (S406), focus measurement (S408), and alignment measurement (S410), the temperature adjustment unit 10 It is good to change the control parameters set for.

Incidentally, the number of times the control parameter set for the temperature adjustment unit 10 is changed is not limited to one, and may be multiple times. In this case, it is possible to change the control parameter in a predetermined range according to the result of each process.

The timing at which the control parameters set for the temperature adjustment unit 10 should be changed is determined in the control unit 17 based on information for controlling the operation of the substrate stage 5. Here, the information for controlling the operation of the substrate stage 5 includes, for example, at least one of layout information of the substrate 4, information about exposure conditions, and information about alignment. The layout information of the substrate 4 is information indicating an arrangement of shot regions (process target regions) on the substrate. The information about the exposure conditions is information about the processing conditions for processing the substrate 4, and includes, for example, an exposure amount and an exposure mode. The information about alignment is information about a mark to be measured for aligning the substrate 4 or information indicating a short area (sample shot area) in which marks are measured to align the substrate 4. The control unit 17 generates a profile of the operation of the substrate stage 5, a so-called driving profile, from these information, and changes the control parameters set for the temperature adjustment unit 10 based on the related driving profile. Decide when to do it. In this case, before operating the exposure apparatus 100, the timing at which the control parameter set for the temperature controller 10 should be changed may be determined in advance.

Further, the information for controlling the operation of the substrate stage 5 may be, for example, at least one of substrate processing start information, alignment measurement start information, alignment measurement retry information, and error information. The substrate processing start information is information instructing the start of exposure (processing) of the substrate 4, and the alignment measurement start information is information instructing the start of alignment of the substrate 4. The alignment measurement retry information is information indicating a retry of alignment of the substrate 4, and the error information is information indicating an error relating to exposure or alignment (processing) of the substrate 4. The control unit 17 determines the timing at which the control parameters set for the temperature adjustment unit 10 should be changed from these information. In this case, while the exposure apparatus 100 is operated, the timing at which the control parameter set for the temperature controller 10 should be changed can be determined in real time.

Further, the information for controlling the operation of the substrate stage 5 may be, for example, at least one of substrate processing progress information and substrate position information. The substrate processing progress information is information indicating the progress of the processing of the substrate 4, and the substrate position information is information indicating the position of the substrate 4 in the exposure apparatus. The control unit 17 determines the timing at which the control parameters set for the temperature adjustment unit 10 should be changed from these information. In this case, the timing at which the control parameter set for the temperature adjustment unit 10 should be changed may be determined in real time according to the processing condition of the exposure apparatus 100.

In addition, in the present embodiment, the temperature adjustment unit 10 sets a control parameter for adjusting the temperature of the substrate stage 5, and the temperature measured by the sensors 15 and 16 when the substrate stage 5 is a target temperature (substrate stage ( 5) target temperature), but is not limited to this. The control parameter is, for example, a parameter for turning on/off the temperature adjustment of the substrate stage 5 by the temperature adjusting unit 10 or a parameter indicating a threshold for determining an abnormality in the temperature of the substrate stage 5 (i.e. , The allowable temperature threshold TDM2) may be used.

In addition, in this embodiment, although the unit which generates heat according to the operation for processing the substrate 4 was described as the substrate stage 5, it is not limited to this. The unit that generates heat according to the operation for processing the substrate 4 is a unit that operates or changes temperature in conjunction with the operation of the substrate stage 5, for example, a mask stage or exposure that moves while holding the mask 2 It may be a vibration suppression device that reduces the vibration of the device 100.

In addition, with regard to the change of the control parameter set for the temperature adjustment unit 10, processing when an abnormality occurs in the exposure apparatus 100 becomes important. 6 is a flowchart showing the operation of the exposure apparatus 100 when an abnormality occurs in the exposure apparatus 100. In the exposure apparatus 100, when an abnormality occurs inside or outside the apparatus, it is necessary to stop the operation or perform a recovery process for recovering from the abnormal state. Therefore, the control parameter changed by the normal operation of the exposure apparatus 100 must be returned to the control parameter before the change when an abnormality occurs in the exposure apparatus 100. In the operation of the exposure apparatus 100, there is a possibility that an abnormality may occur in each step. There, as shown in Fig. 6, for each step, a step of changing (returning) the control parameter set for the temperature adjusting unit 10 is added.

Further, as shown in Fig. 6, when the exposure apparatus 100 returns from an abnormal state, the control parameter set for the temperature adjustment unit 10 is changed according to the state of the substrate stage 5. Specifically, the temperature of the substrate stage 5 is checked, and the timing of changing (returning) the control parameter set for the temperature adjusting unit 10 is determined in accordance with the deviation from the predetermined temperature Tv1. Then, in the recovery processing, at the determined timing, the control parameter set for the temperature adjustment unit 10 is changed (returned).

The manufacturing method of an article in the embodiment of the present invention is suitable for manufacturing an article such as a device (semiconductor element, magnetic storage medium, liquid crystal display element, etc.), for example. A related manufacturing method includes a step of forming a pattern on a substrate using the exposure apparatus 100, a step of processing a substrate on which the pattern is formed, and a step of manufacturing an article from the treated substrate. In addition, the related manufacturing method may include other known processes (oxidation, film formation, vapor deposition, doping, planarization, etching, resist peeling, dicing, bonding, packaging, etc.). Compared with the conventional method, the manufacturing method of an article in this embodiment is advantageous in at least one of performance, quality, productivity, and production code of an article.

The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to clarify the scope of the invention.

Claims (11)

It is a substrate processing apparatus that processes a substrate,
A unit that generates heat according to an operation for processing the substrate,
A temperature adjustment unit that adjusts the temperature of the unit,
Based on the information for controlling the operation of the unit, before starting the operation, a setting unit for setting a control parameter for the temperature adjusting unit to adjust the temperature of the unit,
A substrate processing apparatus having a.
The method of claim 1,
The setting unit, based on the information, determines a timing at which the control parameter should be set for the temperature adjustment unit, and sets the control parameter at the timing.
The method of claim 2,
And the setting unit generates a profile of the operation of the unit from the information, and determines the timing based on the profile.
The method of claim 2,
The information includes information indicating the arrangement of the processing target regions on the substrate, information indicating processing conditions for processing the substrate, information about marks to be measured to align the substrate, and marks for aligning the substrate. A substrate processing apparatus comprising at least one of information indicating an area to be processed for measuring a.
The method of claim 1,
The information includes information instructing the start of processing of the substrate, information instructing the start of alignment of the substrate, information instructing retry of the alignment of the substrate, and information indicating an error relating to processing of the substrate. A substrate processing apparatus comprising at least one of.
The method of claim 1,
The information includes at least one of information indicating a progress of processing of the substrate and information indicating a position of the substrate in the substrate processing apparatus.
The method of claim 1,
The control parameter is at least one of a parameter indicating a target temperature of the unit, a parameter for turning ON/OFF the temperature of the unit by the temperature adjusting unit, and a parameter indicating a threshold value for determining an abnormality in the temperature of the unit. A substrate processing apparatus comprising one.
The method of claim 1,
The setting unit, before the start of the operation, changes the control parameter from a first control parameter to a second control parameter different from the first control parameter, and after the operation ends, the control parameter is changed to the second control parameter. And changing from to the first control parameter.
The method of claim 1,
And the unit includes a stage for holding and moving the substrate.
The method of claim 9,
And a projection optical system for projecting an image of a mask pattern onto the substrate held in the stage.
A step of forming a pattern on a substrate using the substrate processing apparatus according to claim 1, and
A process of processing the substrate on which the pattern is formed in the process,
The process of manufacturing an article from the processed substrate,
A method of manufacturing an article, characterized in that it has.

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