KR20200121207A - Fabrication of printed circuit boards with tamper-proof tap terminals - Google Patents

Fabrication of printed circuit boards with tamper-proof tap terminals Download PDF

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Publication number
KR20200121207A
KR20200121207A KR1020190043982A KR20190043982A KR20200121207A KR 20200121207 A KR20200121207 A KR 20200121207A KR 1020190043982 A KR1020190043982 A KR 1020190043982A KR 20190043982 A KR20190043982 A KR 20190043982A KR 20200121207 A KR20200121207 A KR 20200121207A
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South Korea
Prior art keywords
printed circuit
circuit board
manufacturing
tab terminal
plating
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KR1020190043982A
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Korean (ko)
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박진우
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주식회사 티에스씨테크놀러지
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Priority to KR1020190043982A priority Critical patent/KR20200121207A/en
Publication of KR20200121207A publication Critical patent/KR20200121207A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching

Abstract

The present invention relates to a method of manufacturing a printed circuit board (PCB). According to the prior art, a socket-insertable printed circuit board, when the PCB is inserted into a socket, causes problems such as peeling and separation of a plating bar formed on a tab terminal and an electrical short. Accordingly, since the present invention provides the method of manufacturing the printed circuit board having a damage prevention tab terminal to prevent damage to a plated wire formed on the tap terminal, it is possible to prevent problems such as appearance defects and electrical shorts due to damage and peeling of the plated wire, and in addition, it is possible to increase the productivity and economic feasibility thereof by applying a manufacturing apparatus and method according to the prior art without an additional device.

Description

손상방지된탭단자를갖는인쇄회로기판의제조{Fabrication of printed circuit boards with tamper-proof tap terminals}Fabrication of printed circuit boards with tamper-proof tap terminals

본 발명의 목적은 전자 부품의 소켓 삽입 시 발생되는 도금선을 포함하는 탭 단자의 손상을 방지하기 위해, 손상 방지된 탭 단자를 갖는 인쇄회로기판의 제조방법을 제공하는데 있다.An object of the present invention is to provide a method of manufacturing a printed circuit board having a tab terminal with a damaged tab terminal in order to prevent damage to a tab terminal including a plated line that occurs when an electronic component is inserted into a socket.

본 발명은 인쇄회로기판(printed circuit board; PCB)의 제조방법에 관한 것으로, 더욱 상세하게는 소켓(socket) 삽입형 인쇄회로기판의 탭 단자(tab)에 형성된 도금선(plating bar)의 손상을 방지하기 위한 손상 방지된 탭 단자를 갖는 인쇄회로기판의 제조방법에 대한 것이다.The present invention relates to a method of manufacturing a printed circuit board (PCB), and more particularly, to prevent damage to a plating bar formed on a tab terminal of a socket-insertable printed circuit board. The present invention relates to a method of manufacturing a printed circuit board having a tab terminal to prevent damage.

인쇄회로기판은 소정의 회로가 형성된 전도층과 절연층을 교대로 적층하여 일련의 공정을 거쳐 형성되어, 전기 배선 및 전자 부품의 실장부 기능을 겸비하는 전자부품이다. 최근 전자 기기가 대용량화, 고속화, 다기능화 및 소형 경박화됨에A printed circuit board is an electronic component that is formed through a series of processes by alternately stacking a conductive layer and an insulating layer on which a predetermined circuit is formed, and functions as a mounting unit for electric wiring and electronic components. Recently, electronic devices have become large-capacity, high-speed, multifunctional and small-sized, light-weight.

따라, 인쇄회로기판도 다양한 소재와 형태로 개발되고 있다. 이에 따라, 인쇄회로기판의 내층과 외층에 형성된 회로는 미세 피치(fine pitch)화 및 고집적화 되고 있고, 절연층은 그 두께가 얇아짐과 동시에 저유전율 소재로의 개발이 이루Accordingly, printed circuit boards are also being developed in various materials and shapes. Accordingly, circuits formed on the inner and outer layers of the printed circuit board are fine pitched and highly integrated, and the thickness of the insulating layer is reduced and the development of a low dielectric constant material is achieved.

어지고 있는 추세이다.It is a breaking trend.

일반적으로 인쇄회로기판의 제조공정은, 적층, 드릴링(drilling), 내층과 외층의 회로 형성, 솔더 마스크(solder mask), 전해 도금(electro plating), 무전해 도금(electroless plating), 라우터(router) 공정, 검사 및 테스트 등의 단계로In general, the manufacturing process of a printed circuit board is lamination, drilling, circuit formation of inner and outer layers, solder mask, electro plating, electroless plating, and router. Process, inspection and testing

이루어진다.Done.

내층과 외층의 회로 형성 공정은 구리 전도층에 임의의 회로를 형성하는 공정이며, 적층은 절연층과 전도층을 교대로 적층시켜 소정의 두께를 갖는 적층체가 되도록 열과 압력을 가하는 공정이다. 드릴링은 비트(bit)를 이용한 기계 드릴The circuit formation process of the inner layer and the outer layer is a process of forming an arbitrary circuit on the copper conductive layer, and the lamination is a process of applying heat and pressure to a laminate having a predetermined thickness by alternately laminating an insulating layer and a conductive layer. Drilling is a mechanical drill using a bit

또는 레이져 드릴을 이용하여 층간의 전기적 연결구인 비아 홀(via hole)을 형성하는 공정이며, 보호막 형성은 외층 공정까지 완료된 반제품 상태의 인쇄회로기판의 표면에 솔더 레지스트(solder resist), 포토 솔더 레지스트(photo soldAlternatively, it is a process of forming a via hole, which is an electrical connection between layers, using a laser drill, and the protective film is formed on the surface of a semi-finished printed circuit board with a solder resist or photo solder resist ( photo sold

er resist)등으로 이루어진 보호막을 형성하는 공정이다.er resist), etc.

라우터 공정은 작업 판넬(working panel)상에 나열된 복수개의 인쇄회로기판을 개별 또는 어레이(array) 단위로 분리하는 공정이다. 전해 도금과 무전해 도금 단계는 드릴 공정이 완성된 후 소정의 두께로 구리층을 형성하거나 솔더 마스The router process is a process of separating a plurality of printed circuit boards arranged on a working panel into individual or array units. In the electroplating and electroless plating steps, after the drilling process is completed, a copper layer is formed with a predetermined thickness or solder mask.

크 공정이 완료된 후 탭 단자와 패드부분에 금, 니켈 등을 형성시키는 단계이다. 또한 검사 단계는 인쇄회로기판의 내층 또는 외형을 검사하는 단계로써 육안 검사와 자동 검사기를 이용하여 완성된 인쇄회로기판의 구리 노출, 솔더 마스크This is a step of forming gold, nickel, etc. on the tab terminals and pads after the process is completed. In addition, the inspection step is to inspect the inner layer or the outer shape of the printed circuit board. Using a visual inspection and an automatic inspection machine, the finished printed circuit board is exposed to copper and solder mask

들뜸, 휨 등의 불량을 검사하는 단계이다. 더불어 테스트는 인쇄회로기판의 전기적 특성을 검사하기 위한 단계로써 번인 보드 테스트(burn in board test), 임피던스 테스트(impedance test) 등이 있다.This is the step of inspecting defects such as lifting and bending. In addition, the test is a step to check the electrical characteristics of the printed circuit board, such as a burn in board test and an impedance test.

이하, 도면을 참조하여 종래 기술에 따른 인쇄회로기판을 설명하겠다.Hereinafter, a printed circuit board according to the prior art will be described with reference to the drawings.

도 1은 종래 기술에 따른 탭 단자를 포함하는 인쇄회로기판의 일부분을 나타낸 도이다.1 is a view showing a part of a printed circuit board including a tab terminal according to the prior art.

종래 기술에 따른 인쇄회로기판(100)은, 절연층과 소정의 회로로 형성된 전도층이 복수 회 적층되어 형성된 적층체(101)와, 적층체(101)를 관통하는 복수개의 비아 홀과, 적층체(101)의 양면에 형성된 전도성 재질로 형성된 회로와 도The conventional printed circuit board 100 includes a laminate 101 formed by stacking an insulating layer and a conductive layer formed of a predetermined circuit a plurality of times, a plurality of via holes penetrating the laminate 101, and stacking Circuit and diagram formed of conductive material formed on both sides of the sieve 101

금선(103a)을 포함하는 탭 단자(103) 및 적층체의 양면에 부분적으로 도포되는 보호막(120)을 포함한다.It includes a tab terminal 103 including a gold wire 103a and a protective film 120 partially coated on both surfaces of the laminate.

탭 단자(103)는 인쇄회로기판(100)의 일측 모서리에 소정의 크기와 개수로 형성되며, 그 끝부분에 도금선(103a)이 형성된다. 도금선(103a)은 솔더 마스크 공정이 완료된 인쇄회로기판(100)의 탭 단자 및 패드의 금도금을 위한 전해The tab terminal 103 is formed in a predetermined size and number at one edge of the printed circuit board 100, and a plated line 103a is formed at the end thereof. The plating line 103a is electrolytic for gold plating of the tab terminal and pad of the printed circuit board 100 on which the solder mask process is completed.

도금 공정 시, 전기적 연결을 위해 형성되는 부분이다. 금도금을 위한 전해 도금이 완료된 도금선(103a)은 구리(Cu) 재질과 그 구리 재질 위에 형성된 금(Au; 또는 금과 니켈(Ni)) 재질로 이루어진다.During the plating process, it is a part formed for electrical connection. The plating wire 103a on which the electrolytic plating for gold plating is completed is made of a copper (Cu) material and a gold (Au; or gold and nickel (Ni)) material formed on the copper material.

이와 같은 탭 단자(103)는 소켓에 삽입됨으로써, 소켓을 포함하는 전자부품과 전기적으로 연결된다. 그러나, 인쇄회로 기판(100)의 소켓 삽입 시, 상술한 바와 같이 탭 단자(103)는 금, 구리와 같이 비교적 경도가 낮은 재질로 얇고 좁게The tab terminal 103 is inserted into the socket to be electrically connected to the electronic component including the socket. However, when the socket is inserted into the printed circuit board 100, as described above, the tab terminal 103 is made of a material having a relatively low hardness such as gold and copper.

형성되어 있으므로 긁힘(scratch), 벗겨짐(peeling) 등의 물리적 손상이 쉽게 야기된다. 특히 도금선(103a)은 쉽게 벗겨지거나, 탭 단자(103)로부터 분리되어 주변의 탭 단자(103)사이에 위치하여 전기적 쇼트(short)등을 발생시킬Since it is formed, physical damage such as scratch and peeling is easily caused. In particular, the plated wire 103a is easily peeled off or separated from the tab terminal 103 and positioned between the surrounding tab terminals 103 to cause an electrical short.

수 있다. 이를 방지하기 위해 탭 단자(103)와 도금선(103a)의 경도가 향상되도록 무전해 도금을 추가로 실시할 수 있으나, 무전해 도금층으로 사용되는 주재질은 비교적 값비싼 재질의 금이 사용되므로 비경제적이다.I can. To prevent this, electroless plating may be additionally performed to improve the hardness of the tab terminal 103 and the plating line 103a, but the main material used as the electroless plating layer is a relatively expensive material, so it is expensive. It is economical.

따라서, 본 발명의 목적은 전자 부품의 소켓 삽입 시 발생되는 도금선을 포함하는 탭 단자의 손상을 방지하기 위해, 손상 방지된 탭 단자를 갖는 인쇄회로기판의 제조방법을 제공하는데 있다.Accordingly, an object of the present invention is to provide a method of manufacturing a printed circuit board having a tab terminal with a damaged tab terminal in order to prevent damage to a tab terminal including a plated line that occurs when an electronic component is inserted into a socket.

본 명세서와 도면에 개시된 본 발명의 실시예들은 이해를 돕기 위해 특정 예를 제시한 것에 지나지 않으며, 본 발명의 범위를 한정하고자 하는 것은 아니다. 여기에 개시된 실시예들 이외에도 본 발명의 기술적 사상에 바탕을 둔 다른Embodiments of the present invention disclosed in the present specification and drawings are merely presented specific examples to aid understanding, and are not intended to limit the scope of the present invention. In addition to the embodiments disclosed herein, other

변형예들이 실시 가능하다는 것은, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 자명한 것이다.It is apparent to those of ordinary skill in the art to which the present invention pertains that modifications are possible.

예를 들어, 롤러에 의한 챔퍼링법 이외에도 사포 등을 이용한 연마를 통해 도금선을 포함하는 모서리가 각도를 갖는 면으로 형성되도록 제거하는 또 다른 방식의 챔퍼링법을 이용 할 수 있다.For example, in addition to the chamfering method using a roller, another method of chamfering may be used in which the edge including the plating line is removed to form an angled surface through polishing using sandpaper or the like.

본 발명의 방법을 따르면, 솔더 마스크 공정 시 도금선에 추가의 보호막을 형성하고, 라우터 공정에서 도금선을 제거하며, 챔퍼링에 의해 도금선을 포함하는 인쇄회로기판의 모서리를 압착함으로써, 전자 부품의 소켓에 삽입 시 손상되는According to the method of the present invention, an additional protective film is formed on the plated line during the solder mask process, the plated line is removed in the router process, and the edge of the printed circuit board including the plated line is compressed by chamfering. Damaged when inserted into the socket of the

도금선을 포함하는 탭 단자의 손상을 방지할 수 있다.It is possible to prevent damage to the tab terminal including the plated wire.

따라서, 도금선의 손상 및 벗겨짐에 의한 외형 불량 및 전기적 쇼트 등의 문제가 방지 될 수 있다. 또한 추가의 장치 없이 종래 기술에 따른 제조 장치와 방법을 적용함으로써 그 생산성 및 경제성이 증대될 수 있다.Accordingly, problems such as an appearance defect and an electrical short due to damage and peeling of the plating line can be prevented. In addition, productivity and economy thereof can be increased by applying the manufacturing apparatus and method according to the prior art without additional apparatus.

도 1은 종래 기술에 따른 탭 단자를 포함하는 인쇄회로기판의 사시도,
도 2는 본 발명의 제 1실시예에 따른 탭 단자를 포함하는 인쇄회로기판의 사시도,
도 3은 본 발명의 제 2실시예에 따른 탭 단자를 포함하는 인쇄회로기판의 사시도,
도 4는 본 발명의 제 3실시예에 따른 탭 단자를 포함하는 인쇄회로기판의 사시도이다.1 is a perspective view of a printed circuit board including a tab terminal according to the prior art,
2 is a perspective view of a printed circuit board including a tab terminal according to a first embodiment of the present invention;
3 is a perspective view of a printed circuit board including a tab terminal according to a second embodiment of the present invention;
4 is a perspective view of a printed circuit board including a tab terminal according to a third embodiment of the present invention.

상기 목적을 달성하기 위하여, 본 발명에 따른 손상 방지된 탭 단자를 갖는 인쇄회로기판의 제조방법은, 회로 형성, 드릴링, 솔더 마스크, 전해 도금, 무전해 도금, 라우터 공정, 검사 및 테스트 등의 단계로 이루어지는 인쇄회로기판의 제조In order to achieve the above object, the method of manufacturing a printed circuit board having a damaged tab terminal according to the present invention includes steps such as circuit formation, drilling, solder mask, electroplating, electroless plating, router process, inspection, and testing. Manufacturing of printed circuit board consisting of

공정에 있어서, 솔더 마스크 공정은 도금선의 상단에 포토 레지스트 또는 포토 솔더 레지스트와 같은 보호막을 형성하는 단계를 포함하는 것을 특징으로 한다.In the process, the solder mask process is characterized in that it includes the step of forming a protective film such as photoresist or photo solder resist on the top of the plating line.

본 발명에 따른 손상 방지된 탭 단자를 갖는 인쇄회로기판의 다른 제조방법은, 회로 형성, 드릴링, 솔더 마스크, 전해 도금, 무전해 도금, 라우터 공정, 검사 및 테스트 등의 단계로 이루어지는 인쇄회로기판의 제조 공정에 있어서, 라우터 공Another method of manufacturing a printed circuit board having a damaged tab terminal according to the present invention is a printed circuit board comprising steps such as circuit formation, drilling, solder mask, electroplating, electroless plating, router process, inspection and testing. In the manufacturing process, router balls

정은 도금선을 제거하는 단계를 포함하는 것을 특징으로 한다.It characterized in that it comprises the step of removing the plating line.

본 발명에 따른 손상 방지된 탭 단자를 갖는 인쇄회로기판의 또 다른 제조방법은, 회로 형성, 드릴링, 솔더 마스크, 전해도금, 무전해 도금, 라우터 공정, 검사 및 테스트 등의 단계로 이루어지는 인쇄회로기판의 제조 공정에 있어서, 라우터Another manufacturing method of a printed circuit board having a damaged tab terminal according to the present invention is a printed circuit board comprising steps such as circuit formation, drilling, solder mask, electroplating, electroless plating, router process, inspection and testing. In the manufacturing process of the router

공정은 인쇄회로기판의 도금선을 포함하는 모서리들을 롤러(roller)에 의해 챔퍼링(chamfering)함으로써 소정의 각도를 갖는 면으로 형성하는 단계를 더 포함하는 것을 특징으로 한다.The process further includes forming the edges of the printed circuit board including the plating lines into a surface having a predetermined angle by chamfering by using a roller.

이하, 첨부 도면을 참조하여 본 발명의 실시예를 보다 상세하게 설명하고자 한다.Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

도 2는 본 발명의 제 1실시예에 따른 탭 단자를 포함하는 인쇄회로기판의 사시도이다.2 is a perspective view of a printed circuit board including a tab terminal according to a first embodiment of the present invention.

본 발명에 따른 손상 방지된 탭 단자를 갖는 인쇄회로기판(200)의 제조방법은, 적층체(201)의 외측에 보호막(220)을 부분적으로 형성하는 솔더 마스크 공정에서, 도금선(203a) 상에도 포토 레지스트 또는 포토 솔더 레지스트와 같은 보호막(220)을 형성하는 것을 포함한다.The manufacturing method of the printed circuit board 200 having the damaged tab terminal according to the present invention is, in the solder mask process of partially forming the protective film 220 on the outside of the laminate 201, on the plating line 203a. Edo includes forming a protective film 220 such as photoresist or photo solder resist.

도금선(230a) 상의 보호막(220) 형성은 솔더 마스크 공정 시 마스크의 패턴 디자인을 변경하여 제작함으로써 가능하다. 이 때 소켓에 삽입될 수 있는 인쇄회로기판(200)의 두께를 고려하여, 도금층과 보호막(220)의 두께를 조절함으로The protective layer 220 on the plating line 230a can be formed by changing the pattern design of the mask during the solder mask process. In this case, by adjusting the thickness of the plating layer and the protective film 220 in consideration of the thickness of the printed circuit board 200 that can be inserted into the socket.

써 인쇄회로기판(200)의 소켓 삽입이 용이하도록 한다.To facilitate the socket insertion of the printed circuit board 200.

이와 같은 방법에 의해 제조된 인쇄회로기판(200)의 보호막(220)은 도금선(203a)의 보호 기능과 함께, 소켓 삽입 시윤활 작용을 함으로써, 소켓 삽입에 의한 도금선(203a)의 긁힘이나 벗겨짐 등이 방지된다.The protective film 220 of the printed circuit board 200 manufactured by such a method has a protective function of the plated line 203a and a lubricating function when the socket is inserted, so that the plated line 203a is scratched by the socket insertion. Peeling, etc. are prevented.

도 3은 본 발명의 제 2실시예에 따른 탭 단자를 포함하는 인쇄회로기판의 사시도이다.3 is a perspective view of a printed circuit board including a tab terminal according to a second embodiment of the present invention.

본 발명에 따른 손상 방지된 탭 단자를 갖는 인쇄회로기판(300)의 다른 제조방법은, 인쇄회로기판(300)의 라우터 공정에서, 도금선을 제거하는 것을 포함한다.Another manufacturing method of a printed circuit board 300 having a damaged tab terminal according to the present invention includes removing a plated line in a router process of the printed circuit board 300.

라우터 공정은 인쇄회로기판(300)의 종류와 그 크기 등에 부합되도록 만들어진 프로그램을 실행시키고, 이에 따라 라우터의 비트가 작동됨으로써 복수개의 인쇄회로기판(300)을 포함하는 작업 판넬(working panel)을 개별 또는 어레이In the router process, a program made to match the type and size of the printed circuit board 300 is executed, and accordingly, the bits of the router are operated to separate a working panel including a plurality of printed circuit boards 300. Or array

(array) 단위의 인쇄회로기판(300)으로 분리하는 공정이다. 따라서 절단되는 면적이 변경되도록 프로그램을 수정함으로써, 도금선의 절단이 가능하다. 이 때, 탭 단자(303)는 소정의 크기로 형성되어 소켓과의 전기적 연결이 원활하도록This is a process of separating into the printed circuit board 300 in (array) unit. Therefore, by modifying the program so that the cut area is changed, it is possible to cut the plated line. At this time, the tab terminal 303 is formed in a predetermined size to facilitate electrical connection with the socket.

한다.do.

라우터 공정에 의해 도금선을 제거함으로써, 도금선의 벗겨짐, 긁힘, 쇼트 등의 문제가 미연에 방지된다.By removing the plated line by the router process, problems such as peeling, scratches, and short circuits of the plated line are prevented in advance.

도 4는 본 발명의 제 3실시예에 따른 탭 단자를 포함하는 인쇄회로기판의 사시도이다.4 is a perspective view of a printed circuit board including a tab terminal according to a third embodiment of the present invention.

본 발명에 따른 손상 방지된 탭 단자(403a)를 갖는 인쇄회로기판(400)의 또 다른 제조방법은, 라우터 공정까지 완료 된 인쇄회로기판(400)에서, 도금선(403a)을 포함하는 모서리들이 소정의 각도를 갖는 면으로 형성되도록 롤러를 이Another manufacturing method of the printed circuit board 400 having the damaged tab terminal 403a according to the present invention is, in the printed circuit board 400 completed up to the router process, edges including the plating line 403a are Move the roller so that it is formed into a surface having a predetermined angle.

용하여 챔퍼링하는 것이다.It is to chamfer by melting.

인쇄회로기판(400)에서 탭 단자(403)가 위치하는 부분의 모서리는 롤러에 의해 압착됨으로써, A와 같이 소정의 각도를 갖는 면으로 변형된다. 이 때, 탭 단자(403)는 소정의 크기로 형성되어 소켓과의 전기적 연결이 원활하도록 한다.The edge of the portion of the printed circuit board 400 where the tab terminal 403 is positioned is compressed by a roller, so that it is transformed into a surface having a predetermined angle, such as A. At this time, the tab terminal 403 is formed in a predetermined size to facilitate electrical connection with the socket.

따라서 도금선(403a)은 소켓과 부착되는 면적이 감소되고, 소켓에 삽입되는 인쇄회로기판(400)의 두께가 부분적으로 감소되므로, 도금선(403a)의 물리적 손상이 감소 될 수 있다. 더불어, 도금선의 재질인 구리와 금의 연성으로 인해 라우터 공정 시 발생 될 수 있는 버(burr)를 롤러에 의해 압착함으로써, 버 제거 효과와 동시에 그 발생 정도를 감소시킬 수 있다.Accordingly, the area attached to the plated line 403a is reduced, and the thickness of the printed circuit board 400 inserted into the socket is partially decreased, so that physical damage to the plated line 403a can be reduced. In addition, burrs that may be generated during the router process due to the ductility of copper and gold, which are materials of the plating wire, are compressed by a roller, thereby reducing the degree of occurrence of the burr at the same time as the effect of removing burrs.

100, 200, 300, 400 : 인쇄회로기판
101, 201, 401 : 적층체
103, 203, 303, 403 : 탭 단자
103a, 203a, 403a : 도금선
120, 220, 420 : 보호막100, 200, 300, 400: printed circuit board
101, 201, 401: laminate
103, 203, 303, 403: tap terminal
103a, 203a, 403a: plating wire
120, 220, 420: protective film

Claims (3)

회로 형성, 드릴링(drilling), 솔더 마스크(solder mask), 전해 도금(electro plating), 무전해 도금(electroless plating), 라우터(router) 공정, 검사 및 테스트 등의 단계로 이루어지는 인쇄회로기판의 제조 공정에 있어서,
상기 솔더 마스크 공정은 도금선의 상단에 포토 레지스트(photo resist; PR) 또는 포토 솔더 레지스트(photo resist solder; PSR)와 같은 보호막을 형성하는 단계를 포함하는 것을 특징으로 하는 손상 방지된 탭 단자를 갖는 인쇄회로기 판의 제조방법.A printed circuit board manufacturing process consisting of steps such as circuit formation, drilling, solder mask, electro plating, electroless plating, router process, inspection and testing In,
The solder mask process includes forming a protective film such as a photo resist (PR) or a photo resist solder (PSR) on the top of the plating line. A method of manufacturing a circuit board. 회로 형성, 드릴링, 솔더 마스크, 전해 도금, 무전해 도금, 라우터 공정, 검사 및 테스트 등의 단계로 이루어지는 인쇄회로기판의 제조 공정에 있어서,
상기 라우터 공정은 상기 도금선을 제거하는 포함하는 단계를 포함하는 것을 특징으로 하는 손상 방지된 탭 단자를 갖는 인쇄회로기판의 제조방법.In the manufacturing process of a printed circuit board comprising steps such as circuit formation, drilling, solder mask, electroplating, electroless plating, router process, inspection and testing,
The method of manufacturing a printed circuit board having a damaged tab terminal, characterized in that the router process comprises the step of removing the plated line. 회로 형성, 드릴링, 솔더 마스크, 전해 도금, 무전해 도금, 라우터 공정, 검사 및 테스트 등의 단계로 이루어지는 인쇄회로기판의 제조 공정에 있어서,
상기 라우터 공정은 상기 인쇄회로기판의 도금선을 포함하는 모서리들을 롤러(roller)에 의해 챔퍼링(chamfering)함으로써 소정의 각도를 갖는 면으로 형성하는 단계를 더 포함하는 것을 특징으로 하는 손상 방지된 탭 단자를 갖는 인쇄회로기판의 제조방법.In the manufacturing process of a printed circuit board comprising steps such as circuit formation, drilling, solder mask, electroplating, electroless plating, router process, inspection and testing,
The router process further comprises forming a surface having a predetermined angle by chamfering the edges including the plating line of the printed circuit board with a roller. A method of manufacturing a printed circuit board having a terminal.
KR1020190043982A 2019-04-15 2019-04-15 Fabrication of printed circuit boards with tamper-proof tap terminals KR20200121207A (en)

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