KR20200121102A - Micro channel heat exchanger and heat exchanging device comprising it - Google Patents

Abstract

The present invention relates to a printed board type heat exchanger, which comprises: a first plate in which a plurality of through holes are formed; a second plate having a plurality of through holes disposed so as to cross the through holes of the first plate; and a cover plate attached to the upper surface of the first plate or the lower surface of the second plate. A plurality of first plates, a plurality of second plates, and a plurality of cover plates may be alternately stacked to be formed. According to the present invention, even if a part of a flow path is blocked through a three-dimensional flow path, performance of the flow path is not degraded by moving a fluid through other branches. In addition, a manufacturing cost is low because the plurality of holes are formed using a mold, rather than an expensive etching process.

Description

Micro channel heat exchanger and heat exchanging device comprising the same {Micro channel heat exchanger and heat exchanging device comprising it}

The present invention relates to a microchannel heat exchanger and a heat exchange device including the same.

A heat exchanger is a device that allows heat to be exchanged between two fluids. In general, a heat exchanger exchanges heat as high and low temperature fluids pass through tubes or plates, respectively, and heat moves from the hot fluid to the low temperature fluid.

A printed circuit heat exchanger (PCHE) is a heat exchanger having a fine flow path. A printed circuit heat exchanger is manufactured by stacking a plurality of metal plates and diffusing them in a vacuum high temperature and high pressure atmosphere. A fine flow path is formed on the metal plate by a chemical etching method. The printed board type heat exchanger has the advantage of increasing the heat transfer area by stacking a plurality of metal plates having fine flow paths. Accordingly, it is possible to reduce the overall size and weight of the heat exchanger.

However, since the conventional printed circuit heat exchanger has a linear or zigzag flow path pattern, a plurality of heat exchangers must be connected in series to increase the heat transfer length. In addition, there is a disadvantage that the entire flow path cannot be used if the middle of one flow path is blocked by dust or by-products.

Therefore, it is possible to secure a long heat transfer length without connecting a plurality of heat exchangers in series, and a design of a flow path that does not affect the overall performance even if any one flow path is blocked is required.

In addition, in the conventional printed circuit heat exchanger, a flow path having a predetermined shape is formed on one surface of a thin plate by etching, and when the flow path is formed by such an etching process, there is a problem that the manufacturing cost is high.

Registered Patent No. 10-0938802 (Name: Micro-channel heat exchanger)

An object of the present invention is to provide a heat exchanger that does not affect the overall performance even if any one point of the flow path is blocked by dust or foreign matter.

An object of the present invention is to provide a heat exchanger having a low manufacturing cost by forming a plurality of holes using a mold rather than an expensive etching process.

The microchannel heat exchanger according to an embodiment of the present invention includes: a first plate having a plurality of through holes, a second plate having a plurality of through holes disposed to alternate with the through holes of the first plate, and an upper surface of the first plate or the first plate. Includes; 2 cover plate attached to the lower surface of the plate. It may be formed by alternately stacking a plurality of first plates, a plurality of second plates, and a plurality of cover plates.

In the microchannel heat exchanger according to an embodiment of the present invention, the through holes of the first plate and the through holes of the second plate are disposed so that some of the through holes overlap each other, so that the through holes communicated may form a flow path.

In the microchannel heat exchanger according to an embodiment of the present invention, a plurality of through holes may be formed in a rectangular shape.

In the microchannel heat exchanger according to an exemplary embodiment of the present invention, a third plate may further include a third plate having a plurality of through holes disposed so as to alternate with the through holes of the second plate.

In the microchannel heat exchanger according to an embodiment of the present invention, the through hole of the first plate and the through hole of the second plate may be arranged to be staggered horizontally by half of one side of the rectangle.

In the microchannel heat exchanger according to an embodiment of the present invention, a plurality of through-holes are formed in a square shape, and the through-holes of the first plate and the through-holes of the second plate are arranged to be staggered vertically by half of one side of the square. I can.

In the microchannel heat exchanger according to an embodiment of the present invention, the first plate and the second plate may be formed by a mold or formed by punching the plate.

In the microchannel heat exchanger according to an embodiment of the present invention, a plurality of through holes may be formed in a circular or elliptical shape.

In the microchannel heat exchanger according to an embodiment of the present invention, an etching plate may further include an etching plate attached to an upper surface of the first plate and having a flow path formed on the upper surface by etching.

In the microchannel heat exchanger according to an embodiment of the present invention, a third plate having a plurality of through-holes disposed so as to alternate with the through-holes of the second plate is formed on the lower surface of the second plate, and the third plate is formed on the lower surface of the third plate. It may further include a fourth plate in which a plurality of through-holes are disposed so as to alternate with the through-holes.

A heat exchange device according to an embodiment of the present invention includes a microchannel heat exchanger, an upper cover and a lower cover, a pair of first headers and a pair of second headers. The printed board type heat exchanger includes a first plate having a plurality of through-holes, a second plate having a plurality of through-holes disposed so as to alternate with the through-holes of the first plate, and a cover plate attached to the upper surface of the first plate or the lower surface of the second plate. Includes. A plurality of first plates, a plurality of second plates, and a plurality of cover plates may be alternately stacked so that through holes communicate therein to form a flow path. The upper cover may be mounted on the top of the heat exchanger, and the lower cover may be mounted on the bottom of the heat exchanger. A pair of first headers are symmetrically installed on both sides of the heat exchanger and allow fluid to circulate through a plurality of first three-dimensional flow path units consisting of a first plate, a second plate with through holes formed in the end regions of both sides, and a cover plate. I can. A pair of second headers are symmetrically installed on both sides of the heat exchanger, and supply fluid to a plurality of second three-dimensional flow path units comprising a first plate, a second plate with through holes formed in the end regions of the other both sides, and a cover plate. Can be circulated.

In the heat exchange apparatus according to an embodiment of the present invention, the through holes of the first plate and the through holes of the second plate are disposed so that some of the through holes overlap each other, so that the through holes communicated may form a flow path.

In the heat exchange device according to an embodiment of the present invention, a plurality of through-holes may be formed in a rectangular shape.

In the heat exchange apparatus according to an exemplary embodiment of the present invention, a third plate may further include a third plate having a plurality of through holes disposed so as to cross the through holes of the second plate.

In the heat exchange apparatus according to an embodiment of the present invention, the through hole of the first plate and the through hole of the second plate may be arranged to be alternately left and right by half of one side of the rectangle.

In the heat exchange apparatus according to an embodiment of the present invention, the plurality of through-holes are formed in a square shape, and the through-holes of the first plate and the through-holes of the second plate may be arranged so as to be staggered vertically by half of one side of the square. .

In the heat exchange apparatus according to an embodiment of the present invention, the first plate and the second plate may be formed by a mold or formed by punching the plate.

In the heat exchange device according to an embodiment of the present invention, the plurality of through holes may be formed in a circular or elliptical shape.

In the heat exchange apparatus according to an embodiment of the present invention, an etching plate may be further included, which is attached to an upper surface of the first plate and has a flow path formed on the upper surface by etching.

In the heat exchange apparatus according to an embodiment of the present invention, a third plate having a plurality of through-holes disposed to be alternately disposed with a through-hole of the second plate on a lower surface of the second plate, and a through-hole of the third plate on the lower surface of the third plate It may further include a fourth plate having a plurality of through-holes arranged to be staggered.

According to an embodiment of the present invention, even if some flow paths of the printed circuit board type heat exchanger are blocked by dust or foreign substances, it is possible to prevent the fluid from flowing to the adjacent flow path and restricting the movement of the fluid to the corresponding flow path.

According to the embodiment of the present invention, the manufacturing cost is low by forming a plurality of holes using a mold rather than an expensive etching process.

1 is a perspective view showing a micro-channel heat exchanger according to an embodiment of the present invention.
2 is a plan view showing a three-dimensional flow path unit in a microchannel heat exchanger according to an embodiment of the present invention.
3 is a view showing a first three-dimensional flow path unit separated from the micro-channel heat exchanger according to an embodiment of the present invention.
4 is a view showing a second three-dimensional flow path unit separated from the micro-channel heat exchanger according to an embodiment of the present invention.
5 is a cross-sectional view illustrating sequential stacking of first and second three-dimensional flow path units in a micro-channel heat exchanger according to another embodiment of the present invention.
6 is a plan view showing a first three-dimensional flow path unit in a micro-channel heat exchanger according to another embodiment of the present invention.
7 is a cross-sectional view showing a first three-dimensional flow path unit in a micro-channel heat exchanger according to another embodiment of the present invention.
8 is a cross-sectional view illustrating sequential stacking of first and second three-dimensional flow path units in a microchannel heat exchanger according to another embodiment of the present invention.
9 is a cross-sectional view illustrating sequentially stacking a first three-dimensional flow path unit in which a flow path is formed by etching and a second three-dimensional flow path unit formed by a through hole in a microchannel heat exchanger according to another embodiment of the present invention. to be.
FIG. 10 is a cross-sectional view illustrating that a second three-dimensional flow path unit is formed of four plates having through holes in the microchannel heat exchanger according to the embodiment of FIG. 9.
11 is a perspective view showing a heat exchange device according to an embodiment of the present invention.

The present invention is intended to illustrate specific embodiments and to be described in detail in the detailed description, since various transformations can be applied and various embodiments can be provided. However, this is not intended to limit the present invention to a specific embodiment, it is to be understood to include all conversions, equivalents, and substitutes included in the spirit and scope of the present invention.

The terms used in the present invention are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present invention, terms such as'comprise' or'have' are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof does not preclude in advance.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this case, it should be noted that in the accompanying drawings, the same components are indicated by the same reference numerals as possible. In addition, detailed descriptions of known functions and configurations that may obscure the subject matter of the present invention will be omitted. For the same reason, some components in the accompanying drawings are exaggerated, omitted, or schematically illustrated.

1 is a perspective view showing a microchannel heat exchanger according to an embodiment of the present invention, FIG. 2 is a plan view showing a three-dimensional flow path unit in a microchannel heat exchanger according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. A diagram showing the first three-dimensional flow path unit separated from the micro-channel heat exchanger according to an embodiment, and FIG. 4 is a view showing the second three-dimensional flow path unit separated from the micro-channel heat exchanger according to an embodiment of the present invention. 5 is a cross-sectional view illustrating sequentially stacking first and second three-dimensional flow path units in a micro-channel heat exchanger according to another embodiment of the present invention.

As shown in FIG. 1, the microchannel heat exchanger 1000 according to the present invention includes a first three-dimensional flow path unit 1100 and a second three-dimensional flow path unit 1200. As will be described later, the first three-dimensional passage unit 1100 and the second three-dimensional passage unit 1200 are formed of the inlet portions 1124 and 1224 and the outlet portions 1126 and 1226 formed on the second plates 1120 and 1220. The locations are different.

The first three-dimensional flow path unit 1100 and the second three-dimensional flow path unit 1200 may be alternately stacked. In this embodiment, the first three-dimensional passage unit 1100 and the second three-dimensional passage unit 1200 are alternately stacked, but the first three-dimensional passage unit 1100 and the second three-dimensional passage unit 1200 are 1: It may be stacked in 2 or 2:1.

Different types of fluids respectively flow in flow paths formed by through-holes communicating inside the first three-dimensional flow path unit 1100 and the second three-dimensional flow path unit 1200. A high-temperature fluid may flow through an internal flow path of the first three-dimensional flow path unit 1100 and a low-temperature fluid flow through the internal flow path of the second three-dimensional flow path unit 1200. For example, the fluid flowing through the first three-dimensional flow path unit 1100 may be ethylene glycol (EG) or water, and the fluid flowing through the second three-dimensional flow path unit 1200 is liquefied natural gas (LNG; Liquefied Natural Gas). natural gas).

The first and second three-dimensional flow path units 1100 and 1200 are made of heat-resistant material such as stainless steel or Ni-based alloy. A flow path is formed in the first and second three-dimensional flow path units 1100 and 1200. A plate made of a material such as stainless steel is molded using a mold or a plate is punched to form a plurality of through-holes, and two or more plates with a plurality of through-holes are joined so that the through-holes face each other to form a bonded plate. I can.

As shown in FIG. 2, through holes formed in the plates of the first and second three-dimensional flow path units 1100 and 1200 may be formed in a square shape. The through-holes of each plate are arranged to be staggered so that the through-holes communicate with each other to form a flow path.

As shown in FIG. 3, the first three-dimensional flow path unit 1100 includes a cover plate 1140, a first plate 1110, a second plate 1120, a third plate 1130, and a cover plate in order from above. 1140 may be formed by bonding to each other. The shape constituting the contours of the four plates is formed in the same rectangle.

A through hole is not formed in the cover plate 1140, and a flow path is formed therein by blocking the upper and lower surfaces of the plates on which the through hole is formed.

A plurality of rectangular through-holes 1112 are formed inside the edge of the first plate 1110. Although it is shown that the plurality of through holes 1112 are formed in a square shape, they may be formed in a rectangular shape in which the long sides are arranged parallel to the long sides of the rectangular plate. Further, the through holes 1112 inside the first plate 1110 may be formed in a square shape, and the through holes 1112 near both sides of the edge of the first plate 1110 may be formed in a rectangular shape.

A plurality of square-shaped through holes 1122 are formed inside the second plate 1120. The plurality of through-holes 1122 are disposed so as to be staggered with respect to the plurality of through-holes 1112 of the first plate 1110. Specifically, the through-holes 1112 of the first plate 1110 and the through-holes 1122 of the second plate 1120 may be arranged so as to be staggered vertically by half of one side of the square. In other words, the through-holes 1122 of the second plate 1120 are disposed so that the four through-holes 1112 of the first plate 1110 overlap and communicate with each other.

A plurality of inlet portions 1124 and outlet portions 1126 are formed at ends of the second plate 1120 in the longitudinal direction. The plurality of inlet portions 1124 and the outlet portions 1126 are formed in a form in which a through hole is cut to an end portion in the length direction of the second plate 1120.

The third plate 1130 may have a plurality of through holes 1132 arranged in the same shape as the first plate 1110. The plurality of through-holes 1132 are also arranged so as to be staggered vertically and horizontally with respect to the plurality of through-holes 1122 of the second plate 1120.

The cover plate 1140, the first plate 1110, the second plate 1120, the third plate 1130, and the cover plate 1140 are diffusion bonded to each other by applying a large pressure. The first fluid flows into the plurality of inlets 1124, repeatedly flows through the plurality of through holes 1112 or 1132 and the plurality of through holes 1122, and then flows out through the plurality of outlets 1126. At this time, the first fluid is separated by hitting the walls of the through holes, and then the flow is repeated by collecting and mixing again in the next through hole.

As shown in FIG. 4, the second three-dimensional flow path unit 1200 includes a cover plate 1240, a first plate 1210, a second plate 1220, a third plate 1230, and a cover plate in order from above. 1240 may be formed by bonding to each other. The shape constituting the contours of the four plates is formed in the same rectangle.

A through hole is not formed in the cover plate 1240, and a flow path is formed therein by blocking the upper and lower surfaces of the plates in which the through hole is formed.

A plurality of square-shaped through holes 1212 are formed inside the edge of the first plate 1210.

A plurality of square-shaped through holes 1222 are formed in the second plate 1220. The plurality of through-holes 1222 are arranged so as to be staggered vertically and horizontally with respect to the through-holes 1212 of the first plate 1210. Specifically, the through-hole 1212 of the first plate 1210 and the through-hole 1222 of the second plate 1220 may be arranged so as to be staggered vertically by half of one side of the square.

A plurality of inlet portions 1224 and outlet portions 1226 are formed at end portions of the second plate 1220 in the width direction. The plurality of inlet portions 1224 and outlet portions 1226 are formed in a form in which a through hole is cut to an end portion in the width direction of the second plate 1220.

It is shown that three inlet portions 1224 are formed on one side of the second plate 1220, and three outlet portions 1226 are formed on the other side of the second plate 1220. In contrast, the plurality of inlet portions 1224 and outlet portions 1226 may be formed on one side and the other side of the second plate 1220 at least two, and the maximum number of through holes equal to the number of rows.

The third plate 1230 may have a plurality of through holes 1232 arranged in the same shape as the first plate 1210. The plurality of through-holes 1232 are also arranged so as to be staggered vertically and horizontally with respect to the plurality of through-holes 1222 of the second plate 1220.

The cover plate 1240, the first plate 1210, the second plate 1220, the third plate 1230, and the cover plate 1240 are diffusion bonded to each other by applying a large pressure. The second fluid flows into the plurality of inlet portions 1224, repeatedly flows through the plurality of through holes 1212 or 1232 and the plurality of through holes 1222, and then flows out through the plurality of outlet portions 1226. At this time, the second fluid is separated by hitting the walls of the through-holes, and then the flow is repeated by collecting and mixing again in the next through-hole.

As shown in FIG. 5, the first three-dimensional passage unit 1100 and the second three-dimensional passage unit 1200 may be alternately stacked. The relatively high temperature first fluid may flow into the internal flow path of the first three-dimensional flow path unit 1100, and the relatively low temperature second fluid flow through the internal flow path of the second three-dimensional flow path unit 1200.

Meanwhile, only one of the two cover plates 1140 and 1240 constituting the lowermost layer of the first three-dimensional passage unit 1100 and the uppermost layer of the second three-dimensional passage unit 1200 may be disposed.

In the microchannel heat exchanger according to the present invention, since the internal flow path of the three-dimensional flow path unit is branched from one through hole into two through holes, the fluid flows in two directions. Accordingly, it is possible to prevent the flow rate from affecting the flow performance of the entire flow path even if a part of the flow path is blocked compared to the flow path having a straight line or zigzag shape. That is, in the flow path formed in the microchannel heat exchanger 1000 according to the present invention, even if some points are blocked, the fluid moves to the flow path connected to another branch point, so that the entire flow path is not blocked like a straight or zigzag-shaped flow path.

6 is a plan view showing a first three-dimensional flow path unit in a micro-channel heat exchanger according to another embodiment of the present invention, and FIG. 7 is a cross-sectional view showing a first three-dimensional flow path unit in a micro-channel heat exchanger according to another embodiment of the present invention. to be.

The through-holes of this embodiment may be formed in a rectangular shape that is elongated in the length direction of the plate. In this embodiment, the through-holes of the first plate 1100 and the through-holes of the second plate 1120 may be arranged to be alternately left and right by half of one side of the rectangle.

In this embodiment, in the first three-dimensional flow path unit 1100, a cover plate 1140, a first plate 1110, a second plate 1120, a third plate 1130, and a cover plate 1140 are sequentially stacked. Is formed.

In the embodiment of FIG. 2, when the fluid passes through the flow path formed by the through holes communicated with each other, the fluid flows by being separated into two upper and lower rows of through holes as viewed from the plan view of FIG. 2.

On the other hand, in the embodiment of FIG. 6, when the fluid passes through the flow path formed by the through-holes communicated with each other, the fluid flows through the through-holes of one and the same row as viewed from the plan view of FIG. 6.

However, in common in the embodiment of Fig. 2 and the embodiment of Fig. 6, the fluid is separated from the through hole of the second plate 1120 into two through holes of the upper and lower first plate 1110 and the third plate 1130 and flows. do.

7 is a longitudinal cross-sectional view of the first three-dimensional flow path unit 1100 cut into a plane passing through a plurality of through holes constituting one row.

As indicated by arrows in FIG. 7, the first fluid flows through the inlet and collides with the wall surface between the through holes of the second plate 1120 and separates up and down to flow. Subsequently, the first fluid merges again into the through hole of the second plate 1120 between the wall surfaces of the first plate 1110 and the third plate 1130 and flows.

8 is a cross-sectional view illustrating sequential stacking of first and second three-dimensional flow path units in a microchannel heat exchanger according to another embodiment of the present invention.

In this embodiment, the first three-dimensional flow path unit 1100 includes a cover plate 1140, a first plate 1110, a second plate 1120, and a cover plate 1140 in order from above.

Subsequently, the second three-dimensional flow path unit 1200 includes a first plate 1210, a second plate 1220, and a cover plate 1240 under the cover plate 1140.

Unlike the previous embodiment, in this embodiment, a cover plate without a through hole between the first plate 1110 of the first three-dimensional flow path unit 1100 and the first plate 1210 of the second three-dimensional flow path unit 1200 ( 1140) can be deployed only one.

In the case of the embodiment of FIG. 8, similarly to the embodiment of FIG. 6, the through hole of the first plate 1100 and the through hole of the second plate 1120 may be arranged to be alternately left and right by half of one side of the rectangle.

Referring to the cross-sectional view of FIG. 8, in the first three-dimensional flow path unit 1100, the inlet portion may be disposed at the left end and the outlet portion may be disposed at the right end. In addition, in the second three-dimensional flow path unit 1200, the inlet portion may be disposed at the front end and the outlet portion may be disposed at the rear end.

In the three-dimensional flow path unit of the present embodiment, the fluid flows into the inlet of the second plate, alternately flows through the through hole of the first plate and the through hole of the second plate a plurality of times, and then flows to the outlet of the second plate. At the same time, the first fluid flowing through the internal flow path of the first three-dimensional flow path unit 1100 is exchanged with the second fluid flowing through the internal flow path of the second three-dimensional flow path unit 1200.

Meanwhile, in the above-described embodiments, it has been described and illustrated that the plurality of through holes are formed in a rectangular shape or a square shape, but may be formed in a circular shape or an elliptical shape.

Even when the through-holes are formed in a circular or elliptical shape, when the through-holes of the two plates are arranged to overlap each other, the through-holes may be arranged to communicate with each other.

9 is a cross-sectional view illustrating sequentially stacking a first three-dimensional flow path unit in which a flow path is formed by etching and a second three-dimensional flow path unit formed by a through hole in a microchannel heat exchanger according to another embodiment of the present invention. And FIG. 10 is a cross-sectional view illustrating that a second three-dimensional flow path unit is formed of four plates having through holes in the microchannel heat exchanger according to the embodiment of FIG. 9.

As shown in FIG. 9, the second three-dimensional flow path unit 1200 is composed of a first plate 1210, a second plate 1220 and a cover plate 1240 each having a plurality of through holes, as in FIG. 8 do.

Instead of the first three-dimensional flow path unit 1100 in which a flow path is formed by a through hole on the upper surface of the first plate 1210, an etching plate 1310 in which a flow path is formed by etching may be attached to the upper surface.

A cover plate 1340 is attached to the upper surface of the etching plate 1310 to cover the flow path.

The etching plate 1310 and the cover plate 1340 constitute a third three-dimensional flow path unit 1300 that replaces the first three-dimensional flow path unit 1100. In other words, the third three-dimensional flow path unit 1300 and the second three-dimensional flow path unit 1200 are alternately stacked to constitute the micro-channel heat exchanger 1000.

In the case of the third three-dimensional passage unit 1300 attached under the cover plate 1240 of the second three-dimensional passage unit 1200, the etching plate 1310 may be directly attached without the cover plate 1340.

In the case of the embodiment shown in FIG. 10, a third plate 1230 having a plurality of through-holes disposed so as to alternate with the through-holes of the second plate is formed on the lower surface of the second plate 1220, and the lower surface of the third plate 1230 It may further include a fourth plate 1235 in which a plurality of through-holes are formed so as to alternate with the through-holes of the third plate.

In the second three-dimensional flow path unit 1200, the plates stacked by alternately arranging a plurality of through holes are composed of four layers instead of two or three layers.

In this case, since the fluid branching up and down through the plurality of through-holes flows over four layers, heat transfer efficiency may be further increased.

11 is a view showing a heat exchange device according to an embodiment of the present invention.

As shown in FIG. 11, the heat exchange device 1000' includes a microchannel heat exchanger 1000, an upper cover 1310, a lower cover 1320, a pair of first headers 1410 and 1420, and a pair of It may include second headers 1510 and 1520.

The micro-channel heat exchanger 1000 is formed by alternately stacking first and second three-dimensional flow path units 1100 and 1200. A flow path is formed on the upper surfaces of the first and second three-dimensional flow path units 1100 and 1200. As few as 40-50 plates and as many as 500 plates are stacked and diffusion bonded. The upper cover 1310 is mounted on the heat exchanger 1000 formed by stacking and bonding. A lower cover 1320 is mounted under the heat exchanger 1000. The upper and lower covers 1310 and 1320 stably fix the joined three-dimensional flow path units 1100 and 1200. The material of the upper cover and the lower cover 1310 and 1320 may be formed of the same material as the plate of the heat exchanger 1000, for example, stainless steel.

A pair of first headers 1410 and 1420 may be mounted at an end portion of the heat exchanger 1000 in the width direction. The pair of first headers 1410 and 1420 circulates a high-temperature fluid through the heat exchanger 1000. The first header 1410 introduces high-temperature fluid into the first three-dimensional flow path unit 1100 of the heat exchanger 1000, and the first header 1420 recovers the fluid from the first three-dimensional flow path unit 1100. A fluid supply port 1412 for supplying fluid to the first header 1410 is located at an upper portion of the first header 1410, and a fluid recovery port for recovering fluid from the first header 1420 is at an upper portion of the first header 1420 A sphere 1422 is formed.

A pair of second headers 1510 and 1520 may be mounted on ends of the heat exchanger 1000 in the longitudinal direction. The pair of second headers 1510 and 1520 circulate a low temperature fluid through the heat exchanger 1000. The second header 1510 introduces a low-temperature fluid into the second three-dimensional flow path unit 1200 of the heat exchanger 1000, and the second header 1520 recovers the fluid from the second three-dimensional flow path unit 1200. A fluid supply port 1512 for supplying fluid to the second header 1510 is located at the top of the second header 1510, and a fluid recovery port for recovering fluid from the second header 1520 is at the top of the second header 1520 A sphere 1522 is formed.

As described above, one embodiment of the present invention has been described, but those of ordinary skill in the relevant technical field add, change, delete or add components within the scope not departing from the spirit of the present invention described in the claims. Various modifications and changes can be made to the present invention by means of the like, and it will be said that this is also included within the scope of the present invention.

1000: heat exchanger
1100: first three-dimensional flow path unit 1110: first plate
1112: through hole 1120: second plate
1122: through hole 1124: inlet
1126: outlet 1130: third plate
1132: through hole 1140: cover plate
1200: second three-dimensional flow path unit 1210: first plate
1212: through hole 1220: second plate
1222: through hole 1224: inlet
1226: outlet 1230: third plate
1232: through hole 1235: fourth plate
1240: cover plate 1300: third three-dimensional flow path unit
1310: etching plate 1340: cover plate
1000': heat exchanger 1310: top cover
1320: lower cover 1410, 1420: first header
1510, 1520: second header

Claims (20)

A first plate in which a plurality of through holes are formed;
A second plate having a plurality of through-holes disposed so as to alternate with through-holes of the first plate; And
Includes; a cover plate attached to an upper surface of the first plate or a lower surface of the second plate,
A microchannel heat exchanger, characterized in that formed by alternately stacking a plurality of the first plates, the plurality of second plates, and the plurality of cover plates. The method of claim 1,
The through hole of the first plate and the through hole of the second plate are disposed so that some of the through holes overlap each other, and the through holes communicated with each other form a flow path. The method of claim 2,
The plurality of through holes are microchannel heat exchanger, characterized in that formed in a rectangular shape. The method of claim 3,
The micro-channel heat exchanger further comprising a third plate having a plurality of through-holes disposed so as to alternate with the through-holes of the second plate. The method according to claim 3 or 4,
The microchannel heat exchanger, characterized in that the through holes of the first plate and the through holes of the second plate are arranged so as to be staggered horizontally by half of one side of the rectangle. The method of claim 4,
The plurality of through holes are formed in a square shape,
The microchannel heat exchanger, characterized in that the through-holes of the first plate and the through-holes of the second plate are arranged so as to be staggered vertically by half of one side of a square. The method of claim 1,
The first plate and the second plate are micro-channel heat exchanger, characterized in that formed by molding or punching the plate by a mold. The method of claim 2,
The plurality of through holes are microchannel heat exchanger, characterized in that formed in a circular or elliptical shape. The method of claim 1,
And an etching plate attached to an upper surface of the first plate and having a flow path formed on the upper surface thereof by etching. The method of claim 9,
A third plate having a plurality of through-holes disposed so as to alternate with through-holes of the second plate on a lower surface of the second plate; And
The microchannel heat exchanger further comprising a fourth plate having a plurality of through-holes disposed so as to alternate with through-holes of the third plate on a lower surface of the third plate. A first plate having a plurality of through-holes, a second plate having a plurality of through-holes disposed so as to alternate with the through-holes of the first plate, and a cover plate attached to an upper surface of the first plate or a lower surface of the second plate. And a microchannel heat exchanger in which a plurality of first plates, a plurality of the second plates, and a plurality of the cover plates are alternately stacked to form a flow path by communicating through holes therein;
An upper cover mounted on the heat exchanger;
A lower cover mounted under the heat exchanger;
A pair of first plates symmetrically installed on both side surfaces of the heat exchanger and circulating fluid in a plurality of first three-dimensional flow path units composed of the first plate, a second plate having through-holes formed in the end regions of both sides, and the cover plate. 1 header; And
A pair of symmetrically installed on both sides of the heat exchanger and circulating fluid in a plurality of second three-dimensional flow path units consisting of the first plate, a second plate having through holes formed in the end regions of the other both side surfaces, and a cover plate. Heat exchange device comprising a; second header. The method of claim 10,
The through-hole of the first plate and the through-hole of the second plate are disposed so that some of the through-holes overlap each other, so that the through-holes communicated form a flow path. The method of claim 12,
Heat exchanger device, characterized in that the plurality of through-holes are formed in a rectangular shape. The method of claim 13,
And a third plate having a plurality of through-holes disposed so as to alternate with the through-holes of the second plate. The method of claim 13 or 14,
The through hole of the first plate and the through hole of the second plate are disposed so as to be staggered horizontally by half of one side of the rectangle. The method of claim 14,
The plurality of through holes are formed in a square shape,
The through hole of the first plate and the through hole of the second plate are arranged so as to be staggered up, down, left and right by half of one side of a square. The method of claim 11,
The first plate and the second plate are molded by a mold or formed by punching the plate. The method of claim 12,
The plurality of through holes are microchannel heat exchanger, characterized in that formed in a circular or elliptical shape. The method of claim 11,
And an etching plate attached to an upper surface of the first plate and having a flow path formed on the upper surface thereof by etching. The method of claim 19,
A third plate having a plurality of through-holes disposed so as to alternate with through-holes of the second plate on a lower surface of the second plate; And
And a fourth plate having a plurality of through-holes disposed so as to alternate with through-holes of the third plate on a lower surface of the third plate.

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