KR20200109672A - Heating reactor for wafer processing and cap flange therof - Google Patents

Abstract

Disclosed are a heat treatment device for wafer processing having a purge gas ejection function for an exhaust space between an inner tube and an outer tube, and a cap flange thereof. The cap flange comprises: a purge ring having a purge gas outlet through which an inlet at a lower part and an outlet at an upper part pass; and a base to which the purge ring is coupled to a purge area corresponding to an exhaust space between sidewalls of an upper inner tube and an outer tube, wherein the outlet has a narrower area than the inlet, and a purge gas is ejected to the upper part of the purge area through the outlet at a higher speed than that of flowing into the inlet.

Description

Heat treatment apparatus for wafer processing and its cap flange {HEATING REACTOR FOR WAFER PROCESSING AND CAP FLANGE THEROF}

The present invention relates to a heat treatment apparatus for wafer processing, and more particularly, to a heat treatment apparatus for wafer processing and a cap flange thereof having a function of blowing a purge gas into an exhaust space between an inner tube and an outer tube.

The wafer process includes various processes for processing wafers, among which a heat treatment process for performing a high-temperature reaction is included, and a reactor using a boat for heat treatment of the wafer may be exemplified as a heat treatment apparatus for this.

The reactor performs a heat treatment process on the input wafers, and the boat charges wafers for heat treatment in a predetermined unit (e.g. 180 sheets) and discharges the wafers that have been put into the reactor or heat-treated. ) To discharge to the outside of the reactor.

The reactor includes a heater case, an outer tube, and an inner tube. Among them, the inner tube may be exemplarily divided into an upper boat area and a lower thermal insulation area. The boat area is an area in which a boat is loaded and heat treatment is performed on a wafer loaded on the boat, and the thermal insulation area is an area having an insulating structure for blocking the boat area maintaining high temperature during wafer processing from the outside.

During the wafer process, the reaction gas is supplied to the boat area on the upper part of the inner tube, and the reaction gas used for the reaction and the by-products and by-products obtained as a result of the process are passed through the exhaust space between the inner tube and the outer tube and the exhaust pipe of the outer tube. Exhausted.

In general, a reaction gas, a by-product, and a by-product may remain in the exhaust space between the inner tube and the outer tube and on the cap flange under the exhaust space during the exhaust process.

Reactive gases, by-products, and by-products remaining as described above may affect the wafer process or equipment.

The present invention is a heat treatment for a wafer process capable of preventing and inducing the emission of reaction gases, by-products, and by-products by ejecting purge gas on the upper part of the cap flange corresponding to the exhaust space between the side walls of the inner tube and the outer tube. It is an object to provide an apparatus and a cap flange thereof.

The cap flange of the heat treatment apparatus for wafer processing of the present invention comprises: a purge ring having a purge gas outlet through which a lower inlet and an upper outlet pass; And a base to which the purge ring is coupled to a purge region corresponding to an exhaust space between sidewalls of the upper inner tube and the outer tube, wherein the outlet has a narrower area than the inlet, and the purge gas is passed to the inlet. It is characterized in that it is ejected to the upper portion of the purge region through the outlet at a higher speed than the inflow.

In addition, the heat treatment apparatus for a wafer process of the present invention includes an inner tube accommodating a boat occupying a wafer; An outer tube accommodating the inner tube; A manifold configured under the outer tube and the inner tube and provided with pipes for supplying reaction gas to the inner tube; And a purge gas outlet at a purge area corresponding to an exhaust space between sidewalls of the inner tube and the outer tube and configured under the manifold, and ejects purge gas to the upper portion of the purge area through the purge gas outlet. Including a cap flange, the cap flange, a purge ring having the purge gas outlet through which the inlet of the lower and the outlet of the upper; And a base to which the purge ring is coupled to the purge region, wherein the outlet has an area narrower than the inlet, and an upper portion of the purge region through the outlet at a higher speed than the purge gas flows into the inlet. It is characterized by eruption.

The present invention can prevent the reaction gas, by-products and by-products from remaining in the upper portion of the cap flange corresponding to the exhaust space between the side walls of the inner tube and the outer tube, and induce discharge. Therefore, the present invention has the effect of improving the wafer process yield and preventing equipment damage.

1 is a cross-sectional view showing an embodiment of a heat treatment apparatus for a wafer process according to the present invention.
2 is a plan view showing an embodiment of a cap flange of the heat treatment apparatus for a wafer process according to the present invention.
3 is a plan view showing another embodiment of the cap flange of the heat treatment apparatus for wafer processing of the present invention.
Figure 4 is a plan view showing another embodiment of the cap flange of the heat treatment apparatus for wafer processing of the present invention.
Figure 5 is a cross-sectional view of the purge ring of Figure 4;
6 and 7 are plan views showing still another embodiment of the cap flange of the heat treatment apparatus for a wafer process of the present invention.
8 and 9 are cross-sectional views illustrating still another embodiment of the purge ring of FIG. 4.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Terms used in the present specification and claims are not limited to a conventional or dictionary meaning and are not interpreted, but should be interpreted as meanings and concepts consistent with the technical matters of the present invention.

Since the embodiments described in the present specification and the configurations shown in the drawings are preferred embodiments of the present invention, and do not represent all the technical spirit of the present invention, various equivalents and modifications that can replace them at the time of the present application are There may be.

The heat treatment apparatus for a wafer process according to the present invention will be described as being implemented with the vertical reactor of FIG. 1.

Referring to FIG. 1, a vertical reactor exemplified as a heat treatment apparatus for a wafer process is usually an outer tube 10, a manifold 20, an inner tube 30, a driving part 40, an adiabatic rotator 60, and an insulating body ( 62), a rotating plate 70, and a cap flange 90.

In the vertical reactor of FIG. 1, the heater is omitted. The vertical reactor requires a heater to control the wafer process atmosphere at high temperature, and the heater is generally installed outside the outer tube 10 and is used for heat treatment of the wafer loaded on the boat 50 inside the inner tube 30. Perform heating.

The components configured in the vertical reactor of FIG. 1 are schematically described.

The outer tube 10 has a vertical shape and has an inner space for accommodating the inner tube 30 and an exhaust pipe 12 connected to the inner space at a lower portion of the outer wall.

The inner tube 30 is configured in a vertical shape and is accommodated in the inner space of the outer tube 10 and has an inner space in which the boat 50 is disposed. Exhaust ports 30a vertically arranged in a line are formed on the side walls of the inner tube 30. The exhaust ports 30a are preferably configured to be arranged in a line upward from the position where the exhaust pipe 12 of the outer tube 10 is formed.

Side walls of the outer tube 10 and the inner tube 30 are spaced apart to form an exhaust space.

By the above structure, the reaction gas, by-product gas and by-products are exhausted from the exhaust ports 30a of the inner tube 10, the exhaust space between the outer tube 10 and the side walls of the inner tube 30, and the outer tube 10 It is exhausted through the exhaust pipe 12 of.

The exhaust pipe 12 of the outer tube 10 may be configured to receive a pumping force by being connected to a pump (not shown) for exhaust.

The outer tube 10 and the inner tube 30 are coupled to the lower cap flange 90 through the manifold 20.

The manifold 20 is configured above the cap flange 90, and pipes 22 for supplying a reactive gas to the inner space of the inner tube 30 are installed. The pipes 22 may be configured to extend to the upper portion of the inner tube 30 after passing through the sidewall of the manifold 20, and the inner tube 30 in which the boat 50 is disposed to receive the reaction gas supplied from the outside. It is used to supply the interior space of the.

The cap flange 90 is a boat 50 that occupies the wafer WF, which has undergone a wafer process or is raised or lowered to put the boat 50 occupying the wafer WF to be processed into the inner space of the inner tube 30 May be configured to descend to discharge from the inner tube 30, and the lifting or lowering of the cap flange 90 is interlocked with the lifting or lowering of the lifting module (not shown) coupled with the cap flange 90 Can proceed.

1 illustrates a state in which the cap flange 90 is raised and lowered and the boat 50 is inserted into the inner space of the inner tube 30 and then coupled to the manifold 20.

The cap flange 90 includes a base 92 and a purge ring 100, and a through hole through which the drive shaft 42 of the driving unit 40 can penetrate is formed in the center of the base 92.

The base 92 of the cap flange 90 is coupled to the purge ring 100, and the purge ring 100 is a base 92 corresponding to the exhaust space between the side walls of the inner tube 30 and the outer tube 10. ) Is coupled to the purge region. For coupling of the purge ring 100, the base 92 may have a ring-shaped through hole (not shown) in the purge region, and the purge ring 100 may be inserted and fixed in the ring-shaped through hole of the base 92. have.

The purge ring 100 has a purge gas ejection port PH for ejecting a purge gas, and the purge gas ejection port PH may have various shapes through which the inlet 102 at the lower and the outlet 103 at the upper end pass. .

The cap flange 90 may include various components for coupling and sealing with the manifold 20 at the top, but detailed illustrations and descriptions of the above components are omitted for convenience of description of the embodiment of the present invention. In addition, a specific configuration and description of the purge ring 100 will be described later.

Meanwhile, the inner tube 30 is divided into an upper boat area in which the boat 50 for wafer processing is disposed and an insulation area for heat insulation.

The boat 50 has a structure in which a plurality of slots for occupying the wafer WF are vertically aligned, and is disposed above the inner space of the inner tube 30 for a wafer process.

In addition, a heat insulation rotator 60 and a heat insulation body 62 are configured under the inner space of the inner tube 30. The heat insulation rotator 60 and the heat insulation body 62 show an example for configuring the heat insulation area of the inner tube 30, and the heat insulation area of the inner tube 30 can be variously modified, so the heat insulation rotator ( Detailed descriptions of 60) and the heat insulator 62 are omitted. Among them, the adiabatic rotator 60 may be understood as supporting the upper boat 50.

In FIG. 1, the drive unit 40 provides rotational force through the drive shaft 42, the drive shaft 42 is coupled with a rotary plate 70 configured on the cap flange 90, and the rotary plate 70 is configured at the top. It is coupled with the adiabatic rotator 60, the adiabatic rotator 60 is coupled with the boat 50 of the upper. As a result, when the drive shaft 42 of the driving unit 40 rotates, the rotating plate 70, the adiabatic rotator 60, and the boat 50 rotate.

The boat 50 may be rotated by the rotational force described above during the wafer process in order to induce a uniform reaction on the entire surface of the charged wafer.

In the vertical reactor, which is an embodiment of the heat treatment apparatus for wafer processing of FIG. 1, after the boat 50 is input to the boat region of the inner tube 30, the heater is heated so that the inside of the inner tube 30 has a temperature bonded to the wafer process. Control.

The vertical reactor heats the inside of the inner tube 30 to a temperature suitable for the wafer process, and then supplies a reaction gas to the inside of the inner tube 30 through the pipes 22 of the manifold 20, and the boat 50 A process is performed on the wafer (WF) loaded on ).

The reaction gas is used in the process within the inner tube 30, and thereafter, the exhaust ports 30a of the inner tube 30, the exhaust space between the side walls of the inner tube 30 and the outer tube 10, and the outer tube 10 ) Is exhausted through the exhaust port 12.

The cap flange 90 according to the embodiment of the present invention ejects the purge gas P into a purge region corresponding to an exhaust space between the sidewalls of the inner tube 30 and the outer tube 10 during the wafer process described above.

That is, when the purge gas P is ejected through the purge gas outlet PH of the purge ring 100, the ejected purge gas P prevents the reaction gas, by-products and by-products from approaching the cap flange 90. It prevents and guides the reaction gas, by-products and by-products to the exhaust port 12 of the outer tube 10 for exhaust.

That is, when the purge gas P is ejected from the purge gas outlet PH of the cap flange 90, the reaction gas, by-products, and by-products may be prevented from remaining in the purge region above the cap flange 90, Accordingly, the yield of the wafer process can be improved and damage to the equipment can be prevented.

The embodiment of the cap flange 90 of the present invention is a purge gas that ejects purge gas P into a purge area corresponding to the exhaust space between the side walls of the inner tube 30 and the outer tube 10 as described above. It has a jet port (PH).

More specifically, the cap flange 90 includes a purge ring 100 and a base 92. Among them, the purge ring 100 has a purge gas outlet (PH) through which the inlet 102 of the lower and the outlet 103 of the upper part are penetrated, and the base 92 has a purge ring 100 coupled to the purge area. Have a composition.

The above-described purge area may be understood as an area on the base 92 corresponding to the exhaust space between the side walls of the inner tube 30 and the outer tube 10.

The purge gas outlet (PH) formed in the purge ring 100 has an inlet 102 and an outlet 103, and can be understood as a through space formed by a passage connecting the inlet 102 and the outlet 103. have.

Referring to FIG. 1, the outlet 103 of the purge gas outlet PH has a smaller area than the inlet 102. In addition, the purge gas outlet (PH) connects the inlet passage 104 and the inlet passage 104 and the outlet 103, which gradually narrows in width from the inlet 102 to the upper side, and has a uniform width and a vertically formed outlet. It is illustrated as including a passage 106.

Here, the area of the inlet 102 is referred to as A1, the area of the outlet 102 is referred to as A2, the inflow velocity of the purge gas P at the inlet 102 is referred to as V1, and the purge gas at the outlet 103 Assuming that the ejection velocity of (P) is V2, their relationship can be defined as "A1*V1=A2*V2" by Bernoulli's theorem.

That is, the ejection speed of the purge gas P ejected through the outlet 103 is formed at a higher speed than the inflow velocity of the purge gas P flowing through the inlet 102, and for the inlet 102 of the same area As the area of the outlet 103 becomes narrower, the ejection speed of the purge gas P increases.

The purge gas (P) ejected from the purge gas outlet (PH) forms an air curtain in the purge area on the upper part of the purge ring 100, and reacts gas, by-products and by-products and byproducts are formed on the upper part of the cap flange 90 by the air curtain. It can be understood that a shielding layer is formed to prevent the gas from remaining.

As a result, the purge gas P is a process in which a reaction gas, a by-product gas and a by-product are exhausted from the exhaust space between the inner tube 30 and the side walls of the outer tube 10 to the exhaust port 12 of the outer tube 10 It is possible to prevent access to the cap flange 90 in.

As described above, the purge gas ejection port PH for ejecting the purge gas P may be variously implemented.

First, the purge gas outlet PH is distributed along the purge ring 100 as shown in FIG. 2 and may be formed by a plurality of through-holes having a circular outlet 103. At this time, the purge ring 100 may be configured as a single ring.

In addition, the outlets 103 of the purge gas outlet (PH) of FIG. 2 formed by the through hole are biased toward the inner tube 30 from the center of the width of the purge ring 100 and the center of the width of the purge ring 100 It may be formed in either a position or a position biased toward the outer tube 10 from the center of the width of the purge ring 100.

In addition, it is preferable that the outlets 103 of the purge gas ejection port PH are distributed and formed to have a conformal angle with respect to the center of the purge ring 100.

On the other hand, the purge gas outlet PH is distributed along the purge ring 100 as shown in FIG. 3, and the outlet 103a may be formed to have a plurality of curved slit shapes having a predetermined length and a predetermined width. . In this case, the purge ring 100 may be configured as a single ring or a double ring structure. The purge ring 100 forming the purge gas outlet PH so as to have the outlet 103a of the curved slit by the double ring structure will be described later with reference to FIGS. 6 and 7.

As shown in FIG. 3, the outlets 103a of the curved slit of the purge gas ejection port PH are biased toward the inner tube 30 from the center of the width of the purge ring 100 and the center of the width of the purge ring 100. Alternatively, it may be formed at any one of the positions biased toward the outer tube 10 from the center of the width of the purge ring 100.

In addition, it is preferable that the outlets 103a of the curved slit of the purge gas ejection port PH are distributed and formed to have a conformal angle with respect to the center of the purge ring 100.

In addition, the purge ring 100 may be configured in a double ring structure including an inner ring 100a and an outer ring 100b as shown in FIG. 4. Here, the inner ring 100a is disposed inside the outer ring 100b to be spaced apart by a predetermined distance.

In FIG. 4, a ring-shaped slit is formed between the outer surface of the inner ring 100a and the inner surface of the outer ring 100b separated, and the purge gas outlet PH has a ring-shaped outlet 103 corresponding to the ring-shaped slit. .

As shown in FIG. 4, a cross-sectional structure of a purge gas outlet PH configured by a purge ring 100 having an inner ring 100a and an outer ring 100b may be described with reference to FIG. 5.

The purge ring 100 of FIG. 5 is illustrated as having the same cross-sectional structure as the purge ring 100 of FIG. 1, and is a double ring structure including an inner ring 100a and an outer ring 100b compared to FIG. 1 There is a difference in point.

That is, in FIG. 5, the purge gas outlet (PH) has an inlet 102 and an outlet 103 by the ring-shaped slit of FIG. 4, and the inlet passage 104 and outlet 103 connected to the inlet 102 It has an outlet passage 106 which is connected. Here, the inlet passage 104 has a countersink structure that gradually narrows in width from the inlet 102 to the upper side, and the outlet passage 106 connects the inlet passage 104 and the outlet 103 It has a uniform width and is formed vertically.

In FIG. 5, the inlet 102, the outlet 103, the inlet passage 104, and the outlet passage 106 forming a purge gas outlet PH are spaced apart between the inner ring 100a and the outer ring 100b. That is, it is formed by ring-shaped slits.

In order to form the purge gas outlet PH, the inner ring 100a and the outer ring 100b in FIG. 5 are configured to have a vertically formed upper and an inclined lower side surfaces facing each other. Here, the lower portions of the sidewalls of the inner ring 100a and the outer ring 100b are preferably inclined in a direction away from each other so that the width of the inlet passage 104 gradually increases toward the lower side.

In addition, the purge ring 100 may be implemented in a double ring structure of FIG. 6 or 7 in order to form a purge gas outlet PH in which the outlet 103a is a curved slit as shown in FIG. 3.

First, referring to FIG. 6, the purge ring 100 includes an inner ring 100a and an outer ring 100b.

The outer ring 100b has a plurality of slit support portions 100c dispersedly formed on the inner wall. Each slit support portion 100c extends inward from the inner wall of the outer ring 100b toward the inner ring 100a and is formed to contact the outer wall of the inner ring 100a. That is, the slit support portion 100c has a surface facing the inner ring 100a while having the same curve as the inner wall of the inner ring 100a.

As a result, the purge gas outlet PH having the inlet 103a of the curved slit is formed by a space in which the inner ring 100a and the outer ring 100b are spaced between the dispersed slit support portions 100c.

And, referring to FIG. 7, the inner ring 100b has a plurality of slit support portions 100d distributed on the outer wall. Each slit support portion 100d extends outward from the outer wall of the inner ring 100a toward the outer ring 100b and is formed to contact the inner wall of the outer ring 100b. That is, the slit support portion 100d has a surface facing the outer wall of the outer ring 100b while having the same curve.

As a result, the purge gas outlet PH having the inlet 103a of the curved slit is formed by a space in which the inner ring 100a and the outer ring 100b are separated between the dispersed slit support portions 100d.

Meanwhile, unlike FIG. 5, the purge gas outlet PH may be formed to have various structures as shown in FIGS. 8 and 9. The structure of the purge gas outlet PH of FIGS. 5 to 8 may be commonly applied to a purge ring having a single ring structure and a double ring structure. 8 and 9 will be described as a case formed in a double ring structure for convenience.

Referring to FIG. 8, the purge gas outlet PH has an inlet passage 104, an outlet passage 106 and a connection passage 108.

Among them, the inlet passage 104 is formed to gradually narrow in width from the inlet 102 to the top, and the outlet passage 106 has a uniform width and is connected to the outlet 103 and formed vertically. In addition, the connection passage 108 is configured to horizontally connect the inlet passage 104 and the outlet passage 106. Here, the connection passage 108 is preferably formed to have the same or wider width as the outlet passage (106).

The purge gas outlet PH of FIG. 9 has an inlet passage 104, an outlet passage 106 and a connection passage 108 as in FIG. 8.

In addition, the inlet passage 104 is formed to gradually narrow in width from the inlet 102 to the upper side, and the outlet passage 106 has a uniform width and is connected to the outlet 103 and faces the outer tube 30. It is formed obliquely. In addition, the connection passage 108 is configured to horizontally connect the inlet passage 104 and the outlet passage 106. Here, the connection passage 108 is preferably formed to have the same or wider width as the outlet passage (106).

As described above, the present invention is configured to configure a purge ring having a purge gas outlet on the cap flange, and to eject purge gas with respect to the exhausted reactive gas, by-product gas and by-products. Therefore, in the present invention, the reaction gas, by-products and by-products can be smoothly discharged without remaining in the lower part of the exhaust space during the exhausting process, thereby improving the wafer process yield and preventing equipment damage.

In addition, the present invention may implement a purge gas outlet to have various outlets, such as a circular shape, a curved slit, or a ring shape, or have various through structures. Therefore, the present invention can apply a purge gas outlet for ejecting the purge gas in an optimal state according to the facility environment, and as a result, it is possible to more effectively prevent the reaction gas, by-products and by-products from remaining in the facility.

Claims (17)

A purge ring having a purge gas outlet through which a lower inlet and an upper outlet pass; And
Includes; a base to which the purge ring is coupled to a purge region corresponding to an exhaust space between sidewalls of the upper inner tube and the outer tube,
The outlet has a narrower area than the inlet,
The cap flange of the heat treatment apparatus for wafer processing, characterized in that the purge gas is ejected to the upper portion of the purge region through the outlet at a higher speed than that flowing into the inlet. The method of claim 1,
A ring-shaped through hole is formed in the purge region of the base,
The purge ring is heat treated for wafer processing inserted and fixed to the ring-shaped through hole The method of claim 1,
The purge gas outlet is dispersed along the purge ring and is formed by a plurality of through-holes having the circular outlet. The method of claim 1,
The purge gas outlet is distributed along the purge ring, and the outlet is formed by a plurality of curved slits having a predetermined length and a predetermined width. The method of claim 4,
The purge ring includes an outer ring and an inner ring disposed inside the outer ring,
A plurality of slit support portions extending inwardly from the inner wall of the outer ring toward the inner ring and contacting the outer wall of the inner ring are distributedly formed along the outer ring,
The plurality of curved slits are formed by a space between the plurality of slit support portions in which the inner ring and the outer ring are spaced apart from each other. The method of claim 4,
The purge ring includes an outer ring and an inner ring disposed inside the outer ring,
A plurality of slit support portions extending outwardly from the outer wall of the inner ring toward the outer ring and contacting the inner wall of the outer ring are distributedly formed along the inner ring,
The plurality of curved slits are formed by a space between the plurality of slit support portions in which the inner ring and the outer ring are spaced apart from each other. The method of claim 1,
The purge ring includes an outer ring and an inner ring disposed inside the outer ring,
The purge gas outlet is a cap flange of a heat treatment apparatus for wafer processing, wherein the outlet is formed by a ring-shaped slit in which an outer surface of an inner ring and an inner surface of the outer ring are spaced apart. The method of claim 1, wherein the purge gas outlet,
An inlet passage whose width gradually decreases from the inlet to the upper portion; And
Cap flange of the heat treatment apparatus for wafer processing comprising a; an outlet passage that connects the inlet passage and the outlet and has a uniform width and is vertically formed. The method of claim 1, wherein the purge gas outlet,
An inlet passage whose width gradually decreases from the inlet to the upper portion; And
An outlet passage having a uniform width and connected to the outlet and formed vertically; And
Cap flange of a heat treatment apparatus for wafer processing comprising a; connection passage horizontally connecting the inlet passage and the outlet passage. The method of claim 1, wherein the purge gas outlet,
An inlet passage whose width gradually decreases from the inlet to the upper portion;
An outlet passage having a uniform width and connected to the outlet and inclined toward the outer tube; And
Cap flange of a heat treatment apparatus for wafer processing comprising a; connection passage horizontally connecting the inlet passage and the outlet passage. An inner tube accommodating the boat occupying the wafer;
An outer tube accommodating the inner tube;
A manifold configured under the outer tube and the inner tube and provided with pipes for supplying reaction gas to the inner tube; And
It is configured under the manifold and has a purge gas outlet in a purge region corresponding to an exhaust space between sidewalls of the inner tube and the outer tube, and ejects purge gas to the upper portion of the purge region through the purge gas outlet. Including a cap flange;
The cap flange,
A purge ring having the purge gas outlet through which a lower inlet and an upper outlet pass; And
Includes; a base to which the purge ring is coupled to the purge region,
The outlet has a narrower area than the inlet,
The heat treatment apparatus for a wafer process, characterized in that the purge gas is ejected to the upper portion of the purge region through the outlet at a higher speed than that flowing into the inlet. The method of claim 11,
The purge gas outlet is dispersed along the purge ring and is formed by a plurality of through-holes having the circular outlet. The method of claim 11,
The purge gas outlet is distributed along the purge ring, and the outlet is formed by a plurality of curved slits having a predetermined length and a predetermined width. The method of claim 13,
The purge ring includes an outer ring and an inner ring disposed inside the outer ring,
A plurality of slit support portions extending inwardly from the inner wall of the outer ring toward the inner ring and contacting the outer wall of the inner ring are distributedly formed along the outer ring,
The plurality of curved slits are formed by a space between the plurality of slit support portions in which the inner ring and the outer ring are spaced apart from each other. The method of claim 13,
The purge ring includes an outer ring and an inner ring disposed inside the outer ring,
A plurality of slit support portions extending outwardly from the outer wall of the inner ring toward the outer ring and contacting the inner wall of the outer ring are distributedly formed along the inner ring,
The plurality of curved slits are formed by a space between the plurality of slit support portions in which the inner ring and the outer ring are spaced apart from each other. The method of claim 11,
The purge ring includes an outer ring and an inner ring disposed inside the outer ring,
The purge gas outlet is a heat treatment apparatus for a wafer process in which the outlet is formed by a ring-shaped slit in which an outer surface of the inner ring and an inner surface of the outer ring are spaced apart. The method of claim 11, wherein the purge gas outlet,
An inlet passage whose width gradually decreases from the inlet to the upper portion; And
Heat treatment apparatus for wafer processing comprising a; an outlet passage connecting the inlet passage and the outlet and having a uniform width and formed vertically.

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