KR20200106771A - Cleaning agent for removing solder flux and cleaning method using the cleaning agent - Google Patents

Abstract

The present invention relates to a cleaning agent for removing solder flux and to a cleaning method using the same capable of enhancing the cleaning power. The cleaning agent for removing solder flux according to an embodiment includes: 10 to 100 g of an amine-based compound; a PH regulator; 10 to 50 g of a stabilizer; and 0.01 to 50 g of a surfactant based on 1 L of an aqueous solution of cleaning agent at room temperature, wherein the pH regulator is included in the amount of the cleaning agent having a pH in a neutral range. In addition, the cleaning agent for removing solder flux may further include an additive for enhancing cleaning power of 10 to 50 g based on 1 L of the cleaning agent.

Description

A cleaning agent for removing solder flux and a cleaning method using the same

The present invention relates to a cleaning agent composition for removing solder flux and a cleaning method for removing solder flux using the same.

In the manufacture of electronic components, etc., soldering is usually performed to bond two metals together. For example, soldering is used to mount an electronic component on a printed circuit board or the like and electrically connect and bond the wiring of the electronic component and the electrode of the board by a method such as wire bonding. In the present specification, "soldering" includes both reflow and flow soldering.

In addition to the low melting point metal solder, the materials used for such soldering include flux, which is a mixed salt used to create a thin layer of dissolved salts on the surface of the metal for the purpose of preventing the molten metal surface from contacting the atmosphere. Is included. The flux performs a function of cleaning an object to be soldered and a solder surface and preventing reoxidation during soldering, and promotes the connection by removing oxides that interfere with the connection between metals such as electrodes or wirings and the solder metal. In the present specification, "flux" is not limited to rosin-based fluxes containing rosin or rosin derivatives, and includes water-soluble fluxes that do not contain rosin. And'solder flux' refers to a mixture of solder and flux.

The flux is usually composed of a basic material such as rosin or rosin derivatives, an activator such as an organic acid (oleic acid, lactic acid, etc.), an inorganic material (zinc chloride), an organic-inorganic complex, and a solvent such as an alcohol for adjusting the viscosity of the flux. Among the major components of the flux, the solvent is volatile and vaporizes, but the base material and activator remain as flux residues. The "flux residue" refers to a flux-derived residue remaining on a substrate or the like after forming a solder bump using a solder flux or soldering. For example, when electronic components are stacked and mounted on a circuit board, a space (gap) is formed between the circuit board and the electronic component. After soldering using a reflow method, the flux residue remains in this gap. can do.

When some of the flux residues come into contact with moisture in the air, they become white and whitening occurs, which gradually corrodes the joint. Therefore, after soldering is performed, a cleaning process is essentially performed to remove the gap between the substrate and the electronic component or the flux residue existing on the component surface.

Various compositions of cleaning agents have been proposed for the solder flux, that is, cleaning agents for removing flux residues. For example, in Korean Patent Laid-Open No. 2007-0020144, "A cleaning agent for removing solder flux and a method for cleaning solder flux" (Patent Document 1), water and a surfactant are substantially not included, and glycol compounds, benzyl alcohol, and A cleaning agent for removing solder flux containing amino alcohol is disclosed, and Korean Patent Publication No. 2008-0114718, "Cleaning agent composition for removing lead-free solder flux, cleaning agent for removing lead-free solder flux, and method for removing lead-free solder flux" (Patent Document In 2), a detergent composition for removing a lead-free solder flux containing a polyoxyalkylene phosphate-based surfactant, a metal chelating agent, and a non-halogen-based organic solvent is disclosed. In addition, Korean Patent No. 0907568, "A cleaning agent for removing solder flux and a method for cleaning solder flux" (Patent Document 3) discloses a cleaning agent composition containing an alkoxy alkyl alcohol and an alkoxy propane.

Korean Patent Publication No. 2007-0020144 Korean Patent Publication No. 2008-0114718 Korean Patent Registration No. 0907568

In recent years, for low power consumption and high-speed processing, electronic components have been improved in performance and size. Accordingly, in a printed wiring board or a ceramic substrate for mounting an electronic component, not only the structure of the metal layer is exposed on the surface, etc. but also the gap between the substrate and the electronic component is narrowing. As a result, there is a need for a cleaning agent for efficiently removing the solder flux remaining in the narrowed gap without damaging the metal layer exposed on the surface.

However, the above-described conventional cleaners for enhancing cleaning power are alkaline cleaners and cause discoloration and corrosion of highly corrosive metals such as copper and aluminum exposed to the surface of an electronic component package. This causes a problem in the manufacture of electronic components that require high reliability. Accordingly, there is a need to develop a cleaning agent that does not cause corrosion of exposed metal while maintaining excellent cleaning power capable of removing the solder flux remaining in the narrowed gap.

One problem to be solved by the present invention is to provide a cleaning agent for removing solder flux and a cleaning method using the same, which does not cause corrosion to metals such as copper or aluminum and exhibits excellent cleaning power.

The detergent for removing the solder flux according to an embodiment of the present invention for solving the above-described problem, based on 1L of the detergent, which is an aqueous solution at room temperature, is 10 to 100 g of an amine compound, a PH regulator, 10 to 50 g Of the stabilizer and 0.01 ~ 50g of a surfactant, and the PH modifier is included in an amount of the detergent having a PH in a neutral range. And the cleaning agent for removing the solder plus may further include an additive for enhancing cleaning power of 10 to 50 g based on 1 L of the cleaning agent.

According to an aspect of the embodiment, the pH value in the neutral range may be 6 to 8.

According to another aspect of the above embodiment, the amine-based compound is ethylenediaminetetramethylenephosphoric acid, diethylenetriaminepentamethylenephosphate, aminotrimethylenephosphate, monoethanolamine, diethanolamine, triethanolamine, monoprophanolamine, di. Propanolamine, tripropanolamine, methylenediamine, ethylenediamine, tetramethylenediamine, pentamenylenediamine, hexamethylenediamine, diethylenetriamine, tetraethylenepentamine. It may include at least one compound selected from the group consisting of pentaethylenehexamine, hexaethyleneheptamine, cinnamylamine, and cyclohexylamine.

According to another aspect of the above embodiment, the PH modifier is methanesulfonic acid, ethanesulfonic acid, 1-propanesulfonic acid, 2-propanesulfonic acid, 1-butanesulfonic acid, 2-butanesulfonic acid, pentanesulfonic acid, hexanesulfonic acid, decanesulfonic acid, acetic acid, Propionic acid, butyric acid, citric acid, tartaric acid, gluconic acid, sulfosuccinic acid, trifluoroacetic acid, sulfuric acid, nitric acid and phosphoric acid may include one or more compounds selected from the group consisting of.

According to another aspect of the above embodiment, the stabilizer is ethylenediaminetetraacetic acid, ethylenediaminetetraacetic acid disodium salt, hydroxyethylethylenediaminetriacetic acid, diethylenetriamine pentaacetic acid, triethylenetetraminehexaacetic acid, ethylenediamine tere It may include one or more compounds selected from the group consisting of laproionic acid, nitrilotriacetic acid, iminodiacetic acid, iminodipropionic acid, glutamic acid, ortinine and cysteine.

According to another aspect of the above embodiment, the surfactant is an alkyl sulfate, polyoxyethylene alkyl ether sulfate, polyoxyethylene alkylphenyl ether sulfate, alkylbenzenesulfonate, mono to trialkylamine salt, dimethyldialkylammonium salt, trimethylalkyl Ammonium salt, C1 to C20 alkanol, phenol, naphthol, bisphenols, C1 to C25 alkylphenol, arylalkylphenol, C1 to C25 alkylnaphthol, C1 to C25 alkoxy phosphoric acid (salt), sorbitan ester, polyalkylene glycol, C1 To C22 aliphatic amide, etc., ethylene oxide and propylene oxide condensed by addition of 2 to 300 moles, carboxy betaine, sulfobetaine, imidazoline betaine, and one or more compounds selected from the group consisting of amicarboxylic acid. have.

According to another aspect of the above embodiment, the additive is 1.3-dimethylthioso, trimethylthiourea, diethylthiourea, N,N-diisopropylthiourea, allylthiourea, acetylthiourea, atylenethiourea, 1,3-diphenylthiourea, thiourea dioxide, 2,2' dithioaniline, dipyridyldisulfide, thioglycolic acid, B-thioglycol, bis(dodecaethylene glycol)thioether, 1,2 It may include one or more compounds selected from the group consisting of bis(2-hydroxyethylthio)ethane, 1,4-bis(2-hydroxyethylthio)butane, thioglycol, thioglycolic acid, and mercaptosuccinic acid.

The cleaning method for removing the solder flux according to an embodiment of the present invention for solving the above problems is, based on 1L of the cleaning agent which is an aqueous solution at room temperature, 10 to 100 g of an amine compound, a PH regulator, Preparing a cleaning agent for removing solder flux comprising a stabilizer of 10 to 50 g, a surfactant of 0.01 to 50 g and/or an additive for enhancing cleaning power of 10 to 50 g, heating the cleaning agent to a temperature of 55 to 65°C And immersing the object to be cleaned in the heated detergent, and washing the object to be cleaned with water and then drying the object after a predetermined period of time.

According to the cleaning agent for removing the solder flux according to the embodiment of the present invention, by using the cleaning solution in the neutral region instead of the alkali cleaning solution causing metal corrosion, it is possible to prevent corrosion of metals such as copper or aluminum exposed to the surface. . In addition, by adding an additive for enhancing cleaning power to the cleaning agent, it is possible to enhance cleaning power by compensating for weakening of cleaning power due to the use of the cleaning agent in the neutral region.

1 is a flowchart showing a cleaning method for removing solder flux according to an embodiment of the present invention.
FIG. 2 is a photograph showing a substrate manufactured for testing whether a cleaning agent for removing solder flux according to the present invention has a cleaning power and metal corrosion.
3 is a photograph of a surface of a test substrate cleaned by using the cleaning agents of Experimental Example 1-5 and Comparative Example 1-3, respectively, for evaluation of cleaning power.
4 is a photograph of the surface of an aluminum specimen cleaned using the cleaning agents of Experimental Example 1-5 and Comparative Example 1-3, respectively, in order to evaluate whether aluminum is corroded.
5 is a photograph of a surface of a copper specimen cleaned using the cleaning agents of Experimental Example 1-5 and Comparative Example 1-3, respectively, in order to evaluate whether copper is corroded.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. And in the following description, the hardware configuration and software configuration of the device, processing flow, manufacturing conditions, size, material, shape, etc. are not intended to limit the scope of the present invention to this, unless specifically stated otherwise. .

The cleaning agent for removing the solder flux according to the present invention is a neutral aqueous solution having a pH (PH) in a neutral range, such as 5 to 9, preferably 6 to 8. Accordingly, it is possible to prevent damage from occurring even when cleaning an electronic component exposed to a metal such as copper or aluminum. For this purpose, the cleaning agent for removing the solder flux according to an embodiment of the present invention includes an amine-based compound, a PH regulator, a stabilizer, and a surfactant. The pH of such a cleaning agent can be adjusted by appropriately adjusting the amount of the added pH adjusting agent.

In addition, the cleaning agent for removing the solder flux according to an embodiment of the present invention may further include an additive for improving cleaning power, that is, an additive for improving cleaning power. The cleaning power improving additive compensates for the weakening of cleaning power due to the use of a neutral cleaning agent, thereby enabling more efficient removal of the solder flux remaining in the narrowed gap.

Examples of the amine compounds described above include ethylenediaminetetramethylenephosphate, diethylenetriaminepentamethylenephosphate, aminotrimethylenephosphate, monoethanolamine, diethanolamine, triethanolamine, monopropanolamine, dipropanolamine, tripropanolamine, Methylenediamine, ethylenediamine, tetramethylenediamine, pentamenylenediamine, hexamethylenediamine, diethylenetriamine, tetraethylenepentamine. It may include one or more compounds selected from the group consisting of pentaethylenehexamine, hexaethyleneheptamine, cinnamylamine, and cyclohexylamine.

The amine-based compound contains 1 to 300 g, more preferably 10 to 100 g, based on 1 L of the washing liquid at room temperature. However, the present embodiment is not limited thereto, and an amine-based compound having a concentration higher or lower than the above-described range may also be suitably used. However, if the concentration of the amine-based compound is too low, the cleaning power decreases, whereas if the concentration is too high, the stability of the cleaning solution may be reduced.

The above-described PH modifier is for neutralizing a cleaning solution containing an amine compound having alkali properties, and a compound exhibiting acidic properties such as alkanesulfonic acid or aliphatic carboxylic acid may be used. For example, as the alkanesulfonic acid, methanesulfonic acid, ethanesulfonic acid, 1-propanesulfonic acid, 2-propanesulfonic acid, 1-butanesulfonic acid, 2-butanesulfonic acid, pentanesulfonic acid, hexanesulfonic acid, decanesulfonic acid, and the like can be used. And as the aliphatic carboxylic acid, acetic acid, propionic acid, butyric acid, citric acid, tartaric acid, gluconic acid, sulfosuccinic acid, trifluoroacetic acid, and the like can be used. In addition to alkanesulfonic acid or aliphatic carboxylic acid, sulfuric acid, nitric acid, phosphoric acid, and the like may also be used.

The content of the pH modifier may be appropriately adjusted according to the content of the amine compound so that the detergent containing the amine compound becomes neutral. For example, it is preferable that the content of the PH regulator is adjusted so that the PH of the detergent is in the range of 5 to 9, more preferably in the range of 6 to 8. If the content of the pH modifier is too excessive or too small, and the cleaning agent is out of the pH range of the neutral region, it may cause corrosion to exposed metals such as aluminum or copper in the cleaning process for removing the solder flux.

The stabilizer is for preventing solution turbidity or sludge that may occur while the amine-based compound and the age control agent react. As a stabilizer, a carboxylic acid-based end product may be used, for example, ethylenediaminetetraacetic acid, ethylenediaminetetraacetic acid disodium salt, hydroxyethylethylenediaminetriacetic acid, diethylenetriamine pentaacetic acid, triethylenetetraminehexaacetic acid, ethylenediamine One or more compounds selected from the group consisting of terraproionic acid, nitrilotriacetic acid, iminodiacetic acid, iminodipropionic acid, glutamic acid, ortinine, and cysteine may be used.

These stabilizers may be included from 1 to 100 g, more preferably from 10 to 50 g, based on 1L of the room temperature cleaning solution. However, the present embodiment is not limited thereto, and a stabilizer having a concentration higher or lower than the above-described range may be suitably used. If the concentration of the stabilizer is too low, the solution stability of the detergent is deteriorated, whereas if the concentration is too high, the cleaning power may decrease.

The surfactant described above contributes to the improvement of the penetrating power of the cleaning solution (cleaning agent) so as to more effectively remove the residual solder flux remaining between the fine patterns, and is generally nonionic, anionic, amphoteric, cationic, etc. Various surfactants can be used. As anionic surfactants, for example, alkyl sulfates, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkylphenyl ether sulfates, alkylbenzenesulfonates, and the like can be used. As the cationic surfactant, for example, mono to trialkylamine salts, dimethyldialkylammonium salts, trimethylalkylammonium salts, and the like can be used. Examples of the nonionic surfactant include C1 to C20 alkanol, phenol, naphthol, bisphenols, C1 to C25 alkylphenol, arylalkylphenol, C1 to C25 alkylnaphthol, C1 to C25 alkoxy phosphoric acid (salt), sorbitan ester, poly An alkylene glycol, a C1 to C22 aliphatic amide, or the like may be used by adding ethylene oxide and propylene oxide to about 2 to 300 moles. And as the amphoteric surfactant, carboxy betaine, sulfobetaine, imidazoline betaine, amicarboxylic acid, and the like may be used. These surfactants may be used singly or in combination of two or more. Although there is no particular limitation on the concentration of the surfactant, it is preferably contained in an amount of about 0.01 to 50 g based on 1 L of a washing solution at room temperature.

The above-described additive for enhancing cleaning power is to prevent a decrease in cleaning power that occurs when the cleaning agent for removing the solder flux according to the embodiment of the present invention is neutralized according to the addition of the PH regulator. Thioureas, sulfides, mercaptos, etc. may be used as additives for enhancing cleaning power. For example, as a thiourea derivative, 1.3-dimethylthioso, trimethylthiourea, diethylthiourea, N,N-diisopropylthiourea, allylthiourea, acetylthiourea, atylenethiourea, 1,3 -Diphenyl thiourea, thiourea dioxide, and the like can be used. Examples of sulfides and mercaptos include sulfinol, 2,2' dithioaniline, dipyridyl disulfide, thioglycolic acid, B-thioglycol, bis(dodecaethylene glycol)thioether, 1 ,2 bis(2-hydroxyethylthio)ethane, 1,4-bis(2-hydroxyethylthio)butane, thioglycol, thioglycolic acid, mercaptosuccinic acid, and the like can be used.

The concentration of the detergent enhancer additive is not particularly limited, but it is preferable that about 10g to 50g is included based on 1L of the detergent at room temperature. If the amount of the additive for enhancing cleaning power is low, the effect of improving the cleaning power may be little, whereas when the amount of the additive for enhancing cleaning power is too high, the cost of raw materials may be unnecessarily increased in preparation for the effect of improving the cleaning power.

Next, a cleaning method for removing the solder flux according to an embodiment of the present invention will be described.

1 is a flowchart showing a cleaning method for removing solder flux according to an embodiment of the present invention.

Referring to FIG. 1, first, in a predetermined container, a cleaning solution including a cleaning agent for removing solder flux according to an embodiment of the present invention, such as an amine compound, a PH regulator, a stabilizer, a surfactant, and an additive for enhancing cleaning power, is prepared. Do (S10). For example, a 250 ml beaker can be filled with about 200 ml of detergent (cleaning liquid). Here, since the composition of the cleaning agent for removing the solder flux according to an embodiment of the present invention has been described in detail above, a description thereof will be omitted here.

Then, the cleaning agent is heated to a temperature of 55 to 65°C, preferably about 60°C (S20). For example, by heating the beaker containing the cleaning liquid prepared in step S10 using a heating stirrer, the cleaning liquid may be heated until a predetermined temperature of the cleaning liquid reaches about 60°C.

Subsequently, the object to be cleaned is immersed in the cleaning agent heated in step S20 for a predetermined time (S30). For example, an object to be cleaned (eg, a copper wiring printed board) may be immersed in a beaker containing a cleaning solution heated to a temperature of about 60° C. for about 5 minutes.

Then, the object to be cleaned immersed in the cleaning solution for a predetermined time (eg, about 5 minutes) is taken out, washed (rinsed) with water, and then dried (S40). According to the present embodiment, there is no particular limitation on the washing method or drying method, but the washing process may use running water or water contained in a predetermined container, and the drying method may be used without limitation, such as natural drying or artificial drying. have.

Next, evaluation of the cleaning power of the cleaning agent for removing the solder flux according to the embodiment of the present invention will be described in comparison with the comparative example.

Preparation of cleaning agent (cleaning solution) according to Experimental Examples and Comparative Examples

Each component was blended in a 1 L glass beaker so as to have the composition shown in Table 1 below, and mixed under the following conditions to prepare 1 L of the detergent (washing liquid) of Experimental Example 1-5 and Comparative Example 1-3, respectively.

-Cleaning liquid manufacturing temperature: 25℃

-Agitator: Magnetic stirrer (50mm rotor)

-Speed: 500rpm

-Stirring time: 30 minutes

In addition, the following ingredients were used as the components included in the solder flux removal detergent.

-Amine compound: Monomethanolamine (99%, Daejunghwa Gold)

-PH modulator: gluconic acid (50%, JUNSEI)

-Stabilizer: L-cysteine (99%, Daejunghwa Gold)

-Surfactant: Sulfinol 485W (EVONIK)

-Additive for enhancing cleaning power: Thioglycol (99%, Sigma-Aldrich)

Evaluation of cleaning power and metal corrosion

Using the cleaning agents of Experimental Examples 1-6 and Comparative Example 1-2 prepared according to the above-described composition, cleaning power and metal corrosion were evaluated.

[Cleaning power evaluation]

The test substrate was cleaned under the following conditions, and a test for evaluating cleaning power was conducted.

First, as a test substrate, using a screen plate on a copper wiring printed circuit board (20mm X 20mm), WS-580 (Indium Corporation) flux was applied, and then reflowed at 280°C for 90 seconds, as shown in FIG. As described above, a test substrate having a flux residue was prepared. In FIG. 2, the diagram on the right is an image photographed with a scanning electron microscope (FE-SEM) of a portion indicated by a dotted line in the left diagram.

In addition, in order to analyze the removal performance of the solder flux, the produced test substrate (PCB substrate module) was immersed in a cleaning solution contained in a 250 ml beaker. At this time, the washing solution was heated in advance so that the temperature was 60°C, and immersion was performed for about 5 minutes. Then, the test substrate was taken out from the cleaning solution, washed with water, and dried naturally. In order to check whether the flux residue of the test substrate cleaned using the prepared cleaning agent was well removed, an image was taken with a scanning electron microscope (FE-SEM) and analyzed. A photograph of a test substrate cleaned by using the cleaning agents of Experimental Example 1-5 and Comparative Example 1-3, respectively, is shown in FIG. 3.

[Metal corrosion evaluation]

Aluminum specimens and copper specimens (10mm X 20mm) were immersed in the prepared cleaning solutions of Experimental Examples 1-5 and 1-3, immersed at about 60° C. for 2 hours, and then left to dry naturally. Thereafter, the surfaces of the aluminum specimen and the copper specimen were visually observed to check whether there was corrosion, and photographing results of the surfaces of the aluminum specimen and the copper specimen are shown in FIGS. 4 and 5.

In Table 1, the composition of the cleaning agent for removing the solder flux according to Experimental Examples 1-5 and 1-3, and the resulting cleaning power evaluation result (FIG. 3) and the metal corrosion evaluation result (FIG. 4 and FIG. 5) are disclosed together. . In Table 1, as a criterion for evaluating the cleaning power, the symbol "O" removes 100% of the area applied to the flux, the symbol "△" removes 50 to 90% of the area applied to the flux, and the symbol "X" removes less than 50% of the area applied to the flux. The symbol "O" indicates that there is no corrosion, and the symbol "△" indicates that 10 to 50% of the area of the metal specimen is discolored, and the symbol "X" is more than 50% of the area of the metal specimen. It indicates discoloration.

Referring to Table 1, from the results of metal corrosion evaluation according to the PH range, it can be confirmed that there is no metal corrosion in the neutral region (Experimental Example 1-5). And in the results of evaluating the cleaning power according to the range of PH, when the PH of the cleaning agent is in the alkaline region (Comparative Example 1-2), it shows good cleaning power, whereas in the neutral region (Experimental Example 1), the cleaning power is poor, but in the case of the neutral region. Even if the additive for enhancing cleaning power is added (Experimental Example 2-5), it can be seen that the cleaning power is improved, and as the amount increases, the cleaning power is also proportionally improved.

As described above, the above description is merely an example and should not be construed as being limited thereto. The technical idea of the present invention should be specified only by the invention described in the claims to be described later, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention. Therefore, it is obvious to those skilled in the art that the above-described embodiments can be modified and implemented in various forms.

Claims (9)

In the solder flux removal cleaning agent,
Based on 1L of the detergent, which is an aqueous solution at room temperature, it contains 10 to 100 g of an amine compound, a PH regulator, 10 to 50 g of a stabilizer, and 0.01 to 50 g of a surfactant,
The cleaning agent for removing solder flux, wherein the PH modifier is contained in an amount in which the cleaning agent has a PH in a neutral range.
The method of claim 1,
A cleaning agent for removing solder flux, further comprising an additive for enhancing cleaning power of 10 to 50 g based on 1L of the cleaning agent.
The method according to claim 1 or 2,
A cleaning agent for removing solder flux, characterized in that the pH in the neutral range is 6 to 8.
The method according to claim 1 or 2,
The amine compound is ethylenediaminetetramethylenephosphate, diethylenetriaminepentamethylenephosphate, aminotrimethylenephosphate, monoethanolamine, diethanolamine, triethanolamine, monopropanolamine, dipropanolamine, tripropanolamine, methylene Diamine, ethylenediamine, tetramethylenediamine, pentamenylenediamine, hexamethylenediamine, diethylenetriamine, tetraethylenepentamine. A cleaning agent for removing solder flux, comprising at least one compound selected from the group consisting of pentaethylenehexamine, hexaethyleneheptamine, cinnamylamine, and cyclohexylamine.
The method according to claim 1 or 2,
The PH modifier is methanesulfonic acid, ethanesulfonic acid, 1-propanesulfonic acid, 2-propanesulfonic acid, 1-butanesulfonic acid, 2-butanesulfonic acid, pentanesulfonic acid, hexanesulfonic acid, decanesulfonic acid, acetic acid, propionic acid, butyric acid, citric acid, tartaric acid, glucose A cleaning agent for removing solder flux, comprising at least one compound selected from the group consisting of conic acid, sulfosuccinic acid, trifluoroacetic acid, sulfuric acid, nitric acid and phosphoric acid.
The method according to claim 1 or 2,
The stabilizer is ethylenediaminetetraacetic acid, ethylenediaminetetraacetic acid disodium salt, hydroxyethylethylenediaminetriacetic acid, diethylenetriamine pentaacetic acid, triethylenetetraminehexaacetic acid, ethylenediamine terapropionic acid, nitrilotriacetic acid, already Nodiacetic acid, iminodipropionic acid, glutamic acid, ortinine and cysteine. A cleaning agent for removing solder flux, comprising at least one compound selected from the group consisting of.
The method according to claim 1 or 2,
The surfactants are alkyl sulfates, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkylphenyl ether sulfates, alkylbenzenesulfonates, mono to trialkylamine salts, dimethyldialkylammonium salts, trimethylalkylammonium salts, C1 to C20 alkanols, phenols , Naphthol, bisphenols, C1 to C25 alkylphenol, arylalkylphenol, C1 to C25 alkyl naphthol, C1 to C25 alkoxy phosphoric acid (salt), sorbitan ester, polyalkylene glycol, C1 to C22 aliphatic amide, etc. Ethylene oxide and propylene A cleaning agent for removing solder flux, characterized in that it contains at least one compound selected from the group consisting of an addition-condensation of 2 to 300 moles of oxide, carboxy betaine, sulfo betaine, imidazoline betaine, and amicarboxylic acid .
The method according to claim 1 or 2,
The additives include 1.3-dimethylthioso, trimethylthiourea, diethylthiourea, N,N-diisopropylthiourea, allylthiourea, acetylthiourea, atylenethiourea, 1,3-diphenylthiourea, Thiourea dioxide, 2,2' dithioaniline, dipyridyl disulfide, thioglycolic acid, B-thioglycol, bis (dodecaethylene glycol) thioether, 1,2 bis (2-hydroxyethylthio) A cleaning agent for removing solder flux, comprising at least one compound selected from the group consisting of ethane, 1,4-bis(2-hydroxyethylthio)butane, thioglycol, thioclicholic acid, and mercaptosuccinic acid.
In the cleaning method for removing the solder flux,
Preparing the cleaning agent for removing the solder flux of claim 1 or 2 in a predetermined container;
Heating the cleaning agent to a temperature of 55 to 65°C;
Immersing the object to be cleaned in the heated cleaning agent; And
And washing the object to be cleaned with water and then drying the object after a predetermined period of time.

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