KR20200098976A - Semi-interpenetrating polymer network structure type adhesive film improved heat resistance and manufacturing method of the same - Google Patents

Abstract

A semi-interpenetrating polymer network structure type rubber adhesive film according to the present invention includes: 40 to 60 wt% of a first styrene block copolymer; 35 to 58 wt% of a tackifier resin; and 1 to 10 wt% of a mixture containing a polyfunctional compound, a photo or thermal initiator, and a second styrene block copolymer.

Description

A rubber adhesive film having a pseudo-interpenetrating polymer network structure with improved heat resistance, a method of manufacturing the same, and an adhesive film containing the same

The present invention relates to a rubber pressure-sensitive adhesive composition having a pseudo-interpenetrating polymer network structure with improved heat resistance, a method for preparing the same, and an adhesive film having improved heat resistance, including the same.

The adhesive is a material with viscoelastic properties that can strongly adhere in a short time with a small pressure. Adhesives are used in various ways in the electric and electronic industry, automobile industry, protective film industry, wood composite materials and furniture industry, civil engineering and construction industry, and coating materials, and the use and importance of adhesives are emerging in many ways with the recent development of the industry. In particular, the adhesive industry for protective films to protect the surface of parts and finished products is an industrial field with large import dependence, with synthetic rubber and acrylic adhesives dominated.

Pressure-sensitive adhesives are largely classified into rubber-based, hot-melt-based, acrylic-based and silicone-based depending on raw materials. Among them, rubber-based adhesives are made of natural rubber and synthetic rubber, but rubber has elasticity, so it is difficult to express adhesive properties by itself. Therefore, it is necessary to add a tackifier.

Synthetic rubber used for pressure-sensitive adhesive is mainly a block copolymer system. Such a block copolymer is a molecule composed of blocks of two or more components, with polybutadiene or polyisoprene in the middle and a polystyrene block at the end, each block Due to incompatibility, the styrene block acts as a crosslinking point to form domains. Therefore, since it exhibits higher cohesiveness than natural rubber-based adhesives, it is used as a raw material for fixing double-sided tapes, packaging tapes, and diaper tapes, and its use as a special adhesive is expanding. Adhesives using synthetic rubber must be prepared in consideration of the compatibility between the added tackifier resin and the block because the solubility parameters of polystyrene, polybutadiene and polyisoprene are different. In general, aromatic tackifying resins are well soluble in styrene blocks, and aliphatic tackifying resins are well soluble in rubber.

International application PCT/JP2001/003627 proposes a tackifier obtained by polymerizing a vinyl monomer at 180-350°C in order to provide a pressure-sensitive adhesive composition having high adhesion and weather resistance. In addition, Korean Patent Publication No. 10-2006-0046099 proposes a method of including a cationic surfactant and perchlorate in a polymer for a pressure-sensitive adhesive to provide a pressure-sensitive adhesive composition and film for a surface protective film having excellent antistatic properties.

On the other hand, since the pressure-sensitive adhesive having a linear structure has a disadvantage that it cannot be used at high temperatures, a crosslinked structure is introduced to increase heat resistance. Crosslinking can be formed using a polyfunctional monomer, and the pressure-sensitive adhesive that has formed a crosslinked structure including a crosslinking agent cannot be coated after a certain period of time after the crosslinking agent is added. Is called the pot life time. Crosslinking by UV is used to overcome the shortcomings of pot life time when a crosslinking agent is used. There are two main types of UV curable adhesives, UV polymerization type and UV curing type. In the UV polymerization type, the physical properties of the adhesive are controlled by polymerization of the monomer using a monomer, and in the UV curable type, the side chains of the polymer are crosslinked by UV to control the physical properties of the adhesive. When the adhesive is manufactured by UV curing, it is possible to develop an eco-friendly adhesive that does not contain a solvent and does not emit volatile organic compounds. In addition, UV-curable adhesives are in the spotlight because they can be manufactured in a short time at room temperature and in a narrow space. However, conventional UV-curable pressure-sensitive adhesives have a need for improvement in physical properties such as SAFT.

In order to solve the above problems, the present invention is a styrene-based thermoplastic rubber of styrene-ethylene-butylene-styrene block copolymer (SEBS) and a styrene-isoprene-styrene block copolymer (SIS) or styrene-butadiene-styrene block copolymer. Crosslinking of unsaturated bonds of styrene-isoprene-styrene block copolymer or styrene-butadiene-styrene block copolymer by adding polyfunctional materials that cause radical reaction by light or heat to a rubber adhesive having a composition of a polymer (SBS) and a tackifier resin An object of the present invention is to provide an adhesive film with improved heat resistance and a method for manufacturing the same by introducing a semi-IPN structure that can be rapidly cured at a low temperature by inducing a structure.

The rubber adhesive film having a pseudo-interpenetrating polymer network structure according to an embodiment of the present invention comprises 40 to 60% by weight of the first styrene block copolymer; 35 to 58% by weight of tackifying resin; And 1 to 10% by weight of a mixture containing a polyfunctional compound, a photo or thermal initiator, and a second styrene block copolymer.

In this case, the first styrene block copolymer may be a styrene-ethylene-butylene-styrene block copolymer having a styrene content of 13 to 30% by weight and a diblock content of 0 to 29% by weight.

In addition, the tackifier resin is selected from the group consisting of hydrogenated dicyclopentadiene-based hydrocarbon resin, C5 hydrocarbon-based resin, C9 hydrocarbon-based resin, hydrogenated rosin-based resin, and acrylic resin having a softening point of 80 to 150°C. There may be more than one.

Further, based on 100 parts by weight of the second styrene block copolymer, the content of the polyfunctional compound may be 1 to 10 parts by weight, and the content of the photo or thermal initiator may be 0.1 to 5 parts by weight.

In addition, the polyfunctional compound is pentaerythritol triacrylate (PETA), trimethylolpropane tri (3-mecaptopropionate) (trimethylolpropane tris (3-mercaptopropionate), TMPT), N-dodecyl mer Captan (N-dodecyl mercaptane (NDM)), trimethylolpropane triacrylate (TMPTA), pentaerythritol tetrakis (3-mercaptopropionate) (Pentaerythritol tetrakis (3-mercaptopropionate), PEMP), It may be one or more selected from the group consisting of dipentaerythritol hexakis (3-mercaptopropionate) and melamine acrylate resins.

In addition, the second styrene block copolymer may be a styrene-isoprene-styrene block copolymer or a styrene-butadiene-styrene block copolymer having a styrene content of 10 to 26% by weight.

In addition, the method of manufacturing a rubber adhesive film having a pseudo-interpenetrating polymer network structure according to an embodiment of the present invention is by dissolving the first styrene block copolymer and tackifying resin, which are synthetic rubber, in an aromatic organic solvent or an alcohol organic solvent. Preparing a synthetic rubber solution; Dissolving a polyfunctional compound, a photo or thermal initiator, and a second styrene block copolymer in an aromatic organic solvent or an alcoholic organic solvent to prepare a mixture solution; And mixing the synthetic rubber solution and the mixture solution, applying it to a base film, and photocuring or thermally curing.

According to an embodiment of the present invention, the adhesive film is a styrene-based thermoplastic rubber of styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), or styrene-butadiene-styrene block copolymer. Crosslinked structure of unsaturated bonds of styrene-isoprene-styrene block copolymer or styrene-butadiene-styrene block copolymer by adding a polyfunctional material that causes a radical reaction by light or heat to a rubber adhesive having a composition of (SBS) and tackifier resin By inducing, there is an advantage in that heat resistance is improved through physical crosslinking structure control by forming a semi-IPN structure.

In addition, since the adhesive film is manufactured in a solvent type rather than a hot melt type, it is easy to manufacture a film having a thickness of a thin film, and can be rapidly cured at a low temperature through a radical reaction by light or heat.

1 is a diagram schematically showing a method of measuring a shear adhesion failure temperature (SAFT) of an adhesive film according to an embodiment of the present invention.
Figure 2 is a graph showing the shear adhesion fracture temperature measurement results of the adhesive film according to the Examples and Comparative Examples of the present invention.

In the present invention, various modifications may be made and various forms may be applied, and specific embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific form disclosed, it should be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention.

In describing each drawing, similar reference numerals have been used for similar elements. In the accompanying drawings, the dimensions of the structures are shown to be enlarged than actual for clarity of the present invention. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In the present application, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance the possibility of being added.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

An adhesive film according to an embodiment may include a first styrene block copolymer; Tackifying resin; And a mixture containing a polyfunctional compound, a photo or thermal initiator, and a second styrene block copolymer.

First, the first styrene block copolymer is preferably 40 to 60% by weight based on the total weight of the pressure-sensitive adhesive composition, and more preferably 50 to 60% by weight. When the content of the first styrene block copolymer is less than the above range, the viscosity is too low to cause a slipping phenomenon, which may result in a decrease in initial adhesive strength, and when the content of the first styrene block copolymer is exceeded, the viscosity is too high and leveling property is reduced. There may be a problem that the adhesion is lowered.

The first styrene block copolymer is preferably a styrene-ethylene-butylene-styrene block copolymer (SEBS). The styrene-ethylene-butylene-styrene block copolymer has a linear structure, and it is preferable that the styrene content is 13 to 30% by weight, and the diblock content is 0 to 29% by weight. Non-limiting examples of styrene-ethylene-butylene-styrene block copolymers include G-1650, G1652, G1657, etc. from Kraton Polymer.

Tackifying resin is an amorphous oligomer having a molecular weight of hundreds to thousands of components added to impart adhesive performance, and is a liquid or solid thermoplastic resin at room temperature. Although the rubber itself has no adhesiveness, the selection of the tackifying resin is very important because the fluidity is imparted by the action of the added tackifying resin, so that the initial adhesive strength, adhesive force, and holding power are controlled.

Accordingly, in the present invention, a hydrogenated dicyclopentadiene-based hydrocarbon resin (Hydrogenated dicyclopentadiene, DCPD) having a softening point of 80 to 150°C as a tackifier resin, a C5 hydrocarbon-based resin, a C9 hydrocarbon-based resin, a hydrogenated rosin-based resin, and It is preferable to use at least one selected from the group consisting of acrylic resins.

The natural resin-based rosin system has low stability because its main component is abietic acid and a double bond conjugated with its isomers and oxidizes. Therefore, in order to improve this, it is used in the form of a modified rosin stabilized with a hydrogenation reaction, an inhomogeneous reaction, and a dimer. Terpene resin, which is a natural resin system, uses terpene oil obtained from pine as a raw material and is polymerized with a Lewis acid catalyst to obtain a terpene resin. Since this is an isoprene polymer, it has excellent compatibility, easy to obtain a balance of adhesive properties over a wide resin concentration range, easy development and design of adhesives, and has a remarkable tackifying effect at low temperatures, so it is widely used.

As synthetic resin systems, aliphatic (C5), aromatic (C9), and dicyclopentadiene (DCPD) systems are mainly used. Aliphatic type is used as a tackifying resin for rubber type pressure sensitive adhesives, and it is used in large quantities for kraft tapes and the like because it exhibits a good balance of adhesion properties and shows a stable value. However, since aromatics have poor compatibility with rubber-based adhesives, they are mainly used in the form of copolymerization with aliphatic systems. The tackifying resin of the present invention uses a hydrogenated dicyclopentadiene-based hydrocarbon resin having a softening point of 40 to 150°C in order to impart adhesive performance to the synthetic rubber. It is particularly preferable to use a hydrogenated dicyclopentadiene-based hydrocarbon resin having a softening point of 80 to 150°C in terms of initial adhesive strength and peel strength.

Specific examples of aliphatic hydrocarbon resins include A-1100, A-1100S, A-1115, C-1100, C-100W, C-115R, H-2100, H-2110, H-2120, H-2130, H- 2140 H-2200, H-2300, R-1100, T-1080, T-1095, and the like, and non-limiting examples of hydrogenated dicyclopentadiene-based hydrocarbon resins include the SUKOREZ series of KORON INDUSTRY, SU-90, SU-500, SU-525, SU-640 and the like are particularly preferred

Depending on the content of the tackifier resin, the physical properties of the pressure-sensitive adhesive vary, and in particular, the initial adhesive strength increases up to a certain content, but sharply decreases above a certain content. Considering the physical properties of the initial adhesive strength, the content of the tackifying resin is preferably 35 to 58% by weight, and more preferably 40 to 50% by weight, based on the total weight of the adhesive composition.

Meanwhile, the mixture may include a polyfunctional compound, a photo or thermal initiator, and a second styrene block copolymer according to a curing method. The content of such a mixture is preferably 1 to 10% by weight, and when the content exceeds 10% by weight, heat resistance is lowered, which is not preferable.

The polyfunctional compound is characterized by inducing a crosslinked structure of unsaturated bonds of the second styrene block copolymer to form a semi-interpenetrating polymer network (semi-IPN) structure to control adhesion and heat resistance. do. These IPNs are defined as having a crosslinked structure as two polymers do not chemically bond but physically bond, and in particular, semi-IPN is defined as forming IPN with another polymer crosslinking with a linear polymer.

Here, the second styrene block copolymer is a linear triblock copolymer and is preferably a styrene-isoprene-styrene block copolymer or a styrene-butadiene-styrene block copolymer having a styrene content of 10 to 26% by weight. Examples of the styrene-isoprene-styrene block copolymer include TSRC's VECTOR 4111A/4111N, but are not limited thereto.

In addition, the polyfunctional compound is pentaerythritol triacrylate (PETA), trimethylolpropane tri(3-mecaptopropionate) (trimethylolpropane tris (3-mercaptopropionate), TMPT), N-dodecyl mercaptan (N-dodecyl mercaptane, NDM), trimethylolpropane triacrylate (TMPTA), pentaerythritol tetrakis (3-mercaptopropionate) (Pentaerythritol tetrakis (3-mercaptopropionate), PEMP), D It may be at least one selected from the group consisting of pentaerythritol hexakis (3-mercaptopropionate) and melamine acrylate resins (Miramer SC9610). The content of the polyfunctional compound may be 1 to 10 parts by weight, and preferably 1 to 3 parts by weight, based on 100 parts by weight of the second styrene block copolymer.

In addition, the initiator may be a photoinitiator and a thermal initiator according to the curing method, and the content of the initiator is preferably 0.1 to 5 parts by weight based on 100 parts by weight of the second styrene block copolymer. As a photoinitiator, Omnirad 2100 (Shinyoung-Radchem), IRGACURE 1173, IRGACURE 819, IRGACURE 2100, etc. can be used, and as a thermal initiator, 2,2'-Azobis(2-methylpropionitrile) (AIBN, Sigma-Aldrich Corporation) Can be used, but is not limited thereto.

On the other hand, the adhesive film according to the present invention comprises the steps of preparing a synthetic rubber solution; Preparing a mixture solution; And mixing the synthetic rubber solution and the mixture solution, and then applying it to a base film and performing photocuring or thermal curing, but the present invention is not limited thereto.

First, the step of preparing a synthetic rubber solution may be a step of preparing a synthetic rubber solution by dissolving a first styrene block copolymer, which is a synthetic rubber, and a tackifying resin in an aromatic organic solvent or an alcoholic organic solvent.

On the other hand, when the first styrene block copolymer is swelled in a solvent, the solid content is preferably 20% by weight. In the case of tackifying resin, when dissolved in a solvent (Soluble), 50% by weight or less of a solid content is preferable. The solvent is used by referring to the solubility parameter, and the aromatic organic solvent is preferably benzene, toluene and xylene, and the alcoholic organic solvent is preferably methanol, ethanol, and methyl ethyl ketone. Toluene, an aromatic organic solvent, is particularly preferably used.

The step of preparing the mixture solution may be a step of dissolving a polyfunctional compound, a photo or thermal initiator, and a second styrene block copolymer in an aromatic organic solvent or an alcoholic organic solvent. Here, the multifunctional compound, the photo or thermal initiator, the second styrene block copolymer and the organic solvent are the same as described above, and overlapping descriptions will be omitted. On the other hand, in the case of the second styrene block copolymer, when swelling in a solvent, the solid content is preferably 20% by weight.

Thereafter, a synthetic rubber solution and a mixture solution may be mixed to prepare a rubber pressure-sensitive adhesive composition. Here, the total solid content of the prepared rubber pressure-sensitive adhesive composition is preferably 20% by weight.

The prepared rubber pressure-sensitive adhesive composition may be applied to a base film and photocured or thermally cured depending on the added initiator.

At this time, the material of the base film is not particularly limited, but a polyethylene terephthalate film is most preferred. In addition, the thickness of the pressure-sensitive adhesive applied to the film is preferably 1 ~ 100㎛. On the other hand, curing conditions of the pressure-sensitive adhesive composition to which the thermal initiator is added is suitable in terms of adhesive strength to cure at 90 to 200°C for 3 to 10 minutes. In addition, the curing condition of the pressure-sensitive adhesive composition to which the photoinitiator is added is preferable to irradiate UV using a UV irradiation device after drying the solvent for 3 to 10 minutes at 90 to 200°C on the film to which the pressure-sensitive adhesive is applied. At this time, the UV irradiation amount may be 500 to 2,000ml/cm ² , but is not limited thereto.

The adhesive film thus prepared is a styrene-based thermoplastic rubber such as styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), or styrene-butadiene-styrene block copolymer (SBS). By inducing a crosslinked structure of an unsaturated bond of a styrene-isoprene-styrene block copolymer or a styrene-butadiene-styrene block copolymer by adding a polyfunctional material that causes a radical reaction by light or heat to a rubber adhesive having a composition of a tackifier resin, By forming a semi-IPN structure, heat resistance is improved through physical crosslinking structure control.

In addition, since the adhesive film is manufactured in a solvent type rather than a hot melt type, it is easy to manufacture a film having a thickness of a thin film, and can be rapidly cured at a low temperature through a radical reaction by light or heat.

Hereinafter, the present invention will be described in detail through examples. However, the following examples are only illustrative of the present invention, and the present invention is not limited by the following examples.

[Examples 1 to 4]

A synthetic rubber solution was prepared by dissolving styrene-ethylene-butylene-styrene block copolymer (G1650) and hydrogenated DCPD (SU-90 or SU-640) in a mixed solution of toluene and ethanol in the amounts shown in Table 1 below. I did. The concentration of the prepared synthetic rubber solution was 20% by weight.

A mixture solution was prepared by dissolving the polyfunctional compounds TMPT and PETA, a styrene-isoprene-styrene block copolymer, and a thermal initiator in a mixed solution of toluene and ethanol in the amounts shown in Mixture 1 in Table 2 below. The concentration of the prepared mixture solution was 20% by weight.

Thereafter, the mixture solution was blended with the prepared synthetic rubber solution in the amount shown in Table 1 to prepare a pressure-sensitive adhesive composition. At this time, the content of the mixture solution was adjusted in parts compared to the content of SEBS. The concentration of the prepared pressure-sensitive adhesive composition was 20% by weight.

Thereafter, the prepared pressure-sensitive adhesive composition was applied to two 75 μm PET films, cured in an oven at 90° C. and 110° C. for 3 minutes, respectively, and then covered with a release film to prepare an adhesive film.

[Examples 5 to 8]

A synthetic rubber solution was prepared by dissolving styrene-ethylene-butylene-styrene block copolymer (G1650) and hydrogenated DCPD (SU-90 or SU-640) in a mixed solution of toluene and ethanol in the amounts shown in Table 1 below. I did. The concentration of the prepared synthetic rubber solution was 20% by weight.

A mixture solution was prepared by dissolving the polyfunctional compounds TMPT and PETA, a styrene-isoprene-styrene block copolymer, and a photoinitiator in a mixed solution of toluene and ethanol in the amounts shown in Mixture 2 in Table 2 below. The concentration of the prepared mixture solution was 20% by weight.

Thereafter, the mixture solution was blended with the prepared synthetic rubber solution in the amount shown in Table 1 to prepare a pressure-sensitive adhesive composition. At this time, the content of the mixture solution was adjusted in parts compared to the content of SEBS. The concentration of the prepared pressure-sensitive adhesive composition was 20% by weight.

Thereafter, the prepared adhesive composition was applied to each 75㎛ PET film, and the solvent was dried in an oven at 90°C for 3 minutes, and then irradiated on a conveyor-type UV irradiation device equipped with a 100W high-pressure mercury lamp (367 nm wavelength). Thereafter, the release film was covered to prepare an adhesive film, respectively. At this time, when passing through the UV irradiation device once, the irradiated UV irradiation amount is 1,200mJ/cm ^2, and the total is passed once.

[Comparative Example 1]

A pressure-sensitive adhesive film was prepared in the same manner as in Example 1, except that the mixture solution was not used and the pressure-sensitive adhesive composition was prepared only with a synthetic rubber solution.

[Comparative Examples 2 and 3]

An adhesive film was prepared in the same manner as in Examples 5 and 7, respectively, except that the mixture solution was not used and the adhesive composition was prepared only with a synthetic rubber solution.

Rubber (g) Tackifying resin (g) Mixture (phr) Curing method SEBS SU-90 SU-640 Mixture 1 Mixture 2 Example 1 100 70 - 2 - Heat Example 2 100 70 - 4 - Heat Example 3 100 - 70 2 - Heat Example 4 100 - 70 4 - Heat Example 5 100 70 - - 2 UV Example 6 100 70 - - 4 UV Example 7 100 - 70 - 2 UV Example 8 100 - 70 - 4 UV Comparative Example 1 100 70 - - - Heat Comparative Example 2 100 70 - - - UV Comparative Example 3 100 - 70 - - UV

Thermal initiator (g) Photoinitiator (g) TMPT(g) PETA(g) SIS(g) Mixture 1 One - 0.05 3 100 Mixture 2 - One 0.05 3 100

[Experimental Example]

In order to measure the shear adhesion failure temperature (SAFT) of the adhesive films prepared in Examples 1 to 8 and Comparative Examples 1 to 3, respectively, the test piece was subjected to a holding strength tester (Kwangmyeong Ewha Chemical) according to ASTM D4498. The SAFT was measured. At this time, as shown in FIG. 1, stainless steel (SUS304) was used as the material of the substrate, and after attaching the specimen to the substrate in a certain area (25 mm x 25 mm), a 2 kg roller was reciprocated twice to prepare a specimen. Thereafter, when a constant load (1 kg) was applied to the film and a constant heating rate (0.5° C./min) was applied, the temperature at which the adhesive film fell from the substrate was measured. The measurement results of the example are shown in FIG. 2, and it was confirmed that the shear adhesion fracture temperature of the adhesive film according to the example was 100° C. or higher, and improved heat resistance. In addition, it was confirmed that the heat resistance was significantly improved compared to the case where the mixture was added 2 phr compared to the case where the mixture was not added (Comparative Example). In the case of the comparative example, it can be seen that the shear adhesion fracture temperature is also lower than that of the example.

Although the above has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those of ordinary skill in the art will not depart from the spirit and scope of the present invention described in the claims to be described later. It will be understood that various modifications and changes can be made to the present invention within the scope of the invention.

Therefore, the technical scope of the present invention should not be limited to the content described in the detailed description of the specification, but should be determined by the claims.

Claims (9)

40 to 60% by weight of the first styrene block copolymer;
35 to 58% by weight of tackifying resin; And
A rubber adhesive film having a pseudo-interpenetrating polymer network structure comprising 1 to 10% by weight of a mixture containing a polyfunctional compound, a photo or thermal initiator, and a second styrene block copolymer. The method of claim 1,
The first styrene block copolymer is a styrene-ethylene-butylene-styrene block copolymer having a styrene content of 13 to 30% by weight and a diblock content of 0 to 29% by weight, a rubber having a similar-interpenetrating polymer network structure Adhesive film. The method of claim 1,
The tackifying resin is one selected from the group consisting of hydrogenated dicyclopentadiene-based hydrocarbon resin, C5 hydrocarbon-based resin, C9 hydrocarbon-based resin, hydrogenated rosin-based resin, and acrylic resin having a softening point of 80 to 150°C. The above-mentioned pseudo-interpenetrating polymer network structure rubber adhesive film. The method of claim 1,
Based on 100 parts by weight of the second styrene block copolymer, the content of the polyfunctional compound is 1 to 10 parts by weight, and the content of the optical or thermal initiator is 0.1 to 5 parts by weight, rubber adhesion of the pseudo-interpenetrating polymer network structure film. The method of claim 1,
The polyfunctional compound is pentaerythritol triacrylate (PETA), trimethylolpropane tri(3-mecaptopropionate) (trimethylolpropane tris (3-mercaptopropionate), TMPT), N-dodecyl mercaptan ( N-dodecyl mercaptane (NDM), trimethylolpropane triacrylate (TMPTA), pentaerythritol tetrakis (3-mercaptopropionate) (Pentaerythritol tetrakis (3-mercaptopropionate), PEMP), dipenta Erythritol hexakis (3-mercaptopropionate) (Dipentaerythritol hexakis (3-mercaptopropionate)) and at least one kind selected from the group consisting of melamine acrylate-based resin-a rubber adhesive film having a cross-penetrating polymer network structure. The method of claim 1,
The second styrene block copolymer is a styrene-isoprene-styrene block copolymer having a styrene content of 10 to 26% by weight or a styrene-butadiene-styrene block copolymer, which is a pseudo-interpenetrating polymer network structure adhesive film. Preparing a synthetic rubber solution by dissolving a first styrene block copolymer, which is a synthetic rubber, and a tackifying resin in an aromatic organic solvent or an alcoholic organic solvent;
Dissolving a polyfunctional compound, a photo or thermal initiator, and a second styrene block copolymer in an aromatic organic solvent or an alcoholic organic solvent to prepare a mixture solution; And
After mixing the synthetic rubber solution and the mixture solution, applying it to a base film, and photocuring or thermally curing,
A rubber adhesive film having a semi-interpenetrating polymer network (Semi-IPN) structure, characterized in that the polyfunctional compound causes a radical reaction by light or heat to form a pseudo-interpenetrating polymer network with the second styrene block copolymer Method of manufacturing. The method of claim 7,
The photoinitiator is at least one selected from the group consisting of Omnirad 2100, IRGACURE 1173, IRGACURE 819, and IRGACURE 2100, and the thermal initiator is 2,2'-Azobis (2-methylpropionitrile). Method of manufacturing an adhesive film. The method of claim 7,
The photo-curing is carried out through UV irradiation at an irradiation amount of 500 to 2,000 ml/cm ² , and the thermal curing is performed at 90 to 200° C. for 3 to 10 minutes. Preparation of a rubber adhesive film having a pseudo-interpenetrating polymer network structure Way.

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