KR20200091843A - Apparatus Having Direct Cooling Pathway for Cooling Power Semiconductor - Google Patents

Abstract

Disclosed is a power semiconductor cooling device. According to an embodiment of the present disclosure, the power semiconductor cooling device for cooling a plurality of first power semiconductors arranged in a line and a plurality of second power semiconductors arranged in a line parallel to the first power semiconductors, comprises: a first cooling segment assembly including a plurality of first cooling segments including a first upper box arranged on an upper surface of the first power semiconductors and a first lower box arranged on a lower surface of the first power semiconductors; a second cooling segment assembly including a plurality of second cooling segments having a second upper box arranged on an upper surface of the second power semiconductors and a second lower box arranged on a lower surface of the second power semiconductors; an inlet tank connected to pass through one ends of the first and second upper boxes, and having a fluid introduced thereto; an outlet tank connected to pass through one ends of the first and second lower boxes, and having the fluid introduced thereto; and a connection tank connected to pass through the other ends of the first and second upper boxes and the first and second lower boxes.

Description

Apparatus Having Direct Cooling Pathway for Cooling Power Semiconductor

The present disclosure relates to a power semiconductor cooling device having a direct cooling flow path. In more detail, a fluid such as a refrigerant, cooling water, heat exchange medium, etc. is in direct contact with the top and bottom surfaces of a plurality of power semiconductors, respectively, so that the power semiconductors can be cooled by directly contacting the power semiconductors except for the pins and their surroundings. It relates to a power semiconductor cooling device having a cooling channel.

The content described in this section merely provides background information for the present disclosure and does not constitute a prior art.

In general, there are automobiles using fossil fuels as a power source, such as gasoline and diesel, and environmentally friendly vehicles (EFVs) that are beneficial to the environment and use natural energy, water (hydrogen), or electric energy as a power source.

For example, eco-friendly vehicles include hybrid vehicles (HEV), plug-in hybrids (PHEV), electric vehicles (EV), and hydrogen fuel cell vehicles (FCEV).

These eco-friendly vehicles use high voltage (for example, 300V) and current power of a driving battery, and PCU (power control unit) or power module (power module) that controls such power to be supplied to the motor. ) Are mounted together.

The power module includes an electric device such as an inverter, a smoothing condenser, and a converter, or a power semiconductor that is a power converter. Since an electric element or a power semiconductor generates heat according to the supply of electric power, a separate cooling means is necessarily required. In particular, when designing a power conversion device such as a power semiconductor, cooling performance is an important factor.

As a related art, in the cooling means for power modules in the automobile field, a means for cooling only one end of an electric element or a means for cooling both sides of an electric element has been used.

For example, in the prior art heat exchanger for cooling an electric element, a pair of plates facing each other so that a fluid such as a refrigerant, cooling water, or a heat exchange medium flows, forms a space therein, and is disposed on one side in the height direction of the electric element. One tube, a second tube disposed on the other side, an inlet portion formed in communication with a partial region of the first tube on one side in the longitudinal direction, and an outlet portion formed in communication with a partial region of the second tube on one side in the longitudinal direction. And, the first tube and the second tube is formed to include a connecting portion connecting to communicate with each other.

By the way, in the prior art, the fluid flows along the inner spaces of the first tube and the second tube, and at this time, the heat of cooling of the fluid or the heat of the electric element exchanges heat indirectly through the walls of the first tube or the second tube. I am doing.

That is, the heat exchanger for cooling an electric element of the prior art requires a thermal grease coating process on the outer surface of the tube in contact with the electric element, and thus has a disadvantage in that productivity is very low.

In addition, the heat exchanger for cooling an electric element of the prior art has two tube walls (upper wall and lower wall) on the first tube and the second tube, respectively, and is formed on the upper and lower surfaces of the electric device, so that the overall thickness of the heat exchanger is relatively There is an increased drawback.

In addition, in the prior art heat exchanger for cooling an electric element, the heat exchange efficiency is relatively low due to the indirect cooling method, and in a technique in which a plurality of electric elements are packaged to form one body, not only the cooling performance of each electric element, but also the electric element and housing There is a disadvantage in that the cooling efficiency is relatively low in the entire package made of.

In addition, the heat exchanger for cooling the electric element of the prior art inserts an electric element such as a power semiconductor between the first tube and the second tube, and then compresses the first tube or the second tube so that the deformation occurs. It is very likely that problems will occur.

In addition, the heat exchanger for cooling an electric element of the prior art is difficult to grasp the pin's exact position when a pin of a power semiconductor, which is an electric element, is connected to a printed circuit board (PCB) in an assembly process between the heat exchanger and the electric element, thereby making it difficult The pin alignment process of is added, and as a result, the cycle time of the assembly process of the printed circuit board is increased, such as assembly, quality problem solving, and separate pin alignment process according to the position, so productivity is relatively low.

In addition, since the length of the tube corresponding to the number of electric elements or power semiconductors is predetermined, the heat exchanger for cooling the electric elements of the prior art has to be manufactured in a separate tube according to the decrease or increase in the number of electric elements or power semiconductors. It has a very poor drawback.

The object of the present disclosure is proposed in view of the above circumstances, and is attached on the basis of the upper and lower surfaces of the power semiconductor, so that a plurality of cooling segments (cooling segments) are attached to cool the fluid inside by directly contacting the upper and lower surfaces of the power semiconductor. It is to provide a power semiconductor cooling device having a direct cooling channel that can increase the productivity by removing the thermal grease coating process by providing ).

According to an embodiment of the present disclosure, in a power semiconductor cooling apparatus for cooling a plurality of first power semiconductors arranged in a line and a plurality of second power semiconductors arranged in parallel with the plurality of first power semiconductors, the plurality of A first cooling segment assembly including a plurality of first cooling segments having a first upper box disposed on an upper surface of the first power semiconductor and a first lower box disposed on a bottom surface of the plurality of first power semiconductors; A second cooling segment assembly comprising a plurality of second cooling segments having a second upper box disposed on the upper surface of the plurality of second power semiconductors and a second lower box disposed on the lower surface of the plurality of second power semiconductors ; An inlet tank connected to one end of the first upper box and one end of the second upper box and through which fluid is introduced; An outlet tank that is connected to one end of the first lower box and one end of the second lower box and through which the fluid is discharged; And it provides a power semiconductor cooling device, characterized in that it comprises a first upper box, the second upper box, the first lower box, and a connection tank connected to the other end of each of the second lower box through.

Power semiconductor cooling apparatus having a direct cooling flow path according to the present disclosure, covers a top and a bottom of the power semiconductor, and directs a plurality of cooling segments capable of flowing a fluid such as a refrigerant, cooling water, heat exchange medium, etc. in the direction of the direct cooling flow path. By assembling with each other according to, there is an advantage that the heat exchange efficiency can be relatively increased by performing direct heat exchange between the heat of the fluid or the heat of the power semiconductor.

In addition, the power semiconductor cooling apparatus having a direct cooling flow path of the present disclosure can increase productivity by removing a thermal grease coating process between the outer surface of the tube and the outer surface of the power semiconductor in a heat exchanger using an existing tube. .

In addition, the power semiconductor cooling apparatus having a direct cooling flow path of the present disclosure forms a structure in which an upper box with an open bottom of the box and a lower box with an open top of the box are directly attached to the top or bottom of the power semiconductor in a cooling segment. By doing so, there is an advantage in that a compact device structure can be realized by relatively reducing the thickness of a device with a power semiconductor interposed therebetween.

In addition, the power semiconductor cooling device having a direct cooling flow path of the present disclosure, the heat exchange efficiency is relatively very high, by performing the heat exchange of the direct cooling method, thereby, the overall cooling efficiency of the package module having a large number of power semiconductors There is an advantage that can be increased.

In addition, the power semiconductor cooling apparatus having a direct cooling flow path of the present disclosure is a method in which the cooling segment is directly attached to the power semiconductor, and the first O-ring or the second O-ring of the square ring type is the upper box of the cooling segment. Since it is installed in the seating groove of each flange of the bottom edge or the upper edge of the lower box, it is possible to maintain the airtightness so that the fluid does not leak outside the cooling segment, and the possibility of quality problems is unknown because it is not compressed to the power semiconductor as before. To cut off.

In addition, the power semiconductor cooling device having a direct cooling flow path of the present disclosure is connected to a plurality of cooling segments, an inlet tank, an outlet tank, and a connecting tank, respectively, and intervenes in the cooling segment corresponding to the interval of the cooling segment. Since the spacing of the power semiconductors is kept constant, when the pins of the power semiconductors are connected to the printed circuit board (PCB), the pins can be easily positioned, so no separate pin alignment process is required, so the printed circuit board Productivity can be maximized by relatively shortening the cycle time of the assembly process.

In addition, the power semiconductor cooling device having a direct cooling flow path of the present disclosure has a structure in which cooling segments are modularized and connected to each other, so that the number of cooling segments can be increased without the need to manufacture a large sized cooling segment as the number of power semiconductors decreases or increases. Since it can be easily reduced or increased, it has the advantage of excellent scalability and versatility.

1 is a perspective view of a power semiconductor cooling device having a direct cooling flow path according to an embodiment of the present disclosure.
Figure 2 is an exploded perspective view of the cooling segment shown in Figure 1;
3 and 4 are perspective views for explaining the coupling relationship of the cooling segment shown in FIG.
5 is a perspective view for explaining a coupling relationship between the cooling segment shown in FIG. 3, the inlet tank, the outlet tank, and the connecting tank.
6 is a cross-sectional view of line A-A' shown in FIG. 5;

Hereinafter, some embodiments of the present disclosure will be described in detail through exemplary drawings. It should be noted that in adding reference numerals to the components of each drawing, the same components have the same reference numerals as possible, even if they are displayed on different drawings. In addition, in describing the present disclosure, when it is determined that a detailed description of related known configurations or functions may obscure the subject matter of the present disclosure, the detailed description will be omitted.

In describing the components of the embodiment according to the present disclosure, codes such as first, second, i), ii), a), and b) may be used. These symbols are only for distinguishing the components from other components, and the essence or order or order of the components is not limited by the symbols. When a part in the specification refers to'include' or'equipment' a component, this means that other components may be further included rather than excluding other components, unless explicitly stated to the contrary. .

1 is a perspective view of a power semiconductor cooling apparatus having a direct cooling flow path according to an embodiment of the present disclosure.

Referring to FIG. 1, a power semiconductor cooling device having a direct cooling flow path in this embodiment includes a plurality of cooling segments (200, 200a, 200b, 200c, 200c) corresponding to the number of power semiconductors 300 (for example, 6). , 200d, 200e), an inlet tank (100), an outlet tank (outlet tank 500), and a connecting tank (connecting tank 400).

Cooling segments (200, 200a, 200b, 200c, 200d, 200e), inlet tank 100, outlet tank 500, and connecting tank 400 are made of engineering plastics or synthetic resin that is strong by thermal stress, forming It is formed of any one of easy metal or non-metal, and is injection molded into a shape described below.

Each cooling segment (200, 200a, 200b, 200c, 200d, 200e) is manufactured or assembled to form one body through the power semiconductor 300 at an intermediate position in its thickness direction.

Each power semiconductor 300 is interposed between the upper box and the lower box of each cooling segment (200, 200a, 200b, 200c, 200d, 200e).

The upper box of each cooling segment (200, 200a, 200b, 200c, 200d, 200e) has its bottom surface open and is adhered to the upper surface of the power semiconductor (300). In addition, the lower box has an open top of the box facing the bottom of the power semiconductor 300 and is adhered to the bottom of the power semiconductor 300.

The inlet tank 100 is penetrated to one end of the upper box of the cooling segments 200 and 200e arranged on one side, receives fluid from an external heat dissipation device (not shown), and the cooling segments 200 and 200e It is responsible for supplying or dispensing fluid toward the inner space of the upper box.

Here, the fluid is a refrigerant that circulates between the external heat dissipation device and the present embodiment, a coolant, a heat exchange medium, and a phase change material (PCM) that can absorb or release a lot of heat while the state of the material changes. Means Since the phase change material uses latent heat, the heat exchange efficiency may be superior to that of other media.

The outlet tank 500 has the same volume or plane area as the inlet tank 100, and is stacked on the top of the inlet tank 100.

The outlet tank 500 is penetrated to one end of the lower box of the cooling segments 200 and 200e disposed on one side, and receives the fluid in the inner space of the lower box of the cooling segments 200 and 200e to receive external heat. It is responsible for discharging to the discharge device.

The connecting tank 400 is connected to the other end of each of the upper and lower boxes of the cooling segments 200b and 200c disposed on the other side.

The connecting tank 400 serves to provide fluid to the inside of the lower box of the same cooling segment 200b after receiving the fluid of the upper box of the cooling segment 200b.

In addition, the connection tank 400 is supplied with the fluid of the upper box of the other cooling segment (200c) connected in a parallel connection structure with the cooling segment (200b) and provides fluid to the interior of the lower box of the cooling segment (200c) Plays a role.

That is, the fluid of the upper box of each of the plurality of cooling segments 200b and 200c may be mixed in the interior of the connection tank 400, and then flowed into the lower box of each of the cooling segments 200b and 200c.

In other words, the fluid flowing into the connecting tank 400 from the first upper box 210A and the second upper box 210B may be mixed in the connecting tank 400, and mixed in the connecting tank 400. The fluid may be introduced into the first lower box 240A and the second lower box 240B from the connection tank 400.

These cooling segments (200, 200a, 200b, 200c, 200d, 200e) are connected to each other by the number of power semiconductors (power semiconductor, 300), between the inlet tank 100 and the connecting tank 400 or the outlet tank 500 ) To form a direct cooling flow path between the connecting tank 400, and the fluid directly contacts the upper and lower surfaces of the power semiconductor 300 to cool the power semiconductor 300.

The cooling segments 200, 200a, 200b, 200c, 200d, and 200e are individually manufactured for each power semiconductor 300 and then assembled to penetrate each other through a pipe connection method.

Each of the cooling segments (200, 200a, 200b, 200c, 200d, 200e) has the configuration and coupling relationship shown in Figure 2 to enable this assembly.

In FIG. 2, for ease of explanation, detailed configuration and coupling relations of one cooling segment 200 are described based on the cooling segment 200, and this description is equally applied to all other cooling segments 200a, 200b, 200c, 200d, and 200e. Can.

Meanwhile, the power semiconductor 300 includes a plurality of first power semiconductors 300A and a plurality of second power semiconductors arranged in parallel with the plurality of first power semiconductors 300A. semiconductor, 300B).

Further, the plurality of cooling segments 200 may constitute a first cooling segment assembly (20A) and a second cooling segment assembly (second cooling segment assembly, 20B).

The first cooling segment assembly 20A includes a first upper box 210A disposed on an upper surface of a plurality of first power semiconductors 300A, and a first disposed on a bottom surface of the plurality of first power semiconductors 300A. A plurality of first cooling segments 21A having a lower box 240A may be included.

The second cooling segment assembly 20B includes a second upper box 210B disposed on an upper surface of a plurality of second power semiconductors 300B and a second lower portion disposed on a lower surface of the plurality of second power semiconductors 300B. A plurality of second cooling segments 21B including the box 240B may be included.

The first cooling segment assembly 20A and the second cooling segment assembly 20B may be arranged in parallel with each other.

FIG. 2 is an exploded perspective view of the cooling segment shown in FIG. 1.

Referring to FIG. 2, the cooling segment 200 is configured to be disposed on the upper side or the lower side based on the power semiconductor 300, and includes the upper box 210 and the lower box 240. The upper box 210 and the lower box 240 may be injection molding structures formed of a plastic material or the like.

The upper box 210 has a first hollow body 213 in the form of a rectangular box structure with side and top surfaces closed and a bottom surface open. Here, a fluid storage space in which a fluid is filled or flows is formed inside the first hollow body 213.

In addition, the upper box 210 corresponds to one end of the upper box 210, is formed to penetrate through one side of the first hollow body 213, has a relatively small diameter of the first connecting pipe 211 .

In addition, the upper box 210 corresponds to the other end of the upper box 210, is formed to penetrate the other side of the first hollow body 213, the first connecting tube of another adjacent cooling segment can be inserted It has a second connecting pipe 212 that forms a stop jaw 212a inside the inner diameter.

In addition, the upper box 210 protrudes outward from the bottom edge of the first hollow body 213, extends along the bottom edge, and has a seating groove on the bottom, and a bottom surface except where the seating groove is formed. It has a first flange portion 214 adhered to the upper surface 301 of the power semiconductor (300).

In addition, the upper box 210 includes a first O-ring (220) coupled to the seating groove of the first flange portion 214.

The lower box 240 has a second hollow body 243 in the form of a square box structure with side and bottom surfaces closed and an upper surface open. Here, a fluid storage space in which a fluid is filled or flows is formed inside the second hollow body 243.

In addition, the lower box 240 corresponds to one end of the lower box 240, is formed to penetrate through one side of the second hollow body 243, has a relatively small diameter of the third connector (241) . Here, the third connector 241 has the same size, diameter (outer diameter), and inner diameter as compared to the first connector 211.

In addition, the lower box 240 corresponds to the other end of the lower box 240, is formed to penetrate the other side of the second hollow body 243, the third connecting tube of the other adjacent cooling segment can be inserted It has a fourth connecting pipe 242 formed with a stopper 242a inside the inner diameter. Here, the fourth connector 242 has the same size, outer diameter, and inner diameter as compared to the second connector 212.

The stop jaw 242a is in contact with the end of the third connecting tube of another adjacent cooling segment, and serves to keep the insertion depth of the third connecting tube constant within a predetermined range.

To this end, the inner diameters of all the stop jaws 212a and 242a have an inner diameter sized to match the inner diameter of the first or third connector. Therefore, there may be no or relatively little flow loss of fluid inside the connector.

In addition, the lower box 240 protrudes outward from the upper rim of the second hollow body 243, extends along the upper rim, a seating groove 245 is formed on the upper face, and a seating groove 245 is provided. The upper surface, except where it is formed, has a second flange portion 244 that is bonded to the bottom surface 303 of the power semiconductor 300.

In addition, the lower box 240 has a second O-ring 230 coupled to the seating groove 245 of the second flange portion 244.

The lower box 240 is formed symmetrically up and down with respect to the upper box 210.

Except for the first O-ring 220 and the second O-ring 230, the bottom surface of the first flange portion 214 or the top surface of the second flange portion 244 is attached to any one of adhesive means, ultrasonic welding means, and high-frequency welding means. It is fixed to the upper surface 301 or the lower surface 303 of the power semiconductor 300 by.

The thickness of the first O-ring 220 or the second O-ring 230 is formed to be relatively larger than the depth of the seating groove, and may be elastically deformed by a pressing force generated during adhesion after insertion.

The first O-ring 220 and the second O-ring 230 may collectively refer to a rubber ring, a sealing, a gasket, and the like.

The first O-ring 220 and the second O-ring 230 prevent leakage through the elastic support and crimping of the first O-ring 220 and the second O-ring 230, respectively, in spite of adhesion. do.

Pins 302 of the power semiconductor 300 are on both sides of the power semiconductor 300 based on the direction perpendicular to the connection direction of any one of the first connector 211 to the fourth connector 242 It is protruding in large numbers. The pin 302 is connected to a circuit inside the mold of the power semiconductor 300.

The pin 302 of the power semiconductor 300 may be connected to a printed circuit board having a connection portion or a terminal corresponding to an interval of the power semiconductor 300. The pin 302 may collectively be a pin-shaped portion or a terminal-shaped portion having a hole.

Since the protruding lengths of all the connecting pipes 211, 212, 241, and 242 may be determined according to the arrangement interval of the power semiconductor 300, they may be formed to be longer or shorter than the length shown in FIG. 2 and the like.

The size of the outer diameter and the inner diameter of all the connecting pipes 211, 212, 241, 242 can be formed to be large or small in consideration of the flow rate or cooling performance of the fluid.

3 and 4 are perspective views for explaining the coupling relationship of the cooling segment shown in FIG. 2.

3 and 4, the cooling segments 200 and 200a have the same size and the same shape, and the first connection pipe 211a and the second connection pipe 212 are located in the same connection direction and height. , Also, the third connector 241a and the fourth connector 242 are located in the same connection direction and height.

Accordingly, the cooling segments 200 and the other cooling segments 200a adjacent to each other are assembled by fitting the first and second connectors 211a and 212 corresponding to each other, and at the same time, they also correspond to each other. Just by assembling the three connecting pipes 241a and the fourth connecting pipes 242 to fit each other, it can be a cooling segment assembly 200f having a series connection structure as shown in FIG. 4.

In particular, in the cooling segment assembly 200f having a series connection structure, the interval between the cooling segment 200 and another adjacent cooling segment 200a may be constant.

Accordingly, the spacing or pin spacing of each power semiconductor 300 mounted on the cooling segments 200 and 200a may also be constant, and when the pin of the power semiconductor 300 is connected to a printed circuit board (not shown), Since pins can be easily positioned and a separate pin alignment process is not required, productivity can be maximized by relatively shortening the cycle time of the printed circuit board assembly process.

5 is a perspective view for explaining a coupling relationship between the cooling segment shown in FIG. 3, the inlet tank, the outlet tank, and the connecting tank, and FIG. 6 is a cross-sectional view of line A-A' shown in FIG.

Referring to FIG. 5, the cooling segment assemblies 200f and 200g each having a series connection structure may be manufactured in a plurality (for example, two rows) through repetition of the bonding process illustrated in FIGS. 3 and 4.

That is, the cooling segments 200, 200a, 200b, 200c, 200d, and 200e are connected to each other in series to become cooling segment assemblies 200f and 200g of a series connection structure, and the cooling segment assemblies 200f and 200g are inlets It may be connected between the tank 100 and the connecting tank 400 or between the outlet tank 500 and the connecting tank 400 to form a parallel connection structure, allowing fluid to flow.

To this end, the inlet tank 100 includes a plurality of first fitting parts 111 and 112 that are piped to the inlet pipe 113 through which fluid flows and the first connecting pipes 211 and 211e of the cooling segments 200 and 200e. ).

In addition, the inlet tank 100 is connected to penetrate between the inlet pipe 113 and the first fitting parts 111 and 112, and an internal volume for distributing the introduced fluid toward the first fitting parts 111 and 112 is provided. It has a first distribution header (110).

The outlet tank 500 also includes a second distribution header (510). The second distribution header 510 may have the same volume and shape as compared to the first distribution header 110 and may be stacked under the first distribution header 110.

At the boundary between the second distribution header 510 and the first distribution header 110, an insulation pad (not shown) for a thermal barrier may be interposed, or an adhesive layer of an air layer or a thermal barrier material may be formed. An insulation pad, an air layer, an adhesive layer, etc. may be an effective means of blocking heat exchange between the second distribution header 510 and the first distribution header 110.

The outlet tank 500 has a discharge pipe 513 through which fluid is discharged, and a plurality of second fitting portions 511 and 512 piped to the third connecting pipes 241 and 241e of the cooling segments 200 and 200e.

In addition, the second distribution header 510 of the outlet tank 500 is formed between the discharge pipe 513 and the second fitting parts 511 and 512, and discharges the fluid inside the second distribution header 510 ( 513).

The inlet pipe 113 of the inlet tank 100 based on the plane of the present embodiment is disposed eccentrically compared to the outlet pipe 513 of the outlet tank 500 so that the hose connected to the inlet pipe 113 or the outlet pipe 513 (not shown) City).

Connection tank 400 receives the fluid of the upper box of the cooling segment (200b, 200c) disposed on the other side of the inlet tank 100 and the outlet tank 500, that is, the lower portion of the same cooling segment (200b, 200c) It is responsible for supplying the inside of the box.

To this end, the connecting tank 400 receives the fluid of the upper box, or the third distribution header 410 having an internal volume for supplying the fluid toward the lower box, and the third distribution toward the cooling segments 200b and 200c. It is formed on the side of the header 410, a plurality of (for example, four) third fitting portion 411 for penetrating the second connector 212b, 212c or the fourth connector 242b, 242c It includes.

For example, among the three third fitting parts 411, the two fitting parts spaced apart in the vertical direction from the side of the cooling segment assembly 200f of the first row, the second connecting pipe of the cooling segment 200b at the end of the cooling segment assembly 200f ( 212b) or the fourth connection pipe 242b.

In the same way, the other two fitting parts spaced apart in the vertical direction from the cooling segment assembly 200g in the second row among the four third fitting parts 411, the second of the cooling segment 200c at the end of the cooling segment assembly 200g It is connected to penetrate the connecting pipe 212c or the fourth connecting pipe 242c.

Hereinafter, an operating relationship of the power semiconductor cooling device having the direct cooling flow path according to the present embodiment will be described with reference to FIGS. 5 or 6.

The fluid cooled in the external heat dissipation device, not shown, enters the inside of the inlet tank 100 through the inlet pipe 113.

Thereafter, the fluid inside the inlet tank 100 flows along the upper direct cooling passages C1 formed in sequentially connected cooling segments 200, 200a, 200b. At this time, the fluid inside the upper first hollow body 213 directly contacts the upper surface of the power semiconductor 300. At this time, the primary heat exchange is performed between the warm heat generated in the power semiconductor 300 and the cold heat of the fluid.

The fluid distributed inside the inlet tank 100 also flows along the corresponding cooling segments 200e, 200d, 200c in the same manner, and also performs primary heat exchange.

On the other hand, after the primary heat exchange is finished, the fluid that has exited the last cooling segments 200b and 200c flows into the connection tank 400.

The fluid of the connecting tank 400 flows along the lower direct cooling passage C2 of each cooling segment 200b, 200a, 200, 200c, 200d, 200e.

In this process, the fluid inside the corresponding lower second hollow body 243 directly contacts the bottom surface of the power semiconductor 300. At this time, a second heat exchange is performed between the warm heat generated in the power semiconductor 300 and the cold heat of the fluid.

After completing all of the heat exchange, the fluid reaches the inside of the outlet tank 500 and is recovered toward the external heat dissipation device through the discharge pipe 513.

In addition, the recovered fluid is cooled again in the external heat dissipation device, and the power semiconductor 300 is cooled by direct cooling while repeating re-supply toward the present embodiment.

This embodiment has an advantage of relatively high heat exchange efficiency compared to the indirect cooling method made through a fluid passage wall (eg, tube wall) between the fluid and the object.

For example, the heat resistance of this embodiment was confirmed through experiments, and is improved by 50% compared to the indirect cooling method based on the same capacity.

The above description is merely illustrative of the technical idea of the present embodiment, and those skilled in the art to which this embodiment belongs may be capable of various modifications and variations without departing from the essential characteristics of the present embodiment. Therefore, the present embodiments are not intended to limit the technical spirit of the present embodiment, but to explain, and the scope of the technical spirit of the present embodiment is not limited by these embodiments. The protection scope of the present embodiment should be interpreted by the claims below, and all technical spirits within the equivalent range should be interpreted as being included in the scope of the present embodiment.

100: inlet tank 200, 200a, 200b, 200c, 200d, 200e: cooling segment
210: upper box 220: first O-ring
230: second O-ring 240: lower box
300: power semiconductor 302: pin
400: connecting tank 500: outlet tank

Claims (4)

A power semiconductor cooling device for cooling a plurality of first power semiconductors arranged in series and a plurality of second power semiconductors arranged in parallel with the plurality of first power semiconductors. ,
A plurality of first upper boxes (first upper box) disposed on the upper surface of the plurality of first power semiconductors and a first lower box (first lower box) disposed on the bottom surface of the plurality of first power semiconductors A first cooling segment assembly including a first cooling segment;
A plurality of second upper box (second upper box) disposed on the upper surface of the plurality of second power semiconductors and a second lower box (second lower box) disposed on the lower surface of the plurality of second power semiconductors A second cooling segment assembly including a second cooling segment;
An inlet tank connected to one end of the first upper box and one end of the second upper box and through which fluid flows;
An outlet tank connected to one end of the first lower box and one end of the second lower box and through which fluid is discharged; And
The first upper box, the second upper box, the first lower box, and the power semiconductor cooling device, characterized in that it comprises a connecting tank (connecting tank) connected to the other end of each of the second lower box (apparatus having cooling power semiconductor). According to claim 1,
The fluid flowing into the connecting tank from the first upper box and the second upper box is mixed in the connecting tank,
The fluid mixed in the connecting tank is a power semiconductor cooling device, characterized in that flowing into the first lower box and the second lower box from the connecting tank. According to claim 1,
The bottom surfaces of the first upper box facing the upper surfaces of the plurality of first power semiconductors are open, and the upper surfaces of the first lower box toward the lower surfaces of the plurality of first power semiconductors are open,
The bottom surface of the second upper box facing the upper surface of the plurality of second power semiconductors is open, and the upper surface of the second lower box toward the bottom surface of the plurality of second power semiconductors is open. Semiconductor cooling device. According to claim 3,
The fluid flowing inside the first cooling segment assembly is configured to cool the first power semiconductor by directly contacting the top surface of the first power semiconductor and the bottom surface of the first power semiconductor,
The fluid flowing through the interior of the second cooling segment assembly is configured to cool the second power semiconductor by directly contacting the top surface of the second power semiconductor and the bottom surface of the second power semiconductor, thereby cooling the second power semiconductor. .

Images