KR20200086138A - Light emitting device package and lighting system - Google Patents

Abstract

The invention provides a light emitting device package which can reduce an interval between a plurality of light emitting devices and a cavity. According to an embodiment, the light emitting device package includes: a body having a cavity; a first frame and a second frame disposed on a bottom of the cavity; a first light emitting device on the first frame; and a second light emitting device on the second frame, wherein the body includes first to fourth outer surfaces, the third and fourth outer surfaces have a length longer than that of the first and second outer surfaces, the cavity includes first to fourth inner surfaces adjacent to the first to fourth inner surfaces, respectively, the cavity includes a first recess recessed from a lower end of the first inner surface toward the first outer surface, a second recess recessed from a lower end of the second inner surface toward the second outer surface, a third recess recessed from a lower end of the third inner surface toward the third outer surface, and a fourth recess recessed from a lower end of the fourth inner surface toward the fourth outer surface, the first frame includes first and second bonding portions extending and exposed to the first and third recesses, and the second frame includes third and fourth bonding portions extending and exposed to the second and fourth recesses. The light emitting device package includes first and second wires individually connected to the first light emitting device and the first and second bonding portions, and third and fourth wires connected to the second light emitting device and the third and fourth bonding portions, respectively, wherein the first and second recesses face short sides of the first and second light emitting devices and may overlap in a horizontal direction.

Description

Light emitting device package and light source device {LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM}

An embodiment of the invention relates to a light emitting device package and a light source device.

Light emitting devices such as Light Emitting Diodes or Laser Diodes using Group 3-5 or 2-6 compound semiconductor materials are developed through thin film growth technology and device materials, resulting in red, green, blue and There is an advantage that can realize light in various wavelength bands such as ultraviolet rays. In addition, a light emitting device such as a light emitting diode or a laser diode using a Group 3-5 or 2-6 compound semiconductor material can use a fluorescent material or combine colors to implement a white light source with high efficiency. Such a light emitting device has advantages of low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps.

The light emitting device may be provided as a pn junction diode having a characteristic in which electrical energy is converted into light energy using, for example, a group 3-5 element or a group 2-6 element in the periodic table. Various wavelengths are possible by adjusting the composition ratio. For example, nitride semiconductors have received great attention in the field of optical devices and high power electronic devices due to their high thermal stability and wide band gap energy. In particular, blue light emitting devices using nitride semiconductors, green light emitting devices, ultraviolet (UV) light emitting devices, red (RED) light emitting devices, and the like are commercialized and widely used.

In the light emitting device package, research is being conducted on a method of improving the light extraction efficiency of the light emitting device and improving the light intensity at the package stage. In addition, research is being conducted on a method for improving bonding strength between the frame of the package and the light emitting device.

An embodiment of the present invention provides a light emitting device package that reduces a distance between a plurality of light emitting devices and an inner surface of a cavity.

An embodiment of the present invention provides a light emitting device package that reduces the exposed area of frames due to bonding of wires connected to each frame.

An embodiment of the present invention provides a light emitting device package capable of reducing light loss by reducing an exposed area of a frame at a cavity floor and increasing a body area.

An exemplary embodiment of the present invention provides a light emitting device package in which a bonding part in which a wire is bonded in a frame is disposed in short sides and corner areas of each light emitting device.

A light emitting device package according to an embodiment of the present invention includes a body having a cavity; A first frame disposed on the bottom of the cavity; A second frame disposed on the bottom of the cavity and spaced apart from the first frame; A first light emitting element disposed on the first frame; It includes a second light emitting element disposed on the second frame, the body includes first and second outer sides disposed on opposite sides of each other, and third and fourth outer sides disposed on opposite sides of each other, and the first The third and fourth outer surfaces are longer than the lengths of the first and second outer surfaces, and the cavity includes first to fourth inner surfaces adjacent to the first to fourth inner surfaces, respectively. The first recess recessed in the direction of the first outer surface from the lower end of the first inner surface, the second recess recessed in the direction of the second outer surface from the lower end of the second inner surface, the third inner surface And a third recess recessed in the direction of the third outer surface at the bottom and a fourth recess recessed in the direction of the fourth outer surface at the bottom of the fourth inner surface, wherein the first frame includes the first and It includes first and second bonding portions extending and exposed to a third recess, and the second frame includes third and fourth bonding portions extending and exposed to the second and fourth recesses, and the first And first and second wires respectively connected to the light emitting element and the first and second bonding portions, and third and fourth wires connected to the second light emitting element and the third and fourth bonding portions, respectively. The first and second recesses face the short sides of the first and second light emitting elements, and may overlap in the horizontal direction.

According to the invention, the area where the top surfaces of the first and second frames are exposed in the bottom area of the cavity is 15% or less of the total area of the top surface of the body, and the area is the area of the first to fourth recesses. Can be excluded.

According to the invention, the distance between the first and second light emitting elements and the first to fourth inner side lower ends of the cavity is 0.15 mm or less, and the first to fourth recesses are the first to fourth recesses of the cavity. It may be recessed to a depth of 0.4 mm or less from the bottom of the inner surface.

According to the invention, the first to fourth wires may have a tail portion in the first to fourth recesses.

According to the invention, the third recess faces the long side of the first light emitting element at the bottom of the third inner side, and the fourth recess is the long side of the second light emitting element at the bottom of the fourth inner side. Facing the third wire, the third wire extends in the direction of the third recess toward the short side of the first light emitting element, and the fourth wire extends in the direction of the fourth recess toward the short side of the second light emitting element Can be.

According to the invention, the difference between the inclination angles of the first and second inner surfaces and the inclination angles of the third and fourth inner surfaces is 5 degrees or less, and the inclination angles of the first and second inner surfaces are the third And an inclination angle of the fourth inner surface.

According to the present invention, the first and second recesses face the short-side center regions of the first and second light emitting elements, and the first to fourth recesses may include a hemispherical shape.

According to the invention, the frame may include an Ag reflective layer on the top.

According to the present invention, the third or fourth inner surface includes a fifth recess spaced apart from the bottom of the cavity, and a protection element may be disposed in the fifth recess.

According to the invention, the first and second recesses are symmetrical with respect to the center between the first and second frames at the bottom of the cavity, and the third and fourth recesses can be symmetrical.

An embodiment of the invention may increase the amount of light in the light emitting device package.

Embodiments of the invention can reduce the light loss in the light emitting device package.

An embodiment of the invention may improve reliability by improving light efficiency in a light emitting device package.

An embodiment of the present invention can increase the resin area of the reflective material around the light emitting elements and reduce the exposed area of the frame, thereby reducing problems caused by discoloration of the frame.

An embodiment of the invention can improve the reliability of the light emitting device package and the light source device having the same.

1 is a view showing a perspective view of a light emitting device package according to an embodiment of the present invention.
2 is a plan view of the light emitting device package of FIG. 1.
3 is a rear view of the light emitting device package of FIG. 2.
4 is a cross-sectional view taken along the AA side of the light emitting device package of FIG. 2.
5 is a cross-sectional view taken along the BB side of the light emitting device package of FIG. 2.
6 is a cross-sectional view taken along the CC side of the light emitting device package of FIG. 2.
7 is a view showing a cavity bottom structure excluding the light emitting device from the light emitting device package of FIG. 2.
8 is a view showing in detail a bonding portion to which the wire is bonded in the light emitting device package of FIG. 2.
9 is a view illustrating a bonding structure of a wire in a recess in which the wire is bonded in FIG. 4.
10 is a side cross-sectional view showing an example of a light emitting device in the light emitting device package of FIG. 2.

The technical spirit of the present invention is not limited to some of the embodiments described, but may be implemented in various different forms, and within the scope of the technical spirit of the present invention, selectively combines one or more of its components between embodiments. , Can be used by substitution. In addition, the terms used in the embodiments of the present invention (including technical and scientific terms), unless specifically defined and described, can be generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as meaning, and commonly used terms, such as predefined terms, may interpret the meaning in consideration of the contextual meaning of the related technology. In addition, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In the present specification, a singular form may also include a plural form unless specifically stated in the phrase, and is combined with A, B, C when described as "at least one (or more than one) of A and B, C". It can contain one or more of all possible combinations. In addition, in describing components of the embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the component from other components, and the term does not determine the essence, order, or order of the component. And, when a component is described as being'connected','coupled' or'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also to the component It may also include a case of'connected','coupled' or'connected' due to another component located between the other components. In addition, when described as being formed or disposed in the "top (top) or bottom (bottom)" of each component, the top (top) or bottom (bottom) is one as well as when the two components are in direct contact with each other It also includes a case in which another component described above is formed or disposed between two components. In addition, when expressed as "up (up) or down (down)", it may include the meaning of the downward direction as well as the upward direction based on one component.

Hereinafter, a light emitting device package according to an embodiment will be described with reference to the accompanying drawings.

1 is a perspective view of a light emitting device package according to an embodiment of the invention, Figure 2 is a plan view of the light emitting device package of Figure 1, Figure 3 is a rear view of the light emitting device package of Figure 2, Figure 4 is a 2 is an AA side sectional view of the light emitting device package, FIG. 5 is a BB side sectional view of the light emitting device package of FIG. 2, FIG. 6 is a CC side sectional view of the light emitting device package of FIG. 2, and FIG. 7 is a light emitting device package of FIG. 8 is a view showing a cavity bottom structure excluding the light emitting device, and FIG. 8 is a view showing in detail a bonding portion to which a wire is bonded in the light emitting device package of FIG. 2, and FIG. 9 is a wire in a recess in which the wire is bonded in FIG. It is a diagram explaining the bonding structure of.

1 to 9, the light emitting device package 100 includes a body 110 having a cavity 102, a plurality of frames 121 and 123, light emitting devices 171 and 173, wires 181 to 184, and a molding unit (191).

The body 110 may include an insulating material or a resin material. The body 110 includes, for example, polyphthalamide (PPA), polychloro triphenyl (PCT), liquid crystal polymer (LCP), polyamide9T (PA9T), silicone, epoxy, epoxy molding compound (EMC), silicone molding compound (SMC), ceramic, PSG (photo sensitive glass), may be formed of at least one selected from the group comprising sapphire (Al ₂ O ₃ ). The body 110 has Al ₂ O ₃ , TiO ₂ and SiO ₂ inside the resin material. It may include at least one filler. The content of the filler may be added in the range of 50 wt% or more, such as 70 wt% or more, or 80 to 85 wt% in the body. The body 110 may function as a reflective body, and an epoxy molding compound (EMC) material may improve moldability, moisture resistance, and adhesion. When viewed from above, the shape of the body 110 may be formed in a polygonal structure such as a triangle, a square, or a pentagon, or may be formed in a shape having a circular shape or a curved surface.

The body 110 and the plurality of frames 121 and 123 may be defined as a package body. The length of the first direction (X) of the package body is the length to both ends of the plurality of frames 121 and 123, and may be greater than the length of the second direction (Y), and is 1.5 times or more, for example, 1.5 times compared to the length of the second direction. To 2 times. In such a package, a plurality of light emitting elements 171 and 173 may be arranged in a first direction to provide a high-efficiency package. The thickness of the package body or the body 110 may be 1.2 mm or less, for example, in the range of 0.8 mm to 1.2 mm, and the luminous flux may be improved within the thickness range.

The body 110 may include a plurality of outer surfaces (S1, S2, S3, S4). At least one or all of the plurality of outer surfaces S1, S2, S3, and S4 may be vertically or inclined with respect to the lower surface of the body 110. For example, when the outer surfaces S1, S2, S3, and S4 of the body 110 are inclined, it is easy to separate the mold after injection molding of the body 110.

The body 110 describes the first to fourth outer surfaces S1, S2, S3, and S4 as examples, and the first outer surface S1 and the second outer surface S2 are in the second direction (Y). It extends with a long length in the direction and is opposite to each other, and the third outer surface S3 and the fourth outer surface S4 extend with a long length in the first direction X and are opposite sides. The length of each of the first outer surface S1 and the second outer surface S2 may be smaller than the lengths of the third outer surface S3 and the fourth outer surface S4. The length of the first outer surface S1 or the second outer surface S2 may be an interval between the third outer surface S3 and the fourth outer surface S4. The longitudinal direction of the body 110 is a first direction (X) direction, a direction passing through the center of the plurality of light emitting elements 171,173, or a gap between the first and second outer surfaces S1 and S2, The plurality of light emitting elements 171 and 173 may be arranged. The width direction of the body 110 is a second direction (Y), a direction orthogonal to the first direction, and may be a gap between the third and fourth outer surfaces S3 and S4. Both ends of the third outer surface S3 or the fourth outer surfaces S3 and S4 may be connected to both ends of the first and second outer surfaces S1 and S2. Here, the distance C1 between both short sides of the plurality of light emitting elements 171 and 173 may be in the range of 2.2 mm or more, for example, 2.2 to 3 mm, and may vary depending on the device size. Here, the maximum distance C1 between the recesses R1 and R2 at the bottom of the cavity 102 may be 150% or less, for example, 130 to 150% of the distance C1.

A recess Ra may be formed on at least one fourth outer surface S4 of the outer surfaces of the body 110, and the recess Ra may be a groove for an injection gate. The concave portion (Ra) is disposed on a long side, thereby improving injection efficiency of the body material through a wider injection gate.

1 and 2 and FIGS. 4 to 6, the body 110 may include a cavity 102 having a predetermined depth T1 (see FIG. 5) and the top surface S5 open. The cavity 102 may be recessed from the top surface S5 to the back surface S6. The cavity 102 may have a polygonal shape in which the shape viewed from above is circular, elliptical, polygonal (eg, square), and the corner is curved. The depth of the cavity 102 is a depth from the top surface of the body 110 to the top surface of the frames 121 and 123, and may be formed in a range of 0.5 mm or more, for example, 0.5 mm to 0.8 mm. The depth of the cavity 102 may be in the range of 55% or more, for example, 55% to 75% of the thickness of the body 110. When the depth of the cavity 102 is larger than the above range, the thickness of the package may be increased, and if it is smaller than the above range, the distribution of the directivity of light may be increased or the luminance may be decreased.

Looking at the inner surface of the cavity 102, the first inner surface S11 and the second inner surface S12 face each other, and the third and fourth inner surfaces S13 and S14 may face each other. The first inner surface (S11) is adjacent to the first outer surface (S1), the second inner surface (S12) is adjacent to the second outer surface (S2), the third inner surface (S13) is 3 adjacent to the outer surface (S3), the fourth inner surface (S14) may be adjacent to the fourth outer surface (S4). According to an embodiment of the invention, the lower ends of the first to fourth inner surfaces S11, S12, S13, and S14 extend to a portion closest to the light emitting elements 171 and 171, and expose the top surface areas of the frames 121 and 131. Can be reduced. Since the first to fourth inner surfaces S11, S12, S13, and S14 are formed of a material of the body 110 and disposed with a minimum distance from the light emitting elements 171 and 173, light from the bottom of the cavity 102 is formed. It can reduce losses. That is, the surfaces of the frames 121 and 131 may be discolored by the light emitted from the light emitting elements 171 and 173, and the light reflectance is lower than that of the material of the body 110. Accordingly, as the area of the frames 121 and 131 is reduced, light loss may be reduced.

The first inner surface S11 faces the short side of the first light emitting element 171 in the first direction, and the second inner surface S12 faces the short side of the second light emitting element 173 and the first direction. The third inner surface S13 and the fourth inner surface S14 may face the long sides of the first and second light emitting elements 171 and 173 in a first direction. Here, in the first and second light emitting elements 171 and 173, the short sides may overlap in the first direction, and the long sides may overlap in the second direction. Here, since the length of the body 110 is long in the first direction and short in the second direction, the distance between the third and fourth inner surfaces S13 and S14 disposed in the second direction is disposed in the first direction. It may be shorter than the distance between the first and second inner surfaces S11 and S12. The minimum distance in the first direction between the first and second inner surfaces S11 and S12 is more than twice the minimum distance in the second direction between the third and fourth inner surfaces S13 and S14, for example, 2.1 times to It may be in the range of 2.8 times. That is, since the length difference between the long side and the short side of the package body has a difference of 2 times or less, and the difference in length between the first direction and the second direction of the bottom of the cavity 102 is arranged more than twice, the second direction The bottom length of the cavity 102 can be minimized. This extends the third and fourth inner surfaces S13 and S14 disposed in the second direction to the bottom center of the cavity 102, thereby reducing the exposed areas of the frames 121 and 131. The bottom shape of the cavity 102 may include a symmetrical shape.

4 and 6, the first and second inner surfaces S11 and S12 are inclined at a first angle Q1, and the third and fourth inner surfaces S13 and S14 are at a second angle ( Q2). The first angle Q1 is an inclined angle between the first inner surface S1 and the second inner surface S2 based on a straight line horizontal to the upper surface of the body 110, and the second angle Q2 ) Is an inclined angle of the third and fourth inner surfaces S13 and S14 based on a straight line horizontal to the upper surface of the body 110. Since the third and fourth inner surfaces S13 and S14 extend closer to the light emitting element, the second angle Q2 may be further reduced than the structure of the comparative example. The second angle Q2 may be 65 degrees or less, for example, in the range of 60 degrees to 65 degrees. The comparative example is a package example in which the plurality of light emitting elements 171 and 173 are not aligned in the first direction, and are aligned in the second direction. In this structure, the inclination angle of the inner surface of the cavity 102 in the second direction is 80 degrees. It can be over. The first angle Q1 may be smaller than the second angle Q2, and a difference between the first angle Q1 and the second angle Q2 is 5 degrees or less, for example, in the range of 1 degree to 5 degrees, or It may range from 1.5 degrees to 5 degrees. The second angle Q2 may be 60 degrees or less. Since there is almost no difference between the first and second angles Q1 and Q2 in the first to fourth inner surfaces S11, S12, S13, and S14, the light directing angle characteristic in the second direction in the same package size is obtained. It can be provided more widely. The first and second angles Q1 and Q2 may be internal angles of the inner surfaces S11, S12, S13, and S14 relative to a straight line horizontal to the upper surfaces of the frames 121 and 131.

8 and 9, the gap G1 between the lower end of the inner surface of the cavity 102 and the light emitting elements 171 and 173 may be 0.15 mm or less, for example, in the range of 0.05 to 0.15 mm. In the large case, the improvement in light flux reduction by the Ag surface is negligible, and when it is smaller than the above range, it may be difficult to mount the light emitting devices 171,173 or to insert wire bonding equipment. Accordingly, the area of the reflective layers (eg, Ag) of the frames 121 and 131 at the bottom of the cavity 102 can be minimized, thereby improving light reflectivity due to the body material.

2, each of the inner surfaces S11, S12, S13, and S14 of the cavity 102 may include recesses R1, R2, R3, and R4. The recesses R1, R2, R3, and R4 are first recesses R1 disposed on the first inner surface S11, and second recesses R2 disposed on the second inner surface S12. , A third recess R3 disposed on the third inner surface S13 and a fourth recess R4 disposed on the fourth inner surface S14. The first recess R1 is recessed concavely from the lower portion of the first inner surface S11 toward the first outer surface S1, and the second recess R2 has the second inner surface ( In the lower portion of S12) is recessed in the direction of the second outer surface (S2), the third recess (R3) is in the direction of the third outer surface (S3) from the bottom of the third inner surface (S13) It is recessed, and the fourth recess R4 may be recessed from the bottom of the fourth inner surface S14 toward the fourth outer surface S4. The maximum width of each of the first to fourth recesses R1, R2, R3, and R4 may be smaller than the width of the first and second light emitting elements 171 and 173 or the length of the short side. The first recess R1 faces the short side of the first light emitting element 171 or overlaps in a first direction, and the second recess R2 faces the short side of the second light emitting element 173. Or overlap in the first direction. The third recess R3 faces the long side of the first light emitting element 171, and the fourth recess R4 faces the long side of the second light emitting element 173.

The first and second recesses R1 and R2 and the first and second light emitting elements 171 and 173 may overlap in the first direction. The third and fourth recesses R3 and R4 may not shift or overlap each other in the second direction. 4 and 7, the first frame 121 is extended and exposed to the first and third recesses R1 and R3, and the second and third recesses R2 and R3 are The second frame 131 may be extended and exposed. The first to fourth recesses R1, R2, R3, and R4 may include a hemispherical shape in an outer direction or a curved shape having a radius of curvature of a circle. The centers of the first and second recesses R1 and R2 may be arranged on a straight line passing through the centers of the light emitting elements 171 and 173. The first to fourth recesses R1, R2, R3, and R4 may extend to a horizontal surface such as the bottom of the cavity 102.

The third recess R3 partially faces the long side of the first light emitting element 171 and may correspond to the corner and separation part 115 of the first light emitting element 171. The fourth recess R4 partially faces the long side of the second light emitting element 173 and may correspond to a corner and a separation portion 115 of the second light emitting element 173.

2 and 7, a fifth recess (R5) is disposed on the third or fourth inner surfaces (S13, S14), and the fifth recess (R5) is a barrier and a bottom of the cavity (102). It can be spaced by the unit 105. The fifth recess R5 will be described as an example disposed on the third inner side surface S13, and the barrier portion 105 is a dam between the fifth recess R5 and the bottom of the cavity 102. It plays a role and may be formed of a material of the body. The barrier portion 105 extends along the long side of the second light emitting element 173, and moves from a lower portion 106 of the second inner surface S12 (see FIG. 8) to a lower direction of the third inner surface S13. Can be extended. The width of the barrier portion 105 may be 0.12 mm or more, or a range of 0.12 mm to 0.17 mm, and a height of 0.08 mm or more, for example, 0.08 to 0.12 mm. The height of the barrier portion 105 is disposed at 50% or more of the thickness of the light emitting elements 171 and 173, thereby reducing light loss. A protection element 175 and a fifth wire 185 connected thereto may be disposed in the fifth recess R5. The protection element 175 is disposed on the sub-region 25 extending from the second frame 131, and the first protrusion 22 protruding from the first frame 121 toward the second outer surface S2 ) May be connected to the end 25 and the fifth wire 185. The barrier portion 105 may function as a reflection dam to suppress light emitted in the lateral direction from the second light emitting element 173 from being lost by the protection element 175. A reflective resin may be molded in the fifth recess R5. Accordingly, light loss in the fifth recess R5 can be reduced. The protection element 175 may include an overvoltage protection element such as a thyristor, a zener diode, or a transient voltage suppressor (TVS) diode. The protection element 175 may protect the light emitting elements 171 and 173 by being connected to the connection circuits of the first light emitting element 171 and the second light emitting element 173 in parallel.

Here, the separation unit 115 may be disposed between the plurality of frames 121 and 131, and the first and second frames 121 and 131 may be spaced apart and insulated. The separation part 115 is formed of a material of the body 110 and may be disposed between the first and second frames 121 and 131.

2 to 5, the plurality of frames 121 and 131 may be arranged in two or more, and may be defined as first and second frames 121 and 123. The first frame 121 is disposed under the body 102 adjacent to the bottom of the cavity 102 and the first, third, and fourth outer surfaces S1, S3, and S4, and the second frame 131 ) May be disposed at the bottom of the cavity 102 and the lower body 110 adjacent to the second, third, and fourth outer surfaces S2, S3, and S4. The first and second frames 121 and 131 may include a conductive frame or a metal frame. The first and second frames 121 and 131 include, for example, copper (Cu), titanium (Ti), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), and tin. It may be selected from (Sn) and silver (Ag), and may be formed in a single layer or multiple layers. The thicknesses of the first and second frames 121 and 131 may be formed in consideration of heat dissipation characteristics and electrical conduction characteristics, and may be formed in a range of 200 μm or more, such as 200 to 400 μm. The first frame 121 and the second frame 131 may stably provide the structural strength of the package body, and may be electrically connected to the light emitting elements 171 and 173. A metal layer such as Ag may be formed on the surfaces of the first and second frames 121 and 131. Metal layers such as Ag formed on the surfaces of the first and second frames 121 and 131 may have lower light reflectivity than the material of the body 110 or the separation portion 115. Accordingly, as the exposed areas of the frames 121 and 131 increase under the light emitting devices 171 and 173, the light reflectance decreases, and as the area of the body 110 increases, the light reflectance may increase.

The first end 123 of the first frame 121 may protrude outward from the first outer surface S1 of the body 110 below the first outer surface S1 of the body 110. . The second end 133 of the second frame 131 may protrude more than the fourth outer surface S4 of the body 110. The lower surfaces of the first and second frames 121 and 131 may be exposed to the lower surfaces S6 of the body 110. As shown in FIG. 3, the first and second frames 121 and 131 have stepped structures ST1 and ST2 along the outer circumference, and the first and second frames 121 and 131 are provided by the stepped structures ST1 and ST2. ), the upper surface area may be larger than the lower surface area. The stepped structures ST1 and ST2 of the first and second frames 121 and 131 may increase an area of engagement with the body 110, thereby suppressing moisture penetration.

3, the first and second frames 121 and 131 include a plurality of holes H1, H2, H3 and H4, and the plurality of holes H1, H2, H3 and H4 are the body 110 ) Can be combined. The plurality of holes (H1, H2, H3, H4) has a stepped structure and the contact area with the body 110 may be increased. The holes H1 and H3 of the first frame 121 are arranged in an area adjacent to the first end, and the holes H2 and H4 of the second frame 131 are arranged in an area adjacent to the second end. Can be.

2 and 3, the first frame 121 includes a first region 21 in which the first light emitting element 171 is disposed, and the second frame 131 is the second light emitting element A second region 31 in which 173 is disposed may be included. The first and second regions 21 and 31 may face each other on both sides of the separation portion 115. The first frame 121 includes a first protrusion 22 protruding in the direction of the second frame 131 or the second outer surface S2 in an area adjacent to the third outer surface S3, and the A fifth wire 185 may be bonded to the end 25 of the first protrusion 22. The end portion 25 of the first protrusion 22 may extend to a central point of a long side of the second light emitting element 173. In the second frame 131, a first sub region 35 corresponding to an end of the first protrusion 22 may protrude. The first sub-region 33 may be spaced apart from the second region 31 by the recess region Rb.

The second frame 131 includes a second protrusion 32 protruding in the direction of the first frame 121 or the first outer surface S1 in an area adjacent to the fourth outer surface S4, and the The end portion 32A of the second protrusion 32 may extend to a central point of a long side of the first light emitting element 171. Here, the separating part 115 includes a first extension part 15A extending between the first protruding part 22 of the first frame 121 and the second area 31 of the second frame 131, and the first part A second extension portion 15B extending between the second protrusion portion 32 of the second frame 131 and the first region 21 of the first frame 121 may be included. The first extension portion 15A extends from the separation portion 115 in a second outer surface S2 direction, and the second extension portion 15B is a first outer surface portion S1 from the separation portion 115. ) Direction. The first and second extension portions 15A and 15B may extend in opposite directions with respect to the separation portion 115, thereby strengthening the coupling between the separation portion 115 and the frames 121 and 123. And, it is possible to prevent the stiffness of the center of the body 110 from deteriorating. The first and second protrusions 22 and 32 may be arranged in a symmetrical shape, and the end 25 of the first protrusion 22 may be in the direction of the second outer surface S2 from the virtual center line Y0. With a predetermined distance D1, the end portion 32A of the second lead-out part 32 may protrude at a predetermined distance D2 from the center line Y0 toward the first outer surface S1. . The distances D1 and D2 may be 0.8 mm or more, for example, in the range of 0.8 mm to 1.2 mm.

2 and 7, the first frame 121 is disposed on the bottom of the first recessed portion 11A and the first bonding portion 11A and the third recessed portion R3. It may include a second bonding portion (11B). The second frame 131 includes a third bonding portion 31A disposed on the bottom of the second recess R2 and a fourth bonding portion 31B disposed on the bottom of the fourth recess R4. It can contain. The upper surfaces of the first to fourth bonding portions 11A, 11B, 31A, and 31B are disposed on the same plane as the upper surfaces of the frames 121 and 131, and the upper surfaces of the respective frames 121 and 131 may be extended. The outer end of the second bonding portion 11B and the outer end of the fourth bonding portion 31B may extend the separation portion 115 or overlap the separation portion 115 in a second direction.

As illustrated in FIG. 9, the maximum width B2 of the first and second recesses R1 and R2 may be 0.55 mm or less, for example, in the range of 0.35 to 0.55, and this width B2 is for wire bonding equipment. It can be a minimal space and can reduce light loss. The maximum depth K2 of the first and second recesses R1 and R2 may be equal to or smaller than the maximum width B2, for example, 0.4 mm or less or in a range of 0.2 mm to 0.4 mm. The depth K2 of the first and second recesses R1 and R2 may be changed by the length of the tail portion Wc of the other end Wb of the first and third wires 181 and 183. The depths K2 of the first and second recesses R1 and R2 are the outer circumferential surfaces of the first and second recesses R1 and R2, and the first and second inner surfaces of the cavity 102 (S11, S12) It is the distance between the bottom.

The length K4 of the tail portion Wc of the first and second wires 181 and 182 may be in the range of 0.12 mm±0.05 mm. The straight line distance K3 between one end Wa and the other end Wb of the wires 181 and 183 disposed in the first and second recesses R1 and R2 is the length of the tail portion Wc on a plane ( K4) may be 2 times or less or 1.5 times or less. The straight line distance K3 may be in a range of 0.15 mm±0.05 mm. In addition, the maximum distances between the short sides of the first and second light emitting elements 171 and 173 and the outer circumferential surfaces Sr of the first and second recesses R1 and R2 may be in the range of 0.45 mm ± 0.1.

The maximum height T2 of the outer circumferential surfaces Sr of the first and second recesses R1 and R2 is the outer circumferential surfaces of the third and fourth recesses R3 and R4 based on the upper surfaces of the respective frames 121 and 131. Can be greater than the maximum height of The maximum height T2 of the outer circumferential surfaces Sr of the first and second recesses R1 and R2 may be 0.33 mm or less, for example, in the range of 0.24 mm to 0.33 mm, and the third and fourth recesses ( The maximum height of the outer circumferential surfaces of R3 and R4) may be 0.3 mm or less, for example, in the range of 0.18 to 0.3 mm. When the outer circumferential surfaces of the first to fourth recesses R1, R2, R3, and R4 are larger than the above range, the area of the inner surface of the cavity 102 can be enjoyed, thereby minimizing the Ag exposure area within the range. can do. The outer peripheral surfaces Sr of the first to fourth recesses R1, R2, R3, and R4 may be vertically or inclined.

As illustrated in FIG. 7, in the exemplary embodiment of the present invention, the bottom area of the cavity 102 is the first reflection area A1 except for the areas of the first to fourth recesses R1, R2, R3, and R4, and the The first reflection region may exclude the region of the separation unit 115. The area A2 of the separating part 115 is the area of the separating part 115 at the bottom of the cavity 102 and connects the outer lines of the first to fourth recesses R1, R2, R3, R4. The area of the inner region of the rectangle connecting one imaginary straight line is defined as the second reflection region A3. At this time, the inner region of the rectangle formed by an imaginary straight line connecting the outer lines of the first to fourth recesses R1, R2, R3, and R4 is the first to fourth inner surfaces S11, S12, S13, It may be the second reflection area A2 when the S14) is not extended. That is, when the second reflective region A2 does not have an extended portion of the first to fourth inner surfaces S11, S12, S13, and S14, the area of the reflective layer of each frame 121 and 131 may be further increased, The resulting optical loss can be large. According to an embodiment of the present invention, the first reflection area (excluding the area of the separation portion) A1 smaller than the second reflection area A2 is provided as the bottom area of the cavity 102, thereby reducing the area of the reflective layer of each frame 121 and 131 Alternatively, it is possible to improve the increase in light reflection efficiency by the extended portion of each inner surface S11, S12, S13, S14 of the cavity 102. The two-reflection area A2 covers the entire area of the upper surface of the body. It may be 18% or more as a reference, and the first reflection area (excluding the area of the separation part) may be 15% or less, for example, 13% to 15%, based on the total area of the upper surface of the body 110. The first reflection region A1 may be reduced to 3% or less than the second reflection region A2. In addition, the first to fourth recesses R1, R2, R3, and R4 are provided on each inner surface of the cavity 102. By distributing, light loss can be reduced.

1 to 5, a plurality of light emitting elements 171 and 173 may be disposed in the cavity 102. The light emitting devices 171 and 173 may selectively emit light in the range of visible light to ultraviolet light, and may be selected from, for example, red LED chips, blue LED chips, green LED chips, and yellow green LED chips. The first and second light emitting devices 171 and 173 include an LED chip including at least one of a compound semiconductor of a group III-V element and a compound semiconductor of a group II-VI element. The first and second light emitting elements 171 and 173 may have the highest light intensity of the same color or the highest light intensity of different colors. The first and second light emitting elements 171 and 173 may emit blue light or a wavelength range of 400 nm to 470 nm, for example.

The first and second light emitting elements 171 and 173 may be horizontal chips, disposed between a first conductive semiconductor layer, a second conductive semiconductor layer, and the first conductive semiconductor layer and the second conductive semiconductor layer. It may include an active layer. For example, the first and second conductivity-type semiconductor layers may include at least one selected from the group including GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, etc. . The first conductivity-type semiconductor layer may be an n-type semiconductor layer doped with n-type dopants such as Si, Ge, Sn, Se, and Te. The second conductivity-type semiconductor layer may be a p-type semiconductor layer doped with p-type dopants such as Mg, Zn, Ca, Sr, and Ba. The active layer may be implemented with a compound semiconductor. The active layer may be embodied as at least one of a compound semiconductor of group 3-5 or 2-6. When the active layer is implemented with a multi-well structure, the active layer may include a plurality of alternating well layers and a plurality of barrier layers, and In _x Al _y Ga _{1 -x- y} N (0≤x≤1 , 0≤y≤1, and 0≤x+y≤1). For example, the active layer is selected from the group including InGaN/GaN, GaN/AlGaN, AlGaN/AlGaN, InGaN/AlGaN, InGaN/InGaN, AlGaAs/GaAs, InGaAs/GaAs, InGaP/GaP, AlInGaP/InGaP, InP/GaAs It may include at least one. The first and second light emitting elements 171 and 173 may include a substrate at the bottom. The substrate may be a light-transmitting material or a semiconductor material or a metal material.

The first light emitting element 171 is adhered to the first area of the first frame 121 with an adhesive member, and the second light emitting element 173 is adhered to the second area of the second frame 131. It can be glued as a member. The adhesive member may be an insulating adhesive or a conductive adhesive. The insulating adhesive may include a material such as epoxy or silicone, and the conductive adhesive may include a bonding material such as solder.

The first and second light emitting elements 171 and 173 include first and second pads, and the first and second pads are connected to the first and second conductive semiconductor layers, and the first and second frames ( 121,131). The first light emitting element 171 may be connected to the first and second frames 121 and 131 through first and second wires 181 and 182. The second light emitting element 173 may be connected to the first and second frames 121 and 131 through third and fourth wires 183 and 184.

The first wire 181 is connected to each of the first light emitting element 171 and the first bonding portion 11A of the first frame 121, and the second wire 182 is the first light emitting element ( 171) and the fourth bonding portion of the second frame 131. The third wire 183 is connected to each of the second light emitting element 173 and the third bonding portion of the second frame 131, and the fourth wire 184 is the second light emitting element 173 And a second bonding portion of the first frame 121. Each one end Wa of the first and second wires 181 and 182 is bonded to each pad of the first light emitting element 171, and the other end Wb is bonded to the first and fourth bonding parts. Each one end Wa of the third and fourth wires 183 and 184 is bonded to each pad of the second light emitting element 173, and the other end Wb is bonded to the third and second bonding parts. The other end Wb of the first to fourth wires 181,182,183,184 is bonded to the bottom of the first to fourth recesses R1, R2, R3, and R4, and the first to fourth inner surfaces S11, S12, S13, S14 may be disposed inside the imaginary straight line E1 (see FIG. 9) extending to the lower end Pa.

In the first to fourth wires 181, 182, 183, and 184, each other end Wb has a tail portion Wc, and the tail portion Wc has an inner direction or each recess of each recess from the other end Wb. It extends in the direction of the outer peripheral surface of the set (Sr, see FIG. 9). The tail portion Wc of each wire may improve the bonding strength of the other end Wb of each wire and prevent the wire from boiling or bonding defects.

Here, the first and third wires 181 and 183 extend in the short side directions of the first and second light emitting elements 171 and 173, and extend into the first and second recesses R1 and R2. Accordingly, when the first and second light emitting elements 171 and 173 emit light through the side surfaces, more light is emitted through the barrier, so that the first and second light emitting elements 171 and 173 are disposed on short sides. Light loss by three wires 181 and 183 can be reduced than when placed on a barrier. In addition, when light is emitted from the side surfaces of each light emitting element 171 and 173, the third and fourth inner side surfaces S13 and S14 are disposed adjacent to each light emitting element 171 and 173, so that the long sides of each light emitting element 171 and 173 are long. It is possible to prevent the extraction efficiency of the light emitted through is lowered.

In addition, in order to reduce the light loss of the first and third wires 181 and 183, a recess is disposed at each corner of the inner surface of the cavity 102, and when the wire connected to the light emitting element is drawn out in the corner direction, A problem that a part of the first and third wires is caught in a corner of each of the light emitting elements 171 and 173 may occur, and a problem such as open defect or short may occur.

When the second wire 182 extends from the second light emitting element 173 in the direction of the second bonding portion, it may extend in a short side direction beyond the corner of the second light emitting element 173. When the fourth wire 184 extends from the first light emitting element 171 in the direction of the fourth bonding portion, the fourth wire 184 may extend in a short side direction outside the corner of the fourth light emitting element. Accordingly, defects in which the second and fourth wires 182 and 184 contact the corners of the light emitting elements 171 and 173 can be prevented, and light loss can be minimized.

A molding part 191 may be formed in the cavity 102. The molding part 191 includes a light-transmitting resin material such as silicone or epoxy, and may be formed in a single layer or multiple layers. The molding unit 191 may include a phosphor or quantum sleep to convert the wavelength of light emitted onto the light emitting elements 171 and 173, and the phosphor excites a part of light emitted from the light emitting elements 171 and 173 To emit light of different wavelengths. The phosphor may be selectively formed among YAG, TAG, Silicate, Nitride, and Oxy-nitride-based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but is not limited thereto. The surface of the molding part 191 may be formed in a flat shape, a concave shape, a convex shape, etc., but is not limited thereto.

The surface of the molding part 191 may be a light exit surface. A lens may be disposed on the molding part 191, and the lens may include a convex lens for the light emitting elements 171 and 173, a concave lens, and a convex lens having a total reflection surface at the center, but is not limited thereto. Does not.

The light emitting device according to the embodiment of the present invention will be described with reference to the example of FIG. 10.

Referring to FIG. 10, the light emitting elements 171 and 173 include a substrate 311, a buffer layer 312, a light emitting structure 310, a first electrode 316, and a second electrode 317. The substrate 311 includes a light-transmitting or non-light-transmitting material, and also includes a conductive or insulating substrate. The buffer layer 312 reduces the lattice constant difference between the substrate 311 and the material of the light emitting structure 310, and may be formed of a nitride semiconductor. Between the buffer layer 312 and the light emitting structure 310, a nitride semiconductor layer in which a dopant is not doped may be further formed to improve crystal quality.

The light emitting structure 310 includes a first conductive semiconductor layer 313, an active layer 314, and a second conductive semiconductor layer 315. The first conductive semiconductor layer 313 is implemented as a group III-V compound semiconductor doped with a first conductive dopant, and the first conductive semiconductor layer 313 is an n-type semiconductor layer, and the first The conductive dopant is an n-type dopant, and includes Si, Ge, Sn, Se, and Te. A first clad layer may be formed between the first conductive semiconductor layer 313 and the active layer 314. The first clad layer may be formed of a GaN-based semiconductor, and the band gap may be formed over the band gap of the active layer 314. The first clad layer is formed of a first conductive type, and serves to constrain the carrier.

The active layer 314 is disposed on the first conductive semiconductor layer 313, and optionally includes a single quantum well, multiple quantum wells (MQW), a quantum wire structure, or a quantum dot structure do. The active layer 314 includes a cycle of the well layer and the barrier layer. The well layer includes a composition formula of In _x Al _y Ga _{1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x+y≤1), and the barrier layer is In _x Al _y Ga _{1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x+y≤1) may include a composition formula. The period of the well layer/barrier layer may be formed in one period or more using, for example, a stacked structure of InGaN/GaN, GaN/AlGaN, InGaN/AlGaN, InGaN/InGaN, and InAlGaN/InAlGaN. The barrier layer may be formed of a semiconductor material having a band gap higher than that of the well layer.

A second conductive semiconductor layer 315 is formed on the active layer 314. The second conductive semiconductor layer 315 may be formed of any one of a semiconductor doped with a second conductive dopant, for example, a compound semiconductor such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, or AlInN. The second conductive semiconductor layer 315 is a p-type semiconductor layer, and the second conductive dopant is a p-type dopant, and may include Mg, Zn, Ca, Sr, and Ba.

The second conductive semiconductor layer 315 may include a superlattice structure, and the superlattice structure may include an InGaN/GaN superlattice structure or an AlGaN/GaN superlattice structure. The superlattice structure of the second conductive type semiconductor layer 315 may diffuse the current included in the voltage abnormally to protect the active layer 314.

In addition, the conductivity type of the light emitting structure 310 may be reversed, for example, the first conductive semiconductor layer 313 is a P-type semiconductor layer, and the second conductive semiconductor layer 315 is an n-type semiconductor layer. can do. A semiconductor layer of a first conductivity type having a polarity opposite to that of the second conductivity type may be further disposed on the second conductivity type semiconductor layer 315.

The light emitting structure 310 may be implemented as any one of n-p junction structure, p-n junction structure, n-p-n junction structure, and p-n-p junction structure. Here, p is a p-type semiconductor layer, n is an n-type semiconductor layer, and-includes a structure in which the p-type semiconductor layer and the n-type semiconductor layer are in direct or indirect contact. Hereinafter, for convenience of description, the uppermost layer of the light emitting structure 310 will be described as the second conductive semiconductor layer 315.

A first pad 316 is disposed on the first conductive semiconductor layer 313, and a second pad 317 having a current diffusion layer is disposed on the second conductive semiconductor layer 315. The first and second pads 316 and 317 may include, for example, at least one material selected from the group consisting of Ti, Cu, Ni, Au, Cr, Ta, Pt, Sn, Ag, P, Fe, Sn, Zn, Al. Or an alloy thereof. The first and second pads 316 and 317 may be exposed on top of each light emitting element 171 and 173, and one end of the wire may be bonded to each other.

Meanwhile, one or a plurality of light emitting device packages according to embodiments of the present invention may be disposed on a circuit board and applied to a light source device. Further, the light source device may include a display device, a lighting device, a head lamp, and the like according to the industrial field.

As an example of a light source device, the display device includes a bottom cover, a reflector disposed on the bottom cover, a light emitting module that emits light and includes a light emitting element, and is disposed in front of the reflector and guides light emitted from the light emitting module forward A light guide plate, an optical sheet including prism sheets disposed in front of the light guide plate, a display panel disposed in front of the optical sheet, an image signal output circuit connected to the display panel and supplying an image signal to the display panel, of the display panel It may include a color filter disposed in front. Here, the bottom cover, the reflector, the light emitting module, the light guide plate, and the optical sheet may form a backlight unit. Also, the display device does not include a color filter, and may have a structure in which light emitting elements emitting red, green, and blue light are disposed respectively.

As another example of the light source device, the head lamp includes a light emitting module including a light emitting device package disposed on a substrate, a reflector reflecting light emitted from the light emitting module in a predetermined direction, for example, forward, and reflected by the reflector It may include a lens that refracts light forward, and a shade that is reflected by a reflector to block or reflect a portion of light directed to the lens to form a light distribution pattern desired by the designer.

The lighting device, which is another example of the light source device, may include a cover, a light source module, a heat radiator, a power supply unit, an inner case, and a socket. Further, the light source device according to an embodiment of the present invention may further include any one or more of a member and a holder. The light source module may include a light emitting device package according to an embodiment of the invention.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope of the present invention without departing from the technical spirit of the present invention. It will be clear to those who have the knowledge of Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined by the scope of the claims.

Claims (10)

A body having a cavity;
A first frame disposed on the bottom of the cavity;
A second frame disposed on the bottom of the cavity and spaced apart from the first frame;
A first light emitting element disposed on the first frame;
And a second light emitting element disposed on the second frame,
The body includes first and second outer surfaces disposed opposite to each other, and third and fourth outer surfaces disposed opposite to each other, and the third and fourth outer surfaces have lengths of the first and second outer surfaces. Longer than the length of the outer surface,
The cavity includes first to fourth inner sides adjacent to each of the first to fourth inner sides,
The cavity has a first recess recessed in the direction of the first outer surface from the bottom of the first inner surface, a second recess recessed in the direction of the second outer surface from the bottom of the second inner surface, and the third It includes a third recess recessed in the direction of the third outer surface from the bottom of the inner surface and a fourth recess recessed in the direction of the fourth outer surface from the bottom of the fourth inner surface,
The first frame includes first and second bonding portions extending and exposed to the first and third recesses,
The second frame includes third and fourth bonding portions extending and exposed to the second and fourth recesses,
And first and second wires respectively connected to the first light emitting element and the first and second bonding portions, and third and fourth wires respectively connected to the second light emitting element and the third and fourth bonding portions, ,
The first and second recesses face the short sides of the first and second light emitting elements, and the light emitting device package overlaps in a horizontal direction. According to claim 1,
The area in which the upper surfaces of the first and second frames are exposed in the bottom area of the cavity is 15% or less of the total area of the upper surface of the body, and the area is a light emitting device excluding the areas of the first to fourth recesses. package. According to claim 2,
The distance between the first and second light emitting elements and the lower ends of the first to fourth inner surfaces of the cavity is 0.15 mm or less,
The first to fourth recesses are light emitting device packages that are recessed to a depth of 0.4 mm or less from the bottom of the first to fourth inner surfaces of the cavity. According to claim 1,
The first to fourth wires are light emitting device packages having a tail in the first to fourth recesses. The method according to any one of claims 1 to 4,
The third recess faces a long side of the first light emitting element at a lower portion of the third inner side,
The fourth recess faces the long side of the second light emitting element at the bottom of the fourth inner side,
The third wire extends in the direction of the third recess on the short side of the first light emitting element,
The fourth wire is a light emitting device package extending in the direction of the fourth recess toward the short side of the second light emitting device. The method according to any one of claims 1 to 4,
The difference between the inclination angles of the first and second inner surfaces and the inclination angles of the third and fourth inner surfaces is 5 degrees or less,
The first and second inclined angle of the inner surface is greater than the inclined angle of the third and fourth inner surface light emitting device package. The method according to any one of claims 1 to 4,
The first and second recesses are opposed to short-side center regions of the first and second light emitting elements,
The first to fourth recesses are light emitting device packages including a hemispherical shape. The method according to any one of claims 1 to 4,
The frame is a light emitting device package including an Ag reflective layer on the top. The method according to any one of claims 1 to 4,
And a fifth recess recessed on the third or fourth inner surface,
A light emitting device package in which a protection element is disposed in the fifth recess. The method according to any one of claims 1 to 4,
A light emitting device package in which the first and second recesses are symmetrical with respect to the center between the first and second frames at the bottom of the cavity, and the third and fourth recesses are symmetrical.

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