KR20200081924A - Sterilizing apparatus - Google Patents

Abstract

The present invention relates to a sterilizing apparatus. The sterilizing apparatus according to an embodiment includes: a housing having a space therein; a light source unit disposed on an inner wall of the housing; a heat dissipation unit disposed on the housing; a first transmission unit connected to the inner space of the housing; and a second transmission unit disposed on the heat dissipation unit. The second transmission unit is disposed at an outer side corresponding to the inner wall on which the light source unit is disposed, and extends from the outer side of the housing onto the heat dissipation unit.

Description

Sterilization device {STERILIZING APPARATUS}

The embodiment relates to a sterilization device.

Light emitting devices including compounds such as GaN and AlGaN have many advantages such as having a wide and easy to adjust bandgap energy, and are used in various fields.

Light emitting devices such as light emitting diodes or laser diodes using Group 3-5 or 2-6 compound semiconductor materials are developed with thin film growth technology and device materials, resulting in yellow, red, green, There is an advantage that can realize light in various wavelength bands such as blue and ultraviolet light. In addition, a light emitting device such as a light emitting diode or a laser diode using a Group 3-5 or 2-6 compound semiconductor material can use a fluorescent material or combine colors to implement a white light source with high efficiency. Such a light emitting device has advantages of low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps.

In particular, in the case of a light emitting device that emits ultraviolet rays, light having a relatively large wavelength can be emitted from the active layer of the light emitting device. In detail, the light emitting device may emit light having a relatively short peak wavelength band, for example, about 400 nm or less, and the active layer may include a material having a corresponding band gap energy. The light emitting device may be used for sterilization and purification for short wavelengths in the wavelength band, and may be used for an exposure machine or a curing machine for long wavelengths.

Recently, ultraviolet wavelength light has been applied to various fields to sterilize harmful organisms such as bacteria, ticks, and infectious diseases, or to purify fluids such as contaminated water. As an example, the ultraviolet wavelength light is used in a sterilization device. In detail, the sterilizing device is a device for disposing a UV lamp inside the device to irradiate ultraviolet rays on the surface of a specific object or a fluid such as air or water disposed in the device. However, the UV lamp is generally difficult to miniaturize because it has a bar and a large volume. In addition, the UV lamp contains mercury harmful to the human body, and when the UV lamp is damaged, mercury contained therein is leaked into the device. For the above-mentioned problem, an apparatus for disposing an ultraviolet light emitting element instead of a UV lamp has been proposed. However, the ultraviolet light emitting device has a light output lower than that of the UV lamp, has low quantum efficiency, and has a problem that more than 90% of energy is generated as thermal energy. In addition, when the light emitting device is exposed to a high temperature environment, the output of the light emitting device is lowered and deteriorated, leading to a decrease in reliability.

Therefore, there is a need for a new sterilization device capable of solving the above problems.

The embodiment is to provide a sterilizing device capable of sterilizing the irradiation target by irradiating ultraviolet rays to the irradiation target.

In addition, the embodiment is to provide a sterilizing device capable of sterilizing the irradiation target by controlling the temperature inside the device.

In addition, the embodiment is intended to provide a sterilizing device having improved heat dissipation characteristics.

The sterilization device according to the embodiment includes a housing having a space therein, a light source part disposed on the inner wall of the housing, a heat dissipation part disposed on the housing, a first transmission part connected to the inner space of the housing, and the heat dissipation part It includes; a second transmission portion disposed; the second transmission portion is disposed on the outside corresponding to the inner wall on which the light source portion is disposed, and the second transmission portion extends on the heat dissipation portion on the outer side of the housing.

The sterilization device according to the embodiment may be provided with a second transmission unit on the light source unit. Accordingly, heat emitted from the light source unit may be discharged to the outside of the light source unit through the second transmission unit, and the light source unit may have improved heat dissipation characteristics.

In addition, the sterilization device according to the embodiment may include a heat dissipation unit and a first transmission unit, and heat emitted from the light source unit may be transferred to the heat dissipation unit through the second transmission unit. The first transmission unit may forcibly convect the interior of the heat dissipation unit and inject hot air into the housing. Accordingly, it is possible to sterilize a fluid such as air or water disposed in the housing, or a specific subject with high-temperature heat. That is, the embodiment may sterilize a fluid or a subject by utilizing ultraviolet light emitted from the light source unit and heat generated from the light source unit.

In addition, the sterilization apparatus according to the embodiment can effectively sterilize a fluid or a subject using light emitted from the light source unit and heat generated from the light source unit. Accordingly, the light source unit can operate at low power and have improved energy efficiency.

1 is a perspective view of a sterilizing device according to an embodiment.
FIG. 2 is a cross-sectional view taken along line AA' of the sterilization device of FIG. 1.
3 is a top view of a sterilizing device according to an embodiment.
4 is a view showing the flow of air in the sterilization area according to the embodiment.
5 is a view of the temperature distribution of the sterilizing device according to the embodiment.
6 is a view showing a temperature distribution of a light source unit according to an embodiment.
7 is a side cross-sectional view showing a light emitting device applied to a light source unit of a sterilization device according to an embodiment.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical spirit of the present invention is not limited to some embodiments described, but may be implemented in various different forms, and within the technical spirit scope of the present invention, one or more of its components between embodiments may be selectively selected. It can be used by bonding and substitution.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless specifically defined and described, can be generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as meaning, and commonly used terms, such as predefined terms, may interpret the meaning in consideration of the contextual meaning of the related technology.

In addition, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In the present specification, a singular form may also include a plural form unless specifically stated in the phrase, and is combined with A, B, C when described as "at least one (or more than one) of A and B, C". It can contain one or more of all possible combinations.

In addition, in describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the component from other components, and the term is not limited to the nature, order, or order of the component. And, when a component is described as being'connected','coupled' or'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also to the component It may also include a case of'connected','coupled' or'connected' due to another component located between the other components.

In addition, when described as being formed or disposed in the "top (top) or bottom (bottom)" of each component, the top (top) or bottom (bottom) is one as well as when the two components are in direct contact with each other It also includes a case in which another component described above is formed or disposed between two components. In addition, when expressed as "up (up) or down (down)", it may include the meaning of the downward direction as well as the upward direction based on one component.

In addition, before describing the embodiments of the present invention, the horizontal direction may mean an x-axis direction illustrated in the drawing, and a y-axis direction perpendicular to the x-axis direction, and the vertical direction may be a z-axis direction illustrated in the drawing. It may be a direction perpendicular to the x-axis and y-axis direction. In addition, the optical axis of the light emitting device is the central axis of light emitted from the light emitting chip of the light emitting device and may mean the central axis of the directivity of the light emitting device.

1 is a perspective view of a sterilization device according to an embodiment, and FIG. 2 is a cross-sectional view taken along line A-A' of the sterilization device of FIG. 1. In addition, FIG. 3 is a top view of the sterilization device according to the embodiment, and FIG. 4 is a view showing the flow of air in the sterilization area according to the embodiment.

1 to 4, the sterilization device 1000 according to the embodiment may include a housing 100, a light source unit 200, and a heat dissipation member 300.

The housing 100 may accommodate the light source unit 200. The housing 100 has a space defined therein as an accommodating part 110, and the light source part 200 may be disposed in the accommodating part 110. The light source unit 200 may be disposed on the inner wall of the receiving unit 110. The receiving portion 110 may include an inner surface. In detail, the inner surface of the accommodating portion 110 may include a top surface 111, a bottom surface 112, a plurality of side surfaces 113, 114, and 115 connecting the top surface and the bottom surface 112. The light source unit 200 may be disposed on the upper surface 111 of the receiving unit 110.

The housing 100 may include at least one of plastic, metal, and ceramic materials. The accommodating part 110 may include at least one of plastic, metal, and ceramic materials. In detail, the inner surface of the receiving portion 110 may include at least one of plastic, metal, and ceramic materials that do not react with ultraviolet rays.

The housing 100 may be provided in color. In detail, the inner surface of the receiving portion 110 may be provided in color. For example, the inner surface of the accommodating portion 110 is provided in black so that light emitted from the light source portion 200 can be absorbed without being reflected. Accordingly, the temperature of the accommodating portion 110 can be effectively raised and/or maintained. In detail, light emitted from the light source unit 200 may be absorbed by the inner surface of the receiving unit 110, and the temperature of the receiving unit 110 may be effectively raised and maintained by the absorbed light.

The housing 100 may have a volume defined by a first volume V1. Here, the first volume V1 may mean the volume of the accommodating portion 110 as the volume of the inner space of the housing 100.

The housing 100 may include an opening/closing part 150. The opening/closing part 150 may be disposed outside the housing 100. For example, the opening/closing part 150 may be disposed in an area overlapping one side selected from the side surfaces 113, 114, and 115 of the receiving part 110. The opening and closing part 150 may open or close the inner space of the housing 100. The object to be sterilized may be disposed or taken out of the housing 100 through the opening/closing unit 150.

The housing 100 may further include a sensor (not shown). For example, the housing 100 is opened and closed of the opening and closing portion 150 It may include a detection sensor for detecting whether. The sensor may be disposed adjacent to the opening/closing unit 150. The sensor may be disposed on at least one of the outer side of the housing 100 and the inner side of the housing 100 in which the receiving portion 110 is located. The sensor includes a vision sensor using a camera, a photoelectric sensor using light, a magnetic type, a magnetic saturation type, a high frequency oscillation type, a proximity sensor such as a capacitive type, a pressure sensor, It may include at least one of an infrared sensor and a laser sensor. However, the embodiment is not limited thereto, and may include at least one of sensors capable of detecting whether the opening/closing unit 150 is opened or closed. That is, the embodiment may control whether the sterilization device 1000 is operated by the sensor. In detail, the sterilization apparatus 1000 may prevent the opening/closing unit 150 from operating in an open state through the sensor, and the opening/closing unit 150 may operate in a closed state. Accordingly, it is possible to prevent ultraviolet rays from being irradiated to the user by operating while the opening/closing unit 150 is opened.

The sterilization device 1000 may include a light source unit 200. The light source unit 200 may be disposed in the housing 100. The light source unit 200 may be disposed on the inner wall of the housing 100. The light source unit 200 may be disposed on one inner surface of the receiving unit 110. For example, the light source unit 200 may be disposed on the upper surface 111 of the receiving unit 110. The light source unit 200 may be disposed on the upper surface 111 of the receiving unit 110 to irradiate light toward the lower surface 112 of the receiving unit 110. That is, the light source unit 200 may emit light in the direction of the lower surface 112 of the receiving unit 110 to irradiate light to the sterilization target on the lower surface 112.

The light source unit 200 may include a circuit board 210 and a light emitting device 220 disposed on the circuit board 210. The circuit board 210 may be disposed on the upper surface 111 of the receiving portion 110. The circuit board 210 may directly contact the upper surface 111 of the receiving unit 110. For example, the circuit board 210 includes one surface on which the light emitting device 220 is disposed and the other surface opposite to the one surface, and the other surface of the circuit board 210 is the upper surface 111 of the receiving unit 110 ).

The circuit board 210 may be electrically connected to the light emitting device 220. The circuit board 210 may be a circuit pattern printed on an insulator. The circuit board 210 is at least one of a resin material printed circuit board (PCB), a metal core PCB (MCPCB, Metal Core PCB), a non-flexible PCB, a flexible PCB (FPCB, flexible PCB), and a ceramic material. It can contain one. The circuit board 210 may include a layer of a resin material or a ceramic-based layer, and the resin material is a heat-curable resin including silicone, epoxy resin, or plastic material, or a high heat resistance and high light resistance material. Can be formed. The ceramic material may include a low-temperature co-fired ceramic (LTCC) or a high-temperature co-fired ceramic (HTCC) that are simultaneously fired.

The circuit board 210 may have a plurality of via structures, and the via structure has an electrode pattern formed on one surface of the circuit board 210 on which the light emitting device 220 is disposed and the other surface opposite to the one surface. Can be electrically connected. In addition, although not shown in the drawings, a protection element, a transistor, a voltage regulator and a resistor may be further disposed on the circuit board 210.

The light emitting device 220 may be disposed on one surface of the circuit board 210. For example, the light emitting device 220 may be provided in the form of a package including a light emitting chip 240 and a package body 230 accommodating the light emitting chip 240, and the package is the circuit board 210 ). Alternatively, the light emitting device 220 may be directly disposed on the circuit board 210. In detail, the light emitting device 220 is not provided in a separate package form, and the light emitting chip of the light emitting device 220 may be provided in a form directly disposed on the circuit board 210.

The light emitting device 220 may emit ultraviolet light. For example, the light emitting device 220 is a light emitting device that emits a wavelength in the ultraviolet band and may emit light in a wavelength range of about 400 nm or less. For example, the light emitting device 220 may emit ultraviolet rays in the UV-A, UV-B, and UV-C region in the order of long wavelength. Here, the UV-A light emitting device is a light emitting device having a wavelength of about 315nm to about 400nm, which has the largest relative intensity among emitted light, and can be used in fields such as UV curing, ink curing, lithography, and photocatalyst. The UV-B light emitting device is a light emitting device in which the wavelength of light having the largest relative intensity among emitted light is about 280 nm to about 315 nm, and can be used in medical fields such as skin diseases. The UV-C light emitting device is a light emitting device having a wavelength of about 200 nm to about 280 nm, which has the largest relative intensity among emitted light, and can be used for sterilization, disinfection, air purification, and the like. In particular, the UV-C light emitting device may have a sterilizing effect of about 1000 times or more compared to a light emitting device emitting light (near ultraviolet) having a wavelength in a range of about 300 nm to about 400 nm. The light emitting device 220 according to the embodiment may include a UV-C light emitting device having the greatest intensity of light in a wavelength region of about 280 nm or less. The light emitting device 220 may emit light to a fluid or a specific object to sterilize a fluid or a specific object to which light is incident. One or a plurality of light emitting chips may be disposed in the light emitting device 220, but is not limited thereto.

One or more light emitting devices 220 may be disposed on the circuit board 210. For example, the light emitting device 220 may be provided with one or a plurality of fluids, such as air or water, disposed in the sterilization device 1000, or depending on the amount of ultraviolet energy incident on the surface of a specific subject.

When a plurality of the light emitting devices 220 are provided, the light emitting devices 220 may be spaced apart from each other. For example, the light emitting devices 220 may include first to fourth light emitting devices spaced apart from each other, and the first to fourth light emitting devices may be spaced apart from each other. In detail, the first light emitting device may be spaced apart from the second light emitting device in the x-axis direction, and may be spaced apart from the third light emitting device in the y-axis direction. In addition, the second light emitting device may be spaced apart from the fourth light emitting device in the y-axis direction. In addition, the third light emitting device may be spaced apart from the fourth light emitting device in the x-axis direction. When the light emitting device 220 includes a plurality of light emitting devices, a distance between the plurality of light emitting elements may correspond. For example, an interval between the first and second light emitting elements may be the same as an interval between the third and fourth light emitting elements. In addition, an interval between the first and third light emitting elements may be the same as an interval between the second and fourth light emitting elements. In this case, an interval between the first and second light emitting elements may be the same as an interval between the first and third light emitting elements. That is, when the light emitting device 220 includes a plurality of light emitting devices, the x-axis direction and the y-axis direction of the adjacent light emitting devices 220 may be the same. The plurality of light emitting elements may be disposed at equal intervals with each other.

The object to be irradiated may be disposed in the housing 100. The irradiation target may be a fluid such as air or water, or a specific subject. The object to be irradiated may be disposed in the accommodation unit 110. The object to be irradiated may be disposed on the lower surface 112 of the receiving unit 110 facing the light source unit 200. Accordingly, light emitted from the light source unit 200 may be incident on the surface of the fluid or the subject.

The object to be irradiated may be directly disposed on the lower surface 112 of the receiving portion 110, and may be disposed in a container such as a petri dish and a charet and disposed on the lower surface of the receiving portion 110.

The sterilization device 1000 may include a heat dissipation member 300, and the heat dissipation member 300 may include a heat dissipation part 310 disposed on an outer surface of the housing 100. In detail, the housing 100 may include a first through hole TH1 on an outer surface. Here, the first through hole TH1 may be a through hole penetrating the outer surface of the housing 100 and the side surface of the receiving portion 110. The heat dissipation member 300 may be disposed on the first through hole TH1. The heat dissipation unit 310 may overlap the first through hole TH1 in a horizontal direction. The heat dissipation unit 310 may be disposed on the outer surface of the housing 100 in which the first through hole TH1 is formed. The heat dissipation unit 310 may directly contact the outer surface of the housing 100 in which the first through hole TH1 is formed. The heat dissipation unit 310 may have a shape corresponding to the first through hole TH1. In addition, the heat dissipation unit 310 may have a size corresponding to the first through hole TH1. In detail, the length of the heat dissipation unit 310 in the x-axis direction may be smaller than or equal to the width of the first through-hole TH1 in the x-axis direction. For example, the length in the x-axis direction of the heat dissipation unit 310 may be the same as the width in the x-axis direction of the first through hole TH1. In addition, the length in the z-axis direction of the heat dissipation unit 310 may be smaller than or equal to the width in the z-axis direction of the first through hole TH1. In one example, the length in the z-axis direction of the heat dissipation unit 310 may be the same as the width in the z-axis direction of the first through hole TH1. The lengths in the x-axis and z-axis directions of the heat dissipation unit 310 may be the same as the widths in the x-axis and z-axis directions of the first through hole TH1.

The heat dissipation unit 310 may include a material having excellent thermal conductivity characteristics. The heat dissipation unit 310 may include a metal material. For example, the heat dissipation unit 310 is one selected from aluminum (Al), stainless steel (Stainless), chromium (Cr), molybdenum (Mo), silver (Ag), gold (Au), and copper (Cu) Metal. In addition, the heat dissipation unit 310 is a metal of two or more selected from aluminum (Al), stainless (Stainless), chromium (Cr), molybdenum (Mo), silver (Ag), gold (Au) and copper (Cu) Alloys.

The heat dissipation unit 310 may include a base member formed in a plate shape, and may have a form in which a plurality of heat radiation fins are erected on the base member. The heat dissipation unit 310 may be a heat sink.

The heat dissipation member 300 may include a first transmission unit 320. The first transmission part 320 is disposed on the heat dissipation part 310 and may be connected to an inner space of the housing 100, for example, the accommodation part 110. In detail, the first transmission part 320 may be disposed on one side of the heat dissipation part 310. The first transmission part 320 may face a plurality of heat dissipation fins of the heat dissipation part 310. The first transmission part 320 may be disposed to face the first through hole TH1. The first transmission part 320 may be disposed in line with the heat dissipation part 310 and the housing 100. The heat dissipation unit 310 may be disposed between the first transmission unit 320 and the housing 100. The first transmission part 320 may include a fan and generate air toward the heat dissipation part 310. The first transmission unit 320 may forcibly convect the interior of the heat dissipation unit 310, and may generate air toward the receiving unit 110 of the housing 100. The air generated by the first transmission part 320 may be supplied to the accommodation part 110 through the heat dissipation part 310 and the first through hole TH1. That is, the first transfer part 320 may transfer heat toward the inner space of the housing 100.

In addition, the sterilization device 1000 may include a control unit (not shown). The control unit may vary the rotational speed of the fan of the first transmission unit 320 according to the temperature of the light source unit 200. In addition, the control unit may vary the rotational speed of the fan of the first transmission unit 320 according to the temperature of the interior space of the housing 100, for example, the temperature of the receiving unit 110. That is, the control unit may control the operation of the fan of the first transmission unit 320 according to the set temperature.

The sterilization device 1000 according to the embodiment may include a second transmission unit 350. The second transmission unit 350 may be disposed on the light source unit 200. The second transmission unit 350 may overlap the light source unit 200 in the z-axis direction. In one example, the second transmission unit 350 may overlap the light emitting device 220 in the z-axis direction. The second transmission unit 350 may be disposed outside the housing 100 corresponding to the inner wall on which the light source unit 200 is disposed. In detail, the second transmission unit 350 may be disposed on the outer surface of the circuit board 210 corresponding to the light emitting device 220. In detail, the second transmission unit 350 may be disposed on the other surface opposite to one surface of the circuit board 210 on which the light emitting device 220 is disposed. The second transmission unit 350 may directly contact the other surface of the circuit board 210. Accordingly, heat generated in the light source unit 200 may be transferred to the second transmission unit 350, and the light source unit 200 may be radiated.

The second transmission part 350 may be disposed on the heat dissipation member 300. In detail, the second transmission unit 350 may be disposed on the heat dissipation unit 310. The second transmission part 350 may overlap the heat dissipation part 310 in the z-axis direction. The second transmission unit 350 may extend onto the heat dissipation unit 310 on the outside of the housing 100. In detail, the second transmission unit 350 may extend in the direction of the heat dissipation unit 310 on the outside corresponding to the light source unit 200, and may be disposed on the outer surface of the heat dissipation unit 310. In more detail, the second transmission unit 350 may extend and be disposed on the outer surface (other surface) of the circuit board 210 to the heat dissipation unit 310. The second transmission part 350 may directly contact the outer surface of the heat dissipation part 310. That is, a part of the second transmission part 350 may be disposed on a region corresponding to the light source part 200, and another part extends from the light source part 200 and is disposed on the heat dissipation part 310. Can be. Accordingly, heat generated from the light source unit 200 may be transferred to the second transfer unit 350, and the heat may be transferred to the heat dissipation unit 310 through the second transfer unit 350. . Therefore, the light source unit 200 according to the embodiment may have improved heat dissipation characteristics. The second transmission unit 350 may be provided with one or a plurality of the housing 100 and the heat dissipation unit 310, and is not limited thereto.

The second transmission unit 350 may include a heat pipe. The heat pipe may have a structure in which fluid is injected into a closed vacuum pipe. When the heat pipe is heated at one end, the fluid inside may be vaporized, move to the other side by the pressure difference generated at this time, release heat to the surroundings, and then have a structure capable of transferring heat through a condensation process again. In detail, the heat pipe may have a pipe or bar shape in which a heat medium such as water, alcohol, and freon is sealed or vacuum sealed in a sealed container containing a metal fiber or metal powder sintered layer. At this time, when one end of the heat pipe is heated, the heat medium inside the sealed container can be vaporized to quickly move to the other end, and in the process, the heat medium condenses to release heat, and the heat medium is liquefied by heat release. Can release the principle heat that returns to the heated area by capillary action. The heat pipe has a simple structure, and because it transports heat by latent heat, it can transfer a lot of heat in a short time compared to metals. In addition, the heat pipe has an advantage of little maintenance and repair cost. Accordingly, the second transmission unit 350 according to the embodiment may effectively move heat generated from the light source unit 200 to the heat dissipation unit 310.

The sterilization device 1000 according to the embodiment may include an opening 120. The opening 120 may be formed on the housing 100. The opening 120 may be a hole penetrating the outer surface of the housing 100 and the inner surface of the receiving portion 110. In detail, the opening 120 may be a hole penetrating the outer upper surface of the housing 100 and the upper surface 111 of the receiving portion 110.

One or a plurality of openings 120 may be provided on the housing 100. For example, a plurality of openings 120 may be formed on the housing 100 for smooth air circulation in the receiving portion 110.

The opening 120 may be disposed adjacent to the light source unit 200. The opening 120 may be formed on the same surface on which the light source unit 200 is disposed in the receiving unit 110. The opening 120 is disposed around the light source unit 200 and may be spaced apart from the light source unit 200. That is, the light source unit 200 may be disposed in a central region of the upper surface 111 of the receiving unit 110, and the opening 120 may be disposed in an edge region of the upper surface 111 of the receiving unit 110. have. The accommodating part 110 may provide a path through which heat emitted from the light source part 200 and/or hot air supplied to the accommodating part 110 is discharged by the first transmission part 320. . In detail, air generated by the first transmission unit 320 may be supplied to the accommodation unit 110 through the heat dissipation unit 310 and the first through hole TH1, and the opening 120 may be provided. Through the sterilization device 1000 may be discharged to the outside. The opening 120 may function to prevent high temperature air supplied from the first transmission unit 320 from staying in the accommodation unit 110 for a long time.

In addition, the opening 120 may be formed on the same surface as the surface on which the light source unit 200 is disposed in the receiving unit 110. Accordingly, it is possible to prevent the high temperature air supplied to the accommodating part 110 from staying in the vicinity of the light source part 200 for a long time. Accordingly, it is possible to prevent the light emitting device 220 of the light source unit 200 from being exposed to high temperature, thereby preventing the light emitting device 220 from being deteriorated or a problem such as output deterioration.

When the sterilization apparatus 1000 according to the embodiment operates, the light emitting device 220 emits light and heat may be emitted from the light emitting device 220. Referring to FIG. 4, a part of the heat H emitted from the light source unit 200 may be transferred to the second transmission unit 350 overlapping the light source unit 200 in the z-axis direction. The heat H transferred to the second transfer unit 350 may be transferred to the heat dissipation unit 310 through vaporization and condensation within the second transfer unit 350. The heat H transferred to the heat dissipation unit 310 may be supplied to the housing 100 by the first transfer unit 320. That is, the first transmission unit 320 may supply heated air to the receiving unit 110 by the heat dissipation unit 310. Thereafter, the heated air may be discharged to the outside through the opening 120 formed in the housing 100. That is, the sterilization apparatus 1000 according to the embodiment can supply hot air heated in the accommodation unit 110 by utilizing the heat energy emitted from the light source unit 200, and the heated air is the accommodation unit The fluid or object disposed in the 110 may be sterilized. In detail, the temperature of the receiving unit 110 by the heat dissipation unit 310 and the first transmission unit 320 may be about 40°C or higher. In more detail, the temperature of the accommodating part 110 by the heat dissipation part 310 and the first transmission part 320 may be about 40°C to about 60°C. At this time, the control unit, the output of the light emitting device 220 according to the temperature of the light source unit 200 or the temperature of the receiving unit 110, the operation of the first transmission unit 320, for example, the first transmission unit ( 320) can be controlled. When the temperature of the accommodating portion 110 is less than about 40° C., the effect of sterilizing the fluid or the object disposed in the accommodating portion 110 by temperature may be negligible. In addition, when the temperature of the accommodating unit 110 exceeds about 60° C., the light emitting device 220 may be exposed to high temperature, resulting in problems such as deterioration and output deterioration. In addition, when the temperature of the accommodating portion 110 exceeds about 60° C., a problem that a device such as a protection element, a transistor, a voltage regulator and a resistor disposed on the circuit board 210 is damaged may occur. Therefore, it is preferable that the accommodating portion 110 of the sterilization apparatus 1000 satisfies the above-mentioned temperature in consideration of sterilization power and reliability of the device.

In the sterilization apparatus 1000, the length of the interior space (receptive part 110) of the housing 100 and the heat dissipation part 310 may be the same in the vertical direction (z-axis direction). In addition, the horizontal space (x-axis or y-axis direction) of the inner space of the housing 100 and the heat dissipation unit 310 may be the same or different. For example, the length in the x-axis direction of the accommodating portion 110 may be greater than the length in the x-axis direction of the heat dissipation portion 310. In detail, the length in the x-axis direction of the accommodating portion 110 may be about 1.66 times or more of the length in the x-axis direction of the heat dissipation portion 310. The length of the accommodation portion 110 in the y-axis direction may be greater than the length of the heat dissipation portion 310 in the y-axis direction. In this case, the length of the accommodating portion 110 in the y-axis direction is provided at about 1.5 times to 3.33 times the length of the y-axis direction of the radiator 310 to improve the heat dissipation characteristics of the light source unit 200 and at the same time The volume of the member 300 can be minimized. In addition, the length of the accommodating portion 110 in the y-axis direction may be smaller than or equal to the length of the heat-radiating portion 310 in the y-axis direction. In this case, the length in the y-axis direction of the heat dissipation unit 310 may be about 1 to about 1.2 times the length in the y-axis direction of the receiving unit 110. Accordingly, the embodiment can effectively dissipate heat from the light source unit 200.

In addition, the volume of the housing 100 and the heat dissipation unit 310 in the sterilization device 1000 may be different. In detail, the inner space of the housing 100, for example, the volume of the receiving portion 110 and the heat dissipation portion 310 may be different. For example, the receiving portion 110 of the housing 100 may have a volume value defined as the first volume V1. In addition, the heat dissipation unit 310 may have a volume value defined as the second volume V2. The volume of the receiving portion 110 may be different from the volume of the heat dissipation portion 310. In detail, the first volume V1 may be larger than the second volume V2. The first volume V1 may be about 1.2 times or more of the second volume V2. In detail, the first volume V1 may be about 1.2 times to about 5.6 times the second volume V2. Preferably, the first volume (V1) may be about 1.39 times to about 5.56 times the second volume (V2). When the first volume (V1) is less than about 1.2 times the second volume (V2), the volume occupied by the heat dissipation unit 310 relative to the accommodating unit 110 is relatively large, and heat dissipation characteristics of the light source unit 200 Can be improved. However, since the size and weight of the heat dissipation unit 310 is increased, it is difficult to install and the installation cost may increase rapidly. In addition, stability and reliability of the overall sterilization apparatus 1000 may be reduced by the weight occupied by the heat dissipation unit 310. In addition, when the first volume V1 exceeds about 5.6 times the second volume V2, heat dissipation characteristics of the sterilization device 1000 may be deteriorated. In detail, the volume occupied by the heat dissipation unit 310 relative to the volume of the housing 100 is relatively small, and heat emitted from the heat dissipation unit 310 may be difficult to be effectively discharged. Accordingly, problems such as deterioration and output degradation of the light emitting device 220 may occur, and heat dissipation is not smoothly performed, such as protection elements, transistors, transformer regulators, and resistors disposed on the circuit board 210. Device damage may occur. In addition, when the first volume (V1) exceeds about 5.6 times the second volume (V2), a portion of the heat (H) emitted from the light source unit 200 is the second transfer unit 350, Through the heat dissipation unit 310 and the first transmission unit 320, it may be difficult to smoothly supply the interior of the accommodation unit 110. Accordingly, the effect of sterilizing a fluid or a subject disposed in the receiving unit 110 using the heat H may be insignificant. Preferably, the first volume (V1) is the first volume (V1) is provided from about 1.39 times to about 5.56 times the second volume (V2) to effectively improve the volume, weight, reliability and heat dissipation characteristics of the sterilization device I can do it.

When the sterilization device 1000 according to the embodiment is operated, the light emitting device 220 may emit ultraviolet light, and the ultraviolet light may be incident on an irradiation target disposed in the device. In detail, when the sterilization device 1000 is operated, ultraviolet energy may be applied to an object to be irradiated in the receiving unit 110, for example, a fluid such as air or water, or a surface of a specific object. At this time, the energy incident on the surface of the fluid or the subject may satisfy Equation 1 below.

[Equation 1]

E = mW * T

(E = energy (dose, mJ/cm ² ), mW = illuminance (mW/cm ² ) incident on the irradiation target, T: light emission time (s) of the light emitting device)

The sterilization apparatus 1000 according to the embodiment may apply energy of about 1.5 dose (mJ/cm ² ) to about 2 dose (mJ/cm ² ) to a fluid or a surface of a subject disposed in the receiving unit 110. . For example, the light source unit 200 may apply ultraviolet energy of about 1.89 dose (mJ/cm ² ) to the fluid or the surface of the subject.

When the energy applied to the surface of the fluid or the subject is less than about 1.5 dose (mJ/cm ² ), it may be difficult to effectively sterilize the fluid or the surface of the subject using ultraviolet light. In detail, when the energy is less than about 1.5 dose (mJ/cm ² ), the energy value incident on the irradiation object is relatively small, and the sterilizing power of the fluid or the subject may be reduced. In addition, when the energy is about 1.5 dose (mJ/cm ² ) or less, the amount of heat energy emitted from the light source unit 200 and transmitted to the second transmission unit 350 and the heat dissipation unit 310 may be small. Due to this, the thermal energy supplied into the receiving unit 110 may be small. Therefore, the sterilizing effect using heat emitted from the light source unit 200 may be insignificant. When the energy applied to the surface of the fluid or the subject exceeds about 2 dose (mJ/cm ² ), a high-power light emitting device is disposed, and the amount of heat emitted from the light source unit 200 may be excessively large. Accordingly, the capacity of the heat dissipation unit 310, the first transmission unit 320, and the second transmission unit 350 is increased, so that the size and weight of the sterilization device 1000 can be rapidly increased. In addition, when the energy exceeds about 2 doses (mJ/cm ² ), the light irradiation time required for sterilization of the fluid or the surface of the subject is prolonged, so that the overall sterilization time may increase rapidly.

microbe UV Dose (mJ/cm ² ) 0
(0 min) 0.332
(0.5 min) 0.63
(1 min) 1.89
(3 min) 3.15
(5 min) E. coli O 157:H7
(E. coli) 0% 97.64% 99.97% > 99.99% > 99.99% S. Typhimurium (Salmonella) 0% 97.81% 99.78% > 99.99% > 99.99% L. monocywogenes (Listeria) 0% 59.57% 88.25% 99.97% > 99.99%

Table 1 is data for evaluating the sterilizing power of microorganisms for energy values. Referring to Table 1, when applying an energy of about 0.63mJ/cm ² to the microorganism, it can be seen that E. coli O 157:H7 and Salmonella (S. Typhimuriu) are sterilized by about 99% or more, It can be seen that Listeria (L. monocywogenes) is sterilized by about 88% or more. In addition, when energy of about 1.89 mJ/cm ² is added to the microorganism, it can be seen that E. coli, Salmonella and Listeria are sterilized by about 99% or more. In addition, when energy of about 3.15 mJ/cm ² is added to the microorganism, it can be seen that E. coli, Salmonella, and Listeria are sterilized by about 99.99% or more.

E. coli O 157:H7
(E. coli) S. Typhimurium
(Salmonella) L. monocywogenes
(Listeria) 0℃ 2.2±0.64 3.65±0.28 4.33±0.22 4℃ 1.98±0.19 3.69±0.11 4.35±0.09 15℃ 1.47±0.25 3.4±0.27 4.2±0.14 25℃ 1.16±0.28 3.32±0.18 4.35±0.09 37℃ 0.53±0.4 2.05±0.04 4.31±0.09

Table 2 is data for evaluating the sterilizing power of microorganisms according to temperature, and the log CFU/ml values of E. coli, Salmonella, and Listeria according to temperature. Referring to Table 2, it can be seen that the number of E. coli and Salmonella bacteria decreases as the temperature increases. That is, referring to Tables 1 and 2, energy of about 1.89 mJ/cm ² or more may be required to sterilize the E. coli and Salmonella by 99.99% or more. On the other hand, the sterilization apparatus 1000 according to the embodiment may more effectively sterilize microorganisms by utilizing the ultraviolet energy emitted from the light source unit 200 and heat emitted from the light source unit 200. For example, when the temperature of the accommodating portion 110 is about 40° C. or more, about two times more than E. coli and Salmonella can be sterilized more than twice the temperature of the accommodating portion 110 is about 25° C. Accordingly, the embodiment can sterilize the object to be irradiated with improved sterilizing power than the above-described ultraviolet energy (about 1.89mJ/cm ² ) by applying an ultraviolet energy of about 1.89mJ/cm ^{2 to} the object to be irradiated, such as a fluid or a subject. . Therefore, the sterilization apparatus 1000 according to the embodiment may have higher sterilization power and operate at a lower power, and may have improved reliability by improving heat dissipation characteristics of the light source unit 200.

Hereinafter, the operation and effects of the present invention will be described in more detail through experimental examples.

Experimental Example

Inside the housing space (width X height X height, 10X10X6) and heat dissipation member (width X height X height, 6X5X6 volume ratio of 3.33:1) inside the housing of a sterilization device, a light source unit including 25 UV light emitting elements of class 100mW is placed The UV light-emitting elements were arranged 5X5 (horizontal X length) on the upper surface of the housing, and arranged to be spaced apart from each other at equal intervals from the adjacent UV light-emitting elements. Was placed.

Thereafter, the sterilization apparatus was operated to measure the internal temperature of the sterilization apparatus and the temperature of the light source unit, respectively.

5 and 6 are diagrams for temperature distribution of the sterilizing device and the light source according to the embodiment. In detail, FIGS. 5 and 6 are diagrams for the above-described experimental example. In FIGS. 5 and 6, the closer to red, the higher the temperature may be, and the closer to blue, the lower the temperature is.

5 and 6, when the sterilization device 1000 is operated, the temperature of the light source unit 200 may increase.

Referring first to FIG. 5, it can be seen that as the light emitting device 220 emits light, the temperature of the light source unit 200 may rise, and the ambient temperature of the light source unit 200 is about 50° C. or higher. At this time, heat generated from the light source unit 200 may be transferred to the heat dissipation unit 310 through the second transfer unit 350. Subsequently, air generated by rotation of the first transmission unit 320 may be supplied into the accommodation unit 110 through the heat dissipation unit 310 and the first through-hole TH1, and high-temperature air may be supplied to the air. It may be discharged to the outside through the opening 120. Accordingly, the receiving portion 110 may have a uniform internal temperature. In detail, the receiving portion 110 may have a uniform internal temperature of about 40°C or higher.

In addition, referring to FIG. 6, it can be seen that the heat dissipation characteristics of the light source unit 200 are improved when the light emitting device 220 emits light. In detail, it is understood that the light source unit 200 may contact the second transmission unit 350 and have a temperature of about 64° C. or less when emitting light by the second transmission unit 350 and the heat dissipation unit 310. Can. That is, the light source unit 200 according to the embodiment may maintain reliability in the high temperature accommodation unit 110 of about 40°C or higher.

7 is a side cross-sectional view showing a light emitting device applied to a light source unit according to an embodiment.

Referring to FIG. 7, a light emitting device according to an embodiment may be provided in a package form and disposed on the circuit board 210 described above. The light emitting device 220 includes a package body 230 including a recess 237, a plurality of electrodes 251, 252, and 253 disposed on the recess 237, and a plurality of electrodes 251, 252, A light emitting chip 240 disposed on at least one of the electrodes 253 and a transparent window 290 disposed on the recess 237 may be included.

The light emitting chip 240 may include an optional peak wavelength within the range of ultraviolet wavelengths to visible light wavelengths. For example, the light emitting chip 240 may emit ultraviolet wavelengths in a range of about 10 nm to 400 nm. In detail, the light emitting chip 240 may emit ultraviolet wavelengths in the UV-A, UV-B, and UV-C regions.

The light emitting chip 240 may be formed of a compound semiconductor of a group II and VI element, or a compound semiconductor of a group III and V element. For example, a semiconductor light emitting device manufactured using a compound semiconductor of a series such as AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AllnGaP, InP, InGaAs may be selectively included. The light emitting chip 240 may include an n-type semiconductor layer, a p-type semiconductor layer, and an active layer, and the active layer is InGaN/GaN, InGaN/AlGaN, InGaN/InGaN, GaN/AlGaN, InAlGaN/InAlGaN, AlGaAs/ GaAs, InGaAs/GaAs, InGaP/GaP, AlInGaP/InGaP, InP/GaAs.

The package body 230 may include an insulating material, for example, a ceramic material. The ceramic material may include low temperature co-fired ceramic (LTCC) or high temperature co-fired ceramic (HTCC), which are simultaneously fired. The material of the package body 230 may be, for example, AlN, and may include a metal nitride having a thermal conductivity of 140 W/mK or more.

The package body 230 may include a stepped structure. In detail, the upper circumference of the package body 230 may include a stepped structure 233. The stepped structure 233 may be disposed around an upper portion of the recess 237 in an area lower than an upper surface of the package body 230. The depth of the stepped structure 233 is a depth from the top surface of the package body 230, and may be formed deeper than the thickness of the transparent window 290, but is not limited thereto.

The recess 237 may be formed to a predetermined depth from an upper surface of the package body 230 as a region in which a portion of the upper region of the package body 230 is open. For example, the bottom of the recess 237 may be formed to a deeper depth than the stepped structure 233 of the package body 230. The position of the stepped structure 233 may be arranged in consideration of the height of the first connecting member connected to the light emitting chip 240 disposed on the bottom of the recess 237. Here, the direction in which the recess 237 is opened may be a direction in which light generated from the light emitting chip 240 is emitted.

The recess 237 may include a polygonal, circular, or elliptical top view shape. The recess 237 may have a chamfered edge, for example, a curved surface. Here, the recess 237 may be located inside the stepped structure 233 of the package body 230.

The lower width of the recess 237 may be formed to be the same width as the upper width of the recess 237 or the upper width may be formed wider. In addition, the side wall 231 of the recess 237 may be formed vertically or inclined with respect to the extension line of the lower surface of the recess 237.

A sub recess (not shown) may be disposed in the recess 237. The lower surface of the sub-recess 237 may be disposed below the lower surface of the recess 237 in a vertical direction. A protection element (not shown) may be further disposed in the sub recess. The vertical height of the sub recess 237 may correspond to or be greater than the vertical thickness of the protection element. That is, the upper surface of the protection element is disposed so as not to protrude above the lower surface of the recess, thereby preventing the light output from being deteriorated by the protection element and preventing the directivity from being distorted.

A plurality of electrodes 251, 252, and 253 are disposed on the recess 237, and the plurality of electrodes 251, 252, and 253 may selectively supply power to the light emitting chip 240. The plurality of electrodes 251, 252, and 253 may include metal. For example, the electrodes 251, 252, and 253 are among platinum (Pt), titanium (Ti), copper (Cu), nickel (Ni), gold (Au), tantalum (Ta), and aluminum (Al). It may include at least one. At least one of the plurality of electrodes 251, 252, and 253 may be formed as a single layer or multiple layers. For example, when the electrodes 251, 252, and 253 are formed in multiple layers, gold (Au) having good bonding characteristics may be disposed on the top layer, and titanium having good adhesion to the package body 230 may be disposed on the bottom layer. Materials of (Ti), chromium (Cr), and tantalum (Ta) may be disposed. In addition, platinum (Pt), nickel (Ni), copper (Cu), or the like may be disposed in the intermediate layer between the top and bottom layers.

The electrodes 251, 252, and 253 include a first electrode 251 on which the light emitting chip 240 is disposed, a second electrode 252 and a third electrode 253 spaced apart from the first electrode 251, A fourth electrode (not shown) disposed in the sub recess may be included. The first electrode 251 is disposed at the bottom center of the recess 237, and the second electrode 252 and the third electrode 253 may be disposed on both sides of the first electrode 251. . In addition, any one of the first electrode 251 and the second electrode 252 may be removed, but is not limited thereto. The light emitting chip 240 may be disposed on a plurality of electrodes among the first to third electrodes 251, 252, and 253, but is not limited thereto.

The first electrode 251 and the fourth electrode may be supplied with power having a first polarity. In addition, the second electrode 252 and the third electrode 253 may be supplied with power of a second polarity. The polarity of the electrode may vary depending on an electrode pattern or a connection method with each device, but is not limited thereto.

The light emitting chip 240 may be disposed in the recess 237. The light emitting chip 240 may be bonded to the first electrode 251 with a conductive adhesive, and may be connected to the second electrode 252 with a first connecting member including a first wire or the like. The light emitting chip 240 may be electrically connected to the first electrode and the second electrode 252 or the third electrode 253. The connection method of the light emitting chip 240 may be selectively connected using a wire bonding, die bonding, or flip bonding method, and the chip type and the electrode position of the chip may be changed according to the bonding method. The protection element may be bonded to the fourth electrode and may be connected to the third electrode 253 with a second connection member including wire or the like. However, embodiments are not limited thereto, and the protection element may be removed from the recess 237 and disposed on the circuit board 210 described above.

A plurality of pads 271 and 272 may be disposed on the bottom surface of the package body 230. For example, a first pad 271 and a second pad 272 that are spaced apart from each other may be disposed on the bottom surface of the package body 230. At least one of the first and second pads 271 and 272 may be disposed in a plurality to disperse the current path.

A connection pattern 255 may be disposed in the package body 230. The connection pattern 255 may provide an electrical connection path between the recess 237 and the bottom surface of the package body 230. For example, a part of the first electrode 251 may extend into the package body 230 and be connected to the connection pattern 255, and may be connected to another electrode through the connection pattern 255. . The connection pattern 255 may electrically connect the first electrode 251, the fourth electrode, and the first pad 271, and the second electrode 252, the third electrode 253 And electrically connecting the second pad 272.

A transparent window 290 may be disposed on the recess 237. The transparent window 290 may include a glass material, for example, quartz glass. Accordingly, the transparent window 290 may be defined as a material that can transmit light emitted from the light-emitting chip 240 without damage, such as destruction of bonds between molecules by ultraviolet wavelengths.

The outer side of the transparent window 290 may be coupled to the stepped structure 233 of the package body 230. An adhesive layer 280 is disposed between the transparent window 290 and the stepped structure 233 of the package body 230, and the adhesive layer 280 includes a resin material such as silicone or epoxy. The transparent window 290 may be formed to have a wider width than the bottom width of the recess 237. The lower surface area of the transparent window 290 may be formed with a larger area than the bottom area of the recess 237. Accordingly, the transparent window 290 can be easily coupled to the stepped structure 233 of the package body 230.

The transparent window 290 may be spaced apart from the light emitting chip 240. As the transparent window 290 is spaced apart from the light emitting chip 240, it may be prevented from being expanded by heat generated by the light emitting chip 240. The space under the transparent window 290 may be an empty space or may be filled with a non-metal or metal chemical element, but is not limited thereto.

A lens may be coupled to the transparent window 290. For example, a separate lens may be combined on the transparent window 290 to adjust the directivity angle.

A molding member may be further disposed on a side surface of the package body 230. That is, a molding member may be further disposed on the side surface of the light emitting device 220. Accordingly, reliability and moisture-proofing power of the light emitting device 220 may be improved.

The features, structures, and effects described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, features, structures, effects, and the like exemplified in each embodiment may be combined or modified for other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

In addition, although the embodiments have been mainly described above, these are merely examples and do not limit the present invention, and those skilled in the art to which the present invention pertains are exemplified above in a range that does not depart from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be implemented by modification. And differences related to these modifications and applications should be construed as being included in the scope of the invention defined in the appended claims.

Claims (9)

A housing having a space therein;
A light source unit disposed on the inner wall of the housing;
A heat dissipation unit disposed on the housing;
A first transmission unit connected to the interior space of the housing; And
Including; a second transmission unit disposed on the heat dissipation unit,
The second transmission unit is disposed outside corresponding to the inner wall where the light source unit is disposed,
The second transmission unit is a sterilization device that extends onto the heat dissipation unit on the outside of the housing. According to claim 1,
The light source unit includes a light emitting device, wherein the light emitting device is a sterilization device having a wavelength of light having a relative intensity of the wavelength of less than 280 nm. According to claim 1,
The object to be irradiated is disposed in the housing,
The light source unit is a sterilization device that applies energy of 1.5 dose (mJ/cm ² ) to 2 dose (mJ/cm ² ) to the irradiation target. According to claim 2,
The first transmission unit includes a fan for transferring heat toward the interior space of the housing,
The second transfer unit sterilization device comprising a heat pipe. The method of claim 2 or 4,
The volume of the interior space of the housing is at least 1.2 times the volume of the heat dissipation unit. The method of claim 4,
And a control unit controlling a rotation speed of the fan of the first transmission unit according to the temperature inside the housing. The method of claim 4,
The housing is a sterilization device comprising a plurality of openings disposed adjacent to the light source. The method of claim 7,
The plurality of openings are disposed around the light source unit and spaced apart from the light source unit. The method of claim 4,
The second transmission unit is a sterilization device in direct contact with the circuit board and the heat dissipation unit of the light source unit.

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