KR20200080742A - Display device - Google Patents

Abstract

According to an embodiment of the present application, a display device comprises: a substrate having a first subpixel and a second subpixel adjacent to the first subpixel; a first electrode which is provided on the substrate and includes a first sub-electrode provided on the first subpixel and a second sub-electrode provided on the second subpixel; an organic light-emitting layer including a first organic light-emitting layer arranged on the first sub-electrode and a second organic light-emitting layer arranged on the second sub-electrode; a second electrode arranged on the organic light-emitting layer; a first bank provided between the first sub-electrode and the second sub-electrode to divide the first subpixel and the second subpixel; and a protection unit covering at least a portion of each of the first organic light-emitting layer and the second organic light-emitting layer. The protection unit is made of a material including silicon. Since the organic light-emitting layer can be prevented from being damaged by etching gas, the defect rate of finished display devices can be reduced.

Description

Display device {DISPLAY DEVICE}

The present application relates to a display device for displaying an image.

As the information society develops, the demand for display devices for displaying images is increasing in various forms. Accordingly, in recent years, various display devices such as liquid crystal display devices, light emitting display devices, organic light emitting display devices, micro light emitting display devices, and quantum dot light emitting display devices have been utilized.

In the case of forming red, green, and blue pixels of the organic light emitting layer, the organic light emitting display device can manufacture a small/medium sized panel by a mask shadow as a problem of sagging of a deposition mask when using FMM technology, but it is difficult to apply a large area. In addition, even when the panel is manufactured using the FMM, there is a limit in reducing the size of each pixel, which makes it difficult to apply ultra-high resolution.

An object of the present application is to provide a display device capable of preventing deterioration of device characteristics of an organic light emitting layer.

A display device according to an exemplary embodiment of the present application includes a substrate having a first sub-pixel and a second sub-pixel adjacent to the first sub-pixel, a first sub-electrode provided on the substrate, and a first sub-electrode provided in the first sub-pixel. An organic light emitting layer and an organic light emitting layer including a first electrode including a second sub electrode provided in 2 sub pixels, a first organic light emitting layer disposed on the first sub electrode, and a second organic light emitting layer disposed on the second sub electrode. A first bank disposed between the second electrode, the first sub-electrode, and the second sub-electrode disposed on the first bank to distinguish the first sub-pixel and the second sub-pixel, and at least each of the first organic emission layer and the second organic emission layer It includes a protective portion covering a part, the protective portion may be provided with a material containing silicon.

The display device according to the present application is provided to cover the organic light-emitting layer with a protection part made of a material containing silicon, so that the organic light-emitting layer can be prevented from being damaged by an etching gas, thereby reducing the defect rate of the completed display device.

In addition to the effects of the present application mentioned above, other features and advantages of the present application are described below, or will be clearly understood by those skilled in the art from the description and description.

1 is a schematic cross-sectional view of a display device according to an exemplary embodiment of the present application.
2A to 2I are schematic manufacturing process cross-sectional views of a display device according to an exemplary embodiment of the present application.
3 is a diagram illustrating a schematic molecular structure of a protection unit of a display device according to an exemplary embodiment of the present application.
4 is a schematic diagram showing an energy level of part A of FIG. 1.
5A to 5C relate to a display device according to another exemplary embodiment of the present application, which relates to a head mounted display (HMD) device.

Advantages and features of the present application, and a method of achieving them will be clarified with reference to examples described below in detail together with the accompanying drawings. However, the present application is not limited to the examples disclosed below, but will be implemented in various different forms, only the examples allow the disclosure of the present application to be complete, and to those skilled in the art to which this application belongs. It is provided to fully inform the scope of the invention, and this application is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining examples of the present application are exemplary, and the present application is not limited to the illustrated matters. The same reference numerals refer to the same components throughout the specification. In addition, in the description of the present application, when it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present application, the detailed description will be omitted. When'include','have','consist of' and the like mentioned in the present application are used, other parts may be added unless'~man' is used. When a component is expressed as a singular number, the plural number is included unless otherwise specified.

In interpreting the components, it is interpreted as including the error range even if there is no explicit description.

In the case of the description of the positional relationship, for example, when the positional relationship of two parts is described as'~top','~upper','~bottom','~side', etc.,'right' Alternatively, one or more other parts may be located between the two parts unless'direct' is used.

The first, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are only used to distinguish one component from another component. Therefore, the first component mentioned below may be the second component within the technical spirit of the present application.

In describing the components of the present application, terms such as first and second may be used. These terms are only for distinguishing the component from other components, and the essence, order, order, or number of the component is not limited by the term. When a component is described as being "connected", "coupled" or "connected" to another component, the component may be directly connected to or connected to the other component, but different components between each component It should be understood that the "intervenes", or each component may be "connected", "coupled" or "connected" through other components.

Each of the features of the various examples of the present application may be partially or totally combined or combined with each other, technically various interlocking and driving may be possible, and each of the examples may be independently implemented with respect to each other or may be implemented together in an associative relationship. .

Hereinafter, an example of a display device according to the present application will be described in detail with reference to the accompanying drawings. In adding reference numerals to the components of each drawing, the same components may have the same reference numerals as possible even though they are displayed on different drawings.

1 is a schematic cross-sectional view of a display device according to an exemplary embodiment of the present application, and FIGS. 2A to 2I are schematic cross-sectional views of a manufacturing process of a display device according to an exemplary embodiment of the present application.

1 to 2i, a display device 1 according to an exemplary embodiment of the present application includes a substrate 2, a circuit element layer 3, a first electrode 4, a first bank 5, and It includes two banks 6, an organic light-emitting layer 7, a protective part 8, a second electrode 9, and an encapsulation layer 10.

The substrate 2 may be a plastic film, a glass substrate, or a semiconductor substrate such as silicon. The substrate 2 may be made of a transparent material or an opaque material.

A first sub-pixel 21, a second sub-pixel 22, and a third sub-pixel 23 are provided on the substrate 2. The second sub-pixel 22 according to an example may be disposed adjacent to one side of the first sub-pixel 21. The third sub-pixel 23 according to an example may be disposed adjacent to one side of the second sub-pixel 22. Accordingly, the first sub-pixel 21, the second sub-pixel 22, and the third sub-pixel 23 may be sequentially disposed on the substrate 2.

Referring to FIG. 1, the first sub-pixel 21 emits red (R) light, the second sub-pixel 22 emits green (G) light, and the third sub-pixel 23 is It may be provided to emit blue (B) light, but is not limited thereto, and may emit light of various colors including white. In addition, the arrangement order of each of the sub-pixels 21, 22 and 23 can be variously changed.

Each of the first sub-pixel 21, the second sub-pixel 22, and the third sub-pixel 23 includes a first electrode 4, an organic light emitting layer 7, a protection part 8, and a second electrode It may be provided to include (9).

The display device 1 according to an exemplary embodiment of the present application is made of a so-called top emision method in which the emitted light is emitted toward the top, and thus, the material of the substrate 2 is not only transparent but also opaque. One material can be used.

The circuit element layer 3 is provided on one surface of the substrate 2.

The circuit element layer 3 is provided with circuit elements including a plurality of thin film transistors 31, 32 and 33, various signal wires, and a capacitor for each sub-pixel 21, 22 and 23. The signal wires may include a gate line, a data line, a power line, and a reference line, and the thin film transistors 31, 32, and 33 may include a switching thin film transistor, a driving thin film transistor, and a sensing thin film transistor. have. The sub-pixels 21, 22, and 23 are defined by a cross structure of gate lines and data lines.

The switching thin film transistor is switched according to a gate signal supplied to the gate line and serves to supply a data voltage supplied from the data line to the driving thin film transistor.

The driving thin film transistor is switched according to the data voltage supplied from the switching thin film transistor to generate a data current from the power supplied from the power line and serves to supply the first electrode 4.

The sensing thin film transistor serves to sense a threshold voltage deviation of the driving thin film transistor that causes a deterioration in image quality, and the current of the driving thin film transistor is responsive to a sensing control signal supplied from the gate line or a separate sensing line. Is supplied to the reference line.

The capacitor serves to maintain the data voltage supplied to the driving thin film transistor for one frame, and is connected to the gate terminal and the source terminal of the driving thin film transistor, respectively.

The first transistor 31, the second transistor 32, and the third transistor 33 are arranged in the circuit element layer 3 for each sub-pixel 21, 22, 23. The first transistor 31 according to an example is connected to the first sub-electrode 41 disposed on the first sub-pixel 21 to drive light of a color corresponding to the first sub-pixel 21 Voltage can be applied.

The second transistor 32 according to an example is connected to the second sub-electrode 42 disposed on the second sub-pixel 22 to drive light of a color corresponding to the second sub-pixel 22. Voltage can be applied.

The third transistor 33 according to an example is connected to the third sub-electrode 43 disposed on the third sub-pixel 23 to drive light of a color corresponding to the third sub-pixel 23. Voltage can be applied.

Each of the first sub-pixel 21, the second sub-pixel 22, and the third sub-pixel 23 according to an example, the gate signal is input from the gate line using each of the transistors 31, 32, 33 If possible, a predetermined current is supplied to the organic light emitting layer according to the data voltage of the data line. Accordingly, the organic emission layers of the first sub-pixel 21, the second sub-pixel 22, and the third sub-pixel 23 may emit light with a predetermined brightness according to a predetermined current.

The first electrode 4 is formed on the circuit element layer 3. The first electrode 4 according to an example is a stacked structure of aluminum and titanium (Ti/Al/Ti), a stacked structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a stacked structure of APC alloy and ITO It may be formed of a metal material having a high reflectance such as (ITO/APC/ITO). APC alloys are alloys of silver (Ag), palladium (Pb), and copper (Cu). The first electrode 4 may be an anode. The first electrode 4 may include a first sub-electrode 41, a second sub-electrode 42, and a third sub-electrode 43.

The first sub-electrode 41 may be provided in the first sub-pixel 21. The first sub-electrode 41 may be formed on the circuit element layer 3. The first sub-electrode 41 is connected to the source electrode of the first transistor 31 through a contact hole passing through the circuit element layer 3.

The second sub-electrode 42 may be provided in the second sub-pixel 22. The second sub-electrode 42 may be formed on the circuit element layer 3. The second sub-electrode 42 is connected to the source electrode of the second transistor 32 through a contact hole passing through the circuit element layer 3.

The third sub-electrode 43 may be provided in the third sub-pixel 23. The third sub-electrode 43 may be formed on the circuit element layer 3. The third sub-electrode 43 is connected to the source electrode of the third transistor 33 through a contact hole passing through the circuit element layer 3.

Here, the first to third transistors 31, 32, and 33 may be N-type TFTs.

If the first to third transistors 31, 32, and 33 are provided as P-type TFTs, each of the first to third sub-electrodes 41, 42, and 43 is the first to third transistors. Transistors 31, 32, and 33 may be connected to respective drain electrodes.

That is, each of the first to third sub-electrodes 41, 42 and 43 may be connected to a source electrode or a drain electrode according to the type of the first to third transistors 31, 32 and 33.

The display device 1 according to an exemplary embodiment of the present application is made of an upper emission method, and thus, the first to third sub-electrodes 41, 42 and 43 receive light emitted from the organic emission layer 7. It may include a reflective material for reflecting upward. In this case, the first to third sub-electrodes 41, 42, and 43 may be formed of a stacked structure of a transparent electrode formed of a transparent conductive material and a reflective electrode formed of the reflective material. Although not shown, a separate transparent electrode is additionally provided below the reflective electrode, so that each of the first to third sub-electrodes 41, 42, and 43 is a separate transparent electrode, a reflective electrode, and a transparent electrode in turn. It may be made of a stacked three-layer structure.

At this time, the reflective electrode provided in the first sub-pixel 21, the reflective electrode provided in the second sub-pixel 22, and the reflective electrode provided in the third sub-pixel 23 are all made of the same material. It may be formed to have the same thickness.

Similarly, the transparent electrode provided in the first sub-pixel 21, the transparent electrode provided in the second sub-pixel 22, and the transparent electrode provided in the third sub-pixel 23 are all made of the same material. It may be formed to have a thickness. However, the present invention is not limited thereto, and the thickness of the transparent electrodes provided in each of the sub-pixels 21, 22 and 23 to adjust the separation distance of the sub-electrodes 41, 42 and 43 with respect to the second electrode 9 May be different from each other. For example, when the display device is implemented using microcavity characteristics, the thickness of the transparent electrodes may be different from each other. The microcavity characteristic is that the distance between the reflective electrode of the first electrode 4 and the second electrode 9 is a half wavelength (λ/2) of light emitted from each sub-pixel 21, 22, 23. When it is an integer multiple, reinforcement interference occurs to amplify the light, and when the above reflection and re-reflection processes are repeated, the degree of amplification of light continuously increases, thereby improving the external extraction efficiency of light. When the display device is implemented to have micro-cavity characteristics, the second electrode 9 may include a translucent electrode.

Referring to FIG. 1 again, the first bank 5 is provided between the first sub-electrode 41 and the second sub-electrode 42. The first bank 5 according to an example is for distinguishing the first sub-pixel 21 from the second sub-pixel 22. The first bank 5 is provided to cover the edges of the first sub-electrode 41 and the second sub-electrode 42, thereby distinguishing the first sub-pixel 21 from the second sub-pixel 22. Can. The first bank 5 serves to define a sub-pixel, that is, a light emitting unit. In addition, since the region in which the first bank 5 is formed does not emit light, it may be defined as a non-light emitting unit. The first bank 5 is formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamise resin, or a polyimide resin. Can. The organic emission layer 7 is formed on the first electrode 4 and the first bank 5.

Referring to FIG. 1, the first bank 5 may include an upper surface 51 and an inclined surface 52. The inclined surface 52 may include a first inclined surface 521 and a second inclined surface 522.

The upper surface 51 of the first bank 5 is a surface positioned above the first bank 5.

The first inclined surface 521 of the first bank 5 is a surface extending from the upper surface 51 to the upper surface 41a of the first sub-electrode 41. Accordingly, the first inclined surface 521 and the upper surface 41a of the first sub-electrode 41 may form a predetermined angle. The predetermined angle may be 50° or more and less than 90° because the width of the bank is narrowed as the display device is implemented in high resolution. The width of the bank may be narrowed as the spacing between sub-pixels is narrowed.

The second inclined surface 522 of the first bank 5 is a surface extending from the upper surface 51 to the upper surface 42a of the second sub-electrode 42. Accordingly, the second inclined surface 522 and the upper surface 42a of the second sub-electrode 42 may form a predetermined angle. The angle formed by the second inclined surface 522 and the upper surface 42a of the second sub-electrode 42 is equal to the angle formed by the first inclined surface 521 and the upper surface 41a of the first sub-electrode 41. It can be the same.

Referring to FIG. 1, the display device 1 according to an exemplary embodiment of the present application may further include a second bank 6.

The second bank 6 is provided between the second sub-electrode 42 and the third sub-electrode 43. The second bank 6 according to an example is provided to cover the edges of the second sub-electrode 42 and the third sub-electrode 43, so that the second sub-pixel 22 and the third sub-pixel 23 are provided. Can be distinguished. The second bank 6 serves to define a sub-pixel, that is, a light emitting unit. In addition, the region where the second bank 6 is formed does not emit light, and thus may be defined as a non-light emitting unit. The second bank 6 may be formed of the same material as the first bank 5. The organic emission layer 7 is formed on the first electrode 4 and the second bank 6.

Referring to FIG. 1, the second bank 6 may include an upper surface 61 and an inclined surface 62. The inclined surface 62 may include a first inclined surface 621 and a second inclined surface 622.

The upper surface 61 of the second bank 6 is a surface positioned above the second bank 6.

The first inclined surface 621 of the second bank 6 is a surface extending from the upper surface 61 to the upper surface 42a of the second sub-electrode 42. Accordingly, the upper surface 42a of the first inclined surface 621 and the second sub-electrode 42 may form a predetermined angle. The predetermined angle may be 50° or more and less than 90° because the width of the bank is narrowed as the display device is implemented in high resolution.

The second inclined surface 622 of the second bank 6 is a surface extending from the upper surface 61 to the upper surface 43a of the third sub-electrode 43. Accordingly, the second inclined surface 622 and the upper surface 43a of the third sub-electrode 43 may form a predetermined angle. The angle formed by the second inclined surface 622 and the upper surface 43a of the third sub-electrode 43 is equal to the angle formed by the first inclined surface 621 and the upper surface 42a of the second sub-electrode 42. It can be the same.

The organic light emitting layer 7 is disposed on the first electrode 4. The organic light emitting layer 7 according to an example includes a hole transporting layer (HTL), a light emitting layer (EML), a hole blocking layer (HBL), and an electron transporting layer (ETL) It may include. The organic light emitting layer 7 may further include a hole injecting layer (HIL) and an electron injecting layer (EIL).

The hole injection layer (HIL), the hole transport layer (HTL), the electron transport layer (ETL), and the electron injection layer (EIL) of the organic light emitting layer 7 are for improving the luminous efficiency of the light emitting layer EML, and the hole transport layer (HTL) ) And the electron transport layer (ETL) are for balancing electrons and holes, and the hole injection layer (HIL) and electron injection layer (EIL) are for enhancing the injection of electrons and holes.

More specifically, the hole injection layer (HIL) may facilitate hole injection by lowering the injection energy barrier of holes injected from the anode material. The hole transport layer (HTL) serves to transport holes to the light emitting layer without loss of holes injected from the anode.

The emission layer (EML) is a layer that emits light through recombination of holes injected from the anode and electrons injected from the cathode, and can emit red, blue, and green light according to the binding energy in the emission layer. It is also possible to form a white light emitting layer. The hole blocking layer (HBL) is provided between the light emitting layer (EML) and the electron transport layer (ETL) and serves to suppress the movement of holes that are not coupled with electrons in the light emitting layer (EML).

The electron transport layer (ETL) serves to transport electrons injected from the cathode to the light emitting layer. The electron injection layer (EIL) serves to facilitate the injection of electrons from the cathode by lowering the potential barrier during electron injection.

When a high potential voltage is applied to the first electrode 4 and a low potential voltage is applied to the second electrode 9, holes and electrons are moved to the light emitting layer through the hole transport layer and the electron transport layer, respectively, and the light emitting layers combine with each other to emit light. do.

The organic emission layer 7 may include a first organic emission layer 71, a second organic emission layer 72, and a third organic emission layer 73.

The first organic emission layer 71 may be disposed on the first sub-electrode 41. The first organic emission layer 71 may be formed on the first sub-electrode 41 after the first electrode 4, the first bank 5, and the second bank 6 are formed.

The first organic light emitting layer 71, as shown in Figure 1, a hole injection layer 711, a hole transport layer 712, a light emitting layer 713, a hole blocking layer 714, electron transport layer 715, and electrons It may be provided, including the injection layer 716. The hole injection layer 711, the hole transport layer 712, the light emitting layer 713, the hole blocking layer 714, the electron transport layer 715, and the electron injection layer 716 is a first sub-pixel ( 21) may be formed sequentially.

In this case, the display device 1 according to an exemplary embodiment of the present application may be provided so that the protection unit 8 is disposed inside the organic light emitting layer 7. More specifically, the protection part 8 may be disposed between the hole blocking layer HBL and the electron transport layer ETL. The protection part 8 may be disposed on an upper surface of the hole blocking layer HBL to protect the hole blocking layer HBL from etching gas used during patterning. Therefore, the light emitting layer EML disposed on the lower surface of the hole blocking layer HBL is also protected by the protection part 8, and thus may not be damaged by the etching gas. The protection part 8 may be made of a material containing silicon. A detailed description thereof will be described later.

Meanwhile, the protection part 8 includes a first protection part 81 disposed inside the first organic light emitting layer 71, a second protection part 82 disposed inside the second organic light emitting layer 72, and A third protection part 83 disposed inside the third organic light emitting layer 73 may be included. The first protection part 81 may be disposed on the top surface of the hole blocking layer 714 between the hole blocking layer 714 and the electron transport layer 715 of the first organic emission layer 71.

As a result, the first to third protection parts 81, 82, and 83 are disposed above the light emitting layers of the first to third organic light emitting layers 71, 72, and 73, respectively, so that the organic light emitting layers 71, 72, The light emitting layers of 73) can be protected from the etching gas used for dry etching. A detailed description thereof will be described later.

On the other hand, the electron transport layer 715 and the electron injection layer 716 of the first organic emission layer 71 extend over the second sub-pixel 22 and the third sub-pixel 23 as well as the first sub-pixel 21. It can be deposited entirely. That is, the electron transport layer 715 and the electron injection layer 716 of the first organic light emitting layer 71 are connected to each of the electron transport layer and the electron injection layer of the second organic light emitting layer 72, and the second organic light emitting layer 72 ), the electron transport layer and the electron injection layer may be connected to each of the electron transport layer and the electron injection layer of the third organic light emitting layer 73.

Therefore, the electron transport layer 715 and the electron injection layer 716 of the first organic light emitting layer 71 may be the electron transport layer and the electron injection layer of the second organic light emitting layer 72, as shown in FIG. 3 It may be an electron transport layer and an electron injection layer of the organic light emitting layer 73. As a result, the electron transport layer 715 and the electron injection layer 716 of the first organic emission layer 71 may be disposed as a common layer in the display device 1 according to an embodiment of the present application.

The first bank disposed between the first sub-pixel 21 and the second sub-pixel 22 as the electron transport layer 715 and the electron injection layer 716 of the first organic emission layer 71 are disposed as a common layer In addition to covering the upper surface 51 and the inclined surface 52 of (5), the upper surface 61 of the second bank 6 disposed between the second sub-pixel 22 and the third sub-pixel 23 And the inclined surface 62.

On the other hand, the hole injection layer 711, the hole transport layer 712, the light emitting layer 713, the hole blocking layer 714 of the first organic light emitting layer 71 and the first protection part 81 are the first sub-pixel 21 ).

More specifically, the hole injection layer 711, the hole transport layer 712, the light emitting layer 713, and the hole blocking layer 714 of the first organic emission layer 71 are the first to third sub-pixels 21 and 22 , 23) and then deposited on the top surface of the hole blocking layer 714, the first protection unit 81 may be coated only in the first sub-pixel 21. The first protection part 81 may be partially coated on the top surface of the hole blocking layer 714 of the first organic light emitting layer 71 by using electrostatic spray deposition (ESD) technology. For example, the electrostatic force spraying technique is a technique in which a micronozzle (S, shown in FIG. 2C) sprays a solution in the form of nano-micro-level particulates toward the first sub-electrode 41. More specifically, by applying a high voltage to the micro-nozzle, by forming an electric field between the micro-nozzle (S) and the first sub-electrode (41), the solution injected from the micro-nozzle (S) is a first sub in a particulate state It can be coated on the electrode (41). Next, the hole injection layer 711, the hole transport layer 712, the light emitting layer 713, the hole blocking layer 714, and the first protection unit 81 of the first organic emission layer 71 are the first sub-pixel 21 ) Can be formed by patterning through an etching method such as dry etching.

As described above, the hole injection layer 711, the hole transport layer 712, the light emitting layer 713, the hole blocking layer 714, and the first protection part 81 of the first organic emission layer 71 are subjected to dry etching. By simultaneously patterning with the etching gas used, both ends can be provided to coincide with each other. Therefore, the first protection part 81 may contact the upper surface of the hole blocking layer 714. As a result, the display device 1 according to the exemplary embodiment of the present application has a number of manufacturing processes compared to the case where the hole injection layer, the hole transport layer, the light emitting layer, the hole blocking layer, and the first protective part of the first organic emission layer are patterned, respectively. Since it is possible to reduce the degree of exposure to the etching gas, the first organic emission layer 71 may be provided to reduce the degree of damage by the etching gas.

In addition, in the display device 1 according to the exemplary embodiment of the present application, the dry etching process is performed while the first protection unit 81 is disposed on the top surface of the hole blocking layer 714, that is, on the upper side of the light emitting layer 713. Therefore, since the first protection unit 81 can protect the hole blocking layer 714 and the light emitting layer 713 from the etching gas, it may be provided to prevent the light emitting layer 713 from being damaged by the etching gas.

Referring to FIG. 1 again, the second organic emission layer 72 may be disposed on the second sub-electrode 42. The second organic light emitting layer 72, like the first organic light emitting layer 71, after the first electrode 4, the first bank 5, and the second bank 6 are formed, the second sub-electrode 42 ). However, the present invention is not limited thereto, and the second organic emission layer 72 may be formed on the second sub-electrode 42 after the first organic emission layer 71 is formed on the first sub-pixel 21.

The second organic light emitting layer 72 may include a hole injection layer 721, a hole transport layer 722, a light emitting layer 723, a hole blocking layer 724, an electron transport layer, and an electron injection layer. The hole injection layer 721 of the second organic light emitting layer 72, the hole transport layer 722, the light emitting layer 723, the hole blocking layer 724, the electron transport layer, and the electron injection layer is a second sub The pixels 22 may be sequentially formed.

Here, as described above, the electron transport layer and the electron injection layer of the second organic light emitting layer 72 are connected to each of the electron transport layer 715 and the electron injection layer 716 of the first organic light emitting layer 71 to be disposed as a common layer. Can be. Accordingly, as shown in FIG. 1, the electron transport layer 715 and the electron injection layer 716 of the first organic light emitting layer 71 are disposed on the second sub-pixel 22 so that the second organic light emitting layer 72 is disposed. The functions of the electron transport layer and the electron injection layer can be performed.

On the other hand, the hole injection layer 721, the hole transport layer 722, the light emitting layer 723, the hole blocking layer 724 of the second organic light emitting layer 72 and the second protection unit 82 are second sub-pixels 22 ).

More specifically, the hole injection layer 721, the hole transport layer 722, the light emitting layer 723, and the hole blocking layer 724 of the second organic light emitting layer 72 are the first to third sub-pixels 21 and 22 , 23) and then deposited on the upper surface of the hole blocking layer 724, the second protection unit 82 may be coated to be disposed only in the second sub-pixel 22. The second protective part 82 may be coated only partially on the top surface of the hole blocking layer 724 of the second organic light emitting layer 72 using the electrostatic force spraying technique, like the first protective part 81 described above. have. Next, the hole injection layer 721, the hole transport layer 722, the light emitting layer 723, the hole blocking layer 724 of the second organic light emitting layer 72, and the second protection unit 82 are the second sub-pixel 22 ) Can be formed by patterning through an etching method such as dry etching.

The hole injection layer 721, the hole transport layer 722, the light emitting layer 723, the hole blocking layer 724 of the second organic light emitting layer 72, and the second protection part 82 are etching gases used for dry etching By being patterned at the same time, both ends may be provided to coincide with each other. Therefore, the second protection part 82 may contact the top surface of the hole blocking layer 724. As a result, the display device 1 according to the exemplary embodiment of the present application has a number of manufacturing processes compared to the case where the hole injection layer, the hole transport layer, the light emitting layer, the hole blocking layer, and the second protection part of the second organic light emitting layer are patterned, respectively. Since it is possible to reduce the degree of exposure to the etching gas, the second organic light emitting layer 72 may be provided to reduce the degree of damage by the etching gas.

In addition, in the display device 1 according to the exemplary embodiment of the present application, the dry etching process is performed while the second protection unit 82 is disposed on the top surface of the hole blocking layer 724, that is, on the upper side of the light emitting layer 723. Therefore, since the second protection unit 82 can protect the hole blocking layer 724 and the light emitting layer 723 from the etching gas, it may be provided to prevent the light emitting layer 723 from being damaged by the etching gas.

The third organic light emitting layer 73 may be disposed on the third sub electrode 43. The third organic light emitting layer 73 is formed with a first electrode 4, a first bank 5, and a second bank 6, as in the first organic light emitting layer 71 and the second organic light emitting layer 72 It may be formed on the third sub-electrode 43 later. However, the present invention is not limited thereto, and the third organic light emitting layer 73 may include a first organic light emitting layer 71 formed on the first sub pixel 21 and a second organic light emitting layer formed on the second sub pixel 22 ( After 72) is formed, it may be formed on the third sub-electrode 43.

The third organic light emitting layer 73 may include a hole injection layer 731, a hole transport layer 732, a light emitting layer 733, a hole blocking layer 734, an electron transport layer, and an electron injection layer. The hole injection layer 731, the hole transport layer 732, the light emitting layer 733, the hole blocking layer 734, the electron transport layer, and the electron injection layer of the third organic light emitting layer 73 are the third sub The pixels 23 may be sequentially formed.

Here, as described above, the electron transport layer and the electron injection layer of the third organic light emitting layer 73 may be disposed as a common layer connected to each of the electron transport layer and the electron injection layer of the second organic light emitting layer 72. Accordingly, as illustrated in FIG. 1, the electron transport layer 715 and the electron injection layer 716 of the first organic emission layer 71 are disposed in the third sub-pixel 23 to form the third organic emission layer 73. The functions of the electron transport layer and the electron injection layer can be performed.

On the other hand, the hole injection layer 731, the hole transport layer 732, the light emitting layer 733, the hole blocking layer 734 and the third protection part 83 of the third organic light emitting layer 73 are the third sub-pixel 23 ).

More specifically, the hole injection layer 731, the hole transport layer 732, the light emitting layer 733, and the hole blocking layer 734 of the third organic light emitting layer 73 include first to third sub pixels 21 and 22. , 23) and then deposited on the upper surface of the hole blocking layer 734, the third protection unit 83 may be coated to be disposed only in the third sub-pixel 23. The third protection part 83 is formed of the hole blocking layer 734 of the third organic light emitting layer 73 by using electrostatic force spraying technology, like the first protection part 81 and the second protection part 82 described above. It can only be partially coated on the top surface. Next, the hole injection layer 731, the hole transport layer 732, the light emitting layer 733, the hole blocking layer 734, and the third protection part 83 of the third organic emission layer 73 are the third sub-pixel 23 ) Can be formed by patterning through an etching method such as dry etching.

The hole injection layer 731, the hole transport layer 732, the light emitting layer 733, the hole blocking layer 734, and the third protection part 83 of the third organic light emitting layer 73 are etching gases used for dry etching By being patterned at the same time, both ends may be provided to coincide with each other. Therefore, the third protection part 83 may contact the top surface of the hole blocking layer 734. As a result, the display device 1 according to an exemplary embodiment of the present application has a number of manufacturing processes compared to a case in which a hole injection layer, a hole transport layer, a light emitting layer, a hole blocking layer, and a third protection part of the third organic light emitting layer are respectively patterned. Since it is possible to reduce the degree of exposure to the etching gas, the third organic light emitting layer 73 may be provided to reduce the degree of damage by the etching gas.

In addition, in the display device 1 according to the exemplary embodiment of the present application, the dry etching process is performed while the third protection part 83 is disposed on the top surface of the hole blocking layer 734, that is, on the upper side of the light emitting layer 733. Therefore, since the third protection unit 83 can protect the hole blocking layer 734 and the light emitting layer 733 from the etching gas, it may be provided to prevent damage to the light emitting layer 733 by the etching gas.

As a result, the display device 1 according to an exemplary embodiment of the present application is a hole injection layer 711, a hole transport layer 712, and a light emitting layer of the first organic emission layer 71 so as to be disposed only in the first sub-pixel 21 713), the hole blocking layer 714, and the first protective part 81 is patterned, and the hole injection layer 721 and the hole transport layer of the second organic emission layer 72 so as to be disposed only in the second sub-pixel 22 (hole) 722), the light emitting layer 723, the hole blocking layer 724, and the second protection unit 82 are patterned, and the hole injection layer 731 of the third organic emission layer 73 so as to be disposed only in the third sub-pixel 23 ), the hole transport layer 732, the light emitting layer 733, the hole blocking layer 734, and the first protective part 83 is patterned, and then the electron transport layer 715 and the electron injection layer of the first organic light emitting layer 71 716 may be provided by being sequentially deposited as a common layer.

Accordingly, the display device 1 according to an exemplary embodiment of the present application includes the hole injection layers 711, 721, and 731, which are patterned and disposed in each of the first to third sub-pixels 21, 22, and 23, and the hole transport layer ( 712, 722, 732), the light emitting layer (713, 723, 733), hole blocking layer (714. 724, 734) and the first to third protective parts (81, 82, 83) are provided to be spaced apart from each other, the electron transport layer And the electron injection layer may be provided to emit light of different colors for each of the first to third sub-pixels 21, 22, and 23 even though they are provided as common layers connected to each other. For example, the first sub-pixel 21 emits red (R) light, the second sub-pixel 22 emits green (G) light, and the third sub-pixel 23 emits blue (B) light. It may be provided to emit light. However, the present invention is not necessarily limited thereto, and may be provided to emit light of various colors.

Each of the first organic emission layer 71, the second organic emission layer 72, and the third organic emission layer 73 emits red (R) light, green (G) light, and blue (B) light. When provided, the arrangement order of the first to third organic emission layers 71, 72 and 73 with respect to the first sub-electrodes 41, 42 and 43 may be variously combined. Each of the first organic emission layer 71, the second organic emission layer 72, and the third organic emission layer 73 emits red (R) light, green (G) light, and blue (B) light. Accordingly, since the display device 1 according to the exemplary embodiment of the present application may not use a color filter, an effect of reducing manufacturing cost can be expected.

As described above, the hole injection layers 711, 721, 731, and hole transport layers 712, 722, 732 of the first to third organic light emitting layers 71, 72, and 73, respectively, and the light emitting layers 713, 723, and 733 ), the hole blocking layer (714. 724, 734), and the first to third protection units (81, 82, 83) may be formed by patterning for each of the first to third sub-pixels (21, 22, 23) . Referring to the first organic light emitting layer 71 disposed in the first sub-pixel 21 in more detail, the hole injection layer 711, the hole transport layer 712, and the light emitting layer 713 of the first organic light emitting layer 71 ), each of the hole blocking layer 714 is first deposited over the first to third sub-pixels 21, 22, and 23, and then the first protection unit 81 is first electro-static spraying technology to form the first sub-pixel 21 After being coated only, a hole injection layer 711, a hole transport layer 712, and a light emitting layer 713 of the first organic emission layer 71 in the remaining regions except for the first sub-pixel 21 through a dry etching process ), the hole blocking layer 714 may be removed. At this time, a portion of the first protective part 81 disposed on the top surface of the hole blocking layer 714 may be partially removed by an etching gas. Therefore, both ends of the hole injection layer 711, the hole transport layer 712, the light emitting layer 713, the hole blocking layer 714, and the first protection part 81 of the first organic emission layer 71 are implemented in accordance with each other. Can be.

Here, if there is no first protective part, there is a problem that the hole blocking layer and the light emitting layer disposed below it are damaged by the etching gas. Accordingly, the display device 1 according to an exemplary embodiment of the present application is provided by disposing the first to third protection parts 81, 82, and 83 on the top surfaces of the hole blocking layers 714, 724, 734, respectively. The first to third protection parts 81, 82, and 83 may be provided to protect the hole blocking layers 714, 724, 734 and the light emitting layers 713, 723, 733 from etching gas. Therefore, the display device 1 according to an exemplary embodiment of the present application can prevent the hole blocking layers 714, 724, and 734 and the light emitting layers 713, 723, and 733 from being damaged by the etching gas, thereby completing the display. It may be provided to reduce the defect rate of the device.

Referring to FIG. 1 again, the second electrode 9 is disposed on the organic light emitting layer 7. The second electrode 9 according to an embodiment is a common layer formed in common with the first sub-pixel 21, the second sub-pixel 22, and the third sub-pixel 23. The second electrode 9 is a transparent conductive material (TCO, Transparent Conductive Material) such as ITO or IZO that can transmit light, or magnesium (Mg), silver (Ag), or magnesium (Mg) and silver (ag) It may be formed of a semi-transmissive conductive material such as an alloy of.

An encapsulation layer 10 may be formed on the second electrode 9. The encapsulation layer 10 serves to prevent oxygen or moisture from penetrating the organic light emitting layer 7 and the second electrode 9. To this end, the encapsulation layer 10 may include at least one inorganic layer and at least one organic layer.

For example, the encapsulation layer 10 may include a first inorganic layer, an organic layer, and a second inorganic layer. In this case, the first inorganic film is formed to cover the second electrode 9. The organic film is formed to cover the first inorganic film. The organic film is preferably formed to a sufficient length to prevent foreign particles from entering the organic light emitting layer 7 and the second electrode 9 through the first inorganic film. The second inorganic film is formed to cover the organic film.

In FIG. 1, only the encapsulation layer 10 disposed on the second electrode 9 is illustrated for convenience of description. When the organic light emitting layer includes red, green and blue light emitting layers emitting red (R), green (G) and blue (B) light, the red, green and blue color filters are on the encapsulation layer 10. It may not be placed on.

2A to 2I are schematic manufacturing process cross-sectional views of a display device according to an exemplary embodiment of the present application. The display device 1 according to an exemplary embodiment of the present application includes first to third protection parts 81, 82, and 83 on the top surfaces of each of the hole blocking layers 714, 724, and 734 through the following manufacturing process. Each of the first to third protection parts 81, 82 and 83 protects each of the hole blocking layers 714, 724, 734 and the light emitting layers 713, 723, and 733 from etching gas used when patterning. It may be provided.

2A and 2B, in a state in which a first electrode 4, a first bank 5, and a second bank 6 are formed on the substrate 2 and the circuit element layer 3, The hole injection layer 711, the hole transport layer 712, the light emitting layer 713, and the hole blocking layer 714 of the first organic emission layer 71 are sequentially over the first to third sub-pixels 21, 22, and 23. It is deposited on the entire surface.

Next, referring to FIG. 2C, after the nozzle S is positioned on the first sub-electrode 41, a solution made of a material containing silicon, that is, a solution constituting the first protection part 81 is sprayed. do. That is, a solution constituting the first protection unit 81 is sprayed on the first sub-electrode 41 using electrostatic force spray (ESD) technology. At this time, when a voltage is applied to the nozzle S, the nozzle S serves as an anode, and a first sub-electrode 41 to which a voltage is not relatively applied acts as a cathode, so that the nozzle S and the agent An electric field is formed between the 1 sub-electrodes 41 so that the solution sprayed from the nozzle S may be coated on the hole blocking layer 714. The nozzle S may adjust the amount of the solution to be discharged according to the strength of the applied voltage. For example, the voltage applied to the nozzle S may be 0 V or more and 20 V or less. Therefore, as illustrated in FIG. 2C, a first protection part 81 having a predetermined thickness and width at a position corresponding to the first sub-electrode 41 may be coated on the top surface of the hole blocking layer 714. have. In this case, the coated first protection part 81 may be coated wider than the width of the first sub-electrode 41. This is because the nozzle S sprays the solution in the form of nano-micro-level particulates.

As described above, the display device 1 according to an exemplary embodiment of the present application uses the electrostatic force spraying technology to coat the first protection part 81 on the top surface of the hole blocking layer 714, that is, on the top side of the light emitting layer 713. Since the exposure process can be omitted compared to the case of coating a general fluorine-based shield layer, the number of manufacturing processes can be reduced, and the emission layer 713 may not be exposed to exposure, so that the emission layer 713 by exposure It may be provided to prevent damage.

Next, referring to FIG. 2D, a hole injection layer 711, a hole transport layer 712, a light emitting layer 713, a hole blocking layer 714, and a first protection unit 81 of the first organic emission layer 71 The hole injection layer 711 and the hole transport layer 712 of the first organic emission layer 71 disposed in the remaining sub-pixels 22 and 23 except for the first sub-pixel 21 so that is disposed only in the first sub-pixel 21 ), a process of removing the light emitting layer 713 and the hole blocking layer 714 by using an etching gas is performed. At this time, since the first protection part 81 is disposed on the uppermost side, the first protection part 81 can protect the hole blocking layer 714 and the light emitting layer 713 disposed on the lower surface from etching gas. Therefore, the manufacturing process of the display device 1 according to the exemplary embodiment of the present application is provided so that the patterning process is performed after coating the first protective part 81 on the upper side of the light emitting layer 713 and the hole blocking layer 714 By doing so, the first protection unit 81 can protect the light emitting layer 713 and the hole blocking layer 714 from the etching gas, thereby preventing deterioration of device characteristics of the light emitting layer 713 and the hole blocking layer 714. have.

Meanwhile, after the hole injection layer 711, the hole transport layer 712, the light emitting layer 713, and the hole blocking layer 714 of the first organic emission layer 71 are sequentially deposited, the first protection unit 81 is coated. Since the patterning process is performed in the state, the hole injection layer 711, the hole transport layer 712, the light emitting layer 713, the hole blocking layer 714 of the first organic light emitting layer 71, as shown in Figure 2d, and Both ends of the first protection part 81 may coincide. At this time, since the first protection part 81 is also partially etched by the etching gas, the thickness and width of the first protection part 81 may be reduced compared to the thickness and width initially coated by the electrostatic force spray technology.

Next, referring to FIGS. 2E to 2G, by repeating the above-described processes of FIGS. 2B to 2D, the hole injection layer 721 and the hole transport layer of the second organic emission layer 72 only in the second sub-pixel 22 722), a light emitting layer 723, a hole blocking layer 724, and a second protection unit 82 may be disposed. Since the hole injection layer 721, the hole transport layer 722, the light emitting layer 723, the hole blocking layer 724, and the second protective part 82 of the second organic light emitting layer 72 are simultaneously patterned by etching gas , Both ends of each of the hole injection layer 721, the hole transport layer 722, the light emitting layer 723, the hole blocking layer 724, and the second protective part 82 of the second organic light emitting layer 72 coincide with each other can do. Therefore, as illustrated in FIG. 2G, a hole injection layer 711, a hole transport layer 712, a light emitting layer 713, a hole blocking layer 714, and a first protection part 81 of the first organic emission layer 71 The second organic light emitting layer 72 may be spaced apart from the hole injection layer 721, the hole transport layer 722, the light emitting layer 723, the hole blocking layer 724, and the second protection unit 82, respectively.

Next, referring to FIG. 2H, the hole injection layer 731 and the hole transport layer 732 of the third organic light emitting layer 73 are only repeated in the third sub-pixel 23 by repeating the above-described steps of FIGS. 2B to 2D once more. ), a light emitting layer 733, a hole blocking layer 734, and a third protection part 83 may be disposed. Since the hole injection layer 731, the hole transport layer 732, the light emitting layer 733, the hole blocking layer 734, and the third protection part 83 of the third organic light emitting layer 73 are patterned simultaneously by etching gas , Both ends of the hole injection layer 731, the hole transport layer 732, the light emitting layer 733, the hole blocking layer 734, and the third protection part 83 of the third organic emission layer 73 coincide with each other can do. Therefore, as illustrated in FIG. 2H, the hole injection layer 731, the hole transport layer 732, the light emitting layer 733, the hole blocking layer 734, and the third protection part 83 of the third organic emission layer 73 The second organic light emitting layer 72 may be spaced apart from the hole injection layer 721, the hole transport layer 722, the light emitting layer 723, the hole blocking layer 724, and the second protection unit 82, respectively.

Next, referring to FIG. 2i, a method of manufacturing the display device 1 according to an exemplary embodiment of the present application includes a first protection unit 81, a second protection unit 82, and a third protection unit 83. The electron transport layer 715, the electron injection layer 716, the second electrode 9, and the encapsulation layer 10 of the first organic emission layer 71 are sequentially covered so as to cover the first to third sub-pixels 21 and 22. , 23), the entire manufacturing process can be partially completed.

Here, the electron transport layer 715 and the electron injection layer 716 of the first organic emission layer 71 extend over the first sub-pixel 21, the second sub-pixel 22, and the third sub-pixel 23. Since it is a common layer deposited by, it can be an electron transport layer and an electron injection layer of the second organic light emitting layer 72, and can function as an electron transport layer and an electron injection layer of the third organic light emitting layer 73.

The electron transport layer 715 that is entirely deposited over the first to third sub-pixels 21, 22 and 23 includes the first protection part 81, the second protection part 82, and the third protection part ( 83) Each top and side surfaces, both sides of each of the hole blocking layers 714, 724, and 734, each side of each of the light emitting layers 713, 723, and 733, and each amount of the hole transport layers 712, 722, and 732 Sides, and may be disposed to cover both sides of each of the hole injection layers (711, 721, 731).

The display device 1 according to an exemplary embodiment of the present application includes first to third sub-pixels 21, 22 and 23 of the electron transport layer 715 and the electron injection layer 716 of the first organic emission layer 71. By providing a common layer that covers all of them, it is possible to reduce the number of manufacturing processes compared to the case of patterning the electron transport layer and the electron injection layer for each sub-pixel, thereby reducing the tact time of the completed display device.

On the other hand, as shown in Figure 2i, the hole injection layer 711, the hole transport layer 712, the light emitting layer 713, the hole blocking layer 714 and the first protective portion 81 of the first organic light emitting layer 71 The hole injection layer 721, the hole transport layer 722, the light emitting layer 723, the hole blocking layer 724 of the second organic light emitting layer 72 and the second protective part 82 may be disposed to be spaced apart from each other. . Accordingly, even if an electric field is formed between the first sub-electrode 41 and the second electrode 9, no leakage current is generated toward the second sub-pixel 22, so that the second sub-pixel 22 does not emit light. Can. Likewise, even if an electric field is formed between the second sub-electrode 42 and the second electrode 9, no leakage current is generated toward the first sub-pixel 21, so that the first sub-pixel 21 may not emit light. have.

In addition, the hole injection layer 731, the hole transport layer 732, the light emitting layer 733, the hole blocking layer 734 and the third protection part 83 of the third organic light emitting layer 73 are the second organic light emitting layer 72 ), the hole injection layer 721, the hole transport layer 722, the light emitting layer 723, the hole blocking layer 724 and the second protection unit 82 may be disposed to be spaced apart from each other. Accordingly, even when an electric field is formed between the third sub-electrode 43 and the second electrode 9, no leakage current is generated toward the second sub-pixel 22, so that the second sub-pixel 22 does not emit light. Can.

As a result, the display device 1 according to an exemplary embodiment of the present application uses the electrostatic force spraying technology to provide first to third protection units 81, 82, and 83 on the top of each of the light emitting layers 712, 723, and 733. Since it can be coated, it is possible to omit the exposure process, thereby preventing damage to the light emitting layers 712, 723, and 733 by exposure, as well as reducing the number of manufacturing processes due to the omission of the exposure process and manufacturing due to the mask not being used. It can have the effect of cost reduction.

In addition, the display device 1 according to an embodiment of the present application is etched in a state in which the first to third protection parts 81, 82, and 83 are respectively coated on the upper sides of the light emitting layers 712, 723, and 733, respectively. Since the etching process by gas is performed, each of the first to third protection parts 81, 82, and 83 can protect each of the light emitting layers 712, 723, and 733, so that the light emitting layers 712 by etching gas 723, 733).

Meanwhile, the display device 1 according to an exemplary embodiment of the present application may implement micro-cavity characteristics by providing different thicknesses of the first to third protection parts 81, 82, and 83. In this case, the thickness of the first protection unit 81 disposed in the first sub-pixel 21 emitting red light is the second protection portion 82 disposed in the second sub-pixel 22 emitting green light. And a thickness of the third protection part 83 disposed on the third sub-pixel 23 that emits blue light, and the thickness of the second protection part 82 is the third protection part 83. It can be thicker than the thickness.

3 is a diagram showing a schematic molecular structure of a protection part of a display device according to an exemplary embodiment of the present application, and FIG. 4 is a schematic diagram showing an energy level of part A of FIG. 1.

Referring to FIG. 3, the protection part 8 including the first to third protection parts 81, 82 and 83 is made of a material containing silicon. For example, the protection part 8 may be provided with a silicon-ETL material in which a material of an electron transport layer (ETL) is dissolved in a solution such as a silicone fluid. Here, the material of the electron transport layer (ETL) applicable to the silicone fluid is B4PyMPM (bis-4,6-(3,5-di-4-pyridylphenyl)-2-methylpyrimidine), TmPyPB(1,3,5-Tri (m-pyridin-3-ylphenyl)benzene, Bphen (4,7-diphenyl-1,10-phenanthroline may be any one, but is not necessarily limited to, if applicable to the silicone fluid, the B4PyMPM, the TmPyPB, At least two or more of the Bphens may be combined, or may be other materials The electron transport layer (ETL) dissolved in the silicone fluid is hereinafter referred to as silicon-ETL.

3, the silicon-ETL may be formed by combining P1 and P2. Here, P1 is the molecular structure of a silicone fluid, and P2 is the molecular structure of a general ETL. The silicon-ETL in which P1 and P2 are combined has a molecular structure shown in FIG. 3, which serves as an electron transport layer (ETL) and at the same time serves as a protective layer protecting the hole blocking layer and the light emitting layer from etching gas. Can.

4 is a light emitting layer 713, a hole blocking layer 714, and a first protection unit 81 of the first organic light emitting layer 71 that is disposed on the first sub-pixel 21 and emits red (R) light. It is a schematic representation of the energy level of. As illustrated in FIG. 4, each of the light emitting layer 713, the hole blocking layer 714, and the first protection part 81 constituting the first organic emission layer 71 has different energy levels.

More specifically, the LUMO energy level of the light emitting layer 713 may be greater than the LUMO energy level of the hole blocking layer 714, and the HOMO energy level of the light emitting layer 713 may be greater than the HOMO energy level of the hole blocking layer 714. have. The LUMO energy level of the hole blocking layer 714 may be greater than the LUMO energy level of the first protection unit 81, and the HOMO energy level of the hole blocking layer 714 may be greater than the HOMO energy level of the first protection unit 81. It can be small.

On the other hand, the electron injection layer 716, the electron transport layer 715, the first protection unit 81, the hole blocking layer 714, and the light emitting layer 713, which are electron transfer parts, have LUMO energy levels at the boundary of each layer. The difference between the two may affect the driving voltage, and the hole injection layer 711, the hole transport layer 712, and the light emitting layer 713, which are hole moving parts, have a difference in HOMO energy level at the boundary of each layer. Can affect. Therefore, when the difference in the LUMO energy level of each layer in the electron transfer portion is large, the driving voltage may be large because electrons cannot move smoothly toward the light emitting layer 713, and the difference in the LUMO energy level of each layer in the electron transfer portion is small. If it is, the electrons can move smoothly toward the light emitting layer 713, so the driving voltage can be reduced. Likewise, if the difference in HOMO energy level of each layer in the hole moving portion is large, the driving voltage may increase because the hole cannot move smoothly toward the light emitting layer 713, and the difference in the HOMO energy level of each layer in the hole moving portion is small. If it is, the hole can smoothly move toward the light emitting layer 713, so the driving voltage can be reduced.

The part indicated by the dotted line in the first protection part 81 of FIG. 4 shows the energy level before the silicone fluid is doped into the ETL. As shown in FIG. 4, the LUMO energy level of the ETL before doping indicated by a dotted line is -2.0 eV, which is larger than the LUMO energy level of the hole blocking layer 714 -2.7 eV. In this case, electrons cannot smoothly move from the ETL before doping to the hole blocking layer 714. On the other hand, when the ETL is doped with silicone fluid, the LUMO energy level decreases from -2 eV to -3.7 eV. In this case, since the LUMO energy level of the silicon-ETL doped with silicon fluid is smaller than the LUMO energy level of the hole blocking layer 714, electrons can be smoothly moved from the silicon-ETL to the hole blocking layer 714.

Meanwhile, the HOMO energy level of silicon-ETL is -5.1 eV, which may be greater than the -7 eV HOMO energy level of the ETL before doping. That is, as illustrated in FIG. 4, when the ETL is doped with a silicone fluid, the LUMO energy level becomes smaller and the HOMO energy level becomes larger than the ETL before doping, and thus the overall shrinkage may occur. Therefore, as illustrated in FIG. 4, the LUMO energy level of the first protection unit 81 made of silicon-ETL is smaller than the LUMO energy level of each of the light emitting layer 713 and the hole blocking layer 714, and the first protection unit The HOMO energy level of 81 may be greater than the HOMO energy level of each of the light emitting layer 713 and the hole blocking layer 714.

As a result, the display device 1 according to an embodiment of the present application uses silicon-ETL as a constituent material of the protection part 8, thereby protecting the LUMO energy level of the hole blocking layer contacting the protection part 8 The part 8 can be provided to have a smaller LUMO energy level. Therefore, since the display device 1 according to an embodiment of the present application can smoothly move electrons from the protection unit 8 to the hole blocking layer 714, when the ETL before doping with silicon fluid is used Compared to the light-emitting layer, the light-emitting efficiency may be improved.

In the display device 1 according to the exemplary embodiment of the present application, a difference between the LUMO energy levels of the hole blocking layer 714 and the first protection unit 81 may be 0.3 to 2.0 eV. When the LUMO energy level difference between the hole blocking layer and the first protection unit is less than 0.3 eV, electrons may move from the hole blocking layer toward the first protection unit, so that the luminous efficiency may be further reduced. On the other hand, if the difference between the LUMO energy level of the hole blocking layer and the first protection unit exceeds 2.0 eV, the difference between the LUMO energy level of the hole blocking layer and the first protection unit becomes too large, and the electrons are not smoothly formed, so the hole blocking layer and the first protection Electrons may accumulate between the negative interfaces to increase the driving voltage. In this case, the device life of the light emitting layer can be shortened.

Therefore, the display device 1 according to an embodiment of the present application is provided so that the difference between the LUMO energy levels of the hole blocking layer 714 and the first protection unit 81 is 0.3 eV or more and 2.0 eV or less, thereby smoothly electronizing. Since the driving voltage of the light emitting layer is not increased, it is possible to prevent the life of the light emitting layer from being shortened. The difference between the LUMO energy levels of the first protection unit 81 and the hole blocking layer 714 is between the second protection unit 82 and the hole blocking layer 724 disposed in the second sub-pixel 22, and the third The same may be applied to the third protection unit 83 disposed on the sub-pixel 23 and the hole blocking layer 734.

On the other hand, the display device 1 according to an embodiment of the present application has been described as an example in which a hole blocking layer 714 is provided between the light emitting layer 713 and the first protection unit 81, but the light emitting layer 713 A hole blocking layer 714 may not be provided between and the first protection part 81. In this case, electrons move from the first protection unit 81 directly to the light emitting layer 713 without passing through the hole blocking layer 714, but the LUMO energy level is different compared to the case where the hole blocking layer 714 is provided. Since is suddenly increased, electron movement from the first protection unit 81 to the light emitting layer 713 may not be smoothly performed.

In addition, the display device 1 according to an embodiment of the present application is exemplified that the protection part 8 is silicon-ETL, but is not limited thereto, and has a smaller LUMO energy level than the hole blocking layer while blocking the hole If the material can reduce the difference in LUMO energy level with the layer, a protective part may be provided with another material including silicon.

5A to 5C relate to a display device according to another exemplary embodiment of the present application, which relates to a head mounted display (HMD) device. 5A is a schematic perspective view, FIG. 5B is a schematic plan view of a VR (Virtual Reality) structure, and FIG. 5C is a schematic cross-sectional view of an Augmented Reality (AR) structure.

5A, the head mounted display device according to the present application includes a storage case 11 and a head mounting band 13.

The storage case 11 houses components such as a display device, a lens array, and an eyepiece therein.

The head mounting band 13 is fixed to the storage case 11. The head mounting band 13 is illustrated to be formed so as to surround both the top and both sides of the user's head, but is not limited thereto. The head mounting band 13 is for fixing the head mounted display to the user's head, and can be replaced with a frame or a helmet-shaped structure.

As can be seen in FIG. 5B, the head mounted display device 1 having a VR (Virtual Reality) structure according to the present application includes a display device 2a for a left eye, a display device 2b for a right eye, a lens array 12, and a left eye The eyepiece 20a and the right eyepiece 20b may be included.

The left-eye display device 2a, the right-eye display device 2b, the lens array 12, and the left-eye eye lens 20a and the right-eye eye lens 20b are housed in the aforementioned storage case 11 .

The display device 2a for the left eye and the display device 2b for the right eye can display the same image, in which case the user can watch the 2D image. Alternatively, the left-eye display device 2a may display a left-eye image and the right-eye display device 2b may display a right-eye image, in which case the user can view a stereoscopic image. Each of the display device 2a for the left eye and the display device 2b for the right eye may be formed of the display devices according to FIGS. 1 to 4 described above. For example, each of the left-eye display device 2a and the right-eye display device 2b may be an organic light emitting display.

Each of the left-eye display device 2a and the right-eye display device 2b includes a plurality of sub-pixels, a circuit element layer 3, a first electrode 4, a first bank 5, and a second bank 6 , An organic light emitting layer 7, a protection part 8, a second electrode 9, and an encapsulation layer 10. Various colors are displayed by combining the color of light emitted from each sub-pixel in various ways. can do.

The lens array 12 may be provided between the left eyepiece lens 20a and the left eye display device 2a while being spaced apart from each of the left eyepiece lens 20a and the left eye display device 2a. That is, the lens array 12 may be located in front of the left eyepiece 20a and behind the left eye display 2a. In addition, the lens array 12 may be provided between the right eye lens 20b and the right eye display device 2b while being spaced apart from each of the right eye eye lens 20b and the right eye display device 2b. have. That is, the lens array 12 may be positioned in front of the right-eye eyepiece lens 20b and behind the right-eye display device 2b.

The lens array 12 may be a micro lens array. The lens array 12 may be replaced with a pin hole array. The image displayed on the left-eye substrate 2a or the right-eye substrate 2b due to the lens array 12 may be enlarged to the user.

The left eye LE of the user may be located in the left eyepiece 20a, and the right eye RE of the user may be located in the right eyepiece 20b.

As can be seen in Figure 5c, the head mounted display device of the AR (Augmented Reality) structure according to the present invention is a left-eye display device (2a), a lens array 12, a left eyepiece (20a), a transmissive reflector (14) , And a transmission window (15). For convenience, only the left eye configuration is shown in FIG. 5C, and the right eye configuration is the same as the left eye configuration.

The left-eye display device 2a, the lens array 12, the left-eye eyepiece 20a, the transmissive reflector 14, and the transmissive window 15 are housed in the aforementioned storage case 11.

The display device 2a for the left eye may be disposed on one side, for example, an upper side of the transmission reflection portion 14 without covering the transmission window 15. Accordingly, the left eye display device 2a may provide an image to the transmissive reflector 14 without obscuring an external background seen through the transmissive window 15.

The left-eye display device 2a may be formed of the electroluminescent display device according to FIGS. 1 to 4 described above. At this time, in FIG. 1 to FIG. 4, an upper portion corresponding to a surface on which an image is displayed, for example, an encapsulation layer 10 or a color filter layer (not shown) faces the transmissive reflecting portion 14.

The lens array 12 may be provided between the left eyepiece lens 20a and the transmissive reflector 14.

The left eye of the user is located in the left eyepiece 20a.

The transmission reflection part 14 is disposed between the lens array 12 and the transmission window 15. The transmission reflector 14 may include a reflective surface 14a that transmits a portion of light and reflects another portion of light. The reflective surface 14a is formed such that an image displayed on the left-eye display device 2a proceeds to the lens array 12. Accordingly, the user can view both the external background and the image displayed by the left eye display device 2a through the transmission window 15. That is, since the user can view the virtual image and the background of the reality as a single image, augmented reality (AR) can be implemented.

The transmission window 15 is disposed in front of the transmission reflection unit 14.

The present application described above is not limited to the above-described embodiments and the accompanying drawings, and it is generally possible in the technical field to which this application belongs that various substitutions, modifications, and changes are possible without departing from the spirit of the present application It will be clear to those who have the knowledge of Therefore, the scope of the present application is indicated by the claims, which will be described later, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts should be interpreted to be included in the scope of the present application.

1: Display device
2: Substrate 3: Circuit element layer
4 first electrode 5 first bank
6: second bank 7: organic light emitting layer
8: Protection part 9: Second electrode
10: sealing layer 11: storage case
12: lens array 13: head mounting band
81: first protection unit 82: second protection unit
83: third protection unit

Claims (16)

A substrate having a first sub-pixel and a second sub-pixel adjacent to the first sub-pixel;
A first electrode provided on the substrate and including a first sub-electrode provided in the first sub-pixel and a second sub-electrode provided in the second sub-pixel;
An organic emission layer including a first organic emission layer disposed on the first sub-electrode and a second organic emission layer disposed on the second sub-electrode;
A second electrode disposed on the organic light emitting layer;
A first bank provided between the first sub-electrode and the second sub-electrode to distinguish the first sub-pixel and the second sub-pixel; And
And a protection part covering at least a portion of each of the first organic emission layer and the second organic emission layer,
The protection unit is a display device provided with a material containing silicon. According to claim 1,
The first organic light emitting layer includes a hole injection layer, a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer,
The protection unit is a display device including a first protection unit disposed inside the first organic light emitting layer. According to claim 2,
The first protection unit is a display device disposed on an upper surface of the hole blocking layer between the hole blocking layer and the electron transport layer. The method of claim 3,
The difference between the LUMO energy level of the hole blocking layer and the first protection unit is 0.3 eV or more and 2.0 eV or less. According to claim 2,
A display device in which both ends of the hole injection layer, the hole transport layer, the light emitting layer, the hole blocking layer, and the first protective part of the first organic light emitting layer coincide with each other. According to claim 2,
The second organic light emitting layer includes a hole injection layer, a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer,
The protective part includes a second protective part disposed inside the second organic light emitting layer to contact the top surface of the hole blocking layer of the second organic light emitting layer,
The hole injection layer, the hole transport layer, the light emitting layer, the hole blocking layer of the first organic light emitting layer and the hole injection layer, the hole transport layer, the light emitting layer, and the hole blocking layer of the second organic light emitting layer are spaced apart from each other,
The first protection unit and the second protection unit are spaced apart from each other. The method of claim 6,
A display device in which both ends of the hole injection layer, the hole transport layer, the light emitting layer, the hole blocking layer, and the second protection part of the second organic light emitting layer coincide with each other. According to claim 2,
The second organic light emitting layer includes a hole injection layer, a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer,
An electron transport layer, an electron injection layer of the first organic light emitting layer, and an electron transport layer and an electron injection layer of the second organic light emitting layer are connected to each other, so that the display device covers the upper surface and the inclined surface of the first bank. The method of claim 6,
The substrate includes a third sub-pixel adjacent to one side of the second sub-pixel,
The first electrode is provided on the substrate, and includes a third sub electrode provided in the third sub pixel,
The organic light emitting layer includes a third organic light emitting layer disposed on the third sub-electrode,
The third organic light emitting layer includes a hole injection layer, a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer,
The protection unit includes a third protection unit in contact with the upper surface of the hole blocking layer of the third organic light emitting layer. The method of claim 9,
The first organic light emitting layer, the second organic light emitting layer, the third organic light emitting layer is a display device provided to emit red light, green light, blue light, respectively. The method of claim 9,
The hole injection layer, hole transport layer, light emitting layer, hole blocking layer of the second organic light emitting layer and the hole injection layer, hole transport layer, light emitting layer, and hole blocking layer of the third organic light emitting layer are spaced apart from each other,
The third protection unit and the second protection unit are spaced apart from each other. The method of claim 9,
A display device having a hole injection layer, a hole transport layer, a light emitting layer, a hole blocking layer, and both ends of the third protection part coincide with each other. The method of claim 9,
And a second bank provided between the second and third sub-electrodes to distinguish the second and third sub-pixels,
An electron transport layer, an electron injection layer of the second organic light emitting layer, and an electron transport layer and an electron injection layer of the third organic light emitting layer are connected to each other, so that the display device covers the upper surface and the inclined surface of the second bank. The method according to any one of claims 1 to 13,
The protection unit is a silicon-ETL display device. The method of claim 14,
The silicon-ETL is a display device provided with at least one of B4PyMPM, TmPyPB, and Bphen. The method according to any one of claims 1 to 13,
A display device further comprising a lens array spaced apart from the substrate, and a storage case accommodating the substrate and the lens array.

Images