KR20200061006A - LED lighting fixture - Google Patents

Abstract

The present invention relates to an LED lighting device, and more specifically, an LED lighting device capable of: simply pressing and fixing a printed circuit board to a heat radiating frame without subsidiary materials such as bolts to enhance workability and reduce manufacturing costs by shortening an assembly process; completely blocking an inflow of moisture and foreign substances from the outside; and preventing scattering of light emitted from an LED to minimize light loss. To this end, the present invention provides an LED lighting device that comprises: a heat radiating frame having a board seating part in which a printed circuit board is seated on an upper surface formed, and having a heat sink formed on a lower surface to radiate heat generated from the printed circuit board to outside air; the printed circuit board seated on the board seating part of the heat radiating frame, and having a plurality of LEDs emitting light arranged at regular intervals on the upper surface; a lens cover covering and protecting an upper portion of the printed circuit board, having a plurality of receiving grooves receiving the plurality of arranged LEDs respectively on a lower surface, having a pressing surface part in close contact with the upper surface of the printed circuit board to apply pressure formed between each of the receiving grooves, and having lens parts each formed on an upper portion of each of the receiving grooves, wherein the lens parts prevent the scattering of light emitted from the LEDs; and a cover fixing member detachably coupled to the heat radiating frame through a fastening means, having an insertion hole in which the lens cover is inserted formed in a lower inner side, and fixing the lens cover to the heat radiating frame.

Description

LED lighting fixture

The present invention relates to an LED lighting fixture, and more specifically, by pressing the printed circuit board closely to the heat dissipation frame, and at the same time fixing the heat dissipation frame and the cover for the printed circuit board and the lens to each other to quickly heat the heat generated from the printed circuit board. At the same time, it prevents the printed circuit board from falling off the heat dissipation frame due to heat generated by increasing the binding force at the same time, and completely blocks the inflow of moisture and foreign matter from the outside, and also prevents the scattering of the light emitted from the LED. It relates to an LED lighting fixture that can minimize the light loss.

Recently, LED elements have been spotlighted as light sources for various lighting devices. These LED devices have advantages of less heat generation and power consumption, excellent durability, and long lifespan compared to light sources of conventional lighting devices such as incandescent and fluorescent lights. .

LED lamps do not use mercury or discharge gas like fluorescent lamps, so they have the advantage of not causing environmental pollution.

The LED device can be used for about 100,000 hours or more if it provides adequate power supply and heat dissipation. However, all light sources gradually decrease with time. As 80% of the initial luminosity is hardly felt by humans, According to these criteria, the life of the LED lamp is expected to be about 40,000 to 50,000 hours.

Therefore, compared to 1,500 hours of incandescent lamps and 10,000 hours of fluorescent lamps, it is estimated that the relative life of LED lamps is very long.

However, LED lighting lamps, especially flat lighting lamps, developed so far have shown limitations in that they simply replace conventional incandescent or fluorescent lamps in order to function as one light source.

In other words, the LED lighting structure has limitations in design to the extent that it follows the shape of the existing lighting despite the various arrangement designs of the LED module and the advantages of variously modifying the shape of the entire lighting.

Accordingly, the development of unit lights having unique shapes and shapes has been actively attempted, and the development and dissemination of so-called'system lights', which can realize another type of lights by connecting these unit lights, is urgently requested. have.

Prior art related to this is shown in Korean Registered Patent Publication No. 10-0961236 "LD System Lighting and Unit Lighting Used for It" (Registration Date: 20100526).

This is to make it possible to realize various shapes of the entire shape by combining a flat type unit light emitting light emitted by the LED.

On the other hand, the existing LED lighting structure has a disadvantage that the LDE has a characteristic that is sensitive to temperature and current, so that when the ambient temperature is elevated and exposed to high temperature, the life is reduced.

As a prior art for solving this, it is shown in Korean Registered Patent Publication No. 10-0820942 "LD Lighting Lamp" (Registration Date: 20080402).

This is a plurality of wings are formed in the longitudinal direction on both sides of the heat dissipation frame, the printed circuit board is arranged in close contact with the LED is arranged on the bottom surface of the receiving space of the heat dissipation frame is attached to the heat generated by the LED and the printed circuit board to the outside It is intended to be released efficiently.

Existing LED lighting lamps form bolt holes on the bottom surface of the heat dissipation frame and the printed circuit board to close the printed circuit board to the heat dissipation frame and fasten the bolts to the bolt holes to fix the printed circuit board or use double-sided tape. The method of fixing the printed circuit board to the bottom of the heat dissipation frame is adopted.

However, in the case of fixing the printed circuit board by the bolt fastening method, the existing LED lighting lamps have the hassle of fastening with bolts after the bolt holes of the heat dissipation frame and the bolt holes of the circuit board are placed on the same vertical line, as well as bolts. There is a problem in that the production cost is increased by using such auxiliary materials.

On the other hand, the fixing method using a double-sided tape has a disadvantage that heat dissipation performance is not smooth because the double-sided tape is located between the heat dissipation frame and the circuit board.

In addition, in the case of the existing LED, since light is not concentrated and scattered, loss of illuminance occurs, there is a disadvantage in that a lot of lighting is required due to loss of light in an industrial site where a lighting lamp is placed on a high ceiling.

Korea Patent Registration No. 10-0961236 has been registered. Korea Patent Registration No. 10-0820942 has been registered.

The present invention has been devised to solve the problems of the prior art as described above, and the purpose of the technical configuration of the present invention is to press the printed circuit board closely to the heat dissipation frame, and at the same time cover the heat dissipation frame, the printed circuit board and the lens. By fixing and fastening each other, the heat generated from the printed circuit board is quickly released, and at the same time, the binding circuit is prevented from falling off the heat dissipation frame due to the heat generated by increasing the binding force, and the inflow of moisture and foreign matter from the outside is completely blocked. In addition, it is to provide an LED lighting fixture that can minimize the light loss by preventing the scattering of light emitted from the LED.

The present invention for achieving the above object is a heat-resistant frame is formed on the upper surface is a substrate seating portion on which a printed circuit board is seated, and a heat sink is formed on the bottom surface to radiate heat generated from the printed circuit board to outside air; A printed circuit board mounted on the substrate seating portion of the heat dissipation frame, and a plurality of LEDs irradiating light are arranged at regular intervals on the upper surface; The upper portion of the printed circuit board is covered and protected, and a plurality of receiving grooves are formed in which the plurality of arranged LEDs are respectively accommodated, and the upper surface of the printed circuit board is in close contact between the receiving grooves and the receiving grooves. A pressurized surface portion to be pressurized to be formed respectively, and a lens cover for forming a lens portion to prevent scattering of light irradiated from the LED on the upper portion of each receiving groove; And a cover fixing member detachably coupled to the heat dissipation frame by a fastening means, an insertion hole into which the lens cover is inserted, and a cover fixing member fixing the lens cover to the heat dissipation frame. Provide an appliance.

In addition, a plurality of first to third bolt coupling holes are formed radially around each center and each center of the heat dissipation frame, printed circuit board, and lens cover.

In addition, the pressing surface portion is characterized in that at least one pressing protrusion for contacting and pressing the upper surface of the printed circuit board is protruded.

In addition, a groove portion is formed on the inner edge of the upper surface of the heat radiating frame.

In addition, the lower inner rim of the insertion hole is characterized in that the protrusions and protrusions are inserted into the recess.

In addition, a flange portion is formed on the outer rim of the lens cover.

In addition, the upper inner rim of the insertion hole is characterized in that the stepped portion is formed in close contact with the flange portion.

According to the present invention, the cover for a lens having a pressurized surface portion contacting the printed circuit board is fastened to the heat dissipation frame by using a cover fixing member to fix it, as well as fixing the heat dissipation frame and the printed circuit board and lens using bolts as a coupling means. As the cover for the lens is fixedly coupled to each other, the lens cover closely adheres the printed circuit board to the heat dissipation frame so that heat can be smoothly dissipated quickly, and of course, the printed circuit board adhered to the heat dissipation frame by increasing the binding power. It prevents the phenomenon of falling due to heat generated.

In addition, by protruding the pressing protrusions on the pressing surface of the lens cover, even when the LED is made higher than the predetermined height in the process of manufacturing the LED, the printed circuit board can be easily fixed to the heat dissipation frame.

In addition, a groove is formed in the heat dissipation frame, and a packing protrusion inserted into the groove is formed in the cover fixing member to insert an O-ring into the groove, and then the cover fixing member is bolted to the heat dissipation frame with the packing protrusion inserted, from the outside. It can block moisture and foreign substances from flowing into the lens cover.

In addition, by providing a lens portion on the lens cover, it has the advantage of preventing the scattering of light irradiated through the LED to improve the illuminance through the concentration of light.

1 is an exploded perspective view of the LED lighting fixture according to the present invention as viewed from a plane.
Figure 2 is a perspective view showing a state in which the rest of the components except for the cover fixing member in the state of Figure 1 combined.
Figure 3 is a perspective view of Figure 2 combined.
Figure 4 is an exploded perspective view of the LED lighting fixture according to the present invention as viewed from the bottom.
Figure 5 is a perspective view of Figure 4 combined.
Figure 6 is a side cross-sectional view showing the LED lighting fixture according to the present invention.
Figure 7a is a cross-sectional view showing an embodiment of a lens cover applied to the present invention.
Figure 7b is a cross-sectional view showing another embodiment of a lens cover applied to the present invention.
8 is a bottom view showing the cover fixing member applied to the present invention.

The present invention can be applied to various changes and can have various embodiments, and specific embodiments will be illustrated in the drawings and described in detail.

In the following description of the present invention, when it is determined that a detailed description of related known functions or configurations may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted.

In addition, the terms to be described later are terms that are set in consideration of functions in the present invention, which may vary depending on the intention or custom of the producer, so the definition should be made based on the contents throughout the present specification.

In addition, since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, the present invention is not necessarily limited to that shown in the drawings.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

1 is an exploded perspective view of the LED lighting fixture according to the present invention viewed from a plane, and FIG. 2 is a perspective view showing a state in which the rest of the components except the cover fixing member are combined in the state of FIG. 1, and FIG. 3 is a combined perspective view of FIG. , Figure 4 is an exploded perspective view of the LED lighting fixture according to the present invention as viewed from the bottom, Figure 5 is a combined perspective view of Figure 4, Figure 6 is a side sectional view showing the LED lighting fixture according to the present invention, Figure 7a is a 7B is a cross-sectional view showing one embodiment of a lens cover applied to the present invention, FIG. 7B is a cross-sectional view showing another embodiment of a lens cover applied to the present invention, and FIG. 8 is a bottom view showing the cover fixing member applied to the present invention.

The LED lighting fixture 10 of the present invention will be described with reference to FIGS. 1 to 8 as follows.

First, the present invention can easily fix the printed circuit board to the heat dissipation frame without the need for subsidiary materials such as bolts, thereby shortening the assembly process, improving assembly performance and reducing manufacturing costs. In addition to completely blocking the inflow, as well as to prevent the scattering of light emitted from the LED to minimize the light loss, the LED lighting fixture 10, such as the LED lighting fixture (10) is a large heat dissipation frame (100), printed circuit It comprises a substrate 200, a lens cover 300 and a cover fixing member 400.

As shown in FIGS. 1 and 5, the heat dissipation frame 100 is formed with a substrate seating portion 110 on which the printed circuit board 200 is seated on the upper surface, and is generated from the printed circuit board 200 on the lower surface. The heat sink 120 is formed by dissipating heat to cool the air.

At this time, the second and third bolt coupling holes 220 formed on the printed circuit board 200 and the cover fixing member 400, which will be described later in the left and right and up and down radial directions based on the center and center of the substrate seating portion 110, respectively ( The first bolt coupling holes 111 are formed so that the coupling means bolts are fastened to each other through 350).

In addition, the heat sink 120 is formed with a plurality of air passing holes 121 so that the outside air can pass smoothly, and the inner upper surface, left, right side, and outer lower surface of each air passing hole 121 are connected with external air. In order to increase the heat dissipation efficiency by increasing the surface area to be contacted, the uneven portions 122 are respectively formed.

In addition, a recess 130 is formed in the outer periphery of the substrate seating portion 110 formed on the heat dissipation frame 100, into which the packing protrusion 420 protruding from the cover fixing member 400 to be described later is inserted.

On the other hand, the groove 130 may be equipped with an O-ring 500 formed of a material such as rubber or silicone to prevent rainwater or foreign matter from penetrating from the outside.

In addition, at least one bolt hole 140 is formed on the inner side of the rim of the heat dissipation frame 100 so that a bolt that is a fastening means for fixing the cover fixing member 400 is fastened.

The printed circuit board 200 is mounted on the above-described substrate seating portion 110, the LED 210 for irradiating light is arranged at regular intervals in the radiation direction on the upper surface, and the heat generated from the LED 210 is It is preferable to employ a metal PCB to be conducted and conducted to the heat dissipation frame 100.

In addition, the first bolt coupling hole 111 and the lens cover 300 formed on the substrate seating portion 110 as described above in the left and right and up and down radially based on the center and the center of the printed circuit board 200 Each of the three bolt coupling holes 350 and the second bolt coupling holes 220 is formed.

On the other hand, the wiring and power supply for supplying power to the printed circuit board 200 is a known technical configuration, and will be omitted from the drawings and description.

The cover 300 for the lens covers and protects the upper end of the printed circuit board 200 as shown in FIGS. 1 and 7A, and a plurality of receiving grooves in which a plurality of LEDs 210 arranged in the lower surface are respectively accommodated ( 310) is formed, between the receiving groove 310 and the receiving groove 310, the pressing surface portion 320 is in close contact with the upper surface of the printed circuit board 200 is formed, each receiving groove 310 In the upper portion of the LED 210, a lens unit 330 to prevent scattering of light emitted from the LED 210 is formed, respectively.

In addition, a flange portion 340 that is in close contact with the stepped portion 411 formed in the insertion hole 410 of the cover fixing member 400 to be described later is formed on the outer rim of the lens cover 300.

Meanwhile, at least one pressing protrusion 321 that contacts and presses the upper surface of the printed circuit board 200 may be protruded on the pressing surface portion 320 as illustrated in FIG. 7B.

That is, in the process of manufacturing a plurality of LEDs 210 arranged on the printed circuit board 200, the height of the LEDs varies by ±0.1mm to 0.2mm. At this time, when the height of the LED 210 is made high, the LED is not inserted into the receiving groove 310, so that the pressing surface portion 320 is not in close contact with the top surface of the printed circuit board 200, so a defect occurs, so that pressure is generated. The upper surface of the printed circuit board 200 is pressed through the protrusion 321.

In addition, as described above in the left and right and up and down radially based on the center and center of the lens cover 300, the third bolt coupling hole 350 corresponding to the first and second bolt coupling holes 111 and 220, respectively. Each of these is formed.

The cover fixing member 400 is detachably coupled to the above-described heat dissipation frame 100 by a bolt that is a fastening means, and serves to fix the lens cover 300 to the heat dissipation frame 100. As illustrated in FIGS. 3 and 7, the member 400 has an insertion hole 410 in which a lens cover 300 is inserted into the lower inner side.

At this time, a stepped portion 411 is formed on the upper inner rim of the insertion hole 410 so that the flange portion 340 formed on the outer rim of the lens cover 300 is fastened.

In addition, a packing protrusion 412 that is inserted into the recess 130 formed in the heat dissipation frame 100 to seal the inside of the cover 300 for the reds is protruded on the lower inner rim of the insertion hole 410.

In addition, a plurality of bolt fastening grooves 420 are formed at the lower end of the cover fixing member 400 so that the bolts are fastened through the bolt holes 140 formed on the inner side of the rim of the heat dissipation frame 100.

In addition, a sealing groove 430 is formed between the outer rim of the lower end portion of the cover fixing member 400 and the bolt fastening groove 420 so that a sealing material may be applied and sealed.

Hereinafter, the assembly method and operation of the LED lighting fixture 10 of the present invention configured as described above will be described.

First, in the state as shown in FIG. 1, the printed circuit board 200 is seated on the substrate seating portion 110 formed on the top surface of the heat dissipation frame 100.

Then, the lens cover 300 is placed so that the upper end of the printed circuit board 200 is covered.

At this time, the LED 210 is inserted into the receiving groove 310 of the lens cover 300 at a predetermined depth, and the pressing surface portion 320 is provided in a state in close contact with the upper surface of the printed circuit board 200, the first The third to third bolt coupling holes 350 are positioned on the same line with each other.

Then, by fastening the bolt as the coupling means through the first to third bolt coupling holes () formed in the lens cover 300, the heat dissipation frame 100 and the printed circuit board 200 and the lens cover 300 They are fixed to each other.

As such, as the heat dissipation frame 100, the printed circuit board 200, and the lens cover 300 are fixedly coupled to each other, the printed circuit board 200 and the lens cover 300 by heat generated from the printed circuit board 200 ) Not only prevents the excitation from occurring in the heat dissipation frame 100, but also heats smoothly and quickly as the printed circuit board 200 closely adheres to the substrate seating portion 110 of the heat dissipation frame 100. I made it possible.

Then, after inserting the lens cover 300 into the insertion hole 410 of the cover fixing member 400, the cover fixing member 400 is bolted to the heat dissipation frame 100 and fixed.

At this time, since the flange portion 340 formed on the outer rim of the lens cover 300 is in close contact with the stepped portion 411 formed in the insertion hole 410, the cover fixing member 400 is bolted to the heat dissipation frame 100. In accordance with the fastening and fixing, the stepped portion 411 pushes the flange portion 340 downward, and at the same time, the pressing surface portion 320 of the lens cover 300 presses and presses the upper surface of the printed circuit board 200. give.

For this reason, the lens cover 300 closely adheres the printed circuit board 200 to the substrate seating portion 110 of the heat dissipation frame 100. Due to this, the heat generated from the LED 210 has a transmission path that is conducted to the heat dissipation frame 100 through the printed circuit board 200, and is radiated to outside air through the heat dissipation plate 120 to cool the LED 210. Improves.

In addition, the lens portion 330 is formed on the upper portion of the receiving groove 310 of the lens cover 300 to concentrate the light emitted from the LED 210 to improve the illuminance, from the existing floor surface to the hearing. It has the advantage of being applied to industrial sites with high height.

In addition, the packing protrusion 420 formed on the lower inner rim of the insertion hole 410 formed in the cover fixing member 400 is provided in a state inserted into the recess 130, thereby allowing moisture and moisture to enter the lens cover 300. It blocks the inflow of foreign substances. Meanwhile, the O-ring 500 may be inserted into the recess 130 of the heat dissipation frame 100 before bolting the cover fixing member 400 to the heat dissipation frame 100.

Finally, a sealing material is applied to the sealing groove 440 of the cover fixing member 400. By double waterproofing as described above, moisture and foreign substances from the outside can be completely blocked from flowing into the inside of the lens cover 300.

That is, the LED lighting fixture 10 according to the present invention is bolted to the heat dissipation frame 100 using the cover fixing member 400 for the lens cover 300 having the pressing surface part 320 contacting the printed circuit board. The cover for the lens 300 is printed circuit board 200 by fixing and coupling the heat dissipation frame 100 and the printed circuit board 200 and the lens cover 300 to each other by using bolts as a coupling means By closely adhering to the heat dissipation frame 100, the heat can be quickly dissipated, and of course, the binding power is increased to prevent the phenomenon caused by the heat generated by the printed circuit board 200 closely adhered to the heat dissipation frame 100. .

In addition, even when the height of the LED 210 is higher than a predetermined height in the process of manufacturing the LED 210 by protruding the pressing projection 321 on the pressing surface portion 320 of the lens cover 300 The printed circuit board 200 can be easily fixed to the heat dissipation frame 100.

In addition, a groove 130 is formed in the heat dissipation frame 100, and a packing protrusion 412 inserted into the groove in the cover fixing member 400 is formed to insert the O-ring 500 into the groove 130 and then the packing protrusion. By bolting the cover fixing member 400 to the heat dissipation frame 100 while the 412 is inserted into the groove 130, moisture and foreign matter from the outside can be blocked from flowing into the lens cover.

In addition, by providing the lens portion 330 on the lens cover 300, it has the advantage of preventing the scattering phenomenon of light irradiated through the LED 210 to improve the illuminance through concentration of light.

The technical idea of the LED lighting fixture of the present invention is that it is possible to repeat the same result in practice, and in particular, by carrying out the present invention, it is possible to promote technological development and contribute to industrial development, which is well worth protecting.

10: LED lighting fixture
100: heat dissipation frame
110: substrate mounting portion 111: the first bolt coupling hole
120: heat sink 121: air passage hole 122: irregularities
130: home
140: bolt ball
200: printed circuit board
210: LED
220: second bolt coupling hole
300: lens cover
310: acceptance home
320: pressing surface portion 321: pressing projection
330: lens unit
340: flange
350: third bolt coupling hole
400: cover fixing member
410: insertion hole 411: stepped portion 412: packing protrusion
420: bolt fastening groove
430: sealing groove
500: O-ring

Claims (7)

A heat dissipation frame in which a substrate seating portion on which a printed circuit board is seated is formed on an upper surface, and a heat sink that dissipates heat generated from the printed circuit board to outside air is formed on the lower surface;
A printed circuit board mounted on the substrate seating portion of the heat dissipation frame, and a plurality of LEDs irradiating light are arranged at regular intervals on the upper surface;
The upper portion of the printed circuit board is covered and protected, and a plurality of receiving grooves are formed in which the plurality of LEDs are respectively accommodated on the lower surface, and the upper surface of the printed circuit board is in close contact between the receiving grooves and the receiving grooves. A pressurized surface portion to be pressurized to be formed respectively, and a lens cover for forming a lens portion to prevent scattering of light irradiated from the LED on the upper portion of each receiving groove; And
It characterized in that it comprises a cover fixing member that is detachably coupled by a fastening means to the heat dissipation frame, an insertion hole into which the lens cover is inserted, and fixing the lens cover to the heat dissipation frame. Led lighting fixtures.
According to claim 1,
An LED lighting fixture, characterized in that a plurality of first to third bolt coupling holes are formed radially around each center and each center of the heat dissipation frame, printed circuit board, and lens cover.
According to claim 1,
An LED lighting fixture, characterized in that at least one pressing protrusion for contacting and pressing the upper surface of the printed circuit board is projected on the pressing surface portion.
According to claim 1,
LED lighting fixture, characterized in that the groove formed in the outer periphery of the substrate seating portion formed in the heat dissipation frame.
The method of claim 4,
An LED lighting fixture, characterized in that a packing protrusion inserted into the recess is formed on a lower inner edge of the insertion hole.
According to claim 1,
LED lighting fixture, characterized in that the flange portion is formed on the outer rim of the lens cover.
The method of claim 6,
LED lighting fixture, characterized in that the upper inner rim of the insertion hole is formed with a stepped portion in close contact with the flange portion.

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