KR20200059909A - Apparatus and method for treating substrate - Google Patents

Abstract

The present invention provides a substrate treating apparatus to improve accuracy and efficiency in a substrate treating process. The substrate treating apparatus includes a cylinder unit, wherein the cylinder unit includes a housing having an inner space, a cylinder member having a lifting shaft extended from the inner space of the housing to the outside of the housing and connected to a support unit, and a detection member detecting the vibration of the lifting shaft in the cylinder member. The detection member may include a conductor positioned inside the inner space and coupled with the lifting shaft, a conductive wire positioned inside the inner space, electrically connected to the conductor, and forming a closed circuit with the conductor, a magnetic body providing the closed circuit with magnetic flux, and a galvanometer installed in the closed circuit.

Description

Substrate processing apparatus and substrate processing method {APPARATUS AND METHOD FOR TREATING SUBSTRATE}

The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly, to a substrate processing apparatus and a substrate processing method for detecting the vibration of the lifting shaft for moving the object.

In order to manufacture a semiconductor device, various processes such as deposition, exposure, ashing and cleaning are involved. Among them, processes such as deposition, etching, and ashing are performed under vacuum. In such a semiconductor manufacturing process, a process of processing a substrate using plasma is generally widely performed.

Plasma refers to the state of ionized gas composed of ions, electrons, radicals, etc., and plasma is generated by very high temperatures, strong electric fields, or RF electromagnetic fields.

A typical substrate processing apparatus has a process chamber in which a processing space is formed, in which the substrate is supported by a support plate. The supporting plate is coupled to the lifting shaft, and the substrate supported on the supporting plate is moved in the vertical direction by lifting of the lifting shaft. When the lift shaft is normally driven, the lift shaft moves up and down at a constant speed and moves the substrate without vibration. However, when the hoisting shaft is abnormally driven, the hoisting shaft moves up or down at a constant speed, or vibration occurs in the hoisting shaft. When the lift shaft is abnormally driven, the substrate supported by the support plate is released from its original position. Accordingly, the substrate processing is not uniform. Therefore, when the lifting shaft is abnormally driven, maintenance of the device is required, and for this purpose, the abnormal driving of the lifting shaft must be recognized in a short time.

In the related art, it was necessary for the operator to visually check whether the hoisting shaft was operating normally, or to directly check the sound generated by vibration of the hoisting shaft. However, this checking method may take a large amount of time depending on the skill level of the operator, or in some cases, may not recognize the abnormal driving of the lifting shaft.

The present invention is to provide a substrate processing apparatus and method that can improve the accuracy and efficiency of the substrate processing process.

In addition, the present invention is to provide a substrate processing apparatus and method that can detect the vibration of the lifting shaft for moving the object up and down in the substrate processing apparatus.

In addition, the present invention is to provide a substrate processing apparatus and method that can minimize the time required for maintenance work of the substrate processing apparatus.

The problems to be solved by the present invention are not limited to the above-described problems, and the problems not mentioned can be clearly understood by those skilled in the art from the present specification and the accompanying drawings. will be.

The present invention provides a substrate processing apparatus. An apparatus for processing a substrate includes a chamber having a processing space therein; A gas supply unit supplying gas to the processing space; A support unit having a support plate on which a seating surface for supporting the substrate is formed; A cylinder unit for moving the substrate by moving the support unit up and down, the cylinder unit comprising: a housing having an internal space; A cylinder member extending from the inner space of the housing to the outside of the housing and having a lift shaft connected to the support unit; A detecting member for detecting vibration of the lifting shaft in the cylinder member, wherein the detecting member is located in the interior space and is coupled to the lifting shaft; A conductor located in the interior space, electrically connected to the conductor, and forming a closed circuit with the conductor; A magnetic body that provides magnetic flux to the closed circuit; It may include a galvanometer installed in the closed circuit.

According to an embodiment, the conducting wire may include a first conducting wire provided parallel to the elevating shaft; A second conductor spaced a predetermined distance from the first conductor and parallel to the first conductor; A third conductor connecting the first conductor and the second conductor may be included.

According to an embodiment, the galvanometer is installed on the third conductor, and the conductor may be electrically connected to the first conductor and the second conductor.

According to an embodiment, the first conductor and the second conductor may be disposed to face each other with the lifting shaft interposed therebetween.

According to one embodiment, the magnetic body is provided in a plate shape, the width of the magnetic body is equal to or greater than the distance between the first conductor and the second conductor, and the height of the magnetic body is the first conductor or the agent It may be the same as or greater than the length of the two conductors.

According to an embodiment, the lifting shaft moves in a first direction, and the first conductor and the second conductor are arranged to be spaced apart in a second direction perpendicular to the first direction, and the plate is in contact with the first direction. It may be arranged in a third direction perpendicular to the second direction.

According to one embodiment, the conductor is provided in the shape of a rod, the longitudinal direction of which is the second direction, and when viewed from the third direction, the first conductor and the second conductor may be disposed to overlap the plate. have.

According to an embodiment, the magnetic body may provide the magnetic flux in the third direction.

According to an embodiment, the cylinder unit further includes a control material for measuring the magnitude and change of the induced current flowing through the galvanometer when the conductor is moved, and the control material has the measured value of the induced current. A signal may be generated when it deviates from a preset value.

According to an embodiment, when the measured value of the induced current is smaller than a preset reference value, the control unit may amplify the measured value and determine whether to deviate from the set value.

According to an embodiment, the control unit may measure the measured value after a predetermined time has elapsed from the time when the lifting shaft is operated.

In addition, the present invention provides a cylinder unit for moving the object. The cylinder unit for moving the object includes: a housing having an interior space; A cylinder member extending from the inner space of the housing to the outside of the housing and having a lift shaft for moving an object; A detecting member for detecting vibration of the lifting shaft in the cylinder member, wherein the detecting member is located in the interior space and is coupled to the lifting shaft; A conductor located in the interior space, electrically connected to the conductor, and forming a closed circuit with the conductor; A magnetic body that provides magnetic flux to the closed circuit; It may include a galvanometer installed in the closed circuit.

According to an embodiment, the conducting wire may include a first conducting wire provided parallel to the elevating shaft; A second conductor spaced a predetermined distance from the first conductor and parallel to the first conductor; A third conductor connecting the first conductor and the second conductor may be included.

According to an embodiment, the galvanometer is installed on the third conductor, and the conductor may be electrically connected to the first conductor and the second conductor.

According to one embodiment, the magnetic body is provided in a plate shape, the width of the magnetic body is equal to or greater than the distance between the first conductor and the second conductor, and the height of the magnetic body is the first conductor or the agent It may be the same as or greater than the length of the two conductors.

According to an embodiment, the lifting shaft moves in a first direction, and the first conductor and the second conductor are arranged to be spaced apart in a second direction perpendicular to the first direction, and the plate is in contact with the first direction. It may be arranged in a third direction perpendicular to the second direction.

According to one embodiment, the conductor is provided in the shape of a rod, the longitudinal direction of which is the second direction, and when viewed from the third direction, the first conductor and the second conductor may be disposed to overlap the plate. have.

According to an embodiment, the magnetic body may provide the magnetic flux in the third direction.

According to an embodiment, the cylinder unit further includes a control material for measuring the magnitude and change of the induced current flowing through the galvanometer when the conductor is moved, and the control material has the measured value of the induced current. A signal may be generated when it deviates from a preset value.

According to an embodiment, when the measured value of the induced current is smaller than a preset reference value, the control unit may amplify the measured value and determine whether to deviate from the set value.

According to an embodiment, the control unit may measure the measured value after a predetermined time has elapsed from the time when the lifting shaft is operated.

According to one embodiment, the present invention also provides a vibration detection method for detecting the vibration of the lifting shaft. The vibration detection method detects the vibration of the lifting shaft for moving the substrate up and down on the cylinder member that linearly moves the object, but the measured value of the induced current generated by the movement of the lifting shaft with the conductor in the cylinder member provided with magnetic flux. Based on this, vibration of the lifting shaft can be detected.

According to an embodiment, the method may generate a signal when the measured value of the induced current deviates from a preset value.

According to an embodiment, when the measured value of the induced current is smaller than a preset reference value, the method may amplify the measured value to determine whether to deviate from the set value.

According to an embodiment, the method may measure the measured value after a predetermined time has elapsed since the lifting shaft was operated.

The present invention can detect the vibration of the lifting shaft for moving the object up and down in the substrate processing apparatus.

In addition, the present invention can minimize the deviation of the substrate from the fixed position due to the abnormal driving of the lifting shaft for moving the substrate.

In addition, the present invention can improve the accuracy and efficiency of the substrate processing process.

In addition, the present invention can minimize the time required for maintenance work of the substrate processing apparatus.

The effects of the present invention are not limited to the above-described effects, and the effects not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

1 is a view schematically showing a substrate processing facility of the present invention.
FIG. 2 is a view showing the substrate processing apparatus of FIG. 1.
FIG. 3 is a view showing an embodiment of the cylinder unit of FIG. 2.
4 is a side cross-sectional view showing an embodiment of the cylinder unit of FIG. 2.
5 is a view showing a state in which the lifting shaft moves in the cylinder unit of FIG. 4.
6 is a graph showing a state of induced current generated when the cylinder unit is normally driven.
7 is a graph showing a state of induced current generated when the cylinder unit is abnormally driven.
8 is a side cross-sectional view showing another embodiment of the cylinder unit of FIG. 2.
9 is a view showing a state in which the lifting shaft moves in the cylinder unit of FIG. 8.
2 is a view schematically showing a substrate processing facility according to an embodiment of the present invention.
FIG. 3 is a view showing the substrate processing apparatus of FIG. 2.
4 to 7 are views showing examples of controlling each switch in the substrate processing apparatus.
8 is a view showing another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains may easily practice. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. In addition, in the detailed description of the preferred embodiment of the present invention, when it is determined that a detailed description of related known functions or configurations may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, the same reference numerals are used throughout the drawings for parts having similar functions and functions.

'Including' a component means that other components may be included, not excluded, unless specifically stated to the contrary. Specifically, the terms “include” or “have” are intended to indicate that a feature, number, step, action, component, part, or combination thereof described in the specification exists, or that one or more other features or It should be understood that the presence or addition possibilities of numbers, steps, actions, components, parts or combinations thereof are not excluded in advance.

Singular expressions include plural expressions unless the context clearly indicates otherwise. In addition, the shape and size of elements in the drawings may be exaggerated for a more clear description.

Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 7.

1 is a view schematically showing a substrate processing facility 1 of the present invention. Referring to FIG. 1, the substrate processing facility 1 has an equipment front end module (EFEM) 20 and a process processing unit 30. The equipment front end module 20 and the process processing unit 30 are arranged in one direction.

The equipment front end module 20 has a load port (10) and a transfer frame (21). The load port 10 is disposed in front of the equipment front end module 20 in the first direction 11. The load port 10 has a plurality of support parts 6. Each support portion 6 is arranged in a line in the second direction (Y), the carrier W to be provided to the process and the substrate 4 to which the process has been completed (W) (4, for example, a cassette, FOUP, etc.) are settled. In the carrier 4, a substrate W to be provided in the process and a substrate W having been processed are stored. The transfer frame 21 is disposed between the load port 10 and the process processing chamber 30. The transfer frame 21 is disposed therein and includes a first transfer robot 25 for transferring the substrate W between the load port 10 and the process processing unit 30. The first transfer robot 25 moves along the transfer rail 27 provided in the second direction Y to transfer the substrate W between the carrier 4 and the process processing chamber 30.

The process processing chamber 30 includes a load lock chamber 40, a transfer chamber 50, and a process chamber 60.

The load lock chamber 40 is disposed adjacent to the transfer frame 21. For example, the load lock chamber 40 may be disposed between the transfer chamber 50 and the equipment front end module 20. The load lock chamber 40 is a space to wait before the substrate W to be provided to the process is transferred to the process chamber 60 or before the process processing completed substrate W is transferred to the equipment front end module 20. Gives

The transfer chamber 50 is disposed adjacent to the load lock chamber 40. The transfer chamber 50 has a polygonal body when viewed from the top. Referring to FIG. 1, the transfer chamber 50 has a pentagonal body when viewed from the top. On the outside of the body, a load lock chamber 40 and a plurality of process chambers 60 are arranged along the periphery of the body. On each side wall of the body, a passage (not shown) through which the substrate W enters and exits is formed, and the passage connects the transfer chamber 50 and the load lock chamber 40 or the process chambers 60. Each passage is provided with a door (not shown) that opens and closes the passage to seal the interior. In the inner space of the transfer chamber 50, a second transfer robot 53 for transferring the substrate W between the load lock chamber 40 and the process chambers 60 is disposed. The second transfer robot 53 transfers the unprocessed substrate W waiting in the load lock chamber 40 to the process chamber 60, or transfers the process processed substrate W to the load lock chamber 40 do. Then, in order to sequentially provide the substrates W to the plurality of process chambers 60, the substrates W are transferred between the process chambers 60. As shown in FIG. 1, when the transfer chamber 50 has a pentagonal body, load lock chambers 40 are disposed on side walls adjacent to the front end module 20 of the equipment, and process chambers 60 are continuously disposed on the remaining side walls. Is placed. The transfer chamber 50 may be provided in various forms according to the shape as well as the required process module.

The process chamber 60 is disposed along the perimeter of the transfer chamber 50. A plurality of process chambers 60 may be provided. In each process chamber 60, process processing for the substrate W is performed. The process chamber 60 receives the substrate W from the second transfer robot 53 to process it, and provides the substrate W having the process processing to the second transfer robot 53. The process processing performed in each process chamber 60 may be different from each other. Hereinafter, the substrate processing apparatus 1000 performing the plasma process in the process chamber 60 will be described.

FIG. 2 is a view showing the substrate processing apparatus of FIG. 1. Referring to FIG. 2, the substrate processing apparatus 1000 performs a predetermined process on the substrate W using plasma. For example, the substrate processing apparatus 1000 may etch a thin film on the substrate W. The thin film may be various types of films such as a polysilicon film, a silicon oxide film, and a silicon nitride film. Further, the thin film may be a natural oxide film or a chemically generated oxide film.

The substrate processing apparatus 1000 has a process processing unit 200, a plasma generation unit 400, and an exhaust unit 600.

The process processing unit 200 provides a space on which the substrate W is placed and the process is performed. The plasma generating unit 400 generates plasma from a gas outside the process processing unit 200 and supplies it to the process processing unit 200. The exhaust unit 600 discharges gases and reaction by-products generated in the process of substrate processing inside the process processing unit 200 to the outside, and maintains the pressure in the process processing unit 200 at a set pressure.

The process processing unit 200 has a process chamber 210, a support unit 230, a baffle 250, and a cylinder unit 300.

A processing space 212 for performing a substrate processing process is formed inside the process chamber 210. The process chamber 210 may have an upper wall open and an opening (not shown) formed on the side wall. The substrate W enters and exits the process chamber 210 through the opening. The opening may be opened and closed by an opening / closing member such as a door (not shown). An exhaust hole 214 is formed on the bottom surface of the process chamber 210. The exhaust hole 214 is connected to the exhaust unit 600, and provides a passage through which gases and reaction by-products remaining inside the process chamber 210 are discharged to the outside.

The support unit 230 supports the substrate W. The support unit 230 includes a support plate 232. The support plate 232 is located in the processing space 212 and is provided in a disc shape. The support plate 232 is supported by the cylinder unit 300. The substrate W is placed on the upper surface of the support plate 232. An electrode (not shown) may be provided inside the support plate 232. The electrode is connected to an external power source and generates static electricity by the applied power. The generated static electricity can fix the substrate W to the support plate 232.

A heating member 234 may be provided inside the support plate 232. According to an example, the heating member 234 may be a heating coil. In addition, a cooling member 236 may be provided inside the support plate 232. The cooling member 236 may be provided as a cooling line through which cooling water flows. The heating member 234 heats the substrate W to a predetermined temperature. The cooling member 236 forcibly cools the substrate W. The substrate W, which has been processed, may be cooled to a normal temperature or to a temperature required for the next process.

The baffle 250 is positioned above the support plate 232. Holes 252 are formed in the baffle 250. The holes 252 are provided as through holes provided from the upper surface to the lower surface of the baffle 250, and are uniformly formed in each region of the baffle 250.

The cylinder unit 300 can move the object. For example, the cylinder unit 300 may move the substrate W in the vertical direction. For example, the cylinder unit 300 is coupled to the support unit 230, the substrate W can be moved by moving the support unit 230 up and down.

The plasma generating unit 400 is located above the process chamber 210. The plasma generator 400 generates plasma by discharging process gas, and supplies the generated plasma to the processing space 212. The plasma generator 400 includes a plasma chamber 410, a gas supply unit 420, and a power application unit 430.

In the plasma chamber 410, a plasma generating space 412 having an upper surface and a lower surface open is formed therein. The upper end of the plasma chamber 410 is sealed by a gas supply port 414. The gas supply port 414 is connected to the gas supply unit 420. Gas is supplied to the plasma generation space 412 through the gas supply port 414. The gas supplied to the plasma generation space 412 may be introduced into the processing space 212 through the baffle 250.

The power application unit 430 applies high-frequency power to the plasma generation space 412. The power applying unit 430 includes an antenna 432 and a power source 434.

The antenna 432 is an inductively coupled plasma (ICP) antenna, and is provided in a coil shape. The antenna 432 is wound around the plasma chamber 410 a plurality of times outside the plasma chamber 410. The antenna 432 is wound around the plasma chamber 410 in an area corresponding to the plasma generation space 412. The power source 434 supplies high-frequency power to the antenna 432. The high frequency power supplied to the antenna 432 is applied to the plasma generation space 412. An induction electric field is formed in the plasma generation space 412 by the high frequency current, and the process gas in the plasma generation space 412 is converted into a plasma state by obtaining energy required for ionization from the induction electric field.

The exhaust unit 600 is provided to suck plasma and impurities inside the process processing unit 200. For example, the exhaust unit 600 may include a pressure reducing member that provides pressure reduction to the processing space 212 of the process chamber 210. The pressure reducing member can be a pump. The pressure-sensitive member may discharge plasma and impurities remaining in the processing space 212 to the outside of the process chamber 210. In addition, the pressure reducing member may provide pressure reduction to maintain the pressure in the processing space 212 at a predetermined pressure.

Hereinafter, the cylinder unit 300 according to an embodiment of the present invention will be described in detail with reference to FIGS. 3 to 7.

FIG. 3 is a view showing one embodiment of the cylinder unit of FIG. 2, and FIG. 4 is a side cross-sectional view showing one embodiment of the cylinder unit of FIG. 2. 3 to 4, the cylinder unit 300 may include a housing 320, a cylinder member 340, a detection member 360, and a control material 380.

The housing 320 has an interior space 322. A cylinder member 340 and a detection member 360 may be provided in the inner space 322 of the housing 320. The housing 320 may have a rectangular parallelepiped shape. However, the present invention is not limited thereto, and the cylinder member 340 and the detection member 360 may be deformed into various shapes that can be disposed. For example, the housing 320 may have a cylindrical shape with an open top.

The cylinder member 340 moves the object. For example, the cylinder member 340 may move the substrate W in the vertical direction. The cylinder member 340 may have a lift shaft 322 and a driver 344. The lifting shaft 322 extends from the inner space 322 of the housing 320 to the outside of the housing 320 and may be connected to the support unit 230. The lifting shaft 322 may have a circular shape when viewed from the top. For example, the lifting shaft 322 may have a pin shape. Further, the lifting shaft 322 may be provided as a non-conductor through which no current flows.

The driver 344 may provide driving force to the lifting shaft 322. The actuator 344 may provide air pressure to the lift shaft 322 or hydraulic pressure. That is, the cylinder member 340 may have a pneumatic cylinder or a hydraulic cylinder structure. However, the present invention is not limited thereto, and the driver 344 may be provided as a servo motor. Due to the driving force provided by the driver 344 to the lifting shaft 322, the lifting shaft 322 may be moved in the vertical direction. Accordingly, the support unit 230 connected to the lifting shaft 322 may move in the vertical direction to move the substrate W up and down.

The detection member 360 may detect whether the cylinder member 340 is normally driven or abnormally driven. For example, the detection member 360 may detect vibration of the lifting shaft 342 in the cylinder member 340. The detection member 360 may include a conductor 362, a conductor 364, a magnetic body 366, a galvanometer 368, and a control material 380.

The conductor 362 may be provided in a rod shape. The conductor 362 provided in a rod shape may be provided in a second direction 14 whose length direction is perpendicular to the first direction 12 in which the lifting shaft moves. Conductor 362 may engage cylinder member 340. For example, the conductor 362 may be coupled to one end of the lifting shaft 362 of the cylinder member 340 in the inner space 322 of the housing 320. Accordingly, the conductor 362 may be moved up and down along with the lifting shaft 362, and may be moved at the same speed as the moving speed of the lifting shaft 362. In addition, the conductor 362 is electrically connected to the conductor 364 to be described later, and may form a closed circuit together with the conductor 364.

The conductor 364 is electrically connected to the conductor 362. The conductor 364 is located in the inner space 322 of the housing 320 and may form a closed circuit together with the conductor 362. The conductor 364 may include a first conductor 364a, a second conductor 364b, and a third conductor 364c.

The first conductor 364a may be provided parallel to the longitudinal direction of the elevating shaft 342. The second conductor 364b is spaced a predetermined distance from the first conductor 364a and may be provided in parallel with the first conductor 364a. For example, the first conductor 364a and the second conductor 364b may be arranged to be spaced apart in the second direction 14 perpendicular to the first direction 12, which is a direction in which the lifting shaft moves. In addition, the first conductor 364a and the second conductor 364b may be disposed to face each other with the lifting shaft 342 interposed therebetween. The third conductor 364c may connect the first conductor 364a and the second conductor 364b. The third conductor 364c may be provided vertically in the second direction 14 perpendicular to the first direction 12.

The magnetic body 366 may be provided in a plate shape. For example, the magnetic body 366 may be provided in a plate shape so that one surface has an N pole and the other surface has an S pole. The magnetic body 366 may be arranged in the third direction 16 perpendicular to the first conductor 12 and the second direction 14 in the aforementioned conductor 364 and the magnetic body 366. For example, the magnetic body 366 may be arranged to face the conductor 362 with the conductor 364 interposed therebetween. The width of the magnetic body 366 based on the second direction 14 may be equal to or greater than the distance between the first conductor 364a and the second conductor 364b. In addition, the height of the magnetic body 366 based on the first direction 12 may be equal to or greater than the length of the first conductor 364a or the second conductor 364b. That is, the first conductor 364a and the second conductor 364b may be disposed to overlap the magnetic body 366 when viewed in the third direction 16.

The magnetic body 366 may provide magnetic flux to the closed circuit formed by the conductor 362 and the conductor 364. For example, the magnetic body 366 may provide magnetic flux in the third direction 16 to the closed circuit formed by the conductor 362 and the conductor 364. Also, the magnetic flux provided by the magnetic body 366 may be uniformly provided in the closed circuit. For example, the magnetic flux provided by the magnetic body 366 to the closed circuit may have the same intensity and density regardless of the position in the closed circuit. In addition, the magnetic flux provided by the magnetic body 366 to the closed circuit may not change with time.

The galvanometer 368 may be installed on the conducting wire 364. For example, the galvanometer 368 may be installed on the third conductor 364c among the conductors 364. The galvanometer 368 can detect the current flowing in the conducting wire 364. For example, the galvanometer 368 can detect the induced current flowing in the conducting wire 364.

In the above-described example, the galvanometer 368 is described as being installed on the third conductor 364 of the conductors 364, but is not limited thereto. The galvanometer 368 may be located anywhere in the inner space 322 of the housing 320 if it is connected to the control material 380 and the closed circuit formed by the conductor 364 and the conductor 362. For example, if the galvanometer 368 is connected to the third conductor 364c and the control material 380, the galvanometer 368 may be located anywhere in the inner space 322 of the housing 320.

The control material 380 is generated by the movement of the conductor 362 and can measure the induced current flowing through the galvanometer 368. For example, the control member 380 may be connected to the galvanometer 368 to measure the magnitude and change of the induced current flowing through the galvanometer 368. In FIG. 3, the control member 380 is illustrated as being installed in the inner space 322 of the housing 320, but is not limited thereto, and is installed outside the housing 320, and may be connected to the galvanometer 368.

In the above-described example, it has been described that the control member 380 can measure the induced current flowing through the galvanometer 368, but is not limited thereto. For example, the control material 380 may be connected to the third conductor 364c to perform a function of inspecting the induced current flowing in the conductor 364 and a function of measuring the magnitude and change of the induced current. In this case, the galvanometer 368 can be omitted.

Hereinafter, a vibration detection method of an elevator shaft according to an embodiment of the present invention will be described in detail. 5 is a view showing a state in which the lifting shaft moves in the cylinder unit of FIG. 4.

The conductor 362 and the conductor 364 may be electrically connected. Accordingly, the conductor 362 and the conductor 364 may form a closed circuit. For example, the conductor 362 is connected to the lifting shaft 342 and may be provided to contact the conductor 364. Accordingly, the conductor 362 is moved together with the lifting shaft 342 and can be electrically connected to the conductor 364 in contact with the conductor 364.

. 예컨대, 자기 선속은 폐회로 내 위치에 관계 없이 동일한 크기 및 밀도를 가질 수 있다. 또한, 자성체(366)가 제공하는 자기 선속은 실린더 유닛(300)의 정단면도에서 바라 볼 때 수직한 방향으로 제공될 수 있다. 일 예로, 도 5에서는 실린더 유닛(300)의 정단면도에서 바라 볼 때 자기 선속이 제3방향(16)을 따라 들어가는 방향(In)으로 제공되는 것으로 도시하였다. 도체(362)는 승강축(342)에 결합되어 이동하면서 폐회로를 통과하는 자기 선속의 변화를 발생시키며, 이에 유도 전류(I)를 발생시킨다. 이때, 발생되는 유도 전류(I) 는 자속 변화에 반하는 유도 자기장을 만드는 방향으로 발생된다. 도 5에서는 자속 변화에 반하는 유도 자기장을 만들기 위하여 유도 전류(I)가 반시계 방향으로 발생된다.The magnetic flux provided by the magnetic body 366 may be applied to the closed circuit formed by the conductor 362 and the conductor 364. The magnetic flux provided by the magnetic body 366 may be uniformly provided within the closed circuit.

. For example, the magnetic flux may have the same size and density regardless of the position in the closed loop. In addition, the magnetic flux provided by the magnetic body 366 may be provided in a vertical direction when viewed from a front sectional view of the cylinder unit 300. For example, in FIG. 5, when viewed from the front sectional view of the cylinder unit 300, the magnetic flux is provided as the direction In which is entered along the third direction 16. The conductor 362 is coupled to the elevating shaft 342 to generate a change in magnetic flux passing through the closed circuit while moving, thereby generating an induced current (I). At this time, the generated induction current (I) is generated in a direction to create an induced magnetic field against the change in magnetic flux. In Fig. 5, an induced current I is generated in a counterclockwise direction to create an induced magnetic field against the change in magnetic flux.

When explaining Lenz's Law, the principle in which the induced current (I) is generated, the induced current (inductive electromotive force) generated in an electric circuit occurs in a direction to create an induced magnetic field against the change in magnetic flux passing through the closed circuit. do. For example, in order to create an induced magnetic field that can increase the magnetic flux passing through the closed circuit, the induced current flows in the appropriate direction. If this is described in connection with the configuration of the present invention is as follows.

)은 아래와 같다. The magnetic flux passing through the closed circuit formed by the conductor 362 and the conductor 364 (

) Is as follows.

)의 변화에 기인하고, 자기장(

)은 일정하므로

이고, 여기서,

이다.When the moving conductor 362 is configured as part of a closed circuit, the magnetic flux passing through the closed circuit is the area of the closed circuit (

), And the magnetic field (

) Is constant

And here,

to be.

The induced electromotive force generated by the movement of the conductor 362 is as follows.

In addition, the induced current I generated by the movement of the conductor 362 is as follows.

), 그리고 도체(362)의 길이(l)은 일정하므로, 즉, 도체(362)가 이동하여 발생시키는 유도 전류(I)의 크기는 도체(362)의 이동 속도(v)에 따라 달라질 수 있다. 예컨대, 도체(362)의 이동속도(v)가 일정한 경우에는 유도 전류(I)의 크기가 일정하게 발생하고, 도체(362)의 이동속도(v)가 일정하지 않거나, 도체(362)와 결합된 승강축(342)에 진동이 발생하는 경우에는 유도 전류(I)의 크기가 일정하지 않게 발생한다.Here, the internal resistance (R) of the conductor 362, the magnetic field (

), And since the length (l) of the conductor 362 is constant, that is, the magnitude of the induced current I generated by the movement of the conductor 362 may vary depending on the moving speed v of the conductor 362. . For example, when the moving speed v of the conductor 362 is constant, the magnitude of the induced current I occurs constantly, and the moving speed v of the conductor 362 is not constant, or is combined with the conductor 362 When vibration occurs in the lift shaft 342, the magnitude of the induced current I is not uniform.

6 is a graph showing the state of induced current generated when the cylinder unit is operating normally, and FIG. 7 is a graph showing the state of induced current generated when the cylinder unit is operated abnormally.

6 and 7, the control unit 380 may set a set value S1 and a reference value S2 according to a user's request. The set value S1 may mean the magnitude of the induced current I generated when the cylinder unit 300 is normally driven. In addition, the set value S1 may have a preset error range. In addition, the set value S1 may be set during initial installation of the substrate processing apparatus 1000. For example, when the cylinder unit 300 is installed in the substrate processing apparatus 1000, the set value S1 may be set based on the magnitude of the induced current I generated according to the initial moving speed of the elevating shaft 342. The reference value S2 may mean a reference value for determining whether to amplify the measured value of the induced current I generated by driving the cylinder unit 300.

When the cylinder unit 300 is normally driven, the lifting shaft 342 may move at a constant speed. Accordingly, the conductor 362 coupled to the lifting shaft 342 can also move at a constant speed. In this case, the magnitude of the induced current I generated may be constantly generated according to time t. On the other hand, when the cylinder unit 300 is abnormally driven, the lifting shaft 342 may move at a constant speed or vibration may occur in the lifting shaft 342. Accordingly, the conductor 362 coupled to the lifting shaft 342 may also move at a constant speed or the movement path may not be constant due to vibration. In this case, the magnitude of the induced current I generated may be generated inconsistently with time t.

The control material 380 may measure the magnitude and change of the induced current I flowing through the galvanometer 368. That is, the control unit 380 may determine whether the cylinder unit 300 is normally driven by measuring the magnitude and change of the induced current I flowing through the galvanometer 368. For example, when the control unit 380 compares the measured value of the induced current I with a preset set value S1, and the measured value of the induced current I is determined to be within the range of the preset set value S1 It can be determined that the cylinder unit 300 is normally driven. In addition, the control unit 380 compares the measured value of the induced current (I) with a preset set value (S1), and when the measured value of the induced current (I) deviates from the preset set value (S1), the cylinder unit It may be determined that the 300 is abnormally driven. In this case, the control member 380 can generate a signal. The signal can be generated in various ways so that the operator can recognize it through visual or hearing.

In addition, when the measured value of the induced current I is smaller than the preset reference value S2, the control unit 380 amplifies the measured value of the induced current I to determine whether to deviate from the set value S1. Can be. Accordingly, even when the measured value of the induced current I is fine (only a few mmA), it is possible to detect abnormal driving of the lifting shaft 342.

In addition, the magnitude of the induced current I is independent of the normal driving of the elevating unit 300 at the time at which the elevating shaft 342 starts to operate (0 to t1) and the time at which the operation ends (t2 to t3) It may not correspond to the set value (S1). Accordingly, the control unit 380 may start to measure the measured value of the induced current I after a predetermined time has elapsed since the lifting shaft 342 was operated. In addition, the control unit 380 may finish measuring the measured value of the induced current I after a predetermined time has elapsed from the time when the magnitude of the induced current I is measured. For example, the control material 380 may set a time point t1 at which to start measuring the magnitude of the induced current I and a time point t2 at which the measurement is finished. For example, the starting point t1 of measuring the magnitude of the induced current I may be a point at which the lifting shaft 342 starts moving and reaches a maximum moving speed, and then moves at a constant speed. In addition, the time point t2 when the measurement of the magnitude of the induced current I is completed may be a time point at which the moving speed of the lifting shaft 342 decreases.

Conventional substrate processing apparatuses are not provided with a member capable of detecting such an abnormal drive when the lift shaft is abnormally driven (for example, when the lift shaft moves at a constant speed or when vibration occurs). Accordingly, the operator had to discover abnormal driving of the lifting shaft through the naked eye or hearing. However, this method has a problem in that the discovery of abnormal driving is delayed or may not be found in some cases depending on the work skill of the operator. Accordingly, follow-up measures such as device maintenance are delayed. In addition, when the lifting shaft is abnormally driven, the substrate on which the lifting shaft moves due to vibration may not be positioned at the correct position. In this case, the substrate supported on the support plate may not be uniformly processed. That is, when the abnormal driving of the lifting shaft is delayed and the time of the abnormal driving of the lifting shaft increases, a number of substrates in which processing is not properly performed may be generated.

However, according to one embodiment of the present invention, the conductor 362 moving together with the lifting shaft 342 forms a closed circuit with the conductor 364. Normal driving and abnormal driving of the lifting shaft 342 may be determined through the magnetic flux provided in the closed circuit and the induced current I generated by the movement of the conductor 362. When the lifting shaft 342 is determined to be abnormal driving, since the control unit 380 immediately generates a signal, the operator can recognize abnormal driving such as vibration generated in the lifting shaft 342 early. Thus, it is possible to minimize the time required for maintenance work of the substrate processing apparatus by minimizing the time required for checking abnormal operation.

In addition, according to the present invention, it is possible to minimize the time during which the substrate is deviated from the normal position due to the abnormal driving of the lifting shaft, thereby minimizing the production of a substrate that is not properly processed. Accordingly, the accuracy and efficiency of the substrate processing process can be improved.

In the above-described example, the magnetic flux provided to the closed circuit is described as an example in which it is provided in the direction (In) entering along the third direction 16, but is not limited thereto. For example, referring to FIG. 8, the magnetic body 366 may be provided such that the N pole and the S pole are positioned in opposite directions to the magnetic body 366 illustrated in FIG. 4. In this case, as illustrated in FIG. 9, the magnetic flux provided to the closed circuit may be provided in the direction Out along the third direction 16. In this case, when the conductor 362 moves downward, the induced current I may be generated to flow counterclockwise.

In the above-described example, it has been described as an example that the detection member 360 is provided to the cylinder unit 300 for moving the support unit 230 up and down, but is not limited thereto. For example, the detection member 360 may be provided in various cylinder units used to linearly move the object.

In the above-described example, an apparatus for processing a substrate using plasma has been described as an example, but is not limited thereto. For example, it may be applied to various substrate processing apparatuses that perform a process (deposition, exposure, ashing, cleaning, etc.) of processing a substrate.

The above detailed description is to illustrate the present invention. In addition, the above-described content is to describe and describe preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications and environments. That is, it is possible to change or modify the scope of the concept of the invention disclosed herein, the scope equivalent to the disclosed contents, and / or the scope of the art or knowledge in the art. The above-described embodiments describe the best state for realizing the technical spirit of the present invention, and various changes required in specific application fields and uses of the present invention are possible. Therefore, the detailed description of the above invention is not intended to limit the present invention to the disclosed embodiments. In addition, the appended claims should be construed to include other embodiments.

200: process processing unit
300: cylinder unit
400: plasma generator
600: exhaust

Claims (25)

In the apparatus for processing a substrate,
A chamber having a processing space therein;
A gas supply unit supplying gas to the processing space;
A support unit having a support plate on which a seating surface for supporting the substrate is formed;
It includes a cylinder unit for moving the substrate by raising and lowering the support unit,
The cylinder unit,
A housing having an interior space;
A cylinder member extending from the inner space of the housing to the outside of the housing and having a lift shaft connected to the support unit;
Including the detection member for detecting the vibration of the lifting shaft in the cylinder member,
The detection member,
A conductor positioned in the interior space and coupled to the lifting shaft;
A conductor positioned in the interior space, electrically connected to the conductor, and forming a closed circuit with the conductor;
A magnetic body that provides magnetic flux to the closed circuit;
A substrate processing apparatus including a galvanometer installed in the closed circuit. According to claim 1,
The conductor,
A first conductor provided parallel to the lifting shaft;
A second conductor spaced a predetermined distance from the first conductor and parallel to the first conductor;
And a third conductor connecting the first conductor and the second conductor. According to claim 2,
The galvanometer is installed on the third conductor,
The conductor is a substrate processing apparatus that is electrically connected to the first conductor and the second conductor. According to claim 3,
The first conductor and the second conductor are substrate processing apparatuses that are disposed to face each other with the elevation shaft interposed therebetween. The method of claim 4,
The magnetic body is provided in a plate shape,
The width of the magnetic body is equal to or greater than the distance between the first conductor and the second conductor,
The height of the magnetic material is equal to or greater than the length of the first conductor or the second conductor. The method of claim 5,
The lifting shaft moves in the first direction,
The first conductor and the second conductor are arranged to be spaced apart in a second direction perpendicular to the first direction,
The plate is a substrate processing apparatus arranged in a third direction perpendicular to the first direction and the second direction. The method of claim 6,
The conductor is provided in the shape of a rod and its longitudinal direction is the second direction,
When viewed from the third direction, the first conductor and the second conductor are disposed to overlap the plate. The method of claim 7,
The magnetic material is a substrate processing apparatus for providing the magnetic flux in the third direction. The method according to any one of claims 1 to 8,
The cylinder unit,
Further comprising a control material for measuring the magnitude and change of the induced current flowing through the galvanometer generated by the movement of the conductor,
The control material,
A substrate processing apparatus that generates a signal when the measured value of the induced current deviates from a preset value. The method of claim 9,
The control material,
When the measured value of the induced current is smaller than a preset reference value, the substrate processing apparatus determines whether to amplify the measured value and deviate from the set value. The method of claim 9,
The control material,
A substrate processing apparatus for measuring the measured value after a predetermined time has elapsed from the time when the lifting shaft is operated. In the cylinder unit for moving the object,
A housing having an interior space;
A cylinder member extending from the inner space of the housing to the outside of the housing and having a lift shaft for moving an object;
Including the detection member for detecting the vibration of the lifting shaft in the cylinder member,
The detection member,
A conductor positioned in the interior space and coupled to the lifting shaft;
A conductor located in the interior space, electrically connected to the conductor, and forming a closed circuit with the conductor;
A magnetic body that provides magnetic flux to the closed circuit;
Cylinder unit including a galvanometer installed in the closed circuit. The method of claim 12,
The conductor,
A first conductor provided parallel to the lifting shaft;
A second conductor spaced a predetermined distance from the first conductor and parallel to the first conductor;
A cylinder unit including a third lead connecting the first lead and the second lead. The method of claim 13,
The galvanometer is installed on the third conductor,
The conductor is a cylinder unit electrically connected to the first conductor and the second conductor. The method of claim 14,
The magnetic body is provided in a plate shape,
The width of the magnetic body is equal to or greater than the distance between the first conductor and the second conductor,
The height of the magnetic body is the same or greater than the length of the first conductor or the second conductor cylinder unit. The method of claim 15,
The lifting shaft moves in the first direction,
The first conductor and the second conductor are arranged to be spaced apart in a second direction perpendicular to the first direction,
The plate is a cylinder unit arranged in a third direction perpendicular to the first direction and the second direction. The method of claim 16,
The conductor is provided in the shape of a rod and its longitudinal direction is the second direction,
When viewed from the third direction, the first conductor and the second conductor are arranged to overlap the plate. The method of claim 7,
The magnetic body is a cylinder unit that provides the magnetic flux in the third direction. The method according to any one of claims 12 to 18,
The cylinder unit,
Further comprising a control material for measuring the magnitude and change of the induced current flowing through the galvanometer generated by the movement of the conductor,
The control material,
A cylinder unit that generates a signal when the measured value of the induced current deviates from a preset value. The method of claim 19,
The control material,
When the measured value of the induced current is smaller than a preset reference value, the cylinder unit amplifies the measured value and determines whether or not the set value is deviated. The method of claim 20,
The control material,
A cylinder unit that measures the measured value after a preset time has elapsed from the time when the lifting shaft is operated. Vibration of the lifting shaft for moving the substrate up and down is detected by the cylinder member for linearly moving the object,
A vibration detection method for detecting vibration of the lifting shaft based on a measured value of an induced current generated by movement of the lifting shaft having a conductor in the cylinder member provided with magnetic flux. The method of claim 22,
The above method,
A vibration detection method that generates a signal when the measured value of the induced current deviates from a preset value. The method of claim 22,
The above method,
When the measured value of the induced current is smaller than a predetermined reference value, a vibration detection method for amplifying the measured value to determine whether or not the set value is deviated. The method of claim 22,
The above method,
Vibration detection method for measuring the measured value after a predetermined time has elapsed from the time when the lifting shaft is operated.

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