KR20200034409A - Sterilization module and water purifier the same - Google Patents

Abstract

According to an embodiment of the present invention, a sterilization module comprises: a circuit board including the top surface and the bottom surface; a first and a second electrode pad placed on the top surface of the circuit board; a light emitting device placed on the first and second electrode pads; a first molding unit placed on the top surface of the circuit board and a side surface of the light emitting device; a plurality of connecting pads placed on the bottom surface of the circuit board; a component unit placed on the connecting pad and including a plurality of resistance and switching devices; and a second molding unit surrounding the bottom surface of the circuit board and the component unit. The first and second electrode patterns are electrically connected to the plurality of connecting pads through a via hole which penetrates the circuit board. The light emitting device and the component unit do not overlap in a vertical direction but are separated from each other. Therefore, the provided sterilization module can provide improved waterproof and moistureproof properties.

Description

Sterilization module and water purifier including the same {STERILIZATION MODULE AND WATER PURIFIER THE SAME}

The embodiment relates to a sterilizing module and a water purifier comprising the same.

Light emitting devices including compounds such as GaN and AlGaN have many advantages such as having a wide and easy to adjust bandgap energy, and are used in various fields.

Light emitting devices such as light emitting diodes or laser diodes using Group 3-5 or 2-6 compound semiconductor materials are developed into thin film growth technology and device materials, resulting in yellow, red, green, There is an advantage that can realize light in various wavelength bands such as blue and ultraviolet light. In addition, a light emitting device such as a light emitting diode or a laser diode using a group 3-5 or 2-6 compound semiconductor material can use a fluorescent material or combine colors to implement a white light source with high efficiency. Such a light emitting device has advantages of low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps.

In particular, in the case of a light emitting device that emits ultraviolet rays, light having a relatively large wavelength can be emitted from the active layer of the light emitting device. In detail, the light emitting device may emit light having a relatively short peak wavelength band, for example, about 400 nm or less, and the active layer may include a material having a corresponding band gap energy. The light emitting device may be used for sterilization and purification for short wavelengths in the wavelength band, and may be used for an exposure machine or a curing machine for long wavelengths.

Recently, short-wavelength light emitting devices have been applied to various fields to sterilize harmful organisms such as bacteria, ticks, and infectious diseases or to purify contaminated water. In this case, the light emitting device is disposed in water or placed in a high-humidity environment with high humidity, and there is a problem in that the light-emitting device may be defective due to deterioration of the waterproof and moisture-proof functions and the operation reliability may be deteriorated.

In addition, when the light emitting device is disposed inside the device and is not viewed from the outside, it may be difficult to determine the operating state of the light emitting device. That is, the device must be disassembled to check the operating state or damage of the light emitting device, and in this case, a lot of time and cost may occur.

In addition, the light emitting device may emit ultraviolet rays, and the ultraviolet rays are not visible to the user's eyes and are harmful to the human body. Therefore, it is difficult for a user to intuitively check whether a light emitting device is operating without a light receiving device or the like.

Therefore, a new structure with improved waterproof and moisture-proof properties is required, and a new sterilization module that can be disposed inside the device to check the operating state is required.

The embodiment seeks to provide a sterilization module with improved water and moisture resistance.

In addition, the embodiment is intended to provide a sterilization module having improved reliability by external impact.

In addition, the embodiment is intended to provide a sterilization module that can effectively grasp the operating state.

In addition, the embodiment is to provide a sterilization module capable of effectively sterilizing the water discharge pipe and the water discharge coke of the water purifier.

In addition, the embodiment is to provide a sterilizing module capable of sterilizing the water storage tank of the water purifier and the purified water contained in the water storage tank, and having an improved water resistance in the water storage tank.

The sterilization module according to the embodiment includes a circuit board including an upper surface and a lower surface, first and second electrode pads disposed on the upper surface of the circuit board, light emitting devices disposed on the first and second electrode pads, and the circuit A first molding portion disposed on the upper surface of the substrate and the side surface of the light emitting element, a plurality of connection pads disposed on the lower surface of the circuit board, and a component portion disposed on the connection pad and including a plurality of resistors and switching elements And a second molding part surrounding the lower surface of the circuit board and the component part, wherein the first and second electrode patterns are electrically connected to the plurality of connection pads through via holes penetrating the circuit board, and the light emitting device. And the component parts are spaced apart without overlapping in the vertical direction.

The sterilization module according to the embodiment may have improved waterproof and moisture proof properties. In detail, the sterilization module can effectively seal between the circuit board and the light emitting device, and between the circuit board and the component part through a molding part, so that the light emitting device can be operated while maintaining reliability from moisture and moisture. Accordingly, the sterilizing module can have excellent waterproofing power even when left in the water for a long time, and can operate in the same way only in water.

In addition, the sterilization module according to the embodiment may be disposed on a water purifier to sterilize the water discharge pipe and the water discharge coke through which the purified water of the water purifier flows. In detail, after purified water is discharged through the water discharge pipe of the water purifier, residual moisture may remain in the water discharge coke and the water discharge pipe. The sterilization module according to the embodiment may irradiate ultraviolet rays to the water discharge coke and the water discharge pipe, and sterilize bacteria and the like flowing from the outside of the water discharge coke. Accordingly, it is possible to prevent bacteria and the like from being included in the purified water that is additionally extracted after the purified water is discharged. It can emit, and the ultraviolet rays are not visible to the user's eyes and are harmful to the human body. Therefore, it is difficult for a user to intuitively check whether a light emitting device is operating without a light receiving device or the like.

Therefore, a new structure with improved waterproof and moisture-proof properties is required, and a new structure that can be placed inside the device to check its operating status.

In addition, the sterilization module according to the embodiment may be connected to the control unit of the water purifier. In detail, the sterilization module may include a component capable of scaling down the output voltage to correspond to the input of the controller of the water purifier, and based on the output voltage of the sterilization module, the sterilization module's normal state, short state, open I can grasp the state. Accordingly, the embodiment can check whether the operation is performed without disassembling a separate water purifier in order to check whether the sterilization module is operating.

1 is a plan view of a sterilization module according to an embodiment.
2 is a bottom view of the sterilization module according to the embodiment.
3 is a bottom view showing a connection pad of the sterilization module according to the embodiment.
4 is a cross-sectional view AA 'of the sterilization module of FIG. 1.
5 is a cross-sectional view taken along line BB 'of the sterilization module of FIG. 2.
6 is a circuit diagram of a sterilization module according to an embodiment.
7 is a cross-sectional view showing an example of a light emitting device applied to a sterilization module according to an embodiment.
8 is a cross-sectional view of a sterilizing module according to an embodiment applied to a water purifier.
9 and 10 are enlarged views of the area A1 of FIG. 8.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical spirit of the present invention is not limited to some embodiments described, but may be implemented in various different forms, and within the scope of the technical spirit of the present invention, one or more of its components between embodiments may be selectively selected. It can be used by bonding and substitution.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless clearly defined and specifically described, can be generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as a meaning, and terms that are commonly used, such as predefined terms, may be interpreted by considering the contextual meaning of the related technology.

In addition, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In the present specification, a singular form may also include a plural form unless specifically stated in the phrase, and is combined as A, B, C when described as "at least one (or more than one) of A and B, C". It can contain one or more of all possible combinations.

In addition, in describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the component from other components, and the term is not limited to the nature, order, or order of the component. And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also to the component It may also include a case of 'connected', 'coupled' or 'connected' due to another component between the other components.

Further, when described as being formed or disposed in the "top (top) or bottom (bottom)" of each component, the top (top) or bottom (bottom) is one as well as when the two components are in direct contact with each other It also includes a case in which another component described above is formed or disposed between two components. In addition, when expressed as "up (up) or down (down)", it may include the meaning of the downward direction as well as the upward direction based on one component.

In addition, before describing the embodiments of the present invention, the horizontal direction may mean an x-axis direction illustrated in the drawing and a y-axis direction perpendicular to the x-axis direction, and the vertical direction may be a z-axis direction illustrated in the drawing. It may be a direction perpendicular to the x-axis and y-axis directions.

1 is a plan view of a sterilization module according to the embodiment, FIG. 2 is a bottom view of the sterilization module according to the embodiment, and FIG. 3 is a bottom view showing a connection pad of the sterilization module according to the embodiment. In addition, FIG. 4 is an A-A 'sectional view of the sterilization module of FIG. 1, and FIG. 5 is a B-B' sectional view of the sterilization module of FIG. 2.

1 to 5, the sterilization module 1000 according to the embodiment includes a circuit board 100, a first electrode pad 210 and a second electrode pad (disposed on an upper surface of the circuit board 100) 220), a light emitting device 500, a plurality of connection pads 310 to 370 disposed on the other surface of the circuit board, and a component part 450.

The sterilization module 1000 may include a circuit board 100 and a light emitting device 500 disposed on the circuit board 100. The circuit board 100 may be electrically connected to the light emitting device 500. One or a plurality of light emitting devices 500 may be disposed on the circuit board 100. The circuit board 100 may be a circuit pattern printed on an insulator. The circuit board 100 is at least one of a PCB (MCPCB, Metal Core PCB) having a metal core, a non-flexible PCB, a flexible PCB (FPCB, flexible PCB), and a ceramic material made of a resin material. It can contain one. The circuit board 100 may include a layer of a resin material or a ceramic-based layer, and the resin material is a heat-curable resin including silicone or epoxy resin, or a plastic material, or a high heat resistance and high light resistance material. Can be formed. The ceramic material may include low temperature co-fired ceramic (LTCC) or high temperature co-fired ceramic (HTCC), which are simultaneously fired.

The circuit board 100 may include a plurality of side surfaces. For example, the circuit board 100 may include a first side (S1) and a second side (S2) facing the first side (S1), the first side (S1) and the first It may include a third side (S3) and a fourth side (S4) connecting the two side (S2). The first side surface S1 and the second side surface S2 may be side surfaces facing each other in the x-axis direction, and the third side surface S3 and the fourth side surface S4 may face each other in the y-axis direction. It can be a side. The third side surface S3 and the fourth side surface S4 may be side surfaces connecting the first side surface S1 and the second side surface S2.

The circuit board 100 may have lengths in the x-axis and y-axis directions. The length in the x-axis direction of the circuit board 100 may be different from the length in the y-axis direction of the circuit board 100. For example, the length in the x-axis direction of the circuit board 100 may be shorter than the length in the y-axis direction of the circuit board 100. The length of the circuit board 100 in the x-axis direction may correspond to an interval between the first side surface S1 and the second side surface S2. The length of the circuit board 100 in the y-axis direction may correspond to an interval between the third side surface S3 and the fourth side surface S4.

A first protective layer 101 is disposed on an upper surface of the circuit board 100, and the first protective layer 101 may be a layer disposed on a base layer made of a resin, ceramic, or metal material of the circuit board 100. have. The first protective layer 101 is an insulating layer and may include a solder resist material or a resin material. In one example, the first protective layer 101 may include a white photo solder resist (PSR). A plurality of electrode pads exposed from the first protective layer 101 may be disposed on the top surface of the circuit board 100.

The first electrode pad 210 and the second electrode pad 220 spaced apart from each other may be disposed on the upper surface of the circuit board 100. The first electrode pad 210 and the second electrode pad 220 may have different polarities.

The first electrode pad 210 may be disposed spaced apart from the side surface of the circuit board 100. The first electrode pad 210 may be disposed adjacent to the first side surface S1 and the third side surface S3. In one example, the first electrode pad 210 may be spaced apart by a distance in the x-axis direction defined by the first distance from the first side surface S1 and from the first distance from the second side surface S2. They can be separated by long distances. In addition, the first electrode pad 210 may be spaced apart by a distance in the y-axis direction defined by a second distance from the third side surface S3, and a distance longer than the second distance from the fourth side surface S4. As far as it can be.

The second electrode pad 220 may be disposed spaced apart from the side surface of the circuit board 100. The second electrode pad 220 may be disposed adjacent to the first side S1, the second side S2, the third side S3, and the fourth side S4.

The first electrode pad 210 may have a length in the x-axis direction and the y-axis direction. For example, the length of the first electrode pad 210 in the x-axis direction may be shorter than the length of the second electrode pad 220 in the x-axis direction, and about the length of the second electrode pad 220 in the x-axis direction. 50% or less. In addition, the length of the first electrode pad 210 in the y-axis direction may be shorter than the length of the second electrode pad 220 in the y-axis direction, and about 70 of the length of the second electrode pad 220 in the y-axis direction %. Accordingly, the first electrode pad 210 on the top surface of the circuit board 100 may have a smaller area than the second electrode pad 220.

The light emitting device 500 may be disposed on the circuit board 100. The light emitting device 500 may emit ultraviolet light. For example, the light emitting device 500 may emit light of about 400 nm or less, and emit ultraviolet rays in the UV-A, UV-B and UV-C region. One or a plurality of light emitting chips may be disposed in the light emitting device 500, but is not limited thereto.

The light emitting device 500 may be disposed adjacent to a side surface of the circuit board 100. The light emitting device 500 may be disposed spaced apart from the first side surface S1 by a predetermined distance, and may be disposed spaced apart from the second side surface S2 by a predetermined distance. The light emitting device 500 may be disposed closer to the first side surface S1 of the first side surface S1 and the second side surface S2. For example, the circuit board 100 is based on a center line connecting the centers of the third side surface S3 and the fourth side surface S4, the first area in the direction of the first side surface S1 and the A second region in the second side surface S2 direction may be included. The light emitting device 500 may be disposed on the first region. Accordingly, an interval between the light emitting device 500 and the first side surface S1 may be smaller than an interval between the light emitting device 500 and the second side surface S2. In addition, the light emitting device 500 may be disposed adjacent to the third side (S3) and the fourth side (S4).

A plurality of pads 571 and 572 may be disposed under the light emitting device 500. The light emitting device 500 may include a first pad 571 and a second pad 572 spaced apart from each other on the lower surface of the light emitting device 500. The first and second pads 571 and 572 may have different polarities. At least one of the first and second pads 571 and 572 may be disposed in a plurality to disperse the current path.

The light emitting device 500 may be disposed on the first electrode pad 210 and the second electrode pad 220. The light emitting device 500 may be electrically connected to the first electrode pad 210 and the second electrode pad 220. The light emitting device 500 may be partially overlapped with the first electrode pad 210 and the second electrode pad 220. For example, a portion of the lower surface of the light emitting device 500 may overlap the first electrode pad 210, and a portion of the lower surface of the light emitting device 500 may overlap the second electrode pad 220. In detail, the first pad 571 may be disposed to overlap the first electrode pad 210 to be electrically connected. The second pad 572 may be disposed to overlap the second electrode pad 220 to be electrically connected. At this time, a portion of the lower surface of the light emitting device 500 overlapping the first electrode pad 210 may have a smaller area than another portion of the lower surface overlapping the second electrode pad 220. That is, the light emitting device 500 may improve heat dissipation characteristics by increasing a contact area on the circuit board 100 with the second electrode pad 220 having a larger area than the first electrode pad 210. That is, the light emitting device 500 may include one first pad 571 and may include a plurality of second pads 572. That is, as a plurality of second pads 572 are disposed on the second electrode pad 220 having a larger area than the first electrode pad 210, current paths can be dispersed and an improved heat dissipation path is provided. It is possible to improve the electrical and heat dissipation characteristics of the light emitting device 500.

A first molding part 410 may be disposed on the light emitting device 500 and the circuit board 100. The first molding part 410 may be disposed on the first protective layer 101 and the light emitting device 500 of the circuit board 100, and may be disposed surrounding the side surface of the light emitting device 500. have. The first molding part 410 may be disposed between the circuit board 100 and the lower surface of the light emitting device 500 to improve adhesion between the circuit board 100 and the light emitting device 500. The first molding part 410 may directly contact the upper surface of the circuit board 100. For example, the first molding part 410 may directly contact the upper surface of the first protective layer 101 of the circuit board 100. In addition, the first molding part 410 may directly contact the lower surface of the light emitting device 500 and may directly contact the side surfaces of the first pad 571 and the second pad 572. Accordingly, the first molding part 410 may seal the electrode pads 210 and 220 exposed on the upper surface of the circuit board 100 from an external environment. In addition, the first molding part 410 may be disposed spaced apart from the top surface of the light emitting device 500. That is, the first molding part 410 may not be disposed on an upper surface from which light of the light emitting device 500 is emitted. Accordingly, it is possible to prevent the amount of light from being lowered by the first molding part 410, and it is possible to improve the bonding force and sealing force between the circuit board 100 and the light emitting device 500.

The first molding part 410 may include resin, silicone or epoxy. The first molding part 410 may be formed in a liquid-coated manner on the upper surface of the circuit board 100 and / or the side surfaces of the light emitting device 500. Accordingly, the first molding unit 410 may directly contact the top surface of the circuit board 100 and the side surface of the light emitting device 500, and the bottom surface of the light emitting device 500 and the circuit board 100 ) Is partially disposed in the space between the upper surfaces of the circuit board to seal the space between the circuit board 100 and the light emitting device 500. Therefore, it is possible to prevent foreign matter, moisture, and moisture from penetrating between the circuit board 100 and the light emitting device 500.

The circuit board 100 may have a plurality of via structures. The circuit board 100 includes a plurality of via holes h1 and h2 penetrating through an upper surface of the circuit board 100 on which the light emitting device 500 is disposed and a lower surface on which the connection pads 310 to 390 are disposed. can do. The electrode pads 210 and 220 may be electrically connected to the connection pads 310 to 390 through the via holes h1 and h2.

The via holes h1 and h2 may include a first via hole h1 and a second via hole h2 spaced apart from the first via hole h1. The first via hole h1 may be disposed adjacent to at least one side of the first side S1 and the third side S3. The first via hole h1 may be disposed under the first electrode pad 210. The first via hole h1 may overlap the first electrode pad 210 in a vertical direction. A plurality of first via holes h1 may be disposed on the circuit board 100, and a plurality of first via holes h1 may be spaced apart from each other.

The second via hole h2 may be disposed adjacent to at least one of the first side surface S1, the third side surface S3, and the fourth side surface S4. For example, the second via hole h2 may be disposed adjacent to the first side surface S1 and the fourth side surface S4, and in line with the first via hole h1 based on the y-axis direction. Can be placed on. The second via hole h2 may be disposed under the second electrode pad 220. The second via hole h2 may overlap the second electrode pad 220 in a vertical direction. A plurality of second via holes h2 may be disposed on the circuit board 100, and a plurality of second via holes h2 may be spaced apart from each other.

The second protective layer 102 is disposed on the lower surface of the circuit board 100, and the second protective layer 102 may be a layer disposed on the base layer of the circuit board. The second protective layer 102 is an insulating layer and may include a solder resist material or a resin material. A plurality of connection pads exposed from the second protective layer 102 may be disposed on the bottom surface of the circuit board 100. A plurality of connection pads 310 to 370 electrically connecting the component parts 450 including a plurality of resistors and switching elements may be disposed on the lower surface of the circuit board 100.

The plurality of connection pads 310 to 370 may be electrically connected to the first electrode pad 210 and the second electrode pad 220 through the first via hole h1 and the second via hole h2, and A first connection pad 310 and a second connection pad 320 may be respectively connected to the first via hole h1 and the second via hole h2.

The first connection pad 310 may be disposed on a region corresponding to the first electrode pad 210 in a vertical direction, and electrically connected to the first electrode pad 210 through the first via hole h1. Can be connected to. The first connection pad 310 has an x-axis direction and a y-axis length, and the length of the first connection pad 310 in the x-axis direction may be longer than the y-axis length.

The second connection pad 320 may be disposed on a region corresponding to the second electrode pad 220 in a vertical direction, and may be electrically connected to the second electrode pad 220 through the second via hole h2. Can be connected to. The second connection pad 320 may be disposed spaced apart from the first connection pad 310. In detail, the first connection pad 310 on the lower surface of the circuit board 100 may be disposed spaced apart from the second connection pad 320 in the x-axis direction and the y-axis direction. An interval in the x-axis direction between the first and second connection pads 310 and 320 may be greater than a distance in the y-axis direction.

The second connection pad 320 has a length in the x-axis direction and the y-axis direction, and the length in the x-axis direction of the second connection pad 320 may be longer than the length in the y-axis direction. Further, the length in the x-axis direction of the second connection pad 320 may be shorter than the length in the x-axis direction of the first connection pad 310, and the length in the y-axis direction of the second connection pad 320 may be the first. 1 may be shorter than the length of the connection pad 310 in the y-axis direction.

The area of the second connection pad 320 may be larger than the area of the first connection pad 310. That is, the light emitting device 500 according to the area of the second electrode pad 220 and the second connection pad 320 is larger than the area of the first electrode pad 210 and the first connection pad 310. ) Can effectively dissipate heat emitted from the components.

The connection pads 310 to 390 may further include third to fifth connection pads 330, 340, and 350.

The third connection pad 330 may be disposed adjacent to the first connection pad 310 and the second connection pad 320. The third connection pad 330 may be disposed between the first connection pad 310 and the second connection pad 320. The third connection pad 330 may be disposed to be spaced apart from the first connection pad 310 and the second connection pad 320. The third connection pad 330 may be disposed on an area where the first and second connection pads 310 and 320 are spaced apart in the x-axis direction.

The third connection pad 330 may have lengths in the x-axis and y-axis directions. In detail, the lengths in the x-axis and y-axis directions of the third connection pad 330 may be shorter than the lengths in the x-axis and y-axis directions of the first connection pad 310. In addition, the lengths in the x-axis and y-axis directions of the third connection pad 330 may be shorter than the lengths in the x-axis and y-axis directions of the second connection pad 320. That is, the third connection pad 330 may have an area smaller than that of the first and second connection pads 310 and 320.

The fourth connection pad 340 may be disposed adjacent to the first connection pad 310 and the third connection pad 330. The fourth connection pad 340 may be disposed spaced apart from the first connection pad 310 and the third connection pad 330 in the y-axis direction. The fourth connection pad 340 may be spaced apart from the second connection pad 320 in the x-axis direction.

The fifth connection pad 350 may be disposed adjacent to the second connection pad 320, the third connection pad 330, and the fourth connection pad 340. The fifth connection pad 350 may be disposed spaced apart from the first connection pad 310 and the third connection pad 330 in the y-axis direction. The fifth connection pad 350 may be spaced apart from the second connection pad 320 in the x-axis direction. The fifth connection pad 350 may be disposed adjacent to the second connection pad 320 than the fourth connection pad 340.

The sixth connection pad 360 may be disposed adjacent to the second connection pad 320 and the fourth connection pad 340. The sixth connection pad 360 is spaced apart from the first connection pad 310, the third connection pad 330, the fourth connection pad 340, and the fifth connection pad 350 in the y-axis direction. Can be arranged. In addition, the sixth connection pad 360 may be disposed spaced apart from the second connection pad 320 in the x-axis direction. The sixth connection pad 360 may be disposed adjacent to the second connection pad 320 than the fourth connection pad 340.

The seventh connection pad 370 may be disposed adjacent to the second connection pad 320, the fourth connection pad 340, the fifth connection pad 350, and the sixth connection pad 360. have. The seventh connection pad 370 is spaced apart from the first connection pad 310, the third connection pad 330, the fourth connection pad 340, and the fifth connection pad 350 in the y-axis direction. Can be arranged. In addition, the seventh connection pad 370 may be disposed to be spaced apart in the x-axis direction from the second connection pad 320 and the fourth connection pad 340. In the seventh connection pad 370, the second connection pad 320, the fourth connection pad 340, the fifth connection pad 350, and the sixth connection pad 360 are x-axis and y-axis. It may be disposed on a region formed spaced apart in the direction. The seventh connection pad 370 may have the smallest area among the plurality of connection pads 310-370.

The first connection pad 310 may include a first extension portion 310A for disposing the component portion 450 to be described later. The first extension portion 310A may be bent at an end of the first connection pad 310 and extend in the x-axis direction. The first extension part 310A may be disposed between the third connection pad 330 and the fourth connection pad 340. The first extension part 310A may be disposed to be spaced apart from the third connection pad 330 in the y-axis direction.

The fourth connection pad 340 may include a second extension part 340A and a third extension part 340B for arranging the component part 450. The second extension part 340A may extend in an x-axis direction from one end of the third connection pad 330. The second extension portion 340A is disposed adjacent to the first extension portion 310A and may be disposed between the third connection pad 330 and the fifth connection pad 350. The third extension part 340B may extend in the x-axis direction from the other end of the third connection pad 330. The third extension part 340B may be disposed between the fifth connection pad 350 and the sixth connection pad 360. The second extension portion 340A may be spaced apart from the third extension portion 340B. The second extension portion 340A and the third extension portion 340B may be spaced apart in the y-axis direction.

The fifth connection pad 350 may include a fourth extension portion 350A. The fourth extension part 350A may extend in an x-axis direction from an end of the fifth connection pad 350. The fourth extension portion 350A may extend toward the fourth connection pad 340 and be disposed between the second extension portion 340A and the third extension portion 340B. The fourth extension portion 350A may be disposed to be spaced apart from the second extension portion 340A and the third extension portion 340B. The fourth extension portion 350A may be disposed to be spaced apart in the y-axis direction from the second extension portion 340A and the third extension portion 340B.

The sixth connection pad 360 may include a fifth extension portion 360A. The fifth extension part 360A may extend in an x-axis direction from an end of the fifth connection pad 350. The fifth extension portion 360A may extend toward the second connection pad 320. The fifth extension portion 360A may be disposed adjacent to the third extension portion 340B and the second connection pad 320. The fifth extension portion 360A may be disposed to be spaced apart in the y-axis direction from the third extension portion 340B, the fifth connection pad 350, and the seventh connection pad 370, and the second extension portion 360A. The connection pad 320 may be spaced apart in the x-axis direction. The fifth extension portion 360A may be disposed adjacent to the third extension portion 340B than the fifth connection pad 350.

The seventh connection pad 370 may be disposed between the second connection pad 320, the third extension portion 340B, the fifth connection pad 350, and the fifth extension portion 360A. .

A component part 450 may be disposed on the circuit board 100. The component part 450 may be disposed on the lower surface of the circuit board 100. The component unit 450 may include a component that converts power input from the outside into power for driving the light emitting device 500, for example, a capacitor, a transformer, a switching element, and a plurality of resistors.

The component part 450 may be disposed adjacent to a side surface of the circuit board 100. The component part 450 may be disposed spaced apart from the first side surface S1 by a predetermined distance, and may be disposed spaced apart from the second side surface S2 by a predetermined distance. The component part 450 may be disposed closer to the second side S2 of the first side S1 and the second side S2. For example, the circuit board 100 may include a first region in the first side S1 direction and the first region based on a center line connecting the centers of the third side S3 and the fourth side S4. It may include a second region in the side (S2) direction. The component part 450 may be disposed on the second region. Accordingly, an interval between the component part 450 and the second side surface S2 may be smaller than an interval between the component part 450 and the first side surface S1. In addition, the component part 450 may be disposed adjacent to the third side S3 and the fourth side S4.

The component part 450 may be spaced apart from the light emitting device 500. In detail, the light emitting device 500 may be disposed on a first region of the upper surface of the circuit board 100, and the component part 450 may be disposed on a second region of the lower surface of the circuit board 100. have. That is, the component part 450 may be disposed on an area that does not overlap the light emitting device 500 in a vertical direction. The light emitting device 500 may be disposed adjacent to the first side surface S1 of the circuit board 100, and the component part 450 may include the second side surface opposite to the first side surface S1 ( S2). Accordingly, when heat emitted from the light emitting device 500 moves through the electrode pads 210 and 220 and the connection pads 310 to 390, a longer heat dissipation path may be provided, and the heat may cause the heat. Heat shock applied to the component part 450 may be minimized.

The component part 450 includes a plurality of components disposed on the connection pad, and the plurality of components can be electrically connected to the connection pads 310 to 390.

The component part 450 may include a first component D1. The first component D1 may include an element that protects the light emitting device 500 and the circuit board 100 from electrostatic discharge (ESD) or when an overvoltage is introduced into the sterilization module 1000. In one example, the first component D1 may include a TVS diode. The first component D1 may be disposed on the first connection pad 310 and the fourth connection pad 340, and the first connection pad 310 and the fourth connection pad 340 may be disposed. It can be electrically connected.

The component part 450 may include a second component Q1. The second component Q1 may include a switching element. The second component Q1 may be disposed on the second connection pad 320, the third connection pad 330 and the fifth connection pad 350. The second component Q1 may be disposed on one end of the second connection pad 320 and the third connection pad 330 and one end of the fifth connection pad 350. The second component Q1 may be electrically connected to the second connection pad 320, the third connection pad 330, and the fifth connection pad 350.

The component part 450 may include a first resistor R1. The first resistor R1 may be disposed on the first connection pad 310 and the third connection pad 330. The first resistor R1 may be disposed on the other ends of the first extension portion 310A and the third connection pad 330. The first resistor R1 may be electrically connected to the first connection pad 310 and the third connection pad 330. The first resistor R1 may adjust the current and voltage applied to the second component Q1.

The component part 450 may include a second resistor R2. The second resistor R2 may be disposed on the fourth connection pad 340 and the fifth connection pad 350. The second resistor R2 may be disposed on the third extension portion 340B and the fourth extension portion 350A. The second resistor R2 may be electrically connected to the fourth connection pad 340 and the fifth connection pad 350. The second resistor R2 may adjust the driving current of the light emitting device 500.

The component part 450 may include a third component U1. The third component U1 may include a voltage regulator. The third component U1 may be disposed on the third connection pad 330, the fourth connection pad 340, and the fifth connection pad 350. The third component U1 may be disposed on the third connection pad 330 and the second extension portion 340A and the fifth connection pad 350. The third component U1 may be electrically connected to the third connection pad 330, the fourth connection pad 340, and the fifth connection pad 350. The third component U1 may maintain the voltage at both ends of the second resistor R2 within a predetermined range. The third component U1 may maintain voltages at one end and the other end of the second resistor R2.

The component part 450 may include at least one distribution resistor for lowering the output voltage. The component part 450 may further include third to fifth resistors R3, R4, and R5. The third to fifth resistors R3, R4, and R5 may be distribution resistors for scaling down the output voltage to a set voltage. The third resistor R3 may be disposed on the second connection pad 320 and the seventh connection pad 370. The third resistor R3 is disposed on one end of the second connection pad 320 and the seventh connection pad 370 and is electrically connected to the second connection pad 320 and the seventh connection pad 370. Can be connected to. The fourth resistor R4 may be disposed on the sixth connection pad 360 and the seventh connection pad 370. The fourth resistor R4 is disposed on the other end of the fifth extension portion 360A and the seventh connection pad 370 to be electrically connected to the sixth connection pad 360 and the seventh connection pad 370. Can be connected to. The fifth resistor R5 may be disposed on the fourth connection pad 340 and the sixth connection pad 360. The fifth resistor R5 may be disposed on the third extension portion 340B and the fifth extension portion 360A to be electrically connected to the fourth connection pad 340 and the sixth connection pad 360. have. The third to fifth resistors R3, R4, and R5 may be connected in series.

A connector unit 600 may be disposed on the circuit board 100. The connector unit 600 may be a connector for connecting the sterilization module 1000 and the external control unit according to the embodiment. The connector unit 600 may be disposed on the lower surface of the circuit board 100. The connector unit 600 may be disposed on the connection pads 310 to 390 and electrically connected to the connection pads 310 to 390. For example, the connection pads 310 to 390 may include an eighth connection pad 380 and a ninth connection pad 390 connected to an electrode pad of the connector unit 600.

The connector unit 600 may include a connector body 650 and a plurality of terminals extending from the connector body 650. The connector body 650 may include grooves, protrusions, and the like for connecting and fixing the circuit board 100 and the external terminal. That is, the external terminal may be connected to and fixed to the connector body 650 to be connected to the circuit board 100. In addition, the connector unit 600 may include an input terminal 651, an output terminal 652, and a ground terminal 653, and each terminal may be electrically connected to the connection pads 310-390. . For example, the input terminal 651 may be electrically connected to the first connection pad 310, and the output terminal 652 may be electrically connected to the sixth connection pad 360. In addition, the ground terminal 653 is connected to the fourth connection pad 340 and the connector unit 600 includes electrode pads 210 and 220 of the circuit board 100, connection pads 310 to 390, and The light emitting device 500 may be electrically connected.

A second molding part 420 may be disposed on the lower surface of the circuit board 100. The second molding part 420 may be disposed surrounding the component part 450 and the connection pads 310 to 390 disposed on the lower surface of the circuit board 100. That is, the second molding part 420 may be disposed surrounding both the top and side surfaces of the component part 450, and may be disposed while filling a space between the component part 450 and the circuit board 100. You can. Also, the second molding part 420 may be disposed on the connector unit 600. The second molding part 420 may be disposed surrounding the connector unit 600. For example, the second molding part 420 may be disposed on the connector body 650 and the plurality of terminals 651, 652, 653 of the connector unit 600, and the plurality of terminals 651, 652, 653) may be disposed surrounding the entire top and side surfaces. In detail, the second molding part 420 may be disposed while covering the surfaces of the input terminal 651, the output terminal 652, and the ground terminal 653.

The second molding part 420 may include resin, silicone, or epoxy. The second molding part 420 may be formed in a liquid state on the lower surface of the circuit board 100 on which the component part 450 and the connector unit 600 are located to be solidified. Accordingly, the second molding part 620 may improve adhesion between the circuit board 100 and the component part 450, between the circuit board 100 and the connector unit 600, and A space between the connection pads 310 to 390 and the component part 450 and a space between the connection pads 310 to 390 and the connector unit 600 may be sealed. That is, as the second molding part 420 is disposed to cover the component part 450 and the connector unit 600, a plurality of connection pads 310 to 390 exposed from the second protective layer 102 ) Can be sealed, and it is possible to prevent foreign matter, moisture, and moisture from penetrating through the inter-region.

6 is a circuit diagram of a sterilization module according to an embodiment. The sterilization module 1000 according to the embodiment may include a component part 450 that is electrically connected to the light emitting device 500 and may include a connector unit 600 that is connected to the circuit board 100. have. The connector unit 600 may be connected to a control unit connected to the sterilization module 1000 to grasp the driving state of the light emitting device 500.

Referring to FIG. 6, the control unit connected to the sterilization module 1000 is based on the output voltage value of the sterilization module 1000, and a driving state of the light emitting device 500, for example, a short state, is open. ) It is possible to grasp the state and the normal state in operation.

The sterilization module 1000 may include at least one light emitting device 500, and may include a plurality of parts electrically connected to the light emitting device 500. For example, the sterilization module 1000 may include a first component D1 for protecting the light emitting device 500 and the circuit board 100 from electrostatic discharge (ESD), and the light emitting device ( 500) and a first resistor R1 and a second resistor R2 for controlling the current and voltage applied to the second component Q1 for switching. In addition, the sterilization module 1000 may include the third component U1 for stability of the voltage across both ends of the second resistor R2, and the output voltage across both ends of the fifth resistor R5. For stability of the Zener diode may be further connected, and thereby it is possible to more accurately grasp the state of the light emitting device 500.

In addition, the sterilization module 1000 according to the embodiment may further include third to fifth resistors R3, R4, and R5. In detail, the third to fifth resistors R3, R4, and R5 are distribution resistors, and may be resistors for scaling down an output voltage to correspond to an input of a control unit connected to the sterilization module 1000. have. In one example, the output voltage may be defined as [Equation 1] below.

[Equation 1] Output voltage = (input voltage-Vf of light emitting element) / 3)

That is, the control unit connected to the sterilization module 1000 can grasp the state of the sterilization module 1000 and the light emitting device 500 in real time based on the output voltage value. For example, when the input voltage of the circuit is 12V, the output voltage may be scaled down to correspond to the input of the control unit by the third to fifth resistors R3, R4, and R5.

Short state
0V ≤ Vf ≤ 3.0V Normal state
3.01 ≤ Vf ≤ 8.25V Open state
8.26V ≤ Vf ≤ 12.0V Output voltage 4.0V to 3.0V 2.99V to 1.25V 1.24V to 0V

That is, the control unit may grasp the state of the light emitting device 500 based on the output voltage value of the sterilization module 1000 as shown in Table 1 above. In detail, the controller may determine a short, normal, or open state of the light emitting device 500 based on the output voltage value.

Accordingly, when the sterilizing module 1000 is applied to a sterilizing device or the like and disposed therein, it is possible to effectively determine the operating state of the light emitting device 500. In detail, the sterilization device may include a control unit connected to the sterilization module 1000 with the connector unit 600, and determine whether the light emitting device 500 operates based on the output voltage of the sterilization module 1000. Can be confirmed.

7 is a side cross-sectional view showing a light emitting device of a sterilization module according to an embodiment.

Referring to FIG. 7, the light emitting device 500 includes a body 530 including a recess 537, a plurality of electrodes 551, 552, and 553 disposed on the recess 537, and the plurality of A light emitting chip 510 disposed on at least one of the electrodes 551, 552, and 553, and a light transmitting member 590 disposed on the recess 537 may be included.

The light emitting chip 510 may include an optional peak wavelength within a range from ultraviolet wavelengths to visible light wavelengths. For example, the light emitting chip 510 may emit ultraviolet wavelengths in a region of about 10 nm to 400 nm. In detail, the light emitting chip 510 may emit ultraviolet wavelengths in the UV-A, UV-B, and UV-C region.

The light emitting chip 510 may be formed of a compound semiconductor of a group II and VI element, or a compound semiconductor of a group III and V element. For example, a semiconductor light emitting device manufactured using a compound semiconductor of a series of AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AllnGaP, InP, InGaAs may be selectively included. The light emitting chip 510 may include an n-type semiconductor layer, a p-type semiconductor layer, and an active layer, and the active layer is InGaN / GaN, InGaN / AlGaN, InGaN / InGaN, GaN / AlGaN, InAlGaN / InAlGaN, AlGaAs / It may be implemented as a pair of GaAs, InGaAs / GaAs, InGaP / GaP, AlInGaP / InGaP, InP / GaAs.

The body 530 may include an insulating material, for example, a ceramic material. The ceramic material may include low temperature co-fired ceramic (LTCC) or high temperature co-fired ceramic (HTCC), which are simultaneously fired. The material of the body 530 may be, for example, AlN, and may include a metal nitride having a thermal conductivity of 140 W / mK or more.

The body 530 may include a stepped structure. In detail, the upper circumference of the body 530 may include a stepped structure 533. The stepped structure 533 may be disposed around an upper portion of the recess 537 in an area lower than an upper surface of the body 530. The depth of the stepped structure 533 is a depth from the upper surface of the body 530, and may be formed deeper than the thickness of the light transmitting member 590, but is not limited thereto.

The recess 537 is an area in which a part of the upper region of the body 530 is open, and may be formed at a predetermined depth from the upper surface of the body 530. For example, the bottom of the recess 537 may be formed to a depth deeper than the stepped structure 533 of the body 530. The position of the stepped structure 533 may be arranged in consideration of the height of the first connecting member connected to the light emitting chip 510 disposed on the bottom of the recess 537. Here, the direction in which the recess 537 is opened may be a direction in which light generated from the light emitting chip 510 is emitted.

The recess 537 may include a polygonal, circular, or elliptical top view shape. The recess 537 may have a chamfered edge, for example, a curved surface. Here, the recess 537 may be located inside the stepped structure 533 of the body 530.

The lower width of the recess 537 may be formed to be the same width as the upper width of the recess 537 or the upper width may be formed wider. In addition, the side wall 531 of the recess 537 may be formed perpendicular or inclined to the extension line of the bottom surface of the recess 537.

A sub recess (not shown) may be disposed in the recess 537. The bottom surface of the sub-recess 537 may be disposed below the bottom surface of the recess 537 in a vertical direction. A protection element (not shown) may be further disposed in the sub recess. The vertical height of the sub recess 537 may correspond to or be greater than the vertical thickness of the protection element. That is, the upper surface of the protection element is disposed so as not to protrude above the bottom surface of the recess, thereby preventing light output from being deteriorated by the protection element and preventing the directivity angle from being distorted.

A plurality of electrodes 551, 552, and 553 are disposed in the recess 537, and the plurality of electrodes 551, 552, and 553 may selectively supply power to the light emitting chip 510. The plurality of electrodes 551, 552, and 553 may include metal. For example, the electrodes 551, 552, and 553 are among platinum (Pt), titanium (Ti), copper (Cu), nickel (Ni), gold (Au), tantalum (Ta), and aluminum (Al). It may include at least one. At least one of the plurality of electrodes 551, 552, and 553 may be formed as a single layer or multiple layers. For example, when the electrodes 551, 552, and 553 are formed in a multi-layer, gold (Au) having good bonding characteristics may be disposed on the uppermost layer, and titanium (which has good adhesion to the body 530) on the lowermost layer ( Ti), chromium (Cr), and tantalum (Ta) may be disposed. In addition, platinum (Pt), nickel (Ni), copper (Cu), or the like may be disposed in the intermediate layer between the top and bottom layers.

The electrodes 551, 552, and 553 include a first electrode 551 on which the light emitting chip 510 is disposed, a second electrode 552 and a third electrode 553 spaced apart from the first electrode 551, A fourth electrode (not shown) disposed in the sub recess may be included. The first electrode 551 is disposed at the bottom center of the recess 537 and the second electrode 552 and the third electrode 553 may be disposed on both sides of the first electrode 551. . In addition, either one of the first electrode 551 and the second electrode 552 may be removed, but is not limited thereto. The light emitting chip 510 may be disposed on a plurality of electrodes among the first to third electrodes 551, 552, and 553, but is not limited thereto.

The first electrode 551 and the fourth electrode may be supplied with power having a first polarity. In addition, the second electrode 552 and the third electrode 553 may be supplied with power of a second polarity. The polarity of the electrode may vary depending on an electrode pattern or a connection method with each device, but is not limited thereto.

The light emitting chip 510 may be disposed in the recess 537. The light emitting chip 510 may be bonded to the first electrode 551 with a conductive adhesive, and may be connected to the second electrode 552 with a first connecting member including a first wire or the like. The light emitting chip 510 may be electrically connected to the first electrode and the second electrode 552 or the third electrode 553. The connection method of the light emitting chip 510 may be selectively connected using a wire bonding, die bonding, or flip bonding method, and the chip type and the electrode position of the chip may be changed according to the bonding method. The protection element may be bonded to the fourth electrode and may be connected to the third electrode 553 by a second connection member including wires. However, embodiments are not limited thereto, and the protection element may be removed from the recess 537 and disposed on the circuit board 502 described above.

A plurality of pads 571 and 572 may be disposed on the lower surface of the body 530. For example, a first pad 571 and a second pad 572 that are spaced apart from each other may be disposed on the lower surface of the body 530. At least one of the first and second pads 571 and 572 may be disposed in a plurality to disperse the current path.

A connection pattern 555 may be disposed in the body 530. The connection pattern 555 may provide an electrical connection path between the recess 537 and the bottom surface of the body 530. For example, a portion of the first electrode 551 may extend into the body 530 to be connected to the connection pattern 555, and may be connected to another electrode through the connection pattern 555. The connection pattern 555 may electrically connect the first electrode 551, the fourth electrode, and the first pad 571, and the second electrode 552, the third electrode 553 And electrically connecting the second pad 572.

A light transmitting member 590 may be disposed on the recess 537. The light transmitting member 590 may include a glass material, for example, quartz glass. Accordingly, the light-transmitting member 590 may be defined as a material that can transmit light emitted from the light-emitting chip 510 without damage such as bond breakage between molecules due to, for example, ultraviolet wavelengths.

Alternatively, the light transmitting member 590 may include fluorine. The fluorine has a strong chemical bond with carbon, and bond breakage between molecules by ultraviolet rays does not occur. The light-transmitting member 590 may include a fluorine resin system, and the molecular chain of the light-transmitting member 590 is a helical structure, and the structure of the molecular chain is a three-dimensional helical structure, thereby surrounding the carbon-carbon bond. Fluorine atoms are blocked without any gaps, protecting the destruction of molecular chains due to invasion of ultraviolet rays and oxygen. The light-transmitting member 590 is a light-transmissive material, and can transmit light emitted from the light emitting chip 510, and moisture such as oxygen, water, or oil blocks penetration to the material surface as much as possible to protect the material. You can.

When the light transmitting member 590 includes a fluorine resin-based material, it may have a thickness of about 1 mm or less. In detail, the light transmitting member 590 may have a thickness of about 0.1 mm or less. In more detail, the light transmitting member 590 may have a thickness of about 0.05 mm to about 0.1 mm. When the thickness of the light transmitting member 590 is thicker than the above-mentioned range, the transmittance of light passing through the light transmitting member 590 is low, and when it is thinner than the above-described range, the rigidity of the light transmitting member may be deteriorated and moisture-proof and waterproof efficiency This can degrade. The light transmitting member 590 may have a transmittance of about 70% to about 95% with respect to the wavelength emitted from the sterilization module. If the transmittance is less than about 70%, optical reliability due to deterioration of function may deteriorate. The light transmitting member 590 can transmit the light from the sterilization module without damage.

The light-transmitting member 590 may have an outer circumference coupled to the stepped structure 533 of the body 530. An adhesive layer 580 is disposed between the transmissive member 590 and the stepped structure 533 of the body 530, and the adhesive layer 580 includes a resin material such as silicone or epoxy. The light transmitting member 590 may be formed to have a width wider than the bottom width of the recess 537. The lower surface area of the light transmitting member 590 may be formed with a larger area than the bottom area of the recess 537. Accordingly, the light transmitting member 590 can be easily coupled to the stepped structure 533 of the body 530.

The light transmitting member 590 may be spaced apart from the light emitting chip 510. As the light transmitting member 590 is spaced apart from the light emitting chip 510, it can be prevented from being expanded by heat generated by the light emitting chip 510. The space under the light transmitting member 590 may be an empty space or may be filled with a non-metal or metal chemical element, but is not limited thereto.

A lens may be coupled to the light transmitting member 590. For example, a separate lens may be combined on the light transmission member 590 to adjust the directivity angle.

A molding part may be disposed on the side of the body 530. That is, a molding part may be further disposed on the side surface of the light emitting device 500. Accordingly, reliability and moisture-proofing power of the light emitting device 500 may be improved. That is, the above-described first molding part 410 may be disposed surrounding the body 530 on the side of the body 530. In detail, the first molding part 410 may be disposed in direct contact with the side surface of the body 530 between the circuit board 100 and the light emitting device 500. The first molding part 410 may be disposed on the lower surface of the body 530, and may be disposed in direct contact with the lower surface of the body 530. In addition, the first molding part 410 may not be disposed on an upper surface of the body 530, for example, an area where light emitted from the light emitting chip 510 is emitted, thereby improving light efficiency.

8 is a cross-sectional view of a sterilizing module according to an embodiment applied to a water purifier, and FIGS. 9 and 10 are enlarged views of area A1 of FIG. 8.

8 to 10, the water purifier 2000 according to the embodiment may include a main body 2100, a water outlet part 2200, and a sterilizing part 2300. The main body 2100 has a predetermined accommodation space therein, and at least one filter unit (not shown) for purifying water may be disposed therein. Water purified from the filter unit may be discharged to the outside through the outlet unit 2200. In addition, the main body 2100 may further include a water storage tank (not shown). When the water purifier 2000 includes the water storage tank, the main body 2100 may include a water purification pipe (not shown) through which water purified by the filter unit flows, and the water purification pipe may be connected to the water storage tank. . In this case, the water discharge unit 2200 may be connected to the water storage tank to discharge water stored in the water storage tank to the outside.

A lever (not shown) that operates to take out purified water may be disposed outside the main body 2100. In addition, an operation unit (not shown) may be disposed outside the main body 2100. The operation unit may include a display, a button, and the like, and may display status information of the water purifier 2000 or select various functions. In one example, the operation unit may include at least one button for selecting hot water, purified water, and cold water from the water purifier. The button may include an electrical button including a physical button and / or a touch sensor. The user of the water purifier 2000 can grasp the state of the water purifier through the operation unit and select and operate various functions. In addition, when the water purifier 2000 is taken out through the operation unit, for example, when it is taken out by a button or the like of the operation unit, the lever may be omitted.

A water outlet part 2200 for discharging purified water may be disposed outside the main body 2100. The water outlet part 2200 may include a water outlet pipe 2210 and a water outlet cock 2220 located at the end of the water outlet pipe. The outlet pipe 2210 is a pipe for discharging water purified by the filter unit and may provide a flow path for moving the purified water. The outlet pipe 2210 may be disposed to extend from the inside of the body 2100 to the outside. The outlet pipe 2210 may be disposed in connection with the filter unit. In addition, when the water purifier 2000 includes a water storage tank that stores purified water through the filter unit, the water discharge pipe 2210 may be disposed in connection with the water storage tank. In this case, the water discharge pipe 2210 may be disposed in a lower region of the water storage tank to effectively discharge water from the water storage tank to the outside. The outlet pipe 2210 may have a pipe shape with a hollow formed therein so that purified water can flow therein, and may include at least one of quartz, glass, metal, and stainless steel. The outlet pipe 2210 may include a material that does not react with the ultraviolet rays.

The outlet 2200 may include the outlet coke 2220. The outlet coke 2220 may be disposed at an end of the outlet pipe 2210. The outlet coke 2220 may include a valve capable of controlling the flow of purified water therein. For example, the valve of the water outlet cock 2220 may be opened by the user's operation, and the purified water flowing through the water outlet pipe 2210 may be taken out. In addition, the valve of the water outlet coke 2220 may be closed by the user's operation, and thus the extraction of the purified water may be stopped.

A sterilizing portion 2300 may be disposed on the water outlet portion 2200. The sterilizing part 2300 may be disposed adjacent to the water outlet part 2200. The sterilization unit 2300 may include a sterilization module 1000 according to an embodiment, and may irradiate ultraviolet rays to the water discharge unit 2200. As an example, the water outlet pipe 2210 may include an opening on an area corresponding to the sterilizing portion 2300. In detail, the water outlet pipe 2210 may include an opening in a region overlapping the light emitting device 500 in a vertical direction. The opening may overlap the exit coke 2220 in a vertical direction. Ultraviolet rays emitted from the sterilization module 1000 through the opening may be incident on the water outlet pipe 2210 and the water outlet cock 2220.

The sterilization part 2300 may include a first body 2310 and a second body 2320 coupled with the first body 2310, and the first body 2310 and the second body 2320 ), The sterilization module 1000 may be disposed.

The first body 2310 may include a concave portion having a through hole TH1 in the lower portion, and may include a first recess 2311 concave in a lower direction in the upper portion.

The sterilization module 1000 may be disposed on the first body 2310. The sterilization module 1000 may be disposed on the first recess 2311 of the first body 2310. The sterilization module 1000 may directly contact the surface of the first recess 2311 of the first body 2310, and the light emitting device 500 may be inserted into the through hole TH1 and disposed. . To this end, the horizontal width of the through hole TH1 may be greater than the horizontal width of the light emitting device 500. Further, the horizontal width of the through hole TH1 may correspond to the horizontal width of the first molding part 410 disposed on the side surface of the light emitting device 500.

The first recess 2311 may have a shape corresponding to the sterilization module 1000. The horizontal width of the first recess 2311 may be greater than the horizontal width of the sterilization module 1000. In one example, the width of at least one of the x-axis and the y-axis of the first recess 2311 may be greater than the width of at least one of the x-axis and y-axis of the sterilization module 1000. In addition, the height of the first recess 2311 may be higher than the height of the sterilization module 1000 so that the sterilization module 1000 can be disposed therein. Accordingly, the sterilization module 1000 can be easily arranged and fixed in the first recess 2311.

The through hole TH1 of the first body 2310 may overlap the sterilization module 1000 in a vertical direction. In detail, the through hole TH1 may overlap the light emitting device 500 of the sterilization module 1000 in the vertical direction. The through hole TH1 may be greater than or equal to the horizontal width of the light emitting device 500. For example, the horizontal width of the through hole TH1 may be greater than the horizontal width of the light emitting device 500. Accordingly, the light emitting device 500 may be inserted into or disposed in the through hole TH1 in whole or in part.

In detail, when the horizontal width of the through hole TH1 is greater than the light emitting device 500, the light emitting device 500 is disposed on the first molding part 410 disposed on the side surface of the light emitting device 500. Can be inserted in whole or in part. That is, the inside of the through-hole TH1 may directly contact the first molding part 410, and through the through-hole TH1 to the inside of the first recess 2311 and the sterilization module 1000. It can prevent moisture, moisture and foreign substances from penetrating. When the horizontal width of the through hole TH1 corresponds to the horizontal width of the first molding part 410, the light emitting device 500 may be disposed with the whole inserted into the through hole TH1. . In addition, the first molding part 410 may contact the inside of the through hole TH1, and an upper surface of the circuit board 100 of the sterilization module 1000 may be a bottom surface of the first recess 2311. You can come in contact with. Accordingly, it is possible to more effectively prevent moisture, moisture, and foreign substances from penetrating the sterilization module through the through hole TH1.

A second body 2320 may be disposed on the first body 2310. The second body 2320 may be disposed on the sterilization module 1000. The second body 2320 may include a second recess 2321 recessed in an upward direction at the bottom. The sterilization module 1000 may be disposed in the second recess 2321. That is, the sterilization module 1000 may be disposed in a space formed by the first recess 2311 of the first body 2310 and the second recess 2321 of the second body 2320. The second recess 2321 may face the lower surface of the sterilization module 1000. For example, the second recess 2321 may face the component part 450 of the sterilization module 1000.

The second body 2320 is a body for fixing the sterilization module 1000, and may have a width corresponding to the width of the sterilization module 1000. For example, the horizontal width of the second recess 2321 may correspond to the horizontal width of the sterilization module 1000. In addition, the second body 2320 may further include a fixed rib (not shown) for supporting the sterilization module 1000 from the surface of the second recess 2321. The fixing lip protrudes downward from the surface of the second recess 2321 to contact the lower surface of the circuit board 100 and to fix the sterilization module 1000.

The first body 2310 and the second body 2320 may be combined. For example, a groove for fastening may be formed in the first body 2310 and the second body 2320, and a fastening part is disposed in the groove, such that the first body 2310 and the second body 2320 ) Can combine. That is, the first body 2310 and the second body 2320 may include grooves having a female screw shape on regions corresponding to each other, and may be screwed using a male screw type fastening portion.

The sterilizing unit may further include a first gasket 2330 (see FIG. 10). The first gasket 2330 may be disposed between the first body 2310 and the second body 2320. The first gasket 2330 may have a thicker thickness than the circuit board 100 of the sterilization module 1000 between the first recess 2311 and the second recess 2321. The first gasket 2330 may be disposed surrounding the outer peripheral surface of the sterilization module 1000. In detail, the first gasket 2330 may be formed in a cross-sectional shape of 'C' to surround the upper and lower surfaces of the sterilization module 1000, and directly contact the upper and lower surfaces of the circuit board 100. can do. The first gasket 2330 may be made of a resin material such as NBR (Nitrill Butadiene Rubber), EPDM (Ethylene Propylene), or FPM (Fluorinated Rubber) silicone. The first gasket 2330 may double-block moisture and moisture from flowing into the rear surface of the sterilization module 1000 through the through-hole TH1, that is, the component part 450 is disposed. In addition, the first gasket 2330 can effectively disperse the stress applied from the outside.

The through hole TH1 of the first body 2310 may be disposed in an area overlapping the water outlet pipe 2210 in a vertical direction. The through hole TH1 may overlap the opening formed in the upper portion of the outlet pipe in the vertical direction. In addition, the through-hole TH1 may be disposed in a region overlapping the water outlet cock 2220 in a vertical direction. Accordingly, the light emitting element 500 inserted into the through hole TH1 may also overlap the water outlet pipe 2210 and the water outlet cock 2220 in a vertical direction, and the water outlet pipe 2210 and the water outlet Ultraviolet rays may be irradiated toward the cork 2220.

That is, in the embodiment, the purified water stored in the water storage tank may be exposed to ultraviolet rays emitted from the light emitting device 500 through the opening of the water discharge pipe 2210 while passing through the water discharge pipe 2210, and in this process, The water discharge pipe 2210 and purified water may be sterilized. In addition, residual water may remain inside the water discharge coke 2220 after the water is discharged. At this time, the residual moisture may be contaminated by bacteria or the like introduced from the outside of the water outlet coke 2220. However, the embodiment may sterilize the outlet coke 2220 by the sterilizing portion 2300 disposed on the outlet coke 2220. In detail, the sterilization module 1000 may irradiate ultraviolet light to the water discharge coke 2220, and accordingly, may sterilize the water discharge coke 2220. Therefore, it is possible to prevent the purified water that is additionally discharged from the filter unit through the outlet pipe 2210 from being contaminated by the outlet coke 2220.

In addition, although not shown in the drawings, the sterilization module 1000 according to the embodiment may be further disposed on the reservoir. The sterilization module 1000 may sterilize the water storage tank and purified water accommodated in the water storage tank. The sterilization module 1000 may be disposed on an upper surface of the water storage tank and irradiate ultraviolet light to purified water accommodated in the water storage tank. For example, an upper surface of the water storage tank may include an opening through which the light emitting device 500 may be inserted, and the light emitting device 500 may be inserted into the opening to irradiate ultraviolet light inside the water storage tank. In addition, the sterilization module 1000 may be disposed on the side surface of the water tank to irradiate ultraviolet light inside the water tank. The light emitting device 500 of the sterilization module 1000 may be inserted into and disposed in an opening formed on a side surface of the water storage tank. In addition, the sterilization module 1000 may be disposed on the bottom surface of the water tank to irradiate ultraviolet light inside the water tank. The sterilization module 1000 may be disposed outside or inside the reservoir to sterilize by irradiating ultraviolet light to the reservoir and purified water contained in the reservoir. At this time, the sterilization module 1000 may prevent moisture and moisture from penetrating from the outside by the above-described first molding part 410, the second molding part 420, etc., and may have improved waterproofing power. Accordingly, it can be disposed for a long time inside the water storage tank, for example, inside the purified water accommodated in the water storage tank, it can be driven in the water purification.

Hereinafter, the effects of the present invention will be described in more detail based on experimental examples.

Experimental Example 1

A light emitting device is disposed on an upper surface of the circuit board, and a silicon molding layer is formed on the side surface of the light emitting device to seal the circuit board and the light emitting device. In addition, six components (Sample 1) are disposed on the bottom surface of the circuit board, including components including switching elements, diodes, resistors, etc., and forming a silicon molding layer on the components to seal the circuit board and components. To Sample 6). Subsequently, the radiant flux of the produced samples was measured.

Thereafter, water was filled into a water tank having a depth of 30 cm, and the sterilization module was immersed to a height of 10 cm from the bottom of the water tank. Samples 1 to 3 were left in water for 9 hours, and samples 4 to 6 were operated in water for 9 hours. Then, the radiant flux of the samples was measured and compared.

Experimental Example 2

Three sterilization modules (Samples 7 to 9) were manufactured in the same manner as in Experimental Example 1, and radiant flux of the produced samples was measured.

Subsequently, water was filled into a water tank having a depth of 1.5 m, and the sterilization module was left for 1 hour in a state of submersion to a height of 40 cm from the bottom of the water tank. Then, the radiant flux of the samples was measured and compared.

Kinds Before test after the test Difference (%) Underwater motion Sample 1 2.32 2.25 -3.1 Sample 2 2.35 2.3 -1.9 Sample 3 2.13 2.05 -4 Underwater Sample 4 2.36 2.36 0 Sample 5 2.25 2.26 0.3 Sample 6 2.15 2.15 0

Referring to Table 2, it can be seen that the sterilization module 1000 according to the embodiment has little change in radiation flux compared to before the test even if it is left in water for a long time. In addition, it can be seen that even when operated in water for a long time, the radiation flux is reduced by up to 4% compared to before the test. That is, it can be seen that the amount of radiant flux that is reduced in water does not differ significantly from the amount that is reduced when left or driven for a long time at room temperature.

Underwater Before test after the test Difference (%) Sample 7 2.15 2.16 -0.1 Sample 8 2.11 2.11 0 Sample 9 2.33 2.33 0

In addition, referring to Table 3, it can be seen that the sterilization module 1000 according to the embodiment has almost no change in radiation flux compared to before the test even if it is left in relatively deep water. That is, the sterilization module according to the embodiment may have an improved water resistance regardless of the depth of immersion in water, and may operate with the same performance as outside water. Therefore, the sterilization module 1000 according to the embodiment may be disposed inside the water purifier 2000, for example, inside the water storage tank for a long time, and may have improved reliability even when exposed to moisture and moisture.

In addition, the water purifier 2000 according to the embodiment may further include a control unit (not shown). The control unit may be connected to the sterilization module 1000 through the connector unit 600 described above.

The controller can grasp the state of the water purifier 2000 and control the operation of the water purifier 2000. In addition, the control unit may grasp the driving state of the sterilization module 1000. That is, the sterilization module 1000 can scale down the output voltage to correspond to the input of the control unit, and can grasp the state of the light emitting device 500 in real time based on the output voltage of the light emitting device 500. have. That is, the control unit may grasp the short state, normal state, and open state of the light emitting device 500 according to the output voltage value.

That is, the sterilization module 1000 according to the embodiment may have improved waterproofing power, and may be effectively disposed of and disposed inside a water purifier exposed to moisture and moisture.

In addition, the water purifier 2000 according to the embodiment may analyze the operation and failure state by grasping the operation state of the sterilization module 1000 in real time. Accordingly, the embodiment can effectively grasp the operation state of the sterilizing module 1000 disposed therein without disassembling the water purifier 2000.

Features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, features, structures, effects, and the like exemplified in each embodiment may be combined or modified for other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

In addition, although the embodiments have been mainly described above, these are merely examples and do not limit the present invention, and those skilled in the art to which the present invention pertains are exemplified above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be implemented by modification. And differences related to these modifications and applications should be construed as being included in the scope of the invention defined in the appended claims.

Claims (7)

A circuit board including an upper surface and a lower surface;
First and second electrode pads disposed on an upper surface of the circuit board;
A light emitting element disposed on the first and second electrode pads;
A first molding part disposed on an upper surface of the circuit board and a side surface of the light emitting device;
A plurality of connection pads disposed on a lower surface of the circuit board;
A component part disposed on the connection pad and including a plurality of resistors and switching elements; And
And a second molding part surrounding the lower surface of the circuit board and the component part,
The first and second electrode patterns are electrically connected to the plurality of connection pads through via holes penetrating the circuit board,
The light emitting element and the component part is a sterilization module that is spaced apart without overlapping in the vertical direction. According to claim 1,
The circuit board includes first and second side surfaces facing the first direction, and third and fourth side surfaces facing the second direction perpendicular to the first direction,
The sterilization module, wherein the distance between the first and second sides is longer than the distance between the third and fourth sides. According to claim 2,
The circuit board includes a first region in the first side direction and a second region in the second side direction based on a center line connecting the centers of the third and fourth side surfaces,
The light emitting device is disposed on the first region, and the component unit is a sterilization module disposed on the second region. According to claim 1,
The component unit is a sterilization module comprising at least one distribution resistor for lowering the output voltage. According to claim 1,
The light emitting device includes a first pad disposed on the first electrode pad and a second pad disposed on the second electrode pad,
The number of the first pad is less sterilization module than the number of the second pad. The method of claim 5,
The area of the first electrode pad is smaller than that of the second electrode pad. The method of claim 4,
The distribution resistance includes a first distribution resistance, a second distribution resistance, and a third distribution resistance,
The first to third distribution resistors are sterilization modules connected in series.

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