KR20200025920A - Organic light emitting display device - Google Patents

Abstract

The present invention relates to an organic light emitting display device comprising: a bottom substrate having a plurality of sub-pixels and including a display area and a non-display area surrounding the display area; a film transistor formed on the bottom substrate; an organic light emitting device formed on the thin film transistor; a top substrate facing the bottom substrate; a filling portion filling the space between the top substrate and the organic light emitting device; and a dam structure surrounding the filling portion in the non-display area while in contact with the top and bottom substrate in the non-display area. The dam structure includes a base resin and a functional group capable of binding to the base resin or includes metal-organic framework to improve hydrophobicity.

Description

Organic light emitting display device {ORGANIC LIGHT EMITTING DISPLAY DEVICE}

The present invention relates to an organic light emitting display, and more particularly, to an organic light emitting display that improves transparency of a bezel area and minimizes penetration of moisture and oxygen.

Recently, as the information age has entered, the display field for visually expressing electrical information signals has been rapidly developed, and various display devices with excellent performance of thinning, light weight, and low power consumption have been developed accordingly. Is being developed.

Specific examples of such a display device include a liquid crystal display device (LCD), a plasma display panel device (PDP), a field emission display device (FED), and an organic light emitting display device ( Organic Light Emitting Display Device: OLED).

In particular, the organic light emitting diode display is a self-luminous element, and thus has been widely attracting attention because it has the advantages of faster response speed and greater luminous efficiency, brightness, and viewing angle than other display devices. In addition, the organic light emitting diode applied to the organic light emitting diode display is a next-generation light source having self-luminance characteristics, and has a viewing angle, contrast, response speed, and the like compared to liquid crystals. It has excellent advantages in terms of power consumption.

Recently, there is an attempt to manufacture a transparent display device using an organic light emitting display device. The transparent organic light emitting display device is a display device for observing an object located behind the display device, and includes a pixel area in which the organic light emitting element emits light to display an image, and a transmission area through which external light is transmitted.

On the other hand, the organic light emitting device existing inside the organic light emitting diode display is made of organic material, which is vulnerable to moisture and oxygen, thereby reducing the lifespan and reducing reliability. Therefore, in order to minimize penetration of moisture and oxygen from the outside into the organic light emitting device, various techniques for sealing the organic light emitting device have been used.

Accordingly, an object of the present invention is to improve the light transmittance of a dam structure disposed in a non-display area of an organic light emitting diode display, thereby minimizing the penetration of oxygen and moisture from the side surface and ensuring transparency. It is to provide a device.

In addition, another object of the present invention is to provide an organic light emitting display device including a dam structure capable of maintaining transparency without color change before and after moisture absorption.

In addition, another object of the present invention is to provide a transparent organic light emitting display device capable of implementing a transparent bezel.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve the above problems, the organic light emitting diode display according to the exemplary embodiment includes a plurality of subpixels, and includes a lower substrate and a lower substrate including a display area and a non-display area surrounding the display area. A thin film transistor formed on the thin film transistor, an organic light emitting element formed on the thin film transistor, an upper substrate facing the lower substrate, a filling portion filling a space between the upper substrate and the organic light emitting element, and contacting and filling the upper substrate and the lower substrate in the non-display area The dam structure includes an enclosing dam structure, and the dam structure includes a metal-organic framework that has a surface resin modified to have hydrophobicity or improve a functional group capable of bonding with the base resin.

Details of other embodiments are included in the detailed description and drawings.

The present invention forms a dam structure including a metal-organic structure that is surface-modified to prevent agglomeration between particles in a non-display area of an organic light emitting diode display, thereby ensuring oxygen and water blocking performance of the dam structure and improving transparency. It is effective.

In addition, the present invention can provide a dam structure in which there is no color change and transparency is maintained even before and after moisture absorption.

In addition, the present invention can provide a transparent organic light emitting display device capable of implementing a transparent bezel.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1A is a schematic plan view illustrating an organic light emitting display device according to an exemplary embodiment of the present invention.
FIG. 1B is a schematic cross-sectional view taken along line II ′ of FIG. 1A.
2A to 2C are schematic cross-sectional views illustrating a structure of a dam structure of an organic light emitting diode display according to an exemplary embodiment of the present invention.
3A to 3F are graphs showing light transmittance according to changes in the content of the modified metal-organic structure in the dam structures according to Comparative Example 3 and Examples 1 to 5;

Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the present embodiments make the disclosure of the present invention complete, and those of ordinary skill in the art to which the present invention belongs. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims.

Shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are exemplary, and thus, the present invention is not limited thereto. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. When 'comprises', 'haves', 'consists of' and the like mentioned in the present specification are used, other parts may be added unless 'only' is used. In the case where the component is expressed in the singular, the plural includes the plural unless specifically stated otherwise.

In interpreting a component, it is interpreted to include an error range even if there is no separate description.

In the case of the description of the positional relationship, for example, if the positional relationship of the two parts is described as 'on', 'upper', 'lower', 'next to', etc. Alternatively, one or more other parts may be located between the two parts unless 'direct' is used.

When an element or layer is referred to as “on” another element or layer, it encompasses both the case where another layer or other element is interposed on or in the middle of another element.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the first component mentioned below may be a second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout.

The size and thickness of each component shown in the drawings are shown for convenience of description, and the present invention is not necessarily limited to the size and thickness of the illustrated configuration.

In the present specification, the transparent display device refers to a display device in which at least some regions of the screen of the display device visually recognized by the viewer are transparent. In the present specification, the transparency of the transparent display device refers to a transparent display device at which the user recognizes at least the object behind the display device. In the present specification, the transparent display device means, for example, a display device having a transmittance of at least 20% or more.

Each of the features of the various embodiments of the present invention may be combined or combined with each other, partly or wholly, and various technically interlocking and driving are possible as one skilled in the art can fully understand, and each of the embodiments may be independently implemented with respect to each other. It may be possible to carry out together in an association.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A is a schematic plan view illustrating an organic light emitting display device according to an exemplary embodiment of the present invention. FIG. 1B is a schematic cross-sectional view taken along line II ′ of FIG. 1A. 1A and 1B illustrate a transparent organic light emitting display device. Hereinafter, a transparent organic light emitting diode display will be described, but is not limited thereto. That is, it may be applied to an opaque organic light emitting display device as needed.

1A and 1B, the organic light emitting diode display 100 may include a lower substrate 110, a thin film transistor 120, a white organic light emitting diode 140, an encapsulation layer 150, a filling unit 160, The upper substrate 170, the dam structure 180, and the pad electrode 190 are included.

The lower substrate 110 supports various components of the organic light emitting diode display 100. Referring to FIG. 1A, the lower substrate 110 has an active area (A / A) and an inactive area (I / A). The display area A / A is an area where the white organic light emitting diode 140 is disposed, and is an area where an actual image is displayed, and the non-display area I / A is an outer area surrounding the display area A / A. This is an area where an image is not displayed, and is an area in which various driving devices for driving the white organic light emitting device 140 are disposed.

The display area A / A and the non-display area I / A may be in a form suitable for design of an electronic device having the organic light emitting display device 100. For example, the display area A / A may have various shapes such as a pentagon, a hexagon, a circle, and an oval, and the non-display area I / A may have any shape surrounding the display area A / A. Can have.

Meanwhile, a pad area P / A is disposed in the non-display area I / A. The pad area PA is disposed outside the dam structure 180 disposed in the non-display area I / A. The pad area PA is an area where the pad electrode 190 is formed, and is an area where the pad electrode 150 and an external module, for example, a flexible printed circuit board (FPCB), a chip on film (COF), and the like contact with each other. . The pad region P / A is illustrated as being disposed on one side of the lower substrate 110 as shown in FIG. 1A, but the shape and arrangement of the pad region P / A is not limited thereto.

Referring to FIG. 1A, a plurality of sub pixels SP may be defined on the substrate 110. Each of the plurality of sub-pixels SP is a region for displaying one color, and includes a region in which the white organic light emitting diodes 140 are disposed in the display region A / A. The plurality of sub pixels SP may be composed of a red sub pixel, a green sub pixel, and a blue sub pixel, or may be configured of a red sub pixel, a green sub pixel, a blue sub pixel, and a white sub pixel. The plurality of sub pixels SP may be defined in a matrix form as shown in FIG. 1A.

Each of the plurality of sub-pixels SP of the organic light emitting diode display 100 includes an emission area (EA) and a transmissive area (TA). The emission area EA may be referred to as a non-transmissive area or a light emitting part, and the transmission area TA may be referred to as a transmission part. The emission area EA is an area where an actual image is realized, and is an area where external light is not transmitted, and the transmission area TA is an area that transmits external light. Therefore, when the organic light emitting diode display 100 is not driven, the user can see the background, that is, the object behind the display, through the transmission area TA. Alternatively, when the organic light emitting diode display 100 is driven, the user may simultaneously recognize the image of the emission area EA and the background through the transmission area TA. The area ratio of the light emission area EA and the transmission area TA in the sub-pixel SP may be variously set in view of visibility and transmittance.

1A and 1B, a transparent organic light emitting display device will be described as described above. However, the present invention is not limited thereto and may be applied to an opaque organic light emitting display device. In the case of an opaque organic light emitting diode display, the transparent region may not exist or may occupy a very small area.

The lower substrate 110 may be made of an insulating material. The lower substrate 110 may be made of a flexible material. When the organic light emitting diode display 100 is a transparent organic light emitting diode display, the lower substrate 100 may be formed of a transparent material. For example, flexible transparent materials include polyimide (PI), polyetherimide (PEI), polyethylene terephthalate (PET), polycarbonate (PC), polymethylmethacrylate (polymethylmethacrylate; PMMA), polystyrene (PS), styrene acrylnitrile copolymer (SAN), silicone-acryl resin, and the like.

A buffer layer 131 for protecting various components of the OLED display 100 from penetration of moisture (H ₂ O) and hydrogen (H ₂ ) from the outside of the lower substrate 110 on the lower substrate 110. Is formed. However, the buffer layer 131 may be omitted depending on the structure or characteristics of the organic light emitting diode display 100.

The thin film transistor 120 including the gate electrode 121, the active layer 122, the source electrode 123, and the drain electrode 124 is formed on the buffer layer 131. For example, an active layer 122 is formed on the substrate 110, and a gate insulating layer 132 is formed on the active layer 122 to insulate the active layer 122 and the gate electrode 121. . An interlayer insulating layer 133 is formed to insulate the gate electrode 121, the source electrode 123, and the drain electrode 124, and a source electrode contacting the active layer 122, respectively, on the interlayer insulating layer 133 ( 123 and the drain electrode 124 are formed. In FIG. 1B, for convenience of description, only a driving thin film transistor among various thin film transistors that may be included in the organic light emitting diode display 100 is illustrated, but a switching thin film transistor and a capacitor may also be included in the organic light emitting diode display 100. In addition, although the thin film transistor 120 has been described as having a staggered structure, a thin film transistor having a coplanar structure may also be used.

The planarization layer 134 is formed on the thin film transistor 120. The planarization layer 134 planarizes the upper portion of the thin film transistor 120. The planarization layer 134 may be composed of a single layer or a plurality of layers, and may be formed of an organic material. For example, the planarization layer 134 may be made of an acryl-based organic material, but is not limited thereto. The planarization layer 134 includes a contact hole for electrically connecting the thin film transistor 120 and the anode 141.

In some embodiments, a passivation layer may be formed between the thin film transistor 120 and the planarization layer 134. The passivation layer may be made of an inorganic material, but may be made of a single layer or a multilayer, but is not limited thereto.

The white organic light emitting diode 140 is electrically connected to the thin film transistor 120 and includes an anode 141, a white organic light emitting layer 142, and a cathode 143. The white organic light emitting diode 140 is driven based on a hole in which holes supplied from the anode 141 and electrons supplied from the cathode 143 are combined in the white organic emission layer 142 to emit light. Form an image.

The anode 141 is disposed on the planarization layer 134. The anode 141 is an electrode configured to supply holes to the white organic emission layer 142. The anode 141 may be made of a transparent conductive material having a high work function. The transparent conductive material may include indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO). When the organic light emitting diode display 100 is a top emission method, the anode 141 may further include a reflective plate.

The anode 141 is electrically connected to the thin film transistor 120 through the contact hole of the planarization layer 134. For example, although the anode 141 is illustrated as being electrically connected to the source electrode 123 of the thin film transistor 120 in FIG. 1B, the anode 141 may be electrically connected to the drain electrode 124. The anode 141 is disposed to be spaced apart from each sub pixel SP. In addition, the anode 141 is formed in the emission area EA in each sub-pixel SP. Even when the anode 141 is made of a transparent conductive material, when the anode 141 overlaps the transmission area TA, a decrease in transmittance of the transmission area TA occurs. In addition, when the anode 141 additionally includes a reflecting plate, the transmittance of the transmission area TA is significantly reduced. Therefore, the present invention is not limited thereto, but the anode 141 may be formed only in the emission area EA and may not be formed in the transmission area TA.

The cathode 143 is disposed on the anode 141. The cathode 143 supplies electrons to the white organic emission layer 142. The cathode 143 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), zinc oxide (zinc oxide), and tin. It may be made of an oxide (Tin Oxide, TO) -based transparent conductive oxide or ytterbium (Yb) alloy. Alternatively, the cathode 143 may be made of a metal material of a very thin thickness.

The white organic emission layer 142 is disposed between the anode 141 and the cathode 143. The white organic light emitting layer 142 is configured to emit white light. The white organic emission layer 142 may be configured as one emission layer to emit white light. Alternatively, the white organic light emitting layer 142 may emit white light from a light emitting part having a stack structure in which a plurality of light emitting layers generating light of different colors stacked with the charge generation layer interposed therebetween. For example, the color of light emitted from the first light emitting layer has a complementary color relationship with the color of light emitted from the second light emitting layer, and the light emitted from the first light emitting layer and the light emitted from the second light emitting layer are finally combined to become white light. Can be. In addition to the white organic light emitting layer 142, the white organic light emitting diode 140 may include at least one organic layer among a hole transport layer, an electron transport layer, a hole blocking layer, an electron blocking layer, a hole injection layer, and an electron injection layer. Since the organic layer may transfer or inject electrons or holes into the white organic emission layer 142, the luminous efficiency of the white organic emission layer 142 may be improved.

In this case, the white organic emission layer 142 may be a common layer formed in the plurality of sub pixels SP. That is, as shown in FIG. 1B, the white organic emission layer 142 may be formed as a single layer on the planarization layer 134 and the anode 141. Accordingly, the white organic light emitting layer 142 may be continuously formed in the plurality of sub pixels SP of the organic light emitting diode display 100.

The white organic emission layer 142 having a structure of a common layer formed on the plurality of sub pixels SP may be formed using an open mask. In the case of forming the white organic light emitting layer 142 using an open mask, problems such as color mismatch due to overlapping and misalignment of the FMM, which occur when the organic light emitting layer is pattern deposited using the FMM, may be solved.

The bank layer 135 is formed on the planarization layer 134 including the anode 141. The bank layer 135 distinguishes adjacent sub-pixels SP, and additionally, distinguishes the emission area EA and the transmission area TA from one sub-pixel SP. Therefore, the bank layer 135 is disposed between the adjacent sub-pixels SP and between the emission area EA and the transmission area TA in one sub-pixel SP. In addition, the bank layer 135 may be formed to open a portion of the anode 141. The bank layer 135 may be made of any one of an organic insulating material, for example, polyimide, photo acryl, and benzocyclobutene (BCB). The bank layer 135 may be formed in a taper shape.

Meanwhile, in FIG. 1B, the white organic light emitting layer 142 and the cathode 143 constituting the white organic light emitting element 140 are formed over the entire surface of the bank layer 135 and the planarization layer 134. Although not shown in the drawings, the white organic light emitting layer and the cathode may be separated and formed only in the emission area EA of each sub-pixel SP.

The encapsulation layer 150 is disposed on the white organic light emitting diode 140. The encapsulation layer 150 may be made of an inorganic material. In FIG. 1B, the encapsulation layer is illustrated as a single layer, but the encapsulation layer 150 may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer.

In detail, the first inorganic encapsulation layer is disposed to cover the white organic light emitting diode 140. The first inorganic encapsulation layer protects the white organic light emitting diode 140 from moisture, air, or physical impact that can penetrate from the outside. The first inorganic encapsulation layer may be formed to conformally cover the top surface of the white organic light emitting diode 140. The first inorganic encapsulation layer may be formed of an inorganic material. For example, the first inorganic encapsulation layer may be formed of various inorganic materials such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), and the like.

The organic encapsulation layer is disposed on the first inorganic encapsulation layer. The organic encapsulation layer can compensate for a step existing under the organic encapsulation layer. For example, a step may be generated in the display area by the white organic light emitting diode 140 and the thin film transistor 120. Referring to FIG. 1B, each layer disposed on the anode 141 has a step by the anode 141 formed separately according to the sub-pixel SP. Therefore, the organic encapsulation layer compensates for this step and can have a flat top surface. In addition, the organic encapsulation layer may compensate for a step caused by a foreign substance that may exist under the organic encapsulation layer. For example, a step may be caused by foreign matters generated during the manufacture of components under the organic encapsulation layer or foreign matters introduced from the outside. Thus, the organic encapsulation layer may have a flat top surface to compensate for a step caused by foreign matter.

The organic encapsulation layer is made of polystyrene resin, acrylic resin, epoxy resin, urea resin, isocyanate resin, xylene resin, silicone oxycarbon It may consist of any one of (SiOC) or a mixture thereof, but is not limited thereto.

The second inorganic encapsulation layer is disposed on the organic encapsulation layer. The second inorganic encapsulation layer covers the organic encapsulation layer. The second inorganic encapsulation layer may be a protective layer that protects the white organic light emitting diode 140 from moisture, air, or physical impact. The second inorganic encapsulation layer may be formed to conformally cover the first inorganic encapsulation layer and the organic encapsulation layer. The second inorganic encapsulation layer may be formed of an inorganic material. For example, the second inorganic encapsulation layer may be formed of various inorganic materials such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), and the like, but is not limited thereto.

The filling unit 160 is disposed on the encapsulation layer 150. The filling part 160 occupies a space between the encapsulation layer 150 and the upper substrate 170.

The filling unit 160 may be an adhesive layer that bonds the encapsulation layer 150 and the upper substrate 170. In this case, the filling unit 160 may be a heat curable, photocurable or naturally curable adhesive. For example, the adhesive layer 145 may be made of a material such as barrier pressure sensitive adhesive (B-PSA).

In addition, the filling unit 160 may be a moisture barrier layer for minimizing the penetration of moisture and oxygen into the OLED display. When the lower substrate 110 and the upper substrate 170 are bonded together, when the separate material is not filled in the space between the lower substrate 110 and the upper substrate 170, the outside of the organic light emitting diode display 100 It can be relatively vulnerable to moisture and oxygen penetrating from it. Accordingly, by filling a moisture barrier layer that suppresses moisture and oxygen infiltration into the space between the lower substrate 110 and the upper substrate 170, moisture and oxygen that penetrate from the outside of the organic light emitting diode display 100 may be effectively blocked. . At this time, the filling unit 160 may be made of a desiccant that absorbs moisture or interferes with the progress of moisture and oxygen.

The upper substrate 170 is disposed on the filling unit 160. The upper substrate 170 is disposed to face the lower substrate 110. The upper substrate 170 supports various components of the organic light emitting diode display 100. Specifically, the upper substrate 170 is a base substrate constituting the color filter substrate. In the upper substrate 170, a color filter layer 171 and a black matrix 172 are formed to implement color in the organic light emitting diode display 100.

The black matrix 172 is formed on the bottom surface of the upper substrate 170, and is formed at the boundary between each sub-pixel SP and at the boundary between the emission area EA and the transmission area TA within the sub-pixel SP. Is formed. The black matrix 172 may partition the emission region of the light passing through the color filter layer 171 so that the light passing through each color filter does not overlap or mix with each other. The black matrix 172 may be formed of chromium (Cr) or another opaque metal film, or may be formed of a mixture of a pigment and a resin.

The color filter layer 171 is formed on the bottom surface of the upper substrate 170. The color filter layer 171 may be formed for each sub-pixel SP on the upper substrate 170, and a red (R) color filter, a green (G) color filter, and a blue patterned for each sub-pixel (SP). (B) may comprise a color filter. According to one embodiment of the present invention, since white light is emitted from the white organic light emitting diode 140, a color filter layer 171 having a pattern formed for each sub-pixel SP is further provided to express a color image.

The pad electrode 190 is formed on the lower substrate 110 in the pad region P / A. In addition, the pad electrode 190 is disposed outside the dam structure 180. In detail, the pad electrode 190 is formed on the buffer layer 131. The pad electrode 190 is composed of a plurality of conductive layers. Referring to FIG. 1B, the pad electrode 190 has a first pad electrode 191 and a second pad electrode 192 on the first pad electrode 191.

The first pad electrode 191 of the pad electrode 190 is formed of the same material as the gate electrode 121 of the thin film transistor 120 formed in the display area A / A. The gate insulating layer 132 and the interlayer insulating layer 133 are formed on the first pad electrode 191. In detail, the gate insulating layer 132 and the interlayer insulating layer 133 are formed on the edge of the first pad electrode 191 to cover the edge of the first pad electrode 191. Contact holes are formed in the gate insulating layer 132 and the interlayer insulating layer 133 to open a portion of the first pad electrode 191.

The second pad electrode 192 of the pad electrode 190 is formed of the same material as the source electrode 123 and the drain electrode 124 of the thin film transistor 120 formed in the display area A / A. For example, the second pad electrode 192 may be formed in a structure in which a copper (Cu) layer is stacked on a molybdenum-titanium (MoTi) alloy layer. The passivation layer or the planarization layer 134 may be formed on the second pad electrode 192. The second pad electrode 192 is electrically connected to the first pad electrode 191 through contact holes formed in the gate insulating layer 132 and the interlayer insulating layer 133.

Meanwhile, as shown in FIG. 1A, the first pad electrode and the second pad electrode are formed of the same material as the gate electrode and the source / drain electrode, respectively, but the materials and arrangements of the first pad electrode and the second pad electrode may be different. It is not limited to this. For example, the first pad electrode and the second pad electrode may be formed of the same material as the source / drain electrode and the anode electrode, respectively.

The dam structure 180 is formed between the lower substrate 110 and the upper substrate 170 in the non-display area I / A. The dam structure 180 is disposed to surround the filling unit 160 and is in contact with the lower substrate 110 and the upper substrate 170. The dam structure 180 may reinforce the adhesive force of the filling unit 160 by bonding the lower substrate 110 and the upper substrate 170, and may absorb moisture and oxygen penetrating from the side surface of the organic light emitting diode display 100. It serves to block. The dam structure 180 may also be referred to as a sealant because it serves as a member for sealing the components between the lower substrate 110 and the upper substrate 170.

2A to 2C are schematic views illustrating a structure of a dam structure of an organic light emitting diode display according to an exemplary embodiment of the present invention.

Referring to FIG. 2A, dam structure 180 includes base resin 281 and surface modified metal-organic structure 282.

The base resin 281 is a resin composition formed from a binder compound and disperses the surface modified metal-organic structure 282 that is a component of the dam structure 180. The base resin 281 may itself function to block moisture. In order to apply to a transparent organic light emitting display device, the base resin 281 preferably has high transparency and low birefringence.

The base resin 281 may be formed by polymerization of a binder compound. The binder compound forming the base resin may be a monomer or oligomer including a copolymerizable functional group. For example, an acrylic resin, an epoxy resin or an olefin resin may be used as the binder compound, but is not limited thereto.

The surface-modified metal-organic structure 282 is a material having nano-sized pores that can block or adsorb moisture as a getter. The surface modified metal-organic structure 282 is formed by surface modifying a metal-organic framework (MOF), which is a porous crystalline compound in which metal ions or metal ion clusters are formed by chemical bonding with an organic ligand, New functional groups have been added or substituted on the surface of the metal-organic structure.

Referring to FIG. 2B, surface modified metal-organic structure 282 includes a metal-organic structure (A) and a modified functional group (B) bonded to the particle surface of the metal-organic structure (A). The surface modified metal-organic structure 282 is formed by modifying the surface of the metal-organic structure A with a surface modifier. The modified functional group B of the surface modified metal-organic structure 282 is a functional group formed from a surface modifier.

First, the metal-organic structure (A) is a porous crystalline compound, in which metal ions or metal ion clusters may be formed by chemical bonding with an organic ligand. The pore size of the metal-organic structure may be 1 nm to 10 nm, and preferably 1 nm to 8 nm, but is not limited thereto.

The metal ions forming the metal-organic structure (A) are metal ions capable of coordinating or covalent bonding. For example, the metal ions forming the metal-organic structure are Zr ²⁺ , Zr ³⁺ , Zr ⁴⁺ , Ti ³⁺ , Ti4 ⁺ , Fe2 ⁺ , Fe ³⁺ , V4 ⁺ , V ³⁺ , V ²⁺ , Y ³⁺ , Zr ⁴⁺ , Cu ²⁺ , Al ³⁺ , Si ²⁺ , Si ⁴⁺ , Cr ³⁺ , Ga ³⁺ , Mg ²⁺ , Zn ²⁺ , Zn ³⁺ , Mn ²⁺ , Mn ³⁺ , Mn ⁴⁺ and combinations thereof.

The organic ligand forming the metal-organic structure (A) may be an organic material having a functional group capable of coordinating, ionic or covalently bonding, and coordinating, ionic or covalently bonding to form a stable metal-organic structure. Organic materials having two or more positions may be used.

For example, the organic ligand forming the metal-organic structure (A) may be aliphatic dicarboxylic acid, aliphatic tricarboxylic acid, aromatic dicarboxylic acid, aromatic tricarboxylic acid, imidazole compound, tetrazole compound, Triazole compounds, pyrazole compounds, aromatic sulfonic acids, aromatic phosphoric acids, aromatic sulfinic acids, aromatic phosphinic acids, bipyridine compounds, and combinations thereof. More specifically, the organic ligand is fumaric acid, 1,4-benzenedicarboxylate (BDC), 1,3,5-benzenetricarboxylate (1,3,5- benzenetricarboxlate (BTC), 1,1'-biphenyl-3,3 ', 5,5'-tetracarboxylate (1,1'-biphenyl-3,3', 5,5'-tetracarboxylate: BPTC) and 2- (N, N, N ', N'-tetrakis (4-carboxyphenyl) -biphenyl-4,4'-diamine (2- (N, N, N', N'-tetrakis (4-carboxyphenyl) ) -biphenyl-4,4'-diamine: TCBTDA) may be one or more selected from the group consisting of.

On the other hand, as an example of the metal-organic structure (A), MOF-801, MOF-802, MOF-808, UIO-66, UIO-66-py, UIO-66-OH, UIO-66-COOH, UIO-66 Porous compounds named -NH ₂ , UIO-66-py N-methylation, DUT-67, etc. may be used, but is not limited thereto.

The metal-organic structure and the surface modifier can be reacted to produce the surface modified metal-organic structure 282. The surface-modified metal-organic structure 282 has a functional group capable of combining hydrophobicity or the base resin 281 constituting the dam structure 180 compared to the metal-organic structure A before modification.

The surface modifier combines with the metal-organic structure to add hydrophobicity to the particle surface of the metal-organic structure, or can be directly bonded to the base resin 281 that constitutes the dam structure 180 on the particle surface of the metal-organic structure, or It functions to add functional groups copolymerizable with the binder compound constituting the resin 281.

Surface modifiers include functional groups capable of binding metal-organic structures. For example, when the organic ligands of the metal-organic structure have hydrophilic properties such as carboxylic acid groups, sulfonic acid groups, and phosphate groups, the surface modifiers may include hydrophilic functional groups to bind with the metal-organic structures. Specifically, when the metal-organic structure is (Zr ₆ O ₄ (OH) ₄ (fumarate) ₆ (MOF-801), the surface modifier may include a carboxyl group such that the chemical ligand is formed with the organic ligand fumarate.

Surface modifiers may include hydrophobic sites to impart hydrophobicity to the metal-organic structure. Specifically, the surface modifier may be an amphiphilic molecule having a hydrophilic site composed of hydrophilic functional groups capable of binding to the particle surface of the metal-organic structure and a hydrophobic site that imparts hydrophobicity to the metal-organic structure. As the surface modifier, any amphiphilic molecule capable of imparting hydrophobicity by binding to the surface of the metal-organic structure through a hydrophilic site can be used without limitation.

For example, the surface modifier imparting hydrophobicity to the particle surface of the metal-organic structure may have a hydrophobic moiety consisting of a hydrophilic moiety containing a carboxyl group and a hydrocarbon group. The hydrocarbon group may comprise an aliphatic hydrocarbon and may comprise an aromatic hydrocarbon. For example, the surface modifier may be a carboxylic acid including a hydrocarbon group such as 4-vinyl benzoic acid or oleic acid, but is not limited thereto.

Surface modifiers may include various functional groups to impart greater hydrophobicity to the particle surface of the metal-organic structure. For example, surface modifiers may include longer hydrocarbon groups to impart greater hydrophobicity.

In addition, the surface modifier may further comprise a functional group capable of reacting with another compound. For example, surface modifiers may include hydroxyl groups or nitro groups. The hydroxyl group or nitro group of the surface modifier may react with other compounds in the modified metal-organic structure to form other end groups. That is, it is possible to further extend the length of the modified functional group (B) of the surface modified metal-organic structure 282 through an additional reaction using a hydroxyl group or a nitro group, whereby the surface modified metal- The hydrophobicity of the organic structure 282 can be increased.

In addition, the surface modifier may include a functional group capable of copolymerization reaction. For example, the surface modifier may include a functional group having a carbon double bond so that the polymerization reaction can be performed with another carbon double bond. Through the reforming process, the functional group having the carbon double bond of the surface modifier is introduced to the surface of the surface-modified metal-organic structure 282, and polymerizes the polymer to the metal surface of the metal-organic structure through the polymerization reaction with other compounds. Can be formed. The polymer has a long chain structure, which can increase the hydrophobicity of the surface modified metal-organic structure 282.

Meanwhile, the surface modifier may be larger than the pore size of the metal-organic structure. If the size of the surface modifier or the length of the molecule is less than the pore size of the metal-organic structure, the surface modifier is encapsulated inside the pores of the metal-organic structure, thereby blocking the pores of the metal-organic structure, whereby the surface modified It is possible to lower the optical properties of the metal-organic structure.

The surface modifier may be directly bondable to the base resin 281 or the base resin 281 such that the surface modified metal-organic structure 282 may form a direct chemical bond with the base resin 281 constituting the dam structure 180. It may include a functional group copolymerizable with the binder compound to form a). The dam structure 180 is formed while the dam forming composition is cured. In this case, the base resin 281 is formed by copolymerizing a binder compound included in the dam forming composition. In this case, since the surface-modified metal-organic structure 282 includes a functional group capable of copolymerizing with the binder compound, a copolymerization reaction is performed together with the binder compounds in the process of curing the dam forming composition, thereby directly contacting the base resin 281. Chemically bonded structures can be formed.

For example, when the base resin 281 is formed from an acrylic resin, a compound containing an acrylate group can be used as the surface modifier. Surface modifiers comprising acrylate groups form acrylate groups on the particle surface of the metal-organic structure. The surface modified metal-organic structure 282 including the acrylate group is directly bonded with the acrylic resin in the process of forming the dam structure 180.

As the surface modifier including an acrylate group, for example, 2-carboxyethylacrylate may be used, but is not limited thereto.

The surface modified metal-organic structure 282 has a functional group capable of combining hydrophobicity or the base resin constituting the dam structure 180 compared to the metal-organic structure before modification.

As discussed above, by modifying the particle surface of the metal-organic structure with a surface modifier containing functional groups that can impart greater hydrophobicity, the particle surface of the surface-modified metal-organic structure 282 increases hydrophobicity. For example, hydrocarbon groups may be added to the particle surface of the surface modified metal-organic structure 282 to increase hydrophobicity. Since the surface-modified metal-organic structure 282 has increased hydrophobicity, the surface-modified metal-organic structure 282 may be easily dispersed in the base resin 281, and the aggregation phenomenon may be minimized. Through this, it is possible to improve the optical characteristics including the haze (Haze) of the dam structure (180).

In addition, the surface-modified metal-organic structure 282 can be chemically bonded directly to the base resin 281 by introducing functional groups capable of bonding with the base resin 281 to the particle surface of the metal-organic structure through surface modification. . For example, the surface modified metal-organic structure 282 includes functional groups bondable to the base resin 281, and upon formation of the base resin 281, the surface modified metal-organic structure 282 is directly copolymerized to form a base. It may be connected to the resin 241.

In this regard, referring to FIG. 2C, in the case of the unmodified metal-organic structure (A), aggregation phenomenon occurs in the base resin (C). The metal-organic structure A may increase in size by micrometer due to the aggregation phenomenon, which may increase the haze of the dam structure and lower the overall optical characteristic. However, the metal-organic structure (A + B) surface-modified to include functional groups copolymerizable with the base resin (C) has a structure directly connected to the base resin (C) through a chemical bond. The modified functional group (B) added to the metal-organic structure by modification is connected to some region (D) of the base resin. The surface-modified metal-organic structure 282 is directly connected with the base resin 281, so that the phenomenon of aggregation between the metal-organic structures does not occur. Through this, the optical characteristics including the haze of the dam structure 180 may be improved.

The content of the surface modified metal-organic structure 282 may be 1 wt% to 20 wt%, preferably 1 wt% to 10 wt%, based on the total solids of the dam structure. When the content of the surface-modified metal-organic structure 282 satisfies the above range, it is possible to implement the excellent water barrier performance and maintain transparency of the dam structure 180. If the content of the surface-modified metal-organic structure 282 is less than 1% by weight, the moisture barrier performance is lowered. If the content of the surface-modified metal-organic structure 282 is greater than 20%, the light transmittance of the dam structure 180 is reduced due to difficulty in dispersion in the base resin 281. Can be.

Meanwhile, the dam structure 180 may include various additives to supplement the shape and performance. For example, as an additive, spacers or silane coupling agents may be used.

The spacer maintains the height of the dam structure 180 to maintain a gap between the upper substrate 170 and the lower substrate 110, and serves to block the moisture penetration path. As the spacer, a material satisfying sufficient hardness and light transmittance may be used. For example, a glass fiber, an organic bead material, or silica may be used, but is not limited thereto.

The maximum diameter of the spacer may be 2um to 10um. When the maximum diameter of the spacer satisfies the above range, the water penetration performance of the dam structure 180 can be improved, protecting the dam structure 180 from external impact and the upper substrate 170 and the lower substrate 110. It can keep the interval.

The content of the spacer is preferably 0.1% by weight to 0.5% by weight based on the total solids of the dam structure 180.

The silane coupling agent may additionally be used to improve the adhesion of the dam structure 180. Silane coupling agents may be used as known to those skilled in the art.

The content of the silane coupling agent is preferably 1% by weight to 5% by weight based on the total solids of the dam structure 180. When the content of the silane coupling agent satisfies the above range, the dam structure 180 may serve as an adhesive for bonding the upper substrate 170 and the lower substrate 110.

In the organic light emitting diode display 100 according to the exemplary embodiment of the present invention, the dam structure 180 has an excellent water penetration performance and an excellent light transmittance. Specifically, the light transmittance of the dam structure is 90% or more, which is significantly higher than that of dam structures using a conventional metal oxide as a getter.

The shape of the dam structure 180 may be freely changed according to the structure of the OLED display 100 and the design of each component.

An organic light emitting diode display according to an exemplary embodiment includes a dam structure positioned in a non-display area, in contact with an upper substrate and a lower substrate, and surrounding a filling unit. The dam structure includes a base resin and a surface modified metal-organic structure. The dam structure adheres the upper and lower substrates of the organic light emitting diode display, seals the internal filler or other components, and blocks moisture and oxygen that penetrate from the side of the organic light emitting diode display.

Generally, dam structures include getters that block or adsorb moisture to prevent moisture and oxygen ingress from the sides. However, the conventional dam structure is unable to secure transparency due to the low light transmittance of the getter, and thus has a problem that it is difficult to apply to a transparent organic light emitting display device.

More specifically, the conventional dam structure is a barium oxide (BaO), calcium oxide (CaO), magnesium oxide (MgO), lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), potassium oxide ( K ₂ O), lithium sulfate (LiSO), sodium sulfate (Na ₂ SO ₄ ) and getter consisting of a metal oxide. However, the getter made of the above-described metal oxide has a very large particle diameter and a uniformity in size, which reduces the light transmittance of the dam structure. In addition, the metal oxide such as calcium oxide has a problem that the color change to white when the moisture is absorbed to increase the haze of the dam structure and the transparency decreases. On the other hand, in the case of nanoparticles such as metal-organic structures, water blocking performance is superior to metal oxides due to physical adsorption due to internal pores, and light transmittance is superior to metal oxides due to nano unit size. However, in general metal-organic structures, aggregation phenomenon between structures occurs in the base resin with time, and the particle size increases from nanometers to micrometers. As a result, there is a problem in that the haze increases and the overall optical characteristic is lowered.

Since the transparency of the dam structure is also lowered when the opaque getter is used, when the conventional getter is applied to the transparent organic light emitting display device, there is a problem in that the dam structure is visible in the non-display area of the organic light emitting display device. However, the organic light emitting diode display according to the exemplary embodiment includes a surface-modified metal-organic structure, thereby improving water permeation performance and greatly improving optical characteristics of the dam structure. As a result, transparency of the transparent organic light emitting display device may be improved, and life of the organic light emitting display device may be improved due to moisture and oxygen.

Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following examples are for the purpose of illustrating the present invention, and the scope of the present invention is not limited by the following examples.

Preparation Example 1 Metal-Organic Structure (Zr ₆ O ₄ (OH) ₄ (fumarate) ₆ , MOF-801) manufacture

Dissolve 0.23 g (0.70 mmol) of ZrOCl ₂ 8H ₂ O (Zirconylchloride octahydrate) and 0.081 g (0.70 mmol) of fumaric acid in 35 ml of dimethylformamide (N, N-dimethylformamide, DMF) and add 5.3 ml of fumaric acid. . The solution is heated to 120 ° C. for 24 hours to obtain a transparent metal-organic structure (yield: 90%). After washing three times with DMF, the obtained metal-organic structure is soaked in DMF for a total of three days, one day. After 3 days, the compound was immersed in methanol (MeOH) for 3 days each day in the same manner, and then purified to remove the metal-organic structure (Zr ₆ O ₄ (OH) ₄ (fumarate) ₆ , MOF. -801).

Example 1

Oleic acid (oleic acid) is dissolved in ethanol (EtOH), and then the metal-organic structure prepared according to Preparation Example 1 is dispersed to prepare a suspension solution. The prepared suspension solution is stirred at 50 ° C. for 24 hours to modify the surface of the metal-organic structure, thereby producing a modified metal-organic structure (MOF-OA).

Modified metal-organic structures (MOF-OA, 1 wt.%, 3 wt.%, 5 wt.%), Spacers (7um PMMA beads, 0.5 wt.%), Initiator (photoactive iodonium salt, 3 wt. %) Is added and then dispersed through ball-milling to form a dam forming composition.

The dam-forming composition prepared by using the dispenser is discharged onto the lower glass, and then the upper glass is bonded. Subsequently, the dam structure is formed by exposure to UV (3000 mJ) to cure the dam formation composition.

Example 2

4-vinylbenzoic acid was dissolved in ethanol, and then the metal-organic structure prepared according to Preparation Example 1 (Zr ₆ O ₄ (OH) ₄ (fumarate) ₆ , MOF-801) was dispersed in a suspension solution. To prepare. The prepared suspension solution was stirred at 50 ° C. for 24 hours to modify the surface of the metal-organic structure, thereby producing the modified metal-organic structure (MOF-styrene) in the same manner as in Example 1 Form a dam structure.

Example 3

6-hydroxyhexanoic acid was dissolved in ethanol, and then the metal-organic structure (Zr ₆ O ₄ (OH) ₄ (fumarate) ₆ , MOF-801) prepared according to Preparation Example 1 was dispersed. Prepare suspension solution. The prepared suspension solution was stirred at 50 ° C. for 24 hours to modify the surface of the metal-organic structure, thereby producing the modified metal-organic structure (MOF-OH) in the same manner as in Example 1 Form a dam structure.

Example 4

4-aminobutyric acid was dissolved in ethanol, and then suspended by dispersing the metal-organic structure (Zr ₆ O ₄ (OH) ₄ (fumarate) ₆ , MOF-801) prepared according to Preparation Example 1. Prepare a solution. The same method as in Example 1, except that a modified metal-organic structure (MOF-NH ₂ ) was prepared by stirring the prepared suspension solution at 50 ° C for 24 hours to modify the surface of the metal-organic structure. To form dam structures.

Example 5

After dissolving 2-carboxyethylacrylate in ethanol (EtOH), the metal-organic structure (Zr ₆ O ₄ (OH) ₄ (fumarate) ₆ , MOF-801) prepared according to Preparation Example 1 was prepared. Dispersion prepares a suspension solution. The dam was prepared in the same manner as in Example 1, except that the modified metal-organic structure (MOF-A) was prepared by stirring the prepared solution at 50 ° C. for 24 hours to modify the surface of the metal-organic structure. Form the structure.

Comparative Example 1

The dam-forming composition is prepared by adding a spacer and an initiator to the acrylate resin and then dispersing it through ball-milling. The dam-forming composition prepared by using the dispenser is discharged onto the lower glass, and then the upper glass is bonded. Subsequently, the dam structure is formed by exposure to UV (3000 mJ) to cure the dam formation composition.

Comparative Example 2

Calcium oxide (CaO), a spacer and an initiator are added to the acrylate resin and then dispersed through ball-milling to prepare a dam formation composition. The dam-forming composition prepared by using the dispenser is discharged onto the lower glass, and then the upper glass is bonded. Subsequently, the dam structure is formed by exposure to UV (3000 mJ) to cure the dam formation composition.

Comparative Example 3

The dam-forming composition is prepared by adding a metal-organic structure, a spacer and an initiator prepared according to Preparation Example 1 to the acrylate resin and then dispersing it through ball-milling. The dam-forming composition prepared by using the dispenser is discharged onto the lower glass, and then the upper glass is bonded. Subsequently, the dam structure is formed by exposure to UV (3000 mJ) to cure the dam formation composition.

Experimental Example 1 Measurement of Light Transmittance and Haze

For the dam structures prepared according to Examples 1 to 5 and Comparative Examples 1 to 3, the light transmittance and the haze value when the 450 nm wavelength light was transmitted through the optical measuring device were measured. The results were prepared in Table 1 below.

Experimental Example 2-Measurement of Water Transfer Velocity (WTV)

The dam structures prepared according to Examples 1 and 5 and Comparative Examples 1 to 3 were stored at a temperature of 85 ° C. and a humidity of 85%, and then the time taken for the moisture to penetrate the dam structure to 2 mm was measured. The results are shown in Table 1 below.

division Getter types Getter content Light transmittance Haze WTV Example 1 MOF-OA 1 wt% 96.2% 1.8% 216hr 3 wt% 96.9% 5.5% - 5 wt% 96.4% 9.5% - Example 2 MOF-styrene 1 wt% 97% 0.9% - 3 wt% 85% 3.5% - 5 wt% 84% 3.8% - Example 3 MOF-OH 1 wt% 99% 0.5% - 3 wt% 93% 2.9% - 5 wt% 85% 7.0% - Example 4 MOF-NH2 1 wt% 96% 1.8% - 3 wt% 86% 7.6 - 5 wt% 78% 11.3% - Example 5 MOF-A 1 wt% 97.2% 1.2% 216hr 3 wt% 95.9% 2.1% - 5 wt% 95.9% 4.2% - Comparative Example 1 - 1 wt% 98.7% 0% 120 hr Comparative Example 2 CaO 1 wt% 92.8% 8.2% 192 hr 3 wt% 84.9% 28.0% 5 wt% 68.4% 42.6% Comparative Example 3 MOF-801 1 wt% 96.8% 7.8% 216hr 3 wt% 96.0% 27.2% 5 wt% 94.5% 40.4%

As can be seen in Table 1, the dam structure of Examples 1 to 5 including the surface-modified metal-organic structure was excellent in the moisture barrier performance, it was confirmed that the optical performance such as light transmittance and transparency. Comparative Example 2 is a conventional dam structure containing calcium oxide (CaO) as a getter, WTR measurement shows a good water blocking performance, but it can be seen that the light transmittance and haze characteristics rapidly decreases when the CaO content is increased. there was. On the other hand, Comparative Example 3 is a dam structure using an unmodified metal-organic structure as a getter, but it has been confirmed that the haze is still high, but excellent moisture barrier performance and improved light transmittance. However, the dam structure manufactured using the surface-modified MOF as in Examples 1 to 5 was excellent in water barrier performance, it was confirmed that the haze value is very low. Specifically, in Examples 1 to 5, the haze value is 2.0% or less at 1 wt% content and the haze value is 5.0% or less at 5 wt% content. That is, compared with the comparative example 3 of the dam structure including the unmodified metal-organic structure, the haze value is 8%-when the modified metal-organic structure is included 1%, 3% and 5% by weight, respectively. > 2% or less, 27%-> 8% or less, 40%-> 12% or less it was confirmed that significantly reduced. That is, it was confirmed that the dam structures of Examples 1 to 5 had excellent moisture blocking performance and low haze, and thus had excellent optical characteristics, and thus were suitable for manufacturing a transparent display device. FIGS. 3A to 3F are Comparative Examples 3 and 3. It is a graph showing the light transmittance according to the content change of the modified metal-organic structure in the dam structure according to 1 to 5.

Specifically, Figure 3a is a graph showing the light transmittance according to the change in the content of the metal-organic structure included in the dam structure according to Comparative Example 3. Referring to Figure 3a, even if the content of the unmodified metal-organic structure exceeds 3% by weight based on the total solids, it was confirmed that the light transmittance is sharply reduced.

Next, FIGS. 3B to 3F are graphs showing light transmittance according to changes in the content of the modified metal-organic structure included in the dam structures according to Examples 1 to 5. FIG. Comparing FIG. 3B to FIG. 3F with FIG. 3A, in the case of the dam structure including the modified MOF, the light transmittance decreases as the content of the modified metal-organic structure increases, but is significantly superior to that of Comparative Example 1. It was confirmed that the light transmittance.

Exemplary embodiments of the invention may be described as follows.

In order to solve the above-described problems, an organic light emitting diode display according to an exemplary embodiment includes a lower substrate and a lower substrate including a plurality of sub pixels and including a display area and a non-display area surrounding the display area. A thin film transistor formed on the thin film transistor, an organic light emitting element formed on the thin film transistor, an upper substrate facing the lower substrate, a filling portion filling a space between the upper substrate and the organic light emitting element, and contacting the upper substrate and the lower substrate in the non-display area; A dam structure surrounding the filling in the non-display area, the dam structure including a base resin and a metal-organic framework surface modified to have hydrophobicity or functional groups that can bond with the base resin do.

The dam structure may suppress penetration of moisture and oxygen from the side surface of the organic light emitting diode display.

The surface modified metal-organic structure can include a structure in which a hydrocarbon group is bonded to the particle surface of the metal-organic structure.

The hydrocarbon group may have a length longer than the pore size of the metal-organic structure.

The hydrocarbon group may include a hydroxyl group or an amino group.

The surface modified metal-organic structure may comprise a functional group capable of bonding with the base resin.

The base resin includes an acrylic resin, and the bondable functional group may be an acrylate group.

The surface modified metal-organic structure can be chemically bonded with the base resin.

The surface modified metal-organic structure can be formed by modifying the particle surface of the metal-organic structure with a surface modifier comprising a hydrophilic functional group capable of bonding with the particle surface of the metal-organic structure.

The surface modifier may be an amphiphilic molecule having a hydrophilic moiety consisting of a hydrophilic functional group and a hydrophobic moiety consisting of a hydrocarbon group.

Surface modifiers may include functional groups copolymerizable with the base resin.

Surface modifiers may include acrylate groups.

Metal-organic structures are formed by chemical bonds of metal ions and organic ligands, and metal ions are Zr ²⁺ , Zr ³⁺ , Zr ⁴⁺ , Ti ³⁺ , Ti4 ⁺ , Fe2 ⁺ , Fe ³⁺ , V4 ⁺ , V ³⁺ , V ²⁺ , Y ³⁺ , Zr ⁴⁺ , Cu ²⁺ , Al ³⁺ , Si ²⁺ , Si ⁴⁺ , Cr ³⁺ , Ga ³⁺ , Mg ²⁺ , Zn ²⁺ , Zn ³⁺ , Mn ²⁺ , Mn ³⁺ and Mn ⁴⁺ and at least one selected from the group consisting of organic ligands are aliphatic dicarboxylic acids, aliphatic tricarboxylic acids, aromatic dicarboxylic acids, aromatic tricarboxylic acids, already It may be at least one selected from the group consisting of a dazole compound, a tetrazole compound, a triazole compound, a pyrazole compound, an aromatic sulfonic acid, an aromatic phosphoric acid, an aromatic sulfinic acid, an aromatic phosphinic acid and a bipyridine compound.

The dam structure may comprise 1 wt% to 10 wt% of the surface modified metal-organic structure based on solids.

Each of the plurality of sub pixels may have a light emitting area and a transparent area.

The organic light emitting diode display may further include a color filter which emits white light and is formed on a portion of the upper substrate.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications can be made without departing from the spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: organic light emitting display
110: lower substrate
120: thin film transistor
121: gate electrode
122: active layer
123: source electrode
124: drain electrode
131: buffer layer
132: gate insulating layer
133: interlayer insulation layer
134: planarization layer
140: white organic light emitting device
141: anode
142: white organic light emitting layer
143: cathode
150: encapsulation layer
160: filling unit
170: upper substrate
180, 280: dam structure
190: pad electrode
281: base resin
282 surface modified metal-organic structures

Claims (16)

A lower substrate including a plurality of sub pixels and having a display area and a non-display area surrounding the display area;
A thin film transistor formed on the lower substrate;
An organic light emitting element formed on the thin film transistor;
An upper substrate facing the lower substrate;
A filling part filling a space between the upper substrate and the organic light emitting element; And
A dam structure surrounding the filling unit in the non-display area,
The dam structure includes a base resin and a metal-organic framework having a functional group capable of bonding with the base resin, or surface-modified to improve hydrophobicity. According to claim 1,
And the dam structure suppresses penetration of moisture and oxygen from side surfaces of the organic light emitting display. According to claim 1,
The surface-modified metal-organic structure includes a structure in which a hydrocarbon group is bonded to a particle surface of the metal-organic structure. The method of claim 3, wherein
The hydrocarbon group has a length longer than the pore size of the metal-organic structure. The method of claim 3, wherein
The hydrocarbon group includes a hydroxyl group or an amino group. According to claim 1,
The surface-modified metal-organic structure includes a functional group bondable with the base resin. The method of claim 6,
The base resin includes an acrylic resin, and the bondable functional group is an acrylate group. The method of claim 6,
The surface modified metal-organic structure is chemically bonded to the base resin. According to claim 1,
The surface-modified metal-organic structure is an organic light emitting display device formed by modifying a particle surface of the metal-organic structure with a surface modifier including a hydrophilic functional group capable of bonding with the particle surface of the metal-organic structure. The method of claim 9,
And the surface modifier is an amphiphilic molecule having a hydrophilic portion composed of the hydrophilic functional group and a hydrophobic portion composed of a hydrocarbon group. The method of claim 9,
The surface modifier includes a functional group copolymerizable with the base resin. According to claim 1,
The surface modifier includes an acrylate group. According to claim 1,
The metal-organic structure is formed by a chemical bond of a metal ion with an organic ligand,
The metal ions are Zr ²⁺ , Zr ³⁺ , Zr ⁴⁺ , Ti ³⁺ , Ti4 ⁺ , Fe2 ⁺ , Fe ³⁺ , V4 ⁺ , V ³⁺ , V ²⁺ , Y ³⁺ , Zr ⁴⁺ , Cu ^In the group consisting of ²⁺ , Al ³⁺ , Si ²⁺ , Si ⁴⁺ , Cr ³⁺ , Ga ³⁺ , Mg ²⁺ , Zn ²⁺ , Zn ³⁺ , Mn ²⁺ , Mn ³⁺ and Mn ⁴⁺ 1 or more selected
The organic ligand is aliphatic dicarboxylic acid, aliphatic tricarboxylic acid, aromatic dicarboxylic acid, aromatic tricarboxylic acid, imidazole compound, tetrazole compound, triazole compound, pyrazole compound, aromatic sulfonic acid, aromatic phosphoric acid At least one organic light emitting display device selected from the group consisting of aromatic sulfinic acid, aromatic phosphinic acid and bipyridine compounds. According to claim 1,
The dam structure may include the surface-modified metal-organic structure at 1 wt% to 10 wt% based on solids. The method of claim 1,
And a plurality of sub-pixels each having a light emitting area and a transmissive area. The method of claim 1,
The organic light emitting diode emits white light,
And a color filter formed on a portion of the upper substrate.

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