KR20200025445A - Lighting module and lighting apparatus having thereof - Google Patents

Abstract

According to an embodiment, disclosed is a lighting device, comprising: a rotating body; a plurality of blades along the outer circumferential surface of the rotating body; and a first lighting module disposed on a surface of the rotating body or a front surface of the blades. The first lighting module comprises: a substrate attached to one surface of the rotating body or the front surface of the blades; a plurality of light emitting elements on the substrate; a first resin layer covering the light emitting elements; and at least one upper resin layer on the first resin layer. At least one of the first resin layer and the at least one upper resin layer comprises a fluorescent substance. The at least one upper resin layer may comprise at least one of ink particles and a diffusion agent. According to the present invention, light uniformity of a plane light source in the lighting module can be improved.

Description

Lighting module and lighting device having the same {LIGHTING MODULE AND LIGHTING APPARATUS HAVING THEREOF}

An embodiment of the invention relates to a lighting module having a light emitting device.

An embodiment of the invention relates to a lighting module having a light emitting device and a plurality of resin layers.

An embodiment of the invention relates to a lighting module for providing a surface light source.

An embodiment of the invention relates to a light unit or a vehicle lamp having a lighting module.

Embodiments of the invention relate to a lighting module or a lighting device having the same, which is moved or rotated.

Typical lighting applications include vehicle lights as well as backlights for displays and signs.

Light emitting devices, for example, light emitting diodes (LEDs) have advantages such as low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. The light emitting diode is applied to various lighting devices such as various display devices, indoor lights, or outdoor lights.

Recently, a lamp employing a light emitting diode has been proposed as a vehicle light source. Compared with incandescent lamps, light emitting diodes are advantageous in that they consume less power. However, since the emission angle of the light emitted from the light emitting diode is small, when the light emitting diode is used as a vehicle lamp, there is a demand for increasing the light emitting area of the lamp using the light emitting diode.

The small size of the light emitting diodes increases the design freedom of the lamps and is economical due to their semi-permanent lifetime.

An embodiment of the present invention may provide a lighting module that provides a surface light source.

An embodiment of the present invention may provide a lighting module in which a resin layer is disposed on a plurality of light emitting devices.

An embodiment of the present invention may provide a lighting module in which a plurality of resin layers are disposed on light emitting devices having a plurality of light emitting surfaces.

An embodiment of the present invention may provide a lighting module in which a phosphor is added to at least one of a plurality of resin layers on a circuit board and a light emitting device.

An embodiment of the present invention may provide a lighting module having ink particles in at least one of a plurality of resin layers disposed on a circuit board and a light emitting device.

An embodiment of the present invention may provide an illumination module having a phosphor in a resin layer spaced apart from a circuit board and a light emitting device.

An embodiment of the present invention may provide an illumination module having ink particles in a resin layer spaced apart from a circuit board and a light emitting device.

An embodiment of the present invention may provide a lighting module in which phosphor and ink particles are added to at least one of a plurality of resin layers disposed on a circuit board.

An embodiment of the present invention may provide a lighting module in which ink particles are added to a top layer of a plurality of resin layers disposed on a circuit board and a light emitting device.

An embodiment of the present invention provides a flexible lighting module having a plurality of light emitting devices and a plurality of resin layers.

An embodiment of the present invention provides a lamp having an illumination module disposed on a rotating member.

An embodiment of the present invention provides a lamp having a lighting module in a position opposite to the rotating member.

An embodiment of the present invention provides an illumination module having improved light extraction efficiency and light distribution characteristics.

An embodiment of the present invention provides a lighting module for irradiating a surface light source and a lighting device having the same.

An embodiment of the present invention may provide a light unit having a lighting module, a liquid crystal display, or a vehicle lamp.

Lighting device according to an embodiment of the present invention includes a rotating body; A plurality of blades along an outer circumferential surface of the rotating body; And a first lighting module disposed on a surface of the rotating body or the front of the blade, wherein the first lighting module comprises: a substrate attached to one surface of the rotating body or the front of the blade; A plurality of light emitting elements on the substrate; A first resin layer covering the light emitting device, and at least one upper resin layer on the first resin layer, at least one of the first resin layer and the at least one upper resin layer includes a phosphor; The at least one upper resin layer may include at least one of ink particles and a diffusion agent.

According to an embodiment of the invention, the first lighting module is disposed on the entire front surface of the blade, the surface color of the first lighting module may include the same color as the ink particles.

According to an embodiment of the present disclosure, the first lighting module may include a plurality of lighting modules emitting different light on front surfaces of different blades.

According to an embodiment of the present invention, it includes a second lighting module disposed on the back of the blade, the first lighting module may emit red light, the second lighting module may emit yellow or blue light.

According to an embodiment of the invention, the first lighting module may be disposed along the outer circumferential surface of the rotating body.

According to an embodiment of the present invention, the blade may include a thermally conductive material or a transparent material, and the rotating body may include a transparent material.

According to an embodiment of the present invention, the at least one upper resin layer includes at least one of a diffusion layer and a second resin layer, the second resin layer includes ink particles, and the second resin layer is the first resin. It may extend to the side of the layer and contact the top surface of the substrate.

According to an embodiment of the invention, the second resin layer comprises a phosphor, the emission wavelength of the phosphor and the ink particles have the same red color, the content of the phosphor in the second resin layer is 12wt% to 23wt %, The content of the ink particles in the second resin layer may include a range of 3wt% to 13wt%.

According to an embodiment of the present invention, the light emitting device includes: a substrate made of a transparent material; A light emitting structure having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer under the substrate; A first electrode connected to the first conductive semiconductor layer under the light emitting structure; A second electrode connected to the second conductive semiconductor layer is disposed below the light emitting structure, and the first electrode and the second electrode of the light emitting device may be connected to the circuit board in a flip manner.

According to an embodiment of the present invention, it is possible to improve the light uniformity of the surface light source in the illumination module.

According to an embodiment of the present invention, light may be guided and diffused from the illumination module and emitted to improve the uniformity of the surface light source.

According to an embodiment of the present invention, by converting the light diffused in the illumination module into a phosphor to improve the uniformity of the wavelength-converted light.

According to an embodiment of the present invention, a hot spot on each light emitting device may be reduced in the lighting module.

According to an embodiment of the present invention, the colored phosphor film is provided on the lighting module to realize an image in the color of the phosphor film when turned on.

According to an embodiment of the present invention, by stacking a plurality of resin diffusion layers, it can be implemented as a flexible lighting module.

According to an embodiment of the present invention, by placing the lighting module on the surface of the rotating member or a structure facing the rotating member, it can be provided as a lamp capable of dynamic lighting.

According to an embodiment of the invention, by placing the lighting module on the surface of the rotating member or the structure facing the rotating member, it is possible to improve the heat dissipation effect when driving the lighting module.

According to an embodiment of the invention, it is possible to improve the light efficiency and light distribution characteristics of the lighting module.

The embodiment of the present invention can reduce the difference in chromaticity between the appearance image of the resin layer and the emission image of the lighting module.

The embodiment of the present invention can reduce the amount of phosphor by disposing ink particles having the same color as the light emitting color of the phosphor on the top layer of the illumination module.

Embodiments of the invention can improve the unlit color of the lighting module.

The optical reliability of the lighting module and the lighting device having the same according to an embodiment of the present invention can be improved.

It is possible to improve the reliability of the vehicle lighting apparatus having a lighting module according to an embodiment of the present invention.

Embodiments of the present invention may be applied to a backlight unit having an illumination module, various display devices, a surface light source illumination device, or a vehicle lamp.

1 is a side cross-sectional view showing a lighting module according to a first embodiment of the present invention.
2 is an example of a top view of the lighting module of FIG. 1.
3 is a diagram illustrating a first modified example of the lighting module of FIG. 1.
4 is a diagram illustrating a second modified example of the lighting module of FIG. 1.
5 is another example of the lighting module of FIG. 4.
6 is a diagram illustrating a third modified example of the lighting module of FIG. 1.
FIG. 7 is another example of the lighting module of FIG. 6.
8 is a diagram illustrating a fourth modified example of the lighting module of FIG. 1.
9 is another example of the lighting module of FIG. 8.
10 is another example of the lighting module of FIG. 1.
11 is a fifth modified example of the lighting module of FIG. 1.
12 is another example of the lighting module of FIG. 11.
FIG. 13 is a sixth modified example of the lighting module of FIG. 1.
14 is an example of a side sectional view of a lighting module according to a second embodiment of the invention.
15 is an example of a first modification of the lighting module according to the second embodiment.
FIG. 16 is a second modified example of the lighting module of FIG. 15.
17 is a third modified example of the lighting module according to the second embodiment.
18 is a fourth modified example of the lighting module according to the second embodiment.
19 is a fifth modified example of the lighting module according to the second embodiment.
20 is a sixth modified example of the lighting module according to the second embodiment.
21 is a seventh modified example of the lighting module according to the second embodiment.
22 is an example of an eighth modification of the lighting module according to the second embodiment.
23 is an example of a ninth modification of the lighting module according to the second embodiment.
24 is a tenth modified example of the lighting module according to the second embodiment.
25 is an eleventh modified example of the lighting module according to the second embodiment.
FIG. 26 is a view for explaining an example of a change in surface color according to turn-on or turn-off of a light emitting device in a resin layer having ink particles according to a second embodiment.
27 is an example of a lamp to which the lighting module according to the first and second embodiments is applied in the third embodiment of the present invention.
28 is an example of the blade part in which the lighting module is arranged in the lamp of FIG. 27.
29 is another example of the blade unit in which the lighting module is disposed in the lamp of FIG. 27.
30 is an example of a blade unit in which the lighting module of FIGS. 28 and 29 is disposed.
31 is another example in which the lighting module according to the embodiment of the present invention is disposed above and below the blade unit.
32 illustrates an example in which a light emitting device is disposed on one surface of a rotating body of a blade unit.
FIG. 33 is an example of an illumination module in which a light emitting device is coupled to a recess disposed on one surface of the rotating plate of FIG. 32.
FIG. 34 illustrates another example of FIG. 32, in which a light emitting device is disposed at a position corresponding to the blade around a rotation body.
FIG. 35 is a view illustrating a path in which light emitted from a light emitting device in FIG. 34 is irradiated to a blade.
36 illustrates another example of a blade unit in which a light emitting device is disposed.
FIG. 37 is an exploded side cross-sectional view in which the reflective layer of the housing is disposed around the blade portion of FIG. 36;
38 is a cross-sectional side view of the front of the fixing body and the blade of the housing in which the light emitting device is disposed, according to an embodiment of the present invention.
39 is an example of a light emitting device in the lighting module according to an embodiment of the present invention.
40 is a plan view of a vehicle to which a lamp having a lighting module according to an embodiment is applied.
41 is a view showing a lamp having a lighting module or a lighting apparatus according to the embodiment.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical idea of the present invention is not limited to some embodiments described, but may be embodied in different forms, and within the technical idea of the present invention, one or more of the components may be selectively selected between the embodiments. Can be combined and substituted. In addition, the terms (including technical and scientific terms) used in the embodiments of the present invention may be generally understood by those skilled in the art to which the present invention pertains, unless specifically defined and described. The terms commonly used, such as terms defined in advance, may be interpreted as meanings in consideration of the contextual meaning of the related art. In addition, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the text, and may be combined with A, B, and C when described as "at least one (or more than one) of A and B and C". May contain one or more of all possible combinations. In addition, in describing the components of the embodiments of the present disclosure, terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the components from other components, and the terms are not determined by the nature, order or order of the components. And when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only connected, coupled or connected directly to the other component, It may also include the case where 'connected', 'coupled' or 'connected' due to another component between the other components. In addition, when described as being formed or placed on the "top (or bottom)" of each component, the top (bottom) or bottom (bottom) is not only when two components are in direct contact with each other, but also It also includes a case where the above-described further components are formed or disposed between two components. In addition, when expressed as "up (up) or down (down)" may include the meaning of the down direction as well as the up direction based on one component.

The lighting device according to the present invention is applicable to various lamp devices, such as vehicle lamps, home lighting devices, or industrial lighting devices that require lighting. For example, when applied to vehicle lamps, headlamps, vehicle lights, side mirrors, fog lights, tail lamps, brake lights, daytime running lights, vehicle interior lights, door scars, rear combination lamps, backup lamps Applicable to the back. The lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, and various electric vehicle fields, and can be applied to all lighting related fields or advertisement related fields that are currently developed and commercialized or can be implemented according to future technological developments. Will be said.

First Embodiment

1 is a side cross-sectional view illustrating a lighting module according to a first embodiment, and FIG. 2 is an example of a plan view of the lighting module of FIG. 1.

1 and 2, the lighting module 100 covers a substrate 11, a light emitting element 21 disposed on the substrate 11, and a cover of the light emitting element 21 on the substrate 11. The first resin layer 31 may include at least one or more upper layers 41 and 51 on the first resin layer 31.

The illumination module 100 may emit light emitted from the light emitting element 21 as a surface light source. The illumination module 100 may include a reflective member disposed on the upper surface of the substrate 11. The reflective member may reflect the light traveling to the upper surface of the substrate 11 to the first resin layer 31. The light emitting device 21 may be disposed on the substrate 11. In the lighting module 100, the plurality of light emitting devices 21 may be arranged in N columns (N is an integer of 1 or more) or / and M rows (M is an integer of 1 or more). The plurality of light emitting devices 21 may be arranged in N columns and M rows (where N and M are integers of 2 or more) as shown in FIG. 2. The lighting module 100 may be applied to various lamp devices that require lighting, such as vehicle lamps, home lighting devices, and industrial lighting devices. For example, in the case of a lighting module applied to a vehicle lamp, a head lamp, a headlight, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a back up lamp, a stop lamp ), Daytime running right, vehicle interior lighting, door scarf, rear combination lamp and backup lamp.

As shown in FIGS. 1 and 2, the substrate 11 may function as a base member or a support member positioned under the light emitting element 21 and the first resin layer 31.

The substrate 11 includes a printed circuit board (PCB). The substrate 11 may include, for example, at least one of a resin-based printed circuit board (PCB), a metal core (Metal Core) PCB, a flexible PCB, a ceramic PCB, or an FR-4 substrate. . The substrate 11 may include, for example, a flexible PCB or a rigid PCB. The upper surface of the substrate 11 has an X-axis-Y-axis plane, the thickness of the substrate 11 may be a height in the Z direction perpendicular to the X direction and the Y direction. Here, the X direction may be a first direction, the Y direction may be a second direction orthogonal to the X direction, and the Z direction may be a third direction orthogonal to the X direction and the Y direction.

The substrate 11 may include a wiring layer (not shown) thereon, and the wiring layer may be electrically connected to the light emitting device 21. The reflective member or the protective layer disposed on the substrate 11 may protect the wiring layer. The plurality of light emitting elements 21 may be connected in series, in parallel, or in series-parallel by a wiring layer of the substrate 11. The plurality of light emitting elements 21 may have two or more groups connected in series or in parallel, or the groups may be connected in series or in parallel.

The length x1 of the X direction and the length y1 of the Y direction of the substrate 11 may be different from each other. For example, the length x1 of the X direction may be longer than the length y1 of the Y direction. The length x1 in the X direction may be disposed at twice or more times the length y1 in the Y direction. The thickness of the substrate 11 may be 0.5 mm or less, for example, in the range of 0.3 mm to 0.5 mm. Since the thickness of the substrate 11 is provided thin, the thickness of the lighting module may not be increased. Since the substrate 11 has a thickness of 0.5 mm or less, the substrate 11 may support the flexible module. The thickness of the substrate 11 may be 0.1 times or less, or 0.1 to 0.06 times the interval from the lower surface of the substrate 11 to the upper surface of the uppermost layer 51. The distance from the bottom surface of the substrate 11 to the top surface of the uppermost layer 51 may be a module thickness.

The thickness of the illumination module 100 may be 1/3 or less of a short length among lengths x1 and y1 of the substrate 11 in the X and Y directions, but is not limited thereto. The thickness of the illumination module 100 may be 5.5 mm or less from the bottom of the substrate 11, or may be in the range of 4.5 mm to 5.5 mm or in the range of 4.5 mm to 5 mm. The thickness of the lighting module 100 may be a straight line distance between the lower surface of the substrate 11 and the upper surface of the upper layers 41 and 51. The thickness of the lighting module 100 may be 220% or less, for example, 180% to 220% of the thickness of the first resin layer 31. Since the illumination module 100 has a thickness of 5.5 mm or less, it may be provided as a flexible and slim surface light source module.

When the thickness of the lighting module 100 is thinner than the above range, the light diffusion space may be reduced and hot spots may be generated. When the illumination module 100 is larger than the above range, spatial installation constraints and design freedom may be reduced due to the increase of the module thickness. The embodiment provides a thickness of 5.5 mm or less or 5 mm or less to provide a module having a curved structure, thereby reducing design freedom and space constraints. The ratio of the length y1 of the lighting module 100 in the Y direction to the thickness of the lighting module 100 may be 1: m, and may have a ratio relationship of m = 1, wherein m is at least 1 The above natural number, and the heat of the light emitting element 21 may be an integer smaller than m. For example, when m is four times greater than the thickness of the lighting module 100, the light emitting elements 21 may be arranged in four rows.

The substrate 11 may include a connector 14 at a portion thereof to supply power to the light emitting devices 21. The region 13 in which the connector 14 is disposed in the substrate 11 is a region where the first resin layer is not formed, and may be equal to or smaller than the length y1 of the substrate 11 in the Y direction. The connector 14 may be disposed on a portion of an upper surface or a portion of a lower surface of the substrate 11. When the connector 14 is disposed on the bottom of the substrate 11, the region can be removed. The substrate 11 may have a top view shape of a rectangular shape, a square shape, another polygonal shape, or a bar shape having a curved shape. The connector 14 may be a terminal connected to the light emitting element 21, a female connector, or a male connector.

The substrate 11 may include a protective layer or a reflective layer thereon. The protective layer or the reflective layer may include a member having a solder resist material, and the solder resist material is a white material and may reflect incident light.

As another example, the substrate 11 may include a transparent material. Since the substrate 11 of the transparent material is provided, the light emitted from the light emitting element 21 may be emitted in the upper and lower direction of the substrate 11.

The light emitting device 21 may be disposed on the substrate 11 and sealed by the first resin layer 31. The plurality of light emitting elements 21 may be in contact with the first resin layer 31. The first resin layer 31 may be disposed on side surfaces and top surfaces of the light emitting device 21. The first resin layer 31 may protect the light emitting devices 21 and may contact the upper surface of the substrate 11.

Light emitted from the light emitting element 21 may be emitted through the first resin layer 31. The light emitting device 21 has a light emitting surface S1 and a plurality of side surfaces S2, and the light emitting surface S1 faces the upper surfaces of the upper layers 41 and 51 and the upper layers 41 and 51. The light is emitted in the direction of). The light exit surface S1 is an upper surface of the light emitting element 21 and most of the light is emitted. The plurality of side surfaces S2 include at least four side surfaces, and emit light in a lateral direction of the light emitting device 21. The light emitting device 21 is an LED chip that emits at least five surfaces, and may be disposed on the substrate 11 in the form of a flip chip. The light emitting device 21 may be formed to a thickness of less than 0.3mm. As another example, the light emitting device 21 may be implemented as a horizontal chip or a vertical chip. In the case of the horizontal chip or the vertical chip, it may be connected to another chip or a wiring pattern by a wire. When a wire is connected to the LED chip, the thickness of the diffusion layer may increase due to the height of the wire, and the distance between the light emitting elements 21 may increase due to the connection space according to the length of the wire. The light emitting device 21 according to the embodiment may increase the distribution of the directivity angle by five-side light emission. The light emitting device 21 may be disposed on the substrate 11 by a flip chip. The distance a between the light emitting elements 21 may be equal to or greater than the thickness b and b = a of the first resin layer 31. The interval (a) may be, for example, 2.5 mm or more, and may vary depending on the LED chip size. The minimum distance between the light emitting elements 21 may be equal to or larger than the individual thickness of each of the first resin layers 31.

Since the light emitting device 21 disclosed in the embodiment is provided as a flip chip that emits at least five surfaces, the luminance distribution and the direction angle distribution of the light emitting device 21 can be improved. In the lighting module according to the embodiment, even if the distance between the light emitting devices is further increased, it can be seen that the dark part is not generated. In addition, the orientation angle distribution of the light emitting device may be provided to 130 degrees or more. That is, the distribution of the directivity angles can be more widely distributed, which can give a light diffusion effect, reduce the occurrence of dark areas, and increase the distance between the light emitting devices.

When the light emitting device 21 is disposed in the NХM matrix on the substrate 11, N may be one column or two or more columns, and M may be one row or two or more rows. N, M is an integer of 1 or more. The light emitting elements 21 may be arranged in the Y-axis and X-axis directions, respectively.

The light emitting device 21 is a light emitting diode (LED) chip and may emit at least one of blue, red, green, ultraviolet (UV), or infrared light. The light emitting element 21 may emit at least one of blue, red, and green, for example. The light emitting device 21 may be electrically connected to the substrate 11, but is not limited thereto.

The light emitting device 21 may be sealed with an insulating layer or resin transparent to the surface, but is not limited thereto. The light emitting device 21 may be formed with a phosphor layer having a phosphor on the surface.

The light emitting device 21 may include a support member having a ceramic support member or a metal plate at a lower portion thereof, and the support member may be used as an electrically conductive and thermally conductive member.

The lighting module according to the embodiment may include a plurality of resin layers on the light emitting device 21 and the substrate 11. The plurality of resin layers may include, for example, two or more layers or three or more layers. The plurality of resin layers may optionally include at least two layers or three or more layers of a layer free of impurities, a layer to which phosphor is added, and a layer having a diffusing agent, and a layer to which phosphor / diffuser is added. At least one of the plurality of resin layers may optionally include at least one of a diffusing agent, a phosphor, and ink particles. That is, the phosphor and the diffusion agent may be added to separate resin layers or may be mixed with each other and disposed on one resin layer. The impurity may include a phosphor, a diffusion agent, or ink particles. The layers provided with the phosphor and the diffusion agent may be disposed adjacent to each other or spaced apart from each other. When the phosphor and the layer in which the diffusing agent are disposed are separated from each other, the layer in which the phosphor is disposed may be disposed above the layer in which the diffusing agent is disposed. The phosphor and the ink particles may be disposed on the same layer or different layers. The resin layer to which the Ick particles are added may be disposed above the resin layer to which the phosphor is added.

The phosphor may include at least one of a blue phosphor, a green phosphor, a red phosphor, an amber phosphor, and a yellow phosphor. The size of the phosphor may range from 1 μm to 100 μm. The higher the density of the phosphor, the higher the wavelength conversion efficiency, but the luminous intensity may be lowered, and may be added in consideration of the light efficiency within the size. The diffusion agent may include at least one of PMMA (Poly Methyl Meth Acrylate) series, TiO ₂ , SiO ₂ , Al ₂ O ₃ , and silicon series. The diffusing agent may have a refractive index in the range of 1.4 to 2 at an emission wavelength, and the size may range from 1 μm to 100 μm. The diffusion agent may be spherical, but is not limited thereto. For example, the diffusing agent may have a uniformity of light of 90% or more when the refractive index is 1.4 or more, or a uniformity of light of 90% or more when the size is in the range of 1 μm to 30 μm. The light uniformity is light uniformity on a region in which the light emitting devices are connected to each other, and may be provided as 90% or more.

The ink particles may include at least one of metal ink, UV ink, or curing ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles may be any one of green, red, yellow, and blue. The ink types include polyvinyl chloride (PVC) ink, polycarbonate (PC) ink, acrylonitrile butadiene styrene copolymer (ABS) ink, UV resin ink, epoxy ink, silicone ink, polypropylene (PP) ink, aqueous ink, plastic ink, PMMA It can be selectively applied among (poly methyl methacrylate) ink and polystyrene (PS) ink. Here, the width or diameter of the ink particles may be in the range of 5 μm or less, for example, 0.05 μm to 1 μm. At least one of the ink particles may be smaller than the wavelength of light. The color of the ink particles may include at least one of red, green, yellow, and blue. For example, the phosphor may emit a red wavelength, and the ink particles may include red. For example, the red color of the ink particles may be darker than the color of the wavelength of the phosphor or light. The ink particles may have a color different from the color of light emitted from the light emitting device. The ink particles may have an effect of blocking or blocking incident light.

The resin layer may include a resin or a resin-based material. The plurality of resin layers may have the same refractive index, the at least two layers may have the same refractive index, or the layer adjacent to the uppermost layer may have a lower or higher refractive index.

Referring to FIG. 1, the lighting module 100 may include at least one upper layer on the first resin layer 31. The upper layer may include a first diffusion layer 41 disposed on the first resin layer 31 and a second diffusion layer 51 disposed on the first diffusion layer 41. The first and second diffusion layers 41 and 51 may be resin layers disposed on the first resin layer 31. Alternatively, the first diffusion layer 41 may be defined as a second resin layer disposed on the first resin layer, and the second diffusion layer 51 may be defined as a third resin layer disposed on the second resin layer. .

The first resin layer 31 is disposed on the substrate 11 and seals the light emitting device 21. The first resin layer 31 may be thicker than the thickness of the light emitting device 21. The first resin layer 31 may be a transparent resin material, for example, a resin material such as UV (ultra violet) resin, silicone, or epoxy. The first resin layer 31 may be a diffusion layer or a molding layer without a diffusion agent.

The thickness b of the first resin layer 31 may be thicker than the thickness of the substrate 11. The thickness b of the first resin layer 31 may be 5 times or more, for example, 5 to 9 times greater than the thickness of the substrate 11. The first resin layer 31 may be disposed to the thickness of the first resin layer 31 to seal the light emitting device 21 on the substrate 11, prevent moisture penetration, and support the substrate 11. The first resin layer 31 and the substrate 11 may be a flexible plate. The thickness b of the first resin layer 31 may be 2.7 mm or less, for example, in the range of 2 mm to 2.7 mm. When the thickness b of the first resin layer 31 is smaller than the range, the distance between the light emitting element 21 and the first diffusion layer 41 may be reduced or the thickness of the layer for diffusion may be increased. If it is larger than the range, the module thickness may be increased or the brightness may be decreased.

The first resin layer 31 is disposed between the substrate 11 and the first diffusion layer 41 and guides the light emitted from the light emitting element 21 to be emitted to the first diffusion layer 41. The first resin layer 31 may be a layer of a transparent material to which impurities are not added. Since the first resin layer is free of impurities, light may be transmitted with straightness.

The light emitted from the light emitting element 21 is emitted through the light exit surface S1 and the side surface S2, and the light emitted through the light exit surface S1 and the side surface S2 is the first resin layer ( 31). Light emitted through the side surface S2 or reflected in the first and second diffusion layers 41 and 51 may be reflected back from the upper surface of the substrate 11. The light emitting device 21 may emit blue light, for example, in the range of 420 nm to 470 nm.

The first diffusion layer 41 may be in contact with the first resin layer 31. The first diffusion layer 41 may be cured after being formed of a resin material having a diffusion agent after the first resin layer 31 is cured. Here, the diffusion agent may be added in the range of 1.5wt% to 2.5wt% based on the amount of the first diffusion layer 41 in the process. The first diffusion layer 41 may be a transparent resin material, for example, a resin material such as UV (ultra violet) resin, epoxy, or silicon. The refractive index of the first diffusion layer 41 may be 1.8 or less, for example, in the range of 1.1 to 1.8 or 1.4 to 1.6, and may be lower than the refractive index of the diffusion agent.

As the UV resin, for example, a resin (oligomer type) containing urethane acrylate oligomer as a main material can be used as a main material. For example, urethane acrylate oligomers that are synthetic oligomers can be used. The main material may further include a monomer in which a low boiling point dilution-type reactive monomer, IBOA (isobornyl acrylate), HBA (Hydroxybutyl Acrylate), HEMA (Hydroxy Metaethyl Acrylate), and the like are mixed, and as an additive, a photoinitiator (eg, 1-hydroxycyclohexyl). phenyl-ketone, Diphenyl), Diphwnyl (2,4,6-trimethylbenzoyl phosphine oxide), or an antioxidant may be mixed. The UV resin may be formed of a composition comprising 10 to 21% oligomer, 30 to 63% monomer, 1.5 to 6% additive. In this case, the monomer may be composed of a mixture of 10 to 21% of IBOA (isobornyl acrylate), 10 to 21% of HBA (Hydroxybutyl Acrylate), and 10 to 21% of HEMA (Hydroxy Metaethyl Acrylate). The additive may be added to 1 to 5% of the photoinitiator to perform the function of initiating photoreactivity, and may be formed of a mixture that can improve the yellowing phenomenon by adding 0.5 to 1% of the antioxidant. Formation of the resin layer using the above-described composition forms a layer of a resin such as UV resin instead of the light guide plate to enable refractive index and thickness control, and at the same time, both the adhesive properties, the reliability and the mass production rate using the above-described composition. Can be met.

The first resin layer 31 and the first diffusion layer 41 may be made of the same resin material. When the first resin layer 31 and the first diffusion layer 41 are made of the same resin material, the first resin layer 31 and the first diffusion layer 41 are in close contact with each other, and the first resin layer 31 and the first resin layer 31 are in close contact with each other. Light loss at the interface between the first diffusion layers 41 can be reduced. The refractive index of the resin material may be 1.8 or less, for example, in the range of 1.1 to 1.8 or 1.4 to 1.6, and may be lower than the refractive index of the diffusing agent.

The first diffusion layer 41 may have a thickness (c, b> c) that is thinner than the thickness (b) of the first resin layer (31). The thickness c of the first diffusion layer 41 may be 80% or less, for example, 40% to 80% of the thickness b of the first resin layer 31. Since the first diffusion layer 41 is provided in a thin thickness, ductility characteristics of the lighting module can be ensured.

The first diffusion layer 41 may include beads or dispersing agents therein. The first diffusion layer 41 may be disposed between the first resin layer 31 and the second diffusion layer 51. The diffusing agent may have a refractive index in the range of 1.4 to 2 at an emission wavelength, and the size may range from 4 μm to 6 μm. The diffusion agent may be spherical, but is not limited thereto.

The diffusion agent of the first diffusion layer 41 may diffuse the light incident through the first resin layer 31. Therefore, occurrence of hot spots due to light emitted through the first diffusion layer 41 may be reduced. The diffusing agent may have a size smaller than the wavelength of light emitted from the light emitting element 21. Since the diffusing agent is disposed with a size smaller than the wavelength, it is possible to improve the light diffusing effect.

The content of the diffusion agent may be in the range of 5 wt% or less, for example, 2 wt% to 5 wt% in the first diffusion layer 41. When the content of the diffusing agent is smaller than the range, there is a limit to lower the hot spot, and when larger than the range, the light transmittance may be lowered. Therefore, the diffusing agent is disposed in the content of the first diffusion layer 41 to diffuse the light can reduce the hot spot without lowering the light transmittance.

The second diffusion layer 51 may be made of a material different from that of the resin of the first resin layer 31 and the first diffusion layer 41. The second diffusion layer 51 may be a transparent layer and may include a phosphor therein. The second diffusion layer 51 may include at least one of at least one type of phosphor, for example, a red phosphor, an amber phosphor, or a yellow phosphor. By adding a phosphor in the second diffusion layer 51, the wavelength conversion efficiency of the diffused light may be increased. The second diffusion layer 51 may include a material such as silicon or epoxy. The second diffusion layer 51 may have a refractive index in the range of 1.45 to 1.6. The refractive index of the second diffusion layer 51 may be equal to or higher than that of the diffusion agent. The second diffusion layer 51 may be higher than the refractive indexes of the first resin layer 31 and the first diffusion layer 41. When the refractive index of the second diffusion layer 51 is lower than the above range, the uniformity of light may be lowered, and when higher than the above range, the light transmittance may be lowered. Accordingly, the refractive index of the second diffusion layer 51 may be provided in the above range, thereby controlling light transmittance and light uniformity. The second diffusion layer 51 may be defined as a layer having a phosphor therein and diffusing light.

The content of the phosphor may be added in the same amount as the resin material forming the second diffusion layer 51. The phosphor may be added at a ratio of 40% to 60% relative to the resin material of the second diffusion layer 51 to 40% to 60%. For example, the resin material of the third phosphor and the second diffusion layer 51 may be added in the same ratio, for example, 50% to 50% may be mixed. As another example, the phosphor may range from 40 wt% to 60 wt%, and the resin material of the second diffusion layer 51 may range from 40 wt% to 60 wt%. The content of the phosphor may have a difference of 20% or less or 10% or less with the resin material of the second diffusion layer 51. In addition, it can be seen that the amount of phosphor required for color coordinates Cx and Cy decreases as the density of beads added to the first diffusion layer increases. Accordingly, it can be seen that the amount of phosphor is controlled according to the degree of diffusion of light by the diffusing agent.

According to the embodiment, the content of the phosphor in the second diffusion layer 51 is added in the range of 40 wt% or more, or 40 wt% to 60 wt%, so that the color on the surface of the second diffusion layer 51 may be provided as the color of the phosphor. It can improve the diffusion and wavelength conversion efficiency of light. In addition, the wavelength of light emitted from the light emitting element 21 through the second diffusion layer 51, for example, may reduce transmission of blue light. In addition, the light extracted through the second diffusion layer 51 may be provided to the surface light source by the wavelength of the phosphor.

For example, the second diffusion layer 51 may be provided in the form of a film by curing after adding a phosphor in a resin material. The second diffusion layer 51 may be formed directly on the first diffusion layer 41 or may be separately formed and then bonded. The second diffusion layer 51 formed in the film form may be adhered to an upper surface of the first diffusion layer 41. An adhesive may be disposed between the second diffusion layer 51 and the first diffusion layer 41.

The adhesive is a transparent material, and may be an adhesive such as UV adhesive, silicone or epoxy. Since the second diffusion layer 51 is provided in the form of a film, the phosphor distribution therein may be uniformly provided, and color sensitivity of the surface color may be provided at a predetermined level or more.

By using the resin film as the second diffusion layer 51, a module having higher ductility can be provided as compared with the case where a polyester (PET) film is used. The second diffusion layer 51 may be a protective film having a phosphor or a release film having a phosphor. The second diffusion layer 51 may be provided as a film that can be attached or separated from the first diffusion layer 41.

The second diffusion layer 51 may have a thickness d, d <c <b, which is smaller than the thickness c of the first diffusion layer 41, for example, 0.3 mm to 0.5 mm. The thickness d of the second diffusion layer 51 may be in the range of 25% or less, for example, 16% to 25% of the thickness c of the first diffusion layer 41. The thickness d of the second diffusion layer 51 may be in the range of 18% or less, for example, 14% to 18% of the thickness b of the first resin layer 31. If the thickness d of the second diffusion layer 51 is thicker than the range, light extraction efficiency may be reduced or the module thickness may be increased. If the thickness d is smaller than the range, it may be difficult to suppress hot spots or the wavelength conversion efficiency may be reduced. Can be. In addition, the second diffusion layer 51 is a layer for wavelength conversion and external protection, and when the thickness is greater than the above range, the ductility of the module may be deteriorated and design freedom may be lowered.

The phosphor wavelength converts light emitted from the light emitting element 21. When the phosphor is a red phosphor, the phosphor is converted into red light. Most of the light emitted from the light emitting device 21 may be wavelength converted. The light is uniformly diffused through the diffusion agent added to the first diffusion layer 41, and the diffused light may be wavelength-converted by the phosphor added to the second diffusion layer 51. As another example, the phosphor may include, for example, at least one or two or more of an Amber phosphor, a yellow phosphor, a green phosphor, a red phosphor, or a blue phosphor.

The second diffusion layer 51 may be provided with a phosphor, so that the appearance color may be shown as the color of the phosphor. For example, when the phosphor is red, the surface color of the second diffusion layer 51 may be shown in red. The surface of the second diffusion layer 51 or the surface of the illumination module may be provided as a red image when the light emitting device 21 is extinguished. When the light emitting device 21 is lighted, a red color having a predetermined luminous intensity is provided. Light may be diffused to provide a red image of the surface light source. In some cases, the color coordinates of the surface color may have different values within the color color of the phosphor.

The lighting module 100 according to the embodiment may have a thickness of 5.5 mm or less and emit a surface light source through an upper surface, and may have a ductile characteristic. The lighting module 100 may emit light through the side surface.

The embodiment can provide a flexible lighting module having a plurality of resin layers, for example, a first resin layer 31 and diffusion layers 41 and 51 on the substrate 11. The lighting module of the embodiment guides and spreads the light in the first resin layer 31 in the radial direction or the straight direction, and diffuses the light through the diffusion agent of the first diffusion layer 41, and the second diffusion layer 51. Can be converted and diffused through the phosphor. Accordingly, the light to be finally emitted through the lighting module is emitted to the surface light source. In addition, the plurality of light emitting devices 21 in the lighting module 100 emits five surfaces on the flexible circuit board in a flip manner, and the light emitted through the top and side surfaces of the light emitting device 21 is the first and second diffusion layers. (41, 51) direction and the first resin layer 31 may be emitted in the lateral direction. The light emitted from the light emitting device 210 may emit light in the upper surface and all side directions of the lighting module. The lighting module may be a display device having a vehicle lamp or a micro LED. Applicable to the device.

The illumination module can remove an additional inner lens by providing a surface light source, and the first resin layer 31 seals the light emitting elements 21, thereby providing air on the light emitting elements 21. The structure for inserting the gap or the light emitting device 21 can be removed.

The illumination module 100 may be provided in a flat plate shape, a convex curved shape or a concave curved shape, or a convex / concave shape when viewed from the side. When viewed from the top view, the lighting module may have a bar shape like a stripe, a polygonal shape, a circular shape, an ellipse shape, a shape having a convex side, or a shape having a concave side.

Hereinafter, as an example in which the diffusion layer is modified or changed into another structure in the lighting module as shown in FIGS. 3 to 13, the same configuration as the above configuration is referred to the above description and may be selectively applied to the present modification or other examples.

3 is a first modified example of the lighting module of FIG. 1.

Referring to FIG. 3, in the lighting module, a plurality of light emitting devices 21 may be disposed on a substrate 11, and a first resin layer 32 may be disposed on the plurality of light emitting devices 21. The lighting module is a configuration in which two layers are removed from the lighting module described in FIG. 1.

The first resin layer 32 may include a phosphor and a diffusion agent. The phosphor may include, for example, at least one of a red phosphor, an amber phosphor, a yellow phosphor, a green phosphor, or a white phosphor. The first resin layer 32 may be defined as a diffusion layer or a resin layer. The first resin layer 32 may be formed of the same material as the material of the first resin layer illustrated in FIG. 1.

The content of the diffusion agent added to the first resin layer 32 may be in the range of 5 wt% or less, for example, 2 wt% to 5 wt%. When the content of the diffusing agent is smaller than the range, there is a limit to lower the hot spot, and when larger than the range, the light transmittance may be lowered. Therefore, the diffusing agent may be disposed in the content of the first resin layer 32 to diffuse the light, thereby reducing the hot spot without decreasing the light transmittance.

The phosphor added in the first resin layer 32 may have a content difference of 25% or less or 15% or less with the resin material of the first resin layer 32. The phosphor may be added to the first resin layer 32 in a range of 35 wt% or more or 35 wt% to 45 wt%. The content of the phosphor in the first resin layer 32 may be added at least five times higher than the content of the diffusion agent. Accordingly, the color on the surface of the first resin layer 32 may be provided as the color of the phosphor, and may improve light diffusion and wavelength conversion efficiency. In addition, the wavelength of light emitted from the light emitting element 21 through the first resin layer 32, for example, may reduce transmission of blue light. In addition, the light extracted through the first resin layer 32 may be provided to the surface light source by the wavelength of the phosphor. The thickness of the first resin layer 32 may be formed in the range of 3mm or more, for example, 3mm to 5mm. Since the first resin layer 32 is provided in the thickness of the above range, it is possible to diffuse the light and convert the wavelength. Such a lighting module may be provided as a surface light source. The thickness of the first resin layer 32 may be equal to or smaller than the distance between the light emitting devices 21.

The illumination module of FIG. 3 has a structure in which the first and second diffusion layers are removed in FIG. 1, and may provide a surface light source of which wavelength is converted using the thickness of the first resin layer 32. The first resin layer 32 may include a function of the first and second diffusion layers disclosed in FIG. 1. The first resin layer 32 may be molded and cured on the light emitting device 21. The lighting module according to the embodiment may have a thickness of 5.5 mm or less and emit a surface light source through an upper surface, and may have a ductile characteristic. The lighting module may emit light through the side.

4 is a second modified example of the lighting module of FIG. 1.

Referring to FIG. 4, in the lighting module, a plurality of light emitting elements 21 are disposed on a substrate 11, and the plurality of light emitting elements 21 is molded into a first resin layer 33 and the first resin. The first diffusion layer 55 may be disposed on the layer 33. The lighting module is a configuration in which one layer is removed from the lighting module described in FIG. 1.

The first resin layer 33 may mold the light emitting device 21. The first resin layer 33 may be cured after being formed of a resin material having the diffusion agent. Here, the diffusion agent may be added in the range of 1.5wt% to 2.5wt% based on the amount of the first resin layer 33 in the process. The first resin layer 33 may be a transparent resin material, for example, a resin material such as UV (ultra violet) resin, epoxy, or silicon. The first diffusion layer 55 and the first resin layer 33 may be made of the same resin material. The lighting module may provide a thin module thickness by removing some layers of FIG. 1, and may diffuse hot light through the first resin layer 33 to reduce hot spots. The first resin layer 33 may include the function of a layer having a diffusing agent in FIG. 1.

The first resin layer 33 may have a thickness of 3 mm or more, for example, in a range of 3 mm to 4 mm, to prevent a decrease in light diffusion. The first resin layer 33 may include beads or dispersing agents therein. The first resin layer 33 may be disposed between the substrate 11 and the first diffusion layer 55. The first resin layer 33 may diffuse the light emitted through the light emitting device 21. Therefore, generation of hot spots due to light emitted through the first resin layer 33 may be reduced. The diffusing agent may have a size smaller than the wavelength of light emitted from the light emitting element 21. Since the diffusing agent is disposed with a size smaller than the wavelength, it is possible to improve the light diffusing effect.

The content of the diffusion agent may be in the range of 5 wt% or less, for example, 2 wt% to 5 wt% in the first resin layer 33. When the content of the diffusing agent is smaller than the range, there is a limit to lower the hot spot, and when larger than the range, the light transmittance may be lowered. Therefore, the diffusing agent is disposed in the content of the first resin layer 33 to diffuse the light can reduce the hot spot without lowering the light transmittance.

The first diffusion layer 55 may include a phosphor, and the phosphor may include, for example, at least one of a red phosphor, an amber phosphor, a yellow phosphor, a green phosphor, or a white phosphor. The phosphor added in the first diffusion layer 55 may have a content difference of 20% or less or 10% or less with the resin material of the first diffusion layer 55. The content of the phosphor may be added to the first diffusion layer 55 in a range of 40 wt% or more or 40 wt to 60 wt%. Accordingly, the color on the surface of the first diffusion layer 55 may be provided as the color of the phosphor, and may improve light diffusion and wavelength conversion efficiency. In addition, the wavelength of light emitted from the light emitting element 21 through the first diffusion layer 55, for example, may reduce transmission of blue light. In addition, the light extracted through the first diffusion layer 55 may be provided to the surface light source by the wavelength of the phosphor. The thickness of the first diffusion layer 55 may be formed in a range of 0.3 mm or more, for example, 0.3 mm to 0.7 mm. By providing the first diffusion layer 55 in the thickness of the above range, it is possible to diffuse the light and convert the wavelength. Such a lighting module may be provided as a surface light source. The lighting module according to the embodiment may have a thickness of 5.5 mm or less and emit a surface light source through an upper surface, and may have a ductile characteristic. The lighting module may emit light through the side.

FIG. 5 is another example of FIG. 4. In the lighting module, a first diffusion layer 55 is disposed on the first resin layer 33 covering the light emitting device 21 according to the embodiment, and the first diffusion layer 55 is disposed. May include a side portion 55a covering a side surface of the first resin layer 33. The side portion 55a of the first diffusion layer 55 is disposed along the side surface of the first resin layer 33 and covers the side surface of the first resin layer 33. The side portion 55a may extend in an upper surface direction of the substrate 11 at an upper edge of the first resin layer 33. The side portion 55a of the first diffusion layer 55 may contact the upper surface of the substrate 11. By contacting the side portion 55a of the first diffusion layer 55 along the outer circumference of the substrate 11, moisture penetration may be prevented and the side surface of the lighting module may be protected. The phosphor disclosed above may be added to the side portion 55a of the first diffusion layer 55, but is not limited thereto. The side portion 55a of the first diffusion layer 55 may be formed on one side, at least two sides, or all sides of the first resin layer 33, or may open at least one side. Some light may be extracted through the open area.

6 is a third modified example of the lighting module of FIG. 1.

Referring to FIG. 6, in the lighting module, a plurality of light emitting elements 21 are disposed on a substrate 11, a first resin layer 33 is molded on the plurality of light emitting elements 21, and the first resin is formed. The first diffusion layer 52 may be disposed on the layer 33. The lighting module is a configuration in which one layer is removed from the lighting module described in FIG. 1.

The first resin layer 33 may mold the light emitting device 21. The first resin layer 33 may be cured after being formed of a resin material having the diffusion agent. Here, the diffusion agent may be added in the range of 1.5wt% to 2.5wt% based on the amount of the first resin layer 33 in the process. The first resin layer 33 may be a transparent resin material, for example, a resin material such as UV (ultra violet) resin, epoxy, or silicon. The lighting module can provide a thin module thickness by removing one layer from the module of FIG. 1, and can reduce hot spots by diffusing light through the first resin layer 33.

The first resin layer 33 may have a thickness of 3 mm or more, for example, in a range of 3 mm to 4 mm, and may prevent a decrease in light diffusion. The first resin layer 33 may include beads or dispersing agents therein. The first resin layer 33 may be disposed between the substrate 11 and the first diffusion layer 52. The first resin layer 33 may diffuse the light emitted through the light emitting device 21. Therefore, generation of hot spots due to light emitted through the first resin layer 33 may be reduced. The diffusing agent may have a size smaller than the wavelength of light emitted from the light emitting element 21. Since the diffusing agent is disposed with a size smaller than the wavelength, it is possible to improve the light diffusing effect.

The content of the diffusion agent may be in the range of 5 wt% or less, for example, 2 wt% to 5 wt% in the first resin layer 33. When the content of the diffusing agent is smaller than the range, there is a limit to lower the hot spot, and when larger than the range, the light transmittance may be lowered. Therefore, the diffusing agent is disposed in the content of the first resin layer 33 to diffuse the light can reduce the hot spot without lowering the light transmittance.

The first diffusion layer 52 may include a phosphor and a diffusion agent, and the phosphor may include, for example, at least one of a red phosphor, an amber phosphor, a yellow phosphor, a green phosphor, or a white phosphor. The diffusion agent may include at least one of PMMA (Poly Methyl Meth Acrylate) series, TiO ₂ , SiO ₂ , Al ₂ O ₃ , and silicon series. The diffusing agent may have a refractive index in the range of 1.4 to 2 at an emission wavelength, and the size may range from 4 μm to 6 μm. The diffusion agent may be spherical, but is not limited thereto. The content of the diffusion agent may be in the range of 5 wt% or less, for example, 2 wt% to 5 wt% in the first resin layer 33. When the content of the diffusing agent is smaller than the range, there is a limit to lower the hot spot, and when larger than the range, the light transmittance may be lowered. Therefore, the diffusing agent is disposed in the content of the first resin layer 33 to diffuse the light can reduce the hot spot without lowering the light transmittance.

The phosphor added in the first diffusion layer 52 may have a content difference from the resin material of the first diffusion layer 52 with 35% or less or 25% or less. The phosphor may be added to the first diffusion layer 52 in a range of 35 wt% or more or 35 wt% to 45 wt%. The content of the phosphor in the first diffusion layer 52 may be added at least five times higher than the content of the diffusion agent. Accordingly, the color on the surface of the first diffusion layer 52 may be provided as the color of the phosphor, and may improve light diffusion and wavelength conversion efficiency. In addition, the wavelength of light emitted from the light emitting element 21 through the first diffusion layer 52, for example, may reduce transmission of blue light. In addition, the light extracted through the first diffusion layer 52 may be provided to the surface light source by the wavelength of the phosphor. The thickness of the first diffusion layer 52 may be formed in a range of 0.3 mm or more, for example, 0.3 mm to 0.7 mm. By providing the first diffusion layer 52 in the thickness of the above range, it is possible to diffuse the light and convert the wavelength. Such a lighting module may be provided as a surface light source. The lighting module may be provided as a flexible surface light source module having a thin thickness.

FIG. 7 is another example of the lighting module of FIG. 6.

Referring to FIG. 7, in the lighting module, a first diffusion layer 52 is disposed on a first resin layer 33 covering the light emitting device 21 disclosed in the embodiment, and the first diffusion layer 52 is the first diffusion layer 52. It may include a side portion (52a) covering the side of the resin layer 33. The side portion 52a of the first diffusion layer 52 may cover along the side surface of the first resin layer 33 and may extend in the upper surface direction of the substrate 11. The side portion 52a of the first diffusion layer 52 may contact the upper surface of the substrate 11. By contacting the side portion 52a of the first diffusion layer 52 along the outer circumference of the substrate 11, moisture penetration may be prevented and the side surface of the lighting module may be protected. The phosphor and the diffusion agent disclosed above may be added to the side portion of the first diffusion layer 52, but is not limited thereto. The side portion 52a of the first diffusion layer 52 may be formed on one side, at least two sides, or all sides of the first resin layer 33, or may open at least one side. Some light may be extracted through the open area.

8 is a fourth modified example of the lighting module of FIG. 1. The fourth modified example is a modified example of the structure of FIG. 1, and will be described based on other examples than the description of FIG. 1.

Referring to FIG. 8, the lighting module includes a substrate 11, a plurality of light emitting elements 21 on the substrate 11, a first resin layer 31 covering the light emitting elements 21, and the first resin layer. A first diffusion layer 41 on the 31 and a second diffusion layer 53 on the first diffusion layer 41 may be included. The configuration of the first and second diffusion layers will be described with reference to FIG. 1. The second diffusion layer 53 may be defined as a second resin layer, a diffusion layer, or a phosphor layer.

The second diffusion layer 53 may include a phosphor and a diffusing agent, and the phosphor may include, for example, at least one of a red phosphor, an amber phosphor, a yellow phosphor, a green phosphor, or a white phosphor. The diffusion agent may include at least one of PMMA (Poly Methyl Meth Acrylate) series, TiO ₂ , SiO ₂ , Al ₂ O ₃ , and silicon series. The diffusing agent may have a refractive index in the range of 1.4 to 2 at an emission wavelength, and the size may range from 4 μm to 6 μm. The diffusion agent may be spherical, but is not limited thereto. The content of the diffusion agent may be in the range of 5 wt% or less, for example, 2 wt% to 5 wt% in the first diffusion layer 41. When the content of the diffusing agent is smaller than the range, there is a limit to lower the hot spot, and when larger than the range, the light transmittance may be lowered. Therefore, the diffusing agent is disposed in the content of the first diffusion layer 41 to diffuse the light can reduce the hot spot without lowering the light transmittance.

The phosphor added in the second diffusion layer 53 may have a content difference of 35% or less or 25% or less from the resin material of the second diffusion layer 53. The phosphor may be added to the second diffusion layer 53 in a range of 35 wt% or more or 35 wt% to 45 wt%. Accordingly, the color on the surface of the second diffusion layer 53 may be provided as the color of the phosphor, and may improve light diffusion and wavelength conversion efficiency. In addition, the wavelength of light emitted from the light emitting element 21 through the second diffusion layer 53, for example, may reduce transmission of blue light. In addition, the light extracted through the second diffusion layer 53 may be provided to the surface light source by the wavelength of the phosphor. The thickness of the second diffusion layer 53 may be formed in a range of 0.3 mm or more, for example, 0.3 mm to 0.5 mm. By providing the second diffusion layer 53 in the thickness of the above range, it is possible to diffuse the light and convert the wavelength. Such a lighting module may be provided as a surface light source.

FIG. 9 is another example of the lighting module of FIG. 8. In the lighting module of FIG. 8, the first and second diffusion layers are the same and further include a side portion 52a of the second diffusion layer 52. The second diffusion layer 52 may include a side portion 52a covering side surfaces of the first resin layer 31 and the first diffusion layer 41. The side portion 52a of the second diffusion layer 52 may cover the side surfaces of the first resin layer 31 and the first diffusion layer 41 and may extend in an upper surface direction of the substrate 11. The side portion 52a of the second diffusion layer 52 may contact the upper surface of the substrate 11. By contacting the side portion 52a of the second diffusion layer 52 along the outer circumference of the substrate 11, moisture penetration may be prevented and the side surface of the lighting module may be protected. The phosphor and the diffusion agent disclosed above may be added to the side portion 52a of the second diffusion layer 52. The side portion 52a of the second diffusion layer 52 may be formed on one side, at least two sides, or all sides of the first resin layer 31 and the first diffusion layer 41, or may open at least one side. have.

FIG. 10 is another example of the lighting module of FIG. 1. In the lighting module of FIG. 1, the first and second diffusion layers are the same and further include a side portion 51a of the second diffusion layer 51. The second diffusion layer 51 may include a side portion 51a covering side surfaces of the first resin layer 31 and the first diffusion layer 41. The side surface portion of the second diffusion layer 51 may cover the side surfaces of the first resin layer 31 and the first diffusion layer 41 and may extend in an upper surface direction of the substrate 11. The side portion 51a of the second diffusion layer 51 may be in contact with the upper surface of the substrate 11. By contacting the side surface portion 51a of the second diffusion layer 51 along the outer circumference of the substrate 11, moisture penetration may be prevented and the side surface of the lighting module may be protected. The phosphor disclosed above may be added to the side portion 51a of the second diffusion layer 51, but is not limited thereto. The side portion 51a of the second diffusion layer 51 may be formed on one side, at least two sides, or all sides of the first and second diffusion layers, or may open at least one side.

11 is a fifth modified example of the lighting module of FIG. 1. The fifth modified example is a modified example of the structure of FIG. 1 and will be described with reference to the example different from that of FIG. 1.

Referring to FIG. 11, the lighting module includes a substrate 11, a plurality of light emitting elements 21 on the substrate 11, a first resin layer 31 covering the light emitting elements 21, and the first resin. The first diffusion layer 54 may be included on the layer 31. The configuration of the first resin layer 31 will be described with reference to FIG. 1, and one layer is removed from the lighting module of FIG. 1.

The first diffusion layer 54 may include a phosphor and a diffusing agent, and the phosphor may include, for example, at least one of a red phosphor, an amber phosphor, a yellow phosphor, a green phosphor, or a white phosphor. Can be. The diffusion agent may include at least one of PMMA (Poly Methyl Meth Acrylate) series, TiO ₂ , SiO ₂ , Al ₂ O ₃ , and silicon series. The diffusing agent may have a refractive index in the range of 1.4 to 2 at an emission wavelength, and the size may range from 4 μm to 6 μm. The diffusion agent may be spherical, but is not limited thereto. The content of the diffusion agent may be in the range of 5 wt% or less, for example, 2 wt% to 5 wt% in the first diffusion layer 54. When the content of the diffusing agent is smaller than the range, there is a limit to lower the hot spot, and when larger than the range, the light transmittance may be lowered. Therefore, the diffusing agent is disposed in the content of the first diffusion layer 54 to diffuse the light can reduce the hot spot without lowering the light transmittance.

The phosphor added in the first diffusion layer 54 may have a content difference of less than or equal to 35% or less than or equal to 25% with the resin material of the first diffusion layer 54. The phosphor may be added to the first diffusion layer 54 in a range of 35 wt% or more or 35 wt% to 45 wt%. The content of the phosphor in the first diffusion layer 54 may be added at least five times higher than the content of the diffusion agent. Accordingly, the color on the surface of the first diffusion layer 54 may be provided as the color of the phosphor, and may improve light diffusion and wavelength conversion efficiency. In addition, the wavelength of light emitted from the light emitting element 21 through the first diffusion layer 54, for example, may reduce transmission of blue light. In addition, the light extracted through the first diffusion layer 54 may be provided to the surface light source by the wavelength of the phosphor. The first diffusion layer 54 may have a thickness of 1.7 mm or more, for example, in the range of 1.7 mm to 2.2 mm. By providing the first diffusion layer 54 in the thickness of the above range, it is possible to diffuse the light and convert the wavelength. Such a lighting module may be provided as a surface light source. The lighting module may be provided as a flexible surface light source module having a thin thickness. The first diffusion layer 54 may be defined as a resin layer, a diffusion layer, or a phosphor layer.

12 is another example of the lighting module of FIG. 11. In the lighting module of FIG. 11, the first resin layer 31 is the same and further includes a side portion 54a of the first diffusion layer 54. The first diffusion layer 54 may include a side portion 54a covering a side surface of the first resin layer 31. The side portion 54a of the first diffusion layer 54 may cover the side surface of the first resin layer 31 and may extend in an upper surface direction of the substrate 11. The side portion 54a of the first diffusion layer 54 may contact the upper surface of the substrate 11. By contacting the side portion 54a of the first diffusion layer 54 along the outer circumference of the substrate 11, moisture penetration may be prevented and the side surface of the lighting module may be protected. The phosphor disclosed above may be added to the side portion 54a of the first diffusion layer 54, but is not limited thereto. The side portion 54a of the first diffusion layer 54 may be formed on one side, at least two sides, or all sides of the first resin layer 31, or may open at least one side.

FIG. 13 is a sixth modified example of the lighting module of FIG. 1. FIG. 13 is an example in which the first and second diffusion layers are modified in the lighting module of FIG. 1.

Referring to FIG. 13, the lighting module includes a substrate 11, a light emitting element 21 disposed on the substrate 11, a first resin layer 31, and the first resin layer on the substrate 11. An adhesive layer 45 and a light shield 46 on the adhesive layer 31, a first diffusion layer 41 on the adhesive layer 45 and the light shield 46, and a second diffusion layer on the first diffusion layer 41. 51). In the lighting module, the first resin layer 31 and the first and second diffusion layers 41 and 51 are the same as those in FIG. 1, and description thereof will be omitted.

The adhesive layer 45 may be adhered between the first resin layer 31 and the first diffusion layer 41. The adhesive layer 45 may be formed of the same material or different materials as those of the first resin layer 31 and the first diffusion layer 41. The adhesive layer 45 may be made of a resin material such as silicon or epoxy. The adhesive layer 45 may be disposed around the light blocking portion 46 or may extend to the bottom surface of the light blocking portion 46. The light blocking portion 46 may be disposed in a region corresponding to the light emitting element 21 on a lower surface of the first diffusion layer 41. The light blocking portion 46 may be a 50% or more, for example, a 50% to 120% range of the upper surface area of the light emitting device 21 on the light emitting device 21. The light blocking portion 46 may be formed through a region printed with a white material. The light blocking unit 46 may be printed using, for example, a reflective ink including any one of TiO ₂ , Al ₂ O ₃ CaCO ₃ , BaSO ₄ , and silicon. The light blocking part 46 reflects the light exiting through the light exit surface of the light emitting device 21, thereby reducing the occurrence of large hot spots due to the light intensity on the light emitting device 21. The light blocking unit 46 may print a light blocking pattern by using a light blocking ink. The light blocking portion 46 may be formed in a manner that is printed on the lower surface of the first diffusion layer 41. The light blocking part 46 may transmit light as a function of light blocking and diffusion since the light transmittance may be lower than the reflectance without blocking 100% of incident light. The light blocking portion 46 may be formed in a single layer or a multilayer, and may have the same pattern shape or different pattern shapes.

The second diffusion layer 51 may include a side portion disclosed above, and may cover side surfaces of the first resin layer 31 and the first diffusion layer 41. As another example, the side portion may be formed to extend by the first diffusion layer 31. As another example, the side surface portion of the second diffusion layer 51 has been described as an example of contacting the upper surface of the substrate 11, but the upper surface of any one of the first resin layer 31 and the first diffusion layer 41. Can be contacted. As another example, the side surface portion of the second diffusion layer 51 may contact at least one of the top surfaces of the first resin layer 31 and the first diffusion layer 41 and the top surface of the substrate 11. In this case, the outer circumferences of the first resin layer 31 and the first diffusion layer 41 may be formed in an uneven pattern.

The lighting module according to the embodiment may have the best wavelength conversion efficiency when the diffusion layer having the phosphor is disposed at the position farthest from the light emitting device. The first to second diffusion layers may be stacked as described above, or may be stacked differently. For example, the first diffusion layer having the diffusion agent may be adjacent to the light emitting device or further disposed below the first resin layer. For example, the second diffusion layer having the phosphor may be adjacent to the light emitting device or disposed below the first resin layer, but is not limited thereto. The lighting module may be provided as a flexible surface light source module having a thin thickness.

The upper surface area of the substrate 11 disclosed in the first embodiment may be equal to or larger than the lower surface area of the first resin layer disclosed above. The length of the first and second directions X and Y of the substrate 11 may be greater than the length of the first and second directions of the first resin layer. The outer periphery of the substrate 11 may extend outwardly from the side of the first resin layer. The outer periphery of the substrate 11 may extend outwardly than the side portions of the first and second diffusion layers. The length of the first and second directions of the substrate 11 may be 10% or less, or may protrude in a range of 1% to 10% from at least one of side surfaces of the first resin layer and side surfaces of the first and second diffusion layers. have.

The embodiment of the present invention can solve the problem that the material of the diffusion plate such as the light guide plate is not flexible, so that it is unsuitable for the curved structure. In addition, the number of light emitting devices can be reduced for the surface light source.

The embodiment can provide a flexible lighting module having a plurality of resin layers, for example, a first resin layer 31 and diffusion layers 41 and 51 on the substrate 11. A flexible lighting module having such a laminated structure can be provided. The lighting module of the embodiment guides and spreads the light in the first resin layer 31 in the radial direction or the straight direction, and diffuses the light through the diffusion agent of the first diffusion layer 41, and the second diffusion layer 51. Can be converted and diffused through the phosphor.

Accordingly, the light to be finally emitted through the lighting module is emitted to the surface light source. In addition, the plurality of light emitting devices 21 in the lighting module 100 emits five surfaces on the flexible circuit board in a flip manner, and the light emitted through the top and side surfaces of the light emitting device 21 is the first and second diffusion layers. (41, 51) direction and the first resin layer 31 may be emitted in the lateral direction.

Second Embodiment

In the description of the second embodiment, a redundant description of the same configuration as that of the first embodiment will be omitted, and the same configuration as the first embodiment will be referred to the first embodiment. The lighting module according to the second embodiment may include one or a plurality of resin layers on the light emitting device and the circuit board. The resin layer may include, for example, one or more layers or two or more layers. The resin layer is at least two of a layer free from impurities, a layer to which phosphors are added, and a layer having a diffusing agent, a layer to which ink particles are added, a layer to which phosphors and a diffusing agent are added, and a layer to which phosphors and ink particles are added Or three or more layers optionally. The impurity may include a phosphor, a diffusion agent, or ink particles. At least one of the plurality of resin layers may optionally include at least one of a diffusing agent, a phosphor, and ink particles. That is, each of the phosphor, the diffusion agent, and the ink particles may be added to separate resin layers from each other, or may be mixed with each other and disposed on one resin layer. At least one or two or more of the phosphor, the diffusing agent, and the ink particles may be added to one resin layer. The layers provided with the phosphor and the diffusion agent may be disposed adjacent to each other or spaced apart from each other. When the phosphor and the layer in which the diffusing agent are disposed are separated from each other, the layer in which the phosphor is disposed may be disposed above the layer in which the diffusing agent is disposed. The phosphor and the ink particles may be disposed on the same layer or different layers. The resin layer to which the Ick particles are added may be disposed above the resin layer to which the phosphor is added.

14 is a side sectional view of a lighting module according to a second embodiment.

Referring to FIG. 14, the lighting module 101 includes a substrate 11, a light emitting element 21 disposed on the substrate 11, and a first resin covering the light emitting element 21 on the substrate 11. It may include layer 61. The substrate 11 and the light emitting element 21 will be referred to the configurations disclosed in FIGS. 1 to 13.

The illumination module 101 may emit light emitted from the light emitting element 21 as a surface light source. The illumination module 101 may include a reflective member disposed on the upper surface of the substrate 11. The reflective member may reflect the light traveling to the upper surface of the substrate 11 to the first resin layer 61. The light emitting device 21 may be disposed on the substrate 11. The plurality of light emitting elements 21 disposed on the substrate 11 may be arranged as shown in FIG. 2, or arranged in N columns and M rows (N and M are integers of 1 or more). A portion of the upper or lower surface of the substrate 11 may be provided with a connector to supply power to the light emitting elements 21.

The light emitting device 21 is an LED chip emitting at least five surfaces, and may be disposed on the substrate 11 in a flip chip shape. As another example, the light emitting device 21 may be implemented as a horizontal chip or a vertical chip. The light emitting device 21 is a light emitting diode (LED) chip and may emit at least one of blue, red, green, ultraviolet (UV), or infrared light. The light emitting element 21 may emit at least one of blue, red, and green, for example. The light emitting device 21 may be sealed with an insulating layer or resin transparent to the surface, but is not limited thereto. The light emitting device 21 may be formed with a phosphor layer having a phosphor on the surface.

The light emitting element 21 may be disposed on the substrate 11 and sealed by the first resin layer 61. The plurality of light emitting elements 21 may be in contact with the first resin layer 61. The first resin layer 61 may be disposed on side and top surfaces of the light emitting device 21.

The first resin layer 61 may protect the light emitting devices 21 and may contact the upper surface of the substrate 11. Light emitted from the light emitting element 21 may be emitted through the first resin layer 61. The light emitting device 21 may emit blue light, for example, in the range of 420 nm to 470 nm.

The first resin layer 61 may be thicker than the thickness of the light emitting device 21. The first resin layer 61 may be a transparent resin material, for example, a resin material such as UV (ultra violet) resin, silicone, or epoxy.

The first resin layer 61 may include a phosphor. The first resin layer 61 may include phosphors and ink particles. The first resin layer 61 may include a phosphor, ink particles, and a diffusing agent. The first resin layer 61 may include at least one or two or more of a phosphor, ink particles, and a diffusing agent. The phosphor may include, for example, at least one of a red phosphor, an amber phosphor, a yellow phosphor, a green phosphor, or a white phosphor. The diffusion agent may include at least one of PMMA (Poly Methyl Meth Acrylate) series, TiO ₂ , SiO ₂ , Al ₂ O ₃ , and silicon series. The diffusing agent may have a refractive index in the range of 1.4 to 2 at an emission wavelength, and the size may range from 1 μm to 100 μm. The diffusion agent may be spherical, but is not limited thereto. The light uniformity by the diffusing agent is light uniformity on a region in which the light emitting elements 21 are connected to each other, and may be provided at 90% or more.

The ink particles may include at least one of metal ink, UV ink, or curing ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles may be any one of green, red, yellow, and blue. The ink types include polyvinyl chloride (PVC) ink, polycarbonate (PC) ink, acrylonitrile butadiene styrene copolymer (ABS) ink, UV resin ink, epoxy ink, silicone ink, polypropylene (PP) ink, aqueous ink, plastic ink, PMMA It can be selectively applied among (poly methyl methacrylate) ink and polystyrene (PS) ink. Here, the width or diameter of the ink particles may be 5㎛ or less, or may range from 0.05㎛ to 1㎛. At least one of the ink particles may be smaller than the wavelength of light.

The ink particles may include at least one of metal ink, UV ink, or curing ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles may be any one of green, red, yellow, and blue. The ink types include polyvinyl chloride (PVC) ink, polycarbonate (PC) ink, acrylonitrile butadiene styrene copolymer (ABS) ink, UV resin ink, epoxy ink, silicone ink, polypropylene (PP) ink, aqueous ink, plastic ink, PMMA It can be selectively applied among (poly methyl methacrylate) ink and polystyrene (PS) ink. Here, the width or diameter of the ink particles may be in the range of 5 μm or less, for example, 0.05 μm to 1 μm. At least one of the ink particles may be smaller than the wavelength of light. The color of the ink particles may include at least one of red, green, yellow, and blue. For example, the phosphor may emit a red wavelength, and the ink particles may include red. For example, the red color of the ink particles may be darker than the color of the wavelength of the phosphor or light. The ink particles may be different from the color of the light emitted from the light emitting element 21. The ink particles may have an effect of blocking or blocking incident light.

The lighting module 101 according to the second embodiment may include phosphors and ink particles in the first resin layer 61. Since the light generated from the light emitting element 21 is blocked by the ink particles, hot spots can be reduced. By the ink particles, the concentration of the phosphor can be significantly reduced. For example, in the lighting module without ink particles, the phosphor content may be increased to 35% or more, and in the lighting module including ink particles, the phosphor content may be reduced to 23% or less. The surface of the illumination module 101 or the surface of the first resin layer 61 by the first resin layer 61 having the ink particles may be provided similar to the surface color when light is emitted. That is, the chromaticity or color difference of the surface of the first resin layer 61 according to the on / off of the light emitting device 21 can be reduced.

The first resin layer 61 may include a phosphor, a diffusing agent, and ink particles, in which case the content of the diffusing agent may be in the range of 3 wt% or less, for example, 1 wt% to 3 wt%, and the content of the phosphor is 23 wt%. It may be added in the range of less than or equal to 10wt% to 23wt%, the ink particles may be added in the range of 12wt% or less, for example, 4wt% to 12wt%. In the first resin layer 61, the hot spot may be reduced by the content of the diffusing agent and the light transmittance may be prevented from being lowered, and the decrease of the wavelength conversion efficiency may be prevented by the content of the phosphor. The content of can reduce the color difference of the surface color and lower the hot spot.

When the first resin layer 61 includes phosphors and ink particles, the diffusion agent may be 0 wt%. In this structure, the phosphor content may be added in a range of 23 wt% or less or 10 wt% to 23 wt%, and the ink particles may be added in a range of 12 wt% or less, for example, 4 wt% to 12 wt%. The phosphor content of the first resin layer 61 may be 3 wt% or more than the content of the ink particles, or may be added in a range of 3 wt% to 13 wt%. The weight of the ink particles is smaller than the weight of the phosphor, so that the ink particles may be distributed in an area closer to the surface of the first resin layer than the phosphor. Accordingly, the color of the surface of the first resin layer 61 may be provided as the color of the ink particles. Such ink particles can suppress light transmission, and the hot spot can be lowered.

Color on the surface of the first resin layer 61 may be provided as the color of the color of the ink particles, it is possible to reduce the color difference of the appearance image due to the on / off of the light emitting element 21 and to reduce the wavelength conversion efficiency Can be prevented. In addition, the wavelength of the light emitted from the light emitting device 21 or the blue light transmitted through the first resin layer 61 may be reduced. In addition, the light emitted through the first resin layer 61 may be provided to the surface light source by the wavelength of the phosphor. The first resin layer 61 may have a thickness of 3 mm or more, for example, in a range of 3 mm to 5 mm. The thickness of the first resin layer 61 may be equal to or smaller than the distance between the light emitting devices 21.

The first resin layer 61 may be molded and cured on the light emitting device 21. The lighting module 101 may have a thickness of 5.5 mm or less and emit a surface light source through an upper surface, and may have a ductile characteristic. The lighting module 101 may emit light through the top and side surfaces.

FIG. 15 is a first modified example of the lighting module of FIG. 14.

Referring to FIG. 15, the lighting module 101A may include a substrate 11, a light emitting device 21, a first resin layer 47, and a first diffusion layer 62.

In the lighting module 101, the first structural example may include a diffusing agent and a phosphor in the first resin layer 47, and may include ink particles in the first diffusion layer 62. In the second structural example, a diffusion agent may be included in the first resin layer 47, and phosphors and ink particles may be included in the first diffusion layer 62. The third structural example is a layer free of impurities in the first resin layer 47, and may include phosphors, ink particles, and a diffusing agent in the first diffusion layer 62. In the fourth structural example, a phosphor is added to the first resin layer 47, and ink particles may be included in the first diffusion layer 62. The fifth structural example may be a layer free of impurities in the first resin layer 47, and may be a layer including phosphors and ink particles in the first diffusion layer 62. In the fourth and fifth structural examples, the diffusion agent may not be added to the first resin layer 47 and the first diffusion layer 62.

The content of the diffusion agent may be in the range of 3 wt% or less, for example, 1 wt% to 3 wt% in the first resin layer 47. When the content of the diffusing agent is smaller than the range, there is a limit to lower the hot spot, and when larger than the range, the light transmittance may be lowered. Therefore, the diffusing agent is disposed in the content of the first resin layer 47 to diffuse the light can reduce the hot spot without lowering the light transmittance.

The amount of phosphor added to the first resin layer 47 or the first diffusion layer 62 may be added in a range of 23 wt% or less or 10 wt to 23 wt%. Accordingly, light diffusion and wavelength conversion efficiency in the lighting module can be improved. In addition, the wavelength of light emitted from the light emitting element 21 through the first diffusion layer 62, for example, may reduce the transmission of blue light. In addition, the light extracted through the first diffusion layer 62 may be provided to the surface light source by the wavelength of the phosphor. The phosphor may include, for example, at least one of a red phosphor, an amber phosphor, a yellow phosphor, a green phosphor, or a white phosphor.

The content of the ink particles added to the first diffusion layer 62 may be added in a range of 12 wt% or less or 4 wt% to 12 wt%. Accordingly, the surface color on the surface of the first diffusion layer 62 may be improved, and light diffusion and hot spots may be prevented. The color of the ink particles may be the same as the color of the light wavelength-converted by the phosphor. The color of the ink particles may be the same as the color of the phosphor.

The first resin layer 47 may mold the light emitting device 21 and may be in contact with the top surface of the substrate 11. The thickness of the first resin layer 47 may be provided in a thickness of 3mm or more, for example, in the range of 3mm to 4mm. Since the first resin layer 47 is provided in the thickness range described above, light spreadability may be improved. When at least one of the diffusing agent and the phosphor is disposed in the first resin layer 47, the diffusing property of the light may be improved.

The first diffusion layer 62 may be a transparent resin material, for example, a resin material such as UV (ultra violet) resin, epoxy, or silicon. The refractive index of the first diffusion layer 62 may be 1.8 or less, for example, 1.1 to 1.8 range or 1.4 to 1.6 range, and may be lower than the refractive index of the diffusing agent. The thickness of the first diffusion layer 62 may be smaller than the thickness of the first resin layer 47. The first diffusion layer 62 may have a thickness of 0.3 mm or more, for example, in a range of 0.3 mm to 0.7 mm.

The phosphor added in the first diffusion layer 62 may have a content difference of 20% or less or 10% or less from the resin material of the first diffusion layer 62. The content of the phosphor may be added to the first diffusion layer 62 in a range of 10 wt% or more or 10 wt to 23 wt%. Accordingly, the color on the surface of the first diffusion layer 62 may be provided as the color of the phosphor, and may improve light diffusion and wavelength conversion efficiency. In addition, the wavelength of light emitted from the light emitting element 21 through the first diffusion layer 62, for example, may reduce the transmission of blue light. In addition, the light extracted through the first diffusion layer 62 may be provided to the surface light source by the wavelength of the phosphor. Since the first diffusion layer 62 is provided in the thickness of the above range, it is possible to diffuse the light and convert the wavelength. Such a lighting module may be provided as a surface light source. The lighting module according to the embodiment may have a thickness of 5.5 mm or less and emit a surface light source through an upper surface, and may have a ductile characteristic. The lighting module may emit light through the side. The lighting module may include a flexible structure or a curved structure.

16 is a modified example of the lighting module of FIG. 15, and the same parts as those of FIG. 15 will be referred to the configuration and description of FIG. 15. Referring to FIG. 16, in the lighting module 102, a first diffusion layer 62 is disposed on the first resin layer 47 covering the light emitting device 21 according to the embodiment, and the first diffusion layer 62 is disposed. It may include a side portion (62a) covering the side of the first resin layer 47.

The side portion 62a of the first diffusion layer 62 is disposed along the side surface of the first resin layer 47 and covers the side surface of the first resin layer 47. The side part 62a may extend in an upper surface direction of the substrate 11 at an upper edge of the first resin layer 47. The side part 62a of the first diffusion layer 62 may be in contact with the top surface of the substrate 11. By contacting the side portion 62a of the first diffusion layer 62 along the outer circumference of the substrate 11, moisture penetration may be prevented and the side surface of the lighting module may be protected. The side portion 62a of the first diffusion layer 62 may include the phosphor and the ink particles described above. The side portion 62a of the first diffusion layer 62 may be formed on one side, at least two sides, or all sides of the first resin layer 47, or may open at least one side. Some light may be extracted through the open area.

Since ink particles are added to the first diffusion layer 62 and the side surface portion 62a, the color of the surface color of the first diffusion layer 62 is different from the color of the light emitting element 21 when it is driven. The difference with the color may be reduced. That is, when viewed from a relatively long distance, the color caused by the ink particles can be seen more clearly and in a darker color even when the light emitting element 21 is turned off. Accordingly, even when the light emitting device 21 is in an on / off state, a difference in surface color of the lighting module may be reduced.

An adhesive may be disposed between the first resin layer 47 and the first diffusion layer 62. The adhesive is a transparent material, and may be an adhesive such as UV adhesive, silicone or epoxy. The first diffusion layer 62 may be bonded or injection molded in the form of a film. When the first diffusion layer 62 is provided in the form of a film, the first diffusion layer 62 may be adhered with an adhesive, may be provided with a uniform light distribution, and the color of the surface color may be provided at a predetermined level or more. The first diffusion layer 62 may be a second resin layer to be described later.

In the second embodiment of the present invention, the luminous flux according to the content of the phosphor and the ink particles added to the first diffusion layer 62 without adding a diffusing agent to the first resin layer 47 is as follows. For the experiment, as shown in Table 1, a red phosphor and red ink particles were added to the first diffusion layer, and in the reference example (Ref), 50 wt% of the red phosphor and 10 wt% of the diffusing agent were added without the red ink particles. This is an example added.

In Example 1 to Example 3 of the first diffusion layer 62, the phosphor content is 10wt%, and the red ink particles are 5wt%, 7wt%, and 10wt%, respectively. In Example 4-Example 6, the phosphor content is 15 wt%, and the content of the red ink particles is 5 wt%, 7 wt%, and 10 wt%, respectively. In Example 7-9, the phosphor content is 15 wt%, and the content of the red ink particles is 5 wt%, 7 wt%, and 10 wt%, respectively.

Phosphor [wt%] Red Ink [wt%] Example 1 10 5 Example 2 7 Example 3 10 Example 4 15 5 Example 5 7 Example 6 10 Example 7 20 5 Example 8 7 Example 9 10

Table 1 shows the configuration of Example 1 to Example 9 in which the phosphor and ink particles were added to the first diffusion layer in the above contents. As shown in Fig. 26, the surface color of the reference example Ref is amber when the light emitting element is in the off state, but the surface color of Example 1-Example 9 is red. When the light emitting device is in the on state, the color of the surface color may be brighter as the content of the phosphor is increased, and it may be understood that the luminous flux decreases as the content of the ink particles increases.

Table 2 is a diagram comparing the reference coordinates of Table 1 with the color coordinates and luminous flux of Examples 1-9.

Experimental Example CIE (Cx, Cy) Beam (lm) Ref Cx: 0.6903Cy: 0.3011 74.88 Example 1 Cx: 0.6882Cy: 0.3053 59.86 Example 2 Cx: 0.6912Cy: 0.3006 43.60 Example 3 Cx: 0.6942Cy: 0.2968 30.70 Example 4 Cx: 0.6902Cy: 0.3031 63.75 Example 5 Cx: 0.6885Cy: 0.3028 52.27 Example 6 Cx: 0.6938Cy: 0.2971 34.08 Example 7 Cx: 0.6921Cy: 0.3011 60.45 Example 8 Cx: 0.6872Cy: 0.3037 53.63 Example 9 Cx: 0.6917Cy: 0.2994 34.46

 In Table 2, the reference example has the highest luminous flux, but the difference in color of the outer image according to the off / on state of the light emitting device in the lighting module is large. In this case, the visibility of the module when the light emitting element is off can be reduced. In addition, it can be seen that the content of the phosphor is increased. Examples 1 to 9 do not have a large difference in color coordinates from the reference example, and it can be seen that the color of the external image is red when the light emitting device is turned on or off. Examples 1, 4, and 7 may be selected from examples 1 to 9 having a difference in luminous flux of 20% or less and a surface color of red as compared with the reference example. Here, examples 1, 4, and 7 may have the highest luminous flux when the red ink particles are 5 wt% with respect to the content of the first diffusion layer and the phosphor content is in the range of 10 wt% to 20 wt%.

Therefore, in the second embodiment of the present invention, with reference to Examples 1 to 9, the content of the ink particles in the first diffusion layer is selectively added in the range of 4 wt% to 12 wt% and the phosphor content in the range of 10 wt% to 23 wt%. can do.

17 is a third modified example of the lighting module according to the second embodiment.

Referring to FIG. 17, the lighting module may include a substrate 11, a light emitting device 21, a first resin layer 47, a first diffusion layer 51, and a second resin layer 63. The first resin layer may include a diffusion agent or may be provided without a diffusion agent. The first diffusion layer may be a layer to which a phosphor is added. The second resin layer 63 may be a layer to which ink particles are added. As another example, the first diffusion layer may be a layer to which a phosphor and a diffusion agent are added. As another example, the second resin layer 63 may include phosphors and ink particles. Here, a phosphor may be added to the first diffusion layer and the second resin layer 63, and the first diffusion layer and the second resin layer 63 may include the same phosphor or different phosphors.

The second resin layer 63 may be disposed on the first diffusion layer. The first diffusion layer may be disposed between the first resin layer and the second resin layer 63. The thickness of the second resin layer 63 may be smaller than the thickness of the first diffusion layer. The thickness of the first diffusion layer may be formed in a range of 0.3 mm or more, for example, 0.3 mm to 0.7 mm. The thickness of the second resin layer 63 may be formed in a range of 0.1 mm or more, for example, 0.1 mm to 0.5 mm.

At least one or both of the first diffusion layer and the second resin layer 63 may cover a side surface of the first resin layer.

The phosphor may include at least one of red, green, blue, amber, and yellow phosphors. The ink particles may have the same color as the color of the phosphor or the color wavelength-converted from the phosphor.

FIG. 18 is a modified example of FIG. 17 and illustrates a fourth modified example of the lighting module according to the second embodiment.

Referring to FIG. 18, the lighting module may include a substrate 11, a light emitting device 21, a first resin layer 31, a first diffusion layer 41, and a second resin layer 64. The second resin layer 64 may be disposed on the side surface of the first resin layer 31. The side portion 64a of the second resin layer 64 may be attached to the upper surface of the substrate 11. The side portion 64a of the second resin layer 64 may contact the side surface of the first diffusion layer 41 and the side surface of the first resin layer 31. Accordingly, the second resin layer 64 may improve the color difference of the surface color in the lateral direction. Phosphor may be disposed in the first diffusion layer 41, or a phosphor and a diffusion agent may be added. The second resin layer 64 may include phosphors and ink particles.

FIG. 19 is a modified example of FIG. 17 and illustrates a fifth modified example of the lighting module according to the second embodiment.

Referring to FIG. 19, the lighting module may include a substrate 11, a light emitting device 21, a first resin layer 31, a first diffusion layer 56, and a second resin layer 66. The second resin layer 66 may be disposed on the side surface of the first resin layer 31. The side portion 66a of the second resin layer 66 may be attached to an upper surface of the substrate 11. The side portion 66a of the second resin layer 66 may contact the side surface of the first diffusion layer 56 and the side surface of the first resin layer 31. The first diffusion layer 56 may include a phosphor, or a phosphor and a diffusion agent. The second resin layer 66 may include ink particles without phosphors. Accordingly, the second resin layer 66 may improve the color difference of the surface color in the lateral direction.

20 is a modified example of FIG. 17, which is a sixth modified example of the lighting module according to the second embodiment.

Referring to FIG. 20, the lighting module may include a substrate 11, a light emitting device 21, a first resin layer 47, a first diffusion layer 52, and a second resin layer 63. The first diffusion layer 52 may be disposed on the side surface of the first resin layer 47. The side portion 52a of the first diffusion layer 52 may be attached to an upper surface of the substrate 11. The side portion 52a of the first diffusion layer 52 may contact the side surface of the first resin layer 47. The first resin layer 47 may be provided with a transparent material with or without a diffusing agent. Phosphor may be added to the first diffusion layer 52. The second resin layer 63 may include ink particles without phosphors. The side portion 52a of the first diffusion layer 52 covers the side surface of the first resin layer 47. The side portion 52a of the first diffusion layer 52 may be exposed in the lateral direction of the lighting module. The surface color of the side portion 52a of the first diffusion layer 52 and the second resin layer 63 may be different from each other. The surface color of the second resin layer 63 may have a deeper color than the color of the side portion 52a of the first diffusion layer 52.

17 and 20, the content of the ink particles added to the first resin layers 63, 64, and 66 may be added in a range of 12 wt% or less or 4 wt% to 12 wt%. Accordingly, the color of the surface on the surfaces of the first resin layers 63, 64, 66 may be improved, and hot spots may be prevented through light blocking. The color of the ink particles may be the same as the color of the light wavelength-converted by the phosphor. The color of the ink particles may be the same as the color of the phosphor.

The thickness of the first diffusion layers 51, 41, and 52 may be formed in a range of 0.3 mm or more, for example, 0.3 mm to 0.7 mm. The content of the phosphor added in the first diffusion layers 51, 41, and 52 may be added in a range of 10 wt% or more or 10 wt to 23 wt%.

21 to 24 illustrate a seventh to tenth modified example of the second embodiment, in which two or more layers are stacked on the first resin layer.

Referring to FIG. 21, the lighting module includes a substrate 11, a light emitting element 21, a first resin layer 31, a first diffusion layer 41, a second diffusion layer 56, and a second resin layer 63. It may include. The configuration of the second resin layer 63 is the same as that described above, and the configuration of the first and second diffusion layers 41 and 56 will be described with reference to the description of the first embodiment.

For example, a diffusion agent may be added to the first diffusion layer 41 and a phosphor may be added to the second diffusion layer 56. The ink particles disclosed above may be added to the second resin layer 63. Side portions 63a of the second resin layer 63 cover side surfaces of the first and second diffusion layers 41 and 56 and side surfaces of the first resin layer 31. Side portions 63a of the second resin layer 63 may contact side surfaces of the first and second diffusion layers 41 and 56 and side surfaces of the first resin layer 31 and may contact the upper surface of the substrate 11. Can be.

Referring to FIG. 22, the lighting module may include a substrate 11, a light emitting device 21, a first resin layer 47, a first diffusion layer 52, and a second resin layer 63. The configuration of the second resin layer 63 is the same as that described above, and the configuration of the first diffusion layer 52 will be described with reference to the first and second embodiments.

For example, a phosphor may be added to the first diffusion layer 52, or a phosphor and a diffusion agent may be added. When the first diffusion layer 52 has a diffusing agent, phosphors and ink particles may be added to the second resin layer 63. When the phosphor is added to the first diffusion layer 52, the second resin layer 63 may include ink particles without the phosphor.

The side portion 52a of the first diffusion layer 52 may be disposed on the side surface of the first resin layer 63. The side portion 63a of the second resin layer 63 may be disposed outside the side portion 52a of the first diffusion layer 52. The side portion 63a of the second resin layer 63 may be disposed between the side portion 52a of the first diffusion layer 52 and the side surface of the first resin layer 47. The side portion 52a of the first diffusion layer 52 and the side portion 63a of the second resin layer 63 may contact the upper surface of the substrate 11.

Referring to FIG. 23, the lighting module includes a substrate 11, a light emitting element 21, a first resin layer 31, a first diffusion layer 41, a second diffusion layer 57, and a second resin layer 63. It may include. The configuration of the second resin layer 63 is the same as that described above, and the configuration of the first and second diffusion layers 41 and 57 will be described with reference to the description of the first embodiment.

For example, a diffusion agent may be added to the first diffusion layer 41 and a phosphor may be added to the second diffusion layer 57. The ink particles disclosed above may be added to the second resin layer 63.

The side portion 57a of the second diffusion layer 57 may be disposed on the side surface of the first resin layer 31. The side portion 63a of the second resin layer 63 may be disposed outside the side portion 57a of the second diffusion layer 57. The side portion 63a of the second resin layer 63 may be disposed between the side portion 57a of the second diffusion layer 57 and the side surface of the first resin layer 31. The side portion 57a of the second diffusion layer 57 and the side portion 63a of the second resin layer 63 may contact the upper surface of the substrate 11.

Referring to FIG. 24, the lighting module includes a substrate 11, a light emitting element 21, a first resin layer 31, a first diffusion layer 41, a second diffusion layer 56, and a second resin layer 63. It may include. The configuration of the second resin layer 63 is the same as that described above, and the configuration of the first and second diffusion layers 41 and 56 will be described with reference to the description of the first embodiment.

For example, a diffusion agent may be added to the first diffusion layer 41 and a phosphor may be added to the second diffusion layer 56. The ink particles disclosed above may be added to the second resin layer 63.

The side portion 41a of the first diffusion layer 41 may be disposed on the side surface of the first resin layer 31. The side portion 56a of the second diffusion layer 56 may be disposed outside the side portion 41a of the first diffusion layer 41. The side portion 63a of the second resin layer 63 may be disposed outside the side portion 56a of the second diffusion layer 56. The side portion 56a of the second diffusion layer 56 may be disposed between the side portion 41a of the first diffusion layer 41 and the side portion 63a of the second resin layer 63. The side portion 41a of the first diffusion layer 41, the side portion 56a of the second diffusion layer 56, and the side portion 63a of the second resin layer 63 may contact the upper surface of the substrate 11. have.

25 is an eleventh modified example of the lighting module according to the second embodiment.

Referring to FIG. 25, the lighting module includes a substrate 11, a light emitting element 21 disposed on the substrate 11, a first resin layer 31, and the first resin layer on the substrate 11. An adhesive layer 45 and a light blocking portion 46 on the 31, a first diffusion layer 52 on the adhesive layer 46 and the light blocking portion 46, and a second resin layer on the first diffusion layer 52. (63). The configuration of the first diffusion layer 52 and the second resin layer 63 will be referred to the description of the second embodiment disclosed above.

The adhesive layer 45 may be adhered between the first resin layer 31 and the first diffusion layer 52. The adhesive layer 45 may be formed of the same material or different materials as those of the first resin layer 31 and the first diffusion layer 52. The adhesive layer 45 may be made of a resin material such as silicon or epoxy. The adhesive layer 45 may be disposed around the light blocking portion 46 or may extend to the bottom surface of the light blocking portion 46. The light blocking portion 46 may be disposed in a region corresponding to the light emitting element 21 on a lower surface of the first diffusion layer 41. The light blocking part 46 may be in a range of 50% or more, for example, 50% to 120% of the upper surface area of the light emitting device 21 on the light emitting device 21. The light blocking portion 46 may be formed through a region printed with a white material. The light blocking unit 46 may be printed using, for example, a reflective ink including any one of TiO ₂ , Al ₂ O ₃ CaCO ₃ , BaSO ₄ , and silicon. The light blocking part 46 reflects the light exiting through the light exit surface of the light emitting device 21, thereby reducing the occurrence of large hot spots due to the light intensity on the light emitting device 21. The light blocking unit 46 may print a light blocking pattern by using a light blocking ink. The light blocking portion 46 may be formed in a manner that is printed on the lower surface of the first diffusion layer 52. The light blocking part 46 may transmit light as a function of light blocking and diffusion since the light transmittance may be lower than the reflectance without blocking 100% of incident light. The light blocking portion 46 may be formed in a single layer or a multilayer, and may have the same pattern shape or different pattern shapes.

The second resin layer 63 may include the side portion 63a disclosed above, and may cover side surfaces of the first resin layer 31 and the first diffusion layer 52. As another example, the side portion 63a may be formed to extend by the first diffusion layer 52. As another example, the side portion 63a of the second resin layer 63 has been described as being in contact with the top surface of the substrate 11, but any one of the first resin layer 31 and the first diffusion layer 52 may be used. It may be in contact with the top of the layer. As another example, the side portion 63a of the second resin layer 63 may contact at least one of the top surfaces of the first resin layer 31 and the first diffusion layer 52 and the top surface of the substrate 11. have. In this case, the outer circumferences of the first resin layer 31 and the first diffusion layer 52 may be provided in the form of an uneven pattern or a stepped structure.

Referring to FIG. 26, the lighting modules of FIGS. 15 and 16 may be turned on or off. The light emitting element 21, for example, the surface color (Color1) of the first diffusion layer or the second resin layer which is the uppermost layer when the LED is open, and the surface color of the first diffusion layer or the second resin layer which is the uppermost layer when the LED is turned on It can reduce the color difference of (Color2).

The lighting module of the embodiment may arrange the first resin layer on the substrate 11 and / or the second resin layer on the first diffusion layer. The embodiment can provide a flexible lighting module having a plurality of resin layers on the substrate 11. The lighting module of the embodiment guides light in the first resin layer 31 in the radial direction or in the straight direction to spread the light, converts the wavelength into the phosphor of the first diffusion layer 41, and converts the ink particles of the second resin layer. This can improve the color difference of the surface color. Accordingly, the light to be finally emitted through the lighting module is emitted to the surface light source. In addition, the plurality of light emitting devices 21 in the lighting module 100 emits five surfaces on the flexible circuit board in a flip manner, and the light emitted through the top and side surfaces of the light emitting device 21 is emitted in the top and side directions. Can be.

Light emitted from the light emitting element 21 may emit light in the upper surface and all side directions of the lighting module. The lighting module may be applied to a lamp of a vehicle, a display device having a micro LED, or various lighting devices.

The illumination module can remove an additional inner lens by providing a surface light source, and the first resin layer 31 seals the light emitting elements 21, thereby providing air on the light emitting elements 21. The structure for inserting the gap or the light emitting device 21 can be removed.

The illumination module 100 may be provided in a flat plate shape, a convex curved shape or a concave curved shape, or a convex / concave shape when viewed from the side. When viewed from the top view, the lighting module may have a bar shape like a stripe, a polygonal shape, a circular shape, an ellipse shape, a shape having a convex side, or a shape having a concave side.

Third Embodiment

The third embodiment is an example of a lighting device to which the above-described lighting module is applied. 27 is an example of a lamp to which the lighting module according to the first and second embodiments disclosed above is applied in the third embodiment of the present invention, and FIG. 27 is an example of a lamp to which the lighting module is applied according to the embodiment of the present invention. 28 is an example of a blade unit in which the lighting module is disposed in the lamp of FIG. 27, and FIG. 29 is another example of a blade unit in which the lighting module is disposed in the lamp of FIG. 27, and FIG. 30 is of FIGS. 28 and 29. Is an example of a blade unit in which an illumination module is disposed, and FIG. 31 is another example in which an illumination module according to an embodiment of the present invention is disposed above and below a blade unit. In describing the third embodiment, the configurations of the first and second embodiments disclosed above may be selectively applied, and redundant descriptions thereof will be omitted.

27 to 29, the lamp includes a housing 110, a blade portion 130 having a rotating body 132 and a blade 134 coupled to the housing 110, and the rotating body ( 132 may include a translucent cover 120.

The housing 110 may include a motor unit (not shown) therein, and the motor unit may be coupled to the shaft protrusion 139 of the rotating body 132. The housing 110 may be a cover disposed inside or behind the vehicle.

Here, the blade unit 130 may include a plurality of blades 134 on the outer circumferential surface of the rotating body 132 and the rotating body 132 in the center. The blade unit 130 may have an accommodation space therein or the shaft protrusion 139 may be coupled thereto. The blade unit 130 may include the disclosed lighting module 102 on each blade 134.

The blade 134 may be disposed radially from the outer circumferential surface of the rotating body 132. The rotating body 132 may have a cylindrical shape. The rotating body 132 may be disposed on the housing 110 or one or more.

The blade 134 may be integrally formed with the rotating body 132 or may be separately manufactured and then combined. The rotating body 132 may function as a hub for supporting the blade 134. The blades 134 may be spaced at equal intervals along the outer circumferential surface of the rotating body 132. The blade 134 may be provided in a twisted shape with respect to the axis of rotation, thereby creating an axial flow and / or a cross flow.

The rotating body 132 may be rotated by the rotational force transmitted from the motor unit, and the blade 134 may rotate along the rotating body 132. Here, when the lamp is coupled to a moving means such as a vehicle, the rotating body 132 may be rotated by the motor unit, the motor unit is a control means that can be added to the rotational speed according to the moving speed of the vehicle (Not shown). For example, when the vehicle is less than or equal to the reference speed, the number of rotations of the rotating body 132 may be controlled to be less than or equal to the reference speed. Alternatively, the rotating body 132 may be controlled at a rotational speed proportional to or inversely proportional to the vehicle speed.

 The transparent cover 120 may be disposed on the rotating body 132 and coupled to the housing 110. The translucent cover 120 may cover the rotating body 132 and protect the rotating body 132.

The transparent cover 120 may include at least one of a transparent material, a red material, or a yellow material.

The lamp according to the embodiment of the present invention may include a lighting module 102 that irradiates or rotates the rotatable lighting therein.

For example, as illustrated in FIGS. 28 and 30, the lighting module 102 disclosed above may be coupled to at least one or two or more front surfaces of the blades 134. The lighting module 102 includes a substrate 11 disposed on the front surface of the blade 134, a light emitting element 21 on the substrate 11, a first resin layer 55 on the light emitting element 21, and The first resin layer 55 may include a first diffusion layer 62 and / or a second resin layer (63 of FIG. 22). When the first diffusion layer 62 is disposed on the first resin layer 55, the first diffusion layer 62 may include at least one of a diffusing agent and a phosphor. As another example, at least one of the first resin layer 55 and the first diffusion layer 62 may include a phosphor. When the second resin layer is disposed on the first resin layer 55, the second resin layer may include ink particles. At least one of the first and second resin layers may include a phosphor.

The blade 134 may be a thermally conductive material, or may be a metal or non-metal material. The blade 134 may radiate heat generated from the light emitting element 21. The front surface of the blade 134 and the lower surface of the substrate 11 may be bonded with an adhesive or a thermally conductive adhesive. Since the substrate 11 and the lighting module 102 having the same are provided in a flexible manner, the substrate 11 and the lighting module 102 may be in close contact with the front surface of the blade 134.

The bottom size of the lighting module 102 disposed on the front of each blade 134 may be the same as or smaller than the front size of the blade 134. The lighting module 102 may receive power from the housing 110 through the rotating body 132.

Each blade 134 may provide a plurality of recesses and / or holes (not shown) to strengthen the coupling of the lighting module 102 with the substrate 11. That is, the adhesive area or the amount of adhesive may be increased through the recess, and the fastening member may be fastened to the lighting module 102 through the hole. As another example, the first resin layer 55 may be exposed on the bottom surface of the substrate 11, and the first resin layer 55 may be adhered to an adhesive disposed on the front surface of the blade 134. have. The adhesion of the first resin layer 55 and the adhesive may enhance the supporting force of the lighting module 102.

The illumination module 102 disclosed in the embodiment may selectively apply surface color or emitted light. As illustrated in FIG. 28, each of the lighting modules 102 disposed on the front surface of the blade 134 may be a red color or a yellow color on the surface. The same lighting module 102 may be disposed in front of all blades 134. As shown in FIG. 30, different lighting modules 102 and 102A may be disposed in front of different blades 134, and the different lighting modules 102 and 102A may emit different light. Alternatively, different illumination modules 102 may have different surface colors. Here, the surface color or different light may include at least two of red, green, yellow, blue, and white. For example, when the first and second lights are emitted from different lighting modules 102, the first light may emit red light, and the second light may emit yellow light.

31 is another example of FIG. 30, the blade unit may include different lighting modules 102 and 103. The first lighting module 102 and the second lighting module 103 may be disposed on the front surface of the blade 134. The first lighting module 102 may be the lighting module of FIG. 30. The second lighting module 103 may be the same as or different from the first lighting module 102. For example, the first lighting module 102 is a lighting module disclosed in the second embodiment, and the second lighting module 103 is It may be the lighting module disclosed in the first embodiment.

Since the second lighting module 103 is disposed on the rear surface of the blade 134, it may not be visible to the user's view from the front. The second lighting module 103 may emit light of a different color or different from that of the first lighting module 102. The light emitted from the second lighting module 103 may be reflected by the reflective layer disposed in the receiving area of the housing 110 and may be emitted in all directions.

For example, when the first lighting module 102 is driven, red light is emitted, and when the second lighting module 103 is driven, yellow or blue light may be emitted. The first and second lighting modules 102 and 103 may be driven separately or simultaneously. For example, when the first and second lighting modules 102 and 103 are driven separately, the mode of the first lighting module 102 emitting the red lamp and the second lighting module 103 emitting the yellow or blue lamp Can be driven in mode. Red or yellow light may be provided depending on early vehicle driving conditions.

The blade 134 may provide the same color as the surface color of the lighting modules 102 and 103 on the side where the lighting modules 102 and 102A are not installed. For example, the side surface of the blade 134 may be treated with paint having the same color as the ink added to the second resin layer. Accordingly, it can be provided as a lamp without color separation of the surface of the blade 134 and the lighting module (102, 102A).

By arranging the lighting module 102 on the blade 134 according to an embodiment of the present invention, it can be provided as a lamp that gives a heart or dynamic lighting by the rotating lighting module.

In addition, by controlling the lighting sequence of the lighting module 102 of each blade 134, it can be controlled by sequential turn-on or turn-off. In addition, in order to save power, the light emitting devices in each lighting module may be partially driven in the entire area. The lighting module 102 having such light emitting devices can improve the heat dissipation effect by the rotational flow of air.

32 is a modified example of FIGS. 28 and 29, and is an example of illumination using the light emitting element 21.

Referring to FIG. 32, a plurality of light emitting elements 21 may be arranged on the front side and / or the rear side of the rotating body 132. As illustrated in FIG. 33, the light emitting device 21 may be connected through a substrate 11 or may be connected through a separate wiring pattern. The light emitting device 21 may irradiate light toward the center of the rotating body 132. As another example, the light emitting device 21 may radiate light in a direction opposite to the rotating body 132.

The rotating body 132 may include a transparent resin material. The transparent resin material may function as a light guide plate that transmits light emitted from the light emitting element 21. The blade 134 may be a transparent material or a reflective material. In addition, since the rotating body 132 is rotated, the light emitted from the light emitting device 21 may be irradiated through the rotating body 132, or may be irradiated toward the blade 134. Light propagated through the blade 134 or the rotating body 132 may be provided as a surface light source.

Here, as shown in FIG. 33, the rear surface of the rotating body 132 may include a plurality of recesses r1. The recess r1 may have a ring shape, and a plurality of recesses r1 may be spaced apart from each other. The first resin layer 55, the first diffusion layer 62, and the light emitting device 21 may be disposed in the recess r1. As another example, the recess r1 may include at least one of a structure on the substrate disclosed in the first and second embodiments, for example, a light emitting device and a first resin layer, and a first diffusion layer, a second resin layer, or a second diffusion layer. Can be arranged.

The light emitting elements 21 disposed in the plurality of recesses r1 may be disposed on the substrate 11. The substrate 11 may be electrically connected to the plurality of light emitting devices 21 and may be attached to the rear surface of the rotating body 132. Here, the rotating body 132 may be a transparent material. The blade 134 may be a transparent material or a reflective material. Light emitted from the light emitting elements 21 disposed in each recess r1 of the rotating body 132 is emitted in the front direction through the rotating body 132, transmitted through the blade 134, or the blade 134 can be reflected. Light reflected or transmitted through the blade 134 may be diffused in a rotational direction, and the diffused light may be emitted through the transparent cover. Accordingly, light of the surface light source may be emitted through the transparent cover.

34 and 35 show another example of FIG. 32. 34 and 35, a plurality of light emitting elements 21 or the lighting module 104 may be disposed on an outer circumferential surface of the rotating body 132. The light emitting device 21 or the lighting module 104 may be disposed between the front or rear surface of the rotating body 132 and the blade 134. The light emitting device 21 or the lighting module 104 irradiates the generated light toward the blade 134. In this case, the blade 134 may be a transparent material. The rotating blade 134 may change the path of the light incident through the light emitting device 21 or the lighting module 104 and emit the light toward the front of the rotating body 132. The light emitting device 21 may be a package in a side view type. The light emitting device 21 may be coupled to the outer circumferential groove or recess of the rotating body 132 as shown in FIG. 33. In the case of the illumination module 104, since it provides a surface light source, it can be irradiated through the blade 134. The blade 134 may diffuse the incident light in a rotational direction, and the diffused light may be emitted through the transparent cover.

FIG. 36 is another example of the rotating body in which the light emitting device 21 is disposed, and FIG. 37 is an exploded side cross-sectional view in which a reflective layer of a housing is disposed around the blade of FIG. 36. In an embodiment of the present invention, a front cross-sectional side view of the fixing body and the blade of the housing in which the light emitting device is disposed.

36 to 37, the fixing body 159 of the housing 170 may include a motor unit, and the outer cover 174 of the housing 170 may be spaced apart from the fixing body 159.

A plurality of reflective layers 172 may be disposed on the inner side surface of the outer cover 174. The inner side surface of the outer cover 174 may have a predetermined curvature or inclined surface. The surface of the reflective layer 172 may be formed as a surface having a predetermined curvature or inclined. The reflective layer 172 may be alternately disposed with an inner surface of the outer cover 174. The inner side surface of the outer cover 174 may be a reflective material. The reflective layer 172 may be formed of a metal or a non-metal material in a protruding or concave region. The reflective layer 172 may be formed in a reflective pattern having an embossed shape.

The rotating body 132A has a connecting portion 161 on an outer circumferential surface thereof, and a blade portion 130A having a plurality of blades 136 may be disposed along the connecting portion. The blade portion may be disposed in the vertical direction or in a twisted shape.

One or more light emitting elements 21 may be disposed on each of the outer surfaces of the blades 136. The light emitting device 21 emits light in an outward direction of the blade 136. The light emitting device 21 may be disposed below the outer side of the blade 136. The light emitting device 21 may face an inner surface of the outer cover 174 of the housing 170. Accordingly, the light emitted from the light emitting element 21 may be reflected by the inner surface of the outer cover 174 of the housing 170, and may be emitted toward the upper direction of the housing 170. In addition, since the light emitting elements 21 of each blade 136 rotate together with the blades 136 to emit light, the diffused surface light source may be irradiated. The light emitting devices 21 disposed on each of the blades 136 may emit light of wavelengths having the same peak band or wavelengths of at least two peak bands.

As another example, the lighting module disclosed in the first and second embodiments may be disposed on the entire outer surface or the outer bottom surface of each blade 136. The illumination module may emit a surface light source, and the surface light source may be reflected through the outer cover 174 of the housing 170 and may be emitted in an upper direction of the housing 170.

FIG. 38 is another example of FIG. 37, and a plurality of light emitting devices 21 may be disposed along the outer circumference of the fixing body 159. The light emitting device 21 may be disposed to face the inner side of the rotating body 132A. The light emitting device 21 may emit light through an area between the blades 136 of the rotating body 132A when the rotating body 132A is rotated. Light emitted through the area between the blades 136 may be diffused by the blades 136, and the diffused light may be reflected through the outer cover 174 of the housing 170. . In addition, light may be more effectively reflected by the reflective layer 172.

In this structure, the light emitting device 21 is disposed around the fixed body 159 to which the shaft protrusion 139 is coupled, and the light is emitted between the light emitting device 21 and the corresponding blade 136. Can be. Thus, the surface light source may be emitted through the housing 170. The light emitting devices 21 may emit light of the same peak band or light of different peak bands.

Here, the rotating body 132A or the blade 136 may be a transparent material, and the emitted light may be transmitted through the rotating body 132A or the blade 136. As another example, the lighting module disclosed in the first and second embodiments may be applied to the region in which the light emitting device 21 disclosed in FIGS. 37 and 38 is disposed.

The housing according to the embodiment of the present invention includes a head lamp, a vehicle headlight, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a back up lamp, a stop lamp, It may be applied to at least one of daytime running right, vehicle interior lighting, door scarf, rear combination lamp, and backup lamp.

39 is a diagram illustrating an example of a light emitting device of a lighting module according to an embodiment.

Referring to FIG. 39, the light emitting device includes a light emitting structure 225 and a plurality of electrodes 245 and 247. The light emitting structure 225 may be formed of a compound semiconductor layer of Group II to Group VI elements, for example, a compound semiconductor layer of Group III-V elements or a compound semiconductor layer of Group II-VI elements. The plurality of electrodes 245 and 247 are selectively connected to the semiconductor layer of the light emitting structure 225 and supply power.

The light emitting device may include a substrate 221. The substrate 221 is disposed on the light emitting structure 225. The substrate 221 may be, for example, a light transmissive, insulating substrate, or a conductive substrate. For example, the substrate 221 may use at least one of sapphire (Al ₂ O ₃ ), SiC, Si, GaAs, GaN, ZnO, Si, GaP, InP, Ge, Ga ₂ O ₃ . A plurality of convex portions (not shown) may be formed on at least one or both of a top surface and a bottom surface of the substrate 221 to improve light extraction efficiency. The side cross-sectional shape of each convex portion may include at least one of a hemispherical shape, a semi-elliptic shape, or a polygonal shape. The substrate 221 may be removed, but is not limited thereto.

The substrate 221 and the light emitting structure 225 may include at least one of a buffer layer (not shown) and a low conductivity semiconductor layer (not shown). The buffer layer is a layer for alleviating the difference in lattice constant between the substrate 221 and the semiconductor layer, and may be selectively formed from group II to group VI compound semiconductors. An undoped Group III-V compound semiconductor layer may be further formed below the buffer layer, but is not limited thereto.

The light emitting structure 225 may be disposed under the substrate 221, and may include a first conductive semiconductor layer 222, an active layer 223, and a second conductive semiconductor layer 224. Another semiconductor layer may be further disposed on at least one of the upper and lower portions of each of the layers 222, 223, and 224, but embodiments are not limited thereto.

The first conductive semiconductor layer 222 may be disposed under the substrate 221, and may be implemented as a semiconductor, for example, an n-type semiconductor layer doped with the first conductive dopant. And the first conductive semiconductor layer 222 comprises a composition formula of _{In x Al y Ga 1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x + y≤1). The first conductive semiconductor layer 222 may be selected from compound semiconductors of Group III-V elements, such as GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. . The first conductive dopant is an n-type dopant and includes dopants such as Si, Ge, Sn, Se, Te, and the like. The active layer 223 is disposed under the first conductive semiconductor layer 222 and optionally includes a single quantum well, a multi quantum well (MQW), a quantum wire structure, or a quantum dot structure. And the cycle of the well and barrier layers. The period of the well layer / barrier layer is, for example, InGaN / GaN, GaN / AlGaN, AlGaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, AlGaAs / GaA, InGaAs / GaAs, InGaP / GaP, AlInGaP / InGaP, InP / GaAs At least one of the pairs. The second conductive semiconductor layer 224 is disposed under the active layer 223. The second conductive semiconductor layer 224 may include a semiconductor doped with a second conductive dopant, for example, In _x Al _y Ga _{1 -xy} N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ x + y ≦ The composition formula of 1) is included. The second conductive semiconductor layer 224 may be formed of at least one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. The second conductive semiconductor layer 224 is a p-type semiconductor layer, and the first conductive dopant is a p-type dopant and may include Mg, Zn, Ca, Sr, and Ba.

As another example, the light emitting structure 225 may include the p-type semiconductor layer as the first conductive semiconductor layer 222 and the n-type semiconductor layer as the second conductive semiconductor layer 224. A third conductive semiconductor layer having a polarity opposite to that of the second conductive type may be formed under the second conductive semiconductor layer 224. In addition, the light emitting structure 225 may be implemented as any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, a p-n-p junction structure.

First and second electrodes 245 and 247 are disposed under the light emitting structure 225. The first electrode 245 is electrically connected to the first conductive semiconductor layer 222, and the second electrode 247 is electrically connected to the second conductive semiconductor layer 224. The first and second electrodes 245 and 247 may be polygonal or circular in shape. The light emitting structure 225 may include a plurality of recesses 226.

The light emitting device includes first and second electrode layers 241 and 242, a third electrode layer 243, and insulating layers 231 and 233. Each of the first and second electrode layers 241 and 242 may be formed in a single layer or multiple layers, and may function as a current diffusion layer. The first and second electrode layers 241 and 242 may include a first electrode layer 241 disposed under the light emitting structure 225; And a second electrode layer 242 disposed under the first electrode layer 241. The first electrode layer 241 diffuses current, and the second electrode layer 241 reflects incident light.

The first and second electrode layers 241 and 242 may be formed of different materials. The first electrode layer 241 may be formed of a light transmissive material, for example, a metal oxide or a metal nitride. The first electrode layer 241 may be formed of, for example, indium tin oxide (ITO), indium zinc oxide (ITO), indium zinc oxide (IZO), indium zinc oxide (IZON), indium zinc tin oxide (IZTO), or indium aluminum zinc oxide (AZO). It may be selectively formed from indium gallium zinc oxide (IGZO), indium gallium tin oxide (IGTO), aluminum zinc oxide (AZO), antimony tin oxide (ATO), and gallium zinc oxide (GZO). The second electrode layer 242 is in contact with the bottom surface of the first electrode layer 241 and may function as a reflective electrode layer. The second electrode layer 242 includes a metal such as Ag, Au, or Al. When the partial region of the first electrode layer 241 is removed, the second electrode layer 242 may partially contact the bottom surface of the light emitting structure 225.

As another example, the structures of the first and second electrode layers 241 and 242 may be stacked in an omni directional reflector layer (ODR) structure. The non-directional reflective structure may be formed by stacking a first electrode layer 241 having a low refractive index and a second electrode layer 242 made of a metal material of high reflective material in contact with the first electrode layer 241. The electrode layers 241 and 242 may have, for example, a stacked structure of ITO / Ag. The omnidirectional reflection angle may be improved at the interface between the first electrode layer 241 and the second electrode layer 242.

As another example, the second electrode layer 242 may be removed, and may be formed of a reflective layer of another material. The reflective layer may be formed of a distributed bragg reflector (DBR) structure, and the distributed Bragg reflector includes a structure in which two dielectric layers having different refractive indices are alternately arranged, for example, an SiO ₂ layer. , Si ₃ N ₄ layer, TiO ₂ layer, Al ₂ O ₃ layer, and may include any one of the different from each other MgO layer. As another example, the electrode layers 241 and 242 may include both a distributed Bragg reflection structure and an omnidirectional reflection structure, and in this case, a light emitting device having a light reflectance of 98% or more may be provided. In the flip-mounted light emitting device, since the light reflected from the second electrode layer 242 is emitted through the substrate 221, most of the light may be emitted in the vertical upward direction. Light emitted to the side of the light emitting device may be reflected by the reflective member to the light emission region through the adhesive member according to the embodiment.

The third electrode layer 243 is disposed under the second electrode layer 242 and is electrically insulated from the first and second electrode layers 241 and 242. The third electrode layer 243 may be formed of a metal such as titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), and tin (Sn). ), Silver (Ag) and phosphorus (P). The first electrode 245 and the second electrode 247 are disposed under the third electrode layer 243.

The insulating layers 231 and 233 block unnecessary contact between the first and second electrode layers 241 and 242, the third electrode layer 243, the first and second electrodes 245 and 247, and the layers of the light emitting structure 225. The insulating layers 231 and 233 include first and second insulating layers 231 and 233, and the first insulating layer 231 is disposed between the third electrode layer 243 and the second electrode layer 242. The second insulating layer 233 is disposed between the third electrode layer 243 and the first and second electrodes 245 and 247.

The third electrode layer 243 is connected to the first conductive semiconductor layer 222. The connecting portion 244 of the third electrode layer 243 protrudes in a via structure through the lower portions of the first and second electrode layers 241 and 242 and the light emitting structure 225 and contacts the first conductive semiconductor layer 222. do. The connection part 244 may be arranged in plural. A portion 232 of the first insulating layer 231 extends along the recess 226 of the light emitting structure 225 around the connection part 244 of the third electrode layer 243 and the third electrode layer 243. And electrical connections between the first and second electrode layers 241 and 242, the second conductive semiconductor layer 224, and the active layer 223. An insulating layer may be disposed on the side surface of the light emitting structure 225 for side protection, but is not limited thereto.

The second electrode 247 is disposed below the second insulating layer 233 and contacts at least one of the first and second electrode layers 241 and 242 through an open area of the second insulating layer 233. Or connected. The first electrode 245 is disposed under the second insulating layer 233 and is connected to the third electrode layer 243 through an open area of the second insulating layer 233. Accordingly, the protrusion 248 of the second electrode 247 is electrically connected to the second conductive semiconductor layer 224 through the first and second electrode layers 241 and 242, and the protrusion 246 of the first electrode 245. ) Is electrically connected to the first conductive semiconductor layer 222 through the third electrode layer 243.

40 is a plan view of a vehicle to which a vehicle lamp to which the lighting module is applied is applied, and FIG. 41 is a view showing a vehicle lamp having the lighting module or the lighting apparatus disclosed in the embodiment.

40 and 41, the taillight 800 in the vehicle 900 includes a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. can do. Here, the first lamp unit 812 may be a light source for the role of a turn signal, the second lamp unit 814 may be a light source for the role of a road light, and the third lamp unit 816 serves as a brake light. It may be a light source for, but is not limited thereto. At least one or both of the first to third lamp units 812, 814, 816 may include the lighting module disclosed in the embodiment. The housing 810 accommodates the first to third lamp units 812, 814, and 816 and may be made of a light transmitting material. In this case, the housing 810 may have a curvature according to the design of the vehicle body, and the first to third lamp units 812, 814, 816 may implement a surface light source having a curved surface according to the shape of the housing 810. Can be. Such a vehicle lamp may be applied to a turn signal lamp of a vehicle when the lamp unit is applied to a tail light, a brake light, or a turn signal lamp of the vehicle.

Here, at least one of a rotating plate having an illumination module, a rotating plate having a light emitting element, a fixed plate having a light emitting element, or a housing having a reflective layer according to the embodiments of FIGS. 27 to 38 may be the lamp units 812, 814, 816. Can be applied within. By arranging the lighting module or the light emitting device on such a rotating plate or on the air path of the rotating plate, it is possible to maximize the core feeling for the illumination. In addition, the heat dissipation effect of the lighting module may be improved due to the rotation force by the rotating plate.

In addition, by arranging means for adjusting the number of rotations of the rotating plate proportionally or adaptively to the vehicle speed, the dynamics of the color of the lighting module can be changed according to the vehicle speed. It is also possible to provide a dynamic vehicle lamp.

Features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be interpreted that the contents related to such a combination and modification are included in the scope of the present invention.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains may have illustrated the above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to these modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (8)

Rotating body;
A plurality of blades along an outer circumferential surface of the rotating body; And
It includes a first lighting module disposed on the surface of the rotating body or the front of the blade,
The first lighting module,
A substrate attached to one surface of the rotating body or the front surface of the blade;
A plurality of light emitting elements on the substrate;
A first resin layer covering the light emitting element, and
At least one upper resin layer on the first resin layer,
At least one of the first resin layer and the at least one upper resin layer includes a phosphor,
And the at least one upper resin layer comprises at least one of ink particles and a diffusing agent. The method of claim 1,
The first lighting module is disposed throughout the front of the blade,
The surface color of the first lighting module has the same color as the ink particles. The method of claim 3,
The first lighting module includes a plurality of lighting modules for emitting different light on the front of the different blades. The method according to any one of claims 1 to 3,
It includes a second lighting module disposed on the back of the blade,
The first lighting module emits red light,
And the second lighting module emits yellow or blue light. The method according to any one of claims 1 to 3,
The first lighting module is disposed along the outer circumferential surface of the rotating body. The method according to any one of claims 1 to 3,
The blade includes a thermally conductive material or a transparent material,
The rotating body includes a transparent material. The method of claim 1,
The at least one upper resin layer includes at least one of a diffusion layer and a second resin layer,
The second resin layer includes ink particles,
The second resin layer is extended to the side of the first resin layer and the lighting device in contact with the upper surface of the substrate. The method of claim 7, wherein
The second resin layer includes a phosphor,
The emission wavelength of the phosphor and the ink particles include the same red color,
The content of the phosphor in the second resin layer is in the range of 12wt% to 23wt%,
The amount of the ink particles in the second resin layer is a lighting device comprising a range of 3wt% to 13wt%.

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