KR20200023920A - A printed circuit board comprising a plurality of terminals for measuring the capacitance of an insulating layer disposed between a plurality of wiring layers, Antenna module and Electronic device having the same - Google Patents

Abstract

Disclosed is a printed circuit board capable of easily determining incorrect or duplicated stacking of an insulating layer. The printed circuit board comprises: a first wiring layer including a plurality of first wirings and a first conductive region insulated from the plurality of first wirings; a second wiring layer including a plurality of second wirings and a second conductive region disposed to face the first conductive region while being insulated from the plurality of second wirings, and disposed below the first wiring layer; a first insulating layer disposed between the first wiring layer and the second wiring layer; a first terminal electrically extending from the first conductive region; and a second terminal electrically extending from the second conductive region. The first terminal and the second terminal can be formed to be able to measure the capacitance between the first conductive region and the second conductive region in relation to the properties of the first insulating layer.

Description

A printed circuit board comprising a plurality of terminals for measuring the capacitance of an insulating layer disposed between a plurality of wiring layers, an antenna module and an electronic device comprising the same an insulating layer disposed between a multiple of wiring layers, Antenna module and Electronic device having the same}

The present invention relates to a printed circuit board including a plurality of terminals for measuring capacitance of an insulating layer disposed between a plurality of wiring layers, an antenna module including the same, and an electronic device.

The printed circuit board may be formed by stacking a plurality of layers, and include a wiring layer including wiring and an insulating layer disposed between the wiring layers. Between the wiring layers, an insulating layer may be arranged in a predetermined number or in a predetermined thickness so as to satisfy a specified performance, for example, a dielectric constant.

Defects may occur when some of the plurality of layers constituting the printed circuit board are missing or overlapped. In order to determine the presence or absence of such defects, some of the manufactured printed circuit boards may be sampled to perform stacking failure inspection. Lamination failure inspection can be performed by physically measuring the height of the entire printed circuit board. In this case, there is a problem that it is difficult to determine the failure due to the deviation occurring in the manufacturing process of each layer and the deviation occurring during measurement. In addition, when stacking faults accumulate, there is a problem in which layer cannot determine which fault has occurred.

In one embodiment, it is to provide a printed circuit board capable of stacking failure inspection that is not affected by the deviation occurring in the manufacturing process, or the measurement deviation generated during the defect inspection.

According to various embodiments of the present disclosure, a printed circuit board may include a first wiring layer including a plurality of first wires and a first conductive region insulated from the plurality of first wires; A second wiring layer including a plurality of second wirings, and a second conductive region disposed to face the first conductive region in an insulated state from the plurality of second wirings, the second wiring layer disposed below the first wiring layer; A first insulating layer disposed between the first wiring layer and the second wiring layer; A first terminal electrically extending from the first conductive region; And a second terminal formed to extend electrically from the second conductive region, wherein the first terminal and the second terminal are related to the first conductive region and the first terminal in relation to the property of the first insulating layer. It can be formed to measure the capacitance between the two conductive regions.

According to various embodiments of the present disclosure, an electronic device may include a first cover forming a first surface of the electronic device, a second cover forming a second surface facing the first surface of the electronic device, and the electronic device. A housing structure comprising side members defining a third surface between the first and second surfaces; A display disposed between the first cover and the second cover; And a printed circuit board disposed between the display and the second cover, wherein the printed circuit board includes: a mounting region in which at least one electric element is mounted; An inspection area formed outside the mounting area; And a layer structure including a plurality of layers included in the mounting region and the inspection region, wherein the layer structure includes a first wiring formed in the mounting region and the first wiring formed in the inspection region. A first wiring layer including a first conductive region insulated from the first wiring layer; A second wiring layer formed in the mounting region and a second wiring layer formed in the inspection region and insulated from the second wiring and corresponding to the first conductive region; And an insulating layer disposed between the first wiring layer and the second wiring layer, wherein the layer structure includes a first via extending from the first conductive region to the surface of the inspection region, and from the second conductive region. A second via may extend to the surface of the inspection area.

According to various embodiments of the present disclosure, an antenna module may include: a first surface layer forming a first surface of the antenna module; A second surface layer forming a second surface of the antenna module; A first insulating layer disposed between the first surface layer and the second surface layer; A first radiation layer disposed between the first surface layer and the insulation layer and including a first radiation patch; A second radiation layer disposed between the second surface layer and the insulation layer and including a second radiation patch; Communication circuitry for feeding at least one of the first radiation patch and the second radiation patch; And at least a portion of the first insulating layer, the first radiation layer, the second radiation layer, and the second surface layer to electrically connect the communication circuit with at least one of the first radiation patch and the second radiation patch. A power supply wiring penetrating through the first radiation layer and the second radiation layer, wherein the first radiation layer and the second radiation layer are respectively insulated from the first radiation patch and the second radiation patch and face each other. And a first via extending from the first conductive region to the first surface of the antenna module, and a second via extending from the second conductive region to the first surface of the antenna module.

The printed circuit board according to an exemplary embodiment may be capable of stacking failure inspection without being affected by the variation occurring in the manufacturing process or the measurement variation occurring during the defect inspection based on the capacitance between the layers.

Using the printed circuit board according to an embodiment, the stacking failure inspection for the entire product can be easily performed. The printed circuit board according to an embodiment may have higher reliability than the conventional printed circuit board on which a sample inspection of a part of the finished product is performed.

In addition, various effects may be provided that are directly or indirectly identified through this document.

1 is a plan view of a printed circuit board according to an exemplary embodiment.
FIG. 2 is a cross-sectional view taken along line AA ′ of the printed circuit board of FIG. 1.
3 is another example of an AA ′ cross section of the printed circuit board shown in FIG. 1.
4 is an antenna module according to another embodiment.
5 is a cross-sectional view taken along line AA ′ of the antenna module shown in FIG. 4.
6 is a top view of a printed circuit board including one or more sub printed circuit boards in various embodiments.
7 is a perspective view of a front side of a mobile electronic device according to one embodiment.
8 is a perspective view of a rear surface of the electronic device of FIG. 7.
9 is an exploded perspective view of the electronic device of FIG. 7.
10 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, this is not intended to limit the present disclosure to specific embodiments, but should be understood to cover various modifications, equivalents, and / or alternatives to the embodiments of the present disclosure. For example, components may be exaggerated or reduced in size in the drawings for convenience of description. Since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, the present invention is not necessarily limited to the illustrated. In addition, a Cartesian coordinate system is used, where the x-axis refers to the horizontal direction of the electronic device, the y-axis refers to the vertical direction of the electronic device, and the z-axis may mean the thickness direction of the electronic device. However, the x-axis, y-axis, and z-axis are not limited to three axes on the Cartesian coordinate system, and may be interpreted in a broad sense including the same. For example, the x, y, and z axes may be orthogonal to one another, but may refer to different directions that are not orthogonal to each other. In connection with the description of the drawings, similar reference numerals may be used for similar components.

In this document, expressions such as "have," "may have," "include," or "may include" include the presence of such features (e.g., numerical, functional, operational, or component such as components). Does not exclude the presence of additional features.

In this document, expressions such as “A or B,” “at least one of A or / and B,” or “one or more of A or / and B” may include all possible combinations of items listed together. . For example, “A or B,” at least one of A and B, ”or“ at least one of A or B, ”includes (1) at least one A, (2) includes at least one B, or (3) may refer to both cases including at least one A and at least one B.

Expressions such as "first," "second," "first," or "second," and the like, used in the embodiments of the present disclosure may modify various components regardless of the order and / or importance, It does not limit the components. The above expressions may be used to distinguish one component from another. For example, the first user device and the second user device may represent different user devices regardless of the order or importance. For example, without departing from the scope of the present disclosure, the first component may be called a second component, and similarly, the second component may be renamed to the first component.

One component (such as a first component) is "(operatively or communicatively) coupled with / to" to another component (such as a second component), or When referred to as "connected to," it is to be understood that any component may be directly connected to the other component or may be connected via another component (eg, a third component). On the other hand, when a component (e.g., a first component) is said to be "directly connected" or "directly connected" to another component (e.g., a second component), the component and the It may be understood that no other component (eg, a third component) exists between the other components.

The expression "configured to" used in this document is, for example, "having the capacity to," "suitable for," It may be used interchangeably with "designed to," "adapted to," "made to," or "capable of." The term "configured to" does not necessarily mean only "specifically designed to" in hardware. Instead, in some situations, the expression "device configured to" means that the device is It may mean “to do” with other devices or components, for example, a central processing unit configured (or set up) to perform the phrases A, B, and C. A dedicated central processing unit (e.g. an embedded central processing unit) or a generic-purpose processor (e.g. a CPU or application processor) capable of performing the operations by executing one or more software programs stored in a memory device. May mean.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the scope of other embodiments. Singular expressions may include plural expressions unless the context clearly indicates otherwise. All terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art. Generally defined terms used in the context of the related art may be interpreted as having the same or similar meaning as the meaning in the context of the related art and shall not be interpreted as ideal or excessively formal meanings unless clearly defined in this document. . In some cases, even if terms are defined in the specification, they may not be interpreted to exclude embodiments of the present disclosure.

1 is a plan view of a printed circuit board according to an exemplary embodiment.

In one embodiment, the printed circuit board 100 includes a mounting area 101 including one or more electrical elements 1011 and wires (not shown) that electrically connect the electrical elements 1011, and a plurality of openings ( 1021 may include an inspection region 102 formed therein. The inspection area 102 is an area in which inspection related to the printed circuit board 100 may be performed, which will be described below with reference to FIG. 2.

In one embodiment, the mounting area 101 may be mounted with one or more modules that perform various possibilities of the electronic device including the printed circuit board 100. At least some of the one or more electrical elements 1011 mounted in the mounting area may be exposed on the surface of the printed circuit board 100.

Referring to FIG. 1, the inspection region 102 may be formed in an area spaced from one or more electrical elements 1011 mounted in the mounting region 101. In various embodiments, the inspection area 102 may be formed at at least a portion of the edge of the printed circuit board 100. As shown in FIG. 1, an area in which the electric element 1011 is not formed may be utilized as the inspection area 102. The number of the plurality of openings 1021 formed in the inspection area 102 may be related to the number of stacked layers constituting the printed circuit board 100.

FIG. 2 is a cross-sectional view taken along line AA ′ of the printed circuit board of FIG. 1. The printed circuit board may be referred to as the sub printed circuit board of FIG. 6.

Referring to FIG. 2, a printed circuit board 200 (eg, the printed circuit board 100 of FIG. 1) may include one or more electrical elements 2011 (eg, one or more electrical elements 1011 of FIG. 1) mounted thereon. Mounting area 201 (eg, mounting area 101 of FIG. 1), inspection area 202 adjacent to mounting area 201 (eg, inspection area 102 of FIG. 1), and mounting area 201 And the plurality of layer structures 211, 212, 220, and 230 included in the inspection area 202. In the illustrated embodiment, one or more electrical elements 2011 are shown mounted on the mounting area 201, but the present disclosure is not limited thereto, and one or more electrical elements 2011 may be omitted. As an example, in some embodiments, a printed circuit board on which an electrical device is not yet mounted may be provided to perform a lamination inspection.

In an embodiment, the plurality of layer structures 211, 212, 220, and 230 may include a first surface layer 211 forming a first surface, a second surface layer 212 forming a second surface, and the first surface layer ( It may include a plurality of wiring layers 220 disposed between the second surface layer 211 and the second surface layer 212, and an insulating layer 230 formed between the plurality of wiring layers 220.

Referring to FIG. 2, the first surface layer 211 and the second surface layer 212 may be insulative. One or more terminals 241, 242, 243, and 244 may be formed in the first surface layer 211 included in the inspection region 202. One or more electrical elements 2011 may be disposed on the first surface layer 211 included in the mounting region 201. One or more electrical elements 2011 may be exposed to the first side of the printed circuit board 200.

Referring to FIG. 2, at least a portion of each of the plurality of wiring layers 220 may be conductive. The plurality of wiring layers 220 included in the mounting region 201 may include wirings (not shown) for electrically connecting one or more electrical elements 2011 mounted in the mounting region 201. The plurality of wiring layers 220 included in the test area 202 may include vias connected to each of the terminals formed in the first surface layer 211, and conductive areas connected to each of the vias.

In some embodiments, the first surface layer 211 and the second surface layer 212 may be included in the plurality of insulating layers 230, and in this embodiment, each of the plurality of wiring layers 220 may be a plurality of insulating layers ( 230 may be disposed between.

Hereinafter, with reference to FIG. 2, each layer constituting a plurality of layer structures in one embodiment with reference to the inspection area 202 will be described in detail.

Referring to FIG. 2, the plurality of wiring layers 220 may include a first wiring layer 221 disposed under the first surface layer 211 and a second wiring layer 222 sequentially disposed downward from the first wiring layer 221. ) And the third wiring layer 223. A first terminal 241, a second terminal 242, a third terminal 243, and a fourth terminal 244 may be formed in the first surface layer 211. Each of the plurality of vias may extend from any one terminal formed in the first surface layer 211 to any one wiring layer 220, and one formed between any one wiring layer 220 from the first surface layer 211. It can penetrate more layers.

In an example embodiment, a first conductive region 2211 may be formed in the first wiring layer 221, and the first conductive region 2211 may form a first terminal 241 and a via formed in the first surface layer 211. It can be electrically connected via. The first conductive region 2211 may be insulated from one or more electrical elements 2011 disposed in the mounting region 201 and a plurality of wirings (not shown) included in the mounting region 201. In addition, the first conductive region 2211 may be electrically insulated from other vias passing through the first wiring layer 221. In other words, the first conductive region 2211 may be an electrically isolated region of the first wiring layer 221.

In an example embodiment, the 2-1 conductive region 2221 and the 2-2 conductive region 2222 may be formed in the second wiring layer 222. The second-first conductive region 2221 may be formed to face the first conductive region 2211. The second-first conductive region 2221 may be electrically connected to the second terminal 242 through the via. The second-second conductive region 2222 may be electrically connected to the third terminal 243 through the via. Each of the 2-1 conductive region 2221 and the 2-2 conductive region 2222 may include one or more electrical elements 2011 disposed in the mounting region 201, and a plurality of wirings included in the mounting region 201. It may be insulated from (not shown). In addition, each of the 2-1 conductive region 2221 and the 2-2 conductive region 2222 may be electrically insulated from other vias passing through the second wiring layer 222. In other words, each of the 2-1 conductive region 2221 and the 2-2 conductive region 2222 may be an electrically isolated region of the second wiring layer 222.

In an embodiment, a third conductive region 2231 may be formed in the third wiring layer 223, and the third conductive region 2231 may be electrically connected to the fourth terminal 244 through the via. The third conductive region 2231 may be insulated from one or more electrical elements 2011 disposed in the mounting region 201 and a plurality of wirings (not shown) included in the mounting region 201. The third conductive region 2231 may be an area that is electrically isolated from the third wiring layer 223.

Referring to FIG. 2, the plurality of insulating layers 230 may include a first insulating layer 231, a second wiring layer 222, and a third wiring layer disposed between the first wiring layer 221 and the second wiring layer 222. It may include a second insulating layer 232 disposed between the 223. A first insulating layer 231 may be formed between the first conductive region 2211 and the 2-1 conductive region 2221, and between the second-2 conductive region 2222 and the third conductive region 2231. The second insulating layer 232 may be formed thereon.

In various embodiments, a potential difference may be formed between the first conductive region 2211 and the 2-1 conductive region 2221. For example, a predetermined potential difference may be formed in the first terminal 241 connected to the first conductive region 2211 and the second terminal 242 connected to the 2-1 first conductive region 2221. For example, any one of the first terminal 241 and the second terminal 242 may be connected to the ground area and grounded, and the other may take a predetermined voltage.

Accordingly, charges having opposite polarities may be formed in each of the first conductive region 2211 and the second-first conductive region 2221. In this case, the amount of charge may be substantially proportional to the capacitance based on a constant potential difference. In this case, the capacitance is substantially proportional to the width of the first conductive region 2211 and the 2-1 conductive region 2221, and is between the first conductive region 2211 and the 2-1 conductive region 2221. It can be substantially inversely proportional to the distance of.

Thus, by measuring the capacitance of the first conductive region 2211 and the 2-1 conductive region 2221, the first insulation disposed between the first conductive region 2211 and the 2-1 conductive region 2221. The thickness of layer 231 can be derived. Based on the derived thickness of the first insulating layer 231, it may be determined whether the first insulating layer 231 disposed between the first wiring layer 221 and the second wiring layer 222 is incorrectly stacked (eg, overlapping). Can be.

Similarly, in order to determine whether or not the second insulating layer 232 disposed between the second wiring layer 222 and the third wiring layer 223 is incorrectly stacked, the second conductive region 2222 and the third conductive region ( A predetermined potential difference can be formed between the 2231 and the capacitance can be measured.

The printed circuit board 200 according to an exemplary embodiment includes an inspection region 202 including conductive regions formed in each of the plurality of wiring layers 220 and corresponding conductive regions formed in another wiring layer 220 adjacent thereto. By measuring the capacitance between the conductive region and the corresponding conductive region, it is possible to easily and accurately determine whether the insulating layer 230 disposed between the wiring layers 220 is incorrectly stacked.

In some embodiments, the inspection region 202 may include a plurality of wiring layers 220 and an insulating layer 230 disposed between the plurality of wiring layers 220. A conductive region (eg, the first conductive region 2211) is formed in one wiring layer (eg, the first wiring layer 221), and the other adjacent to the one wiring layer (eg, the first wiring layer 221) is formed. In the wiring layer (eg, the second wiring layer 222), a corresponding conductive region (eg, the second-first conductive region 2221) facing the conductive region (eg, the first conductive region 2211) may be formed. . The conductive region (eg, the first conductive region 2211) is electrically connected to a corresponding terminal (eg, the first terminal 241) formed on the surface of the printed circuit board 200 through a via, and the corresponding conductive region. The second conductive region 2221 may be electrically connected to a terminal (eg, the second terminal 242) formed on the surface of the printed circuit board 200 through a via. At this time, a predetermined potential difference is formed in the terminal (eg, the first terminal 241) and the corresponding terminal (eg, the second terminal 242) to correspond to the conductive region (eg, the first conductive region 2211). The capacitance formed between the conductive regions (eg, the 2-1 conductive regions 2221) may be measured. Through the measured capacitance, an insulating layer (eg, first insulation) stacked between any one wiring layer (eg, the first wiring layer 221) and another wiring layer (eg, the second wiring layer 222) adjacent thereto. It may be determined whether the layer 231 is incorrectly stacked.

3 is another example of an A-A 'cross section of the printed circuit board shown in FIG.

In one embodiment, referring to FIG. 3, the printed circuit board 300 (eg, the printed circuit board 100 of FIG. 1 or the printed circuit board 200 of FIG. 2) may include an inspection area 302 (eg, FIG. Inspection area 102 of FIG. 1 or inspection area 202 of FIG. 2, mounting area 301 (eg, mounting area 101 of FIG. 1 or mounting area 201 of FIG. 2), and common ground area 303. ), And a plurality of layers included in each of the regions 301, 302, and 303. The plurality of layers may include an insulating layer 330 (eg, the insulating layer 230 of FIG. 2) disposed between the plurality of wiring layers 320 (eg, the plurality of wiring layers 220 of FIG. 2) and the wiring layers 320. ) May be included. In the illustrated embodiment, one or more electrical elements 3011 are shown mounted in the mounting region 301, but the present disclosure is not limited thereto, and one or more electrical elements 3011 may be omitted. As an example, in some embodiments, a printed circuit board on which an electrical device is not yet mounted may be provided to perform a lamination inspection.

In one embodiment, one or more electrical elements 3011 (eg, one or more electrical elements 1011 of FIG. 1 or one or more electrical elements 2011 of FIG. 2) may be disposed in the mounting region 301. In one embodiment, the common ground region 303 may be electrically connected to at least some of the one or more electrical elements 3011. The common ground region 303 may include a fourth layer 344 formed in the first surface layer 311 through at least a portion of the wiring layer 320 and the insulating layer 330 included in the common ground region 303. Can be. The fourth terminal 344 may be electrically connected to the wiring 3012 included in each wiring layer 320, and / or the ground regions 3221, 3231, and 3241.

In an embodiment, the first wiring layer 321 included in the inspection region 302 may include a first conductive region 3211. The first conductive region 3211 may be electrically connected to the first terminal 341 formed on the first surface layer through the via. As described above with reference to FIG. 2, the first conductive region 3211 may be an electrically isolated region insulated from the wirings included in the mounting region 301 and other vias penetrating through the first wiring layer 321. .

Referring to FIG. 3, the second wiring layer 322 included in the inspection region may include a second conductive region 3222 and a first ground region 3221 facing the first conductive region 3211. The second conductive region 3222 may be electrically connected to the second terminal 342 formed on the first surface layer 311 of the printed circuit board 300 through the via. As described above with reference to FIG. 2, the second conductive region 3222 is electrically connected to the wirings included in the mounting region 301, other vias penetrating through the second wiring layer 322, and the first ground region 3221. It may be an electrically isolated area that is insulated. Meanwhile, the first ground area 3221 may be electrically connected to the common ground area 303 of the printed circuit board 300. The common ground area 303 may be an area in which one or more electrical elements 3011 disposed in the mounting area 301 are grounded.

Referring to FIG. 3, the third wiring layer 323 included in the inspection region may include a third conductive region 3322 and a second ground region 3321 facing the second conductive region 3222. The third conductive region 3322 may be electrically connected to the third terminal 343 formed on the first surface layer 311 of the printed circuit board 300 through the via. As described above with reference to FIG. 2, the third conductive region 3332 may be wirings included in the mounting region 301 and an electrically isolated region electrically insulated from the second ground region 3231. Meanwhile, the second ground area 3231 may be electrically connected to the common ground area 303 of the printed circuit board 300. The common ground area 303 may be an area in which one or more electrical elements 3011 disposed in the mounting area 301 are grounded.

In the illustrated embodiment, the terminals 341, 342, 343, 344 are shown as being formed in the first surface layer 311, but are not necessarily limited thereto, and in some embodiments, the terminals 341, 342, 343, 344 may be omitted and vias connected to the terminals 341, 342, 343, and 344 may penetrate through the first surface layer 211 and be exposed to the first surface layer 211.

Referring to FIG. 3, the fourth wiring layer 324 may include a third ground region 3321 facing the third conductive region 3322. The third ground area 3241 may be electrically connected to the common ground area 303 of the printed circuit board 300. The common ground area 303 may be an area in which one or more electrical elements 3011 disposed in the mounting area 301 are grounded.

In other words, the first ground area 3221, the second ground area 3231, and the third ground area 3241 may be electrically connected to the common ground area 304 where one or more electrical devices are grounded.

In an embodiment, the first insulating layer 331 may be disposed between the first conductive region 3211 and the first ground region 3221. The thickness of the first insulating layer 331 may be related to the number of insulating layers 330 stacked between the first wiring layer 321 and the second wiring layer 322. A predetermined voltage may be applied to the first conductive region 3211. The capacitance formed by the first conductive region 3211 and the first ground region 3221 is substantially equal to the distance between the two regions when the area of the first conductive region 3211 and the first ground region 3221 is constant. Can be inversely proportional. Therefore, it may be determined whether the first insulating layer 331 is overlapped based on the measured capacitance.

In an embodiment, a second insulating layer 332 may be disposed between the second conductive region 3222 and the second ground region 3321. The thickness of the second insulating layer 332 may be related to the number of insulating layers 330 stacked between the second wiring layer 322 and the third wiring layer 323. A predetermined voltage may be applied to the second conductive region 3222. The capacitance formed by the second conductive region 3222 and the second ground region 3321 is substantially equal to the distance between the two regions when the area of the second conductive region 3222 and the second ground region 3321 is constant. Can be inversely proportional. Therefore, it may be determined whether the second insulating layer 332 is stacked on the basis of the measured capacitance.

In an embodiment, a third insulating layer 333 may be disposed between the third conductive region 3322 and the third ground region 3241. The thickness of the third insulating layer 333 may be related to the number of insulating layers 330 stacked between the third wiring layer 323 and the fourth wiring layer 324. A predetermined voltage may be applied to the third conductive region 3322. The capacitance formed by the third conductive region 3322 and the third ground region 3241 is substantially equal to the distance between the two regions when the area of the third conductive region 3322 and the third ground region 3321 is constant. Can be inversely proportional. Therefore, it may be determined whether the third insulating layer 333 is stacked on the basis of the measured capacitance.

4 is an antenna module according to another embodiment.

Referring to FIG. 4, the antenna module 400 may include one or more first antennas 410 (eg, patch antennas) for emitting a first RF signal, and one or more second antennas 420 (for radiating a second RF signal) ( For example, it may include a printed circuit board 401 including a dipole antenna.

In various embodiments, the first antenna 410 and the second antenna 420 may be printed in a conductive pattern on a plurality of layers included in the printed circuit board 401. The first antenna 410 may be formed in a plurality of layers, and each of the plurality of first antennas 410 may be an insulating layer disposed between (eg, the insulating layer 230 of FIG. 2 or the insulating layer of FIG. 3). 330) may be insulated from each other. Meanwhile, the second antenna 420 may be insulated from the first antenna 410. The second antenna 420 may be formed on a different layer from the first antenna 410, but is not necessarily limited thereto and may be formed on the same layer in a state of being insulated from the first antenna 410.

The first antenna 410 and the second antenna 420 may communicate with an external electronic device or a base station through a 5G generation frequency band (for example, about 20 GHz to 100 GHz).

Referring to FIG. 4, the antenna module 400 may further include an inspection area 402. The inspection region 402 may be formed at the periphery of the first antenna 410 or at the edge of the surface of the antenna module 400, and the inspection region 402 may include terminals formed on the surface of the antenna module 400 (eg, Terminals 241, 242, 243 and 244 of FIG. 2 or terminals 341, 342, 343 and 344 of FIG. 3).

FIG. 5 is a cross-sectional view taken along line A-A 'of the antenna module shown in FIG.

Referring to FIG. 5, the antenna module 500 (eg, the antenna module 400 of FIG. 4) has a radiation region 501 in which a first antenna (eg, the first antenna 410 of FIG. 4) is formed at least in part. ), An inspection region 502 (eg, inspection region 402 of FIG. 4) around the radiation region 501, and a plurality of layer structures 520, 530 included in the radiation region 501 and the inspection region 502. ) May be a printed circuit board 503 (eg, the printed circuit board 401 of FIG. 4).

In some embodiments, the antenna module 500 may include any one of the printed circuit boards 100, 200, 300 shown in FIGS. 1 to 3.

In another embodiment, the plurality of layer structures may include a plurality of emission layers 520 and insulating layers 530. Here, the emission layers 520 may be referred to as the wiring layer 220 illustrated in FIG. 2, and the insulation layers 530 may be referred to as the insulation layer 230 illustrated in FIG. 2.

The first surface layer 511 forming the first surface of the antenna module 500, the first radiation layer 521 disposed under the first surface layer 511, and the second radiation layer 521 disposed under the first surface layer 511. The emission layer 522, a third emission layer 523 disposed under the second emission layer 522, and a fourth emission layer 524 disposed under the third emission layer 523 may be included. The plurality of layer structures are disposed between the first insulating layer 531, the second emitting layer 522, and the third emitting layer 523 disposed between the first emitting layer 521 and the second emitting layer 522. The second insulating layer 532, and the third insulating layer 533 disposed between the third and fourth radiating layers 523 and 524 may be included. In some embodiments, the first surface layer 511 and the second surface layer 512 are further included in an insulating layer, wherein the plurality of layer structures include a plurality of emission layers 520 between the insulating layers 511, 512, 530. Can be placed in.

In another embodiment, at least one of the radiation layers 520 included in the radiation region 501 may include a first radiation patch 570 that is electrically connected to the communication circuit 550, and the rest of the radiation layers 520 may include a first radiation patch 570. And may include two spinning patches 560 (eg, dummy patches). The second radiation patch 560 can secondaryly radiate radio waves emitted from the first radiation patch 570. In one example, the second radiation patch 560 shifts the frequency band (eg, the first frequency band) of the signal emitted from the first radiation patch 570 to a neighboring frequency band (eg, the second frequency band). And emit the signal again. As a result, the bandwidth of the antenna module 500 may increase to a band including the first frequency band and the second frequency band.

In another embodiment, the first radiation patch 570 and the second radiation patch 560 may be implemented with a conductive material (eg, copper). The second spinning patch 560 can be made of one or more and can be disposed above and / or below the first spinning patch 570. The second radiation patch 560 may be disposed in an area corresponding to at least a portion of the first radiation patch 570.

In the illustrated embodiment, the third emissive layer 523 can include a first emissive patch 570, the first emissive layer 521, the second emissive layer 522, and the fourth emissive layer 524. ) May include a second spinning patch 560. The first radiation patch 570 may be electrically connected to the communication circuit 550 disposed on the second surface layer 512 of the antenna module 500 through a power supply circuit. Referring to FIG. 5, the first radiation patch 570 may be formed in the third emission layer 523, but is not limited thereto and may be formed in at least one of the other emission layers 520.

In another embodiment, the first antenna and the second antenna may be electrically connected to the communication circuit 550 through the feed line 552. The communication circuit 550 applies a current to the feed line 552 to designate a specified frequency band (eg, about 28 GHz) based on an electrical path formed from the feed line 552 to a first antenna and / or a second antenna. ) Signal can be sent / received.

In another embodiment, a first conductive region 5211 may be formed in the first emission layer 521 included in the inspection region 502. The first conductive region 5211 may be electrically connected to the first terminal 541 formed in the first surface layer 511 through the via. The first conductive region 5211 is insulated from and electrically isolated from the radiation patches 561, 562, the communication circuit 550, the feed line 552, and other vias through the first emissive layer 521. It may be an area.

In another embodiment, the 2-1 th conductive region 5221 and the 2-2 conductive region 5222 may be formed in the second emission layer 522 included in the inspection region 502. The second-first conductive region 5121 may be formed to face the first conductive region 5211, and may be electrically connected to the second terminal 542 through a via. The second-second conductive region 5222 may be insulated from the second-first conductive region 5221, and may be electrically connected to the third terminal 543 through the via. Each of the 2-1 conductive region 5221 and the 2-2 conductive region 5222 may have different terminals, radiation patches 561 and 562, and a feed line 552 passing through the second emission layer 522. It may be an electrically isolated area insulated from it.

In another embodiment, a 3-1 conductive region 5231 and a 3-2 conductive region 5302 may be formed in the third emission layer 523 included in the inspection region 502. The 3-1 conductive region 5231 may be formed to face the 2-2 conductive region 5222 and may be electrically connected to the fourth terminal 544 through the via. The third-second conductive region 5302 may be insulated from the third-first conductive region 5231, and may be electrically connected to the fifth terminal 545 through the via. Each of the 3-1 conductive region 5231 and the 3-2 conductive region 5252 may be formed by the other vias, the radiation patches 561 and 562, and the feed line 552 passing through the third radiation layer 523. It may be an electrically isolated area insulated from it.

In another embodiment, a fourth conductive region 5231 may be formed in the fourth emission layer 524 included in the inspection region 502. The fourth conductive region 5231 may be electrically connected to the sixth terminal 546 through the via. The fourth conductive region 5231 can be an electrically isolated region insulated from the radiation patches 561, 562, and the feed line 552.

In summary, each of the conductive regions formed in each of the emission layers 520 included in the inspection region 502 may be a region electrically insulated from other components except for corresponding vias. In addition, the vias may extend to respective terminals 541, 542, 543, 544, 545, and 546 formed in the first surface layer 511.

In the illustrated embodiment, each terminal 541, 542, 543, 544, 545, 546 is shown as being connected to conductive regions 5211, 5221, 5222, 5231, 5232, 5241 through vias, but not necessarily. It is not limited to this. For example, the terminals 541, 542, 543, 544, 545, and 546 formed in the first surface layer 511 may be omitted, and the vias may be exposed through the first surface layer 511 to function as terminals.

In another embodiment, the insulating layer 530 may include a first insulating layer 531, a second emitting layer 522, and a third emitting layer disposed between the first emitting layer 521 and the second emitting layer 522. The second insulating layer 532 disposed between the 523 and the third insulating layer 533 disposed between the third emission layer 523 and the fourth emission layer 524 may be included. At least one terminal may be formed in each insulating layer 530 included in the inspection area 502.

In another embodiment, the feed line 552 may electrically connect the first radiation patch 570 and the communication circuit 550. The feed line 552 may pass through at least one insulating layer 530 or an emission layer 520. At least a portion of the feed line 552 may extend through the via.

In other embodiments, the capacitance formed between one conductive region and another conductive region facing it may be related to the thickness of the insulating layer 530 disposed therebetween. For example, the capacitance C may be substantially proportional to the width of the conductive region and the dielectric constant of the insulating layer 530, and may be substantially inversely proportional to the distance between the conductive regions. To this end, a predetermined voltage may be applied to some of the terminals formed on the surface of the antenna module 500. When the dielectric constant of the insulating layer 530 is constant and the area of the conductive region is constant, through the measured capacitance, the distance between the conductive regions, that is, the thickness of the insulating layer 530 disposed between the emission layers 520. Can be measured, and through this, it can be easily determined whether the insulating layer 530 is stacked (eg, overlapping).

In particular, in the 5G antenna module, a frequency band that can be transmitted and received may be determined according to the dielectric constant of the insulating layer 530 disposed between the radiation patches 561 and 562. In this case, when the insulating layers 530 are stacked in a stack, there is a problem in that it cannot operate in a desired frequency band. Therefore, the antenna module 500 according to another exemplary embodiment may include an inspection region 502 in which an overlapping inspection of the insulating layer 530 is performed.

For example, whether or not the first insulating layer 531 disposed between the first emission layer 521 and the second emission layer 522 is overlapped may be determined in the first terminal 541 and the second terminal 542. It can be determined by applying a voltage of and measuring the capacitance between the first conductive region 5211 and the 2-1 conductive region 5121 facing each other.

Similarly, whether or not the second insulating layer 532 disposed between the second radiation layer 522 and the third radiation layer 523 is overlapped is determined by the third terminal 543 and the fourth terminal 544. It may be determined by measuring a capacitance between the 2-2 conductive region 5222 and the 3-1 conductive region 5231 facing each other with a voltage applied thereto.

Similarly, whether or not the third insulating layer 533 disposed between the third radiation layer 523 and the fourth radiation layer 524 is overlapped is determined by the fifth terminal 545 and the sixth terminal 546. It may be determined by measuring a capacitance between the third conductive region 5252 and the fourth conductive region 5231 facing each other and applying a voltage.

In various embodiments, either one of the first terminal 541 and the second terminal 542 may be grounded, and a predetermined voltage may be applied to the other. One of the third terminal 543 and the fourth terminal 544 may be grounded, and a predetermined voltage may be applied to the other. One of the fifth terminal 545 and the sixth terminal 546 may be grounded, and a predetermined voltage may be applied to the other.

6 is a top view of a printed circuit board including one or more sub printed circuit boards in various embodiments. Here, the sub printed circuit board 610 may be referred to as the printed circuit board 100, 200, 300, 401, or 503 of FIGS. 1 to 5.

Referring to FIG. 6, the printed circuit board 600 includes a mounting region 601 (for example, the mounting regions 101, 201, and 301 of FIGS. 1 to 3) formed at the center of the printed circuit board 600. can do. One or more sub-printed circuit boards 610 may be disposed in the mounting area 601. The one or more sub printed circuit boards 610 may be arranged in the mounting area 601. The one or more sub printed circuit boards 610 may all be the same substrate or different substrates.

Referring to FIG. 6, the mounting area 601 may further include an opening area 617 surrounding each of the sub printed circuit boards 610 and one or more bridges 618 across the opening area 617. The bridge 618 connects the sub printed circuit board 610 and the mounting area 601 around the sub printed circuit board 610, and the sub printed circuit board 610 is connected to the printed circuit board 600 by the bridge 618. Can be supported).

The one or more bridges 618 may be formed to be spaced apart by a predetermined interval along the edge of the sub printed circuit board 610. Each of the sub printed circuit boards 610 may be separated from the printed circuit board 600 by cutting the bridge 618 connected to the mounting area 601.

In various embodiments, the inspection region may include a first inspection region 602 formed in at least a portion of a periphery of the mounting region 601 of the printed circuit board 600, and / or one or more subs included in the mounting region 601. It may include a second inspection area 612 formed on at least a portion of each of the printed circuit board 610. The second inspection area 612 may correspond to each of the one or more sub printed circuit boards 610. Referring to FIG. 6, the first inspection area 602 may be formed in an area where the sub printed circuit board 610 is not disposed, and the second inspection area 612 may include one or more sub printed circuit boards 610. It can be formed in the area between. Positions of the first inspection region 602 and the second inspection region 612 are not limited to those shown in the drawings, and may include wiring or electrical elements included in the printed circuit board 600 or the sub-printed circuit board 610. If the area is spaced apart, the inspection area may be located. In the illustrated embodiment, the first inspection region 602 and the second inspection region 612 may be referred to as the inspection regions 102, 202, and 302 of FIGS. 1 to 3, respectively.

In various embodiments, the first inspection area 602 may be an area where an inspection related to the entire printed circuit board 600 is performed. Through the first inspection region 602, an inspection may be performed on whether the entire printed circuit board 600 is stacked incorrectly (eg, overlapping). Specifically, the first inspection area 602 is an insulating layer (eg, shown in FIG. 2) disposed between a plurality of wiring layers (eg, the wiring layer 220 shown in FIG. 2) constituting the printed circuit board 600. The insulating layer 230 may be a region to be inspected for overlapping the stacked layers.

Meanwhile, the second inspection area 612 may be an area where an inspection related to the corresponding sub printed circuit board 610 is performed. Through the second inspection area 612, a test may be performed to check whether the sub-printed circuit board 610 is stacked (eg, overlapped). In detail, the second inspection region 612 may include an insulating layer (eg, illustrated in FIG. 2) disposed between a plurality of wiring layers (eg, the wiring layer 220 illustrated in FIG. 2) of the sub-printed circuit board 610. The insulating layer 230 may be a region to be inspected for overlapping the stacked layers.

In various embodiments, if the plurality of layers forming the entire printed circuit board 600 and the sub printed circuit board 610 are the same, the printed circuit board 600 may include the first inspection region 602 and the second inspection region 612. ) May be optionally included.

As illustrated in FIG. 6, a plurality of terminals may be formed on surfaces of each of the first inspection region 602 and the second inspection region 612. Herein, the plurality of terminals may be referred to as terminals illustrated in FIGS. 2 and 3. The number of the plurality of terminals may be related to the number of stacked layers of the printed circuit board 600. For example, when the number of spaces in which the insulating layer may be disposed on the printed circuit board 600 is n, 2n terminals may be formed.

7 is a perspective view of a front side of a mobile electronic device according to one embodiment. FIG. 8 is a perspective view of a rear side of the electronic device of FIG. 7. 9 is an exploded perspective view of the electronic device of FIG. 7.

7 and 8, an electronic device 700 according to an embodiment may include a first side (or front side) 710A, a second side (or rear side) 710B, and a first side 710A. And a housing 710 including a side surface 710C surrounding a space between the second surface 710B. In another embodiment (not shown), the housing may refer to a structure forming some of the first surface 710A, the second surface 710B, and the side surface 710C of FIG. 7. According to one embodiment, the first side 710A may be formed by a front plate 702 (eg, a glass plate comprising various coating layers, or a polymer plate) that is at least partially substantially transparent. The second side 710B may be formed by the substantially opaque back plate 711. The back plate 711 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be. The side 710C is coupled to the front plate 702 and the back plate 711, and may be formed by a side bezel structure (or “side member”) 718 that includes metal and / or polymer. In some embodiments, back plate 711 and side bezel structure 718 may be integrally formed and include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 702 includes two first regions 710D that are seamlessly extended from the first surface 710A toward the rear plate 711 and extend seamlessly. It may be included at both ends of the long edge (702). In the illustrated embodiment (see FIG. 8), the back plate 711 has a long edge between two second regions 710E extending seamlessly from the second face 710B toward the front plate 702. It can be included at both ends. In some embodiments, the front plate 702 (or the back plate 711) may include only one of the first regions 710D (or the second regions 710E). In another embodiment, some of the first regions 710D or the second regions 710E may not be included. In the above embodiments, when viewed from the side of the electronic device 700, the side bezel structure 718 may be formed on the side of the side in which the first regions 710D or the second regions 710E are not included. It may have a first thickness (or width) and have a second thickness thinner than the first thickness on the side surface including the first regions 710D or the second regions 710E.

According to an embodiment, the electronic device 700 may include a display 701, an audio module 703, 707, 714, a sensor module 704, 716, 719, a camera module 705, 712, 713, a key input. And at least one of the device 717, the light emitting element 706, and the connector holes 708, 709. According to an embodiment of the present disclosure, the electronic device 700 may omit at least one of the components (for example, the key input device 717 or the light emitting device 706) or further include other components.

Display 701 may be exposed through, for example, a substantial portion of front plate 702. In some embodiments, at least a portion of the display 701 may be exposed through the first surface 710A and the front plate 702 forming the first regions 710D of the side surface 710C. In some embodiments, an edge of the display 701 may be formed to be substantially the same as an adjacent outer shape of the front plate 702. In another embodiment (not shown), the distance between the outer side of the display 701 and the outer side of the front plate 702 may be formed to be substantially the same in order to expand the area where the display 701 is exposed.

In another embodiment (not shown), an audio module 714 and a sensor are formed in a portion of the screen display area of the display 701 and are aligned with the opening or the opening. It may include at least one of the module 704, the camera module 705, and the light emitting device 706. In another embodiment (not shown), an audio module 714, a sensor module 704, a camera module 705, a fingerprint sensor 716, and a light emitting element 706 are provided on the back of the screen display area of the display 701. It may include at least one of). In another embodiment (not shown), the display 701 is coupled or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer for detecting a magnetic field stylus pen. Can be arranged. In some embodiments, at least a portion of the sensor module 704, 719, and / or at least a portion of a key input device 717 may be configured such that the first regions 710D, and / or the second regions 710E. Can be placed in the field.

The audio module 703, 707, 714 may include a microphone hole 703 and a speaker hole 707, 714. In the microphone hole 703, a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect a direction of the sound. The speaker holes 707 and 714 may include an external speaker hole 707 and a receiver receiver hole 714 for a call. In some embodiments, the speaker holes 707 and 714 and the microphone hole 703 may be implemented as one hole, or a speaker may be included without the speaker holes 707 and 714 (eg, a piezo speaker).

The sensor modules 704, 716, and 719 may generate an electrical signal or data value corresponding to an operating state inside the electronic device 700 or an external environment state. The sensor modules 704, 716, 719 may include, for example, a first sensor module 704 (eg, proximity sensor) and / or a second sensor module (eg, disposed on the first surface 710A of the housing 710). Not shown) (eg, fingerprint sensor), and / or third sensor module 719 (eg, HRM sensor) and / or fourth sensor module 716 disposed on the second side 710B of the housing 710. ) (Eg, fingerprint sensor). The fingerprint sensor may be disposed on the first surface 710A (eg, the display 701 as well as the second surface 710B) of the housing 710. The electronic device 700 may be a sensor module, for example, not shown. For example, at least one of a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 704 may be used. It may include.

The camera modules 705, 712, 713 include a first camera device 705 disposed on the first surface 710A of the electronic device 700, and a second camera device 712 disposed on the second surface 710B. ) And / or flash 713. The camera devices 705 and 112 may include one or a plurality of lenses, an image sensor, and / or an image signal processor. The flash 713 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 700.

The key input device 717 may be disposed on the side surface 710C of the housing 710. In another embodiment, the electronic device 700 may not include some or all of the above mentioned key input devices 717 and the non-included key input devices 717 may include other soft keys or the like on the display 701. It may be implemented in the form. In some embodiments, the key input device may include a sensor module 716 disposed on the second surface 710B of the housing 710.

The light emitting element 706 may be disposed, for example, on the first surface 710A of the housing 710. The light emitting element 706 may provide, for example, state information of the electronic device 700 in the form of light. In another embodiment, the light emitting device 706 may provide, for example, a light source that is linked to the operation of the camera module 705. The light emitting element 706 may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes 708 and 709 may include a first connector hole 708 that may receive a connector (eg, a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or an external electronic device. And a second connector hole (eg, an earphone jack) 709 that can accommodate a connector for transmitting and receiving an audio signal.

Referring to FIG. 9, the electronic device 900 may include a side bezel structure 910 (eg, side member), a first support member 911 (eg, bracket), and a front plate 920 (eg, first cover). ), Display 930, printed circuit board 940 (e.g., printed circuit board 100 of FIG. 1, printed circuit board 200 of FIG. 2, or printed circuit board 300 of FIG. 3), and battery ( 950, a second support member 960 (eg, a rear case), an antenna 970, and a back plate 980 (eg, a second cover). In some embodiments, the electronic device 900 may omit at least one of the components (eg, the first support member 911 or the second support member 960) or may further include other components. . At least one of the components of the electronic device 900 may be the same as or similar to at least one of the components of the electronic device 700 of FIG. 7 or 8, and overlapping descriptions thereof will be omitted below.

The first support member 911 may be disposed inside the electronic device 900 to be connected to the side bezel structure 910 or may be integrally formed with the side bezel structure 910. The first support member 911 may be formed of, for example, a metal material and / or a non-metal (eg polymer) material. The first support member 911 may have a display 930 coupled to one surface and a printed circuit board 940 coupled to the other surface. The printed circuit board 940 may be equipped with a processor, a memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

The memory may include, for example, volatile memory or nonvolatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device 900 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

The battery 950 is a device for supplying power to at least one component of the electronic device 900 and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. . At least a portion of the battery 950 may be disposed substantially coplanar with the printed circuit board 940, for example. The battery 950 may be integrally disposed in the electronic device 900, or may be detachably attached to the electronic device 900.

The antenna 970 may be disposed between the back plate 980 and the battery 950. The antenna 970 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 970 may perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a part or a combination of the side bezel structure 910 and / or the first support member 911.

In various embodiments, one or more antenna modules (eg, the antenna module 400 of FIG. 4 and the antenna module 600 of FIG. 5) may be disposed in the rear case. At this time, the antenna module may transmit and receive the RF signal of the high frequency band of 3Ghz to 100Ghz.

According to various embodiments of the present disclosure, a printed circuit board may include: a first wiring layer including a plurality of first wires and a first conductive region insulated from the plurality of first wires; A second wiring layer including a plurality of second wirings, and a second conductive region disposed to face the first conductive region in an insulated state from the plurality of second wirings, the second wiring layer disposed below the first wiring layer; A first insulating layer disposed between the first wiring layer and the second wiring layer; A first terminal electrically extending from the first conductive region; And a second terminal formed to extend electrically from the second conductive region, wherein the first terminal and the second terminal are related to the first conductive region and the first terminal in relation to the property of the first insulating layer. A printed circuit board may be provided that is formed to measure capacitance between two conductive regions.

According to various embodiments of the present disclosure, the printed circuit board may further include a ground layer, and the second wiring layer may further include a ground wiring electrically connecting the ground layer and the second conductive region.

In various embodiments, a nonconductive first surface layer disposed over a first wiring layer and forming a first surface of the printed circuit board, wherein the first terminal and the second terminal are exposed through the first surface layer. Can be.

According to various embodiments of the present disclosure, a specified voltage may be applied to one of the first terminal and the second terminal, and the other may be electrically connected to the ground region.

In various embodiments, the second conductive region may be formed wider than the first conductive region.

In various embodiments, a printed circuit board may include a first nonconductive surface layer disposed over the first wiring layer and forming a first surface of the printed circuit board; A third wiring layer including a plurality of third wirings and a third conductive region disposed to face the second conductive region in an insulated state from the plurality of third wirings, and disposed under the second wiring layer; A second insulating layer disposed between the second wiring layer and the third wiring layer; And a third terminal formed to extend electrically from the third conductive region, wherein the second terminal and the third terminal are related to the second conductive region and the third terminal in relation to an attribute of the second insulating layer. It can be formed to measure the capacitance (capacitance) between the three conductive regions.

According to various embodiments of the present disclosure, the printed circuit board may include a mounting area including one or more electrical elements electrically connected to the first wiring and / or the second wiring; And an inspection region formed outside the mounting region, wherein the inspection region may include the first conductive region, the second conductive region, the first terminal, and the second terminal.

According to various embodiments of the present disclosure, the second wiring layer may further include a ground wire to which the one or more electrical elements are grounded, and the second conductive region may be grounded to the ground wire.

In various embodiments, the first terminal or the second terminal may be electrically connected to the first wiring layer or the second wiring layer through at least one via.

According to various embodiments of the present disclosure, an electronic device may include a first cover forming a first surface of the electronic device, a second cover forming a second surface facing the first surface of the electronic device, and an electronic device. A housing structure comprising a side member defining a third surface between the first and second surfaces; a display disposed between the first cover and the second cover; And a printed circuit board disposed between the display and the second cover, wherein the printed circuit board includes: a mounting region in which at least one electric element is mounted; An inspection area formed outside the mounting area; And a layer structure including a plurality of layers included in the mounting region and the inspection region, wherein the layer structure includes a first wiring formed in the mounting region and the first wiring formed in the inspection region. A first wiring layer including a first conductive region insulated from the first wiring layer; A second wiring layer formed in the mounting region and a second wiring layer formed in the inspection region and insulated from the second wiring and corresponding to the first conductive region; And an insulating layer disposed between the first wiring layer and the second wiring layer, wherein the layer structure includes a first via extending from the first conductive region to the surface of the inspection region, and from the second conductive region. An electronic device may be provided in which second vias extending to the surface of the test area are formed.

In various embodiments, the layer structure includes a surface layer forming a first side of the printed circuit board, the surface layer being electrically connected to the first via and the first via and the second via. It may include a second terminal connected to.

According to various embodiments of the present disclosure, the layer structure may further include a ground layer, and one of the first conductive region and the second conductive region may be electrically connected to the ground layer.

In various embodiments, the inspection area may be formed at a portion of an edge of the printed circuit board.

In various embodiments, the at least one electrical element may be electrically connected to the first wiring and / or the second wiring.

According to various embodiments of the present disclosure, an antenna module may include: a first surface layer forming a first surface of the antenna module; A second surface layer forming a second surface of the antenna module; A first insulating layer disposed between the first surface layer and the second surface layer; A first radiation layer disposed between the first surface layer and the insulation layer and including a first radiation patch; A second radiation layer disposed between the second surface layer and the insulation layer and including a second radiation patch; Communication circuitry for feeding at least one of the first radiation patch and the second radiation patch; And at least a portion of the first insulating layer, the first radiation layer, the second radiation layer, and the second surface layer to electrically connect the communication circuit with at least one of the first radiation patch and the second radiation patch. A power supply wiring penetrating through the first radiation layer and the second radiation layer, wherein the first radiation layer and the second radiation layer are respectively insulated from the first radiation patch and the second radiation patch and face each other. An antenna module including a first via extending from the first conductive region to a first side of the antenna module and a second via extending from the second conductive region to a first side of the antenna module; Can be.

According to various embodiments of the present disclosure, a first terminal electrically connected to the first via and a second terminal electrically connected to the second via may be formed in the first surface layer.

In various embodiments, the communication circuit may be disposed on the second surface layer.

In various embodiments, the thickness of the first insulating layer positioned between the first emission layer and the second emission layer may be substantially inversely proportional to the capacitance formed by the first conductive region and the second conductive region. have.

In various embodiments, a third radiation layer disposed between the second radiation layer and the second surface layer and including a third radiation patch, and a second insulation disposed between the third radiation layer and the second radiation layer. Further comprising a layer, wherein the second radiation layer and the third radiation layer each comprise a third conductive region and a fourth conductive region insulated from and facing each other with the second radiation patch and the third radiation patch; Third vias extending from a third conductive region to the first surface of the antenna module and fourth vias extending from the fourth conductive region to the first surface of the antenna module may be formed.

According to various embodiments of the present disclosure, a third terminal electrically connected to the third via and a fourth terminal electrically connected to the fourth via may be formed in the first surface layer.

10 is a block diagram of an electronic device 1001 (eg, the electronic device 700 of FIG. 7 or the electronic device 900 of FIG. 9) in a network environment 1000, according to various embodiments. Referring to FIG. 10, in the network environment 1000, the electronic device 1001 communicates with the electronic device 1002 through a first network 1098 (eg, a short range wireless communication network) or the second network 1099. The electronic device may communicate with the electronic device 1004 or the server 1008 through a long range wireless communication network. According to an embodiment of the present disclosure, the electronic device 1001 may communicate with the electronic device 1004 through the server 1008. According to an embodiment of the present disclosure, the electronic device 1001 may include a processor 1020, a memory 1030, an input device 1050, an audio output device 1055, a display device 1060, an audio module 1070, and a sensor module. 1076, interface 1077, haptic module 1079, camera module 1080, power management module 1088, battery 1089, communication module 1090, subscriber identification module 1096, or antenna module 1097 (For example, the antenna module 400 of FIG. 4 and the antenna module 600 of FIG. 5). In some embodiments, at least one of the components (for example, the display device 1060 or the camera module 1080) may be omitted or one or more other components may be added to the electronic device 1001. In some embodiments, some of these components may be implemented in one integrated circuit. For example, the sensor module 1076 (eg, fingerprint sensor, iris sensor, or illuminance sensor) may be implemented embedded in the display device 1060 (eg, display).

The processor 1020 may execute, for example, software (eg, a program 1040) to execute at least one other component (eg, hardware or software component) of the electronic device 1001 connected to the processor 1020. It can control and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operation, the processor 1020 may receive instructions or data received from another component (eg, the sensor module 1076 or the communication module 1090) from the volatile memory 1032. Can be loaded into, processed in a command or data stored in the volatile memory 1032, and the resulting data stored in the non-volatile memory (1034). According to an embodiment, the processor 1020 may include a main processor 1021 (eg, a central processing unit or an application processor), and a coprocessor 1023 (eg, a graphics processing unit, an image signal processor) that may operate independently or together. , Sensor hub processor, or communication processor). Additionally or alternatively, the coprocessor 1023 may be configured to use lower power than the main processor 1021, or to be specialized for its designated function. The coprocessor 1023 may be implemented separately from or as part of the main processor 1021.

 The coprocessor 1023 may be, for example, on behalf of the main processor 1021 while the main processor 1021 is in an inactive (eg, sleep) state, or the main processor 1021 is active (eg, executing an application). ), Along with the main processor 1021, at least one of the components of the electronic device 1001 (eg, display device 1060, sensor module 1076, or communication module 1090). Control at least some of the functions or states associated with the. According to one embodiment, the coprocessor 1023 (eg, an image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 1080 or communication module 1090). have.

The memory 1030 may store various data used by at least one component (eg, the processor 1020 or the sensor module 1076) of the electronic device 1001. The data may include, for example, software (eg, program 1040) and input data or output data for instructions related thereto. The memory 1030 may include a volatile memory 1032 or a nonvolatile memory 1034.

The program 1040 may be stored as software in the memory 1030 and may include, for example, an operating system 1042, middleware 1044 or an application 1046.

The input device 1050 may receive a command or data to be used for a component (for example, the processor 1020) of the electronic device 1001 from the outside (for example, a user) of the electronic device 1001. The input device 1050 may include, for example, a microphone, a mouse, or a keyboard.

The sound output device 1055 may output a sound signal to the outside of the electronic device 1001. The sound output device 1055 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as multimedia playback or recording playback, and the receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of a speaker.

The display device 1060 may visually provide information to the outside (eg, a user) of the electronic device 1001. The display device 1060 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment of the present disclosure, the display device 1060 may include a touch circuitry configured to sense a touch, or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by the touch. have.

The audio module 1070 may convert sound into an electrical signal or vice versa. According to an embodiment of the present disclosure, the audio module 1070 acquires sound through the input device 1050, or an external electronic device (eg, connected to the sound output device 1055 or the electronic device 1001 directly or wirelessly). Sound may be output through the electronic device 1002 (eg, a speaker or a headphone).

The sensor module 1076 detects an operating state (eg, power or temperature) or an external environmental state (eg, a user state) of the electronic device 1001 and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment of the present disclosure, the sensor module 1076 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 1077 may support one or more designated protocols that may be used for the electronic device 1001 to be directly or wirelessly connected to an external electronic device (for example, the electronic device 1002). According to an embodiment, the interface 1077 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 1078 may include a connector through which the electronic device 1001 may be physically connected to an external electronic device (eg, the electronic device 1002). According to an embodiment of the present disclosure, the connection terminal 1078 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 1079 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinetic senses. According to one embodiment, the haptic module 1079 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 1080 may capture still images and videos. According to an embodiment, the camera module 1080 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 1088 may manage power supplied to the electronic device 1001. According to an embodiment of the present disclosure, the power management module 388 may be implemented as at least a part of a power management integrated circuit (PMIC), for example.

The battery 1089 may supply power to at least one component of the electronic device 1001. According to an embodiment, the battery 1089 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 1090 may be a direct (eg wired) communication channel or wireless communication channel between the electronic device 1001 and an external electronic device (eg, the electronic device 1002, the electronic device 1004, or the server 1008). Establish and perform communication over established communication channels. The communication module 1090 operates independently of the processor 1020 (eg, an application processor) and may include one or more communication processors that support direct (eg, wired) or wireless communication. According to an embodiment, the communication module 1090 may be a wireless communication module 1092 (eg, a cellular communication module, a near field communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1094 (eg, A local area network (LAN) communication module, or a power line communication module). The corresponding communication module of these communication modules may be a first network 1098 (e.g., a short-range communication network such as Bluetooth, WiFi direct, or an infrared data association (IrDA)) or a second network 1099 (e.g., a cellular network, the Internet, or Communicate with external electronic devices through a telecommunication network such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented by a plurality of components (eg, a plurality of chips) separate from each other. The wireless communication module 1092 may use subscriber information (e.g., international mobile subscriber identifier (IMSI)) stored in the subscriber identification module 1096 within a communication network such as the first network 1098 or the second network 1099. The electronic device 1001 may be checked and authenticated.

The antenna module 1097 (eg, the antenna module 400 of FIG. 4 and the antenna module 600 of FIG. 5) may transmit or receive a signal or power to an external (eg, an external electronic device) or from the outside. According to an embodiment, the antenna module may be formed of a conductor or a conductive pattern, and in some embodiments, may further include another component (eg, an RFIC) in addition to the conductor or the conductive pattern. According to an embodiment, the antenna module 1097 may include one or more antennas, from which at least one suitable for a communication scheme used in a communication network, such as the first network 1098 or the second network 1099. May be selected by, for example, the communication module 1090. The signal or power may be transmitted or received between the communication module 1090 and the external electronic device through the selected at least one antenna.

At least some of the components are connected to each other and connected to each other through a communication method (eg, a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)). For example, commands or data).

 According to an embodiment of the present disclosure, the command or data may be transmitted or received between the electronic device 1001 and the external electronic device 1004 through the server 1008 connected to the second network 1099. Each of the electronic devices 1002 and 1004 may be a device that is the same as or different from the electronic device 1001. According to an embodiment of the present disclosure, all or part of operations executed in the electronic device 1001 may be executed in one or more external devices among the external electronic devices 1002, 1004, or 1008. For example, when the electronic device 1001 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 1001 may instead execute the function or service by itself. In addition to or in addition, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that receive the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 1001. The electronic device 1001 may process the result as it is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology. This can be used.

Electronic devices according to various embodiments of the present disclosure may be various types of devices. The electronic device may include, for example, a portable communication device (eg, a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. Electronic devices according to embodiments of the present disclosure are not limited to the above-described devices.

Various embodiments of the present disclosure and terms used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, and it should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the items, unless the context clearly indicates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C," "at least one of A, B and C," and "A Phrases such as “at least one of B, or C” may include any one of the items listed together in the corresponding one of the phrases, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may simply be used to distinguish a component from other corresponding components, and the components may be referred to other aspects (e.g. Order). Some (eg, first) component may be referred to as "coupled" or "connected" to another (eg, second) component, with or without the term "functionally" or "communicatively." When mentioned, it means that any component can be connected directly to the other component (eg, by wire), wirelessly, or via a third component.

As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. The module may be an integral part or a minimum unit or part of the component, which performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present disclosure may include one or more instructions stored in a storage medium (eg, internal memory 1036 or external memory 1038) that can be read by a machine (eg, electronic device 1001). It may be implemented as software (eg, program 1040) including the. For example, the processor (for example, the processor 1020) of the device (for example, the electronic device 1001) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the device to be operated to perform at least one function in accordance with the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' means only that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), which is the term used when the data is stored semi-permanently on the storage medium. It does not distinguish cases where it is temporarily stored.

According to an embodiment of the present disclosure, a method according to various embodiments of the present disclosure may be included in a computer program product. The computer program product may be traded between the seller and the buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store ^TM ) or two user devices ( Example: smartphones) can be distributed (eg downloaded or uploaded) directly or online. In the case of an online distribution, at least a portion of the computer program product may be stored at least temporarily or temporarily created on a device-readable storage medium such as a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or plural object. According to various embodiments of the present disclosure, one or more components or operations of the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of the component of each of the plurality of components the same as or similar to that performed by the corresponding component of the plurality of components before the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order, or may be omitted. Or one or more other operations may be added.

Claims (20)

In a printed circuit board,
A first wiring layer including a plurality of first wirings and a first conductive region insulated from the plurality of first wirings;
A second wiring layer including a plurality of second wirings, and a second conductive region disposed to face the first conductive region in an insulated state from the plurality of second wirings, the second wiring layer disposed below the first wiring layer;
A first insulating layer disposed between the first wiring layer and the second wiring layer;
A first terminal electrically extending from the first conductive region; And
A second terminal formed to extend electrically from the second conductive region;
And the first terminal and the second terminal are configured to measure a capacitance between the first conductive region and the second conductive region in relation to the property of the first insulating layer. The method according to claim 1,
The printed circuit board further comprises a ground layer,
The second wiring layer further includes a ground wiring electrically connecting the ground layer and the second conductive region. The method according to claim 1,
A first nonconductive surface layer disposed over a first wiring layer and forming a first side of the printed circuit board,
The first terminal and the second terminal is a printed circuit board exposed through the first surface layer. The method according to claim 3,
The printed circuit board of claim 1, wherein a specified voltage is applied to one of the first terminal and the second terminal, and the other is electrically connected to a ground region. The method according to claim 1,
The second conductive region is formed wider than the first conductive region. The method according to claim 1,
A first nonconductive surface layer disposed on the first wiring layer and forming a first surface of the printed circuit board;
A third wiring layer including a plurality of third wirings and a third conductive region disposed to face the second conductive region in an insulated state from the plurality of third wirings, and disposed under the second wiring layer;
A second insulating layer disposed between the second wiring layer and the third wiring layer; And
A third terminal electrically extending from the third conductive region;
And the second terminal and the third terminal are configured to measure a capacitance between the second conductive region and the third conductive region in relation to the property of the second insulating layer. The method according to claim 1,
The printed circuit board may include: a mounting region including one or more electrical elements electrically connected to the first wiring and / or the second wiring; And
An inspection area formed outside the mounting area;
The inspection region includes the first conductive region, the second conductive region, the first terminal, and the second terminal. The method according to claim 7,
The second wiring layer further includes a ground wiring to which the at least one electrical element is grounded,
And the second conductive region is grounded to the ground wiring. The method according to claim 1,
The first terminal or the second terminal is electrically connected with the first wiring layer or the second wiring layer through at least one via. In an electronic device,
A first cover forming a first surface of the electronic device, a second cover forming a second surface facing the first surface of the electronic device, and between the first and second surfaces of the electronic device. A housing structure comprising a side member defining a third surface; a display disposed between the first cover and the second cover; And
And a printed circuit board disposed between the display and the second cover.
The printed circuit board (printed circuit board),
A mounting area in which at least one electric element is mounted;
An inspection area formed outside the mounting area; And
And a layer structure including a plurality of layers included in the mounting area and the inspection area.
The layer structure is,
A first wiring layer including a first wiring formed in the mounting region and a first conductive region formed in the inspection region and insulated from the first wiring;
A second wiring layer formed in the mounting region and a second wiring layer formed in the inspection region and insulated from the second wiring and corresponding to the first conductive region; And
And an insulating layer disposed between the first wiring layer and the second wiring layer,
The layer structure is formed with a first via extending from the first conductive region to the surface of the inspection region, and a second via extending from the second conductive region to the surface of the inspection region. The method according to claim 10,
The layer structure includes a surface layer forming a first side of the printed circuit board,
The surface layer includes a first terminal in electrical connection with the first via and a second terminal in electrical connection with the second via. The method according to claim 10,
The layer structure further comprises a ground layer,
Any one of the first conductive region and the second conductive region is electrically connected to the ground layer. The method according to claim 10,
And the inspection area is formed at a portion of an edge of the printed circuit board. The method according to claim 10,
And the at least one electrical element is electrically connected to the first wiring and / or the second wiring. In the antenna module,
A first surface layer forming a first surface of the antenna module;
A second surface layer forming a second surface of the antenna module;
A first insulating layer disposed between the first surface layer and the second surface layer;
A first radiation layer disposed between the first surface layer and the insulation layer and including a first radiation patch;
A second radiation layer disposed between the second surface layer and the insulation layer and including a second radiation patch;
Communication circuitry for feeding at least one of the first radiation patch and the second radiation patch; And
At least a portion of the first insulating layer, the first radiation layer, the second radiation layer, and the second surface layer are electrically connected to at least one of the first radiation patch and the second radiation patch and the communication circuit. Feed through wiring; including,
The first radiation layer and the second radiation layer each include a first conductive region and a second conductive region insulated from and facing each other with the first radiation patch and the second radiation patch,
A first via extending from the first conductive region to the first surface of the antenna module, and a second via extending from the second conductive region to the first surface of the antenna module. The method according to claim 15,
And a first terminal electrically connected to the first via, and a second terminal electrically connected to the second via. The method according to claim 15,
The communication circuitry is disposed on the second surface layer. The method according to claim 15,
And a thickness of a first insulating layer positioned between the first radiating layer and the second radiating layer is substantially inversely proportional to the capacitance formed by the first conductive region and the second conductive region. The method according to claim 15,
A third radiation layer disposed between the second radiation layer and the second surface layer and including a third radiation patch, and a second insulating layer disposed between the third radiation layer and the second radiation layer; ,
The second radiation layer and the third radiation layer each include a third conductive region and a fourth conductive region insulated from the second radiation patch and the third radiation patch and facing each other;
And a third via extending from the third conductive region to the first surface of the antenna module and a fourth via extending from the fourth conductive region to the first surface of the antenna module. The method according to claim 19,
And a third terminal electrically connected to the third via, and a fourth terminal electrically connected to the fourth via.

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