KR20200017756A - Fluid heating heater - Google Patents

Abstract

A fluid heating heater is disclosed. According to an aspect of the present invention, provided is the fluid heating heater including: a plate-shaped partition wall unit; a main body including a flow path forming unit forming a flow path on the other surface of the partition wall unit; a heating plate disposed in a plate shape on the flow path forming unit and including a heating pattern having a shape corresponding to the flow path; a circuit board disposed on one surface of the partition wall unit; and a bus bar electrically connecting the heating pattern and the circuit board.

Description

Fluid Heated Heater {FLUID HEATING HEATER}

The present invention relates to a fluid heating heater, and more particularly to a fluid heating heater capable of heating a fluid, such as cooling water.

Currently, the most common vehicle uses an engine as a driving source. The engine uses gasoline, diesel, and the like as energy sources, which have various problems such as reduction of oil reserves as well as environmental pollution. Accordingly, the need for a new energy source is increasing, and a vehicle using a new energy source such as an electric vehicle is being developed or put into practical use.

However, electric vehicles and the like do not have a heat source that generates a lot of heat like an engine, and therefore, it is necessary to additionally install a heat source to be used for a vehicle air conditioner or the like.

The heat source is additionally installed in the conventional electric vehicle, such as a heat pump, an electric heater, etc. Among these, the electric heater is widely used because it can be applied without changing the design for the existing air conditioner. Electric heaters are largely classified into air heating heaters of a method of directly heating air blown into a vehicle interior, and fluid heating heaters (or cooling water heaters) of indirectly heating air by heating cooling water that exchanges air with air.

Republic of Korea Patent Publication No. 10-2018-0005410 (2018.01.16., Cooling water heater)

Embodiments of the present invention can provide a fluid heating heater that can maximize the overlap area between the fluid and the heating element to minimize the size of the product.

According to an aspect of the invention, the main body including a plate-shaped partition wall portion, and a flow path forming portion for forming a flow path on the other surface of the partition wall portion; A heating plate disposed on the flow path forming part in a plate shape and including a heating pattern having a shape corresponding to the flow path; A circuit board disposed on one surface of the partition wall part; And a bus bar electrically connecting the heating pattern and the circuit board.

A first cover disposed on one surface of the partition wall; And a second cover disposed on the other surface of the partition wall portion, wherein the main body includes a first side wall portion disposed on one surface of the partition wall portion, and a second side wall portion disposed on the other surface of the partition wall portion. The cover may be coupled to the first sidewall portion and the second cover may be coupled to the second sidewall portion.

The flow path forming part may be disposed inside the second sidewall part.

The main body may include an inlet port and an outlet port penetrating the partition wall part outside the first sidewall part, and the flow path may extend from the inlet port to the outlet port.

The inner side of the first side wall portion may include a pair of water temperature sensors respectively disposed in a pair of insertion holes connected to the flow path through the partition wall portion.

The pair of insertion openings may be disposed at positions corresponding to the inlet and the outlet, respectively.

The first sidewall portion may include the first-first sidewall and the first-second sidewall facing each other, and the first-third sidewall and the first-first sidewall connecting the first-first sidewall and the first-second sidewall and facing each other. Four sidewalls, the inner surface of the first-first sidewall includes a pair of inclined surfaces inclined with respect to one surface of the partition wall, the pair of insertion holes may be disposed on the pair of inclined surfaces, respectively.

The insertion hole may extend in a direction perpendicular to the inclined surface.

The heights of the first to third sidewalls and the first to fourth sidewalls may be lowered away from the first-first sidewalls.

The height of the first-second sidewall may be lower than the height of the first-first sidewall.

It may include a first connector and a second connector for electrically connecting the external power source and the circuit board through the first-first sidewall.

The first connector and the second connector may be disposed between the pair of inclined surfaces.

The flow path forming portion may include a plurality of straight portions arranged in parallel with each other, and a plurality of curved portions connecting the plurality of straight portions, and the inlet and the outlet may be disposed at the first end side of the straight portion.

The plurality of curved portions sequentially connect a plurality of first curved portions connecting the second ends of the adjacent odd-numbered straight portions among the plurality of straight portions, and a first end of the adjacent even-numbered straight portions among the plurality of straight portions. It may include a plurality of second curved portion connecting.

In a direction parallel to the straight portion, the maximum distance from the first end of the straight portion to the inlet and the outlet may be greater than the maximum distance from the first end of the straight portion to the second curved portion.

The heating plate may include a metal plate including one surface in contact with the flow path, a first insulating layer disposed on the other surface of the metal plate, the heating pattern disposed on the first insulating layer, and a second insulating layer surrounding the heating pattern. It may include.

The circuit board may be coupled to a plurality of posts protruding from one surface of the partition wall to be spaced apart from one surface of the partition wall.

It may include an electronic device disposed in the mounting groove or platform formed on one surface of the partition wall.

The mounting groove or platform may overlap the flow path in a direction passing through the partition wall part.

The seating groove or platform may overlap the inlet in the extending direction of the flow path.

The electronic device may include an insulated gate bipolar mode transistor (IGBT) connected to the circuit board.

According to embodiments of the present invention, the heating pattern may be formed along the flow path to maximize the overlapping area between the fluid and the heating element, the flow path may be formed on the other side of the partition wall, and the heating element may have a plate shape to minimize the size of the product.

1 is a perspective view of a fluid heating heater according to an embodiment of the present invention,
2 and 3 is an exploded perspective view of Figure 1,
4 is a front view illustrating a state in which the first cover is removed from FIG. 1;
5 is a rear view illustrating a state in which the second cover is removed from FIG. 1;
6 is a cross-sectional view at AA of FIG. 1,
7 is a cross-sectional view taken along line BB of FIG. 1,
8 is a front view of the main body of FIG. 2,
9 is a rear view of the main body of FIG.
10 is a side view of the main body of FIG. 2,
FIG. 11 is a front view of FIG. 8 superimposed on FIG. 9;
12 is a front view of the heating plate of FIG. 2,
FIG. 13 is a cross-sectional view taken along line CC of FIG. 12.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In addition, the coupling or connection does not mean only a direct physical contact between each component, but when other components are interposed between each component and each component is in contact with the other component, respectively It can be used as a comprehensive concept.

Hereinafter, a preferred embodiment of the fluid heating heater according to the present invention will be described in detail with reference to the accompanying drawings, the same or corresponding components in the drawings with reference to the same reference numerals and overlapping The description will be omitted.

1 is a perspective view of a fluid heating heater according to an embodiment of the present invention, Figures 2 and 3 is an exploded perspective view of Figure 1, Figure 4 is a front view showing a state in which the first cover in Figure 1, 5 is a rear view illustrating a state in which the second cover is removed from FIG. 1.

1 to 5, the fluid heating heater 10 according to an embodiment of the present invention includes a main body 100, a first cover 210, a second cover 220, a heating plate 230, and a circuit. It may include the substrate 300 and the bus bar 400, and may further include a first connector 310, a second connector 320, an electronic device 330 and 340, and / or a water temperature sensor 350. have.

The main body 100 may include a partition wall part 110, a first side wall part 120, a second side wall part 130, a flow path forming part 140, and a pair of protrusions 150.

The partition 110 may have a plate shape including one surface and the other surface opposite to the one surface.

The first side wall part 120 may be disposed on one surface of the partition wall part 110, and the second side wall part 130 may be disposed on the other surface of the partition wall part 110.

The flow path forming part 140 may be formed to expose the flow path 141 on the other surface of the partition wall part 110.

The flow path forming part 140 may be a shape protruding from the other surface of the partition wall part 110, but is not necessarily limited thereto and may have a shape in which a part of the other surface of the partition wall part 110 is recessed.

The pair of protrusions 150 may be disposed on one surface of the partition wall part 110. The fluid supply pipe 160 and the fluid discharge pipe 170 may be respectively coupled to the pair of protrusions 150.

The fluid supply pipe 160 may supply fluid to the flow path 141, and the fluid discharge pipe 170 may discharge fluid from the flow path 141.

The first cover 210 may be coupled to the first side wall part 120 by a fastening member such as a bolt to form a first receiving space in front of the main body 100. The second cover 220 may be coupled to the second side wall portion 130 by a fastening member such as a bolt to form a second accommodation space at the rear of the main body 100. A sealing member S such as an O-ring is interposed between the first cover 210 and the main body 100, between the second cover 220 and the heating plate 230, and between the heating plate 230 and the main body 100. It is possible to improve the watertightness.

The heating plate 230 may be disposed on the flow path forming part 140 to close the exposed surface of the flow path 141. For example, the straight portion and the curved portion constituting the flow path forming portion 140 may be in contact with one surface of the heating plate 230.

The heating plate 230 may be disposed on the second side wall portion 130 and the flow path forming portion 140, and coupled to the second side wall portion 130 together with the second cover 220 by a fastening member such as a bolt. Can be. The second side wall portion 130 may include an edge portion 131 forming a step so that the heating plate 230 may be inserted. The edge portion 131 may protrude along the edge of the second side wall portion 130 to support the side surface of the heating plate 230.

The circuit board 300 may be disposed inside the first sidewall part 120. In addition, the circuit board 300 may be coupled to a plurality of posts 111 protruding from one surface of the partition wall part 110 by fastening members such as bolts. Accordingly, the circuit board 300 may be spaced apart from one surface of the partition wall part 110, and the electronic devices 330 and 340 may be disposed between the circuit board 300 and one surface of the partition wall part 110. Space can be secured.

The first connector 310 and the second connector 320 may pass through the first sidewall part 120 to electrically connect an external power source (not shown) and the circuit board 300. The first connector 310 may be a high voltage connector (HV connector), and the second connector 320 may be a low voltage connector (LV connector). The circuit board 300 may receive electricity from an external power source through the first connector 310 and the second connector 320.

The electronic devices 330 and 340 may be disposed in the mounting groove 112 or the platform 113 formed on one surface of the partition wall 110. Therefore, the electronic devices 330 and 340 may exchange heat with the fluid flowing along the flow path 141 with the partition 110 therebetween. Accordingly, overheating of the electronic devices 330 and 340 may be prevented, and energy efficiency may be enhanced by heating the fluid with heat emitted from the electronic devices 330 and 340.

The electronic devices 330 and 340 may be electrically connected to the circuit board 300 to implement various control logics together with a circuit pattern (not shown), an element (not shown), or the like printed or mounted on the circuit board 300. The electronic devices 330 and 340 may include a capacitor 330, an IGBT 340, and the like, but are not limited thereto.

The bus bar 400 may be disposed in the connector 110e penetrating the partition 110 to electrically connect the heating pattern of the heating plate 230 to the circuit board 300. The heating pattern of the heating plate 230 may receive electricity through the bus bar 400. The heating pattern may be an electrical resistor that generates heat when electricity is supplied. Meanwhile, the connector 110e may penetrate the partition wall part 110 inside the first side wall part 120 and the second side wall part 130.

6 is a cross-sectional view taken along the line A-A of FIG. 1, and FIG. 7 is a cross-sectional view taken along the line B-B of FIG. 1.

6 and 7, the main body 100 may include an inlet port 110a and an outlet port 110b that penetrate the partition wall part 110 from the outside of the first sidewall part 120.

The inlet 110a and the outlet 110b may be connected to the flow path 141 and may extend into the pair of protrusions 150 to be connected to the fluid supply pipe 160 and the fluid discharge pipe 170, respectively.

The pair of water temperature sensors 350 may be disposed in the pair of insertion holes 110c and 110d passing through the partition wall part 110, respectively. The insertion holes 110c and 110d may be connected to the flow path 141 through the partition wall part 110 at the inner side of the first side wall part 120. In addition, the pair of insertion holes 110c and 110d may be disposed at positions corresponding to the inlet port 110a and the outlet port 110b, respectively. That is, the pair of insertion holes 110c and 110d may be disposed to face the inlet port 110a and the outlet port 110b with the first sidewall portion 120 interposed therebetween. Accordingly, the pair of water temperature sensors 350 may measure the fluid temperature immediately after flowing into the flow path 141 and the fluid temperature immediately before being discharged from the flow path 141, respectively. On the other hand, the circuit board 300 receives the temperature data from the pair of water temperature sensor 350 and supplies it to the heating plate 230 so that the fluid temperature discharged from the flow path 141 can reach the preset target temperature based on the temperature data. Power can be adjusted.

The pair of insertion holes 110c and 110d may be disposed on the pair of inclined surfaces 121a, respectively. The inclined surface 121a may be disposed to be inclined with respect to one surface of the partition wall part 110 and may be connected to the inner side surface of the first side wall part 120. The insertion holes 110c and 110d may extend in a direction inclined with respect to one surface of the partition wall part 110. Therefore, when the water temperature sensor 350 is installed and replaced, the jig (not shown) holding and transferring the water temperature sensor 350 may collide with the first side wall part 120. The insertion holes 110c and 110d may extend in a direction perpendicular to the inclined surface 121a, but are not necessarily limited thereto.

FIG. 8 is a front view of the main body of FIG. 2, FIG. 9 is a rear view of the main body of FIG. 2, FIG. 10 is a side view of the main body of FIG. 2, and FIG. 11 is a front view of FIG. .

Referring to FIG. 8, the first sidewall portion 120 may face the first-first sidewall 121 and the first-second sidewall 122, the first-first sidewall 121, and the first-second sidewall ( 122 may include a first sidewall 123 and a first sidewall 124 facing each other.

The inner surface of the first-first sidewall 121 may be connected to the pair of inclined surfaces 121a, and the outer surface of the first-first sidewall 121 may be connected to the pair of protrusions 150. The pair of inclined surfaces 121a may be disposed to face the pair of protrusions 150.

4 and 8, the first connector 310 and the second connector 320 may be disposed to penetrate the first-first sidewall 121. In addition, the first connector 310 and the second connector 320 may be disposed between the pair of protrusions 150 or between the pair of inclined surfaces 121a.

Referring to FIG. 9, the flow path 141 may extend from the inlet port 110a to the outlet port 110b, and the pair of insertion holes 110c and 110d may be disposed adjacent to the inlet port 110a and the outlet port 110b, respectively. Can be.

The flow path forming part 140 may be disposed inside the second side wall part 130. The flow path forming unit 140 may include a plurality of straight portions 143 arranged in parallel with each other, and a plurality of curved portions 145 and 147 connecting the plurality of straight portions 143.

The straight portion 143 and the curved portions 145 and 147 may protrude from the other surface of the partition wall 110.

The curved portions 145 and 147 may include a first curved portion 145 and a second curved portion 147 disposed on opposite sides of the straight portion 143. For example, the first curved portion 145 may be disposed on the second end side of the straight portion 143, and the second curved portion 147 may be disposed on the first end side of the straight portion 143. have. The inlet 110a and the outlet 110b may be disposed at the first end side of the straight portion 143. The plurality of first curved portions 145 may sequentially connect the second ends of the odd-numbered straight portions 143 among the plurality of straight portions 143, and the plurality of second curved portions 147 may include a plurality of straight portions ( The first ends of the even-numbered straight parts 143 may be sequentially connected.

With respect to the direction parallel to the straight portion 143, the maximum distance L1 from the first end of the straight portion 143 to the inlet 110a and the outlet 110b is determined from the first end of the straight portion 143. It may be larger than the maximum distance L2 to the two curved portions 147. Therefore, bubbles flowing into the flow path 141 or generated in the flow path 141 may be discharged to the outside of the flow path 141 through the discharge port 110b. When bubbles accumulate in the flow path 141, localized heat concentration may occur on the heat generating plate, thereby causing deterioration in heat generation performance of the heat generating plate and thus causing fire.

8 and 10, based on one surface of the partition wall part 110, the heights of the first sidewall 123 and the first sidewall 124 are away from the first sidewall 121. Can decrease. Based on one surface of the partition wall 110, the height of the first-second sidewall 122 may be smaller than the height of the first-first sidewall 121. Therefore, it is possible to improve the problem that the jig for holding and transferring the water temperature sensor may collide with the first-second sidewall 122 when the water temperature sensor is installed and replaced. In this case, the first cover may include a third sidewall portion having a shape corresponding to the second sidewall portion, and the distance between the partition wall portion 110 and the first cover may be maintained constant over the entire area of the partition wall portion 110. For example, the plate part of the first cover facing one surface of the partition wall part 110 may be disposed in parallel with one surface of the partition wall part 110.

Referring to FIG. 11, the mounting groove 112 or the platform 113 may overlap the flow path 141 in a direction penetrating one surface and the other surface of the partition wall 110. In addition, the inlet 110a and the seating groove 112 or the platform 113 may overlap each other in an extending direction of the flow path 141, that is, in a direction parallel to the straight portion 143.

FIG. 12 is a front view of the heating plate of FIG. 2, and FIG. 13 is a cross-sectional view taken along the line C-C of FIG. 12.

12 and 13, the heating plate 230 may include a metal plate 231 including one surface in contact with the flow path 141 and the other surface opposite to one surface thereof, and a first insulating layer disposed on the other surface of the metal plate 231. 233, a heating pattern 235 disposed on the first insulating layer 233, and a second insulating layer 237 surrounding the heating pattern 235.

The metal plate 231 may include aluminum (Al), stainless steel (SUS), or the like, but is not limited thereto, and may include other materials having excellent thermal conductivity.

The first insulating layer 233 may provide electrical insulation between the metal plate 231 and the heating pattern 235.

The heating plate 230 may include a heating pattern 235 corresponding to the flow path 141. That is, the heating pattern 235 may extend along the flow path 141. Although one heating pattern 235 is illustrated as being disposed in the flow path 141, the present disclosure is not limited thereto, and two or more heating patterns 235 parallel to each other may be disposed. In FIG. 12, for convenience of description, the flow path 141 formed in the main body is indicated by a dashed-dotted line, and the first insulating layer 233, the heating pattern 235, and the second insulating layer 237 are metal plates 231. It is formed on the other side of the metal plate 231 is not visible on one side, but indicated by a dotted line.

As mentioned above, although preferred embodiments of the present invention have been described, those of ordinary skill in the art may add, change, delete, or add components without departing from the spirit of the present invention described in the claims. The present invention may be modified and changed in various ways, which will also be included within the scope of the present invention.

10: fluid heating heater 100: main body
110: partition wall portion 110a: inlet
110b: outlet 110c, 110d: insertion hole
110e: connector 111: post
112: seating groove 113: platform
120: first sidewall portion 121: first-first sidewall
121a: inclined surface 122: 1-2th sidewall
123: first-3 sidewall 124: first-4 sidewall
130: second side wall portion 131: edge portion
140: flow path forming unit 141: flow path
143: straight portion 145: first curved portion
147: second curved portion 150: protrusion
160: fluid supply pipe 170: fluid discharge pipe
210: first cover 220: second cover
230: heating plate 231: metal plate
233: first insulating layer 235: heat generating pattern
237: second insulating layer 300: circuit board
310: first connector 320: second connector
330, 340: electronic device 350: water temperature sensor
400: bus bar

Claims (21)

A main body including a plate-shaped partition wall portion and a flow path forming portion forming a flow path on the other surface of the partition wall portion;
A heating plate disposed on the flow path forming part in a plate shape and including a heating pattern having a shape corresponding to the flow path;
A circuit board disposed on one surface of the partition wall part; And
And a bus bar electrically connecting the heating pattern and the circuit board.
The method of claim 1,
A first cover disposed on one surface of the partition wall; And
A second cover disposed on the other surface of the partition wall;
The main body includes a first side wall portion disposed on one surface of the partition wall portion, and a second side wall portion disposed on the other surface of the partition wall portion,
The first cover is coupled to the first side wall portion,
And the second cover is coupled to the second sidewall portion.
The method of claim 2,
And the flow path forming part is disposed inside the second side wall part.
The method of claim 2,
The main body includes an inlet and an outlet through the partition wall outside the first side wall portion,
And the flow passage extends from the inlet to the outlet.
The method of claim 4, wherein
And a pair of water temperature sensors respectively disposed in a pair of insertion holes connected to the flow path through the partition wall part inside the first side wall part.
The method of claim 5,
The pair of insertion openings are respectively disposed in positions corresponding to the inlet and the outlet.
The method of claim 5,
The first sidewall portion may include the first-first sidewall and the first-second sidewall facing each other, and the first-third sidewall and the first-first sidewall connecting the first-first sidewall and the first-second sidewall and facing each other. Includes 4 sidewalls,
The inner side surface of the first-first sidewall includes a pair of inclined surfaces inclined with respect to one surface of the partition wall part,
The pair of insertion openings are respectively disposed on the pair of inclined surfaces.
The method of claim 7, wherein
The insertion hole extends in a direction perpendicular to the inclined surface.
The method of claim 7, wherein
And heights of the first to third sidewalls and the first to fourth sidewalls are lowered away from the first-first sidewalls.
The method of claim 7, wherein
And a height of the first-second sidewall is lower than a height of the first-first sidewall.
The method of claim 7, wherein
And a first connector and a second connector electrically connecting the external power supply to the circuit board through the first-first sidewall.
The method of claim 11,
And the first connector and the second connector are disposed between the pair of inclined surfaces.
The method of claim 4, wherein
The flow path forming portion includes a plurality of straight portions arranged in parallel with each other, and a plurality of curved portions connecting the plurality of straight portions,
And the inlet and the outlet are disposed at the first end side of the straight portion.
The method of claim 13,
The plurality of curved portions sequentially connect a plurality of first curved portions connecting the second ends of the adjacent odd-numbered straight portions among the plurality of straight portions, and a first end of the adjacent even-numbered straight portions among the plurality of straight portions. A fluid heating heater comprising a plurality of second curved portions to connect.
The method of claim 14,
And a maximum distance from the first end of the straight portion to the inlet and the discharge port relative to the direction parallel to the straight portion is greater than the maximum distance from the first end of the straight portion to the second curved portion.
The method of claim 1,
The heating plate may include a metal plate including one surface in contact with the flow path, a first insulating layer disposed on the other surface of the metal plate, the heating pattern disposed on the first insulating layer, and a second insulating layer surrounding the heating pattern. Fluid heating heater comprising.
The method of claim 4, wherein
The circuit board is coupled to a plurality of posts protruding from one surface of the partition wall fluid heating heater disposed to be spaced apart from one surface of the partition wall.
The method of claim 17,
Fluid heating heater comprising an electronic element disposed in the mounting groove or platform formed on one surface of the partition wall.
The method of claim 18,
And the seating groove or platform overlaps the flow path in a direction passing through the partition wall part.
The method of claim 18,
And the seating groove or platform overlaps the inlet in the extending direction of the flow path.
The method of claim 18,
The electronic device includes a fluid heated heater including an insulated gate bipolar mode transistor (IGBT) connected to the circuit board.

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