KR20190142956A - Spiral contact pin for test socket - Google Patents

Abstract

According to the present invention, provided is a pin for a semiconductor test socket for electrically connecting a conductive ball with a contact pad between a semiconductor device and a test apparatus. The pin for a semiconductor test socket includes a first connection tip in contact with the conductive ball, a contact body, and a three-dimensional spiral type second connection tip. According to the configuration of the present invention, a stroke is reduced.

Description

Spiral contact pin for semiconductor test socket {Spiral contact pin for test socket}

The present invention relates to a spoiler contact pin for a semiconductor test socket, which is provided between a semiconductor device and a test device and performs an electrical inspection of the semiconductor device, wherein the two-dimensional strip is curled and provided as a three-dimensional spoiler tip. will be.

In general, a ball grid array (BGA) type semiconductor device is finally subjected to a characteristic measurement or failure inspection through various electrical tests by an inspection device. In this case, a test socket is used to electrically connect the circuit pattern of the test printed circuit board installed in the test apparatus and the contact ball of the BGA type semiconductor device.

In such a test socket, a plurality of probe pins are installed in the housing according to a predetermined rule. In recent years, the number of parts is increased, and probe pins are gradually miniaturized for fast data processing and low power consumption. Conventional probe pins, including pogo pins, do not actively cope with fine patterns, and thus deteriorate contact characteristics of the probe pins. There is a problem.

In order to improve this structural problem, a contact pin is proposed as follows.

Referring to FIG. 1, the contact pin 2 includes a contact body 10, a pin head 20, a pin leg 30, and an elastic portion 40.

The contact body 10 is mounted on the base of the semiconductor package test socket, and the pin head 20 is formed above the contact body 10 to be in contact with the lower terminal of the semiconductor package to be tested. The pin head 20 is formed in a pair in the contact body 10 to be picked up from both sides of the lower terminal of the semiconductor package. The pin leg 30 is formed below the contact body 10 to be in contact with the test board.

Here, the elastic part 40 is integrally formed between the contact body 10 and the pin leg 30 to reduce the impact with the test board during the test, as well as to improve the connection force by the elastic force. The elastic portion 40 is bent a plurality of times between the contact body 10 and the pin leg 30.

However, the elastic portion 40 in the form of wire is pressurized when the vertical pressure is applied and then returns to its original form by the restoring force when the pressure is released. Since the wire is bent and deformed in a zigzag form, it is easily deformed by an iterative inspection process. And loss of resilience. And there is a problem in that the electrical resistance is increased by the elastic portion 40 that is elongated.

Korea Patent Registration 10-1752468

Accordingly, the present invention has been made to solve the problems of the prior art as described above, an object of the present invention is to provide a contact pin for a semiconductor test socket of the three-dimensional spiral form to solve the resilience of the contact pin of the wire form. will be.

According to a feature of the present invention for achieving the above object, the contact pin for a semiconductor test socket of the present invention, a pin for a semiconductor test socket for electrically connecting the conductive ball and the contact pad between the semiconductor device and the test device. The method may include a first connecting tip contacting the conductive ball, a contact body, and a three-dimensional spoiler type second connecting tip contacting the contact pad.

As described above, according to the configuration of the present invention, the following effects can be expected.

First, since the two-dimensional strip is curled to provide a three-dimensional spoiler tip, the stroke is improved, the restoring force is improved, and the product life is long.

Second, since the electrical path is formed through the strip, the electrical resistance is reduced, thereby improving the reliability of the inspection.

BRIEF DESCRIPTION OF THE DRAWINGS The top view which shows the structure of the contact pin for semiconductor test sockets by a prior art.
2 is a schematic diagram showing a configuration of a test socket of a semiconductor device according to the present invention.
3 is a perspective view showing the configuration of a contact pin according to an embodiment of the present invention.
4 and 5 are strip exploded views of the spoiler tip of FIG. 3.
6 is a perspective view showing the structure of a contact pin according to another embodiment of the present invention.
Figure 7 is a perspective view showing the configuration of a contact pin according to another embodiment according to the present invention.

Advantages and features of the present invention and methods for achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are to make the disclosure of the present invention complete, and the general knowledge in the technical field to which the present invention belongs. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals refer to like elements throughout.

Embodiments described herein will be described with reference to plan and cross-sectional views, which are ideal schematic diagrams of the invention. Therefore, the shape of the exemplary diagram may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in forms generated according to manufacturing processes. Thus, the regions illustrated in the figures have schematic attributes, and the shape of the regions illustrated in the figures is intended to illustrate a particular shape of the pin and is not intended to limit the scope of the invention.

Hereinafter, a preferred embodiment of a spoiler contact pin for a test socket according to the present invention having the configuration as described above will be described in detail with reference to the accompanying drawings.

Pins for semiconductor test sockets will be described as being used in final test sockets for convenience of description, but are not limited thereto and may be used in burn-in test sockets as well.

The test socket is a device for testing a semiconductor device such as a package IC or MCM, a semiconductor device such as a wafer on which an integrated circuit is formed, and a connection terminal (for example, a conductive ball) of a semiconductor device to be inspected and a test device. In order to electrically connect the connection terminals (for example, contact pads) to each other, it is assumed to be disposed between the semiconductor device and the test apparatus.

Referring to FIG. 2, the contact pin 100 for a test socket electrically connects an external device, for example, a conductive ball B of a semiconductor device and a contact pad P of a test device, to between a semiconductor device and a test device. Perform an electrical test.

Referring to FIG. 3, a contact pin 100 for a semiconductor test socket according to the present invention relates to a pin for a semiconductor test socket electrically connecting a conductive ball B and a contact pad P between a semiconductor device and a test device. The first connection tip 110, the contact body 120, and the spoiler type second connection tip 130 contacted with the contact pad P may be included.

The second connection tip 130 is in the form of a two-dimensional strip before undergoing a curling process. The strip is curled at least twice around the pin axis y to provide a three-dimensional spoiler tip 134. The pin axis y is a reference axis connecting the conductive ball B and the contact pad P.

The second connection tip 130 further includes an introduction part 132 extending from the contact body 120, and the introduction part 132 connects the contact body 120 and the second connection tip 130 as necessary. The pin axis y and the curling axis y 'may be generally coaxial or biaxially formed side by side, although they may be eccentric or deflected outwardly.

The spiral tip 134 is formed by helically curling the two-dimensional strip 134 'through a curling process of a press.

The two-dimensional strip 134 'is composed of both surfaces of one side and the other side, and one side becomes the outer side, the other side becomes the inner side by the curling process, and the pin axis y is centered toward the end e. Tilted obliquely at a predetermined angle.

The tilt axis t of the two-dimensional strip 134 'is inclined up to 80 ° with respect to the pin axis y. However, when inclined to 45 ° or less, overlapping portions may not be formed.

Referring to FIG. 4, the width of the two-dimensional strip 134 ′ is generally constant. However, referring to FIG. 5, the width of the two-dimensional strip 134 ′ may become smaller toward the end portion e. .

The two-dimensional strip 134 'is preferably curled two or more times. However, if curled more than 6 times, the thickness of the spiral tip 134 becomes large, which may not be preferable because the entire size of the contact pin 100 may be expanded.

On the other hand, when the end e which is in direct contact with the contact pad P is perpendicular to the pin axis y, there is a high possibility of surface connection with the contact pad P. Alternatively, even at right angles, various patterns may be provided at the end e to induce line connection. For example, it may be provided in an uneven shape.

In the two-dimensional strip 134 ′, there is an area where the one surface by the n-th culling covers the one surface by the n−1 th culling, thereby overlapping each other. If pressure is applied from the outside during the inspection process, the overlapping area is enlarged by an end stroke.

The end (e) stroke does not exceed a maximum of 0.5 mm when the total height of the spoiler tip 134 is 4.0 mm.

Since the three-dimensional spiral tip 134 is formed by spirally curling the two-dimensional strip 134 'like a spring, one surface and the other surface of the strip 134' may be mutually contacted by curling. The electrical resistance can be reduced because the electrical path is shortened by the contact.

6 and 7, since the first connection tip 110 is connected to the conductive ball B and the conductive ball B is generally circular, the first connection tip 110 is used to effectively pick up and contact the conductive ball B. It may be provided in a pair of tongs.

The tongs system is connected in such a manner that the conductive balls are pressed from both sides. Therefore, even in the case of the tongs, there are cases where one clamp is fixed and only the other clamp is elastically operated (see FIG. 6), and the one clamp and the rubbing to both elastically operate (see FIG. 7).

Referring to FIG. 3 again, in the case of a single fin type, an elastic part may be provided in the contact body 120 itself in order to provide elastic force against external force during the inspection process. For example, the shock can be absorbed through a C or bow type contact body. On the other hand, referring to Figures 6 and 7, in the case of the forceps type, the pair of forceps in the first connection tip 110 is provided to both sides to provide an elastic force to absorb the external force.

Commonly in the above embodiment, the second connection tip 130 improves the stroke by changing the two-dimensional strip 134 'to the three-dimensional spoiler tip 134 through a curling process.

As described above, the present invention provides a three-dimensional spoiler tip by curling a two-dimensional strip tilted at a predetermined angle with respect to the pin body, thereby improving the stroke and lowering the electrical resistance. Able to know. Within the scope of the basic technical idea of the present invention, many other modifications will be possible to those skilled in the art.

100: spoiler contact pin 110: first connection tip
120: contact body 130: second connection tip
134 ': strip 134: spoiler tip

Claims (10)

A pin for a semiconductor test socket for electrically connecting a conductive ball and a contact pad between a semiconductor device and a test device,
A first connection tip contacting the conductive ball;
Contact body; And
And a three-dimensional spoiler type second connection tip in contact with the contact pad. The method of claim 1,
Wherein the second connection tip comprises a spoiler tip in which a two-dimensional strip is curled like a spiral spring at least two times in a straight line or parallel to the pin axis connecting the conductive ball and the contact pad. Spoiler contact pins for test sockets. The method of claim 2,
The strip is composed of both surfaces of one side and the other side, the one surface is the outer surface by the curling, the other surface is the inner surface, the semiconductor characterized in that it is tilted obliquely at a predetermined angle around the pin axis toward the end Spoiler contact pins for test sockets. The method of claim 3, wherein
And the strip is smaller in width toward the end thereof. The method of claim 3, wherein
And the strip is wound three or more times and six times or less by the curling. The method of claim 3, wherein
And a tilt axis of the strip is inclined by 45 ° or more and 20 ° or less with respect to the pin axis. The method of claim 3, wherein
The strip is characterized in that the one surface by the n-th curling covers the one surface by the n-th curling, the overlapping region exists, and the overlapping region is enlarged by the bottom stroke. Spoiler contact pins for semiconductor test sockets. The method of claim 3, wherein
Said bottom stroke is a maximum of 0.5 mm, when the total height of the said spoiler tip is 4.0 mm. The method of claim 3, wherein
The first connection tip is a pair of tongs type, the one side of the clamp is fixed and the other side is deformable to the side, the pin axis and curling axis is not located in a straight line, but the spoiler for semiconductor test socket Contact pins. The method of claim 3, wherein
The first connection tip is a pair of forceps type, both of the pair of forceps deformable to both sides, the pin axis and curling axis is a spoiler contact pin for a semiconductor test socket, characterized in that located in a straight line.

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