KR20190122524A - Multi-layered ceramic electronic component - Google Patents

Abstract

The present invention relates to a multilayered ceramic electronic component and, more specifically, to a multilayered ceramic electronic component with excellent reliability. According to the present invention, the multilayered ceramic electronic component includes: a ceramic body; a first outer electrode electrically connected to a first inner electrode and installed outside the ceramic body; and a second outer electrode electrically connected to a second inner electrode. The ceramic body has: a dielectric layer; the first inner electrode and the second inner electrode facing each other across the dielectric layer; a first side and a second side facing each other; a third side and a fourth side facing each other and connected to the first side and the second side; and a fifth side and a sixth side facing each other and connected to the first side to the fourth side. The ceramic body includes: an active unit forming capacity by including the first inner electrode and the second inner electrode, which are installed to face the each other across the dielectric layer; and a cover unit formed in the upper part and the lower part of the active unit. A thickness ratio of the first outer electrode and the second outer electrode in comparison with the thickness of the cover unit is proportional to the square root of the ratio of Young′s modulus of the first and second outer electrode in comparison with the Young′s modulus of the cover unit.

Description

Multi-layered ceramic electronic component

The present invention relates to a multilayer ceramic electronic component, and more particularly, to a multilayer ceramic electronic component having excellent reliability.

Recently, as the mounting density of the substrate is increased, the necessity for reducing the mounting area of the multilayer ceramic capacitor is increasing. In addition, the thickness of the multilayer ceramic capacitor is reduced to embed it in the substrate or to mount the LSC type at the bottom of the AP. The demand for it is increasing.

In the above case, the demand for thinner multilayer ceramic capacitor products is increasing because it is not only reduced in mounting area but also effective in reducing ESL generated in the substrate.

Thin multilayer ceramic capacitors have a problem of brittleness and low breaking strength.

This low breakdown strength increases the likelihood of breakage in the course of breakage and mounting in the measurement, sorting and taping processes of multilayer ceramic capacitors.

Therefore, in order to commercially apply a thin multilayer ceramic capacitor, it is a prerequisite to increase the breakdown strength of the thin multilayer ceramic capacitor.

Conventionally, in order to improve the breaking strength of a thin multilayer ceramic capacitor, an attempt has been made to insert a metal layer irrelevant to the implementation of electrical properties into the body, but a process of inserting a metal layer to the interior of the body is not related to the implementation of electrical properties. There was a problem of increase and decrease in capacity due to the metal layer.

On the other hand, inside the body of the multilayer ceramic capacitor, there is a cover portion, which is a protection region in which internal electrodes are not disposed, and since the cover portion is not protected by the metal layer, the breakdown strength is rapidly lowered when a predetermined thickness or more is not secured.

In order to control the brittleness of the cover part, there is a need to secure the thickness of the external electrode more than a certain level.

Korean Laid-Open Patent Publication 2014-0085097

The present invention relates to a multilayer ceramic electronic component, and more particularly, to a multilayer ceramic electronic component having excellent reliability.

An embodiment of the present invention includes a dielectric layer and a first internal electrode and a second internal electrode disposed to face each other with the dielectric layer interposed therebetween, and include first, second, and first surfaces facing each other. It is connected to two surfaces, but facing the third surface, the fourth surface and the first surface to the fourth surface connected to each other, having a fifth surface, a sixth surface facing each other and the outside of the ceramic body A first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode, wherein the ceramic body is disposed to face each other with the dielectric layer interposed therebetween. An active part including a first internal electrode and a second internal electrode to be formed, and a cover part formed on top and bottom of the active part, wherein the thickness of the first and second external electrodes is greater than the thickness of the cover part. The ratio provides a multilayer ceramic electronic component that is proportional to the square root of the ratio of the Young's Modulus of the first and second external electrodes to the Young's Modulus of the cover part.

Another embodiment of the present invention includes a dielectric layer and internal electrodes disposed to face each other with the dielectric layer interposed therebetween, and connected to the first, second, and first and second surfaces facing each other. A third body, a fourth surface, and the first to fourth surfaces facing each other, the fifth body and the sixth surface facing each other, and a ceramic body disposed on the outer side of the ceramic body; An external electrode electrically connected to the ceramic body, wherein the ceramic body includes an internal electrode disposed to face each other with the dielectric layer interposed therebetween, and includes a ceramic formed on top and a bottom of the active part having a capacitance; The external electrode is disposed on the outside of the ceramic body, the first electrode layer including a first conductive metal and the first electrode layer disposed on the first conductive layer, the second conductive And a plating layer including a metal, wherein the thickness of the external electrode is the sum of the thicknesses of the first electrode layer and the plating layer determined according to the Young's Modulus of the first conductive metal and the Young's Modulus of the second conductive metal. And the ratio of the thickness of the external electrode to the thickness of the cover part is proportional to the ratio of the Young's Modulus of the first conductive metal and the second conductive metal to the Young's Modulus of the ceramic included in the cover part. Provide electronic components.

According to an embodiment of the present invention, by adjusting the ratio of the thickness of the outer electrode and the thickness of the cover portion according to the difference of the Young's Modulus of the conductive metal included in the external electrode and the ceramic material included in the cover portion in the ceramic body In addition, the breakdown strength of the multilayer ceramic capacitor having a thin thickness can be increased to prevent a decrease in reliability due to breakage and cracking during the process.

1 is a perspective view showing a multilayer ceramic capacitor according to an embodiment of the present invention.
2 is a schematic view showing a ceramic body according to one embodiment of the present invention.
3 is an exploded perspective view of FIG. 2.
4 is a cross-sectional view taken along line II ′ of FIG. 1 according to the first embodiment of the present invention.
5 is a cross-sectional view taken along line II ′ of FIG. 1 according to the second embodiment of the present invention.
FIG. 6 is a top plan view viewed from the direction B of FIG. 1.

Embodiments of the invention may be modified in many different forms and should not be construed as limited to the embodiments set forth herein. In addition, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for clarity, and the elements represented by the same reference numerals in the drawings are the same elements.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.

In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and the thicknesses are enlarged in order to clearly express various layers and regions, and like reference numerals denote like parts throughout the specification. To do that.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention.

1 is a perspective view showing a multilayer ceramic capacitor according to an embodiment of the present invention.

2 is a schematic view showing a ceramic body according to one embodiment of the present invention.

3 is an exploded perspective view of FIG. 2.

4 is a cross-sectional view taken along the line II ′ of FIG. 1, according to the first embodiment of the present invention.

1 to 4, a multilayer ceramic electronic component according to an embodiment of the present invention may include a first internal electrode 121 and a first internal electrode 121 disposed to face each other with the dielectric layer 111 and the dielectric layer 111 interposed therebetween. A third surface including two internal electrodes 122 and connected to first and second surfaces S1 and S2 facing each other, the first and second surfaces S1 and S2, and facing each other; The ceramic body 110 and the ceramic body 110 which are connected to the fourth surfaces S3 and S4 and the first to fourth surfaces, respectively, and have the fifth and sixth surfaces S5 and S6 facing each other. It is disposed outside of, and includes a first external electrode 131 electrically connected to the first internal electrode 121 and a second external electrode 132 electrically connected to the second internal electrode 122, The ceramic body 110 may include a first internal electrode 121 and a second internal electrode 122 disposed to face each other with the dielectric layer 111 interposed therebetween. The active part A includes a cover part C formed on the upper and lower portions of the active part A.

Hereinafter, a multilayer ceramic electronic component according to an exemplary embodiment of the present invention will be described. In particular, the multilayer ceramic capacitor is described as, but is not limited to.

In the multilayer ceramic capacitor according to the exemplary embodiment of the present invention, 'length direction' is defined as 'L' direction of FIG. 1, 'width direction' as 'W' direction, and 'thickness direction' as 'T' direction. do. Here, the 'thickness direction' can be used in the same concept as the direction of stacking the dielectric layer, that is, the 'lamination direction'.

In one embodiment of the present invention, the ceramic body 110 is not particularly limited in shape, but may be a hexahedron shape as shown.

The ceramic body 110 may include a first surface S1 and a second surface S2 facing each other, and a third surface S3 and a fourth surface S4 connecting the first and second surfaces, respectively. It may be connected to the first to fourth surfaces, but may have a fifth surface S5 and a sixth surface S6 facing each other.

The first surface S1 and the second surface S2 face each other in the thickness direction of the ceramic body 110, and the third surface S3 and the fourth surface S4 face each other in the longitudinal direction. The fifth surface S5 and the sixth surface S6 may be defined as surfaces facing in the width direction.

The shape of the ceramic body 110 is not particularly limited, but may be a rectangular parallelepiped shape as shown.

One end of the plurality of internal electrodes 121 and 122 formed in the ceramic body 110 is exposed to the fifth surface S5 or the sixth surface S6 of the ceramic body.

The internal electrodes 121 and 122 may be paired with the first internal electrode 121 and the second internal electrode 122 having different polarities.

One end of the first internal electrode 121 may be exposed to the fifth surface S5, and one end of the second internal electrode 122 may be exposed to the sixth surface S6.

The other ends of the first internal electrode 121 and the second internal electrode 122 are formed at a predetermined interval from the sixth surface S6 or the fifth surface S5. More details on this will be described later.

First and second external electrodes 131 and 132 may be formed on the fifth surface S5 and the sixth surface S6 of the ceramic body to be electrically connected to the internal electrodes.

According to one embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained, and may be, for example, barium titanate (BaTiO ₃ ) powder.

As the material for forming the dielectric layer 111, various ceramic additives, organic solvents, plasticizers, binders, dispersants, and the like may be added to powders such as barium titanate (BaTiO ₃ ) according to the present invention.

The ceramic body 110 may include an active part A as a part contributing to the capacitance formation of the capacitor, and an upper and lower cover part C formed at upper and lower parts of the active part A as upper and lower margins, respectively. .

The active part A may be formed by repeatedly stacking the plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

The upper and lower cover parts C may have the same material and configuration as the dielectric layer 111 except that the upper and lower cover parts C do not include internal electrodes.

That is, the upper and lower cover parts C may include a ceramic material, for example, a barium titanate (BaTiO ₃ ) -based ceramic material.

The upper and lower cover parts C may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the active part A in the vertical direction, respectively, and basically damage the internal electrode by physical or chemical stress. It can play a role in preventing.

The material for forming the first and second internal electrodes 121 and 122 is not particularly limited. For example, silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), and copper (Cu) may be used. It can be formed using a conductive paste containing one or more materials of).

The multilayer ceramic capacitor according to an exemplary embodiment of the present invention may include a first external electrode 131 electrically connected to the first internal electrode 121 and a second external electrode 132 electrically connected to the second internal electrode 122. ) May be included.

The first and second external electrodes 131 and 132 may be electrically connected to the first and second internal electrodes 121 and 122 to form a capacitance, and the second external electrode 132 may be electrically connected to the first and second external electrodes 132 and 122. 1 may be connected to a potential different from that of the external electrode 131.

The first internal electrode and the second internal electrode 121 and 122 are disposed to face each other with the dielectric layer 111 interposed therebetween, and the fifth surface S5 or the sixth surface of the ceramic body 110 in the width direction thereof. Alternately exposed at S6.

The first internal electrodes and the second internal electrodes 121 and 122 are alternately exposed to the fifth surface S5 or the sixth surface S6 of the ceramic body 110 in the width direction, and thus RGC ( Reverse Geometry Capacitor (LIFC) or Low Inductance Chip Capacitor (LICC) can be implemented.

In general multilayer ceramic electronic components, external electrodes may be disposed in cross sections facing each other in the length direction of the ceramic body.

In this case, since the current path is long when an alternating current is applied to the external electrode, the current loop may be formed larger, and the inductance may be increased by increasing the size of the induced magnetic field.

In order to solve the above problem, according to an embodiment of the present invention, in order to reduce the path of current, the first and fifth surfaces S5 and S6 face each other in the width direction of the ceramic body 110. And second external electrodes 131 and 132 may be disposed.

In this case, since the distance between the first and second external electrodes 131 and 132 is small, the current path is reduced, thereby reducing the current loop and thus reducing the inductance.

The first and second external electrodes 131 and 132 are disposed on the fifth surface S5 and the sixth surface S6 of the ceramic body 110 in the width direction, respectively, and the thickness direction of the ceramic body 110. It may be extended to the first surface (S1) and the second surface (S2).

According to the exemplary embodiment of the present invention, the areas of the first and second external electrodes 131 and 132 disposed on the first surface S1 and the second surface S2 in the thickness direction of the ceramic body 110 may be the above. The ceramic body 110 may occupy at least 50% of the area of each of the first and second surfaces S1 and S2.

The first and second external electrodes 131 and 132 are disposed outside the ceramic body 111, and include first and second electrode layers 131a and 132a and a first electrode layer 131a and 132a. Disposed on the substrate), and may include plating layers 131b and 132b including the second conductive metal.

Referring to FIG. 4, although the plating layers 131b and 132b are illustrated as being composed of one layer, the plating layers 131b and 132b are not limited thereto. For example, the plating layers may be disposed in at least two layers.

Referring to FIG. 5 as described below, the plating layer may have a two-layer structure, and thus the plating layer may include first plating layers 131b and 132b and second plating layers 131c and 132c, respectively.

The first electrode layers 131a and 132a may include a first conductive metal and glass.

The first and second external electrodes 131 and 132 may be formed on the fifth surface S5 and the sixth surface S6 of the ceramic body 110 in the width direction, respectively, to form the capacitance. The first electrode layers 131a and 132a included in the first and second external electrodes 131 and 132 may be electrically connected to the first and second internal electrodes 121 and 122.

The first electrode layers 131a and 132a may be formed of a conductive material of the same material as the first and second internal electrodes 121 and 122, but is not limited thereto. For example, copper (Cu) or silver (Ag), nickel (Ni), and one or more first conductive metals selected from the group consisting of alloys thereof.

The first electrode layers 131a and 132a may be formed by applying a conductive paste prepared by adding glass frit to the first conductive metal powder and then baking the conductive paste.

According to an embodiment of the present invention, the first and second external electrodes 131 and 132 are disposed on the first electrode layers 131a and 132a, and the plating layers 131b and 132b including a second conductive metal. It may include.

The second conductive metal is not particularly limited, but may be, for example, at least one selected from the group consisting of copper (Cu), nickel (Ni), tin (Sn), and alloys thereof.

The first conductive metal and the second conductive metal may be the same metal or may be different metals.

For example, the first conductive metal included in the first electrode layers 131a and 132a is nickel (Ni), and the second conductive metal included in the plating layers 131b and 132b is nickel (Ni) and copper (Cu). Or tin (Sn).

Similarly, the first conductive metal included in the first electrode layers 131a and 132a is copper (Cu), and the second conductive metal included in the plating layers 131b and 132b is nickel (Ni), copper (Cu), or tin. (Sn).

According to an embodiment of the present invention, the multilayer ceramic capacitor may have a thickness of 100 μm or less.

Thin multilayer ceramic capacitors having a thickness of 100 μm or less have recently been increasing in demand due to a higher density of mounting of substrates. However, thin multilayer ceramic capacitors having a thickness of 100 μm or less have a problem of brittleness and low breakdown strength.

This low breakdown strength increases the likelihood of breakage in the course of breakage and mounting in the measurement, sorting and taping processes of multilayer ceramic capacitors.

According to an embodiment of the present invention, the Young's Modulus of the conductive metal included in the first and second external electrodes 131 and 132 and the ceramic material included in the cover part C in the ceramic body 110 is included. By adjusting the ratio of the thickness of the first and second external electrodes 131 and 132 and the thickness of the cover part C according to the difference, the breakdown strength of the multilayer ceramic capacitor having a thin thickness of 100 μm or less is increased during the process. Reliability can be prevented due to breakage and cracking.

Specifically, according to one embodiment of the present invention, the sum of the thicknesses t ₁ and t ₂ of the first and second external electrodes 131 and 132 or t compared to the thickness t _c of the cover part C. The sum of ₁ , t _2, and t ₃ ) is equal to three square roots of the ratio of the Young's Modulus of the first and second external electrodes 131 and 132 to the Young's Modulus of the cover part C. Proportional.

In one embodiment of the present invention, the Young's Modulus of the ceramic material included in the cover part C and the Young's Modulus of the conductive metal included in the first and second external electrodes 131 and 132. The sum of the thicknesses t ₁ , t ₂ of the first and second external electrodes 131, 132 or t ₁ , t based on the thickness t _c of the cover part C based on the root-square value of the ratio of. The sum of ₂ and t ₃ ).

Since the cover part C does not have a metal layer disposed therein, when the cover part C does not have a predetermined thickness or more, the breaking strength may be drastically lowered.

In order to control the brittleness of the cover part C, the thickness of the external electrode must be secured to a certain part in order to prevent cracking.

In one embodiment of the present invention, to find the appropriate thickness of the external electrode to compensate for the low breaking strength of the thin cover portion (C), specifically the process for the thickness (tc) of the cover portion (C) as a reference The thickness of the external electrode, which can prevent the deterioration of reliability due to breakage and crack generation, is determined by the Young's Modulus of the ceramic material included in the cover part C and the first and second external electrodes 131 and 132. It is proportional to the root-square value of the ratio of the Young's Modulus of the conductive metal to be included.

For this reason, when the cover part C having a thin thickness is disposed in a thin multilayer ceramic capacitor having a thickness of 100 μm or less, it is possible to numerically determine the minimum thickness of the external electrode, which can prevent a decrease in reliability.

According to an embodiment of the present invention, the thickness of the external electrode relative to the thickness of the cover portion is determined in a thin multilayer ceramic capacitor having a thickness of 100 μm or less, and in a multilayer ceramic capacitor having a conventional structure having a thickness of more than 100 μm, The thickness of the cover part may not be a problem of breakage and cracking during the process or the numerical value of the present invention may not be applied.

Specifically, in order to obtain the thickness of the external electrode which can prevent the reliability deterioration due to breakage and crack generation during the process with respect to the thickness tc of the cover portion C as the reference, the cover portion C includes The ratio of the Young's Modulus of the conductive metal included in the external electrode to the Young's Modulus of the ceramic material was calculated, and the value obtained by calculating the square root of this value was derived.

Assuming that the cover part C includes barium titanate (BaTiO ₃ ) as a ceramic material, the thickness of the external electrode according to the material of the external electrode can be derived by the above method.

For example, when the external electrode includes nickel (Ni) which is 70% of the Young's Modulus of the cover part C, the thickness of the external electrode is the thickness of the cover part C as the reference. It should secure more than 80% of to prevent the deterioration of reliability caused by breakage and crack in process.

On the other hand, when the external electrode includes copper (Cu) 50% of the Young's Modulus of the cover portion (C), the thickness of the external electrode is 96 of the thickness of the cover portion (C) as the reference It is necessary to secure more than% to prevent reliability deterioration due to breakage and cracking during the process.

In addition, when the external electrode includes tin (Sn) which is 20% of the Young's Modulus of the cover part C, the thickness of the external electrode is 130 of the thickness of the cover part C as the reference. It is necessary to secure more than% to prevent reliability deterioration due to breakage and cracking during the process.

Meanwhile, as described above, the first and second external electrodes 131 and 132 are disposed on the first electrode layers 131a and 132a including the first conductive metal and the first electrode layers 131a and 132a. The plating layers 131b and 132b including the second conductive metal may be included.

The thicknesses of the first and second external electrodes 131 and 132 may include the first electrode layers 131a and 132a determined according to Young's Modulus of the first conductive metal and Young's Modulus of the second conductive metal. The sum of the thicknesses of the plating layers 131b and 132b (t ₁ and t ₂ ).

In this case, when the first conductive metal and the second conductive metal are the same metal, the thicknesses of the first and second external electrodes 131 and 132 may be determined by the calculation.

For example, when the thickness t _c of the cover part C is 10 μm and the first conductive metal and the second conductive metal are nickel (Ni), the thicknesses of the first electrode layers 131a and 132a ( t ₁ ) is 3 μm, and the thickness (t ₂ ) of the plating layers 131b and 132b is 5 μm, so that the thickness (sum of t ₁ and t ₂ ) of the first and second external electrodes 131 and 132 is equal to 5 μm. The thickness of the cover part C is 80 μm or more relative to the thickness t _c .

Meanwhile, the first conductive metal and the second conductive metal may be different metals. In this case, the thickness of each layer of the external electrode including each metal occupies the thickness of the entire external electrode and the Young's modulus of each metal ( The thickness of the first and second external electrodes 131 and 132 may be determined by combining the ratio of the Young's Modulus to the Young's Modulus of the cover part C.

For example, the thickness of the cover part C is 10 μm, the first conductive metal is nickel (Ni), and the thickness t ₁ of the first electrode layers 131a and 132a is 3 μm, and the second conductivity is The metal is copper (Cu), and the thickness t ₂ of the plating layers 131b and 132b is 6 μm, so that the thickness t ₁ and t ₂ of the first and second external electrodes 131 and 132 is equal to 6 μm. It should be at least 9 μm, which is at least 90% of the thickness t _c of the cover part C.

In summary, the thicknesses of the first and second external electrodes 131 and 132 may be 80% or more of the thickness of the cover part C.

On the other hand, when the Young's Modulus of the first conductive metal and the second conductive metal is 70% or more than the Young's Modulus of the ceramic included in the cover part C, the first and second external electrodes 131 , 132), the thickness (the sum of t _1, t ₂₎ of may be more than 80% of the thickness (t _c) of the cover portion (c).

When the Young's Modulus of the first conductive metal and the second conductive metal is 50% or more and less than 70% of the Young's Modulus of the ceramic included in the cover part C, the first and second external electrodes ( The thickness (sum of t ₁ , t ₂ ) of the 131 and 132 may be 96% or more of the thickness t _c of the cover part C.

When the Young's Modulus of the first conductive metal and the second conductive metal is 20% or more and less than 50% of the Young's Modulus of the ceramic included in the cover part C, the first and second external electrodes ( The thickness (sum of t ₁ , t ₂ ) of the 131 and 132 may be 130% or more of the thickness t _c of the cover part C.

Referring to FIG. 4, the thickness t _c of the cover part C may satisfy 1/40 or less of the length L of the multilayer ceramic electronic component, and may be less than the thickness T of the multilayer ceramic electronic component. 1/5 or less can be satisfied.

When the thickness t _c of the cover part C satisfies 1/40 or less than the length L of the multilayer ceramic electronic component or 1/5 or less of the thickness T of the multilayer ceramic electronic component, breaking strength May be drastically lowered, thereby lowering reliability due to breakage and cracking during the process.

However, according to the first embodiment of the present invention, the ratio of the thickness of the external electrode and the thickness of the cover part according to the difference of the Young's Modulus of the conductive metal included in the external electrode and the ceramic material included in the cover part in the ceramic body. The thickness t _c of the cover part C is 1/40 or less than the length L of the multilayer ceramic electronic component and 1/5 or less than the thickness T of the multilayer ceramic electronic component. Even if satisfactory, the breakdown strength can be increased to prevent degradation of reliability due to breakage and cracking during the process.

5 is a cross-sectional view taken along the line II ′ of FIG. 1, according to a second embodiment of the invention.

As described above, the plating layer may have a two-layer structure, and thus the plating layer may include first plating layers 131b and 132b and second plating layers 131c and 132c, respectively.

Referring to FIG. 5, in the multilayer ceramic capacitor according to the second embodiment of the present invention, the first and second external electrodes 131 and 132 are disposed on the first electrode layers 131a and 132a, and 2 may include a plating layer including a conductive metal, and the plating layer may include first plating layers 131b and 132b and second plating layers 131c and 132c.

The second conductive metal is not particularly limited, but may be, for example, at least one selected from the group consisting of copper (Cu), nickel (Ni), tin (Sn), and alloys thereof.

The first conductive metal and the second conductive metal may be the same metal or may be different metals.

For example, the first conductive metal included in the first electrode layers 131a and 132a is nickel (Ni), and the second conductive metal included in the first plating layers 131b and 132b is nickel (Ni). The second plating layers 131c and 132c may include tin (Sn).

In this case, the cover portion (C) Thickness (t _c) compared to the first and second external electrodes 131 and 132. The thickness (the sum of t _1, t ₂ and t ₃₎ ratio of the cover portion (C in It is proportional to three square roots of the ratio of Young's Modulus of the first and second external electrodes 131 and 132 to Young's Modulus.

As described above, the first conductive metal and the second conductive metal may be different metals, and in this case, the thickness of each layer of the external electrode including each metal and the fraction of the total thickness of the external electrode and The thickness of the first and second external electrodes 131 and 132 may be determined by combining a ratio of the Young's Modulus to the Young's Modulus of the cover part C.

For example, the thickness of the cover part C is 10 μm, the first conductive metal is nickel (Ni), and the thickness t ₁ of the first electrode layers 131a and 132a is 3 μm, and the second conductivity is metal is a nickel (Ni), a first coating layer as a thickness (t ₂₎ is 4 μm and the second conductive metal tin (Sn) of (131b, 132b), the second coating layer thickness (131c, 132c) (t ₃ ) Is 10 μm where the thickness (sum of t ₁ , t ₂ and t ₃ ) of the first and second external electrodes 131, 132 is 100% or more than the thickness t _c of the cover part C, such as 2 μm. It should be more than μm.

Referring to FIG. 5, the thickness t _c of the cover part C may satisfy 1/40 or less than the length L ′ of the multilayer ceramic electronic component, and the thickness T ′ of the multilayer ceramic electronic component. ) To 1/5 or less.

FIG. 6 is a top plan view viewed from the direction B of FIG. 1.

Referring to FIG. 6, the area of the first and second external electrodes 131 and 132 disposed on the first surface S1 and the second surface S2 in the thickness direction of the ceramic body 110 may correspond to the ceramic body ( It may occupy at least 50% of the area of each of the first and second surfaces S1 and S2 of 110.

A multilayer ceramic electronic component according to another embodiment of the present invention includes a dielectric layer 111 and internal electrodes 121 and 122 disposed to face each other with the dielectric layer 111 interposed therebetween, and face each other. The second surface is connected to the first surface and the second surface, and is connected to the third surface, the fourth surface and the first to the fourth surface facing each other, the fifth surface and the sixth surface facing each other. The ceramic body 110 and the outer body disposed on the outside of the ceramic body 110, including the external electrodes (131, 132) electrically connected to the internal electrodes (121, 122), the ceramic body 110 Is formed on the upper and lower portions of the active portion (A) and the active portion (A) having a capacitance including the internal electrodes 121 and 122 disposed to face each other with the dielectric layer 111 therebetween, the ceramic It includes a cover portion (C) including, wherein the external electrodes (131, 132) of the ceramic body (110) It is disposed on the side, the first electrode layer (131a, 132a) containing a first conductive metal and disposed on the first electrode layer (131a, 132a), and includes a plating layer (131b, 132b) containing a second conductive metal The thicknesses of the external electrodes 131 and 132 are the first electrode layers 131a and 132a and the plating layer 131b determined according to the Young's Modulus of the first conductive metal and the Young's Modulus of the second conductive metal. , 132b is the sum of the thicknesses, and the ratio of the thicknesses of the external electrodes 131 and 132 to the thickness t _c of the cover part C is the Young's Modulus of the ceramic included in the cover part C. ) Is proportional to the ratio of Young's Modulus of the first conductive metal and the second conductive metal.

In the description of the multilayer ceramic electronic component according to another embodiment of the present invention, the same parts as the description of the multilayer ceramic electronic component according to the embodiment of the present invention described above will be omitted herein in order to avoid redundant description.

According to another embodiment of the present invention, as described above, the thickness of the external electrode and the thickness of the cover part may vary depending on the difference in Young's Modulus of the conductive metal included in the external electrode and the ceramic material included in the cover part in the ceramic body. By controlling the ratio, it is possible to increase the breaking strength of the thin-walled multilayer ceramic capacitor, thereby preventing a decrease in reliability due to breakage and cracking during the process.

Hereinafter, a method of manufacturing a multilayer ceramic electronic component according to an exemplary embodiment of the present invention will be described, but is not limited thereto.

In the method of manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention, a plurality of ceramic green sheets are first coated and dried by applying a slurry formed of a powder such as barium titanate (BaTiO ₃ ) onto a carrier film. It is possible to form a dielectric layer.

The ceramic green sheet may be prepared by mixing a ceramic powder, a binder, and a solvent to prepare a slurry, and the slurry may be manufactured in a sheet form having a thickness of several μm by a doctor blade method.

Next, the nickel particle average size is 0.1-0.2 micrometer, and the electrically conductive paste for internal electrodes containing 40-50 weight part nickel powder can be provided.

The conductive paste for the internal electrode was coated on the green sheet by a screen printing method to form the internal electrode, and then the green sheet on which the internal electrode pattern was disposed was laminated to form the ceramic body 110.

Next, a first electrode layer including a first conductive metal and glass may be formed outside the ceramic body.

The first conductive metal is not particularly limited, but may be, for example, at least one selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

The glass is not particularly limited, and a material having the same composition as that of the glass used for fabricating an external electrode of a general multilayer ceramic capacitor may be used.

The first electrode layer may be formed on upper and lower surfaces and end portions of the ceramic body, and may be electrically connected to the first and second internal electrodes, respectively.

The first electrode layer may include 5% by volume or more of glass relative to the first conductive metal.

Next, a plating layer including a second conductive metal may be formed on the first electrode layer.

The second conductive metal is not particularly limited, but may be, for example, at least one selected from the group consisting of copper (Cu), nickel (Ni), tin (Sn), and alloys thereof.

According to an embodiment of the present invention, the ratio of the thickness of the external electrode and the thickness of the cover part is adjusted according to the difference of the Young's Modulus of the conductive metal included in the external electrode and the ceramic material included in the cover part in the ceramic body. .

That is, the ratio of the Young's Modulus of the external electrode to the Young's Modulus of the cover part according to the difference of the Young's Modulus of the conductive metal included in the external electrode and the ceramic material included in the cover part in the ceramic body. The thickness of the external electrode may be determined to be proportional to the square root of 3.

Hereinafter, in Table 1, external electrodes having various thicknesses were disposed outside the ceramic body according to the type of conductive metal included in the external electrodes, and the occurrence frequency of cracks according to the thickness of the cover part was measured.

Sample Thickness of cover part [㎛] Thickness of Nickel (Ni) External Electrode
[Μm] Copper (Cu) External Electrode Thickness
[Μm] Thickness of Tin (Sn) External Electrode
[Μm] % Of cracks *One 10 3.5 0 0 80 *2 10 5.4 0 0 50 3 10 8.1 0 0 0 4 10 10.2 0 0 0 * 5 10 0 3.4 0 90 * 6 10 0 5.2 0 70 * 7 10 0 6.9 0 50 8 10 0 9.6 0 0 9 10 0 12.4 0 0 * 10 10 0 0 5.6 80 * 11 10 0 0 8.4 65 12 10 0 0 13.7 0 13 10 0 0 18.2 0 * 14 8 2.8 0 0 90 * 15 8 4.6 0 0 60 16 8 6.5 0 0 0 17 8 9.1 0 0 0 * 18 8 0 3.2 0 85 * 19 8 0 5.4 0 60 20 8 0 7.5 0 0 21 8 0 10.3 0 0 * 22 8 0 0 4.5 90 * 23 8 0 0 10.1 55 24 8 0 0 12.6 0 25 8 0 0 15.5 0 * 26 8 1.2 0 7.1 60 * 27 8 2.3 0 6.4 15 * 28 8 3.5 0 3.9 35 29 8 3.2 0 5.7 0 30 8 4.4 0 3.6 0

*: Comparative Example

As shown in FIG. 4, the data of Table 1 is a scanning electron microscope of a cross section cut in the longitudinal direction L and the thickness direction T at the center of the width direction W of the ceramic body 110 of the multilayer ceramic capacitor 100. Each dimension was measured based on a photograph taken with SEM (Scanning Electron Microscope). Here, the thickness of the external electrode was measured by the sum of the thicknesses of the first electrode layer and the plating layer (t ₁ , t ₂ ). In order to measure the frequency of crack occurrence, 200 samples per sample were identified respectively.

In Table 1, samples 1 to 2 have a thickness of the cover portion C of 10 μm and the thickness of the first or second external electrodes 131 and 132 including nickel (Ni) thereof is 80% of the thickness of the cover portion. As a comparative example of less than%, it can be seen that the frequency of crack occurrence is high.

 On the other hand, Samples 3 to 4 have a thickness of 10 μm of the cover portion C and a thickness of the first or second external electrodes 131 and 132 including nickel (Ni) thereof is 80% or more relative to the thickness of the cover portion. As an embodiment of the invention, it can be seen that no cracking is excellent in reliability.

In addition, samples 5 to 7 have a thickness of the cover portion C of 10 μm and the thickness of the first or second external electrodes 131 and 132 including copper Cu is less than 90% of the thickness of the cover portion. As an example, it can be seen that the crack occurrence frequency is high.

 On the other hand, the samples 8 to 9 have a thickness of 10 μm of the cover portion C, and the thickness of the first or second external electrodes 131 and 132 including copper (Cu) is 90% or more of the thickness of the cover portion. As an embodiment of the invention, it can be seen that no cracking is excellent in reliability.

On the other hand, the samples 10 to 11 have a thickness of 10 μm of the cover portion C and a comparison of the thickness of the first or second external electrodes 131 and 132 including tin Sn therewith is less than 130% of the thickness of the cover portion. As an example, it can be seen that the crack occurrence frequency is high.

 On the other hand, the samples 12 to 13 have a thickness of 10 μm of the cover portion C and the thickness of the first or second external electrodes 131 and 132 including tin Sn therein is 130% or more of the thickness of the cover portion. As an embodiment of the invention, it can be seen that no cracking is excellent in reliability.

In addition, the samples 14 to 15 have a thickness of the cover portion C of 8 μm and the thickness of the first or second external electrodes 131 and 132 including nickel (Ni) is less than 80% of the thickness of the cover portion. As an example, it can be seen that the crack occurrence frequency is high.

 On the other hand, in the samples 16 to 17, the cover part C had a thickness of 8 μm and the first or second external electrodes 131 and 132 including nickel (Ni) had a thickness of 80% or more relative to the cover part thickness. As an embodiment of the invention, it can be seen that no cracking is excellent in reliability.

In addition, samples 18 to 19 have a thickness of the cover part C of 8 μm and the thickness of the first or second external electrodes 131 and 132 including copper Cu is less than 90% of the cover part thickness. As an example, it can be seen that the crack occurrence frequency is high.

 On the other hand, the samples 20 to 21 have the thickness of the cover part C being 8 μm and the thickness of the first or second external electrodes 131 and 132 including copper (Cu) is 90% or more relative to the cover part thickness. As an embodiment of the invention, it can be seen that no cracking is excellent in reliability.

In addition, the samples 22 to 23 have a thickness of the cover part C of 8 μm and the thickness of the first or second external electrodes 131 and 132 including tin Sn is less than 130% of the cover part thickness. As an example, it can be seen that the crack occurrence frequency is high.

 On the other hand, the samples 24 to 25 have the thickness of the cover part C being 8 μm and the thickness of the first or second external electrodes 131 and 132 including tin Sn is 130% or more relative to the cover part thickness. As an embodiment of the invention, it can be seen that no cracking is excellent in reliability.

On the other hand, samples 26 to 30 are cases where the first conductive metal is nickel (Ni), the second conductive metal is tin (Sn), and the first conductive metal and the second conductive metal are different metals, in which case each metal The thickness of each of the layers of the external electrode, including the fraction of the total thickness of the external electrode, and the ratio of the Young's Modulus of each metal to the Young's Modulus of the cover part C is necessary. The thicknesses of the first and second external electrodes 131 and 132 may be determined.

Samples 26 to 28 have a thickness of 8 μm of the cover portion C, and the thickness of the first or second external electrodes 131 and 132 including nickel (Ni) and tin (Sn) is a ratio of the thickness of the cover portion (C). As a comparative example outside the numerical range of the present invention, it can be seen that the occurrence frequency of cracks is high.

 On the other hand, samples 29 to 30 have a thickness of the cover part C of 8 μm, and the thickness of the first or second external electrodes 131 and 132 including nickel (Ni) and tin (Sn) is the thickness of the cover part. As an embodiment of the present invention, the ratio is in the numerical range of the present invention, it can be seen that no cracking is excellent in reliability.

It is intended that the invention not be limited by the foregoing embodiments and the accompanying drawings, but rather by the claims appended hereto. Accordingly, various forms of substitution, modification, and alteration may be made by those skilled in the art without departing from the technical spirit of the present invention described in the claims, which are also within the scope of the present invention. something to do.

110: ceramic body
111: dielectric layers 121 and 122: first and second internal electrodes
131 and 132: first and second external electrodes
131a and 132a: first electrode layer 131b, 132b, 131c and 132c: plating layer

Claims (27)

A first internal electrode and a second internal electrode disposed to face each other with a dielectric layer and the dielectric layer interposed therebetween, and connected to first, second, and first and second surfaces facing each other. A ceramic body having a third surface, a fourth surface facing each other, and a fifth surface and a sixth surface facing each other and connected to the first to fourth surfaces; And
A second external electrode disposed outside the ceramic body and electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode.
The ceramic body includes an active part including a first internal electrode and a second internal electrode disposed to face each other with the dielectric layer interposed therebetween, and a cover part formed on upper and lower portions of the active part.
The thickness ratio of the thickness of the first and second external electrodes to the thickness of the cover part is a multilayer ceramic proportional to the square root of the ratio of the Young's Modulus of the first and second external electrodes to the Young's Modulus of the cover part. Electronic parts.
The method of claim 1,
The first and second external electrodes may be disposed on the outside of the ceramic body, and include a first electrode layer including a first conductive metal and a plating layer disposed on the first electrode layer and including a second conductive metal. Ceramic electronic components.
The method of claim 2,
The first conductive metal is at least one selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni) and alloys thereof.
The method of claim 2,
The second conductive metal is at least one selected from the group consisting of copper (Cu), nickel (Ni), tin (Sn) and alloys thereof.
The method of claim 2,
The plating layer is a multilayer ceramic electronic component disposed in at least two layers.
The method of claim 1,
The multilayer ceramic electronic component has a thickness of 100 μm or less.
The method of claim 1,
The thickness of the cover portion is a multilayer ceramic electronic component that satisfies 1/40 or less than the length of the multilayer ceramic electronic component.
The method of claim 1,
The thickness of the cover portion is a multilayer ceramic electronic component that satisfies 1/5 or less than the thickness of the multilayer ceramic electronic component.
The method of claim 1,
The length of the ceramic body is a distance between the third and fourth surfaces, the width of the ceramic body is a distance between the fifth and sixth surfaces, and the first internal electrode and the second internal electrode are the The multilayer ceramic electronic component alternately exposed to the fifth and sixth surfaces.
The method of claim 1,
The first external electrode and the second external electrode are disposed on the fifth and sixth surfaces of the ceramic body, respectively, and extend to the first and second surfaces, respectively, and the first and second surfaces of the ceramic body. The area of the first external electrode and the second external electrode disposed in the multilayer ceramic electronic component occupies more than 50% of the area of each of the first and second surfaces of the ceramic body.
The method of claim 1,
The cover part is a multilayer ceramic electronic component comprising a barium titanate (BaTiO ₃ ) -based ceramic material.
A dielectric layer and internal electrodes disposed to face each other with the dielectric layer interposed therebetween, and having a first surface, a second surface, and a first surface and a second surface facing each other, facing each other. A ceramic body connected to four surfaces and the first to fourth surfaces and having fifth and sixth surfaces facing each other; And
An outer electrode disposed outside the ceramic body and electrically connected to the inner electrode;
The ceramic body includes an active part having a capacitance formed therein including internal electrodes disposed to face each other with the dielectric layer interposed therebetween, and a cover part formed on upper and lower parts of the active part, the ceramic part comprising:
The external electrode is disposed outside the ceramic body and includes a first electrode layer including a first conductive metal and a plating layer disposed on the first electrode layer and including a second conductive metal.
The thickness of the external electrode is the sum of the thickness of the first electrode layer and the plating layer determined according to the Young's Modulus of the first conductive metal and the Young's Modulus of the second conductive metal,
The ratio of the thickness of the external electrode to the thickness of the cover part is a multilayer ceramic electron proportional to the ratio of the Young's Modulus of the first conductive metal and the second conductive metal to the Young's Modulus of the ceramic included in the cover part. part.
The method of claim 12,
The thickness of the external electrode is a multilayer ceramic electronic component of more than 80% of the thickness of the cover portion.
The method of claim 12,
When the Young's Modulus of the first conductive metal and the second conductive metal is 70% or more of the Young's Modulus of the ceramic included in the cover part, the thickness of the external electrode is 80% or more of the thickness of the cover part. Electronic parts.
The method of claim 12,
When the Young's Modulus of the first conductive metal and the second conductive metal is 50% or more and less than 70% of the Young's Modulus of the ceramic included in the cover part, the thickness of the external electrode is 96% of the thickness of the cover part. Laminated ceramic electronic component.
The method of claim 12,
When the Young's Modulus of the first conductive metal and the second conductive metal is 20% or more and less than 50% of the Young's Modulus of the ceramic included in the cover part, the thickness of the external electrode is 130% of the thickness of the cover part. Laminated ceramic electronic component.
The method of claim 12,
The multilayer ceramic electronic component has a thickness of 100 μm or less.
The method of claim 12,
The thickness of the cover portion is a multilayer ceramic electronic component that satisfies 1/40 or less than the length of the multilayer ceramic electronic component.
The method of claim 12,
The thickness of the cover portion is a multilayer ceramic electronic component that satisfies 1/5 or less than the thickness of the multilayer ceramic electronic component.
The method of claim 12,
The length of the ceramic body is a distance between the third and fourth surfaces, the width of the ceramic body is a distance between the fifth and sixth surfaces, and the first internal electrode and the second internal electrode are the The multilayer ceramic electronic component alternately exposed to the fifth and sixth surfaces.
The method of claim 12,
The first external electrode and the second external electrode are disposed on the fifth and sixth surfaces of the ceramic body, respectively, and extend to the first and second surfaces, respectively, and the first and second surfaces of the ceramic body. The area of the first external electrode and the second external electrode disposed in the multilayer ceramic electronic component occupies more than 50% of the area of each of the first and second surfaces of the ceramic body.
The method of claim 12,
The cover part is a multilayer ceramic electronic component comprising a barium titanate (BaTiO ₃ ) -based ceramic material.
The method of claim 12,
The first conductive metal is at least one selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni) and alloys thereof.
The method of claim 12,
The second conductive metal is at least one selected from the group consisting of copper (Cu), nickel (Ni), tin (Sn) and alloys thereof.
The method of claim 12,
The plating layer is a multilayer ceramic electronic component disposed in at least two layers.
A dielectric layer and internal electrodes disposed to face each other with the dielectric layer interposed therebetween, and having a first surface, a second surface, and a first surface and a second surface facing each other, facing each other. A ceramic body connected to four surfaces and the first to fourth surfaces and having fifth and sixth surfaces facing each other; And
An outer electrode disposed outside the ceramic body and electrically connected to the inner electrode;
The ceramic body includes an active part having a capacitance formed therein including internal electrodes disposed to face each other with the dielectric layer interposed therebetween, and a cover part formed on upper and lower parts of the active part, the ceramic part comprising:
The cover portion has a thickness of 8 μm to 10 μm,
The external electrode includes nickel (Ni), and the thickness of the external electrode is a multilayer ceramic electronic component 10.2 μm or less.
A dielectric layer and internal electrodes disposed to face each other with the dielectric layer interposed therebetween, and having a first surface, a second surface, and a first surface and a second surface facing each other, facing each other. A ceramic body connected to four surfaces and the first to fourth surfaces and having fifth and sixth surfaces facing each other; And
An outer electrode disposed outside the ceramic body and electrically connected to the inner electrode;
The ceramic body includes an active part having a capacitance formed therein including internal electrodes disposed to face each other with the dielectric layer interposed therebetween, and a cover part formed on upper and lower parts of the active part, the ceramic part comprising:
The cover portion has a thickness of 8 μm to 10 μm,
The external electrode may include copper (Cu), and the thickness of the external electrode is 12.4 μm or less.

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