KR20190096020A - Led module - Google Patents

Abstract

The present invention relates to an LED module which minimizes a loss of light even if a UV LED is used as a light source, and has an excellent illuminance uniformity factor. The LED module comprises: a light transmitting member having a first surface formed of flat surfaces which are surfaces except a groove of a reverse-cone shape, and a second surface generally formed of the flat surfaces; and an LED spaced apart from the second surface of the light transmitting member to be arranged in a center line passing an apex of the reverse-cone. The groove of the reverse-cone shape has a part of corresponding to a bottom surface of the reverse-cone which is located in the first surface of the light transmitting member and a part of corresponding to the apex of the reverse-cone which is located in an inner surface of the light transmitting member, and is formed to be dented in the first surface of the light transmitting member.

Description

LED module {LED MODULE}

The present invention relates to an LED module, and more particularly, to an LED module that improves illuminance evenly by diffusing light emitted from the LED.

In general, a light emitting diode (hereinafter referred to as "LED") is a device of a compound semiconductor that emits light using a p-n junction structure of a semiconductor, and is a form of a point light source.

Referring to FIG. 1 (a), the illuminance is the largest in the direction immediately above the LED 10, that is, in the direction in which the direction angle is 0, and the illuminance becomes smaller as the direction angle becomes larger. The reason is basically that the intensity distribution of the light emitted from the LED 10 depends on the direction angle. As shown in FIG. 1 (a), the emitted light is concentrated / emitted toward the center of the upper part of the LED 10 due to the feature of being bright in the middle but having a disadvantage of dark surroundings, thereby not revealing a wider area uniformly. There is this.

FIG. 1B is a diagram showing a configuration in which the diffusion lens 21 is provided on the LED 10. The diffusing lens 21 performs a function of diffusing light concentrated on the central axis in a direction far from the central axis to obtain uniform illuminance. Since the diffusion lens 21 must be manufactured to have a specific shape, the diffusion lens 21 is manufactured by injection molding of a resin such as polycarbonate (PC) or polymethyl methacrylate (PMMA). . However, the above-described diffusion lens 21 may be useful when the visible light LED is a point light source, but when UV LED is a point light source, UV transmittance is low and its effectiveness is low.

In general, when using a UV LED as a point light source, a quartz material with high UV transmittance is used. However, it is difficult to produce quartz in a complicated shape as in the diffusion lens of FIG. For this reason, when the UV LED is used as a light source, a flat plate-like quartz is generally used as shown in FIG.

As shown in FIG. 1C, when the flat plate-shaped light transmitting member 20 (eg, quartz) is installed on the top of the UV LED 10, the light emitted from the UV LED 10 is provided. Is refracted in the light transmitting member to pass through the light transmitting member 20. However, the light emitted from the UV LED 10 due to the light transmitting member 20 is more concentrated to the center. For this reason, when using the UV LED 10 as a light source as shown in Figure 2, although the light transmitting member of the quartz material is preferable in terms of the transmittance of UV, there is a problem that the roughness uniformity is not uniform.

The UV exposure machine or UV curing machine is an important factor that affects the exposure or curing quality of the light uniformity of the light emitted from the UV LED. Therefore, various optical sheets such as a diffusion sheet or a prism sheet have been generally used to diffuse the light emitted from the LED. For example, Korean Patent No. 10-1219323 discloses an exposure apparatus, and uses a diffusion sheet to diffuse an ultraviolet point light source emitted from a UV LED into a two-dimensional surface light source. The light emitted from the LED repeats reflection and dispersion inside the diffusion sheet and forms a constant illuminance on the entire surface in the process, but this causes a lot of light loss. This shortens the path of light and requires additional measures to increase the path of light.

As such, when using a conventional UV LED as a light source, the configuration of the diffusion sheet or prism sheet employed for the purpose of diffusing the point light source to the surface light source to improve the illuminance uniformity has a problem of causing light loss. There was a losing problem.

Registered Patent Publication No. 10-1219323

Accordingly, the present invention has been proposed to solve the problems of the prior art, and it is an object of the present invention to provide an LED module having excellent illuminance uniformity while minimizing the loss of light even when using a UV LED as a light source.

In order to achieve the object of the present invention, the LED module according to the present invention, the surface except the inverted cone-shaped grooves having a first surface consisting of a flat surface, and a second surface consisting of a totally flat surface Penetrating member; And an LED spaced apart from a second surface of the light transmitting member and disposed on a center line passing through a vertex of the inverted cone, wherein the inverted cone-shaped groove is a portion corresponding to a bottom surface of the inverted cone. Located on the first surface of the light transmitting member, it is characterized in that the portion corresponding to the vertex of the inverted cone is formed in the first surface of the light transmitting member so as to be located on the inner surface of the light transmitting member.

In addition, a plurality of the LED is installed, the inverted cone-shaped grooves are formed in a position corresponding to each of the plurality of LEDs, and the LED is disposed on each centerline passing through each vertex of the inverted-cone, respectively It features.

On the other hand, in order to achieve the object of the present invention, the LED module according to the present invention, the substrate portion having a vertical insulating portion for electrically insulating the conductive portion through the conductive portion and the conductive portion vertically; An LED mounted on the substrate; And a light transmitting member installed on an upper portion of the substrate and having a first surface composed of a flat surface and a second surface composed entirely of a flat surface, except for a groove having an inverted cone shape. The groove is shaped so that the portion corresponding to the bottom surface of the inverted cone is located on the first surface of the light transmitting member, and the portion corresponding to the vertex of the inverted cone is located on the inner surface of the light transmitting member. And a centerline formed in the first face of the member and passing through the centerline of the LED and the vertex of the inverted cone is located on the same vertical line with each other.

In addition, the vertical insulator is characterized in that the centerline of the LED and the centerline passing through the vertex of the cone are located on the same vertical line.

On the other hand, in order to achieve the object of the present invention, the LED module according to the present invention, the substrate portion having a vertical insulating portion for electrically insulating the conductive portion through the conductive portion and the conductive portion vertically; An LED mounted on the substrate; And an LED package installed at an upper portion of the substrate and configured of a material through which LED light is transmitted and composed of a first light transmitting member having a flat upper and lower surfaces. A printed circuit board on which the substrate unit is mounted; And a second light transmitting member installed on an upper portion of the LED package and having a first surface composed of a flat surface and a second surface composed entirely of a flat surface except for a groove having an inverted cone shape. The inverted cone-shaped groove has a portion corresponding to the bottom surface of the inverted cone located on the first surface of the light transmitting member, and a portion corresponding to the vertex of the inverted cone is located on the inner surface of the light transmitting member. It is formed so as to be dug on the first surface of the light transmitting member, and the centerline passing through the centerline of the LED and the vertex of the inverted cone is characterized in that located on the same vertical line with each other.

As described above, the LED module according to the present invention has excellent illuminance evenness while minimizing the loss of light even when using a UV LED as a light source.

1 (a) to 1 (c) show the intensity of light emitted from an LED as a function of the direction angle in accordance with the prior art;
FIG. 2 is a diagram showing illuminance obtained by the LED module of FIG.
3 is a perspective view showing a light transmitting member according to a preferred embodiment of the present invention.
4 shows the intensity of light emitted from an LED as a function of direction angle in accordance with a preferred embodiment of the present invention.
5 shows the illuminance obtained by the LED module of the preferred embodiment of the present invention.
6 is a cross-sectional view of the LED package is installed with a light transmitting member according to a preferred embodiment of the present invention.
7 is a cross-sectional view of a plurality of LEDs mounted on the LED package of FIG.
8 is a view showing that a light transmitting member according to a preferred embodiment of the present invention is installed on top of the LED package.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art may implement the principles of the invention and invent various devices included in the concept and scope of the invention, although not explicitly described or illustrated herein. In addition, all conditional terms and embodiments listed herein are in principle clearly intended to be understood only for the purpose of understanding the concept of the invention and are not to be limited to the specifically listed embodiments and states. .

The above objects, features, and advantages will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, and thus, it will be possible to easily implement the technical idea of self-invention having ordinary skill in the art. .

Embodiments described herein will be described with reference to cross-sectional and / or perspective views, which are ideal exemplary views of the invention. The thicknesses of the films and regions illustrated in these drawings are exaggerated for the effective explanation of the technical contents. Accordingly, shapes of the exemplary views may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in forms generated according to manufacturing processes. Accordingly, the regions illustrated in the figures have schematic attributes, and the shape of the regions illustrated in the figures is intended to illustrate a particular form of region of the device, and is not intended to limit the scope of the invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

 LED module according to a preferred embodiment of the present invention can be implemented including an IR LED, visible light LED, UV LED, in particular, even in the case of employing a UV LED as a light source to improve the illuminance evenness while minimizing the light loss of UV light The technical idea is to make it possible. Although the light transmitting member according to the preferred embodiment of the present invention can be employed in all light sources, such as IR LED, visible light LED, UV LED, the light transmitting member according to the preferred embodiment of the present invention employs a UV LED as a light source In this case, it should be noted that the light loss is more advantageous than the technology of diffusing the point light source of the conventional UV LED to the surface light source in that it can improve the illuminance uniformity while minimizing the loss of UV light.

LED module according to a preferred embodiment of the present invention includes a UV exposure machine, UV curing machine, UV sterilizer.

The LED module according to the preferred embodiment of the present invention has a light transmitting member 200 having a first surface consisting of a flat surface and a second surface consisting entirely of flat surfaces except for the inverted conical groove 250. And an LED 100 spaced from the second surface of the light transmitting member 200 and disposed on a centerline passing through the vertex 253 of the inverted cone.

The inverted cone-shaped groove 250 has a portion corresponding to the bottom surface 251 of the inverted cone located on the first surface of the light transmitting member 200 and a portion corresponding to the vertex 253 of the inverted cone. It is formed while being recessed in the first surface of the light transmitting member 200 to be located on the inner surface of the light transmitting member 200.

A plurality of LEDs 100 may be installed, in which case the inverted cone-shaped groove 250 is formed at a position corresponding to each of the plurality of LEDs 100, and each centerline passing through each vertex of the inverted cones. The LEDs 100 are disposed on the center lines of the LEDs 200, respectively.

In a preferred embodiment of the present invention, when the LED module employs a UV LED as a light source, the light transmitting member 200 is preferably made of quartz material having high UV transmittance.

3 is a perspective view showing a light transmitting member 200 according to a preferred embodiment of the present invention.

An inverted cone-shaped groove 250 is formed on the first surface, specifically, the upper surface of the light transmitting member 200. Here, the meaning of the inverted-conical groove 250 means that the groove is formed in a conical shape upside down. Since the groove has a reverse cone shape, the inside of the reverse cone is an area where the light transmitting member 200 does not exist, and the periphery of the reverse cone is an area where the light transmitting member 200 exists.

Referring to FIG. 3, a portion corresponding to the bottom surface 215 of the inverted cone is located corresponding to the first surface of the light transmitting member 200, and a portion corresponding to the vertex 253 of the inverted cone is a light transmitting member. It is configured to be located on the inner surface of the (200). The portion corresponding to the vertex 253 of the inverted cone is located between the first and second surfaces of the light transmitting member 200 so that the inverted cone-shaped groove 250 opens the light transmitting member 200. It does not penetrate up or down.

Inverted cone-shaped grooves 250 are not formed on the second surface, specifically, the lower surface of the light transmitting member 200. For this reason, the second surface of the light transmitting member 200 is composed of a flat surface as a whole.

The inverted cone-shaped groove 250 may be formed by processing the light transmitting member 200 to a predetermined depth on the first surface of the light transmitting member 200 using a processing tool. Alternatively, the etching apparatus may be formed by etching the light transmitting member 200 to a predetermined depth on the first surface of the light transmitting member 200 using an etching solution. Through this, it is possible to easily form the inverted cone-shaped groove 250 on one surface of the light transmitting member 200 while using the light transmitting member 200 having a flat plate shape.

The LED 200 is disposed to be spaced apart from the second surface of the light transmitting member 200, in detail. The inverted cone-shaped groove 250 is formed at a position corresponding to the LED 100 positioned below the light transmitting member 200, and is formed on the vertical center line CL passing through the vertex 253 of the inverted cone. The center line of the LED 200 is disposed in the. That is, the center line of the LED 100 and the center line passing through the vertex 253 of the inverted cone are located on the same vertical line with each other.

Referring to FIG. 4, the light emitted from the LED 100 is incident and refracted by the light transmitting member 200 and then reflected by the busbar surface 255 (see FIG. 3) of the inverted-conical groove 250. Here, the bus bar surface 255 (see FIG. 3) of the inverted-conical groove 250 serves to diffuse light emitted from the LED 100 to the periphery. In other words, the bus bar surface 255 of the inverted cone-shaped groove 250 serves to prevent the light emitted from the LED 100 from being concentrated / radiated above the center line CL of the LED 10. . Accordingly, unlike the illuminance distribution diagram shown in FIG. 2, the LED module according to the preferred embodiment of the present invention has a more uniform illuminance 300 uniformity as shown in FIG. 5.

6 and 7 illustrate an LED module in which the light transmitting member 200 is configured as a cover member of the LED package 1000.

Referring to FIG. 6, an LED module includes a substrate having a vertical insulator 500 that electrically insulates the conductive parts 410 and 430 by vertically penetrating the conductive parts 410 and 430 and the conductive parts 410 and 430. The unit 400, the LED 100 mounted on the substrate unit 400, and the light transmitting material unit 200 installed on the substrate unit 400 are included.

The substrate 400 has a vertical insulator 500 which electrically penetrates the first and second conductive parts 410 and 430 to vertically penetrate the first and second conductive parts 410 and 430. . The board unit 400 itself functions as a heat sink, and also functions to apply external power from the printed circuit board to the LED 100 through the conductive units 410 and 430 of the board unit 400.

Referring to FIG. 6, a vertical insulator 500 is formed between two first and second conductive parts 410 and 430. The vertical insulator 500 may be made of an insulating material. In addition, it may be implemented as an insulating film made of synthetic resin. In this case, the first and second conductive parts 410 and 430 and the vertical insulator 500 are bonded by using a liquid binder, and the like may be bonded in a state in which a bonding film made of a synthetic resin material is interposed therebetween. . On the other hand, anodizing treatment is performed on at least one surface of the first and second conductive parts 410 and 430 among the surfaces facing the vertical insulating part 500, and thus, is bonded to the vertical insulating part 500. Can be. That is, when the first and second conductive parts 410 and 430 are made of aluminum, the at least one surface may be included in the vertical insulation part 500 by anodizing at least one surface before the bonding revolution.

The mounting surface on which the LED 100 is mounted is provided on the upper surface of the substrate 400. Depending on the position of the electrode terminal of the LED 100, the LED 100 may be connected by wire bonding to the substrate 400, or may be bonded in the form of a flip chip. The structure illustrated in FIG. 6 is a structure in which the LED 100 is flip chip bonded to the substrate unit 400 with the conductive bumps 150 interposed therebetween. The conductive bumps 150 are provided on the first and second conductive parts 410 and 430, respectively, and the two terminals positioned below the LED 100 are electrically connected to the conductive bumps 150, respectively, and thus the substrate part 400 may be electrically connected to the conductive bumps 150. It is mounted on).

However, if the center line of the LED 100 can be arranged to coincide with the center line CL passing through the vertex 253 of the inverted cone (see FIG. 3), the LED 100 is mounted on the substrate 400. The method is not limited to flip chip bonding but may be configured to be connected by wire bonding as described above.

The centerline C.L and the centerline of the LED 100 passing through the vertices 253 (see FIG. 3) of the inverted-cone should be aligned in line with each other so that the achievement of the object of the present invention can be more effectively achieved. Therefore, when the LED 100 is bonded to the substrate portion 400 in the form of a flip chip, the vertical insulator 500 becomes an alignment (alignment) reference point, whereby the vertical line and the reverse line of the vertical insulator 500 are reversed. It is easy to match the centerlines CL across the vertices 253 of the cone (see FIG. 3) to one another. Accordingly, the object of the present invention can be more effectively achieved.

A concave cavity 600 is formed in the center of the substrate 400, and a reflective wall is inclined toward the side surface of the cavity 600. The reflective wall is formed by processing and removing a central portion of the substrate 400. As a result, the reflective wall is made of the same material as that of the first and second conductive parts 410 and 430. In addition, the reflective wall functions to condense the light emitted from the LED 100 within a specific range.

The light transmitting member 200 is provided on the substrate 400 to seal the cavity 600. The light transmitting member 200 is made of a material that can transmit light emitted from the LED, for example, may be made of a quartz material.

The upper surface of the light transmitting member 200 is formed with a groove 250 of the reverse-conical shape. The portion corresponding to the bottom surface 215 of the inverted cone is located corresponding to the first surface of the light transmitting member 200, and the portion corresponding to the vertex 253 of the inverted cone is located on the inner surface of the light transmitting member 200. Configured to be located. The portion corresponding to the vertex 253 of the inverted cone is located between the first and second surfaces of the light transmitting member 200 so that the inverted cone-shaped groove 250 opens the light transmitting member 200. It does not penetrate up or down. Inverted cone-shaped grooves 250 are not formed on the second surface, specifically, the lower surface of the light transmitting member 200. For this reason, the second surface of the light transmitting member 200 is composed of a flat surface as a whole.

The LED 100 is arranged such that the center line of the LED 100 coincides with the center line C.L passing through the inverted-cone vertex 253 (see FIG. 3) of the inverted-conical groove 250. This arrangement prevents the busbar surface 255 (see FIG. 3) of the inverted-conical groove 250 from concentrating / radiating light emitted from the LED 100 above the centerline CL of the LED 100. This will improve the roughness uniformity.

Meanwhile, since the LED 100 is connected to the first and second conductive parts 410 and 430 with the vertical insulator 500 interposed therebetween, the vertical insulator 500 passes through the vertex of the inverted cone. ) Is disposed on. The vertical insulation unit 500 not only serves as an alignment (alignment) reference point of the LED 100 mounting when mounting the LED 100, but also serves as an alignment (alignment) reference point of the light transmitting member 200. . This allows the centerline of the LED 100 to more accurately and easily match the centerline of the inverted-conical groove 250.

FIG. 7 is a diagram illustrating an embodiment in which a plurality of LEDs 100 are mounted on a substrate unit 400. The substrate part 400 includes first to fourth conductive parts 410, 430, 450, and 470, and a vertical insulating part 500 is disposed between the conductive parts. Each LED 100 is flip chip bonded to the substrate unit 400 with each vertical insulator 500 therebetween.

Each LED 100 is arranged such that its centerline coincides with the centerline C.L passing through the inverted-cone vertex of each inverted-conical shaped groove 250. This arrangement serves to prevent the busbar surface of the inverted cone-shaped groove 250 from concentrating / radiating light emitted from the LED 100 onto the center line CL of the LED 100. As a result, even when a plurality of LEDs 100 are employed, the overall illuminance is also improved.

FIG. 8 is a diagram illustrating an LED module in which a plurality of LED packages 1000 are mounted on a printed circuit board 2000, and a light transmitting member 200 is disposed on the LED package 1000. The printed circuit board 2000 functions to drive the LED while supporting the LED package 1000.

Referring to FIG. 8, the LED package 1000 may vertically penetrate the conductive portions 410 and 430 and the conductive portions 410 and 430 to electrically insulate the conductive portions 410 and 430. ) Is formed of a substrate portion 400 having a), a LED 100 mounted on the substrate portion 400 and an upper portion of the substrate portion 400 and a material through which the LED light is transmitted, and having a flat upper and lower surfaces. Unlike the structure shown in FIG. 7 in that the first light transmitting member 700 is configured, the configuration difference is that the first light transmitting member 700 is not formed with the inverted cone-shaped groove 250. have.

The second light transmitting member 200 is fixedly installed on the upper portion of the LED package 1000. The fixed installation method or structure herein is not limited thereto as long as it can fix the second light transmitting member 200 by appropriate means. The first surface of the second light transmitting member 200 has a flat surface except for the inverted conical groove 250. Since the second surface of the light transmissive member 200 is not formed with the inverted conical groove 250, the second surface of the light transmissive member 200 is composed of a flat surface as a whole.

Here, the inverted cone-shaped groove 250 is a portion corresponding to the bottom surface 251 (see FIG. 3) of the inverted cone is located on the first surface of the light transmitting member 200, the vertex 253 of the inverted cone 3 is formed to be recessed in the first surface of the light transmitting member 200 so as to be located on the inner surface of the light transmitting member 200, the vertex 253 of the center line and the inverted cone of the LED 100 (See FIG. 3), the centerlines are located on the same vertical line with each other.

The inverted cone-shaped groove 250 is not formed in the first light transmitting member 700 of the LED package 1000, but adopts a configuration formed only in the second light transmitting member 200, thereby the LED package 1000 As the light condensed in a predetermined range by the reflective wall of the light enters and exits the light transmitting member 200 provided with the inverted-conical groove 250, the illuminance uniformity of the condensed light is improved. Through this, the light emitted from the LED 100 can be focused and at the same time improve illuminance.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art various modifications of the present invention without departing from the spirit and scope of the invention described in the claims below. Or it may be modified.

100: LED 200: light transmitting member
250: inverted conical groove

Claims (5)

A surface excluding the inverted conical groove includes: a light transmitting member having a first surface composed of a flat surface and a second surface composed entirely of a flat surface; And
An LED disposed on a centerline spaced apart from the second surface of the light transmitting member and passing through a vertex of the inverted cone,
The inverted cone-shaped groove,
The first surface of the light transmissive member is positioned such that a portion corresponding to the bottom surface of the inverted cone is located on the first surface of the light transmitting member, and a portion corresponding to the vertex of the inverted cone is located on the inner surface of the light transmitting member. LED module, characterized in that formed in the recess.
The method of claim 1,
The LED is installed in plurality,
The inverted cone-shaped groove is formed at a position corresponding to each of the plurality of LEDs, LED module, characterized in that the LED is disposed on each centerline passing through each vertex of the inverted cone.
A substrate portion having a conductive portion and a vertical insulating portion that vertically penetrates the conductive portion to electrically insulate the conductive portion;
An LED mounted on the substrate; And
The surface of the substrate is installed on the upper surface of the substrate except for the inverted conical shape includes a light transmitting member having a first surface consisting of a flat surface, and a second surface consisting of a flat surface as a whole,
The inverted cone-shaped groove has a portion corresponding to the bottom surface of the inverted cone located on the first surface of the light transmitting member, and a portion corresponding to the vertex of the inverted cone is located on the inner surface of the light transmitting member. So as to be recessed in the first surface of the light transmitting member,
And a center line passing through the vertex of the inverted cone and the center line of the LED are located on the same vertical line with each other.
In the third,
The vertical insulation unit is a LED module, characterized in that the center line and the center line passing through the vertex of the cone is located on the same vertical line with each other.
A substrate portion having a conductive portion and a vertical insulating portion that vertically penetrates the conductive portion to electrically insulate the conductive portion; An LED mounted on the substrate; And an LED package installed at an upper portion of the substrate and configured of a material through which LED light is transmitted and composed of a first light transmitting member having a flat upper and lower surfaces.
A printed circuit board on which the substrate unit is mounted; And
Is installed on top of the LED package, the surface except the inverted conical groove includes a second light transmitting member having a first surface consisting of a flat surface, and a second surface consisting of a whole flat surface,
The inverted cone-shaped groove has a portion corresponding to the bottom surface of the inverted cone located on the first surface of the light transmitting member, and a portion corresponding to the vertex of the inverted cone is located on the inner surface of the light transmitting member. So as to be recessed in the first surface of the light transmitting member,
And a center line passing through the vertex of the inverted cone and the center line of the LED are located on the same vertical line with each other.

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