KR20190081460A - Organic light emitting display panel and fabricating method of the same - Google Patents

Abstract

The present invention relates to an organic light emitting display device comprising: an upper substrate and a lower substrate joined to face each other; a sensing layer disposed between the upper substrate and the lower substrate; a sacrificial layer disposed between the sensing layer and the lower substrate; an adhesive layer disposed between the sacrificial layer and the lower substrate; and a light emitting layer disposed between the adhesive layer and the lower substrate. Therefore, an objective of the present invention is to provide the organic light emitting display device having a structure in which the upper substrate can be efficiently removed even when an adhesive layer disposed between the lower substrate and the upper substrate overflows.

Description

Technical Field [0001] The present invention relates to an organic light emitting display panel and an organic light emitting display panel,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an organic light emitting display panel and a method of manufacturing the same, and more particularly, to an organic light emitting display panel having a touch electrode integrated therein.

The image display device that realizes various information on the screen is the core technology of the information communication age, and it is becoming thinner, lighter, portable, and higher performance. Accordingly, an organic light emitting display device for displaying an image by controlling the amount of light emitted from the organic light emitting layer is attracting attention as a display device capable of reducing weight and volume, which is a disadvantage of a cathode ray tube (CRT).

In an organic light emitting display, a plurality of pixels are arranged in a matrix form to display an image. Here, each pixel includes a light emitting element and a pixel driving circuit composed of a plurality of transistors that independently drive the light emitting element.

Since the organic light emitting display device uses a self-emission type organic light emitting device, a separate light source is not required. Therefore, since the organic light emitting display device can realize an ultra-thin display, research on a technology integrating the touch function into the organic light emitting display device has been actively conducted.

The touch organic light emitting display has a structure in which a lower substrate having an organic light emitting element and an upper substrate having a touch electrode array are bonded together by an adhesive layer.

For example, the organic light emitting element array formed on the inner surface of each of the lower substrate and the cover window and the touch electrode array may be bonded together by an adhesive layer. At this time, the touch electrode array can be formed on a separate upper substrate without being formed directly on the cover window, and then the upper substrate is removed by laser irradiation or etching for thinning and flexing, A cover window or protective substrate is attached.

On the other hand, in the process of removing the upper substrate, a part of the upper substrate is not completely removed due to the overflow of the adhesive layer disposed between the lower substrate and the upper substrate, resulting in a defect.

An object of the present invention is to provide an organic light emitting diode display having a structure in which an upper substrate can be efficiently removed even if an adhesive layer disposed between a lower substrate and an upper substrate is overflowed, and a manufacturing method thereof.

According to an aspect of the present invention, there is provided an organic light emitting diode display comprising an upper substrate and a lower substrate defined by a display region and a pad region on one side of the display region, a touch electrode disposed on the display region on the upper substrate, A disposing touch wiring, a sacrificial layer disposed on the touch electrode, a light emitting layer disposed in a display region on the lower substrate, and an adhesive layer disposed between the upper substrate and the lower substrate. Here, the sacrificial layer is in direct contact with the adhesive layer.

According to an embodiment of the present invention, a sacrificial layer is disposed on a pad region, thereby significantly reducing defects that may occur when the upper substrate is separated.

According to an embodiment of the present invention, a sacrificial layer is disposed on a pad region to prevent laser light from reaching the organic light emitting display panel, thereby causing a problem that the display wiring is lost. A reduction effect can be obtained.

1 is a plan view schematically showing a display device according to an embodiment of the present invention.
2 is a cross-sectional view taken along line II-II 'of the display device shown in FIG.
3 is a cross-sectional view taken along line II-II 'of the display device shown in FIG.
4 is a flowchart schematically showing a method of manufacturing a display device according to an embodiment of the present invention.
5A to 5J are cross-sectional views illustrating a manufacturing process of a display device according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. In the case where the word 'includes', 'having', 'done', etc. are used in this specification, other parts can be added unless '~ only' is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

In the case of a description of a temporal relationship, for example, if the temporal relationship is described by 'after', 'after', 'after', 'before', etc., May not be continuous unless they are not used.

The first, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other, partially or wholly, technically various interlocking and driving, and that the embodiments may be practiced independently of each other, It is possible.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view schematically showing an organic light emitting display according to an embodiment of the present invention, and FIGS. 2 and 3 are sectional views taken along a line II-II 'of the organic light emitting display shown in FIG.

Referring to FIGS. 1 to 3, the OLED display 10, 10 'according to an exemplary embodiment includes a display panel DIS and a touch panel TSP. Each of the organic light emitting display devices 10 and 10 'shown in FIGS. 2 and 3 represents an embodiment including the sensing layer 120 having a different structure. In this specification, a case where an organic light emitting display panel (DIS) is applied as a display device is described as an example, but the present invention is not limited thereto. For example, it may include all cases where a separate sensing layer 120 is attached by glue on top of the display panel DIS.

The display panel DIS is formed by stacking a lower substrate 260, a functional layer 220, a color filter layer 230, and an encapsulation layer 240 in this order. The functional layer 220 includes a plurality of thin film transistors for emitting an organic light emitting element. The color filter layer 230 includes organic light emitting elements that emit light of different colors, or a plurality of organic light emitting elements that emit light in a single color, and a color conversion layer that converts the organic light emitting elements into color. The encapsulation layer 240 is configured to encapsulate organic light-emitting devices vulnerable to moisture to minimize contact with the outside.

The display panel DIS includes a display area AA in which organic light emitting elements are arranged and light is emitted, and a pad area PA provided in at least one side of the display area AA. The display panel DIS also includes a display pad portion DP disposed in the pad region PA on the lower substrate 260 to transmit and receive data to the data lines in the display region AA, And a lower touch pad TP1 for supplying a touch signal to the touch electrodes 122 and 124 of the touch panel TSP. The display pad portion DP may be disposed on the functional layer 220 or the functional layer 220 may include the display pad portion DP.

Referring to FIG. 2, a touch panel (TSP) according to an embodiment of the present invention includes an upper substrate 250 and a sensing layer (or a touch layer) 120 formed on the upper substrate 250.

The sensing layer 120 includes a plurality of first touch electrodes (or first sensing electrodes 122) extending in parallel with each other along a first direction on the upper substrate 250, And a second touch electrode (or second sensing electrode) 124 extending in parallel to each other along the direction. The first touch electrode 122 and the second touch electrode 124 may be arranged to cross each other on a plane, but the present invention is not limited thereto.

A first insulating layer 121 is disposed between the upper substrate 250 and the first touch electrode 122 and a second insulating layer 121 is formed between the first touch electrode 122 and the second touch electrode 124 A second insulating layer 123 is disposed. A third insulating layer may be further disposed on the second touch electrode 124, and the third insulating layer may protect or isolate the second touch electrode 124 from the outside.

The sensing layer 120 includes an upper touch pad TP2. The upper touch pad TP2 may have a different position depending on the structure of the touch electrode. In the organic light emitting diode display 10 shown in FIG. 2, the upper substrate 250, the first insulating layer 121, And may be disposed on the upper surface of the insulating layer 122. When the upper touch pad TP2 is disposed on the upper surface of the first insulating layer 121, the second insulating layer 123 and the third insulating layer are designed not to overlap the upper touch pad TP2, When the second insulating layer TP2 is disposed on the upper surface of the second insulating layer 123, the third insulating layer may be designed not to overlap the upper touch pad TP2. Meanwhile, the first insulating layer 121, the second insulating layer 123, and the third insulating layer may not be formed in at least a part of the pad region PA.

The upper touch pad TP2 includes a plurality of touch pads and each touch pad is connected to the first touch electrode 122 and the second touch electrode 124 so that a touch signal is applied to the touch electrodes 122 and 124 .

A conductive contact ball CB is disposed in a region where the lower touch pad TP1 and the upper touch pad TP2 are overlapped with each other so that the upper touch pad TP2 is electrically connected to the lower touch pad TP1. A flexible circuit board FPC is attached to the lower touch pad TP1 exposed by the touch panel TSP and is connected to the lower touch pad TP1, the upper touch pad TP2, and the touch electrodes 122 and 124 A touch signal can be applied.

The sensing layer 120 includes a touch wiring (or sensing wiring) disposed on the pad area PA. The touch wiring is connected to the touch electrodes 122 and 124 and the upper touch pad TP2, respectively.

Referring to FIG. 3, a touch panel TSP according to another embodiment of the present invention includes an upper substrate 250 and a touch portion 120 'formed on the upper substrate 250.

The touch portion 120 'includes a first insulation layer 121' disposed on the upper substrate 250, a first touch electrode 122 'disposed on the first insulation layer 121' (124 '). One of the first touch electrode 122 'and the second touch electrode 124' is connected to the connection electrode (not shown) because the first touch electrode 122 'and the second touch electrode 124' 126, respectively. The touch unit 120 'shown in FIG. 3 shows a structure in which the first touch electrodes 122' are connected to each other through the connection electrode 126. Thus, the first touch electrode 122 'and the second touch electrode 124' connected by the connection electrode 126 can be arranged in a shape intersecting in a plane similar to the touch panel TSP shown in FIG. 2 However, the present invention is not limited thereto.

A second insulation layer 123 'is disposed between the connection electrode 126 and the second touch electrode 124' so that the first touch electrode 122 'and the second touch electrode 124' are electrically shorted . Referring to FIG. 3, the second insulation layer 123 'is formed between the first touch electrode 122' and the second touch electrode 124 ', as well as between the first touch electrode 122' and the second touch electrode 124 ' '). The third insulating layer 125 may be further disposed on the upper substrate 250. The third insulating layer 125 may include a first touch electrode 122 ', a second touch electrode 124' (126).

The touch portion 120 'includes an upper touch pad TP2. 3, a conductive material is formed in the contact hole and the contact hole in the pad region PA of the first insulation layer 121 ', and the conductive material exposed by the contact hole is electrically connected to the upper touch pad TP2. .

A flexible circuit board (FPC) is attached to the upper touch pad TP2 disposed between the upper substrate 250 and the first insulation layer 121 '. 3, a flexible circuit board for the touch panel TSP is disposed on the upper substrate 250, a flexible circuit board for the display panel DIS is formed on the lower substrate 260, A flexible circuit board is disposed. That is, in the organic light emitting diode display 10 'shown in FIG. 3, a flexible circuit board may be attached to both the upper substrate 250 and the lower substrate 260. 2, the flexible circuit board for the touch panel TSP and the flexible circuit board for the display panel DIS are disposed on the lower substrate 260 only.

The touch portion 120 'includes a touch wiring disposed on the pad region PA. The touch wiring is connected to the touch electrodes 122 'and 124' and the upper touch pad TP2, respectively.

Meanwhile, when the touch sensing method is a mutual capacitance type, the first touch electrodes 122 and 122 'may be used as sensing electrodes and the second touch electrodes 124 and 124' may be used as driving electrodes. In the case where the touch sensing method is a self capacitance type, the first touch electrodes 122 and 122 'and the second touch electrodes 124 and 124' are used as sensing electrodes, The connection electrodes 126 may be omitted and the touch electrodes may be arranged in island shapes independent of each other.

A sacrificial layer 130 is disposed on the touch portions 120 and 120 'shown in FIGS. The sacrificial layer 130 is formed on the entire surface of the touch units 120 and 120 'and may be formed on the sides of the touch units 120 and 120'. However, the sacrificial layer 130 is not disposed on the upper substrate 250 which is not overlapped with the touch portions 120 and 120 '. The sacrificial layer 130 will be described in detail with reference to FIGS. 4 and 5. FIG.

An adhesive layer 140 is disposed between the touch panel TSP and the display panel DIS shown in FIG. 2 and FIG. The adhesive layer 140 is made of a transparent material having adhesiveness and may be in a liquid state.

The upper substrate 250 is disposed on the organic light emitting display devices 10 and 10 'in which the display panel DIS and the touch panel TSP are bonded by the adhesive layer 140. [ The upper substrate 250 may be a polarizing film for preventing a decrease in contrast ratio due to reflection of external light or may be a tempered glass or a protective film for protecting from an external impact and the upper substrate 250 may be omitted It is possible.

Hereinafter, a method of manufacturing the organic light emitting display device 10, 10 'according to the embodiment of the present invention will be described.

FIG. 4 is a flowchart schematically illustrating a method of manufacturing an organic light emitting diode display according to an embodiment of the present invention. FIGS. 5A to 5J illustrate a manufacturing process of an OLED display according to an embodiment of the present invention Sectional view.

Referring to FIG. 4, a method of fabricating an OLED display 10, 10 'according to an exemplary embodiment of the present invention includes forming a first sacrificial layer 110 on a substrate S100, Forming a second sacrificial layer 130 in step S300, attaching the touch panel TSP and the organic light emitting display DIS in step S400, 100 (step S500).

5A is a result of forming the first sacrificial layer 110 on the upper substrate 100 (S100). The upper substrate 100 may be made of a transparent material, for example, glass. The upper substrate 100 may be divided into a display area AA and a pad area PA and the first sacrificial layer 110 may be divided into a display area AA and a pad area PA on the upper substrate 100 . Therefore, a separate mask is not required to form the first sacrificial layer 110, which can reduce the manufacturing cost.

The first sacrificial layer 110 is formed of hydrogenated amorphous silicon (a-Si: H) or hydrogenated amorphous silicon (a-Si: H; n + or a-Si: H; p +) doped with impurities. The hydrogen of the first sacrificial layer 110 is combined with the silicon of the upper substrate 100. When the laser is irradiated, the hydrogen of the first sacrificial layer 110 is disconnected from the silicon of the upper substrate 100, And the upper substrate 100 can be easily separated from each other. The upper substrate 100 and the first sacrificial layer 110 of the touch panel TSP may be removed in the process after the step S400 of attaching the touch panel TSP and the display panel DIS together The OLED display 10 of the final product may not include the upper substrate 100 and the first sacrificial layer 110.

Next, the sensing layer 120 is formed on the upper substrate 100. 5B and 5C are the result of forming the sensing layer 120 on the upper substrate 100 (S200). The sensing layer 120 includes a first touch electrode 122, 122 ', a second touch electrode 124, 124', a plurality of insulating layers 121, 123, 126, 121 ' 123 ', a touch wiring, and an upper touch pad TP2.

The metal material such as the touch electrodes 122, 124, 122 ', 124', the touch pad and the touch pad included in the sensing layer 120 may be a metal layer such as Al, AlNd, Mo, MoTi, Cu, , A transparent conductive layer such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or GZO (Gallium-doped Zinc Oxide), or may be formed of a single layer of a metal layer or a transparent conductive layer have. The first touch electrodes 122 and 122 'and the second touch electrodes 124 and 124' may be formed in a mesh shape.

FIG. 5B is a cross-sectional view taken along the line I-I 'of the touch panel TSP shown in FIG. 1, in which the upper touch pad TP2 is not disposed in the pad area PA, Sectional view taken along the line II-II 'of the panel TSP, the touch wiring and the upper touch pad TP2 are disposed in the pad area PA. The area corresponding to the display area AA of the sensing layer 120 is referred to as a touch electrode part 120a and the area corresponding to the pad area PA of the sensing layer 120 is referred to as a touch wiring part 120b .

5C is compared with FIG. 5A, it can be seen that the first sacrificial layer 110 is not present in a region where the sensing layer 120 and the upper substrate 100 are not overlapped. This is because the first sacrificial layer 110 is also etched in the process of etching the metal material to form the touch electrode part 120a. 5B and 5C, if there is no first sacrificial layer 110 in the pad area PA, the light irradiated in the step S500 of removing the upper substrate 100 is irradiated onto the display panel DIS A part of the metal layers (for example, a display wiring or the like) disposed on the pad area PA of the display panel DIS can be lost. More specifically, a buffer layer is disposed between the lower substrate 200 and the display wiring. If the sacrificial layer is not present on the pad region PA of the touch panel TSP, the step of removing the upper substrate 100 S500) may cause peeling of the buffer layer. As a result, a defective phenomenon that the display wiring is lifted or lost may occur. 5B, if the first sacrificial layer 110 disposed on the display area AA does not extend to the pad area PA, the first sacrificial layer 110 may be formed in the process of forming the touch interconnection part 120b, It can be inferred sufficiently that the substrate 110 is etched.

Next, a second sacrificial layer 130 is formed on the upper substrate 100. 5D and 5E are the result of forming the second sacrificial layer 130 (S300).

5D is a cross-sectional view taken along the line I-I 'of the touch panel TSP shown in FIG. 1, in which the second sacrificial layer 130 is formed in the pad region PA without the first sacrificial layer 110, 5 'is a cross-sectional view taken along a line II-II' of the touch panel TSP shown in FIG. 1, and both the first sacrificial layer 110 and the second sacrificial layer 130 are formed in the pad region PA. Particularly, the first sacrificial layer 110 is disposed under the touch wiring portion 120b and the second sacrificial layer 130 is disposed over the touch wiring portion 120b. That is, the second sacrificial layer 130 is formed on the entire surface of the upper substrate 100, and the second sacrificial layer 130 is formed on the side surface of the sensing layer 120.

A second sacrificial layer 130 is formed over the display area AA and the pad area PA on the upper substrate 100. [ Therefore, a separate mask is not required to form the second sacrificial layer 130, which can reduce the manufacturing cost.

The second sacrificial layer 130 is formed of hydrogenated amorphous silicon (a-Si: H) or hydrogenated amorphous silicon (a-Si: H; n + or a-Si: H; p +) doped with impurities. The hydrogen of the second sacrificial layer 130 is combined with the silicon of the upper substrate 100. When the laser is irradiated, the hydrogen of the second sacrificial layer 130 is disconnected from the silicon of the upper substrate 100, And the upper substrate 100 can be easily separated from each other.

As described above, the second sacrificial layer 130 is formed on the entire pad region PA of the upper substrate 100. Accordingly, it is minimized that the light irradiated in the step S500 of removing the upper substrate reaches the pad area PA of the display panel DIS. Accordingly, in the conventional structure, the pad area PA of the display panel DIS, The problem that the metal layer disposed on the substrate is lost is solved.

5F is a step of forming an adhesive layer 140 on the touch panel TSP and the display panel DIS in order to attach the touch panel TSP and the display panel DIS together. In the embodiment of FIG. 5F, the adhesive layer 140 is applied on the touch panel TSP, but is not limited thereto. For example, the adhesive layer 140 may be applied on the display panel DIS.

The adhesive layer 140 is disposed so as to completely cover the display area AA. When the adhesive layer 140 is applied so that the edge of the adhesive layer 140 is located inside the display area AA, the edge of the adhesive layer can be visible to the human eye, Can be largely applied. In addition, the adhesive layer 140 can be applied up to a part of the pad area PA. A part of the adhesive layer 140 may be applied to cover a part of the second sacrificial layer 130 on the pad area PA of the upper substrate 100. [

The display panel DIS includes a lower sacrificial layer 210 on the lower substrate 200, a functional layer 220 on the lower sacrificial layer 210, a color filter layer 230 on the functional layer 220, An encapsulation layer 240 is formed on the encapsulation layer 230. The lower substrate 200 and the lower sacrificial layer 210 of the display panel DIS can be removed in the process after the step S400 of attaching the touch panel TSP and the display panel DIS, The OLED display 10 may not include the lower substrate 200 and the lower sacrificial layer 210.

Then, the touch panel TSP and the organic light emitting display DIS are attached. The sectional view shown in FIG. 5G is the result of the step S400 of attaching the touch panel TSP and the organic light emitting display DIS.

The second sacrificial layer 130 of the touch panel TSP and the sealing layer 240 of the organic light emitting display DIS are disposed so as to face each other when the touch panel TSP and the organic light emitting display DIS are attached together And then cemented.

The adhesive layer 140 may flow over the outer region of the display area AA in the step S400 of attaching the touch panel TSP and the organic light emitting display DIS. 5G, which is a sectional view taken along the line I-I 'of the organic light emitting display (DIS) shown in FIG. 1, the adhesive layer 140 is formed on the pad area PA of the upper substrate 100 It can overflow. Although not shown, in the pad region PA of the cross-sectional view taken along the line II-II 'of the organic light emitting display DIS shown in FIG. 1, the adhesive layer 140 is formed on the touch wiring portion 120b, TP2, or the upper touch pad TP2. At this time, the amount of the overflowing adhesive layer 140 or the area overlapping the pad area PA may vary depending on the pressure applied at the time of adhering or the application range of the adhesive layer 140, and the like.

Then, the upper substrate 100 is removed from the organic light emitting display 10. The sectional view shown in FIG. 5H is a process of removing the upper substrate 100 (S500) and the result thereof.

When a specific light (for example, laser) is irradiated from the outside of the touch panel TSP toward the first sacrificial layer 110 and the second sacrificial layer 130, the first sacrificial layer 110 and the second sacrificial layer 130 The silicon bond between the layer 130 and the upper substrate 100 is broken so that the upper substrate 100 is separated from the organic light emitting display 10. The second sacrificial layer 130 formed on the pad region PA may be formed by a conventional method in which the adhesive layer 140 is partially adhered to the upper substrate 100 and the pad region PA to separate the upper substrate 100 . As the laser, a diode-pumped solid state (DPSS) laser or an eximer laser may be used.

5H, after the upper substrate 100 is separated from the organic light emitting display device 10, a portion of the second sacrificial layer 130 and the adhesive layer 140 may remain on the side surface of the touch electrode portion 120a have. The second sacrificial layer 130 and a portion of the overflowing adhesive layer 140 may remain on the side surface of the sensing layer 120, for example, the side surface of the touch wiring portion 120b. Through such a structural feature, it is possible to sufficiently deduce whether or not any organic light emitting display device has applied the manufacturing method of the present invention and the structure for achieving the object of the present invention.

Then, the upper substrate 250 is attached to the upper part of the organic light emitting diode display device 10. The upper substrate 250 may be a polarizing layer or a protective layer such as tempered glass, and the upper substrate 250 may be omitted.

FIG. 5I is a cross-sectional view taken along the line I-I 'of the organic light emitting diode display 10 shown in FIG. 1, in which an adhesive layer 140 and a second sacrificial layer 130 are formed in a part of the pad region PA. Lt; / RTI > FIG. 5J is a cross-sectional view taken along line II-II 'of the organic light emitting diode display 10 shown in FIG. 1, in which a touch wiring portion 120b and an upper touch pad TP2 are disposed in a pad region PA, And an adhesive layer 140 is formed in a part of the pad area PA. A part of the adhesive layer 140 is left between the touch wiring part 120b and the touch electrode part 120a on the pad area PA and the upper surface or the side surface of the touch electrode part 120a and the touch wiring part The second sacrificial layer 130 may remain on the upper surface or the side surface of the second sacrificial layer 120b.

Subsequently, a step of removing the lower substrate 200 from the display panel DIS and a step of attaching the lower substrate 260 to the display panel DIS may be further included. At this time, the lower substrate 260 is a material having a higher flexibility than the lower substrate 200, for example, a plastic material may be used.

The second sacrificial layer 130 is disposed on the sensing layer 120 and the pad region PA to form the upper substrate 100 and the upper substrate 100. [ It is possible to obtain the effect of significantly reducing the defects that may occur in the separation of the substrate.

According to the organic light emitting display 10 and the method of manufacturing the same according to the embodiment of the present invention, the second sacrificial layer 130 is disposed on the pad area PA, It is possible to obtain an effect that the defects in which the light can not reach and the display wiring is lost are remarkably reduced.

An organic light emitting display according to various embodiments of the present invention can be described as follows.

An organic light emitting display according to an embodiment of the present invention includes an upper substrate and a lower substrate which are adhered to each other facing each other, a sensing layer disposed between the upper substrate and the lower substrate, a sacrificial layer disposed between the sensing layer and the lower substrate, An adhesive layer disposed between the adhesive layer and the lower substrate, and a light emitting layer disposed between the adhesive layer and the lower substrate. Here, the sacrificial layer is disposed in contact with the adhesive layer.

The upper substrate and the lower substrate are defined as a display region corresponding to the light emitting layer and a pad region located at the outer periphery of the display region, and the sensing layer includes a plurality of And a plurality of sensing wirings disposed in the sensing electrode and pad regions.

In the organic light emitting diode display according to an embodiment of the present invention, the sacrifice layer overlaps with both the sensing electrode and the sensing wiring.

In the organic light emitting display according to an embodiment of the present invention, the sacrifice layer may cover the sides of the sensing electrode and the sensing wiring.

In the organic light emitting diode display according to the embodiment of the present invention, the adhesive layer covers at least a part of the entire display area and the pad area.

In the OLED display according to an embodiment of the present invention, the sensing wiring may be in contact with the upper substrate.

A method of manufacturing an organic light emitting display according to various embodiments of the present invention can be described as follows.

A method of fabricating an OLED display according to an embodiment of the present invention includes forming a first sacrificial layer on a first substrate, forming a first sacrificial layer sensing layer, forming a second sacrificial layer on the sensing layer And attaching the first substrate and the second substrate on which the light emitting layer is formed.

The method of manufacturing an organic light emitting diode display according to an embodiment of the present invention may further include removing a first substrate from an organic light emitting display, wherein, in the step of removing the first substrate, Removed together with the substrate.

In the method of manufacturing an organic light emitting display according to an embodiment of the present invention, the first sacrificial layer and the second sacrificial layer are formed on the entire surface of the first substrate.

In an exemplary embodiment of the present invention, the sensing layer includes a plurality of sensing electrodes and a plurality of sensing wires. In the sensing layer forming step, The first sacrificial layer is removed.

In the method of manufacturing an organic light emitting display according to an embodiment of the present invention, the first sacrificial layer and the second sacrificial layer are the same material.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

TSP: Touch panel DIS: Display panel
DP: Display pad part TP1, TP2: Touch pad
AA: display area PA: pad area
100: upper substrate 110: first sacrificial layer
120: sensing layer 130: second sacrificial layer
140: adhesive layer 200: lower substrate
210: lower sacrificial layer 220: functional layer
230: color filter layer 240: sealing layer
250: upper substrate 260: lower substrate

Claims (11)

An upper substrate and a lower substrate bonded together facing each other;
A sensing layer disposed between the upper substrate and the lower substrate;
A sacrificial layer disposed between the sensing layer and the lower substrate;
An adhesive layer disposed between the sacrificial layer and the lower substrate; And
And a light emitting layer disposed between the adhesive layer and the lower substrate,
Wherein the sacrificial layer is in contact with the adhesive layer. The method according to claim 1,
Wherein the upper substrate and the lower substrate are defined as a display region corresponding to the light emitting layer and a pad region located outside the display region,
Wherein the sensing layer includes a plurality of sensing electrodes disposed in the display region and a plurality of sensing wires arranged in the pad region. 3. The method of claim 2,
Wherein the sacrificial layer is overlapped with both the sensing electrode and the sensing wiring. The method of claim 3,
Wherein the sacrificial layer covers a side surface of the sensing electrode and the sensing wiring. 5. The method of claim 4,
Wherein the adhesive layer covers at least a part of the entire display area and the pad area. The method of claim 3,
Wherein the sensing wiring is in contact with the upper substrate. Forming a first sacrificial layer on the first substrate;
Forming a sensing layer on the first sacrificial layer;
Forming a second sacrificial layer on the sensing layer;
And attaching the first substrate and the second substrate on which the light emitting layer is formed. 8. The method of claim 7,
Further comprising the step of removing the first substrate from the display device,
Wherein the first sacrificial layer is removed together with the first substrate in the step of removing the first substrate. 8. The method of claim 7,
Wherein the first sacrificial layer and the second sacrificial layer are formed on the entire surface of the first substrate. 8. The method of claim 7,
Wherein the sensing layer includes a plurality of sensing electrodes and a plurality of sensing wires,
Wherein the first sacrificial layer superimposed on the sensing electrode and the sensing wiring is removed in the forming of the sensing layer. 8. The method of claim 7,
Wherein the first sacrificial layer and the second sacrificial layer are the same material.

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