KR20190068302A - Electroless plating method using light sintering - Google Patents

Abstract

An embodiment of the present invention provides an electroless plating method using light sintering and, more specifically, to an electroless plating method, comprising the following steps of: immersing a metal-oxide precursor in a material to be plated by putting the material to be plated in a solution including the metal-oxide precursor; fixating a metal oxide into the material to be plated by light-sintering the material to be plated in which the metal-oxide precursor is immersed; forming a catalyst coating layer by coating the material to be plated in which the metal oxide is fixated with a catalyst; and forming a metal plating layer by performing electroless plating on the catalyst coating layer.

Description

[0001] Electroless plating method using light sintering [

The present invention relates to an electroless plating pretreatment method using photo-sintering, and more particularly, to a method of pretreating an electroless plating using photo-sintering, And a technique for plating the hard material and providing an advantage of improving the adhesion of the plated film.

Surface treatment of various parts such as PCB, semiconductor wiring, electronic parts, automobile parts, plating for metallization of nonconductive metal is studied and widely used.

Therefore, in order to carry out electroless plating that can be plated on an insulator plastic or ceramic material, catalytic treatment of the surface of the base material is indispensable for initiating the oxidation reaction of the reducing agent. Conventional catalyzed method is using a two-phase method for depositing the Pd nucleus was adsorbed the method step of removing Sn ²⁺ and Sn ²⁺ adsorbed Sn-Pd colloid type catalysts, both methods It is necessary to etch the surface of the material in order to uniformly adsorb the catalyst and improve the adhesion of the plated film. However, a polymer material having excellent chemical resistance, such as silicone rubber, is not etched by acid, and plating is difficult.

Korean Patent Registration No. 10-1623664

SUMMARY OF THE INVENTION The present invention provides an electroless plating pretreatment method using photo-sintering.

More specifically, it is intended to provide a method of surface-treating a material which is difficult to etch by using a light sintering method and forming a catalyst coating layer and electroless plating on the catalyst coating layer.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. There will be.

According to an aspect of the present invention, there is provided an electroless plating method. The electroless plating method includes the steps of: placing a plated body in a solvent containing a metal oxide precursor to impregnate the metal oxide precursor to the plated body; photo-sintering the plated body impregnated with the metal oxide precursor, A step of forming a catalyst coating layer by coating a catalyst on the plated body to which the metal oxide is adhered, and a step of forming a metal plating layer by electroless plating on the catalyst coating layer .

In addition, the plated body includes an insulator.

In addition, the non-conductive material may include plastic, ABS, or a polymer material.

Further, the solvent is characterized by containing alcohol or distilled water.

In addition, the metal oxide precursor may include titanium isopropoxide.

Further, the metal oxide includes TiO ₂ .

Further, the step of photo-sintering and fixing the metal oxide is characterized by imparting hydrophilicity to the surface of the plated body.

The light sintering is characterized in that light including a wavelength band of 200 nm to 1000 nm is continuously irradiated.

Also, the light sintering is performed at 10 ms to 20 ms.

In addition, the catalyst is characterized in that it comprises a palladium (Pd) catalyst.

In order to accomplish the above object, another embodiment of the present invention provides an electroless plating body. The electroless plated body includes a plated body impregnated with a metal oxide precursor, a photo-sintered layer formed on the plated body to which the metal oxide precursor is combined, a catalyst coating layer formed on the photo-sintered layer, and a metal And a plating layer.

According to the embodiment of the present invention, it is possible to perform plating on a polymer material having difficulty in etching and excellent chemical resistance.

Further, the present invention provides the advantage of improving the adhesion of the plated film through the electroless plating.

In addition, the electroless plating method of the present invention provides a technique that enables production of a lightweight product that is applied variously to mobile phones, automobiles, electronic device parts, industrial parts, and the like.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

1 is a flowchart showing an electroless plating method.
2 is a photograph and a schematic view showing a pretreatment process of electroless plating through photo-sintering.
3 is a schematic view showing a single layer of a material electrolessly plated using a light sintering method.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" (connected, connected, coupled) with another part, it is not only the case where it is "directly connected" "Is included. Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a flowchart showing an electroless plating method.

Referring to FIG. 1, an electroless plating method according to an embodiment of the present invention includes the steps of (S100) impregnating the metal oxide precursor with the metal to be plated, placing the metal to be plated in a solvent containing the metal oxide precursor, (S200) a step of photo-sintering an object to be plated impregnated with an oxide precursor to fix the metal oxide to the object to be plated (S200), forming a catalyst coating layer by coating a catalyst on the object to be plated to which the metal oxide is fixed S300) and forming a metal plating layer by electroless plating on the catalyst coating layer (S400).

First, a metal to be plated is placed in a solvent containing a metal oxide precursor to impregnate the metal oxide precursor with the metal to be plated (S100).

The plated body may include nonconductive material.

For example, the nonconductor may be characterized by comprising plastic, ABS, or a polymeric material.

The solvent may include alcohol or distilled water.

For example, the metal oxide precursor may be characterized by containing titanium isopropoxide.

If the metal oxide precursor is titanium isopropoxide, it may be included in an ethanol solvent to form a titanium alkoxide.

Next, the metal to be plated is impregnated with the metal oxide precursor, and the metal oxide is fixed to the metal to be plated (S200).

The metal oxide may include TiO ₂ .

In addition, the step of photo-sintering and fixing the metal oxide may be characterized by imparting hydrophilicity to the surface of the plated body.

For example, the alcohol solvent containing the Ti alkoxide may be prepared by impregnating the metal oxide precursor titanium isopropoxide on the surface of the plated body and photo-sintering the plated body to fix the metal oxide TiO ₂ particles to the surface at a local high energy The TiO ₂ particles adhering to the surface can be provided with an irregular surface and a hydrophilic property so that the catalyst can be adsorbed easily.

The light sintering may be characterized in that light including a wavelength band of 200 nm to 1000 nm is continuously irradiated.

If the band of the optical sintering wavelength is more than 200 nm or less than 1000 nm, desired sintering can not be performed, and the light sintering of the present invention can be carried out using a xenon lamp.

The light sintering may be performed at a time of 10 msec to 20 msec.

If the optical sintering time is less than 10 ms, the metal oxide can not be fixed to the base material, and if it exceeds 20 ms, the base metal may be damaged.

Next, the catalyst is coated on the plated body to which the metal oxide is adhered to form a catalyst coating layer (S300).

The catalyst may include a palladium (Pd) catalyst.

For example, when TiO ₂ particles are fixed by photo-sintering to impart hydrophilicity, a colloid-type Sn-Pd catalyst can be adsorbed and an environment that enables electroless plating can be created have.

Next, a step S400 of forming a metal plating layer by electroless plating on the catalyst coating layer,

For example, an electroless plating solution containing copper may be coated on the catalyst coating layer, and electroless plating may be performed at a temperature of 47 ° C to form a copper plating layer.

Further, the metal plating layer may be characterized by containing Cu or Ni.

In addition, the structure of the electroless plating body manufactured by the above-described electroless plating method is a structure in which a metal oxide precursor impregnated body, a photo-sintered layer formed on the metal body to which the metal oxide precursor is combined, And a metal plating layer formed on the catalyst coating layer.

And the plated body impregnated with the metal oxide precursor is nonconductor.

In addition, the photo-sintering layer may include TiO ₂ .

Also, the catalyst coating layer may include Pd.

Further, the plating layer may be characterized by containing Cu or Ni.

Therefore, the electroless plating material of the present invention is formed by plating the surface of the polymer material with light-sintering, which is difficult to be etched and excellent in chemical resistance, so that the electroless plating is performed, It can be applied to a variety of applications such as mobile phones, automobiles, electronic parts, and industrial parts, thus making it possible to produce lightweight products.

Manufacturing example

1) Titanium isoproposide (15 ml) and ethanol (85 ml) were mixed to prepare a solvent.

2) Silicone rubber insulator was immersed in solvent and photo-sintered for 15 ms in 900nm wavelength region.

3) After photo-sintering, the palladium (pd) catalyst was impregnated at 25 ° C for 3 minutes for adsorption.

4) Copper was electroless plated on the palladium catalyst coating layer to obtain an electroless plated body.

2 is a photograph and a schematic view showing a pretreatment process of electroless plating through photo-sintering.

Referring to FIG. 2, FIG. 2 (a) is a schematic view showing that silicone rubber is contained in a solvent prepared by mixing titanium isopropoxide and ethanol.

FIG. 2 (b) is a schematic view showing that the metal oxide precursor impregnated on the surface of the silicon rubber by photo-sintering is fixed to the metal oxide TiO ₂ particles.

2 (b) is a photograph showing before (before) light sintering and after (after) light sintering.

After the light sintering, the white TiO ₂ particles were fixed and the surface was coated by the transparent silicone rubber before the light sintering.

FIG. 2 (c) is a schematic diagram showing the activation of the Pd catalyst to coat the Pd catalyst.

FIG. 2 (d) is a schematic view showing that Cu is plated by forming an environment in which an electroless plating is possible in a silicon rubber coated with a catalyst, and is a photograph of a plating sample to confirm Cu plating.

2, the present invention provides a method for improving the adhesion of a plated film through light sintering to a material difficult to be etched, and enabling electroless plating.

3 is a schematic view showing a single layer of a material electrolessly plated using a light sintering method.

Referring to FIG. 3, a single layer of an electroless plating product manufactured by the electroless plating method of the present invention described above is impregnated on a silicon rubber surface with a titanium alkoxide solvent on a silicon rubber, and the hydrophilic TiO ₂ A TiO ₂ light sintered layer fixed on the rubber surface is formed, and a hydrophilic environment is formed on the light sintered layer to adsorb the colloidal Pd catalyst as a whole. Further, an environment in which electroless plating is possible is made, and a Cu plating layer is formed on the Pd catalyst coating layer.

According to the embodiment of the present invention, it is possible to perform plating on a polymer material having difficulty in etching and excellent chemical resistance.

Further, the present invention provides the advantage of improving the adhesion of the plated film through the electroless plating.

In addition, the electroless plating method of the present invention provides a technique that enables production of a lightweight product that is applied variously to mobile phones, automobiles, electronic device parts, industrial parts, and the like.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

Claims (15)

Depositing a plated body in a solvent containing a metal oxide precursor to impregnate the metal oxide precursor with the plated body;
A step of photo-sintering an object to be plated impregnated with the metal oxide precursor to fix the metal oxide on the object to be plated;
Forming a catalyst coating layer on the plated body to which the metal oxide is adhered by coating the catalyst; And
And forming a metal plating layer by electroless plating on the catalyst coating layer. The method according to claim 1,
Wherein the plated body comprises a non-conductive material. 3. The method of claim 2,
Wherein the nonconductive material comprises plastic, ABS, or a polymer material. The method according to claim 1,
Wherein the solvent comprises an alcohol or distilled water. The method according to claim 1,
Wherein the metal oxide precursor comprises titanium isopropoxide. ≪ RTI ID = 0.0 > 8. < / RTI > The method according to claim 1,
Wherein the metal oxide comprises TiO ₂ . The method according to claim 1,
Wherein the step of photo-sintering and fixing the metal oxide imparts hydrophilicity to the surface of the plated body. The method according to claim 1,
Wherein the light sintering is a continuous irradiation of light including a wavelength band of 200 nm to 1000 nm. The method according to claim 1,
Wherein the photo-sintering is performed at 10 ms to 20 ms. The method according to claim 1,
Wherein the catalyst comprises a palladium (Pd) catalyst. A plated body impregnated with a metal oxide precursor;
A photo-sintered layer formed on the plated body to which the metal oxide precursor is combined;
A catalyst coating layer formed on the photo-sintering layer; And
A metal plating layer formed on the catalyst coating layer; And an electroless plated body formed on the substrate. 12. The method of claim 11,
Wherein the plated body impregnated with the metal oxide precursor is non-conductive. 12. The method of claim 11,
Wherein the photo-sintering layer comprises TiO ₂ . 12. The method of claim 11,
Wherein the catalyst coating layer comprises palladium (Pd). 12. The method of claim 11,
Wherein the metal plating layer comprises copper (Cu) or nickel (Ni).

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