KR20190045762A - Apparatus for prediction electrostatic discharge damage of smart junction box - Google Patents

Abstract

The present invention relates to a simulation device for predicting electrostatic discharge damage of a smart junction box. The present invention comprises: a data input unit for receiving circuit information corresponding to a smart junction box of the type to test electrostatic discharge (ESD) damage; a 3D modeling unit for generating a three-dimensional PCB shape based on the circuit information; an ESD applying unit for applying a predetermined level of ESD to a designated position of the three-dimensional PCB shape; an electromagnetic field and transmission path analysis unit for analyzing electromagnetic fields of all ESD transmission paths from the point where the ESD is applied to the ground in the three-dimensional PCB shape; and a simulation result output unit for outputting a simulation result, in which the electromagnetic field analysis for the ESD transmission path is completed, in a designated format. According to the present invention, it is possible to check accurate damage voltage for a portion where a problem occurs due to static electricity.

Description

TECHNICAL FIELD [0001] The present invention relates to a smart junction box, and more particularly, to an apparatus for predicting electrostatic discharge damage in a smart junction box,

The present invention relates to an apparatus for predicting electrostatic discharge damage in a smart junction box, and more particularly, to an apparatus for predicting an electrostatic discharge damage in a smart junction box, in which static electricity is not applied to an actual smart junction box, (Or damage) of the smart junction box by performing a simulation of applying the static discharge damage prediction simulation apparatus to the smart junction box.

Generally, an electric device of a car can be likened to a nervous system, and only when the electric device operates normally, the performance of the car can be demonstrated properly.

Such an electric apparatus of an automobile can be divided into an engine-side electric apparatus and a body-side electric apparatus, wherein the engine-side electric apparatus is a charging apparatus composed of an ignition device including an ignition coil, a distributor high-voltage cable, The body-side electrical apparatus includes a battery, an equalizing apparatus for illumination, a marking, and a signal, a meter warning display apparatus installed on the instrument panel, and a cooling / heating apparatus.

All of these automobile electrical devices are connected by wire to the electronic control unit (ECU) inside the engine room of the vehicle. The smart junction box (SJB: Smart Junction Box, or Smart Junction Block) is used.

Therefore, since the smart junction box is a very important device directly connected to the safety of the vehicle, it is necessary to secure safety by verifying the performance through safety inspection before mounting the vehicle in the vehicle.

As a safety inspection of the SmartJunction box (SJB), static electricity is directly applied to a Smart Junction Box (SJB) using an electrostatic application device (e.g., ESD GUN: Electro Static Discharge GUN) (Safety check) to check whether the static junction box (SJB: Smart Junction Box or Smart Junction Block) is broken or malfunctioned by the static electricity.

However, in the test (safety inspection) for confirming whether a static electricity is directly applied to a product (for example, SJB) to check for breakage or malfunction of the component, it is possible to make a normal (abnormal) determination. However, It is difficult to confirm the voltage, and it has been difficult to propose measures for improving the static electricity (for example, changing the capacity of parts or adding components for absorbing static electricity).

The background art of the present invention is disclosed in Korean Registered Patent No. 10-0811009 (Registered on February 29, 2008, Smart Junction Box equipped with a failure diagnosis function).

According to an aspect of the present invention, there is provided a smart junction box product, which is created to solve the above-described problems, and in which, instead of applying static electricity to an actual smart junction box product, The present invention has been made in view of the above problems, and it is an object of the present invention to provide an electrostatic discharge damage prediction simulation device of a smart junction box that can simulate damage (or damage) by applying static electricity.

According to an aspect of the present invention, there is provided an apparatus for predicting electrostatic discharge damage of a smart junction box, comprising: a data input unit receiving circuit information corresponding to a smart junction box of a type for testing electrostatic discharge (ESD) damage; A 3D modeling unit for generating a three-dimensional PCB shape based on the circuit information; An ESD applying unit for applying a predetermined level of ESD to a designated position of the three-dimensional PCB shape; An electromagnetic field and propagation path analyzer for analyzing electromagnetic fields of all ESD propagation paths from the point where the ESD is applied to the ground to the ground in the three-dimensional PCB shape; And a simulation result output unit for outputting a simulation result in which the electromagnetic field analysis for the ESD transmission path is completed, in a specified format.

In the present invention, the circuit information includes a circuit diagram of a Smart Junction Box, a PCB ASCII file, Stack_up data, and device data.

In the present invention, the printed circuit board (PCB) data is ASCII file data as PCB design data, and the stack up data includes copper foil and epoxy thickness data of a pattern as PCB stack structure data, The device data is data including at least one of fuse, cable, and passive device information.

In the present invention, the three-dimensional PCB shape is a three-dimensional shape in which at least one of a PCB, a pattern, a fuse, a passive element, a cable, and a jump line is mounted.

In the present invention, the ESD applying unit may apply an ESD waveform of the same type as the ESD waveform applied in the actual static electricity applying apparatus, and may change the resistance condition for generating the ESD waveform and the capacitance condition of the capacitor, And an ESD waveform can be generated.

In the present invention, the electromagnetic field and propagation path analyzing unit displays the degree of damage to the ESD transmission path in a color on the three-dimensional PCB shape, displays the first color more darkly as the degree of ESD damage becomes smaller, And the second color is darker.

In the present invention, the ESD and propagation path analyzing unit re-interprets the ESD damage countermeasure by applying simulation if ESD damage countermeasure measures are applied to the point, and determines whether the ESD damage is inappropriate or unsuitable. Or adjusting the thickness or the width of the copper foil of the PCB pattern by increasing or decreasing the capacity of the previously inserted device, changing the type of the previously inserted device, or adjusting the thickness or the width of the copper foil of the PCB pattern.

According to an aspect of the present invention, there is provided a smart junction box product, which does not apply static electricity, but instead performs a simulation of applying static electricity by software through three-dimensional modeling using data of a smart junction box, Damage) can be predicted, it is possible to easily identify the correct damage voltage for the part where the problem is caused by static electricity, and to easily propose measures for improving the static electricity (for example, changing the capacity of parts or adding parts for absorbing static electricity) .

1 is a photograph of an electrostatic discharge test apparatus of a conventional smart junction box.
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electrostatic discharge damage prediction simulation apparatus for a smart junction box.
3 is a flowchart illustrating a schematic operation of an apparatus for predicting electrostatic discharge damage in a smart junction box according to an embodiment of the present invention.
FIG. 4 is an exemplary diagram for explaining data input through the data input unit in FIG. 2; FIG.
FIG. 5 is an exemplary view showing the three-dimensional PCB shape generated by the 3D modeling unit in FIG. 2; FIG.
FIG. 6 is an exemplary diagram showing the degree of damage to the ESD transmission path analyzed by the electromagnetic field and propagation path analyzer in FIG. 2 in a color-coded three-dimensional PCB shape.
FIG. 7 is an exemplary diagram for comparing the test results before and after the improvement of the ESD damage in FIG. 2; FIG.

Hereinafter, an embodiment of an apparatus for predicting electrostatic discharge damage in a smart junction box according to the present invention will be described with reference to the accompanying drawings.

In this process, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation. In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.

FIG. 2 is a schematic diagram illustrating an apparatus for predicting the static discharge damage of a smart junction box according to an exemplary embodiment of the present invention. Referring to FIG.

2, the ESD simulation apparatus of the smart junction box according to the present embodiment includes a data input unit 110, a 3D modeling unit 120, an ESD application position selection unit 130, an ESD application level A setting unit 140, an ESD applying unit 150, an electric field and propagation path analyzing unit 160, and a simulation result output unit 170.

The data input unit 110 receives circuit information (e.g., circuit diagram, PCB ASCII file, Stack_up data, BOM data, etc.) corresponding to the type of smart junction box to be tested (see FIG.

FIG. 4 is an exemplary diagram illustrating data input through the data input unit in FIG.

The data input unit 110 includes a PCB data input unit 111 for receiving PCB (Printed Circuit Board) data. The PCB data refers to PCB design data (i.e., ASCII file data) as shown in FIG. 4 (a).

The data input unit 110 includes a stack up data input unit 112 for receiving stack up data. The stack up data refers to data related to a PCB laminate structure (e.g., copper foil, epoxy thickness, etc.) as shown in Fig. 4 (b).

The data input unit 110 includes a device data input unit 113 for receiving device data (i.e., a BOM list). The device data (i.e., the BOM List) includes passive element information as shown in Fig. 4 (c).

The 3D modeling unit 120 generates a three-dimensional PCB shape on which elements are mounted based on circuit information (e.g., circuit diagram, PCB ASCII file, Stack_up data, BOM data, etc.) input through the data input unit 110 (See FIG. 5).

FIG. 5 is an exemplary diagram showing a three-dimensional PCB shape generated by the 3D modeling unit in FIG.

As shown in FIG. 5, the three-dimensional PCB shape is modeled as a three-dimensional shape of a PCB, a pattern, an element (e.g., a fuse, a passive element, etc.), and a cable (e.g., a jump line). That is, a three-dimensional PCB shape corresponding to circuit information (for example, circuit diagram, PCB ASCII file, Stack_up data, BOM data, etc.) input through the data input unit 110 is modeled.

The ESD applying unit 150 applies ESD (static electricity) of a predetermined waveform and level to a desired specific point (or element) of the three-dimensional PCB shape (see FIG. 5).

The ESD (static electricity) can apply the same waveform (for example, an ESD waveform of 330 Ω-330 pF Gun model) to a waveform applied in an actual static electricity applying device (for example, ESD GUN) and change the capacity condition of the resistor and the capacitor Thereby generating and applying another type of ESD waveform.

The ESD application position selection unit 130 designates a position (for example, an element, a pattern, a contact, etc.) to apply ESD (static electricity) to the modeled three-dimensional PCB shape through the ESD application unit 150.

The ESD application level setting unit 140 sets an ESD level to be applied to a position (e.g., device, pattern, contact, etc.) designated by the ESD application position selector 130 through the ESD application unit 150 Lt; / RTI >

For example, the ESD (electrostatic) level may be varied to ± 4 KV, ± 8 KV, and the like.

Accordingly, when ESD (static electricity) of a specified level (for example, ± 4 KV, ± 8 KV, etc.) is applied to the designated position (eg, device, pattern, contact point, etc.), the electromagnetic field and propagation path analysis unit 160 (Electrostatic) propagation path (for example, a path including a pattern and a device) from a point where the ESD (static electricity) is applied to a ground to a ground in a three-dimensional PCB shape.

At this time, the electromagnetic field and propagation path analysis unit 160 may apply the algorithm using the Maxwell's equation for the electromagnetic field analysis.

FIG. 6 is an exemplary diagram showing the degree of damage (damage) to the ESD (electrostatic) transmission path analyzed by the electromagnetic field and propagation path analysis unit in a modeled three-dimensional PCB shape in color in FIG.

Referring to FIG. 6, the smaller the degree of ESD (damage), the more blue is displayed, and the greater the degree of ESD (damage), the more red is displayed.

Accordingly, in the modeled three-dimensional PCB shape, the user can easily see the position of ESD (electrostatic) damage (damage) according to ESD (static electricity) level by referring to the color.

6, the output unit 170 outputs positional information with ESD (electrostatic) damage (damage) according to an applied ESD (static electricity) level, The ESD countermeasure device (ESD countermeasure measure) is inserted into the modeled three-dimensional PCB shape.

For example, ESD-responsive device data may be input through the data input unit 110 to be inserted into the modeled three-dimensional PCB shape. However, the present invention is not limited to this, and other methods (for example, a method of directly inserting a corresponding element modeled in three dimensions into the modeled three-dimensional PCB shape) may be applied.

At this time, the ESD countermeasure (ESD countermeasure) does not necessarily require the insertion of a new device. It is not necessary to increase or decrease the capacity of the previously inserted device, to change the type of the previously inserted device, It also includes adjustment.

When the simulation is performed again by applying the ESD countermeasure device (ESD countermeasure) as described above, the ESD improvement result can be obtained easily and quickly as shown in FIG. FIG. 7 is an exemplary diagram for comparing test results before and after the improvement of ESD (electrostatic) damage (damage) in FIG. 2; FIG.

3 is a flowchart illustrating a schematic operation of an apparatus for predicting electrostatic discharge damage in a smart junction box according to an embodiment of the present invention.

3, the apparatus for predicting the electrostatic discharge damage of the smart junction box according to the present embodiment includes circuit information (for example, a circuit diagram, a circuit diagram, etc.) corresponding to a type of smart junction box to be tested through the data input unit 110, PCB ASCII file, Stack_up data, BOM data, etc.) (S101, S102).

Dimensional PCB shape based on the inputted circuit information (e.g., circuit diagram, PCB ASCII file, Stack_up data, BOM data, etc.) through the following 3D modeling unit 120 (S103).

ESD (static electricity) of a specified level (e.g., ± 4 KV, ± 8 KV, etc.) is applied to a predetermined position (eg, device, pattern, contact, etc.) predetermined in the three-dimensional PCB shape through the next ESD applying unit 150 (Electrostatic) transmission path (for example, a pattern and a device) from the point where the ESD (static electricity) is applied to the ground in the modeled three-dimensional PCB shape through the electromagnetic field and propagation path analysis unit 160 (Step S105).

If the result of the analysis of the electromagnetic field for the ESD transmission path is inadequate (unsuitable in S105), the electromagnetic field and propagation path analysis unit 160 interprets the ESD improvement measures suggested by the user to determine whether the ESD improvement measures are appropriate (S106).

Here, the ESD countermeasure includes the concept of inserting a new device, increasing or decreasing the capacity of a previously inserted device, changing the type of a previously inserted device, or adjusting the thickness or width of a copper foil of a PCB pattern .

Accordingly, when the ESD countermeasure is inappropriate, circuit information is changed or redesigned.

The simulation result is outputted through the output unit 170 as a result of the next simulation in a specified specific format (e.g., an ESD test evaluation form).

As described above, according to the present embodiment, a static electromotive force is applied to the actual smart junction box product instead of the static junction box, and instead, software is applied to the static electromagnetism through three-dimensional modeling using the data of the smart junction box to predict the damage It is possible to confirm the accurate damage voltage to the part where the problem is caused by the static electricity and to make it easy to propose the measures for the improvement of the static electricity (for example, the capacity change of the component or the component addition for the static electricity absorption) have.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, I will understand the point. Accordingly, the technical scope of the present invention should be defined by the following claims.

110: data input unit 120: 3D modeling unit
130: ESD application position selection unit 140: ESD application level setting unit
150: ESD application section 160: electromagnetic field and propagation path analysis section
170: Simulation result output section

Claims (7)

A data input unit for receiving circuit information corresponding to a type of smart junction box to be tested for electrostatic discharge (ESD) damage;
A 3D modeling unit for generating a three-dimensional PCB shape based on the circuit information;
An ESD applying unit for applying a predetermined level of ESD to a designated position of the three-dimensional PCB shape;
An electromagnetic field and propagation path analyzer for analyzing electromagnetic fields of all ESD propagation paths from the point where the ESD is applied to the ground to the ground in the three-dimensional PCB shape; And
And a simulation result output unit for outputting a simulation result in which the electromagnetic field analysis for the ESD transmission path is completed in a designated format.
2. The method of claim 1,
A schematic diagram of the smart junction box, a PCB ASCII file, stack up data, and device data.
3. The method of claim 2,
The PCB (Printed Circuit Board) data is ASCII file data as PCB design data,
The stack up data includes copper foil and epoxy thickness data of a pattern as PCB stack structure data,
Wherein the device data is data including at least one of fuse, cable, and passive device information.
The method of claim 1, wherein the three-
Wherein the at least one of the PCB, the pattern, the fuse, the passive element, the cable, and the jump line is mounted in a three-dimensional shape.
The apparatus of claim 1,
It is possible to apply an ESD waveform of the same type as that of the ESD waveform applied in the actual static electricity applying apparatus and to change the capacitance condition of the resistor and the capacitor for generating the ESD waveform to generate another type of ESD waveform A Smart Discharge Damage Prediction Simulation Apparatus of Smart Junction Box.
The apparatus of claim 1, wherein the electromagnetic field and propagation path analysis unit comprises:
The degree of damage to the ESD transfer path is displayed in color on the three-dimensional PCB shape,
The smaller the degree of ESD damage, the darker the designated first color,
And the ESD damage is displayed in a darker color in accordance with a greater degree of damage to the ESD damage.
[7] The apparatus of claim 6,
When the ESD improvement measure for ESD damage points is applied, it is re-interpreted through simulation to determine suitability or nonconformity,
The ESD countermeasure includes at least one of inserting a new element, increasing or decreasing the capacity of a previously inserted element, changing the type of a previously inserted element, or adjusting the thickness or width of a copper foil of a PCB pattern Wherein the static discharge damage predictive simulation apparatus of the smart junction box comprises:

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